Electronic device comprising at least one light source and heat dissipation structure

Abstract

An electronic device is provided. The electronic device may include a cover including a first surface and a second surface, the first surface being a part of an outer surface of the electronic device, the second surface facing in a direction opposite to the first surface and including a light transmissive portion; a substrate disposed in an internal space of the electronic device; a light source disposed on the substrate and irradiating light to the light transmitting portion; and a heat sink attached to the second surface of the cover so as to surround at least a portion of the light transmitting portion on the second surface of the cover, and including a heat diffusion member and a light reflecting member.

Description

Technical Field

[0001] This disclosure relates to an electronic device including at least one light source and a heat dissipation structure for the at least one light source. Background Technology

[0002] With the development of information and communication technologies and semiconductor technology, various functions are packaged into a portable electronic device (e.g., a smartphone). For example, electronic devices can not only perform communication functions, but also entertainment functions (such as playing games), multimedia functions (such as playing music and videos), communication and security functions for mobile banking, camera functions for capturing images / videos, and calendar or e-wallet functions. These electronic devices are miniaturized for easy carrying by users.

[0003] Portable electronic devices can include flashlights for various purposes (such as flashlights used in emergency situations), sending / receiving messages (such as calls or texts), and / or displaying notifications (such as alarms). Such flashlights typically include light-emitting diodes (LEDs) and may be referred to as flash LEDs, and may have a light-emitting principle based on the electroluminescence effect. Flash LEDs in portable electronic devices can cause localized heating that could potentially lead to safety hazards. Therefore, performance standards for such products are constantly rising. During a predetermined period after the flash LED is turned on, the ambient temperature may rise to 45 degrees Celsius. This necessitates the use of means to monitor and control the temperature of the flash LED.

[0004] The above information is presented as background information only to aid in understanding this disclosure. No determination or assertion is made regarding whether any of the above content can be used as prior art in relation to this disclosure. Summary of the Invention

[0005] The aspects of this disclosure will at least solve the above-mentioned problems and / or disadvantages, and provide at least the following advantages. Therefore, one aspect of this disclosure is to provide an electronic device comprising at least one light source and a heat dissipation structure for the at least one light source.

[0006] Additional aspects will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practice of the embodiments presented.

[0007] According to one aspect of this disclosure, an electronic device is provided. The electronic device includes: a cover including a first surface and a second surface, and including a light-transmitting portion, the first surface being part of an outer surface of the electronic device, and the second surface facing in a direction opposite to the first surface; a substrate disposed in an internal space of the electronic device; a light source disposed on the substrate to emit light through the light-transmitting portion; and a heat sink attached to the second surface of the cover to surround at least a portion of the light-transmitting portion, wherein the heat sink includes a heat-diffusing member and a light-reflecting member.

[0008] According to another aspect of this disclosure, an electronic device is provided. The electronic device includes: a cover including a first surface and a second surface, and including a light-transmitting portion, the first surface being part of an outer surface of the electronic device, and the second surface facing a direction opposite to the first surface; a substrate disposed in an internal space of the electronic device; a light source disposed on the substrate to emit a flash of light through the light-transmitting portion; and a light-reflecting member disposed on the second surface of the cover to surround at least a portion of the light-transmitting portion, wherein the light-reflecting member is configured to reflect a portion of the flash of light emitted by the light source in a direction from the cover toward the internal space.

[0009] According to another aspect of this disclosure, an electronic device is provided. The electronic device includes: a cover including a first surface and a second surface facing in a direction opposite to the first surface, wherein a portion of the cover includes a light-transmitting portion; a substrate disposed in an internal space of the electronic device; at least one light source disposed on the substrate to emit light through the light-transmitting portion; and a heat sink disposed on the second surface of the cover surrounding at least a portion of the light-transmitting portion, wherein the heat sink includes a heat-insulating member and a light-reflecting member, and wherein the heat sink is attached to the second surface of the cover.

[0010] Other aspects, advantages, and distinctive features of this disclosure will become apparent to those skilled in the art from the following detailed description of various embodiments of the disclosure taken in conjunction with the accompanying drawings. Attached Figure Description

[0011] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0012] Figure 1 This is a view illustrating an electronic device in a network environment according to an embodiment of the present disclosure;

[0013] Figure 2 This is a view showing the unfolded state of an electronic device according to an embodiment of the present disclosure;

[0014] Figure 3 This is a view showing the folded state of an electronic device according to an embodiment of the present disclosure;

[0015] Figure 4 This is a cross-sectional view showing an electronic device including at least one light source and a heat sink according to an embodiment of the present disclosure;

[0016] Figure 5 This is a view showing a heat sink according to an embodiment of the present disclosure;

[0017] Figure 6 This is a view showing a heat sink according to an embodiment of the present disclosure;

[0018] Figure 7 This is a view showing the state of a heat sink surrounding at least one light source according to an embodiment of the present disclosure;

[0019] Figure 8 This is a view showing the state of a heat sink surrounding at least one light source according to an embodiment of the present disclosure;

[0020] Figure 9 This is a view showing the state of a heat sink surrounding at least one light source according to an embodiment of the present disclosure;

[0021] Figure 10 This is a view showing the state of light emitted from at least one light source reaching surrounding components according to an embodiment of the present disclosure;

[0022] Figure 11 This is a view showing the state of light emitted from at least one light source reaching surrounding components according to an embodiment of the present disclosure;

[0023] Figure 12 This is a view illustrating the arrangement of components included in a heat sink according to an embodiment of the present disclosure;

[0024] Figure 13 According to embodiments of this disclosure Figure 12 Side view;

[0025] Figure 14 This is a view illustrating the arrangement of components included in a heat sink according to an embodiment of the present disclosure;

[0026] Figure 15 According to embodiments of this disclosure Figure 14 Side view;

[0027] Figure 16 This is a view showing the surface temperature of an electronic device according to an embodiment of the present disclosure; and

[0028] Figure 17 This is a view showing the surface temperature of an electronic device according to an embodiment of the present disclosure.

[0029] Throughout the accompanying drawings, the same reference numerals will be understood to refer to the same parts, components, and structures. Detailed Implementation

[0030] The following description with reference to the accompanying drawings is provided to aid in a full understanding of the various embodiments of this disclosure as defined by the claims and their equivalents. It includes various specific details to aid understanding, but these are merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the various embodiments described herein without departing from the scope and spirit of this disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and structures may be omitted.

