Laminated film

Abstract

The invention relates to a laminated film. The invention provides a laminated film capable of improving work efficiency in a manufacturing process of a semiconductor device. This laminated film is obtained by laminating a first separator, a first adhesive layer, a substrate, a second adhesive layer, and a second separator in this order, the first adhesive layer comprising a low-adhesiveness adhesive layer, and the second adhesive layer comprising a peelable adhesive layer, f (1), F (2), P (2) and P '(2) satisfy the following formulae: F (2) < = F (1), P (2) > = F (1), P' (2) / P (2) < 1.20, P '(2) < 1.00, F (1) is the peeling force of 180-degree peeling of the first spacer to the first adhesive layer, F (2) is the peeling force of 180-degree peeling of the second spacer to the second adhesive layer, P (2) is the adhesive force of 180-degree peeling of the second adhesive layer to the glass plate, and P' (2) is the adhesive force (N / 50 mm) of 180-degree peeling of the second adhesive layer to the glass plate after 5 minutes at 160 DEG C.

Description

[0001] This application is a divisional application of Chinese patent application No. 202280038843.3, filed on May 24, 2022. Technical Field

[0002] This invention relates to laminated films. Background Technology

[0003] In the manufacturing process of semiconductor devices, semiconductor wafers are typically cut into single pieces while temporarily fixed on dicing tape. After being cut into single pieces, the semiconductor chip is pushed from the dicing tape side on the back of the wafer using a pusher member, picked up using an adsorption clamp called a collet, and mounted onto a mounting substrate such as a circuit board (e.g., Patent Document 1).

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2019-9203 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] However, due to advancements in microfabrication technology, semiconductor chips are becoming increasingly miniaturized and thinner, making them susceptible to damage when picked up using tongs. Furthermore, the miniaturization and multilayering of semiconductor devices necessitate the dense, multi-layer mounting of multiple tiny semiconductor chips on a mounting substrate, gradually reducing the efficiency of methods that rely on tongs for individual picking and mounting.

[0009] As a method to address the damage and poor mounting efficiency of such semiconductor chips, one approach could be to receive multiple electronic components, which are cut into single pieces, on a transfer double-sided adhesive film temporarily fixed to a carrier substrate, and then transfer them onto a mounting substrate in one go.

[0010] However, in this method, for laminated films where both sides of the double-sided adhesive film for transfer are protected by spacers, problems such as errors in peeling off the surface protective film (spacers) on the adhesive side, peeling off the surface protective film (spacers) from the carrier substrate after it has been pasted onto the carrier substrate, difficulty in peeling the double-sided adhesive film for transfer from the carrier substrate during recycling, or glue residue can occur, all of which reduce work efficiency.

[0011] The present invention was made in view of the above-mentioned problems, and its object is to provide a laminated film that does not produce errors during the peeling process of the spacer when it is temporarily fixed on the carrier substrate and receives semiconductor chips, etc., does not peel off from the carrier substrate when the semiconductor chips, etc. are transferred to the mounting substrate, and can be peeled off from the carrier substrate without causing contamination such as glue residue after the semiconductor chips, etc. are transferred to the mounting substrate, thus exhibiting excellent reworkability.

[0012] means for solving problems

[0013] To achieve the above objectives, the inventors conducted in-depth research and discovered that when using the following laminated film, no errors occur during the peeling of the spacer when the laminated film is adhered to a carrier substrate to temporarily fix electronic components, the electronic components do not peel off from the carrier substrate when transferred to the mounting substrate, and the electronic components are easily peeled off from the carrier substrate after being transferred to the mounting substrate, thus suppressing adhesive residue. The laminated film has a surface protective film (first spacer), a first adhesive layer for temporarily fixing micro-electronic components such as semiconductor chips, a substrate, a second adhesive layer for temporarily fixing to the carrier substrate, and a surface protective film (second spacer). The peeling force F(1) of the first spacer to the first adhesive layer, the peeling force F(2) of the second spacer to the second adhesive layer, the adhesive force P(2) of the second adhesive layer to the glass plate, and the adhesive force P'(2) of the second adhesive layer to the glass plate after being adhered to the glass plate and subjected to 5 minutes at 160°C satisfy a specific relationship. The present invention was made based on these insights.

[0014] That is, the present invention provides a laminated film, wherein the laminated film is obtained by laminating a first spacer, a first adhesive layer, a substrate, a second adhesive layer and a second spacer in this order, wherein the first adhesive layer comprises a low-adhesion adhesive layer, the second adhesive layer comprises a peelable adhesive layer, and F(1), F(2), P(2) and P'(2) satisfy the following relationship:

[0015] F(2)≤F(1)

[0016] P(2)≥F(1)

[0017] P'(2) / P(2)<1.20、

[0018] P'(2) < 1.00,

[0019] F(1) is the peel force (N / 50mm) of the first spacer peeling 180° from the first adhesive layer, measured under conditions of 23°C, 50%RH and a peel speed of 0.3m / min. F(2) is the peel force (N / 50mm) of the second spacer peeling 180° from the second adhesive layer, measured under conditions of 23°C, 50%RH and a peel speed of 0.3m / min. P(2) is the adhesive force (N / 50mm) of the second adhesive layer peeling 180° from the glass plate, measured under conditions of 23°C, 50%RH and a pulling speed of 0.3m / min. P'(2) is the adhesive force (N / 50mm) of the second adhesive layer peeling 180° from the glass plate after the second adhesive layer is bonded to the glass plate, left at 160°C for 5 minutes, and then peeled 180° from the glass plate under conditions of 23°C, 50%RH and a pulling speed of 0.3m / min.

[0020] The above-mentioned laminated films also preferably satisfy the following relationship.

[0021] F(2) / F(1) < 0.80

[0022] P(2) / F(1)>1.00

[0023] The preferred relationships between the above-mentioned laminated film T(1), T(2) and the adhesive force P(2) are as follows:

[0024] T(1) / T(2)>1.05、

[0025] P(2) / T(1) < 1.00,

[0026] T(1) is the initial 90° peel force (N / 50mm) of the first adhesive layer on the first spacer, measured under conditions of 23°C, 50%RH and a pulling speed of 0.3m / min. T(2) is the initial 90° peel force (N / 50mm) of the second adhesive layer on the second spacer, measured under conditions of 23°C, 50%RH and a pulling speed of 0.3m / min.

[0027] Invention Effects

[0028] The laminated film of the present invention does not produce errors during the separation process when the laminated film is temporarily fixed on the carrier substrate and receives semiconductor chips, etc., it does not peel off from the carrier substrate when the semiconductor chips, etc. are transferred onto the mounting substrate, and it can be peeled off from the carrier substrate without contamination such as glue residue after the semiconductor chips, etc. are transferred onto the mounting substrate. It has excellent reworkability and thus can improve work efficiency in the manufacturing process of semiconductor devices. Attached Figure Description

[0029] Figure 1This is a cross-sectional schematic diagram illustrating one embodiment of the laminated film of the present invention.

[0030] Figure 2 To indicate that it was used Figure 1 A cross-sectional schematic diagram of one embodiment of a mounting method for mounting electronic components onto a mounting substrate using a laminated film.

[0031] Figure 3 To indicate that it was used Figure 1 A cross-sectional schematic diagram of one embodiment of the second step in the mounting method of mounting electronic components onto a mounting substrate using a laminated film.

[0032] Figure 4 This is a cross-sectional schematic diagram illustrating the process from temporarily fixing the laminated film of the present invention onto the carrier substrate to peeling it off. Detailed Implementation

[0033] [Laminated film]

[0034] The laminated film of the present invention has a laminated structure obtained by laminating a first spacer, a first adhesive layer, a substrate, a second adhesive layer, and a second spacer in this order. That is, the laminated film of the present invention has a laminated structure in which the bonding surface (bonding surface of the first adhesive layer and the second adhesive layer) of the transfer double-sided adhesive film comprising the first adhesive layer, the substrate, and the second adhesive layer is protected by the first spacer and the second spacer.

[0035] The first adhesive layer comprises a low-adhesion adhesive layer, and the second adhesive layer comprises a peelable adhesive layer. F(1), F(2), P(2), and P'(2) satisfy the following relationship:

[0036] F(2)≤F(1)

[0037] P(2)≥F(1)

[0038] P'(2) / P(2)<1.20、

[0039] P'(2) < 1.00,

[0040] F(1) is the peel force (N / 50mm) of the first spacer peeling the first adhesive layer at 180° under the conditions of 23°C, 50%RH and peel speed of 0.3m / min.

[0041] F(2) is the peel force (N / 50mm) of the second spacer peeling the second adhesive layer at 180°, measured under the conditions of 23°C, 50%RH and a peel speed of 0.3m / min.

[0042] P(2) is the adhesion force (N / 50mm) of the second adhesive layer to the glass plate after 180° peel, measured under the conditions of 23°C, 50%RH and a pulling speed of 0.3m / min.

[0043] P'(2) is the adhesion force (N / 50mm) of the second adhesive layer to the glass plate after the second adhesive layer is adhered to the glass plate, after 5 minutes at 160°C, and then at 23°C, 50%RH and a pulling speed of 0.3m / min.

[0044] Hereinafter, one embodiment of the laminated film of the present invention will be described with reference to the accompanying drawings, but the laminated film of the present invention is not limited to this embodiment.

[0045] Figure 4 This is a cross-sectional schematic diagram illustrating the process from temporarily fixing the laminated film of the present invention onto the carrier substrate to peeling it off.

[0046] exist Figure 4 In (a), the second spacer 120 is peeled off from the adhesive layer 12 of the laminated film 1 adsorbed on the adsorption stage (not shown). At this time, no lifting occurs at the interface between the first spacer 110 and the first adhesive layer 11. Thereafter, the adhesive surface of the second adhesive layer 12 is attached to the carrier substrate 22 (not shown).

[0047] exist Figure 4 In (b), the first spacer 110 is peeled off from the first adhesive layer 11. At this time, no lifting occurs at the interface between the second adhesive layer 12 and the second spacer 22.

[0048] exist Figure 4 In (c), a double-sided adhesive sheet temporarily fixed to the carrier substrate 22 using the second adhesive layer 12 is used. Figure 2 The process of receiving the cut electronic component 21 in the first adhesive layer 11, Figure 3 The process of transferring the electronic component 21 received by the first adhesive layer 11 onto the mounting substrate 30.

[0049] exist Figure 4 In (d), the second adhesive layer 12 is peeled off from the carrier substrate 22 (illustration omitted). The second adhesive layer 12 exhibits excellent reworkability, allowing it to be peeled off without contamination such as glue residue, thus enabling the carrier substrate 22 to be easily reused.

[0050] In the laminated film of the present invention, by having F(2)≤F(1), it is possible to prevent the first spacer from peeling off from the first adhesive layer when the second spacer is peeled off from the second adhesive layer.

[0051] Here, F(2) / F(1) (the ratio of F(2) to F(1)) is 1.00 or less (F(2) / F(1)≤1.00), preferably 0.90 or less (F(2) / F(1)≤0.90), more preferably less than 0.80 (F(2) / F(1)<0.80), and even more preferably less than 0.50 (F(2) / F(1)<0.50). In addition, although there is no particular limitation, F(2) / F(1) is preferably, for example, 0.10 or more (F(2) / F(1)≥0.10).

[0052] From the viewpoint of balancing workability during the peeling of the first spacer with the adhesive force P(2) of the second adhesive layer on the carrier substrate, F(1) is preferably less than 0.50 N / 50 mm (F(1) < 0.50), more preferably less than 0.40 N / 50 mm (F(1) ≤ 0.40), and even more preferably less than 0.35 N / 50 mm (F(1) ≤ 0.35). In addition, from the viewpoint of spacer warping during transfer sheet processing and transportation, F(1) is preferably more than 0.04 N / 50 mm (F(1) ≥ 0.04), more preferably more than 0.05 N / 50 mm (F(1) ≥ 0.05), and even more preferably more than 0.06 N / 50 mm (F(1) ≥ 0.06).

[0053] From the viewpoint of workability during the peeling of the second separator and the balance with the peeling force F(1) of the first separator, F(2) is preferably less than 0.20 N / 50 mm (F(2) < 0.20), more preferably 0.15 N / 50 mm or less (F(2) ≤ 0.15), and even more preferably 0.10 N / 50 mm or less (F(2) ≤ 0.10). In addition, from the viewpoint of separator warping during transfer sheet processing and transportation, F(2) is preferably 0.01 N / 50 mm or more (F(1) ≥ 0.01), more preferably 0.02 N / 50 mm or more (F(2) ≥ 0.02), and even more preferably 0.04 N / 50 mm or more (F(2) ≥ 0.04).

[0054] In the laminated film of the present invention, by having P(2)≥F(1), it is possible to prevent the second adhesive layer from peeling off from the carrier substrate when the first spacer is peeled off from the first adhesive layer.

[0055] Here, P(2) / F(1) (the ratio of P(2) to F(1)) is 1.00 or more (P(2) / F(1)≥1.00), preferably greater than 1.00 (P(2) / F(1)>1.00), and more preferably 1.20 or more (P(2) / F(1)≥1.20). In addition, although there is no particular limitation, P(2) / F(1) is preferably 4.50 or less (P(2) / F(1)≤4.50).

