Power module packaging body with self-protection function

Abstract

The invention relates to the technical field of packaging bodies, in particular to a power module packaging body with a self-protection function, which comprises a heat dissipation substrate, the top of the heat dissipation substrate is in threaded connection with a double-sided crimping substrate, and the middle part of the bottom inner wall of the double-sided crimping substrate is fixedly connected with a power chip set. According to the device, through double-sided cooling, the thermal resistance is obviously reduced, the module is allowed to operate under higher power without triggering over-temperature protection, the output capability is improved, through flexible interconnection and spring pressurization, the main failure mode of fatigue of bonding wires and welding layers is eliminated, the service life of the module is matched with the theoretical service life of a chip, the connection reliability is improved, and the service life of the chip is prolonged. The modular design realizes rapid assembly and automatic modular production, the guide structure provides a stable and reliable working platform for the electrical function, the electrical protection ensures that the mechanical structure is not damaged due to abnormal electrical stress, and the special protection control chip and the driving and soft turn-off circuit perform self-protection.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of packaging, in particular to a power module packaging with self-protection function. BACKGROUND

[0002] The power module packaging is to embed sensing, protection and execution functions in the module, forming an intelligent power system with self-state perception and autonomous fault management capability. It surpasses the traditional power module which only realizes the single function of power conversion, realizes the leap from "passive bearing" to "active protection", greatly improves the reliability and life of the system.

[0003] The Chinese utility model patent with publication number CN114121923B discloses a power semiconductor module packaging structure, which includes "a packaging substrate, a packaging tube shell, and a half-bridge power semiconductor module. The packaging tube shell is tightly connected with the packaging substrate to form a containing space. The half-bridge power semiconductor module is arranged in the containing space." However, the existing scheme has the problems of slow response, low precision, complex peripherals, and easy damage due to abnormal electrical stress. SUMMARY

[0004] The present application provides a power module packaging with self-protection function to solve the problems raised in the background.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a power module packaging with self-protection function, comprising a heat dissipation substrate, a double-sided crimping substrate is threadedly connected to the top of the heat dissipation substrate, a power chip set is fixedly connected to the middle of the inner wall of the bottom of the double-sided crimping substrate, a plurality of connecting grooves are fixedly connected to one end of the top of the double-sided crimping substrate, flexible copper strips are fixedly connected to the front and rear ends of the side surface of the double-sided crimping substrate, a sensing assembly and a self-protection assembly are respectively fixedly connected to the two ends of the inner wall of the bottom of the double-sided crimping substrate, and a top substrate is clamped to the other end of the top of the double-sided crimping substrate.

[0006] The present application has the following advantages: the packaging shell adopts a sandwich structure, the inner layer metal is used for electromagnetic shielding and heat dissipation, the middle substrate realizes electrical insulation, excellent electromagnetic compatibility is achieved, the external circuit is simplified, the system cost and volume are reduced, the external controller no longer needs to build complex protection circuit and signal conditioning circuit, the number of peripheral components is reduced, the overall system volume and cost are reduced, intelligent soft shutdown is realized, failure mechanism is inhibited, shutdown overvoltage and current tail are effectively inhibited, the loss and electrical stress of each switch are reduced, and self-protection effect is achieved.

[0007] To achieve heat dissipation and increase the service life of the device:

[0008] Further arrangement: the double-sided crimping substrate includes a copper-clad frame, the bottom of the copper-clad frame is threadedly connected to the top of the heat dissipation substrate, both ends of the copper-clad frame are fixedly connected with lead frames, three groups of fixed concave frames are equidistantly distributed in the middle of the copper-clad frame, key grooves are fixedly connected to the four corners of the bottom inner wall of the fixed concave frame, the inside of the fixed concave frame is provided with a plurality of heat dissipation hole structures, and the bottom of the fixed concave frame is connected with a heat dissipation substrate, the top of the copper-clad frame is fixedly connected with a shaft seat at the end away from the connecting groove, and the shaft seat has three and each shaft seat is opposite to the position of the adjacent fixed concave frame.

