Multilayer ceramic capacitor

Abstract

Provided is a multilayer ceramic capacitor capable of reducing ESL. A multilayer ceramic capacitor (1) is provided with end surface internal electrodes (20) exposed on both end surfaces (C) of a multilayer body (2) and side surface internal electrodes (50) exposed on both side surfaces (B) of the multilayer body (2). In a laminated ceramic capacitor (1), a straight line extending parallel to the lamination direction (T) and passing through the center of a laminated body (2) in the longitudinal direction (L) and the center of the laminated body (2) in the width direction (W) is set as a reference line (SL), and an end surface internal electrode (20) closest to a first main surface (AA) is set as a first outermost end surface internal electrode (20A). When the distance between the first outermost end surface internal electrode (20A) and the first main surface (AA) on the reference line (SL) is a1 and the distance between one of the ends of the first outermost end surface internal electrode (20A) in the width direction (W) on the first end surface (CA) and the first main surface (AA) is b1, b1lt is set. A1.

Description

Technical Field

[0001] This invention relates to multilayer ceramic capacitors. Background Technology

[0002] A multi-terminal multilayer ceramic capacitor exists, comprising: a multilayer stacked body, wherein multiple dielectric layers having internal electrodes exposed at the end face of the multilayer stack and dielectric layers having internal electrodes exposed at the side face of the multilayer stack are alternately stacked; an end face external electrode disposed at the end face; and a side external electrode disposed at the side face (e.g., Patent Document 1). By adopting this structure, the equivalent series inductance (ESL) in the multilayer ceramic capacitor can be reduced.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2016-127262 Summary of the Invention

[0006] The problem the invention aims to solve

[0007] However, if the distance between the internal electrode and the mounting surface increases, the ESL increases. In order to further reduce ESL and shorten the current path, the distance between the internal electrode and the mounting surface needs to be reduced.

[0008] The purpose of this invention is to provide a multilayer ceramic capacitor capable of reducing ESL.

[0009] Technical solutions for solving the problem

[0010] To address the aforementioned problems, the multilayer ceramic capacitor of the present invention comprises: a multilayer body including a plurality of stacked dielectric layers and a plurality of internal electrodes respectively disposed on the plurality of dielectric layers, and having a first main surface and a second main surface opposite to each other in the stacking direction, a first side surface and a second side surface opposite to each other in a width direction orthogonal to the stacking direction, and a first end surface and a second end surface opposite to each other in a length direction orthogonal to the stacking direction and the width direction; end surface external electrodes, arranged in pairs on each of the end surfaces; and side surface external electrodes, arranged in pairs on each of the side surfaces, wherein the plurality of internal electrodes are exposed on both the first end surface and the second end surface. The internal electrode of the end face and the internal electrodes of the sides exposed on both the first side and the second side, wherein a straight line extending parallel to the stacking direction through the central portion of the length direction and the central portion of the width direction of the laminate is set as a reference line, the internal electrode of the end face closest to the first main surface is set as the first outermost internal electrode of the end face, the distance between the first outermost internal electrode of the end face and the first main surface on the reference line is set as a1, and the distance between one end of each end of the first outermost internal electrode of the end face in the width direction on the first end face and the first main surface is set as b1, where b1 <a1。

[0011] Invention Effects

[0012] According to the present invention, it is possible to provide a multilayer ceramic capacitor capable of reducing ESL. Attached Figure Description

[0013] Figure 1 This is a schematic perspective view of the multilayer ceramic capacitor 1 according to the first embodiment.

[0014] Figure 2 The first embodiment relates to the multilayer ceramic capacitor 1. Figure 1 A cross-sectional view cut off along the II-II direction.

[0015] Figure 3 The first embodiment relates to the multilayer ceramic capacitor 1. Figure 1 A cross-sectional view cut along direction III-III.

[0016] Figure 4 This is a side view of the laminate 2 according to the first embodiment, viewed from the first end face CA side.

[0017] Figure 5 This is a side view of the laminate 2 according to the first embodiment, viewed from the second end face CB side.

[0018] Figure 6 This is a side view of the laminate 2 according to the first embodiment, viewed from the first side BA side.

[0019] Figure 7 This is a side view of the laminate 2 according to the first embodiment, viewed from the second side BB side.

[0020] Figure 8 This is a diagram showing a ceramic green sheet with conductive paste for internal electrodes 20 on the end face.

[0021] Figure 9 This is a diagram showing a ceramic green sheet with conductive paste for the side internal electrodes 50.

[0022] Figure 10 This is shown during the manufacture of the multilayer ceramic capacitor 1 according to the first embodiment, in Figure 8 The image shows a ceramic sheet coated with dielectric paste.

[0023] Figure 11 This is shown during the manufacture of the multilayer ceramic capacitor 1 according to the first embodiment, in Figure 9 The image shows a ceramic sheet coated with dielectric paste.

[0024] Figure 12 This is a conceptual diagram illustrating the stacking state in the mother block involved in the first embodiment.

[0025] Figure 13 This is a schematic perspective view of the multilayer ceramic capacitor 100 according to the second embodiment.

[0026] Figure 14 The second embodiment relates to the multilayer ceramic capacitor 100. Figure 13 A cross-sectional view cut along the XIV-XIV direction.

[0027] Figure 15 The second embodiment relates to the multilayer ceramic capacitor 100. Figure 13 A cross-sectional view cut off in the XV-XV direction.

[0028] Figure 16 This is a side view of the laminate 102 according to the second embodiment, viewed from the first end face CA side.

[0029] Figure 17 This is a side view of the laminate 102 according to the second embodiment, viewed from the second end face CB side.

[0030] Figure 18 This is a side view of the laminate 102 according to the second embodiment, viewed from the first side BA side.

[0031] Figure 19 This is a side view of the laminate 102 according to the second embodiment, viewed from the second side BB side.

[0032] Figure 20 This is shown in the second embodiment of the manufacturing process of the multilayer ceramic capacitor 1, in which... Figure 8 The image shows a ceramic sheet coated with dielectric paste.

[0033] Figure 21 This is a conceptual diagram illustrating the stacking state in the mother block involved in the second embodiment. Detailed Implementation

[0034] <First Implementation>

[0035] The first embodiment of the multilayer ceramic capacitor 1 of the present invention will now be described. First, the structure of the multilayer ceramic capacitor 1 will be described with reference to… Figures 1 to 7 Please provide an explanation.

[0036] (Laminated ceramic capacitor 1)

[0037] like Figure 1 As shown, the multilayer ceramic capacitor 1 includes a laminate 2 and multiple external electrodes 3. The multilayer ceramic capacitor 1 is a so-called three-terminal type multilayer ceramic capacitor. The multilayer ceramic capacitor 1 is used by mounting it on a mounting substrate (not shown).

[0038] In the multilayer ceramic capacitor 1, the dimension of the stacking direction T is preferably 0.2 mm or more and 2.8 mm or less, the dimension of the length direction L is preferably 0.6 mm or more and 3.5 mm or less, and the dimension of the width direction W is preferably 0.3 mm or more and 2.8 mm or less.

[0039] (Layered body 2)

[0040] The laminate 2 is generally rectangular. All outer surfaces of the laminate 2 are flat. The corners (i.e., the portions where three faces of the laminate intersect) and edges (i.e., the portions where two faces of the laminate intersect) of the laminate 2 are preferably rounded. The laminate 2 has an inner layer 11 on which a dielectric layer 14 and an internal electrode 15 are laminated, and outer layer portions 12 disposed on both sides of the inner layer 11 in the lamination direction T.

[0041] Furthermore, in this specification, as a term indicating the orientation of the multilayer ceramic capacitor 1, the direction in which the dielectric layer 14 and the internal electrode 15 are stacked is designated as the stacking direction T. The direction intersecting the stacking direction T and on which a pair of external end-face electrodes 30 are provided is designated as the length direction L. The direction intersecting both the length direction L and the stacking direction T is designated as the width direction W. In the embodiment, the stacking direction T, the length direction L, and the width direction W are orthogonal to each other.

[0042] Furthermore, among the six outer surfaces of the laminate 2, one pair of outer surfaces located on both sides of the lamination direction T are designated as the first main surface AA and the second main surface AB; one pair of outer surfaces extending in the lamination direction T and located on both sides of the width direction W are designated as the first side surface BA and the second side surface BB; and one pair of outer surfaces extending in the lamination direction T and located on both sides of the length direction L are designated as the first end surface CA and the second end surface CB. When no special distinction is needed, the first main surface AA and the second main surface AB are sometimes collectively referred to as "each main surface A," the first side surface BA and the second side surface BB are collectively referred to as "each side surface B," and the first end surface CA and the second end surface CB are collectively referred to as "each end surface C."

[0043] Figure 2 The cross-section is parallel to the length direction L and the stacking direction T and passes through the center of the width direction W of the laminate 2. Figure 3 The cross-section is parallel to the width direction W and the stacking direction T and passes through the center of the length direction L of the laminate 2.

[0044] A straight line extending parallel to the stacking direction T, passing through the center of the length direction L and the center of the width direction W of the laminate 2, is designated as the baseline SL.

[0045] (Inner layer 11)

[0046] like Figure 2 as well as Figure 3 As shown, the inner layer 11 is generally rectangular. The inner layer 11 is formed by alternately stacking dielectric layer 14 and internal electrode 15.

[0047] (Dielectric layer 14)

[0048] The dielectric layer 14 is made of a ceramic material. For example, a dielectric ceramic with BaTiO3 as the main component can be used. Alternatively, materials with at least one of the following byproducts added to these main components—Mn compounds, Fe compounds, Cr compounds, Co compounds, Ni compounds, etc.—can also be used as ceramic materials.

