Single-channel optical transceiver assembly based on microwave photon integration and optical module

Abstract

The invention discloses a single-channel optical transceiver assembly based on microwave photon integration and an optical module, and relates to the technical field of microwave photon signals. Comprising a packaging shell with an upper cavity, the upper cavity comprises a first channel and a second channel which are isolated from each other, a separating wall between the first channel and the second channel is provided with an optical window, and one side, facing the first channel, of the optical window is provided with an optical filter which is highly reflective to a first optical signal and highly transparent to a second optical signal; a light emitting unit, a spectroscope, a first coupling lens and an optical fiber are sequentially arranged in the first channel in the axial direction, the light emitting unit is used for emitting a first light signal, and the first light signal is coupled to the optical fiber through the first coupling lens after penetrating through the spectroscope; an optical receiving unit is arranged in the second channel, and the optical fiber is used for emitting a second optical signal; the second optical signal is collimated by the first coupling lens, then enters the spectroscope, is reflected by the spectroscope, passes through the light window and is received by the light receiving unit. According to the invention, the system integration degree and the channel isolation degree can be improved.

Description

Technical Field

[0001] This application relates to the field of microwave photonic signal technology, specifically to a single-channel optical transceiver component and optical module based on microwave photonic integration. Background Technology

[0002] Microwave photonics technology combines the advantages of microwaves and photonics, and with its advantages such as high bandwidth, low transmission loss, high-speed processing capability, and strong resistance to electromagnetic interference, it has become a transformative technology in fields such as cellular communication, satellite communication, radar detection, and biomedicine. Currently, most microwave photonics systems are mainly composed of discrete components to form optical transmitting and receiving systems. Discrete components include lasers, modulators, wavelength division multiplexers, photodetectors, and corresponding microwave processing devices, such as microwave amplifiers and radio frequency equalizers.

[0003] These devices are large, power-consuming, and lack flexibility. Single-level optical devices need to be interconnected by fiber optic fusion splicing, and radio frequency devices need to be interconnected by coaxial cables. Multi-level cascading not only increases link loss but also causes system link noise accumulation. At the same time, these interconnection methods all require a large assembly space, which further increases the assembly difficulty of the system in the limited assembly space, making it difficult to meet the miniaturization, lightweighting, and multi-functional application requirements of integrated air-space-ground information systems.

[0004] To overcome the limitations of traditional microwave photonic systems in terms of size, weight, and power consumption, the industry has proposed integrating various core electronic components in traditional links to achieve high-density, arrayed, and scalable miniaturized systems. However, in the pursuit of high-density integration, achieving efficient and stable system integration while ensuring system performance has become a key research issue. Furthermore, in complex electromagnetic environments, effectively ensuring sufficient isolation of optical channels and effectively suppressing interference are also pressing problems that need to be solved. Summary of the Invention

[0005] The purpose of this application is to provide a single-channel optical transceiver component and optical module based on microwave photonic integration, so as to solve the problems of insufficient system integration and channel isolation in existing microwave photonic link systems.

[0006] The technical solution adopted by this application to solve its technical problem is: In a first aspect, a single-channel optical transceiver component based on microwave photonic integration is provided, including a package housing with an upper cavity. The upper cavity includes a first channel and a second channel that are isolated from each other, and an optical window is provided on the isolation wall between the two. A filter that is highly reflective to a first optical signal and highly transparent to a second optical signal is provided on the side of the optical window facing the first channel. The first channel is provided with a light emitting unit, a beam splitter, a first coupling lens and an optical fiber in sequence along its axial direction. The light emitting unit is used to emit the first light signal. After the first light signal passes through the beam splitter, it is coupled to the optical fiber through the first coupling lens. The second channel is equipped with an optical receiving unit, and the optical fiber is used to emit the second optical signal. After being collimated by the first coupling lens, the second optical signal is incident on the beam splitter, and after being reflected by it, it passes through the optical window and is received by the optical receiving unit.

