Gluing control method and device, electronic equipment and computer medium

Abstract

The invention provides a gluing control method and device, electronic equipment and a computer medium, the gluing control method is applied to gluing equipment, the gluing equipment comprises a gluing part, the gluing part is used for gluing a gluing area of a to-be-glued product, and the method comprises the steps that the gluing area is divided into a plurality of sub gluing areas, the width of the sub-gluing area is set as the glue outlet width of the gluing piece; the to-be-glued amount of the gluing sub-area and the glue outlet length of the gluing piece are obtained, and the glue outlet length is equal to the length of the gluing sub-area; based on the to-be-glued amount, the glue outlet width and the glue outlet length, the target moving speed of the gluing piece when the sub-gluing area is glued is calculated; and controlling the gluing piece to move according to the target moving speed so as to glue the sub-gluing areas. The variable-speed gluing device can be used for gluing the to-be-glued product at a variable speed so as to improve the gluing quality.

Description

Technical Field

[0001] This application relates to the field of adhesive coating technology, and in particular to an adhesive coating control method, apparatus, electronic device, and computer medium. Background Technology

[0002] During battery manufacturing, the battery module needs to be placed inside the lower casing. To ensure that the battery module does not shake due to external impacts or other factors inside the lower casing, and to avoid affecting the battery's heat dissipation and leakage prevention performance, an adhesive is sprayed onto one side of the battery module placed inside the lower casing.

[0003] Currently, when applying adhesive to battery modules and the lower casing, the glue gun dispenses adhesive at a constant speed. However, if the surface of the battery module to be coated has unevenness or the lower casing is deformed, uneven adhesive application may occur if the glue gun still dispenses adhesive at a constant speed. Summary of the Invention

[0004] This invention proposes a method, apparatus, electronic device, and computer medium for controlling adhesive application. This application enables variable-speed adhesive application to products to be coated, thereby improving the quality of adhesive application.

[0005] The technical solution of this invention: a glue application control method applied to a glue application equipment, the glue application equipment including a glue application component, the glue application component being used to apply glue to a glue application area of ​​a product to be glued, the method including: dividing the glue application area into multiple sub-glue application areas, and setting the width of the sub-glue application area as the glue dispensing width of the glue application component; obtaining the amount of glue to be applied in the sub-glue application area and the glue dispensing length of the glue application component, wherein the glue dispensing length is equal to the length of the sub-glue application area; calculating a target moving speed of the glue application component when applying glue to the sub-glue application area based on the amount of glue to be applied, the glue dispensing width, and the glue dispensing length; controlling the glue application component to move according to the target moving speed to apply glue to the sub-glue application area.

[0006] The adhesive application control method of this application dynamically adjusts the target moving speed of the adhesive applicator based on the amount of adhesive to be applied, the adhesive application width, and the adhesive application length required for different sub-adhesive application areas. This adapts to the adhesive application needs of different sub-adhesive application areas and ensures the adhesive application quality of each sub-adhesive application area.

[0007] In some embodiments, the product to be coated with adhesive is placed in a box with an opening. The box includes a bottom plate and a cover plate that are opposite to each other and spaced apart. The cover plate covers the opening and is attached to one side of the product to be coated with adhesive. The bottom plate is bonded to the other side of the product to be coated with adhesive. Before dividing the coating area into multiple sub-coating areas, the method further includes: acquiring an image of the product to be coated with adhesive; and processing the image of the product to be coated with adhesive to obtain the coating area.

[0008] In some embodiments, processing the image of the product to be coated with adhesive to obtain the coating area includes: identifying edge feature information of the box and the product to be coated with adhesive; and obtaining the coating area based on the edge feature information.

[0009] In some embodiments, obtaining the amount of adhesive to be applied in the sub-adhesive area includes: obtaining a first actual height of the product to be coated and a second actual height of the box; calculating the height difference between the first actual height and the second actual height; detecting whether the height difference is within a preset height threshold; if the height difference is detected to be within the preset height threshold, calculating the amount of adhesive to be applied using the length, width and height difference of the sub-adhesive area.

