A force and acceleration parallel type multifunctional sensor with a single sensing unit and a regulating method thereof

Abstract

The present application belongs to the technical field of sensor design, and aims to solve the problem of mutual interference of composite sensors in force and acceleration measurement. A force and acceleration parallel type multifunctional sensor composed of a single sensitive unit and an adjusting method thereof are provided. When the sensor is subjected to force, the first outer deformation diaphragm, the first inner deformation diaphragm, the second outer deformation diaphragm and the second inner deformation diaphragm produce shear deformation, the first bearing boss hard center and the second bearing boss hard center vertically move, pressure is applied to the outer ring corresponding PVDF piezoelectric film sensitive unit layer part of the first Silver Ink layer, and a charge signal proportional to the force is generated. When the sensor is subjected to vibration, the mass vertically moves up and down in the first inner load ring, and then generates an inertial force in the inner ring corresponding PVDF piezoelectric film sensitive unit layer part of the first Silver Ink layer, and a charge signal proportional to the acceleration is generated. The sensor of the present application is of a parallel structure and does not interfere with each other in force and acceleration measurement.

Description

Technical Field

[0001] This invention belongs to the field of sensor design technology, specifically relating to a force and acceleration parallel multifunctional sensor composed of a single sensing unit and its adjustment method. Background Technology

[0002] Force sensors are measuring devices that convert force signals into electrical signals and are widely used in industrial automation and structural testing. Accelerometers, on the other hand, measure vibration and impact signals by sensing the inertial force of a mass and are commonly used for equipment condition monitoring and fault diagnosis. To meet the demands of modern testing for simultaneous measurement of multiple physical quantities, the use of structural integration technology to achieve combined force and acceleration measurement has become an important development direction.

[0003] Chinese patent CN202411186290.3 discloses a force and acceleration composite multifunctional sensor and its working method, which is suitable for integrated measurement of acceleration and force. Chinese patent CN202510933025.5 discloses a force and acceleration composite sensor and its adjustment method, which can solve the problem that the pre-pressure magnitude of the force sensor and acceleration sensor cannot be adjusted.

[0004] The shortcomings of the aforementioned patent are: the force measurement module and the acceleration measurement module are arranged in a top-down series structure within the composite sensor. When the composite sensor is subjected to force, stress is generated throughout the sensor housing, causing deformation of the base of the acceleration measurement module, thus interfering with the acceleration measurement. Furthermore, the piezoelectric elements of the force measurement module and the acceleration measurement module are arranged separately, resulting in a large number of piezoelectric elements, complex installation, and high cost. Summary of the Invention

[0005] In order to solve at least one of the above-mentioned technical problems in the prior art, the present invention provides a force and acceleration parallel multifunctional sensor composed of a single sensing unit and its adjustment method.

[0006] The present invention is achieved by the following technical solution: a force and acceleration parallel multifunctional sensor composed of a single sensitive unit, including a first pressure plate, a first cover, a first radio frequency socket, a second radio frequency socket, a sensitive unit group, a second cover, a second pressure plate, a mass block, a retaining ring, and a pre-tightening bolt;

[0007] The first cover, from the outside to the inside, consists of an integrally formed first outer load-bearing ring, a first outer deformable diaphragm, a first load-bearing boss hard center, a first inner deformable diaphragm, and a first inner load-bearing ring; the second cover, from the outside to the inside, consists of an integrally formed second outer load-bearing ring, a second outer deformable diaphragm, a second load-bearing boss hard center, a second inner deformable diaphragm, and a second inner load-bearing ring; wherein the shear stiffness of the first outer deformable diaphragm, the first inner deformable diaphragm, the second outer deformable diaphragm, and the second inner deformable diaphragm are all the same and defined as the first stiffness; the compressive stiffness of the first outer load-bearing ring, the first inner load-bearing ring, the second outer load-bearing ring, and the second inner load-bearing ring are all the same and defined as the second stiffness, and satisfy: the first stiffness Second stiffness;

