Optical module

Abstract

According to the optical module, an optical receiving component (500) comprises a plurality of optical receiving assemblies (520, 530 and 540), a first optical receiving assembly (520) and a second optical receiving assembly (530) are located on one side of the optical receiving component (500), and a third optical receiving assembly (540) is located on the other side of the optical receiving component (500). A transmitting optical signal is transmitted through the first optical filter (5173), and a receiving optical signal is reflected by the first optical filter (5173), the first reflector plate (5174) and the second reflector plate (5175) in sequence, then enters the wave division assembly (5172) and is divided into a first wavelength optical signal, a second wavelength optical signal and a third wavelength optical signal through the wave division assembly (5172). The branching unit (5172) is provided in the longitudinal direction of the light receiving member (500). The first end of the wave division assembly (5172) is provided with a first light emitting position, the second end of the wave division assembly (5172) is provided with a second light emitting position and a third light emitting position, and the three beams of receiving light signals are transmitted through the first light emitting position, the second light emitting position and the third light emitting position respectively.

Description

Optical module

[0001] This application claims priority to the application filed on August 22, 2024 with the China Patent Office, application number 202411163298.8; the application filed on June 13, 2024 with the China Patent Office, application number 202410764520.3; the application filed on June 13, 2024 with the China Patent Office, application number 202410765686.7; the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present disclosure relates to the field of optical fiber communication technology, in particular to an optical module. BACKGROUND

[0003] With the development of new business and application modes such as cloud computing, mobile Internet, video, etc., the development and progress of optical communication technology become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are one of the key devices in optical communication equipment. With the development of optical communication technology, the transmission rate of optical modules is continuously increasing.

[0004] SUMMARY

[0005] The present disclosure provides an optical module, comprising:

[0006] An optical receiving component is connected to an optical fiber adapter at a first end and connected to an optical transmitting component at a second end, wherein the light emitting direction of the optical transmitting component is towards the optical fiber adapter; the optical receiving component comprises:

[0007] A first housing;

[0008] A first optical receiving assembly;

[0009] A second optical receiving assembly is located on one side wall of the first housing with the first optical receiving assembly;

[0010] A third optical receiving assembly is located on another side wall of the first housing;

[0011] A first reflective sheet is located on the receiving light path of the first optical receiving assembly;

[0012] A second reflective sheet is located on the receiving light path of the second optical receiving assembly;

[0013] A wave division assembly is provided at the first end of the first housing and at the second end of the first housing; the transmitting light signal emitted by the optical transmitting component is emitted to the optical fiber adapter through the wave division assembly;

[0014] The received optical signal transmitted by the fiber adapter is incident to the demultiplexing component, and after being reflected by the demultiplexing component, the received optical signal is divided into a first wavelength optical signal, a second wavelength optical signal and a third wavelength optical signal and then emitted; the received optical signal includes the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal;

[0015] The first wavelength optical signal is incident to the first light receiving component via the first reflecting sheet;

[0016] The second wavelength optical signal is incident to the second light receiving component via the second reflecting sheet;

[0017] The third wavelength optical signal is incident to the third light receiving component via the demultiplexing component. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art without creative labor.

[0019] Fig. 1 is a partial structure diagram of an optical communication system according to some embodiments;

[0020] Fig. 2 is a partial structure diagram of a host computer according to some embodiments;

[0021] Fig. 3 is a structure diagram of an optical module according to some embodiments;

[0022] Fig. 4 is an exploded view of an optical module according to some embodiments;

[0023] Fig. 5 is an assembly view of an optical transceiver component and a fiber adapter according to some embodiments;

[0024] Fig. 6 is an exploded view of an optical transceiver component and a fiber adapter according to some embodiments;

[0025] Fig. 7 is a structure diagram of a first cavity according to some embodiments;

[0026] Fig. 8 is an exploded view of a first cavity according to some embodiments;

[0027] Fig. 9 is an exploded view of a first housing and a first light component according to some embodiments;

[0028] Fig. 10 is a sectional view of a first housing according to some embodiments;

[0029] FIG. 11 is a light path diagram of a first optical assembly according to some embodiments;

[0030] FIG. 12 is a light path diagram of another first optical assembly according to some embodiments;

[0031] FIG. 13 is a structural diagram of a wave division assembly according to some embodiments;

[0032] FIG. 14 is a sectional view of an optical transceiver according to some embodiments;

[0033] FIG. 15 is an assembly view of an optical transceiver and a fiber adapter from another perspective according to some embodiments;

[0034] FIG. 16 is a structural diagram of an optical transmitting component according to some embodiments;

[0035] FIG. 17 is an exploded view of a second housing and an electrical connector according to some embodiments;

[0036] FIG. 18 is a light path diagram of a second optical assembly according to some embodiments;

[0037] FIG. 19 is a light path diagram of another second optical assembly according to some embodiments;

[0038] FIG. 20 is an assembly view of an optical transceiver and a fiber adapter and a circuit board from another perspective according to some embodiments;

[0039] FIG. 21 is an exploded view of an optical transceiver and a fiber adapter and a circuit board according to some embodiments;

[0040] FIG. 22 is an exploded view of a flexible circuit board according to some embodiments;

[0041] FIG. 23 is an assembly view of an optical transceiver and a circuit board and a portion of a flexible circuit board according to some embodiments;

[0042] FIG. 24 is an assembly view of an optical transceiver and a circuit board and another portion of a flexible circuit board according to some embodiments;

[0043] FIG. 25 is an assembly view of an optical transceiver and a fiber adapter according to some embodiments;

[0044] FIG. 26 is an exploded view of an optical transceiver and a fiber adapter according to some embodiments;

[0045] FIG. 27 is a structural diagram of a first cavity according to some embodiments;

[0046] FIG. 28 is an assembly view of a first optical receiving assembly, a bracket, and a first filter according to some embodiments;

[0047] FIG. 29 is a cross-sectional view of a first light receiving assembly, a bracket, and a first filter, according to some embodiments;

[0048] FIG. 30 is an exploded view of a first light receiving assembly, a bracket, and a first filter, according to some embodiments;

[0049] FIG. 31 is a structural view of a bracket, according to some embodiments;

[0050] FIG. 32 is a structural view of a bracket, according to some embodiments;

[0051] FIG. 33 is an exploded view of a first cavity, according to some embodiments;

[0052] FIG. 34 is an exploded view of a first housing and a light receiving assembly, according to some embodiments;

[0053] FIG. 35 is an optical path diagram of a light receiving assembly, according to some embodiments;

[0054] FIG. 36 is a structural view of a first housing, according to some embodiments;

[0055] FIG. 37 is a structural view of a first housing, according to some embodiments;

[0056] FIG. 38 is a cross-sectional view of a first housing, according to some embodiments;

[0057] FIG. 39 is a cross-sectional view of a light receiving component, according to some embodiments;

[0058] FIG. 40 is a cross-sectional view of a light receiving component, according to some embodiments;

[0059] FIG. 41 is an assembly view of another light receiving component and a conversion board, according to some embodiments;

[0060] FIG. 42 is an assembly view of another light receiving component, a fiber adapter, and a circuit board, according to some embodiments;

[0061] FIG. 43 is an exploded view of another light receiving component, according to some embodiments;

[0062] FIG. 44 is an exploded view of another light receiving component, according to some embodiments;

[0063] FIG. 45 is an exploded view of another first housing and another light receiving assembly, according to some embodiments;

[0064] Figure 46 is a structural diagram of a light emitting component according to some embodiments;

[0065] Figure 47 is a structural diagram of a light emitting component according to some embodiments;

[0066] Figure 48 is an exploded diagram of a light emitting component according to some embodiments;

[0067] Figure 49 is a partial structural diagram of a light emitting component according to some embodiments;

[0068] Figure 50 is a partial structural diagram of a light emitting component according to some embodiments;

[0069] Figure 51 is a cross-sectional view of a light emitting component according to some embodiments;

[0070] Figure 52 is a partial structural diagram of a light emitting component according to some embodiments;

[0071] Figure 53 is a cross-sectional view of a light emitting component according to some embodiments;

[0072] Figure 54 is a cross-sectional view of a light emitting component according to some embodiments;

[0073] Figure 55 is a transmission optical path diagram of a light emitting signal according to some embodiments;

[0074] Figure 56 is a structural diagram of a mounting bracket according to some embodiments;

[0075] Figure 57 is a structural diagram of a mounting bracket according to some embodiments;

[0076] Figure 58 is a use state diagram of a mounting bracket according to some embodiments;

[0077] Figure 59 is a structural diagram of another light emitting component according to some embodiments;

[0078] Figure 60 is an assembly diagram of another light emitting and receiving component and a fiber adapter according to some embodiments;

[0079] Figure 61 is an exploded diagram of another light emitting component according to some embodiments;

[0080] Figure 62 is an exploded diagram of another light emitting component according to some embodiments;

[0081] Figure 63 is an exploded diagram of a light emitting assembly according to some embodiments;

[0082] FIG. 64 is a cross-sectional view of a light emitting assembly, according to some embodiments;

[0083] FIG. 65 is a light emitting path diagram, according to some embodiments. DETAILED DESCRIPTION

[0084] Some embodiments of the present disclosure will be described in detail below with reference to the drawings. However, the described embodiments are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided in the present disclosure, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present disclosure.

[0085] Unless otherwise required by the context, throughout the specification and claims, the term "comprising" is interpreted to mean "including, but not limited to"; the terms "first", "second", etc. are not used to denote or imply relative importance or to indicate a quantity of limitations; the term "multiple" means two or more; the term "connected" is to be interpreted broadly, for example, "connected" can be fixedly connected, or detachably connected, or integrated, can be directly connected, or indirectly connected through an intermediate medium; the use of the terms "adapted to" or "configured to" means open and inclusive language, which does not exclude devices adapted to or configured to perform additional tasks or steps; the terms "parallel", "vertical", "same", "consistent", "flush", etc. are not limited to absolute mathematical relationships, but also include acceptable error ranges generated in practice, and differences formed based on the same design concept but due to manufacturing reasons.

[0086] In optical communication technology, in order to establish information transmission between information processing devices, information needs to be loaded onto light, and the transmission of information is achieved by the propagation of light. Here, the light loaded with information is an optical signal. The optical signal can reduce the loss of optical power when transmitted in the information transmission device, so as to achieve high-speed, long-distance, low-cost information transmission. The signal that the information processing device can recognize and process is an electrical signal. The information processing device usually includes an optical network unit (ONU), a gateway, a router, a switch, a mobile phone, a computer, a server, a tablet computer, a television, etc., and the information transmission device usually includes an optical fiber and an optical waveguide, etc.

[0087] The optical module can realize mutual conversion between optical signals and electrical signals between the information processing device and the information transmission device. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected with an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected with an optical network terminal; a first optical signal from the optical fiber is transmitted to the optical module, the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; a second electrical signal from the optical network terminal is transmitted to the optical module, the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since information transmission can be performed between multiple information processing devices through electrical signals, at least one of the multiple information processing devices needs to be directly connected with the optical module, without the need for all the information processing devices to be directly connected with the optical module. Here, the information processing device directly connected with the optical module is referred to as a host computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be referred to as an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be referred to as an electrical port.

[0088] FIG. 1 is a partial structure diagram of an optical communication system according to some embodiments. As shown in FIG. 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0089] One end of the optical fiber 101 extends towards the remote information processing device 1000, and the other end of the optical fiber 101 is connected with the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the totally reflected direction can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance and low-power-loss information transmission.

[0090] The optical communication system can include one or more optical fibers 101, and the optical fiber 101 can be detachably connected with the optical module 200 or fixedly connected. The host computer 100 is configured to provide a data signal to the optical module 200, or receive a data signal from the optical module 200, or monitor or control the working state of the optical module 200.

[0091] The host computer 100 includes a housing substantially in the shape of a rectangular cuboid, and an optical module connecting hole 102 arranged on the housing. The optical module connecting hole 102 is configured to access the optical module 200, so as to establish one-way or two-way electrical signal connection between the host computer 100 and the optical module 200.

[0092] The host computer 100 further comprises an external electrical connection hole configured to access an electrical signal network. For example, the external electrical connection hole comprises a Universal Serial Bus (USB) connection hole or a network cable connection hole 104 configured to access a network cable 103 to establish a one-way or two-way electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100 to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted to the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal to the host computer 100, the host computer 100 generates a fourth electrical signal according to the first electrical signal, and the fourth electrical signal is transmitted to the local information processing device 2000. It should be noted that the optical module is a tool for converting optical signals and electrical signals, and the information does not change in the conversion process of the optical signals and the electrical signals, and the encoding and decoding mode of the information can change.

[0093] In addition to the optical network terminal, the host computer 100 further comprises an Optical Line Terminal (OLT), an Optical Network Terminal (ONT), or a data center server, etc.

[0094] Figure 2 is a partial structure diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, only the structure of the host computer 100 related to the optical module 200 is shown in Figure 2. As shown in Figure 2, the host computer 100 further comprises a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector arranged inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a fin or other protruding structure to increase the heat dissipation area.

[0095] The optical module 200 is inserted into the cage 106 of the host computer 100, and the optical module 200 is fixed by the cage 106. The heat generated by the optical module 200 is conducted to the cage 106, and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 and the host computer 100 establish a bidirectional electrical signal connection. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 and the optical fiber 101 establish a bidirectional optical signal connection.

[0096] FIG. 3 is a structural diagram of an optical module according to some embodiments, and FIG. 4 is an exploded view of an optical module according to some embodiments. As shown in FIGS. 3 and 4, the optical module 200 includes a shell, a circuit board 300 arranged in the shell, an optical transmitting component 400, and an optical receiving component 500. However, the present disclosure is not limited thereto, and in some embodiments, the optical module 200 includes one of the optical transmitting component 400 and the optical receiving component 500.

[0097] The shell includes an upper shell 201 and a lower shell 202. The upper shell 201 is covered on the lower shell 202 to form the above-mentioned shell having two openings 204 and 205. The outer contour of the shell generally presents a square body.

[0098] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 arranged perpendicularly to the bottom plate 2021 on both sides of the bottom plate 2021. The upper shell 201 includes a cover plate 2011, and the cover plate 2011 is covered on the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0099] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 arranged perpendicularly to the bottom plate 2021 on both sides of the bottom plate 2021. The upper shell 201 includes a cover plate 2011 and two upper side plates arranged perpendicularly to the cover plate 2011 on both sides of the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to achieve that the upper shell 201 is covered on the lower shell 202.

[0100] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or can be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 (the left end of FIG. 3), and the opening 205 is also located at the end of the optical module 200 (the right end of FIG. 3). Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold fingers of the circuit board 300 extend from the electrical port and are inserted into the electrical connector of the host computer 100; the opening 205 is an optical port configured to access the external optical fiber 101, so that the optical fiber 101 is connected to the optical transmitting component 400 and the optical receiving component 500 in the optical module 200.

[0101] The assembly of the upper shell 201 and the lower shell 202 facilitates the installation of the circuit board 300, the optical transmitting component 400, and the optical receiving component 500 into the shells, and the shells can protect the above-mentioned devices. In addition, when the circuit board 300, the optical transmitting component 400, and the optical receiving component 500 are assembled, the positioning components, heat dissipation components, and electromagnetic shielding components of these devices can be easily arranged, which is beneficial for automated production.

[0102] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which is beneficial for electromagnetic shielding and heat dissipation.

[0103] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside the shell of the optical module 200. The unlocking component 600 is configured to achieve fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0104] For example, the unlocking component 600 is located outside the two lower side plates 2022 of the lower shell 202, and includes a clamping component matched with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the clamping component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the clamping component of the unlocking component 600 moves, thereby changing the connection relationship between the clamping component and the host computer, to release the fixation between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0105] The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to circuit design through the circuit traces to realize power supply, electrical signal transmission, and grounding, etc. The electronic components may, for example, include capacitors, resistors, transistors, and Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). The chips may, for example, include Microcontroller Units (MCUs), laser drive chips, Transimpedance Amplifiers (TIAs), Limiting Amplifiers (LIAs), Clock and Data Recovery (CDR) chips, power management chips, and Digital Signal Processing (DSP) chips.

[0106] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize a bearing function, such as stably bearing the above-mentioned electronic components and chips. The rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0107] The circuit board 300 also includes a gold finger formed on the surface of its end portion. The gold finger is composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106, and the gold finger is in conduction with the electrical connector in the cage 106. The gold finger can be provided only on the surface (e.g., the upper surface shown in FIG. 4) of one side of the circuit board 300, or can be provided on the surfaces of both upper and lower sides of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions requiring a large number of pins. The gold finger is configured to establish electrical connection with the host computer to realize power supply, grounding, Inter-Integrated Circuit (I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. The flexible circuit board is generally used in cooperation with the rigid circuit board to supplement the rigid circuit board.

[0108] At least one of the optical transmitting component 400 or the optical receiving component 500 is located on the side of the circuit board 300 away from the gold finger.

[0109] In some embodiments, the optical transmitting component 400 and the optical receiving component 500 are physically separated from the circuit board 300, and then are electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors, respectively.

[0110] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 can be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 can be disposed on a surface of the circuit board 300 or a side edge of the circuit board 300.

[0111] The light emitting component and the light receiving component constitute a light transceiver component, and the light transceiver component is electrically connected to the circuit board 300. The light emitting component is a transmitting end of the light transceiver component, and the light receiving component is a receiving end of the light transceiver component. Both the transmitting end of the light transceiver component and the receiving end of the light transceiver component are electrically connected to the circuit board 300.

[0112] In some embodiments, the light emitting component 400 can generate light signals of multiple wavelengths. The light signals of multiple wavelengths can be combined into one beam of transmitted light signals, so that the number of transmitted light signals emitted by the light emitting component 400 is one beam. For example, the light emitting component 400 can generate light signals of three wavelengths, and the light signals of three wavelengths have different rates, such as a fourth wavelength light signal, a fifth wavelength light signal and a sixth wavelength light signal having different rates.

[0113] In some embodiments, the fourth wavelength light signal has a wavelength range of 1340-1344 nm, such as a wavelength of 1342 nm; the fifth wavelength light signal has a wavelength range of 1480-1500 nm, such as a wavelength of 1490 nm; and the sixth wavelength light signal has a wavelength range of 1575-1580 nm, such as a wavelength of 1577 nm.

[0114] In some embodiments, the light receiving component 500 can receive received light signals including multiple wavelengths. For example, the light receiving component 500 receives received light signals of three wavelengths, and the received light signals of three wavelengths have different rates, such as a first wavelength light signal, a second wavelength light signal and a third wavelength light signal having different rates. The first wavelength light signal includes a received light signal of a first wavelength, the second wavelength light signal includes a received light signal of a second wavelength, and the third wavelength light signal includes a received light signal of a third wavelength.

[0115] In some embodiments, the first wavelength light signal can have a wavelength range of 1284-1288 nm, or 1290-1330 nm, or 1260-1280 nm. For example, the first wavelength light signal has a wavelength range of 1284-1288 nm, such as a wavelength of 1286 nm.

[0116] In some embodiments, the wavelength range of the second wavelength optical signal can be 1284-1288 nm, or 1290-1330 nm, or 1260-1280 nm. For example, the wavelength range of the second wavelength optical signal is 1290-1330 nm, such as the wavelength of the second wavelength optical signal is 1310 nm.

[0117] In some embodiments, the wavelength range of the third wavelength optical signal can be 1284-1288 nm, or 1290-1330 nm, or 1260-1280 nm. For example, the wavelength range of the third wavelength optical signal is 1260-1280 nm, such as the wavelength of the third wavelength optical signal is 1270 nm.

[0118] As shown in FIG. 4, in some embodiments, the housing of the optical module 200 can be provided with a fiber adapter 700. One end of the fiber adapter 700 can be connected with the first end of the light receiving component 500, so that the externally input received optical signal is input to the light receiving component 500 through the fiber adapter 700. In some embodiments, the second end of the light receiving component 500 and the first end of the light receiving component 500 can be arranged at both ends of the light receiving component 500 along the length direction of the light receiving component 500.

[0119] The second end of the light receiving component 500 can be connected with the light emitting component 400, and the first end of the light receiving component 500 can be connected with one end of the fiber adapter 700, and the light emitting direction of the light emitting component 400 is towards the fiber adapter 700, so that the emitted optical signal emitted by the light emitting component 400 is first transmitted into the light receiving component 500, then transmitted to the fiber adapter 700 through the light receiving component 500, and finally output through the fiber adapter 700. The light receiving component 500 and the light emitting component 400 share the fiber adapter 700, and thus the uplink optical signal and the downlink optical signal of the optical module share the optical fiber 101.

[0120] In some embodiments, among the optical signals incident to the light receiving component 500, the number of the emitted optical signals (i.e., emitted light beams) emitted by the light emitting component 400 is less than the number of the externally input received optical signals (i.e., received light beams). For example, among the optical signals incident to the light receiving component 500, the number of the emitted optical signals (i.e., emitted light beams) emitted by the light emitting component 400 is at least two less than the number of the externally input received optical signals (i.e., received light beams), so as to reduce the difficulty of light splitting of the optical signals in the light receiving component 500.

[0121] FIG. 5 is an assembly view of an optical transceiver assembly and a fiber optic adapter, according to some embodiments. FIG. 6 is an exploded view of an optical transceiver assembly and a fiber optic adapter, according to some embodiments. FIG. 7 is a structural view of a first cavity, according to some embodiments. As shown in FIGS. 5, 6, and 7, in some embodiments, the optical receiving component 500 can include a first cavity. One end of the first cavity can be connected with the optical transmitting component 400. The other end of the first cavity can be connected with the fiber optic adapter 700, so that the first cavity can receive the received optical signal transmitted by the fiber optic adapter 700. One end of the first cavity can be connected with the optical transmitting component 400, and the other end of the first cavity can be connected with one end of the fiber optic adapter 700, so that the transmitted optical signal emitted by the optical transmitting component 400 is first transmitted into the first cavity, then transmitted from the first cavity to the fiber optic adapter 700, and finally output from the fiber optic adapter 700.

[0122] As shown in FIGS. 5, 6, and 7, in some embodiments, the optical receiving component 500 can include at least one optical receiving assembly. The at least one optical receiving assembly can be connected with the first cavity, so that the received optical signal (in some examples, which can include optical signals of multiple wavelengths) input from outside is input into the first cavity through the fiber optic adapter 700, and then transmitted from the first cavity to the at least one optical receiving assembly.

[0123] In some embodiments, the at least one optical receiving assembly can include a first optical receiving assembly 520. The first optical receiving assembly 520 can receive a first wavelength optical signal, and the wavelength range of the first wavelength optical signal can be 1284-1288 nm. It can be understood that the wavelength range of the first wavelength optical signal is only shown as a specific example in some embodiments of the present disclosure, and is not limited to the specific wavelength range of the first wavelength optical signal.

[0124] In some embodiments, the at least one optical receiving assembly can include a second optical receiving assembly 530. The second optical receiving assembly 530 can receive a second wavelength optical signal, and the wavelength range of the second wavelength optical signal can be 1260-1280 nm. It can be understood that the wavelength range of the second wavelength optical signal is only shown as a specific example in some embodiments of the present disclosure, and is not limited to the specific wavelength range of the second wavelength optical signal.

[0125] In some embodiments, the at least one optical receiving assembly can include a third optical receiving assembly 540. The third optical receiving assembly 540 can receive a third wavelength optical signal, and the wavelength range of the third wavelength optical signal can be 1290-1330 nm. It can be understood that the wavelength range of the third wavelength optical signal is only shown as a specific example in some embodiments of the present disclosure, and is not limited to the specific wavelength range of the third wavelength optical signal.

[0126] The at least one light receiving component includes a first light receiving component 520, a second light receiving component 530, and a third light receiving component 540, so that the light receiving part 500 can receive three wavelengths of optical signals with different rates.

[0127] In some embodiments, the first light receiving component 520, the second light receiving component 530, and the third light receiving component 540 each include a receiving tube cap and a receiving tube base, the receiving tube cap is arranged on the receiving tube base to form a receiving cavity, and a light receiving chip is arranged in the receiving cavity, the light receiving chip receives an optical signal and converts the optical signal into an electrical signal.

[0128] The receiving tube base is also provided with a receiving tube pin.

[0129] In some examples, one end of the receiving tube pin can be electrically connected to the circuit board 300.

[0130] In some examples, one end of the receiving tube pin can be electrically connected to the circuit board 300 through a conductor.

[0131] In some examples, the conductor can be arranged on a flexible circuit board. That is, one end of the receiving tube pin can be connected to the circuit board 300 through the flexible circuit board to realize the electrical connection between the receiving tube pin and the circuit board 300.

[0132] In some examples, the receiving tube pin extends upward from the bottom of the receiving tube base until it exceeds the top of the receiving tube base, and is wire-bonded to a pad where the light receiving chip is located to realize the electrical connection between the receiving tube pin and the light receiving chip, and then transmit the electrical signal to the circuit board 300 through the receiving tube pin.

[0133] In some embodiments, the receiving tube cap of the light receiving component is provided with a second lens. The second lens is a converging lens that can converge and couple the optical signal incident on the second lens to the light receiving chip in the receiving cavity.

[0134] In some embodiments, the receiving rate of the light receiving chip of the first light receiving component 520, the receiving rate of the light receiving chip of the second light receiving component 530, and the receiving rate of the light receiving chip of the third light receiving component 540 can all be different. For example, the receiving rate of the light receiving chip of the first light receiving component 520 is greater than the receiving rate of the light receiving chip of the second light receiving component 530, and greater than the receiving rate of the light receiving chip of the third light receiving component 540. For example, the receiving rate of the light receiving chip of the first light receiving component 520 is 25G, the receiving rate of the light receiving chip of the second light receiving component 530 is 10G, and the receiving rate of the light receiving chip of the third light receiving component 540 is 2.5G.

