Electronic device including flexible circuit board

Abstract

An electronic device according to various embodiments of the present invention may include: a frame including at least one antenna, and including a metal material and a polymer material; a front plate coupled to the frame; a rear plate coupled to the frame in an opposite direction to the front plate; at least one electronic component at least partially disposed in an internal space defined by the frame, the front plate, and the rear plate; a printed circuit board disposed in the internal space; a flexible printed circuit board having one end and the other end, where the one end is electrically connected to the printed circuit board and the other end extends so as to be adjacent to the at least one antenna; and a contact member provided at the other end of the flexible printed circuit board, in electrical contact with the at least one antenna, and oriented to apply an elastic force in a direction parallel to a surface of the flexible printed circuit board. The flexible printed circuit board may include a protrusion extending along any one surface of the electronic component within the internal space and formed by increasing a width of the flexible printed circuit board in a region adjacent to the other end.

Description

TECHNICAL FIELD

[0001] Various embodiments disclosed herein relate to an electronic device, and more particularly, to an electronic device including a flexible printed circuit board. BACKGROUND

[0002] An electronic device can include a wire configured to transmit a signal or supply power. Inside the electronic device, the wire can exist, for example, in the form of a cable and / or wiring on a circuit board. In various embodiments, the electronic device can include a flat cable (e.g., a flexible flat cable (FFC) implemented as a flexible printed circuit board (FPCB)) in order to minimize the size (e.g., thickness) of the electronic device.

[0003] An electronic device can include an antenna for wireless communication and a wireless communication module configured to perform a communication operation in a radio frequency band through the antenna. The wireless communication module and the antenna can be connected to each other through the above-described wire (e.g., a flexible circuit board). For example, a contact terminal is provided at the end of the wire, and the contact terminal and the antenna are in contact with each other, such that the antenna and the wireless communication module are electrically connected to each other through the wire. SUMMARY

[0004] TECHNICAL SOLUTION As components (e.g., a camera) provided in an electronic device become larger and the internal space of the electronic device becomes tighter, it becomes increasingly difficult to connect an antenna and a wireless communication module through a printed circuit board. Accordingly, when a high-flexibility circuit board or a flexible flat cable having a relatively small thickness is connected to the antenna, repulsive force applied to the antenna by a contact member (e.g., a C-clip terminal) can cause the contact member or the flexible circuit board to be pushed out and moved. Accordingly, electrical contact between the contact member and the antenna deteriorates, such that the quality of a signal transmitted or received by the wireless communication module through the antenna can be degraded.

[0005] Various embodiments disclosed herein can provide an electronic device having improved electrical connection between a communication module and an antenna and more efficient use of the internal space of the electronic device.

[0006] The technical tasks to be achieved by the present disclosure can not be limited to the above technical tasks and other technical tasks not mentioned below can be understood by those skilled in the art to which the present disclosure pertains, from the following description.

[0007] An electronic device according to various embodiments of the disclosure can include a frame including at least one antenna and having a metal material and a polymer material, a front plate coupled to the frame, a rear plate coupled to the frame in a direction opposite to the front plate, at least one electronic component disposed at least partially in an internal space defined by the frame, the front plate, and the rear plate, a printed circuit board disposed in the internal space, a flexible printed circuit board having a first end portion and a second end portion, wherein the first end portion is electrically connected to the printed circuit board, the second end portion extends adjacent to the at least one antenna, and a contact member disposed in the second end portion of the flexible printed circuit board, electrically contacts the at least one antenna, and is oriented to apply an elastic force in a direction parallel to a surface of the flexible printed circuit board. The flexible printed circuit board can extend along one surface of the electronic component within the internal space, and include a protruding portion formed by increasing a width of the flexible printed circuit board in a region adjacent to the second end portion.

[0008] Advantageously, when a reaction force is applied to the flexible printed circuit board, the protruding portion limits, reduces, or prevents movement of the flexible printed circuit board. Accordingly, the flexible printed circuit board is maintained in substantially the same position, and thus, electrical contact of the contact member with the at least one antenna is not deteriorated, or is deteriorated only to a minimum extent. Accordingly, when the electronic device includes the protruding portion, electrical contact of the contact member with the at least one antenna is better compared to an electronic device that does not include the protruding portion.

[0009] In various embodiments, the frame can include a side frame located on a side surface of the electronic device and including a plurality of metal segments and a polymer injection portion coupled to the metal segments, and a support member coupled to the side frame and extending from the side frame to an inside of the electronic device, wherein the at least one antenna is at least one of the plurality of metal segments.

[0010] In various embodiments, the flexible printed circuit board can extend through a portion between the support member and one surface of the electronic component.

[0011] In various embodiments, the support member can include a snap protrusion, wherein the snap protrusion is formed to allow the protruding portion to be snapped in a region of the support member corresponding to the protruding portion through the snap protrusion.

[0012] In various embodiments, the electronic device can include a fixing member, wherein the fixing member is located in a first direction perpendicular to a surface of the flexible printed circuit board from the contact member and is configured to fix the contact member with respect to the first direction. When the contact member is in contact with the at least one antenna and the protruding portion prevents or reduces movement of the flexible printed circuit board caused by a reaction force of the contact, the flexible printed circuit board can be bent, curved, or moved in a direction perpendicular to the reaction force (and thus perpendicular to the surface of the flexible printed circuit board). Advantageously, the fixing member prevents such movement of the flexible circuit board in the direction perpendicular to the surface of the flexible printed circuit board. Thus, the flexible circuit board is at least substantially maintained in the same position, so that the electrical contact of the flexible circuit board with other components of the electronic device remains stable.

[0013] In various embodiments, the electronic assembly can include a flange, wherein the flange extends in the first direction with respect to the fixing member, and the flange can fix the fixing member with respect to the first direction.

[0014] In various embodiments, the fixing member can include a flange groove, wherein the flange groove has a shape corresponding to the flange, and the flange can be inserted into the flange groove.

[0015] In various embodiments, the side frame can include a fixing groove, wherein the fixing groove is formed in an area where the contact member is in contact with the at least one antenna and has a shape at least partially corresponding to the fixing member, and the fixing member can be fixed by being inserted into the fixing groove.

[0016] In various embodiments, the fixing member can be sized such that the fixing member is fixedly fitted in an inner surface of the fixing groove by interference fitting.

[0017] In various embodiments, the fixing groove can be formed by partially removing a polymer material in an area where the contact member is in contact with the at least one antenna to expose a surface of the antenna facing an inside of the electronic device, and the fixing member can be configured to enhance rigidity of the area where the polymer material has been partially removed by interference fitting the fixing member to an inner surface of the fixing groove.

[0018] In various embodiments, the electronic device can include an adhesive member, wherein the adhesive member is located between the fixing member and the contact member, is adhered to the fixing member and the contact member, and has an elastic material.

[0019] In various embodiments, the flexible printed circuit board can extend through a portion between the rear plate and one surface of the electronic assembly facing the rear plate.

[0020] In various embodiments, the flexible printed circuit board can extend through a portion between the side frame and one surface of the electronic assembly facing the side frame.

[0021] In various embodiments, the side frame can have a polygonal shape, and the flexible printed circuit board can extend along one side of the polygonal shape. The second end of the flexible printed circuit board can be located at a corner portion of the polygonal shape of the side frame, and the contact member can be oriented to apply an elastic force to a surface of another side of the polygonal shape that meets the one side at the corner portion.

[0022] An electronic device according to various embodiments of the disclosure can include a housing including at least one metal segment and having an internal space, wherein the at least one metal segment is disposed on a side surface of the housing; a support member extending from the side surface of the housing into the internal space; at least one electronic component disposed at least partially in the internal space; a wireless communication module located in the internal space; a flexible printed circuit board having a first end electrically connected to the wireless communication module and a second end extending adjacent to at least one antenna; and a contact member disposed in the second end of the flexible printed circuit board, in electrical contact with the at least one antenna, and oriented to apply an elastic force in a direction parallel to a surface of the flexible printed circuit board.

[0023] The flexible printed circuit board can extend between the support member and one surface of the electronic component facing the support member, such that the second end is adjacent to the metal segment, and include a protruding portion formed by increasing a width of a portion of the flexible printed circuit board adjacent to the second end, and the support member can include a snap protrusion, wherein the snap protrusion is located in an area corresponding to the protruding portion and formed to allow the protruding portion to be caught by the snap protrusion.

[0024] In various embodiments, the electronic device can include a fixing member, wherein the fixing member is located in a first direction perpendicular to a surface of the flexible printed circuit board from the contact member, and configured to fix the contact member with respect to the first direction.

[0025] In various embodiments, the electronic component can include a flange, wherein the flange extends in the first direction with respect to the fixing member, and the flange can fix the fixing member with respect to the first direction.

[0026] In various embodiments, the housing can include a fixing groove, wherein the fixing groove is formed in an area where the contact member is in contact with the at least one antenna, and has a shape at least partially corresponding to the fixing member. The fixing member can be fixed by being inserted into the fixing groove.

[0027] In various embodiments, the fixing member can be sized such that the fixing member is fixedly fitted in an inner surface of the fixing groove by interference fitting.