[0010] In some embodiments, controlling the adhesive applicator to move at the target moving speed to apply adhesive to the sub-adhesive area includes: acquiring the adhesive dispensing speed of the adhesive applicator, a first theoretical height of the product to be coated located inside the box, and a second theoretical height of the box, wherein the first theoretical height refers to the height of the product to be coated when the side of the coating area is flat, and the second theoretical height refers to the height between the cover plate and the bottom plate when the side of the bottom plate is flat; calculating the theoretical height difference between the first theoretical height and the second theoretical height; obtaining the theoretical moving speed of the adhesive applicator based on the adhesive dispensing speed, the width of the sub-adhesive area, and the theoretical height difference; calculating the speed difference between the theoretical moving speed and the target moving speed; and if the speed difference is within a preset difference range, controlling the adhesive applicator to move at the target moving speed to apply adhesive to the sub-adhesive area.

[0011] In some embodiments, the adhesive application control method further includes: detecting whether the adhesive application component has applied all the sub-adhesive application areas; if it is detected that the adhesive application component has applied all the sub-adhesive application areas, acquiring an image of the applied adhesive application area; processing the image of the applied adhesive application area to obtain an adhesive breakage result, wherein the adhesive breakage result indicates whether adhesive breakage occurs in the applied adhesive application area.

[0012] In some embodiments, the adhesive breakage result includes adhesive breakage occurring and adhesive breakage not occurring; processing the image of the glued area after application to obtain the adhesive breakage result includes: identifying whether there is an adhesive breakage area in the glued image of the glued area after application; if there is an adhesive breakage area in the glued image, controlling the glue applicator to apply the adhesive breakage area, and the adhesive breakage result is adhesive breakage occurring; if there is no adhesive breakage area in the glued image, the adhesive breakage result is adhesive breakage not occurring.

[0013] One embodiment of this application also provides an adhesive application control device, comprising: a division module, configured to divide the adhesive application area into multiple sub-adhesive application areas, and to set the width of the sub-adhesive application area as the adhesive dispensing width of the adhesive applicator; an acquisition module, configured to acquire the amount of adhesive to be applied to the sub-adhesive application area and the adhesive dispensing length of the adhesive applicator, wherein the adhesive dispensing length is the length of the sub-adhesive application area; a calculation module, configured to calculate a target moving speed of the adhesive applicator when applying adhesive to the sub-adhesive application area based on the amount of adhesive to be applied and the adhesive dispensing length; and a control module, configured to control the adhesive applicator to move according to the target moving speed to apply adhesive to the sub-adhesive application area.

[0014] One embodiment of this application also provides an electronic device, which includes a processor and a memory. The memory is used to store instructions, and the processor is used to call the instructions in the memory to cause the electronic device to execute the above-described adhesive application control method.

[0015] One embodiment of this application also provides a computer-readable storage medium that stores computer instructions that, when executed on an electronic device, cause the electronic device to perform the above-described adhesive application control method.

[0016] Compared with existing technologies, the above-mentioned glue application control method, device, electronic equipment, and computer medium calculate the amount of glue to be applied to the sub-glue area by acquiring the first actual height of the product to be glued, the second actual height of the box, and the length and width of the sub-glue area. The glue dispensing width of the glue applicator is set to be equal to the width of the sub-glue area. Then, the target moving speed of the glue applicator when applying glue to the sub-glue area is calculated using the amount of glue to be applied and the dispensing length. The glue applicator is controlled to apply glue to the sub-glue area based on the target moving speed. Finally, the presence of glue breakage areas in the image of the product to be glued after application is detected, and glue is applied to these areas in a timely manner, ensuring the spraying effect of the product to be glued and improving the glue application quality. Attached Figure Description

[0017] Figure 1 This is a flowchart of the steps of an embodiment of the adhesive application control method of this application.

[0018] Figure 2 This is a schematic diagram of the structure of the product to be coated with adhesive and the box body according to an embodiment of this application.

