Clamp suitable for wafer electroplating, overturning mechanism and wafer clamping and overturning device

Abstract

The invention provides a clamp suitable for wafer electroplating, a turnover mechanism and a wafer clamping and turnover device, and particularly relates to the technical field of mechanical automation, the device comprises a clamp and turnover mechanisms symmetrically arranged on the two sides of the clamp, and the clamp and the turnover mechanisms form an integrated structure through embedding and fixing of a V-shaped block connecting plate and a turnover clamp fixing seat. The clamp comprises clamping plates, a base plate soft cushion, a cover plate, a cover plate sealing gasket, a pressing plate, a V-shaped block connecting plate, a pneumatic assembly and an O-shaped ring, the clamping plates are spliced into a hollow sealing body, the pneumatic assembly comprises eight lifting reciprocating assemblies and an electromagnetic valve, is arranged in the hollow sealing body and can drive the cover plate, the cover plate sealing gasket and the pressing plate to achieve the lifting action, and the O-shaped ring ensures the sealing performance. The turnover mechanism comprises a rotating assembly, a cylinder assembly and the like, the rotating assembly can drive the clamp to turn over synchronously, and the cylinder assembly and the probe assembly are matched to complete electroplating related operation. The overturning device is reasonable in structure, reliable in sealing and accurate and stable in overturning, and the operation efficiency and quality are improved.

Description

TECHNICAL FIELD

[0001] The application provides a clamp, a turnover mechanism and a wafer clamping and turnover device suitable for wafer electroplating, and particularly relates to the technical field of mechanical automation. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafer electroplating is a key process link for realizing wafer metallization, and has strict requirements for the performance of a clamping device and a turnover mechanism, and needs to meet core indexes such as clamping stability, sealing reliability, turnover accuracy and process adaptability, which directly affects the uniformity, density and product yield of the wafer electroplating layer. SUMMARY

[0003] In view of the defects in the prior art, the application provides a clamp, a turnover mechanism and a wafer clamping and turnover device suitable for wafer electroplating, which can effectively solve the related technical problems in the background art.

[0004] To achieve the above purpose, the application is implemented by the following technical scheme: A clamp suitable for wafer electroplating, comprising: A clamping plate assembly comprising a first clamping plate and a second clamping plate, which are spliced to form a hollow sealing body; A base plate soft pad assembly comprising a first base plate soft pad and a second base plate soft pad, which are respectively embedded in a first circular groove of the first clamping plate and a second circular groove of the second clamping plate; A cover plate assembly comprising a first cover plate and a second cover plate, which are respectively fixed on one side surface of the first clamping plate and the second clamping plate by screws; A cover plate gasket assembly comprising a first cover plate gasket and a second cover plate gasket, which are respectively assembled on the first cover plate and the second cover plate; A pressing plate assembly comprising a first pressing plate and a second pressing plate, wherein the first pressing plate is fixedly connected with the first cover plate and the first cover plate gasket as a whole by screws, and the second pressing plate is fixedly connected with the second cover plate and the second cover plate gasket as a whole by screws.

[0005] Further, one side surface of the first clamping plate and the second clamping plate is provided with a first special-shaped groove and a second special-shaped groove, and the other side surface of the first clamping plate and the second clamping plate is respectively provided with a first circular groove, a first recess and a second circular groove, a second recess.

[0006] Further, the first pressing plate and the second pressing plate are respectively provided with a first ear-equipped circular groove and a second ear-equipped circular groove; the sizes of the two grooves are respectively matched with the sizes of the first cover plate gasket and the second cover plate gasket.

[0007] Further, the application further comprises: The V-shaped block connecting plate is provided with a rectangular notch at both ends, one side is fastened and connected with the first clamping plate through a screw, and both ends are embedded in the V-shaped opening of the turnover clamp fixing base.

[0008] Further, it further comprises: The pneumatic assembly is composed of a first lifting reciprocating assembly, a second lifting reciprocating assembly, a third lifting reciprocating assembly, a fourth lifting reciprocating assembly, a fifth lifting reciprocating assembly, a sixth lifting reciprocating assembly, a seventh lifting reciprocating assembly, an eighth lifting reciprocating assembly, and a first electromagnetic valve; each lifting reciprocating assembly comprises a corresponding guide rod and a cylinder, and the first to eighth lifting reciprocating assemblies and the first electromagnetic valve are arranged in the hollow sealing body formed by the splicing of the first clamping plate and the second clamping plate, and the first electromagnetic valve is connected with each lifting reciprocating assembly one by one through a gas pipe; wherein the first to fourth guide rods are fixedly connected with the first cover plate and the first cover plate sealing gasket respectively, and the fifth to eighth guide rods are fixedly connected with the second cover plate and the second cover plate sealing gasket respectively.

[0009] Further, it further comprises: The O-shaped ring assembly comprises a first O-shaped ring and a second O-shaped ring, wherein the first O-shaped ring is embedded in the first recess on one side surface of the first clamping plate, and the second O-shaped ring is embedded in the second recess on one side surface of the second clamping plate.

[0010] A turnover mechanism suitable for wafer electroplating, comprising: The rotating assembly is composed of a joint module fixing plate, a rotating module, a photoelectric switch, a photoelectric switch sensing sheet, a connecting shaft sleeve, a bearing cover plate, and a bearing; The joint module fixing plate is assembled on the surface of the support plate at the upper part of the turnover column assembly, and is fixedly connected with the two side surfaces of the turnover column assembly through screws; The rotating module is tightly assembled in the center hole of the joint module fixing plate; The photoelectric switch is fastened to the corresponding side surface of the joint module fixing plate through a screw; The photoelectric switch sensing sheet is tightly assembled on one side surface of the bearing cover plate; One end surface of the connecting shaft sleeve is fixedly connected with the rotating module through a screw, and the other end is sleeved on the outer side of the cylindrical segment of the turnover transition box and is tightly fixed through the screws arranged on the side surface; The bearing cover plate is fixedly connected to one side surface of the turnover transition box; The bearing is embedded in the circular recess in the center of the bearing cover plate and is adaptively fitted with the inner wall of the recess.

