Semiconductor chip appearance defect detection carrying platform

Abstract

The invention belongs to the technical field of detection equipment, and particularly relates to a semiconductor chip appearance defect detection platform deck which comprises a base, a conveying belt is arranged above the base, a driving assembly is arranged between the conveying belt and the base, a detection assembly is arranged above the conveying belt, and the detection assembly is arranged above the conveying belt. A plurality of hinge blocks A are evenly and fixedly installed on the outer wall of the conveying belt, hinge seats A are rotatably installed on the outer walls of the hinge blocks A, torsional spring shafts are installed between the corresponding hinge seats A and the hinge blocks A, turnover plates are fixedly installed on the outer walls of the hinge seats A, and a plurality of supporting blocks are evenly and fixedly installed on the outer wall of the conveying belt. And when the appearance defect of the chip is detected, the lifting assembly ascends to extrude the placing assembly, so that the defective chip automatically slides to the collecting assembly, manual sorting can be carried out without shutdown, the automatic sorting function avoids detection interruption caused by manual operation, the continuity of the detection process is ensured, and the overall detection efficiency is further improved.

Description

Technical Field

[0001] This invention belongs to the field of testing equipment technology, specifically a semiconductor chip appearance defect detection platform. Background Technology

[0002] As core sensing components in fields such as the Internet of Things, autonomous driving, and industrial automation, the appearance quality of sensor semiconductor chips directly affects the sensitivity, reliability, and lifespan of the devices. In the sensor chip production process, appearance defect detection devices are required to perform high-precision defect screening on the chip surface through industrial vision inspection systems to ensure product yield.

[0003] Existing sensor chip appearance defect detection devices generally adopt an offline mode of "detection-stop-manual sorting": when the vision inspection system identifies a defective chip, it is necessary to manually stop the machine and remove the defective chip. This method causes frequent interruptions to the production line and forces a reduction in the detection cycle. Especially in mass production, the mechanical vibration generated by the start and stop of the equipment can easily accelerate the wear of the platform and increase maintenance costs. Manual sorting has the risk of missed detection and misjudgment, and cannot meet the needs of 24-hour continuous production, making it difficult to improve the overall detection efficiency.

[0004] Therefore, the present invention provides a semiconductor chip appearance defect detection platform. Summary of the Invention

[0005] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0006] The technical solution adopted by the present invention to solve its technical problem is as follows: A semiconductor chip appearance defect detection platform of the present invention includes a base, a conveyor belt arranged above the base, a driving component arranged between the conveyor belt and the base, a detection component arranged above the conveyor belt, a plurality of hinge blocks A uniformly fixedly installed on the outer wall of the conveyor belt, a hinge seat A rotatably installed on the outer wall of each hinge block A, a torsion spring shaft installed between each hinge seat A and the hinge block A, a flipping plate fixedly installed on the outer wall of each hinge seat A, a plurality of support blocks uniformly fixedly installed on the outer wall of the conveyor belt, each support block abutting against the flipping plate, a placement component arranged on the side of the flipping plate away from the hinge seat A, and a lifting component and a collecting component arranged on the top of the base.

[0007] Preferably, the lifting assembly includes a mounting frame, which is fixedly mounted on the top of the base. A hydraulic cylinder is fixedly mounted on the horizontal section of the mounting frame. A lifting plate is fixedly mounted through the output shaft of the hydraulic cylinder and the mounting frame. A vertical plate is fixedly mounted on the bottom of the lifting plate. A horizontal plate A is fixedly mounted on one side of the vertical plate. A positioning frame A is fixedly mounted on the top of the horizontal plate A. An extrusion roller A is rotatably mounted on the inner wall of the positioning frame A.

[0008] Preferably, the collection component includes a fixed base, which is fixedly installed on the top of the base. A positioning seat is fixedly installed on the top of the fixed base. A collection box is slidably installed on the inner wall of the positioning seat. Positioning blocks are symmetrically fixedly installed on the outer wall of the collection box. Each positioning block is engaged with the inner wall of the positioning seat.