[0135] In some embodiments, the first light receiving component 520, the second light receiving component 530, and the third light receiving component 540 can be located on the same side wall of the first cavity.

[0136] In some examples, two of the first light receiving component 520, the second light receiving component 530, and the third light receiving component 540 can be located on one side of the first cavity, and the other of the first light receiving component 520, the second light receiving component 530, and the third light receiving component 540 can be located on the other side of the first cavity. In this way, the length of the light receiving component 500 can be reduced.

[0137] In some embodiments, the first light receiving component 520 and the second light receiving component 530 can be located on one side wall of the first cavity, and the third light receiving component 540 can be located on the other side wall of the first cavity, so as to reduce the length of the light receiving component 500.

[0138] In some embodiments, the first cavity can include a first connecting hole 5111. The first connecting hole 5111 can be located at the first end of the first cavity. The first connecting hole 5111 can be connected with the fiber adapter 700, so as to connect the fiber adapter 700 with the first cavity. For example, one end of the connecting sleeve 710 is inserted into the first connecting hole 5111, and the other end of the connecting sleeve 710 is connected with the fiber adapter 700, so as to connect the fiber adapter 700 with the first cavity through the connecting sleeve 710.

[0139] In some embodiments, the first cavity can include a second connecting hole 5131. The second connecting hole 5131 can be located at the second end of the first cavity. The second connecting hole 5131 can be connected with the light emitting component 400, so as to connect the light emitting component 400 with the first cavity.

[0140] In some embodiments, the first connecting hole 5111 and the second connecting hole 5131 can be oppositely arranged.

[0141] In some embodiments, the first cavity can include a third connecting hole 5122. The third connecting hole 5122 can be configured to be inserted with the first light receiving component 520, so as to connect the first light receiving component 520 with the first cavity.

[0142] In some embodiments, the first cavity can include a fourth connecting hole 5121. The fourth connecting hole 5121 can be configured to be inserted with the second light receiving component 530, so as to connect the second light receiving component 530 with the first cavity.

[0143] In some embodiments, the first cavity can include a fifth connecting hole 5141. The fifth connecting hole 5141 can be configured for insertion of the third light receiving assembly 540, so that the third light receiving assembly 540 is connected with the first cavity.

[0144] In some embodiments, the third connecting hole 5122 and the fourth connecting hole 5121 can be located at one sidewall of the first cavity, and the fifth connecting hole 5141 can be located at another sidewall of the first cavity, so that the first light receiving assembly 520 and the second light receiving assembly 530 are located at one sidewall of the first cavity, and the third light receiving assembly 540 is located at another sidewall of the first cavity, thereby reducing the length dimension of the first cavity.

[0145] FIG. 8 is an exploded view of a first cavity according to some embodiments. FIG. 9 is an exploded view of a first housing and a first light assembly according to some embodiments. As shown in FIGS. 8 and 9, in some embodiments, the first cavity can include a first housing 510.

[0146] In some embodiments, the first cavity can include a first cover plate 515. The first cover plate 515 can be coupled to the first housing 510 to form the first cavity. A first light assembly 517 can be disposed in the first cavity. The first light assembly 517 can transmit the emitted light signal to the fiber optic adapter 700, and can also split the received light signal transmitted by the fiber optic adapter 700 to the first cavity, and then the split light signal is incident on the corresponding light receiving assembly.

[0147] During assembly, the first light assembly 517 is first fixed in the first housing 510, and then the first cover plate 515 is coupled to the first housing 510 to assemble the first light assembly 517 into the first cavity.

[0148] FIG. 10 is a cross-sectional view of a first housing according to some embodiments. As shown in FIGS. 8, 9, and 10, in some embodiments, the first housing 510 can be inwardly recessed to form a receiving cavity 516, which is an inner cavity of the first cavity, and the receiving cavity 516 can be in communication with the first connecting hole 5111, the second connecting hole 5131, the third connecting hole 5122, the fourth connecting hole 5121, and the fifth connecting hole 5141. The receiving cavity 516 can accommodate devices other than the first lens 5171 in the first light assembly 517.

[0149] In some embodiments, the first housing 510 can include a first sidewall 511. The first sidewall 511 can have a first connecting hole 5111. The first connecting hole 5111 can traverse the first sidewall 511, so that the first connecting hole 5111 can be in communication with the inner cavity of the first cavity, thereby allowing the light signal to be transmitted in and out of the first cavity along the first connecting hole 5111.

[0150] In some embodiments, the first housing 510 can include a second side wall 512. One end of the second side wall 512 can be connected with one end of the first side wall 511.

[0151] In some embodiments, the second side wall 512 can have a third connecting hole 5122. The third connecting hole 5122 can traverse the second side wall 512, such that the third connecting hole 5122 can be in communication with the inner cavity of the first cavity, and thus the optical signal of the inner cavity of the first cavity can be incident to the light receiving component connected with the third connecting hole 5122.

[0152] In some embodiments, the second side wall 512 can have a fourth connecting hole 5121. The fourth connecting hole 5121 can traverse the second side wall 512, such that the fourth connecting hole 5121 can be in communication with the inner cavity of the first cavity, and thus the optical signal of the inner cavity of the first cavity can be incident to the light receiving component connected with the fourth connecting hole 5121.

[0153] In some embodiments, the first housing 510 can include a third side wall 513. One end of the third side wall 513 can be connected with the other end of the second side wall 512. The third side wall 513 can be disposed opposite to the first side wall 511. The third side wall 513 can have a second connecting hole 5131. The second connecting hole 5131 can traverse the third side wall 513, such that the second connecting hole 5131 can be in communication with the inner cavity of the first cavity, and thus the emitted light signal emitted by the light emitting component 400 can be incident to the first cavity along the second connecting hole 5131.

[0154] In some embodiments, the first housing 510 can include a fourth side wall 514. One end of the fourth side wall 514 can be connected with one end of the third side wall 513. The other end of the fourth side wall 514 can be connected with the other end of the first side wall 511. The fourth side wall 514 can be disposed opposite to the second side wall 512.

[0155] In some embodiments, the fourth side wall 514 can have a fifth connecting hole 5141. The fifth connecting hole 5141 can traverse the fourth side wall 514, such that the fifth connecting hole 5141 can be in communication with the inner cavity of the first cavity, and thus the optical signal of the inner cavity of the first cavity can be incident to the light receiving component connected with the fifth connecting hole 5141.

[0156] In some embodiments, the first housing 510 can include a bottom plate 5161. The bottom plate 5161 can be used to support the first light assembly 517. The bottom plate 5161 can be connected with bottoms of the first sidewall 511, the second sidewall 512, the third sidewall 513, and the fourth sidewall 514, respectively. The first sidewall 511, the second sidewall 512, the third sidewall 513, and the fourth sidewall 514 are connected in sequence and connected with the bottom plate 5161, respectively, to form the first housing 510 with an opening at the top.

[0157] In some embodiments, the third sidewall 513 can include a first connecting wall 5132. One end of the first connecting wall 5132 can be connected with the second sidewall 512.

[0158] In some embodiments, the third sidewall 513 can include a first supporting wall 5133. The first supporting wall 5133 is closer to the first sidewall 511 than the first connecting wall 5132. The first supporting wall 5133 can be connected with the first connecting wall 5132. The first supporting wall 5133 is more concave than the first connecting wall 5132, so that the first supporting wall 5133 supports the first cover plate 515.

[0159] In some embodiments, the fourth sidewall 514 can include a second connecting wall 5143. One end of the second connecting wall 5143 can be connected with the first connecting wall 5132. The other end of the second connecting wall 5143 can be connected with the first sidewall 511.

[0160] In some embodiments, the fourth sidewall 514 can include a second supporting wall 5144. One end of the second supporting wall 5144 can be connected with the first supporting wall 5133. The other end of the second supporting wall 5144 can be connected with the first sidewall 511. The second supporting wall 5144 can be connected with the second connecting wall 5143. The second supporting wall 5144 is more concave than the second connecting wall 5143, so that the second supporting wall 5144 supports the first cover plate 515.

[0161] The first supporting wall 5133 and the second supporting wall 5144 can jointly support the first cover plate 515, so as to increase the contact area of the first cover plate 515 with the first housing 510 and improve the connection stability of the first cover plate 515 with the first housing 510.

[0162] In some embodiments, the second supporting wall 5144 can include a first supporting portion 51441. One end of the first supporting portion 51441 can be connected with the first supporting wall 5133.

[0163] The diameter size of the fifth connecting hole 5141 is equal to the thickness size of the second connecting wall 5143, the second supporting wall 5144 is protruded relative to the second connecting wall 5143, resulting in that the diameter size of the fifth connecting hole 5141 is greater than the thickness size of the second supporting wall 5144, therefore, the first supporting part 51441 can have an avoiding hole 5147. The avoiding hole 5147 can be communicated with the fifth connecting hole 5141 to avoid the fifth connecting hole 5141.

[0164] In some embodiments, the second supporting wall 5144 can include a second supporting part 51444. One end of the second supporting part 51444 can be connected with the other end of the first supporting part 51441. The width size of the second supporting part 51444 is smaller than the width size of the first supporting part 51441, that is, the vertical distance between the second supporting part 51444 and the second side wall 512 is greater than the vertical distance between the first supporting part 51441 and the second side wall 512, to provide accommodation space for the first light assembly 517.

[0165] In some embodiments, the second supporting wall 5144 can include a third supporting part 51445. One end of the third supporting part 51445 can be connected with the other end of the second supporting part 51444. The other end of the third supporting part 51445 can be connected with the first side wall 511.

[0166] In some embodiments, the second supporting wall 5144 can include a supporting piece 51442. One end of the supporting piece 51442 can be connected with the side surface of the first supporting part 51441. The other end of the supporting piece 51442 is not connected with the second side wall 512, to avoid the first light assembly 517. One side of the supporting piece 51442 can not be connected with the third side wall 513. The other side of the supporting piece 51442 can not be connected with the first side wall 511.

[0167] In some embodiments, the supporting piece 51442 can have a first light passing hole 51443. The first light passing hole 51443 can pass through the supporting piece 51442, so that the optical signal can pass through the first light passing hole 51443.

[0168] The supporting piece 51442 and the second supporting wall 5144 can be an integrally formed structure, or can be two independent structural pieces.

[0169] In some embodiments, the first light passing hole 51443 can be correspondingly arranged with the first connecting hole 5111, so that the optical signal passes through the first light passing hole 51443 and then is incident to the first connecting hole 5111.

[0170] In some embodiments, the central axis of the first connecting hole 5111 (as shown in FIG. 9e) is closer to the fourth side wall 514 relative to the central axis of the first side wall 511 (as shown in FIG. 9f).

[0171] In some embodiments, the fourth sidewall 514 can have a step 5142. The step 5142 can provide sufficient space for the connecting sleeve 710 to increase the contact area between the connecting sleeve 710 and the first sidewall 511, thereby improving the connection stability between the connecting sleeve 710 and the first sidewall 511.

[0172] One side of the step 5142 (e.g., the left side as shown in FIG. 9) is more concave than the other side of the step 5142 (e.g., the right side as shown in FIG. 9). The one side of the step 5142 has a fifth connecting hole 5141, and a light receiving component can be disposed in the fifth connecting hole 5141. The step 5142 can provide accommodation space for the light receiving component in the fifth connecting hole 5141, so as to reduce the width dimension of the light receiving component 500.

[0173] FIG. 11 is a light path diagram of a first light assembly according to some embodiments. FIG. 12 is a light path diagram of another first light assembly according to some embodiments. As shown in FIGS. 11 and 12, in some embodiments, the first light assembly 517 can include a first lens 5171. The first lens 5171 is configured to collimate / converge light signals. For example, the received light signals transmitted by the first cavity to the fiber optic adapter 700 are converged by the first lens 5171, and the light signals transmitted by the fiber optic adapter 700 to the first cavity are collimated by the first lens 5171.

[0174] In some embodiments, the first light assembly 517 can include a first filter 5173. The first filter 5173 can be disposed on one side of the first lens 5171, so that the first filter 5173 can reflect the received light signals collimated by the first lens 5171.

[0175] The first filter 5173 can receive the emitted light signals and transmit the emitted light signals to the first lens 5171.

[0176] In some embodiments, the first filter 5173 is disposed at an inclination, so that the received light signals can be reflected. For example, the inclination angle of the first filter 5173 is a first preset angle. The first preset angle can be 8°-13°.

[0177] In some examples, the first preset angle can be 8°-11°.

[0178] In some examples, the first preset angle can be 10°-13°.

[0179] In some examples, the first preset angle can be 10°-11°.

[0180] It should be noted that the numerical values and numerical ranges involved in some examples of the embodiments of the present disclosure are approximate values, and there can be a certain range of errors due to the manufacturing process, which can be considered negligible by those skilled in the art.

[0181] In some embodiments, the first light assembly 517 can include a first reflecting sheet 5174. The first reflecting sheet 5174 can reflect the received light signal outwards. The first reflecting sheet 5174 can be located on the reflected light path of the first filter 5173, so that the received light signal reflected by the first filter 5173 to the first reflecting sheet 5174 is reflected outwards.

[0182] In some embodiments, the first reflecting sheet 5174 is arranged obliquely. For example, the oblique angle of the first reflecting sheet 5174 is a second preset angle, which can be 32°-37°.

[0183] In some examples, the second preset angle can be 32°-35°.

[0184] In some examples, the second preset angle can be 34°-37°.

[0185] In some examples, the second preset angle can be 34°-35°.

[0186] As shown in FIGS. 11 and 12, in some embodiments, the first light assembly 517 can include a second reflecting sheet 5175. The second reflecting sheet 5175 can reflect the light signal incident to the second reflecting sheet 5175 outwards. The second reflecting sheet 5175 can be located on the reflected light path of the first reflecting sheet 5174, so that the received light signal reflected by the first reflecting sheet 5174 to the second reflecting sheet 5175 is reflected outwards.

[0187] In some embodiments, the second reflecting sheet 5175 is arranged obliquely. For example, the oblique angle of the second reflecting sheet 5175 is a third preset angle, which can be 45°.

[0188] The first preset angle, the second preset angle, and the third preset angle cooperate with each other, so that the received light signal reflected by the second reflecting sheet 5175 can be emitted along the length direction of the light receiving component 500.

[0189] As shown in FIG. 11 and FIG. 12, in some embodiments, the first optical assembly 517 can include a wavelength division assembly 5172. The wavelength division assembly 5172 can be located on the reflection light path of the second reflecting sheet 5175, so that the wavelength division assembly 5172 can receive the received light signal reflected by the second reflecting sheet 5175. The wavelength division assembly 5172 can split the received light signal according to the wavelength. For example, the wavelength division assembly 5172 can split a received light signal including a first wavelength, a second wavelength and a third wavelength into a first wavelength light signal, a second wavelength light signal and a third wavelength light signal according to the wavelength.

[0190] In some embodiments, the first end of the wavelength division assembly 5172 has an entrance for light, and the received light signal including the first wavelength, the second wavelength and the third wavelength emitted by the fiber adapter 700 is incident to the entrance of the first end of the wavelength division assembly 5172 and reflected by the second end of the wavelength division assembly 5172.

[0191] In some embodiments, the first end of the wavelength division assembly 5172 has a first light exit, the second end of the wavelength division assembly 5172 has a second light exit and a third light exit, the received light signal is split into the first wavelength light signal, the second wavelength light signal and the third wavelength light signal by the wavelength division assembly 5172, the first wavelength light signal is emitted through the first light exit of the first end of the wavelength division assembly 5172, the second wavelength light signal is emitted through the second light exit of the second end of the wavelength division assembly 5172, and the third wavelength light signal is emitted through the third light exit of the second end of the wavelength division assembly 5172, so that the emission direction of the light signal emitted through the first light exit is opposite to the emission direction of the light signal emitted through the second light exit or the third light exit, thereby improving the isolation degree.

[0192] As shown in FIG. 8, FIG. 11 and FIG. 12, the first end of the wavelength division assembly 5172 can be correspondingly arranged with the first end of the first shell 510, and the second end of the wavelength division assembly 5172 can be correspondingly arranged with the second end of the first shell 510, so that the wavelength division assembly 5172 can be arranged along the length direction of the first shell 510.

[0193] The wavelength division assembly 5172 can be arranged along the length direction of the light receiving component 500, i.e. the wavelength division assembly 5172 can be arranged along the length direction of the first shell 510, so as to reduce the width dimension of the first shell 510, and further reduce the width dimension of the light receiving component 500. When the wavelength division assembly 5172 is arranged along the length direction of the first shell 510, the width dimension of the first shell 510 required to accommodate the wavelength division assembly 5172 can be reduced, which can meet the requirement. Since the length dimension of the receiving pin of the light receiving assembly is small, the width dimension of the first shell 510 is reduced, and the width dimension of the light receiving component 500 is also reduced.

[0194] In some embodiments, the first end of the wave separation component 5172 and the second end of the wave separation component 5172 are arranged in parallel, so that the emitted light signal incident to the second end of the wave separation component 5172 and the emitted light signal emitted from the first end of the wave separation component 5172 are parallel to each other.

[0195] In some embodiments, the first end of the wave separation component 5172 has a first preset range of inclination angle, so that the received light signal including the first wavelength, the second wavelength and the third wavelength incident to the wave separation component 5172 can be separated into the first wavelength light signal, the second wavelength light signal and the third wavelength light signal by the wave separation component 5172. For example, the first preset range is 8°±1°.

[0196] FIG. 13 is a structural diagram of a wave separation component according to some embodiments. As shown in FIGS. 8, 11 and 13, in some embodiments, the wave separation component 5172 can include a substrate 51721. The substrate 51721 is a block substrate. The first end surface of the substrate 51721 is arranged corresponding to the first end of the light receiving component 500, and the second end surface of the substrate 51721 is arranged corresponding to the second end of the light receiving component 500, so that the substrate 51721 is arranged along the length direction of the light receiving component 500. The first end surface of the substrate 51721 can face the first connecting hole 5111. The second end surface of the substrate 51721 can face the second connecting hole 5131.

[0197] The first end surface of the substrate 51721 and the second end surface of the substrate 51721 are arranged in parallel, so that the light signal incident to the substrate 51721 and the light signal emitted from the substrate 51721 are parallel to each other.

[0198] The first end surface of the substrate 51721 can face the first connecting hole 5111, and the second end surface of the substrate 51721 can face the second connecting hole 5131, so that the substrate 51721 can be arranged along the length direction of the first shell 510.

[0199] As shown in FIGS. 8, 11 and 13, in some embodiments, the wave separation component 5172 can include an entrance a. The entrance a can be located at the first end surface of the substrate 51721. The entrance a can be located on the reflection light path of the second reflecting sheet 5175, so that the entrance a can receive the received light signal reflected by the second reflecting sheet 5175.

[0200] In some embodiments, the entrance a can be a region of the first end surface of the substrate 51721 corresponding to the arrangement of the second reflecting sheet 5175, and a wave plate is arranged on the region. The wave plate allows the received light signal to pass through.

[0201] In some embodiments, the light-in area a can be a region on the first end surface of the substrate 51721 corresponding to the second reflective sheet 5175, which is coated with an anti-reflection film. The anti-reflection film allows the received light signal to be transmitted.

[0202] The side wall of the substrate 51721 close to the light-in area a is in contact with the second side wall 512, and there is a gap between the side wall of the substrate 51721 away from the light-in area a and the fourth side wall 514, so that the emitted light signal is transmitted through the gap between the substrate 51721 and the fourth side wall 514.

[0203] The vertical distance between the side wall of the substrate 51721 away from the light-in area a and the second side wall 512 is less than the vertical distance between the first light transmission hole 51443 and the second side wall 512, so as to avoid the emitted light signal passing through the substrate 51721.

[0204] As shown in FIGS. 8, 11 and 13, in some embodiments, the wave separation assembly 5172 can include a first reflection area b. The first reflection area b can be located on the second end surface of the substrate 51721. The first reflection area b can be arranged opposite to the light-in area a, so that the first reflection area b can reflect the received light signal incident through the light-in area a.

[0205] In some embodiments, the first reflection area b can be a region on the second end surface of the substrate 51721 arranged opposite to the light-in area a, which is provided with a wave plate. The wave plate does not allow the received light signal to be transmitted, but allows the received light signal to be reflected.

[0206] In some embodiments, the first reflection area b can be a region on the second end surface of the substrate 51721 arranged opposite to the light-in area a, which is coated with a high-reflection film. The high-reflection film does not allow the received light signal to be transmitted, but allows the received light signal to be reflected.

[0207] As shown in FIGS. 8, 11 and 13, in some embodiments, the wave separation assembly 5172 can include a first wave plate 51722. The first wave plate 51722 can be arranged on the first end surface of the substrate 51721. The first wave plate 51722 can be arranged adjacent to the light-in area a. The first wave plate 51722 can be connected to the light-in area a to reduce the size of the first end of the wave separation assembly 5172. The first wave plate 51722 can be located on the reflection light path of the first reflection area b, so that the received light signal reflected by the first reflection area b can be incident on the first wave plate 51722.

[0208] In some embodiments, the first wave plate 51722 can be a band-pass filter, which can allow signals within a certain frequency range to pass through and block signals of other frequencies. For example, the first wave plate 51722 can allow first wavelength light signals to be transmitted, and can also allow other wavelength light signals to be reflected.

[0209] The first wave plate 51722 is a first light exit of the wave division assembly 5172, so that the first wavelength light signal in the wave division assembly 5172 is transmitted through the first wave plate 51722.

[0210] As shown in FIG. 8, FIG. 11 and FIG. 13, in some embodiments, the wave division assembly 5172 can include a second wave plate 51723. The second wave plate 51723 can be disposed on the second end surface of the substrate 51721. The second wave plate 51723 can be disposed adjacent to the first reflection position b. The second wave plate 51723 can be located on the reflection light path of the first wave plate 51722, so that the received light signal reflected by the first wave plate 51722 can be incident on the second wave plate 51723.

[0211] In some embodiments, the second wave plate 51723 can be a band-pass filter, which can allow signals within a certain frequency range to pass through and block signals of other frequencies. For example, the second wave plate 51723 can allow the second wavelength light signal to be transmitted, and can also allow other wavelength light signals to be reflected.

[0212] The second wave plate 51723 is a second light exit of the wave division assembly 5172, so that the second wavelength light signal in the wave division assembly 5172 is transmitted through the second wave plate 51723.

[0213] In some embodiments, the wave division assembly 5172 can include a second reflection position c. The second reflection position c can be disposed adjacent to the first wave plate 51722, so that the first wave plate 51722 can be located between the light entrance position a and the second reflection position c. The second reflection position c can be located on the reflection light path of the second wave plate 51723, so that the second reflection position c can reflect the received light signal reflected by the second wave plate 51723.

[0214] In some embodiments, the second reflection position c can be a region on the first end surface of the substrate 51721 adjacent to the first wave plate 51722, which is provided with a wave plate. The wave plate does not allow the received light signal to be transmitted, but allows the received light signal to be reflected.

[0215] In some embodiments, the second reflection position c can be a region on the first end surface of the substrate 51721 adjacent to the first wave plate 51722, which is coated with a high reflection film. The high reflection film does not allow the received light signal to be transmitted, but allows the received light signal to be reflected.

[0216] In some embodiments, the wave division assembly 5172 can include a third wave plate 51724. The third wave plate 51724 is disposed on the second end surface of the substrate 51721. The third wave plate 51724 can be disposed adjacent to the second wave plate 51723. The third wave plate 51724 can be located on the reflection light path of the second reflection position c, so that the received light signal reflected by the second reflection position c can be incident on the third wave plate 51724.

[0217] In some embodiments, the third wave plate 51724 can be a band-pass filter, which allows signals within a certain frequency range to pass through and blocks signals of other frequencies. For example, the third wave plate 51724 can allow third wavelength light signals to transmit and can also allow other wavelength light signals to reflect.

[0218] The third wave plate 51724 is the third light exit of the wave splitting component 5172, so that the third wavelength light signals in the wave splitting component 5172 are transmitted out through the third wave plate 51724.

[0219] In some embodiments, the second wave plate 51723 and the third wave plate 51724 can be connected to reduce the size of the second end surface of the substrate 51721.

[0220] FIG. 14 is a cross-sectional view of an optical transceiver provided in some embodiments. As shown in FIGS. 10 and 14, in some embodiments, the first lens 5171 can be disposed in the first connecting hole 5111 to reduce the length of the first housing 510.

[0221] In some embodiments, the first lens 5171 can be disposed in the accommodating cavity 516.

[0222] In some embodiments, an isolator 518 can be disposed in the second connecting hole 5131. The isolator 518 can allow the emission light signals emitted by the optical transmitter 400 to be incident on the optical receiver 500 and block the emission light signals incident on the optical receiver 500 from returning to the optical transmitter 400.

[0223] In some embodiments, a first optical receiving component 520 can be disposed in the third connecting hole 5122.

[0224] In some embodiments, a second optical receiving component 530 can be disposed in the fourth connecting hole 5121.

[0225] In some embodiments, a third optical receiving component 540 can be disposed in the fifth connecting hole 5141.

[0226] In some embodiments, the first light assembly 517 can include a third reflecting sheet 5176. The third reflecting sheet 5176 can be located on the transmission light path of the first wave plate 51722, such that the third reflecting sheet 5176 can receive the first wavelength light signal transmitted by the first wave plate 51722. The third reflecting sheet 5176 can reflect the received first wavelength light signal. The third connecting hole 5122 can be located on the reflected light path of the third reflecting sheet 5176, such that the first light receiving assembly 520 in the third connecting hole 5122 can be located on the reflected light path of the third reflecting sheet 5176, and thus the third reflecting sheet 5176 can reflect the first wavelength light signal to the first light receiving assembly 520.

[0227] In some embodiments, the third reflecting sheet 5176 can include a reflecting surface. The reflecting surface can be located on the transmission light path of the first wave plate 51722, and the first light receiving assembly 520 can be located on the reflected light path of the reflecting surface, such that the first wavelength light signal transmitted by the first wave plate 51722 is reflected to the first light receiving assembly 520 by the reflecting surface.