[0011] Further, it further comprises: The overturning column assembly is a closed long groove structure composed of multiple plate pieces, a circular hole is arranged on the internal support member, and a third circular groove is arranged at the center of the hole.

[0012] Further, it also includes: The overturning transition box is fixed to the upper area of the corresponding side of the overturning column assembly.

[0013] Further, it also includes: The cylinder assembly is composed of a first sliding table cylinder, a first sliding table connecting block, a second sliding table cylinder, a second sliding table connecting block, a third sliding table cylinder, a connecting plate, a first probe assembly, a second electromagnetic valve, and a second probe assembly. The first sliding table cylinder is fixed to the bottom surface of the overturning transition box. The first sliding table connecting block is fastened to the sliding block surface of the first sliding table cylinder by screws. The second sliding table cylinder is assembled on the corresponding side surface of the vertical plate of the first sliding table connecting block. The second sliding table connecting block is fixed to the pre-set mounting hole of the second sliding table cylinder by screws. The third sliding table cylinder is fixed to the inner surface of the cover plate of the overturning transition box. The connecting plate is fastened to the pre-set mounting hole of the third sliding table cylinder. The first probe assembly is located at the front end of the movement direction of the third sliding table cylinder and is fixed to the corresponding surface of the connecting plate by screws. The second electromagnetic valve is installed on the inner surface of the overturning transition box. The second probe assembly is installed on the same side front end of the third sliding table cylinder.

[0014] Further, it also includes: The overturning transition box cover plate is installed on the top end surface of the overturning transition box.

[0015] Further, it also includes: The connecting block pressing block is fixed to the corresponding side surface of the second sliding table connecting block, and one end of the connecting block pressing block extends into the rectangular slot of the V-shaped block connecting plate.

[0016] Further, it also includes: The side sealing plate is provided with a long slot and a long groove in the central area, and is installed on one side end surface of the overturning transition box.

[0017] Further, it also includes: The overturning clamp fixing seat is provided with a V-shaped opening on the upper part, and the overturning clamp fixing seat B8 is embedded and fixed in the long groove of the side sealing plate.

[0018] Furthermore, the flipping mechanism is symmetrically arranged on both sides of the fixture. The fixture is fitted and fixed to the flipping fixture fixing seat of the flipping mechanism through the V-shaped block connecting plate it is assembled with. Specifically, the two ends of the V-shaped block connecting plate are fitted into the V-shaped opening of the flipping fixture fixing seat, and one side of the V-shaped block connecting plate is fastened to the first clamping plate of the fixture, so that the fixture and the flipping mechanism form an integrated structure. The rotating component of the flipping mechanism drives the fixture to flip synchronously through the flipping fixture fixing seat, thereby realizing the flipping operation in the wafer electroplating process.

[0019] Compared with the known prior art, the technical solution provided by this invention has the following beneficial effects: Firstly, it has excellent sealing performance, effectively avoiding the problem of electroplating solution leakage: The hollow sealing body is formed by splicing the clamping plate components, and a double sealing structure is constructed with O-ring components and cover plate sealing gasket components. The O-ring is precisely embedded in the corresponding groove of the clamping plate, and the cover plate sealing gasket fits and fits the groove of the pressure plate, which greatly improves the sealing reliability and prevents the electroplating solution from seeping into the fixture and corroding the drive and conductive components, ensuring the purity and uniformity of the wafer electroplating layer and reducing the waste of electroplating solution.

[0020] Secondly, it has strong clamping stability, protects the wafer and ensures electroplating accuracy: the substrate soft pad assembly fits against the wafer clamping surface to avoid edge damage caused by hard contact; the eight sets of lifting and reciprocating components of the pneumatic assembly are uniformly controlled by solenoid valves, and synchronously drive the cover plate and sealing gasket to ensure smooth opening and closing of the clamp, and the coaxiality and flatness of the wafer after clamping meet the standards, so that the current distribution is uniform during the electroplating process, and the problem of excessive deviation in electroplating layer thickness is solved.

[0021] Thirdly, the flipping mechanism is precise and stable, adapting to the needs of double-sided electroplating: the flipping mechanism and the fixture are fixed by the V-shaped block connecting plate and the V-shaped opening of the flipping fixture fixing seat to form a stable integrated structure; the rotating component is equipped with photoelectric switches and induction plates to achieve precise control of the flipping angle, avoid axial movement and radial offset during the flipping process, ensure high-precision alignment of the wafer double-sided electroplating, and improve the consistency of double-sided electroplating quality. Attached Figure Description

