Lead frame punching method, punching machine, electronic equipment and medium

Abstract

The invention discloses a lead frame punching method, a punching machine, electronic equipment and a medium, and relates to the technical field of lead frames. The method comprises the steps that a first round corner is arranged on a punch, a second round corner is arranged on a stamping groove, and a first preset gap is kept between the first round corner and the second round corner; the raw materials are divided into a plurality of machining areas, and the moving step pitch of the raw materials is determined according to the sizes of the machining areas; the raw materials are fed through the progressive feeding mechanism, so that the raw materials move on the punching machine in the machining direction in sequence at the moving step pitch; the salient point forming mechanism is used for sequentially machining each machining area to form salient points; a first through hole is punched in each machining area in sequence through a pre-punching mechanism; blanking is conducted on all the machining areas in sequence through a blanking mechanism; forming is conducted on each machining area in sequence through a forming mechanism; and cutting each processing area in sequence through a cutting mechanism to obtain the lead frame. The method can optimize stress distribution and reduce burrs.

Description

Technical Field

[0001] This invention relates to the field of lead frame technology, and in particular to a lead frame stamping method, stamping machine, electronic device, and dielectric. Background Technology

[0002] Leadframes are the core component of semiconductor packaging, responsible for external transmission of electrical signals and mechanical support of the internal chip. Depending on the manufacturing process, leadframes are divided into stamped and etched types. Etching is mainly used for leadframes with 100 pins or more, but faces greater environmental pressures and equipment costs; therefore, stamping is currently the primary method. With the rapid development of electronic information technology, the performance requirements for integrated circuits and discrete devices are becoming increasingly diverse, and the reliability requirements are becoming increasingly stringent, while costs must also be reduced. This continuously drives leadframes towards higher density, higher reliability, and lower cost. Consequently, the development of new high-density leadframes has accelerated significantly, while traditional leadframes are also evolving towards multi-row designs. However, traditional stamping methods are not ideal for multi-row leadframes, easily leading to frame deformation due to stress, and producing numerous burrs during the stamping process. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a lead frame stamping method, stamping machine, electronic equipment, and dielectric that can optimize stress and burrs.

[0004] In a first aspect, according to an embodiment of the present invention, a lead frame stamping method is applied to a controller of a stamping machine, wherein the stamping machine is sequentially provided with a protrusion forming mechanism, a pre-punching mechanism, a blanking mechanism, a forming mechanism, and a cutting mechanism along the processing direction, wherein the blanking mechanism includes a punch and a stamping groove disposed opposite to each other; the method includes: Based on the thickness of the raw material, a first rounded corner is provided for the punch, and a second rounded corner is provided for the stamping groove, so that a first preset gap is maintained between the first rounded corner and the second rounded corner, wherein the first preset gap is determined according to the thickness; The raw material is divided into multiple equally spaced processing areas, and the moving step distance of the raw material is determined according to the size of the processing area. According to the moving step distance, the raw material is fed by the progressive feeding mechanism, so that the raw material moves sequentially along the processing direction on the stamping press with the moving step distance; The protrusion forming mechanism sequentially processes each of the processing areas to form protrusions. The pre-punching mechanism sequentially punches a first through hole in each of the processing areas; The blanking mechanism sequentially blanks each of the processing areas; The forming mechanism sequentially shapes each of the processing areas; The cutting mechanism sequentially cuts the connection between each processing area and the adjacent processing area to obtain the lead frame.

[0005] According to some embodiments of the present invention, the step of providing a first fillet to the punch and a second fillet to the stamping groove based on the thickness of the raw material, such that a first preset gap is maintained between the first fillet and the second fillet, includes: Create a first mapping table, which includes multiple first elements, each of which is used to characterize a first design ratio corresponding to different thickness ranges; Based on the thickness of the raw material and the first mapping table, determine the target first element and the target first design ratio corresponding to the raw material; The first preset gap is determined by multiplying the thickness of the raw material by the target first design ratio.

