Electronic device including a wing plate and method of manufacturing a wing plate

Abstract

The electronic device may include a display component including a first area, a second area, and a folding area between the first area and the second area; the first shell is used for supporting the first area; the second shell is used for supporting the second area; a hinge unit connecting the first housing to the second housing and operating between a folded state in which the first region and the second region face each other and an unfolded state in which the first region and the second region do not face each other; and a wing plate disposed between the hinge unit and the display assembly and supporting the display assembly. The wing plate may be formed by stacking a plurality of sheets.

Description

TECHNICAL FIELD

[0001] The disclosure relates to an electronic device including a wing plate and a manufacturing method of a wing plate. BACKGROUND

[0002] With the development of display-related technology, electronic devices including a flexible display have recently been developed. The flexible display can be used in a flat form, and can also be deformed into a specific shape for use. For example, an electronic device including a flexible display can be implemented in a foldable form that can be folded or unfolded with respect to at least one folding axis.

[0003] However, the foregoing is not to be interpreted in an effort to concede that the applicant has recognized the prior art of the description set forth in the disclosure, but should only be interpreted as the related art of the invention described herein. SUMMARY

[0004] According to an embodiment of the disclosure, an electronic device includes a display assembly including a first area, a second area, and a folding area between the first area and the second area; a first housing supporting the first area; a second housing supporting the second area; a hinge unit connecting the first housing and the second housing and operating between a folded state in which the first area and the second area face each other and an unfolded state in which the first area and the second area do not face each other; and a wing plate disposed between the hinge unit and the display assembly and supporting the display assembly. In an embodiment, the wing plate is formed by laminating a plurality of sheets.

[0005] In addition, according to an embodiment of the disclosure, a manufacturing method of a wing plate includes laminating a plurality of sheets; positioning the plurality of sheets in a mold and thermoforming the plurality of sheets; cutting the thermoformed plurality of sheets to form a wing plate; and washing the wing plate. BRIEF DESCRIPTION OF DRAWINGS

[0006] Figure 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment.

[0007] Figure 2a is a diagram illustrating an unfolded state of an electronic device according to an embodiment of the disclosure.

[0008] Figure 2b is a diagram illustrating a folded state of an electronic device according to an embodiment of the disclosure.

[0009] Figure 2c is a perspective view illustrating a fully unfolded state of an electronic device according to an embodiment of the disclosure.

[0010] Figure 2d is a perspective view illustrating an example of a partially unfolded intermediate state of an electronic device according to an embodiment of the disclosure.

[0011] Figure 3a This is an exploded perspective view of an electronic device according to an embodiment.

[0012] Figure 3b This is a plan view of a portion of an electronic device according to an embodiment.

[0013] Figure 3c This is a cross-sectional view of an electronic device according to an embodiment.

[0014] Figure 4a This is an exploded perspective view of multiple slices according to an embodiment.

[0015] Figure 4b This is a plan view of multiple pieces according to an embodiment.

[0016] Figure 5a This is a perspective view of the wing panel according to an embodiment.

[0017] Figure 5b This is a plan view of the wing plate according to an embodiment.

[0018] Figure 5c This is a rear view of the wing panel according to an embodiment.

[0019] Figure 6a This is a cross-sectional view of a portion of the wingplate according to an embodiment.

[0020] Figure 6b This is a cross-sectional view of a portion of the wingplate according to an embodiment.

[0021] Figure 6c This is a cross-sectional view of a portion of the wingplate according to an embodiment.

[0022] Figure 7 This is a cross-sectional view of a portion of the wingplate according to an embodiment.

[0023] Figure 8a This is a perspective view of the wing panel according to an embodiment.

[0024] Figure 8b This is a perspective view of the wing plate and connecting member according to an embodiment.

[0025] Figure 8c This is an exploded perspective view of the wing plate and connecting member according to an embodiment.

[0026] Figure 9 This is a flowchart of a method for manufacturing a wingplate according to an embodiment.

[0027] Figure 10 This is a flowchart of a method for manufacturing a wingplate according to an embodiment. Detailed Implementation

[0028] In the following description, examples will be given in detail with reference to the accompanying drawings. When describing examples with reference to the accompanying drawings, the same reference numerals denote the same parts, and repeated descriptions related to them will be omitted.

[0029] The electronic device according to the embodiments can be one of various types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0030] It should be understood that the embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. Regarding the description of the drawings, the same reference numerals may be used for similar or related parts. It will be understood that nouns in the singular form corresponding to terms may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “A, B, or C” may include any one of the items enumerated in the corresponding phrase of the plurality of phrases, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used only to distinguish the component from another component under discussion and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “attached to another element (e.g., a second element)”, it means that the first element can be directly (e.g., via a wire) connected to the second element, wirelessly connected to the second element, or connected to the second element via a third element.

[0031] As used in connection with various embodiments of this disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module may be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to embodiments, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0032] The embodiments described herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0033] According to embodiments, methods according to embodiments disclosed herein may be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM The computer program product may be published online (e.g., downloaded or uploaded), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If published online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0034] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities, and some of the multiple entities may be separately disposed in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0035] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to an embodiment.

[0036] Reference Figure 1 In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some examples, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some examples, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0037] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) connected to electronic device 101 and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0038] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor (ISP) or a communication processor (CP)) can be implemented as part of another component (e.g., a camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit (NPU)) can include hardware architecture dedicated to artificial intelligence (AI) model processing. AI models can be generated through machine learning. For example, such learning can be performed via an electronic device 101 that performs artificial intelligence, or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. Artificial neural networks may include, for example, deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), or deep Q-networks, or combinations of two or more thereof, but are not limited to these examples. Additionally or alternatively, the artificial intelligence model may include software structures in addition to hardware structures.

[0039] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0040] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0041] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0042] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to embodiments, the receiver and speaker can be implemented separately or as part of the speaker.

[0043] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display module 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to sense touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0044] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or can output sound via an external electronic device (e.g., electronic device 102) (e.g., a speaker or headphones) that is directly or wirelessly connected to the electronic device 101.

[0045] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and can generate electrical signals or data values ​​corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0046] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., via wire) or wirelessly to external electronic device (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0047] Connection 178 may include a connector, via which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0048] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0049] Camera module 180 can capture still images and moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor (ISP), or a flash.

[0050] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0051] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0052] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors (CPs) capable of operating independently of processor 120 (e.g., application processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the Subscriber Identity Module (SIM) 196.

[0053] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane delay (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0054] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element comprising conductive material or conductive patterns formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can then be transmitted or received between communication module 190 and the external electronic device via at least one selected antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0055] According to an embodiment, antenna module 197 can form a millimeter-wave antenna module. According to an embodiment, the millimeter-wave antenna module may include a printed circuit board (PCB), a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on a first surface (e.g., the bottom surface) of the PCB, or adjacent to the first surface and capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on a second surface (e.g., the top surface or a side surface) of the PCB, or adjacent to the second surface and capable of transmitting or receiving signals in the specified high-frequency band.

[0056] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0057] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of the external electronic devices 102 and 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some of the operations to be performed by electronic device 101 can be performed by one or more of the external electronic devices (e.g., external electronic devices 102 and 104 and server 108). For example, if electronic device 101 needs to automatically perform a function or service, or should perform a function or service in response to a request from a user or another device, electronic device 101 can request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 can request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. The one or more external electronic devices receiving the request may perform at least a portion of the function or service, or perform additional functions or services related to the request, and may transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In an embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0058] Figure 2a This is a diagram showing the unfolded state of an electronic device 200 according to an embodiment of the present disclosure. Figure 2b This is a diagram showing the folded state of the electronic device 200 according to an embodiment of the present disclosure. Figure 2c This is a perspective view showing the electronic device 200 in its fully deployed state according to an embodiment of the present disclosure. Figure 2d This is a perspective view showing an example of an intermediate state in which an electronic device 200 according to an embodiment of the present disclosure is partially unfolded.

[0059] Figures 2a to 2d The electronic device 200 is Figure 1Examples of electronic devices 101, which may be foldable or bendable electronic devices.

[0060] exist Figure 2c The following figures illustrate a spatial coordinate system defined by mutually orthogonal X-axis, Y-axis, and Z-axis. Here, the X-axis may represent the width direction of the electronic device, the Y-axis may represent the length direction of the electronic device, and the Z-axis may represent the height (or thickness) direction of the electronic device. In the following description, "first direction" may refer to a direction parallel to the Z-axis.

[0061] Reference Figure 2a and Figure 2b In embodiments, the electronic device 200 may include a foldable housing 201 and a flexible or foldable display 250 (hereinafter simply referred to as "display 250") in the space formed by the foldable housing 201 (e.g., Figure 1 Display module 160).