[0031] The terms and words used in the following description and claims are not limited to their literal meaning, but are used by the inventors only to enable a clear and consistent understanding of this disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of this disclosure is provided for illustrative purposes only and is not intended to limit the disclosure as defined by the appended claims and their equivalents.

[0032] It will be understood that, unless the context clearly specifies otherwise, the singular forms “a,” “an,” and “the” include plural indicators. Thus, for example, a reference to “component surface” includes a reference to one or more such surfaces.

[0033] A thermistor can be placed around the flashing LED and its surroundings to monitor the temperature of the flashing LED. After monitoring the temperature of the flashing LED, it may be necessary to investigate the means to control it.

[0034] Previous research on dissipating heat generated in electronic devices primarily focused on reducing resistive heat generated in processors (e.g., application processors), power management modules, and / or camera modules. In other words, there were shortcomings in the design of radiative heat dissipation for flash LEDs.

[0035] As the brightness of the light source increases, the flashing LED emits more radiant energy, which may cause the temperature of the electronic device's cover to rise. In particular, in the case of electronic devices with a structure in which the flashing LED is positioned adjacent to the cover, heat energy accumulates in the cover of the electronic device and remains in a saturated state, which may cause inconvenience to the user.

[0036] In the following, various embodiments for solving the LED heat generation problem can be provided in electronic devices having structures such as flashing LEDs. In this disclosure, the aforementioned problem can be solved by providing an electronic device comprising at least one light source and a heat sink.

[0037] The following description, taken in conjunction with the accompanying drawings, provides an understanding of various embodiments of this disclosure, including the claims and their equivalents. The specific embodiments disclosed in the following description require various specific details to aid understanding, but are considered as one of many embodiments. Therefore, those skilled in the art will understand that various changes and modifications can be made to the various embodiments described in this disclosure without departing from the scope and spirit of this disclosure. Furthermore, for clarity and brevity, descriptions of well-known functions and constructions may be omitted.

[0038] The terms and words used in the following description and claims are not limited to their literal meaning, but are intended to clearly and consistently describe embodiments of this disclosure. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of this disclosure is provided for descriptive purposes only and is not intended to limit the scope of this disclosure as defined by the claims and their equivalents.

[0039] It will be understood that the boxes in each flowchart and the combination of flowcharts can be executed by one or more computer programs including instructions. The entirety of the one or more computer programs can be stored in a single memory device, or the one or more computer programs can be divided into different parts stored in multiple different memory devices.

[0040] Any of the functions or operations described herein can be processed by a processor or a combination of processors. The processor or combination of processors is a circuit that performs the processing and includes circuitry such as: an application processor (AP, e.g., a central processing unit (CPU)), a communication processor (CP, e.g., a modem), a graphics processing unit (GPU), a neural processing unit (NPU) (e.g., an artificial intelligence (AI) chip), a Wi-Fi chip, and Bluetooth. ® Chips, Global Positioning System (GPS) chips, Near Field Communication (NFC) chips, connectivity chips, sensor controllers, touch controllers, fingerprint sensor controllers, display driver integrated circuits (ICs), audio codec chips, Universal Serial Bus (USB) controllers, camera controllers, image processing ICs, microprocessor units (MPUs), system-on-a-chip (SoCs), integrated circuits (ICs), etc.

[0041] Figure 1 This is a diagram illustrating an electronic device in a network environment according to an embodiment of the present disclosure.

[0042] Reference Figure 1In network environment 100, electronic device 101 can communicate with at least one of electronic devices 102 via a first network 198 (e.g., a short-range wireless communication network), or with electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In an embodiment, at least one of the components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. According to an embodiment, some of the components (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0043] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the result data in non-volatile memory 134. According to an embodiment, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be configured to use less power than the main processor 121, or may be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0044] When the main processor 121 is inactive (e.g., in sleep) state, the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0045] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0046] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0047] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0048] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0049] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of the force generated by the touch.

[0050] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0051] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0052] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0053] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0054] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0055] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0056] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0057] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0058] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules may communicate with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a fifth-generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network (LAN) or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 may use user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196 to identify or verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199).

[0059] Wireless communication module 192 can support 5G networks beyond fourth-generation (4G) networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0060] Antenna module 197 can transmit or receive signals or power to or from an external source (e.g., an external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiator formed of a conductor or conductive pattern on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190. Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, other components besides the radiator (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of antenna module 197.

[0061] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0062] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0063] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. External electronic devices 102 or 104 can be devices of the same type as electronic device 101, or devices of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0064] Figure 2 This is a view showing the unfolded state of an electronic device according to an embodiment of the present disclosure. Figure 3 This is a view showing the folded state of an electronic device according to an embodiment of the present disclosure.

[0065] Figure 2 and Figure 3 The electronic device 101 may be constructed wholly or partially with Figure 1 The electronic device 101 has the same structure.

[0066] Figure 2 and Figure 3 The embodiments can be related to Figure 1Implementation examples or Figures 4 to 15 Examples of combinations.

[0067] Reference Figure 2 As shown in the accompanying drawings, the length direction of electronic device 101 can be defined as the "Y-axis direction," the width direction can be defined as the "X-axis direction," and / or the height direction (thickness direction) can be defined as the "Z-axis direction." In the following detailed description, the references to length, width, and / or height (or thickness) directions may indicate the length, width, and / or height (or thickness) directions of electronic device 10. In embodiments, "negative / positive (- / +)" may be mentioned in conjunction with the Cartesian coordinate system illustrated in the drawings regarding the orientation of the components. Although not explicitly stated in the drawings... Figure 2 As shown, however, the arrangement of components or one component in the height direction, that is, the reference for whether one component is on or below another component, can follow the +Z axis direction / -Z axis direction.

[0068] Reference Figure 2 and Figure 3 The electronic device 101 may include a housing 202 for accommodating components of the electronic device 101 and a flexible display (hereinafter, display 230) disposed in the space formed by the housing 202. According to an embodiment, the housing 202 may be referred to as a foldable housing. According to an embodiment, the display 230 may be referred to as a foldable display.

[0069] According to an embodiment, housing 202 may include a first housing 210 and a second housing 220 configured to rotate about the first housing 210.