[0009] Preferably, the drive assembly includes a support frame, two of which are symmetrically fixedly installed on the top of the base. A rotating shaft is rotatably installed on the inner wall of each support frame, and a drive wheel is fixedly installed on the outer wall of each rotating shaft. The conveyor belt is sleeved between the two drive wheels. A drive motor is fixedly installed on the outer wall of one of the support frames, and the output end of the drive motor is fixedly connected to one end of one of the rotating shafts.

[0010] Preferably, the placement assembly includes a placement seat that fits against a flip plate. A hinge block B is fixedly installed on the outer wall of the placement seat. A hinge seat B is fixedly installed at one end of the flip plate. A connecting shaft is installed between the hinge seat B and the hinge block B. A calibration plate is fixedly installed on the inner wall of the placement seat. A counterweight magnet is fixedly installed on the inner wall of the placement seat. An adsorption magnet is fixedly installed on the inner wall of the flip plate. The adsorption magnet and the counterweight magnet are magnetically attracted to each other. A pressing assembly is provided above one of the placement seats.

[0011] Preferably, the pressing assembly includes a horizontal plate B, which is fixedly installed on one side of the vertical plate. A positioning frame B is fixedly installed at the bottom of the horizontal plate B, and a pressing roller B is rotatably installed on the inner wall of the positioning frame B.

[0012] Preferably, two support legs are fixedly installed on the top of the base, and a feeding frame is fixedly installed between the tops of the two support legs. The feeding frame is located on one side of the conveyor belt, and a feeding assembly is provided on the top of the base.

[0013] Preferably, the feeding assembly includes a connecting plate, which is fixedly installed on the top of the base. A receiving frame is fixedly installed at the end of the connecting plate, and an arc-shaped guide rail is fixedly installed on the inner side of the receiving frame. The arc-shaped guide rail abuts against one of the placement seats.

[0014] Preferably, a baffle is fixedly installed on the inner wall of the feeding frame, and a feeding port is opened at the bottom of the baffle.

[0015] Preferably, the detection component includes a sliding column, which is slidably mounted on the inner wall of the mounting frame. A detection probe is fixedly mounted on one end of the sliding column, and a connecting block is fixedly mounted between the detection probe and the lifting plate.

[0016] The beneficial effects of this invention are as follows: 1. When a chip is found to have an appearance defect, the lifting component rises and squeezes the placement component, causing the defective chip to automatically slide down to the collection component. There is no need to stop the machine for manual sorting. This automatic sorting function avoids the detection interruption caused by manual operation, ensures the continuity of the detection process, and further improves the overall detection efficiency.

[0017] 2. This invention takes into account the potential errors during chip placement and the problem that vibrations generated during device operation may cause the chip to separate from the calibration plate. The placement component is designed with a unique automatic calibration function. When the placement seat moves with the chip under the detection component, the pressing component moves down to squeeze the placement seat, causing it to tilt towards the vertical plate. Under the action of gravity, the chip slides along the inclined plane towards the calibration plate until it re-attaches to the calibration plate. This automatic calibration process does not require manual intervention and can ensure that the chip is in the correct detection position in real time, thus ensuring the accuracy and reliability of the detection results.

[0018] 3. The chip angle changes when the placement seat is flipped. This design facilitates the detection device to capture chip defects from different perspectives. During the chip tilting process, the detection device can scan and detect the chip from multiple angles, and can discover some defects that are difficult to detect under normal perspectives, thus improving the comprehensiveness and accuracy of defect detection. Attached Figure Description

[0019] The invention will now be further described with reference to the accompanying drawings.

[0020] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is a schematic diagram of the three-dimensional structure of the back of the present invention; Figure 3 This is a schematic diagram of the conveyor belt structure of the present invention; Figure 4 This is a partial structural diagram of the conveyor belt of the present invention; Figure 5 This is a partial structural diagram of the mounting bracket of the present invention; Figure 6 This is a schematic diagram of the vertical plate structure of the present invention; Figure 7 This is a schematic diagram of the structure of the collection box of the present invention; Figure 8 This is a schematic diagram of the rotating structure of the placement seat of the present invention; Figure 9 This is a schematic diagram of the structure of the material feeding frame of the present invention; Figure 10 This is a schematic diagram of the structure of the arc-shaped guide rail of the present invention.

