Phased-array antenna reflow soldering tool and method
By using a phased array antenna reflow soldering fixture, the welding efficiency and consistency of phased array antennas have been improved, solving the problems of low efficiency and poor consistency in manual soldering and increasing the product qualification rate.
Patent Information
- Application Number
- CN202511720264.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-21
- Publication Date
- 2026-02-24
AI Technical Summary
The welding of existing phased array antennas mainly relies on manual labor, resulting in low production efficiency, poor solder joint consistency, and low product qualification rate.
A phased array antenna reflow soldering fixture, including a substrate, support plate, cover plate and positioning components, is used to achieve precise positioning of the insulator and outer conductor through guide posts and elastic elements, and then soldering is carried out in the reflow oven to ensure the consistency of the height and size of the solder joints.
It improved welding efficiency, weld consistency, and product qualification rate, increasing production efficiency by 3.5 times and achieving a qualification rate of over 95%, while reducing defect rate and costs.
Smart Images
Figure CN121551750A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of welding fixtures, specifically relating to a phased array antenna reflow welding fixture and method. Background Technology
[0002] In modern radar and communication systems, phased array antennas, with their high operating frequency, wide signal bandwidth, and excellent gain performance, have become a core component in the fields of high-precision detection and high-speed data transmission.
[0003] A phased array antenna, a key component of a certain product, employs an n×n array structure and is assembled from three core components: a radiating plate, multiple insulators, and a ground plane. The radiating plate and ground plane are mounted parallel to each other. The consistency of the solder joints between the radiating plate and the inner conductors of each insulator (the inner conductors are inserted into the radiating plate) directly affects the antenna's VSWR and signal gain. The solder joints between the outer conductors of each insulator and the grounding block (the outer conductors are inserted into the grounding block, and the outer and inner conductors are spaced apart through the insulator body, see...) Figure 1 Consistency is closely related to grounding reliability and array structure stability. Therefore, the welding quality of this type of antenna plays a decisive role in the overall performance.
[0004] However, the aforementioned phased array antennas are currently mainly produced by manual welding, which results in low production efficiency. Furthermore, manual welding suffers from variations in the height and size of the solder joints, leading to poor consistency among the solder joints and a low product qualification rate. Summary of the Invention
[0005] In view of the above-mentioned defects or improvement needs of the existing technology, the present invention provides a phased array antenna reflow soldering fixture and method. The purpose of this reflow soldering fixture is to improve the soldering efficiency and ensure the consistency of solder joint height and size in the subsequent reflow soldering process, thereby improving the product qualification rate.
[0006] To achieve the above objectives, in a first aspect, the present invention provides a phased array antenna reflow soldering fixture, the reflow soldering fixture comprising a substrate, a support plate, a cover plate, and multiple positioning components; The substrate, the support plate, and the cover plate are detachably connected. The substrate has a groove on the side facing the support plate. The substrate and the support plate are stacked together in parallel. The support plate has a plurality of spaced guide holes. The support plate and the cover plate are arranged in parallel and spaced apart. The cover plate has a plurality of spaced solder clearance grooves on the side facing the support plate. Multiple positioning components are arranged at intervals. Each positioning component includes a guide post and an elastic element. Each guide post is movably inserted into the guide hole. One end of each guide post has a coaxially connected positioning ring and is directly opposite the corresponding solder relief groove. The positioning ring is used to insert between the inner conductor and the outer conductor of the insulator in the phased array antenna to abut against the body of the insulator. Each elastic element is located in the groove, and both ends of each elastic element abut against the substrate and the corresponding guide post, respectively.
[0007] Optionally, the substrate has a plurality of spaced-apart first ventilation holes, and the support plate has a plurality of spaced-apart second ventilation holes, each of the first ventilation holes facing the corresponding second ventilation hole, and each of the first ventilation holes and the corresponding second ventilation hole communicating with the groove.
