Weldless probe connector system for edge mounting

Abstract

The application relates to the technical field of probe connector, in particular to a welding-free probe connector system for edge installation, which comprises a probe connector, an outer conductor shell, an elastic rebound assembly and a parameter detection module. The probe connector comprises a probe inner conductor and a probe outer conductor. The probe inner conductor comprises a probe tip and a coaxial inner conductor. The probe outer conductor is wrapped around the outer periphery of the probe inner conductor to protect the probe inner conductor. The outer conductor shell is used for protecting the probe connector and fixing a to-be-tested object. The elastic rebound assembly is used for determining a deformation state based on the distance between the bottom of the outer conductor shell and the to-be-tested object, so as to adjust the distance between the probe tip and the to-be-tested object. The parameter detection module is used for acquiring the stress parameters of the to-be-tested object in a free state and a locked state. The parameter analysis module is used for determining whether a state adjustment is triggered and whether a pre-warning prompt is performed. The application can improve the stability of radio frequency signal transmission and prolong the service life of the structure.

Description

Technical Field

[0001] This invention relates to the field of probe connector technology, and more particularly to a solderless probe connector system for edge mounting. Background Technology

[0002] Radio frequency (RF) probes play a crucial role in the development and testing of RF products at multiple stages. By using RF probes, the characteristics of RF components can be accurately measured at the chip level, thereby shortening R&D time and reducing new product development costs. RF probe technology has undergone rapid development over the past thirty years, evolving from initial low-frequency measurements to commercial solutions applicable to a variety of scenarios. RF probes are used in areas such as impedance matching in high-frequency and high-temperature environments, multi-port, differential and mixed-signal measurements, high-power measurements, and terahertz applications.

[0003] However, traditional microcoaxial cable RF probes, due to the beryllium copper outer conductor of the microcoaxial cable, have an extremely thin outer diameter of only 0.8mm and 0.5mm. Under prolonged repeated contact, the microcoaxial cable can deform, and some may even break, ultimately preventing RF signal transmission in wafer and chip testing. To address the issue of repeatable measurement with traditional microcoaxial cable RF probes, the protruding coaxial cable portion of the probe needs to be as short as possible. Because the coaxial cable wall is very thin, repeated contact over time can cause deformation and breakage. Damage rarely occurs at the tip; it usually happens at the junction of the coaxial cable and the metal housing. Traditional microcoaxial cable RF probes are typically fixed to a probe stage, with the tip contacting the chip / PCB by adjusting the height of the micro-test fixture. This requires frequent disassembly and reassembly, and the exposed coaxial cable portion is susceptible to contact with other unknown objects, easily deformed by impact. Furthermore, the large metal housing of traditional microcoaxial cable RF probes takes up considerable space, making it difficult to guarantee the stability of RF signal transmission and resulting in a shorter structural lifespan. Summary of the Invention

[0004] Therefore, the present invention provides a solderless probe connector system for edge mounting to overcome the problems of easy deformation and breakage and short service life of existing technologies.

[0005] To achieve the above objectives, the present invention provides a solderless probe connector system for edge mounting, comprising:

[0006] A probe connector includes an inner probe conductor and an outer probe conductor. The inner probe conductor is used to transmit radio frequency signals and includes a probe tip and a coaxial inner conductor. The probe tip is fixedly connected to one end of the coaxial inner conductor. The probe tip has a tapered transition structure. The outer probe conductor covers the outer periphery of the inner probe conductor to protect it. The probe tip is partially connected to the outer probe conductor. The angle between the inner probe conductor and the object under test is a preset angle.

[0007] An outer conductor housing is disposed on the outer periphery of the probe outer conductor and is movably connected to the probe outer conductor to protect the probe connector and fix the object under test. The outer conductor housing is provided with several positioning posts to adjust the distance between the bottom of the outer conductor housing and the object under test, so as to achieve solderless installation.

[0008] An elastic rebound assembly is disposed at the end of the coaxial inner conductor away from the probe tip, and is used to determine the deformation state based on the distance between the bottom of the outer conductor housing and the object to be tested, so as to adjust the distance between the probe tip and the object to be tested, wherein the deformation state includes a free state and a locked state.