[0009] By adopting the above technical scheme, the traditional single-sided substrate welding and bonding wire connection are abandoned, the power chip is clamped in the middle by adopting the upper and lower two substrates, the upper and lower surfaces of the chip are connected with the substrate through silica gel, a double-sided heat dissipation path is formed, the thermal resistance can be significantly reduced, higher current density can be carried, at the same time, the bonding wire is eliminated, the problem of lead falling caused by thermal fatigue is solved, and the service life is greatly improved.

[0010] In order to realize interface installation and assembly maintenance:

[0011] Further arrangement: the connecting groove includes a clamping groove, the side surface of the clamping groove is fixedly connected to one end of the top of the copper-clad frame, the side surface of the inner wall of the clamping groove is fixedly connected with a hook rod, and the bottom inner wall of the clamping groove is fixedly connected with an upper top spring.

[0012] By adopting the above technical scheme, the butterfly spring on the opposite side of the top substrate and the power chip group ensures that all mechanical and electrical contact points always maintain constant contact pressure during thermal expansion and contraction, avoids connection loosening or failure caused by mismatching of material thermal expansion coefficient, is especially suitable for places with wide working temperature range, and is connected with the opposite end of the top substrate, so that the bolt is saved, the assembly density and the automation degree are improved, the connection is convenient, the assembly is fast, and the detection and maintenance are simple and convenient. When in use, the quick pressing type and spring reset structure make the internal detection and maintenance process simple and fast.

[0013] In order to realize the modular connection of the chip group:

[0014] Further arrangement: the power chip group includes an interconnection circuit board, the bottom of the interconnection circuit board is fixedly connected to the middle of the bottom inner wall of the fixed concave frame, both ends of the interconnection circuit board are circuit-connected to the opposite end of the flexible copper strip, one end of the top of the interconnection circuit board is fixedly connected with a disc spring, the disc spring is fixedly connected with guide rods around, and both ends of the side surface of the interconnection circuit board are fixedly connected with key rods.

[0015] By adopting the technical scheme, a part of the power chip set is designed by adopting surface mounting extrusion or press-in technology, a large power module is designed into multiple power subunits which can be independently disassembled, the subunits and the motherboard are connected through mechanical guiding and locking mechanism to ensure accurate alignment and good contact, maintenance is facilitated, a damaged subunit can be quickly replaced, the power density and assembly reliability are improved through the anti-misinsertion interface arranged on the side surface and the top of the power chip set, manual wiring errors are avoided, and the automatic large-scale production is suitable.

[0016] To realize the sensing effect of self-protection effect:

[0017] Further setting is that the sensing assembly includes a temperature sensing unit, a voltage sensing unit and a current sensing unit, the bottom of the temperature sensing unit is attached to one end of the top of the interconnection circuit board, the side surface circuit of the voltage sensing unit is connected to one side of the interconnection circuit board, and the bottom circuit of the current sensing unit is connected to the other side of the interconnection circuit board.

[0018] By adopting the technical scheme, direct measurement of junction temperature avoids errors and hysteresis caused by estimation of junction temperature through shell temperature; built-in current and voltage sensing avoids measurement distortion caused by electromagnetic interference of external sensors. This enables all protection thresholds to be set at more accurate boundaries closer to the actual safe working area of the chip, which fully utilizes the performance of the chip and ensures safety.

[0019] To realize intelligent soft shutdown and inhibit failure mechanism:

[0020] Further setting is that the self-protection assembly includes a soft shutdown circuit group, the bottom circuit of the soft shutdown circuit group is connected to one end of the side surface of the fixed recess frame, the soft shutdown circuit group is located on the other side of the interconnection circuit board, and the other end of the soft shutdown circuit group is fixedly connected with a protection control chip.

[0021] By adopting the technical scheme, the shutdown overvoltage and current tail are effectively inhibited, the loss and electrical stress of each switch are reduced, the life of the power module is prolonged from the mechanism, the external controller can clearly know what kind of failure occurs in the module, key data support is provided for system debugging, fault diagnosis and predictive maintenance, and the maintainability of the entire power electronic device is improved.