[0008] Optionally, the support plate is provided with a plurality of spaced-apart gaskets on the side facing the cover plate, each gasket being used to clamp between the support plate and the ground plate.
[0009] Optionally, each of the guide holes on the support plate has an inner flange on the side facing the cover plate, each guide post slides with the corresponding inner flange, and the end of each guide post facing the substrate has an outer flange. Each outer flange is movably inserted into the guide hole, and each inner flange is used to limit the corresponding outer flange.
[0010] Optionally, the cover plate has a positioning groove on the side facing the support plate, the positioning groove communicating with a plurality of solder clearance grooves, and the positioning groove being used to position the radiating plate.
[0011] Optionally, the reflow soldering fixture further includes a plurality of spaced-apart pins, each of which is inserted into the substrate, the support plate, and the cover plate.
[0012] Optionally, the cover plate is fitted with a plurality of spaced-apart connecting bolts, the support plate has a plurality of spaced-apart through holes, and the base plate has a plurality of spaced-apart threaded holes. Each connecting bolt passes through the corresponding through hole and is then inserted into the corresponding threaded hole.
[0013] In a second aspect, the present invention provides a reflow soldering method for a phased array antenna, the reflow soldering method being based on a phased array antenna reflow soldering fixture described in the first aspect, the reflow soldering method comprising: S1. After connecting the substrate and the support plate, place them horizontally and arrange insulators on each of the guide posts, so that each of the positioning rings is inserted between the inner conductor and the outer conductor of the insulator in the phased array antenna. S2. A solder ring is arranged on the top surface of the outer conductor of each insulator, and a grounding plate is placed on the plurality of insulators, such that the plurality of insulators are inserted into the grounding plate; S3. Arrange multiple spaced solder pastes on the top surface of the radiating plate at corresponding positions, place the radiating plate on the ground plane, and insert the inner conductor of each insulator into the corresponding through hole of the radiating plate. S4. Cover the radiating plate with the cover plate, and make each solder paste face the corresponding solder relief groove. Connect the cover plate, the support plate and the substrate, so that each elastic element is compressed and pushes the insulator. S5. Place the reflow soldering fixture and the phased array antenna to be soldered in the reflow soldering furnace for reflow soldering.
[0014] Optionally, in step S3, multiple spaced solder pastes are arranged at corresponding positions on the top surface of the radiating plate by means of stencil printing.
[0015] Optionally, in step S5, when reflow soldering is performed in the reflow oven, the temperature control in the reflow oven includes, in sequence, a preheating stage, a holding stage, a first heating stage, a second heating stage, and a cooling stage.
[0016] The aforementioned improved technical features can be combined with each other as long as they do not conflict with each other.
[0017] In summary, the beneficial effects of the above-described technical solutions conceived by this invention compared with the prior art include: In the phased array antenna reflow soldering fixture provided in this embodiment of the invention, when soldering the phased array antenna, firstly, the substrate and support plate are connected and placed horizontally, and insulators are arranged on each guide post, so that each positioning ring is inserted between the inner conductor and the outer conductor of the insulator in the phased array antenna, thereby achieving support and precise positioning of each insulator through the guide posts and positioning rings. Then, solder rings are arranged on the top surface of the outer conductor of each insulator, and a ground plane is placed on multiple insulators, so that multiple insulators are inserted into the ground plane (i.e., the solder rings are inserted into the ground plane), thereby achieving the insertion and positioning of the outer conductor of the insulator in the ground plane.
