Microneedle Machining Fixtures and Microneedle Machining Methods

Abstract

This invention discloses a microneedle processing fixture and a microneedle processing method, relating to the field of microneedle processing. The microneedle processing fixture includes a base plate, a needle plate, and a positioning plate, which are stacked and tightly fitted together. The needle plate has a needle hole area and multiple needle holes, and the positioning plate has a cutout portion corresponding to the needle hole area. During processing, the fixture is fixed to a aligning machine, and microneedles are introduced into the needle holes in batches through vibration, with the end of the microneedle to be processed protruding from the positioning plate. After the microneedles are fixed by injecting glue or wax into the needle hole area, the processing position is determined based on the positioning plate, and processing is completed using processing tools. This invention, through a three-layer bonding structure and collaboration with the aligning machine, achieves precise batch clamping of microneedles. The positioning plate ensures processing consistency, avoids glue or wax overflow, and improves processing efficiency and accuracy. It solves the problems of small microneedle size, difficult clamping, and poor batch processing stability, and is suitable for microneedle manufacturing in medical, cosmetic, and other fields.

Description

Technical Field

[0001] This invention relates to the field of microneedle fabrication, and particularly to a microneedle fabrication fixture and a microneedle fabrication method. Background Technology

[0002] In the field of microneedle manufacturing, microneedles typically have a tiny size on the order of 0.1 to 1 mm, and their end faces often need to be machined into specific geometric shapes (such as bevels, arcs, etc.) to meet the functional requirements of applications such as medical, cosmetic, or sensing. However, due to the extremely small size and fragile structure of microneedles, they are difficult to effectively identify, position, and clamp during the manufacturing process, and are prone to problems such as displacement, breakage, or insufficient machining accuracy.

[0003] Traditional processing methods often employ single-needle clamping or simple fixtures to hold microneedles, which is not only inefficient but also makes it difficult to guarantee the consistency and stability of batch processing. Furthermore, when grinding or machining the microneedle end faces, the lack of reliable support and positioning structures can easily introduce tool marks, burrs, or deformation, severely affecting the quality of the finished product. Although some solutions have attempted to temporarily fix the microneedles in the fixture using glue or wax to enhance stability, existing fixture structures often cannot achieve high-density arrangement of microneedle arrays, precise alignment, or a design that facilitates subsequent processing operations.

[0004] Therefore, there is an urgent need for a microneedle machining fixture with a reasonable structure, precise positioning, and convenient batch clamping and processing to solve the above-mentioned technical problems and improve the efficiency and accuracy of microneedle machining. Summary of the Invention

[0005] The main objective of this invention is to provide a microneedle machining fixture and a microneedle machining method, aiming to solve the technical problem of low efficiency in microneedle machining in the prior art.

[0006] To achieve the above-mentioned objectives, the first aspect of this invention provides a microneedle machining fixture, comprising:

[0007] substrate;

[0008] The needle plate is stacked and tightly attached to the substrate. The needle plate is provided with a needle hole area, and the needle hole area is provided with multiple needle holes.

[0009] The positioning plate is installed in close contact with the needle plate in a stacked manner, and the positioning plate is provided with a hollow part corresponding to the needle hole area.

[0010] Furthermore, a recess is provided at one end of the needle plate facing the substrate, corresponding to the needle hole area;

[0011] Wherein, after the needle plate is attached to the positioning plate, the recessed portion and the substrate form a receiving space for accommodating the glue or wax used to fix the microneedles during processing.

[0012] Furthermore, a groove is provided at one end of the needle plate facing the substrate, one end of the groove is connected to the recessed portion, and the other end extends to the side of the needle plate;

[0013] When the needle plate and the positioning plate are attached, the groove and the substrate form an air passage for connecting to an external vacuum pumping device.

[0014] Furthermore, a heating element and a cooling element are provided on the side of the substrate near the needle plate, corresponding to the needle hole area, for heating or cooling the adhesive or wax in the accommodating space.

[0015] Furthermore, a plurality of electromagnets are provided on the back side of the substrate away from the needle plate;

[0016] The needle plate and / or the positioning plate are made of a material that attracts the magnet.

[0017] Furthermore, the substrate is provided with a plurality of first pin holes; the pin plate is provided with a plurality of second pin holes that are directly opposite to the first pin holes; and the positioning plate is provided with a plurality of third pin holes that are directly opposite to the first pin holes.

[0018] The base plate, pin plate, and positioning plate are connected using pins through the first pin hole, the second pin hole, and the third pin hole.

[0019] Furthermore, the pinhole is an inclined pinhole relative to the top surface of the pin plate.

[0020] A second aspect of the present invention provides a microneedle fabrication method, implemented using a microneedle fabrication fixture as described in any of the preceding claims, comprising:

[0021] The microneedle is inserted into the needle hole, wherein the end of the microneedle to be processed protrudes from the end face of the positioning plate;

[0022] Apply glue or wax to the pinhole area to fix the microneedle inside the pinhole;

[0023] The microneedles inside the pinholes are processed using processing tools.

[0024] Further, the step of injecting adhesive or wax into the pinhole area to fix the microneedle within the pinhole includes:

[0025] A fluid adhesive or wax is injected into the pinhole area, and the heating element in the substrate is activated to improve or maintain the fluidity of the adhesive or wax.

[0026] A vacuum pump is used to create a vacuum in the containment space through the air passage, thereby creating negative pressure to facilitate the filling of glue or wax.

[0027] After a preset time, heating is stopped and the cooling element is activated to accelerate the curing of the adhesive or wax.

[0028] Further, inserting the microneedle into the needle hole includes:

[0029] The substrate, pin plate, and positioning plate are connected using pins through the first pin hole, the second pin hole, and the third pin hole;

[0030] The microneedles are inserted into the needle holes using a aligner;

[0031] The electromagnet is activated to attract and fix the substrate, needle plate, and positioning plate together.

[0032] The microneedle processing fixture of the present invention, through a three-layer stacked structure design of a substrate, a needle plate, and a positioning plate tightly bonded together, constructs a stable and reliable microneedle clamping foundation, bringing many beneficial effects:

[0033] Firstly, the pinhole area and multiple pinholes of the pin plate provide a mass carrying space for microneedles, enabling the array-style arrangement and mass clamping of microneedles. This completely changes the traditional situation of low efficiency in single-needle clamping and greatly improves the batch processing capability of microneedle processing.