[0006] According to some embodiments of the present invention, a punching mechanism is further provided between the pre-punching mechanism and the blanking mechanism, the punching mechanism including a cutting head and a cavity arranged opposite to each other; The method of setting a first rounded corner on the punch and a second rounded corner on the stamping groove according to the thickness of the raw material, and maintaining a first preset gap between the first rounded corner and the second rounded corner, further includes: Based on the thickness of the raw material, a third fillet is provided for the cutting head, and a fourth fillet is provided for the cavity, so that a second preset gap is maintained between the third fillet and the fourth fillet; After the punching mechanism punches the processing area, it punches a hole in the processing area through the cooperation of the cutter head and the cavity to form a second through hole; wherein the second through hole is offset from the first through hole.

[0007] According to some embodiments of the present invention, the step of setting a third fillet for the cutting head and a fourth fillet for the cavity based on the thickness of the raw material, and maintaining a second preset gap between the third fillet and the fourth fillet, includes: A second mapping table is created, which includes multiple second elements. Each second element is used to represent a second design ratio corresponding to different thickness ranges; wherein, the second design ratio corresponding to the same thickness range is less than the first design ratio. Based on the thickness of the raw material and the second mapping table, determine the target second element and the target second design ratio corresponding to the raw material; The second preset gap is determined by multiplying the thickness of the raw material by the target second design ratio.

[0008] According to some embodiments of the present invention, the step of sequentially punching each of the processing areas by the punching mechanism includes: The punch is controlled to descend at a first speed; When the distance between the punch and the raw material is less than a preset distance, the punch is controlled to descend at a second speed; the second speed is less than the first speed. When the punch comes into contact with the surface of the raw material, the punch is controlled to apply a preset pressure to the raw material to punch and form a groove.

[0009] According to some embodiments of the present invention, the bottom of the punch is provided with a guide post adapted to the first through hole; When the distance between the punch and the raw material is less than a preset distance, the punch is controlled to descend at a second speed. When the guide post enters the first through hole, the punch is controlled to descend at a second speed until the guide post is fully inserted into the first through hole; When there is a deviation between the guide post and the first through hole, the press is controlled to stop working, and the moving step distance, the pre-punching mechanism and the blanking mechanism are detected.

[0010] According to some embodiments of the present invention, the step of sequentially punching each of the processing areas by the punching mechanism includes: Lubricating oil is applied to the surface of the punch and / or the inner wall of the stamping groove; The punch and the stamping groove, after being coated with lubricating oil, cooperate to punch each of the processing areas in sequence. Secondly, according to an embodiment of the present invention, the stamping machine is provided with a protrusion forming mechanism, a pre-punching mechanism, a blanking mechanism, a forming mechanism and a cutting mechanism in sequence along the processing direction. The blanking mechanism includes a punch and a stamping groove arranged opposite to each other. The stamping machine is used to implement the lead frame stamping method described in the first aspect embodiment.

[0011] Thirdly, an electronic device according to an embodiment of the present invention includes at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor, the instructions being executed by the at least one control processor to enable the at least one control processor to perform the lead frame stamping method as described in the first aspect embodiment.

[0012] Fourthly, according to an embodiment of the present invention, the storage medium stores computer-executable instructions for causing a computer to perform the lead frame stamping method described in the first aspect embodiment.

[0013] The lead frame stamping method, stamping machine, electronic device, and medium according to embodiments of the present invention have at least the following beneficial effects: By setting a first fillet on the punch and a second fillet on the stamping groove, a suitable first preset gap is maintained between the first and second fillets, thereby optimizing stress distribution and reducing burrs; by processing the processing area with a protrusion forming mechanism, the overall stress distribution is made more uniform, achieving the purpose of reducing and homogenizing internal stress. The raw material is punched by a pre-punching mechanism to form the first through hole required for the lead frame. Simultaneously, this first through hole can also serve as a guide hole during the punching process of the blanking mechanism, thereby improving the punching accuracy of the blanking mechanism. After pre-punching, the raw material is punched to form the various slots required for the lead frame. Finally, the raw material is cut by a cutting mechanism, cutting each processing area from the raw material to form the lead frame.