[0228] In some embodiments, the reflecting surface of the third reflecting sheet 5176 has a non-45° inclination angle, such that the first wavelength light signal is obliquely incident on the first light receiving assembly 520 after being reflected by the reflecting surface of the third reflecting sheet 5176, thereby reducing the return of the first wavelength light signal along the original path at the first light receiving assembly 520.

[0229] In some embodiments, the third reflecting sheet 5176 can include an incident surface. The incident surface can be located between the first wave plate 51722 and the reflecting surface. One end of the incident surface can be connected to one end of the reflecting surface.

[0230] In some embodiments, the third reflecting sheet 5176 can include an exit surface. The exit surface can be located between the reflecting surface and the first light receiving assembly 520. One end of the exit surface can be connected to the other end of the reflecting surface. The other end of the exit surface can be connected to the other end of the incident surface.

[0231] In some embodiments, the incident surface or the exit surface of the third reflecting sheet 5176 is coated with a filter film to filter out received light signals of wavelengths other than the first wavelength, such that the first wavelength light signal can be incident on the first light receiving assembly 520, and the second wavelength light signal and the third wavelength light signal are prevented from being incident on the first light receiving assembly 520.

[0232] Alternatively, in some embodiments, a filter can be provided between the third reflecting sheet 5176 and the first wave plate 51722 or between the third reflecting sheet 5176 and the first light receiving assembly 520 to filter out received light signals of wavelengths other than the first wavelength.

[0233] The incident surface or the emergent surface of the third reflecting sheet 5176 is coated with a filter film, which can effectively reduce the space occupied by the first light assembly and the space of the first shell.

[0234] The first filter 5173 and the first reflecting sheet 5174 are located in opposite directions of the reflected light path of the third reflecting sheet 5176, and the first light receiving assembly 520 is located on the reflected light path of the third reflecting sheet 5176 to reduce the size of the light receiving component 500.

[0235] In some embodiments, the first light assembly 517 can include a light splitting prism 5177. The light splitting prism 5177 can include a first reflecting surface 51771. The first reflecting surface 51771 can be located on the transmitted light path of the second wave plate 51723, so that the first reflecting surface 51771 can receive the second wavelength light signal transmitted by the second wave plate 51723. The fourth connecting hole 5121 can be located on the reflected light path of the first reflecting surface 51771, so that the second light receiving assembly 530 in the fourth connecting hole 5121 can be located on the reflected light path of the first reflecting surface 51771, and the first reflecting surface 51771 can reflect the second wavelength light signal to the second light receiving assembly 530.

[0236] In some embodiments, the light splitting prism 5177 can include a second reflecting surface 51772. The second reflecting surface 51772 can be located on the transmitted light path of the third wave plate 51724, so that the second reflecting surface 51772 can receive the third wavelength light signal transmitted by the third wave plate 51724. The fifth connecting hole 5141 can be located on the reflected light path of the second reflecting surface 51772, so that the third light receiving assembly 540 in the fifth connecting hole 5141 can be located on the reflected light path of the second reflecting surface 51772, and the second reflecting surface 51772 can reflect the third wavelength light signal to the third light receiving assembly 540.

[0237] The first reflecting surface 51771 of the light splitting prism 5177 and the second reflecting surface 51772 of the light splitting prism 5177 can be connected or not connected.

[0238] In some embodiments, the light splitting prism 5177 can include a first incident surface. The first incident surface can be located between the first reflecting surface 51771 and the second wave plate 51723. One end of the first incident surface can be connected to one end of the first reflecting surface 51771.

[0239] In some embodiments, the light splitting prism 5177 can include a first emergent surface. The first emergent surface can be located between the first reflecting surface and the second light receiving assembly 530. One end of the first emergent surface can be connected to the other end of the first reflecting surface 51771. The other end of the first emergent surface can be connected to the other end of the first incident surface.

[0240] In some embodiments, the first incident surface or the first exit surface is coated with a filter film to filter out the received light signals of wavelengths other than the second wavelength, so that the light signals of the second wavelength can be incident to the second light receiving component 530, and the light signals of the first wavelength and the third wavelength are prevented from being incident to the second light receiving component 530.

[0241] Alternatively, in some embodiments, a filter can be arranged between the light-splitting prism 5177 and the second wave plate 51723 or between the light-splitting prism 5177 and the second light receiving component 530 to filter out the received light signals of wavelengths other than the second wavelength. As shown in FIG. 12, a second filter 5179 is arranged between the light-splitting prism 5177 and the second wave plate 51723. The second filter 5179 can filter out the received light signals of wavelengths other than the second wavelength.

[0242] In some embodiments, the light-splitting prism 5177 can include a second incident surface. The second incident surface can be located between the second reflecting surface 51772 and the second wave plate 51723. One end of the second incident surface can be connected to one end of the second reflecting surface 51772.

[0243] In some embodiments, the light-splitting prism 5177 can include a second exit surface. The second exit surface can be located between the second reflecting surface 51772 and the third light receiving component 540. One end of the second exit surface can be connected to the other end of the second reflecting surface 51772. The other end of the second exit surface can be connected to the other end of the second incident surface.

[0244] In some embodiments, the second incident surface or the second exit surface is coated with a filter film to filter out the received light signals of wavelengths other than the third wavelength, so that the light signals of the third wavelength can be incident to the third light receiving component 540, and the light signals of the second wavelength and the third wavelength are prevented from being incident to the third light receiving component 540.

[0245] Alternatively, in some embodiments, a filter can be arranged between the light-splitting prism 5177 and the third wave plate 51724 or between the light-splitting prism 5177 and the third light receiving component 540 to filter out the received light signals of wavelengths other than the third wavelength. As shown in FIG. 11, a third filter 5178 is arranged between the light-splitting prism 5177 and the third wave plate 51724. The third filter 5178 can filter out the received light signals of wavelengths other than the third wavelength.

[0246] As shown in FIG. 10 and FIG. 14, the side of the support 51442 facing the first side wall 511 can be provided with a first filter 5173. The emitted light signal is transmitted to the first filter 5173 through the first light transmission hole 51443 of the support 51442, and is transmitted to the first lens 5171 through the first filter 5173. The received light signal is incident on the first filter 5173 after collimation by the first lens 5171, and is reflected out of the first filter 5173.

[0247] Due to the inclined arrangement of the first filter 5173, the emitted light signal is incident on the first filter 5173 obliquely, and the emitted light signal is refracted at the light entrance surface and the light exit surface of the first filter 5173, causing the central axis of the first connection hole 5111 to be offset relative to the central axis of the first light transmission hole 51443.

[0248] Due to the inclined arrangement of the first filter 5173, in order to increase the connection stability of the first filter 5173 and the support 51442, in some embodiments, the side of the support 51442 facing the first side wall 511 can be arranged parallel to the first filter 5173. That is, the inclination angle of the side of the support 51442 facing the first side wall 511 is equal to the inclination angle of the first filter 5173. For example, the inclination angle of the side of the support 51442 facing the first side wall 511 is a first preset angle.

[0249] As shown in FIG. 10 and FIG. 14, in some embodiments, the side of the third support portion 51445 facing the support 51442 can be provided with a first reflecting sheet 5174. The side of the third support portion 51445 can be arranged obliquely so that the first reflecting sheet 5174 is located on the reflected light path of the first filter 5173.

[0250] Due to the inclined arrangement of the first reflecting sheet 5174, in order to increase the connection stability of the first reflecting sheet 5174 and the third support portion 51445, in some embodiments, the side of the third support portion 51445 facing the support 51442 can be arranged parallel to the first reflecting sheet 5174. That is, the inclination angle of the side of the third support portion 51445 facing the support 51442 is equal to the inclination angle of the first reflecting sheet 5174. For example, the inclination angle of the side of the third support portion 51445 facing the support 51442 is a second preset angle.

[0251] In some embodiments, the receiving rate of the first light receiving component 520 is greater than the receiving rate of the second light receiving component 530 and the third light receiving component 540, resulting in that the receiving light-sensitive surface of the first light receiving component 520 is smaller than the receiving light-sensitive surface of the second light receiving component 530 and the third light receiving component 540, so that the transmission path of the first wavelength light signal received by the first light receiving component 520 is the shortest, and the light receiving chip of the first light receiving component 520 can receive the first wavelength light signal with high coupling efficiency.

[0252] As shown in FIG. 11, FIG. 12 and FIG. 14, the light path is as follows:

[0253] The emitted light signal is transmitted through the first filter 5173, and then focused and coupled to the fiber adapter 700 through the first lens 5171.

[0254] The received light signal is first collimated through the first lens 5171, and then sequentially reflected by the first filter 5173, the first reflecting sheet 5174 and the second reflecting sheet 5175 to enter the light entrance a of the light splitting component 5172, and then reflected by the first reflecting sheet b. The first wavelength light signal in the received light signal is transmitted through the first wave plate 51722, and finally reflected out through the third reflecting sheet 5176.

[0255] The second wavelength light signal in the received light signal is reflected by the first wave plate 51722, transmitted through the second wave plate 51723, and then reflected out through the first reflecting surface 51771 of the light splitting prism 5177.

[0256] The second wavelength light signal in the received light signal is sequentially reflected by the first wave plate 51722, the second wave plate 51723 and the second reflecting sheet c, transmitted through the third wave plate 51724, and then reflected out through the second reflecting surface 51772 of the light splitting prism 5177.

[0257] FIG. 15 is an assembly view of an optical transceiver component and a fiber adapter from another perspective according to some embodiments. FIG. 16 is a structural view of an optical transmitting component according to some embodiments. As shown in FIG. 5 and FIG. 15, in some embodiments, the optical transmitting component 400 can include a second cavity. The second cavity can be connected with the optical receiving component 500, so that the emitted light signal emitted by the optical transmitting component 400 can be incident to the optical receiving component 500.

[0258] As shown in FIG. 15 and FIG. 16, in some embodiments, the second cavity can include a second housing 410.

[0259] As shown in FIG. 15 and FIG. 16, in some embodiments, the second cavity can include a second cover plate 415. The second cover plate 415 can be coupled to the second housing 410 to form the second cavity. The second light assembly 430 can be disposed in the second cavity. The second light assembly 430 can emit at least one light signal. For example, the second light assembly 430 can emit a fourth wavelength light signal, a fifth wavelength light signal, and a sixth wavelength light signal.

[0260] During assembly, the second light assembly 430 can be fixed in the second housing 410, and then the second cover plate 415 can be coupled to the second housing 410 to form the second cavity.

[0261] As shown in FIG. 5 and FIG. 15, the openings of the first housing 510 and the second housing 410 can face in opposite directions. For example, the opening of the first housing 510 can face the upper housing 201, and the opening of the second housing 410 can face the lower housing 202.

[0262] In some embodiments, the openings of the first housing 510 and the second housing 410 can face in the same direction. For example, the openings of the first housing 510 and the second housing 410 can both face the upper housing 201.

[0263] FIG. 17 is an exploded view of a second housing and an electrical connector according to some embodiments. As shown in FIG. 16 and FIG. 17, in some embodiments, the second housing 410 can have a notch 417. The electrical connector 420 can be disposed at the notch 417, such that one end of the electrical connector 420 can be connected to the second light assembly 430, and thus the electrical connector 420 can transmit electrical signals with the second light assembly 430. The other end of the electrical connector 420 can be connected to the circuit board 300, such that the electrical connector 420 can transmit electrical signals with the circuit board 300.

[0264] The notch 417 can be formed in the middle portion of the sidewall of the second housing 410, and the notch 417 can not extend beyond the top surface of the sidewall and the bottom surface of the sidewall of the second housing 410, such that the notch 417 can not be in communication with the opening of the second housing 410.

[0265] In some embodiments, the notch 417 can not extend beyond the bottom surface of the sidewall of the second housing 410, and the notch 417 can extend beyond the top surface of the sidewall of the second housing 410, such that the notch 417 can be in communication with the opening of the second housing 410.

[0266] In some embodiments, the second housing 410 can include a bottom plate 416. The bottom plate 416 can be used to support the second light assembly 430.

[0267] In some embodiments, the second housing 410 can include a first sidewall 411. The bottom of the first sidewall 411 can be connected with the bottom plate 416. The first sidewall 411 can be connected with the light receiving component 500. The first sidewall 411 can have a sixth connecting hole 4111. The sixth connecting hole 4111 can pass through the first sidewall 411. The sixth connecting hole 4111 can be in communication with the inner cavity of the second cavity, so that the emitted light signal emitted by the light emitting component 400 can be transmitted to the light receiving component 500 through the sixth connecting hole 4111.

[0268] In some embodiments, the second housing 410 can include a second sidewall 412. The bottom of the second sidewall 412 can be connected with the bottom plate 416. One end of the second sidewall 412 can be connected with one end of the first sidewall 411.

[0269] In some embodiments, the second housing 410 can include a third sidewall 413. The bottom of the third sidewall 413 can be connected with the bottom plate. One end of the third sidewall 413 can be connected with the other end of the second sidewall 412. The third sidewall 413 is arranged opposite to the first sidewall 411.

[0270] In some embodiments, the second housing 410 can include a fourth sidewall 414. The bottom of the fourth sidewall 414 can be connected with the bottom plate. One end of the fourth sidewall 414 can be connected with the other end of the third sidewall 413. The other end of the fourth sidewall 414 can be connected with the other end of the first sidewall 411. The fourth sidewall 414 can be arranged opposite to the second sidewall 412.

[0271] The first sidewall 411, the second sidewall 412, the third sidewall 413 and the fourth sidewall 414 are sequentially connected and respectively connected with the bottom plate 416 to form the second housing 410 with an opening.

[0272] FIG. 18 is a light path diagram of a second light assembly according to some embodiments. FIG. 19 is a light path diagram of another second light assembly according to some embodiments. As shown in FIGS. 18 and 19, in some embodiments, the second light assembly 430 can include a laser chip group 431. The laser chip group 431 can be connected with the electrical connector 420, so that the laser chip group 431 emits an emitted light signal according to the electrical signal provided by the electrical connector 420.

[0273] In some embodiments, the laser chip group 431 can include a first laser chip 4311. The first laser chip 4311 is connected with the electrical connector 420, so that the first laser chip 4311 emits a fourth wavelength light signal according to the electrical signal provided by the electrical connector 420.

[0274] Since the fourth wavelength light signal corresponds to a larger outgoing light power than the fifth wavelength light signal and the sixth wavelength light signal, the first laser chip 4311 can include a Distributed Feedback Laser (DFB) that emits the fourth wavelength light, an Electro-Absorption Modulator (EAM) that modulates the fourth wavelength light to obtain the fourth wavelength light signal, and a Semiconductor Optical Amplifier (SOA) that amplifies the fourth wavelength light signal, so that the outgoing light power of the fourth wavelength light signal meets the demand.

[0275] The presence of the SOA causes the first laser chip 4311 to be arranged obliquely. The first laser chip 4311 is arranged obliquely, but the direction of the fourth wavelength light signal output by the first laser chip 4311 is parallel to the length direction of the second housing 410, so as to reduce the end face reflection of the light signal at the exit port of the first laser chip 4311, and effectively reduce the interference of the reflected light signal entering the first laser chip 4311 with the light emission of the first laser chip 4311.

[0276] In some embodiments, the laser chip group 431 can include a second laser chip 4312. The second laser chip 4312 is connected with the electrical connector 420, so as to emit the fifth wavelength light signal according to the electrical signal provided by the electrical connector 420.

[0277] The wavelength of the fifth wavelength light signal is 1480-1500 nm, which is in the low dispersion region of the optical fiber, and the influence of the dispersion caused by the chirp on the signal is small, and the chirp effect of the DFB will not significantly affect the signal quality. Therefore, the second laser chip 4312 is a Directly Modulated Laser (DML). The DML is also referred to as a DFB. The circuit board 300 provides a driving signal through the electrical connector 420, so as to make the DFB emit the fifth wavelength light signal.

[0278] In some embodiments, the laser chip group 431 can include a third laser chip 4313. The third laser chip 4313 is connected with the electrical connector 420, so as to emit the sixth wavelength light signal according to the electrical signal provided by the electrical connector 420.

[0279] The wavelength of the sixth wavelength optical signal is 1575-1580 nm, and the wavelength of the sixth wavelength optical signal is in the high dispersion region of the optical fiber. The dispersion caused by the chirp has a greater impact on the signal. Using an external modulated laser (EML) can reduce the chirp effect, thereby reducing the impact of dispersion on the signal and ensuring high-quality signal transmission. Therefore, the third laser chip 4313 is an EML. The EML includes a DFB and an EAM. The circuit board 300 provides a first driving signal and a second driving signal through the electrical connection 420, the first driving signal causes the DFB to emit a sixth wavelength light, and the second driving signal causes the EAM to modulate the output sixth wavelength optical signal.

[0280] In some embodiments, the second optical assembly 430 can include a lens assembly 432. The lens assembly 432 can include a second lens 4321. The second lens 4321 can be located on the exit light path of the first laser chip 4311, so that the second lens 4321 collimates the fourth wavelength optical signal emitted by the first laser chip 4311.

[0281] In some embodiments, the lens assembly 432 can include a third lens 4322. The third lens 4322 can be located on the exit light path of the second laser chip 4312, so that the third lens 4322 collimates the fifth wavelength optical signal emitted by the second laser chip 4312.

[0282] In some embodiments, the lens assembly 432 can include a fourth lens 4323. The fourth lens 4323 can be located on the exit light path of the third laser chip 4313, so that the fourth lens 4323 collimates the sixth wavelength optical signal emitted by the third laser chip 4313.

[0283] In some embodiments, the second optical assembly 430 can include a combining assembly 433. The combining assembly 433 can include a wavelength division multiplexer. The entrance side of the wavelength division multiplexer faces the laser chip group 431, and the exit side of the wavelength division multiplexer faces the sixth connecting hole 4111. The wavelength division multiplexer combines the fourth wavelength optical signal, the fifth wavelength optical signal and the sixth wavelength optical signal emitted by the laser chip group 431 into a bundle of emitted optical signal and emits it.

[0284] In some embodiments, the combining assembly 433 can include a polarization assembly and a polarization combining assembly. The polarization assembly is used to adjust the polarization direction of the optical signal, and the polarization combining assembly combines multiple polarized lights into one. By adjusting the polarization direction of the optical signal through the polarization assembly, and then combining multiple polarized lights into one through the polarization combining assembly, the light emitting component can realize combining.

[0285] In some embodiments, the combining assembly 433 can include a plurality of optical filters that cooperate with each other to combine the fourth, fifth and sixth wavelength optical signals into one beam of emitted optical signal.

[0286] As shown in FIGS. 18 and 19, the combining assembly 433 can include a fourth optical filter 4331. The fourth optical filter 4331 can include an incident surface and an exit surface, both of which are located on the collimated light path of the second lens 4321, i.e., between the second lens 4321 and the sixth connecting hole 4111, so that the fourth wavelength optical signal can be incident to the fourth optical filter 4331 through the incident surface and transmitted out through the exit surface of the fourth optical filter 4331.

[0287] The combining assembly 433 can include a fifth optical filter 4332. The fifth optical filter 4332 can include an incident surface, a filtering surface and an exit surface, the incident surface and the filtering surface are both located on the collimated light path of the third lens 4322, and the exit surface is located on the reflected light path of the filtering surface, so that the fifth wavelength optical signal can be incident to the fifth optical filter 4332 through the incident surface, reflected at the filtering surface of the fifth optical filter 4332, and finally emitted at the exit surface.

[0288] The exit surface of the fifth optical filter 4332 is connected to the exit surface of the fourth optical filter 4331, so that after the fifth wavelength optical signal is emitted through the exit surface of the fifth optical filter 4332, it is reflected out through the exit surface of the fourth optical filter 4331.

[0289] The combining assembly 433 can include a sixth optical filter 4333. The sixth optical filter 4333 can include an incident surface, a filtering surface and an exit surface, the incident surface and the filtering surface are both located on the collimated light path of the fourth lens 4323, and the exit surface is located on the reflected light path of the filtering surface, so that the sixth wavelength optical signal can be incident to the sixth optical filter 4333 through the incident surface, reflected at the filtering surface of the sixth optical filter 4333, and finally emitted at the exit surface.

[0290] The exit surface of the sixth optical filter 4333 is connected to the filtering surface of the fifth optical filter 4332, so that after the sixth wavelength optical signal is emitted through the exit surface of the sixth optical filter 4333, it is transmitted through the filtering surface of the fifth optical filter 4332 and then emitted from the exit surface of the fifth optical filter 4332, and finally reflected out through the exit surface of the fourth optical filter 4331.

[0291] The exit surface of the sixth optical filter 4333 is connected to the filtering surface of the fifth optical filter 4332, and the exit surface of the fifth optical filter 4332 is connected to the exit surface of the fourth optical filter 4331, to increase the stability of the combining assembly 433.

[0292] To prevent the emission light signal incident to the light receiving component 500 from returning to the laser chip set 431, in some embodiments, no isolator is provided in the light emitting component 400, as shown in FIG. 18. For example, an isolator 518 is provided in the light receiving component 500, which can prevent a bundle of emission light signal incident to the light receiving component 500 from returning to the light emitting component 400, as shown in FIG. 14.

[0293] As shown in FIG. 19, in some embodiments, the second optical assembly 430 can include an isolator set 434. The isolator set 434 can include a first isolator 4341. The first isolator 4341 can be located between the second lens 4321 and the fourth filter 4331 to prevent the fourth wavelength light signal from returning to the first laser chip 4311 via the first isolator 4341.

[0294] In some embodiments, the isolator set 434 can include a second isolator 4342. The second isolator 4342 can be located between the third lens 4322 and the fifth filter 4332 to prevent the fifth wavelength light signal from returning to the second laser chip 4312 via the second isolator 4342.

[0295] In some embodiments, the isolator set 434 can include a third isolator 4343. The third isolator 4343 can be located between the fourth lens 4323 and the sixth filter 4333 to prevent the sixth wavelength light signal from returning to the third laser chip 4313 via the third isolator 4343.

[0296] The isolator includes a first polarizer, a Faraday plate and a second polarizer, the Faraday plate rotates in the same direction, and the polarized light passing through the first polarizer cannot return to the first polarizer after Faraday rotation, so that the isolator composed of the first polarizer, the Faraday plate and the second polarizer has the effect of reverse isolation.

[0297] FIG. 20 is an assembly view of an optical transceiver component, a fiber adapter and a circuit board from another perspective, according to some embodiments. FIG. 21 is an exploded view of an optical transceiver component, a fiber adapter and a circuit board, according to some embodiments. As shown in FIGS. 20 and 21, in some embodiments, the light emitting component 400 and the circuit board 300 can be connected through a flexible circuit board 900. For example, the electrical input end of the light emitting component 400 and the circuit board 300 can be connected through the flexible circuit board 900.

[0298] In some embodiments, the electrical input end of the light emitting component 400 can include a first electrical input end. The first electrical input end can be located on a side wall of the light emitting component 400. The first electrical input end can be located on the side wall of the light emitting component 400 close to the circuit board 300.

[0299] In some embodiments, the electrical input end of the light emitting component 400 can include a second electrical input end. The second electrical input end can be located on a sidewall of the light emitting component 400. The second electrical input end and the first electrical input end can be located on different sidewalls of the light emitting component 400.

[0300] In some embodiments, the sidewall on which the second electrical input end is located is adjacent to the sidewall on which the first electrical input end is located. For example, the first electrical input end can be located on a third sidewall of the light emitting component 400, and the second electrical input end can be located on a fourth sidewall of the light emitting component 400. The third sidewall and the fourth sidewall are adjacent to each other and connected.

[0301] As shown in FIGS. 20 and 21, in some embodiments, the light receiving component 500 and the circuit board 300 can be connected through a flexible circuit board 900. For example, the electrical input end of the light receiving component 500 and the circuit board 300 can be connected through the flexible circuit board 900.

[0302] In some embodiments, the electrical input end of the light receiving component 500 can be arranged along the width direction of the light receiving component 500.

[0303] In some embodiments, the electrical input end of the light receiving component 500 can include a first electrical input end. The first electrical input end can be located on a sidewall of the light receiving component 500.

[0304] In some embodiments, the electrical input end of the light receiving component 500 can include a second electrical input end. The second electrical input end can be located on a sidewall of the light receiving component 500.

[0305] In some embodiments, the electrical input end of the light receiving component 500 can include a third electrical input end. The third electrical input end can be located on a sidewall of the light receiving component 500.

[0306] In some embodiments, any two of the first electrical input end, the second electrical input end and the third electrical input end can be located on a sidewall of the light receiving component 500, and the other electrical input end can be located on another sidewall of the light receiving component 500, so as to reduce the length of the light receiving component 500. For example, the first electrical input end is located on a fourth sidewall of the light receiving component 500, and the second electrical input end and the third electrical input end are located on a second sidewall of the light receiving component 500.

[0307] In some embodiments, the sidewalls on which the first electrical input end, the second electrical input end and the third electrical input end are located are the same sidewall.

[0308] FIG. 22 is an exploded view of a flexible circuit board, according to some embodiments. FIG. 23 is an assembly view of an optical transceiver component and a portion of a flexible circuit board, according to some embodiments. FIG. 24 is an assembly view of an optical transceiver component and another portion of a flexible circuit board, according to some embodiments. As shown in FIGS. 22, 23, and 24, in some embodiments, the flexible circuit board 900 can include a first flexible circuit board 901. One end of the first flexible circuit board 901 can be connected to the upper surface of the circuit board 300. The other end of the first flexible circuit board 901 can be connected to the first electrical input of the optical transmitter component 400.

[0309] One end of the first flexible circuit board 901 can be connected to the upper surface of the circuit board 300, and the other end of the first flexible circuit board 901 can be connected to the first electrical input of the optical transmitter component 400, such that the first electrical input of the optical transmitter component 400 is connected to the circuit board 300 through the first flexible circuit board 901, thereby allowing electrical signals between the first electrical input of the optical transmitter component 400 and the circuit board 300 to be transmitted through the first flexible circuit board 901.