[0022] To realize the connection of the crimping type structure and the packaging shell:

[0023] Further arrangement: the top substrate includes a clamping hook, the inner wall of one end of the clamping hook is clamped on the side surface of the shaft rod of the shaft seat, the other end of the clamping hook is fixedly connected with an upper layer plate, and the middle parts of the upper layer plate and the heat dissipation substrate are arranged as horizontal opening structures, the other end of the upper layer plate is fixedly connected with two extension plates, the middle parts of the two extension plates are both penetrated and connected with pressure rods, the side surfaces of the pressure rods are both slidably connected with abutting rods, the abutting rods are penetrated and connected in the interiors of the extension plates, and the top inner wall of one end of the extension plate is fixedly connected with a return spring.

[0024] By adopting the above technical scheme, the packaging shell adopts a sandwich structure of "metal-plastic-metal". The inner metal layer is used for electromagnetic shielding and heat dissipation, the middle plastic layer is used for electrical insulation, and the outer metal layer is used as a structural support and secondary heat dissipation, thereby achieving excellent electromagnetic compatibility, while considering insulation, heat dissipation and mechanical strength. The module can be directly installed on the whole machine radiator without additional insulation pad, the layered shielding and integrated shell, and the mechanical interlocking ensure the absolute reliability of the connection, and the anti-vibration and impact performance is strong.

[0025] To realize module heat dissipation management:

[0026] Further arrangement: the interior of the heat dissipation substrate is arranged as an embedded micro-channel structure.

[0027] By adopting the above technical scheme, the interior of the heat dissipation substrate is processed into an embedded micro-channel structure, which can not only retain the original air cooling heat dissipation function, but also effectively and quickly connect in series with the external liquid cooling heat dissipation device. When the cooling liquid in the liquid cooling radiator flows through the module heating area, efficient heat dissipation is realized, leaving a platform for subsequent product connection and device function upgrade, expanding the adjustable connection structure of the module heat dissipation function, especially in the series connection device of electric vehicles, effectively increasing the equipment adaptability and reducing secondary processing.

[0028] To realize the equipment airtight packaging effect:

[0029] Further arrangement: one end of the soft shutdown circuit group extending to the interior of the fixed recess frame is connected with a state indicator structure, and the interior cavity of the fixed recess frame is filled with silica gel material.

[0030] By adopting the above technical scheme, after the device is sealed, the filled gum substance can maximize the isolation of external moisture and pollutants, prevent internal circuit corrosion and ion migration, and is suitable for use in high reliability environments, thereby widening the application boundary. In order to protect the state indicator of the fault traceable connection, subsequent diagnosis and maintenance are facilitated. Through the state indicator, the controller connected externally can master which direction of the interior has an electronic fault such as overcurrent and overtemperature, thereby providing key data support for system debugging, intentional diagnosis and predictive maintenance, and improving the maintainability of the entire power electronic device.

[0031] The parts not involved in the device are the same as or can be realized by the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 The schematic diagram of the whole assembled structure of the present application is shown in the figure.

[0033] Figure 2 The schematic diagram of the whole unfolded structure of the present application is shown in the figure.

[0034] Figure 3 The schematic diagram of the whole bottom structure of the present application is shown in the figure.

[0035] Figure 4 The schematic diagram of the enlarged structure of the double-sided crimping substrate of the present application is shown in the figure.

[0036] Figure 5 The schematic diagram of the enlarged structure of the heat-dissipating substrate and the top substrate of the present application is shown in the figure.

[0037] Figure 6 The schematic diagram of the enlarged structure of the extension plate of the present application is shown in the figure.

[0038] Figure 7 The schematic diagram of the sectional structure of the connecting groove of the present application is shown in the figure.

[0039] Figure 8 The schematic diagram of the enlarged structure of the power chip set connection of the present application is shown in the figure.

[0040] In the figure: 1, heat-dissipating substrate; 2, double-sided crimping substrate; 201, copper-clad frame; 202, lead frame; 203, fixed concave frame; 204, key groove; 205, shaft seat; 3, connecting groove; 301, clamping groove; 302, hook rod; 303, upper top spring; 4, power chip set; 401, interconnection circuit board; 402, guide rod; 403, disc spring; 404, key rod; 5, flexible copper strip; 6, sensing assembly; 601, temperature sensing unit; 602, voltage sensing unit; 603, current sensing unit; 7, self-protection assembly; 701, soft-off circuit assembly; 702, protection control chip; 8, top substrate; 801, clamping hook; 802, upper layer plate; 803, extension plate; 804, pressing rod; 805, abutting rod; 806, reset spring. DETAILED DESCRIPTION

[0041] In order for those skilled in the art to better understand the technical solutions of the present application, the present application is described in detail below in combination with the drawings, and the description in this part is only exemplary and explanatory, and should not have any limiting effect on the protection scope of the present application.