[0028] A flexible printed circuit board according to various embodiments of the disclosure is a flexible printed circuit board of an electronic device, and the electronic device can include a housing including at least one metal segment and having an internal space, wherein the at least one metal segment is disposed on a side surface of the housing, a support member extending from the side surface of the housing into the internal space, a wireless communication module located in the internal space, and a snap protrusion formed in a region of the support member adjacent to the metal segment. The flexible printed circuit board can include a connector disposed in a first end portion of the flexible printed circuit board and configured to be electrically connected to the communication module, a contact member disposed in a second end portion of the flexible printed circuit board and including a pin, wherein the pin is configured to apply an elastic force in a direction parallel to a surface of the flexible printed circuit board, and a protrusion portion, wherein the protrusion portion is formed by increasing a width of a region of the flexible printed circuit board adjacent to the second end portion and is formed to be caught by the snap protrusion.

[0029] Various embodiments disclosed herein can provide an electronic device in which a wireless communication module and an antenna are connected to each other through a flexible printed circuit board to efficiently use an internal space of the electronic device. A protrusion portion formed on a distal end of the flexible printed circuit board restricts pushing of the flexible printed circuit board in order to maintain good electrical contact between the antenna and the contact member.

[0030] Furthermore, effects obtainable or expected due to various embodiments of the present document can be directly or implicitly disclosed in the detailed description of embodiments of the present document. BRIEF DESCRIPTION OF DRAWINGS

[0031] With regard to the description of the drawings, the same or similar components can be designated by the same or similar reference numerals.

[0032] Figure 1 is a block diagram of an electronic device in a network environment according to an embodiment; Figure 2 is a front perspective view of an electronic device according to an embodiment; Figure 3 is a rear perspective view of an electronic device according to an embodiment; Figure 4 is an exploded perspective view of an electronic device according to an embodiment; Figure 5a is an exploded perspective view of a portion of an electronic device according to various embodiments; Figure 5b is a cross-sectional view of an electronic device according to various embodiments; Figure 6a is a perspective view illustrating a flexible printed circuit board according to various embodiments; Figure 6b is a perspective view illustrating a contact member according to various embodiments; Figure 6c is a front view illustrating a contact member according to various embodiments; Figure 6d is a side view illustrating a contact member according to various embodiments; Figure 7a is a plan view illustrating a frame and a flexible printed circuit board according to various embodiments of the disclosure; Figure 7b is a cross-sectional view illustrating a frame and a flexible printed circuit board according to various embodiments of the disclosure; Figure 8a is a perspective view of an electronic device according to various embodiments; Figure 8b is a cross-sectional view of an electronic device according to various embodiments; Figure 8c is a perspective view of a fixing member according to various embodiments; Figure 8d is a perspective view of an electronic device according to various embodiments; Figure 8e is a cross-sectional view of an electronic device according to various embodiments; Figure 9a is a cross-sectional view of an electronic device according to various embodiments; and Figure 9b is an internal plan view of an electronic device according to various embodiments. DETAILED DESCRIPTION

[0033] Hereinafter, various embodiments of the present document are described with reference to the accompanying drawings.

[0034] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Referring to Figure 1The electronic device 101 in the network environment 100 can communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 can include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one (e.g., the connection terminal 178) of the above components can be omitted from the electronic device 101, or one or more other components can be added in the electronic device 101. In some embodiments, some of the above components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) can be implemented as a single integrated component (e.g., the display module 160). The processor 120 can execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120, and can perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 120 can store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store processed results in the non-volatile memory 134. According to an embodiment, the processor 120 can include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 can be adapted to consume less power than the main processor 121, or to be specialized for a specific function. The auxiliary processor 123 can be implemented as separate from, or as part of the main processor 121.

[0035] The auxiliary processor 123 (not the main processor 121) can control at least some of the functions or status related to at least one component (for example, the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, while the main processor 121 is in an inactive (for example, sleep) state, or the auxiliary processor 123 can control at least some of the functions or status related to at least one component (for example, the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101, together with the main processor 121, while the main processor 121 is in an active state (for example, executing an application). According to an embodiment, the auxiliary processor 123 (for example, an image signal processor or a communication processor) can be implemented as a part of another component (for example, the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (for example, a neural processing unit) can include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model can be generated through machine learning. For example, such learning can be performed by the electronic device 101 where artificial intelligence is performed or via a separate server (for example, the server 108). The learning algorithm can include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple artificial neural network layers. The artificial neural network can be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model can include a software structure other than the hardware structure. The memory 130 can store various data used by at least one component (for example, the processor 120 or the sensor module 176) of the electronic device 101. The various data can include, for example, software (for example, a program 140) and input data or output data for commands related thereto. The memory 130 can include the volatile memory 132 or the non-volatile memory 134. The program 140 can be stored in the memory 130 as software, and can include, for example, an operating system (OS) 142, middleware 144, or an application 146. The input module 150 can receive a command or data, which is to be used by other components (for example, the processor 120) of the electronic device 101, from the outside (for example, a user) of the electronic device 101. The input module 150 can include, for example, a microphone, a mouse, a keyboard, a key (for example, a button), or a digital pen (for example, a stylus pen).

[0036] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing record. The receiver can be used to receive an incoming call. According to an embodiment, the receiver can be implemented as separate from the speaker, or can be implemented as part of the speaker.

[0037] The display module 160 can visually provide information to the outside (e.g., a user) of the electronic device 101. The display module 160 can include, for example, a display, a hologram device, or a projector and a control circuit for controlling a corresponding one of the display, the hologram device, and the projector. According to an embodiment, the display module 160 can include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.

[0038] The audio module 170 can convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 can obtain sound through the input module 150, or output sound through the sound output module 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.

[0039] The sensor module 176 can detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 can include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. The interface 177 can support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 can include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0040] The connection terminal 178 can include a connector through which the electronic device 101 can be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connection terminal 178 can include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module 179 can convert electrical signal into a mechanical stimulus (e.g., a vibration or movement) or electrical stimulus that can be recognized by a user via his tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 can include, for example, a motor, a piezoelectric element, or an electrical stimuluser.

[0042] The camera module 180 can capture still images or moving images. According to an embodiment, the camera module 180 can include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module 188 can manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0044] The battery 189 can supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 can include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

[0045] The communication module 190 can support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication between the electronic devices 101 and the external electronic device via the established communication channel. The communication module 190 can include one or more communication processors that are operable independently from the processor 120 (e.g., an application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 can include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a conventional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules can be implemented as a single component (e.g., a single chip) or can be implemented as separate components (e.g., separate chips) from each other. The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196. The wireless communication module 192 can support 5G networks and next-generation communication technologies (e.g., new radio (NR) access technology) after 4G networks. The NR access technology can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low-latency communications (URLLC). The wireless communication module 192 can support a high frequency band (e.g., a millimeter wave band) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for securing performance on a high frequency band, such as, for example, beamforming, massive multiple input multiple output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beamforming, or large scale antenna. The wireless communication module 192 can support various requirements designated in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 can support a peak data rate of eMBB (e.g., 20 Gbps or more) for implementation, a loss coverage (e.g., 164 dB or less) for mMTC implementation, or a U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC implementation.

[0046] The antenna module 197 can transmit or receive a signal or power to or from the outside (e.g., an external electronic device) of the electronic device 101. According to an embodiment, the antenna module 197 can include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a base (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 can include a plurality of antennas (e.g., array antennas). In this case, at least one antenna suitable for a communication scheme used in a communication network, such as the first network 198 or the second network 199, can be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Then, a signal or power can be transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to an embodiment, in addition to the radiating element, another component (e.g., a radio frequency integrated circuit (RFIC)) can additionally be formed as part of the antenna module 197.

[0047] According to various embodiments, the antenna module 197 can form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module can include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., a bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high frequency band (e.g., a millimeter wave band), and the plurality of antennas is disposed on a second surface (e.g., a top surface or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving a signal of the designated high frequency band.

[0048] At least some of the above-described components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicate information (e.g., commands or data) between them.

[0049] According to an embodiment, commands or data can be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. Each of the electronic devices 102 and 104 can be a device of a same type as or different from the electronic device 101. According to an embodiment, all or some of the operations to be executed by the electronic device 101 can be executed at one or more of the external electronic devices 102, 104, or server 108. For example, if the electronic device 101 is to automatically perform a function or a service or is to perform a function or a service in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, can request one or more of the external electronic devices to execute at least part of the function or the service. The one or more external electronic devices receiving the request can execute the at least part of the function or the service requested, or execute an additional function or an additional service related to the request, and transfer an execution result to the electronic device 101. The electronic device 101 can provide the execution result, with or without further processing of the execution result, as a part of a reply corresponding to the request. To this end, a cloud computing technique, a distributed computing technique, a mobile edge computing (MEC) technique, or a client-server computing technique can be used, for example. The electronic device 101 can use, for example, distributed computing or mobile edge computing to provide an ultra-low-latency service. In another embodiment, the external electronic device 104 can include an Internet of Things (IoT) device. The server 108 can be an intelligent server using machine learning and / or a neural network. According to an embodiment, the external electronic device 104 or the server 108 can be included in the second network 199. The electronic device 101 can be applied to a smart service (e.g., a smart home, a smart city, a smart car, or a health care) based on a 5G communication technique or an IoT-related technique.

[0050] An electronic device according to various embodiments can be one of various types of electronic devices. The electronic devices can include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.

[0051] It should be understood that various embodiments of the present disclosure and the terms used therein are not intended to limit technically described features to particular embodiments and include various changes, equivalents or replacements for corresponding embodiments. Descriptions of components in the drawings are intended to assist in easily understanding various embodiments and are not intended to limit the various embodiments. The singular forms are intended to include one or more of the plural forms unless the context clearly indicates otherwise. Each of the terms "comprise", "comprises", "comprising", "include", "includes", "including", "have", "has", "having", or variants thereof are used in the detailed description of the various embodiments, unless the context clearly indicates otherwise, are intended to mean that the object or subject-matter includes the content indicated along with any additional content. The term "or" is used in the inclusive sense (i.e., and / or) unless the context clearly indicates otherwise. The term "associated with", used in the context of a component, indicates a direct or indirect connection between the component and another component or changes between the components, unless the context clearly indicates otherwise.