[0021] In the diagram: 1. Base; 2. Conveyor belt; 3. Hinge block A; 4. Hinge seat A; 5. Torsion spring shaft; 6. Tilting plate; 7. Support block; 8. Mounting frame; 9. Hydraulic cylinder; 10. Lifting plate; 11. Vertical plate; 12. Horizontal plate A; 13. Positioning frame A; 14. Extrusion roller A; 15. Fixed seat; 16. Positioning seat; 17. Collection box; 18. Positioning block; 19. Support frame; 20. Rotating shaft; 21. Drive wheel; 22. Drive motor 23. Machine; 24. Placement seat; 25. Hinge block B; 26. Hinge seat B; 27. Connecting shaft; 28. Calibration plate; 29. ​​Counterweight magnet; 30. Adsorption magnet; 31. Horizontal plate B; 32. Positioning frame B; 33. Extrusion roller B; 34. Support leg; 35. Discharge frame; 36. Connecting plate; 37. Receiving frame; 38. Arc guide rail; 39. Baffle; 40. Discharge port; 41. Sliding column; 42. Detection probe; 43. Connecting block. Detailed Implementation

[0022] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0023] like Figures 1 to 7As shown in the figure, a semiconductor chip appearance defect detection stage according to an embodiment of the present invention includes a base 1. Above the base 1, a conveyor belt 2 is provided. Between the conveyor belt 2 and the base 1, a driving component is provided. Above the conveyor belt 2, a detection component is provided. On the outer wall of the conveyor belt 2, a number of hinge blocks A3 are evenly and fixedly installed. On the outer walls of the hinge blocks A3, hinge seats A4 are rotatably installed. Between the corresponding hinge seats A4 and hinge blocks A3, torsion spring shafts 5 are installed. On the outer walls of the hinge seats A4, turning plates 6 are fixedly installed. On the outer wall of the conveyor belt 2, a number of support blocks 7 are evenly and fixedly installed. The support blocks 7 respectively abut against the turning plates 6. On the side of the turning plate 6 away from the hinge seat A4, placing components are provided. On the top of the base 1, a lifting component and a collection component are provided; when performing detection work, the driving component is started to drive the conveyor belt 2 to operate. When the conveyor belt 2 operates, it will drive the turning plate 6 and the placing component to rotate in a cycle. The chips to be detected are sequentially placed inside the placing component. The conveyor belt 2 drives the chips to move through the placing component. When the chips move below the detection component, the detection component will perform appearance defect detection on the chips. When it is detected that the chips are qualified, the conveyor belt 2 will continue to drive the chips to be conveyed backward for subsequent processes. When it is detected that there are appearance defects on the chips, the lifting component will rise to squeeze the placing component from below. After being squeezed, the placing component will drive the turning plate 6 to rotate together around the torsion spring shaft 5. Since the rotated placing component is in an inclined state, the defective chips above it will slide down along its inclined surface. The slid chips will fall into the interior of the collection component for collection. Then the lifting component descends, and the placing component and the turning plate 6 will reset under the action of the torsion spring shaft 5. After the placing component and the turning plate 6 are reset, the driving component continues to drive the conveyor belt 2 to operate, and the detection work continues. The present invention drives the conveyor belt 2 to continuously operate through the driving component, making the turning plate 6 and the placing component rotate in a cycle. The chips are sequentially placed on the placing component and continuously move below the detection component. The whole process does not require manual frequent intervention to pick and place chips, realizing continuous and uninterrupted automatic detection, greatly shortening the detection time of a single chip, significantly increasing the detection volume per unit time, and meeting the requirements of rapid detection in large-scale chip production. When it is detected that there are appearance defects on the chips, the lifting component rises to squeeze the placing component, causing the defective chips to automatically slide into the collection component without stopping the machine for manual sorting. This automatic sorting function avoids detection interruption caused by manual operation, ensures the coherence of the detection process, and further improves the overall detection efficiency.

