Preparation device and method for low-humidity bonding epoxy resin material

Abstract

The invention discloses a preparation device for a low-humidity bonding epoxy resin material, which comprises a heating box, and a first weighing platform, a mixing and stirring container, an electric stirring mechanism, a second weighing platform, a third weighing platform, a curing agent container, an epoxy resin container and a vacuum pump are arranged in the heating box, the invention also discloses a preparation method of the epoxy resin material for low-humidity bonding. The preparation method comprises the following steps: 1, carrying out vacuum heating and dehumidification; 2, uniformly stirring the dehumidification curing agent and the epoxy resin under a low-humidity condition; and 3, carrying out low-humidity bonding, and curing to form the epoxy resin material adhesion component with high crosslinking density and high adhesive property. By integrating vacuum heating and dehumidification, precise weighing, automatic mixing and quantitative output, an integrated process of vacuum heating and dehumidification, low-humidity bonding and curing is constructed, the problems of large metering error, water residue and the like in traditional glue preparation are effectively solved, and the crosslinking density and bonding stability of an epoxy system are improved.

Description

Technical Field

[0001] This invention belongs to the field of engineering bonding technology, specifically relating to a preparation apparatus and method for low-humidity bonding epoxy resin materials. Background Technology

[0002] Epoxy resins are widely used in precision electronic assembly, high-performance composite material manufacturing, and aerospace structural bonding due to their excellent mechanical properties and thermal stability. However, a key bottleneck in traditional epoxy bonding processes is the significant impact of ambient humidity on curing quality. Particularly in the curing agent stage, amine-based curing agents are highly hygroscopic, readily absorbing moisture from the air, leading to residual moisture in the mixture. This not only affects the integrity of the epoxy crosslinking reaction but also causes problems such as bubbling, whitening, and decreased interfacial bond strength, severely restricting its application in high-reliability structures.

[0003] Currently, most mainstream adhesive mixing processes rely on manual metering and open-environment operation, making it difficult to effectively dehumidify the curing agent and control humidity throughout the process. Furthermore, large mixing ratio errors and poor repeatability easily lead to batch-to-batch performance inconsistencies. Some high-end solutions attempt to introduce premixed adhesives or dried fillers to alleviate moisture absorption problems, but these suffer from poor storage stability, high preparation costs, and limited applicability. Therefore, there is an urgent need to construct a highly integrated adhesive mixing device that combines vacuum heating dehumidification, precise metering, automatic mixing, and closed-loop quantitative release to improve mixing accuracy and process consistency while controlling humidity interference.

[0004] To address the aforementioned issues, it is necessary to systematically resolve the key technical bottlenecks in low-humidity adhesive preparation and bonding scenarios by considering both the device structure and the process route. Summary of the Invention

[0005] The technical problem to be solved by this invention is to address the shortcomings of the prior art by providing a preparation device for low-humidity adhesive epoxy resin materials. This device integrates vacuum heating and dehumidification, precise weighing, automatic mixing, and quantitative output, creating an integrated, low-humidity, automated adhesive preparation device suitable for high-reliability bonding scenarios. This effectively improves the control precision of the preparation process and the consistency of the adhesive quality, making it suitable for fields with high interface reliability requirements, such as electronic packaging and structural bonding.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a preparation device for low-moisture bonding epoxy resin materials, characterized in that the device includes a heating box, a first weighing platform is provided in the heating box, a mixing and stirring container is provided on the first weighing platform, an electric stirring mechanism is provided on the upper part of the mixing and stirring container, a second weighing platform and a third weighing platform are respectively provided on both sides of the first weighing platform, a curing agent container and an epoxy resin container are respectively provided on the second weighing platform and the third weighing platform, and a vacuum heating box is connected to a vacuum pump.

[0007] The aforementioned apparatus for preparing low-moisture adhesive epoxy resin materials is characterized in that a first lifting assembly is provided at the lower part of the first weighing platform, the first lifting assembly comprising a base and two first lifters mounted on the base. The above-mentioned apparatus for preparing low-moisture adhesive epoxy resin materials is characterized in that the electric stirring mechanism includes a motor and a stirring paddle.