[0052] As used in connection with the various embodiments of the present disclosure, the term "module" can include a unit implemented in hardware, software, or firmware, and can interchangeably be used with other terms, e.g., "logic", "logic block", "part", or "circuitry". The module can be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module can be implemented in a form of an application-specific integrated circuit (ASIC). Various embodiments as set forth herein can be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that are readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated as a special purpose machine to perform at least one function. The one or more instructions can include a code generated by a compiler or a code that forms at least a part of a language as provided in a high-level programming language. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave). However, the term "non-transitory" does not encompass data that is at least temporarily stored in the storage medium.

[0053] According to the embodiments, a method according to various embodiments of the disclosure can be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed online via an application store (e.g., PlayStore TM ). If the computer program product is distributed online, at least part of it can be temporarily stored or temporarily generated in a machine-readable storage medium such as a manufacturer's server, an application store's server, or a relay server.

[0054] According to various embodiments, each component (e.g., a module or a program) of the above-described components can include a single entity or multiple entities, and some of the multiple entities can be separately positioned in different components. According to various embodiments, one or more of the above-described components can be omitted, or one or more other components can be added. The components (e.g., modules or programs) can be integrated into a single component according to various embodiments. In such a case, the integrated component can still perform one or more functions of the corresponding one or more of the above-described components. According to various embodiments, operations performed by the module, the program, or another component can be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations can be executed in a different order or omitted, or one or more other operations can be added.

[0055] Figure 2 is a front perspective view of an electronic device 200 according to an embodiment. Figure 3 is a rear perspective view of the electronic device 200 according to an embodiment.

[0056] In various embodiments of the present document, for ease of explanation, a direction in which a display 301 included in the electronic device 200 is visually exposed (e.g., a +z-axis direction) is defined as a front surface, and a direction opposite thereto (e.g., a -z-axis direction) is defined as a rear surface.

[0057] Referring to Figure 2 and Figure 3 , the electronic device 200 (e.g., Figure 1The electronic device 101) can include a housing 210. The housing 210 can provide, for example, a front surface 210A of the electronic device 200, a rear surface 210B of the electronic device 200, and side surfaces 210C of the electronic device 200. In some embodiments, the housing 210 can refer to a structure including at least a portion of the front surface 210A, the rear surface 210B, and the side surfaces 210C. In embodiments, the housing 210 can include a front plate (or first plate) 201, a rear plate (or second plate) 202, and a side member (or side bezel structure) 203. The front surface 210A of the electronic device 200 can be provided by the front plate 201. The front plate 201 can be at least partially transparent, and can include, for example, a glass plate or a polymer plate including various coatings. The rear surface 210B of the electronic device 200 can be provided by the rear plate 202. The rear plate 202 can be substantially opaque, and can be formed of, for example, a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side member 203 can be combined with the front plate 201 and the rear plate 202, and can form (or provide) the side surfaces 210C of the electronic device 200. The side member 203 can include metal and / or polymer.

[0058] According to embodiments, the electronic device 200 can include at least one of a display 301, a first audio module 302, a second audio module 303, a third audio module 304, a sensor module 305, a front camera module 306, a plurality of rear camera modules (e.g., a first rear camera module 3071, a second rear camera module 3072, a third rear camera module 3073, and a fourth rear camera module 3074), a light emitting module 308, an input module 309, a first connection terminal module 310, and a second connection terminal module 311. In some embodiments, the electronic device 200 can omit at least one of the above-described components or include other components.

[0059] A display area (e.g., a screen display area or an active area) of the display 301 can be visually exposed through, for example, the front plate 201. In an embodiment, the electronic device 200 can be implemented such that the display area visible through the front plate 201 appears as large as possible (e.g., a large screen or a full screen). For example, the display 301 can be implemented to have an outer edge having substantially the same shape as that of the outer edge of the front plate 201. For another example, a distance between the outer edge of the display 301 and the outer edge of the front plate 201 can be formed to be substantially the same distance. In an embodiment, the display 301 can include a touch sensing circuit. In some embodiments, the display 301 can include a pressure sensor capable of measuring intensity (pressure) of a touch. In some embodiments, the display 301 can be incorporated into or placed adjacent to a digitizer (e.g., an electromagnetic induction panel), which is configured to detect a magnetic field type electronic pen (e.g., a stylus pen). In some embodiments, the display 301 can be implemented to include a digitizer.

[0060] The first audio module 302 can include, for example, a microphone located inside the electronic device 200 and a microphone hole provided on the side surface 210C of the electronic device 200 to correspond to the microphone. The location or the number of the audio module related to the microphone is not limited to the illustrated example and can vary. For another example, the electronic device 200 can include a microphone hole constructed on the rear surface 210B of the electronic device 200 and a microphone located inside the electronic device 200 to correspond to the microphone hole. In some embodiments, the electronic device 200 can include a plurality of microphones to detect a sound direction.

[0061] The second audio module 303 can include, for example, a first speaker located inside the electronic device 200 and a first speaker hole provided on the side surface 210C of the electronic device 200 to correspond to the first speaker. The third audio module 304 can include, for example, a second speaker located inside the electronic device 200 and a second speaker hole provided on the front surface 210A of the electronic device 200 to correspond to the second speaker. In an embodiment, the second speaker can include a receiver for a phone call, and the second speaker hole can be referred to as a receiver hole. The location or the number of the second audio module 303 or the third audio module 304 is not limited to the illustrated example and can vary. In some embodiments, the microphone hole and the speaker hole can be implemented as one single hole. In some embodiments, the second audio module 303 or the third audio module 304 can include a piezoelectric speaker without a speaker hole.

[0062] For example, the sensor module 305 can generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state. In an embodiment, the sensor module 305 can include an optical sensor located inside the electronic device 200 to correspond to the front surface 210A of the electronic device 200. The optical sensor can include, for example, a proximity sensor or an illumination sensor. The optical sensor can be aligned with an opening provided on the display 301. External light can reach the optical sensor through the opening and the front plate 201 of the display 301. In some embodiments, the optical sensor can be located on the rear surface of the display 301 or below or under the display 301, and can perform a related function without the location of the optical sensor being visually distinguished (or exposed). In some embodiments, the optical sensor can be aligned and located in a recess provided on the rear surface of the display 301. The optical sensor can be disposed to overlap at least a portion of the screen (or display area), and perform its sensing function without being visually exposed. In this case, the partial area of the display 301 that overlaps at least partially with the optical sensor can include a different pixel structure and / or wiring structure compared to other areas. For example, the partial area of the display 301 that overlaps at least partially with the optical sensor can have a different pixel density compared to other areas. In some embodiments, a plurality of pixels can not be arranged in the partial area of the display 301 that overlaps at least partially with the optical sensor. In some embodiments, the electronic device 200 can include a biometric sensor (for example, a fingerprint sensor) located on the rear surface of the display 301 or below or under the display 301. The biometric sensor can be implemented as an optical sensor, an electrostatic sensor, or an ultrasonic sensor, and its location or number can vary. The electronic device 200 can further include at least one of various other sensor modules such as a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a temperature sensor, or a humidity sensor.

[0063] For example, the front camera module 306 can be located inside the electronic device 200 to correspond to the front surface 210A of the electronic device 200. For example, a plurality of rear camera modules 3071, 3072, 3073, and 3074 can be located inside the electronic device 200 to correspond to the rear surface 210B of the electronic device 200. The front camera module 306 and / or the rear camera modules 3071, 3072, 3073, or 3074 can include one or more lenses, image sensors, and / or image signal processors. The location or number of the camera modules is not limited to the illustrated examples and can vary.

[0064] According to an embodiment, the display 301 can include an opening aligned with the front camera module 306. External light can reach the front camera module 306 through the opening of the display 301 and the front plate 201. The opening of the display 301 aligned with or overlapping the front camera module 306 can be provided in the form of a recess. In some embodiments, the opening of the display 301 aligned with or overlapping the front camera module 306 can be provided in the form of a hole. In some embodiments, the front camera module 306 can be located on a rear surface of the display 301 or below or under the display 301, and the front camera module 306 can perform a related function (e.g., image capture) without the location of the front camera module 306 being visually distinguished (or exposed). The front camera module 306 can include, for example, a hidden display rear camera (e.g., an under-display camera (UDC)). In some embodiments, the front camera module 306 can be aligned and located in a recess provided on the rear surface of the display 301. The front camera module 306 can be disposed to overlap at least a portion of a screen (or display area) so as to obtain an image of an external object without being visually exposed to the outside. In this case, the portion area of the display 301 at least partially overlapping the front camera module 306 can include a different pixel structure and / or wiring structure compared to other areas. For example, the portion area of the display 301 at least partially overlapping the front camera module 306 can have a different pixel density compared to other areas. The pixel structure and / or wiring structure provided in the portion area of the display 301 at least partially overlapping the front camera module 306 can reduce light loss between the outside and the front camera module 306. In some embodiments, pixels can not be provided in the portion area of the display 301 at least partially overlapping the front camera module 306. In some embodiments, the electronic device 200 can further include a light emitting module (e.g., a light source) located inside the electronic device 200 to correspond to the front surface 210A of the electronic device 200. For example, the light emitting module can provide status information of the electronic device 200 in the form of light. In some embodiments, the light emitting module can provide a light source linked to the operation of the front camera module 306. The light emitting module can include, for example, an LED, an IR LED, or a xenon lamp.