[0009] The parameter detection module is used to obtain the force parameters of the object under test;

[0010] The parameter analysis module is used to determine whether to trigger state adjustment and whether to issue an early warning based on the force parameters of the test object in the free and locked states of the elastic rebound component.

[0011] Furthermore, the probe tip includes an outer portion and an inner portion, the inner portion being connected to the coaxial inner conductor, the outer portion being connected to the end of the inner portion away from the coaxial inner conductor, and the inner portion being connected to the probe outer conductor.

[0012] Furthermore, the outer conductor housing is provided with a housing groove to protect the outer part of the probe tip.

[0013] Furthermore, it also includes:

[0014] An insulating substrate, which is movably connected to the outer conductor housing via each of the positioning posts, is used to fix the object to be tested.

[0015] Furthermore, the parameter analysis module determines the force characterization value based on the comparison result of the force parameters of the test object in the free state and the force parameters of the test object in the locked state, and determines whether to trigger state adjustment based on the comparison result of the force characterization value and the first preset characterization value.

[0016] Furthermore, the parameter analysis module determines the trigger state adjustment based on the first determination condition;

[0017] The first determination condition is that the force characterization value is greater than the first preset characterization value.

[0018] Furthermore, the parameter analysis module determines whether to issue a warning based on the comparison result between the force characterization value and the second preset characterization value;

[0019] Wherein, the second preset characterization value is greater than the first preset characterization value.

[0020] Furthermore, the elastic rebound component determines the deformation state based on a comparison between the distance between the bottom of the outer conductor housing and the object to be tested and a preset distance.

[0021] Furthermore, the elastic rebound component adjusts the distance between the probe tip and the object to be tested to a first preset distance based on the deformation state being in a free state, and adjusts the distance between the probe tip and the object to be tested to a second preset distance based on the deformation state being in a locked state;

[0022] Wherein, the first preset distance is greater than the second preset distance.

[0023] Furthermore, the parameter analysis module is also used to determine the force fluctuation index based on the changes in the force parameters of the test object within the target time period, and to adjust the second preset distance based on the force fluctuation index.

[0024] Compared with existing technologies, the advantages of this invention are as follows: the probe tip adopts a tapered transition structure, combined with a fixed connection design with the coaxial inner conductor, which reduces impedance abrupt changes and discontinuities in the signal transmission path, reduces signal reflection and loss, and ensures the stability and accuracy of radio frequency signal transmission. The fixed connection between the probe tip and the coaxial inner conductor avoids defects such as desoldering and cold solder joints that are prone to occur in traditional welding structures. Simultaneously, the integrally formed core transmission structure has higher strength and can withstand the mechanical impact from high-frequency repeated contact, extending the service life of the inner conductor. The tapered transition probe tip can accurately fit the contact pressure point of the test object, reducing contact gaps, improving contact stability, and reducing test errors caused by poor contact. The outer conductor of the probe covers the outer periphery of the inner conductor, forming a closed protective structure that effectively isolates external collisions, dust, moisture, and other environmental interference, ensuring the structural integrity and contact performance stability of the inner conductor and enhancing electromagnetic shielding. The elastic rebound component adaptively adjusts the deformation state based on the distance between the outer conductor shell and the test object, avoiding excessive force when the probe tip contacts the test object, improving the stability of repeatable measurements and the reliability of test results. The parameter detection module accurately collects the force parameters of the test object, providing quantitative data support for judging the contact state. This avoids signal interruption due to insufficient contact pressure or component damage due to excessive pressure, ensuring the controllability and safety of the testing process. The parameter analysis module, based on the comparison of force parameters in the free and locked states, accurately determines whether the contact state meets the standards and automatically triggers adjustment commands. This optimizes the contact effect without manual intervention, improving testing efficiency and accuracy. When the force parameters exceed the safe range, a timely warning is issued, facilitating quick troubleshooting by operators, preventing the fault from escalating, and extending the structural lifespan.