[0034] Secondly, the hollowed-out part of the positioning plate precisely corresponds to the pinhole area, which not only ensures that the end of the microneedle to be processed can protrude smoothly, but also forms a closed space with the needle plate, effectively preventing glue or wax from overflowing during the glue or waxing process, and ensuring the firmness of the microneedle fixation; at the same time, the positioning plate further enhances the bonding stability of the three-layer structure by pressing the needle plate, reducing displacement deviation during the processing, and providing a guarantee for processing accuracy.

[0035] Third, the large end face area of ​​the positioning plate can serve as a positioning reference for processing tools, facilitating rapid and accurate positioning by intelligent processing equipment. This helps ensure consistent processing of the microneedle end face, effectively solving the positioning problem caused by the small size of the microneedle, improving the consistency of batch-processed products, and providing reliable support for the high-precision requirements of microneedles in the medical, beauty and other fields. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of a microneedle machining fixture according to an embodiment of the present invention;

[0037] Figure 2 This is a schematic diagram of the bottom structure of a microneedle machining fixture according to an embodiment of the present invention;

[0038] Figure 3 This is an exploded structural diagram of a microneedle machining fixture according to an embodiment of the present invention;

[0039] Figure 4This is a schematic flowchart of a microneedle fabrication method according to an embodiment of the present invention.

[0040] in:

[0041] 10-Substrate; 11-First pin hole; 12-Electromagnet; 20-Needle plate; 21-Second pin hole; 22-Pin hole; 30-Positioning plate; 31-Third pin hole; 40-Pin; 50-Micro needle.

[0042] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0043] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0044] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0045] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0046] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0047] Reference Figures 1-3 An embodiment of the present invention provides a microneedle machining fixture, comprising:

[0048] substrate 10;

[0049] The needle plate 20 is stacked and tightly attached to the substrate 10. The needle plate 20 is provided with a needle hole area, and the needle hole area is provided with a plurality of needle holes 22.

[0050] The positioning plate 30 is installed in close contact with the needle plate 20 in a stacked manner, and the positioning plate 30 is provided with a hollow part corresponding to the needle hole area.

[0051] The substrate 10 is the basic load-bearing component of the entire microneedle processing fixture. It is made of high-strength stainless steel with a thickness of 10-15mm to ensure it does not deform during processing. It provides a stable and reliable support platform for the needle plate 20 and positioning plate 30, and is typically fixed to the worktable of the alignment machine using bolts. The needle plate 20 is made of hard alloy, possessing good wear resistance and dimensional stability. It has a thickness of 5-8mm and is installed in a tightly laminated manner with the substrate 10. The mating surfaces are precision ground, with a flatness error controlled within 0.002mm, effectively preventing gaps in the mating surfaces. The needle hole area on the needle plate 20 is a core area specifically designed to support the microneedles 50. In this embodiment, the needle hole area is designed as a rectangle (e.g., ...). Figure 3As shown in the diagram, multiple pinholes 22 are evenly distributed within this area. The diameter of each pinhole 22 matches the outer diameter of the microneedle 50 to be processed, with the gap controlled between 0.001-0.003mm. This ensures smooth insertion of the microneedle 50 while preventing wobbling after insertion. The positioning plate 30 is made of aerospace-grade aluminum alloy, combining lightweight and high strength characteristics. It is 3-5mm thick and, like the pin plate 20, uses a tight-fitting installation method. The mating surfaces are anodized, enhancing wear resistance and further improving the tightness of the fit. The cutouts on the positioning plate 30 precisely correspond to the pinhole areas of the pin plate 20. The outline of the cutouts is slightly larger than that of the pinhole areas, ensuring that the end of the microneedle 50 to be processed can smoothly protrude from the end face of the positioning plate 30, while also providing sufficient space for subsequent glue or wax injection operations. Figure 1 As shown, the substrate 10, needle plate 20, and positioning plate 30 are stacked sequentially from top to bottom to form a stable three-layer integrated structure, which enables the batch loading and precise positioning of the microneedles 50.

[0052] The three-layer bonding structure design of this embodiment fundamentally solves the technical problems of low clamping efficiency and poor positioning accuracy of traditional microneedle processing fixtures. The high-strength material of the substrate 10 ensures the load-bearing stability of the entire fixture, effectively avoiding positioning deviations caused by deformation of the basic components during processing, and providing a basic guarantee for subsequent processing accuracy. The wear-resistant material of the needle plate 20 and the design of the precision needle holes 22 enable array-style batch clamping of the microneedles 50. Compared with the traditional single-needle clamping method, the clamping efficiency is increased by tens of times, which is especially suitable for batch processing of microneedles with a size of 0.1-1mm, and significantly reduces labor costs and labor intensity. The hollow part of the positioning plate 30 corresponds precisely to the needle hole area, which not only provides exposed space for the end of the microneedle to be processed, but also forms a relatively closed area with the needle plate 20, which can effectively prevent glue or wax from overflowing during subsequent glue or waxing processes, and ensure the firmness of the microneedle fixation. Meanwhile, the flat and large end face of the positioning plate 30 can serve as a positioning reference for the processing tools. By recognizing the end face contour or preset marking points of the positioning plate 30, the intelligent processing equipment can quickly and accurately determine the processing position of each microneedle 50, with positioning errors controlled at the micrometer level, significantly improving the consistency of batch processing. The tightly fitted three-layer structure also enhances the overall rigidity of the fixture, reducing microneedle displacement or breakage caused by vibration during processing, improving the yield of microneedle processing, and providing a reliable guarantee for the high-precision requirements of microneedles in medical, cosmetic and other fields.

[0053] In one embodiment, the end of the needle plate 20 facing the substrate 10 has a recessed portion corresponding to the needle hole area; wherein, after the needle plate 20 is attached to the positioning plate 30, the recessed portion and the substrate 10 form a receiving space for receiving the glue or wax used to fix the microneedle 50 during processing.