[0024] As Figures 1 to 2 and Figures 5 to 6As shown, the lifting assembly includes a mounting frame 8, which is fixedly mounted on the top of the base 1. A hydraulic cylinder 9 is fixedly mounted on the horizontal section of the mounting frame 8. The output shaft of the hydraulic cylinder 9 passes through the mounting frame 8 and a lifting plate 10 is fixedly mounted thereon. A vertical plate 11 is fixedly mounted on the bottom of the lifting plate 10. A horizontal plate A12 is fixedly mounted on one side of the vertical plate 11. A positioning frame A13 is fixedly mounted on the top of the horizontal plate A12. A squeezing roller A14 is rotatably mounted on the inner wall of the positioning frame A13. When a chip is detected to have an appearance defect, the hydraulic cylinder 9 will retract, thereby driving the lifting plate 10 to move upward. When the lifting plate 10 moves upward, it will drive the horizontal plate A12 to move upward through the vertical plate 11. When the horizontal plate A12 moves upward, it will drive the squeezing roller A14 to move upward through the positioning frame A13. When the squeezing roller A14 moves upward, it will squeeze the placement component from below. After the placement component is squeezed, it will drive the flipping plate 6 to rotate around the torsion spring shaft 5, thereby providing power for automatically removing the defective chip and ensuring the operation of the automatic sorting function.

[0025] like Figure 1 and Figure 7 As shown, the collection assembly includes a fixed base 15, which is fixedly installed on the top of the base 1. A positioning base 16 is fixedly installed on the top of the fixed base 15. A collection box 17 is slidably installed on the inner wall of the positioning base 16. Positioning blocks 18 are symmetrically fixedly installed on the outer wall of the collection box 17, and the positioning blocks 18 are all engaged with the inner wall of the positioning base 16. When sorting defective chips, the flip plate 6 and the placement assembly will tilt towards the collection box 17, and the chips will slide down the inclined surface of the placement assembly into the inner side of the collection box 17, thereby realizing the collection of defective chips. By pulling the collection box 17 outward, the collection box 17 can slide out from the inner side of the positioning base 16, which facilitates the processing of the collected defective chips. The positioning blocks 18 are used to position the collection box 17 to ensure that the collection box 17 is in the designated position.

[0026] like Figures 1 to 3 As shown, the drive assembly includes a support frame 19. Two support frames 19 are symmetrically and fixedly installed on the top of the base 1. A rotating shaft 20 is rotatably installed on the inner wall of each support frame 19, and a drive wheel 21 is fixedly installed on the outer wall of each rotating shaft 20. The conveyor belt 2 is sleeved between the two drive wheels 21. A drive motor 22 is fixedly installed on the outer wall of one of the support frames 19. The output end of the drive motor 22 is fixedly connected to one end of one of the rotating shafts 20. The support frame 19 forms the basic structure of the drive assembly and provides reliable support for the smooth operation of the conveyor belt 2. When the drive motor 22 is started, it drives one of the drive wheels 21 to rotate through the rotating shaft 20. The drive wheel 21, in cooperation with the other drive wheel 21, drives the conveyor belt 2 to operate, providing power for the operation of the device.