[0008] The sensitive unit group is located within the space enclosed by the first cover and the second cover, and the thickness of the sensitive unit group is equal to the distance between the hard centers of the first and second bearing bosses. The sensitive unit group includes a PI film, a first Silver Ink layer, a PVDF piezoelectric film sensitive unit layer, and a second Silver Ink layer. The PI film is located above the first Silver Ink layer to insulate the first cover from the first Silver Ink layer. The first Silver Ink layer, located above the PVDF piezoelectric film sensitive unit layer, includes a separated outer ring and an inner ring. The lower boss of the first bearing boss hard center above the outer ring of the first Silver Ink layer and the upper boss of the second bearing boss hard center below the outer ring of the first Silver Ink layer can both apply pressure to the PVDF piezoelectric film sensitive unit layer portion corresponding to the outer ring of the first Silver Ink layer during force measurement. The mass block is upper limited by a retaining ring threadedly connected to the first inner load ring. The retaining ring can provide the preload required for acceleration measurement. The mass block can apply pressure to the PVDF piezoelectric film sensitive unit layer portion corresponding to the inner ring of the first Silver Ink layer during acceleration measurement. The outer ring of the Ink layer is connected to the first RF socket via electrode lines to output a charge signal proportional to force. The inner ring of the first Silver Ink layer is connected to the second RF socket via electrode lines to output a charge signal proportional to acceleration. The second Silver Ink layer located at the lower end of the PVDF piezoelectric film sensitive unit layer abuts against the upper boss of the hard center of the second bearing boss.

[0009] The structure consisting of the first cover, the sensitive unit group, and the second cover is limited by the first and second pressure plates at the upper and lower ends. The required preload is measured by adjusting the torque of the multiple preload bolts connected between the first and second pressure plates.

[0010] Preferably, the outer ring of the first Silver Ink layer is an annular structure with a notch, and a first protruding edge extends outward from the end of the annular structure opposite to the notch. The first protruding edge is used to lead out a charge signal proportional to force to the first RF socket. The inner ring of the first Silver Ink layer is a circular structure, and a second protruding edge extends outward from the circular structure through the notch of the annular structure. The second protruding edge is used to lead out a charge signal proportional to acceleration to the second RF socket. There is an annular gap and a strip gap between the outer ring and the inner ring of the first Silver Ink layer.

[0011] Preferably, the width of the annular structure is the same as the width of the first bearing boss hard center and the second bearing boss hard center, and the diameter of the circular structure is the same as the outer diameter of the mass block; a strip groove structure is provided on the first bearing boss hard center at the position corresponding to the second convex edge to avoid the first bearing boss hard center from contacting the inner ring of the first Silver Ink layer, and the width of the annular gap between the outer ring of the first Silver Ink layer and the inner ring of the first Silver Ink layer is the same as the total width of the first inner deformable diaphragm and the first inner load-bearing ring.

[0012] Preferably, a retaining ring is threadedly connected to the upper ring portion of the inner ring of the first inner load-sharing ring. The retaining ring is used to engage with the inner ring of the first inner load-sharing ring to limit the position of the mass block. The upper end face of the retaining ring is provided with a hole structure that can be externally connected to a retaining ring rotating tool. The upper outer ring of the mass block is provided with a stepped structure that matches the retaining ring, and the height of the stepped structure is less than the height of the internal thread of the inner ring of the first inner load-sharing ring. The upper inner ring of the mass block is provided with a groove structure, and the depth and width of the groove structure are changed to adjust the mass of the mass block.

[0013] Preferably, the opposite end faces of the first inner load-sharing ring and the second inner load-sharing ring each extend with a plurality of spaced guide rings, and the PI film, the PVDF piezoelectric film sensitive unit layer and the second Silver Ink layer are each provided with guide grooves that match the corresponding guide rings; the first outer load-sharing ring is fastened to the upper end of the second outer load-sharing ring.

[0014] Preferably, the first Silver Ink layer and the second Silver Ink layer are both printed on the PVDF piezoelectric thin film sensitive unit layer by magnetron sputtering. The PVDF piezoelectric thin film sensitive unit layer has a bearing protrusion that matches the first and second protrusions. The second cover also includes a central bottom support, which is interference-fitted inside the second inner loading ring and abuts against the second Silver Ink layer.

[0015] Preferably, both the first RF socket and the second RF socket include a metal outer ring, an insulating inner ring, and a metal inner core. The metal outer ring is threaded onto the first outer load ring. The insulating inner ring, disposed between the metal outer ring and the metal inner core, is used to prevent electrical connection between the metal outer ring and the metal inner core. The metal inner core is connected to the outer ring or the inner ring of the first Silver Ink layer via an electrode wire.