[0065] According to an embodiment, when viewed from above the rear plate 202 (e.g., when viewed in the +z-axis direction), the rear plate 202 can include a plurality of openings corresponding one-to-one to the plurality of rear camera modules 3071, 3072, 3073, and 3074. The plurality of rear camera modules 3071, 3072, 3073, and 3074 can be placed through the plurality of openings of the rear plate 202. In some embodiments, the rear plate 202 can be implemented to include a substantially transparent light-transmissive area in place of the plurality of openings corresponding to the plurality of rear camera modules 3071, 3072, 3073, and 3074. In an embodiment, the plurality of rear camera modules 3071, 3072, 3073, and 3074 can have different attributes (e.g., angles of view) or functions, and can include, for example, a dual camera or a triple camera. The plurality of rear camera modules 3071, 3072, 3073, and 3074 can include a plurality of camera modules including lenses having different angles of view, and the electronic device 200 can be implemented to change the angle of view of the camera module performed by the electronic device 200 based on a user's selection. The plurality of rear camera modules 3071, 3072, 3073, and 3074 can include at least one of a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an infrared (IR) camera (e.g., a time-of-flight (TOF) camera or a structured light camera). In some embodiments, the IR camera can operate as at least a part of a sensor module.

[0066] According to an embodiment, when viewed from above the rear plate 202, the rear plate 202 can include an opening corresponding to the light emitting module 308. The light emitting module 308 can be placed through the opening of the rear plate 202. In some embodiments, the rear plate 202 can be implemented to include a substantially transparent light-transmissive area in place of the opening corresponding to the light emitting module 308. The light emitting module 308 can include a light source (e.g., a flash) for the plurality of rear camera modules 3071, 3072, 3073, and 3074. The light emitting module 308 can include, for example, an LED or a xenon lamp.

[0067] The input module 309 can include, for example, one or more key input devices. For example, the one or more key input devices can be located in an opening provided on the side surface 210C of the electronic device 200. In some embodiments, the electronic device 200 can not include some or all of the key input devices, and can implement the excluded key input devices as soft keys by using the display 301. The location or number of the input module 309 can vary, and in some embodiments, the input module 309 can include at least one sensor module.

[0068] The first connection end module (e.g., a first connector module or a first interface end module) 310 can include, for example, a first connector (or a first interface end) located inside the electronic device 200 and a first connector hole provided on the side surface 210C of the electronic device 200 to correspond to the first connector. The electronic device 200 can transmit power and / or data to an external electronic device electrically connected to the first connector and / or receive power and / or data from the external electronic device electrically connected to the first connector. In an embodiment, the first connector can include a universal serial bus (USB) connector or a high-definition multimedia interface (HDMI) connector. In some embodiments, the electronic device 200 can further include another connection end module including an audio connector (e.g., a headphone connector or an earplug connector). The second connection end module (e.g., a second connector module or a second interface end module) 311 can be used to mount an external storage medium (e.g., a SIM card or a memory card) to the electronic device 200. The second connection end module 311 can include, for example, a second connector (or a second interface end) located inside the electronic device 200 and a second connector hole provided on the side surface 210C of the electronic device 200 to correspond to the second connector. The second connection end module 311 can include a cover located (e.g., fitted) in the second connector hole and forming a part of the side surface 210C of the electronic device 200. In an embodiment, the second connection end module 311 can include a tray (or an adapter) (e.g., a SIM tray) for electrically or mechanically connecting the external storage medium to the second connector. The external storage medium can be disposed on the tray to be inserted into the second connector hole, and the external storage medium can be electrically connected to the second connector. In some embodiments, the tray can be connected to the cover. The location or the number of the connection end modules is not limited to the illustrated example and can vary.

[0069] Figure 4 is an exploded perspective view of the electronic device 200 according to an embodiment.

[0070] Referring to Figure 4 In an embodiment, the electronic device 200 can include the front plate 201, the rear plate 202, the side member 203, the first support member 410, the second support member 420, the third support member 430, the display 301, the first plate assembly 440, the second plate assembly 450, the battery 460, the antenna structure 470, the first adhesive member 480, and / or the second adhesive member 490. In some embodiments, the electronic device 200 can omit some of the above-described components or include other components.

[0071] According to an embodiment, the side member 203 may include a first side portion (or first frame portion) 2031, a second side portion (or second frame portion) 2032, a third side portion (or third frame portion) 2033, and / or a fourth side portion (or fourth frame portion) 2034. When viewed from above the front panel 201 (e.g., when viewed in the -z-axis direction), the first side portion 2031 and the second side portion 2032 may be positioned spaced apart from each other in a first direction (e.g., the y-axis direction) and may be substantially parallel to each other. The first side portion 2031 may provide a first side surface 210C corresponding to the +y-axis direction of the electronic device 200, and the second side portion 2032 may provide a second side surface 210C corresponding to the -y-axis direction of the electronic device 200. The third side portion 2033 may connect one end of the first side portion 2031 and one end of the second side portion 2032. The fourth side portion 2034 may connect the other end of the first side portion 2031 and the other end of the second side portion 2032. When viewed from above the front panel 201, the third side portion 2033 and the fourth side portion 2034 can be positioned spaced apart from each other in a second direction perpendicular to the first direction (e.g., the x-axis direction) and can be substantially parallel to each other. The third side portion 2033 can provide a third side surface of side surface 210C corresponding to the +x-axis direction of the electronic device 200, and the fourth side portion 2034 can provide a fourth side surface of side surface 210C corresponding to the -x-axis direction of the electronic device 200. The corners connecting the first side portion 2031 and the third side portion 2033, the corners connecting the first side portion 2031 and the fourth side portion 2034, the corners connecting the second side portion 2032 and the third side portion 2033, and / or the corners connecting the second side portion 2032 and the fourth side portion 2034 can be implemented with smooth curved shapes.

[0072] According to an embodiment, the side member 203 may include a plurality of insulating portions 403 and a plurality of conductive portions separated from each other by the plurality of insulating portions 403. The side surface 210C of the electronic device 200 (see reference) Figure 2 The side surface 210C may be provided by a plurality of conductive portions and a plurality of insulating portions 403. The side surface 210C may include a first region provided by a plurality of conductive portions included in the side member 203. The side surface 210C may include a second region provided by a plurality of insulating portions 403 included in the side member 203. The first and second regions of the side surface 210C may be smoothly connected without a significant height difference. In various embodiments, the plurality of conductive portions included in or disposed on the side member 203 may be electrically connected to communication circuitry included in the first board assembly 440 or the second board assembly 450 (e.g., Figure 1 The wireless communication module 192 is used as an antenna radiator.

[0073] According to an embodiment, the first support member 410 can be located inside the electronic device 200 and connected to the side member 203, or can be integrally configured with the side member 203. The first support member 410 can be formed of, for example, a metal material and / or a non-metal material (e.g., a polymer).

[0074] According to an embodiment, an element including the first support member 410 and the side member 203 can be referred to as a front case 40. Electronic components such as the display 301, the first board assembly 440, the second board assembly 450, or the battery 460 or various members associated with the electronic components can be disposed on or supported by the front case 40 or the first support member 410. The front case 40 or the first support member 410 can be included in the electronic device 200 to withstand a load and thus contribute to the durability or rigidity (e.g., torsional rigidity) of the electronic device 200. In some embodiments, the front case 40 or the first support member 410 can be referred to by various other terms such as "first frame," "first frame structure," or "first chassis." The first support member 410 is an internal structure located in an internal space of the electronic device 200. In some embodiments, the first support member can be referred to by various other terms such as "bracket," "first support," or "first support structure." In some embodiments, the first support member 410 can be interpreted as a part of the housing 210 (refer to FIG. 2). In various embodiments, the front case 40 can have a metal material and a polymer material, and a polymer or a polymer composite is injected into a metal part formed of the metal material so that the front case can be formed such that the metal material and the polymer material are adhered to each other. Figure 2

[0075] According to an embodiment, at least one conductive part included in the first support member 410 can serve as electromagnetic shielding and / or grounding for the display 301, the first board assembly 440, and / or the second board assembly 450.

[0076] For example, the display 301 can be located between the first support member 410 and the front plate 201 and can be disposed on a surface of the first support member 410 facing the front plate 201. In an embodiment, the display 301 can be bonded to the front plate 201 by using an optically transparent adhesive member such as an optical clear adhesive (OCA), an optical clear resin (OCR), or a super view resin (SVR). For example, the first board assembly 440 and the second board assembly 450 can be located between the first support member 410 and the rear plate 202 and can be disposed on a surface of the first support member 410 facing the rear plate 202. For example, the battery 460 can be located between the first support member 410 and the rear plate 202 and can be disposed in the first support member 410.

[0077] ​According to an embodiment, the first board assembly 440 can include a first printed circuit board 441 (e.g., a printed circuit board (PCB) or a printed circuit board assembly (PBA)). The first board assembly 440 can include various electronic components electrically connected to the first printed circuit board 441. The electronic components can be disposed on the first printed circuit board 441 or can be electrically connected to the first printed circuit board 441 through an electrical path such as a cable or a flexible printed circuit board (FPCB). Referring to Figure 2 and Figure 3 The electronic components can include, for example, a second speaker included in the third audio module 304, the sensor module 305, the front camera module 306, the plurality of rear camera modules 3071, 3072, 3073, and 3074, the light emitting module 308, or the input module 309.