[0014] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0015] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a flowchart illustrating the steps of the lead frame stamping method according to an embodiment of the present invention. Figure 2 This is a schematic diagram of the structure of the stamping machine according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the punch and stamping groove according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the lead frame structure according to an embodiment of the present invention. Detailed Implementation

[0016] The embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. The step numbers in the following embodiments are set only for ease of explanation, and there is no limitation on the order between the steps. The execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0017] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0018] The terms "first," "second," "third," and "fourth," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0019] In this invention, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0020] Leadframes are the core component of semiconductor packaging, responsible for external transmission of electrical signals and mechanical support of the internal chip. Depending on the manufacturing process, leadframes are divided into stamped and etched types. Etching is mainly used for leadframes with 100 pins or more, but faces greater environmental pressures and equipment costs; therefore, stamping is currently the primary method. With the rapid development of electronic information technology, the performance requirements for integrated circuits and discrete devices are becoming increasingly diverse, and the reliability requirements are becoming increasingly stringent, while costs must also be reduced. This continuously drives leadframes towards higher density, higher reliability, and lower cost. Consequently, the development of new high-density leadframes has accelerated significantly, while traditional leadframes are also evolving towards multi-row designs. However, traditional stamping methods are not ideal for multi-row leadframes, easily generating stress that causes frame deformation, and producing numerous burrs during the stamping process.

[0021] To address this, embodiments of the present invention provide a lead frame stamping method, a stamping machine, an electronic device, and a medium. By setting a first rounded corner on the punch and a second rounded corner on the stamping groove, a suitable first preset gap is maintained between the first and second rounded corners, thereby optimizing stress distribution and reducing burrs. A protrusion forming mechanism processes protrusions in the processing area, making the overall stress distribution more uniform and achieving the purpose of reducing and homogenizing internal stress. A pre-punching mechanism punches holes in the raw material to form the first through-hole required for the lead frame. Simultaneously, this first through-hole can also serve as a guide hole during the punching process of the blanking mechanism, thereby improving the punching accuracy of the blanking mechanism. After pre-punching, the raw material is punched to form the various slots required for the lead frame. Finally, a cutting mechanism cuts the raw material, separating each processing area from the raw material to form the lead frame.

[0022] The lead frame stamping method, stamping machine, electronic equipment, and medium of the present invention will now be described in detail with reference to the accompanying drawings.

[0023] On one hand, this invention provides a lead frame stamping method applied to the controller of a stamping machine 100. The stamping machine 100 is sequentially equipped with a protrusion forming mechanism, a pre-punching mechanism, a blanking mechanism, a forming mechanism, and a cutting mechanism along the processing direction. The blanking mechanism includes a punch 110 and a stamping groove 120 arranged opposite to each other. Figure 1 and Figure 2 As shown, the lead frame stamping method includes the following steps: Step S100: Based on the thickness of the raw material, a first fillet is set on the punch 110 and a second fillet is set on the stamping groove 120, so that a first preset gap is maintained between the first fillet and the second fillet, wherein the first preset gap is determined according to the thickness. Step S200: Divide the raw material into multiple equally spaced processing areas, and determine the moving step distance of the raw material according to the size of the processing area; Step S300: According to the moving step distance, the raw material is fed by the progressive feeding mechanism 200, so that the raw material moves sequentially along the processing direction on the stamping press 100 with the moving step distance. Step S400: The bump forming mechanism sequentially processes each processing area to form bumps; Step S500: The first through hole is punched sequentially in each processing area by the pre-punching mechanism; Step S600: The punching mechanism punches each processing area sequentially; Step S700: Each processing area is formed sequentially by the forming mechanism; Step S800: The connection between each processing area and the adjacent processing area is cut sequentially by the cutting mechanism to obtain the lead frame.