[0056] From the viewpoint of improving reworkability by enabling peeling from the carrier substrate without contamination such as adhesive residue, P(2) is preferably less than 1.10 N / 50 mm (P(2) < 1.10), more preferably 1.00 N / 50 mm or less (P(2) ≤ 1.00), and even more preferably 0.90 N / 50 mm or less (P(2) ≤ 0.90). Furthermore, from the viewpoint of the adhesion of the carrier substrate to the second adhesive layer, P(2) is preferably 0.10 N / 50 mm or more (P(2) ≥ 0.10), more preferably 0.20 N / 50 mm or more (P(2) ≥ 0.20), and even more preferably 0.30 N / 50 mm or more (P(2) ≥ 0.30).

[0057] By satisfying the above relationship through F(1), F(2) and P(2), errors are less likely to occur during the spacer peeling process when the above double-sided adhesive film for transfer is pasted onto the carrier substrate.

[0058] In the second adhesive layer of the present invention, from the viewpoint that the adhesive force of the second adhesive layer to the carrier substrate does not increase even due to the hot pressing when transferring and mounting electronic components onto the mounting substrate, and that it peels off well and thus has excellent reworkability, P'(2) / P(2) (the ratio of P'(2) to P(2)) is less than 1.20 (P'(2) / P(2) < 1.20), preferably 1.0 or less (P'(2) / P(2) ≤ 1.0), and more preferably 0.8 or less (P'(2) / P(2) ≤ 0.8). In addition, although there is no particular limitation, P'(2) / P(2) is preferably 0.01 or more (P'(2) / P(2) ≥ 0.01), and more preferably 0.03 or more (P'(2) / P(2) ≥ 0.03).

[0059] In the second adhesive layer of the present invention, from the viewpoint of easily and fully peeling the double-sided adhesive film for transfer from the carrier substrate without adhesive residue and having excellent reworkability, P'(2) is less than 1.00 N / 50 mm (P'(2) < 1.00), preferably 0.6 N / 50 mm or less (P'(2) ≤ 0.6), and more preferably 0.4 N / 50 mm or less (P'(2) ≤ 0.4). In addition, although there are no particular limitations, P'(2) is preferably, for example, 0.01 N / 50 mm or more (P'(2) ≥ 0.01), and more preferably 0.02 N / 50 mm or more (P'(2) ≥ 0.02).

[0060] By satisfying the above relationship through P(2) and P'(2), when transferring semiconductor chips or the like onto the mounting substrate, the above-mentioned double-sided adhesive film for transfer is not easily peeled off from the carrier substrate, and after transferring semiconductor chips or the like onto the mounting substrate, the above-mentioned double-sided adhesive film for transfer is easily peeled off from the carrier substrate, and glue residue is not easily generated.

[0061] Furthermore, in the laminated film of the present invention, the 90° initial peel force T(1) (N / 50mm) of the first adhesive layer to the first spacer, measured under conditions of 23°C, 50%RH and a stretching speed of 0.3m / min, the 90° initial peel force T(2) (N / 50mm) of the second adhesive layer to the second spacer, measured under conditions of 23°C, 50%RH and a stretching speed of 0.3m / min, and the adhesive force P(2) preferably satisfy the following relationship.

[0062] T(1) / T(2)>1.05

[0063] P(2) / T(1) < 1.90

[0064] The initial peel force T(1) refers to the maximum value (maximum stress) of the peel force recorded at the beginning of peeling when the first spacer is peeled from the first adhesive layer, and the initial peel force T(2) refers to the maximum value (maximum stress) of the peel force recorded at the beginning of peeling when the second spacer is peeled from the second adhesive layer.

[0065] In the laminated film of the present invention, from the viewpoint that it is less likely for the first spacer to peel off from the first adhesive layer when the second spacer is peeled off from the second adhesive layer, T(1) / T(2) (the ratio of T(1) to T(2)) is preferably greater than 1.05 (T(1) / T(2)>1.05), more preferably 1.10 or more (T(1) / T(2)≥1.10), and even more preferably 1.15 or more (T(1) / T(2)≥1.15). In addition, although there is no particular limitation, T(1) / T(2) is preferably, for example, 3.50 or less (T(1) / T(2)≤3.50).

[0066] In the laminated film of the present invention, from the viewpoint that the second adhesive layer is less likely to peel off from the carrier substrate when the first spacer is peeled off from the first adhesive layer, P(2) / T(1) (the ratio of P(2) to T(1)) is preferably less than 1.90 (P(2) / T(1) < 1.90), more preferably less than 1.50 (P(2) / T(1) ≤ 1.50), even more preferably less than 1.00 (P(2) / T(1) < 1.00), and particularly preferably less than 0.90 (P(2) / T(1) ≤ 0.90). In addition, although there is no particular limitation, P(2) / T(1) is preferably, for example, more than 0.20 (P(2) / T(1) ≥ 0.20), more preferably more than 0.40 (P(2) / T(1) ≥ 0.40).

[0067] T(1) is preferably 0.10 N / 50 mm or more (T(1) ≥ 0.10), more preferably 0.15 N / 50 mm or more (T(1) ≥ 0.15), and even more preferably 0.20 N / 50 mm or more (T(1) ≥ 0.20). In addition, although there are no particular limitations, T(1) is preferably, for example, 1.00 N / 50 mm or less (T(1) ≤ 1.00), more preferably 0.85 N / 50 mm or less (T(1) ≤ 0.85), and even more preferably 0.70 N / 50 mm or less (T(1) ≤ 0.70).

[0068] T(2) is preferably 0.50 N / 50 mm or less (T(2) ≤ 0.50), more preferably 0.45 N / 50 mm or less (T(2) ≤ 0.45), and even more preferably 0.40 N / 50 mm or less (T(2) ≤ 0.40). In addition, although there is no particular limitation, T(2) is preferably, for example, 0.10 N / 50 mm or more (T(2) ≥ 0.10), and more preferably 0.15 N / 50 mm or more (T(2) ≥ 0.15).

[0069] By satisfying the above relationship through T(1), T(2) and P(2), errors are less likely to occur during the spacer peeling process when the above-mentioned double-sided adhesive film for transfer is pasted onto the carrier substrate.

[0070] As described above, by optimizing the overall composition of peel force and adhesive force so that F(1), F(2), P(2), P'(2), T(1) and T(2) satisfy the above relationship, the efficiency of operation can be improved in the manufacturing process of semiconductor devices.

[0071] The aforementioned F(1), F(2), P(2), P'(2), T(1) and T(2) can be adjusted by adjusting the adhesive force based on the type or composition of the adhesives constituting the first adhesive layer and the second adhesive layer, the degree of crosslinking, etc.; by combining a light release agent and a plasticizer to form a WBL (Weak Boundary Layer); and by adjusting the thickness of the first spacer and the second spacer, the material of the constituent parts, or the release treatment, etc.

[0072] <First adhesive layer>

[0073] In the double-sided adhesive film for transfer of the present invention, the first adhesive layer is an adhesive layer for receiving and holding electronic components, and includes a low-adhesion adhesive layer. From the perspective of reducing the force applied to the electronic components when receiving them and suppressing damage to the electronic components, the configuration of the first adhesive layer including a low-adhesion adhesive layer is suitable. Furthermore, when the first adhesive layer receives the electronic components in a non-contact manner, for example, by pushing the electronic components using a pusher member to peel them off the cutting tape and allow them to fall onto the first adhesive layer, sometimes the electronic components bounce off and cannot be received with high precision. When this occurs, the positional accuracy of the electronic components decreases, and sometimes poor contact occurs. From the perspective of easily capturing the electronic components without bouncing when the first adhesive layer receives them in a non-contact manner, and being able to receive them with good positional accuracy, the aforementioned configuration of the first adhesive layer including a low-adhesion adhesive layer is also suitable. Furthermore, it is also preferable to consider that the electronic components received by the transfer double-sided adhesive film can be easily peeled off from the first adhesive layer when mounting them onto the mounting substrate.

[0074] The first adhesive layer described above can be made into a low-adhesion adhesive layer by adjusting the type or composition of the adhesive, the degree of crosslinking, etc., and by combining it with a light peeling agent and a plasticizer to form a WBL (Weak Boundary Layer).

[0075] In the laminated film of the present invention, the storage modulus (E'1a) of the first adhesive layer at 1 Hz and 25°C, obtained by AFM-DMA (nano dynamic mechanical analysis using atomic force microscopy), is preferably 50 MPa or less. This configuration is preferred from the viewpoint of reliably adhesively bonding the electronic components receiving the first adhesive layer. When E'1a is too high, the adhesion of the electronic components to the first adhesive layer decreases, sometimes resulting in misalignment or falling off of the electronic components. From the viewpoint of the adhesion of the electronic components to the first adhesive layer, E'1a is preferably 40 MPa or less, more preferably 30 MPa or less. Alternatively, it can be 20 MPa or less, or 10 MPa or less. On the other hand, from the viewpoint of transferability from the first adhesive layer to the circuit board, E'1a is preferably 0.1 MPa or more. If E'1a is too low, the adhesion of the electronic component to the first adhesive layer becomes too high, which may impair the transferability when mounted onto the mounting substrate. From the viewpoint of the transferability of the electronic component to the mounting substrate, E'1a is preferably 0.2 MPa or more, and more preferably 0.5 MPa or more.

[0076] In the laminated film of the present invention, the storage modulus (E'1b) of the first adhesive layer at a frequency of 1 kHz and 25°C, measured using AFM-DMA, is preferably 100 MPa or less. This configuration is preferred from the viewpoint that the electronic component will not bounce off the surface of the first adhesive layer when the electronic component is received in a non-contact manner, and that the electronic component can be received with good positional accuracy. When E'1b is too high, when the electronic component is dropped and received without contacting the surface of the first adhesive layer, the electronic component may bounce off the intended position or flip over, thereby easily reducing positional accuracy. From the viewpoint of positional accuracy of the electronic component on the first adhesive layer, E'1b is preferably 90 MPa or less, more preferably 80 MPa or less. In addition, it can be 70 MPa or less, 60 MPa or less, 50 MPa or less, 40 MPa or less, 30 MPa or less, and particularly 20 MPa or less. On the other hand, from the viewpoint of transferability from the first adhesive layer to the circuit board, E'1b is preferably 0.5 MPa or more. When E'1b is too low, the adhesion of the electronic component to the first adhesive layer becomes high. Furthermore, sometimes the electronic component may become embedded in the first adhesive layer when dropped, thus impairing the transferability when mounted onto the mounting substrate. From the viewpoint of transferability of the electronic component to the mounting substrate, E'1b is preferably 0.7 MPa or higher, more preferably 1 MPa or higher.

[0077] In the laminated film of the present invention, the ratio (E'1b / E'1a) of the storage modulus (E'1b) of the first adhesive layer at 1 kHz and 25°C, measured using AFM-DMA, to the storage modulus (E'1a) of the first adhesive layer at 1 Hz and 25°C, measured using AFM-DMA, is preferably greater than 1. This configuration is preferred from the perspective of improving the balance between the adhesiveness, positional accuracy, and transferability of the electronic components on the first adhesive layer. From the viewpoint of balancing the adhesiveness, positional accuracy, and transferability of the electronic components on the mounting substrate, E'1b / E'1a is preferably 1.05 or more, more preferably 1.1 or more. There is no particular upper limit to E'1b / E'1a, but from the viewpoint of the above balance, it is preferably 3 or less.

[0078] In the laminated film of the present invention, the loss modulus (E”1a) of the first adhesive layer at a frequency of 1 Hz and 25°C, measured using AFM-DMA, is preferably 7 MPa or less. This configuration is preferred from the viewpoint of excellent transferability of electronic components to the mounting substrate. If E”1a is too high, the adhesion of the electronic components to the first adhesive layer becomes too high, which may sometimes impair the transferability when mounted to the mounting substrate. From the viewpoint of transferability of electronic components to the mounting substrate, E”1a is preferably 5 MPa or less, more preferably 3 MPa or less. When E”1a is too low, the adhesion of the electronic components to the first adhesive layer decreases, which may sometimes cause misalignment or falling of the electronic components. From the viewpoint of adhesion of electronic components to the first adhesive layer, E”1a is preferably 0.01 MPa or more, more preferably 0.03 MPa or more.

[0079] The energy storage modulus (E'1a) at 1 Hz and 25°C, the energy storage modulus (E'1b) at 1 kHz and 25°C, and the loss modulus (E”1a) at 1 Hz and 25°C, as measured by AFM-DMA, can be adjusted by the type or composition of the adhesive, the degree of crosslinking, etc.

[0080] In the laminated film of the present invention, the adhesion of the first adhesive layer to the stainless steel plate (5 mm in diameter) is preferably 10 gf / Φ5 mm SUS to 250 gf / Φ5 mm SUS. From the viewpoint of the adhesiveness and positional accuracy of the electronic components on the first adhesive layer, a configuration with an adhesion of 10 gf or more / Φ5 mm SUS is preferred, and more preferably 20 gf or more / Φ5 mm SUS. On the other hand, from the viewpoint of the transferability of the electronic components to the mounting substrate, a configuration with an adhesion of 250 gf or less / Φ5 mm SUS is preferred, and more preferably 200 gf or less / Φ5 mm SUS.

[0081] The adhesion of the first adhesive layer to the stainless steel plate (5mm in diameter) can be adjusted by the type or composition of the adhesive, the degree of crosslinking, and additives such as fatty acid esters or fluorinated surfactants.

[0082] In the laminated film of the present invention, the surface force of the first adhesive layer is preferably -500 μN to -100 μN. From the viewpoint of the adhesion and positional accuracy of the electronic components on the first adhesive layer, a surface force of -500 μN or more is preferred, and more preferably -400 μN or more. On the other hand, from the viewpoint of the transferability of the electronic components to the mounting substrate, a surface force of -100 μN or less is preferred, and more preferably -50 μN or less.