[0018] Next, multiple spaced solder pastes are arranged on the top surface of the radiating plate at corresponding positions. The radiating plate is then placed on the ground plane, and the inner conductors of each insulator are inserted into the corresponding through holes in the radiating plate, thus achieving the insertion and positioning of the inner conductors of the insulators within the radiating plate. A cover plate is then placed on the radiating plate, with each solder paste aligned with its corresponding solder relief groove. The cover plate, support plate, and base plate are connected, causing the elastic elements to compress and push against the insulators. The solder relief grooves prevent the solder paste on the radiating plate from shifting or bridging during subsequent pressing. Furthermore, during the connection of the cover plate, it is pressed down towards one side of the support plate. As the cover plate moves downward, it presses against the radiating plate, ground plane, insulators, and guide posts, ultimately compressing the elastic elements (at which point the ground plane abuts against the support plate). During the compression of the elastic component, the inner and outer conductors of multiple insulators are pushed upwards to the same height relative to the ground plane and radiating plate. The inner conductors all come into contact with the solder paste, ensuring consistency in solder joint height and size during subsequent reflow soldering and improving product yield. Finally, the reflow soldering fixture and the phased array antenna to be soldered are placed in the reflow oven for reflow soldering, greatly improving soldering efficiency and avoiding manual soldering.
[0019] In other words, the phased array antenna reflow soldering fixture provided in this embodiment of the invention improves soldering efficiency and ensures the consistency of solder joint height and size during subsequent reflow soldering, thereby increasing the product qualification rate. Attached Figure Description
[0020] Figure 1 This is a cross-sectional view of an insulator provided in an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a phased array antenna reflow soldering fixture provided in an embodiment of the present invention; Figure 3 This is a cross-sectional view of a phased array antenna reflow soldering fixture provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the structure of the substrate provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of the support plate provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the cover plate provided in an embodiment of the present invention; Figure 7 This is a schematic diagram illustrating the use of a phased array antenna reflow soldering fixture provided in an embodiment of the present invention; Figure 8 This is a flowchart of a phased array antenna reflow soldering method provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of temperature control in a reflow oven provided in an embodiment of the present invention.
[0021] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically: 1. Substrate; 11. Groove; 12. First ventilation hole; 2. Support plate; 21. Guide hole; 22. Second ventilation hole; 23. Gasket; 24. Inner flange; 3. Cover plate; 31. Solder clearance groove; 32. Positioning groove; 4. Positioning assembly; 41. Guide post; 411. Positioning ring; 412. Outer flange; 42. Elastic element; 5. Pin; 6. Connecting bolt; 100. Radial plate; 200. Grounding plate; 300. Insulator; 301. Inner conductor; 302. Outer conductor; 303. Body; 400. Solder paste; 500. Solder ring. Detailed Implementation
[0022] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.
[0023] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.
[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0025] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0026] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0027] Example: Figure 2 This is a schematic diagram of the structure of a phased array antenna reflow soldering fixture provided in an embodiment of the present invention. Figure 3 This is a cross-sectional view of a phased array antenna reflow soldering fixture provided in an embodiment of the present invention, combined with... Figure 2 and Figure 3 As shown, the reflow soldering fixture includes a substrate 1, a support plate 2, a cover plate 3, and multiple positioning components 4. The substrate 1, support plate 2, and cover plate 3 are detachably connected.
[0028] Figure 4 This is a schematic diagram of the substrate structure provided in an embodiment of the present invention, as shown below. Figure 4 As shown, the substrate 1 has a groove 11 on the side facing the support plate 2, and the substrate 1 and the support plate 2 are stacked together in parallel. Figure 5 This is a schematic diagram of the structure of the support plate 2 provided in an embodiment of the present invention, as shown below. Figure 5 As shown, the support plate has multiple spaced guide holes 21, and the support plate 2 and the cover plate 3 are arranged in parallel space. Figure 6 This is a schematic diagram of the structure of the cover plate provided in an embodiment of the present invention, as shown below. Figure 6 As shown, the cover plate 3 has multiple spaced solder clearance grooves 31 on the side facing the support plate 2.