[0019] Figure 3 This is a flowchart of the sub-steps of the adhesive application control method according to one embodiment of this application.

[0020] Figure 4 This is a schematic diagram of the structure of an adhesive application control device according to an embodiment of this application.

[0021] Figure 5This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0022] Explanation of main component symbols

[0023] 1000 electronic devices

[0024] Processor 1001

[0025] Memory 1002

[0026] Computer Program 1003

[0027] Box 10

[0028] Base plate 11

[0029] Cover plate 12

[0030] Base plate adhesive surface P1

[0031] 100 products to be coated with adhesive

[0032] Glue application area P2

[0033] Glue application control device 200

[0034] Module 210

[0035] Get Module 220

[0036] Calculation Module 230

[0037] Control Module 240 Detailed Implementation

[0038] To better understand the above-mentioned objectives, features, and advantages of this application, the application will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0039] The following description sets forth many specific details to provide a full understanding of this application. The described embodiments are only some, not all, of the embodiments of this application.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0041] It should be further noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0042] In this application, "at least one" means one or more, and "more than one" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and drawings of this application are used to distinguish similar objects, not to describe a specific order or sequence.

[0043] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0044] The adhesive application control method of this application can be applied to one or more electronic devices. The electronic device is a device capable of automatically performing numerical calculations and / or information processing according to pre-set or stored instructions. Its hardware includes, but is not limited to, processors, microprogrammed control units (MCUs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), embedded devices, etc. The electronic device can be a portable electronic device (such as a mobile phone or tablet computer), a personal computer, a server, etc.

[0045] Figure 1This is a flowchart illustrating one embodiment of the adhesive application control method of this application. Depending on different requirements, the order of the steps in the flowchart can be changed, and some steps can be omitted. This adhesive application control method is applied to an adhesive application device. The device includes an adhesive application component, which is used to apply adhesive to the adhesive application area of ​​the product to be coated. The adhesive application component can be a glue gun. This application does not limit the type of adhesive application component.

[0046] In this embodiment, please refer to Figure 2 The product to be coated, 100, is a battery module, which is placed inside a housing 10 with an opening. The housing 10 includes a cover plate 12 and a bottom plate 11, which are positioned opposite each other and spaced apart, as well as side plates. The side plates form an accommodating space, and the opening connects to this space. The battery module is placed within this space. After the cover plate 12 closes the opening, it adheres to one side of the product to be coated, and the bottom plate 11 adheres to the other side of the product to be coated. Because the thickness of the battery module is less than the height of the side plates, to prevent the battery module from shaking within the housing 10 due to external factors such as vibration, which could affect its performance, adhesive needs to be applied to the coating area P2 of the battery module. Then, the bottom plate 11 is placed over the coating area P2, thus also adhering adhesive to the coating surface P1 of the bottom plate. This makes the connection between the bottom plate 11 and the product to be coated 100 more stable.

[0047] See Figure 1 As shown, the adhesive application control method may include the following steps.

[0048] S100. Divide the glue application area into multiple sub-glue application areas, and set the width of the sub-glue application area as the glue outlet width of the glued part.

[0049] In some embodiments, in order to obtain the adhesive coating area P2 of the battery module, it is necessary to use a camera assembly to capture an image of the product 100 to be coated with adhesive. The camera assembly can be a 2D camera, a 3D camera, a visual sensing element, etc., and this application is not limited to this.

[0050] Furthermore, the edge feature information of the box 10 and the product 100 to be coated in the image to be coated is identified. Based on the edge feature information, the coating area P2 is obtained.

[0051] In this embodiment, before identifying the edge feature information of the box 10 and the product 100 to be glued in the image to be glued, it is necessary to perform noise reduction and smoothing processing on the image to be glued to eliminate areas with high brightness or low brightness in the image to be glued. This facilitates the acquisition of accurate edge feature information.

