Adjustable circuit board automatic burning tool

Abstract

The invention relates to the technical field of electronic manufacturing equipment, in particular to an adjustable circuit board automatic burning tool which comprises a positioning seat, a guide plate assembly, a pressure stopping assembly and a heat dissipation base plate. The guide plate assembly comprises a first sliding plate, a second sliding plate and a driver, and the two sliding plates relatively slide along a sliding groove in the surface of the positioning base and are used for adjusting the clamping distance. The pressure stopping assembly comprises a sliding sleeve seat, a rotating sleeve seat, a driving rod, a pressure head block and a linkage plate, the pressure head block is driven by the driving rod to realize multi-point pressure equalizing and stopping, and the pressure stopping assembly can adapt to circuit boards with different thicknesses; a liquid cooling coil is arranged in the heat dissipation base plate, and a soaking plate is installed on the surface of the heat dissipation base plate and used for achieving rapid heat conduction and constant-temperature heat dissipation in the burning process. According to the tool, the clamping and pressing positions can be automatically adjusted according to the length, width and thickness of the circuit board, stable fixation and efficient heat dissipation of the circuit board in the burning process are ensured, and the burning precision, the production efficiency and the thermal control stability are remarkably improved.

Description

Technical Field

[0001] This invention relates to the field of electronic manufacturing equipment technology, specifically to an adjustable automatic circuit board programming fixture. Background Technology

[0002] Currently, in the electronic manufacturing and circuit board mass production testing stages, circuit board programming fixtures are commonly used for chip programming and functional verification. Traditional programming fixtures generally include a fixed base, a clamping mechanism, and an upper pressure assembly. The basic principle is to fix the circuit board in position using mechanical clamps, and then the upper pressure block or probe assembly contacts the circuit board port to complete the programming operation.

[0003] However, existing circuit board programming fixtures generally have the following problems: First, traditional clamping mechanisms are mostly fixed-size or unidirectional slide rail structures, unable to automatically adjust to circuit boards of different lengths or widths. They typically require changing clamps of different specifications or manually adjusting limit blocks, resulting in cumbersome operation and low repeatability, hindering rapid changeover in flexible production lines. Existing pressure-resistant structures often use single-axis clamping or elastic pressure heads with a fixed clamping direction, failing to accommodate variations in circuit board thickness. This can easily lead to localized overpressure or uneven pressing, causing circuit board warping, loose solder joints, or poor contact during programming, affecting programming stability. Especially when programming multilayer or irregularly shaped boards, traditional devices cannot achieve adaptive angle compensation of the pressure head.

[0004] Furthermore, the chip and circuit board generate a significant amount of heat during the programming process. Traditional programming fixtures rely solely on a metal base plate for passive heat dissipation or simply incorporate air cooling channels, resulting in low heat dissipation efficiency and localized heat accumulation. This leads to excessively high chip temperatures during programming, causing data writing errors or component performance degradation. Moreover, existing devices lack effective heat dissipation designs and liquid cooling circulation structures, making it difficult to maintain thermal stability during prolonged programming operations.

[0005] In summary, existing technologies have significant shortcomings in terms of dimensional adaptability, clamping stability, and heat dissipation efficiency of circuit board programming fixtures, failing to meet the demands for rapid, high-precision, and stable programming of circuit boards of different specifications in automated production lines. To address these issues, it is necessary to provide an adjustable automatic circuit board programming fixture with multi-dimensional adaptive clamping, pressure equalization and stabilization, and efficient heat dissipation capabilities, thereby achieving an overall technological improvement in terms of flexible structural adaptation, stable and reliable operation, and efficient thermal management. Summary of the Invention

[0006] This invention aims to solve the technical problems of existing circuit board programming fixtures, such as poor size adaptability, low pressing stability, and insufficient heat dissipation efficiency, and provides an adjustable automatic circuit board programming fixture. This fixture, through the coordinated operation of a sliding plate linkage adjustment mechanism, a pressure-stopping component linkage mechanism, and a liquid cooling system, achieves automatic clamping, flexible pressure-stopping, and efficient heat dissipation for circuit boards of different specifications, ensuring the stability and accuracy of the programming process.

[0007] This invention provides an adjustable automatic circuit board programming fixture, comprising a positioning base, a guide plate assembly, a pressure-stopping assembly, and a heat dissipation pad. The overall design employs a layered structure and features automatic centering, pressure equalization clamping, and constant temperature control, enabling rapid switching and precise positioning of circuit boards of various specifications in an automated programming environment.