[0070] According to an embodiment, the first housing 210 and / or the second housing 220 may form part of the appearance of the electronic device 101. According to an embodiment, the visually exposed surface of the display 230 may be defined as the front surface of the electronic device 101 and / or housing 202 (e.g., the first front surface 210a and the second front surface 220a). The surface opposite to the front surface may be defined as the rear surface of the electronic device 101 (e.g., the first rear surface 210b and the second rear surface 220b). Surfaces surrounding at least a portion of the space between the front and rear surfaces may be defined as the side surfaces of the electronic device 101 (e.g., the first side surface 210c and the second side surface 220c).

[0071] According to an embodiment, the first housing 210 can be connected to the second housing 220 using a hinge structure to be rotatable about the second housing 220. For example, the first housing 210 and the second housing 220 can be connected to each other to be rotatable about the hinge structure. Therefore, the electronic device 101 can be folded (e.g., Figure 3 ) or unfolded state (e.g., Figure 2In the folded state of the electronic device 101, the first front surface 210a may face the second front surface 220a. In the unfolded state, the direction in which the first front surface 210a faces may be substantially the same as the direction in which the second front surface 220a faces. For example, in the unfolded state, the first front surface 210a may be positioned on a plane substantially the same as the second front surface 220a. According to an embodiment, the second housing 220 may be able to move relative to the first housing 210.

[0072] According to an embodiment, the first housing 210 and the second housing 220 can be disposed on both sides of the folding axis A, and are generally symmetrical in shape with respect to the folding axis A. The angle between the first housing 210 and the second housing 220 can be changed depending on whether the electronic device 101 is in an unfolded state, a folded state, or an intermediate state between the unfolded and folded states.

[0073] According to an embodiment, the electronic device 101 may include a hinge cover 240. At least a portion of the hinge cover 240 may be disposed between the first housing 210 and the second housing 220. According to an embodiment, the hinge cover 240 may be covered by a portion of the first housing 210 and the second housing 220, or may be exposed to the outside depending on the state of the electronic device 101. According to an embodiment, the hinge cover 240 may protect the hinge structure from external impacts to the electronic device 101. According to an embodiment, the hinge cover 240 may be interpreted as a hinge housing for protecting the hinge structure.

[0074] According to the embodiments, such as Figure 2 As shown, in the unfolded state of the electronic device 101, the hinge cover 240 can be covered by the first housing 210 and the second housing 220, and is therefore not exposed. As another example, such as... Figure 3 As shown, in the folded state (e.g., fully folded state) of the electronic device 101, the hinge cover 240 may be exposed to the outside between the first housing 210 and the second housing 220. As another example, in an intermediate state where the first housing 210 and the second housing 220 are folded at an angle, the hinge cover 240 may be partially exposed to the outside between the first housing 210 and the second housing 220. However, in this case, the exposed area may be smaller than in the fully folded state. In embodiments, the hinge cover 240 may include a curved surface.

[0075] According to an embodiment, display 230 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display 230 may include, for example, a holographic device or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display 230 may include a touch sensor configured to detect touch, or a pressure sensor configured to measure the intensity of the force generated by a touch.

[0076] According to an embodiment, display 230 may refer to a display whose at least a portion can be transformed into a flat surface or a curved surface. For example, display 230 may be configured to be deformable in response to movement of the second housing 220 relative to the first housing 210. According to an embodiment, display 230 may include a folding region 233, a first display region 231 disposed on one side of the folding region 233 (e.g., in the upper (+Y) direction), and a second display region 232 disposed on the other side of the folding region 233 (e.g., in the lower (-Y) direction). According to an embodiment, the folding region 233 may be located above a hinge structure. For example, at least a portion of the folding region 233 may face the hinge structure. According to an embodiment, the first display region 231 may be disposed on the first housing 210, and the second display region 232 may be disposed on the second housing 220. According to an embodiment, display 230 may be housed within the first housing 210 and the second housing 220.

[0077] However, as Figure 2 The division of the display 230 shown is merely an example. Depending on the structure or function of the display 200, the display 230 may be divided into multiple (e.g., four or more, or two) areas.

[0078] In addition, Figure 2 In the illustrated embodiment, the area of ​​display 230 may be divided by folded region 233 or a folding axis (axis A) extending parallel to the X-axis. However, according to another embodiment of this disclosure, display 230 may also be divided relative to other folded regions (e.g., folded regions parallel to the Y-axis) or other folding axes (e.g., folding axes parallel to the Y-axis). According to embodiments, display 230 may be coupled to or disposed adjacent to touch detection circuitry, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digital converter for detecting a magnetic field stylus.

[0079] According to an embodiment, electronic device 101 may include a rear display 234. The rear display 234 may be configured to face a different direction than display 230. For example, display 230 may be visually exposed through the front surface of electronic device 101 (e.g., a first front surface 210a and / or a second front surface 220a), and rear display 234 may be visually exposed through the rear surface of electronic device 101 (e.g., a first rear surface 210b).

[0080] According to an embodiment, electronic device 101 may include at least one camera module 204 and 206 and a flash 208. According to an embodiment, electronic device 101 may include a front-facing camera module 204 exposed via a front surface (e.g., a first front surface 210a) and / or a rear-facing camera module 206 exposed via a rear surface (e.g., a first rear surface 210b). Camera modules 204 and 206 may include one or more lenses, an image sensor, a flash, and / or an image signal processor. Flash 208 may include a light-emitting diode (LED) or a xenon lamp. According to an embodiment, two or more lenses (e.g., infrared (IR) cameras, wide-angle lenses, and telephoto lenses) and an image sensor may be disposed on one surface of electronic device 101. The configuration of the front-facing camera module 204 and / or the rear-facing camera module 206 may be wholly or partially related to... Figure 1 The camera module 180 has the same structure.

[0081] The following is for reference Figures 4 to 15 The embodiments are described in detail, including the structure of an electronic device with at least one light source and a heat sink, as well as the arrangement of the components.

[0082] Figure 4 This is a cross-sectional view showing an electronic device including at least one light source and a heat sink according to an embodiment of the present disclosure. Figure 4 It can be shown that includes Figure 2 and Figure 3 The cross-section of the flash lamp 208 in the electronic device 101 and the electronic device of the adjacent components.