[0049] (Internal electrode 15)

[0050] The internal electrode 15 is preferably formed of a metallic material, such as Ni, Cu, Ag, Pd, Ag-Pd alloy, Au, etc.

[0051] The plurality of internal electrodes 15 have end-face internal electrodes 20 exposed on both the first end face CA and the second end face CB, and side internal electrodes 50 exposed on both the first side face BA and the second side face BB. The end-face internal electrodes 20 and the side internal electrodes 50 are arranged alternately.

[0052] (Internal electrode 20 on end face)

[0053] The end-face internal electrode 20 extends between the two end faces C in the longitudinal direction L of the laminate 2 and is separated from the two side faces B in the width direction W by a fixed distance. The end-face internal electrode 20 has a first opposing portion 20a opposite to the side internal electrode 50 adjacent in the lamination direction T, and a first lead-out portion 20b extending from the first opposing portion 20a and exposed on the two end faces C respectively. Specifically, the first opposing portion 20a is located in the central portion between the two end faces C. In addition, the end-face internal electrode closest to the first main face AA is designated as the first outermost end-face internal electrode 20A, and the end-face internal electrode closest to the second main face AB is designated as the second outermost end-face internal electrode 20B.

[0054] (Side internal electrode 50)

[0055] The width W of the side internal electrode 50 is smaller than that of the laminate 2, and it is separated from both end faces C. The side internal electrode 50 has a second opposing portion 50a opposite to the end face internal electrode 20 adjacent in the lamination direction T, and a second lead-out portion 50b extending from the second opposing portion 50a and exposed on both side faces B. Specifically, the second opposing portion 50a is located in the center between the two side faces B. In addition, the side internal electrode 50 closest to the first main face AA is designated as the first outermost side internal electrode 50A, and the side internal electrode 50 closest to the second main face AB is designated as the second outermost side internal electrode 50B.

[0056] Furthermore, when no special distinction is required, the first opposing part 20a and the second opposing part 50a are sometimes referred to as "each opposing part 21, 51", and the first lead-out part 20b and the second lead-out part 50b are referred to as "each lead-out part 22, 52".

[0057] (Outer layer 12)

[0058] The outer layer 12 is a dielectric layer of fixed thickness. The outer layer 12 can be made of the same material as the dielectric layer 14 of the inner layer 11, or it can be made of a different material.

[0059] The dimensions of the stacking direction T of each outer layer 12 are preferably 10 μm or more and 100 μm or less. Furthermore, as a method for measuring the dimensions of the stacking direction T of the outer layer 12, for example, a method is to observe the LT cross-section near the center of the width direction W of the laminate exposed by grinding using a scanning electron microscope. In addition, due to the bending of the internal electrode 15, the dimensions of the stacking direction T of each outer layer 12 may vary depending on the measurement location. Therefore, the dimensions of the stacking direction T of the outer layer 12 are obtained as the average of the measured values ​​at multiple locations along the length direction L. For example, four points equidistantly separated along the length direction L can be set, and the value can be obtained as the average of the measured values ​​at each point.

[0060] (External electrode 3)

[0061] The plurality of external electrodes 3 have end-face external electrodes 30 arranged in pairs on each end face C and side external electrodes 40 arranged in pairs on each side face B. The end-face external electrodes 30 have a first end-face external electrode 30A arranged on the first end face CA and a second end-face external electrode 30B arranged on the second end face CB. The side external electrodes 40 have a first side external electrode 40A arranged on the first side face BA and a second side external electrode 40B arranged on the second side face BB.

[0062] (External electrode 30 on end face)

[0063] Each end-face external electrode 30 is connected to a first lead-out portion 20b. Each end-face external electrode 30 covers not only each end-face C, but also a portion of each end-face C side of each main surface A and each side surface B. Each end-face external electrode 30 includes a base electrode layer 31 and a plating layer 32 disposed on the base electrode layer 31. The base electrode layer 31 contains, for example, Cu. The plating layer 32 includes a Ni (nickel) plating layer 321 disposed on the base electrode layer 31 and a Sn (tin) plating layer 322 disposed on the Ni plating layer 321. Alternatively, the base electrode layer 31 may also be a Ni-containing base electrode layer. Furthermore, a conductive resin layer may be disposed between the base electrode layer 31 and the plating layer 32.

[0064] (Side external electrode 40)

[0065] Each side external electrode 40 is connected to a second lead 50b. Each side external electrode 40 covers not only side B, but also a portion of side B of the main surface A. Each side external electrode 40 includes a base electrode layer 41 and a plating layer 42 disposed on the base electrode layer 41. The base electrode layer 41 contains, for example, Cu. The plating layer 42 includes a Ni (nickel) plating layer 421 disposed on the base electrode layer 41 and a Sn (tin) plating layer 422 disposed on the Ni plating layer 421. Alternatively, the base electrode layer 41 may also be a Ni-containing base electrode layer.

[0066] (Regarding the bending of the internal electrode 20 on the end face)

[0067] Here, at least a portion of the internal electrodes 20 of the multiple end faces bends in the stacking direction T.

[0068] First, the region on the first main surface AA side of the first end face CA side will be described. For example... Figure 3 As shown, the central portion of the inner electrode 20A of the first outermost end face on the first end face CA in the width direction W is separated from the first main face AA relative to the portion on the reference line SL of the inner electrode 20A of the first outermost end face. Therefore, if the distance between the inner electrode 20A of the first outermost end face on the reference line SL and the first main face AA is set as a1, and the distance between the central portion of the inner electrode 20A of the first outermost end face on the first end face CA in the width direction and the first main face AA is set as c1, then it becomes a1 <c1。

[0069] like Figure 4 As shown, on the first end face CA, at least one end of each end of the inner electrode 20A on the first outermost end face in the width direction W is closer to the first main surface AA than the center of the inner electrode 20A on the width direction W. Specifically, on the first end face CA, each end of the inner electrode 50A on the first outermost end face in the width direction W is closer to the first main surface AA than the center of the inner electrode 20A on the width direction W. Furthermore, the first main surface AA is a flat surface. Therefore, if the distance between one end of the inner electrode 20A on the first end face CA in the width direction W and the first main surface AA is defined as b1, then b1 ≤ c1, specifically, b1 ≤ c1. <c1。

[0070] At least one end (specifically, both ends) of the first outermost end face inner electrode 20A on the first end face CA in the width direction W is closer to the first main surface AA than the portion on the reference line SL of the first outermost end face inner electrode 20A. Therefore, it becomes b1 <a1。

[0071] Next, the region on the second main surface AB side of the first end face CA side will be described. The central portion of the inner electrode 20B of the second outermost end face on the first end face CA, relative to the portion on the reference line SL in the inner electrode 20B of the second outermost end face, separates from the second main surface AB. (Refer to...) Figure 3 Therefore, if the distance between the inner electrode 20B of the second outermost end face and the second main face AB on the baseline SL is set as a2, and the distance between the center of the inner electrode 20B of the second outermost end face on the first end face CA in the width direction and the second main face AB is set as c2, then it becomes a2. <c2。

[0072] On the first end face CA, at least one end (specifically, both ends) of the inner electrode 20B on the second outermost end face in the width direction W is closer to the second main surface AB than the center of the inner electrode 20B on the second outermost end face in the width direction W (see reference). Figure 3 Furthermore, the second principal surface AB becomes a flat surface. Therefore, if the distance between one end of each end of the inner electrode 20B of the second outermost end surface on the first end surface CA in the width direction W and the second principal surface AB is set as b2, then b2 ≤ c2, specifically, b2 <c2。

[0073] At least one end (specifically, both ends) of the inner electrode 20B on the second outermost end face CA, in the width direction W, is closer to the second main surface AB than the portion on the reference line SL in the inner electrode 20B on the second outermost end face. Therefore, it becomes b2. <a2。

[0074] Next, the region on the first main surface AA side of the second end face CB side will be described. The central portion of the inner electrode 20A of the first outermost end face on the second end face CB, relative to the portion on the reference line SL in the inner electrode 20A of the first outermost end face, separates from the first main surface AA (see reference). Figure 3 Therefore, if the distance between the center of the inner electrode 20A of the first outermost end face on the second end face CB in the width direction and the first main face AA is set as c3, then it becomes a1. <c3。

[0075] like Figure 5 As shown, on the second end face CB, at least one end (more specifically, both ends) of each end of the inner electrode 20A on the first outermost end face in the width direction W is closer to the first main surface AA than the center of the inner electrode 20A on the first outermost end face in the width direction W. Therefore, if the distance between one end of the inner electrode 20A on the second end face CB in the width direction W and the first main surface AA is defined as b3, then b3 ≤ c3, more specifically, b3 <c3。

[0076] At least one end (specifically, both ends) in the width direction W of the first outermost end face internal electrode 20A on the second end face CB is closer to the first main face AA than the portion on the reference line SL in the first outermost end face internal electrode 20A. Therefore, b3 < a1.

[0077] Next, the region on the second main face AB side of the second end face CB side will be described. The central portion in the width direction W of the second outermost end face internal electrode 20B on the second end face CB is separated from the second main face AB compared to the portion on the reference line SL in the second outermost end face internal electrode 20B (see Figure 3 ). Therefore, if the distance between the central portion in the width direction of the second outermost end face internal electrode 20B on the second end face CB and the first main face AA is set as c4, then a2 < c4.

[0078] On the second end face CB, at least one end (specifically, both ends) in the width direction W of the second outermost end face internal electrode 20B is closer to the second main face AB than the central portion in the width direction W of the second outermost end face internal electrode 20B (see Figure 5 ). Therefore, if the distance between one end in the width direction W of the second outermost end face internal electrode 20B on the second end face CB and the second main face AB is set as b4, then b4 ≤ c4, specifically, b4 < c4.