[0062] The surface on which the display 250 is disposed (or the surface on which the display 250 is viewed from the outside of the electronic device 200) can be defined as the front surface of the electronic device 200. Furthermore, the surface opposite the front surface can be defined as the rear surface of the electronic device 200. Additionally, the surface surrounding the space between the front and rear surfaces can be defined as the side surface of the electronic device 200.

[0063] According to an embodiment, the foldable housing 201 may include a first housing structure 210, a second housing structure 220 including a sensor region 222, a first rear cover 215, a second rear cover 225, and a hinge structure 230. Here, the hinge structure 230 may include a hinge cover covering the foldable portion of the foldable housing 201. The foldable housing 201 of the electronic device 200 is not limited to... Figure 2a and Figure 2b The shapes and combinations shown can be implemented in different shapes or different combinations of components. For example, in an embodiment, the first housing structure 210 and the first rear cover 215 can be integrally formed, and the second housing structure 220 and the second rear cover 225 can be integrally formed.

[0064] According to an embodiment, the first housing structure 210 can be connected to the hinge structure 230 and may include a first surface facing a first direction and a second surface facing a second direction opposite to the first direction. The second housing structure 220 can be connected to the hinge structure 230 and may include a third surface facing a third direction and a fourth surface facing a fourth direction opposite to the third direction. The second housing structure 220 can rotate relative to the first housing structure 210 based on the hinge structure 230. The state of the electronic device 200 can be changed to a folded state or an unfolded state.

[0065] According to an embodiment, in the fully folded state of the electronic device 200, the first surface may face the third surface, and in the fully unfolded state of the electronic device 200, the third direction may be the same as the first direction.

[0066] According to an embodiment, the first housing structure 210 and the second housing structure 220 are positioned on opposite sides of the folding axis A, and are generally symmetrical with respect to the folding axis A. As will be described below, the angle or distance between the first housing structure 210 and the second housing structure 220 may vary depending on whether the electronic device 200 is in an unfolded state, a folded state, or an intermediate state (e.g., a partially folded state or a partially unfolded state). According to an embodiment, unlike the first housing structure 210, the second housing structure 220 may additionally include a sensor region 222 in which various sensors are arranged; however, the first housing structure 210 and the second housing structure 220 may have mutually symmetrical shapes in areas other than the sensor region 222.

[0067] According to the embodiments, such as Figure 2a As shown, the first housing structure 210 and the second housing structure 220 can together form a recess for accommodating the display 250.

[0068] According to an embodiment, due to the sensor region 222, the recess can have at least two different widths in a direction perpendicular to the folding axis A. For example, the recess can have a first width W1 and a second width W2, the first width W1 being between a first portion 210a of the first housing structure 210 parallel to the folding axis A and a first portion 220a of the second housing structure 220 formed on the periphery of the sensor region 222, and the second width W2 being formed by a second portion 210b of the first housing structure 210 and a second portion 220b of the second housing structure 220 that does not correspond to the sensor region 222 and is parallel to the folding axis A. In this example, the second width W2 can be greater than the first width W1. In an embodiment, the first portion 220a and the second portion 220b of the second housing structure 220 can be at different distances from the folding axis A. The width of the recess is not limited to the example shown.

[0069] In embodiments, the recess may have multiple widths depending on the shape of the sensor region 222 or the asymmetrical portions of the first housing structure 210 and the second housing structure 220. In embodiments, the sensor region 222 may be formed having a predetermined region adjacent to a corner of the second housing structure 220. However, the arrangement, shape, and size of the sensor region 222 are not limited to the examples shown. For example, in embodiments, the sensor region 222 may be provided at another corner of the second housing structure 220 or in a predetermined region between an upper corner and a lower corner.

[0070] In an embodiment, components embedded in the electronic device 200 to perform various functions may be exposed on the front surface of the electronic device 200 via the sensor region 222 or by providing one or more openings in the sensor region 222. In an embodiment, the components may include various types of sensors. Sensors may include at least one of, for example, a front-facing camera, a receiver, or a proximity sensor. According to an embodiment, the sensor region 222 may not be included in the second housing structure 220, or it may be formed at a location different from that shown in the figure.

[0071] According to an embodiment, at least a portion of the first housing structure 210 and the second housing structure 220 may be formed of a metallic or non-metallic material having a selected rigidity to support the display 250. At least a portion of the first housing structure 210 and the second housing structure 220 formed of metallic material may provide a ground plane for the electronic device 200 and may be electrically connected to a grounding wire formed on a PCB in the foldable housing 201.

[0072] According to an embodiment, the first rear cover 215 may be on one side of the folding axis A on the rear surface of the electronic device 200, and may have a substantially rectangular periphery, for example, that can be surrounded by the first housing structure 210. Similarly, the second rear cover 225 may be on the other side of the folding axis A on the rear surface of the electronic device 200, and may have a periphery that can be surrounded by the second housing structure 220.

[0073] According to an embodiment, the first rear cover 215 may be substantially symmetrical with respect to the folding axis A to the second rear cover 225. However, the first rear cover 215 and the second rear cover 225 do not necessarily have mutually symmetrical shapes. For example, the electronic device 200 may include a first rear cover 215 and a second rear cover 225 of various shapes. In an embodiment, the first rear cover 215 may be integrally formed with the first housing structure 210, and the second rear cover 225 may be integrally formed with the second housing structure 220.

[0074] According to an embodiment, the first rear cover 215, the second rear cover 225, the first housing structure 210, and the second housing structure 220 can form spaces in which various components of the electronic device 200 (e.g., a printed circuit board (PCB) or a battery) will be housed. In an embodiment, one or more components may be disposed on or visually exposed on the rear surface of the electronic device 200. For example, at least a portion of the sub-display may be visually exposed through a first rear region 216 of the first rear cover 215. In an embodiment, one or more components or sensors may be visually exposed through a second rear region 226 of the second rear cover 225. In an embodiment, the sensor may include a proximity sensor and / or a rear camera.

[0075] According to embodiments, a front-facing camera exposed to the front surface of the electronic device 200 via one or more openings in sensor region 222, or a rear-facing camera exposed via a second rear region 226 of the second rear cover 225, may include one or more lenses, an image sensor, and / or an image sensor (ISP). A flash may include, for example, a light-emitting diode (LED) or a xenon lamp. In embodiments, two or more lenses (e.g., infrared (IR) cameras, wide-angle lenses, and telephoto lenses) and image sensors may be arranged on one surface of the electronic device 200.

[0076] Reference Figure 2b The hinge cover can be located between the first housing structure 210 and the second housing structure 220 to cover internal components (e.g., hinge structure 230). According to an embodiment, the hinge structure 230 can be covered by a portion of the first housing structure 210 and a portion of the second housing structure 220, or it can be exposed to the outside depending on the state of the electronic device 200 (e.g., unfolded state, intermediate state, or folded state).

[0077] For example, when electronic device 200 is in such a state Figure 2a In the unfolded state (e.g., fully unfolded state) shown, the hinge structure 230 can be covered by the first housing structure 210 and the second housing structure 220 and can be kept hidden. For example, when the electronic device 200 is in such a state... Figure 2b In the folded state shown (e.g., fully folded state), the hinge structure 230 may be exposed to the outside between the first housing structure 210 and the second housing structure 220. For another example, when the first housing structure 210 and the second housing structure 220 are in an intermediate state folded at a predetermined angle, at least a portion of the hinge structure 230 may be exposed to the outside between the first housing structure 210 and the second housing structure 220. In this case, the exposed area may be smaller than the area exposed in the fully folded state. In an embodiment, the hinge structure 230 may have a curved surface.

[0078] According to an embodiment, the display 250 may be disposed in the space formed by the foldable housing 201. For example, the display 250 may be housed in a recess formed by the foldable housing 201 and may be viewed from the outside through the front surface of the electronic device 200. For example, the display 250 may form a large portion of the front surface of the electronic device 200. Therefore, the front surface of the electronic device 200 may include the display 250 and a portion of the first housing structure 210 and a portion of the second housing structure 220 adjacent to the display 250. Additionally, the rear surface of the electronic device 200 may include a first rear cover 215, a portion of the first housing structure 210 adjacent to the first rear cover 215, a second rear cover 225, and a portion of the second housing structure 220 adjacent to the second rear cover 225.

[0079] In embodiments, display 250 may refer to a display in which at least one area is deformable into a planar or curved surface. According to embodiments, display 250 may include a folded region 253, and on one side of the folded region 253 (e.g., at...). Figure 2a The first region 251 (on the left side of the folded region 253 shown), and on the other side of the folded region 253 (e.g., on ...). Figure 2a The second region 252 (to the right of the folded region 253 shown).

[0080] However, as Figure 2a The area division of the display 250 shown is merely illustrative, and the display 250 can be divided into multiple areas (e.g., four or more areas or two areas) depending on its structure or function. For example, as Figure 2a As shown, the display 250 can be divided into multiple regions based on a folded region 253 extending parallel to the folding axis A. In another example, the display 250 can be divided into multiple regions based on another folding axis (e.g., a folding axis parallel to the width direction of the electronic device).

