Laser processing tool and laser processing device

Abstract

The embodiment of the invention discloses a laser processing tool and a laser processing device. The laser machining tool comprises two clamping pieces which are oppositely arranged in the first direction, a workpiece to be machined is clamped between the two clamping pieces, at least one clamping piece is provided with a cooling structure, and when the clamping pieces clamp the workpiece to be machined, the cooling structure is arranged between the two clamping pieces. The orthographic projection of the cooling structure in the first direction is partially overlapped with the orthographic projection of the workpiece to be machined in the first direction. The cooling structure is arranged on the clamping piece, and the orthographic projection of the cooling structure in the first direction is partially overlapped with the orthographic projection of the to-be-machined workpiece in the first direction, so that the to-be-machined workpiece can be cooled in the machining process while the to-be-machined workpiece is clamped by the clamping piece; the heat influence on the to-be-machined workpiece in the machining process is reduced, and therefore when the laser machining tool is used for clamping, only a small number of machinable areas need to be reserved, and the machining requirement can be met.

Description

Technical Field

[0001] This application relates to the field of laser processing, specifically to a laser processing fixture and a laser processing device. Background Technology

[0002] Copper flat wire is the material used in flat wire motors, and a current technological trend in drive motor development is the use of flat wire windings. With market development, drive motor manufacturers are continuously developing products aimed at reducing size and weight. After the copper flat wire undergoes laser cleaning to remove the enamel coating, it is laser-cut and then laser-welded. However, existing laser processing fixtures require the processing area to be far from the enamel coating during clamping to allow sufficient processing space and prevent burning of the enamel coating during laser processing. This results in a heavier drive motor after the copper flat wire is applied. Summary of the Invention

[0003] This application provides a laser processing fixture and a laser processing device, which can solve the problem that existing laser processing fixtures need to reserve a sufficient amount of processable area when clamping.

[0004] This application provides a laser processing fixture, including two clamping members arranged opposite to each other along a first direction, with the two clamping members used to clamp a workpiece to be processed, and at least one of the clamping members having a cooling structure; wherein... When the clamping member is holding the workpiece to be processed, the orthographic projection of the cooling structure in the first direction partially overlaps with the orthographic projection of the workpiece to be processed in the first direction.

[0005] Optionally, in some embodiments of this application, at least one of the clamping members has a groove on the side opposite to the other clamping member, the groove being used to place the workpiece to be processed.

[0006] Optionally, in some embodiments of this application, the cooling structure and the groove are disposed on the same clamping member.

[0007] Optionally, in some embodiments of this application, the groove extends through the opposite sides of the clamping member along the second direction, the cooling structure includes an inlet and an outlet, the inlet and the outlet are disposed on the opposite sides of the clamping member along a third direction, and the inlet and the outlet are interconnected; the second direction, the third direction and the first direction form an angle with each other.

[0008] Optionally, in some embodiments of this application, the orthographic projection of the cooling structure in the first direction at least partially covers the orthographic projection of the groove in the first direction.

[0009] Optionally, in some embodiments of this application, the groove extends through the opposite sides of the clamping member along the second direction, the cooling structure includes an inlet and an outlet, the inlet and the outlet are disposed on the opposite sides of the clamping member along the second direction, the inlet and the outlet are interconnected, the second direction forms an angle with the first direction; the orthographic projection of the cooling structure in the first direction covers the orthographic projection of the groove in the first direction.

[0010] Optionally, in some embodiments of this application, the two clamping members are respectively provided with the cooling structure and the groove, the grooves on the two clamping members are symmetrically arranged along the first direction, and the cooling structures on the two clamping members are symmetrically arranged along the first direction.

[0011] Optionally, in some embodiments of this application, when the clamping member is holding the workpiece to be processed, the opposite sides of the two clamping members abut against each other.

[0012] Accordingly, embodiments of this application also provide a laser processing apparatus, including: The laser processing fixture described in any of the above items; and A laser, used to process the workpiece held in the laser processing fixture.

[0013] Optionally, in some embodiments of this application, the laser is a water-guided laser.