[0079] At least one end (specifically, both ends) in the width direction W of the second outermost end face internal electrode 20B on the second end face CB is closer to the second main face AB than the portion on the reference line SL in the second outermost end face internal electrode 20B. Therefore, b4 < a2.

[0080] In the multilayer ceramic capacitor 1, on the first main face AA side of the first end face CA side, b1 < a1.

[0081] If the distance through which current flows between the internal electrode and the mounting substrate is shortened, then in the multilayer ceramic capacitor, the ESL is reduced. In particular, in the high-frequency region, the current flowing through the internal electrode tends to flow at the edge portion of the internal electrode. Therefore, it is considered that by bringing the edge portion of the internal electrode close to the mounting substrate, the ESL can be effectively reduced.

[0082] By having b1 < a1, compared with the case where the internal electrode 15 is not bent, the distance between the mounting substrate and the edge portion of the first outermost end face internal electrode 20A can be easily shortened. Thereby, the ESL can be reduced.

[0083] In addition, by making b1 ≤ c1, it is possible to easily shorten the distance between the edge portion of the first outermost end surface internal electrode 20A and the mounting substrate. As a result, the ESL can be reduced. Moreover, by making b1 < c1, it is possible to more easily bring the mounting substrate closer to the edge portion of the first outermost end surface internal electrode 20A. As a result, the ESL can be reduced.

[0084] On the second main surface AB side of the first end surface CA side, similarly, since b2 < a2, it is possible to easily shorten the distance between the mounting substrate and the edge portion of the first outermost end surface internal electrode 20A. As a result, the ESL can be reduced.

[0085] In addition, since b2 ≤ c2, the ESL can be reduced. Moreover, since b2 < c2, the ESL can be more appropriately reduced.

[0086] On the first main surface AA side of the second end surface CB side, similarly, since b3 < a1, it is possible to easily shorten the distance between the mounting substrate and the edge portion of the first outermost end surface internal electrode 20A. As a result, the ESL can be reduced.

[0087] In addition, since b3 ≤ a3, the ESL can be reduced. Moreover, since b3 < a3, the ESL can be more appropriately reduced.

[0088] On the second main surface AB side of the second end surface CB side, similarly, since b4 < a2, it is possible to easily shorten the distance between the mounting substrate and the edge portion of the second outermost end surface internal electrode 20B. As a result, the ESL can be reduced.

[0089] In addition, since b4 ≤ c4, the ESL can be reduced. Moreover, since b4 < c4, the ESL can be more appropriately reduced.

[0090] (Regarding the bending of the side surface internal electrode 50)

[0091] At least a part of the plurality of side surface internal electrodes 50 is bent in the stacking direction T.

[0092] First, the region on the first main surface AA side of the first side surface BA will be described. As Figure 2 shown, the distance from the first main surface AA to the central portion in the length direction L of the first outermost side surface internal electrode 50A on the first side surface BA and the portion on the reference line SL in the first outermost side surface internal electrode 50A is the same. Therefore, if the distance between the first outermost side surface internal electrode 50A and the first main surface AA on the reference line SL is set as a3, and the distance between the central portion in the width direction of the first outermost side surface internal electrode 50A on the first side surface BA and the first main surface AA is set as c5, then a3 = c5.

[0093] like Figure 6 As shown, on the first side surface BA, at least one end (more specifically, both ends) of each end of the inner electrode 50A on the first outermost side surface along the length direction L is closer to the first main surface AA than the center of the inner electrode 50A on the first outermost side surface along the length direction L. Furthermore, the first main surface AA is a flat surface. Therefore, if the distance between one end of the inner electrode 50A on the first side surface BA along the length direction L and the first main surface AA is defined as b5, then b5 ≤ c5, specifically, b5 <c5。

[0094] At least one end (specifically, both ends) of the longitudinal direction L of the inner electrode 50A on the first outermost side surface BA is closer to the first main surface AA than the portion on the reference line SL in the inner electrode 50A on the first outermost side surface. Therefore, it becomes b5. <a3。

[0095] Next, the region on the second main surface AB side of the first side BA side will be described. The central portion of the inner electrode 50B on the second outermost side of the first side BA in the length direction L and the portion on the reference line SL in the inner electrode 50B on the second outermost side are equidistant from the second main surface AB (see reference). Figure 2 Therefore, if the distance between the inner electrode 50B of the second outermost side surface and the second main surface AB on the baseline SL is set as a4, and the distance between the central part of the inner electrode 50B of the second outermost side surface on the first side surface BA in the width direction and the second main surface AB is set as c6, then a4 = c6.

[0096] On the first side BA, at least one end (more specifically, both ends) of each end of the inner electrode 50B on the second outermost side in the longitudinal direction L is closer to the second main surface AB than the central portion of the inner electrode 50B on the second outermost side in the longitudinal direction L (see reference). Figure 6 Furthermore, the second principal surface AB becomes a flat surface. Therefore, if the distance between one end of each end of the length direction L of the inner electrode 50B of the second outermost surface on the first side surface BA and the second principal surface AB is set as b6, then b6 ≤ c6, specifically, b6 <c6。

[0097] At least one end (specifically, both ends) of the inner electrode 50B on the second outermost side surface BA is closer to the second main surface AB than the portion on the reference line SL in the inner electrode 50B on the second outermost side surface BA. Therefore, it becomes b6. <a4。

[0098] Next, the region on the first main surface AA side of the second side BB side will be described. The central portion of the inner electrode 50A on the first outermost side of the second side BB in the longitudinal direction L and the portion on the reference line SL in the inner electrode 50A on the first outermost side are equidistant from the first main surface AA (see reference). Figure 2 Therefore, if the distance between the center of the inner electrode 50A of the first outermost side surface on the second side surface BB and the first main surface AA in the width direction is set as c7, then a3 = c7.

[0099] like Figure 7 As shown, on the second side BB, at least one end (more specifically, both ends) of each end of the inner electrode 50A on the first outermost side along the length direction L is closer to the first main surface AA than the center of the inner electrode 50A on the first outermost side along the length direction L. Therefore, if the distance between one end of the inner electrode 50A on the second side BB along the length direction L and the first main surface AA is defined as b7, then b7 ≤ c7, more specifically, b7 <c7。

[0100] At least one end of each of the ends of the inner electrode 50A on the first outermost side surface BB in the length direction L is closer to the first main surface AA than the portion on the reference line SL in the inner electrode 50A on the first outermost side surface BB. Therefore, it becomes b7. <a3。

[0101] Next, the region on the second main surface AB side of the second side BB side will be described. The central portion of the inner electrode 50B on the second outermost side of the second side BB in the longitudinal direction L and the portion on the reference line SL in the inner electrode 50B on the second outermost side are equidistant from the second main surface AB (see reference). Figure 2 Therefore, if the distance between the center of the inner electrode 50B of the second outermost side surface BB and the first main surface AA in the width direction is set as c8, then a4 = c8.

[0102] On the second side surface BB, at least one end (more specifically, both ends) of each end of the inner electrode 50B on the second outermost side surface along the length direction L is closer to the second main surface AB than the central portion of the inner electrode 50B on the second outermost side surface along the length direction L (see reference). Figure 7 Therefore, if the distance between one end of each end of the inner electrode 50B on the second outermost side surface BB along the length direction L and the second main surface AB is set as b8, then b8 ≤ c8, specifically, b8 <c8。

[0103] In at least one end portion (specifically, both end portions) in the longitudinal direction L of the second outermost side internal electrode 50B on the second side surface BB, the end portion is closer to the second main surface AB than the portion on the reference line SL in the second outermost side internal electrode 50B. Therefore, b8 < a4 is obtained.

[0104] In the multilayer ceramic capacitor 1, on the first main surface AA side on the first end surface CA side, b5 < a3 is obtained. Therefore, the distance between the mounting substrate and the edge portion of the first outermost side internal electrode 50A can be easily shortened as compared with the case where the internal electrode is not bent. Thereby, ESL can be reduced.

[0105] Furthermore, by making b5 ≤ c5, the distance between the mounting substrate and the edge portion of the first outermost side internal electrode 50A can be easily shortened. Thereby, ESL can be reduced. And by making b5 < c5, the distance between the mounting substrate and the edge portion of the first outermost side internal electrode 50A can be more easily shortened. Thereby, ESL can be more appropriately reduced.

[0106] On the second main surface AB side on the first end surface CA side, similarly, since b6 < a4 is obtained, the distance between the mounting substrate and the edge portion of the first outermost side internal electrode 50A can be easily shortened. Thereby, ESL can be more appropriately reduced.

[0107] Furthermore, since b6 ≤ c6 is obtained, it becomes easy to reduce ESL. And since b6 < c6 is obtained, ESL can be more appropriately reduced.

[0108] On the first main surface AA side on the second end surface CB side, similarly, since b7 < a3 is obtained, the distance between the mounting substrate and the edge portion of the first outermost side internal electrode 50A can be easily shortened. Thereby, it becomes easy to reduce ESL.

[0109] Furthermore, since b7 ≤ c7 is obtained, it becomes easy to reduce ESL. And since b7 < c7 is obtained, it becomes easy to more appropriately reduce ESL.

[0110] On the second main surface AB side on the second end surface CB side, similarly, since b8 < a4 is obtained, the distance between the mounting substrate and the edge portion of the second outermost side internal electrode 50B can be easily shortened. Thereby, it becomes easy to reduce ESL.

[0111] Furthermore, since b8 ≤ c8 is obtained, it becomes easy to reduce ESL. And since b8 < c8 is obtained, it becomes easy to more appropriately reduce ESL.