[0007] Furthermore, the optical emitting unit includes a first radio frequency coaxial connector, a first microwave chip, a laser chip, and a collimating lens; The first RF coaxial connector, the first microwave chip, and the laser chip are sequentially connected through a first matching chip. The first RF coaxial connector is used to input a first RF signal. After the first RF signal is processed by the first microwave chip, it is sent to the laser chip to be converted into the first optical signal. The collimating lens is disposed between the laser chip and the beam splitter, and is used to collimate the first optical signal emitted by the laser chip and allow it to pass through the beam splitter.

[0008] Furthermore, a first isolator is provided in the optical path between the collimating lens and the beam splitter.

[0009] Furthermore, a reflector is provided in the second channel. The reflector is used to receive the second light signal passing through the light window and reflect it so that it can be received by the light receiving unit.

[0010] Furthermore, the angle between the incident light path and the reflected light path of both the beam splitter and the reflector is 90°.

[0011] Furthermore, the optical receiving unit includes a second radio frequency coaxial connector, a second microwave chip, a detector chip, and a second coupling lens; The second coupling lens is disposed between the reflector and the detector chip, and is used to couple the second optical signal reflected by the reflector to the detector chip; The second RF coaxial connector, the second microwave chip, and the detector chip are connected in sequence via a second matching chip; the detector chip is used to convert the second optical signal into a second RF signal, and the second RF signal is processed by the second microwave chip and then output by the second RF coaxial connector.

[0012] Furthermore, a second isolator is provided in the optical path between the second coupling lens and the reflector.

[0013] Furthermore, the optical fiber is a beveled single-mode optical fiber.

[0014] Furthermore, the gap between the first coupling lens and the optical fiber is greater than 200 μm.

[0015] In a second aspect, an optical module is provided, including the single-channel optical transceiver assembly provided in the first aspect. The encapsulation housing has a lower cavity isolated from the upper cavity. The lower cavity has a PCB control board and a power supply control insulator connected to the PCB control board. The PCB control board is connected to the optical emitting unit and the optical receiving unit through a cavity insulator.

[0016] The beneficial effects of this application are: The single-channel optical transceiver component and optical module based on microwave photonics integration provided in this application embodiment are used to achieve high-density hybrid integration and packaging of optical transmitting and receiving components, realizing the mutual conversion between microwave signals and optical signals. Physical isolation between the transmitting and receiving channels is achieved by setting mutually isolated first and second channels. Crosstalk is reduced by setting filters on the optical window, further improving the isolation between the transmitting and receiving channels. Crosstalk is further reduced by setting isolators on the optical transmitting and receiving paths. The merging of external optical interfaces of the transmitting and receiving channels is achieved by adopting a single-fiber bidirectional transmission method, further improving the component space reuse rate and enhancing the system integration. This solves the problems of insufficient system integration and channel isolation in existing microwave photonic link systems, thereby improving system stability. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the upper cavity structure of the single-channel optical transceiver assembly provided in the embodiments of this application; Figure 2 This is a schematic diagram of the lower cavity structure of the single-channel optical transceiver assembly provided in the embodiments of this application; Figure 3 This is a schematic block diagram of a single-channel optical transceiver component provided in an embodiment of this application.

[0019] Figure label: 10-Encapsulation housing; 101-First channel; 102-Second channel; 103-Isolation wall; 104-Light window; 11-First RF coaxial connector; 12-First matching chip; 13-First microwave chip; 14-Laser chip; 15-Collimating lens; 16-First isolator; 17-Beam splitter; 18-First coupling lens; 19-Fiber optic cable; 20 - Second RF coaxial connector; 21 - Second matching chip; 22 - Second microwave chip; 23 - Detector chip; 24 - Second coupling lens; 25 - Second isolator; 26 - Mirror; 27 - Filter; 30 - PCB control board; 40 - Power supply control insulator. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0021] In the description of this application, the terms "upper," "lower," "left," "right," "front," "rear," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Unless otherwise specified, the above-mentioned orientational descriptions can be flexibly set in actual application, provided that the relative positional relationships shown in the accompanying drawings are satisfied.

