Die bonding device and packaging method for stacked chips

Abstract

The invention relates to the technical field of stacked chip processing, and discloses a stacked chip die bonding device and a packaging method.The stacked chip die bonding device comprises a rack, vertical rods are fixedly connected to the four corners of the bottom face of the rack, a base is fixedly installed at the bottom ends of the vertical rods, a lifting plate is movably installed on the outer side of the base, and a mounting plate is arranged on the top face of the lifting plate; a base plate is arranged at the top of the mounting plate, a split plate is arranged on the inner side of the rack, an electric sliding rail is arranged in the rack, an electric sliding block is mounted on the inner side of the electric sliding rail, and the electric sliding block is fixedly connected with the split plate. By means of the integrated rack, the lifting plate can be controlled to move upwards, the lifting plate can drive the mounting plate and the substrate to move upwards, the substrate makes contact with the bottoms of the stacked chips, the stacked chips can be packaged through external packaging equipment, the packaging process can be achieved without transferring the stacked chips, and the machining efficiency and the automation degree of the stacked chips are improved.

Description

Technical Field

[0001] This invention relates to the field of stacked chip processing technology, specifically to a die bonding device and packaging method for stacked chips. Background Technology

[0002] Chip stacking is a revolutionary semiconductor technology that stacks multiple chips vertically like building blocks, using micro-interconnect technologies such as through-silicon vias (TSVs) for high-speed electrical connections. This significantly improves the performance and functional density of integrated circuits without increasing the chip's planar area. This technology effectively overcomes the limitations of traditional two-dimensional scaling, achieving shorter data transmission paths, higher bandwidth, and lower power consumption through three-dimensional integration. It is a core driving force behind the continued development of high-performance computing, artificial intelligence, and mobile devices.

[0003] Stacked chips are formed by stacking multiple individual chips through die bonding. After the multiple chips are die bonded, a stacked chip is formed. After the stacked chip is formed, it needs to be packaged on a substrate before it can be processed. However, the traditional solution usually separates die bonding and packaging into two processes. After the stacked chip is die bonded, it needs to be transferred to the packaging area. This process reduces the processing efficiency of the stacked chip, so it needs to be improved. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a die bonding device and packaging method for stacked chips, solving the problem that existing technologies separate die bonding and packaging into two different processes, which affects processing efficiency.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a die bonding device for stacked chips, comprising a frame, uprights fixedly connected to the four corners of the bottom surface of the frame, bases fixedly installed at the bottom ends of the uprights, a lifting plate movably installed on the outer side of the bases, a mounting plate on the top surface of the lifting plate, a base plate on the top of the mounting plate, a split plate on the inner side of the frame, an electric slide rail inside the frame, an electric slider installed on the inner side of the electric slide rail and fixedly connected to the split plate, fixing frames fixedly installed on both sides of the split plate, multiple telescopic rods installed on the inner side of the fixing frames, a pressing plate fixedly connected to one end of each telescopic rod, and symmetrical extension openings on the inner side of the frame. The split plate is placed inside the extension opening. A fixing plate is fixedly installed on one side of the frame. A rotating rod is rotatably installed on the top of the fixing plate via a bearing. A deflection rod is fixedly installed at the top of the rotating rod. Side plates are fixedly installed on both sides of the deflection rod. A second temperature sensor and a first temperature sensor are respectively installed on the inner sides of the deflection rod and the side plates. A laser emitter is installed on the top of the frame. The top of the split plate has symmetrically formed grooves, and a clamping block is provided inside the groove. A clamping assembly is connected to one side of the clamping block. An air blowing port is installed inside the frame. An ionized nitrogen purging device is installed inside the frame, and the outlet of the ionized nitrogen purging device is connected to the air blowing port. A controller is fixedly installed on one side of the frame via a fixing bracket.

[0006] Preferably, the clamping assembly includes a threaded cylinder, a threaded rod, a first worm gear, a connecting worm, a second worm gear, and a double-segment worm. The two threaded rods are respectively fixedly installed on one side of the two clamping blocks. The threaded cylinder is sleeved on the outside of the threaded rod. The first worm gear is fixedly installed on one side of the threaded cylinder. The connecting worm is engaged with the bottom of the first worm gear. The second worm gear is fixedly installed at one end of the connecting worm. The double-segment worm is disposed on the top of the two second worm gears, and the double-segment worm is engaged with the two second worm gears respectively.

[0007] Preferably, a first motor is fixedly installed on one side of the frame via a fixing bracket, and the output end of the first motor is connected to a double-segment worm gear. A guide rod is fixedly installed on the inner wall of the frame, and one end of the guide rod is connected to a clamping block.

