High-temperature mold assembly with data acquisition function

Abstract

The invention provides a high-temperature mold assembly with a data acquisition function. The assembly comprises a high-temperature mold and a data acquisition device. The high-temperature mold is composed of a first mold and a second mold which can move relatively to be closed and opened, a mounting notch with three open faces is formed in the corner of the first mold, and an induction magnet is installed at the corresponding position of the second mold. And the data acquisition device comprises an acquisition shell fixed at the mounting notch, and a battery, an acquisition circuit, a Hall sensor, an aerogel pad and a heat-conducting silicone grease layer are arranged in the acquisition shell. The first wall face of the shell and the inner wall of the installation notch form a heat dissipation gap, and the second wall face is flush with or protrudes out of the outer surface of the mold. The aerogel pad is laid on the side close to the first wall face, the heat-conducting silicone grease layer is coated on the side close to the second wall face, and the battery, the collecting circuit and the Hall sensor are located between the aerogel pad and the heat-conducting silicone grease layer and make contact with the heat-conducting silicone grease layer. The assembly can accurately and efficiently monitor the opening and closing times and frequency of the mold.

Description

Technical Field

[0001] This invention relates to the field of high-temperature mold data acquisition technology, and specifically to a high-temperature mold component with data acquisition function. Background Technology

[0002] During the manufacturing process of shoe soles, it is necessary to monitor and manage the number of times the mold opens and closes, the frequency of opening and closing, and the operating status. Current monitoring methods mainly rely on manual counting, which is prone to errors; or mechanical counters are used, which count the opening and closing of the mold through physical linkages, but these counters are prone to jamming in high-temperature or oily environments, causing the counting to fail. Summary of the Invention

[0003] The purpose of this invention is to overcome the above-mentioned defects or problems in the background art and provide a high-temperature mold assembly with data acquisition function, which can accurately and efficiently monitor the number of times and frequency of mold opening and closing.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: Technical Solution 1: A high-temperature mold assembly with data acquisition function, comprising: a high-temperature mold, including a first mold and a second mold adapted for relative movement to close and open the mold, and an induction magnet mounted on the second mold; the first mold has a three-sided open mounting notch at its peripheral corner position; the second mold is equipped with the induction magnet facing the mounting notch; a data acquisition device, comprising an acquisition housing forming an internal mounting chamber, and a battery, acquisition circuit, Hall sensor, aerogel pad, and thermally conductive silicone grease layer installed in the mounting chamber; the acquisition housing is fixedly mounted on the mounting notch along its thickness direction, and its side facing the mounting notch along its thickness direction. The surface is a first wall surface, and the side surface facing away from the mounting notch along the thickness direction is a second wall surface; the inner wall of the mounting notch facing the first wall surface is a third wall surface, and a first heat dissipation gap is formed between the first wall surface and the third wall surface; the aerogel pad is laid on the side of the mounting chamber near the first wall surface, and the thermally conductive silicone grease layer is coated on the side of the mounting chamber near the second wall surface; the battery, the acquisition circuit, and the Hall sensor are located between the aerogel pad and the thermally conductive silicone grease layer and are in contact with the thermally conductive silicone grease layer; the battery is connected to the acquisition circuit, the acquisition circuit is connected to the Hall sensor, and the sensing direction of the Hall sensor is towards the sensing magnet.

[0005] Technical Solution 2 based on Technical Solution 1: The surface of the second mold facing the installation notch is the fourth wall surface; the induction magnet is installed on the fourth wall surface by the first fastener and protrudes from the fourth wall surface; the side surface of the collection housing facing the fourth wall surface along the width direction is the fifth wall surface; when the high-temperature mold is closed, a second heat dissipation gap is formed between the fourth wall surface and the fifth wall surface.

[0006] Technical Solution 3 based on Technical Solution 2: The side surfaces of the acquisition housing facing the mounting notch along the width and length directions are the sixth wall surface and the seventh wall surface, respectively; the inner walls of the mounting notch facing the sixth wall surface and the seventh wall surface are the eighth wall surface and the ninth wall surface; a third heat dissipation gap and a fourth heat dissipation gap are formed between the sixth wall surface and the eighth wall surface, and between the seventh wall surface and the ninth wall surface, respectively.