[0078] According to an embodiment, when viewed from above the front plate 201 (e.g., when viewed in the -z-axis direction), the second board assembly 450 can be disposed to be spaced apart from the first board assembly 440 by the battery 460 interposed between the second board assembly 450 and the first board assembly 440. The second board assembly 450 can include a second printed circuit board 451 electrically connected to the first printed circuit board 441 of the first board assembly 440. The second board assembly 450 can include various electronic components electrically connected to the second printed circuit board 451. The electronic components can be disposed on the second printed circuit board 451 or can be electrically connected to the second printed circuit board 451 through an electrical path such as a cable or an FPCB. Referring to Figure 2 and Figure 3 The electronic components can include, for example, a microphone included in the first audio module 302, a first speaker included in the second audio module 303, a first connector included in the first connection end module 310, or a second connector included in the second connection end module 311.

[0079] According to some embodiments, the first board assembly 440 or the second board assembly 450 can include a primary PCB (or main PCB or main PCB), a secondary PCB (or slave PCB) disposed to partially overlap the primary PCB, and / or an interposer substrate between the primary PCB and the secondary PCB.

[0080] The battery 460 is a device for supplying power to at least one component of the electronic device 200 and can include, for example, a primary cell that is not rechargeable, a secondary cell that is rechargeable, or a fuel cell. The battery 460 can be integrally disposed inside the electronic device 200. In some embodiments, the battery 460 can be attached to or detached from the electronic device 200.

[0081] According to an embodiment, the third support member 430 can be located between the first support member 410 and the rear plate 202, and be coupled to the first support member 410 and / or the first plate assembly 440 by using fastening elements such as screws (or bolts). At least a portion of the first plate assembly 440 can be located between the first support member 410 and the third support member 430, and the third support member 430 can cover and protect the first plate assembly 440. The second support member 420 can be placed to be at least partially spaced apart from the third support member 430 by the battery 460 interposed therebetween, when viewed from above the rear plate 202 (for example, when viewed in the +z-axis direction). The second support member 420 can be located between the first support member 410 and the rear plate 202, and be coupled to the first support member 410 and / or the second plate assembly 450 by using fastening elements such as screws (or bolts). At least a portion of the second plate assembly 450 can be located between the first support member 410 and the second support member 420, and the second support member 420 can cover and protect the second plate assembly 450. The second support member 420 and / or the third support member 430 can be formed of a metal material and / or a non-metal material (for example, a polymer). In some embodiments, the third support member 430 can serve as an electromagnetic shield for the first plate assembly 440, and the second support member 420 can serve as an electromagnetic shield for the second plate assembly 450. In some embodiments, the second support member 420 and / or the third support member 430 can be referred to as a "rear case". In some embodiments, the second support member 420 can be referred to by various other terms such as a "second support" or a "second support structure", and the third support member 430 can be referred to by various other terms such as a "third support" or a "third support structure". In some embodiments, the second support member 420 and / or the third support member 430 can be interpreted as a part of the housing 210 (refer to Figure 2 ).

[0082] According to an embodiment, at least one conductive portion included in or disposed in the second support member 420 can serve as an antenna radiator electrically connected to a communication circuit (for example, the wireless communication module 192) included in the first plate assembly 440 or the second plate assembly 450. Figure 1

[0083] According to an embodiment, at least one conductive portion included in or disposed in the third support member 430 can serve as an antenna radiator electrically connected to a communication circuit (for example, the wireless communication module 192) included in the first plate assembly 440 or the second plate assembly 450. Figure 1

[0084] ​​According to some embodiments, an integrated plate assembly including the first plate assembly 440 and the second plate assembly 450 can be implemented. For example, when viewed from above the back plate 202 (e.g., when viewed in the +z-axis direction), the plate assembly can include a first part, a second part, and a third part, where the first part and the second part are placed to be spaced apart from each other by the battery 460 interposed between the first part and the second part, and the third part extends between the battery 460 and the side member 203 and connects the first part and the second part. The third part can be implemented substantially rigidly. In some embodiments, the third part can be implemented to be substantially flexible. In some embodiments, an integrated support member including the second support member 420 and the third support member 430 can be implemented.

[0085] According to embodiments, the antenna structure 470 can be located between the third support member 430 and the back plate 202. In some embodiments, the antenna structure 470 can be located between the battery 460 and the back plate 202. The location of the antenna structure 470 is not limited thereto and can vary. For example, the antenna structure 470 can be implemented in a film form such as an FPCB. The antenna structure 470 can include at least one conductive pattern serving as a loop-type radiator. For example, the at least one conductive pattern can include a planar-shaped spiral conductive pattern (e.g., a planar coil or a pattern coil). In embodiments, the at least one conductive pattern included in the antenna structure 470 can be electrically connected to a communication circuit (or a wireless communication circuit) included in the first plate assembly 440 (e.g., Figure 1 the wireless communication module 192). For example, the at least one conductive pattern can be used in short distance wireless communication such as near field communication (NFC). As another example, the at least one conductive pattern can be used for transmitting and / or receiving a magnetic signal in magnetic secure transmission (MST). In some embodiments, the at least one conductive pattern included in the antenna structure 470 can be electrically connected to a power transmission / reception circuit included in the first plate assembly 440. The power transmission / reception circuit can wirelessly receive power from an external electronic device or wirelessly transmit power to the external electronic device by using the at least one conductive pattern. The power transmission / reception circuit can include a power management module, and can include, for example, a power management integrated circuit (PMIC) or a charger integrated circuit (IC). The power transmission / reception circuit can charge the battery 460 by using power wirelessly received using the conductive pattern.

[0086] According to some embodiments, a processor electrically connected to a wireless communication circuit (e.g., Figure 1 the wireless communication module 192) can be implemented to perform a function of the wireless communication circuit. For example, the processor can be implemented to perform a function of the wireless communication module 192. As another example, the processor can be implemented to perform a function of the power transmission / reception circuit. Figure 1The processor (e.g., the processor 120 of the electronic device 200) can use the antenna structure 470 to perform a location determination function (e.g., angle of arrival (AOA)) for a signal source (e.g., a responder, a transmitter, or a transmitter (Tx) device). The processor can simultaneously perform a location determination of a measured angle (AOA) and a location determination of a measured distance (ranging). In an embodiment, the processor can identify (or estimate) a distance between the electronic device 200 and the signal source by using at least one antenna element (e.g., the first antenna element, the second antenna element, and / or the third antenna element) included in the antenna structure 470. In an embodiment, the processor can identify or estimate a reception angle (e.g., a direction of a signal) of a signal with respect to a set axis of the electronic device 200 by using at least one of a difference in arrival time of a response message to a request message, a difference in arrival distance between received signals, or a phase difference of at least two antenna elements included in the antenna structure 470. The electronic device 200 can support a location determination function by using a wideband bandwidth (e.g., ultra-wideband (UWB)). For example, UWB is a technology that complies with an international standard of IEEE 802.15.4, and can refer to a technology that performs communication with a wideband bandwidth. In an embodiment, the processor can identify or estimate a location of a signal source (e.g., a responder, a transmitter, or a Tx device) with respect to the electronic device 200 (e.g., an initiator, a receiver, or a receiver (Rx) device) by using a phase difference of signals received through a plurality of antenna elements included in the antenna structure 470. The antenna structure 470 can be implemented as a printed circuit board (e.g., a flexible printed circuit board (FPCB)), and can be, for example, a patch antenna including a plurality of patches (e.g., the first antenna element, the second antenna element, and the third antenna element).

[0087] According to an embodiment, the first adhesive member 480 can be located between the front plate 201 and the first support member 410, or between the front plate 201 and the side member 203. The front plate 201 can be coupled to the first support member 410 or the side member 203 by using the first adhesive member 480. For example, the first adhesive member 480 can be disposed in a ring shape adjacent to an edge (or a boundary) of the front plate 201. The first adhesive member 480 can be disposed in various other forms other than the example shown. In some embodiments, the first adhesive member 480 can include a plurality of adhesive members separated from each other. In this case, there can be a separate adhesive member or a filler member that connects the two adhesive members separated from each other.

[0088] According to an embodiment, the second adhesive member 490 can be located between the rear plate 202 and the first support member 410 or between the rear plate 202 and the side member 203. The rear plate 202 can be coupled to the first support member 410 or the side member 203 by using the second adhesive member 490. For example, the second adhesive member 490 can be provided in a ring shape adjacent to the edge (or boundary) of the rear plate 202. The second adhesive member 490 can be provided in various other forms other than the illustrated example. In some embodiments, the second adhesive member 490 can include a plurality of adhesive members separated from each other. In this case, there can be a separate adhesive member or a filler member connecting the two adhesive members separated from each other.

[0089] According to an embodiment, the first adhesive member 480 or the second adhesive member 490 can include a heat-reactive adhesive material, a light-reactive adhesive material, a general adhesive, or a double-sided tape.

[0090] The electronic device 100 or 200 according to various embodiments can include an electronic device such as a bar-type, a foldable-type, a rollable-type, a slide-type, a wearable-type, a tablet PC, and / or a laptop PC. The electronic device 100 or 200 according to various embodiments of the disclosure is not limited to the above-described examples, and can include various other electronic devices.

[0091] Figure 5a is an exploded perspective view of a part of an electronic device 500 according to various embodiments.

[0092] Figure 5b is a cross-sectional view of an electronic device 500 according to various embodiments.