[0042] Please refer to Figures 1 to 8The utility model provides a power module package with self-protection function, including heat dissipation base plate 1, the top of heat dissipation base plate 1 is screwed with double-sided pressure contact base plate 2, the middle part of the bottom inner wall of double-sided pressure contact base plate 2 is fixedly connected with power chip group 4, one end of the top of double-sided pressure contact base plate 2 is fixedly connected with multiple groups of connecting grooves 3, the front and rear ends of the side surface of double-sided pressure contact base plate 2 are fixedly connected with flexible copper band 5, the two ends of the bottom inner wall of double-sided pressure contact base plate 2 are fixedly connected with sensing assembly 6 and self-protection assembly 7 respectively, and the other end of the top of double-sided pressure contact base plate 2 is clamped with top base plate 8.

[0043] In the embodiment, as shown in the figure, Figure 2 The double-sided pressure contact base plate 2 includes a copper-clad frame 201, the bottom of the copper-clad frame 201 is screwed to the top of the heat dissipation base plate 1, both ends of the copper-clad frame 201 are fixedly connected with lead frames 202, three groups of fixed recessed frames 203 are equidistantly distributed in the middle of the copper-clad frame 201, key grooves 204 are fixedly connected to the four corners of the bottom inner wall of the fixed recessed frame 203, the inside of the fixed recessed frame 203 is provided with a plurality of heat dissipation hole structures, and the bottom of the fixed recessed frame 203 is connected with the heat dissipation base plate 1, an axle seat 205 is fixedly connected to the end of the top of the copper-clad frame 201 away from the connecting groove 3, and the axle seat 205 has three in total and each axle seat 205 is opposite to the adjacent fixed recessed frame 203 in position.

[0044] In the embodiment, as shown in the figure, Figure 1 The connecting groove 3 includes a clamping groove 301, the side surface of the clamping groove 301 is fixedly connected to one end of the top of the copper-clad frame 201, hook rods 302 are fixedly connected to the side surface of the inner wall of the clamping groove 301, and an upper compression spring 303 is fixedly connected to the bottom inner wall of the clamping groove 301.

[0045] In the embodiment, as shown in the figure, Figure 4 The power chip group 4 includes an interconnection circuit board 401, the bottom of the interconnection circuit board 401 is fixedly connected to the middle part of the bottom inner wall of the fixed recessed frame 203, both ends of the interconnection circuit board 401 are circuit-connected to the opposite ends of the flexible copper band 5, a disc spring 403 is fixedly connected to one end of the top of the interconnection circuit board 401, guide rods 402 are fixedly connected to the periphery of the disc spring 403, and key rods 404 are fixedly connected to both ends of the side surface of the interconnection circuit board 401.

[0046] In the embodiment, as shown in the figure, Figure 5 The sensing assembly 6 includes a temperature sensing unit 601, a voltage sensing unit 602 and a current sensing unit 603, the bottom of the temperature sensing unit 601 is attached to one end of the top of the interconnection circuit board 401, the side surface of the voltage sensing unit 602 is circuit-connected to one side of the interconnection circuit board 401, and the bottom of the current sensing unit 603 is circuit-connected to the other side of the interconnection circuit board 401.

[0047] In the embodiment, as shown in the figure, Figure 3As shown, the self-protection assembly 7 includes a soft-off circuit group 701, the bottom line of the soft-off circuit group 701 is connected to one end of the side surface of the fixed recess frame 203, and the soft-off circuit group 701 is located on the other side of the interconnection circuit board 401, and the other end of the soft-off circuit group 701 is fixedly connected with a protection control chip 702.