[0027] like Figure 4 , Figure 6 and Figure 8 As shown, the placement assembly includes a placement seat 23, which is attached to a flip plate 6. A hinge block B24 is fixedly installed on the outer wall of the placement seat 23, and a hinge base B25 is fixedly installed on one end of the flip plate 6. A connecting shaft 26 is installed between the hinge base B25 and the hinge block B24. A calibration plate 27 is fixedly installed on the inner wall of the placement seat 23, and a counterweight magnet 28 is fixedly installed on the inner wall of the placement seat 23. An adsorption magnet 29 is fixedly installed on the inner wall of the flip plate 6. The adsorption magnet 29 and the counterweight magnet 28 are magnetically attracted to each other. A pressing assembly is provided above one of the placement seats 23. When placing the chip, the chip is placed on the inner side of the placement seat 23 and attached to the calibration plate 27 to achieve chip positioning. The conveyor belt 2... The operation causes the placement seat 23, carrying the chip, to move below the detection component for inspection. When a defect is detected in the chip, the pressure roller A14 moves upward to press the placement seat 23, tilting it towards the collection box 17, thereby sorting out the defective chip. Errors may occur during chip placement, whether mechanical or manual, resulting in the chip failing to adhere to the calibration plate 27. Vibrations generated during device operation may also cause the chip to separate from the calibration plate 27, affecting the detection effect. To address this, when the placement seat 23, carrying the chip, moves below the detection component, the pressing component moves downward to press the placement seat 23. The placement seat 23 rotates around the connecting shaft 26, causing it to tilt vertically. The plate 11 is tilted, and after the placement seat 23 tilts, the chip slides along its inclined plane towards the calibration plate 27 until the chip is in contact with the calibration plate 27, thereby calibrating the chip. A counterweight magnet 28 is used to increase the weight at one end of the placement seat 23, ensuring that the placement seat 23 can return to its original position. An adsorption magnet 29 attracts the counterweight magnet 28, thus positioning the placement seat 23 and preventing it from rotating when it moves under the conveyor belt 2. This invention considers potential errors during chip placement and the vibration generated by the device operation that could cause the chip to separate from the calibration plate 27. The placement assembly is designed with a unique automatic calibration function. When the placement seat 23 moves with the chip to… When the chip is under the detection component, the pressing component moves down and squeezes the placement seat 23, causing it to tilt towards the vertical plate 11. Under the action of gravity, the chip slides along the inclined plane towards the calibration plate 27 until it re-attaches to the calibration plate 27. This automatic calibration process does not require manual intervention and can ensure that the chip is in the correct detection position in real time, thus ensuring the accuracy and reliability of the detection results. When the placement seat 23 is flipped, the chip angle changes. This design provides convenience for the detection device to capture chip defects from different perspectives. During the chip tilting process, the detection device can scan and detect the chip from multiple angles, which can discover some defects that are difficult to detect under normal perspectives, thus improving the comprehensiveness and accuracy of defect detection.

[0028] like Figures 5 to 6As shown, the pressing assembly includes a horizontal plate B30, which is fixedly installed on one side of the vertical plate 11. A positioning frame B31 is fixedly installed at the bottom of the horizontal plate B30, and a pressing roller B32 is rotatably installed on the inner wall of the positioning frame B31. The pressing roller B32 is connected to the vertical plate 11 through the positioning frame B31 and the horizontal plate B30. During calibration, the vertical plate 11 is moved downward by the extension of the hydraulic cylinder 9, which causes the pressing roller B32 to move downward to press the placement seat 23. No additional power is required, saving energy consumption and reducing equipment operating costs.

[0029] like Figure 1 and Figure 9 As shown, two support legs 33 are fixedly installed on the top of the base 1, and a feeding frame 34 is fixedly installed between the tops of the two support legs 33. The feeding frame 34 is located on one side of the conveyor belt 2, and a feeding component is provided on the top of the base 1. When the chip is detected to have no appearance defects, the conveyor belt 2 will continue to transport the chip through the placement seat 23. During the subsequent transport, the placement seat 23 will pass through the feeding component. The feeding component will cause the placement seat 23 to tilt around the torsion spring shaft 5 towards the feeding frame 34. The chip will slide down the placement seat 23 into the inner side of the feeding frame 34. After entering the inner side of the feeding frame 34, the chip will slide down its inclined surface to the subsequent processing equipment, thereby achieving the effect of automatic feeding. The automatic feeding function realizes the continuous operation of chip detection and feeding, reduces manual intervention and operation time. After the chip passes the detection, it can quickly and automatically enter the subsequent processing equipment, shorten the production cycle, improve production efficiency, and meet the needs of large-scale production. When the placement seat 23 passes the feeding component, the placement seat 23 will reset again under the action of the torsion spring shaft 5.