[0310] As shown in FIGS. 22, 23, and 24, in some embodiments, the flexible circuit board 900 can include a second flexible circuit board 902. One end of the second flexible circuit board 902 can be connected to the lower surface of the circuit board 300. The other end of the second flexible circuit board 902 can be connected to the second electrical input of the optical transmitter component 400. The other end of the second flexible circuit board 902 can be connected to the first electrical input of the optical receiver component 500.

[0311] In some embodiments, the second flexible circuit board 902 can include a first end 921. The first end 921 can be connected to the lower surface of the circuit board 300.

[0312] In some embodiments, the second flexible circuit board 902 can include a second end 922. The second end 922 can be connected to the second electrical input of the optical transmitter component 400. The second end 922 can be connected to the first end 921.

[0313] In some embodiments, the second flexible circuit board 902 can include a third end 923. The third end 923 can be connected to the first electrical input of the optical receiver component 500. The third end 923 can be connected to the first end 921. There can be a gap between the third end 923 and the second end 922, such that the second end 922 is not connected to the third end 923.

[0314] The first end of the second flexible circuit board 902 can be connected with the lower surface of the circuit board 300, the second end of the second flexible circuit board 902 can be connected with the second electrical input end of the light emitting component 400, and the third end of the second flexible circuit board 902 can be connected with the first electrical input end of the light receiving component 500, so that the second electrical input end of the light emitting component 400 and the first electrical input end of the light receiving component 500 are both connected with the circuit board 300 through the second flexible circuit board 902, thereby making the electrical signals between the second electrical input end of the light emitting component 400 and the first electrical input end of the light receiving component 500 and the circuit board 300 be transmitted through the second flexible circuit board 902.

[0315] As shown in FIGS. 22, 23 and 24, in some embodiments, the flexible circuit board 900 can include a third flexible circuit board 903. One end of the third flexible circuit board 903 can be connected with the lower surface of the circuit board 300. The other end of the third flexible circuit board 903 can be connected with the second electrical input end of the light receiving component 500.

[0316] One end of the third flexible circuit board 903 can be connected with the lower surface of the circuit board 300, and the other end of the third flexible circuit board 903 can be connected with the second electrical input end of the light receiving component 500, so that the second electrical input end of the light receiving component 500 is connected with the circuit board 300 through the third flexible circuit board 903, thereby making the electrical signals between the second electrical input end of the light receiving component 500 and the circuit board 300 be transmitted through the third flexible circuit board 903.

[0317] As shown in FIGS. 22, 23 and 24, in some embodiments, the flexible circuit board 900 can include a fourth flexible circuit board 904. One end of the fourth flexible circuit board 904 can be connected with the upper surface of the circuit board 300. The other end of the fourth flexible circuit board 904 can be connected with the third electrical input end of the light receiving component 500.

[0318] One end of the fourth flexible circuit board 904 can be connected with the upper surface of the circuit board 300, and the other end of the fourth flexible circuit board 904 can be connected with the third electrical input end of the light receiving component 500, so that the third electrical input end of the light receiving component 500 is connected with the circuit board 300 through the fourth flexible circuit board 904, thereby making the electrical signals between the third electrical input end of the light receiving component 500 and the circuit board 300 be transmitted through the fourth flexible circuit board 904.

[0319] FIG. 25 is an assembly view of an optical transceiver assembly and a fiber optic adapter, according to some embodiments. FIG. 26 is an exploded view of an optical transceiver assembly and a fiber optic adapter, according to some embodiments. FIG. 27 is a structural view of a first cavity, according to some embodiments. As shown in FIGS. 25, 26, and 27, in some embodiments, a first end of the optical receiving assembly 500 can be connected to the fiber optic adapter 700. A second end of the optical receiving assembly 500 can be connected to the optical transmitting assembly 400.

[0320] In some embodiments, the optical receiving assembly 500 can include a first cavity. One end of the first cavity can be connected to the optical transmitting assembly 400. Another end of the first cavity can be connected to the fiber optic adapter 700, such that the first cavity can receive a received optical signal transmitted by the fiber optic adapter 700. One end of the first cavity can be connected to the optical transmitting assembly 400, and another end of the first cavity can be connected to one end of the fiber optic adapter 700, such that a transmitted optical signal emitted by the optical transmitting assembly 400 can be first transmitted into the first cavity, then transmitted from the first cavity to the fiber optic adapter 700, and finally outputted by the fiber optic adapter 700.

[0321] As shown in FIGS. 25, 26, and 27, in some embodiments, the optical receiving assembly 500 can include at least one receiving component. The at least one receiving component can be connected to the first cavity, such that an externally inputted received optical signal (including optical signals of multiple wavelengths) can be inputted into the first cavity through the fiber optic adapter 700, and then transmitted from the first cavity to the at least one receiving component.

[0322] In some embodiments, the at least one receiving component can include a first receiving component 530. The first receiving component 530 can receive a third wavelength optical signal. For example, the first receiving component 530 can receive a received optical signal with a wavelength range of 1260-1280 nm.

[0323] In some embodiments, the at least one receiving component can include a second receiving component 520. The second receiving component 520 can receive a first wavelength optical signal. For example, the second receiving component 520 can receive a received optical signal with a wavelength range of 1284-1288 nm.

[0324] In some embodiments, the at least one receiving component can include a third receiving component 540. The third receiving component 540 can receive a second wavelength optical signal. For example, the third receiving component 540 can receive a received optical signal with a wavelength range of 1290-1330 nm.

[0325] The at least one light receiving component includes a first light receiving component 530, a second light receiving component 520, and a third light receiving component 540, so that the light receiving part 500 can receive three wavelengths of optical signals with different rates.

[0326] In some embodiments, the first light receiving component 530, the second light receiving component 520, and the third light receiving component 540 can adopt a coaxial package. For example, the receiving optical axes of the first light receiving component 530, the second light receiving component 520, and the third light receiving component 540 are parallel to each other. That is, the first light receiving component 530, the second light receiving component 520, and the third light receiving component 540 each include a receiving cap and a receiving seat, the receiving cap is arranged on the receiving seat to form a receiving cavity, and a light receiving chip is arranged in the receiving cavity. The light receiving chip receives an optical signal and converts the optical signal into an electrical signal.

[0327] The receiving seat is also provided with a receiving pin, one end of the receiving pin is connected with the circuit board 300 through a flexible circuit board 900 to realize the electrical connection between the receiving pin and the circuit board 300. The receiving pin extends upward from the bottom of the receiving seat until it exceeds the top of the receiving seat and is connected with the pad where the light receiving chip is located by wire bonding to realize the electrical connection between the receiving pin and the light receiving chip, and then the electrical signal is transmitted to the circuit board 300 through the receiving pin.

[0328] The receiving pin of the light receiving component is the electrical input end of the light receiving part 500. For example, the receiving pin of the first light receiving component 530 is the second electrical input end of the light receiving part 500, the receiving pin of the second light receiving component 520 is the third electrical input end of the light receiving part 500, and the receiving pin of the third light receiving component 540 is the first electrical input end of the light receiving part 500. As shown in FIGS. 21, 23, and 24, the fourth flexible circuit board 904 is connected with the receiving pin of the second light receiving component 520, the third flexible circuit board 903 is connected with the receiving pin of the first light receiving component 530, and the second flexible circuit board 902 is connected with the receiving pin of the third light receiving component 540.

[0329] In some embodiments, the top of the receiving cap of the light receiving component is provided with a second lens. The second lens is a converging lens that can converge and couple the optical signal incident on the second lens to the light receiving chip in the receiving cavity.

[0330] The second lens can or can not protrude from the receiving tube cap. When the second lens does not protrude from the receiving tube cap, the top of the light receiving assembly can be directly attached with a 0° filter. The 0° filter can allow certain specific wavelength of light signals to pass through, so as to reduce the incidence of light signals of other wavelengths to the light receiving chip of the light receiving assembly. As shown in FIG. 26, the top of the second light receiving assembly 520 is directly attached with a second filter 5178, which is a 0° filter and can allow the second wavelength of light signals to pass through.

[0331] When the second lens protrudes from the receiving tube cap, the top of the light receiving assembly is attached with a 0° filter through the support 550. As shown in FIG. 26, the top of the first light receiving assembly 530 is attached with a first filter 5177 through the support 550, which is a 0° filter and can allow the first wavelength of light signals to pass through.

[0332] In some embodiments, the receiving rate of the light receiving chip of the first light receiving assembly 530, the receiving rate of the light receiving chip of the second light receiving assembly 520, and the receiving rate of the light receiving chip of the third light receiving assembly 540 can all be different. For example, the receiving rate of the light receiving chip of the second light receiving assembly 520 is greater than the receiving rate of the light receiving chip of the first light receiving assembly 530 and greater than the receiving rate of the light receiving chip of the third light receiving assembly 540. For example, the receiving rate of the light receiving chip of the first light receiving assembly 530 is 10G, the receiving rate of the light receiving chip of the second light receiving assembly 520 is 25G, and the receiving rate of the light receiving chip of the third light receiving assembly 540 is 2.5G.

[0333] In some embodiments, the first light receiving assembly 530, the second light receiving assembly 520, and the third light receiving assembly 540 are all located on the same side of the light receiving component 500.

[0334] In some embodiments, the first light receiving assembly 530 and the second light receiving assembly 520 can be located on one side of the light receiving component 500, and the third light receiving assembly 540 can be located on the other side of the light receiving component 500, so as to reduce the length dimension of the light receiving component 500.

[0335] As shown in FIGS. 25, 26, and 27, in some embodiments, the first cavity can include a first connecting hole 5111. The first connecting hole 5111 can be located at the light input / output end of the light receiving component 500. The first connecting hole 5111 can be connected with the fiber adapter 700, so as to connect the fiber adapter 700 with the first cavity. For example, one end of the connecting sleeve 710 is inserted into the first connecting hole 5111, and the other end of the connecting sleeve 710 is connected with the fiber adapter 700, so as to connect the fiber adapter 700 with the first cavity through the connecting sleeve 710.

[0336] As shown in FIGS. 25, 26 and 27, in some embodiments, the first cavity can comprise a second connecting hole 5131. The second connecting hole 5131 can be located at the light input end of the light receiving component 500 to connect the light emitting component 400 with the first cavity.

[0337] In some embodiments, the first connecting hole 5111 and the second connecting hole 5131 can be oppositely arranged.

[0338] In some embodiments, an isolator can be arranged in the second connecting hole 5131. The isolator can allow the emission light signal emitted by the light emitting component 400 to be incident on the light receiving component 500, and prevent the emission light signal incident on the light receiving component 500 from returning to the light emitting component 400.

[0339] As shown in FIGS. 25, 26 and 27, in some embodiments, the first cavity can comprise a third connecting hole 5141. The third connecting hole 5141 can be used for insertion of one of the at least one light receiving assembly to connect the one of the at least one light receiving assembly with the first cavity. For example, the third connecting hole 5141 can be used for insertion of the third light receiving assembly 540 to connect the third light receiving assembly 540 with the first cavity.

[0340] As shown in FIGS. 25, 26 and 27, in some embodiments, the first cavity can comprise a fourth connecting hole 5121. The fourth connecting hole 5121 can be used for insertion of another of the at least one light receiving assembly to connect the another of the at least one light receiving assembly with the first cavity. For example, the fourth connecting hole 5121 can be used for insertion of the second light receiving assembly 520 to connect the second light receiving assembly 520 with the first cavity.

[0341] As shown in FIGS. 25, 26 and 27, in some embodiments, the first cavity can comprise a fifth connecting hole 5122. The fifth connecting hole 5122 can be used for insertion of a further one of the at least one light receiving assembly to connect the further one of the at least one light receiving assembly with the first cavity. For example, the fifth connecting hole 5122 can be used for insertion of the first light receiving assembly 530 to connect the first light receiving assembly 530 with the first cavity.

[0342] In some embodiments, the fourth connecting hole 5121 and the fifth connecting hole 5122 can be located at one side wall of the first cavity, and the third connecting hole 5141 can be located at another side wall of the first cavity to reduce the length dimension of the first cavity.

[0343] FIG. 28 is an assembly view of the first light receiving assembly, the bracket, and the first filter according to some embodiments. FIG. 29 is a sectional view of the first light receiving assembly, the bracket, and the first filter according to some embodiments. FIG. 30 is an exploded view of the first light receiving assembly, the bracket, and the first filter according to some embodiments. As shown in FIGS. 28, 29, and 30, in some embodiments, the first light receiving assembly 530 can include a receiving tube base 532, a receiving tube cap 533, and a receiving tube pin 531. The receiving tube cap 533 is arranged on the top of the receiving tube base 532 to form a receiving cavity in which a light receiving chip is arranged. The receiving tube pin 531 extends upwardly from the bottom of the receiving tube base 532 to protrude from the top of the receiving tube base 532 and is connected to the light receiving chip and the like in the receiving cavity. The second lens 534 is arranged on the receiving tube cap 533.

[0344] As shown in FIGS. 28, 29, and 30, the top of the first light receiving assembly 530 is provided with the bracket 550, and the first filter 5177 is attached to the bracket 550.

[0345] FIG. 31 is a structural view of the bracket according to some embodiments. FIG. 32 is a structural view of the bracket from another perspective according to some embodiments. As shown in FIGS. 31 and 32, in some embodiments, the bracket 550 can include a first fixing portion 551. The bottom surface of the first fixing portion 551 can be in contact with the outer top surface of the receiving tube cap 533 to fix the first fixing portion 551 to the receiving tube cap 533.

[0346] As shown in FIGS. 31 and 32, in some embodiments, the bracket 550 can include a second fixing portion 552. The bottom surface of the second fixing portion 552 can be in contact with the top surface of the first fixing portion 551 to fix the second fixing portion 552 to the first fixing portion 551. The top surface of the second fixing portion 552 can be attached to the first filter 5177.

[0347] As shown in FIGS. 31 and 32, in some embodiments, the bracket 550 can include an enclosing portion 553. The inner surface of the enclosing portion 553 is in contact with the outer surface of the second fixing portion 552 to fix the enclosing portion 553 to the second fixing portion 552.

[0348] In some embodiments, the height dimension of the enclosing portion 553 is greater than the height dimension of the second fixing portion 552 to enclose the first filter 5177.

[0349] As shown in FIG. 31 and FIG. 32, in some embodiments, the bracket 500 has a first light hole 554. The first light hole 554 can extend from the first fixed part 551 to the second fixed part 552, so that the first light hole 554 can pass through the bracket 500, and thus the light signal of the first cavity can be incident on the first light receiving assembly 530 through the first light hole 554.

[0350] In some embodiments, a first filter 5177 is disposed at the port of the first light hole 554 to block the port of the first light hole 554, so that the light signal (i.e. the third wavelength light signal) passing through the first filter 5177 is incident on the first light receiving assembly 530 through the first light hole 554. For example, the size of the first filter 5177 is greater than the size of the first light hole 554.

[0351] In some embodiments, the size of the first light hole 554 is greater than or equal to the size of the second lens 534, so that the first light hole 554 can accommodate the second lens 534, and thus the light signal of the first cavity is coupled into the light receiving chip of the first light receiving assembly 530 through the second lens 534 in the first light hole 554.

[0352] The first light hole 554 can accommodate the second lens 534, and the first filter 5177 is disposed on the first light hole 554, so that the light signal (i.e. the third wavelength light signal) of the first filter 5177 is coupled into the light receiving chip of the first light receiving assembly 530 through the second lens 534 in the first light hole 554.

[0353] FIG. 33 is an exploded view of a first cavity according to some embodiments. FIG. 34 is an exploded view of a first housing and a light receiving assembly according to some embodiments. As shown in FIG. 33 and FIG. 34, in some embodiments, the first cavity can include a first cover plate 515.

[0354] As shown in FIG. 33 and FIG. 34, in some embodiments, the first cavity can include a first housing 510. The first cover plate 515 can be covered on the first housing 510 to form the first cavity. The light receiving assembly 517 can be disposed in the first cavity. The light receiving assembly 517 can transmit the emitted light signal to the fiber adapter 700, or can split the received light signal transmitted by the fiber adapter 700 to the first cavity, and then the split light signal is incident on the corresponding light receiving assembly.

[0355] In the assembly process, the light receiving assembly 517 is first fixed in the first housing 510, and then the first cover plate 515 is covered on the first housing 510 to form the first cavity.

[0356] FIG. 35 is a light path diagram of a receiving light assembly according to some embodiments. As shown in FIG. 35, in some embodiments, the receiving light assembly 517 can include a first lens 5171. The first lens 5171 is configured to collimate / converge light signals. For example, the receiving light signals transmitted by the first cavity to the fiber optic adapter 700 are converged by the first lens 5171, and the light signals transmitted by the fiber optic adapter 700 to the first cavity are collimated by the first lens 5171.

[0357] As shown in FIG. 35, in some embodiments, the receiving light assembly 517 can include a wavelength division assembly 5172. The first end of the wavelength division assembly 5172 can be disposed corresponding to the first end of the light receiving component, and the second end of the wavelength division assembly 5172 can be disposed corresponding to the second end of the light receiving component, so that the wavelength division assembly 5172 can be disposed along the length direction of the light receiving component 500.

[0358] The wavelength division assembly 5172 can be disposed along the length direction of the light receiving component 500, i.e., the wavelength division assembly 5172 can be disposed along the length direction of the first housing 510, so as to reduce the width dimension of the first housing 510, and further reduce the width dimension of the light receiving component 500. When the wavelength division assembly 5172 is disposed along the length direction of the first housing 510, the width dimension of the first housing 510 required to accommodate the wavelength division assembly 5172 can be reduced, and the length dimension of the receiving pins of the light receiving assembly is small, so that the width dimension of the light receiving component 500 can be reduced.

[0359] In some embodiments, the wavelength division assembly 5172 can be located between the first lens 5171 and the light emitting component 400, and the wavelength division assembly 5172 can be disposed along the length direction of the light receiving component 500, so that the wavelength division assembly 5172 can transmit the emitted light signals emitted by the light emitting component 400 to the first lens 5171. The wavelength division assembly 5172 can divide the light signals collimated by the first lens 5171 according to wavelengths. For example, the wavelength division assembly 5172 divides a bundle of receiving light signals including a first wavelength, a second wavelength and a third wavelength into first wavelength light signals, second wavelength light signals and third wavelength light signals according to wavelengths.

[0360] The wavelength division assembly 5172 can transmit the emitted light signals (i.e., emitted light beams) emitted by the light emitting component 400 to the first lens 5171, and can also divide the receiving light signals collimated by the first lens 5171 (i.e., receiving light beams) according to wavelengths, so as to reduce the distance between the emitted light beams and the receiving light beams in the width direction of the first housing 510, and further reduce the width dimension of the light receiving component 500.

[0361] In some embodiments, the first end of the wave separation component 5172 has a receiving light entrance, the second end of the wave separation component 5172 has a transmitting light entrance, the transmitting light signal emitted by the light emitting component 400 is incident to the transmitting light entrance of the second end of the wave separation component 5172 and is emitted through the receiving light entrance of the first end of the wave separation component 5172, and the receiving light signal emitted by the fiber adapter 700 and including the first wavelength, the second wavelength and the third wavelength is incident to the receiving light entrance of the first end of the wave separation component 5172 and is reflected through the transmitting light entrance of the second end of the wave separation component 5172. The light path of the transmitting light signal and the light path of the receiving light signal overlap in the width direction of the light receiving component 500, so as to reduce the width dimension of the light receiving component 500.

[0362] In some embodiments, the first end of the wave separation component 5172 has a first light exit, the second end of the wave separation component 5172 has a second light exit and a third light exit, the receiving light signal is separated into the first wavelength light signal, the second wavelength light signal and the third wavelength light signal after being reflected through the transmitting light entrance of the second end of the wave separation component 5172, the first wavelength light signal is emitted through the second light exit of the second end of the wave separation component 5172, the third wavelength light signal is emitted through the first light exit of the first end of the wave separation component 5172, and the third wavelength light signal is emitted through the third light exit of the second end of the wave separation component 5172.

[0363] In some embodiments, the first end of the wave separation component 5172 and the second end of the wave separation component 5172 are arranged in parallel, so that the transmitting light signal incident to the second end of the wave separation component 5172 and the transmitting light signal emitted through the first end of the wave separation component 5172 are parallel to each other.

[0364] In some embodiments, the inclination angle of the first end of the wave separation component 5172 is in a first preset range, so that the receiving light signal including the first wavelength, the second wavelength and the third wavelength incident to the wave separation component 5172 can be separated into the first wavelength light signal, the second wavelength light signal and the third wavelength light signal. For example, the first preset range is 8°±1°.

[0365] In some embodiments, the wave separation component 5172 can include a substrate 51721. The substrate 51721 is a block substrate. The first end surface of the substrate 51721 is arranged corresponding to the first end of the light receiving component 500, and the second end surface of the substrate 51721 is arranged corresponding to the second end of the light receiving component 500, so that the substrate 51721 is arranged along the length direction of the light receiving component 500. The first end surface of the substrate 51721 can be directed towards the first lens 5171. The second end surface of the substrate 51721 can be directed towards the second connecting hole 5131.

[0366] The first end surface of the substrate 51721 and the second end surface of the substrate 51721 are arranged in parallel, so that the optical signal incident to the substrate 51721 and the optical signal emitted from the substrate 51721 are parallel to each other.

[0367] The first end surface of the substrate 51721 can be directed to the first lens 5171, and the second end surface of the substrate 51721 can be directed to the second connecting hole 5131, so that the substrate 51721 can be arranged along the horizontal direction of the first cavity.

[0368] In some embodiments, the wave splitting component 5172 can include a first wave plate 51722. The first wave plate 51722 can be arranged on the first end surface of the substrate 51721. The first wave plate 51722 can be located between the first lens 5171 and the substrate 51721. The first wave plate 51722 is the receiving light-in light of the first end of the wave splitting component 5172. The first wave plate 51722 can allow the emitted optical signal and the received optical signal to pass through.

[0369] The central axis of the first wave plate 51722 and the central axis of the first lens 5171 can coincide, so that the received optical signal collimated by the first lens 5171 is incident to the first wave plate 51722, and the emitted optical signal of the first wave plate 51722 can be focused and coupled by the first lens 5171.

[0370] In some embodiments, the wave splitting component 5172 can include a second wave plate 51723. The second wave plate 51723 can be arranged on the first end surface of the substrate 51721. One side of the second wave plate 51723 can be connected with the first wave plate 51722. The second wave plate 51723 can allow the received optical signal to be reflected.

[0371] In some embodiments, the wave splitting component 5172 can include a third wave plate 51724. The third wave plate 51724 can be arranged on the first end surface of the substrate 51721. One side of the third wave plate 51724 can be connected with the other side of the second wave plate 51273. The third wave plate 51724 is the first light-out of the first end of the wave splitting component 5172.

[0372] In some embodiments, the third wave plate 51724 can be a low-pass filter, which can allow low-frequency signals to pass through and block high-frequency signals. For example, the third wave plate 51724 can allow the third wavelength optical signal to transmit, and can allow the second wavelength optical signal to reflect.

[0373] In some embodiments, the wave splitting component 5172 can include a fourth wave plate 51725. The fourth wave plate 51725 can be disposed on the second end surface of the substrate 51721. The fourth wave plate 51725 can be disposed opposite to the first wave plate 51722. The fourth wave plate 51725 can be located between the substrate 51721 and the second connecting hole 5131. The fourth wave plate 51725 is the second end of the wave splitting component 5172. The fourth wave plate 51725 can allow the received light signal to be reflected, and can also allow the emitted light signal to be transmitted.

[0374] The central axis of the fourth wave plate 51725 can coincide with the central axis of the second connecting hole 5131, so that the emitted light signal incident to the first cavity through the second connecting hole 5131 is incident to the fourth wave plate 51725.

[0375] In some embodiments, the wave splitting component 5172 can include a fifth wave plate 51726. The fifth wave plate 51726 can be disposed on the second end surface of the substrate 51721. The fifth wave plate 51726 can be disposed opposite to the second wave plate 51723. One side of the fifth wave plate 51726 can be connected to the fourth wave plate 51725. The fifth wave plate 51726 is the second light exit of the second end of the wave splitting component 5172.

[0376] In some embodiments, the fifth wave plate 51726 can be a band-pass filter, which can allow signals within a certain frequency range to pass through and block signals of other frequencies. For example, the fifth wave plate 51726 can allow the first wavelength light signal to be transmitted, and can also allow the third wavelength light signal and the second wavelength light signal to be reflected.

[0377] In some embodiments, the wave splitting component 5172 can include a sixth wave plate 51727. The sixth wave plate 51727 can be disposed on the second end surface of the substrate 51721. The sixth wave plate 51727 can be disposed opposite to the third wave plate 51724. The sixth wave plate 51727 can be connected to the other side of the fifth wave plate 51726. The sixth wave plate 51727 is the third light exit of the second end of the wave splitting component 5172.

[0378] In some embodiments, the sixth wave plate 51727 can be a high-pass filter, which can allow high-frequency signals to pass through and block low-frequency signals. For example, the sixth wave plate 51727 can allow the second wavelength light signal to be transmitted, and can also allow the third wavelength light signal to be reflected.

[0379] The fourth wave plate 51725, the fifth wave plate 51726, and the sixth wave plate 51727 can be connected in sequence to reduce the length of the second end surface of the substrate 51721.

[0380] In some embodiments, the center distance between any two of the fourth wave plate 51725, the fifth wave plate 51726, and the sixth wave plate 51727 is greater than a first preset value, so as to increase the distance between the first wavelength light signal transmitted by the fifth wave plate 51726 and the second wavelength light signal transmitted by the sixth wave plate 51727, thereby improving the isolation. For example, the first preset value is 1000 nm, and the center distance between any two of the fourth wave plate 51725, the fifth wave plate 51726, and the sixth wave plate 51727 is greater than 1000 nm.