[0083] Reference Figure 4 The subsequent diagram shows direction components ①, ②, and ③. Direction components ①, ②, and ③ are orthogonal to each other and can be respectively associated with... Figure 2 The coordinate axes are Y, Z, and X, but not limited to them. According to embodiments, direction components ①, ②, and ③ can be interpreted as facing directions different from the coordinate axes Y, Z, and X. When one element is positioned above another element, it can mean that the element is positioned above the other element in direction component ②; when one element is positioned below another element, it can mean that the element is positioned below the other element in direction component ②. It should also be noted that although one component is positioned above or below another component, it does not necessarily mean that the entire component is positioned above or below the entire other component. For example, it should be noted that a portion of the component may be positioned on a portion of the other component, and another portion of the component may be positioned below another portion of the other component. In the following description, it should be noted that the above description of the arrangement relationship in the height direction can be applied when one component overlaps (or stacks on) another component.

[0084] Electronic device 300 may include cover 310.

[0085] Cover 310 can be a reference above the limit. Figure 2 and Figure 3 The described electronic device 101 and / or housing 202 are elements of the front surface (e.g., the first front surface 210a and the second front surface 220a). Alternatively, the cover 310 may be an element defined by the above references. Figure 2 and Figure 3 The described electronic device 101 and / or housing 202 are elements of the rear surface (e.g., the first rear surface 210b and the second rear surface 220b). According to various embodiments, the cover 310 may be an element defining the side surfaces of the electronic device 101 and / or housing 202. In the following description of various embodiments of this disclosure, reference may be made to... Figures 2 to 4 The cover 310 that defines the rear surface of the electronic device 101 is described as an example.

[0086] Cover 310 may be formed of a glass plate or a resin (or polymer) plate. In addition to cover 310, the housing may also include a substantially opaque plate, but its detailed description may be omitted. The glass plate may be a glass plate including various coatings, such as coated or tinted glass. According to embodiments, the glass plate may be window glass to protect the display from external physical / chemical impacts. At least a portion of the polymer plate may be a transparent polymer plate. The polymer plate may include, for example, materials based on polycarbonate, polysulfone, polyacrylate, polystyrene, polyvinyl chloride, polyvinyl alcohol, polynorbornene, and polyester.

[0087] When the cover 310 is transparent, the internal components of the electronic device may be wholly or partially exposed to the outside. This can be a factor that reduces the aesthetics of the electronic device. Therefore, an anti-visibility sheet 380 can be formed on the rear surface of the cover 310 to prevent the internal components of the electronic device from being visually exposed to the outside. The anti-visibility sheet 380 may be, for example, a masking film and / or a masking strip, and may be coated with a material for preventing visibility or colored for privacy.

[0088] Within the internal space S of the electronic device, various components 360, components for supporting said components (e.g., at least one support member (hereinafter referred to as "at least one bracket 320")), and fastening members F for fastening any component to another component may be provided.

[0089] The various components 360 disposed within the internal space S of the electronic device can be diverse, such as processors (e.g., one or more of a central processing unit, application processor, graphics processing unit, image signal processor, sensor hub processor, or communication processor), memory, power management module, battery, communication module, audio module, and various sensors. The various components 360 may include printed circuit boards (e.g., substrate 330) on which various signal lines are routed. Figure 4 At least one light source 350, a sensor 361, and an audio module 362 are shown as examples of various components 360. However, this disclosure is not limited thereto, and other components may be added or omitted depending on the embodiment.

[0090] At least one bracket 320 may be disposed within the internal space S of the electronic device to connect to the housing and / or cover 310 of the electronic device 300, or may be integrally formed with the housing and / or cover 310. At least one bracket 320 may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. At least one bracket 320 may include, for example, a first bracket 320-1, a second bracket 320-2, and a third bracket 320-3. According to embodiments, the electronic device may omit at least one of these components (e.g., the second bracket 320-2 or the third bracket 320-3), or may further include other components. A printed circuit board 330 may be disposed on at least one of the at least one bracket 320, for example, on one surface of the first bracket 320-1.

[0091] Reference Figure 4 An embodiment is shown in which multiple components are disposed on a printed circuit board 330. For example, as multiple components, at least one light source 350 and a sensor 361 may be disposed on a first surface 330a of the printed circuit board 330. A second surface 330b of the printed circuit board 330 may be disposed on a surface of a first support 320-1. As another example, a lens structure 331 may be disposed on the printed circuit board 330. The lens structure 331 may include a lens for refracting light, such that light emitted from at least one light source 350 is moved toward a predetermined angle while passing through the lens structure 331. For example, the lens structure 331 may include a Fresnel lens.

[0092] The electronic device 300 may emit light to the outside of the electronic device 300 using at least one light source 350. For example, the electronic device may emit light from at least one light source 350 for various purposes, such as using it as a flashlight in an emergency, or sending / receiving messages (such as telephone calls, text messages) and / or displaying notifications (such as alarms). The light emitted from at least one light source 350 may diffuse radially from at least one light source 350 and then bend at a specified angle as it passes through lens structure 331.

[0093] The cover 310 may include a light-transmitting portion 310c for transmitting light emitted from at least one light source 350 to the outside, and the light-transmitting portion 310c may be aligned such that its center matches the center of at least one light source 350. The light emitted from at least one light source 350 is designed to diffuse through the light-transmitting portion 310c while having a predetermined viewing angle (hereinafter referred to as...). Figure 5 and Figure 6 (Angle α). Light emitted from at least one light source 350 reaches the cover 310 surrounding the light-transmitting portion 310c. However, since the cover 310 surrounding the light-transmitting portion 310c is opaque, light energy can accumulate and the temperature of the cover 310 can rise.

[0094] To reduce the radiated energy accumulated in the cover 310 during this operation, a heat sink 370 may be additionally provided on the rear surface (or lower part) of the cover 310 in this disclosure. The heat sink 370 may be configured to surround at least a portion of the light-transmitting portion 310c.

[0095] According to an embodiment, the light-transmitting portion 310c of the cover 310 may include an opening 310d extending from a first surface 310a of the cover 310 to a second surface 310b. In this case, the electronic device 300 may further include a dustproof and / or waterproof structure that prevents foreign objects or moisture from entering from the outside through the opening 310d.