[0022] Figure 1 This is an assembly drawing of the fixture, flipping mechanism, and wafer clamping and flipping device for wafer electroplating proposed in this invention. Figure 2 This is a three-dimensional structural diagram of a fixture suitable for wafer electroplating proposed in this invention; Figure 3 This is a schematic diagram of a clamping plate assembly suitable for wafer electroplating proposed in this invention; Figure 4This is a diagram of a clamping plate assembly suitable for wafer electroplating proposed in this invention; Figure 5 This is a schematic diagram of a V-shaped block connecting plate for a fixture suitable for wafer electroplating proposed in this invention; Figure 6 This is a structural diagram of a pneumatic component for a fixture suitable for wafer electroplating proposed in this invention; Figure 7 This is a schematic diagram of an O-ring for wafer electroplating proposed in this invention; Figure 8 This is a three-dimensional structural diagram of a flipping mechanism suitable for wafer electroplating proposed in this invention; Figure 9 This is a structural diagram of a flipping column assembly for a flipping mechanism suitable for wafer electroplating proposed in this invention; Figure 10 This is a schematic diagram of a flipping transition box for a flipping mechanism suitable for wafer electroplating proposed in this invention; Figure 11 This is a structural diagram of a cylinder assembly for a flipping mechanism suitable for wafer electroplating proposed in this invention; Figure 12 This is a schematic diagram of a flipping transition box cover plate of a flipping mechanism suitable for wafer electroplating proposed in this invention; Figure 13 This is a schematic diagram of a flipping mechanism connecting block pressure block suitable for wafer electroplating proposed in this invention; Figure 14 This is a schematic diagram of a side sealing plate for a flipping mechanism suitable for wafer electroplating proposed in this invention; Figure 15 This is a schematic diagram of a flipping fixture fixing seat for a flipping mechanism suitable for wafer electroplating proposed in this invention; The labels in the diagram represent: A1-Clamping plate assembly, A11-First clamping plate, A111-First irregular groove, A112-First circular groove, A113-First groove, A12-Second clamping plate, A121-Second irregular groove, A122-Second circular groove, A123-Second groove, A2-Substrate pad assembly, A21-First substrate pad, A22-Second substrate pad, A3-Cover plate assembly, A31-First cover plate, A32-Second cover plate, A4-Cover plate sealing gasket assembly, A41-First cover plate sealing gasket, A42-Second cover plate sealing gasket, A5-Pressure plate assembly, A51-First pressure plate, A511- First circular groove with support lugs, A521 - Second circular groove with support lugs, A52 - Second pressure plate, A6 - V-shaped block connecting plate, A61 - Rectangular slot, A7 - Pneumatic assembly, A71 - First lifting reciprocating assembly, A711 - First guide rod, A712 - First cylinder, A72 - Second lifting reciprocating assembly, A721 - Second guide rod, A722 - Second cylinder, A73 - Third lifting reciprocating assembly, A731 - Third guide rod, A732 - Third cylinder, A74 - Fourth lifting reciprocating assembly, A741 - Fourth guide rod, A742 - Fourth cylinder, A75 - Fifth lifting reciprocating assembly, A751 - Fifth guide rod, A752 - Fifth cylinder, A76 - Sixth lifting reciprocating assembly, A761 - Sixth guide rod, A762 - Sixth cylinder, A77 - Seventh lifting reciprocating assembly, A771 - Seventh guide rod, A772 - Seventh cylinder, A78 - Eighth lifting reciprocating assembly, A781 - Eighth guide rod, A782 - Eighth cylinder, A79 - First solenoid valve, A8 - O-ring assembly, A81 - First O-ring, A82 - Second O-ring, B1 - Rotating assembly, B11 - Joint module fixing plate, B12 - Rotating module, B13 - Photoelectric switch, B14 - Photoelectric switch sensor, B15 - Connection Bushing, B16 - Bearing cover plate, B17 - Bearing, B2 - Tilting column assembly, B3 - Tilting transition box, B4 - Cylinder assembly, B41 - First slide cylinder, B42 - First slide connecting block, B43 - Second slide cylinder, B44 - Second slide connecting block, B45 - Third slide cylinder, B46 - Connecting plate, B47 - First probe assembly, B48 - Second solenoid valve, B49 - Second probe assembly, B5 - Tilting transition box cover plate, B6 - Connecting block pressure block, B7 - Side sealing plate, B71 - Long strip through groove, B72 - Long strip groove, B8 - Tilting clamp fixing seat, B81 - V-shaped opening. Detailed Implementation

[0023] The present invention will be further described below with reference to embodiments.

[0024] Currently, existing fixtures and flipping mechanisms for wafer electroplating still have many technical drawbacks in practical applications, making it difficult to meet the process requirements of high-precision wafer manufacturing: First, the sealing structure design is unreasonable, often using a single sealing layer or with insufficient compatibility between the seal and the mounting surface, causing the electroplating solution to easily seep into the internal cavity of the fixture. This not only wastes the electroplating solution but also corrodes the internal drive components and conductive structures, leading to equipment failure and affecting the purity and uniformity of the electroplated layer on the wafer surface. Second, the structural layout of the clamping components lacks optimization, and the contact method between the clamping plates and the wafer is improper, easily causing squeezing damage to the wafer edges. Furthermore, the coaxiality and flatness after clamping are difficult to guarantee, resulting in uneven current distribution during electroplating and thus excessive deviation in the thickness of the electroplated layer. Third, the flipping mechanism and fixture... The connection method lacks stability and precise positioning design, making it prone to axial movement or radial offset during the flipping process. This prevents high-precision alignment for double-sided wafer plating, resulting in poor consistency in plating quality. Fourth, the pneumatic drive components are scattered, with poor synchronization of various lifting and reciprocating movements. The opening and closing response of the fixtures is sluggish, and the coordination with the flipping action is low, hindering the improvement of production efficiency. Fifth, the integration of the fixtures and flipping mechanism is low, the disassembly and debugging process is cumbersome, and the flexibility to adapt to different wafer specifications is insufficient, making it difficult to meet the production needs of modern semiconductor manufacturing industry for multi-variety, high-precision, and high-efficiency production. Sixth, some devices have insufficient wear resistance and corrosion resistance. Long-term exposure to the electroplating solution environment can easily lead to component aging and failure, resulting in increased equipment maintenance costs and shortened service life.

[0025] To overcome the aforementioned drawbacks, the present invention employs the following embodiments to address the current situation.