[0029] Multiple positioning components 4 are arranged at intervals. Each positioning component 4 includes a guide post 41 and an elastic element 42. Each guide post 41 is movably inserted into a guide hole 21. One end of the guide post 41 has a coaxially connected positioning ring 411, which is directly opposite the corresponding solder relief groove 31. The positioning ring 411 is used to be inserted between the inner conductor 301 and the outer conductor 302 of the insulator 300 in the phased array antenna so as to abut against the body 303 of the insulator 300. Each elastic element 42 is located in the groove 11, and both ends of each elastic element 42 abut against the substrate 1 and the corresponding guide post 41, respectively.
[0030] In the reflow soldering fixture for a phased array antenna provided in this embodiment of the invention, when soldering the phased array antenna, firstly, the substrate 1 and the support plate 2 are connected and placed horizontally, and insulators 300 are arranged on each guide post 41, so that each positioning ring 411 is inserted between the inner conductor 301 and the outer conductor 302 of the insulator 300 in the phased array antenna, thereby achieving support and precise positioning of each insulator 300 through the guide post 41 and the positioning ring 411. Then, a solder ring 500 is arranged on the top surface of the outer conductor 302 of each insulator 300, and a ground plane 200 is placed on multiple insulators 300, so that multiple insulators 300 are inserted into the ground plane 200 (i.e., the solder ring 500 is inserted into the ground plane 200), thereby achieving the insertion and positioning of the outer conductor 302 of the insulator 300 in the ground plane 200.
[0031] Next, multiple spaced solder pastes 400 are arranged at corresponding positions on the top surface of the radiating plate 100. The radiating plate 100 is placed on the ground plane 200, and the inner conductor 301 of each insulator 300 is inserted into the corresponding through hole of the radiating plate 100, thereby achieving the insertion and positioning of the inner conductor 301 of the insulator 300 in the radiating plate 100. Furthermore, a cover plate 3 is placed on the radiating plate 100, with each solder paste 400 facing the corresponding solder relief groove 31. The cover plate 3, support plate 2, and base plate 1 are connected, so that each elastic element 42, after compression, pushes the insulator 300 (see...). Figure 7The solder relief groove 31 can prevent the solder paste 400 on the radiating plate 100 from shifting or bridging during subsequent pressing. Additionally, during the connection of the cover plate 3, it is pressed down towards the support plate 2. As the cover plate 3 moves downward, it presses down on the radiating plate 100, the ground plane 200, the insulators 300, and the guide post 41, ultimately compressing the elastic element 42 (at which point the ground plane 200 abuts against the support plate 2). During the compression of the elastic element 42, it pushes the inner conductors 301 and outer conductors 302 of multiple insulators 300, causing them to move upwards synchronously relative to the ground plane 200 and the radiating plate 100 to the same height. The inner conductors 301 all come into contact with the solder paste 400, ensuring the consistency of solder joint height and size during subsequent reflow soldering and improving the product yield. Finally, the reflow soldering fixture and the phased array antenna to be soldered are placed in a reflow oven for reflow soldering, greatly improving soldering efficiency and avoiding manual soldering.
[0032] In other words, the phased array antenna reflow soldering fixture provided in this embodiment of the invention improves soldering efficiency and ensures the consistency of solder joint height and size during subsequent reflow soldering, thereby increasing the product qualification rate.
[0033] In addition, compared with traditional manual soldering, production efficiency has increased by 3.5 times; at the same time, the first-pass yield rate of products can reach more than 95%, and the defect rate has been reduced from the original 25% to less than 5%, which greatly saves material and time costs. According to statistics, it can save about 30% of costs.
[0034] For example, this phased array antenna uses an 8×8 array structure, that is, the corresponding insulator 300 is 8×8.
[0035] Combination Figure 4 and Figure 5 It is known that the substrate 1 has a plurality of spaced first ventilation holes 12, and the support plate 2 has a plurality of spaced second ventilation holes 22. Each first ventilation hole 12 is directly opposite to the corresponding second ventilation hole 22, and each first ventilation hole 12 and the corresponding second ventilation hole 22 are connected to the groove 11.