[0096] In the following text, refer to Figure 5 and Figure 6 The embodiment describes the heat sink 370 in detail.

[0097] Figure 5 This is a view showing a heat sink according to an embodiment of the present disclosure. Figure 6 This is a view showing a heat sink according to an embodiment of the present disclosure.

[0098] Reference Figure 5 and Figure 6The heat sink 370 may include a heat diffusion member 372 and a light reflection member 373. The heat sink 370 may be attached to the second surface 310b of the cover 310. The heat sink 370 may be attached to the second surface 310b of the cover 310 using a first adhesive member 371. As described above, a privacy screen 380 may be provided on the second surface 310b of the cover 310. In this case, the heat sink 370 may be disposed on the rear surface (lower part) of the privacy screen 380. The heat sink 370 may be a structure in which the first adhesive member 371, the heat diffusion member 372, and the light reflection member 373 are stacked. For example, the heat sink 370 may be attached to the cover 310 using the first adhesive member 371 and may have a structure in which the heat diffusion member 372 and the light reflection member 373 are sequentially stacked on the first adhesive member 371. (See also...) Figure 4 and Figure 5 When the heat sink 370 is disposed on the rear surface of the cover 310, the heat sink 370 can at least partially overlap with the printed circuit board 330 on which at least one light source 350 is disposed, and the light reflecting member 373 can face the first surface 330a of the printed circuit board 330. The light reflecting member 373 is disposed at a position where light emitted from at least one light source 350 is incident obliquely relative to the light reflecting member 373, such that light can be reflected away from the light transmission portion 310c.

[0099] The first adhesive member 371 can be used to attach the heat diffusion member 372 to the rear surface of the cover 310. The first adhesive member 371 may include, for example, optically clear adhesive (OCA), optically clear resin (OCR), and / or pressure-sensitive adhesive (PSA).

[0100] The heat diffusion member 372 is a structure configured to overlap and / or stack with the light reflecting member 373, and can be used to reduce and / or prevent energy accumulated when the light reflecting member 373 reflects light from the concentration at a single point on the housing and / or cover 310, and to diffuse energy. The heat diffusion member 372 may include a heat diffusion material. Various materials (e.g., graphite) can be used as heat diffusion materials. However, this is merely an example, and it should be noted that the heat diffusion member 372 may additionally or alternatively include highly thermally conductive materials such as solid-phase or liquid-phase thermal interface materials (TIMs), graphite, carbon nanotubes, silicon, etc.

[0101] According to embodiments, in addition to or as a replacement for the heat diffusion member 372, an insulation material may be further included. The insulation material can block energy accumulated when light is reflected by the light reflecting member 373 from reaching the housing and / or cover 310. Various materials, such as Poron™, cork, magnesium powder, calcium silicate, perlite, aluminum foil, or porous refractory materials, can be used as the insulation material. However, the type of insulation material is not limited and may vary depending on the embodiment. According to embodiments of this disclosure, since an insulation material may be provided in addition to or as a replacement for the heat diffusion member, the heat diffusion member may be referred to as a heat diffusion member and / or insulation material.

[0102] The light-reflecting component 373 can be an assembly for reflecting light emitted from at least one light source 350, and may include at least one of, for example, a light-reflecting film, a light-reflecting strip, and a reflector. According to Figure 6 In the illustrated embodiment, a second adhesive member 374 may be provided between the heat diffusion member and the light reflection member to securely bond at least one of the light reflection film, light reflection strip, and reflector to the heat diffusion member 372. In this case, the material of the second adhesive member 374 may be the same as the material of the first adhesive member 371. In addition to the embodiments described above, the light reflection member 373 may be formed by applying a light reflection material to the heat diffusion member.

[0103] According to various embodiments of this disclosure, radiant energy transmitted from at least one light source 350 can be diffused due to the stacked structure of the light reflecting member 373 and the heat diffusion member 372. In this case, the efficiency of diffusing radiant energy (i.e., heat diffusion performance) can vary depending on the material and / or color of the light reflecting member 373 and the material and / or thickness of the heat diffusion member 372.

[0104] For example, when the light-reflecting member 373 is formed of a film and the heat-diffusing member 372 comprises graphite with a predetermined thickness, the difference in heat diffusion performance based on the color of the light-reflecting member 373 can be identified with reference to Table 1 below. As a comparative example of the difference in heat diffusion performance based on the color of the light-reflecting member 373, embodiments using a heat sink without a light-reflecting member (e.g., Embodiment 1) and embodiments using a reflector as the light-reflecting member 373 (e.g., Embodiment 5) are further disclosed. The difference in heat diffusion performance compared to measuring the temperature of the cover 310 without the heat sink 370 can be expressed as the result of measuring the temperature of the cover 310 at the location where the heat sink 370 is provided.

[0105] Table 1

[0106]

[0107] As shown in Table 1, even when graphite is used as the heat diffusion member 372, the temperature decreases by 1 degree when the light reflection member 373 is black (absorbing heat), by 2.5 degrees when only graphite is used as the heat diffusion member 372, by 4.5 degrees when the light reflection member 373 is gray, and by 6 degrees when the light reflection member 373 is white (reflecting heat). In the case where the light reflection member 373 is a mirror formed of a material that completely reflects heat, the temperature decreases by 6.5 degrees, the largest decrease. Therefore, as shown in Table 1, by appropriately adjusting the material and / or color of the light reflection member 373 and the material and / or thickness of the heat diffusion member 372, the temperature of the cover 310 can be significantly reduced at the location where the heat sink 370 is installed. In this disclosure, by including references... Figures 4 to 6 The heat sink 370 can effectively solve the LED heat dissipation problem described in the background section. Various embodiments related to the heat sink 370 are described in detail below.

[0108] Figure 7 This is a view showing the state of a heat sink surrounding at least one light source according to an embodiment of the present disclosure. Figure 8 This is a view showing the state of a heat sink surrounding at least one light source according to an embodiment of the present disclosure. Figure 9 This is a view showing the state of a heat sink surrounding at least one light source according to an embodiment of the present disclosure.