[0008] The above-mentioned apparatus for preparing low-moisture adhesive epoxy resin materials is characterized in that a second lifting assembly is provided at the lower part of the second weighing platform, the second lifting assembly includes a second base plate and two second lifters mounted on the second base plate, and a second pulley is provided at the lower part of the second base plate; a third lifting assembly is provided at the lower part of the third weighing platform, the third lifting assembly includes a third base plate and two third lifters mounted on the third base plate, and a third pulley is provided at the lower part of the third base plate; and an electric slide rail that cooperates with the pulley is provided at the bottom of the vacuum heating box.

[0009] The above-mentioned apparatus for preparing low-moisture adhesive epoxy resin materials is characterized in that a first control valve is provided on the mixing and stirring container, a second control valve is provided on the curing agent container facing the mixing and stirring container, and a third control valve is provided on the epoxy resin container facing the mixing and stirring container.

[0010] In addition, the present invention also provides a method for preparing a low-moisture adhesive epoxy resin material, characterized in that the method includes the following steps: Step 1: Add the curing agent and epoxy resin to the curing agent container and epoxy resin container respectively, and then perform vacuum heating and dehumidification to obtain dehumidified curing agent and epoxy resin. Step 2: Release the dehumidifying curing agent and epoxy resin obtained in Step 1 into a mixing container in a measured amount, and then stir evenly under low humidity conditions to obtain a low humidity bonding epoxy resin material. Step 3: The low-moisture adhesive epoxy resin material obtained in Step 2 is quantitatively applied to the surface of the component to be bonded for low-moisture bonding. Then, it is cured in a sealed desiccant to finally form an epoxy resin material with high cross-linking density and high bonding performance to adhere the component.

[0011] This invention constructs a low-humidity, sealed environment through vacuum heating and dehumidification, effectively removing the moisture adsorbed by the curing agent. By mixing the dehumidifying curing agent and epoxy resin, a low-moisture adhesive epoxy resin material with low water content is obtained. Finally, the low-humidity adhesive epoxy resin material is output to the surface of the components to be bonded. Then, the components to be bonded are stacked and pressed together for low-humidity bonding and curing, forming epoxy resin material adhesive components with high cross-linking density and high bonding performance.

[0012] The above method is characterized in that the curing agent in step one is a fatty amine curing agent, a polyamide curing agent, or a compound amine curing agent; the fatty amine curing agent is diethylenetriamine curing agent; the polyamide curing agent is acetamide curing agent; the compound amine curing agent is 793 epoxy resin curing agent; the epoxy resin is E44 epoxy resin or E51 epoxy resin; and the mass ratio of the curing agent to the epoxy resin is 20~50:100. This invention selects E44 epoxy resin or E51 epoxy resin as the matrix, which has high epoxy value, excellent thermal stability and adhesive performance, and is suitable for structural adhesive systems. The curing agent is preferably a fatty amine, polyamide, or compound amine, which combines reactivity, flexibility and moisture resistance. The ratio of epoxy to curing agent is controlled within a reasonable equivalent range to achieve a balance between high crosslinking density and flexibility, improving the adhesive reliability and environmental adaptability of the system.

[0013] The above method is characterized in that, in step one, the vacuum degree of vacuum heating dehumidification is -0.08MPa to -0.1MPa, the temperature is 30℃ to 50℃, and the time is 15min to 60min, and the vacuum heating dehumidification controls the relative humidity to below 10%. This invention addresses the effective removal of adsorbed water from curing agents by requiring processing under near-absolute vacuum conditions. The vacuum environment significantly lowers the boiling point of water within the system, allowing water to desorb and drain rapidly at lower temperatures. This effectively avoids the damage to curing agent performance caused by high-temperature treatment. Simultaneously, appropriate temperature and processing time ensure the full release of moisture from both the interior and surface of the curing agent, balancing efficiency and thoroughness. This prevents uneven adhesive distribution or component deterioration due to insufficient or excessive treatment. Furthermore, this invention reveals that curing agents are highly sensitive to environmental humidity, especially during the blending and application stages of the curing agent and epoxy resin. Moisture in the air is easily reabsorbed by the curing agent, leading to a rise in the moisture content of the low-humidity epoxy resin material, which in turn affects the integrity of the curing reaction and the bonding quality. Maintaining relative humidity within a reasonable range significantly reduces the interference of external moisture on the system, maintaining a low-water environment, which is beneficial for forming a dense and uniform cross-linked structure.