[0008] Preferably, the split plate is composed of two plates, with a hole in the center of the split plate and air holes on the surface of the hole. A movable tube is provided on one side of the split plate, and one end of the movable tube is connected to the air holes. A first negative pressure pump is fixedly installed on one side of the frame by a fixing bracket, and the air intake of the first negative pressure pump is connected to the movable tube.

[0009] Preferably, a hydraulic rod is installed at the center of the top surface of the base, the telescopic end of the hydraulic rod is connected to the bottom surface of the lifting plate, a third negative pressure pump is installed on the top of the base, a first air pipe is installed on the top of the third negative pressure pump, one end of the first air pipe is connected to a first suction cup, and the first suction cup is embedded in the interior of the lifting plate.

[0010] Preferably, a third motor is fixedly mounted on the bottom surface of the fixed plate by a mounting bracket, and the output end of the third motor is connected to the rotating rod. A moving groove is opened on the bottom surface of the deflecting rod, and a screw is provided inside the moving groove. A moving block is passed through the screw, and the moving block and the moving groove are slidably connected. An electric push rod is installed at the bottom of the moving block, and a second suction cup is connected to the telescopic end of the electric push rod.

[0011] Preferably, a second negative pressure pump is fixedly installed at the top of the deflection rod, a second air pipe is connected to one side of the second negative pressure pump, and one end of the second air pipe is connected to the second suction cup. A second motor is fixedly installed on one side of the deflection rod through a fixing bracket, and the output end of the second motor is connected to the screw.

[0012] Preferably, a second heat-conducting plate and a first heat-conducting plate are respectively installed on the inner side of the deflection rod and the side plate, and the second temperature sensor and the first temperature sensor are respectively installed on the top of the first heat-conducting plate and the second heat-conducting plate.

[0013] Preferably, the telescopic rod is divided into an inner rod and an outer rod. A pressure sensor is installed inside the telescopic rod, and a spring is installed inside the telescopic rod, with the two ends of the spring connected to the pressure sensor and the inner rod, respectively.

[0014] A method for packaging stacked chips, the method comprising the following steps:

[0015] S1. After the stacked chips are die-bonded and stacked on the top of the split plate, the two clamping blocks are pushed to move relative to each other by the clamping components, so as to clamp and fix the stacked chips on the top of the split plate.

[0016] S2. By opening the electric slide rail, the electric slider can be moved within the electric slide rail, thereby controlling the opening and closing of the split plate and moving the split plate to both sides to open the bottom opening of the frame.

[0017] S3, when the split plate moves to both sides, it will enter the interior of the extension port, and then the split plate continues to move in the opposite direction to the extrusion plate, thereby extruding the extrusion plate to both sides. The extrusion plate causes the telescopic rod to retract, and the inner rod of the telescopic rod extrudes the spring inward. The spring extrudes the pressure sensor through elastic potential energy, and the pressure sensor transmits the pressure signal to the controller.

[0018] S4. The controller receives the pressure signal from the pressure sensor and can then detect that the split plate has been opened. At this time, the controller will control the hydraulic rod to move upward. The hydraulic rod pushes the lifting plate to slide on the surface of the upright. The lifting plate rising can drive the top mounting plate and base plate to rise.

[0019] S5. The mounting plate and substrate continue to rise, bringing the substrate into contact with the bottom of the stacked chips that are being clamped and positioned. Then, using external packaging equipment, the stacked chips are packaged on top of the substrate, thus completing the packaging process.

[0020] Working principle: When using this equipment, the frame can be placed in the designated position, and the bottom stacked chip and its base can be placed on the top of the split plate. The first negative pressure pump is turned on. The first negative pressure pump can adsorb and fix the single stacked chip placed on the top of the split plate through negative pressure suction. The third motor is turned on. The third motor drives the rotating rod to rotate. The rotating rod drives the deflection rod to deflect to the area where the new chip is placed. The electric push rod is turned on. The electric push rod drives the second suction cup to move down and contact the second suction cup with the new chip. The second negative pressure pump is turned on. The second negative pressure pump transmits the suction force to the second suction cup, thereby adsorbing and fixing the new chip.