[0008] In a preferred embodiment, the positioning seat is located at the bottom of the tooling and serves to provide an installation reference and sliding guide. The surface of the positioning seat has several protrusions and is fixedly connected to the bottom surface of the heat dissipation pad, forming a structural support and limiting guide relationship. A sliding groove is provided on the positioning seat along its length to provide a guide trajectory for the sliding movement of the guide plate assembly and the pressure-stopping assembly, ensuring that the clamping mechanisms on both sides remain synchronized and parallel during operation.

[0009] In a preferred embodiment, the heat dissipation pad is mounted above the positioning base, and a heat spreader is fixedly mounted on its surface. The heat spreader is a composite liquid metal sheet structure with high thermal conductivity and temperature uniformity. A liquid cooling coil is embedded inside the heat dissipation pad and is connected to an external liquid cooling circulation system, forming a continuous cooling cycle during the programming process to achieve efficient heat dissipation and stable temperature control. Specifically, this combined structure can quickly remove heat during chip programming, prevent local overheating, and improve programming accuracy and stability.

[0010] In a preferred embodiment, the guide plate assembly is used to achieve automatic adaptation and clamping adjustment along the length of the circuit board, and includes a first slide plate, a second slide plate, and a driver. The first and second slide plates are oppositely disposed and slidably mounted between the positioning seat and the heat dissipation pad. Symmetrical sliding is achieved through sliding fingers and protrusion guidance, thereby adjusting the clamping distance according to the circuit board size. The opposing surfaces of the two slide plates are provided with a plurality of staggered sliding fingers. During sliding, the sliding fingers mesh with each other and are guided by protrusions to ensure symmetry and guiding accuracy, and avoid clamping errors caused by misalignment.

[0011] In a preferred example, the driver is located at one end of the positioning seat, and its output end is fixedly connected to a double-ended lead screw. Both ends of the double-ended lead screw are threaded with screw fittings, which are connected to the rotating sleeve surfaces of the two pressure-stopping assemblies. The driver can be electric or manual. When the double-ended lead screw is rotated, the oppositely helical threads on its surface cause the two screw fittings to slide axially towards or away from each other, driving the two rotating sleeves to move synchronously and symmetrically. This, in turn, causes the linkage plate to form a symmetrical linkage, enabling automatic adaptation and rapid adjustment of circuit boards of different lengths.

[0012] In a preferred embodiment, four pressure-stopping components are used for flexible pressing and positioning of the upper surface of the circuit board, respectively arranged on both sides of the surfaces of the first and second sliding plates. The pressure-stopping components include a sliding sleeve seat, a rotating sleeve seat, a drive rod, a pressure head block, and a linkage plate. The sliding sleeve seat is slidably fitted into the groove of the positioning seat for synchronous movement with the sliding plate; the rotating sleeve seat is rotatably mounted on the surface of the sliding plate and fitted onto the outer side of the sliding sleeve seat for deflection angle adjustment. The drive rod is fixedly mounted inside the sliding sleeve seat, and its output end is fixedly connected to a fork seat. The fork seat is rotatably connected to the pressure head block to achieve lifting transmission. Both ends of the linkage plate are rotatably connected to the pressure head block and the rotating sleeve seat surface, forming an angle compensation mechanism. When the rotating sleeve seat deflects, the linkage plate drives the pressure head block to swing synchronously, adapting it to circuit boards of different widths to achieve flexible pressing.

[0013] In a preferred example, a flexible pressure pad is fixedly installed on the bottom surface of the pressure head block. The flexible pressure pad has an arc-shaped curved surface structure, which can form surface contact when pressure is stopped, thereby dispersing the clamping force and avoiding local force concentration that could damage the device.

[0014] In a preferred embodiment, the rotating sleeve base is provided with a linkage lug on its surface, which is rotatably connected to the end of the linkage plate and the surface of the screw assembly, respectively. The direction of the linkage lug is perpendicular to the rotation direction of the linkage plate and the screw assembly. When the driver drives the double-ended lead screw to rotate, the two rotating sleeve bases on both sides are symmetrically deflected under the action of the screw assembly, thereby realizing the synchronous angle adjustment of the pressure head block and ensuring that the pressure-stopping action is uniform and reliable.