[0112] Furthermore, the internal electrodes 15 disposed at the center of the stacking direction T of the laminate 2 are not bent, or are only slightly bent. The internal electrodes 15 disposed near the first main surface AA are bent in the same manner as the internal electrodes 20A and 50A of the first outermost end surface, and the internal electrodes disposed near the second main surface AB are bent in the same manner as the internal electrodes 20B and 50B of the second outermost end surface. However, the degree of bending of these internal electrodes 15 can increase as they separate from the internal electrodes 15 disposed at the center of the stacking direction T of the laminate 2.

[0113] (Method for determining the distance between the internal electrode 15 and each main surface A)

[0114] First, the external electrodes 30 on the end face and the external electrodes 40 on the side face are removed from the multilayer ceramic capacitor 1 using acetone or the like, exposing each end face C and each side face B of the multilayer 2. The exposed end face C and each side face B are observed using a scanning electron microscope (SEM) or a metallographic microscope, and the distances between the internal electrode 15 and each main face A are measured (e.g., b1 to b8, c1 to c8).

[0115] More specifically, for example, b1 to b4 can be determined by measuring the distance from the end of the end face inner electrode 20 in the width direction W, to a position 20 μm closer to the center of the end face inner electrode 20 in the width direction W, and the distance from the first main surface AA or the second main surface AB. b5 to b8 can be determined by measuring the distance from the end of the side face inner electrode 50 in the length direction L, to a position 20 μm closer to the center of the side face inner electrode 50 in the length direction L, and the distance from the first main surface AA or the second main surface AB. For example, c1 to c4 can be determined by measuring the distance from the center of the end face inner electrode 20 in the width direction W, and c5 to c8 can be determined by measuring the distance from the center of the side face inner electrode 50 in the length direction L, and the distance from the first main surface AA or the second main surface AB.

[0116] Next, the laminate 2 is ground to expose any section from either the LT section near the center of the width direction W of the laminate 2 or the WT section near the center of the length direction L of the laminate 2. The section is then observed using a scanning microscope, metallographic microscope, or similar means, and the distances (e.g., a1 to a4) between the internal electrode 15 and each principal surface A on the reference line SL are measured.

[0117] (Manufacturing method of multilayer ceramic capacitor 1)

[0118] Next, regarding the manufacturing method of the multilayer ceramic capacitor 1, refer to... Figures 8-12 To explain further. Additionally, in Figure 10 as well as Figure 11In the diagram, an imaginary line indicates the position of the mother block B1 during the cutting process described later. Figure 12 For convenience, only the portion of the mother block B1 that constitutes a stack is shown.

[0119] (Printing process)

[0120] First, a conductive paste P1, serving as an internal electrode 15, is deposited on a ceramic green sheet S. The ceramic green sheet is a sheet-like or strip-like sheet formed on a carrier film using a die-coating machine, gravure coating machine, or micro-gravure coating machine, where a ceramic slurry containing ceramic powder, binder, and solvent is deposited. The conductive paste P1 contains both binder and solvent. For example, the conductive paste P1 is deposited on the ceramic green sheet in a desired shape using printing methods such as screen printing, gravure printing, or letterpress printing. Furthermore, a ceramic green sheet with conductive paste deposited as an internal electrode 20 on the end face is sometimes referred to as "first ceramic green sheet S1," and a ceramic green sheet with conductive paste deposited as an internal electrode 50 on the side face is sometimes referred to as "second ceramic green sheet S2."

[0121] like Figure 8 As shown, conductive paste P1 is disposed on the first ceramic green sheet S1. This forms a pattern of the internal end-face electrode 20 on the first ceramic green sheet S1. Figure 9 As shown, conductive paste P1 is disposed on the second ceramic green sheet. This forms a pattern of the side internal electrode 50 on the second ceramic green sheet S2.

[0122] Next, a dielectric paste P2 is deposited on the ceramic green sheet S to form a dielectric layer. The dielectric paste P2 is a ceramic slurry containing ceramic powder, a binder, and a solvent; for example, it is a ceramic slurry containing the same components as the ceramic slurry used as the material for the ceramic green sheet in the same proportions. However, this is not a limitation; the dielectric paste P2 and the ceramic slurry used as the material for the ceramic green sheet may contain different types and proportions of components. For example, the dielectric paste P2 is deposited on the ceramic green sheet S in a desired shape using printing methods such as screen printing, gravure printing, or letterpress printing.

[0123] like Figure 10 As shown, in the first ceramic green sheet S1, the dielectric paste P2 is printed as a plurality of stripe-like patterns arranged in a direction orthogonal to its long side direction. In the first ceramic green sheet S1, the dielectric paste P2 is disposed in the entire area where the conductive paste P1 is not disposed, and in the area overlapping with each end edge of the end face internal electrode 20 in the width direction W, and is not disposed in the area overlapping with the straight line-shaped area of ​​a fixed width extending in the length direction L through the center portion of the width direction W of the end face internal electrode 20.

[0124] like Figure 11As shown, in the second ceramic green sheet S2, the dielectric paste P2 is printed as a plurality of rectangular patterns arranged in a longitudinal and transverse pattern. The areas in the second ceramic green sheet S2 where the dielectric paste P2 is not disposed appear approximately lattice-like when viewed in the lamination direction T. These areas in the second ceramic green sheet S2 have regions overlapping with a linear region of fixed width extending in the length direction L through the central portion of the width direction W of the side internal electrode 50, and regions overlapping with a linear region of fixed width extending in the width direction W through the central portion of the length direction L of the side internal electrode 50.

[0125] Furthermore, the order in which the conductive paste P1 and the dielectric paste P2 are disposed on the ceramic green sheet S is not limited to the order described above; the conductive paste P1 may also be disposed on the ceramic green sheet S in a state where the dielectric paste P2 is disposed.

[0126] (Layering process)

[0127] Next, as Figure 12 As shown, a first ceramic green sheet S1, which is provided with conductive paste P1 and dielectric paste P2, and a second ceramic green sheet, which is also provided with conductive paste P1 and dielectric paste P2, are alternately stacked. Next, outer layer ceramic green sheets S3 are respectively placed on both sides of the stacking direction T of the alternately stacked first ceramic green sheets S1 and second ceramic green sheets S2. Thus, a mother block B1 is obtained.

[0128] Furthermore, each outer layer 12 can be an outer layer having multiple ceramic green sheets S3 stacked together, or it can be a single ceramic green sheet S3. In addition, the ceramic green sheets used in the inner layer (i.e., the first ceramic green sheet S1 and the second ceramic green sheet S2) and the ceramic green sheets S3 used in the outer layer can contain different compositions. For example, the ceramic green sheet used in the inner layer can contain components that improve the dielectric constant, while the ceramic green sheet used in the outer layer can contain components that improve moisture resistance, weather resistance, and strength.

[0129] In the mother block B1, due to the overlap of the ceramic green sheet S, conductive paste P1, and dielectric paste P2, a portion of the outer surface of the mother block B1 bulges in the stacking direction T, and the internal electrode 15 (conductive paste P1) bends in the stacking direction T. The size of the bulge on the outer surface of the mother block B1 and the size of the bend of the internal electrode 15 can be adjusted by adjusting the thickness of the dielectric paste P2 (the dimension in the stacking direction T), the amount of binder and plasticizer in the dielectric paste P2, etc.

[0130] (Crimping process)

[0131] Next, the outer ceramic green sheet, and the stacked first ceramic green sheet S1 and second ceramic green sheet S2 are hot-pressed together. At this time, the mother block is held by two metal plates in the stacking direction T. As a result, the third ceramic green sheet and the stacked first ceramic green sheet S1 and second ceramic green sheet S2 are hot-pressed together, and the outer surface of the mother block B1 in the stacking direction T is flattened.

[0132] Furthermore, the size of the bulge on the outer surface of the mother block B1 and the degree of bending of the internal electrode 15 can be adjusted by adjusting the temperature, pressure, and rigidity of the metal plate during hot pressing. If there is a bulge on the outer surface of the mother block B1 after hot pressing, the bulge can be ground to flatten the outer surface of the mother block B1.

[0133] (Cutting process)

[0134] Next, the parent block B1 is cut along the length direction L and the width direction W. This results in multiple cuboid-shaped blocks.

[0135] (Laminated body firing process)

[0136] The resulting block is heated in a nitrogen atmosphere at a given firing temperature for a given time. This yields laminate 2.

[0137] (External electrode formation process)

[0138] Next, side external electrodes 40 are formed on both sides B of the laminate 2. The second lead-out portion 50b of the side internal electrode 50 is connected to the side external electrodes 40. Each side external electrode 40 is formed to cover not only the side B but also a part of the side B side of the main surface A.

[0139] External electrodes 30 are formed on both end faces C of the laminate 2. Each external electrode 30 is connected to a first lead-out portion 20b of the internal electrode 20. Each external electrode 30 is formed to cover not only the end face C but also a portion of the end face C side, including the main face A and the side face B.

[0140] (External electrode bonding process)

[0141] Next, the laminate 2, with the end face external electrode 30 and the side face external electrode 40 formed thereon, is heated in a nitrogen atmosphere at a given firing temperature for a given time. Thus, the end face external electrode 30 and the side face external electrode 40 are sintered onto the laminate 2. Through the above, a result is obtained. Figure 1 The stacked ceramic capacitor 1 shown.

[0142] (Effects related to the first embodiment)

[0143] According to this embodiment, the following effects can be obtained.

[0144] According to the present embodiment, when the distance between the first outermost end face internal electrode 20A on the reference line SL and the first main face AA is set as a1, and the distance between one end of each end in the width direction W of the first outermost end face internal electrode 20A on the first end face CA and the first main face AA is set as b1, b1 < a1.

[0145] If the distance through which current flows between the internal electrode and the mounting substrate is shortened, then in a multilayer ceramic capacitor, the ESL is reduced. In particular, in a high-frequency region, the current flowing through the internal electrode tends to flow at the edge portion of the internal electrode. Therefore, it is considered that by bringing the edge portion of the internal electrode close to the mounting substrate, the ESL can be effectively reduced.