[0093] Figure 5a is an exploded perspective view of a part A in Figure 3

[0094] Figure 5b is a cross-sectional view taken along the B-B direction of Figure 5a

[0095] Referring to Figure 5a and Figure 5b , the electronic device 500 can include a housing 510 (e.g., the housing 210 of Figure 2 to Figure 4 ), at least one printed circuit board 502 (e.g., the first board assembly 440 and / or the second board assembly 450 of Figure 4 ), electronic components, and a flexible printed circuit board 530. The housing 510 can be a component that provides an internal space for arranging components of the electronic device 500 and protects the components of the electronic device 500. The housing 510 can include a frame 540 (e.g., the front case 40 of Figure 4 ), a front plate 518 (e.g., the front plate 201 of Figure 2 to Figure 4 ), and a rear plate 519 (e.g.,​​Figure 2 to Figure 4 The rear panel 202). The frame 540 may include a side frame 541 (e.g., the side surface facing the x and y directions) that protects the side surface of the electronic device 500. Figure 4 The side member 203) and the support member 542 (e.g., extending from the side frame 541 into the interior space of the electronic device 500) Figure 4 The first support member 410. The side frame 541 may include a plurality of metal segments 5411 and a polymer injection portion 5412 configured to combine the plurality of metal segments 5411. The support member 542 may be a component extending from the side frame 541 and supporting internal components of the electronic device 500. The support member 542 may include polymer components and metal components.

[0096] The printed circuit board 502 can be a circuit board on which various electronic components of the electronic device 500 are arranged or electrically connected. In various embodiments, a wireless communication module (e.g., Figure 1 The wireless communication module 192 can be mounted on the printed circuit board 502.

[0097] In various embodiments, the electronic device 500 may include at least one antenna 508. The antenna 508 may be integrated with the housing 510 of the electronic device 500 to save or conserve internal space and improve the design of the electronic device 500. For example, at least one of a plurality of metal segments 5411 of the side frame 541 may serve as the antenna 508. For this purpose, the metal segment 5411 serving as the antenna 508 may be electrically connected to a communication module.

[0098] In various embodiments, electronic device 500 may include a flexible printed circuit board 530. Flexible printed circuit board 530 may include a flexible substrate and a conductor pattern attached to the surface of the substrate. Flexible printed circuit board 530 may be referred to as a flexible printed cable. In various embodiments, flexible printed circuit board 530 may electrically connect antenna 508 (i.e., metal segment 5411 of side frame 541) to printed circuit board 502 and / or wireless communication module. Because flexible printed circuit board 530 is more flexible and thinner than printed circuit board 502, it saves internal space in electronic device 500 compared to a situation where printed circuit board 502 extends to antenna 508 to connect wireless communication circuitry and antenna 508.

[0099] The electronic device 500 may include various electronic components 520 (such as a camera 520a). The camera 520a may include a camera housing 521, at least one optical element 522, and an image sensor.

[0100] In various embodiments, the flexible printed circuit board 530 can extend along one surface of the electronic component 520. In various embodiments, one surface of the electronic component 520 can face the support member 542, and the flexible printed circuit board 530 can extend between the one surface of the electronic component and the support member 542.

[0101] In various embodiments, a first end 530a (shown in Figure 6a ) of the flexible printed circuit board 530 can be connected to the printed circuit board 502, and a contact member 531 can be disposed in a second end 530b (shown in Figure 6a ) of the flexible printed circuit board. The contact member 531 can include a metallic material (e.g., copper, iron, stainless steel, brass, and / or aluminum alloy). The contact member 531 can be a member that forms electrical contact with a metallic segment 5411 (i.e., the antenna 508) of the side frame 541. In various embodiments, the electronic device 500 can include a fixing member 550 on the second end 530b of the flexible printed circuit board 530. The contact member 531 and the fixing member 550 will be described in greater detail later.

[0102] Figure 6a is a perspective view illustrating a flexible printed circuit board 530 according to various embodiments.

[0103] Figure 6b is a perspective view illustrating a contact member 531 according to various embodiments.

[0104] Figure 6c is a front view illustrating a contact member 531 according to various embodiments.

[0105] Figure 6d is a side view illustrating a contact member 531 according to various embodiments.

[0106] Referring to Figure 6a , in the flexible printed circuit board 530 according to various embodiments, a connector 539 can be disposed at a first end 530a, and a contact member 531 can be disposed at a second end 530b. The connector 539 can be a member configured to be connected to the printed circuit board 502 (and a wireless communication module disposed on the printed circuit board 502) of the electronic device 500. For example, the connector 539 can be configured to be inserted into and fixed to a socket disposed on the printed circuit board 502. The contact member 531 can be a member that forms electrical contact with the antenna 508 by applying an elastic force to a surface or a portion of the antenna 508.

[0107] In various embodiments, the protruding portion 538 formed by increasing the width (e.g., the size in the x-axis direction) of the cross-section of the flexible printed circuit board 530 can be constructed in a region adjacent to the second end portion 530b of the flexible printed circuit board 530. That is, the protruding portion 538 can be provided in a region of the flexible printed circuit board 530 close to the second end portion 530b of the flexible printed circuit board, in a region adjacent to the second end portion 530b of the flexible printed circuit board, or in a region within a predetermined distance from the second end portion 530b of the flexible printed circuit board. The protruding portion 538 can be provided in a region of the flexible printed circuit board a predetermined distance from the end of the second end portion 530b. The protruding portion 538 can be provided in a region of the flexible printed circuit board a predetermined distance from the contact member 531. The protruding portion 538 can be a region of the flexible printed circuit board whose width is greater than the width of most of the flexible printed circuit board 530. The protruding portion 538 can be a region of the flexible printed circuit board whose width is greater than the width of an adjacent region or regions of the flexible printed circuit board 530. The width of the protruding portion 538 can be at least 10%, 20%, 25%, 33%, or 50% greater than the width of an adjacent region of the flexible printed circuit board. The protruding portion 538 can appear as a protrusion in the width of the flexible printed circuit board. The additional width of the protruding portion 538 can extend equally or substantially equally from both sides of the flexible printed circuit board, such that the protruding portion 538 is substantially symmetrical with respect to the adjacent portions of the flexible printed circuit board 530. The width of the portions of the flexible printed circuit board 530 adjacent to the protruding portion 538 and on both sides of the protruding portion 538 can be the same or substantially the same. The protruding portion 538 can be a portion that limits movement of the flexible printed circuit board 530 due to the elastic force applied by the contact member 531. The role of the protruding portion 538 will be described in greater detail later.

[0108] Referring to Figure 6b to Figure 6d , the contact member 531 according to various embodiments can include a body portion 532, a contact point 533, a clip 534, and a lead 535. The contact point 533 can be a portion that contacts another electronic component 520 (e.g., the antenna 508) to form an electrical contact. The clip 534 can be a member configured to generate an elastic force by spring action and apply the elastic force such that the contact point 533 is in contact with another electronic component. The lead 535 can be a member fixed to the flexible printed circuit board 530 by a method such as soldering and formed to form an electrical connection. The body portion 532 can be a member that partially covers components such as the clip 534. The body portion 532 can be fixed to the fixing member 550 such that the contact member 531 can be fixed to the frame 540.

[0109] Figure 7a is a plan view illustrating the frame 540 and the flexible printed circuit board 530 according to various embodiments of the present disclosure.

[0110] Figure 7b is a cross-sectional view illustrating a frame 540 and a flexible printed circuit board 530 according to various embodiments of the present disclosure.

[0111] Figure 7b is a cross-sectional view taken along the C-C direction of Figure 7a .

[0112] According to Figure 7a and Figure 7b , the support member 542 of the frame 540 can include a snap protrusion 543 configured at a portion of the support member 542 corresponding to the protruding portion 538 of the flexible printed circuit board 530. For example, a surface of the support member 542 overlapping the protruding portion 538 of the flexible printed circuit board 530 is recessed in the z direction, or a peripheral portion of the area overlapping the protruding portion 538 protrudes in the -z direction, so that the snap protrusion 543 can be formed.

[0113] Since the contact member 531 applies an elastic force to the antenna 508, due to the reaction (Newton's third law), a reaction or a reaction force (F) is applied to the flexible printed circuit board 530, which can move the flexible printed circuit board 530 in a direction away from the antenna 508. This causes the contact member 531 on the flexible printed circuit board 530 to move away from the antenna 508, and thus the electrical connection between the contact member 531 and the antenna 508 is weakened. Accordingly, the elastic force applied by the contact member 531 to the antenna 508 to form electrical contact is weakened, and thus the electrical contact between the contact member 531 and the antenna 508 can become unstable or the contact resistance can increase. Therefore, the quality of the signal transmitted or received through the antenna 508 can be deteriorated. According to various embodiments of the present disclosure, since the protruding portion 538 of the flexible printed circuit board 530 is caught by the snap protrusion 543 and thus the movement of the flexible printed circuit board 530 is restricted, the contact member 531 can form electrical contact with the antenna 508 by an elastic force strong enough, and thus, the quality of the signal transmitted or received through the antenna 508 can be improved. That is, the snap protrusion 543 of the support member 542 catches or interacts with the protruding portion 538 of the flexible printed circuit board 530 to prevent or reduce the movement of the flexible printed circuit board 530 away from the antenna 508 due to the reaction force F. Accordingly, the contact member 531 maintains good contact with the antenna 508, and thus the quality of the signal transmitted or received through the antenna 508 can be improved.

[0114] Figure 8a is a perspective view of an electronic device 500 according to various embodiments.

[0115] Figure 8b is a cross-sectional view of an electronic device 500 according to various embodiments.

[0116] Figure 8c is a perspective view of a fixing member 550 according to various embodiments.