[0052] In some embodiments, for the sub-adhesive region P2 after dividing the adhesive application region P2, the length of the sub-adhesive region P2 is set to be equal to the product of the thickness of the product 100 to be adhesiveed and a preset value. The preset value can be one-half, one-third, or equal to the product of the thickness of the product 100. It should be noted that the smaller the length of the sub-adhesive region P2 is set, the better the adhesive application effect.

[0053] It should be noted that the glue application area P2 can be divided into multiple sub-glue application areas P2. Since the area of ​​each sub-glue application area P2 is the same, and the glue application width of the glued part is equal to the width of each sub-glue application area P2, the glue application will be more uniform and the effect will be better when the glued part is glued later.

[0054] In other embodiments, the adhesive application area P2 can be divided into multiple sub-adhesive application areas P2 with different areas according to the actual application requirements. This application does not limit this.

[0055] S200: Obtain the amount of adhesive to be applied in the sub-adhesive area and the adhesive discharge length of the part to be coated, wherein the adhesive discharge length is the length of the sub-adhesive area.

[0056] In some embodiments, please refer to Figure 3 The method for obtaining the amount of adhesive to be applied in sub-coating area P2 is as follows:

[0057] S201. Obtain the first actual height of the product to be coated and the second actual height of the box.

[0058] In this embodiment, due to improper stacking or compression during the production process, the heights of the products 100 to be coated in multiple sub-coating areas P2 differ. To ensure coating quality and avoid excessive or insufficient coating, it is necessary to accurately obtain the heights within the multiple sub-coating areas P2.

[0059] Similarly, during the processing of the housing 10, or during the assembly of the housing 10 and the product 100 to be glued, the housing 10 may deform, affecting the height of some housing 10 within each sub-glue application area P2. Therefore, it is necessary to accurately obtain the height of some housing 10 within each sub-glue application area P2.

[0060] S202. Calculate the height difference between the first actual height and the second actual height.

[0061] S203. Detect whether the height difference is within the preset height threshold.

[0062] In some embodiments, the preset height threshold is [-3.5mm, +3.5mm]. In other embodiments, the preset height threshold can also be [-2mm, +2mm], [-4mm, +4mm], [-5mm, +5mm], etc., which can be set according to actual design requirements. This application does not limit the specific range of the preset height threshold.

[0063] S204. If the height difference is detected to be within the preset height threshold, the amount of adhesive to be applied is calculated based on the length, width and height difference of the sub-coating area.

[0064] In some embodiments, if the height difference is detected to be outside the preset height threshold, it indicates that the production of the product 100 to be coated or the box 10 does not meet the standard, and the product 100 to be coated or the box 10 needs to be replaced. Otherwise, the amount of glue to be coated = height difference * width of sub-coating area P2 * length of sub-coating area P2.

[0065] S300. Based on the amount of glue to be applied, the glue dispensing width, and the glue dispensing length, calculate the target moving speed of the glue-applying part in the glue-applying area.

[0066] In some embodiments, the average movement speed and dispensing speed of the adhesive-coated part are obtained, where the actual dispensing amount of the adhesive-coated part = the length of the sub-coating area P2 * the average movement speed * the dispensing speed.

[0067] In some embodiments, the amount of adhesive to be applied is set equal to the actual amount of adhesive dispensed, thus ensuring that each sub-coating area P2 can be completely coated. Therefore, the average movement speed of the coated part is calculated as: (height difference * width of sub-coating area P2 * length of sub-coating area P2) / (length of sub-coating area P2 * dispensing speed). This average movement speed is used as the target movement speed.

[0068] S400: Control the adhesive-coated part to move at the target moving speed to apply adhesive to the sub-adhesive-coated area.