[0054] In this embodiment, a recess is machined at the end of the needle plate 20 facing the substrate 10 (i.e., the lower end surface of the needle plate 20) at the position corresponding to the pinhole area. The shape of the recess is consistent with the shape of the pinhole area. In this embodiment, the pinhole area is rectangular, so the recess is also designed to be rectangular (e.g., ...). Figure 3 (As shown). The depth of the recess is precisely calculated and designed to be 0.3-0.8mm. The specific depth is determined based on the amount of adhesive or wax to be injected, ensuring that enough adhesive or wax can be accommodated to completely fix the microneedles 50. The edges of the recess are designed with rounded corners, with a radius of 0.2-0.5mm. This design avoids stress concentration caused by sharp angles, extends the service life of the needle plate 20, and facilitates the flow and filling of adhesive or wax within the accommodating space. When the needle plate 20 is tightly attached to the substrate 10, a closed accommodating space is formed between the recess of the needle plate 20 and the upper surface of the substrate 10. The outline of this accommodating space completely coincides with the pinhole area, and each pinhole 22 is connected to this accommodating space, ensuring that adhesive or wax can smoothly enter the gap between the pinhole 22 and the microneedles 50. After the microneedles 50 are inserted into the pinholes 22 in batches by the aligner, the glue or wax is poured into the pinhole area through the hollow part of the positioning plate 30, and then flows into the receiving space to fill the gap between the microneedles 50 and the wall of the pinhole 22 and the empty part of the receiving space. After the glue or wax has cured, the microneedles 50 can be firmly fixed in the pinholes 22, providing stable support for subsequent processing.

[0055] In this embodiment, by providing a recess on the needle plate 20 and forming a receiving space with the substrate 10, the fixing effect of the microneedles is significantly optimized, bringing several technical advantages. First, the receiving space provides a dedicated storage area for adhesive or wax, ensuring sufficient amount of adhesive or wax to completely cover the fixing end of the microneedle 50, avoiding the problem of weak fixing due to insufficient adhesive or wax, effectively resisting the influence of cutting force and grinding force on the microneedles during processing, and greatly reducing the risk of loosening, displacement or breakage of the microneedles 50. Second, the rounded corner transition design of the recess promotes the flow of adhesive or wax, allowing the adhesive or wax to fill the gap of each needle hole 22 evenly, ensuring consistent fixing strength of each microneedle 50, further improving the stability of batch processing, and avoiding differences in processing accuracy caused by weak fixing of some microneedles. At the same time, the good sealing of the receiving space can prevent the adhesive or wax from flowing out during the pouring and curing process, avoiding material waste, and reducing the contamination of other parts of the fixture by the overflow of adhesive or wax, reducing the cleaning difficulty and maintenance cost of the fixture. Compared to traditional fixture designs without dedicated space, this structure improves the reliability of microneedle fixation and enhances the rigidity of the cured microneedle array, providing a stable foundation for subsequent high-precision machining. It is particularly suitable for machining processes such as microneedle end face grinding and polishing, which require high fixation strength, and can effectively improve the surface quality and dimensional accuracy of the finished microneedle.

[0056] In one embodiment, a groove is provided at one end of the needle plate 20 facing the substrate 10, one end of the groove is connected to the recessed portion, and the other end extends to the side of the needle plate 20; wherein, after the needle plate 20 is attached to the positioning plate 30, the groove and the substrate 10 form an air passage for connecting to an external vacuum pumping device.

[0057] In this embodiment, the needle plate 20 has one or more grooves on its lower end face facing the substrate 10. The cross-sectional shape of the grooves can be U-shaped or V-shaped, and in this embodiment, a U-shaped groove is preferred. The width of the groove is designed to be 0.5-1mm, and the depth is consistent with the depth of the recessed part to ensure smooth communication between the groove and the recessed part without any steps. One end of the groove is directly connected to the recessed part on the needle plate 20, and the connection point adopts a smooth transition design to further ensure smooth flow of gas and glue or wax. The other end of the groove extends along the length or width of the needle plate 20 until it penetrates the side of the needle plate 20, forming an external interface of the air passage for connection to the connecting pipe of an external vacuum pumping device. When the needle plate 20 is tightly attached to the substrate 10, a closed air passage is formed between the groove on the needle plate 20 and the upper end face of the substrate 10. One end of the air passage is connected to the receiving space, and the other end is connected to the external vacuum pumping device through the interface on the side of the needle plate 20. After injecting the adhesive or wax into the containment space, the vacuum pump is activated to evacuate the containment space through the air passage, creating a stable negative pressure environment. The negative pressure promotes the adhesive or wax to fill the tiny gaps between the microneedles 50 and the pinholes 22 more quickly and evenly, while efficiently expelling air from the containment space to prevent air bubbles from forming and ensure filling quality.

[0058] In this embodiment, the air duct design provides a negative pressure-assisted filling mechanism for the microneedle fixation process, significantly improving the reliability and efficiency of microneedle fixation. First, the negative pressure environment effectively removes air from the containment space, eliminating the problem of uneven fixation strength caused by air bubbles after the adhesive or wax has cured. This prevents the microneedle 50 from shifting due to localized weak fixation during processing, significantly improving the reliability of microneedle fixation and increasing the yield of microneedle processing. Second, the suction generated by the negative pressure promotes the flow of the adhesive or wax, especially for high-viscosity adhesives or waxes, quickly filling the tiny gaps (typically at the micrometer level) between the microneedle 50 and the pinhole 22. This solves the technical problem of traditional injection methods where adhesives or waxes cannot completely fill the gaps, ensuring no gaps between the microneedle 50 and the wall of the pinhole 22, further enhancing the fixation firmness and enabling the microneedle to withstand greater cutting and grinding forces during processing. Furthermore, the negative pressure filling method significantly shortens the filling time of adhesives or waxes, greatly improving filling efficiency compared to traditional natural filling methods. This enhances the overall efficiency of microneedle clamping, saving considerable waiting time and significantly increasing production cycle time for batch processing. The air channel structure is simple in design, does not affect the overall strength and dimensional accuracy of the fixture, and the external interface facilitates connection with conventional vacuum pumping devices. Its versatility allows it to be used with different types of adhesives or waxes for fixing, expanding the fixture's applicability and providing flexible support for the diverse needs of microneedle processing.