[0024] It should be noted that the punch 110 and the stamping groove 120 constitute the blanking die of the blanking mechanism, such as Figure 3 As shown, by setting a first fillet α on the punch 110 and a second fillet β on the stamping groove 120, problems such as stress concentration, lateral force, and raw material deformation during stamping can be avoided. However, if the gap between the first fillet α of the punch 110 and the second fillet β of the stamping groove 120 is not set properly, it will produce more burrs, affecting product quality. Therefore, it is necessary to adjust the gap between the first fillet α and the second fillet β to optimize stress and reduce burrs. To this end, this application sets a first preset gap between the first fillet α and the second fillet β according to the thickness of the raw material, so that the first preset gap matches the stamping force to achieve the required stress and burr effect.

[0025] After setting the structure of the punch 110 and the stamping groove 120, they are installed on the stamping mechanism; then, the complete stamping process of the raw material begins. It should be noted that during stamping, the raw material is relatively long, allowing for the stamping of multiple required lead frames. Therefore, based on the dimensions of each lead frame, the raw material needs to be divided into multiple equally spaced processing areas, each corresponding to one lead frame, and the movement step distance of the raw material is determined according to the dimensions of the processing areas. During the stamping process, the raw material is fed by a progressive feeding mechanism, causing it to move sequentially along the processing direction on the stamping press 100 with a movement step distance, each time moving the distance of one processing area, allowing each mechanism to process different processing areas. For example, when the first processing area moves to the forming mechanism, the second processing area is located at the blanking mechanism, the third processing area at the pre-punching mechanism, and the fourth processing area at the protrusion forming mechanism. At this time, when the press 100 operates, the protrusion forming mechanism punches protrusions into the fourth processing area, the pre-punching mechanism pre-punches holes in the third processing area, the blanking mechanism blanks the second processing area, and the forming mechanism forms the first processing area. After completing this stamping process, the progressive feeding mechanism 200 moves the raw material by a predetermined step distance. At this point, when the first processing area moves to the cutting mechanism, the second processing area is located at the forming mechanism, the third processing area at the blanking mechanism, the fourth processing area at the pre-punching mechanism, and the fifth processing area at the protrusion forming mechanism. The cutting mechanism cuts the first processing area to form a lead frame. This process continues sequentially; after each stamping operation, the progressive feeding mechanism moves the raw material by a predetermined step distance for the next stamping operation.

[0026] It should be noted that the bump forming mechanism is used to create bumps in the processing area. By applying pressure to specific locations on the sheet metal through the bumps, local plastic deformation occurs. This process disrupts the original stress balance within the material, thereby creating a beneficial compressive stress field around the bumps. This compressive stress field can effectively counteract some of the original tensile stress in the material, making the overall stress distribution more uniform and achieving the purpose of reducing and homogenizing internal stress.

[0027] The pre-punching mechanism is mainly used to punch holes in the raw material to form the first through hole required for the lead frame. Simultaneously, this first through hole also serves as a guide hole for the blanking mechanism, thereby improving the blanking accuracy. After pre-punching, the raw material is blanked to form the various slots required for the lead frame. During blanking, the punch 110 punches downwards, allowing the punch 110 and the stamping groove 120 to cooperate in blanking the raw material, thus forming the slots. Because the punch 110 has a first fillet α and the stamping groove 120 has a second fillet β, stress is optimized and burrs are reduced, thereby improving product quality. After blanking, the raw material is shaped by a forming device. The forming process can include bending, deformation, side punching, and other processes required for the product. Finally, the raw material is cut by a cutting mechanism, separating each processing area from the raw material to form the lead frame. The final lead frame is as follows: Figure 4 As shown.

[0028] It should be noted that the protrusion forming mechanism, pre-punching mechanism, punching mechanism, forming mechanism and cutting mechanism are all composed of upper and lower dies. The corresponding die is selected according to different functions. This is a common structure in this technical field, and its specific structure will not be described in detail here.

[0029] The progressive feeding mechanism 200 feeds the raw material according to a preset step. The progressive feeding mechanism 200 has a clamping component inside for pressing the raw material. During feeding, the clamping component presses the raw material, adjusting the feeding tension. When stamping, the stamping bar 130 of the stamping machine presses down on the rotating roller 210 of the progressive feeding mechanism 200. The rotating roller 210 drives the clamping component to rise, releasing the raw material and preventing deformation of the raw material due to the pressing force during stamping. After stamping is completed, the rotating roller 210 drives the clamping component to reset.