[0030] like Figure 2 and Figure 10 As shown, the unloading assembly includes a connecting plate 35, which is fixedly installed on the top of the base 1. A receiving frame 36 is fixedly installed at the end of the connecting plate 35, and an arc-shaped guide rail 37 is fixedly installed on the inner side of the receiving frame 36. The arc-shaped guide rail 37 abuts against one of the placement seats 23. The arc-shaped guide rail 37 is fixed on the moving path of the placement seat 23 through the receiving frame 36 and the connecting plate 35. During the process of the placement seat 23 following the conveyor belt 2 to transport the chip, the placement seat 23 will pass through the arc-shaped guide rail 37. The arc-shaped guide rail 37 will squeeze the placement seat 23 to make it rotate around the torsion spring shaft 5, thereby tilting it in the direction of the lower loading frame 34 for unloading. This method of tilting the placement seat 23 by mechanical extrusion does not require an additional power source, simplifies the structure of the unloading assembly, and reduces energy consumption and equipment costs.

[0031] like Figure 9As shown, a baffle 38 is fixedly installed on the inner wall of the feeding frame 34, and a feeding port 39 is opened at the bottom of the baffle 38. When the placement seat 23 first tilts, the baffle 38 will block the end of the placement seat 23 to prevent the chip from falling. When the chip is aligned with the feeding port 39, the chip will slide from the feeding port 39 to the top of the feeding frame 34. When the placement seat 23 first tilts, the chip tends to slide downwards due to gravity. At this time, the baffle 38 blocks the end of the placement seat 23, effectively preventing the chip from falling too early and avoiding the chip from falling directly from a high position to the inside of the feeding frame 34. This reduces the risk of chip damage due to excessive impact, ensures the integrity and quality of the chip, and reduces the defect rate in the production process.

[0032] like Figure 5 As shown, the detection assembly includes a sliding column 40, which is slidably mounted on the inner wall of the mounting frame 8. A detection probe 41 is fixedly mounted on one end of the sliding column 40, and a connecting block 42 is fixedly mounted between the detection probe 41 and the lifting plate 10. The detection probe 41 is connected to the lifting plate 10 through the connecting block 42. The lifting plate 10 is raised and lowered by the extension and retraction of the hydraulic cylinder 9, and the lifting plate 10 will then raise and lower the detection probe 41 through the connecting block 42. This allows for dynamic adjustment of the height of the detection probe 41 according to the specific specifications of the chip. Whether it is a thin chip or a thick chip, the detection probe 41 can be adjusted to the optimal detection position to ensure the comprehensiveness and accuracy of the detection.

[0033] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip appearance defect detection stage, comprising a base (1), characterized in that: A conveyor belt (2) is provided above the base (1). A drive assembly is provided between the conveyor belt (2) and the base (1). A detection assembly is provided above the conveyor belt (2). Several hinge blocks A (3) are uniformly fixedly installed on the outer wall of the conveyor belt (2). A hinge seat A (4) is rotatably installed on the outer wall of each hinge block A (3). A torsion spring shaft (5) is installed between the hinge seat A (4) and the hinge block A (3). A flip plate (6) is fixedly installed on the outer wall of each hinge seat A (4). Several support blocks (7) are uniformly fixedly installed on the outer wall of the conveyor belt (2). The support blocks (7) abut against the flip plate (6). A placement assembly is provided on the side of the flip plate (6) away from the hinge seat A (4). A lifting assembly and a collecting assembly are provided on the top of the base (1).