[0015] In a preferred example, the outer surface of the swivel base is fitted with a bearing ring embedded in the slide plate surface, and its inner side is provided with a linear bearing fitted onto the outer side of the slide base to reduce friction and improve motion accuracy. The drive rod adopts an electric drive structure, achieving precise lifting and lowering through electrical signal control. During the upward movement, the drive rod drives the fork seat to rise, and the pressure head block deflects and presses down vertically under the guidance of the linkage plate. The flexible pressure pad adheres to the surface of the circuit board, achieving uniform pressure and positioning of the circuit board.

[0016] In a preferred example, the heat dissipation pad achieves rapid heat conduction and liquid cooling circulation through a combination of a heat spreader and a liquid cooling coil. This can maintain the chip temperature stable during long-term programming operations, avoid programming errors caused by local overheating, and improve the consistency and stability of circuit board programming.

[0017] In summary, this invention achieves automatic length adaptation through a sliding plate linkage adjustment mechanism, flexible pressure resistance in the width and thickness directions through a pressure-stopping component linkage structure, and efficient constant temperature control through a heat dissipation system, forming an integrated structure for automatic clamping, stable positioning, and efficient heat dissipation of the circuit board. This tooling structure is coordinated and operates smoothly, significantly improving the automation level, reliability, and production efficiency of the circuit board programming process.

[0018] The beneficial effects achieved by this invention are as follows: 1. In this invention, the relative movement of the first and second sliding plates enables automatic adaptation of the circuit board in the length direction; the deflection and swing of the linkage plate can be adaptively adjusted according to the width of the circuit board; during the pressure-stopping stage, the linkage plate generates linkage angle compensation as the pressure head block is pressed down, thereby adapting to circuit boards of different thicknesses and achieving a high adaptation effect in the three-dimensional directions of length, width and thickness.

[0019] 2. In this invention, the pressure-stopping component adopts a linkage structure between the sliding sleeve seat, the rotating sleeve seat and the drive rod. The double-headed screw is driven by the driver to drive the screw assembly to slide synchronously and symmetrically, so that the pressure-stopping component can move precisely along the sliding groove of the positioning seat. This ensures that the pressure head block moves smoothly and achieves multi-point synchronous clamping, thereby improving the uniformity of pressure and the repeatability of the circuit board fixing.

[0020] 3. In this invention, the heat dissipation pad has a built-in heat spreader and liquid cooling coil, which realizes rapid heat conduction and cooling circulation during the programming process. It can evenly diffuse and dissipate the heat in the chip area in a short time, effectively avoiding programming deviation and device aging caused by overheating, thereby ensuring programming accuracy and extending the life of the circuit board. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of one embodiment of the present invention; Figure 2 This is a top view of one embodiment of the present invention; Figure 3 This is an exploded structural diagram of an embodiment of the present invention; Figure 4 This is a schematic diagram of the surface structure of the first and second sliding plates according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the surface structure of a first skateboard according to an embodiment of the present invention; Figure 6This is a schematic diagram of a pressure-stopping component structure according to an embodiment of the present invention; Figure 7 This is an exploded structural diagram of a pressure-stopping component according to an embodiment of the present invention; Figure 8 This is a schematic diagram of a heat dissipation pad structure according to an embodiment of the present invention.

[0022] Figure label: 100. Positioning seat; 110. Slide groove; 200. Guide plate assembly; 210. First slide plate; 220. Second slide plate; 230. Driver; 211. Slide finger; 231. Double-ended lead screw; 232. Screw assembly; 300, Pressure-stopping assembly; 310, Sliding sleeve seat; 320, Rotating sleeve seat; 330, Drive rod; 340, Pressure head block; 350, Linkage plate; 331, Fork seat; 341, Flexible pressure pad; 400. Heat dissipation pad; 410. Heat spreader; 420. Liquid cooling coil. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0024] It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the invention.

[0025] The following describes, with reference to the accompanying drawings, some embodiments of an adjustable circuit board automatic programming fixture provided by the present invention.

[0026] Combination Figures 1-8 As shown, the present invention provides an adjustable circuit board automatic programming fixture, including a positioning seat 100, a guide plate assembly 200, a pressure-stopping assembly 300, and a heat dissipation pad 400.