[0381] The first wave plate 51722, the second wave plate 51723, and the third wave plate 51724 can be connected in sequence, so as to reduce the length of the first end surface of the substrate 51721.

[0382] Since the plurality of wave plates of the first end surface of the substrate 51721 and the plurality of wave plates of the second end surface of the substrate 51721 are oppositely arranged, the center distance between any two of the first wave plate 51722, the second wave plate 51723, and the third wave plate 51724 is 1000 nm.

[0383] The third wave plate 51724 is located at the first end surface of the substrate 51721, and the fifth wave plate 51726 and the sixth wave plate 51727 are located at the second end surface of the substrate 51721, so that the emission direction of the light signal transmitted by the third wave plate 51724 is opposite to the emission direction of the light signal transmitted by the fifth wave plate 51726 or the sixth wave plate 51727, thereby improving the isolation.

[0384] As shown in FIG. 35, in some embodiments, the receiving light assembly 517 can include a first reflecting sheet 5173. The first reflecting sheet 5173 can be located on the output light path of the fifth wave plate 51726, so as to reflect the light signal transmitted by the fifth wave plate 51726. The first reflecting sheet 5173 can allow the first wavelength light signal transmitted by the fifth wave plate 51726 to be reflected.

[0385] As shown in FIG. 35, in some embodiments, the receiving light assembly 517 can include a second reflecting sheet 5176. The second reflecting sheet 5176 can be located on the output light path of the third wave plate 51724, so as to reflect the light signal transmitted by the third wave plate 51726. The second reflecting sheet 5176 can allow the third wavelength light signal transmitted by the third wave plate 51724 to be reflected.

[0386] As shown in FIG. 35, in some embodiments, the receiving light assembly 517 can include a third reflecting sheet 5175. The third reflecting sheet 5175 can be located on the output light path of the sixth wave plate 51727, so as to reflect the light signal transmitted by the sixth wave plate 51727. The third reflecting sheet 5175 can allow the second wavelength light signal transmitted by the sixth wave plate 51727 to be reflected.

[0387] As shown in FIG. 35, the receiving light assembly 517 can include a first filter 5177. The first filter 5177 can be located on the reflected light path of the second reflecting piece 5176.

[0388] In some embodiments, the first filter 5177 can be attached on the top of the first light receiving assembly 530 for filtering light signals so that the first light receiving assembly 530 receives the third wavelength light signals.

[0389] As shown in FIG. 35, the receiving light assembly 517 can include a second filter 5178. The second filter 5178 can be located on the reflected light path of the first reflecting piece 5173.

[0390] In some embodiments, the second filter 5178 can be attached on the top of the second light receiving assembly 520 for filtering light signals so that the second light receiving assembly 520 receives the first wavelength light signals.

[0391] As shown in FIG. 35, in some embodiments, the receiving light assembly 517 can include a third filter 5174. The third filter 5174 can be located on the output light path of the sixth wave piece 51727. The third filter 5174 can allow the light signals transmitted through the sixth wave piece to pass through. For example, the third filter 5174 can allow the second wavelength light signals to pass through.

[0392] In some embodiments, the third filter 5174 can be attached on the top of the third light receiving assembly 540 for filtering light signals so that the third light receiving assembly 540 receives the second wavelength light signals.

[0393] In some embodiments, the third filter 5174 can be located between the sixth wave piece 51727 and the corresponding light receiving assembly, and the third filter 5174 is not connected to the corresponding light receiving assembly. For example, the third filter 5174 can be located between the sixth wave piece 51727 and the third light receiving assembly 540, and the third filter 5174 is not connected to the third light receiving assembly 540.

[0394] As shown in FIG. 35, the light path is as follows:

[0395] The emitted light signals are transmitted through the fourth wave piece 51725 and the first wave piece 51722 in turn, and then focused and coupled to the fiber adapter 700 through the first lens 5171.

[0396] The received light signal is first collimated by the first lens 5171, second transmitted by the first wave plate 51722, third reflected by the fourth wave plate 51725 and the second wave plate 51723 in turn, and then incident on the fifth wave plate 51726. The first wavelength light signal in the received light signal is first transmitted by the fifth wave plate 51726, second reflected by the first reflecting sheet 5173, and then incident on the second filter sheet 5178.

[0397] The third wavelength light signal in the received light signal is first reflected by the fifth wave plate 51726, second transmitted by the third wave plate 51724, third reflected by the second reflecting sheet 5176, and then incident on the first filter sheet 5177.

[0398] The second wavelength light signal in the received light signal is first reflected by the fifth wave plate 51726, second transmitted by the sixth wave plate 51727, third filtered by the third filter sheet 5174, and finally reflected by the third reflecting sheet 5175.

[0399] FIG. 36 is a structural diagram of a first housing at a first viewing angle according to some embodiments. FIG. 37 is a structural diagram of a first housing at a second viewing angle according to some embodiments. FIG. 38 is a sectional view of a first housing according to some embodiments. As shown in FIGS. 36, 37 and 38, in some embodiments, the first housing 510 can include a first side wall 511. The first side wall 511 is a side wall of the first housing 510 close to the fiber optic adapter 700. The first side wall 511 can have a first connecting hole 5111. The first connecting hole 5111 can traverse the first side wall 511, so that the first connecting hole 5111 can be in communication with the inner cavity of the first cavity, thereby enabling the transmission of the light signal along the first connecting hole 5111 in and out of the first cavity.

[0400] As shown in FIGS. 36, 37 and 38, in some embodiments, the first housing 510 can include a second side wall 512. One end of the second side wall 512 can be connected to one end of the first side wall 511.

[0401] As shown in FIGS. 36, 37 and 38, in some embodiments, the first housing 510 can include a third side wall 513. One end of the third side wall 513 can be connected to the other end of the second side wall 512. The third side wall 513 is a side wall of the first housing 510 close to the light emitting component 400. The third side wall 513 can be disposed opposite to the first side wall 511. The third side wall 513 can have a second connecting hole 5131. The second connecting hole 5131 can traverse the third side wall 513, so that the second connecting hole 5131 can be in communication with the inner cavity of the first cavity, thereby enabling the incident of the emitted light signal emitted by the light emitting component 400 to the first cavity along the second connecting hole 5131.

[0402] As shown in FIGS. 34, 37 and 38, in some embodiments, the third side wall 513 can have a first bearing surface 5132. The first bearing surface 5132 can be formed by inwardly recessing an inner surface of the third side wall 513. The first bearing surface 5132 can be directed toward the third connecting hole 5141.

[0403] As shown in FIGS. 34, 37 and 38, in some embodiments, the third side wall 513 can have a second bearing surface 5133. The second bearing surface 5133 can be formed by inwardly recessing an inner surface of the third side wall 513. One end of the second bearing surface 5133 can be connected with the first bearing surface 5132. The second bearing surface 5133 can be directed toward the fourth connecting hole 5121 and the first connecting hole 5111.

[0404] As shown in FIGS. 34, 37 and 38, in some embodiments, the third side wall 513 can have a fifth bearing surface 5134. The fifth bearing surface 5134 can be formed by inwardly recessing an inner surface of the third side wall 513. The fifth bearing surface 5134 can be connected with another end of the second bearing surface 5133. The fifth bearing surface 5134 can be provided with the second connecting hole 5131 between the fifth bearing surface 5134 and the bottom plate of the first housing 510. The fifth bearing surface 5134 can be directed toward the first connecting hole 5111.

[0405] As shown in FIGS. 34 and 38, in some embodiments, the first housing 510 can include a fourth side wall 514. One end of the fourth side wall 514 can be connected with one end of the third side wall 513. Another end of the fourth side wall 514 can be connected with another end of the first side wall 511. The fourth side wall 514 can be oppositely arranged with the second side wall 512.

[0406] As shown in FIG. 36, in some embodiments, the fourth side wall 514 can have a third bearing surface 5143. The third bearing surface 5143 can be a partial area of an inner surface of the fourth side wall 514.

[0407] As shown in FIGS. 36, 37 and 38, the fourth side wall 514 can have a fourth bearing surface 5144. The fourth bearing surface 5144 can be a partial area of an inner surface of the fourth side wall 514. The fourth bearing surface 5144 can be connected with or not connected with the third bearing surface 5143.

[0408] In some embodiments, the third bearing surface 5143 is obliquely arranged relative to the fourth bearing surface 5114, so that the third bearing surface 5413 can be directed toward the fifth connecting hole 5122.

[0409] As shown in FIG. 33, FIG. 34 and FIG. 37, in some embodiments, the first housing 510 can include a bottom plate 5161. The bottom plate 5161 can be used to support the light receiving assembly 517. The bottom plate 5161 can be connected with the first sidewall 511. The bottom plate 5161 can be connected with the second sidewall 512. The bottom plate 5161 can be connected with the third sidewall 513. The bottom plate 5161 can be connected with the fourth sidewall 514.

[0410] In some embodiments, the bottom plate of the first housing 510 can have a reserved hole 518. The reserved hole 518 can traverse the bottom plate 5161 of the first housing 510. The reserved hole 518 can be located below the second bearing surface 5133 and the fifth bearing surface 5134, so that the reserved hole 518 can be correspondingly arranged with the second bearing surface 5133 and the fifth bearing surface 5134, to facilitate the formation of the second bearing surface 5133 and the fifth bearing surface 5134.

[0411] The first sidewall 511, the second sidewall 512, the third sidewall 513 and the fourth sidewall 514 are sequentially connected and respectively connected with the bottom plate 5161, to form the first housing 510 with an opening. The opening of the first housing 510 can be towards the lower housing 202.

[0412] As shown in FIG. 36, FIG. 37 and FIG. 38, in some embodiments, the inward recess of the first housing 510 can form a containing cavity 516. The containing cavity 516 can be an inner cavity of the first cavity, so that the containing cavity 516 can be in communication with the first connecting hole 5111, the second connecting hole 5131, the third connecting hole 5141, the fourth connecting hole 5121 and the fifth connecting hole 5122. The containing cavity 516 can accommodate other devices in the light receiving assembly 517 except the first filter 5177 and the second filter 5178.

[0413] In some embodiments, the fourth connecting hole 5121 and the fifth connecting hole 5122 can be located in one of the second sidewall 512 and the fourth sidewall 514, and the third connecting hole 5141 can be located in the other of the second sidewall 512 and the fourth sidewall 514. For example, the fourth connecting hole 5121 and the fifth connecting hole 5122 can be located in the second sidewall 512, and the third connecting hole 5141 can be located in the fourth sidewall 514.

[0414] As shown in FIG. 36, FIG. 37 and FIG. 38, the second sidewall 512 can have a fourth connecting hole 5121. The fourth connecting hole 5121 can traverse the second sidewall 512, so that the fourth connecting hole 5121 can be in communication with the inner cavity of the first cavity, so that the light signal of the inner cavity of the first cavity can be incident to the light receiving assembly connected with the fourth connecting hole 5121. For example, the light signal of the inner cavity of the first cavity can be incident to the second light receiving assembly 520.

[0415] As shown in FIGS. 36 and 38, in some embodiments, the fourth connecting hole 5121 can include a first sub-connecting hole 51211.

[0416] As shown in FIGS. 36 and 38, in some embodiments, the fourth connecting hole 5121 can include a second sub-connecting hole 51212. One end of the second sub-connecting hole 51212 can be in communication with the inner cavity of the first housing 510. The other end of the second sub-connecting hole 51212 can be in communication with the first sub-connecting hole 51211. The second sub-connecting hole 51212 can have a size smaller than that of the first sub-connecting hole 51211.

[0417] One end of the second sub-connecting hole 51212 can be in communication with the inner cavity of the first housing 510, and the other end of the second sub-connecting hole 51212 can be in communication with the first sub-connecting hole 51211, so that the fourth connecting hole 5121 can be in communication with the inner cavity of the first cavity.

[0418] As shown in FIGS. 36, 37 and 38, the second side wall 512 can have a fifth connecting hole 5122. The fifth connecting hole 5122 can be closer to the first side wall 512 than the fourth connecting hole 5121. The fifth connecting hole 5122 can traverse the second side wall 512, so that the fifth connecting hole 5122 can be in communication with the inner cavity of the first cavity, and thus the light signal of the inner cavity of the first cavity can be incident on the light receiving component connected to the fifth connecting hole 5122. For example, the light signal of the inner cavity of the first cavity can be incident on the first light receiving component 530.

[0419] In some embodiments, the fourth connecting hole 5121 is closer to the second connecting hole 5131 than the fifth connecting hole 5122, so that the light receiving component placed in the fourth connecting hole 5121 is closer to the light emitting component 400 than the light receiving component placed in the fifth connecting hole 5122.

[0420] As shown in FIGS. 36 and 38, in some embodiments, the fifth connecting hole 5122 can include a third sub-connecting hole 51221.

[0421] As shown in FIGS. 36 and 38, in some embodiments, the fifth connecting hole 5122 can include a fourth sub-connecting hole 51222. One end of the fourth sub-connecting hole 51222 can be in communication with the inner cavity of the first housing 510. The other end of the fourth sub-connecting hole 51222 can be in communication with the third sub-connecting hole 51221. The fourth sub-connecting hole 51222 can have a size smaller than that of the third sub-connecting hole 51221.

[0422] One end of the fourth sub-connection hole 51222 can be in communication with the inner cavity of the first shell 510, and the other end of the fourth sub-connection hole 51222 can be in communication with the third sub-connection hole 51221, so that the fifth connection hole 5122 can be in communication with the inner cavity of the first cavity.

[0423] As shown in FIGS. 36, 37 and 38, in some embodiments, the second side wall 512 can have a first step 5123. The first step 5123 can be located between the fourth connection hole 5121 and the fifth connection hole 5122. The first step 5123 can make the surface of the area where the fifth connection hole 5122 is located different in height from the surface of the area where the fourth connection hole 5121 is located, i.e., the depth of the fifth connection hole 5122 is different from the depth of the fourth connection hole 5121, so that the light receiving components placed in the fifth connection hole 5122 and the fourth connection hole 5121 are both located in the corresponding connection holes, thereby improving the connection stability of the fifth connection hole 5122 and the fourth connection hole 5121 with their corresponding light receiving components, respectively. For example, the second light receiving component 520 is arranged in the fourth connection hole 5121, and the first light receiving component 530 is arranged in the fifth connection hole 5122, and the first step 5123 makes the depth of the fifth connection hole 5122 greater than the depth of the fourth connection hole 5121.

[0424] As shown in FIGS. 36, 37 and 38, the fourth side wall 514 can have a third connection hole 5141. The third connection hole 5141 can pass through the fourth side wall 514, so that the third connection hole 5141 can be in communication with the inner cavity of the first cavity, and thus the optical signal of the inner cavity of the first cavity can be incident on the light receiving component connected with the third connection hole 5141. For example, the optical signal of the inner cavity of the first cavity can be incident on the third light receiving component 540.

[0425] In some embodiments, the central axis of the fourth connection hole 5121 is closer to the first connection hole 5131 than the central axis of the third connection hole 5141, so that the light receiving component placed in the fourth connection hole 5121 is closer to the fiber adapter 700 than the light receiving component placed in the third connection hole 5141.

[0426] As shown in FIGS. 34 and 38, in some embodiments, the fourth side wall 514 can have a second step 5142, so that the area of the fourth side wall 514 where the third connection hole 5141 is located is recessed relative to other areas of the fourth side wall 514, thereby providing accommodation space for the third light receiving component 540 inserted into the third connection hole 5141, and also increasing the strength of the first shell 510.

[0427] FIG. 39 is a cross-sectional view of a light receiving component according to some embodiments. FIG. 40 is a cross-sectional view of a light receiving component according to some embodiments, from another perspective. As shown in FIGS. 39 and 40, in some embodiments, the first lens 5171 can be located outside the first connecting hole 5111, i.e., in the accommodation cavity 516, to facilitate active coupling of the first lens 5171. Since the space of the accommodation cavity 516 is larger than the space of the first connecting hole 5111, active coupling of the first lens 5171 is facilitated, and assembly difficulty is reduced.

[0428] In some embodiments, the first lens 5171 can be passively mounted in the first connecting hole 5111 to reduce the volume of the first cavity.

[0429] As shown in FIGS. 39 and 40, in some embodiments, the second light receiving assembly 520 can be located on the reflection light path of the first reflecting sheet 5173, the first reflecting sheet 5173 facing the fifth wave sheet 51726 and the second light receiving assembly 520, so that the first wavelength light signal transmitted by the fifth wave sheet 51726 is reflected by the first reflecting sheet 5173 to the second light receiving assembly 520.

[0430] As shown in FIGS. 39 and 40, in some embodiments, the first light receiving assembly 530 can be located on the reflection light path of the second reflecting sheet 5176, the second reflecting sheet 5176 facing the third wave sheet 51724 and the first light receiving assembly 530, so that the three-wavelength light signal transmitted by the third wave sheet 51724 is reflected by the second reflecting sheet 5176 to the first light receiving assembly 530.

[0431] As shown in FIGS. 39 and 40, in some embodiments, the third light receiving assembly 540 can be located on the reflection light path of the third reflecting sheet 5175, the third reflecting sheet 5175 facing the sixth wave sheet 51727 and the third light receiving assembly 540, so that the second wavelength light signal transmitted by the sixth wave sheet 51727 is reflected by the third reflecting sheet 5175 to the third light receiving assembly 540.

[0432] In some embodiments, the wavelength range of the first wavelength light signal received by the second light receiving assembly 520 is 1284-1288 nm, the receiving rate of the second light receiving assembly 520 is greater than the receiving rate of the first light receiving assembly 530 and the third light receiving assembly 540, resulting in that the receiving light sensitive surface of the second light receiving assembly 520 is smaller than the receiving light sensitive surface of the first light receiving assembly 530 and the third light receiving assembly 540, so that the transmission path of the first wavelength light signal received by the second light receiving assembly 520 is the shortest, and the light receiving chip of the second light receiving assembly 520 can receive the first wavelength light signal with high coupling efficiency.

[0433] In some embodiments, the wavelength range of the first wavelength optical signal received by the second light receiving component 520 is 1284-1288 nm, the wavelength range of the third wavelength optical signal received by the first light receiving component 510 is 1260-1280 nm, and the wavelength range of the second wavelength optical signal received by the third light receiving component 540 is 1290-1330 nm. The receiving rate of the second light receiving component 520, the first light receiving component 530, and the third light receiving component 540 decreases in turn, and the light receiving surface of the second light receiving component 520, the first light receiving component 530, and the third light receiving component 540 increases in turn, so that the transmission path of the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal increases in turn, and the second light receiving component 520, the first light receiving component 530, and the third light receiving component 540 can efficiently receive the corresponding wavelength receiving optical signal.

[0434] As shown in FIGS. 37, 38, and 39, in some embodiments, the second light receiving component 520 can be placed in the fourth connecting hole 5121. The second light receiving component 520 can be placed in the first sub-connecting hole 51211, and the second filter 5178 on the second light receiving component 520 can be placed in the second sub-connecting hole 51212.

[0435] As shown in FIGS. 39 and 40, in some embodiments, the first light receiving component 530 can be placed in the fifth connecting hole 5122. The first light receiving component 530 is placed in the third sub-connecting hole 51221, and part of the bracket 550 on the first light receiving component 530 is located in the third sub-connecting hole 51221 and part of the bracket 550 is located in the fourth sub-connecting hole 51222. The first filter 5177 on the bracket 550 is located in the fourth sub-connecting hole 51222.

[0436] As shown in FIGS. 39 and 40, in some embodiments, the third light receiving component 540 can be placed in the third connecting hole 5141.

[0437] As shown in FIGS. 37, 38, and 39, the first reflecting sheet 5173 can be supported on the second supporting surface 5133, so that the first reflecting sheet 5173 can be directed towards the fifth wave sheet 51726 and the second light receiving component 520 in the fourth connecting hole 5121, so that the first reflecting sheet 5173 can reflect the first wavelength optical signal to the second light receiving component 520.

[0438] As shown in FIGS. 37 and 40, the first reflecting sheet 5173 can be supported on the fifth supporting surface 5134. The first reflecting sheet 5173 is supported on the second supporting surface 5133 and the fifth supporting surface 5134 to increase the contact area of the first reflecting sheet 5173 with the first housing 510 and improve the connection stability of the first reflecting sheet 5173 with the first housing 510.

[0439] As shown in FIG. 21 and FIG. 24, the second reflecting sheet 5176 can be supported by the third supporting surface 5143, so that the second reflecting sheet 5176 can be directed towards the fifth connecting hole 5122, and then the second reflecting sheet 5176 can be directed towards the first light receiving assembly 530 in the fifth connecting hole 5122, so that the second reflecting sheet 5176 can reflect the third wavelength light signal to the first light receiving assembly 530.

[0440] As shown in FIG. 38 and FIG. 40, a side wall of the wave splitting assembly 5172 can be supported by the fourth supporting surface 5144, so as to facilitate the adhesion between the wave splitting assembly 5172 and the first shell 510. The fourth supporting surface 5144 can be located on the inner surface of the fourth side wall 514, or can be located on the inner surface of the second side wall 512.

[0441] As shown in FIG. 34, FIG. 37 and FIG. 39, the third reflecting sheet 5175 can be supported by the first supporting surface 5132, so that the third reflecting sheet 5175 can be directed towards the third connecting hole 5141, and then the third reflecting sheet 5175 can be directed towards the third light receiving assembly 540 in the third connecting hole 5141, so that the third reflecting sheet 5175 can reflect the second wavelength light signal to the third light receiving assembly 540.

[0442] In some embodiments, the third reflecting sheet 5175 can include an incident surface, a reflecting surface and an exit surface, the incident surface is located between the sixth wave plate 51727 and the reflecting surface, the exit surface is located between the third light receiving assembly 540 and the reflecting surface, the reflecting surface is arranged obliquely relative to the incident surface, the second wavelength light signal is incident to the third reflecting sheet 5175 through the incident surface, and is reflected by the reflecting surface of the third reflecting sheet 5175 and then is emitted through the exit surface.

[0443] In some embodiments, one side of the reflecting surface can be connected with one side of the incident surface through a connecting surface.

[0444] In some embodiments, the other side of the reflecting surface can be connected with one side of the exit surface.

[0445] In some embodiments, the other side of the exit surface can be connected with the other side of the incident surface.

[0446] One side of the reflecting surface can be connected with one side of the incident surface through a connecting surface, the other side of the reflecting surface can be connected with one side of the exit surface, and the other side of the exit surface can be connected with the other side of the incident surface, which can reduce the width dimension of the third reflecting sheet 5175, and facilitate to increase the contact area between the third reflecting sheet 5175 (the connecting surface of the third reflecting sheet 5175) and the first supporting surface 5132, and then improve the connection stability between the third reflecting sheet 5175 and the first shell 510.

[0447] As shown in FIG. 37 and FIG. 39, the third filter 5174 can be in contact with the first contact surface 5132.

[0448] In some embodiments, the third filter 5174 can be located between the sixth wave plate 51717 and the third reflecting plate 5175 to reduce the distance between the third reflecting plate 5175 and the third light receiving component 540, thereby reducing the width dimension of the first housing 510.

[0449] In some embodiments, the third filter 5174 is connected to the incident surface of the third reflecting plate 5175 to make the third filter 5174 in contact with the third reflecting plate 5175, thereby reducing the length dimension of the first housing 510.

[0450] As shown in FIG. 38, FIG. 39 and FIG. 40, in some embodiments, the central axis of the fourth connecting hole 5121 is closer to the central axis of the first connecting hole 5131 than the central axis of the third connecting hole 5141, which not only reduces the interference between the first reflecting plate 5173 and the third reflecting plate 5175, but also provides a space for the third filter 5174, and can reduce the width dimension of the first housing 510.

[0451] After the light signal is divided into the first wavelength light signal, the second wavelength light signal and the third wavelength light signal by the light dividing component 5172, the light path is shown in FIG. 39. The first wavelength light signal is reflected by the first reflecting plate 5173 to the second filter 5178, and then is filtered by the second filter 5178 and enters the second light receiving component 520. The third wavelength light signal is reflected by the second reflecting plate 5176 to the first filter 5177, and then is filtered by the first filter 5177 and enters the first light receiving component 530. The second wavelength light signal is filtered by the third filter 5174, and then enters the third reflecting plate 5175, and is reflected by the third reflecting plate 5175 to the third light receiving component 540.

[0452] FIG. 41 is an assembly view of another light receiving component and an adapter plate according to some embodiments. FIG. 42 is an assembly view of another light receiving component, a fiber adapter and a circuit board according to some embodiments. FIG. 43 is an exploded view of another light receiving component according to some embodiments. As shown in FIG. 41, FIG. 42 and FIG. 43, in some embodiments, the light input end of the light receiving component 500 can be connected with the light output end of the light emitting component 400. The light input / output end of the light receiving component 500 can be connected with the fiber adapter 700.

[0453] As shown in FIG. 42, the light emitting component 400 and the circuit board 300 can be connected through the flexible circuit board 300.

[0454] In some embodiments, the flexible circuit board 900 can include a first end. The first end can be connected with the surface of the circuit board 300.

[0455] In some embodiments, the flexible circuit board 900 can include a second end. The second end can be connected with the first electrical input end of the light emitting component 400. The second end can be connected with the first end.

[0456] In some embodiments, the flexible circuit board 900 can include a third end. The third end can be connected with the second electrical input end of the light emitting component 400. The third end can be connected with the first end. There can be a gap between the third end and the second end, so that the second end and the third end of the flexible circuit board 900 are not connected.