[0016] Preferably, the center of the first pressure plate has a channel for the passage of the circlip rotation tool, and the lower end of the first pressure plate is provided with a first positioning boss that matches the inner ring of the hard center of the first bearing boss; the height of the first positioning boss is less than the height of the upper boss of the hard center of the first bearing boss, and the upper end of the second pressure plate is provided with a second positioning boss that matches the inner ring of the hard center of the second bearing boss, and the height of the second positioning boss is less than the height of the lower boss of the hard center of the second bearing boss; both the first pressure plate and the second pressure plate are provided with countersunk holes for preload bolts and workpiece mounting holes.

[0017] A second aspect of the present invention also provides a method for adjusting a force and acceleration parallel multifunctional sensor composed of a single sensing unit, including adjusting the preload required for force measurement and acceleration measurement of the sensor and adjusting the range of acceleration measurement.

[0018] The required preload is measured by adjusting the torque adjustment force of the multiple preload bolts;

[0019] By adjusting the position of the retaining ring on the first inner load-sharing ring, the highest position of the mass block moving upward can be adjusted, thereby providing different preload forces required for acceleration measurement;

[0020] The range of acceleration measurement can be adjusted by changing the depth and width of the groove structure in the upper inner ring of the mass block.

[0021] Compared with the prior art, the beneficial effects of the present invention are:

[0022] In this invention, when the sensor is subjected to force, force measurement can be performed. Supported by the first outer load-sharing ring, the first inner load-sharing ring, the second outer load-sharing ring, and the second inner load-sharing ring, the first outer deformation diaphragm, the first inner deformation diaphragm, the second outer deformation diaphragm, and the second inner deformation diaphragm undergo shear deformation, and the deformation is uniform. The hard centers of the first and second bearing bosses move vertically, uniformly applying pressure to the PVDF piezoelectric thin film sensitive unit layer corresponding to the outer ring of the first Silver Ink layer, further generating a charge signal (positive electrode) proportional to the force. The charge signal is led out from the outer ring of the first Silver Ink layer through electrode lines. Because only the first outer deformation diaphragm, the first inner deformation diaphragm, the second outer deformation diaphragm, and the second inner deformation diaphragm deform when the sensor is subjected to force, and the hard centers of the first and second bearing bosses displace, while the components related to acceleration measurement do not deform, the two do not interfere with each other.

[0023] When the sensor is subjected to vibration, acceleration can be measured. The mass block moves vertically up and down in the first inner load ring, generating inertial force in the PVDF piezoelectric thin film sensitive unit layer corresponding to the inner ring of the first Silver Ink layer. This further generates a charge signal (positive electrode) proportional to the acceleration, which is led out from the inner ring of the first Silver Ink layer through electrode lines. Similarly, during acceleration measurement, the components related to force measurement do not deform, and the two do not interfere with each other, forming a parallel structure.

[0024] Furthermore, by setting a structure in which the second bearing boss hard center and the center bottom support abut against the second Silver Ink layer, the sensitive unit group shares a single negative electrode, which is connected to the sensor housing, effectively avoiding interference from the grounding loop. This invention requires only one PVDF piezoelectric thin film sensitive unit layer to achieve combined force and acceleration measurement. In addition, the PVDF piezoelectric thin film sensitive unit layer also has advantages such as high mechanical strength, flexibility, impact resistance, ease of processing into large-area elements and array elements, and low cost. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a three-dimensional schematic diagram (first perspective) of the overall structure of the present invention;

[0027] Figure 2 This is a three-dimensional schematic diagram (second perspective) of the overall structure of the present invention;

[0028] Figure 3 This is a cross-sectional view of the overall structure of the present invention;

[0029] Figure 4 This is a three-dimensional structural diagram of the sensitive unit group of the present invention;

[0030] Figure 5 This is an exploded schematic diagram of the sensitive unit group of the present invention;

[0031] Figure 6 This is a schematic diagram of the structure of the first pressure plate of the present invention (top view).

[0032] Figure 7 This is a schematic diagram of the structure of the first pressure plate of the present invention (view from below).

[0033] Figure 8 This is a schematic diagram of the structure of the second pressure plate of the present invention (top view).

[0034] Figure 9 This is a schematic diagram of the structure of the second pressure plate of the present invention (view from below).

[0035] Figure 10 This is a schematic diagram of the structure of the first cover of the present invention (top view).

[0036] Figure 11 This is a structural schematic diagram of the first cover body of the present invention (view from below).

[0037] Figure 12 This is a schematic diagram of the structure of the second cover of the present invention (top view).

[0038] Figure 13 This is a structural schematic diagram of the second cover of the present invention (view from below).