[0021] The third motor is activated again, which drives the deflection rod to reset. The electric push rod controls the second suction cup to move down, allowing the new chip to contact the bottom chip. Multiple chips can then be stacked and die-bonded using external die-bonding equipment. While the deflection rod is deflecting, the laser emitter remains on. When the deflection rod resets, the laser emitter emits a laser beam to the first temperature sensor. The first temperature sensor detects the temperature rise and transmits this information to the controller. The controller receives the temperature rise information and can then activate the ionized nitrogen purging device to purge impurities from the chip surface. When the deflection rod is deflected, the laser emitter emits a laser beam to the area of ​​the second temperature sensor. The temperature of the second temperature sensor rises, and the controller receives this information and can then deactivate the ionized nitrogen purging device, thus saving energy.

[0022] After die bonding of the stacked chips is completed, the first motor can be turned on. The first motor drives the double-segment worm gear to rotate, which in turn drives the second worm wheel to rotate. The second worm wheel drives the first worm wheel to rotate through the connecting worm gear. The first worm wheel drives the threaded cylinder to rotate, which in turn drives the threaded rod to extend. The threaded rod pushes the clamping block to move, and the clamping block positions the base of the bottom chip. The electric slide rail is then activated, and the electric slide rail controls the electric slider to slide inside the electric slide rail, thereby controlling the split plate to move to both sides. The split plate continues to move towards the extrusion plate, which presses the telescopic rod. The spring inside the telescopic rod is compressed, which applies pressure to the pressure sensor. The controller receives the pressure signal from the pressure sensor and determines that the split plate is in the open state. The controller then controls the hydraulic rod to extend, which drives the lifting plate to move upward. The lifting plate drives the top mounting plate and substrate to move upward, bringing the substrate into contact with the bottom of the stacked chips. The stacked chips can then be packaged using external packaging facilities.

[0023] This invention provides a die bonding apparatus and packaging method for stacked chips. It has the following advantages:

[0024] 1. This invention uses an integrated rack. After multiple chips are die-bonded and stacked, the split plate can be controlled to move to both sides, opening the opening at the bottom of the rack. Then, the controller receives the opening signal of the split plate and controls the lifting plate to move upward. The lifting plate can then move the mounting plate and substrate upward, bringing the substrate into contact with the bottom of the stacked chips. The chips can then be packaged using external packaging equipment. The packaging process can be achieved without transferring the stacked chips, increasing the processing efficiency and automation of the stacked chips.

[0025] 2. By setting up a clamping component, when the stacked chip is packaged, the clamping component can drive the two clamping blocks to move relative to each other. The two clamping blocks are fixed to the bottom mounting base of the stacked chip, thereby ensuring the stability of the stacked chip during packaging and preventing displacement of the stacked chip during the packaging process.

[0026] 3. In this invention, the laser emitter and temperature sensor work together. When the deflection rod moves to the top of the rack to perform die bonding on the chip, the laser emitter emits a laser that can irradiate the first temperature sensor. The first temperature sensor senses the temperature rise and can transmit the temperature signal to the controller. The controller receives the temperature signal and can control the ionized nitrogen purging device inside the rack to start. The ionized nitrogen purging device can blow off impurities on the chip surface, ensuring the die bonding quality of the stacked chips. Attached Figure Description

[0027] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0028] Figure 2This is a bottom-view structural diagram of the present invention;

[0029] Figure 3 This is a schematic diagram of the electric slide rail position structure of the present invention;

[0030] Figure 4 This is a schematic diagram of the split plate structure of the present invention;

[0031] Figure 5 This is a schematic diagram of the clamping component structure of the present invention;

[0032] Figure 6 This is a schematic diagram of the movable slot position structure of the present invention;

[0033] Figure 7 This is a schematic diagram of the position structure of the first temperature sensor of the present invention;

[0034] Figure 8 This is a schematic diagram of the pressure sensor location structure according to the present invention.

[0035] The components include: 1. Frame; 2. Base; 3. Upright pole; 4. Lifting plate; 5. Controller; 6. First negative pressure pump; 7. First motor; 8. Fixing plate; 9. Rotating rod; 10. Bearing; 11. Eccentric rod; 12. Side plate; 13. Split plate; 14. Second negative pressure pump; 15. Fixing frame; 16. Extension port; 17. Telescopic rod; 18. Extrusion plate; 19. Laser emitter; 20. Hydraulic rod; 21. Third negative pressure pump; 22. First air pipe; 23. First suction cup; 24. Mounting plate; 25. Base plate; 26. Electric slide rail; 27. Second air pipe; 28. Second... 29. Suction cup; 30. Clamping block; 31. Electric slider; 32. Movable tube; 33. Air hole; 34. Moving slot; 35. Screw; 36. Moving block; 37. Second motor; 38. Electric actuator; 39. Third motor; 40. Mounting bracket; 41. First heat-conducting plate; 42. Second heat-conducting plate; 43. First temperature sensor; 44. Second temperature sensor; 45. Spring; 46. Pressure sensor; 47. Threaded cylinder; 48. Threaded rod; 49. Guide rod; 50. First worm gear; 51. Connecting worm; 52. Second worm gear; 53. Double-stage worm; 54. Air outlet. Detailed Implementation