[0026] Example 1: Reference Appendix Figure 1 A wafer clamping and flipping device includes a clamp and a flipping mechanism symmetrically arranged on both sides thereof. The clamp is fitted and fixed to the flipping clamp fixing seat B8 of the flipping mechanism through the V-shaped block connecting plate A6 assembled thereon. The two ends of the V-shaped block connecting plate A6 are fitted into the V-shaped openings B81 of the flipping clamp fixing seat B8. One side of the V-shaped block connecting plate A6 is fastened to the first clamping plate A11 of the clamp, so that the clamp and the flipping mechanism form an integrated structure. The rotating component B1 of the flipping mechanism drives the clamp to flip synchronously through the flipping clamp fixing seat B8.

[0027] like Figure 2 The image shows a fixture suitable for wafer electroplating, comprising: The clamping plate assembly A1 includes a first clamping plate A11 and a second clamping plate A12, which are joined together to form a hollow sealing body; The substrate pad assembly A2 includes a first substrate pad A21 and a second substrate pad A22, which are respectively embedded in the first circular groove A112 of the first clamping plate A11 and the second circular groove A122 of the second clamping plate A12. The cover plate assembly A3 includes a first cover plate A31 and a second cover plate A32, which are respectively fixed to one side surface of the first clamping plate A11 and the second clamping plate A12 by screws; The cover gasket assembly A4 includes a first cover gasket A41 and a second cover gasket A42, which are respectively mounted on the first cover plate A31 and the second cover plate A32. The pressure plate assembly A5 includes a first pressure plate A51 and a second pressure plate A52. The first pressure plate A51 is fixedly connected to the first cover plate A31 and the first cover plate sealing gasket A41 by screws, and the second pressure plate A52 is fixedly connected to the second cover plate A32 and the second cover plate sealing gasket A42 by screws.

[0028] In this embodiment, a hollow sealed body is formed by splicing the first clamping plate A11 and the second clamping plate A12, which provides an installation reference and accommodation space for subsequent functional components, and at the same time lays the foundation for the structural stability of the fixture.

[0029] The first substrate pad A21 and the second substrate pad A22 of the substrate pad assembly A2 are respectively embedded in the circular groove of the clamping plate and make flexible contact with the wafer surface. This can achieve precise positioning and stable clamping of the wafer, and avoid damage to the wafer edge or surface caused by hard contact.

[0030] The cover plate sealing gasket assembly A4 is assembled on top of the cover plate assembly A3. Together with the pressure plate assembly A5, the cover plate assembly A3 and the sealing gasket are fixed together to form a sealing and protective layer at the clamping part, which initially prevents the electroplating solution from seeping into the interior of the fixture.

[0031] The groove of the pressure plate assembly is adapted to the shape of the cover plate sealing gasket, which not only achieves precise positioning and fixation of the sealing gasket and prevents the sealing gasket from shifting and affecting the sealing effect, but also enhances the uniformity of the clamping pressure of the fixture on the wafer through the integrated connection with the cover plate and sealing gasket, ensuring the flatness and coaxiality of the wafer after clamping, and providing a guarantee for the uniformity of the electroplating layer.

[0032] like Figure 3 As shown, in another embodiment, the first clamping plate A11 and the second clamping plate A12 are respectively provided with a first irregular groove A111 and a second irregular groove A121 on one side surface, and the other side surface of the two are respectively provided with a first circular groove A112, a first groove A113 and a second circular groove A122 and a second groove A123.

[0033] The first irregular groove A111 and the second irregular groove A121 on one side surface are adapted to the irregular structure of the corresponding component, realizing the directional insertion and positioning of the component, avoiding assembly misalignment, and improving the fit and connection stability between components; the first circular groove A112 and the second circular groove A122 on the other side surface provide dedicated installation space for subsequent circular adapter parts such as O-ring component A8, ensuring the installation accuracy of key components such as seals, and ensuring the reliability of sealing, connection and other functions.

[0034] like Figure 4 As shown, in one embodiment, the first pressure plate A51 and the second pressure plate A52 are respectively provided with a first circular groove with a support lug A511 and a second circular groove with a support lug A521; the dimensions of the two grooves are respectively adapted to the outer dimensions of the first cover gasket A41 and the second cover gasket A42.

[0035] The first circular groove A511 and the second circular groove A521 with support ears of the first pressure plate A51 and the second pressure plate A52 are precisely matched with the shape of the corresponding first cover plate sealing gasket A41 and the second cover plate sealing gasket A42. They can form a wrap-around limit for the sealing gasket, preventing the sealing gasket from shifting or moving during assembly, jig opening and closing or electroplating operations, ensuring that the sealing gasket is always precisely attached to the cover plate and the wafer clamping surface, and ensuring the integrity of the sealing path.

[0036] like Figure 5 As shown, in one embodiment, it further includes: V-shaped block connecting plate A6, the two ends of which are provided with rectangular slots A61, one side of which is fastened to the first clamping plate A11 by screws, and both ends are embedded in the V-shaped openings B81 of the flipping clamp fixing seat B8.

[0037] One side of the V-block connecting plate A6 is fastened to the first clamping plate A11 of the fixture with screws, and both ends are embedded in the V-shaped openings B81 of the flipping fixture fixing seat B8 of the flipping mechanism, directly mechanically connecting the fixture and the flipping mechanism, providing rigid support for the transmission of subsequent flipping actions; the V-shaped openings B81 are adapted to the end structure of the V-block connecting plate A6, which has an automatic centering and positioning effect, ensuring the coaxiality of the fixture and the flipping mechanism and avoiding assembly misalignment; at the same time, the dual fixing method of embedded fit and screw fastening can prevent axial movement or radial displacement between the two during operation, ensuring connection stability.