[0039] Figure 14 This is a three-dimensional structural diagram of the first or second radio frequency socket of the present invention;

[0040] Figure 15 This is a three-dimensional structural diagram of the retaining ring of the present invention;

[0041] Figure 16 This is a three-dimensional structural diagram of the mass block of the present invention;

[0042] Figure 17 This is a cross-sectional structural diagram of the first cover body of the present invention;

[0043] Figure 18 This is a cross-sectional structural diagram of the second cover body of the present invention (excluding the central bottom support).

[0044] In the diagram: 1-First pressure plate; 201-First outer load-sharing ring; 202-First outer deformable diaphragm; 203-First bearing boss hard center; 204-First inner deformable diaphragm; 205-First inner load-sharing ring; 301-First RF socket; 302-Second RF socket; 401-First Silver Ink layer; 402-PVDF piezoelectric film sensitive unit layer; 403-Second Silver Ink layer; 404-PI film; 501-Second outer load-sharing ring; 502-Second outer deformable diaphragm; 503-Second bearing boss hard center; 504-Second inner deformable diaphragm; 505-Second inner load-sharing ring; 506-Center bottom support; 6-Second pressure plate; 7-Mass block; 8-Snap ring; 9-Pre-tightening bolt. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] It should be noted that the structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should fall within the scope of the technical content disclosed in the present invention. It should be noted that in this specification, relational terms such as "first" and "second" are only used to distinguish one entity from several other entities, and do not necessarily require or imply any actual relationship or order between these entities.

[0047] This invention provides an embodiment:

[0048] like Figures 1 to 18 As shown, a force and acceleration parallel multi-functional sensor composed of a single sensing unit includes a first pressure plate 1, a first cover, a first radio frequency socket 301, a second radio frequency socket 302, a sensing unit group, a second cover, a second pressure plate 6, a mass block 7, a retaining ring 8, and a pre-tightening bolt 9.

[0049] The first cover, from the outside to the inside, consists of an integrally formed first outer load-bearing ring 201, a first outer deformable diaphragm 202, a first load-bearing boss hard center 203, a first inner deformable diaphragm 204, and a first inner load-bearing ring 205; the second cover, from the outside to the inside, consists of an integrally formed second outer load-bearing ring 501, a second outer deformable diaphragm 502, a second load-bearing boss hard center 503, a second inner deformable diaphragm 504, and a second inner load-bearing ring 505; wherein the shear stiffness of the first outer deformable diaphragm 202, the first inner deformable diaphragm 204, the second outer deformable diaphragm 502, and the second inner deformable diaphragm 504 are all the same and are defined as the first stiffness; the compressive stiffness of the first outer load-bearing ring 201, the first inner load-bearing ring 205, the second outer load-bearing ring 501, and the second inner load-bearing ring 505 are all the same and are defined as the second stiffness, and satisfy: the first stiffness The second stiffness ensures that when the first outer deformable diaphragm 202, the first inner deformable diaphragm 204, the second outer deformable diaphragm 502, and the second inner deformable diaphragm 504 are deformed under stress, the first outer load-sharing ring 201, the first inner load-sharing ring 205, the second outer load-sharing ring 501, and the second inner load-sharing ring 505 will not deform.

[0050] The sensitive unit group is located within the space enclosed by the first cover and the second cover, and the thickness of the sensitive unit group is equal to the distance between the first bearing boss hard center 203 and the second bearing boss hard center 503. The sensitive unit group includes a PI film 404, a first Silver Ink layer 401, a PVDF piezoelectric film sensitive unit layer 402, and a second Silver Ink layer 403. The PI film 404 is located at the upper end of the first Silver Ink layer 401 to insulate the first cover from the first Silver Ink layer 401. The first Silver Ink layer 401, located above the PVDF piezoelectric film sensitive unit layer 402, includes a separated outer ring and an inner ring. The lower boss of the first bearing boss hard center 203 above the outer ring of the first Silver Ink layer 401 and the upper boss of the second bearing boss hard center 503 below the outer ring of the first Silver Ink layer 401 can both apply pressure to the first Silver Ink layer during force measurement. The outer ring of the Ink layer 401 corresponds to the PVDF piezoelectric film sensitive unit layer 402 portion; the mass block 7 is upper-positioned by a retaining ring 8 threadedly connected to the first inner load ring 205. The retaining ring 8 can provide the preload required for acceleration measurement. The mass block 7 can apply pressure to the inner ring of the first Silver Ink layer 401 corresponding to the PVDF piezoelectric film sensitive unit layer 402 portion during acceleration measurement. The outer ring of the first Silver Ink layer 401 is connected to the first RF socket 301 through an electrode wire for outputting a charge signal proportional to force. The inner ring of the first Silver Ink layer 401 is connected to the second RF socket 302 through an electrode wire for outputting a charge signal proportional to acceleration. The second Silver Ink layer 403 located at the lower end of the PVDF piezoelectric film sensitive unit layer 402 abuts against the upper boss of the second bearing boss hard center 503.