[0022] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] An optical transceiver assembly includes an optical transmitting assembly and an optical receiving assembly; wherein, the optical transmitting assembly is used to convert electrical signals into optical signals and input them into optical fibers for transmission; the optical receiving assembly is used to receive the optical signals transmitted through the optical fibers and convert them into electrical signals.

[0024] See Figure 1This application provides a single-channel optical transceiver component based on microwave photonics integration, including a package housing 10 with an upper cavity. The upper cavity includes a first channel 101 and a second channel 102 that are isolated from each other, and an optical window 104 is provided on the isolation wall 103 between the two. A filter 27 with high reflectivity for the first optical signal and high transmittance for the second optical signal is provided on the side of the optical window 104 facing the first channel 101. An optical emitting unit, a beam splitter 17, a first coupling lens 18 and an optical fiber 19 are arranged sequentially along its axial direction in the first channel 101. The optical emitting unit is used to emit the first optical signal. After the first optical signal passes through the beam splitter 17, it is coupled to the optical fiber 19 through the first coupling lens 18. An optical receiving unit is provided in the second channel 102. The optical fiber 19 is used to emit the second optical signal. After the second optical signal is collimated by the first coupling lens 18, it is incident on the beam splitter 17, and after being reflected by it, it passes through the optical window 104 and is received by the optical receiving unit.

[0025] The encapsulation housing 10 has an upper cavity for integrating the encapsulated light emitting component and the light receiving component, enabling miniaturized product design. The upper cavity is divided into a first channel 101 and a second channel 102 by an isolation wall 103. These two channels are physically separated and independent, providing high isolation. An optical window 104 is provided on the isolation wall 103, allowing light signals to couple from the first channel 101 to the second channel 102. This optical window 104 can be an ITO thin-film coated window, achieving efficient electromagnetic shielding while ensuring high light transmittance. Simultaneously, the light transmittance of the optical window 104 can be dynamically adjusted through electric field control, thereby achieving intelligent dimming and energy-saving effects. A filter 27 is provided on the side of the optical window 104 facing the first channel 101. This filter 27 only allows light signals of specific wavelengths to pass through, achieving light signal filtering. For example, the first optical signal with wavelength λ1 and the second optical signal with wavelength λ2 are optical signals of different wavelengths. The filter 27 has high reflectivity for the first optical signal and high transmittance for the second optical signal, allowing only the second optical signal to enter the second channel 102.

[0026] The first channel 101 is horizontally oriented axially, and from left to right, it contains a light emitting unit, a beam splitter 17, a first coupling lens 18, and an optical fiber 19. The light emitting unit converts the input first radio frequency signal into parallel light to emit the first optical signal to the right. The beam splitter 17 and the first coupling lens 18 are both located in the optical path of the first optical signal. The beam splitter 17 allows the first optical signal to pass through, and the first coupling lens 18 couples and converges the first optical signal to the optical fiber 19 for transmission. The outer surface of the encapsulation housing 10 has a tail tube communicating with the right end of the first channel 101. The first coupling lens 18 and the optical fiber 19 are sealed inside the tail tube using a brazing process. A plastic sleeve may also be wrapped around the tail tube to increase mechanical protection.

[0027] Optical fiber 19 can be beveled to effectively reduce reflections at the fiber end face and weaken crosstalk of the optical signal. For example, the end face grinding angle of the beveled fiber is 8° to achieve a return loss of <-60Db. The gap between the first coupling lens 18 and the optical fiber 19 should meet the coupling and convergence requirements. Under this premise, the gap between the first coupling lens 18 and the optical fiber 19 is greater than 200μm, thereby suppressing multiple reflections of the optical signal.

[0028] Optical fiber 19 is also used to emit a second optical signal in the opposite direction to the first optical signal into the first channel 101, realizing bidirectional communication over a single fiber and further improving integration. The first coupling lens 18 collimates the second optical signal into parallel light before it is incident on the beam splitter 17. The beam splitter 17 reflects the second optical signal to the optical window 104, allowing it to pass through the optical window 104 and enter the second channel 102. Meanwhile, the first optical signal in the first channel 101 is blocked by the filter 27 on the optical window 104, preventing it from entering the second channel 102. An optical receiving unit is provided in the second channel 102 along the optical path of the second optical signal, used to receive the second optical signal and convert it into a second radio frequency signal for output.