[0059] In one embodiment, a heating element and a cooling element are provided on the side of the substrate 10 near the needle plate 20, corresponding to the needle hole area, for heating or cooling the adhesive or wax in the containment space.

[0060] In this embodiment, the substrate 10 adopts a double-layer structure design. Heating and cooling elements are embedded in the substrate 10 on the side closest to the pin plate 20 (i.e., the upper layer of the substrate 10), corresponding to the pinhole areas. Both heating and cooling elements are sheet-like structures, and their dimensions match the dimensions of the pinhole areas to ensure uniform heating or cooling of the space and avoid localized temperature differences. Ceramic heating elements are used, characterized by fast heating speed and high temperature control accuracy. The heating temperature range is adjustable from 40-120℃, and precise temperature control is achieved through a matching temperature controller, with a temperature control error within ±1℃. Semiconductor cooling elements are used, with a cooling temperature range of -10-30℃. The cooling power is also adjusted through a dedicated temperature control module to ensure stable cooling performance. The heating and cooling elements are alternately distributed inside the substrate 10, with a spacing of 5-10mm between adjacent heating and cooling elements. This distribution ensures uniform temperature distribution and avoids localized overheating or overcooling. The substrate 10 is also equipped with a temperature sensor to monitor the surface temperature of the substrate 10 corresponding to the receiving space in real time, and feeds the temperature signal back to the temperature control system in real time to realize automatic switching and precise control of heating and cooling. When glue or wax is poured into the receiving space, the temperature control system activates the heating element to increase the temperature of the glue or wax, enhance its fluidity, and ensure full filling; after filling is completed, the temperature control system automatically turns off the heating element and activates the cooling element to reduce the temperature, accelerate the curing of the glue or wax, and shorten the waiting time.

[0061] In this embodiment, by setting heating and cooling plates inside the substrate 10, precise temperature control of the adhesive or wax is achieved, significantly optimizing the efficiency and effect of microneedle fixation and demonstrating significant technical advantages. The heating plate effectively improves the fluidity of the adhesive or wax, especially for materials whose viscosity increases at low temperatures. Heating reduces the viscosity, making it easier to fill the tiny gap between the microneedle 50 and the pinhole 22, while shortening the filling time. This solves the technical problem of difficult adhesive or wax infusion at low temperatures, ensuring the stability of microneedle fixation under different ambient temperatures. The cooperation between the temperature sensor and the temperature control system allows for precise control of the heating temperature within the optimal flow temperature range of the adhesive or wax, preventing deterioration due to excessively high temperatures or reduced fluidity due to excessively low temperatures. This ensures the stability of the fixation material's performance and thus guarantees the reliability of microneedle fixation. The application of the cooling plate significantly accelerates the curing speed of the adhesive or wax. Compared to natural cooling, the curing time is greatly shortened, improving the efficiency of microneedle clamping and allowing the fixture to quickly enter subsequent processing stages, thus improving overall production efficiency. For large-scale mass production, this significantly increases production capacity. In addition, the uniformly distributed heating and cooling plates ensure uniform temperature within the containment space and consistent curing speed of the adhesive or wax. This avoids uneven microneedle fixing stress caused by local curing speed differences, reduces deformation of the microneedles 50 due to stress release, and further improves the precision and yield of microneedle processing. It is suitable for large-scale microneedle production scenarios with high requirements for processing efficiency and precision, and provides strong support for the large-scale and standardized production of microneedles.

[0062] In one embodiment, a plurality of electromagnets 12 are provided on the back side of the substrate 10 away from the needle plate 20; wherein the needle plate 20 and / or the positioning plate 30 are made of a material that attracts the electromagnets 12.

[0063] In this embodiment, a plurality of recesses (such as...) are uniformly provided on the back side of the substrate 10 away from the needle plate 20 (i.e., the lower end surface of the substrate 10). Figure 2As shown, the number of sinks is rationally designed according to the size of the substrate 10 to ensure uniform distribution of adsorption force. An electromagnet 12 is fixedly installed in each sink to ensure sufficient adsorption force for tight adhesion between the layers. The electromagnet 12 is fixed in the sink with bolts or high-strength adhesive. After installation, the surface of the electromagnet 12 is flush with the back of the substrate 10 to avoid affecting the stability of the substrate 10 on the workbench of the aligning machine. The needle plate 20 is made of iron alloy, which has good magnetic conductivity and can generate a strong adsorption effect with the electromagnet 12; the positioning plate 30 is made of nickel alloy, which also has excellent magnetic conductivity, further enhancing the adsorption effect. When the electromagnet 12 is energized, it quickly generates a strong magnetic field, which produces a uniform attraction force on the needle plate 20 and the positioning plate 30, causing the substrate 10, needle plate 20 and positioning plate 30 to be tightly attracted together. The gap between the mating surfaces is controlled within 0.001mm, forming a stable overall structure. When the processing is completed, the electromagnet 12 is de-energized, the magnetic field disappears instantly, and the layers can be easily disassembled to remove the processed microneedles 50. The operation is convenient and efficient.

[0064] In this embodiment, the electromagnet 12's adsorption structure design significantly improves the bonding stability and ease of operation between the various layers of the fixture, bringing multiple technical advantages. The strong adsorption force generated by the electromagnet 12 enables the substrate 10, needle plate 20, and positioning plate 30 to form a stable whole. Compared with traditional mechanical connection methods, the adsorption force distribution is more uniform, and the gap between the bonding surfaces is smaller, effectively preventing layer displacement caused by vibration or external force during processing. This ensures the relative positional accuracy of structures such as the pinhole 22, the accommodating space, and the air passage, providing a reliable guarantee for the precise positioning and fixation of the microneedle 50, and controlling the positioning error of microneedle processing to the micrometer level. The on / off control method of the electromagnet 12 is simple to operate, eliminating the need for cumbersome disassembly and installation steps, greatly shortening the assembly and disassembly time of the fixture, and improving the overall efficiency of microneedle processing. Compared with traditional mechanical connection methods, the assembly and disassembly efficiency of the fixture is greatly improved. Meanwhile, the adsorption fixing method does not damage the bonding surfaces of each layer, avoiding indentations or deformation caused by screw tightening in mechanical connections, extending the service life of the fixture, and reducing equipment maintenance costs. The needle plate 20 and positioning plate 30 are made of materials that attract the electromagnet 12, ensuring the reliability of the adsorption effect. Furthermore, a wide range of adsorption materials can be selected, allowing for flexible combinations based on actual processing needs and cost budgets. In addition, the adsorption force of the electromagnet 12 can be precisely controlled by adjusting the current, making it suitable for needle plates 20 and positioning plates 30 of different thicknesses and materials. This expands the applicability of the fixture, providing flexible support for diverse microneedle processing needs and enhancing the versatility and practicality of the equipment.