[0083] The surface force of the first adhesive layer can be adjusted by the type or composition of the adhesive, the degree of crosslinking, and additives such as fatty acid esters or fluorinated surfactants.

[0084] In the double-sided adhesive film for transfer of the present invention, there is no particular limitation on the thickness of the first adhesive layer, but it is preferably 1 μm or more, more preferably 3 μm or more. When the thickness is above a certain value, the first adhesive layer can easily and accurately receive electronic components, which is preferred. In addition, there is no particular limitation on the upper limit of the thickness of the first adhesive layer, but it is preferably 100 μm, more preferably 75 μm. When the thickness is below a certain value, it is easy and accurate to transfer electronic components onto the mounting substrate, which is preferred.

[0085] In the laminated film of the present invention, there is no particular limitation on the haze of the first adhesive layer (according to JIS K7136), but it is preferably 10% or less, more preferably 5.0% or less. When the haze is 10% or less, excellent transparency can be obtained, for example, the pattern on the carrier substrate (e.g., markings indicating the transfer position of electronic components) can be visually identified when the laminated film is bonded to the carrier substrate, which is preferred. It should be noted that the above-mentioned haze can be measured, for example, by forming the first adhesive layer on the spacer and letting it stand at normal temperature (23°C, 50%RH) for at least 24 hours, then peeling off the spacer, bonding the first adhesive layer to a glass slide (e.g., a glass slide with a total transmittance of 91.8% and a haze of 0.4%), using it as a sample, and measuring it using a haze meter (product name "HM-150", manufactured by Murakami Color Technology Research Institute Co., Ltd.).

[0086] In the laminated film of the present invention, there is no particular limitation on the total transmittance of the first adhesive layer in the visible light wavelength range (according to JISK7361-1), but it is preferably 85% or more, more preferably 88% or more. When the total transmittance is 85% or more, excellent transparency can be obtained, for example, when the laminated film is bonded to the carrier substrate, the pattern on the carrier substrate (e.g., markings indicating the transfer position of electronic components) can be visually identified, which is preferred. It should be noted that the above-mentioned total transmittance can be measured, for example, by forming the first adhesive layer on the spacer and letting it stand at normal temperature (23°C, 50%RH) for at least 24 hours, then peeling off the spacer, bonding the first adhesive layer to a glass slide (e.g., a glass slide with a total transmittance of 91.8% and a haze of 0.4%), using it as a sample, and measuring it using a haze meter (product name "HM-150", manufactured by Murakami Color Technology Research Institute Co., Ltd.).

[0087] There are no particular limitations on the adhesives constituting the first adhesive layer described above. Examples include silicone adhesives, urethane adhesives, acrylic adhesives, rubber adhesives, polyester adhesives, polyamide adhesives, epoxy adhesives, vinyl alkyl ether adhesives, and fluorinated adhesives. From the viewpoint of being able to receive electronic components with good positional accuracy without damaging them, and to achieve good transferability onto the mounting substrate, silicone adhesives, urethane adhesives, and acrylic adhesives that are easily controlled to have low adhesion are preferred; silicone adhesives and urethane adhesives are more preferred; and silicone adhesives are even more preferred.

[0088] (Silicone adhesives)

[0089] As a silicone adhesive, there are no particular restrictions; any known or conventional silicone adhesive can be used, such as addition-type silicone adhesives, peroxide-curing silicone adhesives, and condensation-type silicone adhesives. Silicone adhesives can be either one-component or two-component. Silicone adhesives can be used alone or in combination of two or more components.

[0090] The aforementioned addition-type silicone adhesives are typically adhesives that generate silicone polymers by using a platinum compound catalyst such as chloroplatinic acid to induce an addition reaction (hydrosilylation reaction) between organopolysiloxanes having vinyl or other alkenyl groups on silicon atoms and organopolysiloxanes having hydromethoxysilyl groups. Peroxide-cured silicone adhesives are typically adhesives that generate silicone polymers by curing (crosslinking) organopolysiloxanes using peroxides. Additionally, condensation-type silicone adhesives are typically adhesives that generate silicone polymers through a dehydration or de-alcoholization reaction between polyorganosiloxanes with hydrolyzable silanyl groups such as silanol groups or alkoxysilyl groups at the ends.

[0091] As for silicone adhesives, from the viewpoint of being easy to control to have low adhesion, examples include silicone adhesive compositions containing silicone rubber and silicone resin.

[0092] As for the aforementioned silicone rubber, there are no particular restrictions on the type of organosilicon rubber component. For example, organopolysiloxanes with dimethylsiloxane, methylphenylsiloxane, etc., as the main structural units can be used. Furthermore, depending on the type of reaction, silicone rubbers with alkenyl groups bonded to silicon atoms (alkenyl-containing organopolysiloxanes; addition reaction type), silicone rubbers with at least methyl groups (peroxide curing type), and silicone rubbers with silanol groups or hydrolyzable alkoxysilyl groups at the ends (condensation type) can be used. It should be noted that the weight-average molecular weight of the organopolysiloxane in the silicone rubber is typically 150,000 or more, preferably 280,000 to 1,000,000, and particularly preferably 500,000 to 900,000.

[0093] Furthermore, as for the aforementioned silicone resin, there are no particular limitations as long as it is used in silicone adhesives. Examples include silicone resins containing organopolysiloxanes, where the organopolysiloxane contains a component selected from the structural unit "R3Si". 1 / 2 The M unit containing the structural unit "SiO2", the Q unit containing the structural unit "RSiO" 3 / 2The polymer (copolymer) is a polymer (polymer) of at least one unit selected from the T unit and the D unit containing the structural unit "R2SiO". It should be noted that R in the above structural unit represents a hydrocarbon group or a hydroxyl group. Examples of such hydrocarbon groups include: aliphatic hydrocarbon groups (alkyl groups such as methyl and ethyl), alicyclic hydrocarbon groups (cyclohexyl and cycloalkyl groups), and aromatic hydrocarbon groups (aryl groups such as phenyl and naphthyl). The ratio of the M unit to at least one unit selected from the Q unit, T unit, and D unit is preferably, for example, the former / the latter (molar ratio) = The concentration is approximately 0.3 / 1 to approximately 1.5 / 1 (preferably approximately 0.5 / 1 to approximately 1.3 / 1). Various functional groups, such as vinyl groups, can be introduced into the organopolysiloxane in such silicone resins as needed. It should be noted that the introduced functional groups can be those capable of undergoing cross-linking reactions. As a silicone resin, MQ resins containing M and Q units are preferred. The weight-average molecular weight of the organopolysiloxane in the silicone resin is typically 1000 or more, preferably 1000 to 20000, and particularly preferably 1500 to 10000.

[0094] There are no particular restrictions on the ratio of silicone rubber to silicone resin. From the viewpoint of easy control to achieve low adhesion, for example, the silicone resin is preferably 100 to 220 parts by weight (especially 120 to 180 parts by weight) relative to 100 parts by weight of silicone rubber.

[0095] It should be noted that in silicone adhesive compositions containing silicone rubber and silicone resin, the silicone rubber and silicone resin can be in a mixed state where they are simply mixed, or they can react with each other to form condensates (especially partial condensates), crosslinking reaction products, addition reaction products, etc.

[0096] Furthermore, in silicone-based adhesive compositions containing silicone rubber and silicone resin, a crosslinking agent is typically included to facilitate the formation of a crosslinked structure, considering the ease of controlling low tack. There are no particular limitations on such crosslinking agents; siloxane-based crosslinking agents (silicone-based crosslinking agents) and peroxide-based crosslinking agents are preferred. Two or more crosslinking agents can be used alone or in combination.

[0097] As a siloxane crosslinking agent, a polyorganohydrosiloxane having two or more hydrogen atoms bonded to silicon atoms in its molecule is preferably used. In such a polyorganohydrosiloxane, in addition to hydrogen atoms, various organic groups may be bonded to the silicon atoms bonded to the hydrogen atoms. Examples of such organic groups include alkyl groups such as methyl and ethyl; aryl groups such as phenyl; and haloalkyl groups, etc. From a synthetic and processing point of view, methyl is preferred. Furthermore, the skeletal structure of the polyorganohydrosiloxane can be linear, branched, or cyclic, with a linear structure being preferred.

[0098] As peroxide-based crosslinking agents, examples include: diacyl peroxide, alkyl peroxide esters, dicarbonate peroxide, monocarbonate peroxide, ketal peroxide, dialkyl peroxide, hydroperoxide, ketone peroxide, etc. More specifically, examples include: benzoyl peroxide, tert-butyl peroxide, dicumyl peroxide, tert-butyl cumene peroxide, di-tert-butyl peroxide, 2,5-dimethyl-2,5-di-tert-butyl peroxide hexane, 2,4-dichlorobenzoyl peroxide, di-tert-butyl peroxide diisopropylbenzene, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, 2,5-dimethyl-2,5-di-tert-butylperoxyhexyne-3, etc.

[0099] As addition-type silicone adhesives, commercially available examples include "KR-3700", "KR-3701", "X-40-3237-1", "X-40-3240", "X-40-3291-1", and "X-40-3306" (all manufactured by Shin-Etsu Chemical Industry Co., Ltd.). Additionally, as peroxide-curing silicone adhesives, commercially available examples include "KR-100", "KR-101-10", and "KR-130" (all manufactured by Shin-Etsu Chemical Industry Co., Ltd.).

[0100] The addition-type silicone adhesive composition described above preferably includes a curing catalyst such as a platinum catalyst. Examples of commercially available platinum catalysts include "CAT-PL-50T" (manufactured by Shin-Etsu Chemical Co., Ltd.), "DOWSILNC-25 Catalyst," and "DOWSIL SRX212 Catalyst" (both manufactured by Dow Toray Industries, Ltd.). From the viewpoint of balancing the acceptability, positional accuracy, and transferability to the mounting substrate of the electronic components in the first adhesive layer, the content of the curing catalyst is preferably about 0.1 parts by weight to about 10 parts by weight relative to 100 parts by weight of the silicone polymer (including silicone rubber, silicone resin, etc.) used as the base polymer.

[0101] (Carbamate adhesives)

[0102] There are no particular limitations on the use of urethane adhesives; known or conventional urethane adhesives can be used. From the viewpoint of easy control to achieve low tack, urethane adhesive compositions containing polyols, polyfunctional isocyanate compounds, and catalysts are preferred.

[0103] As the aforementioned polyol, any polyol having two or more hydroxyl groups is acceptable; any suitable polyol can be used. Examples of such polyols include: polyols with two hydroxyl groups (diols), polyols with three hydroxyl groups (triols), polyols with four hydroxyl groups (tetraols), polyols with five hydroxyl groups (pentaols), and polyols with six hydroxyl groups (hexaols). Two or more polyols can be used alone or in combination.

[0104] The polyols mentioned above preferably contain polyols with a number average molecular weight (Mn) of 400 to 20,000. Furthermore, the percentage of polyols with a number average molecular weight (Mn) of 400 to 20,000 in the total amount of polyols is preferably 50% to 100% by weight, more preferably 70% to 100% by weight, even more preferably 90% to 100% by weight, particularly preferably 95% to 100% by weight, and most preferably substantially 100% by weight. By adjusting the percentage of polyols with a number average molecular weight (Mn) of 400 to 20,000 in the polyols to the above range, for example, it is possible to provide urethane adhesives with controlled low adhesion.

[0105] Examples of the aforementioned polyols include: polyester polyols, polyether polyols, polycaprolactone polyols, polycarbonate polyols, castor oil polyols, etc.

[0106] The aforementioned polyester polyol can be obtained, for example, through an esterification reaction between the polyol component and the acid component.

[0107] Examples of the aforementioned polyol components include: ethylene glycol, diethylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 2-butyl-2-ethyl-1,3-propanediol, 2,4-diethyl-1,5-pentanediol, 1,2-hexanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 1,8-decanediol, octadecanediol, glycerin, trimethylolpropane, pentaerythritol, hexanetriol, polypropylene glycol, etc.

[0108] Examples of the aforementioned acidic components include: succinic acid, methylsuccinic acid, adipic acid, pimelic acid, azelaic acid, sebacic acid, 1,12-dodecanoic acid, 1,14-tetradecanoic acid, dimer acid, 2-methyl-1,4-cyclohexanedicarboxylic acid, 2-ethyl-1,4-cyclohexanedicarboxylic acid, terephthalic acid, isophthalic acid, phthalic acid, isophthalic acid, terephthalic acid, 1,4-naphthalenedicarboxylic acid, 4,4'-biphenyldicarboxylic acid, and their anhydrides.

[0109] Examples of the aforementioned polyether polyols include those obtained by using water, low-molecular-weight polyols (propylene glycol, ethylene glycol, glycerol, trimethylolpropane, pentaerythritol, etc.), bisphenols (bisphenol A, etc.), and dihydroxybenzenes (catechol, resorcinol, hydroquinone, etc.) as initiators to perform addition polymerization on epoxides such as ethylene oxide, propylene oxide, and butane oxide. Specifically, examples include polyethylene glycol, polypropylene glycol, and polybutane glycol.

[0110] Examples of the aforementioned polycaprolactone polyols include caprolactone-type polyester diols obtained by ring-opening polymerization of cyclic ester monomers such as ε-caprolactone and σ-valerolactone.