[0457] As shown in FIGS. 41, 42 and 43, in some embodiments, the light module can be provided with an adapter board 310 inside the housing. One end of the adapter board 310 can be inserted into the light receiving component 500. The other end of the adapter board 310 can be connected with the circuit board 300. One end of the adapter board 310 can be inserted into the light receiving component 500, and the other end of the adapter board 310 can be connected with the circuit board 300, so that the electrical signal transmission between the light receiving component 500 and the circuit board 300 is realized through the adapter board 310.

[0458] In some embodiments, the other end of the adapter board 310 is stacked with the circuit board 300, and the electrical connection between the adapter board 310 and the circuit board 300 is realized through the connecting piece.

[0459] As shown in FIGS. 41, 42 and 43, in some embodiments, the adapter board 310 and the light receiving component 500 can enclose a first avoiding opening 320. The light emitting component 400 can be placed at the first avoiding opening 320 of the adapter board 310, so as to provide a placing space for the light emitting component 400.

[0460] As shown in FIG. 43, in some embodiments, the light receiving component 500 can include a first cover plate 515.

[0461] As shown in FIG. 43, in some embodiments, the light receiving component 500 can include a first housing 510. The first cover plate 515 can be covered on the first housing 510 to form a first cavity. The first cavity can be provided with a receiving light assembly 517. The receiving light assembly 517 can transmit the emitted light signal to the fiber optic adapter 700, or can split the received light signal transmitted by the fiber optic adapter 700 to the first cavity, and then make the split received light signal incident to the corresponding light receiving assembly.

[0462] FIG. 44 is an exploded view of another light receiving component according to some embodiments. FIG. 45 is an exploded view of another first housing and another receiving light assembly according to some embodiments. As shown in FIGS. 44 and 45, in some embodiments, at least one light receiving chip is arranged on the end surface of the adapter board 310 extending into the light receiving component 500.

[0463] In some embodiments, the at least one light receiving chip can include a first light receiving chip 3132.

[0464] In some embodiments, the at least one light receiving chip can include a second light receiving chip 3131.

[0465] In some embodiments, the at least one light receiving chip can include a third light receiving chip 3121.

[0466] Any two of the first light receiving chip 3132, the second light receiving chip 3131 and the third light receiving chip 3121 can be located on one side of the adapter board 310, and the remaining one of the first light receiving chip 3132, the second light receiving chip 3131 and the third light receiving chip 3121 can be located on the other side of the adapter board 310, so as to reduce the length dimension of the light receiving component 500.

[0467] As shown in FIGS. 44 and 45, in some embodiments, the adapter board 310 can include a connecting portion 311. The connecting portion 311 can be arranged in a stack with the circuit board 300 and electrically connected through a connecting piece.

[0468] As shown in FIGS. 44 and 45, in some embodiments, the adapter board 310 can include a first clamping portion 312. One end of the first clamping portion 312 is inserted into the first housing 510. The other end of the first clamping portion 312 can be connected with the connecting portion 311.

[0469] As shown in FIGS. 44 and 45, in some embodiments, the adapter board 310 can include a second clamping portion 313. One end of the second clamping portion 313 is inserted into the first housing 510. The other end of the second clamping portion 313 can be connected with the connecting portion 311. The first clamping portion 312 can be not connected with the second clamping portion 313, so that the first clamping portion 312, the connecting portion 311 and the second clamping portion 313 enclose the adapter board 310 with a second avoiding opening.

[0470] In some embodiments, the size of the first avoiding opening 320 is smaller than the size of the second avoiding opening.

[0471] In some embodiments, the third light receiving chip 3121 can be located on the surface of the first clamping portion 312, and the first light receiving chip 3132 and the second light receiving chip 3131 can be located on the surface of the second clamping portion 313.

[0472] As shown in FIGS. 44 and 45, in some embodiments, the first housing 510 can include a first side wall 511. The first side wall 511 can be connected with the fiber adapter 700. The first side wall 511 can have a first connecting hole 5111.

[0473] As shown in FIGS. 44 and 45, in some embodiments, the first housing 510 can include a third sidewall 513. The third sidewall 513 can be connected with the light emitting component 400. The third sidewall 513 is opposite to the first sidewall 511. The third sidewall 513 can have a second connecting hole 5131. The second connecting hole 5131 can be connected with the light emitting component 400, so that the emitted light signal emitted by the light emitting component 400 can be incident into the first cavity through the second connecting hole 5131.

[0474] In some embodiments, the third sidewall 513 can have a first notch 5135. The opening of the first notch 5135 can be towards one side edge of the first housing 510. The first notch 5135 can be correspondingly arranged with the first clamping part 312. The first clamping part 312 can be inserted into the first housing 510 through the first notch 5135.

[0475] In some embodiments, the first notch 5135 has a gap with the bottom of the third sidewall 513, so that the height of the bottom of the first notch 5135 is flush with the height of the bottom of the adapter board 310, thereby facilitating the insertion of the first clamping part 312 into the first housing 510 through the first notch 6135.

[0476] In some embodiments, the width dimension of the first notch 5135 can be greater than or equal to the thickness dimension of the first clamping part 312, so as to facilitate the insertion of the first clamping part 312 into the first housing 510 through the first notch 5135. For example, the width dimension of the first notch 5135 is equal to the thickness dimension of the first clamping part 312, so as to improve the sealing performance of the third sidewall 513.

[0477] In some embodiments, the length dimension of the first notch 5135 can be greater than or equal to the width dimension of the first clamping part 312. For example, the length dimension of the first notch 5135 is equal to the width dimension of the first clamping part 312.

[0478] In some embodiments, the third sidewall 513 can have a second notch 5136. The opening of the second notch 5136 can be towards another side edge of the first housing 510. The second notch 5136 can be correspondingly arranged with the second clamping part 313. The second clamping part 313 can be inserted into the first housing 510 through the second notch 5136.

[0479] In some embodiments, the second notch 5136 has a gap with the bottom of the third sidewall 513, so that the height of the bottom of the second notch 5136 is flush with the height of the bottom of the adapter board 310, thereby facilitating the insertion of the second clamping part 313 into the first housing 510 through the second notch 5136.

[0480] In some embodiments, the width dimension of the second gap 5136 can be greater than or equal to the thickness dimension of the second clamping portion 313, so as to facilitate the insertion of the second clamping portion 313 into the first housing 510 through the second gap 5136. For example, the width dimension of the second gap 5136 is equal to the thickness dimension of the second clamping portion 313, so as to improve the sealing of the third side wall 513.

[0481] In some embodiments, the length dimension of the second gap 5136 can be greater than or equal to the width dimension of the second clamping portion 313. For example, the length dimension of the second gap 5136 is equal to the width dimension of the second clamping portion 313.

[0482] In some embodiments, the first gap 5135 and the second gap 5136 can be located on both sides of the second connecting hole 5131, so as to improve the connection stability of the adapter board 310 and the first housing 510.

[0483] As shown in FIGS. 44 and 45, in some embodiments, the first housing 510 can include a bottom plate 5161. The receiving light assembly 517 can be disposed on the bottom plate 5161 to support the receiving light assembly 517.

[0484] The first housing 510 only includes the first side wall 511, the third side wall 513 and the bottom plate 5161, and thus, as shown in FIG. 43, the first cover plate 515 covering the first housing 510 can include a first connecting portion 5151. The first connecting portion 5151 can be disposed opposite to the bottom plate 5161.

[0485] In some embodiments, the first cover plate 515 can include a second connecting portion 5152. One side of the second connecting portion 5152 can be connected with the first connecting portion 5151. The other side of the second connecting portion 5152 can be connected with a side wall of the bottom plate 5161 close to the first clamping portion 312.

[0486] In some embodiments, the first cover plate 515 can include a third connecting portion 5153. The third connecting portion 5153 is disposed opposite to the second connecting portion 5152. One side of the third connecting portion 5153 can be connected with the first connecting portion 5151. The other side of the third connecting portion 5153 can be connected with a side wall of the bottom plate 5161 close to the second clamping portion 313.

[0487] As shown in FIGS. 43, 44 and 45, in some embodiments, the receiving light assembly 517 can include a first lens 5171, a wave division assembly 5172, a first reflecting sheet 5173, a second reflecting sheet 5176, a third reflecting sheet 5175 and a third filter sheet 5174. The functions and mutual positional relationships of the above-mentioned devices have been described in the foregoing, and thus will not be described here again.

[0488] As shown in FIGS. 43, 44 and 45, in some embodiments, the receiving light assembly 517 can include a second lens 5179.

[0489] As shown in FIGS. 43, 44 and 45, in some embodiments, the receiving light assembly 517 can include a second lens 5181.

[0490] As shown in FIGS. 43, 44 and 45, in some embodiments, the receiving light assembly 517 can include a second lens 5183.

[0491] As shown in FIGS. 43, 44 and 45, in some embodiments, the receiving light assembly 517 can include a turning prism 5180. The turning prism 5180 can reflect the light signal converged by the second lens 5179 to the corresponding light receiving chip. For example, the turning prism 5180 can reflect the light signal converged by the second lens 5179 to the first light receiving chip 3132.

[0492] As shown in FIGS. 43, 44 and 45, in some embodiments, the receiving light assembly 517 can include a turning prism 5182. The turning prism 5182 can reflect the light signal converged by the second lens 5181 to the corresponding light receiving chip. For example, the turning prism 5182 can reflect the light signal converged by the second lens 5181 to the second light receiving chip 3131.

[0493] As shown in FIGS. 43, 44 and 45, in some embodiments, the receiving light assembly 517 can include a turning prism 5184. The turning prism 5184 can reflect the light signal converged by the second lens 5183 to the corresponding light receiving chip. For example, the turning prism 5184 can reflect the light signal converged by the second lens 5183 to the third light receiving chip 3121.

[0494] The turning prism 5180, the turning prism 5182 and the turning prism 5184 each have a reflecting surface which is obliquely arranged above the corresponding light receiving chip, so that the light signal is reflected to the corresponding light receiving chip by the reflecting surface.

[0495] As shown in FIGS. 43, 44 and 45, in some embodiments, the bottom plate 5161 can include a first support portion 51611. The first support portion 51611 can support the first lens 5171, the splitting assembly 5172, the first reflecting sheet 5173, the second reflecting sheet 5176, the third reflecting sheet 5175, the third filtering sheet 5174, the second lens 5179, the turning prism 5180, the second lens 5181, the turning prism 5182, the second lens 5183 and the turning prism 5184.

[0496] In some embodiments, the bottom plate 5161 can include a second support portion 51612. The second support portion 51612 can be located on one side of the first support portion 51611. The second support portion 51612 can support the first clamping portion 312. The height of the second support portion 51612 is lower than the height of the first support portion 51611, so that the height of the light receiving chip on the first clamping portion 312 is lower than the height of the turning prism 5184.

[0497] In some embodiments, the bottom plate 5161 can include a third support portion 51613. The third support portion 51613 can be located on the other side of the first support portion 51611. The third support portion 51613 can support the second clamping portion 313. The height of the third support portion 51613 is lower than the height of the first support portion 51611, so that the height of the light receiving chip on the second clamping portion 313 is lower than the height of the turning prism.

[0498] In some embodiments, one end of the turning prism 5180 is fixed to the first support portion 51611, and the other end is suspended on the third support portion 51613, so that the light signal reflected by the turning prism 5180 can be incident on the corresponding light receiving chip placed on the third support portion 51613.

[0499] In some embodiments, one end of the turning prism 5182 is fixed to the first support portion 51611, and the other end is suspended on the third support portion 51613, so that the light signal reflected by the turning prism 5182 can be incident on the corresponding light receiving chip placed on the third support portion 51613.

[0500] In some embodiments, one end of the turning prism 5184 is fixed to the first support portion 51611, and the other end is suspended on the second support portion 51612, so that the light signal reflected by the turning prism 5184 can be incident on the corresponding light receiving chip placed on the second support portion 51612.

[0501] As shown in FIGS. 43, 44 and 45, in some embodiments, a first abutting plate 51614 can be arranged on the first support portion 51611. The first abutting plate 51614 can be arranged along the length direction of the first housing 510. The substrate of the wave division assembly 5172 abuts the side surface of the first abutting plate 51614.

[0502] As shown in FIGS. 43, 44 and 45, in some embodiments, a second abutting plate 51615 can be arranged on the first support portion 51611. The inner surface of the second abutting plate 51615 is an abutting surface, which faces the second lens 5179. The second reflecting sheet 5176 abuts the abutting surface of the second abutting plate 51615.

[0503] As shown in FIGS. 43, 44 and 45, the first abutting surface 5132 can be disposed on the first support portion 51611.

[0504] As shown in FIGS. 43, 44 and 45, the second abutting surface and the fifth abutting surface for abutting the first reflective sheet 5173 are also located on the first support portion 51611.

[0505] The above is the description of different parts of two different light receiving components. The same parts have been described in the introduction of one light receiving component, and will not be repeated here.

[0506] FIG. 46 is a structural schematic diagram I of a light emitting component according to some embodiments. FIG. 47 is a structural schematic diagram II of a light emitting component according to some embodiments. FIG. 48 is an exploded schematic diagram of a light emitting component according to some embodiments. As shown in FIGS. 46, 47 and 48, in some embodiments, the light emitting component 400 can include a second cavity. The second cavity can be connected with one end of the first cavity.

[0507] In some embodiments, the second cavity can include a second cover plate 420.

[0508] In some embodiments, the second cavity can include a second housing 410. The second cover plate 420 can cover the second housing 410 to form the second cavity.

[0509] In some embodiments, the second housing 410 can include a bottom plate 411. The bottom plate 411 can be used to support devices.

[0510] In some embodiments, the second housing 410 can include a first side wall 412. The first side wall 412 can be located at one end of the second housing 410. The bottom of the first side wall 412 can be connected with the bottom plate 411.

[0511] In some embodiments, the second housing 410 can include a second side wall 413. The second side wall 413 can be located at the side of the first housing 510510. The bottom of the second side wall 413 can be connected with the bottom plate 411. One end of the second side wall 413 can be connected with one end of the second side wall 413.

[0512] In some embodiments, the second housing 410 can include a third side wall 414. The third side wall 414 can be located at the other end of the first housing 510510. The third side wall 414 can be close to the circuit board 300. The bottom of the third side wall 414 can be connected with the bottom plate 411. One end of the third side wall 414 can be connected with the other end of the second side wall 413.

[0513] In some embodiments, the second housing 410 can include a fourth side wall 415. The fourth side wall 415 can be located at the side of the first housing 510510. The fourth side wall 415 can be oppositely arranged with the second side wall 413. The bottom of the fourth side wall 415 can be connected with the bottom plate 411. One end of the fourth side wall 415 can be connected with the other end of the third side wall 414. The other end of the fourth side wall 415 can be connected with the other end of the first side wall 412.

[0514] The first side wall 412, the second side wall 413, the third side wall 414 and the fourth side wall 415 are sequentially connected and the bottom is respectively connected with the bottom plate 411 to form a second inner cavity. The top of the first side wall 412, the second side wall 413, the third side wall 414 and the fourth side wall 415 supports and connects the second cover plate 420. In some embodiments, the second housing 410 is a metal material integrally formed housing.

[0515] In some embodiments, the first side wall 412 can be provided with a sixth connecting hole 4121. The sixth connecting hole 4121 communicates with the second inner cavity, and the sixth connecting hole 4121 is used as a light outlet of the second cavity. The sixth connecting hole 4121 is connected with the first housing 510510, so that the second housing 410 communicates with the accommodating cavity 516 through the sixth connecting hole 4121. For example, the other end of the connecting seat 5101 is embedded to connect the sixth connecting hole 4121. In some embodiments, the outer side of the first side wall 412 is provided with a boss 4122, one end of the sixth connecting hole 4121 penetrates through the boss 4122, and the end of the connecting seat 5101 is embedded to connect the boss 4122.

[0516] In some embodiments, the third side wall 414 can be provided with two rows of pins, and each row of pins includes a plurality of pins 430. The pins 430 on the third side wall 414 are electrically connected with the circuit board 300 through the corresponding flexible circuit board.

[0517] In some embodiments, the fourth side wall 415 can be provided with two rows of parallel pins, and each row of pins includes a plurality of pins 430. The pins 430 on the fourth side wall 415 are electrically connected with the circuit board 300 through the corresponding flexible circuit board.

[0518] The third side wall 414 and the fourth side wall 415 are respectively provided with two rows of pins, and each row of pins includes a plurality of pins 430. For the convenience of description, the row of pins close to the bottom plate 411 on the third side wall 414 and the fourth side wall 415 is referred to as the bottom row of pins on the third side wall 414 and the fourth side wall 415. The pins 430 on the third side wall 414 and the pins 430 on the fourth side wall 415 are respectively electrically connected with the circuit board 300 through the corresponding flexible circuit board.

[0519] As shown in FIGS. 46, 47 and 48, in some embodiments, the second housing 410 can be provided with a first laser assembly 440. The first laser assembly 440 can be located at the side of a side wall of the second housing 410. The first laser assembly 440 can generate a fourth wavelength light signal.

[0520] As shown in FIGS. 46, 47 and 48, in some embodiments, the second housing 410 can be provided with a second laser assembly 450. The second laser assembly 450 can be located at the side of a side wall of the second housing 410. The second laser assembly 450 can generate a fifth wavelength light signal.

[0521] As shown in FIGS. 46, 47 and 48, in some embodiments, the second housing 410 can be provided with a third laser assembly 460. The third laser assembly 460 can be located at the side of a side wall of the second housing 410. The third laser assembly 460 can generate a sixth wavelength light signal.

[0522] In some embodiments, the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460 are located at the side of the third side wall 414, so that the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460 are arranged in a row.

[0523] In some embodiments, the first laser assembly 440 is located at the side of the second side wall 413 and the third side wall 414; the second laser assembly 450 and the third laser assembly 460 are located at the side of the fourth side wall 415, and the third laser assembly 460 is located at the side of the first side wall 412 away from the second laser assembly 450 and the third side wall 414, so that the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460 are distributed at the side of two connected side walls of the second housing 410, and are in a triangular distribution state instead of being arranged in a row, so as to reduce the packaging volume of the light emitting component 400.

[0524] In some embodiments, the third side wall 414 is arranged along the width direction of the second housing 410, and the fourth side wall is arranged along the length direction of the second housing 410, so that the first laser assembly 440 is arranged in the width direction in the second housing 410, so as to reduce the size of the second housing 410 in the width direction. The second laser assembly 450 and the third laser assembly 460 are arranged in the length direction in the second housing 410, which cooperates with the first laser assembly 440 arranged in the width direction in the second housing 410, so that sufficient laser assemblies can be arranged in the second housing 410, and the overall size of the second housing 410 can be reduced, and the size of the light emitting component 400 can be reduced.

[0525] In some embodiments, the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460 have different transmission rates. For example, the first laser assembly 440 has a transmission rate of 50G, the second laser assembly 450 has a transmission rate of 10G, and the third laser assembly 460 has a transmission rate of 2.5G.

[0526] In some embodiments, the second housing 410 can be provided with a combining assembly. The combining assembly can combine the fourth wavelength optical signal, the fifth wavelength optical signal and the sixth wavelength optical signal into one beam of emission optical signal.

[0527] In some embodiments, the combining assembly can be a wavelength division multiplexer. The wavelength division multiplexer has an entrance side facing the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460, and an exit side facing the sixth connecting hole 4121. The wavelength division multiplexer combines the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal emitted by the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460 into one beam of emission optical signal.

[0528] In some embodiments, the combining assembly includes a polarization assembly and a polarization combining assembly. The polarization assembly is used to adjust the polarization direction of the optical signal, and the polarization combining assembly combines multiple polarized light into one beam. The polarization direction of the optical signal is adjusted by the polarization assembly, and then the multiple polarized light is combined into one beam by the polarization combining assembly, so that the light emitting component realizes combining.

[0529] The two types of combining assemblies described above can be applied to the case where the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460 are arranged in a row.

[0530] In some embodiments, the combining assembly includes a plurality of optical filters. The plurality of optical filters cooperate with each other to combine the fourth wavelength optical signal, the fifth wavelength optical signal and the sixth wavelength optical signal into one beam of emission optical signal.

[0531] The combining assembly of the plurality of optical filters can not only be applied to the case where the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460 are arranged in a row, but also be applied to the case where the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460 are in a triangular distribution state.

[0532] In some embodiments, the wavelength combining assembly can include a second filter 416. The second filter 416 can be disposed at the side of the sixth connecting hole 4121. The second filter 416 is located on the output light path of the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460. The second filter 416 can be used for the transmission of the fourth wavelength optical signal and the fifth wavelength optical signal, and also for the reflection of the sixth wavelength optical signal.

[0533] In some embodiments, the wavelength combining assembly can include a third filter 417. The third filter 417 can be disposed at the side of the sixth connecting hole 4121. The third filter 417 can be located on the output light path of the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460. The third filter 417 can be disposed side by side with the second filter 416. The third filter 417 can be used for the transmission of the fourth wavelength optical signal and the reflection of the fifth wavelength optical signal.

[0534] The second filter 416 and the third filter 417 are both disposed at the side of the sixth connecting hole 4121 and are both located on the output light path of the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460. The second filter 416 and the third filter 417 are disposed side by side to change the transmission light path of the fourth wavelength optical signal, the fifth wavelength optical signal and the sixth wavelength optical signal, so that the fourth wavelength optical signal, the fifth wavelength optical signal and the sixth wavelength optical signal can pass through the sixth connecting hole 4121.

[0535] In some embodiments, the second filter 416 and the third filter 417 are disposed at the side of the connection between the first side wall 412 and the second side wall 413, so that the second filter 416, the third filter 417 and the first laser assembly 440 are compactly arranged, facilitating the control of the length direction size of the second housing 410.

[0536] In some embodiments, the second filter 416 is disposed at the intersection of the output light path of the first laser assembly 440 and the output light path of the third laser assembly 460, and the third filter 417 is disposed at the intersection of the output light path of the first laser assembly 440 and the output light path of the second laser assembly 450. The first laser assembly 440 is located on the transmission side of the third filter 417, the second laser assembly 450 is located on the reflection side of the third filter 417, and the third laser assembly 460 is located on the reflection side of the second filter 416. For example, the second filter 416 includes a first optical surface and a second optical surface, which are the main optical surfaces of the second filter 416; the third filter 417 includes a third optical surface and a fourth optical surface, which are the main optical surfaces of the third filter 417. The first optical surface faces the third laser assembly 460, the second optical surface faces the third filter 417, the third optical surface faces the second laser assembly 450, and the fourth optical surface faces the first laser assembly 440.

[0537] In some embodiments, a mounting bracket 470 can be disposed in the second housing 410. The mounting bracket 470 can be disposed on the side of the sixth connecting hole 4121 and fixed in the second housing 410. The mounting bracket 470 can support the connection of the second filter 416 and the third filter 417. The second filter 416 and the third filter 417 are fixed in the second housing 410 by the mounting bracket 470, which facilitates the fixation of the second filter 416 and the third filter 417 in the second housing 410.

[0538] In some embodiments, a lens 418 can be disposed in the second housing 410. The lens 418 can be disposed on the light path of the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 to the second filter 416 or the third filter 417. For example, a first lens 4181 is disposed on the transmission light path of the first laser assembly 440 to the third filter 417, which collimates the fourth wavelength optical signal; a second lens 4182 is disposed on the transmission light path of the second laser assembly 450 to the third filter 417, which collimates the fifth wavelength optical signal; and a third lens 4183 is disposed on the transmission light path of the third laser assembly 460 to the second filter 416, which collimates the sixth wavelength optical signal.

[0539] FIG. 49 is a partial structural schematic diagram I of a light emitting component according to some embodiments. FIG. 50 is a partial structural schematic diagram II of a light emitting component according to some embodiments. FIG. 51 is a cross-sectional view I of a light emitting component according to some embodiments of the present disclosure. As shown in FIG. 49, FIG. 50 and FIG. 51, in some embodiments, the first laser assembly 440 can include a first laser chip 442. The first laser chip 442 is integrated with an electro-absorption modulated laser and a semiconductor optical amplifier.

[0540] As shown in FIG. 49, FIG. 50 and FIG. 51, in some embodiments, the first laser assembly 440 can include a first substrate 441. The first laser chip 442 can be disposed on the first substrate 441.

[0541] In some embodiments, a ground layer 4410 can be disposed on the first substrate 441. The first laser chip 442 can be disposed on the ground layer 4410.

[0542] In some embodiments, a first high-frequency pad 4411 can be disposed on the first substrate 441. The first high-frequency pad 4411 can be located at a side of the first laser chip 442. The first high-frequency pad 4411 can be wire-bonded to the first laser chip 442.

[0543] In some embodiments, a first LD pad 4412 can be disposed on the first substrate 441. The first LD pad 4412 can be located at a side of the first laser chip 442. The first LD pad 4412 can be wire-bonded to the first laser chip 442.

[0544] In some embodiments, a first SOA pad 4413 can be disposed on the first substrate 441. The first SOA pad 4413 can be located at a side of the first laser chip 442. The first SOA pad 4413 can be wire-bonded to the first laser chip 442.

[0545] The first high-frequency pad 4411, the first LD pad 4412 and the first SOA pad 4413 are located at the side of the first laser chip 442, and the first high-frequency pad 4411, the first LD pad 4412 and the first SOA pad 4413 are wire-bonded to the first laser chip 442, respectively.

[0546] The first high-frequency pin 4301, the first SOA pin 4302 and the first LD pin 4303 are arranged on the third side wall 414 and embedded in the third side wall 414 with the end portions extending into the inner cavity of the second shell 410. The first high-frequency pin 4301, the first SOA pin 4302 and the first LD pin 4303 are insulated from the third side wall 414 by the insulating layer. The first high-frequency pin 4301 is located in the bottom row of pins on the third side wall 414.

[0547] The first high-frequency pin 4301 is electrically connected to the first high-frequency pad 4411. The first SOA pin 4302 is electrically connected to the first SOA pad 4413. The first LD pin 4303 is electrically connected to the first LD pad 4412. For example, one end of the first high-frequency pin 4301 is wire-bonded to the first high-frequency pad 4411. One end of the first SOA pin 4302 is wire-bonded to the first SOA pad 4413. One end of the first LD pin 4303 is wire-bonded to the first LD pad 4412.