[0065] In one embodiment, the substrate 10 is provided with a plurality of first pin holes 11; the needle plate 20 is provided with a plurality of second pin holes 21 that are directly opposite to the first pin holes 11; the positioning plate 30 is provided with a plurality of third pin holes 31 that are directly opposite to the first pin holes 11; the substrate 10, the needle plate 20 and the positioning plate 30 are connected by pins 40 through the first pin holes 11, the second pin holes 21 and the third pin holes 31.

[0066] In this embodiment, four first pin holes 11 are provided on the substrate 10 (e.g., ...). Figure 3 As shown, the four corners of the substrate 10 have the following pin holes: the first pin hole 11 is a blind hole with a diameter accuracy of H7 and a depth of 10-15mm, ensuring that the pin 40 can be firmly inserted without loosening. The pin plate 20 has four second pin holes 21 corresponding to the first pin hole 11, and the positioning plate 30 has four third pin holes 31 corresponding to the first pin hole 11. Both the second and third pin holes 21 are through holes with a diameter also machined to H7 grade, and their diameters are completely consistent with those of the first pin holes 11, ensuring that the pin 40 can pass through smoothly and guaranteeing the fitting accuracy. The pin 40 is made of high-strength alloy steel, with a surface hardened to a hardness of HRC55-60, possessing good wear resistance and shear strength. The length of the pin 40 is equal to the sum of the thickness of the base plate 10, the pin plate 20, and the positioning plate 30. The pin 40 and the three pin holes adopt a transition fit, with the fit clearance controlled between 0.001-0.003mm, ensuring both tightness of connection and ease of disassembly. During assembly, the pin plate 20 is first placed stably on the base plate 10, and the second pin hole 21 is precisely aligned with the first pin hole 11 through visual positioning or tooling positioning. Then, the positioning plate 30 is placed on the pin plate 20, and the third pin hole 31 is also precisely aligned with the second pin hole 21 through precise positioning. Finally, the pin 40 is passed through the third pin hole 31 and the second pin hole 21 in sequence, and slowly inserted into the first pin hole 11 to complete the positioning connection of the three parts. Combined with the attraction force of the electromagnet 12, double fixation is achieved to ensure structural stability.

[0067] In this embodiment, the positioning connection structure of pin 40 and the adsorption structure of electromagnet 12 form a dual guarantee, greatly improving the positioning accuracy and structural stability of the fixture, and has significant technical advantages. The high-precision cooperation between pin 40 and the three pin holes ensures the relative positional accuracy between the substrate 10, pin plate 20, and positioning plate 30, making key structures such as pin hole 22, hollow part, accommodating space, and air passage precisely aligned, with the positioning error controlled within 0.002mm. This effectively avoids microneedle clamping deviation caused by layer misalignment, laying a solid foundation for the high-precision machining of microneedle 50 and improving the dimensional accuracy of the finished microneedle. The pin connection method can withstand a certain amount of lateral shear force, and combined with the axial adsorption force of electromagnet 12, it forms an all-round fixing effect, which can effectively resist external forces such as vibration and cutting force generated during processing, prevent relative displacement between layers, further improve the overall rigidity of the fixture, and keep the fixture stable under high-speed or heavy-duty processing scenarios, avoiding processing defects caused by fixture deformation. Compared to a single adsorption fixation method, the dual-fixation structure offers higher reliability. Even in the event of an unexpected power outage of the electromagnet 12, the pins 40 maintain the relative positions of each layer, preventing product scrap or equipment damage due to fixture failure during processing and reducing production risks. Furthermore, the pin connection is easy to disassemble and install, and the high-strength material of the pins 40 ensures a long service life and allows for repeated use, reducing fixture maintenance costs. This structural design is suitable for microneedle processing scenarios requiring extremely high positioning accuracy, such as ultra-precision grinding and laser processing of microneedle ends. It can significantly improve the dimensional and geometric accuracy of finished microneedles, meeting the stringent requirements of high-end fields such as medical and cosmetic medicine.

[0068] In one embodiment, the pinhole 22 is a pinhole 22 that is inclined relative to the top surface of the pin plate 20.

[0069] In this embodiment, the pinholes 22 on the pin plate 20 are inclined relative to the top surface of the pin plate 20. The inclination angle can be flexibly designed according to the processing requirements of the microneedle 50 end face to meet common inclined microneedle processing requirements. The inclination direction of the pinholes 22 is uniform, all tilting in the same direction, ensuring that the microneedles 50 processed in batches have the same inclination angle, thus ensuring product consistency. The inclined structure of the pinholes 22 is processed by precision drilling equipment. An angle positioning fixture is used during drilling, and the angle error of the fixture is controlled within ±0.1°, ensuring that the inclination angle error of each pinhole 22 is controlled within ±0.5°, and the inclination direction consistency error of adjacent pinholes 22 does not exceed ±0.2°, meeting the accuracy requirements of batch processing. The diameter of the pinhole 22 still matches the outer diameter of the microneedle 50. After tilting, the microneedle 50 is inserted into the pinhole 22, with its end to be processed protruding from the end face of the positioning plate 30 and exhibiting the same tilt as the pinhole 22. The processing tool only needs to process in a horizontal direction to form a bevel at the end of the microneedle 50 at a preset angle, without the need to adjust the angle of the processing tool, thus simplifying the processing flow. In addition, the hole wall of the pinhole 22 is precision polished, with a surface roughness Ra≤0.8μm, which reduces the frictional resistance when the microneedle 50 is inserted, prevents the surface of the microneedle 50 from being scratched, and ensures the surface quality of the microneedle.