[0029] The single-channel optical transceiver component based on microwave photonics integration provided in this application embodiment is used to achieve high-density hybrid integration and packaging of optical transmitting and receiving components, realizing mutual conversion between microwave signals and optical signals and miniaturization of the product. Physical isolation between the transmitting and receiving channels is achieved by setting mutually isolated first channels 101 and second channels 102. Crosstalk is reduced by setting a filter 27 on the optical window 104, further improving the isolation between the transmitting and receiving channels. The use of single-fiber bidirectional transmission merges the external optical interfaces of the transmitting and receiving channels, further improving the component space reuse rate and enhancing the system integration. This solves the problems of insufficient system integration and channel isolation in existing microwave photonic link systems, thereby improving system stability.

[0030] In some embodiments, see Figure 1 The optical emitting unit includes a first radio frequency coaxial connector 11, a first microwave chip 13, a laser chip 14, and a collimating lens 15. The first radio frequency coaxial connector 11, the first microwave chip 13, and the laser chip 14 are connected in sequence through a first matching chip 12. The first radio frequency coaxial connector 11 is used to input a first radio frequency signal. After the first radio frequency signal is processed by the first microwave chip 13, it is sent to the laser chip 14 and converted into a first optical signal. The collimating lens 15 is disposed between the laser chip 14 and the beam splitter 17 and is used to collimate the first optical signal emitted by the laser chip 14 and then transmit it through the beam splitter 17.

[0031] The first RF coaxial connector 11 is used to input the first RF signal. It is located at the left end of the first channel 101 and can be sealed and soldered to the package housing 10 using Au80Sn20 solder. The first RF coaxial connector 11 is connected to the first microwave chip 13 using a first matching chip 12. The first microwave chip 13 is also connected to the laser chip 14 using a first matching chip 12. The parameters of the two first matching chips 12 are different and should be set independently according to the impedance matching requirements of their respective ports. The first microwave chip 13 amplifies, filters, attenuates, and performs other microwave processing on the first RF signal, which is then directly modulated onto the laser chip 14. The laser chip 14 then converts the first RF signal into a first optical signal and transmits it to the right.

[0032] Each chip is bonded within the first channel 101 using conductive adhesive, and the chips are interconnected using gold wire or gold strip bonding. Wideband RF lossless matching of each chip is achieved through the matching network of the first matching chip 12, and efficient transmission of the wideband signal is achieved through various levels of impedance matching networks. The matching network includes, but is not limited to, transmission line transformation or multi-stage capacitor-inductor cascade matching methods.

[0033] Since the first optical signal emitted by the laser chip 14 is an asymmetrical beam, it is collimated and shaped into a parallel beam by the collimating lens 15 and transmitted to the right. The dual-lens coupling method, combining the collimating lens 15 with the first coupling lens 18, achieves higher coupling efficiency, exceeding 85%.

[0034] The first microwave chip 13 can be a low-noise amplifier chip with a noise figure ≤3dB, gain ≥14dB, and output P-1 ≥17dBm, achieving an optical emission channel noise figure ≤26dB and an input P-1 ≥3dBm. By reducing the link noise figure and increasing the input compression point by 1dB, the system dynamic range is improved. The laser chip 14 converts the electrical signal into an optical signal output. A high-speed direct-modulation DFB laser can be selected, which can suppress laser mode hopping over a wide operating current and temperature range, achieving a side-mode rejection ratio of over 50dB and a relative intensity noise of over -150dB / Hz, suitable for high signal-to-noise ratio output requirements. The laser includes, but is not limited to, DML lasers or EML lasers.

[0035] In some embodiments, see Figure 1A first isolator 16 is provided in the optical path between the collimating lens 15 and the beam splitter 17. By setting the first isolator 16, the first optical signal can only be transmitted from the collimating lens 15 to the beam splitter 17, and cannot be transmitted from the beam splitter 17 to the collimating lens 15, realizing unidirectional transmission of the first optical signal, effectively reducing the reflection of the first optical signal, attenuating the back-reflected light to <-60dB, avoiding lasing interference caused by reflected light in the optical path to the laser chip 14, and improving the reliability of the optical emitting unit.