[0109] Figure 7 and Figure 8 It shows when in Figure 2 and Figure 3 In the illustrated embodiment, the state of the components inside the electronic device is observed when the cover on the rear surface 210b is removed. Figure 9 The second surface of the cover is shown in its observed state. (Refer to...) Figure 7 and Figure 9 The heat sink 370 may have a shape that generally surrounds at least one light source 350. (See reference...) Figure 8 The heat sink 370 may partially surround at least one light source 350.

[0110] The heat sink 370 may include a first portion surrounding at least a portion of the light-transmitting portion and a second portion 370b extending from the first portion 370a. (See reference...) Figure 7When viewed from above, the first portion 370a of the heat sink 370 appears to surround the entirety of at least one light source 350. The second portion 370b is a portion extending to one side from the first portion 370a, and according to an embodiment, may have a larger area than the first portion 370a in the heat sink 370. According to an embodiment, the second portion 370b may be positioned facing at least one support (e.g., a first support 320-1). Because the heat sink 370 includes the first portion 370a and the second portion 370b, heat concentration around the light-transmitting portion can be reduced and / or prevented. In the following text, as shown below... Figure 17 As described in the illustrated embodiment, when the second portion 370b is positioned facing upwards toward at least one support (e.g., the first support 320-1), heat can be dispersed toward the second portion 370b.

[0111] Reference Figure 8 When viewed from above, the first portion 371 of the heat sink 370 is shown as only surrounding a portion of the heat sink 370 and not the entirety surrounding at least one light source 350. This could be a design of the heat sink 370 that allows it to have predetermined tolerances without interfering with components positioned around the at least one light source 350.

[0112] according to Figure 9 In another embodiment shown, the heat sink 370 may have a shape that surrounds only the light-transmitting portion 310c. In this case, the second portion 370b of the heat sink 370 facing above at least one support (e.g., the first support 320-1) may be omitted.

[0113] Figure 10 This is a view showing the state of light emitted from at least one light source reaching surrounding components according to an embodiment of the present disclosure. Figure 11 This is a view showing the state of light emitted from at least one light source reaching surrounding components according to an embodiment of the present disclosure.

[0114] Reference Figure 10 In addition to the light passing through the light transmission portion 310c, light emitted from at least one light source 350 can reach components surrounding the light transmission portion 310c. For example... Figure 10As shown, if a heat sink 370 is included, light reaching the area around the light-transmitting portion 310c can be reflected, thereby reducing and / or preventing heat buildup in the cover 310. Light reflected from the heat sink 370 can again reach the substrate 330 surrounding at least one light source 350. According to an embodiment, the substrate 330 can have a bright color. For example, the substrate 330 can be white. According to another example, the substrate 330 can be light gray. Various other bright colors can be applied to the substrate 330. Although a privacy screen 380 is provided on the second surface 310b of the cover 310, the substrate 330 disposed near the cover 310 can be observed through the cover 310 when viewed from the outside of the cover 310. When the substrate 330 is white, although the substrate 330 is partially visible, the overall aesthetics of the electronic device can be prevented from deteriorating. In this case, light reaching the first surface 330a of the substrate 330 can be reflected to reach the heat sink 370. Light reaching the heat sink 370 can be reflected again to reach the substrate 330. The light reaching the substrate 330 can be reflected again and partially absorbed into the privacy screen 380. By having a structure in which light is reflected multiple times around the light transmission portion 310c, it is possible to have the effect of dispersing heat rather than concentrating it in a localized area of ​​the cover 310.

[0115] Reference Figure 11 In addition to the light passing through the light-transmitting portion 310c, light emitted from at least one light source 350 can reach the components surrounding the light-transmitting portion 310c. Light reflected from the heat sink 370 can again reach the substrate 330 surrounding the at least one light source 350. According to an embodiment, the substrate 330 can have a dark color. For example, the substrate 330 can be black. According to another example, the substrate 330 can be dark gray. Various other dark colors can be applied to the substrate 330. According to an embodiment, the black color on the substrate 330 can be achieved by applying a coating comprising a light-absorbing material 332 or attaching a light-absorbing film and / or tape comprising a light-absorbing material 332. Light reaching the first surface 330a of the substrate 330 can be absorbed by the light-absorbing material 332 and not reflected again. In this way, since the light does not accumulate around the light-transmitting portion 310c but is absorbed by the substrate 330, heat can be dispersed and not concentrated in a local area of ​​the cover 310.

[0116] Figure 12 This is a view illustrating the arrangement of components included in a heat sink according to an embodiment of the present disclosure. Figure 13 According to embodiments of this disclosure Figure 12 Side view. Figure 14 This is a view illustrating the arrangement of components included in a heat sink according to an embodiment of the present disclosure. Figure 15 According to embodiments of this disclosure Figure 14 Side view.

[0117] Reference Figures 12 to 15 A heat diffuser 372 can be disposed on the cover 310, and a light reflector 373 can be disposed on the heat diffuser 372. This is the basic structure of the heat sink disclosed herein, and it should be noted that, for convenience, Figures 12 to 16 The adhesive component is omitted in the implementation method.

[0118] Reference Figure 12 and Figure 13 The heat sink may further include a light-absorbing member 381 on the light-reflecting member 373. The light-absorbing member 381 may include a light-absorbing material and may be used to absorb light emitted from at least one light source. By further including the light-absorbing member 381, light can be reduced and / or prevented from entering the internal space of the electronic device (e.g., Figure 4 It is reflected again in the internal space S). Figure 4 In addition to or as an alternative to the privacy screen 380 shown, a light-absorbing member 381 may be provided. When the internal space of the electronic device (e.g., Figure 4 When the interior space (S) is spacious, it can be applied Figure 12 and Figure 13 The heat sink shown.

[0119] Reference Figure 14 and Figure 15 The heat sink may further include a light-absorbing member 382, ​​which is disposed adjacent to and spaced apart from the light-reflecting member 373 by a predetermined distance. The light-absorbing member 382 may include a light-absorbing material and can be used to absorb light emitted from at least one light source. By further including the light-absorbing member 382, ​​light can be reduced and / or prevented from entering the internal space of the electronic device (e.g., Figure 4 It is reflected again within the internal space S. This can provide... Figure 14 and Figure 15 The light-absorbing component 382 is used to replace Figure 12 and Figure 13 Light-absorbing component 381. Figure 4 In addition to the privacy screen 380 shown, it can also provide Figure 14 and Figure 15 The light-absorbing component 382, ​​or Figure 14 and Figure 15 The light-absorbing component 382 can be provided as Figure 4 The replacement shown is the anti-visible film 380. When the internal space of the electronic device (e.g., Figure 4 When the internal space (S) is narrow or more space needs to be provided for the installation of other electronic components, it can be applied. Figure 14 and Figure 15 The heat sink shown.