[0038] like Figure 6 As shown, in one embodiment, it further includes: The pneumatic assembly A7 comprises a first lifting and reciprocating assembly A71, a second lifting and reciprocating assembly A72, a third lifting and reciprocating assembly A73, a fourth lifting and reciprocating assembly A74, a fifth lifting and reciprocating assembly A75, a sixth lifting and reciprocating assembly A76, a seventh lifting and reciprocating assembly A77, an eighth lifting and reciprocating assembly A78, and a first solenoid valve A79; each of the lifting and reciprocating assemblies A71-A78 includes corresponding guide rods A711-A781 and cylinders A712-A782, and the first to the eighth solenoid valves... The eight lifting and reciprocating components A71-A78 and the first solenoid valve A79 are all arranged in the hollow sealed body formed by splicing the first clamping plate A11 and the second clamping plate A12. The first solenoid valve A79 is connected to each lifting and reciprocating component one by one through the air pipe. Among them, the first to fourth guide rods A711-A741 are fixedly connected to the first cover plate A31 and the first cover plate sealing gasket A41 respectively, and the fifth to eighth guide rods A751-A781 are fixedly connected to the second cover plate A32 and the second cover plate sealing gasket A42 respectively.

[0039] Power is output from cylinders A712-A782 of eight sets of lifting and reciprocating components, and transmitted through guide rods A711-A781 to the corresponding first cover plate A31, second cover plate A32, and first cover plate sealing gasket A41, driving them to achieve smooth lifting and lowering, thereby completing the opening and closing action of the clamp and providing power support for the clamping and releasing of the wafer. The first solenoid valve A79 is connected to each lifting and reciprocating component in a corresponding manner to achieve centralized and unified control of the eight components, ensuring the synchronicity of the actions of the first to fourth guide rods driving the first cover plate side component and the fifth to eighth guide rods driving the second cover plate side component, avoiding wafer clamping deviation or uneven sealing caused by lag in action on one side.

[0040] like Figure 7 As shown, in one embodiment, it further includes: O-ring assembly A8 includes a first O-ring A81 and a second O-ring A82, wherein the first O-ring A81 is fitted into a first groove A113 on one side surface of the first clamping plate A11, and the second O-ring A82 is fitted into a second groove A123 on one side surface of the second clamping plate A12.

[0041] The first O-ring A81 and the second O-ring A82 are precisely fitted into the first groove A113 of the first clamping plate A11 and the second groove A123 of the second clamping plate A12, respectively, fitting the splicing surfaces of the clamping plates and the assembly gaps of the components. They form an additional sealing protection on the basis of the cover plate sealing gasket, greatly improving the overall sealing level and effectively preventing electroplating liquid from seeping in from the splicing of the clamping plates or the assembly gaps of the components.

[0042] like Figure 8 The image shows a flipping mechanism suitable for wafer electroplating, comprising: The rotating component B1 consists of a joint module fixing plate B11, a rotating module B12, a photoelectric switch B13, a photoelectric switch sensing plate B14, a connecting bushing B15, a bearing cover plate B16, and a bearing B17. The joint module fixing plate B11 is assembled on the support plate surface of the upper part of the flip column assembly B2, and its two sides are fixedly connected to the two side plates of the flip column assembly B2 by screws. The rotating module B12 is fastened to the central circular hole of the joint module fixing plate B11; The photoelectric switch B13 is fastened to the corresponding side of the joint module fixing plate B11 by screws; The photoelectric switch sensor B14 is fastened to one side of the bearing cover plate B16; One end of the connecting bushing B15 is fixedly connected to the rotating module B12 by screws, and the other end is fitted onto the outside of the cylindrical section of the flip transition box B3 and fastened by screws arranged on the side. The bearing cover plate B16 is fixedly connected to one side of the flip-over transition box B3; The bearing B17 is fitted into the circular groove in the center of the bearing cover plate B16 and fits snugly against the inner wall of the groove.

[0043] In this embodiment, the joint module fixing plate B11 is fastened to the flip column assembly B2, providing a stable mounting reference for the rotating assembly B1; the rotating module B12, as the power core, transmits the rotational power to the flip transition box B3 through the connecting bushing B15, forming a complete path of power output, transmission and bearing, laying the structural foundation for the subsequent flipping of the fixture.

[0044] The photoelectric switch B13 and the photoelectric switch sensing element B14 form a linkage detection structure. The sensing element rotates synchronously with the bearing cover plate B16. The photoelectric switch detects the position of the sensing element and provides feedback on the flipping state, realizing real-time monitoring and precise positioning of the flipping angle, avoiding over-flipping or positioning deviation, and ensuring the alignment accuracy of double-sided electroplating of the wafer.

[0045] Bearing B17 is fitted into the circular groove of bearing cover plate B16, and the precise fit with the groove can reduce frictional resistance during rotation and avoid jamming and shaking. At the same time, the bearing cover plate protects and positions the bearing, ensuring smooth power transmission when the rotating module is driven, improving the stability of the flipping action, and preventing the wafer from shifting or being damaged during the flipping process.

[0046] The flipping transition box B3 is fixed to the rotating assembly via a connecting bushing. As a load-bearing carrier, it provides an installation reference for the subsequent assembly of components such as cylinder assembly B4 and side sealing plate B7, so that the components of the flipping mechanism form an organic whole and ensure functional coordination.

[0047] like Figure 9 As shown, in one embodiment, it further includes: The flip-up column assembly B2 is a closed long groove structure composed of multiple plates. The internal support component has a circular hole, and the center of the hole has a third circular groove B21.

[0048] The closed long slot structure, which is spliced ​​from multiple plates, greatly improves the structural rigidity and torsional and compressive strength of the column. It can stably support the overall weight of the rotating component B1, the flipping transition box B3 and the clamp, resist the torque and vibration generated during the flipping process, avoid structural deformation, and provide a stable installation and support foundation for all upper components.

[0049] like Figure 10 As shown, in one embodiment, it further includes: The flip-over transition box B3 is fixed to the upper region of the corresponding side of the flip-over column assembly B2.