[0036] In some embodiments, see Figure 1 The second channel 102 is equipped with a reflector 26, which receives the second optical signal passing through the optical window 104 and reflects it so that it is received by the optical receiving unit. By setting the reflector 26, the transmission direction of the second optical signal is redirected, thereby changing the transmission direction of the second optical signal within the second channel 102. For example, the angle between the incident and reflected optical paths of both the beam splitter 17 and the reflector 26 is 90°. The reflector 26 can be a MEMS micromirror, and the coupling accuracy with the PD can be adjusted through micromechanical means to achieve dynamic adjustment of the signal amplitude of the optical receiving link. Accordingly, by changing the transmission direction of the second optical signal within the second channel 102, the first channel 101 and the second channel 102 can be arranged in parallel, further improving the integration and miniaturization of the product.

[0037] In some embodiments, see Figure 1 The optical receiving unit includes a second RF coaxial connector 20, a second microwave chip 22, a detector chip 23, and a second coupling lens 24. The second coupling lens 24 is disposed between the reflector 26 and the detector chip 23 and is used to couple the second optical signal reflected by the reflector 26 to the detector chip 23. The second RF coaxial connector 20, the second microwave chip 22, and the detector chip 23 are connected in sequence through a second matching chip 21. The detector chip 23 is used to convert the second optical signal into a second RF signal. After being processed by the second microwave chip 22, the second RF signal is output by the second RF coaxial connector 20.

[0038] The second coupling lens 24 is disposed between the reflector 26 and the detector chip 23. The second coupling lens 24 couples and converges the second optical signal reflected by the reflector 26 to the photosensitive surface of the detector chip 23. The detector chip 23 then converts the second optical signal into a second radio frequency (RF) signal and transmits it to the second microwave chip 22. The second RF coaxial connector 20 is connected to the second microwave chip 22 using a second matching chip 21, and the second microwave chip 22 is also connected to the detector chip 23 using a second matching chip 21. The parameters of the two second matching chips 21 are different and should be set independently according to the impedance matching requirements of their respective ports. The second microwave chip 22 amplifies, filters, attenuates, and performs other microwave processing on the second RF signal before directly modulating it onto the second RF coaxial connector 20, which then outputs the second RF signal. Each chip is bonded to the second channel 102 with conductive adhesive, and the chips are interconnected using gold wire or gold ribbon bonding. The matching network of the second matching chip 21 achieves broadband RF lossless matching between the chips, and the impedance matching networks at various levels ensure efficient transmission of the broadband signal along the transmission path. Matching networks include, but are not limited to, transmission line transformation or matching methods involving cascaded multi-stage capacitors and inductors.

[0039] The second RF coaxial connector 20 is located at the left end of the second channel 102 and can be sealed and soldered to the package housing 10 using Au80Sn20 gold solder. The second microwave chip 22 can be a digitally controlled attenuator chip, composed of multiple cascaded attenuation units with an attenuation step of 0.5dB. A 6-bit attenuator can provide an attenuation range of 0-31.5dB, realizing digitally controlled adjustment of the system link gain. The detector chip 23 converts the optical signal into an electrical signal output. A PIN-structured InGaAs photodetector can be selected, with a responsivity of over 0.8A / W, meeting the requirements for RF signal transmission from 0.01GHz to 20GHz in the wavelength range of 1100nm-1680nm. The photodetector includes, but is not limited to, InGaAs detectors or Ge / Si detectors.

[0040] In some embodiments, see Figure 1 A second isolator 25 is provided in the optical path between the second coupling lens 24 and the reflector 26. By setting the second isolator 25, the second optical signal can only be transmitted from the reflector 26 to the second coupling lens 24, and not from the second coupling lens 24 to the reflector 26. This achieves unidirectional transmission of the second optical signal, effectively reduces the reflection of the second optical signal, and thus effectively reduces the interference of reflected light introduced by the surface-incident PD on the stability of the light source, improves the detection accuracy, reduces phase jitter, and improves system stability.