[0007] Technical Solution 4 based on Technical Solution 3: The first heat dissipation gap, the third heat dissipation gap and the fourth heat dissipation gap are interconnected to form an air convection channel surrounding the three sides of the collection housing.

[0008] Technical Solution 5 based on Technical Solution 1: The acquisition housing has a mounting post protruding from the first wall surface. When the acquisition housing is installed in the mounting notch, the mounting post abuts against the third wall surface to form the first heat dissipation gap between the first wall surface and the third wall surface.

[0009] Technical Solution Six based on Technical Solution Five: The two mounting columns are arranged on both sides along the length of the acquisition housing.

[0010] Technical solution seven based on technical solution five or six: a high-temperature resistant elastic pad is attached to the end face of the mounting column; the acquisition housing is fixed to the third wall surface by a second fastener passing through the mounting column.

[0011] Technical solution eight based on technical solution one: The outer surface of the second wall is provided with heat dissipation patterns, which are one or more of the following: grid pattern, stripe pattern, or dot matrix pattern.

[0012] Technical solution nine based on technical solution two: A heat insulation pad is provided between the induction magnet and the fourth wall surface, and the outer diameter of the heat insulation pad is larger than the outer diameter of the induction magnet.

[0013] Technical solution ten based on technical solution seven: both the acquisition shell and the second fastener are made of polyetheretherketone.

[0014] As can be seen from the above description of the present invention, compared with the prior art, the present invention has the following beneficial effects: This invention provides a high-temperature mold assembly with data acquisition function. The second mold in the high-temperature mold is equipped with an induction magnet, and a data acquisition device is installed on the mounting notch of the first mold. A Hall sensor in the data acquisition device works in conjunction with the induction magnet to sense and acquire the opening and closing frequency and other motion states of the high-temperature mold. The monitoring results are accurate, efficient, and less affected by the external environment, making it less prone to damage. However, since the data acquisition device contains high-temperature-sensitive electronic components such as batteries, acquisition circuits, and Hall sensors, and the high temperature of the mold itself is high, simply placing the data acquisition device on the mold would cause it to malfunction due to the high temperature. Therefore, this solution specifically provides a three-sided open mounting notch on the first mold, where the data acquisition device is installed. The induction magnet on the second mold is also positioned corresponding to this notch. This notch ensures that at least three sides of the data acquisition device face the outside of the high-temperature mold, initially reducing the direct heat conduction effect. Furthermore, this solution uses a fixing structure to physically separate the first wall of the acquisition housing from the third wall of the mounting notch, forming a first heat dissipation gap. In conventional sensor installation processes, to ensure a stable connection, the bottom surface of the device is usually placed tightly against the mold mounting surface. However, this causes heat to be conducted rapidly into the device through the metal contact surface. This solution utilizes the extremely low thermal conductivity of air to construct a thermal barrier between the high-temperature mold and the data acquisition device, effectively cutting off the main heat conduction path. Furthermore, the environment surrounding the high-temperature mold still affects the temperature of the data acquisition device. Therefore, this solution further lays an aerogel pad on the inner side of the first wall of the acquisition housing near the high-temperature mold. The aerogel pad effectively blocks heat radiation from the high-temperature mold to the internal electronic components of the data acquisition device; however, this aerogel pad can also hinder heat dissipation from the internal electronic components. Therefore, this solution specifically applies a thermally conductive silicone grease layer to the inner side of the second wall facing away from the high-temperature mold, ensuring close contact between the thermally conductive silicone grease and the outer casing wall directly exposed to ambient air. This creates a directional heat flow gradient within the housing, utilizing the high thermal resistance of the aerogel to prevent heat from penetrating the mold, while the low thermal resistance of the silicone grease rapidly conducts the heat generated by the electronic components and any residual heat that seeps in to the cooler back surface of the outer casing for dissipation. This approach better enables the long-term stable operation of electronic devices under high-temperature conditions, ensuring accurate and efficient data acquisition from the high-temperature mold.

[0015] In technical solution two, the second heat dissipation gap formed between the second mold and the data acquisition device ensures that even when the mold is in the closed state, the mounting surface of the induction magnet on the second mold will not physically contact the side of the data acquisition device. This gap utilizes the thermal insulation properties of air to block direct heat conduction from the second mold to the side of the data acquisition device, preventing the high temperature of the second mold from affecting the normal operation of the Hall sensor in the data acquisition device.