[0146] By making b1 < a1, compared with the case where the internal electrode 15 is not bent, the distance between the mounting substrate and the edge portion of the first outermost end face internal electrode 20A can be easily shortened. Thereby, the ESL can be reduced.

[0147] Therefore, a multilayer ceramic capacitor that can easily reduce the ESL can be provided.

[0148] According to the present embodiment, when the distance between the central portion of the second outermost end face internal electrode 20B on the first end face CA in the width direction W and the second main face AB is set as c1, b1 ≤ c1.

[0149] Thereby, the distance between the mounting substrate and the edge portion of the first outermost end face internal electrode 20A can be easily shortened, and thus the ESL can be reduced.

[0150] In addition, according to the present embodiment, b1 < c1. Thereby, the distance between the mounting substrate and the edge portion of the first outermost end face internal electrode 20A can be more easily shortened, and thus the ESL can be more appropriately reduced.

[0151] According to the present embodiment, when the distance between the second outermost end face internal electrode 20B on the reference line SL and the second main face AB is set as a2, and the distance between one end of each end in the width direction W of the second outermost end face internal electrode 20B on the first end face CA and the second main face AB is set as b2, b2 < a2. Thereby, the distance between the edge portion of the internal electrode 15 and the mounting substrate can be easily shortened, and thus the ESL can be reduced.

[0152] According to the present embodiment, when the distance between the central portion of the second outermost end face internal electrode 20B on the first end face CA in the width direction W and the second main face AB is set as c2, b2 ≤ c2. Thereby, the distance between the edge portion of the internal electrode 15 and the mounting substrate can be easily shortened, and thus the ESL can be more appropriately reduced.

[0153] Moreover, according to the present embodiment, b2 < c2. Thus, it is possible to easily shorten the distance between the edge portion of the internal electrode 15 and the mounting substrate, and therefore the ESL can be reduced.

[0154] According to the present embodiment, when the distance between one end of each end in the width direction W of the first outermost end surface internal electrode 20A on the second end surface CB and the first main surface AA is set to b3, b3 < a1. Thus, it is possible to easily shorten the distance between the edge portion of the internal electrode 15 and the mounting substrate, and therefore the ESL can be reduced.

[0155] According to the present embodiment, when the distance between the central portion of the first outermost end surface internal electrode 20A in the width direction W on the second end surface CB and the first main surface AA is set to c3, b3 ≤ c3. Thus, it is possible to easily shorten the distance between the edge portion of the internal electrode 15 and the mounting substrate, and therefore the ESL can be reduced.

[0156] Moreover, according to the present embodiment, b3 < c3. Thus, the distance between the edge portion of the internal electrode 15 and the mounting substrate can be shortened, and therefore the ESL can be more appropriately reduced.

[0157] According to the present embodiment, when the distance between the second outermost end surface internal electrode 20B on the reference line SL and the second main surface AB is set to a2, and the distance between one end of each end in the width direction W of the second outermost end surface internal electrode 20B on the second end surface CB and the second main surface AB is set to b4, b4 < a2. Thus, the distance between the edge portion of the internal electrode 15 and the mounting substrate can be shortened, and therefore the ESL can be reduced.

[0158] According to the present embodiment, when the distance between the central portion of the second outermost end surface internal electrode 20B in the width direction W on the second end surface CB and the second main surface AB is set to c4, b4 ≤ c4. Thus, it is possible to easily shorten the distance between the edge portion of the internal electrode 15 and the mounting substrate, and therefore the ESL can be reduced.

[0159] Moreover, according to the present embodiment, b4 < c4. Thus, the distance between the edge portion of the internal electrode 15 and the mounting substrate can be shortened, and therefore the ESL can be reduced.

[0160] According to the present embodiment, when the distance between the first outermost side internal electrode on the reference line SL and the first main surface AA is set to a3, and the distance between one end of each end in the length direction L of the first outermost side internal electrode 50A on the first side surface BA and the first main surface AA is set to b5, b5 < a3. Thus, it is possible to easily shorten the distance between the edge portion of the internal electrode 15 and the mounting substrate, and therefore the ESL can be reduced.

[0161] According to the present embodiment, when the distance between the central portion in the length direction L of the first outermost-side internal electrode 50A on the first side BA and the first main surface AA is set as c5, b5 ≤ c5. Thereby, it is possible to easily shorten the distance between the edge portion of the internal electrode 15 and the mounting substrate, and thus the ESL can be reduced.

[0162] Moreover, according to the present embodiment, b5 < c5. Thereby, it is possible to easily shorten the distance between the edge portion of the internal electrode 15 and the mounting substrate, and thus the ESL can be reduced.

[0163] According to the present embodiment, when the distance between the second outermost-side internal electrode 50B on the reference line SL and the second main surface AB is set as a4, and the distance between one end portion of the second outermost-side internal electrode 50B in the length direction L on the first side BA and the second main surface AB is set as b6, b6 < a4. Thereby, it is possible to easily shorten the distance between the edge portion of the internal electrode 15 and the mounting substrate, and thus the ESL can be reduced.

[0164] According to the present embodiment, when the distance between the central portion in the length direction L of the second outermost-side internal electrode 50B on the first side BA and the second main surface AB is set as c6, b6 ≤ c6. Thereby, it is possible to easily shorten the distance between the edge portion of the internal electrode 15 and the mounting substrate, and thus the ESL can be reduced.

[0165] Moreover, according to the present embodiment, b6 < c6. Thereby, it is possible to easily shorten the distance between the edge portion of the internal electrode 15 and the mounting substrate, and thus the ESL can be more appropriately reduced.

[0166] According to the present embodiment, when the distance between one end portion of the first outermost-side internal electrode 50A in the length direction L on the second side BB and the first main surface AA is set as b7, b7 < a3. Thereby, it is possible to easily shorten the distance between the edge portion of the internal electrode 15 and the mounting substrate, and thus the ESL can be reduced.

[0167] According to the present embodiment, when the distance between the central portion in the length direction L of the first outermost-side internal electrode 50A on the second side BB and the first main surface AA is set as c7, d7 ≤ c7. Thereby, it is possible to easily shorten the distance between the edge portion of the internal electrode 15 and the mounting substrate, and thus the ESL can be reduced.

[0168] Moreover, according to the present embodiment, d7 < c7. Thereby, it is possible to shorten the distance between the edge portion of the internal electrode 15 and the mounting substrate, and thus the ESL can be more appropriately reduced.

[0169] According to the present embodiment, when the distance between the second outermost side internal electrode 50B on the reference line SL and the second main surface AB is set as a4, and the distance between one end of each end in the length direction L of the second outermost side internal electrode 50B on the second side BB and the second main surface AB is set as b8, b8 < a4. Thus, the distance between the edge portion of the internal electrode 15 and the mounting substrate can be shortened, and therefore, the ESL can be more appropriately reduced.

[0170] According to the present embodiment, when the distance between the central portion in the length direction L of the second outermost side internal electrode 50B on the second side BB and the second main surface AB is set as c8, b8 ≤ c8. Thus, the separation between the edge portion of the internal electrode 15 and the mounting substrate can be suppressed, and therefore, the ESL can be reduced.

[0171] Moreover, according to the present embodiment, b8 < c8. Thus, the distance between the edge portion of the internal electrode 15 and the mounting substrate can be easily shortened, and therefore, the ESL can be reduced.

[0172] <Second Embodiment>

[0173] Next, the multilayer ceramic capacitor 100 according to the second embodiment of the present invention will be described. Hereinafter, the description will be centered on the differences from the first embodiment, and for the structures identical to those of the multilayer ceramic capacitor 1 according to the first embodiment, the same reference numerals may be given and the description may be omitted. In addition, Figure 14 The cross-section is a cross-section parallel to the length direction L and the stacking direction T and passing through the central portion in the width direction W of the stacked body 102. Figure 15 The cross-section is a cross-section parallel to the width direction W and the stacking direction T and passing through the central portion in the length direction L of the stacked body 102.

[0174] As Figure 13 shown, the multilayer ceramic capacitor 100 according to the second embodiment is also a so-called three-terminal type multilayer ceramic capacitor as in the first embodiment. However, as will be described below, in the second embodiment, the bending form of the internal electrode is different from that of the first embodiment.

[0175] (Regarding the bending of the end face internal electrode 120)

[0176] First, the region on the first main surface AA side of the first end face CA side will be described. As Figure 15 shown, the central portion in the width direction W of the first outermost end face internal electrode 120A on the first end face CA is closer to the first main surface AA than the portion on the reference line SL in the first outermost end face internal electrode 120A. Thus, c1 < a1 is obtained. Thus, the distance between the end portion of the internal electrode and the mounting substrate can be easily shortened, and therefore, the ESL can be reduced.

[0177] As Figure 16 shown, on the first end face CA, at least one end (specifically, both ends) of each end in the width direction W of the first outermost end face internal electrode 120A and the central portion in the width direction W of the first outermost end face internal electrode 120A are at the same distance from the first main face AA. Therefore, b1 = c1. Additionally, b1 and c1 may be slightly different from each other. However, it is preferred that b1 ≤ c1. In this case, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus the ESL can be reduced.

[0178] At least one end (specifically, both ends) of each end in the width direction W of the first outermost end face internal electrode 120A on the first end face CA is closer to the first main face AA than the portion on the reference line SL in the first outermost end face internal electrode 120A. Therefore, b1 < a1. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus the ESL can be reduced.