[0081] According to an embodiment, the display 250 may be coupled to or disposed adjacent to a touch panel, the touch panel including touch sensing circuitry and a pressure sensor for measuring the intensity (pressure) of the touch. For example, as an example of a touch panel, the display 250 may be coupled to or adjacent to a touch panel for detecting an electromagnetic resonant (EMR) type stylus.

[0082] According to an embodiment, the first region 251 and the second region 252 may have a globally symmetrical shape around the folded region 253. However, unlike the first region 251, the second region 252 may include a notch cut according to the presence of the sensor region 222, but may have a shape symmetrical to the first region 251 in other regions. For example, the first region 251 and the second region 252 may include portions with mutually symmetrical shapes and portions with mutually asymmetrical shapes.

[0083] According to an embodiment, the edge thickness of each of the first region 251 and the second region 252 may differ from the edge thickness of the folded region 253. The edge thickness of the folded region 253 may be less than the edge thickness of the first region 251 and the second region 252. For example, when viewed in cross-section, the first region 251 and the second region 252 may be asymmetrical in thickness. For example, the edge of the first region 251 may have a first radius of curvature, and the edge of the second region 252 may have a second radius of curvature different from the first radius of curvature. For another example, when viewed in cross-section, the first region 251 and the second region 252 may be symmetrical in thickness.

[0084] The following describes the operation of each area of ​​the display 250 and the first housing structure 210 and the second housing structure 220 according to the state of the electronic device 200 (e.g., folded state, unfolded state, or intermediate state).

[0085] According to an embodiment, when the electronic device 200 is in an unfolded state (e.g., Figure 2a When the first housing structure 210 and the second housing structure 220 are oriented in the same direction while forming a 180-degree angle, the surfaces of the first region 251 and the second region 252 of the display 250 can also face the same direction (e.g., the front direction of the electronic device) while forming a 180-degree angle. The folding region 253 can form a coplanar plane with the first region 251 and the second region 252.

[0086] According to an embodiment, when the electronic device 200 is in a folded state (e.g., Figure 2b When the first housing structure 210 and the second housing structure 220 are in use, they can face each other. The surfaces of the first region 251 and the second region 252 of the display 250 can face each other while forming a narrow angle (e.g., between 0 and 10 degrees). At least a portion of the folded region 253 can form a curved surface with a predetermined curvature.

[0087] According to an embodiment, when the electronic device 200 is in an intermediate state, the first housing structure 210 and the second housing structure 220 can form a predetermined angle therebetween. The surfaces of the first region 251 and the second region 252 of the display 250 can form an angle greater than that in the folded state and less than that in the unfolded state. At least a portion of the folded region 253 may include a curved surface with a predetermined curvature, and the curvature may be less than that in the folded state.

[0088] Figure 2c The fully deployed state of the electronic device 200 is shown. Figure 2d The diagram shows an intermediate state of the electronic device 200 partially unfolded. As described above, the state of the electronic device 200 can be changed to a folded state or an unfolded state. According to an embodiment, when along the folding axis (e.g., ... Figure 2aWhen viewed along the folding axis A, the electronic device 200 can be folded in two types: an "inward fold" type where the front surface of the electronic device 200 is folded to form an acute angle, and an "outward fold" type where the front surface of the electronic device 200 is folded to form an obtuse angle. For example, in the inward folded state, the first surface of the first housing structure 210 can face the third surface of the second housing structure 220. In the fully unfolded state, the first surface of the first housing structure 210 and the third surface of the second housing structure 220 can face the same direction (e.g., a direction parallel to the Z-axis).

[0089] In another example, when the electronic device 200 is folded in a non-folding manner, the second surface of the first housing structure 210 may face the fourth surface of the second housing structure 220.

[0090] Additionally, although not shown in the accompanying drawings, the electronic device 200 may include multiple hinge axes (e.g., including...). Figure 2a (The folding axis A and two parallel hinge axes parallel to another axis parallel to folding axis A). In this example, the electronic device 200 can also be folded in a "multi-fold" type that combines inward folding and outward folding.

[0091] An inward-folding type refers to a state where the display 250 is not exposed to the outside when fully folded. An outward-folding type refers to a state where the display 250 is exposed to the outside when fully folded.

[0092] Although the folded state of electronic device 200 and below is described below for convenience, it should be noted that this description can be similarly applied to folded states other than electronic device 200.

[0093] Figure 3a This is an exploded perspective view of the electronic device 300 according to an embodiment. Figure 3b This is a plan view of a portion of the electronic device 300 according to an embodiment. Figure 3c This is a cross-sectional view of the electronic device 300 according to an embodiment.

[0094] Specifically, Figure 3b yes Figure 3a A plan view of the display component 350 in the disassembled state in the electronic device 300. Figure 3c It is along Figure 2b The cross-sectional view taken by line B-B' shows the internal structure of the electronic device 300.

[0095] Reference Figure 3a , Figure 3b and Figure 3c According to the embodiment, the electronic device 300 (e.g., Figure 1 Electronic device 101 orFigure 2a , Figure 2b , Figure 2c and Figure 2d The electronic device 200 can be a foldable electronic device 300. For example, the electronic device 300 can be folded or unfolded relative to the folding axis A.

[0096] However, Figure 3a , Figure 3b and Figure 3c The electronic device 300 is merely illustrative, and its size, shape, structure, and hinge axis are not limited thereto. For example, although the electronic device 300 shown in the figures includes a folding axis A in the long side direction (e.g., the Y-axis direction), the electronic device 300 according to an embodiment may include a folding axis in the short side direction (e.g., the X-axis direction).

[0097] In the following text, the description provided above will not be repeated, and it will be apparent that parts of the configuration and structure of the electronic device 300 can be substituted, added, or omitted to the extent readily understood by those skilled in the art with reference to the following drawings and description. Furthermore, at least one component or feature of the above embodiments may be incorporated into the electronic device 300 unless this is clearly not technically feasible.

[0098] In an embodiment, the electronic device 300 may include a foldable housing 310 (e.g., Figure 2a , Figure 2b , Figure 2c and Figure 2d The foldable housing 201), and the display assembly 350 (e.g., Figure 1 Display module 160 or Figures 2a to 2d At least some of the following: display 250, hinge unit 370, and wing plate 400.

[0099] In an embodiment, the foldable housing 310 may form at least a portion of the appearance of the electronic device 300. The foldable housing 310 may include a first housing 301 (e.g., Figure 2a , Figure 2b , Figure 2c and Figure 2d The first housing structure 210) and the second housing 302 (e.g., Figure 2a , Figure 2b , Figure 2c and Figure 2d The second shell structure 220).

[0100] In one embodiment, the hinge unit 370 may be disposed between the first housing 301 and the second housing 302. The first housing 301 and the second housing 302 may be foldably connected to each other via the hinge unit 370.

[0101] In this embodiment, the angle or distance between the first housing 301 and the second housing 302 can vary depending on whether the electronic device 300 is in a flat, unfolded, folded, or intermediate state. For example, an intermediate state can include all states between the unfolded and folded states.

[0102] In one embodiment, the first housing 301 and the second housing 302 may provide space for housing the display assembly 350. The display assembly 350 may be a foldable, flexible display assembly 350.

[0103] In an embodiment, the display component 350 may include multiple layers 350a, 350b, and 350c. For example, the second layer 350b may be a display panel, and the first layer 350a and the third layer 350c may be collectively referred to as multiple components disposed on the respective front and rear surfaces of the display panel.

[0104] For example, the first layer 350a may include at least some of a protective film, a glass layer formed of foldable glass, and a polarizing layer (polarizer) such as a polarizing film. Additionally, the third layer 350c may include at least some of a polymer layer formed of a polymer material and a metal sheet layer or reinforcing layer for enhancing the rigidity of the second layer 350b.

[0105] However, layers 350a, 350b, and 350c schematically illustrate some components of the display assembly 350. The actual implementation of the display assembly 350 is not limited to this, and the display assembly 350 may further include various components and additional layers.

[0106] For example, display component 350 may include a first region 351 (e.g., Figure 2c First region 251), second region 352 (e.g., Figure 2c The second region 252) and the folded region 353 between the first region 351 and the second region 352 (e.g., Figure 2c (253) folded area.

[0107] In one embodiment, the first housing 301 may be configured to face the first region 351 of the display component 350 to support the first region 351. The second housing 302 may be configured to face the second region 352 of the display component 350 to support the second region 352.

[0108] In an embodiment, a hinge unit 370 may be disposed between a first housing 301 and a second housing 302 to connect the first housing 301 to the second housing 302. For example, the hinge structure of the electronic device 300 may include a plurality of hinge units 370a and 370b. The hinge units 370a and 370b may be spaced apart on both sides of the folding axis A (e.g., the Y-axis direction).