[0016] In technical solution three, by establishing a third and a fourth heat dissipation gap between the side of the collection housing and the inner wall of the installation notch, the collection device is fully suspended within the installation notch, ensuring that all surfaces of the collection housing facing the high-temperature mold are isolated by an air layer, thus minimizing the contact area for solid-phase heat conduction.

[0017] In technical solution four, the interconnection of the first, third, and fourth heat dissipation gaps constructs an air convection channel that surrounds the three embedded surfaces of the acquisition housing. This interconnected structure utilizes the thermal buoyancy of heated air to generate a chimney effect, promoting the continuous rise and exhaust of hot air within the gaps while drawing in external cold air, thereby achieving dynamic convection heat dissipation and further improving the heat dissipation effect of the data acquisition device.

[0018] In technical solution five, the mounting column allows the acquisition housing to be securely installed on the mounting notch while preventing the acquisition housing from directly contacting the inner wall of the mounting notch, thus forming the required first heat dissipation gap and reducing the impact of the high-temperature mold on the data acquisition device.

[0019] In technical solution six, the mounting columns are arranged on both sides of the collection housing, which can improve the stability of the collection housing when it is installed on the mounting notch to resist the vibration of the mold. At the same time, it keeps the central area of ​​the first heat dissipation gap unobstructed, reduces the obstruction to the air flow in the first heat dissipation gap, and facilitates the smooth discharge of hot air.

[0020] In technical solution seven, the high-temperature resistant elastic pad located between the inner wall of the mounting column and the mounting notch has both thermal insulation and mechanical buffering functions, which can further improve the heat insulation effect and absorb vibration energy to keep the data acquisition device firmly and stably installed.

[0021] In technical solution eight, a grid-like, striped, or dot-matrix pattern of heat dissipation is set on the second wall surface, which significantly increases the contact area between the surface and the external ambient air and improves the heat exchange efficiency with the external cold air.

[0022] In technical solution nine, the heat insulation pad placed between the induction magnet and the fourth wall surface blocks the heat conduction from the high-temperature surface of the second mold to the magnet, preventing the magnetic field of the induction magnet from weakening due to excessive temperature. At the same time, the pad design with an outer diameter larger than the magnet increases the thermal creepage distance and reduces the impact of lateral heat radiation on the magnet.

[0023] In technical solution ten, polyetheretherketone (PEEK) is selected to manufacture the acquisition housing. This material has high temperature resistance and low thermal conductivity, which can ensure that the acquisition housing will not deform under high temperature exposure and can prevent heat flow from entering the housing. The second fastener is also made of PEEK, which can prevent heat flow from entering the housing along the metal fastener due to the use of conventional metal fasteners. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments are briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a high-temperature mold assembly with data acquisition function according to an embodiment of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the structure of a high-temperature mold assembly with data acquisition function according to an embodiment of the present invention. Figure 2 ; Figure 3 This is a schematic diagram of the structure of a high-temperature mold assembly with data acquisition function according to an embodiment of the present invention. Figure 3 ; Figure 4 This is a cross-sectional schematic diagram of the data acquisition device in a high-temperature mold assembly with data acquisition function according to an embodiment of the present invention.

[0026] Explanation of key figure labels: High-temperature mold 100; First mold 110; Installation notch 111; Third wall surface 112; Eighth wall surface 113; Ninth wall surface 114; Second mold 120; Fourth wall surface 121; Induction magnet 131; First fastener 132; Data acquisition device 200; acquisition housing 210; first wall surface 211; second wall surface 212; fifth wall surface 213; sixth wall surface 214; seventh wall surface 215; mounting post 216; high temperature resistant elastic pad 217; second fastener 218; housing cover 219; housing base 2110; aerogel pad 220; thermally conductive silicone grease layer 230; battery 240. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are preferred embodiments of the present invention and should not be considered as excluding other embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0028] Unless otherwise expressly defined, the use of terms such as "first," "second," or "third" in the claims, description, and accompanying drawings of this invention is for distinguishing different objects and not for describing a specific order.