[0051] The structure consisting of the first cover, the sensitive unit group, and the second cover is limited by the first pressure plate 1 and the second pressure plate 6 at the upper and lower ends. The required preload is measured by adjusting the torque of the multiple preload bolts 9 connected between the first pressure plate 1 and the second pressure plate 6.

[0052] In this embodiment, the retaining ring 8 is threadedly connected to the upper ring portion of the inner ring of the first inner load-sharing ring 205. The retaining ring 8 is used to cooperate with the inner ring of the first inner load-sharing ring 205 to limit the upper limit of the mass block 7. The upper end face of the retaining ring 8 is provided with a hole structure that can be connected to a retaining ring rotation tool. The upper outer ring of the mass block 7 is provided with a stepped structure that matches the retaining ring 8, and the height of the stepped structure is less than the height of the internal thread of the inner ring of the first inner load-sharing ring 205. The upper inner ring of the mass block 7 is provided with a groove structure, and the depth and width of the groove structure are changed to adjust the mass of the mass block 7.

[0053] The center of the first pressure plate 1 has a channel for the passage of the clasp rotation tool. The lower end of the first pressure plate 1 is provided with a first positioning boss that matches the inner ring of the first bearing boss hard center 203. The height of the first positioning boss is less than the height of the upper boss of the first bearing boss hard center 203. The upper end of the second pressure plate 6 is provided with a second positioning boss that matches the inner ring of the second bearing boss hard center 503. The height of the second positioning boss is less than the height of the lower boss of the second bearing boss hard center 503. Both the first pressure plate 1 and the second pressure plate 6 are provided with pre-tightening bolt countersunk holes and workpiece mounting holes. The pre-tightening bolt countersunk holes are located at the four corners, and the workpiece mounting holes are located in the cross direction.

[0054] Furthermore, the outer ring of the first Silver Ink layer 401 is a ring structure with a notch, and a first protruding edge extends outward from the end of the ring structure opposite to the notch. The first protruding edge is used to lead out a charge signal proportional to force to the first radio frequency socket 301. The inner ring of the first Silver Ink layer 401 is a circular structure, and a second protruding edge extends outward from the circular structure through the notch of the ring structure. The second protruding edge is used to lead out a charge signal proportional to acceleration to the second radio frequency socket 302. There is an annular gap and a strip gap between the outer ring of the first Silver Ink layer 401 and the inner ring of the first Silver Ink layer 401.

[0055] The width of the annular structure is the same as the width of the first bearing boss hard center 203 and the second bearing boss hard center 503, and the diameter of the circular structure is the same as the outer diameter of the mass block 7; a strip-shaped groove structure is provided on the first bearing boss hard center 203 at the position corresponding to the second convex edge to avoid the first bearing boss hard center 203 from contacting the inner ring of the first Silver Ink layer 401, and the width of the annular gap between the outer ring of the first Silver Ink layer 401 and the inner ring of the first Silver Ink layer 401 is the same as the total width of the first inner deformable diaphragm 204 and the first inner load-bearing ring 205.

[0056] The first Silver Ink layer 401 and the second Silver Ink layer 403 are both printed on the PVDF piezoelectric thin film sensitive unit layer 402 by magnetron sputtering. The PVDF piezoelectric thin film sensitive unit layer 402 has a bearing protrusion that matches the first and second protrusions. The second cover also includes a central bottom support 506, which is interference-fitted into the interior of the second inner load-bearing ring 505 and abuts against the second Silver Ink layer 403. The abutment between the central bottom support 506, the second bearing protrusion hard center 503, and the second Silver Ink layer 403 is equivalent to connecting the negative electrode of the sensitive unit group to the sensor housing, thereby connecting to the metal outer ring of the first RF socket 301 and the second RF socket 302, so that the negative electrode can be connected to an external device, such as the negative electrode of a charge amplifier. The central bottom support 506 also serves to limit the lower position of the mass block 7 and resist the preload applied to the mass block 7.