[0014] In this embodiment, the laser processing fixture includes two clamping members arranged opposite each other along a first direction. The two clamping members are used to clamp the workpiece to be processed. At least one clamping member is provided with a cooling structure. When the clamping member is holding the workpiece to be processed, the orthographic projection of the cooling structure in the first direction partially overlaps with the orthographic projection of the workpiece to be processed in the first direction. By providing a cooling structure on the clamping member and making the orthographic projection of the cooling structure in the first direction partially overlap with the orthographic projection of the workpiece to be processed in the first direction, this application enables the clamping member to cool the workpiece to be processed while clamping it, thereby reducing the thermal impact on the workpiece during processing. This allows the processing position to be closer to the edge of the machinable area of ​​the workpiece, such as closer to the paint layer, after clamping the workpiece with this laser processing fixture. As a result, the laser processing fixture only needs to reserve a smaller machinable area to meet the processing requirements when clamping. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of a laser processing fixture provided in an embodiment of this application; Figure 2 This is a schematic diagram of a laser processing fixture for holding a workpiece to be processed, provided in an embodiment of this application. Figure 3 This is a schematic diagram of the structure of a laser processing apparatus provided in an embodiment of this application.

[0017] Explanation of reference numerals in the attached figures: 1. Laser processing equipment; 10. Laser processing fixture; 11. Clamping component; 12. Cooling structure; 121. Water inlet; 122. Water outlet; 13. Groove; Z, first direction; X, second direction; Y, third direction; 20. Laser; 30. Workpiece to be processed. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.

[0019] This application provides a laser processing fixture and a laser processing apparatus, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0020] First, this application provides a laser processing fixture, such as... Figure 1 and Figure 2As shown, the laser processing fixture 10 includes two clamping members 11 arranged opposite each other along the first direction Z. The two clamping members 11 are used to clamp the workpiece 30 to be processed. At least one clamping member 11 is provided with a cooling structure 12. That is, during laser processing, the workpiece 30 to be processed is clamped between the two clamping members 11. By providing a cooling structure 12 on at least one clamping member 11, the heat generated during laser processing can be removed by the cooling structure 12, reducing the thermal impact on the workpiece 30 during processing.

[0021] In this configuration, with the clamping member 11 holding the workpiece 30, the orthographic projection of the cooling structure 12 in the first direction Z partially overlaps with the orthographic projection of the workpiece 30 in the first direction Z. That is, the cooling structure 12 is positioned corresponding to the clamping position of the workpiece 30, ensuring sufficient heat exchange area between the cooling structure 12 and the workpiece 30. This helps to further reduce the thermal impact on the workpiece 30 during processing, allowing the processing position to be closer to the edge of the machinable area of ​​the workpiece 30 after clamping it with the laser processing fixture 10, such as closer to the paint layer. This means that the laser processing fixture 10 only needs to reserve a smaller machinable area to meet processing requirements during clamping.

[0022] It should be noted that the workpiece 30 to be processed in this embodiment can be a copper flat wire, and the processing of the copper flat wire can be laser cutting. Before processing the copper flat wire, the paint in the processing area needs to be removed by laser cleaning to expose the processing area of ​​the workpiece 30. Then, the edge of the paint on the workpiece 30 is clamped by the clamping member 11 to facilitate processing of the processing area. Since the clamping member 11 is provided with a cooling structure 12, the heat generated during the laser processing can be removed by the cooling structure 12, reducing the thermal impact on the workpiece 30 during processing. Therefore, processing can be performed closer to the paint of the copper flat wire without damaging the paint, thereby reducing the amount of copper flat wire used and reducing the weight of the motor after the copper flat wire is applied to the motor.

[0023] In this embodiment of the application, the laser processing fixture 10 includes two clamping members 11 arranged opposite to each other along the first direction Z. The two clamping members 11 are used to clamp the workpiece 30 to be processed. At least one clamping member 11 is provided with a cooling structure 12. When the clamping member 11 is clamping the workpiece 30 to be processed, the orthographic projection of the cooling structure 12 in the first direction Z partially overlaps with the orthographic projection of the workpiece 30 in the first direction Z. This application provides a cooling structure 12 on the clamping member 11, and makes the orthographic projection of the cooling structure 12 in the first direction Z partially overlap with the orthographic projection of the workpiece 30 to be processed in the first direction Z. This allows the clamping member 11 to hold the workpiece 30 to be processed while also cooling the workpiece 30 during processing, thereby reducing the thermal impact on the workpiece 30 during processing. This allows the processing position to be closer to the edge of the processable area of ​​the workpiece 30 after the laser processing fixture 10 clamps the workpiece 30, such as closer to the paint on the workpiece 30. As a result, the laser processing fixture 10 only needs to reserve a smaller processable area when clamping to meet the processing requirements.

[0024] In some embodiments, at least one clamping member 11 has a groove 13 on the side opposite to the other clamping member 11. The groove 13 is used to place the workpiece 30 to be processed. That is, when the clamping member 11 clamps the workpiece 30 to be processed, the workpiece 30 to be processed is engaged in the groove 13. On the one hand, the setting of the groove 13 helps to improve the stability of the clamping member 11 in clamping the workpiece 30 to be processed. On the other hand, the setting of the groove 13 helps to increase the contact area between the workpiece 30 to be processed and the clamping member 11, thereby facilitating the design of the cooling structure 12 to improve the heat exchange effect between the clamping member 11 and the workpiece 30 to be processed.