[0050] The flipping transition box B3 is fixed to the upper area of ​​the corresponding side of the flipping column assembly B2. As the core load-bearing component, it provides a stable installation benchmark for components such as cylinder assembly B4, side sealing plate B7, connecting bushing B15, and bearing cover plate B16, so that the components can be assembled in an orderly manner and the layout is compact, avoiding spatial interference.

[0051] like Figure 11 As shown, in one embodiment, it further includes: The cylinder assembly B4 consists of a first slide cylinder B41, a first slide connecting block B42, a second slide cylinder B43, a second slide connecting block B44, a third slide cylinder B45, a connecting plate B46, a first probe assembly B47, a second solenoid valve B48, and a second probe assembly B49. The first slide cylinder B41 is fixed to the bottom surface of the flipping transition box B3; The first slide block B42 is fastened to the surface of the slider of the first slide cylinder B41 by screws; The second slide cylinder B43 is assembled on the corresponding side of the vertical plate of the first slide connecting block B42; The second slide connecting block B44 is fixed to the preset mounting hole of the second slide cylinder B43 by screws; The third slide cylinder B45 is fixed to the inner surface of the flip transition box cover plate B5; The connecting plate B46 is fastened to the preset mounting hole of the third slide cylinder B45. The first probe assembly B47 is located at the front end of the movement direction of the third slide cylinder B45, and is fixed to the corresponding surface of the connecting plate B46 by screws. The second solenoid valve B48 is installed on the inner surface of the flip-over transition box B3; The second probe assembly B49 is mounted on the same side front end of the third slide cylinder B45.

[0052] The first slide cylinder B41, the second slide cylinder B43, and the third slide cylinder B45 transmit linear driving force through the corresponding first slide connecting block B42, second slide connecting block B44, and third slide connecting block B46, respectively. This enables telescopic movements in different directions, which can drive related components to strengthen the connection and tightness between the fixture and the flipping mechanism, and also drive the probe assembly to achieve precise telescopic movement, adapting to the position adjustment requirements in the wafer electroplating process.

[0053] The first probe assembly B47 and the second probe assembly B49 are linked with the third slide cylinder B45 via the third slide connecting block B46. Under the drive of the cylinder, they can accurately approach or contact the wafer surface. On the one hand, this provides a stable conductive path for the electroplating process and ensures uniform current transmission; on the other hand, it can assist in detecting the wafer clamping status or electroplating process, improving the accuracy of the operation.

[0054] The second solenoid valve B48 centrally controls each slide cylinder, ensuring the synchronization and timing of the extension and retraction movements of different slide cylinders and avoiding action conflicts. At the same time, the precise assembly of each first slide connecting block B42, second slide connecting block B44, and third slide connecting block B46 ensures that the cylinder power transmission is without deviation, guaranteeing that the drive action, the rotation action of the flipping mechanism, and the clamping action of the fixture are coordinated and adapted to the rhythm of the electroplating process.

[0055] like Figure 12 As shown, in one embodiment, it further includes: The flip-over transition box cover B5 is installed on the top end face of the flip-over transition box B3.

[0056] The flip-over transition box cover B5 is installed on the top end face of the flip-over transition box B3. It can seal the top opening of the transition box, preventing external dust, electroplating liquid mist, impurities, etc. from entering the box, avoiding contamination or corrosion of core components such as the internal cylinder assembly B4 and the second solenoid valve B48, and ensuring the stability of component operation. The installation of the cover provides a stable installation benchmark for components such as the third slide cylinder B45 assembled inside it, ensuring the installation position accuracy of such components, avoiding component displacement due to the lack of top limit, and ensuring the precise transmission of drive actions.

[0057] like Figure 13 As shown, in one embodiment, it further includes: Connecting block pressure block B6 is fixed to the corresponding side of the second slide connecting block B44, and one end of it extends into the rectangular slot A61 of the V-shaped block connecting plate A6.

[0058] The connecting block pressure block B6 is fixed to the corresponding side of the second slide connecting block B44. It can move synchronously with the connecting block under the drive of the second slide cylinder B43. One end of it extends into the rectangular slot A61 of the V-shaped block connecting plate A6, forming a double fixation of embedding limit and lateral pressing, further locking the fitting structure of the V-shaped block connecting plate and the flipping clamp fixing seat B8, and preventing loosening during operation.

[0059] The fitting of the pressure block and the rectangular slot restricts the axial and radial displacement freedom of the V-block connecting plate A6, compensating for any gaps that may exist in simple embedding and screw fastening, preventing the fixture from shifting or deviating relative to the flipping mechanism, and ensuring the coaxiality and positional accuracy of the connection. Relying on the linear drive capability of the second slide cylinder B43, the connecting block pressure block B6 can achieve precise extension and retraction. It automatically extends into the slot to lock during fixture assembly and exits the slot for easy disassembly during maintenance, achieving automated coordination of drive, locking, and unlocking, thus improving operational convenience.

[0060] By reliably limiting and clamping the V-block connecting plate, the rotational power of the flipping mechanism is transmitted to the fixture without loss, avoiding jamming or deviation of the flipping action due to loose connection, thereby protecting the wafer from damage during the flipping process and ensuring the stability of the electroplating process.

[0061] like Figure 14 As shown, in one embodiment, it further includes: Side sealing plate B7, the central area of ​​which has an elongated through groove B71 and an elongated recess B72, and is installed on one side end face of the flip-over transition box B3.