2. The semiconductor chip appearance defect detection stage according to claim 1, characterized in that: The lifting assembly includes a mounting frame (8), which is fixedly installed on the top of the base (1). A hydraulic cylinder (9) is fixedly installed on the horizontal section of the mounting frame (8). The output shaft of the hydraulic cylinder (9) passes through the mounting frame (8) and a lifting plate (10) is fixedly installed thereon. A vertical plate (11) is fixedly installed at the bottom of the lifting plate (10). A horizontal plate A (12) is fixedly installed on one side of the vertical plate (11). A positioning frame A (13) is fixedly installed at the top of the horizontal plate A (12). An extrusion roller A (14) is rotatably installed on the inner wall of the positioning frame A (13).

3. The semiconductor chip appearance defect detection stage according to claim 1, characterized in that: The collection assembly includes a fixed base (15), which is fixedly installed on the top of the base (1). A positioning base (16) is fixedly installed on the top of the fixed base (15). A collection box (17) is slidably installed on the inner wall of the positioning base (16). Positioning blocks (18) are symmetrically fixedly installed on the outer wall of the collection box (17). The positioning blocks (18) are all snapped into the inner wall of the positioning base (16).

4. The semiconductor chip appearance defect detection stage according to claim 1, characterized in that: The drive assembly includes a support frame (19), two of which are symmetrically fixedly installed on the top of the base (1). The inner wall of each support frame (19) is rotatably mounted with a rotating shaft (20), and the outer wall of each rotating shaft (20) is fixedly mounted with a drive wheel (21). The conveyor belt (2) is sleeved between the two drive wheels (21). One of the support frames (19) has a drive motor (22) fixedly mounted on its outer wall. The output end of the drive motor (22) is fixedly connected to one end of one of the rotating shafts (20).

5. A semiconductor chip appearance defect detection platform according to claim 2, characterized in that: The placement assembly includes a placement seat (23), which is attached to a flip plate (6). A hinge block B (24) is fixedly installed on the outer wall of the placement seat (23). A hinge seat B (25) is fixedly installed at one end of the flip plate (6). A connecting shaft (26) is installed between the hinge seat B (25) and the hinge block B (24). A calibration plate (27) is fixedly installed on the inner wall of the placement seat (23). A counterweight magnet (28) is fixedly installed on the inner wall of the placement seat (23). An adsorption magnet (29) is fixedly installed on the inner wall of the flip plate (6). The adsorption magnet (29) and the counterweight magnet (28) are magnetically attracted to each other. A pressing assembly is provided above one of the placement seats (23).

6. The semiconductor chip appearance defect detection stage according to claim 5, characterized in that: The pressing assembly includes a horizontal plate B (30), which is fixedly installed on one side of the vertical plate (11). A positioning frame B (31) is fixedly installed at the bottom of the horizontal plate B (30), and an extrusion roller B (32) is rotatably installed on the inner wall of the positioning frame B (31).

7. A semiconductor chip appearance defect detection stage according to claim 5, characterized in that: Two support legs (33) are fixedly installed on the top of the base (1), and a feeding frame (34) is fixedly installed between the tops of the two support legs (33). The feeding frame (34) is located on one side of the conveyor belt (2), and a feeding assembly is provided on the top of the base (1).

8. A semiconductor chip appearance defect detection stage according to claim 7, characterized in that: The feeding assembly includes a connecting plate (35), which is fixedly installed on the top of the base (1). A receiving frame (36) is fixedly installed at the end of the connecting plate (35). An arc-shaped guide rail (37) is fixedly installed on the inner side of the receiving frame (36). The arc-shaped guide rail (37) abuts against one of the placement seats (23).

9. A semiconductor chip appearance defect detection stage according to claim 7, characterized in that: The inner wall of the feeding frame (34) is fixedly installed with a baffle (38), and the bottom of the baffle (38) is provided with a feeding port (39).

10. A semiconductor chip appearance defect detection stage according to claim 2, characterized in that: The detection assembly includes a sliding column (40), which is slidably installed on the inner wall of the mounting frame (8). A detection probe (41) is fixedly installed at one end of the sliding column (40), and a connecting block (42) is fixedly installed between the detection probe (41) and the lifting plate (10).

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