[0048] In this embodiment, as shown in the figure, Figure 2 As shown, the top base plate 8 includes a clamping hook 801, the inner wall of one end of the clamping hook 801 is clamped to the side surface of the shaft rod of the shaft seat 205, the other end of the clamping hook 801 is fixedly connected with an upper plate 802, and the middle part of the upper plate 802 and the heat dissipation base plate 1 is provided as a horizontal opening structure, the other end of the upper plate 802 is fixedly connected with two extension plates 803, the middle part of the two extension plates 803 is penetratingly connected with a pressing rod 804, the side surface of the pressing rod 804 is slidingly connected with a stop rod 805, and the stop rod 805 is penetratingly connected in the inside of the extension plate 803 and extends to the top inner wall of one end of the top of the extension plate 803 and is fixedly connected with a return spring 806.

[0049] In this embodiment, as shown in the figure, Figure 3 As shown, the inside of the heat dissipation base plate 1 is provided as an embedded micro-channel structure.

[0050] In this embodiment, as shown in the figure, Figure 7 As shown, the one end line of the soft-off circuit group 701 extending to the inside of the fixed recess frame 203 is connected with a state indicator structure, and the inside cavity of the fixed recess frame 203 is filled with silica gel material.

[0051] The working process of the power module packaging body with self-protection function is as follows:

[0052] First twist the bolt to make the heat dissipation base plate 1 connect at the bottom of the copper clad frame 201, then make the key rod 404 of the interconnection circuit board 401 two sides clamped along the key groove 204 of the fixed concave frame 203, after welding, then the temperature sensing unit 601 is sleeved on the side surface of the guide rod 402, the disc spring 403 is in the opening inside the temperature sensing unit 601, the voltage sensing unit 602 and the soft shutdown circuit group 701 are respectively connected at the two ends of the interconnection circuit board 401, the current sensing unit 603 is connected at the other end of the interconnection circuit board 401, and the protection control chip 702 is pressed into the groove of the soft shutdown circuit group 701, at this time the two ends of the interconnection circuit board 401 are respectively located in the flexible copper belt 5 at the two ends of the inner wall of the fixed concave frame 203, after setting, the clamping hook 801 and the upper plate 802 are sequentially clamped on the side surface of the shaft rod of the shaft seat 205, then the pressing rod 804 in the extension plate 803 is inserted into the hook rod 302 in the clamping groove 301, and the upper top spring 303 is pressed down, the pressing rod 804 in the pressing down is clamped with the hook rod 302, when it is necessary to disassemble and maintain, the hook rod 302 is squeezed out by pressing the pressing rod 805 to pull out the upper plate 802, when running, the protection control chip 702 receives the interconnection circuit board 401 condition transmitted by the sensing assembly 6 in real time, and after detecting the fault, the soft shutdown circuit group 701 takes over the control to achieve the self-protection effect.

[0053] The contents not described in detail in the specification belong to the prior art known to the person skilled in the art.

[0054] It should be noted that, in this document, the terms "comprising", "containing" or any other variant thereof are intended to cover non-exclusive inclusions, so that a process, method, article or device that includes a series of elements not only includes those elements, but also includes other elements not explicitly listed, or inherent to such a process, method, article or device.

[0055] The principles and implementation manners of the present application are described by applying specific examples, and the above example is only used to help understand the method of the present application and its core idea. The above description is only the preferred implementation manner of the present application, and it should be noted that, due to the limitation of language expression, there are infinite specific structures, and for the person skilled in the art, without departing from the principles of the present application, a number of improvements, refinements or changes can be made, or the above technical features can be combined in an appropriate manner; the improvements, refinements, changes or combinations, or the direct application of the inventive concept and technical solution to other occasions without improvement, shall be regarded as the protection scope of the present application.

Claims

1. A power module package with self-protection function, comprising a heat dissipation substrate (1), characterized in that: The top of the heat dissipation substrate (1) is threadedly connected with a double-sided crimping substrate (2), the middle of the bottom inner wall of the double-sided crimping substrate (2) is fixedly connected with a power chip set (4), one end of the top of the double-sided crimping substrate (2) is fixedly connected with a plurality of groups of connecting grooves (3), the front and rear ends of the side surface of the double-sided crimping substrate (2) are both fixedly connected with flexible copper strips (5), the two ends of the bottom inner wall of the double-sided crimping substrate (2) are respectively fixedly connected with a sensing assembly (6) and a self-protection assembly (7), and the other end of the top of the double-sided crimping substrate (2) is clamped with a top substrate (8).