[0025] Furthermore, the probe tip of the present invention strengthens the structural mechanical strength and improves durability and repeatability stability by setting an outer part and an inner part. The outer part, as the contact end with the test object, withstands the mechanical impact during insertion, removal or contact. The inner part, through its connection with the outer conductor, disperses part of the force to the outer conductor shell, avoiding stress concentration at the connection between the tip and the coaxial inner conductor, reducing the risk of tip detachment or breakage. It is especially suitable for high-frequency repetitive testing scenarios and extends the overall service life of the probe.

[0026] Furthermore, the present invention provides a housing groove in the outer conductor housing to accommodate the probe tip external contact portion, forming a physical barrier to prevent deformation of the external contact portion, tip wear, or material loss. The inner wall of the housing groove precisely matches the outer periphery of the external contact portion, forming a radial limit to prevent the external contact portion from wobbling or shifting during contact or insertion / removal. This ensures that the contact position between the external contact portion and the pressure point of the object under test is always kept within the preset area, avoiding signal transmission discontinuity and test data fluctuation caused by contact point offset, and improving repeatability measurement accuracy.

[0027] Furthermore, the positioning post of this invention is designed with high precision dimensions to fit the insulating substrate and the outer conductor shell. The insulating substrate serves as the direct bearing surface of the test object. The positioning post achieves precise alignment with the outer conductor shell, thereby ensuring that the relative position of the contact pressure point of the test object and the probe tip (external part) is fixed. This avoids contact point deviation caused by the displacement of the test object during the test, adapts to test objects of different thicknesses / sizes, buffers mechanical impact, thereby improving the accuracy and stability of repeatable measurements and ensuring the service life of the structure.

[0028] Furthermore, the parameter analysis module of this invention can prevent damage caused by over-tightening and test failure caused by insufficient contact by analyzing the force parameters of the test object, thereby improving the stability of radio frequency signal transmission. Attached Figure Description

[0029] Figure 1 This is an overall structural diagram of a solderless probe connector system for edge mounting according to an embodiment of the present invention;

[0030] Figure 2 This is a side sectional view of a solderless probe connector system for edge mounting according to an embodiment of the present invention;

[0031] Figure 3 This is a schematic diagram of the solderless probe connector system in a free state according to an embodiment of the present invention;

[0032] Figure 4 This is an embodiment of the present invention. Figure 3 A magnified view of a portion of location A;

[0033] Figure 5 This is a schematic diagram of the solderless probe connector system in the locked state according to an embodiment of the present invention;

[0034] Figure 6 This is an embodiment of the present invention. Figure 5 A magnified view of a portion of position B;

[0035] In the figure, 1. Probe tip; 2. Coaxial inner conductor; 3. Probe outer conductor; 4. Outer conductor housing; 5. Positioning post; 6. Elastic rebound assembly; 7. Insulating substrate; 8. Connector port; 9. Housing groove; 10. Test object. Detailed Implementation

[0036] To make the objectives and advantages of the present invention clearer, the present invention will be further described below with reference to embodiments; it should be understood that the specific embodiments described herein are merely for explaining the present invention and are not intended to limit the present invention.

[0037] Preferred embodiments of the present invention will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of the present invention and are not intended to limit the scope of protection of the present invention.

[0038] It should be noted that in the description of this invention, the terms "upper", "lower", "left", "right", "inner", "outer", etc., which indicate directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. This is only for the convenience of description and is not intended to indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this invention.

[0039] Furthermore, it should be noted that, in the description of this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0040] Please see Figures 1-6 As shown, Figure 1 This is an overall structural diagram of a solderless probe connector system for edge mounting according to an embodiment of the present invention; Figure 2 This is a side sectional view of a solderless probe connector system for edge mounting according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the solderless probe connector system in a free state according to an embodiment of the present invention; Figure 4 This is an embodiment of the present invention. Figure 3 A magnified view of a portion of location A; Figure 5 This is a schematic diagram of the solderless probe connector system in the locked state according to an embodiment of the present invention; Figure 6 This is an embodiment of the present invention. Figure 5 A partial enlarged view of position B; in the figure, probe tip 1, coaxial inner conductor 2, probe outer conductor 3, outer conductor housing 4, positioning post 5, elastic rebound assembly 6, insulating substrate 7, connector port 8, housing groove 9, and test object 10. This embodiment of the invention provides a solderless probe connector system for edge mounting, comprising:

[0041] A probe connector includes an inner probe conductor and an outer probe conductor 3. The inner probe conductor is used to transmit radio frequency signals and includes a probe tip 1 and a coaxial inner conductor 2. The probe tip 1 is fixedly connected to one end of the coaxial inner conductor 2. The probe tip 1 has a tapered transition structure. The outer probe conductor 3 covers the outer periphery of the inner probe conductor to protect it. The probe tip 1 and the outer probe conductor 3 are partially connected. The angle between the inner probe conductor and the object under test 10 is a preset angle.

[0042] In practice, the angle between the inner conductor of the probe and the test object 10 should be such that the probe tip does not interfere with the test object or the outer conductor shell. The preset angle value range can be set to 15° to 45°. Preferably, the preset angle is set to 30°, which can reduce the impedance change at the contact interface, improve the uniformity of the contact pressure, extend the probe's service life, and ensure the integrity and stability of the radio frequency signal transmission.

[0043] Understandably, the object under test can be a chip or a PCB board, etc.

[0044] Specifically, the probe tip 1 includes an outer part and an inner part. The inner part is connected to the coaxial inner conductor 2. The outer part is connected to the end of the inner part away from the coaxial inner conductor 2. The inner part is connected to the probe outer conductor 3.

[0045] In practice, the length of the external part can be set to 0.05mm to 0.1mm to ensure that the outer conductor of the probe achieves planar limiting protection.

[0046] Specifically, the probe tip of this invention strengthens the structural mechanical strength and improves durability and repeatability stability by setting an outer part and an inner part. The outer part, as the contact end with the test object, withstands the mechanical impact during insertion, removal or contact. The inner part, through its connection with the outer conductor, disperses some of the force to the outer conductor shell, avoiding stress concentration at the connection between the tip and the coaxial inner conductor, reducing the risk of tip detachment or breakage. It is especially suitable for high-frequency repetitive testing scenarios and extends the overall service life of the probe.

[0047] The outer conductor housing 4 is disposed on the outer periphery of the probe outer conductor 3 and is movably connected to the probe outer conductor 3 to protect the probe connector and fix the object to be tested 10. The outer conductor housing 4 is provided with several positioning posts 5 to adjust the distance between the bottom of the outer conductor housing 4 and the object to be tested 10 so as to achieve solderless installation.

[0048] Specifically, the outer conductor housing 4 is provided with a housing groove 9, which is used to protect the outer part of the probe tip 1.

[0049] In practice, the outer conductor shell and the probe outer conductor can be connected by a sliding groove. The number of positioning posts is not limited. Preferably, there are two positioning posts, which can be set on both sides of the groove of the shell. The distance between the bottom of the outer conductor shell and the object to be tested can be adjusted by adjusting the positioning posts to ensure that the object to be tested is fixed and to prevent the object to be tested from moving.

[0050] Specifically, the present invention provides a housing groove in the outer conductor housing to accommodate the probe tip external contact part, forming a physical barrier to prevent deformation of the external contact part, tip wear or material loss. The inner wall of the housing groove is precisely matched with the outer periphery of the external contact part to form a radial limit, preventing the external contact part from wobbling or shifting during contact or insertion and removal. This ensures that the contact position between the external contact part and the pressure point of the object under test is always kept in the preset area, avoiding signal transmission discontinuity and test data fluctuation caused by contact point offset, and improving repeatability measurement accuracy.

[0051] The elastic rebound component 6 is disposed at the end of the coaxial inner conductor 2 away from the probe tip 1, and is used to determine the deformation state based on the distance between the bottom of the outer conductor housing 4 and the object to be tested 10, so as to adjust the distance between the probe tip 1 and the object to be tested 10. The deformation state includes a free state and a locked state.

[0052] Specifically, the elastic rebound component determines the deformation state based on a comparison between the distance between the bottom of the outer conductor housing and the object under test and a preset distance.