[0109] For example, such as Figure 3a As shown, the two hinge units 370a and 370b can be respectively disposed at both ends of the electronic device 300 along the folding axis A (e.g., one end in the +Y direction and one end in the -Y direction). However, the number and arrangement of the hinge units 370 are not limited to the foregoing description.

[0110] In this embodiment, the hinge unit 370 can perform folding or unfolding of the electronic device 300. The hinge unit 370 can operate between a folded state where the first region 351 and the second region 352 face each other and an unfolded state where the first region and the second region do not face each other. The hinge unit 370 can generate force to maintain a specific folded state of the electronic device 300.

[0111] For example, when the electronic device 300 is in a folded state, the hinge unit 370 can generate a force (e.g., a closing positioning force) to maintain the folded state of the electronic device 300.

[0112] For example, when the electronic device 300 is in the unfolded state, the hinge unit 370 can generate a force (e.g., an opening positioning force) to keep the electronic device 300 in the unfolded state.

[0113] For example, when the electronic device 300 is in an intermediate state, the hinge unit 370 can generate a force (e.g., a free-stopping force) to maintain the intermediate state of the electronic device 300.

[0114] In one embodiment, the wing plate 400 can support the display assembly 350. The wing plate 400 can be disposed between the hinge unit 370 and the display assembly 350. The wing plate 400 can prevent the display assembly 350 from sagging under its own weight. Alternatively, the wing plate 400 can withstand its own weight and / or external forces applied to the display assembly 350 to prevent damage to the display assembly 350.

[0115] In this embodiment, the wing plates 400 may be provided as a pair. For example, the wing plates 400 may include a first wing plate 400a and a second wing plate 400b. The first wing plate 400a may support a first region 351 of the display assembly 350, and the second wing plate 400b may support a second region 352 of the display assembly 350.

[0116] In one embodiment, the wing plate 400 can be secured to the hinge unit 370 via a fixing member 390. The wing plate 400 can move in association with the operation of the hinge unit 370 and can assist in the folding operation of the foldable housing 310 and / or the display assembly 350.

[0117] Figure 4a This is an exploded perspective view of multiple pieces 410 according to an embodiment, and Figure 4bThis is a plan view of multiple pieces 410 according to an embodiment.

[0118] Reference Figure 4a and Figure 4b The wing according to the embodiment can be formed by laminating multiple sheets 410 (e.g., Figure 3a , Figure 3b and Figure 3c 400 wingplates.

[0119] Figure 4a and Figure 4b The plurality of pieces 410 shown are examples of the state of the raw materials or prior to machining for forming the wing 400. The size, shape, structure, arrangement, number, and material of the plurality of pieces 410 used to form the wing 400 in the embodiments of this disclosure are not limited thereto.

[0120] In the following description, with reference to the accompanying drawings, the plurality of plates 410 and the wing 400 are described based on a plurality of plates 410 having a uniform thickness and comprising nine plates. However, this is merely illustrative, and the number, structure, shape, material, or thickness of the plurality of plates 410 to be implemented is not limited thereto. For example, at least one plate may have a thickness greater than or less than the thickness of the other plates.

[0121] In the following text, any repetitive descriptions that overlap with the above description are omitted, and it is obvious that in the wing 400 and the electronic devices including the wing 400 (e.g., Figure 1 Electronic device 101 Figure 2a , Figure 2b , Figure 2c and Figure 2d Electronic devices 200, or Figure 3a , Figure 3b and Figure 3c In the electronic device 300, a portion of the configuration and structure can be replaced, added, or omitted to the extent readily understood by those skilled in the art with reference to the following drawings and description. Furthermore, unless technically clearly impractical, at least one component or feature of the above embodiments can be combined with the wing 400 and the electronic device 300 including the wing 400.

[0122] In an embodiment, the plurality of sheets 410 may include an outer sheet 410a and an inner sheet 410b, and may include, for example, a plurality of outer sheets 410a and at least one inner sheet 410b.

[0123] In an embodiment, the outer sheet 410a may be a sheet disposed on the outermost side relative to the center of the wing 400, or it may be a sheet that is visually exposed to the outside of the wing 400. The inner sheet 410b may be a sheet disposed on the inner side of the outer sheet 410a, and it may be a sheet that is not visually exposed to the outside of the wing 400 or is only partially exposed.

[0124] In one embodiment, the plurality of outer sheets 410a may include a first outer sheet 411 and a second outer sheet 419. The first outer sheet 411 and the second outer sheet 419 may face opposite directions.

[0125] For example, in the state where the wing plate 400 is assembled to the electronic device 300 (e.g., Figure 3c In the state of (e.g., the first external piece 411 can be facing the display (e.g., Figure 3c The display component 350). Additionally, for example, in the state where the wing plate 400 is assembled to the electronic device 300 (e.g., Figure 3c In the state of (e.g., the second outer piece 419 can be facing the hinge unit (e.g., Figure 3c The hinge unit 370) is a piece.

[0126] In an embodiment, the first outer sheet 411 may have a centerline average (CLA) surface roughness in the range of 1.0 Ra to 5.0 Ra. Since the first outer sheet 411 faces the display assembly 350, bonding strength may be required for attaching to other components (e.g., tape) disposed on the front surface of the wing 400. Physical, optical, or chemical surface treatments (e.g., sandblasting) may be performed on the first outer sheet 411 to improve surface bonding strength.

[0127] For example, if the surface roughness of the first outer sheet 411 is greater than 5.0 Ra, the synthetic resin surface of the carbon fibers protecting the multiple sheets 410 may be damaged, and the carbon fibers may be exposed to the outside. The carbon fibers may then be damaged or may come into contact with other components, which could lead to a short circuit.

[0128] For example, if the surface roughness of the first outer piece 411 is less than 1.0 Ra, the surface bonding strength used to attach the wing plate 400 to other components may be reduced.

[0129] In embodiments of this disclosure, the first outer sheet 411 may have a CLA surface roughness in the range of 1.0 Ra to 5.0 Ra, thereby preventing the carbon fibers of the plurality of sheets 410 from being exposed to the outside, thereby providing surface bond strength.

[0130] In an embodiment, the internal sheet 410b may be provided as a plurality of sheets, and may include, for example, a total of seven sheets. The internal sheet 410b may include at least some of a first internal sheet 412, a second internal sheet 413, a third internal sheet 414, a fourth internal sheet 415, a fifth internal sheet 416, a sixth internal sheet 417, and a seventh internal sheet 418. The first internal sheet 412, the second internal sheet 413, the third internal sheet 414, the fourth internal sheet 415, the fifth internal sheet 416, the sixth internal sheet 417, and the seventh internal sheet 418 may be sequentially arranged and stacked between the first external sheet 411 and the second external sheet 419.

[0131] In an embodiment, each of the plurality of sheets 410 may be oriented in a single direction and may be formed of unidirectional (UD) fibers that have relatively higher stiffness in that direction than in other directions. UD fibers may refer to unidirectional fibers or fibers oriented in a single direction.

[0132] In embodiments of this disclosure, compared to cases formed from metallic materials, the wing 400 formed from multiple UD fiber sheets can be relatively lightweight, easy to process, and readily achieve the desired shape.

[0133] In addition, in the embodiments of this disclosure, the wing plate 400 having a stacked structure of multiple pieces 410 can facilitate the formation of a wing plate 400 with a relatively small thickness and can facilitate thickness control.

[0134] In this embodiment, any one of the plurality of sheets 410 may be oriented in a different direction than the other adjacent sheets stacked among the plurality of sheets 410. If each of the plurality of sheets 410 is oriented differently, the direction of higher rigidity of each sheet may also be different. Therefore, the wing 400 formed by stacking the plurality of sheets 410 can provide high rigidity in multiple directions.

[0135] In an embodiment, any one of the plurality of sheets 410 may be oriented perpendicular to each other of the adjacent sheets stacked among the plurality of sheets 410. For example, as Figure 4a As shown, the first outer sheet 411, the second inner sheet 413, the fourth inner sheet 415, the sixth inner sheet 417, and the second outer sheet 419 can be oriented parallel to the Y-axis. Alternatively, for example, the first inner sheet 412, the third inner sheet 414, the fifth inner sheet 416, and the seventh inner sheet 418 can be oriented parallel to the X-axis.

[0136] In embodiments of this disclosure, since the orientations of each of the plurality of plates 410 are different from or perpendicular to each other, the wing plate 400 can provide high rigidity in the transverse and longitudinal directions, can achieve uniform tensile strength in the transverse and longitudinal directions, and can provide stable durability and rigidity.