[0057] The first inner load-sharing ring 205 and the second inner load-sharing ring 505 each have four spaced guide rings extending from their opposite end faces. The guide rings are one-eighths circular rings. The PI film 404, the PVDF piezoelectric film sensitive unit layer 402, and the second SilverInk layer 403 are all provided with guide grooves that match the corresponding guide rings, which serve as limiters. The first outer load-sharing ring 201 is tightly fastened to the upper end of the second outer load-sharing ring 501.

[0058] In this embodiment, both the first RF socket 301 and the second RF socket 302 include a metal outer ring, an insulating inner ring, and a metal inner core. The metal outer ring is threaded onto the first outer load ring 201. The insulating inner ring, disposed between the metal outer ring and the metal inner core, prevents electrical connection between them. The metal inner core is connected to the outer ring or inner ring of the first Silver Ink layer 401 via an electrode wire. The insulating inner ring is made of polytetrafluoroethylene (PTFE). One end of the electrode wire is connected to the first Silver Ink layer 401 by riveting or bonding, and the other end is connected to the metal inner core by welding.

[0059] Working principle: In this invention, when the sensor is subjected to force, force measurement can be performed. Under the support of the first outer load-sharing ring 201, the first inner load-sharing ring 205, the second outer load-sharing ring 501, and the second inner load-sharing ring 505, the first outer deformation diaphragm 202, the first inner deformation diaphragm 204, the second outer deformation diaphragm 502, and the second inner deformation diaphragm 504 undergo shear deformation, and the deformation is consistent. The first bearing boss hard center 203 and the second bearing boss hard center 503 move vertically, uniformly applying pressure to the PVDF piezoelectric thin film sensitive unit layer 402 part corresponding to the outer ring of the first Silver Ink layer 401, further generating a charge signal (positive electrode) proportional to the force. The charge signal is led out from the outer ring of the first Silver Ink layer 401 through the electrode line. When the sensor is subjected to force, only the first outer deformable diaphragm 202, the first inner deformable diaphragm 204, the second outer deformable diaphragm 502, and the second inner deformable diaphragm 504 deform, while the first bearing boss hard center 203 and the second bearing boss hard center 503 displace. The components related to acceleration measurement do not deform, and the two do not interfere with each other.

[0060] When the sensor is subjected to vibration, acceleration can be measured. The mass block 7 moves vertically up and down on the upper ring of the first inner load-sharing ring 205, generating inertial force in the PVDF piezoelectric thin film sensitive unit layer 402 corresponding to the inner ring of the first Silver Ink layer 401. This further generates a charge signal (positive electrode) proportional to the acceleration, which is led out from the inner ring of the first Silver Ink layer 401 through the electrode wire. Similarly, during acceleration measurement, the components related to force measurement do not deform, and the two do not interfere with each other, forming a parallel structure.

[0061] The present invention also provides a method for adjusting a force and acceleration parallel multifunctional sensor composed of a single sensing unit, including adjusting the preload required for force measurement and acceleration measurement of the sensor and adjusting the range of acceleration measurement.

[0062] The sensor's force measurement module adjusts the preload required for force measurement by uniformly adjusting the torque of the four preload bolts 9 to achieve optimal linearity in force measurement. When the preload reaches 50% of the sensor's measurement range, the sensor can achieve axial tensile and compressive dynamic force measurement.

[0063] The force measurement module of the sensor mainly consists of a first outer load distribution ring 201, a first inner load distribution ring 205, a second outer load distribution ring 501, a second inner load distribution ring 505, a first outer deformable diaphragm 202, a first inner deformable diaphragm 204, a second outer deformable diaphragm 502, a second inner deformable diaphragm 504, a first bearing boss hard center 203, a second bearing boss hard center 503, an outer ring of a first Silver Ink layer 401, a PVDF piezoelectric thin film sensitive unit layer 402, a second Silver Ink layer 403, a PI film 404, a first pressure plate 1, a second pressure plate 6, a pre-tightening bolt 9, and a first radio frequency socket 301.

[0064] The acceleration measurement module of the sensor uses a retaining ring 8 to adjust the preload required for acceleration measurement. Different preloads can adjust the high-frequency cutoff measurement frequency of the acceleration measurement module of the sensor.

[0065] The acceleration measurement module of the sensor mainly consists of a first inner load ring 205, a retaining ring 8, a mass block 7, the inner ring of the first SilverInk layer 401, a PVDF piezoelectric thin film sensitive unit layer 402, a second SilverInk layer 403, a PI film 404, a second radio frequency socket 302, and a central bottom support 506.