[0053] During implementation, if the distance between the bottom of the outer conductor shell and the object under test is greater than a preset distance, the deformation state is determined to be a free state; if the distance between the bottom of the outer conductor shell and the object under test is less than or equal to the preset distance, the deformation state is determined to be a locked state. Practitioners can set the preset distance based on actual conditions or based on the average distance between the bottom of the outer conductor shell and the object under test in the locked state from historical data that passed the qualification test.

[0054] Specifically, the elastic rebound component adjusts the distance between the probe tip and the object to be tested to a first preset distance based on the deformation state being in a free state, and adjusts the distance between the probe tip and the object to be tested to a second preset distance based on the deformation state being in a locked state;

[0055] Wherein, the first preset distance is greater than the second preset distance.

[0056] In practice, the implementers can set a first preset distance and a second preset distance based on the actual situation. The first preset distance can maintain a safe gap between the probe tip and the test object, avoiding rigid collision between the probe tip and the test object in the initial stage of assembly (free state). In the locked state, the elastic rebound component deforms, driving the distance between the probe tip and the test object to shorten from the first preset distance to the second preset distance. At this time, the elastic force of the elastic rebound component is converted into a stable contact pressure, which not only ensures effective conductive contact between the probe tip and the test object pressure point, but also avoids tip wear or test object damage caused by excessive pressure, thus extending the service life of the test object and the probe. The smaller the second preset distance, the greater the contact pressure between the probe tip and the test object.

[0057] The parameter detection module is used to obtain the force parameters of the object under test 10;

[0058] In practice, the force parameters include the magnitude and direction of the force.

[0059] The parameter analysis module is used to determine whether to trigger state adjustment and whether to issue a warning based on the force parameters of the test object 10 in the free and locked states of the elastic rebound component 6.

[0060] Specifically, the parameter analysis module determines the force characterization value based on the comparison result of the force parameters of the test object in the free state and the force parameters of the test object in the locked state, and determines whether to trigger state adjustment based on the comparison result of the force characterization value and the first preset characterization value.

[0061] Specifically, the parameter analysis module determines the trigger state adjustment based on the first determination condition;

[0062] The first determination condition is that the force characterization value is greater than the first preset characterization value.

[0063] In practice, the force parameters at various points on the object under test in a free state are: Y1, Y2, ..., Y... j , ..., Y m For the force parameters at various points on the test object under the locked state: E1, E2, ..., E j , ..., E m Where j = 1, 2, ..., m; m is the number of location points, Y j =(YA j YB j E j =(EA j ,EB j If the force characteristic value is HP = (∑ m j=1 (((abs(YA j -EA j) / YA j )+(abs(YB j -EB j ) / YB j )) / 2)) / m, abs() is a preset function for determining absolute value.

[0064] Understandably, if the force characterization value is greater than the first preset characterization value, it indicates that the force parameters at various points on the test object are changing abnormally under the locking state, possibly due to over-locking, thus triggering a state adjustment. Practitioners can set the first preset characterization value based on the actual situation or the average force characterization value corresponding to the locking state that passed the qualification test in historical data.

[0065] Specifically, the parameter analysis module of this invention can prevent damage caused by over-tightening and test failure caused by insufficient contact by analyzing the force parameters of the test object, thereby improving the stability of radio frequency signal transmission.

[0066] Specifically, the parameter analysis module determines whether to issue a warning based on the comparison result between the force characterization value and the second preset characterization value;

[0067] Wherein, the second preset characterization value is greater than the first preset characterization value.

[0068] During implementation, if the stress characterization value is greater than the second preset characterization value, an early warning will be issued. The implementers can set the second preset characterization value based on the actual situation, or set the second preset characterization value based on 120% to 130% of the first preset characterization value.

[0069] Specifically, the parameter analysis module is also used to determine the force fluctuation index based on the changes in the force parameters of the test object within the target time period, and to adjust the second preset distance based on the force fluctuation index.

[0070] During implementation, the force parameters of the object under test during the target time period are: J1, J2, ..., J i , ..., J n J i =(JA i JB i ), where i=1, 2, ..., n; n is the number of parameter acquisitions within the target time period, and the force fluctuation index SP=((∑ n i=1 (JA j -(∑ n i= 1JA j ) / n) 2 ) / n+(∑ n i=1 (JB j -(∑n i=1 JB j ) / n) 2 ) / n) / 2.