[0137] In an embodiment, the plurality of sheets 410 may be prepreg sheets. For example, each of the plurality of sheets 410 may be manufactured by impregnating unidirectionally oriented carbon fibers with a liquid synthetic resin (e.g., epoxy resin), and the wing 400 may be formed by heat-treating the stacked plurality of sheets 410.

[0138] In embodiments of this disclosure, compared to general woven fabrics, the wing 400, comprising a plurality of prepreg sheets formed of UD fibers, can have virtually no unevenness on its surface and can form a smoother surface with reduced roughness, thereby facilitating the management of the surface smoothness and roughness (e.g., surface unevenness rate) of the wing 400.

[0139] For example, if the wing plate 400 has many uneven structures and therefore high surface roughness, the uneven structures of the wing plate 400 may press against the display assembly 350 and reduce image quality. In embodiments of this disclosure, the wing plate 400 comprising a plurality of prepreg sheets formed of UD fibers can reduce uneven structures and lower surface roughness, thereby improving the performance of the display assembly 350 of the electronic device 300.

[0140] In this embodiment, each of the plurality of sheets 410 may be formed of any one of carbon fiber, glass fiber, or aramid fiber. Alternatively, each of the plurality of sheets 410 may be formed of a blended fabric comprising at least two of carbon fiber, glass fiber, and aramid fiber. The materials of the plurality of sheets 410 may be selected based on the desired properties, production costs, and / or performance of the wing 400.

[0141] In an embodiment, a plurality of sheets 410 may be formed from fiber sheets and a liquid synthetic resin. For example, each of the plurality of sheets 410 may be formed by impregnating a plurality of fiber sheets used as raw materials with a liquid synthetic resin. Based on the weight of the plurality of fiber sheets, the liquid synthetic resin may have a content of 30% to 60% by weight. See below for reference. Figure 9 As described, during the thermoforming of multiple sheets 410, a liquid synthetic resin can be cured, thereby binding the multiple fiber sheets together to form a laminated wing 400.

[0142] In an embodiment, the inner sheet 410b may include a punch 410c formed in at least a portion of the sheet. The punch 410c may define a step difference in the structure and height of the wing 400. When a portion of the inner sheet 410b is formed as an opening, the wing 400 including the inner sheet 410b may have a step formed in that portion, thereby achieving a three-dimensional structure and stepped shape of the wing 400.

[0143] For example, such asFigure 4b As shown, the first internal piece 412 may include a first punch 412a, the second internal piece 413 may include a second punch 413a, the third internal piece 414 may include a third punch 414a, the fourth internal piece 415 may include a fourth punch 415a, the fifth internal piece 416 may include a fifth punch 416a, the sixth internal piece 417 may include a sixth punch 417a, and / or the seventh internal piece 418 may include a seventh punch 418a.

[0144] In the embodiments, including Figure 4b The components within region C can form a single wing 400. Multiple pieces 410 can be stacked, thermoformed, and cut and / or punched. Therefore, multiple pieces 410 in region C can be stacked to form a single wing 400.

[0145] In this embodiment, at least some of the multiple perforations 410c may have different positions, shapes, and sizes. By designing the shape and size of the multiple perforations 410c, the multiple pieces 410 can form a complex structure of the wing plate 400.

[0146] In one embodiment, the first outer piece 411 and / or the second outer piece 419 may be continuous over the entire area of ​​the wing 400. Alternatively, the first outer piece 411 and / or the second outer piece 419 may not include any perforations 410c or any openings.

[0147] For example, when a perforation 410c is formed in the first outer sheet 411 and / or the second outer sheet 419, fibers may accumulate at the edge of the perforation 410c, the edge may be prominent and visually emphasized, or there may be a deviation in step height.

[0148] In embodiments of this disclosure, the first outer sheet 411 and / or the second outer sheet 419 may be continuous over the entire area of ​​the wing 400, thereby improving the surface smoothness and roughness of the wing 400 and providing improved surface quality of the product.

[0149] Figure 5a This is a perspective view of the wing 400 according to an embodiment. Figure 5b This is a plan view of the wing plate 400 according to the embodiment. Figure 5c This is a rear view of the wing 400 according to an embodiment.

[0150] Specifically, Figure 5b and Figure 5c It is shown in an emphasis manner Figure 5a Plan view and rear view of the stepped structure of the wing plate 400.

[0151] Specifically, Figure 5b and Figure 5cIt is shown in an emphasis manner Figure 5a Plan view and rear view of the stepped structure of the wing plate 400.

[0152] In the following text, the description provided above will not be repeated, and it will be apparent that at least a portion of the configuration and structure of the wing 400 can be replaced, added, or omitted to the extent readily understood by those skilled in the art with reference to the following figures and description. Furthermore, at least one component or feature of the above embodiments may be combined with the wing 400 unless this is clearly not technically feasible.

[0153] In one embodiment, the wing 400 may include a reference region 421. The reference region 421 may be a region in which no step is formed. Alternatively, as described below... Figure 6a As shown, reference area 421 may be an area in which no punching is formed (e.g., Figure 4b The area of ​​the punched hole (410c).

[0154] In an embodiment, the stepped region 420 may be a region of the wing 400 with a thickness different from that of other regions (e.g., reference region 421). For example, as Figure 5b and Figure 5c As shown, the step region 420 can be a region with a height lower than or thinner than the reference region 421.

[0155] In one embodiment, the wing 400 may include a plurality of stepped regions 420. Alternatively, the wing 400 may include a plurality of stepped regions 420 with different thicknesses.

[0156] In an embodiment, the plurality of stepped regions 420 may include a first stepped region 422 and a second stepped region 423 having a thickness less than that of the first stepped region 422. For example, the first stepped region 422 may be a region where the stepped region 420 is formed on the rear surface of the wing 400 but not on the front surface, and the second stepped region 423 may be a region where the stepped region 420 is formed on both the rear and front surfaces of the wing 400. Alternatively, the second stepped region 423 may be a sheet having fewer layers than the first stepped region 422 (e.g., Figure 4a and Figure 4b The area of ​​multiple slices (410).

[0157] However, this is merely illustrative, and the structure and thickness of the multiple stepped regions 420 are not limited thereto. For example, the first stepped region 422 and the second stepped region 423 may be two regions with different heights relative to the reference region 421 on the same side of the wing plate 400. (Reference region 421) Figure 6a , Figure 6b and Figure 6cAn exemplary structure is described for reference region 421, first step region 422, and second step region 423.

[0158] In embodiments of this disclosure, the stepped region 420 may reduce or eliminate the interaction between the wing plate 400 and the hinge unit (e.g., Figure 3a , Figure 3b and Figure 3c The hinge unit 370) and / or the display (e.g., Figure 3a , Figure 3b and Figure 3c Interference or contact between display components 350. Alternatively, the step area 420 may be a fixed component (e.g., Figure 3c The structure to which the fixing component 390 is fastened.

[0159] In an embodiment, the open area 425 may be an area that opens from the front surface to the rear surface of the wing 400. The open area 425 may be an area through which at least a portion of the components of the hinge unit 370 passes, or it may be an area to which the fixing member 390 is fastened. Alternatively, the open area 425 may be an area used to reduce the weight of the wing 400 and to prevent or reduce interference with other components of the wing 400. The open area 425 may be formed by perforation through a cutting process or computer numerical control (CNC) machining after the wing 400 has been thermoformed.

[0160] In an embodiment, the protruding region 427 may be a region of the wing plate 400 (e.g., reference region 421) that protrudes forward (e.g., in the +Z direction or toward the display assembly 350) or rearward (e.g., in the -Z direction or toward the hinge unit 370) relative to an adjacent region. The protruding region 427 may be the region to which a fixing member 390 for securing the wing plate 400 to the hinge unit 370 or the foldable housing 310 is fastened.

[0161] Figure 6a This is a cross-sectional view of a portion of the wing plate 400 according to an embodiment. Figure 6b This is a cross-sectional view of a portion of the wing plate 400 according to an embodiment. Figure 6c This is a cross-sectional view of a portion of the wing 400 according to an embodiment.

[0162] Specifically, Figure 6a , Figure 6b and Figure 6c It is shown Figure 5a A cross-sectional view of the stacked structure of reference region 421, first step region 422, and second step region 423. For ease of understanding, Figure 6a , Figure 6b and Figure 6c The state of the multiple sheets 410 before heat treatment or compression can be schematically shown.Figure 6a , Figure 6b and Figure 6c Multiple punches (e.g., Figure 4b The punched holes (410c) can then be heat-treated and filled with adjacent sheets, thereby forming steps in the corresponding areas.

[0163] Reference Figure 6a , Figure 6b and Figure 6c According to the embodiment, the wing plate 400 may have a different number of pieces 410 stacked in multiple regions (e.g., reference region 421, first step region 422 and second step region 423).