[0036] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0037] Example 1:

[0038] Please see the appendix Figure 1- Appendix Figure 8 This invention provides a die bonding device for stacked chips, including a frame 1. Uprights 3 are fixedly connected to the four corners of the bottom surface of the frame 1. A base 2 is fixedly installed at the bottom end of each upright 3. A lifting plate 4 is movably installed on the outer side of the base 2. A mounting plate 24 is provided on the top surface of the lifting plate 4. A substrate 25 is provided on the top of the mounting plate 24. A split plate 13 is provided on the inner side of the frame 1. An electric slide rail 26 is provided inside the frame 1. An electric slider 30 is installed inside the electric slide rail 26 and is fixedly connected to the split plate 13. Fixing frames 15 are fixedly installed on both sides of the split plate 13. Multiple telescopic rods 17 are installed inside the fixing frames 15. One end of each telescopic rod 17 is fixedly connected to a pressing plate 18. Extension openings 16 are symmetrically provided on the inner side of the frame 1, and the split plate 13 is placed... Inside the extension port 16, a fixed plate 8 is fixedly installed on one side of the frame 1. A rotating rod 9 is rotatably installed on the top of the fixed plate 8 via a bearing 10. A deflection rod 11 is fixedly installed on the top of the rotating rod 9. Side plates 12 are fixedly installed on both sides of the deflection rod 11. A second temperature sensor 43 and a first temperature sensor 42 are respectively installed on the inner sides of the deflection rod 11 and the side plates 12. A laser emitter 19 is installed on the top of the frame 1. Grooves are symmetrically provided on the top of the split plate 13, and clamping blocks 29 are provided on the inner side of the grooves. A clamping assembly is connected to one side of the clamping block 29. An air blowing port 53 is installed inside the frame 1. An ionized nitrogen purging device is installed inside the frame 1, and the outlet of the ionized nitrogen purging device is connected to the air blowing port 53. A controller 5 is fixedly installed on one side of the frame 1 via a fixed bracket.

[0039] Specifically, the lifting plate 4 is movably installed on the outside of the upright 3, so that when the lifting plate 4 rises or falls, it can slide on the outside of the upright 3, thus ensuring the stability and directionality of the lifting plate 4 during rise and fall. The controller 5 can receive temperature signals from the first temperature sensor 42 and the second temperature sensor 43. In use, a temperature threshold can be preset in the controller 5. When the temperature signals received by the temperature sensors from the first temperature sensor 42 and the second temperature sensor 43 exceed the set threshold, the start and stop of the ionized nitrogen purging device can be controlled. Since the rotating rod 9 is mounted on the top of the fixed plate 8 through the bearing 10, the rotating rod 9 can rotate on the top of the fixed plate 8. This allows the deflection rod 11 to be controlled to deflect at the top of the rack 1. The deflection of the rod 11 facilitates the gripping of individual chips. When a chip is gripped to the top of the rack 1, the laser emitter 19 emits a laser beam to the first temperature sensor 42. The first temperature sensor 42 detects a localized temperature increase and transmits this temperature information to the controller 5. The controller 5 receives the temperature information from the first temperature sensor 42. When the temperature exceeds a set threshold, it activates the ionized nitrogen purging device. The ionized nitrogen purging device blows through the air outlet 53 onto the chips located inside the rack 1 and on top of the split plate 13, thereby removing the chips... Surface impurities are blown off, facilitating subsequent die bonding and increasing the quality of die bonding. When the deflector 11 deflects again to pick up a new single chip, the laser emitted by the laser emitter 19 will irradiate a local area of ​​the second temperature sensor 43. At this time, the second temperature sensor 43 detects a local temperature increase and transmits the temperature information to the controller 5. The controller 5 receives the temperature information from the second temperature sensor 43. When the temperature information of the second temperature sensor 43 exceeds a set threshold, it will control the ionized nitrogen purging device to shut down, thereby avoiding the continuous operation of the ionized nitrogen purging device when picking up a new chip, thus avoiding energy waste. Electric slider 30 The two split plates 13 are fixedly connected, and the electric slider 30 can be controlled to slide inside the electric slide rail 26 by controlling the electric slide rail 26, thereby controlling the opening and closing of the split plates 13. The bottom of the frame 1 is provided with an opening. When the split plates 13 are opened, the opening at the bottom of the frame 1 can be exposed, which facilitates the mounting plate 24 and substrate 25 on the top of the lifting plate 4 to be aligned with the stacked chips inside the frame 1, so as to facilitate the subsequent packaging of the stacked chips. The extension port 16 is positioned opposite to the split plates 13. When the split plates 13 move to both sides, the split plates 13 can be moved to the inside of the extension port 16, thereby ensuring the normal opening and closing of the split plates 13.