[0111] Examples of the aforementioned polycarbonate polyols include: polycarbonate polyols obtained by polycondensation of the aforementioned polyol components with carbonyl chloride; polycarbonate polyols obtained by transesterification condensation of the aforementioned polyol components with dimethyl carbonate, diethyl carbonate, dipropyl carbonate, diisopropyl carbonate, dibutyl carbonate, ethylbutyl carbonate, ethylene carbonate, propylene carbonate, diphenyl carbonate, dibenzyl carbonate, etc.; copolymerized polycarbonate polyols obtained by combining two or more of the aforementioned polyol components; and polycarbonate polyols obtained by esterification of the aforementioned various polycarbonate polyols with carboxyl-containing compounds. Polycarbonate polyols; polycarbonate polyols obtained by etherification of the above-mentioned polycarbonate polyols with hydroxyl-containing compounds; polycarbonate polyols obtained by transesterification of the above-mentioned polycarbonate polyols with ester compounds; polycarbonate polyols obtained by transesterification of the above-mentioned polycarbonate polyols with hydroxyl-containing compounds; polyester-type polycarbonate polyols obtained by polycondensation of the above-mentioned polycarbonate polyols with dicarboxylic acid compounds; copolymer polyether-type polycarbonate polyols obtained by copolymerization of the above-mentioned polycarbonate polyols with epoxides; etc.

[0112] Examples of castor oil polyols include those obtained by reacting castor oil fatty acids with the aforementioned polyol components. Specifically, examples include castor oil polyols obtained by reacting castor oil fatty acids with polypropylene glycol.

[0113] From the viewpoint of low adhesion and wettability of the first adhesive layer to electronic components, a polyol having three hydroxyl groups (triol) is preferably used as an essential component. The content of the polyol having three hydroxyl groups (triol) is preferably 50% to 100% by weight, more preferably 70% to 100% by weight, relative to the total amount of components constituting the polyol.

[0114] Examples of the aforementioned polyfunctional isocyanates include aliphatic polyisocyanates, alicyclic polyisocyanates, and aromatic polyisocyanate compounds.

[0115] Examples of the aforementioned aliphatic polyisocyanates include: trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylidene diisocyanate, 1,3-butylidene diisocyanate, dodecamethylene diisocyanate, and 2,4,4-trimethylhexamethylene diisocyanate.

[0116] Examples of the aforementioned alicyclic polyisocyanates include: 1,3-cyclopentene diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, isophorone diisocyanate, hydrogenated diphenylmethane diisocyanate, hydrogenated phenylenedimethylene diisocyanate, hydrogenated toluene diisocyanate, and hydrogenated tetramethylphenylenedimethylene diisocyanate.

[0117] Examples of the aforementioned aromatic polyisocyanates include: phenylene diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 2,2'-diphenylmethane diisocyanate, 4,4'-diphenylmethane diisocyanate, 4,4'-toluidine diisocyanate, 4,4'-diphenyl ether diisocyanate, 4,4'-biphenyl diisocyanate, 1,5-naphthalene diisocyanate, and phenylenediamine diisocyanate.

[0118] Among them, aliphatic polyisocyanates and their modified products are preferred. Compared with other isocyanate crosslinking agents, aliphatic polyisocyanates and their modified products have high flexibility in crosslinking structures and are easy to control to achieve low adhesion. As aliphatic polyisocyanates and their modified products, hexamethylene diisocyanate and its modified products are particularly preferred.

[0119] From the viewpoint of low adhesion and wettability of the first adhesive layer to electronic components, the equivalent ratio (NCO / OH) of the isocyanate group of the polyfunctional isocyanate compound to the hydroxyl group of the polyol is preferably 1 to 5, more preferably 1.1 to 3, and even more preferably 1.2 to 2.

[0120] The above-mentioned carbamate adhesive compositions preferably contain catalysts such as iron-containing compounds and / or tin-containing compounds. Specifically, examples include: tin-containing catalysts such as dibutyltin dilaurate and dioctyltin dilaurate; tri(acetylacetonate)ferric, tri(hexane-2,4-diketone)ferric, tri(heptane-2,4-diketone)ferric, tri(heptane-3,5-diketone)ferric, tri(5-methylhexane-2,4-diketone)ferric, tri(octane-2,4-diketone)ferric, tri(6-methylheptane-2,4-diketone)ferric, tri(2,6-dimethylheptane-3,5-diketone)ferric, tri(nonane-2,4-diketone)ferric, tri(nonane-4,6-diketone)ferric, tri(2,2,6,6-tetramethylheptane-3,5-diketone)ferric, tri(tetrane-6,8-diketone)ferric, tri(1-phenylene)ferric, and tri(2,2,6,6-tetramethylheptane-3,5-diketone)ferric, tri(tetrane-6,8-diketone)ferric, and tri(1-phenylene)ferric. Iron-containing catalysts include tris(hexafluoroacetylacetone) iron, tris(ethyl acetoacetate) iron, tris(n-propyl acetoacetate) iron, tris(isopropyl acetoacetate) iron, tris(n-butyl acetoacetate) iron, tris(sec-butyl acetoacetate) iron, tris(tert-butyl acetoacetate) iron, tris(methyl propionyl acetate) iron, tris(ethyl propionyl acetate) iron, tris(n-propyl propionyl acetate) iron, tris(isopropyl propionyl acetate) iron, tris(n-butyl propionyl acetate) iron, tris(sec-butyl propionyl acetate) iron, tris(tert-butyl propionyl acetate) iron, tris(benzyl acetoacetate) iron, tris(dimethyl malonate) iron, tris(diethyl malonate) iron, trimethoxy iron, triethoxy iron, triisopropoxy iron, and ferric chloride.

[0121] The amount of catalyst contained in the above-mentioned carbamate adhesive composition relative to 100 parts by weight is preferably 0.002 parts by weight to 0.5 parts by weight, more preferably 0.005 parts by weight to 0.3 parts by weight, and even more preferably 0.01 parts by weight to 0.1 parts by weight. When it is within this range, the rate of crosslinking reaction during the formation of the adhesive layer becomes faster, and the pot life of the adhesive composition also becomes longer, which is a preferred method.

[0122] Furthermore, from the viewpoint of easily controlling low adhesion, urethane adhesive compositions containing urethane prepolymers are preferred as urethane adhesives.

[0123] Examples of urethane adhesive compositions containing urethane prepolymers include adhesive compositions containing polyurethane polyols as urethane prepolymers and polyfunctional isocyanate compounds. The urethane prepolymers can be used alone or in combination of two or more. The polyfunctional isocyanate compounds can be used alone or in combination of two or more.

[0124] The polyurethane polyol used as a urethane prepolymer is preferably a polyurethane polyol obtained by reacting polyester polyol and polyether polyol with an organic polyisocyanate compound in the presence of a catalyst or in the absence of a catalyst.

[0125] Any suitable polyester polyol can be used as the polyester polyol. Examples of such polyester polyols include those obtained by reacting an acidic component with a diol component. Examples of acidic components include terephthalic acid, adipic acid, azelaic acid, sebacic acid, phthalic anhydride, isophthalic acid, trimellitic acid, etc. Examples of diol components include ethylene glycol, propylene glycol, diethylene glycol, butanediol, 1,6-hexanediol, 3-methyl-1,5-pentanediol, 3,3'-dimethylolheptane, polyoxyethylene glycol, polyoxypropylene glycol, 1,4-butanediol, neopentanediol, butylethylpentanediol; and polyol components include glycerol, trimethylolpropane, pentaerythritol, etc. Other examples of polyester polyols include those obtained by ring-opening polymerization of lactones such as polycaprolactone, poly(β-methyl-γ-valerolactone), and polyvalerolactone.

[0126] The molecular weight of the polyester polyol can range from low to high. The number average molecular weight is preferably between 500 and 5000. When the number average molecular weight is less than 500, the reactivity increases, and gelation may occur easily. When the number average molecular weight is greater than 5000, the reactivity decreases, and the cohesive strength of the polyurethane polyol itself may decrease. The amount of polyester polyol used is preferably between 10 mol% and 90 mol% of the polyol constituting the polyurethane polyol.

[0127] Any suitable polyether polyol can be used as the polyether polyol. Examples of such polyether polyols include those obtained by polymerizing ethylene oxide, propylene oxide, ethylene oxide, tetrahydrofuran, and other epoxide compounds using low molecular weight polyols such as water, propylene glycol, ethylene glycol, glycerol, and trimethylolpropane as initiators. More specifically, examples of such polyether polyols include polypropylene glycol, polyethylene glycol, polybutane glycol, and other polyether polyols with two or more functional groups.

[0128] The molecular weight of the polyether polyol can range from low to high. The number average molecular weight is preferably between 1000 and 5000. When the number average molecular weight is less than 1000, the reactivity increases, and gelation may occur easily. When the number average molecular weight is greater than 5000, the reactivity decreases, and the cohesive force of the polyurethane polyol itself may decrease. The amount of polyether polyol used is preferably 20 mol% to 80 mol% of the polyol constituting the polyurethane polyol.

[0129] Polyether polyols can be partially replaced with diols such as ethylene glycol, 1,4-butanediol, neopentyl glycol, butyl ethyl pentanediol, glycerol, trimethylolpropane, and pentaerythritol, or polyamines such as ethylenediamine, N-aminoethyl ethanolamine, isophorone diamine, and phenylenediamine, as needed, and used in combination.

[0130] As polyether polyols, only bifunctional polyether polyols can be used, or polyether polyols with a number average molecular weight of 1000 to 5000 and having at least three hydroxyl groups per molecule can be used partially or entirely. When polyether polyols with an average molecular weight of 1000 to 5000 and having at least three hydroxyl groups per molecule are used partially or entirely, a good balance between adhesiveness and re-peelability can be achieved. For such polyether polyols, when the number average molecular weight is less than 1000, the reactivity becomes high, and gelation may be easy. In addition, for such polyether polyols, when the number average molecular weight is greater than 5000, the reactivity decreases, and the cohesiveness of the polyurethane polyol itself may decrease. A more preferred number average molecular weight for such polyether polyols is 2500 to 3500.

[0131] As an organic polyisocyanate compound, any suitable organic polyisocyanate compound can be used. Examples of such organic polyisocyanates include aromatic polyisocyanates, aliphatic polyisocyanates, aromatic aliphatic polyisocyanates, and alicyclic polyisocyanates.

[0132] Examples of aromatic polyisocyanates include: 1,3-phenylene diisocyanate, 4,4'-biphenyl diisocyanate, 1,4-phenylene diisocyanate, 4,4'-diphenylmethane diisocyanate, 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4'-bitoluidine diisocyanate, 2,4,6-triisocyanatotoluene, 1,3,5-triisocyanatobenzene, bianisidine diisocyanate, 4,4'-diphenyl ether diisocyanate, and 4,4',4”-triphenylmethane triisocyanate.

[0133] Examples of aliphatic polyisocyanates include: trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylidene diisocyanate, 2,3-butylidene diisocyanate, 1,3-butylidene diisocyanate, dodecamethyl diisocyanate, and 2,4,4-trimethylhexamethylene diisocyanate.

[0134] Examples of aromatic aliphatic polyisocyanates include: ω,ω'-diisocyanate-1,3-dimethylbenzene, ω,ω'-diisocyanate-1,4-dimethylbenzene, ω,ω'-diisocyanate-1,4-diethylbenzene, 1,4-tetramethylphenyldimethyl diisocyanate, 1,3-tetramethylphenyldimethyl diisocyanate, etc.

[0135] Examples of alicyclic polyisocyanates include: 3-isocyanate-methyl-3,5,5-trimethylcyclohexyl isocyanate, 1,3-cyclopentane diisocyanate, 1,3-cyclohexane diisocyanate, 1,4-cyclohexane diisocyanate, methyl-2,4-cyclohexane diisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'-methylene bis(cyclohexyl isocyanate), 1,4-bis(isocyanate-methyl)cyclohexane, 1,4-bis(isocyanate-methyl)cyclohexane, etc.

[0136] As an organic polyisocyanate compound, it can also be used in combination with trimethylolpropane adducts, biuret forms obtained by reaction with water, trimers having isocyanurate rings, etc.

[0137] As a catalyst that can be used in obtaining polyurethane polyols, any suitable catalyst can be used. Examples of such catalysts include tertiary amine compounds and organometallic compounds.

[0138] Examples of tertiary amine compounds include triethylamine, triethylenediamine, and 1,8-diazabicyclo(5.4.0)-undecene-7 (DBU).

[0139] As organometallic compounds, examples include tin-containing compounds and non-tin-containing compounds.

[0140] Examples of tin-containing compounds include: dibutyltin dichloride, dibutyltin oxide, dibutyltin dibromide, dibutyltin dimaleate, dibutyltin dilaurate (DBTDL), dibutyltin diacetate, dibutyltin sulfide, tributyltin sulfide, tributyltin oxide, tributyltin acetate, triethyltin ethoxide, tributyltin ethoxide, dioctyltin oxide, tributyltin chloride, tributyltin trichloroacetate, and tin 2-ethylhexanoate.

[0141] Examples of non-tin-containing compounds include: titanium-containing compounds such as dibutyltitanium dichloride, tetrabutyl titanate, and butoxytitanium trichloride; lead-containing compounds such as lead oleate, lead 2-ethylhexanoate, lead benzoate, and lead naphthenate; iron-containing compounds such as ferric 2-ethylhexanoate and ferric acetylacetone; cobalt-containing compounds such as cobalt benzoate and cobalt 2-ethylhexanoate; zinc-containing compounds such as zinc naphthenate and zinc 2-ethylhexanoate; zirconium-containing compounds such as zirconium naphthenate; and so on.