[0036] In the above embodiment, the first ventilation hole 12 and the second ventilation hole 22 serve to ventilate, thereby enhancing the heat convection effect on the outside of the tooling and inside the groove 11 during the welding process. This allows heat to be quickly transferred vertically to the groove 11 and then to the insulator 300 and the solder, avoiding the problem of the internal insulator 300 and solder heating up too slowly.
[0037] For example, the first ventilation hole 12 and the second ventilation hole 22 are arranged in a 9×9 pattern.
[0038] Furthermore, a plurality of spaced gaskets 23 are provided on the side of the support plate 2 facing the cover plate 3, and each gasket 23 is used to clamp between the support plate 2 and the ground plate 200.
[0039] It is easy to understand that the gasket 23 serves to raise the grounding plate 200, so that an air duct is formed between the support plate 2 and the grounding plate 200. This air duct is arranged opposite to the insulator 300, thereby realizing rapid lateral heat transfer to the insulator 300, further enhancing the heat convection effect, and ensuring uniform temperature at all locations of the tooling and product.
[0040] In other embodiments of the present invention, the gasket 23 may also be fitted onto the guide post 41.
[0041] In this embodiment, each guide hole 21 on the support plate 2 has an inner flange 24 on the side facing the cover plate 3, each guide post 41 is slidably engaged with the corresponding inner flange 24, and the end of the guide post 41 facing the substrate 1 has an outer flange 412. Each outer flange 412 is movably inserted into the guide hole 21, and each inner flange 24 is used to limit the corresponding outer flange 412.
[0042] In the above embodiment, the inner flange 24 and the outer flange 412 can guide the guide post 41, and the inner flange 24 can limit the outer flange 412 to prevent the guide post 41 from disengaging from the guide hole 21.
[0043] For example, the elastic element 42 can be a spring, the top of which is also inserted into the guide hole 21.
[0044] In one implementation of the present invention, the cover plate 3 has a positioning groove 32 on the side facing the support plate 2. The positioning groove 32 is connected to a plurality of solder clearance grooves 31, and the positioning groove 32 is used to position the radiating plate 100. The positioning groove 32 can realize the positioning of the radiating plate 100 and the cover plate 3, thereby ensuring the arrangement accuracy of the radiating plate 100.
[0045] See also Figure 1 The reflow soldering fixture also includes multiple spaced pins 5, each pin 5 being inserted into the substrate 1, support plate 2 and cover plate 3, thereby ensuring the accuracy between the substrate 1, support plate 2 and cover plate 3 through the pins 5.
[0046] Furthermore, the cover plate 3 is fitted with a plurality of spaced connecting bolts 6, the support plate 2 has a plurality of spaced through holes, and the base plate 1 has a plurality of spaced threaded holes. Each connecting bolt 6 passes through the corresponding through hole and is inserted into the corresponding threaded hole. Thus, the connecting bolts 6 can not only fix the cover plate 3, but also press down and displace the cover plate 3.
[0047] For example, the number of pins 5 can be 2, and the number of connecting bolts 6 can be 4.
[0048] In addition, before inserting the pin 5 and connecting bolt 6, the base plate 1 and the support plate 2 can also be pre-fixed by connecting the base plate 1 and the support plate 2 with multiple screws.
[0049] This reflow soldering fixture adopts a modular structure design, and the connection and disassembly of each layer are achieved through a graded fastening method. It is not only easy to install, disassemble and maintain, but also well adapted to the needs of mass production.
[0050] Figure 8 This is a flowchart of a phased array antenna reflow soldering method provided in an embodiment of the present invention, as shown below. Figure 8 As shown, the reflow soldering method for a phased array antenna described above includes the following reflow soldering fixture: S1. After connecting the base plate 1 and the support plate 2, place them horizontally and arrange insulators 300 on each guide post 41, so that each positioning ring 411 is inserted between the inner conductor 301 and the outer conductor 302 of the insulator 300 in the phased array antenna.