[0025] In some embodiments, the cooling structure 12 and the groove 13 are disposed on the same clamping member 11, that is, the contact area between the workpiece 30 to be processed and the side wall of the groove 13 is the heat exchange area between the workpiece 30 to be processed and the clamping member 11, thereby helping to ensure the heat exchange effect between the workpiece 30 to be processed and the clamping member 11, and further reducing the thermal impact on the workpiece 30 to be processed during the processing.

[0026] In some examples, the groove 13 extends through the opposite sides of the corresponding clamping member 11 along the second direction X. The cooling structure 12 includes an inlet 121 and an outlet 122. The inlet 121 and the outlet 122 are arranged on the opposite sides of the corresponding clamping member 11 along the third direction Y. The inlet 121 and the outlet 122 are interconnected. The second direction X, the third direction Y and the first direction Z form an angle with each other. The workpiece 30 to be processed passes through the groove 13 of the clamping member 11 along the second direction X and is stuck in the groove 13. The cooling medium flows between the inlet 121 and the outlet 122 along the third direction Y to remove the heat generated during the processing. By designing the setting direction of the inlet 121 and the outlet 122 to form an angle with the placement direction of the workpiece 30 to be processed, the heat exchange effect between the workpiece 30 to be processed and the clamping member 11 can be ensured, while reducing the possible interference of the connection between the inlet 121 and the outlet 122 and the external circulation equipment to the processing process, thereby helping the processing process to proceed smoothly.

[0027] In some embodiments, the orthographic projection of the cooling structure 12 in the first direction Z at least partially covers the orthographic projection of the groove 13 in the first direction Z. Since the groove 13 is used to place the workpiece 30 to be processed, by setting the orthographic projection of the cooling structure 12 in the first direction Z to at least partially cover the orthographic projection of the groove 13 in the first direction Z, the cooling structure 12 is correspondingly arranged with the groove 13, so as to ensure that there is a sufficient heat exchange area between the cooling structure 12 and the workpiece 30 to be processed, thereby helping to further reduce the thermal impact of the processing on the workpiece 30 to be processed.

[0028] In some examples, the groove 13 extends through the opposite sides of the corresponding clamping member 11 along the second direction X. The cooling structure 12 includes an inlet 121 and an outlet 122. The inlet 121 and the outlet 122 are arranged on the opposite sides of the corresponding clamping member 11 along the second direction X. The inlet 121 and the outlet 122 are interconnected. The second direction X forms an angle with the first direction Z. The orthographic projection of the cooling structure 12 in the first direction Z covers the orthographic projection of the groove 13 in the first direction Z. The workpiece 30 to be processed passes through the groove 13 of the clamping member 11 along the second direction X and is stuck in the groove 13. The cooling medium also flows between the inlet 121 and the outlet 122 along the second direction X to remove the heat generated during the processing. By designing the setting direction of the inlet 121 and the outlet 122 to be consistent with the placement direction of the workpiece 30 to be processed, it helps to further increase the heat exchange area between the workpiece 30 to be processed and the cooling structure 12 of the clamping member 11, thereby helping to further reduce the thermal impact on the workpiece 30 during the processing.

[0029] The clamping member 11 includes a clamping part and two connecting ports. The clamping part is used to clamp the workpiece 30 to be processed, and the connecting ports are used to connect to an external circulating cooling device. The cooling channel of the cooling structure 12 is set in the clamping part, with an inlet 121 located in one of the connecting ports and an outlet 122 located in the other connecting port. This structural design ensures that the workpiece 30 to be processed and the clamping member 11 have sufficient heat exchange area to reduce the heat impact generated during processing, while also facilitating the connection design between the clamping member 11 and the external circulating cooling device.

[0030] In some embodiments, cooling structures 12 and grooves 13 are respectively provided on the two clamping members 11. The grooves 13 on the two clamping members 11 are symmetrically arranged along the first direction Z, and the cooling structures 12 on the two clamping members 11 are symmetrically arranged along the first direction Z. That is, the two clamping members 11 have the same structure. When clamping the workpiece 30 to be processed, the two clamping members 11 are symmetrically clamped on opposite sides of the workpiece 30 to be processed. By setting the structure of the two clamping members 11 to be the same, the clamping positions of the two clamping members 11 can be interchanged without being fixed in a specific position, thereby making the assembly of the laser processing fixture 10 and the clamping of the workpiece 30 to be processed more convenient.