[0142] When using a catalyst to obtain polyurethane polyols, in systems containing both polyester polyols and polyether polyols, the different reactivity of the two catalysts can easily lead to gelation or turbidity of the reaction solution. Therefore, by using two catalysts in the process of obtaining polyurethane polyols, these problems can be easily solved by controlling the reaction rate and catalyst selectivity. Examples of such combinations of two catalysts include: tertiary amine / organometallic compounds, tin-containing / non-tin-containing compounds, and tin-containing / tin-containing compounds, preferably tin-containing / tin-containing compounds, and more preferably a combination of dibutyltin dilaurate and tin 2-ethylhexanoate. Regarding the mixing ratio, by weight, the ratio of tin 2-ethylhexanoate to dibutyltin dilaurate is preferably less than 1, more preferably 0.2 to 0.6. When the mixing ratio is 1 or more, gelation may easily occur due to the balance of catalyst activity.

[0143] When a catalyst is used to obtain polyurethane polyol, the amount of catalyst used is preferably 0.01% to 1.0% by weight relative to the total amount of polyester polyol, polyether polyol and organic polyisocyanate compound.

[0144] When a catalyst is used to obtain polyurethane polyols, the reaction temperature is preferably less than 100°C, and more preferably 85°C to 95°C. When the reaction temperature reaches 100°C or higher, it may be difficult to control the reaction rate and crosslinking structure, and it may be difficult to obtain polyurethane polyols with the specified molecular weight.

[0145] When obtaining polyurethane polyols, a catalyst may not be used. In this case, the reaction temperature is preferably 100°C or higher, more preferably 110°C or higher. Furthermore, when obtaining polyurethane polyols without a catalyst, it is preferable to allow the reaction to proceed for at least 3 hours.

[0146] Methods for obtaining polyurethane polyols include, for example, 1) adding all the polyester polyol, polyether polyol, catalyst, and organic polyisocyanate into a flask; and 2) adding the polyester polyol, polyether polyol, and catalyst into a flask and then adding the organic polyisocyanate dropwise. From the perspective of controlling the reaction, method 2) is preferred for obtaining polyurethane polyols.

[0147] In obtaining polyurethane polyols, any suitable solvent can be used. Examples of such solvents include methyl ethyl ketone, ethyl acetate, toluene, xylene, and acetone. Among these solvents, toluene is preferred.

[0148] As a polyfunctional isocyanate compound, the aforementioned polyfunctional isocyanate compounds can be cited.

[0149] As a method for manufacturing a polyurethane resin composition obtained from a composition containing a urethane prepolymer, any suitable manufacturing method can be adopted as long as the so-called "urethane prepolymer" is used as a raw material to manufacture the polyurethane resin composition.

[0150] (Acrylic adhesives)

[0151] As for acrylic adhesives, there are no particular limitations, and known or conventional acrylic adhesives can be used. For example, from the viewpoint of easy control to achieve low tack, acrylic adhesive compositions containing acrylic polymers as base polymers can be listed.

[0152] The aforementioned acrylic polymers are polymers that contain structural units derived from acrylic monomers (monomers having a (meth)acryloyl group in the molecule) as structural units. Preferably, the acrylic polymers contain the most structural units derived from (meth)acrylates by mass ratio. It should be noted that acrylic polymers can be used alone or in combination of two or more. Furthermore, in this specification, "(meth)acrylic acid" means "acrylic acid" and / or "methacrylic acid" (any one or both of "acrylic acid" and "methacrylic acid"), and so on.

[0153] Examples of (meth)acrylates containing hydrocarbon groups include: alkyl (meth)acrylates, cycloalkyl (meth)acrylates, and aryl (meth)acrylates. Examples of alkyl (meth)acrylates include: methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, pentyl, isoamyl, hexyl, heptyl, octyl, 2-ethylhexyl, isooctyl, nonyl, decyl, isodecanyl, undecyl, dodecyl (lauryl), tridecyl, tetradecyl, hexadecyl, octadecyl, and eicosyl esters. Examples of cycloalkyl (meth)acrylates include: cyclopentyl and cyclohexyl (meth)acrylates. Examples of aryl (meth)acrylates include: phenyl and benzyl (meth)acrylates.

[0154] The aforementioned hydrocarbon-containing (meth)acrylates can be used alone or in combination of two or more. From the viewpoint of enabling the first adhesive layer to appropriately exhibit basic properties such as adhesion produced by the hydrocarbon-containing (meth)acrylates, and to easily control it to a low adhesion level, the proportion of hydrocarbon-containing (meth)acrylates in all monomer components used to form the acrylic polymer is preferably 40% by mass or more, more preferably 60% by mass or more.

[0155] To improve cohesion, heat resistance, and adhesion, the aforementioned acrylic polymers may contain structural units derived from other monomer components capable of copolymerizing with the aforementioned hydrocarbon-containing (meth)acrylates. Examples of these other monomer components include: carboxyl-containing monomers, acid anhydride monomers, hydroxyl-containing monomers, glycidyl-containing monomers, sulfonic acid-containing monomers, phosphate-containing monomers, acrylamide, acrylonitrile, and other functionalized monomers, as well as vinyl ester monomers. Examples of carboxyl-containing monomers include: acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Examples of acid anhydride monomers include: maleic anhydride and itaconic anhydride. Examples of hydroxyl-containing monomers include: 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylaurate (meth)acrylate, and methyl (4-hydroxymethylcyclohexyl)methacrylate. Examples of glycidyl-containing monomers include: glycidyl (meth)acrylate and methyl glycidyl (meth)acrylate. Examples of sulfonic acid-containing monomers include: styrene sulfonic acid, allyl sulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfonylpropyl (meth)acrylate, and (meth)acryloyloxynaphthalene sulfonic acid. Examples of phosphate-containing monomers include: 2-hydroxyethylacryloyl phosphate. Examples of vinyl ester monomers mentioned above include vinyl acetate, vinyl propionate, vinyl butyrate, vinyl pentanoate, vinyl cyclohexanecarboxylate, and vinyl benzoate. The other monomer components mentioned above can be used alone or in combination of two or more. From the viewpoint of enabling the first adhesive layer to appropriately exhibit basic properties such as adhesion resulting from (meth)acrylates containing hydrocarbon groups, and of easily controlling low adhesion, the total percentage of the other monomer components mentioned above in all monomer components used to form the acrylic polymer is preferably 60% by mass or less, more preferably 40% by mass or less.

[0156] For the aforementioned acrylic polymers, in order to form a cross-linked structure in their polymer backbone, structural units derived from multifunctional monomers capable of copolymerizing with monomeric components that form acrylic polymers can be included. Examples of such multifunctional monomers include: hexanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy (meth)acrylates (e.g., polyglycidyl (meth)acrylate), polyester (meth)acrylates, urethane (meth)acrylates, and other monomers having (meth)acryloyl groups and other reactive functional groups within their molecules. Two or more of the aforementioned multifunctional monomers can be used alone or in combination. From the viewpoint that the first adhesive layer should appropriately exhibit basic properties such as adhesion produced by (meth)acrylate containing hydrocarbon groups, and that it is easy to control to a low adhesion, the ratio of the above-mentioned multifunctional monomers in all monomer components used to form acrylic polymers is preferably 40% by mass or less, more preferably 30% by mass or less.

[0157] Acrylic polymers are obtained by polymerizing one or more monomer components containing acrylic monomers. Examples of polymerization methods include solution polymerization, emulsion polymerization, bulk polymerization, and suspension polymerization.

[0158] The mass-average molecular weight of the acrylic polymer is preferably 100,000 or more, and more preferably 200,000 to 3,000,000. When the mass-average molecular weight is 100,000 or more, there is a tendency for fewer low molecular weight substances in the adhesive layer, which can further suppress contamination of electronic components, etc.

[0159] The acrylic adhesive composition forming the first adhesive layer may contain a crosslinking agent. For example, an agent capable of crosslinking the acrylic polymer can further reduce low molecular weight substances in the first adhesive layer. Additionally, it can increase the mass-average molecular weight of the acrylic polymer, thereby controlling for low adhesion. Examples of such crosslinking agents include: polyisocyanate compounds, epoxy compounds, polyol compounds (polyphenolic compounds, etc.), aziridine compounds, melamine compounds, etc., with isocyanate crosslinking agents and / or epoxy crosslinking agents being preferred. When using a crosslinking agent, the amount of crosslinking agent used is preferably about 10 parts by mass or less, more preferably 0.1 parts by mass to 10 parts by mass, relative to 100 parts by mass of the acrylic polymer.

[0160] Examples of isocyanate crosslinking agents include aliphatic isocyanates, alicyclic isocyanates, and aromatic isocyanates. Examples of aliphatic isocyanates include trimethylene diisocyanate, butylene diisocyanate, hexamethylene diisocyanate, and dimer diisocyanate. Examples of alicyclic isocyanates include cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, and 1,3-bis(isocyanate-methyl)cyclohexane. Examples of aromatic isocyanates include 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, and phenylenediamine diisocyanate. In addition, other examples of isocyanate crosslinking agents include: trimethylolpropane adduct of toluene diisocyanate (trade name "Coronate L", manufactured by Tosoh Corporation) and isocyanuric acid form of hexamethylene diisocyanate (trade name "Coronate HX", manufactured by Tosoh Corporation).

[0161] Examples of epoxy crosslinking agents (multifunctional epoxy compounds) include: N,N,N',N'-tetraglycidyl-m-phenylenediamine, diglycidyl-aniline, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, etc. Glyceryl ethers, glyceryl polyglycidyl ethers, pentaerythritol polyglycidyl ethers, polyglyceryl polyglycidyl ethers, sorbitol polyglycidyl ethers, trimethylolpropane polyglycidyl ethers, diglycidyl adipic acid ester, diglycidyl phthalate ester, tri(2-hydroxyethyl)isocyanurate triglycidyl ester, resorcinol diglycidyl ether, and bisphenol S diglycidyl ether; additionally, epoxy resins having two or more epoxy groups within the molecule can also be listed. As commercially available epoxy crosslinking agents, for example, "Tetrad C" manufactured by Mitsubishi Gas Chemical Co., Ltd. can be listed.

[0162] The adhesive composition constituting the first adhesive layer preferably contains a mild release agent. By including a mild release agent, a weak interface layer (WBL) is formed on the surface of the first adhesive layer, which is easily controlled to achieve low adhesion.

[0163] There are no particular restrictions on the use of light stripping agents. Well-known light stripping agents can be used without limitation, such as silicone stripping agents, fluorinated surfactants, fatty acid esters, etc. These substances can be used alone or in combination of two or more.

[0164] There are no particular limitations on the aforementioned silicone-based release agents; examples include thermosetting silicone-based release agents and ionizing radiation-curing silicone-based release agents. Furthermore, silicone-based release agents can be either solvent-free (without solvents) or solvent-based (dissolved or dispersed in an organic solvent). It should be noted that silicone-based release agents can be used alone or in combination of two or more.

[0165] There are no particular limitations on the aforementioned thermosetting silicone-based release agents, but release agents comprising organohydrogen polysiloxanes and organopolysiloxanes having aliphatic unsaturated groups are preferred. Furthermore, the aforementioned silicone-based release agents are preferably thermoaddition-cured silicone-based release agents that cure through crosslinking caused by a thermoaddition reaction.

[0166] As for the aforementioned thermoaddition-curable silicone-based release agents, there are no particular limitations, but preferred examples include: polysiloxanes containing Si-H groups (polysiloxanes with hydrogen atoms (H) bonded to silicon atoms (Si) in their molecules) and polysiloxanes containing Si-H-based reactive functional groups (Si-H-based reactive polysiloxanes) in their molecules. It should be noted that this release agent is cross-linked and cured through an addition reaction between the Si-H groups and the Si-H-based reactive functional groups.

[0167] In the aforementioned polysiloxanes containing Si-H groups, the Si bonded to H can be either Si in the main chain or Si in the side chain. Preferably, the aforementioned polysiloxanes containing Si-H groups are polysiloxanes containing two or more Si-H groups in the molecule. Examples of polysiloxanes containing two or more Si-H groups include dimethylhydrosiloxane polymers such as poly(dimethylsiloxane-methylsiloxane).

[0168] Furthermore, as the aforementioned Si-H-based reactive polysiloxanes, preferred examples include polysiloxanes in which the Si-H-based reactive functional group or a side chain containing such a functional group is bonded to the Si (e.g., Si at the end of the main chain or Si inside the main chain) of the main chain (backbone) of the siloxane polymer. Among these, polysiloxanes in which the Si-H-based reactive functional group is directly bonded to the Si in the main chain are preferred. Moreover, as the aforementioned Si-H-based reactive polysiloxanes, preferred examples also include polysiloxanes containing two or more Si-H-based reactive functional groups in the molecule.

[0169] Examples of Si-H reactive functional groups in the aforementioned Si-H based reactive polysiloxanes include vinyl, hexenyl, and other alkenyl groups. Examples of siloxane polymers forming the main chain portion of the aforementioned Si-H based reactive polysiloxanes include polydialkylsiloxanes such as polydimethylsiloxane, polydiethylsiloxane, and polymethylethylsiloxane (the two alkyl groups may be the same or different); polyalkylarylsiloxanes; poly(dimethylsiloxane-methylsiloxane); and polymers formed by polymerizing various Si-containing monomers. Among these, polydimethylsiloxane is preferred as the siloxane polymer forming the main chain portion.

[0170] In particular, the above-mentioned thermoaddition-curable silicone release agent is preferably a thermoaddition-curable silicone release agent containing polysiloxanes with two or more Si-H groups in the molecule and polysiloxanes with two or more Si-H reactive functional groups in the molecule.