[0029] Unless otherwise expressly defined, in the claims, description, and accompanying drawings of this invention, the use of directional terms such as "center," "lateral," "longitudinal," "horizontal," "vertical," "top," "bottom," "inner," "outer," "upper," "lower," "front," "rear," "left," "right," "clockwise," and "counterclockwise" to indicate orientation or positional relationships is based on the orientation and positional relationships shown in the accompanying drawings and is only for the convenience of describing the invention and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the specific scope of protection of this invention.

[0030] Unless otherwise expressly defined, the terms "fixed connection" or "fixed connection" used in the claims, description and drawings of this invention should be interpreted broadly to refer to any connection in which there is no displacement or relative rotation relationship between the two parties, including non-removable fixed connection, detachable fixed connection, integral connection and fixed connection by other means or components.

[0031] In the claims, description and accompanying drawings of this invention, the terms "comprising," "having," and variations thereof are used to mean "including but not limited to."

[0032] Example This invention relates to a high-temperature mold assembly with data acquisition function, which can monitor and collect data such as the number of times and frequency of high-temperature mold 100 is opened.

[0033] Among them, reference Figure 1 The high-temperature mold assembly includes a high-temperature mold 100 and a data acquisition device 200.

[0034] The high-temperature mold 100 includes a first mold 110 and a second mold 120 adapted for relative movement to close and open the mold, and an induction magnet 131 installed in the second mold 120; the first mold 110 has a three-sided open mounting notch 111 at the peripheral corner position; the second mold 120 is equipped with the induction magnet 131 facing the mounting notch 111.

[0035] Specifically, the high-temperature mold 100 in this embodiment can be a mold for manufacturing programmed shoe soles. The first mold 110 can be a lower mold, and the second mold 120 can be an upper mold. During production, the second mold 120 moves up and down relative to the first mold 110 to close or open. Both the first mold 110 and the second mold 120 are generally flat rectangular parallelepipeds, each having an upper surface, a lower surface, and a peripheral surface. The first mold 110 has a mounting notch 111 at a peripheral corner. This mounting notch 111 is open on three sides, meaning it connects to two open side surfaces at one corner on the peripheral surface and is also open on the upper surface. The second mold 120 has approximately the same shape and dimensions as the first mold 110. Therefore, the second mold 120 still has a solid portion corresponding to the mounting notch 111, where an induction magnet 131 is located.

[0036] Among them, reference Figure 2 and Figure 3 The surface of the second mold 120 facing the mounting notch 111 is the fourth wall surface 121. The induction magnet 131 is mounted on the fourth wall surface 121 and protrudes from it via a first fastener 132. Specifically, the fourth wall surface 121 can be considered as the lower surface of the second mold 120. A recessed groove can be provided on the fourth wall surface 121, and a threaded hole is provided at the bottom of the groove. The first fastener 132 can pass through the induction magnet 131 and be screwed into the threaded hole, thereby fixing the induction magnet 131 to the second mold 120. Preferably, a heat insulation gasket can be provided between the induction magnet 131 and the fourth wall surface 121, and the outer diameter of the heat insulation gasket is larger than the outer diameter of the induction magnet 131. Specifically, the heat insulation pad can be made of high-temperature resistant heat insulation materials such as mica or ceramic fiber. Its outer diameter is larger than that of the induction magnet 131, so that the protruding part of the edge of the pad can effectively block the heat radiation from the periphery of the fourth wall 121 from directly acting on the side wall of the induction magnet 131.

[0037] Reference Figures 1 to 4The data acquisition device 200 includes an acquisition housing 210 with an internal mounting chamber, and a battery 240, acquisition circuit, Hall sensor, aerogel pad 220, and thermally conductive silicone grease layer 230 installed in the mounting chamber. The acquisition housing 210 is fixedly mounted on the mounting notch 111 along its thickness direction. The side surface of the housing facing the mounting notch 111 along its thickness direction is the first wall surface 211, and the side surface facing away from the mounting notch 111 along its thickness direction is the second wall surface 212. The inner wall of the mounting notch 111 facing the first wall surface 211 is the third wall surface 112, and a first heat dissipation gap is formed between the first wall surface 211 and the third wall surface 112. The second wall surface 212 protrudes from or is flush with the peripheral side wall of the first mold 110 at the mounting notch 111.