[0179] Next, the region on the side of the second main face AB on the first end face CA will be described. The central portion in the width direction W of the second outermost end face internal electrode 120B on the first end face CA is separated from the second main face AB compared to the portion on the reference line SL in the second outermost end face internal electrode 120B (refer to Figure 15 ). Therefore, a2 < c2. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus the ESL can be reduced.

[0180] On the first end face CA, at least one end (specifically, both ends) of each end in the width direction W of the second outermost end face internal electrode 120B and the central portion in the width direction W of the second outermost end face internal electrode 120B are at the same distance from the second main face AB (refer to Figure 16 ). Therefore, b2 = c2. Additionally, b2 and c3 may be slightly different from each other. However, it is preferred that b2 ≤ c2. In this case, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus the ESL can be reduced.

[0181] At least one end (specifically, both ends) of each end in the width direction W of the second outermost end face internal electrode 120B on the first end face CA is closer to the second main face AB than the portion on the reference line SL in the second outermost end face internal electrode 120B. Therefore, b2 < a2. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus the ESL can be reduced.

[0182] Next, the region on the AA side of the first main surface with respect to the CB side of the second end face will be described. The central portion in the width direction W of the first outermost end face internal electrode 120A on the second end face CB is separated from the portion on the reference line SL in the first outermost end face internal electrode 120A, away from the first main surface AA (refer to Figure 14 ). Therefore, a1 < c3. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and therefore the ESL can be reduced.

[0183] As Figure 17 shown, on the second end face CB, the distance from the first main surface AA to at least one end portion (specifically, both end portions) in the width direction W of the first outermost end face internal electrode 120A and the central portion in the width direction W of the first outermost end face internal electrode 120A is the same. Therefore, b3 = c3. Additionally, b3 and c3 may be slightly different from each other. However, it is preferable that b3 ≤ c3. In this case, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and therefore the ESL can be reduced.

[0184] At least one end portion (specifically, both end portions) in the width direction W of the first outermost end face internal electrode 120A on the second end face CB is closer to the first main surface AA than the portion on the reference line in the first outermost end face internal electrode 120A. Therefore, b3 < a1. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and therefore the ESL can be reduced.

[0185] Next, the region on the AB side of the second main surface with respect to the CB side of the second end face will be described. The central portion in the width direction W of the second outermost end face internal electrode 120B on the second end face CB is separated from the portion on the reference line SL in the second outermost end face internal electrode 120B, away from the second main surface AB (refer to Figure 15 ). Therefore, a2 < c4. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and therefore the ESL can be reduced.

[0186] On the second end face CB, the distance from the second main surface AB to at least one end portion (specifically, both end portions) in the width direction W of the second outermost end face internal electrode 120B and the central portion in the width direction W of the second outermost end face internal electrode 120B is the same (refer to Figure 17 ). Therefore, b4 = c4. Additionally, b4 and c4 may be slightly different from each other. However, it is preferable that b4 ≤ c4. In this case, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and therefore the ESL can be reduced.

[0187] At least one end (specifically, both ends) in the width direction W of the second outermost end face internal electrode 120B on the second end face CB is closer to the second main face AB than the portion on the reference line SL in the second outermost end face internal electrode 120B. Therefore, b4 < a2. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus the ESL can be reduced.

[0188] (Regarding the bending of the side internal electrode 150)

[0189] First, the region on the first main face AA side of the first side BA will be described. As Figure 14 shown, the central portion in the length direction L of the first outermost side internal electrode 150A on the first side BA is closer to the first main face AA than the portion on the reference line SL in the first outermost side internal electrode 150A. Therefore, a3 < c5. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus the ESL can be reduced.

[0190] As Figure 18 shown, on the first side BA, at least one end (specifically, both ends) in the length direction L of the first outermost side internal electrode 150A is at the same distance from the first main face AA as the central portion in the length direction L of the first outermost side internal electrode 150A. Therefore, b5 = c5. Additionally, b5 and c5 may be slightly different from each other.

[0191] At least one end (specifically, both ends) in the length direction L of the first outermost side internal electrode 150A on the first side BA is closer to the first main face AA than the portion on the reference line SL in the first outermost side internal electrode 150A. Therefore, b5 < a3. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus the ESL can be reduced.

[0192] Next, the region on the second main face AB side of the first side BA will be described. The central portion in the length direction L of the second outermost side internal electrode 150B on the first side BA is closer to the second main face AB than the portion on the reference line SL in the second outermost side internal electrode 150B (refer to Figure 14 ). Therefore, a4 < c6. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus the ESL can be reduced.

[0193] On the first side BA, at least one end (specifically, both ends) in the length direction L of the second outermost side internal electrode 150B is at the same distance from the second main face AB as the central portion in the length direction L of the second outermost side internal electrode 150B (refer to Figure 18). Therefore, b6 = c6. Additionally, b6 and c6 can be slightly different from each other.

[0194] At least one end (specifically, both ends) of the second outermost side internal electrode 150B in the length direction L on the first side BA is closer to the second main surface AB than the portion on the reference line SL in the second outermost side internal electrode 150B. Therefore, b6 < a4. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus ESL can be reduced.

[0195] Next, the region on the first main surface AA side of the second side BB will be described. The central portion of the first outermost side internal electrode 150A in the length direction L on the second side BB is closer to the first main surface AA than the portion on the reference line SL in the first outermost side internal electrode 150A (refer to Figure 14 ). Therefore, a3 < c7. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus ESL can be reduced.

[0196] As Figure 19 shown, on the second side BB, at least one end (specifically, both ends) of the first outermost side internal electrode 150A in the length direction L and the central portion of the first outermost side internal electrode 150A in the length direction L are at the same distance from the first main surface AA. Therefore, b7 = c7. Additionally, b7 and c7 can be slightly different from each other.

[0197] At least one end (specifically, both ends) of the first outermost side internal electrode 150A in the length direction L on the second side BB is closer to the first main surface AA than the portion on the reference line SL in the first outermost side internal electrode 150A. Therefore, b7 < a3. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus ESL can be reduced.

[0198] Next, the region on the second main surface AB side of the second side BB will be described. The central portion of the second outermost side internal electrode 150B in the length direction L on the second side BB is separated from the second main surface AB compared to the portion on the reference line SL in the second outermost side internal electrode 150B (refer to Figure 14 ). Therefore, a4 < c8. Thus, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus ESL can be reduced.

[0199] On the second side BB, at least one end (specifically, both ends) of the second outermost side internal electrode 150B in the length direction L and the central portion of the second outermost side internal electrode 150B in the length direction L are at the same distance from the second main surface AB (refer to Figure 19 ). Therefore, b8 = c8. Additionally, b8 and c8 can be slightly different from each other.

[0200] At least one end (specifically, both ends) of the length direction L of the second outermost side internal electrode 150B on the second side BB is closer to the second main surface AB than the portion on the reference line SL in the second outermost side internal electrode 150B. Thus, b8 < a4. Thereby, it is possible to easily shorten the distance between the end of the internal electrode and the mounting substrate, and thus reduce the ESL.

[0201] (Manufacturing method of the multilayer ceramic capacitor 100)

[0202] Next, regarding the manufacturing method of the multilayer ceramic capacitor 100 according to the second embodiment, reference is made to Figure 20 and Figure 21 for explanation. Additionally, in Figure 20 , the position where the mother block B2 is divided in the subsequent cutting process is shown by a phantom line. In Figure 21 , for convenience, only the portion of the mother block B2 that constitutes one laminate is shown.

[0203] In the second embodiment, the arrangement of the dielectric paste P2 in the second ceramic green sheet S2 is different from that in the first embodiment. As shown in Figure 20 , in the second ceramic green sheet S2, the dielectric paste P2 is arranged in the entire area of the region where the side internal electrode 150 is not arranged and in the region overlapping with the peripheral portion of the side internal electrode 150, and is not arranged in the region overlapping with the region that is substantially rectangular when viewed in the lamination direction T and includes the central portion of the length direction L and the width direction W of the second opposed portion 150b.

[0204] In addition, the arrangement of the dielectric paste P2 in the first ceramic green sheet S1 is the same as that in the first embodiment.

[0205] As shown in Figure 21 , similar to the first embodiment, the first ceramic green sheet S1 on which the conductive paste P1 and the dielectric paste P2 are arranged, and the second ceramic green sheet are alternately laminated.

[0206] Above, the embodiments of the present invention have been described, but the present invention is not limited to the above-described embodiments, and various changes and modifications can be made.

[0207] The form of the bending of the end face internal electrode is not limited to the forms of the above-described embodiments. However, it is preferably b1 < a1, and more preferably b1 < a1 and b2 < a2. Thereby, it is possible to more appropriately reduce the ESL.

[0208] In addition, it is preferable that b3 < a1, and more preferably that b3 < a1 and b4 < a2. Thereby, the ESL can be more appropriately reduced.

[0209] In addition, b1, b3, c1, and c3 do not necessarily have to be smaller than a1. By setting b1 < c1 and b3 < c3, the ESL can be reduced. However, by making b1, b3, c1, and c3 smaller than a1, the ESL can be more appropriately reduced.

[0210] Similarly, b2, b4, c2, and c4 do not necessarily have to be smaller than a2. By setting b2 < c2 and b4 < c4, the ESL can be reduced. However, by making b2, b4, c2, and c4 smaller than a2, the ESL can be more appropriately reduced.

[0211] The shape of the bend of the side internal electrode is not limited to the shape of each of the above embodiments. However, it is preferable that b5 < a3, and more preferably that b5 < a3 and b7 < a4. Thereby, the ESL can be more appropriately reduced.

[0212] In addition, it is preferable that b6 < a3, and more preferably that b6 < a3 and b8 < a4. Thereby, the ESL can be more appropriately reduced.