[0171] In addition, there are no particular limitations on the above-mentioned ionizing radiation curable silicone release agents, but UV-curable silicone release agents that are cured by cross-linking reaction under ultraviolet (UV) irradiation are preferred examples.

[0172] The aforementioned UV-curable silicone-based release agents are release agents that are cured by chemical reactions such as cationic polymerization, free radical polymerization, free radical addition polymerization, and hydrosilylation under UV irradiation. Particularly preferred of the aforementioned UV-curable silicone-based release agents are UV-curable silicone-based release agents cured by cationic polymerization.

[0173] As a cationic polymeric UV-curable silicone-based release agent, there are no particular limitations, but preferably include: release agents comprising epoxy-containing polysiloxanes, wherein at least two epoxy groups are bonded directly or via divalent groups (methylene, ethylene, etc., alkylene groups; ethyleneoxy, propyleneoxy, etc., alkylene groups, etc.) to the Si (e.g., Si at the end of the main chain, Si inside the main chain) and / or Si contained in the side chains of the siloxane polymer backbone. The bonding modes of these at least two epoxy groups to Si can be the same or different. That is, preferably include: release agents comprising polysiloxanes containing two or more epoxy-containing side chains. Examples of epoxy-containing side chains include: glycidyl groups, epoxypropoxy groups (glycidyloxy groups), 3,4-epoxycyclohexyl groups, 2,3-epoxycyclopentyl groups, etc. The epoxy-containing polysiloxanes can be linear, branched, or mixtures thereof.

[0174] In particular, in the double-sided adhesive film for transfer of the present invention, from the viewpoint of easily controlling the first adhesive layer to have low adhesion, the silicone adhesive preferably contains a thermosetting silicone release agent, and more preferably a thermoaddition reaction curable silicone release agent.

[0175] When the first adhesive layer of the transfer double-sided adhesive film of the present invention comprises a silicone adhesive, there is no particular limitation on the content of the silicone release agent. The content of the silicone release agent is preferably 0.5 parts by weight or more and 100 parts by weight or less relative to 100 parts by weight of the silicone polymer as the base polymer. When the content is 0.5 parts by weight or more, it is easy to control the first adhesive layer to have low adhesion; more preferably, it is 1 part by weight or more, and even more preferably, it is 3 parts by weight or more. Furthermore, when the content is 100 parts by weight or less, it is easy to suppress undesirable conditions such as insufficient adhesion and difficulty in receiving electronic components; more preferably, it is 30 parts by weight or less, and even more preferably, it is 25 parts by weight or less.

[0176] By using the aforementioned fluorinated surfactant as a light stripping agent, a light stripping effect generated by the low surface free energy of the fluorinated site can be achieved.

[0177] There are no particular limitations on the aforementioned fluorinated surfactants. Examples include: fluorinated oligomers, perfluorobutane sulfonates, carboxylates containing perfluoroalkyl groups, sulfonates containing hexafluoropentane trimer derivatives, carboxylates containing hexafluoropentane trimer derivatives, quaternary ammonium salts containing hexafluoropentane trimer derivatives, betaine containing hexafluoropentane trimer derivatives, and polyoxyethylene ethers containing hexafluoropentane trimer derivatives. Among these, fluorinated oligomers are preferred. It should be noted that two or more fluorinated surfactants can be used alone or in combination.

[0178] Specific examples of the aforementioned fluorinated surfactants include, for instance, commercially available products such as: "Megaface F(1)14" and "Megaface F-410" (manufactured by DIC Corporation); "Surflon S-211", "Surflon S-221", "Surflon S-231", "Surflon S-232", "Surflon S-233", "Surflon S-241", "Surflon S-242", "Surflon S-243", and "Surflon S-420" (manufactured by AGC Seimei Chemical Co., Ltd.); and "Ftergent 100", "Ftergent 100C", "Ftergent 110", "Ftergent 150", "Ftergent 150CH", "Ftergent 300", "Ftergent 310", "Ftergent 320", "Ftergent 400SW", and "Ftergent 100C". Ftergent 251, Ftergent 212M, Ftergent 215M, Ftergent 250, Ftergent 209F, Ftergent 222F, Ftergent 245F, Ftergent 208G, Ftergent 218GL, Ftergent 240G, Ftergent 212P, Ftergent 220P, Ftergent 228P, Ftergent FTX-218, and Ftergent DFX-18 (all manufactured by NEOS Corporation). These compounds can be used alone or in combination of two or more.

[0179] The weight-average molecular weight (Mw) of the aforementioned fluorinated oligomers is preferably 3,500 or more, more preferably 5,000 or more, even more preferably 10,000 or more, and particularly preferably 20,000 or more. When the weight-average molecular weight of the aforementioned fluorinated oligomers is 3,500 or more, it is easy to control for low adhesion. Furthermore, when the weight-average molecular weight is 20,000 or more, foaming during the compounding of the adhesive (composition) can be suppressed, resulting in an excellent appearance after adhesive coating, which is therefore preferred. In addition, the upper limit of the weight-average molecular weight (Mw) of the aforementioned fluorinated oligomers is preferably 200,000, more preferably 100,000. By setting the upper limit of the weight-average molecular weight (Mw) of the aforementioned fluorinated oligomers to 200,000, the fluorinated oligomers are easily enriched on the surface, making it easier to achieve a light peeling effect, which is preferred.

[0180] In addition, examples of the aforementioned fluorinated oligomers, such as commercially available products, include: "Megaface F(2)51", "Megaface F(2)53", "Megaface F(2)81", "Megaface F-410", "Megaface F-430", "Megaface F-444", "Megaface F-477", "Megaface F-510", "Megaface F-511", "Megaface F-551", "Megaface F-552", "Megaface F-553", "Megaface F-554", "Megaface F-555", "Megaface F-556", "Megaface F-557", "Megaface F-558", "Megaface F-559", "Megaface F-560", "Megaface F-561", "Megaface F-562", "Megaface F-563", "Megaface F-565", "Megaface F-568", "Megaface F-56 ...1", "Megaface F-562", "Megaface F-563", "Megaface F-565", "Megaface F-568", "Megaface F-569", "Megaface F-561", "Megaface F-562", "Megaface F-563", "Megaface The following compounds are listed: “F-569”, “Megaface F-570”, “Megaface F-571”, “Megaface F-572” (manufactured by DIC Corporation), “Surflon S-611”, “Surflon S-651”, “Surflon S-386” (manufactured by AGC Seimei Chemical Co., Ltd.), and “Ftergent 610FM”, “Ftergent 710FL”, “Ftergent 710FM”, “Ftergent 710FS”, “Ftergent 730FL”, “Ftergent 730LM” (manufactured by NEOS Corporation). These compounds can be used alone or in combination of two or more.

[0181] When the first adhesive layer of the transfer double-sided adhesive film of the present invention contains a fluorinated surfactant, there is no particular limitation on the content of the fluorinated surfactant. The content of the fluorinated surfactant is preferably 0.01 parts by weight or more and 5 parts by weight or less relative to 100 parts by weight of the silicone polymer as the base polymer. When the content is 0.01 parts by weight or more, it is easy to control the first adhesive layer to have low adhesion; more preferably, it is 0.05 parts by weight or more, and even more preferably, it is 0.1 parts by weight or more. Furthermore, when the content is 5 parts by weight or less, it is easy to suppress undesirable conditions such as insufficient adhesion and difficulty in receiving electronic components. From the viewpoint of suppressing reduced transparency, it is more preferably 3 parts by weight or less, and even more preferably 2 parts by weight or less.

[0182] By including fatty acid esters in the adhesive composition constituting the first adhesive layer, low adhesion and wettability of the first adhesive layer to electronic components can be expected.

[0183] Examples of the aforementioned fatty acid esters include: bisphenol A laurate of polyethylene oxide, butyl stearate, 2-ethylhexyl palmitate, 2-ethylhexyl stearate, glyceryl monobenzyl hesperidate, cetyl 2-ethylhexanoate, isopropyl myristate, isopropyl palmitate, cholesterol isostearate, lauryl methacrylate, coconut oil fatty acid methyl ester, methyl laurate, methyl oleate, methyl stearate, myristyl myristate, octyl dodecyl myristate, pentaerythritol monooleate, pentaerythritol monostearate, pentaerythritol tetrapalmitate, stearate, isotridecyl stearate, glyceryl tri(2-ethylhexanoate), butyl laurate, octyl oleate, tridecyl isononanoate, etc. Fatty acid esters can be used alone or in combination of two or more.

[0184] From the viewpoint of low adhesion to electronic components, low wettability, and low contamination of the adhered object by the first adhesive layer, for example, the content of fatty acid esters contained in the above-mentioned carbamate adhesive composition is preferably 1 to 50 parts by weight, more preferably 2 to 40 parts by weight, and even more preferably 3 to 30 parts by weight, relative to 100 parts by weight of polyol.

[0185] When the adhesive composition constituting the first adhesive layer contains a light release agent, from the viewpoint of low adhesion, wettability, and contamination of the electronic components by the first adhesive layer, for example, the content (total amount) of the light release agent relative to 100 parts by weight of the base polymer is preferably 0.1 parts by weight or more, more preferably 1 part by weight or more, and even more preferably 3 parts by weight or more. From the viewpoint of preventing discoloration of the first adhesive layer, the content (total amount) of the light release agent is preferably 50 parts by weight or less, more preferably 30 parts by weight or less, and even more preferably 10 parts by weight or less.

[0186] The adhesive composition constituting the first adhesive layer preferably includes antioxidants, ultraviolet absorbers, and other deterioration-preventing agents. By including deterioration-preventing agents, it is possible to suppress deterioration such as discoloration during storage of the double-sided adhesive film for transfer of the present invention, and furthermore, it is possible to improve the processability of the double-sided adhesive film for transfer, such as making it easy to cut.

[0187] There are no particular limitations on the aforementioned ultraviolet absorbers. Examples include triazine ultraviolet absorbers, benzotriazole ultraviolet absorbers, benzophenone ultraviolet absorbers, hydroxybenzophenone ultraviolet absorbers, salicylate ultraviolet absorbers, and cyanoacrylate ultraviolet absorbers. These can be used alone or in combination of two or more. Among them, triazine ultraviolet absorbers and benzotriazole ultraviolet absorbers are preferred. At least one ultraviolet absorber selected from the group consisting of triazine ultraviolet absorbers having two or fewer hydroxyl groups in one molecule and benzotriazole ultraviolet absorbers having one benzotriazole skeleton in one molecule has good solubility in the monomer used to form the acrylic adhesive composition and has high ultraviolet absorption capacity at a wavelength near 380 nm. Therefore, it is preferred.

[0188] Triazine UV absorbers having two or fewer hydroxyl groups in one molecule include, specifically: 2,4-bis[{4-(4-ethylhexyloxy)-4-hydroxy}phenyl]-6-(4-methoxyphenyl)-1,3,5-triazine (trade name "Tinosorb S", manufactured by BASF), 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3,5-triazine (trade name "TINUVIN 460", manufactured by BASF), 2-(4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine-2-yl)-5-hydroxyphenyl and [(C 10 -C 16 (mainly C) 12 -C 13The reaction product of ethylene oxide with alkoxymethyl[2,4-diphenyl-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, the reaction product of 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol (trade name "TINUVIN 405", manufactured by BASF), and the reaction product of 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[(hexyl)oxy]phenol (trade name "TINUVIN 405"). 1577, manufactured by BASF), 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-[2-(2-ethylhexanoyloxy)ethoxy]phenol (trade name "ADK STAB LA46", manufactured by ADEKA), 2-(2-hydroxy-4-[1-octoxycarbonylethoxy]phenyl)-4,6-bis(4-phenylphenyl)-1,3,5-triazine (trade name "TINUVIN 479", manufactured by BASF), etc.

[0189] In addition, examples of benzotriazole UV absorbers having one benzotriazole skeleton in one molecule include: 2-(2H-benzotriazole-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol (trade name "TINUVIN 928", manufactured by BASF), 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole (trade name "TINUVIN PS", manufactured by BASF), phenylpropionic acid with 3-(2H-benzotriazole-2-yl)-5-(1,1-dimethylethyl)-4-hydroxy(C 7-9Ester compounds of side-chain and straight-chain alkyl groups (trade name "TINUVIN 384-2", manufactured by BASF), 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol (trade name "TINUVIN 900", manufactured by BASF), 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol (trade name "TINUVIN 928", manufactured by BASF), the reaction product of methyl 3-(3-(2H-benzotriazol-2-yl)-5-tert-butyl-4-hydroxyphenyl)propionate / polyethylene glycol 300 (trade name "TINUVIN 1130", manufactured by BASF), 2-(2H-benzotriazol-2-yl)p-cresol (trade name "TINUVIN 900"). P), manufactured by BASF, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol (trade name "TINUVIN 234", manufactured by BASF), 2-[5-chloro(2H)-benzotriazol-2-yl]-4-methyl-6-(tert-butyl)phenol (trade name "TINUVIN 326", manufactured by BASF), 2-(2H-benzotriazol-2-yl)-4,6-di-tert-pentylphenol (trade name "TINUVIN 328", manufactured by BASF), 2-(2H-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol (trade name "TINUVIN") 329”, manufactured by BASF, methyl 3-(3-(2H-benzotriazol-2-yl)-5-tert-butyl-4-hydroxyphenyl)propionate reacting with polyethylene glycol 300 (trade name “TINUVIN 213”, manufactured by BASF), 2-(2H-benzotriazol-2-yl)-6-dodecyl-4-methylphenol (trade name “TINUVIN 571”, manufactured by BASF), 2-[2-hydroxy-3-(3,4,5,6-tetrahydrophthalimidemethyl)-5-methylphenyl]benzotriazole (trade name “Sumisorb 250”, manufactured by Sumitomo Chemical Co., Ltd.), etc.