[0027] It includes a positioning base 100, a guide plate assembly 200, a pressure-stopping assembly 300, and a heat dissipation pad 400. The overall structure is arranged in an upper and lower stacked manner, with the positioning base 100 located at the bottom to provide an installation reference and sliding guide; the heat dissipation pad 400 is located above the positioning base 100 to support the circuit board and facilitate heat conduction and dissipation; the guide plate assembly 200 is arranged on both sides of the heat dissipation pad 400 to clamp circuit boards of different sizes; and the pressure-stopping assembly 300 is located above the guide plate assembly 200 to provide pressure-stopping and positioning for the upper surface of the circuit board.

[0028] The upper surface of the positioning seat 100 is provided with several protrusions for fixed connection with the bottom surface of the heat dissipation pad 400 to enhance the stability of the overall structure. The positioning seat 100 is provided with a slide groove 110 extending along the length direction. The slide groove 110 serves as a guide structure and provides trajectory support for the sliding of the pressure-stopping assembly 300, ensuring that the clamping structures on both sides remain parallel and synchronous during movement.

[0029] The heat dissipation pad 400 is a high thermal conductivity structural component, with a heat spreader 410 fixedly mounted on its surface. The heat spreader 410 adopts a composite liquid metal sheet structure, which can quickly disperse heat and form a uniform temperature field within its surface. A liquid cooling coil 420 is embedded inside the heat dissipation pad 400, and the liquid cooling coil 420 is connected to an external liquid cooling circulation system to form a stable cooling loop during the programming process. This combined structure can achieve efficient heat dissipation and constant temperature control during circuit board programming, preventing chip performance degradation or programming errors due to high temperatures.

[0030] In this embodiment, the guide plate assembly 200 is used to realize automatic adaptation and clamping adjustment in the length direction of the circuit board, and includes a first slide plate 210, a second slide plate 220 and a driver 230.

[0031] The first sliding plate 210 and the second sliding plate 220 are positioned opposite each other and slidably mounted between the positioning base 100 and the heat dissipation pad 400. The two are guided by the sliding finger 211 and the protrusion on the upper surface of the positioning base 100, so as to achieve symmetrical sliding in the lateral direction, thereby automatically adjusting the clamping distance according to different circuit board sizes.

[0032] The first sliding plate 210 and the second sliding plate 220 have several staggered sliding fingers 211 on their opposing surfaces. The sliding fingers 211 mesh with each other and are guided by the protrusions on the surface of the positioning seat 100 during sliding, so that the sliding plates maintain guiding stability and positional consistency during symmetrical movement. This structure can effectively avoid sliding deviation and improve the clamping accuracy of the circuit board.

[0033] The driver 230 is located at one end of the positioning seat 100, and its output end is fixedly connected to a double-ended lead screw 231. Both ends of the double-ended lead screw 231 are threaded with screw fittings 232, which are respectively connected to the surfaces of the rotating sleeve seats 320 of the two pressure-stopping components 300. The driver 230 can be operated electrically or manually. When it drives the double-ended lead screw 231 to rotate, the threads on the double-ended lead screw 231 in opposite directions cause the screw fittings 232 on both sides to slide axially towards or away from each other, thereby driving the two rotating sleeve seats 320 to move synchronously and symmetrically, completing the synchronous action of the linkage plate 350. This mechanism achieves automatic adaptation and rapid adjustment for circuit boards of different lengths.

[0034] IV. Pressure-resistant assembly 300 The pressure-stopping assembly 300 is used for flexible pressing and positioning of the upper surface of the circuit board. There are four pressure-stopping assemblies 300, which are respectively arranged on both sides of the surface of the first sliding plate 210 and the second sliding plate 220.

[0035] Each pressure-stopping assembly 300 includes a sliding sleeve seat 310, a rotating sleeve seat 320, a drive rod 330, a pressure head block 340, and a linkage plate 350.

[0036] The sliding sleeve 310 is slidably sleeved in the groove 110 of the positioning seat 100, and is used to slide synchronously with the first slide plate 210 and the second slide plate 220 during clamping and adjustment; the rotating sleeve 320 is rotatably mounted on the surface of the first slide plate 210 and the second slide plate 220, and is sleeved on the outside of the sliding sleeve 310, and is used to realize the deflection movement.