[0051] S2. Solder rings 500 are arranged on the top surface of the outer conductor 302 of each insulator 300, and grounding plates 200 are placed on multiple insulators 300, so that multiple insulators 300 are inserted into grounding plates 200.
[0052] S3. Arrange multiple spaced solder pastes 400 at corresponding positions on the top surface of the radiating plate 100, place the radiating plate 100 on the ground plane 200, and insert the inner conductor 301 of each insulator 300 into the corresponding through hole of the radiating plate 100.
[0053] S4. Place the cover plate 3 on the radiation plate 100, and make each solder paste 400 face the corresponding solder relief groove 31. Connect the cover plate 3, the support plate 2 and the substrate 1, so that each elastic element 42 is compressed and pushes the insulator 300.
[0054] S5. Place the reflow soldering fixture and the phased array antenna to be soldered in the reflow oven for reflow soldering.
[0055] The present invention provides a reflow soldering method for phased array antennas. The reflow soldering fixture improves the soldering efficiency and ensures the consistency of solder joint height and size during subsequent reflow soldering processes, thereby improving the product qualification rate.
[0056] Before step S1, this reflow soldering method also includes pretreatment, specifically, gold removal treatment is performed on the surface of the radiant plate 100 without tinning, so as to avoid solder bridging during the soldering process and ensure the controllability of the solder joint shape; at the same time, anhydrous ethanol is used to thoroughly clean the tooling, ground plate 200 and radiant plate 100 to remove oil, dust and other excess substances in the slots and ensure the cleanliness of the soldering surface.
[0057] After step S5, once the phased array antenna has completely cooled down, loosen all fasteners, disassemble the fixture, remove residual flux using a special solvent, and then inspect the internal quality of the solder joints using X-ray inspection equipment to check for defects such as voids and incomplete soldering. At the same time, measure and observe the size and shape of the solder joints under a microscope to ensure that the welding quality meets the design requirements.
[0058] In this embodiment, in step S3, multiple spaced solder pastes 400 are arranged at corresponding positions on the top surface of the radiating plate 100 by means of stencil printing, and the amount of solder is quantitatively distributed by means of stencil printing.
[0059] For example, the stencil thickness is 0.12 mm and the aperture size is 0.93 mm × 0.93 mm. The solder paste 400 is Sn63Pb37 solder paste with a melting point of 183°C.
[0060] Additionally, in step S5, during reflow soldering in the reflow oven, the temperature control in the reflow oven sequentially includes: a preheating stage, a holding stage, a first heating stage, a second heating stage, and a cooling stage (see...). Figure 9 ).
[0061] Specifically, a reflow profile with multi-stage heating is used for welding operations.
[0062] Preheating stage: The temperature is slowly increased from room temperature to a specific temperature, and the heating rate is controlled at a specific value. The purpose of this stage is to prevent the solder paste 400 from splashing due to excessive heating, and to prevent the antenna components from being damaged by thermal shock.
[0063] Insulation stage: The temperature is basically kept constant, with a slight increase, i.e., controlled near a specific temperature.
[0064] The first heating stage: The reflow oven is gradually heated from a specific temperature to another specific temperature. During this stage, the flux in the solder is activated, which fully removes the oxide layer on the soldering surface and improves the wettability of the solder.
[0065] The second heating stage involves continuing to heat the material to another specific temperature to ensure that the solder can completely melt and achieve a reliable connection between the welded parts.
[0066] Cooling stage: Allow the welded components to cool naturally to below a specific temperature. Slow cooling reduces the generation of thermal stress and prevents the phased array antenna from being affected by thermal deformation.