[0190] In addition, examples of the aforementioned benzophenone-based ultraviolet absorbers (benzophenone compounds) and hydroxybenzophenone-based ultraviolet absorbers (hydroxybenzophenone compounds) include: 2,4-dihydroxybenzophenone, 2-hydroxy-4-methoxybenzophenone, 2-hydroxy-4-methoxybenzophenone-5-sulfonic acid (anhydrous salt and trihydrate salt), 2-hydroxy-4-octoxybenzophenone, 4-dodecyloxy-2-hydroxybenzophenone, 4-benzyloxy-2-hydroxybenzophenone, 2,2',4,4'-tetrahydroxybenzophenone, and 2,2'-dihydroxy-4,4'-dimethoxybenzophenone.

[0191] In addition, examples of salicylate-based ultraviolet absorbers (salicylate compounds) mentioned above include: phenyl 2-acryloyloxybenzoate, phenyl 2-acryloyloxy-3-methylbenzoate, phenyl 2-acryloyloxy-4-methylbenzoate, phenyl 2-acryloyloxy-5-methylbenzoate, phenyl 2-acryloyloxy-3-methoxybenzoate, phenyl 2-hydroxybenzoate, phenyl 2-hydroxy-3-methylbenzoate, phenyl 2-hydroxy-4-methylbenzoate, phenyl 2-hydroxy-5-methylbenzoate, phenyl 2-hydroxy-3-methoxybenzoate, and 2,4-di-tert-butyl-4-hydroxybenzoate (trade name "TINUVIN 120", manufactured by BASF).

[0192] Examples of cyanoacrylate-based ultraviolet absorbers (cyanoacrylate compounds) include: alkyl cyanoacrylate, cycloalkyl cyanoacrylate, alkoxyalkyl cyanoacrylate, alkenyl cyanoacrylate, alkynyl cyanoacrylate, etc.

[0193] The maximum absorption wavelength of the absorption spectrum of the above-mentioned ultraviolet absorber is preferably in the wavelength range of 300 nm to 400 nm, and more preferably in the wavelength range of 320 nm to 380 nm.

[0194] Examples of antioxidants include phenolic antioxidants, phosphorus-containing antioxidants, sulfur-containing antioxidants, and amine antioxidants, with at least one selected from the latter being used. Phenolic antioxidants are preferred, and hindered phenolic antioxidants are particularly preferred.

[0195] Specific examples of the aforementioned phenolic antioxidants, as monocyclic phenolic compounds, include: 2,6-di-tert-butyl-p-cresol, 2,6-di-tert-butyl-4-ethylphenol, 2,6-dicyclohexyl-4-methylphenol, 2,6-diisopropyl-4-ethylphenol, 2,6-di-tert-pentyl-4-methylphenol, 2,6-di-tert-octyl-4-n-propylphenol, 2,6-dicyclohexyl-4-n-octylphenol, 2-isopropyl-4-methyl-6-tert-butylphenol, 2-tert-butyl-4-ethyl-6-tert-octylphenol, 2-isobutyl-4-ethyl-6-tert-hexylphenol, 2-cyclohexyl-4-n-butyl-6-isopropylphenol, and styrene-modified mixed methylphenol. Phenols, DL-α-tocopherol, stearyl β-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, etc.; as bicyclic phenolic compounds, examples include: 2,2'-methylenebis(4-methyl-6-tert-butylphenol), 4,4'-butylidenebis(3-methyl-6-tert-butylphenol), 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-thiobis(4-methyl-6-tert-butylphenol), 4,4'-methylenebis(2,6-di-tert-butylphenol), 2,2'-methylenebis[6-(1-methylcyclohexyl)-p-cresol], 2,2'-ethidenebis(4,6-di-tert-butylphenol), 2,2'-butylidenebis( 2-tert-butyl-4-methylphenol), 3,6-dioxaoctamethylenebis[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionate], triethylene glycol bis[3-(3-tert-butyl-5-methyl-4-hydroxyphenyl)propionate], 1,6-hexanediol bis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], 2,2'-thiodiethylenebis[3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate], etc.; as tricyclic phenolic compounds, examples include: 1,1,3-tris(2-methyl-4-hydroxy-5-tert-butylphenyl)butane, 1,3,5-tris(2,6-dimethyl-3-hydroxy-4-tert-butyl)butane, etc. Examples of tetracyclic phenolic compounds include: benzyl isocyanurate, 1,3,5-tris[(3,5-di-tert-butyl-4-hydroxyphenyl)propionyloxyethyl]isocyanurate, tris(4-tert-butyl-2,6-dimethyl-3-hydroxybenzyl)isocyanurate, and 1,3,5-trimethyl-2,4,6-tris(3,5-di-tert-butyl-4-hydroxybenzyl)benzene; tetracyclic phenolic compounds include: tetra[methylene-3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate]methane; phosphorus-containing phenolic compounds include: bis(3,5-di-tert-butyl-4-hydroxybenzylphosphonate ethyl ester)calcium and bis(3,5-di-tert-butyl-4-hydroxybenzylphosphonate ethyl ester)nickel.

[0196] The aforementioned anti-deterioration agents can be used alone or in combination of two or more. From the viewpoint of inhibiting deterioration such as discoloration during storage and the processability of the double-sided adhesive film for transfer, for example, relative to 100 parts by weight of the aforementioned first adhesive composition, the content of the anti-deterioration agent contained in the adhesive composition is preferably 0.01 parts by weight to 10 parts by weight, more preferably 0.03 parts by weight to 5 parts by weight, and even more preferably 0.1 parts by weight to 3 parts by weight.

[0197] The adhesive composition constituting the first adhesive layer described above may contain any suitable other components without impairing the effects of the present invention. Examples of such other components include, for instance, tackifiers, inorganic fillers, organic fillers, metal powders, pigments, foils, softeners, plasticizers, conductive agents, surface lubricants, leveling agents, heat stabilizers, polymerization inhibitors, lubricants, solvents, etc.

[0198] <Second adhesive layer>

[0199] In the double-sided adhesive film for transfer of the present invention, the second adhesive layer is an adhesive layer for temporarily fixing to the carrier substrate, and preferably includes a peelable adhesive layer. From the viewpoint of being able to peel the second adhesive layer from the carrier substrate without contamination such as glue residue, and improving reworkability, the above-mentioned configuration in which the second adhesive layer includes a peelable adhesive layer is preferred.

[0200] The aforementioned second adhesive layer can be made into a peelable adhesive layer by adjusting the adhesiveness through the type or composition of the adhesive, the degree of crosslinking, etc.; or by reducing the adhesive force through physical stimulation such as heat, ultraviolet light, and electromagnetic waves.

[0201] The adhesive strength of the second adhesive layer can be adjusted by regulating the type or composition of the adhesive, the degree of crosslinking, etc., and by forming a WBL (weak interface layer) by combining a light peeling agent and a plasticizer.

[0202] In the double-sided adhesive film for transfer of the present invention, there is no particular limitation on the thickness of the second adhesive layer, but it is preferably 1 μm or more, and more preferably 3 μm or more. When the thickness is above a certain value, the second adhesive layer is easily and stably fixed on the carrier substrate, which is therefore preferred. In addition, there is no particular limitation on the upper limit of the thickness of the second adhesive layer, but it is preferably 30 μm, and more preferably 20 μm. When the thickness is below a certain value, the second adhesive layer is easily peeled off from the carrier substrate, improving reworkability, which is also preferred.

[0203] There are no particular limitations on the adhesives constituting the second adhesive layer described above. Examples include silicone adhesives, urethane adhesives, acrylic adhesives, rubber adhesives, polyester adhesives, polyamide adhesives, epoxy adhesives, vinyl alkyl ether adhesives, and fluorinated adhesives used in the first adhesive layer. From the viewpoint of being able to peel off from the carrier substrate without residue or other contamination, thus improving reworkability, silicone adhesives, urethane adhesives, and acrylic adhesives are preferred; urethane adhesives and acrylic adhesives are more preferred; and acrylic adhesives are even more preferred.

[0204] The second adhesive layer in the double-sided adhesive film for transfer of the present invention can be an adhesive layer whose adhesive strength can be intentionally reduced by external action during the use of the double-sided adhesive film for transfer (adhesive strength reduction type adhesive layer), or an adhesive layer whose adhesive strength is almost or completely not reduced by external action during the use of the double-sided adhesive film for transfer (adhesive strength non-reduction type adhesive layer). It can be appropriately selected according to the method, conditions, etc. of transferring electronic components using the double-sided adhesive film for transfer of the present invention.

[0205] When the second adhesive layer is a type of adhesive layer with reduced adhesion, the manufacturing and use of the transfer double-sided adhesive film of the present invention can flexibly utilize a state where the second adhesive layer exhibits relatively high adhesion or a state where it exhibits relatively low adhesion. For example, during the use of the transfer double-sided adhesive film of the present invention, in the process of receiving electronic components on the first adhesive layer, utilizing the state where the second adhesive layer exhibits relatively high adhesion can suppress and prevent the transfer double-sided adhesive film from peeling off the carrier substrate. On the other hand, subsequently, during the process of peeling the transfer double-sided adhesive film of the present invention off the carrier substrate, by reducing the adhesion of the second adhesive layer, reworkability can be improved.

[0206] Examples of adhesives that can form such adhesive layers with reduced adhesion include radiation-curing adhesives and heat-blown adhesives. Two or more adhesives that can form adhesive layers with reduced adhesion can be used alone or in combination.

[0207] As for the aforementioned radiation-curing adhesives, adhesives that can be cured by irradiation with electron beams, ultraviolet rays, alpha rays, beta rays, gamma rays, or X-rays can be used, and adhesives that can be cured by ultraviolet irradiation (ultraviolet-curing adhesives) are particularly preferred.

[0208] Examples of radiation-curing adhesives include additive-type radiation-curing adhesives containing a base polymer such as acrylic polymers and a radiation-polymerizable monomer or oligomer component with functional groups such as carbon-carbon double bonds that are radiation-polymerizable.

[0209] As the base polymer, an acrylic polymer, the same as that used in the first adhesive layer, can be used. From the viewpoint of enabling the second adhesive layer to appropriately exhibit basic properties such as adhesion produced by (meth)acrylate containing hydrocarbon groups, and to easily control adhesion and peelability, the proportion of (meth)acrylate containing hydrocarbon groups in all monomer components used to form the acrylic polymer is preferably 40% by mass or more, more preferably 60% by mass or more.

[0210] The aforementioned acrylic polymer may contain hydroxyl-containing monomers. When the acrylic polymer in the second adhesive layer contains hydroxyl-containing monomers, the second adhesive layer easily achieves moderate cohesiveness. From the viewpoint of achieving moderate adhesiveness and cohesiveness in the second adhesive layer, the ratio of hydroxyl-containing monomers in the aforementioned acrylic polymer is, for example, 0.1% to 30% by mass, preferably 0.5% to 20% by mass.

[0211] The aforementioned acrylic polymer may contain carboxyl-containing monomers. When the acrylic polymer in the second adhesive layer contains carboxyl-containing monomers, the second adhesive layer readily achieves moderate adhesive reliability. From the viewpoint of achieving moderate adhesive reliability in the second adhesive layer, the ratio of carboxyl-containing monomers in the aforementioned acrylic polymer is, for example, 0.1% to 30% by mass, preferably 0.5% to 20% by mass.

[0212] The aforementioned acrylic polymer may contain vinyl ester monomers. When the acrylic polymer in the second adhesive layer contains vinyl ester monomers, the second adhesive layer readily achieves moderate cohesiveness. From the viewpoint of achieving moderate cohesiveness in the second adhesive layer, the ratio of vinyl ester monomers in the aforementioned acrylic polymer is, for example, 0.1% to 60% by mass, preferably 0.5% to 50% by mass.

[0213] The acrylic adhesive composition forming the second adhesive layer may contain a crosslinking agent. For example, an agent can crosslink the acrylic polymer, thereby further reducing low molecular weight substances in the second adhesive layer. Additionally, it can increase the weight-average molecular weight of the acrylic polymer, thereby controlling low adhesion and peelability. Examples of such crosslinking agents include: polyisocyanate compounds, epoxy compounds, polyol compounds (polyphenolic compounds, etc.), aziridine compounds, melamine compounds, etc., with isocyanate crosslinking agents and / or epoxy crosslinking agents being preferred. When using a crosslinking agent, the amount of crosslinking agent used is preferably about 10 parts by weight or less, more preferably 0.1 parts by weight to 10 parts by weight, relative to 100 parts by weight of the acrylic polymer.

[0214] The acrylic adhesive composition forming the second adhesive layer can use a crosslinking accelerator. The type of crosslinking accelerator can be appropriately selected depending on the type of crosslinking agent used. It should be noted that, in this specification, a crosslinking accelerator refers to a catalyst that increases the rate of the crosslinking reaction using the crosslinking agent. Examples of such crosslinking accelerators include: tin (Sn) compounds such as dioctyltin dilaurate, dibutyltin dilaurate, dibutyltin diacetate, dibutyltin diacetylacetone, tetra-n-butyltin, and trimethyltin hydroxide; N-containing compounds such as amines and imidazoles such as N,N,N',N'-tetramethylhexanediamine and triethylamine; etc. Sn-containing compounds are preferred. These crosslinking accelerators are particularly effective when using a hydroxyl-containing monomer as the aforementioned minor monomer and an isocyanate-based crosslinking agent as the crosslinking agent. The amount of crosslinking accelerator contained in the adhesive composition, relative to 100 parts by weight of the above acrylic polymer, can be set to, for example, about 0.001 parts by weight to about 0.5 parts by weight (preferably about 0.001 parts by weight to about 0.1 parts by weight).