[0120] Figure 16 This is a view showing the surface temperature of an electronic device according to an embodiment of the present disclosure. Figure 17 This is a view showing the surface temperature of an electronic device according to an embodiment of the present disclosure.

[0121] Figure 16 This is a view illustrating an electronic device according to an embodiment of the present disclosure in which a flash lamp reaches saturation temperature after a specified time when the power is turned on. Figure 17 It could be that a reference was applied. Figures 4 to 15 The embodiment describes a view of an electronic device with a heat sink, wherein a flash lamp provided on the rear surface reaches saturation temperature after a specified time when the power is turned on.

[0122] Figure 16 The figure shows that the center temperature measured in the light transmission portion corresponding to the flash was 60.5 degrees Celsius. Figure 17 The central temperature measured in the light transmission portion corresponding to the flash is 53.4 degrees Celsius. Figure 16 An embodiment without a heat sink is shown. Figure 17 An embodiment providing a heat sink is shown. It can be determined that when the heat sink of this disclosure is applied, the surface temperature of the electronic device increases by 7 degrees or more relative to its saturation temperature. The surface temperature of the electronic device can be reduced due to the heat sink disposed on the rear surface of the cover. Figure 16 As shown, it can be determined that when no heat sink is provided, heat can be concentrated on the light-transmitting part of the cover, but as... Figure 17 As shown, when a heat sink is provided, the heat concentrated on the light-transmitting portion of the cover is diffused to the surroundings due to the heat sink, and the overall surface temperature of the electronic device is reduced.

[0123] The electronic device according to various embodiments can be one of a variety of types of electronic devices. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. According to embodiments of this disclosure, the electronic device is not limited to those described above.

[0124] It should be understood that the various embodiments of this disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the specific embodiments, but rather to include various changes, equivalents, or substitutions to the respective embodiments. In the description of the drawings, similar reference numerals may be used to refer to similar or related elements. As used herein, each of the phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of items enumerated together with the corresponding phrase among the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish one component from another and do not limit the components in other respects (e.g., importance or order). It will be understood that, whether the terms “operably” or “communically” are used or not, if an element (e.g., a first element) is referred to as “combined with another element (e.g., a second element),” “combined to another element (e.g., a second element),” “connected to another element (e.g., a second element),” or “connected to another element (e.g., a second element)”, it means that the element can be directly (e.g., wiredly) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0125] As used herein, the term "module" can include a unit implemented in hardware, software, or firmware, and is used interchangeably with other terms such as "logic," "logic block," "part," or "circuit." A module can be a single integrated component adapted to perform one or more functions, or the smallest unit or part of such a single integrated component. For example, according to an embodiment, a module can be implemented in the form of an application-specific integrated circuit (ASIC).

[0126] The various embodiments set forth herein can be implemented as software (e.g., program 140) containing one or more instructions readable by a machine (e.g., electronic device 101) stored in a storage medium (e.g., internal memory 136 or external memory 138). For example, under the control of a processor, the processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke and execute at least one of the one or more instructions stored in the storage medium, with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the invoked at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. Machine-readable storage media may be provided in the form of non-transitory storage media. The term "non-transitory" simply means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but this term does not distinguish between data being stored semi-permanently in the storage medium and data being temporarily stored in the storage medium.

[0127] According to embodiments, methods according to various embodiments of this disclosure may be included and provided in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an app store (e.g., the Play Store™), or may be distributed directly between two user devices (e.g., smartphones) (e.g., downloaded or uploaded). If distributed online, at least a portion of the computer program product may be temporarily generated, or at least a portion of the computer program product may be stored at least temporarily in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a forwarding server).

[0128] According to various embodiments, each of the above-described components (e.g., a module or program) may include a single entity or multiple entities. Some of the multiple entities may be separately located in different components. According to various embodiments, one or more of the above-described components may be omitted, or one or more other components may be added. Optionally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions before integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

[0129] Electronic device 101 or 300 according to embodiments of the present disclosure may include: a cover 310, the cover 310 including a first surface 310a and a second surface 310b, the first surface 310a being part of the outer surface of the electronic device, the second surface 310b facing in a direction opposite to the first surface, and the cover 310 including a light-transmitting portion 310c; a substrate 330 disposed in the internal space S of the electronic device; a light source 350 disposed on the substrate 330 to emit light through the light-transmitting portion 310c; and a heat sink 370 attached to the second surface of the cover to surround at least a portion of the light-transmitting portion. The heat sink 370 may include a heat diffusion member 372 and a light reflection member 373.

[0130] According to an embodiment, the cover may be disposed on the rear side of the electronic device. The light source may include a light-emitting diode (LED) configured to emit flashes. A light-reflecting member may be configured to reflect a portion of the flash emitted by the light source. A heat sink may be disposed between the light-reflecting member and the cover.

[0131] According to an embodiment, the cover may be disposed on the front side of the electronic device. The light source may include a light-emitting diode (LED) configured to emit flashes, and a light-reflecting member may be configured to reflect a portion of the flashes emitted by the light source. A heat sink may be disposed between the light-reflecting member and the cover.

[0132] According to an embodiment, the cover may include a glass plate or a resin plate.

[0133] According to an embodiment, at least one light source 350 may include a light-emitting diode or a xenon lamp.

[0134] According to an embodiment, the light transmission portion 310c may include an opening 310d that penetrates from the first surface to the second surface.

[0135] According to an embodiment, the heat diffusion component can be formed of graphite material.

[0136] According to an embodiment, the light-reflecting component may include at least one of a light-reflecting film, a light-reflecting strip, and a reflector.

[0137] According to an embodiment, the electronic device may further include an adhesive member disposed between the heat dissipation member and the second surface of the cover.

[0138] According to an embodiment, a light-reflecting component can be formed by coating a light-reflecting material onto a heat-diffusion component.

[0139] According to an embodiment, the electronic device may further include a privacy screen 380 formed on a second surface of the cover. A heat sink may be disposed on the rear surface of the privacy screen.