[0014] The method described above is characterized in that the water absorption rate of the low-moisture adhesive epoxy resin material in step two is less than 5%, and the bonding strength is greater than 30 MPa. This invention effectively prevents corrosion of the components to be bonded during the bonding process and ensures bonding performance by controlling the parameters of the low-moisture adhesive epoxy resin material.

[0015] The above method is characterized in that the curing temperature in step three is 25℃~60℃, and the time is 24h~72h. The present invention selects appropriate curing temperature and reaction time, which is beneficial for controlling the reaction rate and preventing stress concentration, interface debonding, or bubble formation due to excessively rapid curing. Especially in low-humidity environments, where there is less moisture in the system, the reaction is more stable. Appropriately extending the curing time can promote the full cross-linking reaction, improving the material's density and bonding strength.

[0016] Compared with the prior art, the present invention has the following advantages: 1. This invention provides a closed, low-humidity reaction environment by setting up a heating box and a vacuum pump, and by setting up a curing agent container, an epoxy resin container, and a mixing and stirring container, the epoxy resin and curing agent are mixed in this closed, low-humidity reaction environment, which effectively reduces the residual moisture in the system and significantly improves the crosslinking degree and bonding reliability of the low-humidity adhesive epoxy resin material.

[0017] 2. By configuring independent weighing platforms and control valves, corresponding to curing agents, epoxy resins and low-humidity adhesive epoxy resin materials respectively, the present invention ensures that the raw materials are accurately added according to the set ratio, realizing a continuous and automated process from raw material processing to finished adhesive output, which greatly improves efficiency, reduces human error, and maintains a low-humidity and sealed state throughout the process.

[0018] 3. The present invention achieves fully automated operation of raw materials from dehumidification and metering to mixing and output through the coordinated control of the lifting device, the moving platform and the electric slide rail, which significantly improves operating efficiency and meets the needs of continuous and batch production.

[0019] 4. This invention removes moisture from the curing agent by vacuum heating and dehumidification, which not only enhances the bonding strength, but also prevents the metal from rusting due to residual moisture in the curing agent when bonding metals.

[0020] 5. The vacuum heating dehumidification and drying humidity control process adopted in this invention has the characteristics of maturity, reliability, and high integration. It is easy to operate, has good consistency, and is applicable to various types of epoxy resin and curing agent systems. This method has strong adaptability and is particularly suitable for application scenarios with strict requirements for bonding quality and environmental stability, such as aerospace, electronics, and civil engineering.

[0021] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the apparatus for preparing low-humidity adhesive epoxy resin materials according to the present invention.

[0023] Figure 2 This is a schematic diagram illustrating the preparation and use of the low-moisture adhesive epoxy resin material of the present invention.

[0024] Figure 3 The water absorption rates of the curing agent and epoxy resin used in Example 2 of this invention under different humidity levels.

[0025] Figure 4 This is a low-field NMR spectrum of the moisture in the curing agent used in Example 2 of the present invention.

[0026] Figure 5 The shear strength diagram shows the low-moisture adhesive epoxy resin material prepared in Example 2 of this invention and epoxy resin materials prepared with curing agents of different water absorption rates.

[0027] Figure 6 The image shows the cross-sectional morphology of epoxy resin materials prepared by the low-moisture bonding epoxy resin material prepared in Example 2 of this invention and curing agents with different water absorption rates.

[0028] Figure 7 This is a macroscopic view of the bonding surface of the low-moisture adhesive epoxy resin material prepared in Example 2 of the present invention and epoxy resin materials prepared with curing agents with different water absorption rates.