[0041] See Figure 1 , Figure 2This application also provides an optical module, including a single-channel optical transceiver assembly. The encapsulation housing 10 has a lower cavity isolated from the upper cavity. The lower cavity has a PCB control board 30 and a power supply control insulator 40 connected to the PCB control board 30. The PCB control board 30 is connected to the optical emitting unit and the optical receiving unit through the cavity insulator.

[0042] Figure 3 A schematic block diagram of a single-channel optical transceiver component provided in an embodiment of this application is shown. See also... Figure 3 The optical transmitting channel serves as the downlink channel, and the optical receiving channel serves as the uplink channel; the signal flow in the downlink channel is the input radio frequency signal RF. in 1. The signal input from the RF coaxial connector first undergoes microwave processing by the microwave signal processing unit, then is converted into an optical signal by the electro-optical conversion unit and coupled into the optical fiber by the optical coupling unit. The optical signal λ1 is then output from the optical fiber. In the uplink channel, the signal flow is as follows: the input optical signal λ2 is input from the optical fiber, first coupled to the optical filtering unit by the optical coupling unit, and then converted into an RF signal by the photoelectric conversion unit. The RF signal undergoes microwave processing by the microwave signal processing unit and is output from the RF coaxial connector as the RF signal RF. out 1.

[0043] The encapsulation housing 10 has a middle partition plate. An upper cavity is formed above the middle partition plate, with a top cover plate at the top of the upper cavity. A lower cavity is formed below the middle partition plate, with a bottom cover plate at the bottom of the lower cavity. The top cover plate has a double-layer structure consisting of an inner cover plate and an outer cover plate. The inner cover plate is fixed with fasteners, and the outer cover plate is encapsulated by soldering. The bottom cover plate can be encapsulated by either fasteners or soldering. The soldering method can be parallel soldering or laser soldering.

[0044] Since microwave optical transmission components are sensitive to optical path offset, submicron-level displacement can cause a rapid decrease in optical signal transmission power. Therefore, in order to improve optical path stability, the packaging shell 10 is made of Kovar alloy material that matches the thermal expansion coefficient of glass / ceramic, and is supplemented with a low-stress packaging process to suppress the deformation of the packaging shell 10 caused by temperature change, thereby significantly reducing the risk of optical path offset.

[0045] The upper cavity of the package housing 10 is a sealed tube. When hydrogen accumulates to a certain level in the packaging material and the metal tube coating, it may cause the performance of transistors or MMICs in chips such as gallium arsenide and gallium nitride inside the tube to degrade. Therefore, after the package housing 10 is manufactured and before the device is assembled, the housing and cover plate and other structural components need to be subjected to high-temperature vacuum dehydrogenation treatment.

[0046] The PCB control board 30 and the power supply control insulator 40 are located in the lower cavity of the package housing 10. The power supply control insulator 40 is electrically connected to the pads on the PCB control board 30 by wire bonding. The PCB control board 30 realizes power supply and control processing of each chip in the upper cavity through the cavity insulator.

[0047] The PCB control board 30 includes a power conversion circuit, a laser driver circuit, a temperature control circuit, a detector driver circuit, and a microcontroller circuit, realizing the power supply and control functions for various components such as microwave chips, laser chips, and detector chips. The power supply control insulator 40 is soldered to the lower cavity of the package housing 10, and includes, but is not limited to, VCC, GND, and serial port control insulators. External power supplies power the PCB control board 30 through the VCC and GND insulators, while the serial port control insulators enable control and status reporting.

[0048] This application employs a hybrid integration approach to integrate microwave chips, optoelectronic chips, logic control chips, and optical coupling devices into a single package. By optimizing the design of the transmitting section, receiving section, optical path, and shielding housing structure, a highly efficient, stable, and interference-resistant single-fiber bidirectional optical transceiver component and module is achieved. This system features high integration and high isolation, and can be widely applied in various optical communication scenarios with high requirements for transmission signal quality and stability.

[0049] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.