[0066] The mass of mass block 7 is adjusted by changing the depth and width of the groove structure in the upper inner ring, thereby adjusting the range of acceleration measurement of the sensor.

[0067] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A force and acceleration parallel multifunctional sensor composed of a single sensing unit, characterized in that: It includes a first pressure plate (1), a first cover, a first radio frequency socket (301), a second radio frequency socket (302), a sensitive unit group, a second cover, a second pressure plate (6), a mass block (7), a retaining ring (8), and a pre-tightening bolt (9); The first cover, from the outside to the inside, consists of an integrally formed first outer load-bearing ring (201), a first outer deformable diaphragm (202), a first load-bearing boss hard center (203), a first inner deformable diaphragm (204), and a first inner load-bearing ring (205); the second cover, from the outside to the inside, consists of an integrally formed second outer load-bearing ring (501), a second outer deformable diaphragm (502), a second load-bearing boss hard center (503), a second inner deformable diaphragm (504), and a second inner load-bearing ring (505); wherein the shear stiffness of the first outer deformable diaphragm (202), the first inner deformable diaphragm (204), the second outer deformable diaphragm (502), and the second inner deformable diaphragm (504) is the same and is defined as the first stiffness; the compressive stiffness of the first outer load-bearing ring (201), the first inner load-bearing ring (205), the second outer load-bearing ring (501), and the second inner load-bearing ring (505) is the same and is defined as the second stiffness, and satisfies: the first stiffness Second stiffness; The sensitive unit group is located within the space enclosed by the first cover and the second cover, and the thickness of the sensitive unit group is equal to the distance between the first bearing boss hard center (203) and the second bearing boss hard center (503). The sensitive unit group includes a PI film (404), a first Silver Ink layer (401), a PVDF piezoelectric film sensitive unit layer (402), and a second Silver Ink layer (403). The PI film (404) is located at the upper end of the first Silver Ink layer (401) to insulate the first cover from the first Silver Ink layer (401). The first Silver Ink layer (401) located at the upper end of the PVDF piezoelectric film sensitive unit layer (402) includes an outer ring and an inner ring separated by a partition. The lower boss of the first bearing boss hard center (203) located above the outer ring of the first Silver Ink layer (401) and the upper boss of the second bearing boss hard center (503) located below the outer ring of the first Silver Ink layer (401) can both apply pressure to the first Silver Ink layer during force measurement. The outer ring of the Silver Ink layer (401) corresponds to the PVDF piezoelectric film sensitive unit layer (402); the mass block (7) is upper-positioned by a retaining ring (8) threadedly connected to the first inner load ring (205), the retaining ring (8) can provide the preload required for acceleration measurement, the mass block (7) can apply pressure to the inner ring of the first Silver Ink layer (401) corresponding to the PVDF piezoelectric film sensitive unit layer (402) during acceleration measurement, the outer ring of the first Silver Ink layer (401) is connected to the first radio frequency socket (301) through an electrode wire for outputting a charge signal proportional to force, the inner ring of the first Silver Ink layer (401) is connected to the second radio frequency socket (302) through an electrode wire for outputting a charge signal proportional to acceleration; the second Silver Ink layer (403) located at the lower end of the PVDF piezoelectric film sensitive unit layer (402) abuts against the upper boss of the second bearing boss hard center (503); The structure consisting of the first cover, the sensitive unit group and the second cover is limited by the first pressure plate (1) and the second pressure plate (6) at the upper and lower ends. The required preload is measured by adjusting the torque of the multiple preload bolts (9) connected between the first pressure plate (1) and the second pressure plate (6).

2. The force and acceleration parallel multifunctional sensor composed of a single sensing unit according to claim 1, characterized in that: The outer ring of the first Silver Ink layer (401) is a ring structure with a notch, and a first protruding edge extends outward from the end of the ring structure opposite to the notch. The first protruding edge is used to lead out a charge signal proportional to the force to the first radio frequency socket (301). The inner ring of the first Silver Ink layer (401) is a circular structure, and a second protruding edge extends outward from the circular structure through the notch of the ring structure. The second protruding edge is used to lead out a charge signal proportional to the acceleration to the second radio frequency socket (302). There is an annular gap and a strip gap between the outer ring of the first Silver Ink layer (401) and the inner ring of the first Silver Ink layer (401).