[0029] Explanation of reference numerals in the attached figures: Detailed Implementation

[0030] The apparatus for preparing low-humidity adhesive epoxy resin materials of the present invention will be described in detail through Example 1.

[0031] Example 1 like Figure 1 As shown, the apparatus for preparing low-moisture adhesive epoxy resin materials in this embodiment includes a heating chamber 1, a first weighing platform 2 in the heating chamber 1, a mixing and stirring container 3 on the first weighing platform 2, an electric stirring mechanism on the upper part of the mixing and stirring container 3, a second weighing platform 4 and a third weighing platform 5 on both sides of the first weighing platform 2, a curing agent container 6 and an epoxy resin container 7 respectively on the upper part of the second weighing platform 4 and the third weighing platform 5, and a vacuum pump 8 connected to the vacuum heating chamber 1.

[0032] It should be noted that by setting up a heating chamber 1 and a vacuum pump 8, heating is performed under the action of the heating chamber 1, and vacuum is performed under the action of the vacuum pump 8, forming a closed low-humidity reaction environment. This environment is used to perform vacuum heating and dehumidification treatment on the curing agent in the curing agent container 6, which significantly reduces its moisture content. This ensures that its moisture content is reduced to an extremely low level and effectively inhibits the water absorption of the subsequently formed low-humidity adhesive epoxy resin material. This ensures the degree of crosslinking and subsequent bonding strength of the low-humidity adhesive epoxy resin material after bonding and curing.

[0033] It should be noted that by setting up a mixing container 3 to receive the curing agent output from the curing agent container 6 and the epoxy resin output from the epoxy resin container 7, and by using a matching electric stirring mechanism to stir, the raw materials are ensured to be fully and evenly dispersed under low humidity conditions, avoiding the problem of local curing or decreased bonding performance caused by uneven mixing, and forming a low-humidity bonding epoxy resin material with consistent quality.

[0034] It should be noted that by setting up the first weighing platform 2, the weights of the curing agent and epoxy resin output from the curing agent container 6 and epoxy resin container 7 are verified, and the weight of the low-moisture bonding epoxy resin material is determined, thus achieving accurate dispensing. By setting up the second weighing platform 4 and the third weighing platform 5, the weights of the curing agent and epoxy resin in the curing agent container 6 and epoxy resin container 7 are determined, respectively, ensuring accurate dispensing and maintaining the correct mixing ratio. This improves the performance of the low-moisture bonding epoxy resin material. Furthermore, the first weighing platform 2, the second weighing platform 4, and the third weighing platform 5 all have an accuracy control within 0.1g, enabling high-precision mixing and recording of raw materials, and achieving high-precision use of the low-moisture bonding epoxy resin material.

[0035] It should be noted that the heating box 1, the first weighing platform 2, the second weighing platform 4, the third weighing platform 5, the vacuum pump 8, the first lifting assembly, the motor 11, the second lifting device 14, the third lifting device 17, the electric slide rail 19, the first control valve 20, the second control valve 21, and the third control valve 22 are all connected to the controller. During use, the required mass ratio of epoxy resin and curing agent is set through the controller's control interface, and the entire process of dehumidification, weighing, addition, and mixing is automatically carried out. Finally, a low-moisture bonding epoxy resin material with low water absorption, high strength, and high cross-linking density is prepared for structural bonding between various substrates such as metals, plastics, and ceramics.

[0036] In this embodiment, a first lifting assembly is provided at the lower part of the first weighing platform 2. The first lifting assembly includes a base 9 and two first lifting devices 10 installed on the base 9. By providing two first lifting devices 10, when stirring is required, the mixing container 3 is raised so that the stirring paddle 12 can be inserted into the mixing container 3 for stirring. After stirring is completed, the mixing container 3 is lowered to disengage from stirring. It can also be used to add materials according to the height of the curing agent container 6 and the epoxy resin container 7.

[0037] It should be noted that by setting two first lifting devices 10, when it is necessary to pour out the low-moisture adhesive epoxy resin material in the mixing container 3, the two first lifting devices 10 are raised to different heights, so that the mixing container 3 has a certain tilt angle, which facilitates the pouring out of the low-moisture adhesive epoxy resin material.