[0548] In some embodiments, the height position of the first high-frequency pin 4301 on the third side wall 414 is lower than the height positions of the first SOA pin 4302 and the first LD pin 4303 on the third side wall 414, i.e., the first high-frequency pin 4301 is closer to the bottom plate 411. The first ground pin 4304 is also arranged on the third side wall 414 and located on the side of the first high-frequency pin 4301. The first ground pin 4304 is electrically connected to the third side wall 414.

[0549] In some embodiments, the first adapter plate 481 can be arranged in the second shell 410. The first adapter plate 481 can be provided with a circuit pattern to realize the electrical connection between the first high-frequency pin 4301 and the first laser assembly 440 through the first adapter plate 481. The first adapter plate 481 can be used to match the impedance of the first laser chip 442 to ensure the impedance continuity of the high-frequency transmission link.

[0550] In some embodiments, the front surface of the first adapter plate 481 can be provided with the first high-frequency transmission line 4811. One side of the first high-frequency transmission line 4811 can be provided with the first ground layer 4812. The other side of the first high-frequency transmission line 4811 can be provided with the second ground layer 4813. One end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pad 4411. The other end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pin 4301. For example, one end of the first high-frequency transmission line 4811 is wire-bonded to the first high-frequency pad 4411. The other end of the first high-frequency transmission line 4811 is soldered to the first high-frequency pin 4301. The ground layer 4110 is wire-bonded to the first ground layer 4812 and the second ground layer 4813.

[0551] In some embodiments, the back surface of the first adapter plate 481 can be provided with a layer, and the first layer 4812 and the second layer 4813 are respectively provided with through holes. The first layer 4812 and the second layer 4813 are respectively connected to the layer on the back surface of the first adapter plate 481 through the through holes.

[0552] FIG. 52 is a partial structural schematic diagram III of a light emitting component according to some embodiments. FIG. 53 is a cross-sectional view II of a light emitting component according to some embodiments. FIG. 54 is a cross-sectional view III of a light emitting component according to some embodiments. As shown in FIG. 52, FIG. 53 and FIG. 54, in some embodiments, the second laser assembly 450 can include a second laser chip 452. The second laser chip 452 is integrated with an electro-absorption modulated laser and a semiconductor optical amplifier.

[0553] As shown in FIG. 52, FIG. 53 and FIG. 54, in some embodiments, the second laser assembly 450 can include a second substrate 451. The second laser chip 452 is attached to the second substrate 451.

[0554] In some embodiments, the second substrate 451 can be provided with a layer 4510. The second laser chip 452 can be attached to the layer 4510.

[0555] In some embodiments, the second substrate 451 can be provided with a second high-frequency pad 4511. The second high-frequency pad 4511 can be located at the side of the second laser chip 452. The second high-frequency pad 4511 can be wire-bonded to the second laser chip 452.

[0556] In some embodiments, the second substrate 451 can be provided with a second LD pad 4512. The second LD pad 4512 can be located at the side of the second laser chip 452. The second LD pad 4512 can be wire-bonded to the second laser chip 452.

[0557] In some embodiments, the second substrate 451 can be provided with a second SOA pad 4513. The second SOA pad 4513 can be located at the side of the second laser chip 452. The second SOA pad 4513 can be wire-bonded to the second laser chip 452.

[0558] The second high-frequency pad 4511, the second LD pad 4512 and the second SOA pad 4513 are all located at the side of the second laser chip 452, and the second high-frequency pad 4511, the second LD pad 4512 and the second SOA pad 4513 are wire-bonded to the second laser chip 452, respectively.

[0559] The second high-frequency pin 4305 can be included in the pins 430, and is located in the bottom row of pins on the third side wall 414. The second high-frequency pin 4305 is electrically connected to the second high-frequency pad 4511. The second SOA pin 4306 is electrically connected to the second SOA pad 4513. The second LD pin 4307 is electrically connected to the second LD pad 4512.

[0560] In some embodiments, a second adapter plate 482 can be disposed in the second housing 410. A circuit board pattern can be disposed on the second adapter plate 482. The second adapter plate 482 is used to achieve electrical connection between the second high-frequency pin 4305 and the second laser assembly 450, and the second adapter plate 482 can also be used for impedance matching of the second laser chip 452 to ensure impedance continuity of the high-frequency transmission link.

[0561] In some embodiments, the second high-frequency pin 4305 is embeddedly connected to the third side wall 414, and is insulated from the third side wall 414 by an insulating layer. The second adapter plate 482 is disposed on the side of the third side wall 414. The second SOA pin 4306 and the second LD pin 4307 are embeddedly connected to the fourth side wall 415 and are insulated from the fourth side wall 415 by an insulating layer, respectively. The second SOA pin 4306 is wire-bonded to the second SOA pad 4513. The second LD pin 4307 is wire-bonded to the second LD pad 4512. A second ground pin 4308 is also disposed on the third side wall 414, and is located on the side of the second high-frequency pin 4305. The second ground pin 4308 is electrically connected to the third side wall 414. For example, the second ground pin 4308 is located on the side of the second high-frequency pin 4305 close to the first high-frequency pin 4301. The second adapter plate 482 and the first adapter plate 481 are located on the same side of the second housing 410, which facilitates assembly of the second adapter plate 482 and facilitates improvement of the assembly density of devices in the second housing 410, thereby helping to reduce the size of the second housing 410.

[0562] In some embodiments, the front surface of the second adapter plate 482 is provided with a second high-frequency transmission line 4821. One side of the second high-frequency transmission line 4821 is provided with a third ground layer 4822. The other side of the second high-frequency transmission line 4821 is provided with a fourth ground layer 4823. One end of the second high-frequency transmission line 4821 is used to electrically connect the second high-frequency pad 4511. The other end of the second high-frequency transmission line 4821 is used to electrically connect the second high-frequency pin 4305. For example, one end of the second high-frequency transmission line 4821 is wire-bonded to the second high-frequency pad 4511. The other end of the second high-frequency transmission line 4821 is soldered to the second high-frequency pin 4305. The ground layer 4510 is electrically connected to the third ground layer 4822 and the fourth ground layer 4823.

[0563] In some embodiments, the back surface of the second adapter plate 482 is provided with a ground layer, and the third ground layer 4822 and the fourth ground layer 4823 are respectively provided with vias, and the third ground layer 4822 and the fourth ground layer 4823 are respectively connected to the ground layer on the back surface of the second adapter plate 482 through the vias. In some embodiments, the second housing 410 is further provided with a third adapter plate 483, and the third adapter plate 483 is provided with a circuit pattern, and the third adapter plate 483 is arranged between the second laser assembly 450 and the second adapter plate 482, and the side edges of the third adapter plate 483 are close to the first laser assembly 440. The third adapter plate 483 is used to realize the electrical connection between the second laser assembly 450 and the second adapter plate 482, and the third adapter plate 483 can also be used for impedance matching the second laser chip 452 to ensure the impedance continuity of the high-frequency transmission link. The third adapter plate 483 helps to reduce the wire length between the second laser assembly 450 and the second adapter plate 482, so as to reduce the parasitic inductance and ensure the high-frequency signal transmission quality.

[0564] In some embodiments, the front surface of the third adapter plate 483 is provided with a third high-frequency transmission line 4831, one side of the third high-frequency transmission line 4831 is provided with a fifth ground layer 4832, and the other side of the third high-frequency transmission line 4831 is provided with a sixth ground layer 4833. One end of the third high-frequency transmission line 4831 is used for electrical connection with the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is used for electrical connection with the second high-frequency transmission line 4821. For example, one end of the second high-frequency transmission line 4821 is wire-bonded to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is wire-bonded to one end of the second high-frequency transmission line 4821; the fifth ground layer 4832 is wire-bonded to the third ground layer 4822, the sixth ground layer 4833 is wire-bonded to the fourth ground layer 4823, and the fifth ground layer 4832 and the sixth ground layer 4833 are respectively wire-bonded to the ground layer 4510.

[0565] In some embodiments, the front surface of the third adapter plate 483 is further provided with a third LD pad 4834 and a third SOA pad 4835, the third LD pad 4834 and the third SOA pad 4835 are close to the first laser assembly 440. The first LD pad 4412 and the first LD pin 4303 are electrically connected to the third LD pad 4834 respectively, and the first SOA pad 4413 and the first SOA pin 4302 are electrically connected to the third SOA pad 4835 respectively, so as to electrically connect the first laser assembly 440, the first LD pin 4303 and the first SOA pin 4302 through the third adapter plate 483, facilitate the control of the wire bonding arc height, and then facilitate the wire bonding. In some embodiments, a capacitor is respectively attached on the third LD pad 4834 and the third SOA pad 4835, the first LD pad 4412 and the first LD pin 4303 are respectively connected to the capacitor arranged on the third LD pad 4834, and the first SOA pad 4413 and the first SOA pin 4302 are respectively connected to the capacitor arranged on the third SOA pad 4835. The third adapter plate 483 is arranged at the side edge of the connection between the third side wall 414 and the fourth side wall 415, so that the third adapter plate 483 can serve both the first laser assembly 440 and the second laser assembly 450, and facilitate the coordination of the space in the second shell 410.

[0566] In some embodiments, the third laser assembly 460 can include a third laser chip 462.

[0567] In some embodiments, the third laser assembly 460 can include a third substrate 461. A negative pad 4611 can be arranged on the third substrate. The third laser chip 462 is attached and arranged on the negative pad 4611.

[0568] In some embodiments, a positive pad 4612 can be arranged on the third substrate. The third laser chip 462 is wire-bonded to the positive pad 4612.

[0569] The pin 430 can include a third LD pin 4309 and a fourth LD pin 4310, the third LD pin 4309 is wire-bonded to the positive pad 4612, and the fourth LD pin 4310 is wire-bonded to the negative pad 4611. Illustratively, the third LD pin 4309 and the fourth LD pin 4310 are embedded and arranged on the fourth side wall 415, and the ends thereof respectively extend into the inner cavity of the second shell 410 and are insulated from the fourth side wall 415 by an insulating layer.

[0570] In some embodiments, the third laser assembly 460 can include a back-illuminated detector 463, the back-illuminated detector 463 is arranged on the third substrate 461 and located at the back-illumination side of the third laser chip 462. The back-illuminated detector 463 is used to receive the back-illumination of the third laser chip 462 to monitor the sixth wavelength optical signal.

[0571] The pins 430 can include an MPD pin 4311 which is wire-bonded to the back light detector 463. For example, the MPD pin 4311 is embedded on the fourth side wall 415, and the end of the MPD pin 4311 extends into the inner cavity of the second housing 410, and the MPD pin 4311 is insulated from the fourth side wall 415 by an insulating layer.

[0572] In some embodiments, a Thermo Electric Cooler (TEC) 490 can be disposed in the second housing 410. The bottom of the TEC 490 is connected to the bottom plate 411, and the top of the TEC 490 supports the first laser assembly 440, the second laser assembly 450, the third laser assembly 460, and the like.

[0573] The side of the TEC 490 includes a first TEC pad 491 and a second TEC pad 492 which are located on the side of the second side wall 413. The pins 430 further include a first TEC pin 4312 and a second TEC pin 4313 which are electrically connected to the first TEC pad 491 and the second TEC pad 492, respectively. For example, the first TEC pin 4312 and the second TEC pin 4313 are embedded on the third side wall 414, and the ends thereof extend into the inner cavity of the second housing 410 and are insulated from the third side wall 414 by an insulating layer, respectively.

[0574] In some embodiments, a support plate 419 can be disposed in the second housing 410, and the support plate 419 is disposed on the top of the TEC 490. The bottom of the support plate 419 is connected to the top of the TEC 490, and the top of the support plate 419 supports the first laser assembly 440, the second laser assembly 450, the third laser assembly 460, and the like. In some embodiments, the support plate 419 is electrically connected to the ground layer on the front of the third adapter plate 483.

[0575] In some embodiments, a fourth adapter plate 484 can be arranged in the second housing 410. The fourth adapter plate 484 is arranged on the support plate 419, and a circuit pattern is arranged on the fourth adapter plate 484, which is used to connect the TEC pads and the TEC pins. For example, the fourth adapter plate 484 includes a fourth substrate 4841, and a first metal layer 4842 and a second metal layer 4843 are arranged on the fourth substrate 4841 and extend along the length direction of the fourth substrate 4841, respectively. The fourth adapter plate 484 is arranged at the side of the second side wall 413 and at the side of the first laser assembly 440; one end of the first metal layer 4842 is wire-connected to the first TEC pad 491, and the other end of the first metal layer 4842 is wire-connected to the first TEC pin 4312; one end of the second metal layer 4843 is wire-connected to the second TEC pad 492, and the other end of the second metal layer 4843 is wire-connected to the second TEC pin 4313.

[0576] In some embodiments, a temperature sensor 4836 can be arranged on the third adapter plate 483. For example, the temperature sensor 4836 is a thermistor.

[0577] The pins 430 can include an RTH pin 4314, which is embedded in the third side wall 414, one end of the RTH pin 4314 extends into the inner cavity of the second housing 410, and the RTH pin 4314 is insulated from the third side wall 414 by an insulating layer; one end of the RTH pin 4314 is electrically connected to the temperature sensor 4836.

[0578] In some embodiments, an adapter pad 4837 can be arranged on the third adapter plate 483. The adapter pad 4837 is arranged at the side of the temperature sensor 4836, and the adapter pad 4837 is wire-connected to the temperature sensor 4836 and the RTH pin 4314, respectively. The adapter pad 4837 realizes the adapter of the temperature sensor 4836 and the RTH pin 4314, so as to reduce the heat transmission from the temperature sensor 4836 to the RTH pin 4314 through the wire connection, which causes the temperature sensor 4836 to inaccurately detect the temperature in the second cavity.

[0579] In some embodiments, the inner side of the third side wall 414 can include a first side surface 4141. The inner side of the third side wall 414 can include a second side surface 4142. The inner side of the third side wall 414 can include a first step surface 4143. The inner side of the third side wall 414 can include a second step surface 4144. The first side surface 4141 is connected to the first step surface 4143, one end of the second step surface 4144 is connected to the first side surface 4141, the other end of the second step surface 4144 is connected to the second side surface 4142, and the first step surface 4143 is closer to the bottom plate 411 than the second step surface 4144, i.e., the height position of the first step surface 4143 in the second shell 410 is lower than the height position of the second step surface 4144 in the second shell 410.

[0580] The first step surface 4143 supports the connection of the first adapter plate 481 and the second adapter plate 482. One end of the first high-frequency pin 4301 and one end of the second high-frequency pin 4305 pass through the first side surface 4141, one end of the first high-frequency pin 4301 extends above the first adapter plate 481, and one end of the second high-frequency pin 4305 extends to the second adapter plate 482. One end of the RTH pin 4314 passes through the first side surface 4141, one end of the first SOA pin 4302, one end of the first LD pin 4303, one end of the first TEC pin 4312, and one end of the second TEC pin 4313 pass through the second side surface 4142. The second ground pin 4308 is located between the first high-frequency pin 4301 and the second high-frequency pin 4305, and the first ground pin 4304 is located on the side of the first high-frequency pin 4301 away from the second high-frequency pin 4305.

[0581] In some embodiments, the pins passing through the first side surface 4141 form a first row of pins 430a, and the pins passing through the second side surface 4142 form a second row of pins 430b, i.e., the pins arranged on the third side wall 414 are arranged in two rows. The pins in the first row of pins 430a are staggered with the pins in the second row of pins 430b, which facilitates pin wire bonding and flexible circuit board adaptation, and reduces the risk of air leakage due to deformation of the insulating layer used to fix the pins.

[0582] In some embodiments, the MPD pin 4311 and the second SOA pin 4306 are located in one row, and the second LD pin 4307, the third LD pin 4309, and the fourth LD pin 4310 are located in one row.

[0583] In some embodiments, the sixth connecting hole 4121 is a stepped through hole that gradually decreases in size from one side of the boss 4122 to the inside of the second shell 410. A sealing window 4123 is arranged in the sixth connecting hole 4121 at the boss 4122, and the sealing window 4123 seals the sixth connecting hole 4121.

[0584] Figure 55 is a diagram of a transmission optical path of a light emission signal according to some embodiments of the present disclosure. As shown in Figure 55, the fourth wavelength light signal generated by the first laser assembly 440 is transmitted to the first lens 4181, collimated by the first lens 4181, transmitted to the third filter 417, transmitted to the second filter 416 through the third filter 417, transmitted to the sixth connecting hole 4121 through the second filter 416; the fifth wavelength light signal generated by the second laser assembly 450 is transmitted to the second lens 4182, collimated by the second lens 4182, transmitted to the third filter 417, reflected by the third filter 417, transmitted to the second filter 416, transmitted to the sixth connecting hole 4121 through the second filter 416; the sixth wavelength light signal generated by the third laser assembly 460 is transmitted to the third lens 4183, collimated by the third lens 4183, transmitted to the second filter 416, reflected by the second filter 416, transmitted to the sixth connecting hole 4121. The second filter 416 and the third filter 417 make the fourth wavelength light signal, the fifth wavelength light signal and the sixth wavelength light signal in the same optical path when outputting from the second housing 410.

[0585] Figure 56 is a diagram of a structure of a mounting bracket according to some embodiments of the present disclosure. Figure 57 is a diagram of a structure of a mounting bracket according to some embodiments of the present disclosure. Figure 58 is a diagram of a use state of a mounting bracket according to some embodiments of the present disclosure. As shown in Figures 56, 57 and 58, in some embodiments, the mounting bracket 470 includes a bracket body 471. The side of the bracket body 471 can be provided with a first support body 472 and a second support body 473. The bottom of the bracket body 471 is used to connect the support plate 419; one end of the first support body 472 is connected to the bracket body 471, and the other end of the first support body 472 extends away from the bracket body 471; one end of the second support body 473 is connected to the bracket body 471, and the other end of the second support body 473 extends away from the bracket body 471; a gap 474 is formed between the first support body 472 and the second support body 473. The gap 474 is used to transmit the fourth wavelength light signal and the sixth wavelength light signal.

[0586] In some embodiments, one side of the first support body 472 can be provided with a first support surface 4721, the other side of the first support body 472 can be provided with a second support surface 4722, one side of the second support body 473 can be provided with a third support surface 4731, the other side of the second support body 473 can be provided with a fourth support surface 4732; the first support surface 4721 and the third support surface 4731 are inclined at a first preset angle, and the second support surface 4722 and the fourth support surface 4732 are inclined at a second preset angle. The first support surface 4721 and the third support surface 4731 support the connection of the second filter 416, and the second support surface 4722 and the fourth support surface 4732 support the connection of the third filter 417, facilitating the fixation of the second filter 416 and the third filter 417.

[0587] In some embodiments, the bracket body 471 can be provided with a first limiting surface 4711 and a second limiting surface 4712, which are respectively located at the side edges of the bracket body 471. The first limiting surface 4711 is located at one end of the first support surface 4721, and the second limiting surface 4712 is located at one end of the second support surface 4722. For example, one end of the first limiting surface 4711 and one end of the second limiting surface 4712 respectively extend to the top of the bracket body 471, and the other end of the first limiting surface 4711 and the other end of the second limiting surface 4712 respectively extend to the bottom of the bracket body 471. The first limiting surface 4711 limits the connection of the second filter 416, and the second limiting surface 4712 limits the connection of the third filter 417, and the first limiting surface 4711 and the second limiting surface 4712 facilitate the accurate assembly of the second filter 416 and the third filter 417.

[0588] FIG. 59 is a structural diagram of another light emitting component according to some embodiments. FIG. 60 is an assembly diagram of another light transceiver component and a fiber adapter according to some embodiments. As shown in FIGS. 59 and 60, in some embodiments, the light emitting component 400 can include a second cavity. The second cavity can be connected with the light receiving component 500, so that the emitted light signal of the light emitting component 400 can be incident to the light receiving component 500.

[0589] As shown in FIGS. 59 and 60, in some embodiments, the light emitting component 400 can include at least one light emitting assembly. The at least one light emitting assembly can be connected with the second cavity, so that the light emitting component 400 can emit at least one wavelength light signal.

[0590] As shown in FIGS. 59 and 60, in some embodiments, the at least one light emitting assembly can include a first light emitting assembly 402. The first light emitting assembly 402 can emit a fourth wavelength light signal.

[0591] As shown in FIGS. 59 and 60, in some embodiments, the at least one light emitting component can include a second light emitting component 401. The second light emitting component can emit a fifth wavelength light signal.

[0592] As shown in FIGS. 59 and 60, in some embodiments, the at least one light emitting component can include a third light emitting component 403. The third light emitting component 403 can emit a sixth wavelength light signal.

[0593] The at least one light emitting component includes the first light emitting component 402, the second light emitting component 401 and the third light emitting component 403, so that the light emitting part 400 can emit three wavelengths of light signals with different rates.

[0594] In some embodiments, the first light emitting component 402, the second light emitting component 401 and the third light emitting component 403 can adopt a coaxial package. For example, the emission axes of the first light emitting component 402, the second light emitting component 401 and the third light emitting component 403 are parallel to each other. That is, the first light emitting component 402, the second light emitting component 401 and the third light emitting component 403 each include an emission tube cap and an emission tube base, the emission tube cap is covered on the emission tube base to form an emission cavity, and a laser chip is arranged in the emission cavity to emit a light signal.

[0595] The emission tube base is also provided with an emission tube pin, one end of the emission tube pin is connected with the circuit board 300 through a flexible circuit board 900 to realize the electrical connection between the emission tube pin and the circuit board 300. The emission tube pin extends upward from the bottom of the emission tube base until it exceeds the top of the emission tube base and is wire-bonded with a pad where the laser chip is located to realize the electrical connection between the emission tube pin and the laser chip, and then the electrical signal on the circuit board 300 is transmitted to the laser chip through the emission tube pin.

[0596] In some embodiments, the first light emitting component 402, the second light emitting component 401 and the third light emitting component 403 are respectively located at different side walls of the light emitting part 400 to reduce the size of the light emitting part 400. For example, the first light emitting component 402 is located at the third side wall of the light emitting part 400, the second light emitting component 401 is located at the second side wall of the light emitting part 400, and the third light emitting component 403 is located at the fourth side wall of the light emitting part 400.

[0597] FIG. 61 is an exploded view I of another light emitting component, according to some embodiments. FIG. 62 is an exploded view II of another light emitting component, according to some embodiments. As shown in FIG. 61 and FIG. 62, in some embodiments, the second cavity can include a sixth connecting hole 4121. The sixth connecting hole 4121 can traverse a sidewall of the second cavity near the light receiving component 500, so that the optical signal within the second cavity can be transmitted to the light receiving component 500 through the sixth connecting hole 4121.

[0598] In some embodiments, the second cavity can include a seventh connecting hole 4131. The seventh connecting hole 4131 can be used for insertion of one of the at least one light emitting assembly, so that the one of the at least one light emitting assembly is connected with the second cavity. For example, the seventh connecting hole 4131 can be used for insertion of the second light emitting assembly 401, so that the second light emitting assembly 401 is connected with the second cavity.

[0599] In some embodiments, the second cavity can include an eighth connecting hole 4145. The eighth connecting hole 4145 can be used for insertion of another of the at least one light emitting assembly, so that the another of the at least one light emitting assembly is connected with the second cavity. For example, the eighth connecting hole 4145 can be used for insertion of the first light emitting assembly 402, so that the first light emitting assembly 402 is connected with the second cavity.

[0600] In some embodiments, the second cavity can include a ninth connecting hole 4151. The ninth connecting hole 4151 can be used for insertion of a further one of the at least one light emitting assembly, so that the further one of the at least one light emitting assembly is connected with the second cavity. For example, the ninth connecting hole 4151 can be used for insertion of the third light emitting assembly 403, so that the third light emitting assembly 403 is connected with the second cavity.

[0601] The seventh connecting hole 4131, the eighth connecting hole 4145 and the ninth connecting hole 4151 are located at different sidewalls of the second cavity respectively, so as to reduce the size of the second cavity. For example, the seventh connecting hole 4131 is located at the second sidewall of the second cavity, the eighth connecting hole 4145 is located at the third sidewall of the second cavity, and the ninth connecting hole 4151 is located at the fourth sidewall of the second cavity.

[0602] As shown in FIG. 61 and FIG. 62, in some embodiments, the second cavity can include a second cover plate 420.

[0603] As shown in FIGS. 61 and 62, in some embodiments, the second cavity can include a second housing 410. A second cover plate 420 can be coupled to the second housing 410 to form the second cavity. The emission light assembly 404 can be disposed in the second cavity. The emission light assembly 404 can be located on an output light path of at least one of the light emission assemblies, such that at least one light signal emitted by at least one of the light emission assemblies can be transmitted out of the emission light assembly 404.

[0604] FIG. 63 is an exploded view of an emission light assembly, according to some embodiments. FIG. 64 is a cross-sectional view of an emission light assembly, according to some embodiments. FIG. 65 is a light path diagram of an emission light assembly, according to some embodiments. As shown in FIGS. 63, 64, and 65, in some embodiments, the emission light assembly 404 can include a first reflective transmission sheet 4043.

[0605] The first reflective transmission sheet 4043 can allow transmission of one wavelength of light signals. The first reflective transmission sheet 4043 can be located on an output light path of one of the light emission assemblies, such that one wavelength of light signals emitted by the one of the light emission assemblies can be transmitted out of the emission light assembly 404. For example, the first reflective transmission sheet 4043 can be located on an output light path of the first light emission assembly 402, such that fourth wavelength of light signals emitted by the first light emission assembly 402 can be transmitted out of the emission light assembly 404 via the first reflective transmission sheet 4043.