[0117] Figure 8d is a perspective view of an electronic device 500 according to various embodiments.

[0118] Figure 8e is a cross-sectional view of the electronic device 500 according to various embodiments.

[0119] Figure 8b the cross-section is a cross-section taken along the D-D direction of Figure 8a

[0120] Figure 8e the cross-section is a cross-section taken along the E-E direction of Figure 8d

[0121] Referring to Figure 8a to 8c , the electronic device 500 can include a fixing member 550. The fixing member 550 can be a member that restricts movement of the flexible printed circuit board 530 in a direction perpendicular to a surface of the flexible printed circuit board 530 (e.g., -z direction).

[0122] When the flexible printed circuit board 530 receives a reaction of the elasticity of the contact member 531 and movement of the flexible printed circuit board 530 in the reaction direction is restricted (e.g., by the protruding portion 538), the flexible printed circuit board 530 can move in a direction perpendicular to a surface of the flexible printed circuit board 530 due to the reaction. For example, a force that bends the flexible printed circuit board 530 can be generated. The fixing member 550 can prevent or reduce separation of the flexible printed circuit board 530 from its proper position by restricting such movement, and thus can stably maintain electrical contact between the contact member 531 and the antenna 508.

[0123] In various embodiments, the electronic component 520 (e.g., the camera 520a) can include a flange 524, wherein the flange 524 fixes the fixing member 550 in a direction perpendicular to a surface of the flexible printed circuit board 530 (e.g., -z direction). For example, the flange 524 can be disposed on the camera housing 521 of the camera 520a.

[0124] In various embodiments, the fixing member 550 can include a flange groove 551, and the flange 524 can be inserted into the flange groove 551. The flange groove 551 can be a groove formed in a surface of the fixing member 550 in a direction (e.g., -z direction) in which the fixing member 550 contacts the flange 524, having a shape corresponding to a shape of the flange 524. The flange 524 is inserted into the flange groove 551, such that separation of the fixing member 550 due to pressure of the flange 524 can be prevented or reduced.

[0125] ​​In various embodiments, the electronic device 500 can include an adhesive member 553 that binds the fixing member 550 and the contact member 531 to each other. The adhesive member 553 can fix the fixing member 550 and the contact member 531 to each other to restrict movement (e.g., tilting in the -z direction) of the contact member 531.

[0126] Referring to Figure 8d and Figure 8e , the side frame 541 can include a fixing recess 544. The fixing recess 544 can be a recess formed to have a shape corresponding to a shape of the fixing member 550 so that the fixing member 550 is inserted and fixed.

[0127] In various embodiments, the fixing recess 544 can be configured such that a polymer injection portion 5412 of the side frame 541 is partially removed (e.g., by machining such as drilling) to expose an inner surface of the metal segment 5411 inside the fixing recess 544, and the contact member 531 can form an electrical contact with the exposed inner surface of the metal segment 5411. Rigidity of the side frame 541 can be enhanced by inserting the fixing member 550 into the fixing recess 544. When a portion of the polymer injection portion 5412 of the side frame 541 is removed so that the metal segment 5411 and the contact member 531 contact each other, rigidity of the side frame 541 can be weakened, and rigidity of the side frame 541 can be enhanced by inserting the fixing member 550 into the fixing recess 544.

[0128] In various embodiments, the fixing member 550 can be fixedly fitted in the fixing recess 544 by interference fitting. For example, a width (W1) of the fixing member 550 can be greater than a width (W2) of the fixing recess 544. Accordingly, the fixing member 550 can be firmly fixed by a frictional force between the fixing member 550 and the fixing recess 544.

[0129] Figure 9a is a cross-sectional view of an electronic device 500 according to various embodiments.

[0130] Figure 9b is a cross-sectional view of an electronic device 500 according to various embodiments.

[0131] Referring to Figure 9a , electronic components of the electronic device 500 can be disposed such that one surface of the electronic components faces a rear plate of the electronic device 500, and the flexible printed circuit board 530 can extend along the one surface between the rear plate and the one surface of the electronic components 520 facing the rear plate so that the metal segment 5411 and the contact member 531 contact each other.

[0132] When a portion of the electronic component is disposed in close contact with the support member 542 and there is not enough space for the flexible printed circuit board 530 to pass between the support member 542 and the electronic component 520, the flexible printed circuit board 530 can pass between the electronic component 520 and the rear plate. In various embodiments, the snap protrusion 543 can be configured in a region of the rear plate corresponding to the protruding portion 538 of the flexible printed circuit board 530.

[0133] Referring to Figure 9b , the electronic component of the electronic device 500 can be disposed such that one surface (e.g., a side surface) of the electronic component faces the side frame 541 of the electronic device 500, and the flexible printed circuit board 530 can extend along the side frame 541 between the side frame 541 and the surface of the electronic component 520 facing the side frame 541.

[0134] In various embodiments, the side frame 541 can have a shape of a polygon (hereinafter, including a polygon with rounded corners), such as a quadrilateral shape. The flexible printed circuit board 530 can extend in a direction of one side of the polygon at a corner of the polygon. The second end portion 530b of the flexible printed circuit board 530 and the contact member 531 can be located at the corner. The contact member 531 can be in contact with another side of the polygon at the corner, which is in contact with the one side. In various embodiments, the snap protrusion 543 can be configured in a region of the side frame 541 corresponding to the protruding portion 538 of the flexible printed circuit board 530. When the flexible printed circuit board 530 extends along the side frame 541, a space in the thickness direction (z-axis direction) is not occupied, and thus the thickness of the electronic device 500 can be reduced.

[0135] An electronic device 500 according to various embodiments of the disclosure can include a frame 540 including at least one antenna 508 and having a metal material and a polymer material, a front plate 518 coupled to the frame 540, a rear plate 519 coupled to the frame 540 in a direction opposite to the front plate 518, at least one electronic component 520 disposed at least partially in an internal space defined by the frame 540, the front plate 518, and the rear plate 519, a printed circuit board 502 disposed in the internal space, a flexible printed circuit board 530 having a first end portion 530a and a second end portion 530b, wherein the first end portion 530a is electrically connected to the printed circuit board 502 and the second end portion 530b extends adjacent to the at least one antenna 508, and a contact member 531 disposed on the second end portion 530b of the flexible printed circuit board 530, in electrical contact with the at least one antenna 508, and oriented to apply an elastic force in a direction parallel to a surface of the flexible printed circuit board 530. The flexible printed circuit board 530 can extend along one surface of the electronic component 520 within the internal space and include a protruding portion 538 formed by increasing a width of the flexible printed circuit board 530 in a region adjacent to the second end portion 530b.

[0136] In various embodiments, the frame 540 can include a side frame 541 located on a side surface of the electronic device 500 and including a plurality of metal segments 5411 and a polymer injection portion 5412 coupled to the metal segments 5411, and a support member 542 coupled to the side frame 541 and extending from the side frame 541 to an inside of the electronic device 500. The at least one antenna 508 can be at least one of the plurality of metal segments 5411.

[0137] In various embodiments, the flexible printed circuit board 530 can extend through a portion between the support member 542 and the one surface of the electronic component 520.

[0138] In various embodiments, the support member 542 can include a snap protrusion 543 formed to allow the protruding portion 538 to be snapped in a region of the support member 542 corresponding to the protruding portion 538 through the snap protrusion 543.

[0139] In various embodiments, the electronic device 500 can include a fixing member 550 located in a first direction perpendicular to a surface of the flexible printed circuit board 530 from the contact member 531 and configured to fix the contact member 531 with respect to the first direction.

[0140] In various embodiments, the electronic component 520 can include a flange 524, wherein the flange 524 extends in a first direction with respect to the fixing member 550, and the flange 524 can fix the fixing member 550 with respect to the first direction.

[0141] In various embodiments, the fixing member 550 can include a flange recess 551, wherein the flange recess 551 has a shape corresponding to the flange 524, and the flange 524 can be inserted into the flange recess 551.

[0142] In various embodiments, the side frame 541 can include a fixing recess 544, wherein the fixing recess 544 is formed in an area where the contact member 531 contacts the at least one antenna 508, and has a shape corresponding at least partially to the fixing member 550, and the fixing member 550 can be fixed by being inserted into the fixing recess 544.

[0143] In various embodiments, the fixing member 550 can be sized such that the fixing member 550 is fixedly fitted in an inner surface of the fixing recess 544 by interference fitting.

[0144] In various embodiments, the fixing recess 544 can be formed by partially removing a polymer material in an area where the contact member 531 contacts the at least one antenna 508 to expose a surface of the antenna 508 facing an inside of the electronic device 500. The fixing member 550 can be configured to enhance rigidity of the area where the polymer material has been partially removed by interference fitting the fixing member 550 to an inner surface of the fixing recess 544.

[0145] In various embodiments, the electronic device 500 can include an adhesive member, wherein the adhesive member is located between the fixing member 550 and the contact member 531, is adhered to the fixing member 550 and the contact member 531, and has an elastic material.

[0146] In various embodiments, the flexible printed circuit board 530 can extend through a portion between the rear plate 519 and one surface of the electronic component 520 facing the rear plate 519.

[0147] In various embodiments, the flexible printed circuit board 530 can extend through a portion between the side frame 541 and one surface of the electronic component 520 facing the side frame 541.

[0148] In various embodiments, the side frame 541 can have a polygonal shape. The flexible printed circuit board 530 can extend along one side of the polygonal shape, the second end portion 530b of the flexible printed circuit board 530 can be located at a corner portion of the polygonal shape of the side frame 541, and the contact member 531 can be oriented to apply an elastic force to a surface of another side of the polygonal shape that meets the one side at the corner portion.