[0030] According to some embodiments of this application, the above-mentioned step S100, which involves setting a first fillet α for the punch 110 and a second fillet β for the stamping groove 120 based on the thickness of the raw material, so that a first preset gap is maintained between the first fillet α and the second fillet β, specifically includes the following three sub-steps: Step S110: Create a first mapping table. The first mapping table includes multiple first elements, each of which is used to characterize the first design ratio corresponding to different thickness ranges. Step S120: Determine the target first element and target first design ratio corresponding to the raw material based on the thickness of the raw material and the first mapping table; Step S130: Determine the first preset gap based on the product of the thickness of the raw material and the target first design ratio.

[0031] It should be noted that the first mapping table sets multiple thickness ranges, each with a corresponding first design ratio. Each first element includes the thickness range and the first design ratio, and can be represented as (thickness range, first design ratio), as shown in the table below:

[0032] The above is only an example. The specific data is obtained based on actual experiments to determine the optimal first design ratio for each thickness range. In this way, the corresponding first design ratio can be selected according to the thickness of different materials. Then, the first design ratio is multiplied by the thickness of the raw material to obtain the first preset gap. The first preset gap is used to set the first radius α of the punch 110 and the second radius β of the stamping groove 120.

[0033] Furthermore, in some embodiments of this application, a punching mechanism is further provided between the blanking mechanism and the pre-punching mechanism, the punching mechanism including a cutting head and a cavity disposed opposite to each other; in this example, the lead frame stamping method further includes the following steps: Based on the thickness of the raw material, a third fillet is set for the cutter head and a fourth fillet is set for the cavity, so that a second preset gap is maintained between the third fillet and the fourth fillet; After the punching mechanism punches the processing area, it punches holes in the processing area through the cooperation of the cutter head and the cavity to form a second through hole; wherein the second through hole is staggered from the first through hole.

[0034] It should be noted that when the lead frame requires a large number of through holes, a punching mechanism is also set up to avoid excessive stress during stamping. The pre-punching mechanism is only responsible for punching the first through hole for guidance, while the remaining through holes are punched by the punching mechanism to form the second through hole. Dividing all the through holes into two punching operations with staggered distribution can further optimize stress distribution and improve the stamping effect. During punching, in order to improve the punching effect, a third fillet is set on the cutting head of the punching mechanism, and a fourth fillet is set on the cavity of the punching mechanism, so that a second preset gap is maintained between the third fillet and the fourth fillet.

[0035] In some embodiments of this application, the above-mentioned step of: setting a third fillet for the cutting head and a fourth fillet for the cavity according to the thickness of the raw material, and maintaining a second preset gap between the third fillet and the fourth fillet, includes: Create a second mapping table, which includes multiple second elements. Each second element is used to represent the second design ratio corresponding to different thickness ranges. The second design ratio corresponding to the same thickness range is less than the first design ratio. Based on the thickness of the raw materials and the second mapping table, determine the target second element and the target second design ratio corresponding to the raw materials; The second preset gap is determined by multiplying the thickness of the raw material by the target second design ratio.

[0036] The second mapping table is similar in form to the first mapping table. In the second mapping table, multiple thickness ranges are set, each with a corresponding second design ratio. Each second element includes the thickness range and the second design ratio, and can be represented as (thickness range, second design ratio), as shown in the table below:

[0037] It should be noted that the size of the die clearance will affect the elastic recovery after punching. Punching requires high punching accuracy. In order to reduce the extrusion of raw materials during punching, the first preset clearance of the first fillet α and the second fillet β needs to be slightly larger. For punching, we want the hole size to be accurate and the burrs to be small, so a smaller clearance is needed to suppress the elastic expansion of the hole diameter. Therefore, the second design ratio needs to be smaller than the first design ratio.