[0071] Understandably, the adjustment coefficient is determined based on the ratio of the force fluctuation index to the preset fluctuation index, and the distance adjustment amount is determined based on the product of the adjustment coefficient and the second preset distance, thereby increasing the second preset distance. In practice, implementers can set the preset fluctuation index based on actual conditions or the average force fluctuation index that has passed compliance testing in historical data.

[0072] Specifically, it also includes:

[0073] An insulating substrate 7 is movably connected to the outer conductor housing 4 via each of the positioning posts 5, for fixing the object to be tested 10.

[0074] Specifically, the positioning post of this invention adopts a high-precision dimensional design for its fit with the insulating substrate and the outer conductor shell. The insulating substrate serves as the direct bearing surface of the test object, and the positioning post achieves precise alignment with the outer conductor shell. This ensures that the relative position of the contact pressure point of the test object and the probe tip (external part) is fixed, avoiding contact point deviation caused by the displacement of the test object during the test. It is suitable for test objects of different thicknesses / sizes, buffers mechanical impacts, thereby improving the accuracy and stability of repeatable measurements and ensuring the service life of the structure.

[0075] Specifically, it also includes:

[0076] Connector port 8, which connects to the probe connector and is located at the end away from the probe tip 1, is used to connect an RF cable.

[0077] This invention features a tapered transition structure for the probe tip, combined with a fixed connection to the coaxial inner conductor. This reduces impedance abrupt changes and discontinuities in the signal transmission path, minimizing signal reflection and loss, and ensuring the stability and accuracy of RF signal transmission. The fixed connection between the probe tip and the coaxial inner conductor avoids defects such as desoldering and cold solder joints common in traditional welded structures. Furthermore, the integrated core transmission structure offers higher strength, withstanding the mechanical impact of repeated high-frequency contact, extending the lifespan of the inner conductor. The tapered probe tip precisely conforms to the contact pressure point of the test object, reducing contact gaps, improving contact stability, and minimizing test errors caused by poor contact. The outer conductor of the probe covers the outer periphery of the inner conductor, forming a closed protective structure that effectively isolates the probe tip from external collisions, dust, moisture, and other environmental interference, ensuring the structural integrity and contact performance stability of the inner conductor and enhancing electromagnetic shielding. The elastic rebound component adaptively adjusts its deformation state based on the distance between the outer conductor shell and the test object, preventing excessive force on the probe tip when in contact with the test object, thus improving the stability of repeatable measurements and the reliability of test results. The parameter detection module accurately collects the force parameters of the test object, providing quantitative data support for judging the contact state. This avoids signal interruption due to insufficient contact pressure or component damage due to excessive pressure, ensuring the controllability and safety of the testing process. The parameter analysis module, based on the comparison of force parameters in the free and locked states, accurately determines whether the contact state meets the standards and automatically triggers adjustment commands. This optimizes the contact effect without manual intervention, improving testing efficiency and accuracy. When the force parameters exceed the safe range, a timely warning is issued, facilitating quick troubleshooting by operators, preventing the fault from escalating, and extending the structural lifespan.

[0078] Example:

[0079] The embodiment provides a comparison of the number of repeated measurements and electrical performance indicators when testing a chip using a conventional micro-coaxial cable RF probe and the solderless probe connector system of the present invention for edge mounting. Table 1 shows the comparison data.

[0080] Number of repeated measurements Return loss (dB@110GHz) Insertion loss (dB@110GHz) This invention provides a solderless probe connector system for edge mounting. 10000 8.24 11.12 Traditional microcoaxial cable RF probe 5000 4.20dB 12.60

[0081] Table 1 above shows that when using traditional microcoaxial cable RF probes to test chips, the thin walls of the coaxial cable cause deformation and breakage during repeated contact over extended periods, limiting its lifespan to only 5,000 cycles. Furthermore, traditional microcoaxial cable RF probes are assembled from a small section of coaxial cable (approximately 30mm-50mm) and a connector, resulting in relatively high overall return and insertion losses. However, when using the solderless probe connector system for edge mounting as described in this invention, the coaxial cable is eliminated, reducing the number of weak points that can be repeatedly measured. By shortening the overall inner conductor length of the connector, the number of repeatable measurements can reach 10,000, making it more durable and less prone to damage. This results in lower overall return and insertion losses, leading to more accurate testing.