[0040] Please see the appendix Figure 5The clamping assembly includes a threaded cylinder 46, a threaded rod 47, a first worm gear 49, a connecting worm 50, a second worm gear 51, and a double-stage worm 52. The two threaded rods 47 are respectively fixedly installed on one side of the two clamping blocks 29. The threaded cylinder 46 is sleeved on the outside of the threaded rod 47. The first worm gear 49 is fixedly installed on one side of the threaded cylinder 46. The connecting worm 50 is engaged with the bottom of the first worm gear 49. The second worm gear 51 is fixedly installed at one end of the connecting worm 50. The double-stage worm 52 is located on the top of the two second worm gears 51, and the double-stage worm 52 is engaged with the two second worm gears 51 respectively. A first motor 7 is fixedly installed on one side of the frame 1, and the output end of the first motor 7 is connected to the double-stage worm 52. A guide rod 48 is fixedly installed on the inner wall of the frame 1, and one end of the guide rod 48 is connected to the clamping block 29.

[0041] Specifically, the threaded cylinder 46 and the threaded rod 47 are connected by threads. When the threaded cylinder 46 rotates, it limits the movement of the threaded rod 47, allowing it to extend inside the threaded cylinder 46. When the threaded rod 47 extends, it can push the clamping block 29 to move. In actual use, the rotation of the double-stage worm gear 52 drives the two second worm wheels 51 to rotate synchronously. The second worm wheels 51 drive the two connecting worm gears 50 to rotate synchronously. The connecting worm gears 50 drive the two first worm wheels 49 to rotate synchronously. The two first worm wheels 49 drive the two threaded cylinders 46 to rotate synchronously. The rotation of the threaded cylinder 46 can move the two threaded rods 47. The synchronous extension allows the two clamping blocks 29 to move synchronously. The clamping blocks 29 are placed in the slots at the top of the split plate 13. The movement of the clamping blocks 29 clamps the base 2 of the stacked chips placed on the top of the split plate 13. Thus, when the split plate 13 is opened, the clamped stacked chips will not fall, which facilitates the packaging operation of the stacked chips. The guide rod 48 is telescopic. Thus, when the clamping blocks 29 move, the guide rod 48 can be extended and retracted accordingly, which can ensure the directional of the movement of the clamping blocks 29. At the same time, the limiting of the guide rod 48 can prevent the threaded rod 47 from rotating with the rotation of the threaded cylinder 46, which ensures the normal extension of the threaded rod 47.

[0042] Please see the appendix Figure 4 The split plate 13 is composed of two plates. A hole is opened in the center of the split plate 13, and an air hole 32 is opened on the surface of the hole. A movable tube 31 is provided on one side of the split plate 13, and one end of the movable tube 31 is connected to the air hole 32. A first negative pressure pump 6 is fixedly installed on one side of the frame 1 through a fixed bracket, and the air intake of the first negative pressure pump 6 is connected to the movable tube 31.

[0043] Specifically, one side of one of the split plates 13 also has an opening, which is connected to the air hole 32. The movable tube 31 is movably installed in the opening, and the part of the movable tube 31 inserted into the opening has a limiting member larger than the diameter of the opening, thereby preventing the movable tube 31 from detaching from one side of the split plate 13. A magnet is provided at the end of the opening, and the connecting pipe between the first negative pressure pump 6 and the movable tube 31 is made of metal. Therefore, when the first negative pressure pump 6 and the movable tube 31 are facing each other, the magnet at the end of the movable tube 31 attracts the connecting pipe of the first negative pressure pump 6, allowing the first... The negative pressure pump 6 is connected to the movable tube 31. By turning on the first negative pressure pump 6, the adsorbed negative pressure can be transmitted to the air hole 32 through the movable tube 31, thereby adsorbing and fixing the stacked chips placed on the top of the split plate 13. When the split plate 13 is opened to both sides, the movable tube 31 can be disengaged from the connecting tube of the first negative pressure pump 6, so as not to hinder the opening and closing of the split plate 13. At the same time, the maximum extension length of the movable tube 31 is the contact length with the connecting tube of the first negative pressure pump 6, so it will not prevent the movable tube 31 and the connecting tube of the first negative pressure pump 6 from locking each other when the split plate 13 is closed.