[0038] Furthermore, the side surface of the acquisition housing 210 facing the fourth wall surface 121 along the width direction is the fifth wall surface 213; when the high-temperature mold 100 is closed, a second heat dissipation gap is formed between the fourth wall surface 121 and the fifth wall surface 213. The side surfaces of the acquisition housing 210 facing the mounting notch 111 along the width and length directions are the sixth wall surface 214 and the seventh wall surface 215, respectively. The inner walls of the mounting notch 111 facing the sixth wall surface 214 and the seventh wall surface 215 are the eighth wall surface 113 and the ninth wall surface 114; a third heat dissipation gap and a fourth heat dissipation gap are formed between the sixth wall surface 214 and the eighth wall surface 113, and between the seventh wall surface 215 and the ninth wall surface 114, respectively. The first heat dissipation gap, the third heat dissipation gap, and the fourth heat dissipation gap are interconnected, forming an air convection channel surrounding the three sides of the acquisition housing 210.

[0039] The main body of the data acquisition device 200 is a data acquisition housing 210, which includes a housing cover 219 and a housing base 2110. The data acquisition housing 210 is screwed to the first mold 110 by a second fastener 218. The second fastener 218 not only fixes the data acquisition housing 210, but also secures the housing cover 219 and the housing base 2110 together. The space between the housing cover 219 and the housing base 2110 forms a mounting chamber, in which the battery 240, the acquisition circuit, and the Hall sensor in the data acquisition device 200 are all installed.

[0040] The acquisition housing 210 is roughly rectangular in shape and is fixed in the mounting notch 111 of the first mold 110. Therefore, it has three outer surfaces that face the three inner walls of the mounting notch 111. Specifically, the two sides of the acquisition housing 210 in the thickness direction are the first wall 211 and the second wall 212, with the first wall 211 facing the mounting notch 111 and the second wall 212 facing away from it. The inner wall of the mounting notch 111 facing the first wall 211 is the third wall 112. In the width direction of the acquisition housing 210, the wall facing the mounting notch 111 is the sixth wall 214, and the wall facing the second mold 120 is the fifth wall 213. In the length direction of the acquisition housing 210, the wall facing the mounting notch 111 is the seventh wall 215. The inner wall of the mounting notch 111 corresponding to the sixth wall 214 is the eighth wall 113, and the inner wall corresponding to the seventh wall 215 is the ninth wall 114.

[0041] Through the cooperation between the aforementioned wall surfaces, a first heat dissipation gap, a third heat dissipation gap, and a fourth heat dissipation gap are formed between the acquisition housing 210 and the mounting notch 111. Simultaneously, after mold closing, a second heat dissipation gap is formed between the fourth wall surface 121 and the fifth wall surface 213 of the second mold 120. Through the interconnected first, third, and fourth heat dissipation gaps, an air convection channel surrounding the acquisition housing 210 is formed between the first mold 110 and the acquisition housing 210. When the second mold 120 closes, the second heat dissipation gap also connects to this air convection channel. Utilizing the lighter weight of hot air, air can continuously flow in the air convection channel and exit through the second heat dissipation gap, thereby achieving efficient heat dissipation and insulation of the acquisition housing 210.