[0062] Side sealing plate B7 is installed on one end face of the flipping transition box B3, which can seal the side opening of the transition box and prevent impurities such as electroplating liquid mist and dust from entering the box. This avoids contamination or corrosion of core components such as the internal cylinder assembly B4 and the second solenoid valve B48, ensuring the stability of component operation. The elongated groove B72 in its central area is structurally adapted to the flipping fixture fixing seat B8, providing a dedicated embedding space for the fixing seat. This ensures the positional accuracy and perpendicularity of the fixing seat during installation, thereby ensuring the coaxiality of the fixture after it is connected to the fixing seat through the V-block connecting plate A6, and avoiding assembly deviations from affecting the flipping accuracy. The fixed assembly of the side sealing plate and the flipping transition box makes the transition box form a complete structure that is closed on all four sides and bears loads in multiple directions. This improves its torsional and compressive resistance, better disperses the torque and vibration generated during the flipping process, ensures the overall structural stability of the flipping mechanism, and provides support for the smooth flipping of the fixture.

[0063] like Figure 15 As shown, in one embodiment, it further includes: The flip clamp fixing seat B8 has a V-shaped opening B81 on its upper part, and the flip clamp fixing seat B8 is embedded and fixed in the elongated groove B72 of the side sealing plate B7.

[0064] The flipping fixture fixing seat B8 is embedded and fixed in the elongated groove B72 of the side sealing plate B7. Through this embedded fit, it achieves precise positioning and stable fixation, forming the core load-bearing component connecting the fixture and the flipping mechanism. It can stably support the weight of the fixture and the torque during the flipping process. The V-shaped opening B81 at its upper part is adapted to the end structure of the V-block connecting plate A6. Utilizing the self-aligning characteristics of the V-shape, it guides the V-block connecting plate to be precisely embedded, ensuring the coaxiality and positional accuracy of the fixture and the flipping mechanism, and avoiding flipping offset caused by assembly misalignment. As the direct connector for transmitting the rotational power of the flipping mechanism to the fixture, after the fixing seat is embedded and fixed with the V-block connecting plate, it can efficiently transmit the rotational power output by the rotating component B1 to the fixture, ensuring that the fixture flips synchronously and smoothly with the flipping mechanism, without power loss or lag.

[0065] In one embodiment, the flipping mechanism suitable for wafer electroplating is symmetrically arranged on both sides of the fixture. The fixture is fitted and fixed to the flipping fixture fixing seat B8 of the flipping mechanism through the V-shaped block connecting plate A6 assembled thereon. Specifically, the two ends of the V-shaped block connecting plate A6 are fitted into the V-shaped opening B81 of the flipping fixture fixing seat B8, and one side of the V-shaped block connecting plate A6 is fastened to the first clamping plate A11 of the fixture, so that the fixture and the flipping mechanism form an integrated structure. The rotating component B1 of the flipping mechanism drives the fixture to flip synchronously through the flipping fixture fixing seat B8, thereby realizing the flipping operation in the wafer electroplating process.

[0066] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the present invention.

Claims

1. A fixture suitable for wafer electroplating, characterized in that, include: The clamping plate assembly (A1) includes a first clamping plate (A11) and a second clamping plate (A12), which are joined together to form a hollow sealing body; The substrate pad assembly (A2) includes a first substrate pad (A21) and a second substrate pad (A22), which are respectively embedded in the first circular groove (A112) of the first clamping plate (A11) and the second circular groove (A122) of the second clamping plate (A12); The cover plate assembly (A3) includes a first cover plate (A31) and a second cover plate (A32), which are respectively fixed to one side surface of the first clamping plate (A11) and the second clamping plate (A12) by screws; The cover gasket assembly (A4) includes a first cover gasket (A41) and a second cover gasket (A42), which are respectively mounted on the first cover plate (A31) and the second cover plate (A32); The pressure plate assembly (A5) includes a first pressure plate (A51) and a second pressure plate (A52). The first pressure plate (A51) is fixedly connected to the first cover plate (A31) and the first cover plate sealing gasket (A41) by screws. The second pressure plate (A52) is correspondingly fixedly connected to the second cover plate (A32) and the second cover plate sealing gasket (A42) by screws.

2. The fixture for wafer electroplating according to claim 1, characterized in that, The first clamping plate (A11) and the second clamping plate (A12) have a first irregular groove (A111) and a second irregular groove (A121) on one side surface respectively, and the other side surface of the two are respectively provided with a first circular groove (A112), a first groove (A113), a second circular groove (A122), and a second groove (A123).

3. A fixture suitable for wafer electroplating according to claim 1, characterized in that, The first pressure plate (A51) and the second pressure plate (A52) are respectively provided with a first circular groove with a support lug (A511) and a second circular groove with a support lug (A521); the dimensions of the two grooves are adapted to the outer dimensions of the first cover gasket (A41) and the second cover gasket (A42).

4. A fixture suitable for wafer electroplating according to claim 1, characterized in that, Also includes: V-shaped block connecting plate (A6) has rectangular slots (A61) at both ends. One side of the plate is fastened to the first clamping plate (A11) by screws, and both ends are embedded in the V-shaped opening (B81) of the flip clamp fixing seat (B8).

5. A fixture suitable for wafer electroplating according to claim 1, characterized in that, Also includes: The pneumatic assembly (A7) comprises a first lifting and reciprocating assembly (A71), a second lifting and reciprocating assembly (A72), a third lifting and reciprocating assembly (A73), a fourth lifting and reciprocating assembly (A74), a fifth lifting and reciprocating assembly (A75), a sixth lifting and reciprocating assembly (A76), a seventh lifting and reciprocating assembly (A77), an eighth lifting and reciprocating assembly (A78), and a first solenoid valve (A79). Each of the lifting and reciprocating assemblies (A71-A78) includes a corresponding guide rod (A711-A781) and a cylinder (A712-A782), and the first... The eighth lifting reciprocating assembly (A71-A78) and the first solenoid valve (A79) are both arranged in the hollow sealed body formed by splicing the first clamping plate (A11) and the second clamping plate (A12). The first solenoid valve (A79) is connected to each lifting reciprocating assembly one by one through the air pipe. The first to fourth guide rods (A711-A741) are fixedly connected to the first cover plate (A31) and the first cover plate sealing gasket (A41) respectively. The fifth to eighth guide rods (A751-A781) are fixedly connected to the second cover plate (A32) and the second cover plate sealing gasket (A42) respectively.