[0044] Please see the appendix Figure 2 A hydraulic rod 20 is installed at the center of the top surface of the base 2. The telescopic end of the hydraulic rod 20 is connected to the bottom surface of the lifting plate 4. A third negative pressure pump 21 is installed on the top of the base 2. A first air pipe 22 is installed on the top of the third negative pressure pump 21. One end of the first air pipe 22 is connected to a first suction cup 23, and the first suction cup 23 is embedded in the interior of the lifting plate 4.

[0045] Specifically, by activating the hydraulic rod 20, the lifting plate 4 can slide on the surface of the upright 3. When the lifting plate 4 rises and falls, it can also raise and lower the mounting plate 24 and the substrate 25 on its top, thus facilitating the connection between the substrate 25 and the stacked chips inside the frame 1. The first air pipe 22 is made of flexible tubing, so when the lifting plate 4 rises and falls, the first air pipe 22 can extend accordingly, thus ensuring the normal rise and fall of the lifting plate 4. At the same time, by activating the third negative pressure pump 21, the third negative pressure pump 21 can transmit negative pressure to the first suction cup 23 through the first air pipe 22. The first suction cup 23 is embedded in the lifting plate 4, and the mounting plate 24 can be adsorbed and fixed through the suction port on the surface of the first suction cup 23, ensuring the stability of the stacked chip packaging.

[0046] Please see the appendix Figure 6 The bottom surface of the fixed plate 8 is fixedly mounted with a third motor 38 via a mounting bracket 39, and the output end of the third motor 38 is connected to the rotating rod 9. The bottom surface of the eccentric rod 11 is provided with a moving groove 33, and a screw 34 is provided inside the moving groove 33. The screw 34 passes through a moving block 35, and the moving block 35 is slidably connected to the moving groove 33. An electric push rod 37 is installed at the bottom of the moving block 35, and the telescopic end of the electric push rod 37 is connected to a second suction cup 28.

[0047] Specifically, the movable block 35 is connected to the screw 34 by a thread, and the movable block 35 is limited by the movable groove 33. When the screw 34 rotates, it can drive the movable block 35 to slide inside the movable groove 33. When the movable block 35 moves, the electric push rod 37 can drive the second suction cup 28 to move. When the second suction cup 28 adsorbs a single chip, the position of the single chip can be changed by adjusting the position of the second suction cup 28, thereby adjusting the relative position of the single chip and the stacked chips, increasing the flexibility of stacking and die bonding. The electric push rod 37 can control the lifting and lowering of the second suction cup 28, which makes it easier to lift and lower the adsorbed and fixed single chip, so as to facilitate the die bonding operation of stacked chips.

[0048] Please see the appendix Figure 3 and attached Figure 6 A second negative pressure pump 14 is fixedly installed at the top of the deflection rod 11. A second air pipe 27 is connected to one side of the second negative pressure pump 14, and one end of the second air pipe 27 is connected to the second suction cup 28. A second motor 36 is fixedly installed on one side of the deflection rod 11 through a fixing bracket, and the output end of the second motor 36 is connected to the screw 34.

[0049] Specifically, the second air tube 27 is also made of flexible tubing. Therefore, when the second suction cup 28 moves, the second air tube 27 can extend accordingly, thus not hindering the movement of the second suction cup 28. By turning on the second negative pressure pump 14, the negative pressure pump can transmit negative pressure suction to the second suction cup 28 through the second air tube 27. Through the suction port at the bottom of the second suction cup 28, a new single chip can be adsorbed, thus facilitating the die bonding operation of stacked chips.

[0050] Please see the appendix Figure 6 Appendix Figure 7 and attached Figure 8 The inner sides of the deflection rod 11 and the side plate 12 are respectively equipped with a second heat-conducting plate 41 and a first heat-conducting plate 40, and the second temperature sensor 43 and the first temperature sensor 42 are respectively installed on the top of the first heat-conducting plate 40 and the second heat-conducting plate 41. The telescopic rod 17 is divided into an inner rod and an outer rod. A pressure sensor 45 is installed inside the telescopic rod 17. A spring 44 is installed inside the telescopic rod 17, and the two ends of the spring 44 are respectively connected to the pressure sensor 45 and the inner rod.