[0037] The drive rod 330 is fixedly sleeved inside the sliding sleeve seat 310, and its output end is fixedly connected to the fork seat 331. The fork seat 331 is rotatably connected to the pressure head block 340 to transmit lifting power. The two ends of the linkage plate 350 are rotatably connected to the surfaces of the pressure head block 340 and the rotating sleeve seat 320, respectively, forming a variable angle linkage structure. When the rotating sleeve seat 320 deflects, the linkage plate 350 drives the pressure head block 340 to swing synchronously, thereby achieving angle compensation and circuit board width adaptation.

[0038] A flexible pressure pad 341 is fixedly installed on the bottom surface of the pressure head block 340. The flexible pressure pad 341 has an arc-shaped curved surface structure, which can achieve surface contact when pressing the circuit board, thereby dispersing the pressing force and preventing local stress concentration from causing damage to components.

[0039] The rotating sleeve 320 has connecting ears on its surface, which are rotatably connected to the end of the linkage plate 350 and the surface of the screw assembly 232. The mounting direction of the connecting ears is perpendicular to the rotation direction of the linkage plate 350 and the screw assembly 232, ensuring that the rotating sleeve 320 deflects synchronously when the double-ended lead screw 231 rotates, so that the pressure head block 340 can automatically adjust its angle and position according to the width of the circuit board to achieve flexible bonding.

[0040] The outer surface of the swivel base 320 is fitted with a bearing ring embedded in the surfaces of the first slide plate 210 and the second slide plate 220. The inner side of the ring is provided with a linear bearing fitted on the outer side of the slide base 310 to reduce friction and improve motion stability, thereby ensuring the linear accuracy of the pressure-stopping assembly 300 during the lifting and lowering process.

[0041] The drive rod 330 adopts an electrically driven structure, achieving precise lifting and lowering through electrical signal control. During upward movement, the drive rod 330 causes the fork 331 to rise, while the pressure head 340, guided by the linkage plate 350, deflects and presses downwards vertically. The flexible pressure pad 341 fits tightly against the upper surface of the circuit board, completing the pressure equalization and positioning of the circuit board. Working principle and usage process of this invention: The adjustable circuit board automatic programming fixture of the present invention achieves automatic clamping, stable positioning and efficient heat dissipation of circuit boards of different specifications through the coordinated action of the sliding plate linkage adjustment mechanism, the pressure-stopping component linkage mechanism and the liquid cooling heat dissipation system.

[0042] During operation, the operator first places the circuit board to be programmed onto the heat dissipation pad 400, ensuring that the bottom surface of the circuit board is fully in contact with the heat spreader 410 to form a uniform heat-conducting contact surface. Then, the operator adjusts the relative sliding of the first sliding plate 210 and the second sliding plate 220, causing the pressure-stopping components 300 on both sides to move synchronously and symmetrically along the sliding grooves 110 on the positioning seat 100, thereby bringing the pressure head block 340 close to both ends of the circuit board and maintaining a pre-contact state with its surface.

[0043] When the driver 230 drives the double-ended lead screw 231 to rotate, the screw assembly 232 slides synchronously in opposite directions, causing the two rotating sleeve seats 320 to deflect. The deflection of the rotating sleeve seats 320 further drives the connected drive rod 330 and pressure head block 340 to swing in a linked manner, so that the pressure head block 340 can adaptively adjust its angle and position according to the width of the circuit board. Subsequently, the drive rod 330 moves upward under electrical signal or manual control, driving the fork seat 331 and the linkage plate 350 to move synchronously. The pressure head block 340 then presses down, and the flexible pressure pad 341 adheres to the upper surface of the circuit board, uniformly pressing and fixing the circuit board.

[0044] After the circuit board is fixed, the flexible pressure pad 341 effectively disperses the clamping force, ensuring that the circuit board surface is subjected to uniform force and does not deform, and maintaining stable contact between the programming pins and the interface ports. At this time, the heat dissipation pad 400 under the circuit board, through the combined action of the heat dissipation plate 410 and the liquid cooling coil 420, achieves rapid heat conduction and liquid cooling circulation, thereby preventing local overheating caused by prolonged programming and ensuring the stability and accuracy of the chip programming process.

[0045] After the burning task is completed, the drive rod 330 moves in the opposite direction, causing the pressure head block 340 to lift and release the pressure. Then, the driver 230 rotates the double-ended lead screw 231 in the opposite direction, causing the two side slides 210 and 220 to separate and reset, completing the circuit board release operation.