[0042] Among them, reference Figure 3The acquisition housing 210 has mounting posts 216 protruding from the first wall surface 211. When the acquisition housing 210 is installed in the mounting notch 111, the mounting posts 216 abut against the third wall surface 112 to form a first heat dissipation gap between the first wall surface 211 and the third wall surface 112. Furthermore, two mounting posts 216 are arranged on both sides along the length of the acquisition housing 210. In addition, a high-temperature resistant elastic pad 217 is attached to the end face of the mounting post 216; the acquisition housing 210 is fixed to the third wall surface 112 by a second fastener 218 passing through the mounting post 216. Specifically, the mounting posts 216 are preferably cylindrical protrusions integrally injection molded with the housing base 2110 of the acquisition housing 210, two of which are arranged on both sides along the length of the acquisition housing 210, and have through holes for the second fastener 218 to pass through. A high-temperature resistant elastic pad 217 (e.g., a methyl vinyl silicone rubber gasket) is adhered to or fitted onto the end face of the mounting post 216, and its shape is adapted to the end face of the mounting post 216. When the second fastener 218 passes through the mounting post 216 and the elastic pad from inside the acquisition housing 210 and locks to the third wall surface 112 of the first mold 110, the height of the mounting post 216 and the thickness of the elastic pad together limit the distance between the first wall surface 211 and the third wall surface 112, thereby stably supporting the first heat dissipation gap. The mounting post 216 allows the acquisition housing 210 to be firmly installed on the mounting notch 111, while preventing the acquisition housing 210 from directly abutting against the inner wall of the mounting notch 111, thereby forming the required first heat dissipation gap and reducing the impact of the high-temperature mold 100 on the data acquisition device 200. Arranging the mounting posts 216 on both sides of the data acquisition housing 210 improves the stability of the data acquisition housing 210 when mounted on the mounting notch 111 to resist mold vibration. Simultaneously, it keeps the central area of ​​the first heat dissipation gap unobstructed, reducing obstruction to airflow within the gap and facilitating the smooth discharge of hot air. The high-temperature resistant elastic pad 217 located between the mounting posts 216 and the inner wall of the mounting notch 111 serves both thermal insulation and mechanical buffering functions, further improving the heat insulation effect and absorbing vibration energy to ensure the data acquisition device 200 is firmly and stably installed.

[0043] Reference Figure 4An aerogel pad 220 is laid on the inner bottom surface of the housing base 2110, that is, on the side of the mounting cavity near the first wall 211. Utilizing the low thermal conductivity of the aerogel, it forms a thermal barrier layer to block high-temperature heat transferred from the first wall 211. The battery 240, the acquisition circuit (typically integrated into a PCB circuit board), and the Hall sensor are mounted on the aerogel pad 220. The PCB circuit board can be fixed inside the housing base 2110 by screws or clips, and the battery 240 is connected to the PCB circuit board via wires or sockets. A thermally conductive silicone grease layer 230 is applied to the top surface of the battery 240 and the main heat-generating components (such as the microcontroller unit and RF module) in the acquisition circuit, that is, on the side of the mounting cavity near the second wall 212. When the housing cover 219 and the housing base 2110 are locked closed by the second fastener 218, the upper surface of the thermally conductive silicone grease layer 230 is compressed and tightly adhered to the inner top wall of the housing cover 219 (i.e., the inner side of the second wall 212).

[0044] Furthermore, the outer surface of the second wall 212 is provided with heat dissipation patterns, which can be one or more of the following: grid-like, striped, or dot-matrix pattern. For example, in this embodiment, the heat dissipation patterns are designed as a grid, which can significantly increase the contact area between the second wall 212 and the external ambient air, thereby improving heat dissipation efficiency. Combined with the thermally conductive silicone grease layer 230 that is closely attached to the inner side of the second wall 212, this structure can quickly conduct the heat generated during the operation of electronic devices, as well as a small amount of residual heat entering through the aerogel pad 220, to the second wall 212 and dissipate it into the surrounding air through the heat dissipation patterns.

[0045] In this embodiment, both the acquisition housing 210 and the second fastener 218 are made of polyetheretherketone (PEEK). The acquisition housing 210 is made of PEEK, which has high-temperature resistance and low thermal conductivity, ensuring that the acquisition housing 210 will not deform under high-temperature exposure and preventing heat transfer into the housing. The second fastener 218 is also made of PEEK, preventing heat from entering the housing along the metal fastener, which would be a problem with conventional metal fasteners.

[0046] It should be understood that the function of the data acquisition device 200 is to monitor and acquire the number of opening and closing times and frequency of the high-temperature mold 100. Therefore, the acquisition circuit of the data acquisition device 200 can be a main control circuit board integrating a microcontroller unit (MCU) and a wireless communication module. Specifically, the Hall sensor is electrically connected to the microcontroller unit and is used to convert the sensed magnetic field changes into electrical signals (such as high / low level transitions or pulse signals) and send them to the microcontroller unit. The microcontroller unit is configured to filter the received electrical signals, accumulate the number of mold opening and closing times based on the number of triggers of the electrical signals, and calculate the mold opening and closing frequency or production cycle based on the time interval between two adjacent mold closing signals. In addition, the acquisition circuit also includes a wireless communication module (e.g., a 4G, NB-IoT, or LoRa module) connected to the microcontroller unit, which is used to package the data processed by the microcontroller unit and send it to a remote server or monitoring terminal via a wireless network. Preferably, the acquisition circuit also includes a power management unit, which is connected to the battery 240 and a parallel capacitor to regulate the output voltage of the battery 240 and provide instantaneous pulse current when the wireless communication module transmits signals, ensuring stable operation of the circuit in a high-temperature environment.