[0213] In addition, b5, b7, c5, and c7 do not necessarily have to be smaller than a3. By setting b5 < c5 and b7 < c7, the ESL can be reduced. However, by making b5, b7, c5, and c7 smaller than a3, the ESL can be more appropriately reduced.

[0214] Similarly, b6, b8, c6, and c8 do not necessarily have to be smaller than a4. By setting b6 < c6 and b8 < c8, the ESL can be reduced. However, by making b6, b8, c6, and c8 smaller than a4, the ESL can be reduced.

[0215] The arrangement patterns and components of the dielectric paste P2 and the conductive paste P1 are not limited to each of the above embodiments. By appropriately changing them, the size relationships of a1 to a4, b1 to b8, and c1 to c8 can be adjusted.

[0216] In the above embodiment, each main surface A of the laminate has become a flat surface, but concavities and convexities may be formed on each main surface A. However, from the viewpoint of being able to appropriately shorten the distance between the end edge portion of the internal electrode and each main surface A, each main surface A is preferably as flat as possible.

[0217] In the above embodiment, the end surface internal electrode 20 extends between the two end surfaces C of the laminate 2 and is separated from the two side surfaces B by a fixed distance, but the structure of the end surface internal electrode is not limited to this.

[0218] The width W of a portion of the first lead-out portion 20b may be larger than the width W of the first opposing portion 20a. The end of the width W of the portion of the first lead-out portion 20b may also be connected to both sides B. The end of the width W of the first lead-out portion 20b connected to both sides B is exposed from both sides B. The end of the length L of the first lead-out portion 20b may also be completely connected to one end face. The internal electrode 20 of the end face of the first lead-out portion 20b, having the end in the width W connected to both sides B and the end in the length L completely connected to one end face, appears H-shaped when viewed in the stacking direction T. Alternatively, each end of the width W of the first lead-out portion 20b may not be connected to each side B, but may be separated from each side B.

[0219] When viewed in the stacking direction T, the ESL of the internal electrode 20 of the H-shaped end face is further suppressed.

[0220] During the manufacture of this multilayer ceramic capacitor, when printing conductive paste P1 on the first ceramic green sheet S1, multiple stripes of conductive paste P1 extending in the length direction L and stripes of conductive paste P1 extending in the width direction W are printed on the first ceramic green sheet S1 at given intervals. When the first multilayer ceramic green sheet S1 is viewed in the stacking direction, the conductive paste P1 is arranged in a grid pattern. Furthermore, for example, the conductive paste P1 extending in the length direction L is printed so as not to overlap with the cutting line in the length direction L during the cutting process. The central portion of the conductive paste P1 extending in the width direction W in the short side direction is printed at a position that overlaps with the cutting line in the width direction W during the cutting process.

[0221] Furthermore, the dielectric paste P2 is preferably printed on the first ceramic green sheet such that it overlaps at least with the portions of the conductive paste P1 that form the first leads in the width direction W. In this case, in the multilayer ceramic capacitor, it is possible to bring the portions of the first leads in the width direction W of the inner electrode of the first outermost end face closer to the first main surface AA, or to bring the portions of the first leads in the width direction W of the inner electrode of the second outermost end face closer to the second main surface AB. Therefore, b1 to b4 can be reduced.

[0222] In the above embodiment, when printing dielectric paste P2 on the first ceramic green sheet S1, the dielectric paste P2 is disposed in the entire area where the conductive paste P1 is not disposed, and in the area overlapping with each end edge of the inner electrode 20 in the width direction W. It is not disposed in the area overlapping with a linear area of ​​fixed width extending in the length direction L through the center of the inner electrode 20 in the width direction W. However, the placement of the dielectric paste P2 is not limited to this. Furthermore, the dielectric paste P2 may also be disposed in multiple overlapping configurations.

[0223] For example, dielectric paste P2 can also be disposed on the first ceramic green sheet S1, such that it overlaps with the area in the conductive paste P1 that becomes the first lead-out portion. In this case, for example, multiple conductive paste P1s are printed on the first ceramic green sheet at given intervals of striped openings extending in the length direction L. Multiple dielectric paste P2s are printed on the first ceramic green sheet S1 at given intervals of striped openings extending in the length direction L, and further multiple are printed at given intervals of striped openings extending in the width direction W. If the first laminated ceramic green sheet S1 is viewed in the lamination direction, the multiple dielectric pastes P2s are arranged in a grid pattern. In addition, the central portion of the short side of the dielectric paste P2 extending in the length direction L is printed at a position that overlaps with the cutting line in the length direction L during the cutting process. The dielectric paste P2 extending in the length direction L is printed such that its end in the width direction W overlaps with the end in the width direction W of the conductive paste P1. The dielectric paste P2 extending in the width direction W, for example, has its central portion in the short side direction printed at a position that overlaps with the cutting line in the width direction W during the cutting process.

[0224] In this way, the ends of the portion of conductive paste P1 that becomes an internal electrode of an end face after the mother block is cut become an area that overlaps with dielectric paste P2 in the entire region of the width direction W.

[0225] In this case, in the multilayer ceramic capacitor, it is possible to make each end of the inner electrode of the first outermost end face closer to the first main surface AA in the length direction L, or to make each end of the inner electrode of the second outermost end face closer to the second main surface AB in the length direction L. Therefore, it is possible to reduce b1~b4 and c1~c4.

[0226] Furthermore, the portion of conductive paste P1 that becomes an internal electrode of an end face after the mother block is cut, with each end of its length direction L becoming its width direction W, overlaps with the dielectric paste P2 extending in the length direction L and the dielectric paste P2 extending in the width direction W.

[0227] In this case, in the multilayer ceramic capacitor, it is possible to make each end of the length direction L of the inner electrode of the first outermost end face closer to the width direction W of the inner electrode of the first outermost end face, or to make each end of the length direction L of the inner electrode of the second outermost end face closer to the width direction W of the inner electrode of the second outermost end face. Therefore, c1 to c4 can be further reduced.

[0228] Furthermore, the present invention includes the following combinations.

[0229] <1> A multilayer ceramic capacitor includes: a laminate containing a plurality of stacked dielectric layers and a plurality of internal electrodes respectively disposed on the plurality of dielectric layers, and having a first main surface and a second main surface opposite to each other in a stacking direction, a first side surface and a second side surface opposite to each other in a width direction orthogonal to the stacking direction, and a first end surface and a second end surface opposite to each other in a length direction orthogonal to the stacking direction and the width direction; end surface external electrodes, arranged in pairs on each of the end surfaces; and side surface external electrodes, arranged in pairs on each of the side surfaces, wherein the plurality of internal electrodes have end surface interiors exposed on both the first end surface and the second end surface. Electrodes, and side internal electrodes exposed on both the first and second side surfaces, wherein a reference line is defined as a straight line extending parallel to the stacking direction through the central portion of the length direction and the central portion of the width direction of the laminate; the end face internal electrode closest to the first main surface is defined as the first outermost end face internal electrode; the distance between the first outermost end face internal electrode and the first main surface on the reference line is defined as a1; and the distance between one end of each end of the first outermost end face internal electrode on the first end surface and the first main surface is defined as b1, where b1... <a1。

[0230] <2> according to <1> In the described multilayer ceramic capacitor, when the distance between the central portion of the inner electrode of the first outermost end face in the width direction and the first main surface is set as c1, b1≤c1.

[0231] <3> according to <1> or <2> In the described multilayer ceramic capacitor, when the inner electrode of the end face closest to the second main surface is designated as the inner electrode of the second outermost end face, and the distance between the inner electrode of the second outermost end face and the second main surface on the reference line is designated as a2, and the distance between one end of each end of the inner electrode of the second outermost end face on the first end face in the width direction and the second main surface is designated as b2, b2 <a2。

[0232] <4> according to <3> In the described multilayer ceramic capacitor, when the distance between the central portion of the inner electrode of the second outermost end face on the first end face in the width direction and the second main face is set as c2, b2≤c2.

[0233] <5> according to <1> to <4> In any of the following descriptions of a multilayer ceramic capacitor, when the distance between one end of each end of the inner electrode of the first outermost end face in the width direction on the second end face and the first main face is set as b3, b3 <a1。

[0234] <6> according to <5> In the described multilayer ceramic capacitor, when the distance between the central portion of the inner electrode of the first outermost end face on the second end face in the width direction and the first main face is set as c3, b3≤c3.

[0235] <7> according to <1> to <6> In any of the following descriptions of a multilayer ceramic capacitor, wherein the inner electrode of the end face closest to the second main surface is designated as the second outermost end face inner electrode, the distance between the second outermost end face inner electrode and the second main surface on the reference line is designated as a2, and the distance between one end of each end of the second outermost end face inner electrode in the width direction on the second end face and the second main surface is designated as b4, b4 <a2。

[0236] <8> according to <7> In the described multilayer ceramic capacitor, when the distance between the central portion of the inner electrode of the second outermost end face in the width direction and the second main surface is set as c4, b4≤c4.

[0237] <9> according to <1> to <8> In any of the following descriptions of a multilayer ceramic capacitor, wherein the inner electrode of the side closest to the first main surface is designated as the first outermost inner electrode, the distance between the first outermost inner electrode and the first main surface on the reference line is designated as a3, and the distance between one end of each end of the first outermost inner electrode along the length direction on the first side surface and the first main surface is designated as b5, b5 <a3。

[0238] <10> according to <9> In the described multilayer ceramic capacitor, when the distance between the central portion of the inner electrode of the first outermost side surface on the first side surface along the length direction and the first main surface is set to c5, b5≤c5.