[0038] Furthermore, in some embodiments of this application, step S600 above, which involves sequentially punching each processing area using a punching mechanism, includes the following three steps: Step S610: Control the punch 110 to descend at a first speed; Step S620: When the distance between the punch 110 and the raw material is less than the preset distance, the punch 110 is controlled to descend at a second speed; the second speed is less than the first speed. Step S630: After the punch 110 comes into contact with the surface of the raw material, control the punch 110 to apply a preset pressure to the raw material to punch and form a groove.

[0039] During the blanking process, firstly, the punch 110 is controlled to descend at a relatively fast initial speed, allowing it to quickly approach the raw material. Just before contact, the speed of the punch 110 is reduced, bringing it closer to the raw material at a second speed to minimize impact and prevent damage. Finally, the required preset pressure is applied to the punch 110 to blank the raw material, forming the desired groove. It should be noted that since other mechanisms operate synchronously with the blanking mechanism, their stamping speeds are consistent with those of the blanking mechanism.

[0040] Furthermore, in some embodiments of this application, the bottom of the punch 110 is provided with a guide post adapted to the first through hole; the above-mentioned step S620: when the distance between the punch 110 and the raw material is less than a preset distance, controlling the punch 110 to descend at a second speed includes the following two steps: When the guide post enters the first through hole, the control punch 110 descends at a second speed until the guide post is fully inside the first through hole; When there is a deviation between the guide post and the first through hole, the press 100 is stopped and the moving step distance, pre-punching mechanism and blanking mechanism are checked.

[0041] Specifically, when the guide post enters the first through hole, it indicates that the punch 110 is about to contact the raw material. At this time, the descent speed of the punch 110 is reduced until the guide post completely enters the first copper block. At this point, the punch 110 contacts the raw material, and then the raw material is punched according to the preset pressure. However, when there is a deviation between the guide post and the first through hole, it indicates that there is a problem with the stamping accuracy of the press 100. At this time, the press 100 needs to be stopped, and the structure of the set moving step distance, pre-punching mechanism and punching mechanism needs to be checked to troubleshoot the fault and avoid producing defective products.

[0042] Furthermore, in some embodiments of this application, step S600 above, which involves sequentially punching each processing area using a punching mechanism, includes: Lubricating oil is applied to the surface of the punch 110 and / or the inner wall of the stamping groove 120; The punch 110, coated with lubricating oil, and the stamping groove 120 work together to punch each processing area in sequence.

[0043] By applying lubricating oil, the coefficient of friction can be reduced, wear and frictional heat can be decreased, and mold overheating, chipping, scoring and sintering can be prevented; scratches, scoring and burrs on the surface of raw materials can be reduced, and surface finish can be improved; it can facilitate metal flow, reduce defects such as cracking and deformation, and reduce stamping pressure.

[0044] According to embodiments of the present invention, the lead frame stamping method, stamping machine, electronic device, and medium optimize stress distribution and reduce burrs by setting a first rounded corner on the punch and a second rounded corner on the stamping groove, maintaining a suitable first preset gap between the first and second rounded corners. A protrusion forming mechanism processes protrusions in the processing area, making the overall stress distribution more uniform and reducing and homogenizing internal stress. A pre-punching mechanism punches holes in the raw material to form the first through hole required for the lead frame. This first through hole also serves as a guide hole for the blanking mechanism, improving the blanking accuracy. After pre-punching, the raw material is blanked to form the various slots required for the lead frame. Finally, a cutting mechanism cuts the raw material, separating each processing area from the raw material to form the lead frame.

[0045] On the other hand, the present invention also proposes a stamping machine, which includes a protrusion forming mechanism, a pre-punching mechanism, a blanking mechanism, a forming mechanism and a cutting mechanism arranged sequentially along the processing direction. The blanking mechanism includes a punch and a stamping groove arranged opposite to each other. The stamping machine is used to implement the lead frame stamping method described in the first aspect embodiment.

[0046] It should be noted that the content of the above method embodiments is applicable to this device embodiment. The specific functions implemented in this embodiment are the same as those in the above method embodiments, and the beneficial effects achieved are also the same as those achieved in the above method embodiments.