[0070] In this embodiment, the inclined pinhole 22 design provides an efficient and precise solution for the bevel machining of microneedle end faces, offering significant technical advantages. Traditional microneedle bevel machining requires adjusting the angle of the machining tool or the clamping angle of the microneedle, which is complex and makes it difficult to ensure consistency in batch processing. In this embodiment, the inclined pinhole 22 ensures that the microneedle 50 is in a preset inclined state after clamping, eliminating the need to adjust the machining tool angle. Only conventional planar machining is required to obtain the desired bevel, significantly simplifying the machining process and improving efficiency compared to traditional methods. The tilt angle of each pinhole 22 is precisely controlled to ensure consistent bevel angles in batch-processed microneedles 50, with an error controlled within ±0.5°. This significantly improves product consistency, meets the stringent requirements for microneedle bevel angles in medical and cosmetic fields, and reduces product scrap due to angle deviations. The polished walls of the inclined needle holes 22 reduce the risk of damage during microneedle insertion, protect the surface quality of the microneedles 50, and prevent surface scratches from affecting their performance. This is especially beneficial for microneedles used in skin care or medical injections, as improved surface quality effectively reduces the risk of irritation and infection. Furthermore, the tilt angle can be flexibly designed to meet specific needs. By changing the needle plates 20 with different tilt angles, microneedles with varying bevel angles can be processed without modifying the entire fixture. This reduces production costs, expands the fixture's applicability, provides convenient support for diverse microneedle processing requirements, and enhances the equipment's market competitiveness.

[0071] Reference Figure 4 This application also provides a microneedle fabrication method, implemented using the microneedle fabrication fixture in any of the above embodiments, including:

[0072] S1: Insert the microneedle into the needle, wherein the end of the microneedle to be processed protrudes from the end face of the positioning plate;

[0073] S2: Apply glue or wax to the pinhole area to fix the microneedle inside the pinhole;

[0074] S3: Use processing tools to process the microneedles inside the pinhole.

[0075] The microneedle processing method of this embodiment is based on the microneedle processing fixture described above. The specific steps are as follows: First, a microneedle insertion operation is performed. The assembled microneedle processing fixture (base plate 10, needle plate 20, and positioning plate 30 are connected by pins 40 and fixed by electromagnet 12) is fixed to the worktable of the alignment machine with bolts to ensure that the fixture is stable and will not shift during the vibration of the alignment machine. The microneedles 50 to be processed (0.1-1mm in size) are poured into the hopper of the alignment machine in batches. The alignment machine is started, and controllable vibration is generated by the preset vibration frequency (50-100Hz) and vibration direction. The vibration force and the gravity of the microneedles 50 are used to move the microneedles 50 in an orderly manner towards the needle hole area of ​​the needle plate 20 and into the needle hole 22. After insertion, a visual inspection device is used to check whether each needle hole 22 has been inserted with a microneedle 50 to ensure that there is no missing or incorrect insertion. At the same time, it is ensured that the end of the microneedle 50 to be processed protrudes from the end face of the positioning plate 30 to meet the requirements of subsequent processing. Next, perform the glue or wax fixing operation. Select epoxy glue or low-temperature wax with good fluidity, moderate hardness after curing, and easy removal as the fixing material. Through the hollow part of the positioning plate 30, use a metering injection device to evenly inject the glue or wax into the pinhole area, avoiding the formation of air bubbles. The injection volume should be sufficient to completely fill the accommodating space and the gap between the pinhole 22 and the microneedle 50, usually 1.1-1.2 times the volume of the accommodating space, to ensure full filling. After injection, let it stand for 5-10 minutes to allow the glue or wax to fully penetrate into the gap between the microneedle 50 and the pinhole 22, ensuring a firm fixation. Finally, the microneedle processing operation is performed. According to the processing requirements of the end face of the microneedle 50 (such as bevel, arc, polishing), a precision grinding tool or laser processing tool is selected. The processing position is determined based on the end face of the positioning plate 30. The processing tool is moved to the target position by the CNC system. The end face of the microneedle 50 to be processed is processed according to the preset processing parameters (such as grinding speed 5000-10000rpm, processing depth 0.01-0.1mm). After the processing is completed, the processing equipment is turned off, and the machine waits for subsequent disassembly and needle removal.

[0076] In this embodiment, the microneedle processing method, through its synergistic cooperation with a dedicated fixture, completely solves the technical challenges of difficult clamping, low efficiency, and poor precision in traditional microneedle processing. The application of the alignment machine enables batch, automated insertion of microneedles 50. Compared to manual single-needle insertion, clamping efficiency is increased by tens or even hundreds of times, significantly reducing labor costs and intensity. Simultaneously, it avoids problems such as microneedle damage and clamping misalignment caused by manual operation, improving the cleanliness and integrity of the microneedles and increasing the clamping qualification rate. The fixation method using glue or wax, combined with the fixture's accommodating space and air passage structure, ensures the firmness of the microneedles 50, effectively resisting cutting and grinding forces during processing, reducing the risk of microneedle breakage and displacement. Furthermore, the glue or wax can be easily removed subsequently by heating or dissolving without affecting the performance of the microneedles 50, avoiding the impact of residual fixing materials on their use. The machining positioning method based on the positioning plate 30 fully utilizes its advantages of large end-face area and stable positioning reference, avoiding the difficulties of directly positioning the ends of tiny microneedles. This results in high positioning accuracy, controlling the end-face dimensional error of batch-processed microneedles 50 to the micrometer level, significantly improving product consistency and stability, and meeting the high-precision requirements of microneedles in medical, cosmetic, and other fields. The entire method has clear steps, a high degree of automation, and is compatible with microneedle processing of different specifications and end-face processing needs. It is highly versatile and can significantly improve the efficiency, accuracy, and yield of microneedle processing, providing reliable technical support for the large-scale, standardized production of microneedles. It is applicable to microneedle manufacturing scenarios in multiple fields such as medical, cosmetic, and sensing, and has broad market application prospects.

[0077] In one embodiment, when a heating plate and a cooling plate are provided inside the substrate 10 of the microneedle processing fixture on the side close to the needle plate 20, corresponding to the needle hole area, for heating or cooling the adhesive or wax in the receiving space, adhesive or wax is poured into the needle hole area to fix the microneedle inside the needle hole, including:

[0078] S21: Inject fluid adhesive or wax into the pinhole area and activate the heating element in the substrate to improve or maintain the fluidity of the adhesive or wax.