[0051] Specifically, a first temperature sensor 42 is mounted on the top of the second heat-conducting sheet 41, and a second temperature sensor 43 is mounted on the top of the first heat-conducting sheet 40. The first heat-conducting sheet 40 and the second heat-conducting sheet 41 can protect the second temperature sensor 43 and the first temperature sensor 42 respectively. At the same time, the thermal conductivity of the first heat-conducting sheet 40 and the second heat-conducting sheet 41 facilitates the second temperature sensor 43 and the first temperature sensor 42 to detect the temperature of the surrounding area. When the split plate 13 moves into the extension opening 16 and continues to move in the opposite direction to the extrusion plate 18, the split plate 13... The pressure plate 18 is squeezed to one side, which in turn squeezes the telescopic rod 17 inward. The telescopic rod 17 inward squeezes the spring 44. The spring 44 can apply pressure to the pressure sensor 45 through its elastic potential energy. The pressure sensor 45 transmits the pressure signal to the controller 5. When the controller 5 receives the pressure information from the pressure sensor 45, it can determine that the split plate 13 is in the open state. Then, it can automatically control the hydraulic rod 20 to open, thereby driving the lifting plate 4 to rise, so as to control the upward movement of the mounting plate 24 and the substrate 25, so as to facilitate the packaging of stacked chips, increasing the processing efficiency and automation.

[0052] Example 2:

[0053] A method for packaging stacked chips, the method comprising the following steps:

[0054] S1. After the stacked chips are die-bonded and stacked on the top of the split plate 13, the two clamping blocks 29 are pushed to move relative to each other by the clamping assembly, so as to clamp and fix the stacked chips on the top of the split plate 13.

[0055] S2. By opening the electric slide rail 26, the electric slider 30 can be moved within the electric slide rail 26, thereby controlling the opening and closing of the split plate 13 and moving the split plate 13 to both sides to open the bottom opening of the frame 1.

[0056] S3, when the split plate 13 moves to both sides, it will enter the interior of the extension port 16. Then the split plate 13 continues to move in the opposite direction to the pressing plate 18, and then presses the pressing plate 18 to both sides. The pressing plate 18 causes the telescopic rod 17 to retract. The inner rod of the telescopic rod 17 presses the spring 44 inward. The spring 44 presses the pressure sensor 45 through elastic potential energy. The pressure sensor 45 transmits the pressure signal to the controller 5.

[0057] S4. The controller 5 receives the pressure signal received by the pressure sensor 45, and can then detect that the split plate 13 has been opened. At this time, the controller 5 will control the hydraulic rod 20 to move upward. The hydraulic rod 20 pushes the lifting plate 4 to slide on the surface of the upright 3. The rise of the lifting plate 4 can drive the top mounting plate 24 and the base plate 25 to rise.

[0058] S5, mounting plate 24 and substrate 25 continue to rise, so that substrate 25 contacts the bottom of the stacked chip that is clamped and positioned, and then the stacked chip is packaged on the top of substrate 25 by external packaging equipment, thereby completing the packaging operation.

[0059] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A die bonding device for stacked chips, characterized in that, The system includes a frame, with uprights fixedly connected to the four corners of the frame's bottom surface. Bases are fixedly installed at the bottom ends of the uprights. A lifting plate is movably installed on the outer side of the base. A mounting plate is provided on the top surface of the lifting plate, and a base plate is provided on the top of the mounting plate. A split plate is provided on the inner side of the frame. An electric slide rail is provided inside the frame, and an electric slider is installed on the inner side of the electric slide rail, with the electric slider fixedly connected to the split plate. Fixed frames are fixedly installed on both sides of the split plate, and multiple telescopic rods are installed on the inner side of the fixed frames. One end of each telescopic rod is fixedly connected to a pressing plate. Symmetrical extension openings are provided on the inner side of the frame, with the split plate positioned inside the extension openings. One... A fixed plate is fixedly installed on the side. A rotating rod is rotatably installed on the top of the fixed plate via a bearing. A deflection rod is fixedly installed at the top of the rotating rod. Side plates are fixedly installed on both sides of the deflection rod. A second temperature sensor and a first temperature sensor are respectively installed on the inner side of the deflection rod and the side plates. A laser emitter is installed on the top of the frame. The top of the split plate has symmetrically formed grooves, and a clamping block is provided on the inner side of the groove. A clamping assembly is connected to one side of the clamping block. An air blowing port is installed on the inner side of the frame. An ionized nitrogen purging device is installed inside the frame, and the outlet of the ionized nitrogen purging device is connected to the air blowing port. A controller is fixedly installed on one side of the frame via a fixed bracket.