[0164] Reference Figure 6a In this embodiment, the reference region 421 of the wing 400 can be all the stacked regions of the plurality of pieces 410. Alternatively, the reference region 421 can be any other region adjacent to the first stepped region 422 or the second stepped region 423. Alternatively, the reference region 421 of the wing 400 can be a region in which no perforations are formed (e.g., Figure 4b The area of ​​the punched hole (410c).

[0165] However, Figure 6a The reference region 421 is merely illustrative and may be defined for comparison with the first step region 422 or the second step region 423. For example, the reference region 421 may be a region having a thickness greater than that of the first step region 422 or the second step region 423. Alternatively, the reference region 421 may be a region occupying a major portion of the wing plate 400.

[0166] Reference Figure 6b and Figure 6c In embodiments, different numbers of sheets 410 may be stacked in the first step region 422 and the second step region 423 compared to the reference region 421. For example, in the wing plate 400, the step region 420, which has a smaller thickness than other regions, may have fewer stacked sheets 410.

[0167] In the embodiments, reference is made to Figure 6b At least some of the plurality of punches 410c (e.g., punches 412a, 413a, 414a, and 415a) may be formed in the plurality of pieces 410 in the first step region 422. For example, the first step region 422 may be the region in which the first punch 412a, the second punch 413a, the third punch 414a, and the fourth punch 415a are formed.

[0168] In an embodiment, the first inner sheet 412, the second inner sheet 413, the third inner sheet 414, and the fourth inner sheet 415, in which at least some of the plurality of perforations 410c (e.g., perforations 412a, 413a, 414a, and 415a) are formed, may not be stacked in the first stepped region 422. Therefore, the first stepped region 422 may include a first outer sheet 411, a fifth inner sheet 416, a sixth inner sheet 417, a seventh inner sheet 418, and a second outer sheet 419.

[0169] In the embodiments, reference is made to Figure 6c At least some of the plurality of punches 410c (e.g., punches 413a, 414a, 415a, 416a, and 418a) may be formed in the plurality of pieces 410 in the second step region 423. For example, the second step region 423 may be the region in which the second punch 413a, the third punch 414a, the fourth punch 415a, the fifth punch 416a, and the seventh punch 418a are formed.

[0170] In an embodiment, the second inner sheet 413, the third inner sheet 414, the fourth inner sheet 415, the fifth inner sheet 416, and the seventh inner sheet 418, in which at least some of the plurality of perforations 410c are formed (e.g., perforations 413a, 414a, 415a, 416a, and 418a), may not be stacked in the second stepped region 423. Therefore, the second stepped region 423 may include a first outer sheet 411, a first inner sheet 412, a sixth inner sheet 417, and a second outer sheet 419.

[0171] In embodiments, in regions where fewer sheets 410 are stacked, the wing 400 can be thinner and can form relative steps. For example, in a second step region 423 having a thickness less than that of the first step region 422, fewer sheets 410 can be stacked than in the first step region 422. (See also...) Figure 6b and Figure 6c The first step region 422 may include a total of five pieces 410, and the second step region 423 may include a total of four pieces 410. However, this is merely illustrative, and the number and arrangement of the multiple pieces 410 forming the step region 420 are not limited thereto and can be implemented in various ways.

[0172] In an embodiment, the stepped region 420 can be formed by at least one punch 410c in each of the individual pieces 410 of the wing 400. If a cutting process or CNC machining is performed on the wing 400 to form the stepped region 420, the structural continuity of the wing 400 may be compromised, its rigidity and durability may be reduced, and burrs may be generated. Furthermore, precise control of the height of the wing 400 may be limited, expensive cutting equipment may be required, or errors may occur during the cutting process.

[0173] According to embodiments of the present disclosure, by providing punches 410c in the plurality of pieces 410, the stepped region 420 can be easily and simply formed, achieving precise steps at the target location and reducing or suppressing burr formation. Furthermore, according to embodiments of the present disclosure, the wing plate 400 can simplify processing, achieve cost efficiency in manufacturing, and reduce or prevent a decrease in its durability and rigidity.

[0174] Figure 7 This is a cross-sectional view of a portion of the wing 400 according to an embodiment.

[0175] Reference Figure 7 According to the embodiment, the protruding region 427 may include a plurality of pieces 410, at least some of which extend continuously from another region.

[0176] In an embodiment, the protruding region 427 may be a region that protrudes forward (e.g., in the +Z direction) or rearward (e.g., in the -Z direction) relative to another adjacent region of the wing 400 (e.g., reference region 421). A fastening hole 428 may be provided at the center of the protruding region 427. A fixing member (e.g., Figure 3c The fixing member 390 can be inserted through the fastening hole 428 to fix the wing plate 400 to another structure. After the wing plate 400 is thermoformed, the fastening hole 428 can be drilled by cutting or CNC machining.

[0177] In an embodiment, the protruding region 427 may include at least some of a plurality of pieces 410 extending continuously from another adjacent region of the wing 400. For example, as Figure 7 As shown, the protruding region 427 may include a first outer sheet 411, a fifth inner sheet 416, a sixth inner sheet 417, a seventh inner sheet 418, and a second outer sheet 419 that are continuous from the reference region 421.

[0178] In an embodiment, since multiple plates 410 extend continuously from another adjacent region into the protruding region 427, the wing plate 400 can reduce or prevent the deterioration of rigidity and durability in the protruding region 427.

[0179] In this embodiment, if cutting, CNC machining, and / or thermal processes are performed on the wing plate 400 to form the protruding region 427, the structural continuity of the wing plate 400 may be compromised, its durability may be degraded, and burrs may be generated. Furthermore, precise control of the height of the wing plate 400 may be limited, potentially requiring expensive cutting equipment, or errors may occur during the cutting process. Additionally, the protruding region 427 may be susceptible to damage due to the torque and pressure applied by the fixing member 390 during fastening.

[0180] According to embodiments of this disclosure, the wing plate 400 can maintain the continuity of at least some of the plurality of pieces 410 to form the protruding region 427, and can reduce or suppress the formation of burrs. Additionally, the wing plate 400 can simplify processing, achieve cost efficiency in manufacturing, and reduce or prevent degradation of durability and rigidity. Furthermore, the wing plate 400 can reduce or prevent damage to the protruding region 427 during the fastening of the fixing member 390.

[0181] In an embodiment, the protruding region 427 may be included as a step region (e.g., Figure 5a , Figure 5b and Figure 5c Part of the stepped area (420). Figure 7 As shown, the protruding region 427 may have a smaller thickness than another adjacent region (e.g., reference region 421) and a different number of stacked sheets 410.

[0182] For example, in the transition from reference region 421 to protruding region 427, punching (e.g., Figure 4b The first inner piece 412, the second inner piece 413, the third inner piece 414, and the fourth inner piece 415 are omitted in the punch 410c. The first outer piece 411, the fifth inner piece 416, the sixth inner piece 417, the seventh inner piece 418, and the second outer piece 419 can form a protruding area 427.

[0183] In an embodiment, when the number of pieces 410 forming the protruding region 427 is reduced, steps can be formed in the protruding region 427, and the protruding region 427 can be formed easily and simply.

[0184] Figure 8a This is a perspective view of the wing 400 according to an embodiment. Figure 8b This is a perspective view of the wing plate 400 and the connecting member 461 according to an embodiment. Figure 8c This is an exploded perspective view of the wing plate 400 and the connecting member 461 according to an embodiment.

[0185] Reference Figure 8a , Figure 8b and Figure 8c According to the embodiment, the wing plate 400 may include a connecting region 450 and a connecting member 461.

[0186] In the following text, the description provided above will not be repeated, and it will be apparent that at least a portion of the configuration and structure of the wing 400 can be replaced, added, or omitted to the extent readily understood by those skilled in the art with reference to the following figures and description. Furthermore, at least one component or feature of the above embodiments may be combined with the wing 400 unless this is clearly not technically feasible.

[0187] In an embodiment, the connecting region 450 may be a region having a thickness different from that of the adjacent region of the wing 400. For example, the connecting region 450 may be a stepped region (e.g., Figure 5a , Figure 5b and Figure 5c Stepped areas 420) and / or open areas (e.g., Figure 5a , Figure 5b and Figure 5c Example of an open area (425).

[0188] In this embodiment, the connecting member 461 may be connected to the connecting region 450. The connecting member 461 may be connected to the wing 400 to form a countergradient structure or an undercut structure. Since the wing 400 formed by multiple pieces 410 may have limitations in forming countergradient or undercut structures, a single connecting member 461 may be connected to the wing 400, thereby allowing for various structures and shapes without limitation.

[0189] In the embodiments, reference is made to Figure 8a The connection area 450 may include at least one of a first fastening structure 451 and a second fastening structure 452. The first fastening structure 451 and the second fastening structure 452 may fix and / or support the connection member 461.