[0038] In this embodiment, the electric stirring mechanism includes a motor 11 and a stirring paddle 12.

[0039] It should be noted that the speed of motor 11 can switch between 100rpm and 500rpm to adapt to the mixing requirements of low-moisture adhesive epoxy resin materials of different viscosities.

[0040] In this embodiment, a second lifting assembly is provided at the lower part of the second weighing platform 4. The second lifting assembly includes a second base plate 13 and two second lifters 14 mounted on the second base plate 13. A second pulley 15 is provided at the lower part of the second base plate 13. A third lifting assembly is provided at the lower part of the third weighing platform 5. The third lifting assembly includes a third base plate 16 and two third lifters 17 mounted on the third base plate 16. A third pulley 18 is provided at the lower part of the third base plate 16. An electric slide rail 19 cooperating with the pulley is provided at the bottom of the vacuum heating box 1. To achieve precise docking and mixing of raw materials in different containers, the heights of the curing agent container 6 and the epoxy resin container 7 are adjusted using two second lifters 14 and two third lifters 17. This, combined with the second base plate 13 with second pulleys 15, the third base plate 16 with third pulleys 18, and the electric slide rail 19, completes the automatic alignment and movement of the feeding position, realizing the spatial transfer and precise docking of the components before and after mixing. This achieves precise release and collection of raw materials at designated points, improving the automation level and space utilization efficiency of the device.

[0041] It should be noted that the electric slide rail 19 drives the second pulley 15 and the third pulley 18 to move horizontally, switch to the top of the mixing container 3 for precise feeding, and return to the original position, realizing the sequential connection between modules and the precise delivery of raw materials, completing the efficient collaborative operation from metering to mixing, improving the overall automation level of the device, and making it suitable for large-scale continuous glue production operations.

[0042] It should be noted that by setting two second lifting devices 14, when it is necessary to pour out the curing agent in the curing agent container 6, the two second lifting devices 14 are raised to different heights, so that the curing agent container 6 has a certain tilt angle, which facilitates the pouring out of the curing agent; by setting two third lifting devices 17, when it is necessary to pour out the epoxy resin in the epoxy resin container 7, the two third lifting devices 17 are raised to different heights, so that the epoxy resin container 7 has a certain tilt angle, which facilitates the pouring out of the epoxy resin.

[0043] In this embodiment, a first control valve 20 is provided on the mixing container 3, a second control valve 21 facing the mixing container 3 is provided on the curing agent container 6, and a third control valve 22 facing the mixing container 3 is provided on the epoxy resin container 7. The first control valve 20 and the second control valve 21 are used to control the quantitative release of the raw materials, achieving independent quantitative output of the two components and ensuring the accurate and stable component ratio of the low-moisture adhesive epoxy resin material. The third control valve 22 facilitates the quantitative release of the low-moisture adhesive epoxy resin material.

[0044] Figure 2 This is a schematic diagram illustrating the preparation and use of the low-moisture adhesive epoxy resin material of the present invention. Figure 2 As can be seen, the epoxy resin and curing agent are first dehumidified by vacuum heating, and then stirred evenly under low humidity conditions to obtain a low humidity bonding epoxy resin material. The low humidity bonding epoxy resin material is then evenly coated on the surface of the components to be bonded. Finally, the components to be bonded are stacked and pressed together for low humidity bonding, and then cured in a sealed desiccant to form epoxy resin material with high cross-linking density and high bonding performance to adhere the components.

[0045] The preparation method of the low-moisture adhesive epoxy resin material of the present invention is described in detail through Examples 2 to 4.