2. The die bonding apparatus for stacked chips according to claim 1, characterized in that, The clamping assembly includes a threaded cylinder, a threaded rod, a first worm gear, a connecting worm, a second worm gear, and a double-stage worm. The two threaded rods are respectively fixedly installed on one side of the two clamping blocks. The threaded cylinder is sleeved on the outside of the threaded rod. The first worm gear is fixedly installed on one side of the threaded cylinder. The connecting worm is engaged with the bottom of the first worm gear. The second worm gear is fixedly installed at one end of the connecting worm. The double-stage worm is disposed on the top of the two second worm gears and is engaged with the two second worm gears respectively.

3. The die bonding apparatus for stacked chips according to claim 2, characterized in that, A first motor is fixedly installed on one side of the frame via a fixing bracket, and the output end of the first motor is connected to a double-segment worm gear. A guide rod is fixedly installed on the inner wall of the frame, and one end of the guide rod is connected to a clamping block.

4. The die bonding apparatus for stacked chips according to claim 1, characterized in that, The split plate is composed of two plates. A hole is opened in the center of the split plate, and an air hole is opened on the surface of the hole. A movable tube is provided on one side of the split plate, and one end of the movable tube is connected to the air hole. A first negative pressure pump is fixedly installed on one side of the frame through a fixed bracket, and the air inlet of the first negative pressure pump is connected to the movable tube.

5. The die bonding apparatus for stacked chips according to claim 1, characterized in that, A hydraulic rod is installed at the center of the top surface of the base. The telescopic end of the hydraulic rod is connected to the bottom surface of the lifting plate. A third negative pressure pump is installed on the top of the base. A first air pipe is installed on the top of the third negative pressure pump. One end of the first air pipe is connected to a first suction cup, and the first suction cup is embedded inside the lifting plate.

6. The die bonding apparatus for stacked chips according to claim 1, characterized in that, The bottom surface of the fixed plate is fixedly mounted with a third motor by a mounting bracket, and the output end of the third motor is connected to the rotating rod. The bottom surface of the deflecting rod is provided with a moving groove, and a screw is provided inside the moving groove. The screw passes through a moving block, and the moving block and the moving groove are slidably connected. An electric push rod is installed at the bottom of the moving block, and the telescopic end of the electric push rod is connected to a second suction cup.

7. The die bonding apparatus for stacked chips according to claim 6, characterized in that, A second negative pressure pump is fixedly installed at the top of the deflection rod. A second air pipe is connected to one side of the second negative pressure pump, and one end of the second air pipe is connected to a second suction cup. A second motor is fixedly installed on one side of the deflection rod through a fixing bracket, and the output end of the second motor is connected to a screw.

8. The die bonding apparatus for stacked chips according to claim 1, characterized in that, The inner sides of the deflection rod and the side plate are respectively equipped with a second heat-conducting plate and a first heat-conducting plate, and the second temperature sensor and the first temperature sensor are respectively installed on the top of the first heat-conducting plate and the second heat-conducting plate.

9. The die bonding apparatus for stacked chips according to claim 1, characterized in that, The telescopic rod is divided into an inner rod and an outer rod. A pressure sensor is installed inside the telescopic rod, and a spring is installed inside the telescopic rod. The two ends of the spring are connected to the pressure sensor and the inner rod, respectively.

10. A method for packaging stacked chips, characterized in that, A die bonding apparatus for a stacked chip according to any one of claims 1-9, the method comprising the following steps: S1. After the stacked chips are die-bonded and stacked on the top of the split plate, the two clamping blocks are pushed to move relative to each other by the clamping components, so as to clamp and fix the stacked chips on the top of the split plate. S2. By opening the electric slide rail, the electric slider can be moved within the electric slide rail, thereby controlling the opening and closing of the split plate and moving the split plate to both sides to open the bottom opening of the frame. S3, when the split plate moves to both sides, it will enter the interior of the extension port, and then the split plate continues to move in the opposite direction to the extrusion plate, thereby extruding the extrusion plate to both sides. The extrusion plate causes the telescopic rod to retract, and the inner rod of the telescopic rod extrudes the spring inward. The spring extrudes the pressure sensor through elastic potential energy, and the pressure sensor transmits the pressure signal to the controller. S4. The controller receives the pressure signal from the pressure sensor and can then detect that the split plate has been opened. At this time, the controller will control the hydraulic rod to move upward. The hydraulic rod pushes the lifting plate to slide on the surface of the upright. The lifting plate rising can drive the top mounting plate and base plate to rise. S5. The mounting plate and substrate continue to rise, bringing the substrate into contact with the bottom of the stacked chips that are clamped and positioned. Then, through external packaging equipment, the stacked chips are packaged on top of the substrate, thus completing the packaging operation.

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