[0082] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of the present invention.

Claims

1. A solderless probe connector system for edge mounting, characterized by, The probe connector comprises a probe inner conductor for transmitting a radio frequency signal and a probe outer conductor, the probe inner conductor comprises a probe tip and a coaxial inner conductor, the probe tip is fixedly connected with one end of the coaxial inner conductor, the probe tip is a tapered transition structure, the probe outer conductor is wrapped around the outer periphery of the probe inner conductor to protect the probe inner conductor, the probe tip is partially connected with the probe outer conductor, and an included angle between the probe inner conductor and the object to be measured is a preset angle. The outer conductor shell is arranged on the outer periphery of the probe outer conductor and movably connected with the probe outer conductor to protect the probe connector and fix the object to be measured, and the outer conductor shell is provided with a plurality of positioning columns for adjusting the distance between the bottom of the outer conductor shell and the object to be measured to realize the welding-free installation. The elastic rebound assembly is arranged at the end of the coaxial inner conductor away from the probe tip to determine the deformation state based on the distance between the bottom of the outer conductor shell and the object to be measured, so as to adjust the distance between the probe tip and the object to be measured, wherein the deformation state comprises a free state and a locked state. The parameter detection module is used to obtain the stress parameter of the object to be measured. The parameter analysis module is used to determine whether to trigger state adjustment and whether to give a warning prompt based on the stress parameter of the object to be measured in the free state and the locked state of the elastic rebound assembly. The probe tip comprises an outer connecting part and an inner connecting part, the inner connecting part is connected with the coaxial inner conductor, the outer connecting part is connected with the end of the inner connecting part away from the coaxial inner conductor, and the inner connecting part is connected with the probe outer conductor.

2. The solderless probe connector system for edge mounting of claim 1, wherein, The outer conductor shell is provided with a shell groove for protecting the outer connecting part of the probe tip.

3. The solderless probe connector system for edge mounting of claim 2, wherein, Further comprising:

4. The solderless probe connector system for edge mounting of claim 3, wherein, The insulating substrate is movably connected with the outer conductor shell through the positioning columns to fix the object to be measured. The parameter analysis module determines a stress characteristic value based on the comparison result of the stress parameter of the object to be measured in the free state and the stress parameter of the object to be measured in the locked state, and determines whether to trigger state adjustment based on the comparison result of the stress characteristic value and a first preset characteristic value.

5. The solderless probe connector system for edge mounting of claim 4, wherein, The parameter analysis module determines to trigger state adjustment based on a first determination condition.

6. The solderless probe connector system for edge mounting of claim 5, wherein, The first determination condition is that the stress characteristic value is greater than the first preset characteristic value. The parameter analysis module determines whether to give a warning prompt based on the comparison result of the stress characteristic value and a second preset characteristic value.

7. The solderless probe connector system for edge mounting of claim 6, wherein, The second preset characteristic value is greater than the first preset characteristic value. The elastic rebound assembly determines the deformation state based on the comparison result of the distance between the bottom of the outer conductor shell and the object to be measured and a preset distance.

8. The solderless probe connector system for edge mounting of claim 7, wherein, The elastic rebound assembly adjusts the distance between the probe tip and the object to be measured to a first preset distance based on the free state of the deformation state, and adjusts the distance between the probe tip and the object to be measured to a second preset distance based on the locked state of the deformation state.

9. The solderless probe connector system for edge mounting of claim 8, wherein, The first preset distance is greater than the second preset distance. ​ 10. The solderless probe connector system for edge mounting of claim 9, wherein, The parameter analysis module is further configured to determine a force fluctuation index based on a change of the force parameter of the analyte in a target time period, and adjust the second preset distance based on the force fluctuation index.

Images