[0069] Furthermore, in order to spray each sub-coating area P2 more accurately, the target moving speed calculated in step S300 needs to be checked. The check steps are as follows:

[0070] First, the dispensing speed of the adhesive-coating component, the first theoretical height of the product 100 to be coated within the housing 10, and the second theoretical height of the housing 10 are obtained. The first theoretical height refers to the height of the product 100 when the surface containing the adhesive-coating area P2 is flat, and the second theoretical height refers to the height between the cover plate 12 and the base plate 11 when the surface containing the base plate 11 is flat. Then, the theoretical height difference between the first and second theoretical heights is calculated. Based on the dispensing speed, the width of the sub-adhesive-coating area P2, and the theoretical height difference, the theoretical moving speed of the adhesive-coating component is obtained. In this embodiment, the theoretical moving speed = dispensing speed / [width of sub-adhesive-coating area P2 * theoretical height difference].

[0071] Finally, the speed difference between the theoretical moving speed and the target moving speed is calculated. If the speed difference is within a preset difference range, the adhesive applicator is controlled to move at the target moving speed to apply adhesive to the product 100. In this embodiment, the preset difference range can be [target moving speed - target moving speed * 0.2, target moving speed + target moving speed * 0.2], [target moving speed - target moving speed * 0.4, target moving speed + target moving speed * 0.4], [target moving speed - target moving speed * 0.2, target moving speed]. This application does not limit the preset difference range.

[0072] The adhesive application control method of this application calculates the amount of adhesive to be applied to the sub-adhesive application area P2 by acquiring the first actual height of the product 100 to be coated, the second actual height of the housing 10, and the length and width of the sub-adhesive application area P2. The adhesive dispensing width of the adhesive applicator is set to be equal to the width of the sub-adhesive application area P2, and the actual dispensing amount of the adhesive applicator is determined. Then, the target moving speed of the adhesive applicator is calculated using the amount of adhesive to be applied and the actual dispensing amount. The adhesive applicator is controlled to apply adhesive to the product 100 based on the target moving speed. Finally, the method detects whether there are any gaps in the adhesive application image and applies adhesive to these gaps in a timely manner, ensuring the coating effect on the product 100 and improving the adhesive application quality.

[0073] In some embodiments, this application also discloses a method for detecting adhesive application effect. The specific details are as follows:

[0074] In this embodiment, it is detected whether all sub-adhesive areas P2 have been completely coated. If it is detected that all sub-adhesive areas P2 have been completely coated, an image of the coated areas P2 after coating is completed is acquired. The image of the coated areas P2 after coating is completed is processed to obtain the adhesive breakage result. The adhesive breakage result indicates whether an adhesive breakage occurs within the coated areas P2.

[0075] The method for processing the glued area P2 after the glue application is completed can employ existing image processing techniques. For example, image denoising techniques can be used to remove points with high or low noise levels, and edge detection techniques can be used to extract edge features from the image.

[0076] Specifically, the glue breakage result includes whether glue breakage has occurred or not. The system identifies whether a glue breakage area exists in the glued image of the glued area P2 after application. If a glue breakage area exists in the glued image of the glued area P2 after application, the glued part is controlled to cover the glue breakage area, and the glue breakage result is "glue breakage occurred". If no glue breakage area exists in the glued image of the glued area P2 after application, the glue breakage result is "glue breakage did not occur".

[0077] The adhesive application effect detection method in this embodiment involves detecting the adhesive application effect after the adhesive application component has completed the adhesive application to the adhesive application area P2 of the product to be coated 100. If the adhesive application effect does not meet the requirements, the adhesive application component can be controlled to apply adhesive to the adhesive application area P2 again to ensure the adhesive application quality.

[0078] In some embodiments, this application also discloses an adhesive application control device 200. For example... Figure 4 As shown, the adhesive application control device 200 includes a division module 210, an acquisition module 220, a calculation module 230, and a control module 240. The division module 210 divides the adhesive application area into multiple sub-adhesive application areas, where the width of each sub-adhesive application area is equal to the adhesive dispensing width of the adhesive applicator. The acquisition module 220 acquires the amount of adhesive to be applied to each sub-adhesive application area and the adhesive dispensing length of the adhesive applicator, where the dispensing length is the length of the sub-adhesive application area. The calculation module 230 calculates the target moving speed of the adhesive applicator when applying adhesive to the sub-adhesive application areas based on the amount of adhesive to be applied, the adhesive dispensing width, and the adhesive dispensing length. The control module 240 controls the adhesive applicator to move at the target moving speed to apply adhesive to the sub-adhesive application areas.