3. The force and acceleration parallel multifunctional sensor composed of a single sensing unit according to claim 2, characterized in that: The width of the annular structure is the same as the width of the first bearing boss hard center (203) and the second bearing boss hard center (503), and the diameter of the circular structure is the same as the outer diameter of the mass block (7). A strip groove structure is provided on the first bearing boss hard center (203) at the position corresponding to the second convex edge to avoid the first bearing boss hard center (203) from contacting the inner ring of the first Silver Ink layer (401). The width of the annular gap between the outer ring of the first Silver Ink layer (401) and the inner ring of the first Silver Ink layer (401) is the same as the total width of the first inner deformable diaphragm (204) and the first inner load-bearing ring (205).

4. A force and acceleration parallel multifunctional sensor composed of a single sensing unit according to claim 3, characterized in that: The retaining ring (8) is threadedly connected to the upper ring portion of the inner ring of the first inner load distribution ring (205). The retaining ring (8) is used to cooperate with the inner ring of the first inner load distribution ring (205) to limit the upper limit of the mass block (7). The upper end face of the retaining ring (8) is provided with a hole structure that can be connected to a retaining ring rotation tool. The upper outer ring of the mass block (7) is provided with a stepped structure that matches the retaining ring (8), and the height of the stepped structure is less than the height of the internal thread of the inner ring of the first inner load distribution ring (205). The upper inner ring of the mass block (7) is provided with a groove structure. The depth and width of the groove structure are changed to adjust the mass of the mass block (7).

5. A force and acceleration parallel multifunctional sensor composed of a single sensing unit according to claim 3, characterized in that: The first inner load-sharing ring (205) and the second inner load-sharing ring (505) each have a number of spaced guide rings extending from their opposite end faces. The PI film (404), the PVDF piezoelectric film sensitive unit layer (402) and the second Silver Ink layer (403) each have guide grooves that match the corresponding guide rings. The first outer load-sharing ring (201) is fastened to the upper end of the second outer load-sharing ring (501).

6. A force and acceleration parallel multifunctional sensor composed of a single sensing unit according to claim 3, characterized in that: The first Silver Ink layer (401) and the second Silver Ink layer (403) are both printed on the PVDF piezoelectric thin film sensitive unit layer (402) by magnetron sputtering. The PVDF piezoelectric thin film sensitive unit layer (402) has a bearing protrusion that matches the first protrusion and the second protrusion. The second cover also includes a central bottom support (506), which is interference-fitted inside the second inner load ring (505) and abuts against the second Silver Ink layer (403).

7. A force and acceleration parallel multifunctional sensor composed of a single sensing unit according to claim 1, characterized in that: Both the first RF socket (301) and the second RF socket (302) include a metal outer ring, an insulating inner ring, and a metal inner core. The metal outer ring is threaded onto the first outer load ring (201). The insulating inner ring, which is disposed between the metal outer ring and the metal inner core, is used to prevent electrical connection between the metal outer ring and the metal inner core. The metal inner core is connected to the outer ring or the inner ring of the first Silver Ink layer (401) through an electrode wire.

8. A force and acceleration parallel multifunctional sensor composed of a single sensing unit according to claim 4, characterized in that: The center of the first pressure plate (1) is reserved with a channel for the circlip rotation tool to pass through. The lower end of the first pressure plate (1) is provided with a first positioning boss that matches the inner ring of the first bearing boss hard center (203). The height of the first positioning boss is less than the height of the upper boss of the first bearing boss hard center (203). The upper end of the second pressure plate (6) is provided with a second positioning boss that matches the inner ring of the second bearing boss hard center (503). The height of the second positioning boss is less than the height of the lower boss of the second bearing boss hard center (503). Both the first pressure plate (1) and the second pressure plate (6) are provided with pre-tightening bolt countersunk holes and workpiece mounting holes.

9. A method for adjusting a force and acceleration parallel multifunctional sensor composed of a single sensing unit, based on the force and acceleration parallel multifunctional sensor as described in any one of claims 1 to 8, characterized in that, This includes adjusting the preload required for force and acceleration measurements by the sensor, as well as adjusting the range of acceleration measurements. The required preload force is measured by adjusting the torque adjustment force of the multi-stage preload bolts (9); By adjusting the position of the retaining ring (8) on the first inner load-sharing ring (205), the highest position of the mass block (7) can be adjusted to provide different preload forces required for acceleration measurement; The range of acceleration measurement can be adjusted by changing the depth and width of the groove structure in the upper inner ring of the mass block (7).

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