[0190] In one embodiment, the first fastening structure 451 may be an opening extending from one surface of the wing 400 to the opposite surface to allow the connecting member 461 to pass through it. The second fastening structure 452 may be a step or groove formed inward from the outer peripheral surface of the wing 400 to accommodate the connecting member 461.

[0191] In the embodiments, reference is made to Figure 8b The wing plate 400 may include a plurality of connecting members 461, and the plurality of connecting members 461 may include a first connecting member 461a and a second connecting member 461b. The first connecting member 461a and the second connecting member 461b may have different shapes from each other.

[0192] In this embodiment, the connecting member 461 can be attached to the wing plate 400 via insert injection molding. For example, the wing plate 400 can be disposed in a mold, and the connecting member 461 can be molded onto the wing plate 400 by injecting synthetic resin via insert injection molding. When insert injection molding is used, the risk of the connecting member 461 separating or detaching from the connecting area 450 can be reduced or eliminated, and the connecting member 461 can be stably attached to the wing plate 400.

[0193] In the embodiments, reference is made to Figure 8c The first connecting member 461a can be divided into a first connecting portion 461a-1 and a second connecting portion 461a-2. The first connecting portion 461a-1 and the second connecting portion 461a-2 are structures for fixing via a first fastening structure 451 of the connecting region 450, and are configured to face each other on both sides of the wing plate 400 and be interconnected and assembled onto the wing plate 400. The first connecting portion 461a-1 and the second connecting portion 461a-2 can be structurally interconnected and / or adhesively bonded using a bonding material.

[0194] In this embodiment, the connecting member 461 may be injection molded or manufactured separately from the wing 400, and then connected and / or bonded to the connecting region 450 of the wing 400. For example, the connecting member 461 may be injection molded or formed separately and may have a shape corresponding to the first fastening structure 451 and the second fastening structure 452 of the wing 400. When the connecting member 461 is formed separately, its material may be chosen differently, and various levels of rigidity or elasticity may be achieved.

[0195] For example, the connecting member 461 can be formed from a synthetic resin. For example, the connecting member 461 can be formed from at least one selected from the group consisting of polycarbonate (PC), glass fiber reinforced polycarbonate, carbon fiber reinforced polycarbonate, polyamide, glass fiber reinforced polyamide, carbon fiber reinforced polyamide, polyetheretherketone, glass fiber reinforced polyetheretherketone, and carbon fiber reinforced polyetheretherketone. The rigidity of the connecting member 461 can be improved by reinforcing it with glass fiber and carbon fiber, and there is no particular limitation on the content of these materials.

[0196] Figure 9 This is a flowchart of a manufacturing method 500 for the wing plate 400 according to an embodiment.

[0197] Reference Figure 9 The manufacturing method 500 of the wing 400 according to the embodiment may include at least some of the following: a stacking operation 510 of stacking multiple sheets 410, a thermoforming operation 530, a forming operation 550 of forming the wing 400, and a cleaning operation 570 of cleaning the wing 400.

[0198] In the following text, any repetitive descriptions overlapping with the foregoing description are omitted, and the wingplate 400 to be manufactured by manufacturing method 500 may be the wingplate 400 described above or may be a different wingplate 400. Furthermore, in the wingplate 400 to be manufactured by manufacturing method 500, it is apparent that parts of the configuration and structure may be substituted, added, or omitted to the extent readily understood by those skilled in the art with reference to the following figures and description. Additionally, the wingplate 400 to be manufactured by manufacturing method 500 may be combined with at least one component or feature of the above embodiments, unless this is clearly not technically feasible.

[0199] In an embodiment, the stacking operation 510 of multiple sheets 410 can be performed by stacking multiple fiber sheets in a prepreg state. The stacking operation 510 for stacking multiple sheets 410 may include removing release paper attached to the sheets in the prepreg state and sequentially placing the sheets on a fixture.

[0200] In an embodiment, each of the plurality of sheets 410 may be oriented in a single direction and may be formed of UD fibers having relatively higher stiffness in that direction than in other directions.

[0201] In an embodiment, the stacking operation 510 may include stacking a plurality of sheets 410 such that any sheet is oriented in a direction different from that of the adjacent sheets (e.g., the vertical direction).

[0202] In an embodiment, the thermoforming operation 530 may include positioning the stacked sheets 410 in a mold and thermoforming the sheets. Multiple sheets 410 may be formed by impregnating sheets with a synthetic resin, and multiple sheets 410 may be thermoformed because the synthetic resin undergoes a curing reaction when exposed to high temperatures for a predetermined time period.

[0203] For example, thermoforming operation 530 can be performed at a temperature of 145 to 155 degrees Celsius, a pressure of 180 to 200 bar, with a preheating time of 10 to 20 seconds and a molding time of approximately 400 seconds. Alternatively, thermoforming operation 530 can be performed at a temperature of 150 to 180 degrees Celsius for a molding time of 400 to 1800 seconds. For example, the thickness of the multiple sheets 410 after thermoforming can be 0.85 mm.

[0204] In an embodiment, the forming operation 550 of forming the wing 400 may include cutting and / or stamping a thermoformed sheet 410 to form the wing 400. The forming operation 550 of forming the wing 400 may include machining the outer contour and opening shape of the product by roughing and / or finishing to form the product shape.

[0205] For example, the forming operation 550 of forming the wing 400 may include CNC machining to cut the outer contour and opening structure of the wing 400 to a predetermined depth (e.g., 0.3 mm) to form the wing 400.

[0206] In an embodiment, the cleaning operation 570 of cleaning the airfoil 400 can remove the fine carbon fibers generated in the forming operation 550 of forming the airfoil 400, and can remove foreign matter on the surface of the airfoil 400.

[0207] Figure 10 This is a flowchart of a manufacturing method 500 for the wing plate 400 according to an embodiment.

[0208] Reference Figure 10 The manufacturing method 500 of the wing plate 400 according to the embodiment may further include at least some of the following: raw material fiber impregnation operation 501, punching forming operation 505 for forming punches 410c, and sandblasting operation 560.

[0209] In the following text, any repetitive descriptions overlapping with the foregoing description are omitted, and the wingplate 400 to be manufactured by manufacturing method 500 may be the wingplate 400 described above or may be a different wingplate 400. Furthermore, in the wingplate 400 manufactured by manufacturing method 500, it is apparent that parts of the configuration and structure may be replaced, added, or omitted to the extent readily understood by those skilled in the art with reference to the following figures and description. Additionally, the wingplate 400 to be manufactured by manufacturing method 500 may be combined with at least one component or feature of the above embodiments, unless this is clearly not technically feasible.

[0210] In this embodiment, a raw material fiber impregnation operation 501 and a punching operation 505 for forming punches 410c can be performed prior to a stacking operation 510 of multiple sheets 410. The raw material fiber impregnation operation 501 can form a prepreg-state sheet by impregnating each fiber sheet used as the raw material for the multiple sheets 410 with a liquid synthetic resin such as epoxy resin. Based on the weight of the multiple fiber sheets, the impregnating liquid synthetic resin can have a content of 30% to 60% by weight.

[0211] In an embodiment, the punching operation 505, which forms the perforation 410c, can form the perforation 410c in at least some of the impregnated plurality of raw material fibers. The perforation 410c can form a step of the wing plate 400. The position, shape, and size of the perforations 410c in the plurality of sheets 410 can be different from each other. In the punching operation 505, the two sheets stacked on the outermost layer of the plurality of sheets 410 may not have perforations 410c formed.

[0212] In an embodiment, sandblasting operation 560 may include performing a sandblasting process on at least one surface of the wing plate 400 prior to cleaning operation 570 of cleaning the wing plate 400.

[0213] In this embodiment, because the wing 400 undergoes multiple processes, the surface of the wing 400 formed from the carbon composite material may have residual release agent and other contaminants. Release agent is a chemical used to prevent bonding between the wing 400 and the surface of another material. Release agent can interfere with the bonding between the adhesive and the wing 400. Since release agent is difficult to remove with alcohols and other organic solvents, and other contaminants remaining on the surface of the wing 400 reduce the bond strength between the wing 400 and other components, a sandblasting process can be performed to treat the surface of the wing 400 to improve surface bond strength. Additionally, the sandblasting process can remove fine carbon fiber burrs generated during the forming operation 550 to form the wing 400. Through the sandblasting process, at least one surface of the wing 400 can have a CLA surface roughness in the range of 1.0 Ra to 5.0 Ra.

[0214] Although not shown in the figure, the manufacturing method 500 of the wing plate 400 may further include a forming operation (not shown) for forming the connecting member 461.

[0215] In an embodiment, the forming operation (not shown) for forming the connecting member 461 may include injection molding the connecting member 461, made of synthetic resin, into the connecting region 450 provided in the wing 400, thereby forming an anti-gradient structure or undercut structure in the wing 400. However, the forming operation (not shown) of the connecting member 461 is not limited to this and may include forming it by assembling and / or bonding the connecting member 461, which is formed separately from the wing 400, to the wing 400.