[0047] This invention relates to a high-temperature mold assembly with data acquisition function. A sensing magnet 131 is provided on the second mold 120 of the high-temperature mold 100, and a data acquisition device 200 is provided on the mounting notch 111 of the first mold 110. A Hall sensor in the data acquisition device 200 can cooperate with the sensing magnet 131 to sense and acquire the opening and closing frequency and other motion states of the high-temperature mold 100. The monitoring results are accurate and efficient, and are less affected by the external environment and less prone to damage. However, because the data acquisition device 200 contains high-temperature-sensitive electronic components such as a battery 240, acquisition circuit, and Hall sensor, and the high-temperature mold 100 itself has a high temperature, simply placing the data acquisition device 200 on the high-temperature mold 100 will cause it to malfunction due to the high temperature. To address this, this solution specifically includes a three-sided open mounting notch 111 on the first mold 110, where the data acquisition device 200 is mounted. Simultaneously, the induction magnet 131 on the second mold 120 is also positioned corresponding to this mounting notch 111. The mounting notch 111 ensures that at least three sides of the data acquisition device 200 face the outside of the high-temperature mold 100, initially reducing the direct heat conduction from the high-temperature mold 100. Furthermore, this solution uses a fixing structure to physically separate the first wall 211 of the acquisition housing 210 from the third wall 112 of the mounting notch 111, forming a first heat dissipation gap. In conventional sensor installation processes, to ensure connection stability, the bottom surface of the device is usually pressed tightly against the mold mounting surface. However, this causes heat to be rapidly conducted to the inside of the device through the metal contact surface. This solution utilizes the extremely low thermal conductivity of air to construct a thermal barrier between the high-temperature mold 100 and the data acquisition device 200, effectively cutting off the main heat conduction path. In addition, the environment around the high-temperature mold 100 will still affect the temperature of the data acquisition device 200. To address this, this solution further lays an aerogel pad 220 inside the acquisition housing 210 near the inner side of the first wall 211 of the high-temperature mold 100. The aerogel pad 220 can effectively block the heat radiation from the high-temperature mold 100 to the internal electronic components of the data acquisition device 200. However, the installation of this aerogel pad 220 will also hinder the heat dissipation of the internal electronic components.Therefore, this solution specifically coats the inner side of the second wall 212 facing away from the high-temperature mold 100 with a thermally conductive silicone grease layer 230, and makes it in close contact with the electronic components and the outer shell wall directly facing the ambient air. This creates a directional heat flow gradient in the internal installation chamber of the acquisition housing 210. On the one hand, the high thermal resistance of the aerogel makes it difficult for heat from the mold to enter. On the other hand, the low thermal resistance of the thermally conductive silicone grease quickly conducts the heat generated by the electronic components and the small amount of residual heat that seeps in to the cooler back surface of the outer shell and dissipates it. Combined with the structure of the second wall 212 protruding from or flush with the peripheral wall of the first mold 110, it can better achieve long-term stable operation of electronic components under high temperature exposure, and ensure accurate and efficient data acquisition from the high-temperature mold 100.

[0048] The foregoing description of the specifications and embodiments is intended to explain the scope of protection of this invention, but does not constitute a limitation on the scope of protection of this invention. Modifications, equivalent substitutions, or other improvements to the embodiments of this invention or a portion thereof that can be obtained by those skilled in the art through logical analysis, reasoning, or limited experimentation, based on the teachings of this invention or the foregoing embodiments, in conjunction with common knowledge, general technical knowledge, and / or existing technology, should all be included within the scope of protection of this invention.