[0079] S22: Use a vacuum pumping device to create a vacuum in the containment space through the air passage to create negative pressure and promote the filling of glue or wax.

[0080] S23: After a preset time, heating stops and the cooling element is activated to accelerate the curing of the adhesive or wax.

[0081] In this embodiment, a fluid adhesive or wax material is first prepared. If the initial viscosity of the adhesive or wax is high, preheating can be performed in advance to ensure that the initial fluidity meets the filling requirements. Through the hollow portion of the positioning plate 30, a quantitative filling device is used to fill the pinhole area with the adhesive or wax. The filling amount is determined by completely filling the accommodating space and the gap between the pinhole 22 and the microneedle 50, typically 1.1-1.2 times the volume of the accommodating space, ensuring sufficient filling and avoiding insufficient filling. Simultaneously, the heating element inside the substrate 10 is activated, and the heating temperature is set to the optimal flow temperature of the adhesive or wax (e.g., 60-80℃ for epoxy adhesive, 40-50℃ for low-temperature wax) through a temperature control system. Continuous heating is used to improve or maintain the fluidity of the adhesive or wax, avoiding insufficient filling due to increased viscosity. The temperature control error is kept within ±1℃ to ensure stable flow performance. Next, an external vacuum pump is activated to evacuate the accommodating space through the air passage. The vacuum degree is set to -0.08 to -0.09 MPa to create a stable negative pressure environment. Negative pressure quickly expels air from the containment space and gaps, while simultaneously promoting the penetration of adhesive or wax into minute gaps, shortening the filling time and significantly improving filling efficiency compared to vacuum-free systems. During the vacuuming process, a vacuum sensor (a type of gas pressure sensor) continuously monitors the vacuum level to ensure stable negative pressure. If a drop in vacuum occurs, the air passage sealing is checked promptly to eliminate any leaks. Finally, after a preset time, visual inspection or pressure testing confirms that the adhesive or wax has completely filled all gaps. The vacuum pump is then turned off, the heating element is stopped, and the cooling element is activated. The cooling temperature is set to 10-20℃, and the cooling rate is controlled by a temperature control system to prevent cracking of the adhesive or wax due to excessively rapid cooling, which would affect the fixing effect. After 5-10 minutes of cooling, the adhesive or wax is completely cured and can proceed to subsequent processing stages.

[0082] In this embodiment, the glue or wax fixation method achieves efficient and thorough filling and rapid curing of glue or wax through the synergistic effect of heating, negative pressure, and cooling, significantly improving the quality and efficiency of microneedle fixation and demonstrating outstanding technical advantages. The precise temperature control of the heating element ensures that the glue or wax maintains optimal fluidity, solving the problem of difficult filling of high-viscosity materials. This ensures that the glue or wax can penetrate the micron-level gap between the microneedle 50 and the pinhole 22, avoiding filling dead zones and making the fixation of the microneedle 50 more secure and uniform, increasing fixation strength and effectively resisting external forces during processing. The creation of a negative pressure environment effectively removes air, eliminating the generation of air bubbles and preventing uneven fixation strength caused by air bubbles. This reduces the risk of displacement or breakage of the microneedle 50 due to localized weak fixation during processing, improving the reliability of microneedle fixation and increasing the yield of microneedle processing. The application of the cooling element significantly shortens the curing time of the glue or wax. Compared with natural cooling, the curing efficiency is greatly improved, allowing the fixture to quickly enter the processing stage, increasing the overall production cycle. For large-scale mass production, this can significantly increase production capacity and reduce production costs. The entire fixation process is highly automated, achieving precise control through temperature and vacuum control systems. It is easy to operate, requires minimal human intervention, and reduces product defects caused by human error, ensuring the stability and consistency of batch processing and improving product qualification rates. Furthermore, this method is applicable to various types of adhesives or waxes, expanding the material selection range for microneedle processing and providing flexible support for microneedle processing with different performance requirements, thus enhancing production flexibility and adaptability.

[0083] In one embodiment, when a plurality of electromagnets 12 are provided on the back side of the substrate 10 of the microneedle processing fixture away from the needle plate 20, inserting the microneedle into the needle hole includes:

[0084] S11: Connect the substrate, pin plate and positioning plate using pins through the first pin hole, the second pin hole and the third pin hole;

[0085] S12: Use a aligner to insert the microneedles into the needle holes;

[0086] S13: Activate the electromagnet to attract and fix the base plate, needle plate and positioning plate together.

[0087] In this embodiment, when using a microneedle machining fixture with an electromagnet 12 and pin holes, the specific operation of the microneedle insertion step is as follows: First, the fixture is assembled and positioned. The substrate 10 is placed on a flat workbench, and the position of the substrate 10 is adjusted using a level to ensure that the substrate 10 is placed horizontally, with the levelness error controlled within 0.002 mm / m. The needle plate 20 is placed stably on the upper surface of the substrate 10, and the position of the needle plate 20 is adjusted using a vision positioning system so that the second pin hole 21 on the needle plate 20 is precisely aligned with the first pin hole 11 on the substrate 10, with the alignment error controlled within 0.002 mm, ensuring that the pin 40 can be inserted smoothly. Next, the positioning plate 30 is placed on the upper surface of the needle plate 20, and the position of the positioning plate 30 is also adjusted using a vision positioning system so that the third pin hole 31 on the positioning plate 30 is precisely aligned with the second pin hole 21, ensuring the coaxiality of the pin holes of the three. Next, select a pin 40 that matches the pin hole, and pass the pin 40 through the third pin hole 31 and the second pin hole 21 in sequence, and slowly insert it into the first pin hole 11. During the insertion process, avoid excessive force to prevent damage to the pin hole or the pin, and ensure that the pin 40 fits tightly with the three pin holes without any looseness, thus completing the pin positioning connection of the base plate 10, the needle plate 20, and the positioning plate 30. Subsequently, fix the assembled fixture to the worktable of the alignment machine with bolts to prevent the fixture from shifting when the alignment machine vibrates. Pour the micro needles 50 to be processed into the hopper of the alignment machine in batches. According to the size of the micro needles 50 and the parameters of the pin hole 22, set the vibration parameters of the alignment machine, start the alignment machine, and use vibration to guide the micro needles 50 into the pin holes 22 of the needle plate 20 in an orderly manner. After insertion, a visual inspection device is used to comprehensively inspect the insertion status of each pin hole 22 to ensure that there are no missing or incorrect insertions, and that the protruding length of the microneedle 50 to be processed meets the preset requirements (0.1-0.5mm). Finally, the electromagnet 12 on the back of the substrate 10 is activated and the power supply is turned on (voltage is 24V, current is 1-2A). The electromagnet 12 quickly generates a strong magnetic field, producing a uniform attraction force on the pin plate 20 and the positioning plate 30, so that the three are tightly attracted together. The gap between the mating surfaces is controlled within 0.001mm, completing the double fixation of the fixture and providing a stable and reliable structural foundation for subsequent glue or waxing operations and processing operations.