[0047] On the other hand, embodiments of the present invention also provide an electronic device, including at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor, the instructions being executed by the at least one control processor to enable the at least one control processor to perform the lead frame stamping method as described in the first aspect embodiment. On the other hand, embodiments of the present invention also provide a storage medium, which is a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described lead frame stamping method.

[0048] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof. The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separate, and may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0049] Although specific embodiments are described herein, those skilled in the art will recognize that many other modifications or alternative embodiments are also within the scope of this disclosure. For example, any of the functions and / or processing capabilities described in connection with a particular device or component can be performed by any other device or component. Furthermore, while various exemplary embodiments and architectures have been described according to embodiments of this disclosure, those skilled in the art will recognize that many other modifications to the exemplary embodiments and architectures described herein are also within the scope of this disclosure.

[0050] The foregoing description, with reference to block diagrams and flowcharts of systems, methods, systems, and / or computer program products according to exemplary embodiments, has described certain aspects of this disclosure. It should be understood that one or more blocks in the block diagrams and flowcharts, as well as combinations of blocks in the block diagrams and flowcharts, can be implemented by executing computer-executable program instructions, respectively. Similarly, according to some embodiments, some blocks in the block diagrams and flowcharts may not need to be executed in the order shown, or may not all need to be executed. Furthermore, additional components and / or operations beyond those shown in the blocks in the block diagrams and flowcharts may exist in some embodiments.

[0051] Therefore, blocks in block diagrams and flowcharts support combinations of means for performing a specified function, combinations of elements or steps for performing a specified function, and program instruction means for performing a specified function. It should also be understood that each block in a block diagram and flowchart, and combinations of blocks in block diagrams and flowcharts, can be implemented by a dedicated hardware computer system or a combination of dedicated hardware and computer instructions that performs a specific function, element, or step.

[0052] The program modules, applications, etc., described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functionality described herein (e.g., one or more operations of the exemplary methods described herein) to be performed.

[0053] Software components can be coded using any of a variety of programming languages. An exemplary programming language could be a low-level programming language, such as assembly language associated with a specific hardware architecture and / or operating system platform. Software components including assembly language instructions may need to be converted into executable machine code by an assembler before being executed by the hardware architecture and / or platform. Another exemplary programming language could be a higher-level programming language that is portable across multiple architectures. Software components including higher-level programming languages ​​may need to be converted into an intermediate representation by an interpreter or compiler before execution. Other examples of programming languages ​​include, but are not limited to, macro languages, shell or command languages, job control languages, scripting languages, database query or search languages, or report writing languages. In one or more exemplary embodiments, a software component containing instructions from one of the above-described programming language examples can be executed directly by the operating system or other software components without first being converted into another form.

[0054] Software components can be stored as files or other data storage structures. Software components of similar type or related function can be stored together in a specific directory, folder, or library. Software components can be static (e.g., pre-defined or fixed) or dynamic (e.g., created or modified at runtime).

[0055] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A method for stamping a lead frame, characterized in that, A controller for a stamping press, wherein the stamping press is sequentially arranged along the processing direction as a protrusion forming mechanism, a pre-punching mechanism, a blanking mechanism, a forming mechanism, and a cutting mechanism, wherein the blanking mechanism includes a punch and a stamping groove arranged opposite each other; the method includes: Based on the thickness of the raw material, a first rounded corner is provided for the punch, and a second rounded corner is provided for the stamping groove, so that a first preset gap is maintained between the first rounded corner and the second rounded corner, wherein the first preset gap is determined according to the thickness; The raw material is divided into multiple equally spaced processing areas, and the moving step distance of the raw material is determined according to the size of the processing area. According to the moving step distance, the raw material is fed by the progressive feeding mechanism, so that the raw material moves sequentially along the processing direction on the stamping press with the moving step distance; The protrusion forming mechanism sequentially processes each of the processing areas to form protrusions. The pre-punching mechanism sequentially punches a first through hole in each of the processing areas; The blanking mechanism sequentially blanks each of the processing areas; The forming mechanism sequentially shapes each of the processing areas; The cutting mechanism sequentially cuts the connection between each processing area and the adjacent processing area to obtain the lead frame.