[0046] The entire workflow achieves automatic centering and positioning of the circuit board, linkage clamping, flexible pressure resistance and intelligent heat dissipation control. The structure is coordinated and the operation is smooth, which significantly improves the reliability, safety and production efficiency of circuit board programming.

[0047] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0048] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An adjustable circuit board automatic burning tool, characterized in that, The utility model provides a positioning seat (100), guide plate assembly (200), stop pressure subassembly (300) and heat dissipation backing plate (400), the surface of positioning seat (100) is equipped with a plurality of bosses and is fixedly connected with the bottom surface of heat dissipation backing plate (400), guide plate assembly (200) includes first slide plate (210), second slide plate (220) and driver (230), first slide plate (210) and second slide plate (220) are oppositely arranged and are slidably installed between positioning seat (100) and heat dissipation backing plate (400), The number of stop pressure subassembly (300) is four, and it is oppositely arranged on the surface of first slide plate (210) and second slide plate (220), The stop pressure subassembly (300) includes slide sleeve seat (310), rotating sleeve seat (320), drive rod (330), pressure head block (340) and linkage plate (350), the inner side of slide sleeve seat (310) is slidably sleeved in the inner side of slide groove (110), the rotating sleeve seat (320) is rotatably installed on the surface of first slide plate (210) and second slide plate (220) and is rotatably sleeved on the outer side of slide sleeve seat (310), the drive rod (330) is fixedly sleeved on the inner side of slide sleeve seat (310), and the output end of drive rod (330) is fixedly connected with fork seat (331), the pressure head block (340) is rotatably installed on the inner side of fork seat (331), and the both ends of linkage plate (350) are rotatably connected with one end of pressure head block (340) and the surface of rotating sleeve seat (320) respectively.

2. The adjustable circuit board automatic burning tooling according to claim 1, characterized in that, The opposite surface of first slide plate (210) and second slide plate (220) is equipped with a plurality of staggered slide fingers (211), and the slide fingers (211) on the surface of first slide plate (210) and second slide plate (220) slide oppositely and are guided to slide through the slide groove (110) boss on the surface of positioning seat (100).

3. The adjustable circuit board automatic burning tooling according to claim 1, characterized in that, The output end of driver (230) is provided with double-end screw rod (231), and the surface of double-end screw rod (231) is threadedly sleeved with screw sleeve (232), and the surface of screw sleeve (232) is rotatably connected with the surface of rotating sleeve seat (320).

4. The adjustable circuit board automatic burning tooling according to claim 3, characterized in that, The driver (230) is one of electric drive or manual drive, for driving double-end screw rod (231) to rotate, the surface of double-end screw rod (231) is provided with two groups of oppositely arranged screw threads, for realizing the relative movement of two screw sleeves (232).

5. The adjustable circuit board auto-burning tool of claim 1, wherein, The surface of rotating sleeve seat (320) is provided with a linkage lug, the linkage lug is rotatably connected with the end of linkage plate (350) and the surface of screw sleeve (232) respectively, and the rotation directions of linkage plate (350), screw sleeve (232) and linkage lug are perpendicular to each other.

6. The adjustable circuit board auto-burning tool of claim 1, wherein, The surface of rotating sleeve seat (320) is sleeved with bearing ring embeddedly installed on the surface of first slide plate (210) and second slide plate (220), and the inner side of rotating sleeve seat (320) is provided with linear bearing sleeved on the outer side of slide sleeve seat (310).

7. The adjustable circuit board auto-burning tool of claim 1, wherein, The bottom surface of pressure head block (340) is fixedly installed with flexible pressure pad (341), and the flexible pressure pad (341) is in the shape of arc curved surface.

8. The adjustable circuit board auto-burning tool of claim 1, wherein, The driving rod (330) is an electric driving rod structure, used for driving the fork seat (331) to realize lifting movement, and the surface of the pressing head block (340) is provided with two groups of shaft pins arranged in parallel and connected with the surface of the fork seat (331) and the end of the linkage plate (350) respectively in rotation.

9. The adjustable circuit board auto-burning tool of claim 1, wherein, The surface of the heat dissipation cushion plate (400) is provided with a uniform heat plate (410), the uniform heat plate (410) is a composite liquid metal sheet structure, and the inner side of the heat dissipation cushion plate (400) is embedded with a liquid cooling coil (420) for connecting an external liquid cooling circulation system.

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