[0239] <11> according to <9> or <10> In the described multilayer ceramic capacitor, when the inner electrode of the side closest to the second main surface is designated as the second outermost inner electrode, and the distance between the second outermost inner electrode and the second main surface on the reference line is designated as a4, and the distance between one end of each end of the second outermost inner electrode along the length direction on the first side surface and the second main surface is designated as b6, b6 <a4。

[0240] <12> according to <11> In the described multilayer ceramic capacitor, when the distance between the central portion of the inner electrode of the second outermost side surface on the first side surface and the second main surface is set as c6, b6≤c6.

[0241] <13> according to <9> to <12> In any of the following descriptions of a multilayer ceramic capacitor, wherein the inner electrode of the side closest to the first main surface is designated as the first outermost inner electrode, and the distance between one end of each end of the first outermost inner electrode along the length direction on the second side surface and the first main surface is defined as b7, b7 <a3。

[0242] <14> according to <13> The described multilayer ceramic capacitor, wherein when the distance between the central portion of the inner electrode of the first outermost side surface on the second side surface along the length direction and the first main surface is set as c7, d7≤c7.

[0243] <15> according to <9> to <14> In any of the following descriptions of a multilayer ceramic capacitor, wherein the inner electrode of the side closest to the second main surface is designated as the second outermost inner electrode, the distance between the second outermost inner electrode and the second main surface on the reference line is designated as a4, and the distance between one end of each end of the second outermost inner electrode along the length direction on the second side surface and the second main surface is designated as b8, b8 <a4。

[0244] <16> according to <15> In the described multilayer ceramic capacitor, when the distance between the central portion of the inner electrode of the second outermost side surface on the second side surface along the length direction and the second main surface is set to c8, b8 ≤ c8.

[0245] <17> A sort of <1> to <16> A multilayer ceramic capacitor as described in any one of the following claims comprises: a multilayer body including a plurality of stacked dielectric layers and a plurality of internal electrodes respectively disposed on the plurality of dielectric layers, and having a first main surface and a second main surface opposite to each other in the stacking direction, a first side surface and a second side surface opposite to each other in a width direction orthogonal to the stacking direction, and a first end surface and a second end surface opposite to each other in a length direction orthogonal to the stacking direction and the width direction; end surface external electrodes, arranged in pairs on each of the end surfaces; and side surface external electrodes, arranged in pairs on each of the side surfaces, wherein the plurality of internal electrodes have ends exposed on both the first end surface and the second end surface. The internal electrode and the internal electrodes exposed on both the first and second side surfaces are defined as follows: a reference line is defined as a straight line extending parallel to the stacking direction through the central portion of the length direction and the central portion of the width direction of the laminate; the internal electrode closest to the first main surface is defined as the first outermost internal electrode; the distance between the first outermost internal electrode and the first main surface on the reference line is defined as a3; and the distance between one end of each end of the first outermost internal electrode on the first side surface and the first main surface is defined as b5. <a3。

[0246] Explanation of reference numerals in the attached figures

[0247] 1. 100: Multilayer ceramic capacitor

[0248] 2, 102: Laminated body

[0249] 14: Dielectric layer

[0250] 15: Internal Electrodes

[0251] 3: External electrode on end face

[0252] 4: Side external electrode

[0253] 20, 120: Internal electrodes on the end face

[0254] 50, 150: Side internal electrodes

[0255] 20A, 120A: The inner electrode of the first outermost end face

[0256] 20B, 120B: Internal electrode of the second outermost end face

[0257] 50A, 150A: The inner electrode of the first outermost surface

[0258] 50B, 150B: Second outermost surface internal electrode

[0259] AA: 1st main side

[0260] AB: 2nd main side

[0261] BA: First side

[0262] BB: Second side

[0263] CA: First end face

[0264] CB: Second end face

[0265] SL: Baseline.

Claims

1. A multilayer ceramic capacitor comprising: a multilayer body including a plurality of dielectric layers stacked and a plurality of internal electrodes respectively arranged in the plurality of dielectric layers, and having a first main surface and a second main surface opposed in a stacking direction, a first side surface and a second side surface opposed in a width direction orthogonal to the stacking direction, and a first end surface and a second end surface opposed in a length direction orthogonal to the stacking direction and the width direction; end surface external electrodes arranged in pairs on each of the end surfaces; and side surface external electrodes arranged in pairs on each of the side surfaces, the plurality of internal electrodes having end surface internal electrodes exposed on both the first end surface and the second end surface, and side surface internal electrodes exposed on both the first side surface and the second side surface, wherein a straight line extending in parallel with the stacking direction through a central portion of the length direction of the multilayer body and a central portion of the width direction of the multilayer body is set as a reference line, the end surface internal electrode closest to the first main surface is set as a first outermost end surface internal electrode, a distance on the reference line between the first outermost end surface internal electrode and the first main surface is set as al, when a distance on the first end surface between one of end portions of the width direction of the first outermost end surface internal electrode and the first main surface is set as bl, bl < al.

2. The multilayer ceramic capacitor according to claim 1, wherein when a distance on the first end surface between a central portion of the width direction of the first outermost end surface internal electrode and the first main surface is set as cl, bl < cl.

3. The multilayer ceramic capacitor according to claim 1 or 2, wherein the end surface internal electrode closest to the second main surface is set as a second outermost end surface internal electrode, a distance on the reference line between the second outermost end surface internal electrode and the second main surface is set as a2, when a distance on the first end surface between one of end portions of the width direction of the second outermost end surface internal electrode and the second main surface is set as b2, b2 < a2.

4. The multilayer ceramic capacitor according to claim 3, wherein when a distance on the first end surface between a central portion of the width direction of the second outermost end surface internal electrode and the second main surface is set as c2, b2 < c2.

5. The multilayer ceramic capacitor according to any one of claims 1 to 4, wherein when a distance on the second end surface between one of end portions of the width direction of the first outermost end surface internal electrode and the first main surface is set as b3, b3 < al.

6. The multilayer ceramic capacitor according to claim 5, wherein when a distance on the second end surface between a central portion of the width direction of the first outermost end surface internal electrode and the first main surface is set as c3, b3 < c3.

7. The multilayer ceramic capacitor according to any one of claims 1 to 6, wherein the end surface internal electrode closest to the second main surface is set as a second outermost end surface internal electrode, ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ a2 is the distance from the second outermost end surface inner electrode on the reference line to the second main surface, b4 is the distance from one of the end portions in the width direction of the second outermost end surface inner electrode on the second end surface to the second main surface, b4 < a2.

8. The multilayer ceramic capacitor according to claim 7, wherein c4 is the distance from the central portion in the width direction of the second outermost end surface inner electrode on the second end surface to the second main surface, b4 < c4.

9. The multilayer ceramic capacitor according to any one of claims 1 to 8, wherein the side surface inner electrode closest to the first main surface is a first outermost side surface inner electrode, a3 is the distance from the first outermost side surface inner electrode on the reference line to the first main surface, b5 is the distance from one of the end portions in the length direction of the first outermost side surface inner electrode on the first side surface to the first main surface, b5 < a3.

10. The multilayer ceramic capacitor according to claim 9, wherein c5 is the distance from the central portion in the length direction of the first outermost side surface inner electrode on the first side surface to the first main surface, b5 < c5.

11. The multilayer ceramic capacitor according to claim 9 or 10, wherein the side surface inner electrode closest to the second main surface is a second outermost side surface inner electrode, a4 is the distance from the second outermost side surface inner electrode on the reference line to the second main surface, b6 is the distance from one of the end portions in the length direction of the second outermost side surface inner electrode on the first side surface to the second main surface, b6 < a4.

12. The multilayer ceramic capacitor according to claim 11, wherein c6 is the distance from the central portion in the length direction of the second outermost side surface inner electrode on the first side surface to the second main surface, b6 < c6.

13. The multilayer ceramic capacitor according to any one of claims 9 to 12, wherein the side surface inner electrode closest to the first main surface is a first outermost side surface inner electrode, b7 is the distance from one of the end portions in the length direction of the first outermost side surface inner electrode on the second side surface to the first main surface, b7 < a3.

14. The multilayer ceramic capacitor according to claim 13, wherein c7 is the distance from the central portion in the length direction of the first outermost side surface inner electrode on the second side surface to the first main surface, d7 < c7.

15. The multilayer ceramic capacitor according to any one of claims 9 to 14, wherein the side surface inner electrode closest to the second main surface is a second outermost side surface inner electrode, a4 is the distance from the second outermost side surface inner electrode on the reference line to the second main surface, When a distance of one of each end portion in the length direction of the second outermost side internal electrode on the second side surface from the second main surface is set as b8, b8 < a4.

16. The multilayer ceramic capacitor according to claim 15, wherein When a distance of a central portion in the length direction of the second outermost side internal electrode on the second side surface from the second main surface is set as c8, b8 < c8.

17. The multilayer ceramic capacitor according to any one of claims 1 to 16, comprising: a laminate including a plurality of dielectric layers laminated, and a plurality of internal electrodes respectively arranged in the plurality of dielectric layers, and having a first main surface and a second main surface opposite in a laminating direction, a first side surface and a second side surface opposite in a width direction orthogonal to the laminating direction, and a first end surface and a second end surface opposite in a length direction orthogonal to the laminating direction and the width direction; an end surface external electrode arranged in pairs on each of the end surfaces; and a side surface external electrode arranged in pairs on each of the side surfaces, the plurality of internal electrodes have an end surface internal electrode exposed on both of the first end surface and the second end surface, and a side surface internal electrode exposed on both of the first side surface and the second side surface, wherein a straight line extending in parallel to the laminating direction through a central portion in the length direction of the laminate and a central portion in the width direction of the laminate is set as a reference line, the side surface internal electrode closest to the first main surface is set as a first outermost side internal electrode, a distance of the first outermost side internal electrode from the first main surface on the reference line is set as a3, when a distance of one of each end portion in the length direction of the first outermost side internal electrode on the first side surface from the first main surface is set as b5, b5 < a3.

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