[0046] Example 2 This embodiment includes the following steps: Step 1: Add 793 epoxy resin curing agent and E51 epoxy resin to curing agent container 6 and epoxy resin container 7 respectively, and then perform vacuum heating and dehumidification for 30 minutes at a vacuum degree of -0.095MPa and a temperature of 40℃ to control the relative humidity below 10% to obtain dehumidifying curing agent and epoxy resin. Step 2: Release the dehumidifying curing agent and epoxy resin obtained in Step 1 into the mixing container 3 at a mass ratio of 30:100, and then stir evenly under low humidity conditions to obtain a low humidity bonding epoxy resin material. Step 3: Quantitatively apply the low-moisture adhesive epoxy resin material obtained in Step 2 to the surface of the iron component to be bonded. Then, stack and press the components to be bonded together for low-moisture bonding. Finally, cure in a sealed desiccator at 25°C for 48 hours to form an epoxy resin material adhesive component with high cross-linking density and high bonding performance.

[0047] Testing showed that the water absorption rate of the low-moisture adhesive epoxy resin material prepared in this embodiment was less than 5%, and the adhesive strength was greater than 30 MPa.

[0048] Figure 3 The water absorption rates of the curing agent and epoxy resin used in this embodiment under different humidity levels are calculated from... Figure 3 As can be seen, the 793 epoxy resin curing agent used in this embodiment exhibits obvious hygroscopicity and significant water release characteristics in a high humidity environment, while the E51 epoxy resin hardly absorbs moisture.

[0049] Figure 4 This is a low-field NMR spectrum of the moisture in the curing agent used in this embodiment. Figure 4 As can be seen from the data, the 793 epoxy resin curing agent used in this embodiment is mainly free water with bound water as a secondary component.

[0050] To clarify the advantages of low-moisture bonding epoxy resin materials, epoxy resin materials were prepared and bonded using simulated 793 epoxy resin curing agent with water absorption rates of 10%, 20%, 30%, and 40% for comparison. Mechanical properties, cross-sectional morphology, and corrosion were tested and analyzed. The results showed that the low-moisture bonding epoxy resin material in Example 1, which underwent vacuum heating and dehumidification, possessed the highest shear strength, exceeding 30 MPa, significantly superior to the samples without vacuum heating and dehumidification. Furthermore, the shear strength decreased rapidly with increasing water absorption rate. Scanning electron microscopy (SEM) images of the cross-sections showed that the low-moisture bonding epoxy resin material had a dense and smooth cross-section, while the high-water-absorption sample exhibited obvious cracks and defects. Additionally, no corrosion was observed on the surface of the low-moisture bonding epoxy resin material, while the components on the surface of the moisture-absorbing sample showed significant corrosion.

[0051] Figure 5 This is a shear strength diagram of the low-moisture bonding epoxy resin material prepared in this embodiment and epoxy resin materials prepared with curing agents of different water absorption rates. The water absorption rate indicates the strength of the mixture of 793 epoxy resin curing agent and E51 epoxy resin at that water absorption rate. Figure 5 As can be seen, the low-moisture adhesive epoxy resin material prepared in this embodiment has the highest shear strength, which is greater than 30 MPa. However, as the water absorption rate of the curing agent increases from 10% to 40%, the shear strength decreases significantly, indicating that water absorption has a significant weakening effect on the adhesive performance.

[0052] Figure 6The images show cross-sectional morphology of the low-moisture bonding epoxy resin material prepared in this embodiment and epoxy resin materials prepared with curing agents of different water absorption rates. The water absorption rate indicates the ratio of 793 epoxy resin curing agent and E51 epoxy resin used when mixed. Figure 6 As can be seen, the cross-sectional structure of the low-moisture adhesive epoxy resin material prepared in this embodiment is dense and without obvious defects. However, as the water absorption rate of the curing agent gradually increases from 10% to 40%, cracks, pores and layered delamination gradually appear on the cross-section, and the structural integrity decreases significantly, indicating that moisture has a destructive effect on the microstructure of the epoxy system.

[0053] Figure 7 This is a macroscopic view of the bonding surface of the low-moisture adhesive epoxy resin material prepared in this embodiment with epoxy resin materials prepared with curing agents of different water absorption rates. The water absorption rate indicates the use of a mixture of 793 epoxy resin curing agent and E51 epoxy resin at that water absorption rate. Figure 7 As can be seen from the data, no rust spots appeared on the bonding surface of the low-moisture adhesive epoxy resin material prepared in this embodiment. However, as the water absorption rate of the curing agent gradually increased from 10% to 40%, obvious defects and rust spots appeared at the interface, and the bonding quality gradually deteriorated.