[0216] According to embodiments of this disclosure, the electronic device 300 may include: a display assembly 350 including a first region 351, a second region 352, and a folded region 353 between the first region 351 and the second region 352; a first housing 301 for supporting the first region 351; a second housing 302 for supporting the second region 352; a hinge unit 370 for connecting the first housing 301 and the second housing 302 and operating between a folded state in which the first region 351 and the second region 352 face each other and an unfolded state in which the first region 351 and the second region 352 do not face each other; and a wing plate 400 disposed between the hinge unit 370 and the display assembly 350 and for supporting the display assembly 350. In embodiments, the wing plate 400 may be formed by stacking a plurality of sheets 410.

[0217] In an embodiment, each of the plurality of sheets 410 may be oriented in a single direction and may be formed of UD fibers having relatively higher stiffness in that direction than in other directions.

[0218] In an embodiment, any one of the plurality of sheets 410 may be oriented in a different direction than the other adjacent sheets stacked among the plurality of sheets 410.

[0219] In an embodiment, any one of the plurality of sheets 410 may be oriented perpendicularly to each other with the stacked adjacent sheets among the plurality of sheets 410.

[0220] In one embodiment, the wing 400 may include a stepped region 420 having a thickness different from that of adjacent regions of the wing 400. In another embodiment, the number of stacked sheets 410 in the stepped region 420 may differ from the number of adjacent regions of the wing 400.

[0221] In one embodiment, the wing plate 400 may include a plurality of stepped regions 420. In another embodiment, the plurality of stepped regions 420 may include a first stepped region 422 and a second stepped region 423, the second stepped region 423 having a thickness less than that of the first stepped region 422 and fewer sheets 410 stacked in the first stepped region 422.

[0222] In one embodiment, the wing 400 may include a protruding region 427 that projects toward the display assembly 350 or hinge unit 370 relative to an adjacent region of the wing 400. In another embodiment, the protruding region 427 may include at least some of a plurality of pieces 410 extending from another adjacent region of the wing 400.

[0223] In an embodiment, the plurality of sheets 410 may include a first outer sheet 411 facing the display assembly 350, a second outer sheet 419 disposed opposite to the first outer sheet 411 and facing the hinge unit 370, and an inner sheet 410b stacked between the first outer sheet 411 and the second outer sheet 419.

[0224] In an embodiment, the inner sheet 410b may include a punch 410c formed in at least a portion of the sheet.

[0225] In one embodiment, the first outer piece 411 may be continuous over the entire area of ​​the wing 400.

[0226] In one embodiment, the second outer piece 419 may be continuous over the entire area of ​​the wing 400.

[0227] In an embodiment, the first outer sheet 411 may have a CLA surface roughness in the range of 1.0 Ra to 5.0 Ra.

[0228] In an embodiment, the wing plate 400 may include a connecting region 450 and a connecting member 461. The connecting region 450 has a thickness different from that of the adjacent region of the wing plate 400, and the connecting member 461 is connected to the connecting region 450.

[0229] In an embodiment, the coupling region 450 may include a first fastening structure 451, which is an opening extending from one surface of the wing plate 400 to the opposite surface to allow the coupling member 461 to pass through it.

[0230] In an embodiment, the connection area 450 may include a second fastening structure 452, which forms a groove from the outer surface of the wing plate 400 inward for accommodating the connection member 461.

[0231] In an embodiment, each of the plurality of sheets 410 may be formed of any one of carbon fiber, glass fiber or aramid fiber, or of a blended fabric comprising at least two of carbon fiber, glass fiber and aramid fiber.

[0232] In an embodiment, the plurality of sheets 410 may be formed from a plurality of fiber sheets and a liquid synthetic resin, and the liquid synthetic resin may have a content of 30% to 60% by weight based on the weight of the plurality of fiber sheets.

[0233] Additionally, the manufacturing method 500 of the wing plate 400 according to the embodiments of the present disclosure may include: a stacking operation 510 of stacking a plurality of pieces 410; a thermoforming operation 530 of positioning the plurality of pieces 410 in a mold and thermoforming the pieces; a forming operation 550 of cutting the thermoformed plurality of pieces 410 to form the wing plate 400; and a cleaning operation 570 of cleaning the wing plate 400.

[0234] In an embodiment, prior to the cleaning operation 570 of cleaning the wing plate 400, the manufacturing method 500 of the wing plate 400 may further include a sandblasting operation 560 of sandblasting at least one surface of the wing plate 400.

[0235] In an embodiment, prior to the stacking operation 510 of stacking multiple sheets 410, the manufacturing method 500 of the wing plate 400 may further include: a raw material fiber impregnation operation 501 and a punching forming operation 505 of forming punches 410c in at least some of the impregnated raw material fibers.

[0236] While the preferred embodiments have been described and illustrated above, this disclosure is not limited to the embodiments described herein. Those skilled in the art will certainly be able to perform various implementations without departing from the scope of the claims, and such implementations should not be understood in isolation from the technical ideas or intentions herein.

Claims

1. An electronic device (300), comprising: The display component (350) includes a first region (351), a second region (352), and a folded region (353) between the first region (351) and the second region (352). The first housing (301) supports the first region (351); The second housing (302) supports the second region (352); A hinge unit (370) connects the first housing (301) and the second housing (302) and operates between a folded state where the first region (351) and the second region (352) face each other and an unfolded state where the first region (351) and the second region (352) do not face each other; and A wing plate (400) is disposed between the hinge unit (370) and the display assembly (350) and supports the display assembly (350). The wing plate (400) is formed by stacking multiple pieces (410).

2. The electronic device (300) according to claim 1, wherein, Each of the plurality of sheets (410) is formed of unidirectional (UD) fibers that are oriented in a single direction and exhibit higher stiffness in that single direction than in other directions.

3. The electronic device (300) according to claim 1 or 2, wherein, One of the plurality of sheets (410) is oriented in a direction different from that of the stacked adjacent sheets among the plurality of sheets (410).

4. The electronic device (300) according to any one of claims 1 to 3, wherein, One of the plurality of sheets (410) is oriented in a direction perpendicular to the stacked adjacent sheets among the plurality of sheets (410).

5. The electronic device (300) according to any one of claims 1 to 4, wherein, The wing plate (400) includes a stepped region (420) having a thickness different from that of adjacent regions of the wing plate (400), and The number of stacked pieces (410) in the stepped region (420) is different from the number of stacked pieces (410) in the adjacent region of the wing plate (400).

6. The electronic device (300) according to any one of claims 1 to 5, wherein, The wing plate (400) includes multiple stepped areas (420), and The plurality of step regions (420) include a first step region (422) and a second step region (423) having a thickness smaller than that of the first step region (422). The number of stacked pieces (410) in the second step region (423) is less than the number of stacked pieces (410) in the first step region (422).

7. The electronic device (300) according to any one of claims 1 to 6, wherein, The wing plate (400) includes a protruding region (427) that protrudes toward the display assembly (350) or the hinge unit (370) relative to an adjacent region of the wing plate (400). The protruding area (427) is the area in which at least some of the plurality of pieces (410) extend from the adjacent area of ​​the wing plate (400).

8. The electronic device (300) according to any one of claims 1 to 7, wherein, The plurality of slices (410) include: The first outer sheet (411) faces the display component (350). The second outer piece (419) is provided in the opposite direction to the first outer piece (411) and faces the hinge unit (370); and The inner sheet (410b) is stacked between the first outer sheet (411) and the second outer sheet (419).

9. The electronic device (300) according to any one of claims 1 to 8, wherein, The inner sheet (410b) includes a perforation (410c) provided in at least a portion thereof.

10. The electronic device (300) according to any one of claims 1 to 9, wherein, The first outer piece (411) extends over the entire area of ​​the wing plate (400).

11. The electronic device (300) according to any one of claims 1 to 10, wherein, The second outer piece (419) extends over the entire area of ​​the wing plate (400).

12. The electronic device (300) according to any one of claims 1 to 11, wherein, The first outer sheet (411) has a centerline average surface roughness in the range of 1.0 Ra to 5.0 Ra.

13. The electronic device (300) according to any one of claims 1 to 12, wherein, The wing plate (400) includes: The connecting region (450) has a thickness different from that of the adjacent region of the wing plate (400); and The connecting member (461) is connected to the connecting area (450).

14. The electronic device (300) according to any one of claims 1 to 13, wherein, The connection area (450) includes a first fastening structure (451) that opens from one surface through the wing plate (400) to another surface, such that the connection member (461) passes through the first fastening structure (451).

15. The electronic device (300) according to any one of claims 1 to 14, wherein, The connection area (450) includes a second fastening structure (452) that forms a groove inward from the outer peripheral surface of the wing plate (400) so that the connection member (461) is placed.

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