[0031] In some embodiments, when the clamping members 11 are holding the workpiece 30 to be processed, the opposite sides of the two clamping members 11 abut against each other. That is, the two clamping members 11 completely enclose the outer peripheral surface of the workpiece 30 to be processed in the clamping position. On the one hand, this can improve the stability of the clamping members 11 in holding the workpiece 30 to be processed; on the other hand, it can ensure that there is sufficient heat exchange area between the workpiece 30 to be processed and the clamping members 11, so as to further reduce the thermal impact of the processing on the workpiece 30 to be processed. This allows the processing position to be closer to the edge of the machinable area of ​​the workpiece 30 after the laser processing fixture 10 is used to clamp the workpiece 30, so that the laser processing fixture 10 only needs to reserve a small amount of machinable area to meet the processing requirements when clamping.

[0032] It should be noted that the clamping component in this embodiment can be made of a material with a high thermal conductivity, such as copper, so as to better remove the heat generated during laser processing, thereby further reducing the thermal impact on the workpiece during processing.

[0033] Secondly, this application provides a laser processing apparatus, which includes a laser processing fixture. The specific structure of the laser processing fixture is as described in the above embodiments. Since this laser processing apparatus adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0034] like Figure 3 As shown, the laser processing apparatus 1 includes a laser processing fixture 10 and a laser 20. The laser processing fixture 10 is used to clamp the workpiece 30 to be processed, and the laser 20 is used to process the workpiece 30 held by the laser processing fixture 10. Before processing, the workpiece 30 needs to be processed first. For example, when the workpiece 30 is a copper flat wire, it is necessary to first use laser cleaning to remove part of the paint from the copper flat wire. The area after removing the paint is the processable area. Then, the laser processing fixture 10 clamps the processable area and the edge of the paint, and the laser 20 is aligned with the unclamped processable area to process the workpiece 30.

[0035] In this embodiment, the laser 20 used can be a water-guided laser. That is, when the laser 20 emits a laser beam for processing, it will simultaneously form a water column and wrap the laser beam to remove some of the heat generated during the laser beam processing, thereby further reducing the thermal impact on the workpiece 30 to be processed during the processing.

[0036] It should be noted that, in addition to using a water-guided laser, other methods can also be used to cool the laser 20, such as setting up a circulating cooling channel on the laser 20, in order to remove some of the heat generated by the laser 20 during the processing and reduce the thermal impact on the workpiece 30 to be processed during the processing. No special restrictions are imposed here.

[0037] Specifically, the laser processing fixture 10 includes two clamping members 11 arranged opposite each other along the first direction Z. The two clamping members 11 are used to clamp the workpiece 30 to be processed. At least one clamping member 11 is provided with a cooling structure 12. When the clamping member 11 is clamping the workpiece 30 to be processed, the orthographic projection of the cooling structure 12 in the first direction Z partially overlaps with the orthographic projection of the workpiece 30 in the first direction Z. This application provides a cooling structure 12 on the clamping member 11, and makes the orthographic projection of the cooling structure 12 in the first direction Z partially overlap with the orthographic projection of the workpiece 30 to be processed in the first direction Z. This allows the clamping member 11 to hold the workpiece 30 to be processed while also cooling the workpiece 30 during processing, thereby reducing the thermal impact on the workpiece 30 during processing. This allows the processing position to be closer to the edge of the processable area of ​​the workpiece 30 after the laser processing fixture 10 clamps the workpiece 30, such as closer to the paint on the workpiece 30. As a result, the laser processing fixture 10 only needs to reserve a smaller processable area when clamping to meet the processing requirements.

[0038] It should be noted that the workpiece 30 to be processed includes a paint area, a machinable area, and the connection position between the paint area and the machinable area. The laser processing fixture 10 clamps the connection position between the paint area and the machinable area, and also clamps a portion of the paint area and the machinable area. The laser 20 is aligned with the unclamped machinable area. There is a first distance L1 between the processing position of the laser 20 and the connection position between the paint area and the machinable area. There is a second distance L2 between the edge of the machinable area and the connection position between the paint area and the machinable area of ​​the laser processing fixture 10.

[0039] In this embodiment, a water-guided laser 20 is used in conjunction with a laser processing fixture 10 equipped with a cooling structure 12. This minimizes the heat impact generated by the laser processing device 1 during processing, allowing it to process closer to the junction of the paint area and the processable area (the edge of the paint) (where L1 and L2 are smaller) without damaging the paint. Simultaneously, the processed surface is bright with few burrs, facilitating subsequent processing of the workpiece 30. For example, when the workpiece 30 is a copper flat wire, this processing method can reduce the amount of copper flat wire used, thereby reducing the weight of the motor after the copper flat wire is applied.