[0054] Example 3 This embodiment includes the following steps: Step 1: Add 793 epoxy resin curing agent and E44 epoxy resin to curing agent container 6 and epoxy resin container 7 respectively, and then perform vacuum heating and dehumidification for 30 minutes at a vacuum degree of -0.08MPa and a temperature of 40℃ to control the relative humidity below 10% to obtain dehumidifying curing agent and epoxy resin. Step 2: Release the dehumidifying curing agent and epoxy resin obtained in Step 1 into the mixing container 3 at a mass ratio of 20:100, and then stir evenly under low humidity conditions to obtain a low humidity bonding epoxy resin material. Step 3: The low-moisture adhesive epoxy resin material obtained in Step 2 is quantitatively applied to the surface of the aluminum alloy component to be bonded. Then, the aluminum alloy components to be bonded are stacked and pressed together for low-moisture bonding. Finally, the components are cured in a sealed desiccator at 25°C for 48 hours to form an epoxy resin material adhesive component with high cross-linking density and high bonding performance.

[0055] Testing showed that the water absorption rate of the low-moisture adhesive epoxy resin material prepared in this embodiment was less than 5%, and the adhesive strength was greater than 30 MPa.

[0056] Example 4 This embodiment includes the following steps: Step 1: Add acetamide curing agent and E51 epoxy resin to curing agent container 6 and epoxy resin container 7 respectively, and then vacuum heat dehumidify at a vacuum degree of -0.1MPa and a temperature of 30℃ for 60 minutes to control the relative humidity below 10% to obtain dehumidifying curing agent and epoxy resin. Step 2: Release the dehumidifying curing agent and epoxy resin obtained in Step 1 into the mixing container 3 at a mass ratio of 30:100, and then stir evenly under low humidity conditions to obtain a low humidity bonding epoxy resin material. Step 3: The low-moisture adhesive epoxy resin material obtained in Step 2 is quantitatively applied to the surface of the plastic component to be bonded for low-moisture bonding. Then, the plastic components to be bonded are stacked and pressed together for low-moisture bonding. Finally, the components are cured in a sealed desiccator at 25°C for 72 hours to form epoxy resin material adhesive components with high cross-linking density and high bonding performance.

[0057] Testing showed that the water absorption rate of the low-moisture adhesive epoxy resin material prepared in this embodiment was less than 5%, and the adhesive strength was greater than 30 MPa.

[0058] Example 5 This embodiment includes the following steps: Step 1: Add diethylenetriamine curing agent and E51 epoxy resin to curing agent container 6 and epoxy resin container 7 respectively. Then, vacuum heating and dehumidification are carried out at a vacuum degree of -0.095MPa and a temperature of 50℃ for 15 minutes to control the relative humidity below 10% to obtain dehumidifying curing agent and epoxy resin. Step 2: The dehumidifying curing agent and epoxy resin obtained in Step 1 are quantitatively released into the mixing container 3 at a mass ratio of 50:100. Then, the mixture is stirred evenly under low humidity conditions to obtain a low humidity bonding epoxy resin material. Step 3: The low-moisture bonding epoxy resin material obtained in Step 2 is quantitatively applied to the surface of the ceramic component to be bonded for low-moisture bonding. Then, the ceramic components to be bonded are stacked and pressed together for low-moisture bonding. Finally, the components are cured at 60°C for 24 hours in a sealed desiccator to form epoxy resin material adhesive components with high cross-linking density and high bonding performance.

[0059] Testing showed that the water absorption rate of the low-moisture adhesive epoxy resin material prepared in this embodiment was less than 5%, and the adhesive strength was greater than 30 MPa.

[0060] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention in any way. Any simple modifications, alterations, and equivalent changes made to the above embodiments based on the inventive essence shall still fall within the protection scope of the present invention.