[0088] In this embodiment, the microneedle insertion method, through the dual fixation of pin 40 positioning and electromagnet 12 attraction, ensures the stable connection of each layer of the fixture and the precise clamping of the microneedles, bringing significant technical advantages and practical value. The high-precision positioning connection of pin 40 ensures the relative positional accuracy between the substrate 10, the needle plate 20, and the positioning plate 30, enabling precise alignment of key structures such as the needle hole 22 and the hollowed-out part. This avoids difficulties in microneedle insertion or clamping deviations caused by layer misalignment, ensuring that the microneedle 50 can be smoothly inserted into the needle hole 22 with precise positioning, laying a solid foundation for subsequent processing accuracy and controlling the positioning error of microneedle processing to the micrometer level. The application of the alignment machine enables the batch and automated insertion of microneedles 50. Compared with manual operation, it not only significantly improves clamping efficiency by tens of times, but also avoids problems such as microneedle contamination and damage caused by manual contact, improving the cleanliness and integrity rate of the microneedles. The adsorption and fixation of the electromagnet 12 further enhances the bonding stability of each layer plate. The adsorption force is uniform and strong, which can effectively resist the vibration of the alignment machine and the external forces generated during subsequent processing, prevent relative displacement between the layers plate, ensure the stable position of the microneedle 50 in the pin hole 22, avoid loosening or displacement after insertion, and improve the yield of microneedle processing. The double fixing structure has high reliability. Even if unexpected situations occur during processing, it can ensure the structural integrity of the fixture and the clamping stability of the microneedle, reduce the risk of product scrap, and significantly improve production safety and stability. In this embodiment, the electromagnet is activated only after the microneedle 50 is inserted into the pin hole 22. This is to prevent the microneedle 50 from being made of materials such as metal that attract magnets. Activating the electromagnet 12 in advance interferes with the alignment machine to insert the microneedle 50 into the pin hole 22. Furthermore, the electromagnet 12 is made of a low remanent magnetization material, and the magnetic field strength in the pin hole area is lower than a preset value when the power is off, ensuring no adsorption effect on the metal microneedle. The entire insertion process is standardized, clear, highly automated, and requires minimal human intervention, making it suitable for large-scale mass production. It can significantly improve the overall efficiency and product quality of microneedle processing, providing strong support for the standardization and large-scale production of microneedles and has broad application prospects.

[0089] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A microneedle machining fixture, characterized in that, include: substrate; The needle plate is stacked and tightly attached to the substrate. The needle plate is provided with a needle hole area, and the needle hole area is provided with multiple needle holes. The positioning plate is installed in close contact with the needle plate in a stacked manner, and the positioning plate is provided with a hollow part corresponding to the needle hole area; The end of the needle plate facing the substrate has a recessed portion corresponding to the needle hole area; Wherein, after the needle plate is attached to the positioning plate, the recessed portion and the substrate form a receiving space for accommodating the glue or wax used to fix the microneedles during the processing of the microneedles; The needle plate has a groove at one end facing the substrate, one end of the groove is connected to the recessed portion, and the other end extends to the side of the needle plate. Wherein, after the needle plate and the positioning plate are attached, the groove and the substrate form an air passage for connecting to an external vacuum pumping device; A heating element and a cooling element are provided on the side of the substrate near the needle plate, corresponding to the needle hole area, for heating or cooling the glue or wax in the accommodating space. A plurality of electromagnets are provided on the back side of the substrate away from the needle plate; The needle plate and / or the positioning plate are made of a material that attracts the magnet. The pinhole is inclined relative to the top surface of the pin plate.

2. The microneedle machining fixture according to claim 1, characterized in that, The substrate is provided with a plurality of first pin holes; the pin plate is provided with a plurality of second pin holes that are directly opposite to the first pin holes; the positioning plate is provided with a plurality of third pin holes that are directly opposite to the first pin holes. The base plate, pin plate, and positioning plate are connected using pins through the first pin hole, the second pin hole, and the third pin hole.

3. A microneedle fabrication method, implemented using the microneedle fabrication fixture as described in claim 1 or 2, characterized in that, include: The microneedle is inserted into the needle hole, wherein the end of the microneedle to be processed protrudes from the end face of the positioning plate; Apply glue or wax to the pinhole area to fix the microneedle inside the pinhole; The microneedles inside the pinholes are processed using processing tools.

4. The microneedle fabrication method according to claim 3, characterized in that, The process of injecting adhesive or wax into the pinhole area to fix the microneedle within the pinhole includes: A fluid adhesive or wax is injected into the pinhole area, and the heating element in the substrate is activated to improve or maintain the fluidity of the adhesive or wax. A vacuum pump is used to create a vacuum in the containment space through the air passage, thereby creating negative pressure to facilitate the filling of glue or wax. After a preset time, heating is stopped and the cooling element is activated to accelerate the curing of the adhesive or wax.

5. The microneedle fabrication method according to claim 4, characterized in that, When the microneedle machining fixture is the microneedle machining fixture according to claim 2, the step of inserting the microneedle into the needle hole includes: The substrate, pin plate, and positioning plate are connected using pins through the first pin hole, the second pin hole, and the third pin hole; The microneedles are inserted into the needle holes using a aligner; The electromagnet is activated to attract and fix the substrate, needle plate, and positioning plate together.

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