[0606] The first reflective transmission sheet 4043 can allow reflection of another wavelength of light signals. The first reflective transmission sheet 4043 can be located on an output light path of another one of the light emission assemblies, such that another wavelength of light signals emitted by the another one of the light emission assemblies can be reflected out of the emission light assembly 404. For example, the first reflective transmission sheet 4043 can be located on an output light path of the second light emission assembly 401, such that fifth wavelength of light signals emitted by the second light emission assembly 401 can be reflected out of the emission light assembly 404 via the first reflective transmission sheet 4043.

[0607] As shown in FIGS. 63, 64, and 65, in some embodiments, the emission light assembly 404 can include a second reflective transmission sheet 4042.

[0608] The second reflective transmission sheet 4042 can allow transmission of one wavelength of light signals. The second reflective transmission sheet 4042 can be located on a transmission light path of the first reflective transmission sheet 4043, such that one wavelength of light signals transmitted by the first reflective transmission sheet 4043 can be transmitted out of the emission light assembly 404 via the first reflective transmission sheet 4043.

[0609] The second reflective transmission sheet 4042 can allow another wavelength optical signal to be transmitted. The second reflective transmission sheet 4042 can be located on the reflected light path of the first reflective transmission sheet 4043, so that another wavelength optical signal reflected by the first reflective transmission sheet 4043 is transmitted out of the second reflective transmission sheet 4042.

[0610] The second reflective transmission sheet 4042 can allow another wavelength optical signal to be reflected. The second reflective transmission sheet 4042 can be located on the output light path of another light emitting component in the at least one light emitting component, so that another wavelength optical signal emitted by another light emitting component in the at least one light emitting component is reflected out of the second reflective transmission sheet 4042. For example, the second reflective transmission sheet 4042 can be located on the output light path of the third light emitting component 403, so that the sixth wavelength optical signal emitted by the third light emitting component 403 is reflected out of the second reflective transmission sheet 4042.

[0611] The light path of the light emitting component 400 is introduced by taking the fourth wavelength optical signal emitted by the first light emitting component 402 as an example, the fifth wavelength optical signal emitted by the second light emitting component 401 is reflected by the first reflective transmission sheet 4043, and the sixth wavelength optical signal emitted by the third light emitting component 403 is reflected by the second reflective transmission sheet 4042. As shown in FIG. 50, the light path is as follows:

[0612] The fourth wavelength optical signal is emitted by the first light emitting component 402, and is transmitted by the first reflective transmission sheet 4043 and the second reflective transmission sheet 4042; the fifth wavelength optical signal is emitted by the second light emitting component 401, is reflected by the first reflective transmission sheet 4043, and is transmitted by the second reflective transmission sheet 4042 after being reflected; the sixth wavelength optical signal is emitted by the third light emitting component 403, and is emitted after being reflected by the second reflective transmission sheet 4042.

[0613] The coupling margin of the fourth wavelength optical signal relative to the fifth wavelength optical signal and the sixth wavelength optical signal is small, and the fourth wavelength optical signal emitted by the first light emitting component 402 is transmitted by the first reflective transmission sheet 4043 and the second reflective transmission sheet 4042 in turn, so as to improve the coupling efficiency.

[0614] As shown in FIGS. 62 and 65, in some embodiments, the second housing 410 can include a bottom plate 411. The bottom plate 411 can be used to support the device.

[0615] As shown in FIGS. 62 and 65, in some embodiments, the second housing 410 can include a first sidewall 412. The first sidewall 412 can be connected with the bottom plate 411 at a bottom thereof. The first sidewall 412 can be connected with the light receiving component 500. The first sidewall 412 can have a sixth connecting hole 4121. The sixth connecting hole 4121 can pass through the first sidewall 412. The sixth connecting hole 4121 can be in communication with the inner cavity of the second cavity, so that the emitted light signal emitted by the light emitting component 400 can be transmitted to the light receiving component 500 through the sixth connecting hole 4121.

[0616] As shown in FIGS. 62 and 65, in some embodiments, the second housing 410 can include a second sidewall 413. The second sidewall 413 can be connected with the bottom plate 411 at a bottom thereof. One end of the second sidewall 413 can be connected with one end of the first sidewall 412. The second sidewall 413 can have a seventh connecting hole 4131. The seventh connecting hole 4131 can pass through the second sidewall 413. The seventh connecting hole 4131 can be in communication with the inner cavity of the second cavity, so that the light signal emitted by the second light emitting component 401 placed in the seventh connecting hole 4131 can be incident to the inner cavity of the second cavity. For example, the fifth wavelength light signal emitted by the second light emitting component 401 is incident to the inner cavity of the second cavity.

[0617] In some embodiments, the seventh connecting hole 4131 can be directed towards one side of the first reflective transmission sheet 4043, so that the fifth wavelength light signal emitted by the second light emitting component 401 placed in the seventh connecting hole 4131 can be reflected out through the first reflective transmission sheet 4043.

[0618] As shown in FIGS. 62 and 65, in some embodiments, the second housing 410 can include a third sidewall 414. The third sidewall 414 can be connected with the bottom plate at a bottom thereof. One end of the third sidewall 414 can be connected with the other end of the second sidewall 413. The third sidewall 414 can be disposed opposite to the first sidewall 412. The third sidewall 414 can have an eighth connecting hole 4145. The eighth connecting hole 4145 can pass through the third sidewall 414. The eighth connecting hole 4145 can be in communication with the inner cavity of the second cavity, so that the light signal emitted by the light emitting component placed in the eighth connecting hole 4145 can be incident to the inner cavity of the second cavity. For example, the fourth wavelength light signal emitted by the first light emitting component is incident to the inner cavity of the second cavity.

[0619] In some embodiments, the eighth connecting hole 4145 can be directed towards the other side of the first reflective transmission sheet 4043, so that the fourth wavelength light signal emitted by the first light emitting component 402 placed in the eighth connecting hole 4145 can be incident to the first reflective transmission sheet 4043.

[0620] In some embodiments, one side of the first reflective-transmissive sheet 4043 is disposed opposite to the other side of the first reflective-transmissive sheet 4043, so that the fourth wavelength light signal incident to the first reflective-transmissive sheet 4043 can be transmitted out.

[0621] As shown in FIGS. 62 and 63, in some embodiments, the second housing 410 can include a fourth side wall 415. The bottom of the fourth side wall 415 can be connected with the bottom plate. One end of the fourth side wall 415 can be connected with the other end of the third side wall 414. The other end of the fourth side wall 415 can be connected with the other end of the first side wall 412. The fourth side wall 415 can be disposed opposite to the second side wall 413. The fourth side wall 415 can have a ninth connecting hole 4151. The ninth connecting hole 4151 can pass through the fourth side wall 415. The ninth connecting hole 4151 can be in communication with the inner cavity of the second cavity, so that the light signal emitted by the light emitting component placed in the ninth connecting hole 4151 can be incident to the inner cavity of the second cavity. For example, the sixth wavelength light signal emitted by the third light emitting component 403 is incident to the inner cavity of the second cavity.

[0622] In some embodiments, the ninth connecting hole 4151 can be towards one side of the second reflective-transmissive sheet 4042, so that the sixth wavelength light signal emitted by the third light emitting component 403 placed in the ninth connecting hole 4151 can be reflected out through the second reflective-transmissive sheet 4042.

[0623] In some embodiments, the first reflective-transmissive sheet 4043 can be towards the other side of the second reflective-transmissive sheet 4042, so that the fifth wavelength light signal reflected by the first reflective-transmissive sheet 4043 and the fourth wavelength light signal transmitted by the first reflective-transmissive sheet 4043 can be incident to the second reflective-transmissive sheet 4042.

[0624] In some embodiments, one side of the second reflective-transmissive sheet 4042 is disposed opposite to the other side of the second reflective-transmissive sheet 4042, so that the fourth wavelength light signal and the fifth wavelength light signal incident to the second reflective-transmissive sheet 4042 can be transmitted out.

[0625] The first side wall 412, the second side wall 413, the third side wall 414 and the fourth side wall 415 are sequentially connected and respectively connected with the bottom plate 411, to form the second housing 410 with an opening. The opening of the second housing 410 can be towards the lower housing 202.

[0626] As shown in FIGS. 62, 64 and 65, in some embodiments, the vertical distance between the second end of the first reflective-transmissive sheet 4043 and the second side wall 413 is less than the vertical distance between the first end of the first reflective-transmissive sheet 4043 and the second side wall 413, so that the first reflective-transmissive sheet 4043 is arranged obliquely to the second side wall 413, so that the second wavelength emitted by the second light emitting component 401 located on the second side wall 413 can be reflected out through the first reflective-transmissive sheet 4043. Wherein, the end of the first reflective-transmissive sheet 4043 away from the first light emitting component 402 is the first end of the first reflective-transmissive sheet 4043, and the end of the first reflective-transmissive sheet 4043 close to the first light emitting component 402 is the second end of the first reflective-transmissive sheet 4043.

[0627] In some embodiments, the oblique angle between the first reflective-transmissive sheet 4043 and the second side wall 413 is 45°, so that the second wavelength emitted by the second light emitting component 401 can be reflected out through the first reflective-transmissive sheet 4043 along the length direction of the second housing 410.

[0628] As shown in FIGS. 62, 64 and 65, in some embodiments, the vertical distance between the second end of the second reflective-transmissive sheet 4042 and the fourth side wall 415 is less than the vertical distance between the first end of the second reflective-transmissive sheet 4042 and the fourth side wall 415, so that the second reflective-transmissive sheet 4042 is arranged obliquely to the fourth side wall 415, so that the third wavelength emitted by the third light emitting component 403 located on the fourth side wall 415 can be reflected out through the second reflective-transmissive sheet 4042. Wherein, the end of the second reflective-transmissive sheet 4042 away from the first light emitting component 402 is the first end of the second reflective-transmissive sheet 4042, and the end of the second reflective-transmissive sheet 4042 close to the first light emitting component 402 is the second end of the second reflective-transmissive sheet 4042.

[0629] In some embodiments, the oblique angle between the second reflective-transmissive sheet 4042 and the fourth side wall 415 is 45°, so that the third wavelength emitted by the third light emitting component 403 can be reflected out through the second reflective-transmissive sheet 4042 along the length direction of the second housing 410.

[0630] The oblique angle between the second reflective-transmissive sheet 4042 and the fourth side wall 415 is 45°, and the oblique angle between the first reflective-transmissive sheet 4043 and the second side wall 413 is 45°, so that the included angle between the first reflective-transmissive sheet 4043 and the second reflective-transmissive sheet 4042 is a right angle, i.e. 90°.

[0631] As shown in FIGS. 63, 64 and 65, in some embodiments, the light emitting assembly 404 can include a fixing member 4041. The fixing member 4041 can include a first connecting surface 40414. The first connecting surface 40414 can be disposed adjacent to the second side wall 413. The first connecting surface 40414 can be disposed parallel to the second side wall 413, such that the fifth wavelength light signal emitted by the first light emitting assembly 401 is perpendicularly incident to the first connecting surface 40414.

[0632] In some embodiments, the first connecting surface 40414 can have a second light transmission hole 40413, such that the fifth wavelength light signal incident to the fixing member 4041 can be transmitted through the second light transmission hole 40413.

[0633] As shown in FIGS. 63, 64 and 65, in some embodiments, the fixing member 4041 can include a second connecting surface 40415. One end of the second connecting surface 40415 can be connected to one end of the first connecting surface 40414. The second connecting surface 40415 can be connected to the first reflective transmission sheet 4043. The second connecting surface 40415 can be disposed obliquely to the second side wall 413, such that the first reflective transmission sheet 4043 is disposed obliquely to the second side wall 413.

[0634] In some embodiments, the second connecting surface 40415 can have a third light transmission hole 40411, such that the fourth wavelength light signal transmitted through the first reflective transmission sheet 4043 is transmitted along the third light transmission hole 40411 after being incident to the fixing member 4041.

[0635] In some embodiments, the third light transmission hole 40411 can be in communication with the second light transmission hole 40413, such that the fifth wavelength light signal is sequentially incident to the first reflective transmission sheet 4043 through the second light transmission hole 40413 and the third light transmission hole 40411, and is reflected by the first reflective transmission sheet 4043.

[0636] As shown in FIGS. 63, 64 and 65, in some embodiments, the fixing member 4041 can include a third connecting surface 40416. One end of the third connecting surface 40416 can be connected to the other end of the second connecting surface 40415. The other end of the third connecting surface 40416 can be connected to the other end of the first connecting surface 40414. The third connecting surface 40416 can be connected to the second reflective transmission sheet 4042. The third connecting surface 40416 can be disposed obliquely to the fourth side wall 415, such that the second reflective transmission sheet 4042 is disposed obliquely to the fourth side wall 415.

[0637] In some embodiments, the second connection surface 40415 can have a fourth light transmission hole 40412, which can be in communication with the second light transmission hole 40413 and the third light transmission hole 40411, so that the fifth wavelength optical signal and the fourth wavelength optical signal transmitted through the third light transmission hole 40411 are transmitted out through the fourth light transmission hole 40412.

[0638] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for some technical features therein; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

An optical module comprises: an optical receiving component, a first end of which is connected with a fiber adapter, and a second end of which is connected with an optical transmitting component, the light emitting direction of the optical transmitting component being towards the fiber adapter; the optical receiving component comprises: a first housing; a first optical receiving assembly; a second optical receiving assembly, which is located on one side wall of the first housing; a third optical receiving assembly, which is located on another side wall of the first housing; a first reflecting sheet, which is located on the receiving light path of the first optical receiving assembly; a second reflecting sheet, which is located on the receiving light path of the second optical receiving assembly; a wave division assembly, a first end of which is arranged corresponding to the first end of the first housing, and a second end of which is arranged corresponding to the second end of the first housing; the emitted light signal of the optical transmitting component is emitted to the fiber adapter through the wave division assembly; the received light signal transmitted by the fiber adapter is incident to the wave division assembly, and after being reflected by the wave division assembly, the received light signal is divided into a first wavelength light signal, a second wavelength light signal and a third wavelength light signal and is emitted; the received light signal comprises the first wavelength light signal, the second wavelength light signal and the third wavelength light signal; the first wavelength light signal is incident to the first optical receiving assembly through the first reflecting sheet; the second wavelength light signal is incident to the second optical receiving assembly through the second reflecting sheet; the third wavelength light signal is incident to the third optical receiving assembly through the wave division assembly. The optical module according to claim 1, wherein the optical receiving component further comprises: an optical assembly comprising: a first filter, which is located between the optical transmitting component and the fiber adapter, so as to realize the transmission of the emitted light signal and the reflection of the received light signal; wherein the first reflecting sheet is located on the reflected light path of the first filter, and the second reflecting sheet is located on the reflected light path of the first reflecting sheet; a first end of the wave division assembly comprises an incident light and a first light exit, the incident light is located on the reflected light path of the second reflecting sheet, and the incident light and the first light exit are arranged adjacently; a second end of the wave division assembly comprises a second light exit and a third light exit, after the received light signal is incident to the wave division assembly through the incident light, the received light signal is divided into beams, the first wavelength light signal is transmitted through the first light exit, the second wavelength light signal is transmitted through the second light exit, and the third wavelength light signal is transmitted through the third light exit; the optical module further comprises: a third reflecting sheet, which is located on the emitted light path of the first light exit; the first optical receiving assembly is located on the reflected light path of the third reflecting sheet, and the first filter and the first reflecting sheet are located on the opposite directions of the reflected light path of the third reflecting sheet; a light splitting prism, which comprises a first reflecting surface and a second reflecting surface, the first reflecting surface is located on the emitted light path of the second light exit, the second optical receiving assembly is located on the reflected light path of the first reflecting surface, the second reflecting surface is located on the emitted light path of the third light exit, and the third optical receiving assembly is located on the reflected light path of the second reflecting surface. The optical module according to claim 2, wherein the first housing comprises: a first side wall, which is connected with the fiber adapter; a second side wall connected to one end of the first side wall; the second side wall is provided with the first light receiving component and the second light receiving component; a third side wall connected to the other end of the second side wall and connected to the light emitting component; a fourth side wall connected to the other end of the third side wall and connected to the other end of the first side wall; the fourth side wall is provided with the third light receiving component, the first filter and the first reflecting sheet, so that the first wavelength optical signal is reflected by the third reflecting sheet and then is emitted to the first light receiving component provided on the second side wall. The optical module according to claim 3, wherein The fourth side wall comprises: a first support part having a connecting hole; the third light receiving component is arranged in the connecting hole; a support piece connected to one side of the first support part and not connected to the other end of the second side wall, one side of the first side wall and the other side of the third side wall; one side of the support piece close to the second side wall is provided with the first filter, the support piece has a first light transmission hole corresponding to the first connecting hole of the first side wall and the second connecting hole of the third side wall, so that the emitted light signal is incident on the fiber optic adapter in sequence through the second connecting hole, the first light transmission hole, the first filter and the first connecting hole; a second support part connected to the other end of the support piece; the vertical distance between the second support part and the second side wall is greater than the vertical distance between the first support part and the second side wall; a third support part connected to the other end of the second support part and connected to the first side wall; the first reflecting sheet is arranged on the surface of the third support part facing the second side wall. The optical module according to claim 4, wherein The wave division component comprises a substrate, one side wall of the substrate close to the light entrance is abutted to the second side wall, and the vertical distance between the other side wall of the substrate away from the light entrance and the second side wall is less than the vertical distance between the first light transmission hole and the second side wall, so as to avoid the emitted light signal passing through the substrate. The optical module according to claim 2, wherein The inclination angle of the first filter is a first preset angle, the inclination angle of the first reflecting sheet is a second preset angle, and the inclination angle of the second reflecting sheet is a third preset angle; the first preset angle, the second preset angle and the third preset angle cooperate with each other, so that the received light signal is emitted in parallel along the length direction of the light receiving component. The optical module according to claim 2, wherein The wave division component comprises: a substrate, a first end of the substrate is arranged corresponding to a first end of the light receiving component, and a second end of the substrate is arranged corresponding to a second end of the light receiving component; the second end of the substrate has a first reflecting part allowing the received light signal to be reflected; the first end of the substrate has a light entrance allowing the received light signal to be transmitted and a second reflecting part allowing the third wavelength optical signal to be reflected; a first wave plate arranged between the light entrance and the second reflecting part to allow the first wavelength optical signal to be transmitted. A second wave plate is disposed adjacent to the first reflection surface to allow the second wavelength optical signal to be transmitted; A third wave plate is disposed adjacent to the second wave plate to allow the third wavelength optical signal to be transmitted. The optical module according to claim 2, wherein A first filter is disposed between the reflection surface of the third reflection plate and the first light emitting surface, or between the reflection surface of the third reflection plate and the first light receiving component, and is used to filter out the second wavelength optical signal and the third wavelength optical signal; A second filter is disposed between the first reflection surface and the second light emitting surface, or between the first reflection surface and the second light receiving component, The second filter is used to filter out the first wavelength optical signal and the third wavelength optical signal; A third filter is disposed between the second reflection surface and the third light emitting surface, or between the second reflection surface and the third light receiving component, and is used to filter out the first wavelength optical signal and the second wavelength optical signal. The optical module according to claim 2, wherein An isolator is disposed between the light emitting component and the first light component, and is used to block the return of the emitted optical signal along the original path, the emitted optical signal including a fourth wavelength optical signal, a fifth wavelength optical signal and a sixth wavelength optical signal; Alternatively, an isolator array is disposed inside the light emitting component, the isolator array including a first isolator, a second isolator and a third isolator, the first isolator being used to block the return of the fourth wavelength optical signal along the original path, the second isolator being used to block the return of the fifth wavelength optical signal along the original path, and the third isolator being used to block the return of the sixth wavelength optical signal along the original path. The optical module according to claim 1, wherein The light emitting component emits an emitted optical signal, which is incident to a light emitting end of a second end of the wave division component, and is emitted through a light receiving end of a first end of the wave division component. The first end of the wave division component has a first light emitting surface, and the second end of the wave division component has a second light emitting surface and a third light emitting surface, the first wavelength optical signal being incident to the second light receiving component after being emitted through the second light emitting surface, the third wavelength optical signal being incident to the first light receiving component after being emitted through the first light emitting surface, and the second wavelength optical signal being incident to the third light receiving component after being emitted through the third light emitting surface. The optical module according to claim 10, wherein The wave division component includes a substrate, a first end surface of the substrate being disposed corresponding to the first end of the light receiving component, and a second end surface of the substrate being disposed corresponding to the second end of the light receiving component, the first end surface of the substrate sequentially being provided with a first wave plate, a second wave plate and a third wave plate, the second end surface of the substrate sequentially being provided with a fourth wave plate, a fifth wave plate and a sixth wave plate, the first wave plate and the fourth wave plate being oppositely disposed, the second wave plate and the fifth wave plate being oppositely disposed, and the third wave plate and the sixth wave plate being oppositely disposed. The optical module according to claim 10, wherein ​ The emitted light signal emitted by the light emitting component is transmitted to the fiber adapter in sequence through the fourth wave plate and the first wave plate; the received light signal emitted by the fiber adapter is transmitted through the first wave plate, reflected by the fourth wave plate and the second wave plate, transmitted and reflected by the fifth wave plate, reflected by the fifth wave plate and then transmitted and reflected by the third wave plate, and finally transmitted through the sixth wave plate after being reflected by the third wave plate, so that the first wavelength light signal is emitted through the fifth wave plate, the third wavelength light signal is emitted through the third wave plate, and the second wavelength light signal is emitted through the sixth wave plate. The optical module according to claim 12, wherein The light receiving component further comprises a first reflecting sheet, a second reflecting sheet and a third reflecting sheet; The first reflecting sheet is located between the fifth wave plate and the second light receiving assembly, and faces the fifth wave plate and the second light receiving assembly, so that the first wavelength light signal is reflected to the second light receiving assembly; The second reflecting sheet is located between the third wave plate and the first light receiving assembly, and faces the third wave plate and the first light receiving assembly, so that the third wavelength light signal is reflected to the first light receiving assembly; The third reflecting sheet is located between the sixth wave plate and the third light receiving assembly, and faces the sixth wave plate and the third light receiving assembly, so that the second wavelength light signal is reflected to the third light receiving assembly; The light receiving component further comprises a first filter sheet, a second filter sheet and a third filter sheet, the first filter sheet is located on the reflected light path of the second reflecting sheet, the second filter sheet is located on the reflected light path of the first reflecting sheet, and the third filter sheet is located on the exit light path of the sixth wave plate; The first filter sheet is attached to the top of the first light receiving assembly, the second filter sheet is attached to the top of the second light receiving assembly, and the third filter sheet is connected with the third reflecting sheet. The optical module according to claim 13, wherein The first light receiving assembly, the second light receiving assembly and the third light receiving assembly each comprise a receiving cap and a receiving seat, the receiving cap is arranged on the receiving seat, and a light receiving chip is arranged on the receiving seat to receive a light signal; The receiving cap of the first light receiving assembly has a lens which protrudes from the receiving cap, a support is arranged on the receiving cap, the support has a first light passing hole, the first filter sheet is arranged on the support, and the first filter sheet blocks the first light passing hole, so that the light signal is filtered by the first filter sheet and then incident on the first light receiving assembly; The receiving cap of the second light receiving assembly has a lens which does not protrude from the receiving cap, and a second filter sheet is arranged on the receiving cap, the second filter sheet covers the second lens, so that the light signal is filtered by the second filter sheet and then incident on the second light receiving assembly. The optical module of claim 10, wherein, The first shell has a first bearing surface, a second bearing surface, a third bearing surface and a fourth bearing surface, the first bearing surface faces the third light receiving assembly, the second bearing surface faces the second light receiving assembly, the third bearing surface faces the first light receiving assembly, and the fourth bearing surface faces the second side wall; The wave division assembly bears on the fourth bearing surface, so that the wave division assembly is arranged along the length direction of the first shell; The first reflecting sheet bears on the second bearing surface, so that the received light signal emitted by the wave division assembly is reflected to the second light receiving assembly; the second reflecting sheet bears on the third bearing surface, so that the received light signal emitted by the wave division assembly is reflected to the first light receiving assembly; and the third reflecting sheet bears on the first bearing surface, so that the received light signal emitted by the wave division assembly is reflected to the third light receiving assembly. The optical module according to claim 15, characterized in that The first side wall has a first connecting hole connected with a fiber adapter; The first shell is provided with a first lens between the first connecting hole and the wave division assembly, so as to collimate or converge the light signal. The optical module according to claim 15, wherein The third side wall has a second connecting hole, the fourth side wall has a third connecting hole, the second side wall has a fourth connecting hole and a fifth connecting hole, the second connecting hole is connected with a light emitting part, the third connecting hole is connected with a third light receiving assembly, the fourth connecting hole is connected with a second light receiving assembly, and the fifth connecting hole is connected with a first light receiving assembly; The second side wall has a first step between the fourth connecting hole and the fifth connecting hole, so that the depth of the fourth connecting hole is smaller than the depth of the fifth connecting hole; The fourth side wall has a second step on one side of the third connecting hole, so as to enhance the strength of the first shell; The fourth connecting hole is closer to the second connecting hole than the fifth connecting hole, and the central axis of the fourth connecting hole is closer to the first connecting hole than the central axis of the third connecting hole. The optical module according to claim 17, wherein The fourth connecting hole includes a first sub-connecting hole and a second sub-connecting hole, one end of the second sub-connecting hole is connected with the first sub-connecting hole, the other end of the second sub-connecting hole is connected with the inner cavity of the first shell, the size of the second sub-connecting hole is smaller than the size of the first sub-connecting hole, and the first filter is located in the second sub-connecting hole; The fifth connecting hole includes a third sub-connecting hole and a fourth sub-connecting hole, one end of the fourth sub-connecting hole is connected with the third sub-connecting hole, the other end of the fourth sub-connecting hole is connected with the inner cavity of the first shell, the size of the fourth sub-connecting hole is smaller than the size of the third sub-connecting hole, and the second filter is located in the fourth sub-connecting hole.

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