Claims

1. A single-channel optical transceiver module based on microwave photonic integration, characterized in that, The application relates to a packaging shell (10) with an upper cavity, wherein the upper cavity comprises a first channel (101) and a second channel (102) which are isolated from each other, and a light window (104) is arranged on a partition wall (103) between the first channel (101) and the second channel (102); one side of the light window (104) towards the first channel (101) is provided with a filter (27) which has high reflection to a first light signal and high transmission to a second light signal. A light emitting unit, a beam splitter (17), a first coupling lens (18) and an optical fiber (19) are sequentially arranged in the first channel (101) along the axial direction; the light emitting unit is used for emitting the first light signal; after the first light signal transmits through the beam splitter (17), the first light signal is coupled to the optical fiber (19) through the first coupling lens (18). A light receiving unit is arranged in the second channel (102); the optical fiber (19) is used for emitting the second light signal; after the second light signal is collimated through the first coupling lens (18), the second light signal is incident to the beam splitter (17) and then transmits through the light window (104) after being reflected by the beam splitter (17) and is received by the light receiving unit.

2. The single channel transceiver package of claim 1, wherein, The light emitting unit comprises a first radio frequency coaxial connector (11), a first microwave chip (13), a laser chip (14) and a collimating lens (15); The first radio frequency coaxial connector (11), the first microwave chip (13) and the laser chip (14) are sequentially connected through a first matching chip (12); the first radio frequency coaxial connector (11) is used for inputting a first radio frequency signal; after the first radio frequency signal is processed through the first microwave chip (13), the first radio frequency signal is transmitted to the laser chip (14) to be converted into the first light signal; The collimating lens (15) is arranged between the laser chip (14) and the beam splitter (17) and is used for collimating the first light signal emitted by the laser chip (14) and then transmitting the first light signal through the beam splitter (17).

3. The single channel transceiver module of claim 2, wherein the first and second optical subassemblies are mounted on the same side of the substrate. A first isolator (16) is arranged on an optical path between the collimating lens (15) and the beam splitter (17).

4. The single channel transceiver package of claim 1, wherein, A reflector (26) is arranged in the second channel (102); the reflector (26) is used for receiving the second light signal which transmits through the light window (104) and reflecting the second light signal so that the second light signal is received by the light receiving unit.

5. The single channel transceiver package of claim 4, wherein, The included angles between the incident light paths and the reflected light paths of the beam splitter (17) and the reflector (26) are both 90 degrees.

6. The single channel optical transceiver subassembly of claim 4 or 5, wherein, The light receiving unit comprises a second radio frequency coaxial connector (20), a second microwave chip (22), a detector chip (23) and a second coupling lens (24); The second coupling lens (24) is arranged between the reflector (26) and the detector chip (23) and is used for coupling the second light signal reflected by the reflector (26) to the detector chip (23). The second radio frequency coaxial connector (20), the second microwave chip (22) and the detector chip (23) are connected in sequence through a second matching chip (21); the detector chip (23) is used for converting the second optical signal into a second radio frequency signal, and the second radio frequency signal is output by the second radio frequency coaxial connector (20) after being processed by the second microwave chip (22).

7. The single channel optical transceiver module of claim 6, wherein the optical subassembly is configured to be mounted on a printed circuit board. A second isolator (25) is arranged on an optical path between the second coupling lens (24) and the reflector (26).

8. The single channel transceiver package of claim 1, wherein, The optical fiber (19) is a single-mode optical fiber with an inclined surface.

9. The single-channel optical transceiver subassembly of claim 1, wherein, The gap between the first coupling lens (18) and the optical fiber (19) is greater than 200 microns.

10. An optical module characterized by comprising: The single-channel optical transceiver assembly comprises the single-channel optical transceiver assembly according to any one of claims 1 to 9, a lower cavity isolated from the upper cavity is arranged in the packaging shell (10), a PCB control board (30) and a feed control insulator (40) connected with the PCB control board (30) are arranged in the lower cavity; the PCB control board (30) is connected with the optical transmitting unit and the optical receiving unit through a cavity-penetrating insulator.

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