[0079] In some embodiments, this application also discloses an electronic device 1000, such as... Figure 5 As shown, the electronic device 1000 includes a memory 1002, a processor 1001, and a computer program 1003 stored in the memory 1002 and executable on the processor 1001. When the processor 1001 executes the computer program 1003, it implements the steps in the above-described adhesive application control method embodiment.

[0080] For example, computer program 1003 can also be divided into one or more modules / units, which are stored in memory 1002 and executed by processor 1001. The one or more modules / units can be a series of computer program instruction segments capable of performing specific functions, which describe the execution process of computer program 1003 in electronic device 1000.

[0081] Those skilled in the art will understand that the schematic diagram is merely an example of the electronic device 1000 and does not constitute a limitation on the electronic device 1000. It may include more or fewer components than shown in the diagram, or combine certain components, or different components. For example, the electronic device 1000 may also include input / output devices, network access devices, buses, etc.

[0082] Processor 1001 can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor can be a microprocessor, a single-chip microcomputer, or processor 1001 can be any conventional processor.

[0083] The memory 1002 can be used to store computer programs 1003 and / or modules / units. The processor 1001 implements various functions of the electronic device 1000 by running or executing the computer programs and / or modules / units stored in the memory 1002 and by calling data stored in the memory 1002. The memory 1002 may mainly include a program storage area and a data storage area. The program storage area may store the operating system, application programs required for at least one function (such as sound playback function, image playback function, etc.), etc.; the data storage area may store data created according to the use of the electronic device 1000 (such as audio data), etc. In addition, the memory 1002 may include high-speed random access memory, and may also include non-volatile memory, such as hard disk, RAM, plug-in hard disk, smart media card (SMC), secure digital card (SD) card, flash card, at least one disk storage device, flash memory device, or other non-volatile solid-state storage device.

[0084] If the modules / units integrated in the electronic device 1000 are implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments can also be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include: any entity or device capable of carrying the computer program code, a recording medium, a USB flash drive, a portable hard drive, a magnetic disk, an optical disk, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium, etc. It should be noted that the content contained in the computer-readable medium may be appropriately added to or subtracted from the content as required by the legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, the computer-readable medium may not include electrical carrier signals and telecommunication signals.

[0085] In the several embodiments provided in this application, it should be understood that the disclosed electronic devices and methods can be implemented in other ways. For example, the electronic device embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and other division methods may be used in actual implementation.

[0086] Furthermore, the functional units in the various embodiments of this application can be integrated into the same processing unit, or each unit can exist physically separately, or two or more units can be integrated into the same unit. The integrated units described above can be implemented in hardware or in the form of hardware plus software functional modules.

[0087] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered exemplary and not restrictive in all respects. Furthermore, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or electronic devices recited in the electronic device claims may also be implemented by the same unit or electronic device through software or hardware. The terms "first," "second," etc., are used to indicate names and do not indicate any particular order.

[0088] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A method for controlling adhesive application, applied to adhesive application equipment, characterized in that, The adhesive coating equipment includes an adhesive coating component, which is used to apply adhesive to the adhesive coating area of ​​the product to be coated. The method includes: The adhesive application area is divided into multiple sub-adhesive application areas, and the width of the sub-adhesive application area is set as the adhesive dispensing width of the adhesive part; Obtain the amount of adhesive to be applied in the sub-adhesive area and the adhesive discharge length of the adhesive-coated part, wherein the adhesive discharge length is equal to the length of the sub-adhesive area; Based on the amount of glue to be applied, the glue dispensing width, and the glue dispensing length, calculate the target moving speed of the glued part when applying glue to the sub-glue area; The adhesive applicator is controlled to move at the target speed to apply adhesive to the sub-adhesive area.