[0067] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. A reflow soldering fixture for a phased array antenna, characterized in that, The reflow soldering fixture includes a base plate, a support plate, a cover plate, and multiple positioning components; The substrate, the support plate, and the cover plate are detachably connected. The substrate has a groove on the side facing the support plate. The substrate and the support plate are stacked together in parallel. The support plate has a plurality of spaced guide holes. The support plate and the cover plate are arranged in parallel and spaced apart. The cover plate has a plurality of spaced solder clearance grooves on the side facing the support plate. Multiple positioning components are arranged at intervals. Each positioning component includes a guide post and an elastic element. Each guide post is movably inserted into the guide hole. One end of each guide post has a coaxially connected positioning ring and is directly opposite the corresponding solder relief groove. The positioning ring is used to insert between the inner conductor and the outer conductor of the insulator in the phased array antenna to abut against the body of the insulator. Each elastic element is located in the groove, and both ends of each elastic element abut against the substrate and the corresponding guide post, respectively.
2. The phased array antenna reflow soldering fixture according to claim 1, characterized in that, The substrate has a plurality of spaced-apart first ventilation holes, and the support plate has a plurality of spaced-apart second ventilation holes. Each first ventilation hole is directly opposite to a corresponding second ventilation hole, and each first ventilation hole and its corresponding second ventilation hole are connected to the groove.
3. The phased array antenna reflow soldering fixture according to claim 2, characterized in that, The support plate has a plurality of spaced-apart gaskets on the side facing the cover plate, and each gasket is used to clamp between the support plate and the ground plate.
4. The phased array antenna reflow soldering fixture according to claim 1, characterized in that, Each of the guide holes on the support plate has an inner flange on the side facing the cover plate, each guide post slides with the corresponding inner flange, and the end of each guide post facing the substrate has an outer flange. Each outer flange is movably inserted into the guide hole, and each inner flange is used to limit the corresponding outer flange.
5. The phased array antenna reflow soldering fixture according to claim 1, characterized in that, The cover plate has a positioning groove on the side facing the support plate. The positioning groove is connected to a plurality of solder avoidance grooves and is used to position the radiating plate.
6. The phased array antenna reflow soldering fixture according to claim 1, characterized in that, The reflow soldering fixture also includes a plurality of spaced-apart pins, each of which is inserted into the substrate, the support plate, and the cover plate.
7. The phased array antenna reflow soldering fixture according to claim 6, characterized in that, The cover plate is fitted with a plurality of spaced connecting bolts, the support plate has a plurality of spaced through holes, and the base plate has a plurality of spaced threaded holes. Each connecting bolt passes through the corresponding through hole and is then inserted into the corresponding threaded hole.
8. A reflow soldering method for a phased array antenna, characterized in that, The reflow soldering method is based on a phased array antenna reflow soldering fixture according to any one of claims 1-7, and the reflow soldering method includes: S1. After connecting the substrate and the support plate, place them horizontally and arrange insulators on each of the guide posts, so that each of the positioning rings is inserted between the inner conductor and the outer conductor of the insulator in the phased array antenna. S2. A solder ring is arranged on the top surface of the outer conductor of each insulator, and a grounding plate is placed on the plurality of insulators, such that the plurality of insulators are inserted into the grounding plate; S3. Arrange multiple spaced solder pastes on the top surface of the radiating plate at corresponding positions, place the radiating plate on the ground plane, and insert the inner conductor of each insulator into the corresponding through hole of the radiating plate. S4. Cover the radiating plate with the cover plate, and make each solder paste face the corresponding solder relief groove. Connect the cover plate, the support plate and the substrate, so that each elastic element is compressed and pushes the insulator. S5. Place the reflow soldering fixture and the phased array antenna to be soldered in the reflow soldering furnace for reflow soldering.
9. The reflow soldering method for a phased array antenna according to claim 8, characterized in that, In step S3, multiple spaced solder pastes are arranged at corresponding positions on the top surface of the radiating plate by means of stencil printing.
10. The reflow soldering method for a phased array antenna according to claim 8, characterized in that, In step S5, when reflow soldering is performed in the reflow oven, the temperature control in the reflow oven includes the following stages in sequence: preheating stage, heat preservation stage, first heating stage, second heating stage, and cooling stage.