[0149] An electronic device 500 according to various embodiments of the disclosure can include a housing 510 including at least one metal segment 5411 disposed on a side surface thereof and having an internal space, a support member 542 extending from the side surface of the housing 510 into the internal space, at least one electronic component 520 disposed at least partially in the internal space, a wireless communication module located in the internal space, a flexible printed circuit board 530 having a first end portion 530a electrically connected to the wireless communication module and a second end portion 530b extending adjacent to at least one antenna 508, and a contact member 531 disposed in the second end portion 530b of the flexible printed circuit board 530, in electrical contact with the at least one antenna 508, and oriented to apply an elastic force in a direction parallel to a surface of the flexible printed circuit board 530.

[0150] The flexible printed circuit board 530 can extend between the support member 542 and one surface of the electronic component 520 facing the support member 542, such that the second end portion 530b is adjacent to the metal segment 5411, and include a protruding portion 538 formed by increasing a width of a portion of the flexible printed circuit board 530 adjacent to the second end portion 530b, and the support member 542 can include a snap protrusion 543 located in a region corresponding to the protruding portion 538 and formed to allow the protruding portion 538 to be caught by the snap protrusion 543. That is, the snap protrusion 543 is configured to abut or contact the protruding portion 538 to prevent the protruding portion 538 from moving past the snap protrusion 543.

[0151] In various embodiments, the electronic device 500 can include a fixing member 550 located in a first direction perpendicular to a surface of the flexible printed circuit board 530 from the contact member 531 and configured to fix the contact member 531 with respect to the first direction.

[0152] In various embodiments, the electronic component 520 can include a flange 524 extending in the first direction with respect to the fixing member 550, and the flange 524 can fix the fixing member 550 with respect to the first direction.

[0153] In various embodiments, the housing 510 can include a fixing groove 544 formed in a region in which the contact member 531 contacts the at least one antenna 508 and having a shape at least partially corresponding to the fixing member 550, and the fixing member 550 can be fixed by being inserted into the fixing groove 544.

[0154] In various embodiments, the fixing member 550 can be sized such that the fixing member 550 is fixedly fitted in the inner surface of the fixing groove 544 by interference fitting.

[0155] A flexible printed circuit board 530 according to various embodiments of the disclosure is a flexible printed circuit board 530 of an electronic device 500, and the electronic device 500 can include a housing 510 including at least one metal segment 5411 disposed on a side surface thereof and having an internal space, a support member 542 extending from the side surface of the housing 510 into the internal space, a wireless communication module located in the internal space, and a snap protrusion 543 formed in a region of the support member 542 adjacent to the metal segment 5411. The flexible printed circuit board 530 can include a connector 539 disposed in a first end portion 530a of the flexible printed circuit board 530 and configured to be electrically connected to the communication module, a contact member 531 disposed in a second end portion 530b of the flexible printed circuit board 530 and including a pin configured to apply an elastic force in a direction parallel to a surface of the flexible printed circuit board 530, and a protrusion portion 538, wherein the protrusion portion 538 is formed by increasing a width of a region of the flexible printed circuit board 530 adjacent to the second end portion 530b and is formed to be caught by the snap protrusion 543.

[0156] Furthermore, the embodiments disclosed in the specification and drawings are merely provided to offer specific examples in order to describe technical contents according to the embodiments disclosed in the present document and help understand the embodiments disclosed in the present document, and are not intended to limit the scope of the embodiments disclosed in the present document. Therefore, the scope of various embodiments disclosed in the present document should be interpreted as including all changes or modified forms based on the various embodiments disclosed in the present document in addition to the embodiments disclosed herein.

[0157] It will be understood that all the above-described embodiments and their technical features can be combined with each other in every combination unless there is a conflict between two embodiments or features. That is, every combination of two or more of the above-described embodiments is conceived and included in the present disclosure. One or more features from any embodiment can be incorporated into any other embodiment and provide a corresponding advantage.

Claims

1. An electronic device (500), comprising: The frame (540) includes at least one antenna (508) and comprises metallic and polymeric materials; The front panel (518) is attached to the frame (540). The rear panel (519) is attached to the frame (540) in the opposite direction to the front panel (518). At least one electronic component (520) is at least partially disposed in the interior space defined by the frame (540), the front panel (518) and the rear panel (519); A printed circuit board (502) is disposed in the internal space; A flexible printed circuit board (530) has a first end (530a) and a second end (530b), wherein the first end (530a) is electrically connected to the printed circuit board (502), and the second end (530b) extends adjacent to the at least one antenna (508); and A contact member (531) is disposed on the second end (530b) of the flexible printed circuit board (530), making electrical contact with the at least one antenna (508), and is oriented to apply a spring force to the at least one antenna (508) in a direction parallel to the surface of the flexible printed circuit board (530). The flexible printed circuit board (530) extends along one surface of the electronic component (520) within the internal space and includes a protrusion (538) wherein the width of the protrusion (538) is greater than the width of the portion of the flexible printed circuit board adjacent to the protrusion (538).

2. The electronic device as claimed in claim 1, wherein, The frame (540) includes a side frame (541) and a support member (542), wherein the side frame (541) is located on a side surface of the electronic device (500) and includes a plurality of metal segments (5411) and polymer injection portions (5412) bonded to the plurality of metal segments (5411), and the support member (542) is bonded to the side frame (541) and extends from the side frame (541) into the interior of the electronic device (500). The at least one antenna (508) is at least one of the plurality of metal segments (5411).

3. The electronic device as claimed in claim 2, wherein, The flexible printed circuit board (530) extends through a portion between the support member (542) and one surface of the electronic component (520).

4. The electronic device as claimed in claim 2 or claim 3, wherein, The support member (542) includes a snap-fit ​​protrusion (543), wherein the snap-fit ​​protrusion (543) is configured to contact the protrusion portion (538) when the contact member (531) applies a spring force and reduce the movement of the flexible printed circuit board (538) in a direction away from the at least one antenna (508).

5. The electronic device of claim 2, further comprising: A fixing member (550) is located in a first direction perpendicular to the surface of the flexible printed circuit board (530) from the contact member (531) and is configured to fix the contact member (531) relative to the first direction.

6. The electronic device as claimed in claim 5, wherein, The electronic component (520) includes a flange (524) wherein the flange (524) extends in the first direction relative to the fixing member (550) and the flange (524) is configured to fix the fixing member (550) relative to the first direction.

7. The electronic device as claimed in claim 6, wherein, The fixing member (550) includes a flange groove (551), wherein the flange groove (551) has a shape corresponding to the flange (524). The flange (524) is inserted into the flange groove (551).

8. The electronic device according to any one of claims 5 to 7, wherein, The side frame (541) includes a fixing groove (544), wherein the fixing groove (544) is formed in the region where the contact member (531) contacts the at least one antenna (508), and has a shape that at least partially corresponds to the fixing member (550). The fixing member (550) is fixed by being inserted into the fixing groove (544).

9. The electronic device as claimed in claim 8, wherein, The dimensions of the fixing member (550) are configured such that the fixing member (550) is fixedly fitted into the inner surface of the fixing groove (544) by interference assembly.

10. The electronic device as claimed in claim 8 or claim 9, wherein, The fixing groove (544) is formed in the region where the contact member (531) contacts the at least one antenna (508) by partially removing the polymer material to expose the surface of the antenna (508) facing the interior of the electronic device (500). The fixing member (550) is configured to enhance the rigidity of the area where the polymer material has been partially removed by interfering fitting the fixing member (550) to the inner surface of the fixing groove (544).

11. The electronic device according to any one of claims 5 to 10, further comprising: An adhesive member, located between the fixing member (550) and the contact member (531), is bonded to the fixing member (550) and the contact member (531) and comprises an elastic material.

12. The electronic device according to any one of claims 1 to 11, wherein, The flexible printed circuit board (530) extends through a portion between the back panel (519) and a surface of the electronic component (520) facing the back panel (519).

13. The electronic device as claimed in claim 2, wherein, The flexible printed circuit board (530) extends through a portion between the side frame (541) and a surface of the electronic component (520) facing the side frame (541).

14. The electronic device of claim 13, wherein, The side frame (541) has a polygonal shape. The flexible printed circuit board (530) extends along one side of a polygonal shape. The second end (530b) of the flexible printed circuit board (530) is located at the corner of the polygonal shape of the side frame (541), and The contact member (531) is oriented to apply an elastic force to the surface of another side that is connected to the edge at the corner portion of the polygonal shape.

15. A flexible printed circuit board (530) for an electronic device (500), said electronic device (500) comprising: The housing (510) includes at least one metal segment (5411) and has an internal space, wherein the at least one metal segment (5411) is disposed on a side surface of the housing (510); A support member (542) extends from the side surface of the housing (510) into the interior space; The wireless communication module is located in the internal space; A snap-fit ​​protrusion (543) is formed in the region of the support member (542) adjacent to the metal segment (5411). The flexible printed circuit board (530) includes: A connector (530) is disposed in a first end (530a) of the flexible printed circuit board (530) and is configured to be electrically connected to the communication module; A contact member (531) is disposed in the second end (530b) of the flexible printed circuit board (530) and includes a pin, wherein the pin is configured to apply a resilient force in a direction parallel to the surface of the flexible printed circuit board (530); and The protrusion (538) has a width greater than the width of the portion of the flexible printed circuit board adjacent to the protrusion, and the protrusion (538) is configured to contact the snap protrusion (543) when the contact member (531) applies a spring force.

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