6. A fixture suitable for wafer electroplating according to claim 1, characterized in that, Also includes: The O-ring assembly (A8) includes a first O-ring (A81) and a second O-ring (A82), wherein the first O-ring (A81) is fitted into a first groove (A113) on one side surface of the first clamping plate (A11), and the second O-ring (A82) is fitted into a second groove (A123) on one side surface of the second clamping plate (A12).

7. A flipping mechanism suitable for wafer electroplating, characterized in that, The fixture for wafer electroplating as described in any one of claims 1-6 is disposed on both sides, comprising: The rotating assembly (B1) consists of a joint module fixing plate (B11), a rotating module (B12), a photoelectric switch (B13), a photoelectric switch sensing plate (B14), a connecting bushing (B15), a bearing cover plate (B16), and a bearing (B17). The joint module fixing plate (B11) is assembled on the support plate surface on the upper part of the flip column assembly (B2), and its two sides are fixedly connected to the two side plates of the flip column assembly (B2) by screws. The rotating module (B12) is fastened to the central circular hole of the joint module fixing plate (B11); The photoelectric switch (B13) is fastened to the corresponding side of the joint module fixing plate (B11) by screws; The photoelectric switch sensor (B14) is fastened to one side of the bearing cover plate (B16); One end of the connecting bushing (B15) is fixedly connected to the rotating module (B12) by screws, and the other end is fitted onto the outside of the cylindrical section of the flip transition box (B3) and fastened by screws arranged on the side. The bearing cover plate (B16) is fixedly connected to one side of the flip-over transition box (B3); The bearing (B17) is fitted into the circular groove in the center of the bearing cover plate (B16) and fits snugly against the inner wall of the groove.

8. A flipping mechanism suitable for wafer electroplating according to claim 7, characterized in that, Also includes: The flip-up column assembly (B2) is a closed long groove structure composed of multiple plates. The internal support component has a circular hole, and the center of the hole has a third circular groove (B21).

9. A flipping mechanism suitable for wafer electroplating according to claim 7, characterized in that... It also includes: The flip-over transition box (B3) is fixed to the upper region of the corresponding side of the flip-over column assembly (B2).

10. A flipping mechanism suitable for wafer electroplating according to claim 7, characterized in that... It also includes: The cylinder assembly (B4) consists of a first slide cylinder (B41), a first slide connecting block (B42), a second slide cylinder (B43), a second slide connecting block (B44), a third slide cylinder (B45), a connecting plate (B46), a first probe assembly (B47), a second solenoid valve (B48), and a second probe assembly (B49). The first slide cylinder (B41) is fixed to the bottom surface of the flip transition box (B3); The first slide block connecting block (B42) is fastened to the surface of the slider of the first slide cylinder (B41) by screws; The second slide cylinder (B43) is mounted on the corresponding side of the vertical plate of the first slide connecting block (B42); The second slide connecting block (B44) is fixed to the preset mounting hole of the second slide cylinder (B43) by screws; The third slide cylinder (B45) is fixed to the inner surface of the flip transition box cover (B5); The connecting plate (B46) is fastened to the pre-set mounting hole of the third slide cylinder (B45); The first probe assembly (B47) is located at the front end of the third slide cylinder (B45) in the direction of movement, and is fixed to the corresponding surface of the connecting plate (B46) by screws; The second solenoid valve (B48) is installed on the inner surface of the flip-over transition box (B3); The second probe assembly (B49) is mounted on the same side front end of the third slide cylinder (B45).

11. A flipping mechanism suitable for wafer electroplating according to claim 7, characterized in that... It also includes: A flip-over transition box cover (B5) is installed on the top end face of the flip-over transition box (B3).

12. A flipping mechanism suitable for wafer electroplating according to claim 7, characterized in that... It also includes: Connecting block pressure block (B6) is fixed to the corresponding side of the second slide connecting block (B44), and one end of it extends into the rectangular slot (A61) of the V-shaped block connecting plate (A6).

13. A flipping mechanism suitable for wafer electroplating according to claim 7, characterized in that... It also includes: The side sealing plate (B7) has an elongated through groove (B71) and an elongated recess (B72) in its central area and is installed on one side end face of the flip-over transition box (B3).

14. A flipping mechanism suitable for wafer electroplating according to claim 7, characterized in that... It also includes: A flip clamp fixing seat (B8) is provided with a V-shaped opening (B81) at the upper part, and the flip clamp fixing seat (B8) is embedded and fixed in the elongated groove (B72) of the side sealing plate (B7).

15. A wafer clamping and flipping device, characterized in that, According to any one of claims 1-6, the fixture for wafer electroplating and the flipping mechanism according to any one of claims 7-14, the flipping mechanism is symmetrically arranged on both sides of the fixture, and the fixture is fitted and fixed with the flipping fixture fixing seat (B8) of the flipping mechanism through the V-shaped block connecting plate (A6) assembled thereon. Specifically, the two ends of the V-shaped block connecting plate (A6) are fitted into the V-shaped opening (B81) of the flipping fixture fixing seat (B8), and one side of the V-shaped block connecting plate (A6) is fastened to the first clamping plate (A11) of the fixture, so that the fixture and the flipping mechanism form an integrated structure. The rotating component (B1) of the flipping mechanism drives the fixture to flip synchronously through the flipping fixture fixing seat (B8), thereby realizing the flipping operation in the wafer electroplating process.

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