2. A power module package with self-protection function according to claim 1, characterized in that: The double-sided crimping substrate (2) comprises a copper-clad frame (201), the bottom of the copper-clad frame (201) is threadedly connected with the top of the heat dissipation substrate (1), both ends of the copper-clad frame (201) are fixedly connected with lead frames (202), the middle of the copper-clad frame (201) is equidistantly provided with three groups of fixed recessed frames (203), the four corners of the bottom inner wall of the fixed recessed frame (203) are fixedly connected with key grooves (204), the inside of the fixed recessed frame (203) is provided with a plurality of heat dissipation hole structures, and the bottom of the fixed recessed frame (203) is connected with the heat dissipation substrate (1), one end of the top of the copper-clad frame (201) away from the connecting groove (3) is fixedly connected with an axle seat (205), and the axle seat (205) has three and each axle seat (205) is opposite to the position of the adjacent fixed recessed frame (203).

3. A power module package with self-protection according to claim 2, characterized in that: The connecting groove (3) comprises a clamping groove (301), one end of the side surface of the clamping groove (301) is fixedly connected with the top of the copper-clad frame (201), the side surface of the inner wall of the clamping groove (301) is fixedly connected with a hook rod (302), and the bottom inner wall of the clamping groove (301) is fixedly connected with an upper top spring (303).

4. A power module package with self-protection function according to claim 2, characterized in that: The power chip set (4) comprises an interconnection circuit board (401), the bottom of the interconnection circuit board (401) is fixedly connected with the middle of the bottom inner wall of the fixed recessed frame (203), and both ends of the interconnection circuit board (401) are circuit-connected with opposite ends of the flexible copper strip (5), one end of the top of the interconnection circuit board (401) is fixedly connected with a disc spring (403), the periphery of the disc spring (403) is fixedly connected with a guide rod (402), and both ends of the side surface of the interconnection circuit board (401) are fixedly connected with key rods (404).

5. A power module package with self-protection according to claim 4, characterized in that: The sensing assembly (6) comprises a temperature sensing unit (601), a voltage sensing unit (602) and a current sensing unit (603), the bottom of the temperature sensing unit (601) is attached to one end of the top of the interconnection circuit board (401), the side surface of the voltage sensing unit (602) is circuit-connected to one side of the interconnection circuit board (401), and the bottom of the current sensing unit (603) is circuit-connected to the other side of the interconnection circuit board (401).

6. A power module package with self-protection according to claim 4, characterized in that: The self-protection assembly (7) comprises a soft-off circuit group (701), one end of the soft-off circuit group (701) is connected to the side surface of the fixed recess frame (203), and the soft-off circuit group (701) is located on the other side of the interconnection circuit board (401); the other end of the soft-off circuit group (701) is fixedly connected with a protection control chip (702).

7. A power module package with self-protection according to claim 2, characterized in that: The top base plate (8) comprises a clamping hook (801), the inner wall of one end of the clamping hook (801) is clamped on the side surface of the shaft rod of the shaft seat (205), the other end of the clamping hook (801) is fixedly connected with an upper layer plate (802), the middle part of the upper layer plate (802) and the middle part of the heat dissipation base plate (1) are provided with a horizontal opening structure, the other end of the upper layer plate (802) is fixedly connected with two extension plates (803), the middle part of the two extension plates (803) is penetratingly connected with a pressing rod (804), the side surface of the pressing rod (804) is slidingly connected with a resisting rod (805), the resisting rod (805) is penetratingly connected in the inside of the extension plate (803) and extends to the top inner wall of one end of the top of the extension plate (803) and is fixedly connected with a reset spring (806).

8. A power module package with self-protection according to claim 1, characterized in that: The inside of the heat dissipation base plate (1) is provided with an embedded micro-channel structure.

9. A power module package with self-protection according to claim 6, characterized in that: The end of the soft-off circuit group (701) extending to the inside of the fixed recess frame (203) is connected with a state indicator structure, and the inside cavity of the fixed recess frame (203) is filled with silica gel material.

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