[0140] According to an embodiment, the electronic device may further include a light-absorbing component disposed on a light-reflecting component.

[0141] According to an embodiment, the privacy screen may have a dark color to absorb light.

[0142] According to an embodiment, the electronic device may further include a light-absorbing member disposed adjacent to the light-reflecting member.

[0143] According to an embodiment, the light-reflecting component may have a bright color for reflecting light.

[0144] According to an embodiment, the substrate may have a bright color.

[0145] According to an embodiment, the substrate may have a dark color.

[0146] According to an embodiment, the electronic device may further include at least one support disposed within the internal space of the electronic device. A substrate may be disposed on said at least one support.

[0147] According to an embodiment, the heat sink may include a first portion surrounding at least a portion of the light-transmitting portion and a second portion extending from the first portion. The second portion of the heat sink may be configured to face the at least one support.

[0148] Electronic device 101 or 300 according to embodiments of the present disclosure may include: a cover 310 including a first surface 310a and a second surface 310b, the first surface 310a being part of the outer surface of the electronic device, the second surface 310b facing a direction opposite to the first surface, and the cover 310 including a light-transmitting portion 310c; a substrate 330 disposed in an internal space S of the electronic device; a light source 350 disposed on the substrate 330 to emit a flash of light through the light-transmitting portion 310c; and a light-reflecting member 373 attached to the second surface of the cover to surround at least a portion of the light-transmitting portion. The light-reflecting member 373 may be configured to reflect a portion of the flash of light emitted by the light source in a direction from the cover toward the internal space.

[0149] According to an embodiment, the electronic device may further include a heat diffusion member. The heat diffusion member may be disposed between the light reflective member and the cover.

[0150] According to an embodiment, the electronic device may further include a heat-insulating member. The heat-insulating member may be disposed between the light-reflecting member and the cover.

[0151] According to an embodiment, the electronic device may further include a light-absorbing component disposed on a light-reflecting component.

[0152] According to an embodiment, the electronic device may further include a light-absorbing member disposed adjacent to the light-reflecting member.

[0153] According to an embodiment, the cover may include a glass plate disposed on the front or rear surface of the electronic device, or a polymer plate including a substantially transparent portion.

[0154] According to an embodiment, the light transmission portion 310c may include an opening 310d that penetrates the first surface and the second surface.

[0155] According to embodiments, a heat-diffusing member and / or a heat-insulating member may be included. A light-reflecting member may include at least one of a light-reflecting film, a light-reflecting strip, and a reflector. An electronic device may include a second adhesive member 374 disposed between the heat-diffusing member and / or the heat-insulating member.

[0156] According to an embodiment, the heat diffusion member and / or heat insulation member may include graphite. The light reflection member may be formed as being coated with a light reflection material.

[0157] An electronic device 101 or 300 according to an embodiment of the present disclosure may include: a cover 310 including a first surface 310a and a second surface 310b facing a direction opposite to the first surface, and including a light-transmitting portion 310c in a portion thereof; a substrate 330 disposed in the internal space S of the electronic device; a light source 350 disposed on the substrate 330 to emit flashes through the light-transmitting portion 310c; and a heat sink 370 disposed on the second surface of the cover surrounding at least a portion of the light-transmitting portion. The heat sink 370 may include a heat-insulating member 372 and a light-reflecting member 373. The heat sink 370 may be attached to the second surface 310b of the cover 310.

[0158] Although this disclosure has been shown and described with reference to various embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the overall scope of this disclosure as defined by the appended claims and their equivalents.

Claims

1. An electronic device (101, 300), comprising: The cover (310) includes a first surface (310a) and a second surface (310b) facing in the opposite direction to the first surface, and includes a light-transmitting portion (310c), wherein the first surface (310a) is part of the outer surface of the electronic device; A substrate (330) is disposed in the internal space (S) of the electronic device; A light source (350) is disposed on the substrate (330) to emit light through the light transmission portion (310c); as well as A heat sink (370) is attached to the second surface of the cover to surround at least a portion of the light-transmitting portion. The heat sink (370) includes: Heat diffusion component (372); and Light reflecting component (373).

2. The electronic device according to claim 1, in, The cover is located on the rear side of the electronic device. The light source includes a light-emitting diode (LED) configured to emit flashes. The light-reflecting component is configured to reflect a portion of the flash emitted by the light source, and The heat sink is disposed between the light-reflecting component and the cover.

3. The electronic device according to claim 1, in, The cover is located on the front side of the electronic device. The light source includes a light-emitting diode (LED) configured to emit flashes. The light-reflecting component is configured to reflect a portion of the flash emitted by the light source, and The heat sink is disposed between the light-reflecting component and the cover.

4. The electronic device according to any one of claims 1 to 3, in, The cover may be a glass plate or a resin plate.

5. The electronic device according to any one of claims 1 to 4, in, The heat diffusion component is formed of graphite material.

6. The electronic device according to any one of claims 1 to 5, in, The light-reflecting component includes at least one of a light-reflecting film, a light-reflecting strip, and a reflector.

7. The electronic device according to any one of claims 1 to 6, further comprising an adhesive member disposed between the heat diffusion member and the second surface of the cover.

8. The electronic device according to any one of claims 1 to 5, in, The light-reflecting component is formed by coating the heat-diffusing component with a light-reflecting material.

9. The electronic device according to any one of claims 1 to 8, further comprising a privacy screen formed on the second surface of the cover, wherein the heat sink is disposed on the rear surface of the privacy screen.

10. The electronic device according to any one of claims 1 to 9, further comprising a light-absorbing member disposed on the light-reflecting member.

11. The electronic device according to any one of claims 1 to 10, in, The light-reflecting component has a bright color for reflecting light.

12. The electronic device according to any one of claims 1 to 11, further comprising a light-absorbing member disposed adjacent to the light-reflecting member.

13. The electronic device according to any one of claims 1 to 11, The substrate is dark in color.

14. The electronic device according to any one of claims 1 to 13, further comprising at least one support disposed in the internal space of the electronic device. in, The substrate is disposed on the at least one support.

15. The electronic device according to any one of claims 1 to 14, in, The heat diffusion component includes at least one of a heat diffusion material, a thermally conductive material, or a thermally insulating material.

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