Claims

1. An apparatus for preparing low-moisture adhesive epoxy resin materials, characterized in that, The device comprises a heating box (1), a first weighing platform (2) is arranged in the heating box (1), a mixing and stirring container (3) is arranged on the first weighing platform (2), an electric stirring mechanism is arranged on the upper portion of the mixing and stirring container (3), a second weighing platform (4) and a third weighing platform (5) are respectively arranged on the two sides of the first weighing platform (2), a curing agent container (6) and an epoxy resin container (7) are respectively arranged on the upper portions of the second weighing platform (4) and the third weighing platform (5), and the vacuum heating box (1) is connected with a vacuum pump (8).

2. A device for preparing a low moisture adhesive epoxy resin material according to claim 1, characterized in that, A first lifting assembly is arranged on the lower portion of the first weighing platform (2), and the first lifting assembly comprises a base (9) and two first lifters (10) mounted on the base (9).

3. A device for preparing a low moisture adhesive epoxy resin material according to claim 1, characterized in that, The electric stirring mechanism comprises a motor (11) and a stirring paddle (12).

4. A device for preparing a low moisture adhesive epoxy resin material according to claim 1, characterized in that, A second lifting assembly is arranged on the lower portion of the second weighing platform (4), and the second lifting assembly comprises a second bottom plate (13) and two second lifters (14) mounted on the second bottom plate (13); a third lifting assembly is arranged on the lower portion of the third weighing platform (5), and the third lifting assembly comprises a third bottom plate (16) and two third lifters (17) mounted on the third bottom plate (16); a second pulley (15) is arranged on the lower portion of the second bottom plate (13); a third pulley (18) is arranged on the lower portion of the third bottom plate (16); and the bottom of the vacuum heating box (1) is provided with an electric sliding rail (19) matched with the pulleys.

5. A device for preparing low moisture adhesive epoxy resin material according to claim 1, characterized in that, A first control valve (20) is arranged on the mixing and stirring container (3), a second control valve (21) is arranged on the curing agent container (6) and faces the mixing and stirring container (3), and a third control valve (22) is arranged on the epoxy resin container (7) and faces the mixing and stirring container (3).

6. A method of using a device as claimed in any one of claims 1 to 5 for the preparation of a low-moisture adhesive epoxy material, characterised in that, The method comprises the following steps: Step one: the curing agent and the epoxy resin are respectively added into the curing agent container (6) and the epoxy resin container (7), and then vacuum heating and dehumidification are performed to obtain dehumidified curing agent and epoxy resin; Step two: the dehumidified curing agent and the epoxy resin obtained in step one are quantitatively released into the mixing and stirring container (3), and then uniformly stirred under low humidity conditions to obtain low-humidity adhesive epoxy resin material; Step three: the low-humidity adhesive epoxy resin material obtained in step two is quantitatively output to the surface of the component to be bonded for low-humidity bonding, and then curing is performed in a closed drying dish to finally form an epoxy resin material adhered component with high cross-linking density and high bonding performance.

7. The method of claim 6, wherein, In step one, the curing agent is a fatty amine curing agent, a polyamide curing agent or a compounded amine curing agent; the fatty amine curing agent is a diethylene triamine curing agent; the polyamide curing agent is an acetamide curing agent; the compounded amine curing agent is a 793 epoxy resin curing agent; the epoxy resin is an E44 epoxy resin or an E51 epoxy resin; and the mass ratio of the curing agent to the epoxy resin is 20-50:

100.

8. The method of claim 6, wherein, The vacuum degree of the vacuum heating and dehumidifying in step one is -0.08 MPa to -0.1 MPa, the temperature is 30 DEG C to 50 DEG C, and the time is 15 min to 60 min, and the vacuum heating and dehumidifying controls the relative humidity to be less than 10%.

9. The method of claim 6, wherein, The water absorption of the low-humidity adhesive epoxy resin material in step two is less than 5%, and the adhesive strength is greater than 30 MPa.

10. The method of claim 6, wherein, The curing temperature in step three is 25 DEG C to 60 DEG C, and the time is 24 h to 72 h.

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