[0040] In some embodiments, the clamping member 11 in the laser processing fixture 10 has at least a partial inclined surface on the side facing the laser 20. This inclined surface is inclined in the direction away from the laser 20 along the direction away from the workpiece 30 to be processed. That is, the end of the laser processing fixture 10 closest to the laser 20 is conical to avoid the clamping of the laser processing fixture 10 interfering with the processing position of the laser 20. This allows the processing position of the laser 20 to be closer to the connection position (edge ​​of the paint) between the paint area and the processable area. As a result, the laser processing fixture 10 only needs to reserve a small amount of processable area to meet the processing requirements when clamping.

[0041] Specifically, the laser processing apparatus 1 in this embodiment mainly includes the following steps when processing the workpiece 30, wherein the workpiece 30 is a copper flat wire as an example: First, laser cleaning is used to remove part of the paint from the copper flat wire. The area after the paint is removed is the processable area. Then, the laser processing fixture 10 is used to clamp the processable area and the edge of the paint, and the laser 20 is aligned with the processable area that is not clamped.

[0042] Next, the laser 20 is turned on, and the laser 20 emits a laser beam and forms a water column. The water column surrounds the laser beam. The laser beam is used to process the flat copper wire, while the water column is used to remove some of the heat generated during the processing. At the same time, the cooling structure 12 on the laser processing fixture 10 is connected to an external circulating cooling device, so that the cooling medium circulates within the cooling structure 12 to remove some of the heat generated during the processing.

[0043] After processing is completed, the laser 20 is turned off, and the connection between the cooling structure 12 on the laser processing fixture 10 and the external circulating cooling equipment is disconnected. The processed workpiece is then removed for subsequent use. Through the cooperation of the laser 20 and the cooling structure 12, the heat effect generated by the laser processing device 1 during processing can be reduced, resulting in less remaining processable area on the processed copper flat wire, thereby reducing the amount of copper flat wire used and reducing the weight of the motor after the copper flat wire is applied.

[0044] The above provides a detailed description of a laser processing fixture and laser processing apparatus provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A laser processing fixture, characterized in that, The device includes two clamping members arranged opposite each other along a first direction, with the two clamping members used to clamp the workpiece to be processed, and at least one of the clamping members is provided with a cooling structure; wherein... When the clamping member is holding the workpiece to be processed, the orthographic projection of the cooling structure in the first direction partially overlaps with the orthographic projection of the workpiece to be processed in the first direction.

2. The laser processing fixture according to claim 1, characterized in that, At least one of the clamping members has a groove on the side opposite to the other clamping member, the groove being used to place the workpiece to be processed.

3. The laser processing fixture according to claim 2, characterized in that, The cooling structure and the groove are disposed on the same clamping member.

4. The laser processing fixture according to claim 2, characterized in that, The groove extends through the opposite sides of the clamping member along the second direction. The cooling structure includes an inlet and an outlet. The inlet and outlet are arranged on the opposite sides of the clamping member along a third direction. The inlet and outlet are interconnected. The second direction, the third direction and the first direction form an angle with each other.

5. The laser processing fixture according to claim 2, characterized in that, The orthographic projection of the cooling structure in the first direction at least partially covers the orthographic projection of the groove in the first direction.

6. The laser processing fixture according to claim 5, characterized in that, The groove extends through the opposite sides of the clamping member along the second direction. The cooling structure includes an inlet and an outlet. The inlet and outlet are arranged along the second direction on the opposite sides of the clamping member. The inlet and outlet are interconnected. The second direction forms an angle with the first direction. The orthographic projection of the cooling structure in the first direction covers the orthographic projection of the groove in the first direction.

7. The laser processing fixture according to any one of claims 2 to 6, characterized in that, The two clamping members are respectively provided with the cooling structure and the groove. The grooves on the two clamping members are symmetrically arranged along the first direction, and the cooling structures on the two clamping members are symmetrically arranged along the first direction.

8. The laser processing fixture according to any one of claims 1 to 6, characterized in that, When the clamping member is holding the workpiece to be processed, the opposite sides of the two clamping members abut against each other.

9. A laser processing apparatus, characterized in that, include: The laser processing fixture according to any one of claims 1 to 8; as well as A laser, used to process the workpiece held in the laser processing fixture.

10. The laser processing apparatus according to claim 9, characterized in that, The laser is a water-guided laser.

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