Claims

1. A high-temperature mold assembly with data acquisition function, characterized in that, include: A high-temperature mold (100) includes a first mold (110) and a second mold (120) adapted for relative movement to close and open the mold, and an induction magnet (131) mounted on the second mold (120); the first mold (110) has a three-sided open mounting notch (111) at the peripheral corner position; the second mold (120) is equipped with the induction magnet (131) facing the mounting notch (111); A data acquisition device (200) includes an acquisition housing (210) forming an internal mounting chamber, and a battery (240), an acquisition circuit, a Hall sensor, an aerogel pad (220), and a thermally conductive silicone grease layer (230) installed in the mounting chamber; the acquisition housing (210) is fixedly mounted to the mounting notch (111) along its thickness direction, the side surface of the housing facing the mounting notch (111) along its thickness direction is a first wall surface (211), and the side surface facing away from the mounting notch (111) along its thickness direction is a second wall surface (212); the inner wall of the mounting notch (111) facing the first wall surface (211) is a third wall surface (112), and a first heat dissipation gap is formed between the first wall surface (211) and the third wall surface (112); The aerogel pad (220) is laid on the side of the mounting chamber near the first wall (211), and the thermally conductive silicone grease layer (230) is coated on the side of the mounting chamber near the second wall (212). The battery (240), the acquisition circuit and the Hall sensor are located between the aerogel pad (220) and the thermally conductive silicone grease layer (230) and are in contact with the thermally conductive silicone grease layer (230). The battery (240) is connected to the acquisition circuit, which is connected to the Hall sensor, and the Hall sensor's sensing direction is towards the sensing magnet (131).

2. The high-temperature mold assembly with data acquisition function as described in claim 1, characterized in that, The surface of the second mold (120) facing the mounting notch (111) is the fourth wall surface (121); the induction magnet (131) is mounted on the fourth wall surface (121) by the first fastener (132) and protrudes from the fourth wall surface (121); the side surface of the collection housing (210) facing the fourth wall surface (121) along the width direction is the fifth wall surface (213); when the high temperature mold (100) is closed, a second heat dissipation gap is formed between the fourth wall surface (121) and the fifth wall surface (213).

3. A high-temperature mold assembly with data acquisition function as described in claim 2, characterized in that, The side surfaces of the collection housing (210) facing the mounting notch (111) along the width and length directions are the sixth wall surface (214) and the seventh wall surface (215), respectively. The inner walls of the mounting notch (111) facing the sixth wall surface (214) and the seventh wall surface (215) are the eighth wall surface (113) and the ninth wall surface (114). A third heat dissipation gap and a fourth heat dissipation gap are formed between the sixth wall surface (214) and the eighth wall surface (113), and between the seventh wall surface (215) and the ninth wall surface (114), respectively.

4. A high-temperature mold assembly with data acquisition function as described in claim 3, characterized in that, The first heat dissipation gap, the third heat dissipation gap and the fourth heat dissipation gap are interconnected, forming an air convection channel that surrounds the three sides of the collection housing (210).

5. A high-temperature mold assembly with data acquisition function as described in claim 1, characterized in that, The collection housing (210) has a mounting post (216) protruding from the first wall surface (211). When the collection housing (210) is installed in the mounting notch (111), the mounting post (216) abuts against the third wall surface (112) to form the first heat dissipation gap between the first wall surface (211) and the third wall surface (112).

6. A high-temperature mold assembly with data acquisition function as described in claim 5, characterized in that, The two mounting posts (216) are arranged on both sides along the length of the acquisition housing (210).

7. A high-temperature mold assembly with data acquisition function as described in claim 5 or 6, characterized in that, The end face of the mounting post (216) is attached with a high-temperature resistant elastic pad (217); the collection housing (210) is fixed to the third wall surface (112) by a second fastener (218) passing through the mounting post (216).

8. A high-temperature mold assembly with data acquisition function as described in claim 1, characterized in that, The outer surface of the second wall (212) is provided with heat dissipation patterns, which are one or more of the following: grid pattern, stripe pattern, or dot matrix pattern.

9. A high-temperature mold assembly with data acquisition function as described in claim 2, characterized in that, A heat insulation pad is provided between the induction magnet (131) and the fourth wall surface (121), and the outer diameter of the heat insulation pad is larger than the outer diameter of the induction magnet (131).

10. A high-temperature mold assembly with data acquisition function as described in claim 7, characterized in that, Both the collection housing (210) and the second fastener (218) are made of polyetheretherketone (PEEK).

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