2. The adhesive application control method as described in claim 1, characterized in that, The product to be coated with adhesive is placed in a box with an opening. The box includes a bottom plate and a cover plate that are opposite to each other and spaced apart. After the cover plate closes the opening, it is attached to one side of the product to be coated with adhesive. The bottom plate is bonded to the other side of the product to be coated with adhesive. Before dividing the adhesive application area into multiple sub-adhesive application areas, the method further includes: Acquire an image of the product to be coated with adhesive; The image of the product to be coated with adhesive is processed to obtain the adhesive coating area.

3. The adhesive application control method as described in claim 2, characterized in that, The process of processing the image of the product to be coated with adhesive to obtain the adhesive coating area includes: Identify the edge features of the box and the product to be coated; The adhesive-coated area is obtained based on the edge feature information.

4. The adhesive application control method as described in claim 2, characterized in that, The step of obtaining the amount of adhesive to be applied in the sub-coating area includes: Obtain the first actual height of the product to be coated and the second actual height of the box; Calculate the height difference between the first actual height and the second actual height; Detect whether the height difference is within a preset height threshold; If the height difference is detected to be within the preset height threshold, the amount of adhesive to be applied is calculated using the length, width, and height difference of the sub-adhesive application area.

5. The adhesive application control method as described in claim 2, characterized in that, The control of the adhesive applicator to move at the target moving speed to apply adhesive to the sub-adhesive area includes: The glue dispensing speed of the coating component, the first theoretical height of the product to be coated located inside the box, and the second theoretical height of the box are obtained. The first theoretical height refers to the height of the product to be coated when the side where the coating area is located is a plane, and the second theoretical height refers to the height between the cover plate and the bottom plate when the side where the bottom plate is located is a plane. Calculate the theoretical height difference between the first theoretical height and the second theoretical height; Based on the dispensing speed, the width of the sub-coating area, and the theoretical height difference, the theoretical moving speed of the coated part is obtained; Calculate the speed difference between the theoretical moving speed and the target moving speed; If the speed difference is within a preset range, the adhesive applicator is controlled to move at the target speed to apply adhesive to the sub-adhesive area.

6. The adhesive application control method as described in claim 1, characterized in that, The method further includes: Detect whether all sub-adhesive areas of the adhesive-coated component have been completely coated; If it is detected that all the sub-adhesive areas of the adhesive-coated part have been coated, an image of the coated area after coating is completed is acquired. The image of the glued area after application is processed to obtain a glue breakage result, wherein the glue breakage result indicates whether a glue breakage occurs in the glued area.

7. The adhesive application control method as described in claim 6, characterized in that, The glue breakage result includes glue breakage occurring and glue breakage not occurring; The image of the coated area after the adhesive application is completed is processed to obtain the adhesive breakage result, including: Identify whether there are any areas with broken adhesive in the glued area image after the glue has been applied; If there is a broken glue area in the glued image, control the glue applicator to apply glue to the broken glue area, and the broken glue result is that a broken glue has occurred; If there are no areas of glue breakage in the glued image, the glue breakage result is that no glue breakage has occurred.

8. A glue application control device, characterized in that, include: The dividing module is used to divide the glue application area into multiple sub-glue application areas, and to set the width of the sub-glue application area as the glue outlet width of the glued part. The acquisition module is used to acquire the amount of glue to be applied in the sub-coating area and the glue dispensing length of the coated part, wherein the glue dispensing length is the length of the sub-coating area; The calculation module is used to calculate the target moving speed of the coating part when applying glue to the sub-coating area based on the amount of glue to be applied and the glue dispensing length; The control module is used to control the adhesive applicator to move at the target moving speed in order to apply adhesive to the sub-adhesive area.

9. An electronic device, the electronic device comprising a processor and a memory, characterized in that, The memory is used to store instructions, and the processor is used to call the instructions in the memory to cause the electronic device to perform the adhesive application control method as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that, when executed on an electronic device, cause the electronic device to perform the adhesive application control method as described in any one of claims 1 to 7.

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