2. The lead frame stamping method according to claim 1, characterized in that, The step of setting a first rounded corner on the punch and a second rounded corner on the stamping groove according to the thickness of the raw material, so that a first preset gap is maintained between the first rounded corner and the second rounded corner, includes: Create a first mapping table, which includes multiple first elements, each of which is used to characterize a first design ratio corresponding to different thickness ranges; Based on the thickness of the raw material and the first mapping table, determine the target first element and the target first design ratio corresponding to the raw material; The first preset gap is determined by multiplying the thickness of the raw material by the target first design ratio.

3. The lead frame stamping method according to claim 2, characterized in that, A punching mechanism is also provided between the pre-punching mechanism and the blanking mechanism. The punching mechanism includes a cutting head and a cavity arranged opposite to each other. The method of setting a first rounded corner on the punch and a second rounded corner on the stamping groove according to the thickness of the raw material, and maintaining a first preset gap between the first rounded corner and the second rounded corner, further includes: Based on the thickness of the raw material, a third fillet is provided for the cutting head, and a fourth fillet is provided for the cavity, so that a second preset gap is maintained between the third fillet and the fourth fillet; After the punching mechanism punches the processing area, it punches a hole in the processing area through the cooperation of the cutter head and the cavity to form a second through hole; wherein the second through hole is offset from the first through hole.

4. The lead frame stamping method according to claim 3, characterized in that, The step of setting a third fillet for the cutting head and a fourth fillet for the cavity based on the thickness of the raw material, and maintaining a second preset gap between the third fillet and the fourth fillet, includes: A second mapping table is created, which includes multiple second elements. Each second element is used to represent a second design ratio corresponding to different thickness ranges; wherein, the second design ratio corresponding to the same thickness range is less than the first design ratio. Based on the thickness of the raw material and the second mapping table, determine the target second element and the target second design ratio corresponding to the raw material; The second preset gap is determined by multiplying the thickness of the raw material by the target second design ratio.

5. The lead frame stamping method according to claim 1, characterized in that, The step of sequentially punching each of the processing areas through the punching mechanism includes: The punch is controlled to descend at a first speed; When the distance between the punch and the raw material is less than a preset distance, the punch is controlled to descend at a second speed; the second speed is less than the first speed. When the punch comes into contact with the surface of the raw material, the punch is controlled to apply a preset pressure to the raw material to punch and form a groove.

6. The lead frame stamping method according to claim 5, characterized in that, The bottom of the punch is provided with a guide post that is adapted to the first through hole; When the distance between the punch and the raw material is less than a preset distance, the punch is controlled to descend at a second speed. When the guide post enters the first through hole, the punch is controlled to descend at a second speed until the guide post is fully inserted into the first through hole; When there is a deviation between the guide post and the first through hole, the press is controlled to stop working, and the moving step distance, the pre-punching mechanism and the blanking mechanism are detected.

7. The lead frame stamping method according to claim 1, characterized in that, The step of sequentially punching each of the processing areas through the punching mechanism includes: Lubricating oil is applied to the surface of the punch and / or the inner wall of the stamping groove; The punch and the stamping groove, after being coated with lubricating oil, cooperate to punch each of the processing areas in sequence.

8. A stamping machine, characterized in that, The stamping machine is provided with a protrusion forming mechanism, a pre-punching mechanism, a blanking mechanism, a forming mechanism and a cutting mechanism in sequence along the processing direction. The blanking mechanism includes a punch and a stamping groove arranged opposite to each other. The stamping machine is used to implement the lead frame stamping method as described in any one of claims 1-7.

9. An electronic device, characterized in that, It includes at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor to enable the at least one control processor to perform the lead frame stamping method as described in any one of claims 1 to 7.

10. A storage medium, characterized in that, The storage medium stores computer-executable instructions for causing a computer to perform the lead frame stamping method according to any one of claims 1-7.

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