[0215] Examples of the aforementioned radiation-polymerizable monomer components include: urethane (meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and 1,4-butanediol di(meth)acrylate. Examples of the aforementioned radiation-polymerizable oligomer components include: various oligomers such as polyurethanes, polyethers, polyesters, polycarbonates, and polybutadienes, preferably oligomers with a molecular weight of about 100 to about 30,000. The content of the aforementioned radiation-curable monomer and oligomer components in the radiation-curable adhesive forming the second adhesive layer is, for example, about 5 parts by mass to about 500 parts by mass, preferably about 40 parts by mass to about 150 parts by mass, relative to 100 parts by mass of the aforementioned base polymer. Alternatively, as an additive-type radiation-curing adhesive, the radiation-curing adhesive disclosed in Japanese Patent Application Publication No. 60-196956 can be used, for example.

[0216] As an example of the aforementioned radiation-curing adhesive, an intrinsic radiation-curing adhesive can also be cited: a base polymer containing functional groups such as carbon-carbon double bonds with radiation-polymerizable properties in the polymer side chains, polymer backbone, and polymer backbone ends. When such an intrinsic radiation-curing adhesive is used, there is a tendency to suppress unexpected changes in adhesive properties over time caused by the migration of low molecular weight components within the formed second adhesive layer.

[0217] Acrylic polymers are preferred as the base polymer contained in the aforementioned intrinsic radiation-curing adhesives. As a method for introducing radiation-polymerizable carbon-carbon double bonds into acrylic polymers, one possible method is to polymerize (copolymerize) a raw material monomer containing a monomer component having a first functional group to obtain an acrylic polymer, and then subject a compound having a second functional group capable of reacting with the aforementioned first functional group and radiation-polymerizable carbon-carbon double bonds to a condensation or addition reaction with the acrylic polymer while maintaining the radiation-polymerizable nature of the carbon-carbon double bonds.

[0218] Examples of combinations of the first and second functional groups mentioned above include: carboxyl and epoxy groups, epoxy and carboxyl groups, carboxyl and aziridinyl groups, aziridinyl and carboxyl groups, hydroxyl and isocyanate groups, and isocyanate and hydroxyl groups. From the viewpoint of easy reaction tracking, combinations of hydroxyl and isocyanate groups, and combinations of isocyanate and hydroxyl groups are preferred. From the viewpoint that while the production of polymers with highly reactive isocyanate groups is technically challenging, it is easy to produce and obtain acrylic polymers with hydroxyl groups. Examples of compounds containing isocyanate groups and radiation-polymerizable carbon-carbon double bonds, i.e., isocyanate compounds containing radiation-polymerizable unsaturated functional groups, include: methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, and m-isopropenyl-α,α-dimethylbenzyl isocyanate. In addition, examples of acrylic polymers containing hydroxyl groups include polymers that contain structural units derived from ether compounds such as the aforementioned hydroxyl-containing monomers, 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether.

[0219] The aforementioned radiation-curing adhesive preferably contains a photopolymerization initiator. Examples of such photopolymerization initiators include: α-keto alcohols, acetophenones, benzoin ethers, ketals, aromatic sulfonyl chlorides, photoactive oximes, benzophenones, thioxanones, camphorquinones, haloketones, phosphine oxides, and acylphosphonates. Examples of such α-keto alcohols include: 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl) methyl ketone, α-hydroxy-α,α'-dimethylacetophenone, 2-methyl-2-hydroxyacetophenone, and 1-hydroxycyclohexylphenyl methyl ketone. Examples of such acetophenones include: methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1-one. Examples of the aforementioned benzoin ether compounds include, for example, benzoin ethyl ether, benzoin isopropyl ether, and anisolein methyl ether. Examples of the aforementioned ketal compounds include, for example, benzoin dimethyl ketal. Examples of the aforementioned aromatic sulfonyl chloride compounds include, for example, 2-naphthalenesulfonyl chloride. Examples of the aforementioned photoactive oxime compounds include, for example, 1-phenyl-1,2-propanedione-2-(O-ethoxycarbonyl)oxime. Examples of the aforementioned benzophenone compounds include, for example, benzophenone, benzoylbenzoic acid, and 3,3'-dimethyl-4-methoxybenzophenone. Examples of the aforementioned thioxanthone compounds include, for example, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropylthioxanthone. The content of photopolymerization initiator in the radiation-curable adhesive is, for example, 0.05 to 20 parts by mass relative to 100 parts by mass of the base polymer.

[0220] The aforementioned heat-expanding adhesives contain components that foam and expand upon heating (foaming agents, thermally expandable microspheres, etc.). Various inorganic and organic foaming agents can be listed as examples of such foaming agents. Examples of inorganic foaming agents include: ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium borohydride, and azide compounds. Examples of organic foaming agents include: chlorofluoroalkane such as trichlorofluoromethane and dichlorofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarbonamide, and barium azodicarbonate; hydrazine compounds such as p-toluenesulfonyl hydrazine, diphenyl sulfone-3,3'-disulfonyl hydrazine, 4,4'-oxobis(benzenesulfonyl hydrazine), and allylbis(sulfonyl hydrazine); aminourea compounds such as p-toluenesulfonamide and 4,4'-oxobis(benzenesulfonamide); triazole compounds such as 5-morpholino-1,2,3,4-thiatriazole; and N-nitroso compounds such as N,N'-dinitrospentamethylenetetramine and N,N'-dimethyl-N,N'-dinitrosterephthalamide. Examples of thermally expandable microspheres include microspheres composed of a substance that easily vaporizes and expands upon heating, encapsulated within the shell. Examples of substances that easily vaporize and expand upon heating include isobutane, propane, and pentane. Thermally expandable microspheres can be produced by encapsulating these substances within a shell-forming material using methods such as condensation or interfacial polymerization. The shell-forming material can be composed of substances exhibiting thermal melting properties or substances capable of rupture through the thermal expansion of the encapsulated material. Examples of such substances include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone.

[0221] As an example of an adhesive layer that does not reduce adhesion, a pressure-sensitive adhesive layer can be cited. It should be noted that a pressure-sensitive adhesive layer includes an adhesive layer that has been cured by radiation irradiation from an adhesive layer formed by a radiation-curing adhesive layer as described above regarding adhesive layers with reduced adhesion, but which possesses a certain degree of adhesion. The adhesives forming the adhesive layer that do not reduce adhesion can be used alone or in combination of two or more. Furthermore, the second adhesive layer may be entirely an adhesive layer that does not reduce adhesion, or a portion of the second adhesive layer may be an adhesive layer that does not reduce adhesion. For example, when the second adhesive layer has a single-layer structure, the entire second adhesive layer may be an adhesive layer that does not reduce adhesion, or a specific portion of the second adhesive layer may be an adhesive layer that does not reduce adhesion while other portions are adhesive layers with reduced adhesion. Furthermore, when the second adhesive layer has a laminated structure, all adhesive layers in the laminated structure may be adhesive layers that do not reduce adhesion, or a portion of the adhesive layers in the laminated structure may be adhesive layers that do not reduce adhesion.

[0222] For an adhesive layer that has been cured by radiation irradiation (a radiation-cured adhesive layer after radiation irradiation) after being formed by radiation-curing adhesive (a radiation-cured adhesive layer without radiation irradiation), even if the adhesive strength is reduced due to radiation irradiation, it still exhibits the adhesiveness produced by the contained polymer components, and can exert the minimum adhesive strength required for the transfer double-sided adhesive film of the present invention. When using a radiation-cured adhesive layer after radiation irradiation, in the surface extension direction of the second adhesive layer, the second adhesive layer may be entirely a radiation-cured adhesive layer after radiation irradiation, or a portion of the second adhesive layer may be a radiation-cured adhesive layer after radiation irradiation and the other portion may be a radiation-cured adhesive layer without radiation irradiation. It should be noted that, in this specification, "radiation-cured adhesive layer" refers to an adhesive layer formed by radiation-curing adhesive, including both a radiation-cured adhesive layer without radiation irradiation that has radiation curability and a radiation-cured adhesive layer after radiation irradiation that has cured the adhesive layer.

[0223] As the adhesive forming the aforementioned pressure-sensitive adhesive layer, known or conventional pressure-sensitive adhesives can be used, and acrylic adhesives with acrylic polymers as the base polymer are preferred. When the second adhesive layer contains an acrylic polymer as the pressure-sensitive adhesive, this acrylic polymer is preferably a polymer containing structural units derived from (meth)acrylates as the most abundant structural units by mass ratio. As the aforementioned acrylic polymer, for example, acrylic polymers described as those that can be included in the aforementioned additive-type radiation-curing adhesives can be used.

[0224] <Substrate>

[0225] The substrate in the double-sided adhesive film for transfer of the present invention functions as a support in the first adhesive layer and the second adhesive layer. Examples of substrates include plastic substrates (especially plastic films). The substrate can be a single layer or a laminate of the same or different types of substrates.

[0226] Examples of resins constituting the aforementioned plastic substrates include: low-density polyethylene, linear low-density polyethylene, medium-density polyethylene, high-density polyethylene, ultra-low-density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homopolymer polypropylene, polybutene, polymethylpentene, ethylene-vinyl acetate copolymer (EVA), ionomers, ethylene-(meth)acrylic acid copolymer, ethylene-(meth)acrylic acid (random, alternating) copolymer, ethylene-butene copolymer, ethylene-hexene copolymer, and other polyolefin resins; polyurethane; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate, and polybutylene terephthalate (PBT); polycarbonate; polyimide; polyetheretherketone; polyetherimide; polyamides such as aromatic polyamides and fully aromatic polyamides; polyphenylene sulfide; fluorinated resins; polyvinyl chloride; polyvinylidene chloride; cellulose resins; and silicone resins. From the viewpoint that electronic components received by the double-sided adhesive film for transfer of the present invention are transferred to a mounting substrate by heat pressing (e.g., 150°C) and then mounted, exhibiting good heat resistance, minimal expansion and contraction due to heat, and enabling high-precision mounting, the substrate preferably contains heat-resistant resins such as polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyamide (PA), and polyetheretherketone (PEEK) as its main component, and more preferably polyimide as its main component. It should be noted that the main component of the substrate refers to the component that accounts for the largest mass percentage in the constituent components. The above-mentioned resins can be used alone or in combination of two or more. In the case where the second adhesive layer is a radiation-cured adhesive layer as described above, the substrate preferably has radiation transmittance.

[0227] When the substrate is a plastic film, the plastic film can be unoriented or oriented in at least one direction (uniaxial direction, biaxial direction, etc.), but it is less likely to exhibit heat shrinkage when unoriented, so it is preferred.

[0228] To improve adhesion and retention with the adhesive layer, the surfaces of the substrate on the first and / or second adhesive layer side may undergo physical treatments such as corona discharge treatment, plasma treatment, sandblasting, ozone exposure treatment, flame exposure treatment, high-voltage electric shock exposure treatment, and ionizing radiation treatment; chemical treatments such as chromic acid treatment; coating agents (primers); and easy-to-adhere treatments using silicone primers. Furthermore, to impart antistatic properties, in addition to forming a conductive vapor-deposited layer containing metals, alloys, or their oxides on the substrate surface, a conductive polymer such as PEDOT-PSS may be coated. Preferably, the entire surface of the substrate on the adhesive layer side undergoes a surface treatment to improve adhesion.

[0229] From the viewpoint of ensuring the strength of the substrate to function as a support in the transfer double-sided adhesive film of the present invention, the thickness of the substrate is preferably 5 μm or more, more preferably 10 μm or more, further preferably 15 μm or more, and particularly preferably 20 μm or more. Furthermore, from the viewpoint of achieving appropriate flexibility in the transfer double-sided adhesive film of the present invention, the thickness of the substrate is preferably 200 μm or less, more preferably 180 μm or less, and further preferably 150 μm or less.

[0230] <Separator>

[0231] The adhesive layer surface (the bonding surface of the first adhesive layer and the second adhesive layer) of the double-sided adhesive film for transfer of the present invention is protected by a release liner (spacer) until use. The spacer serves as a protective material for the adhesive layer and is peeled off when the adhesive film is adhered to the substrate.

[0232] As the aforementioned spacer, conventional release paper or the like can be used. Specifically, for example, a substrate having a release layer obtained by a release agent on at least one surface can be used; and a low-adhesion substrate containing fluoropolymers (e.g., polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, chlorofluoroethylene-vinylidene fluoride copolymer, etc.) or a low-adhesion substrate containing non-polar polymers (e.g., olefin resins such as polyethylene and polypropylene).

[0233] As the aforementioned spacer, a spacer having a release layer formed on at least one surface of the spacer substrate is preferred. Examples of such spacer substrates include: polyester films (polyethylene terephthalate films, etc.), olefin resin films (polyethylene films, polypropylene films, etc.), polyvinyl chloride films, polyimide films, polyamide films (nylon films), rayon films, and other plastic substrate films (synthetic resin films); paper materials (high-grade paper, Japanese paper, kraft paper, cellophane, synthetic paper, surface-coated paper, etc.); and substrates obtained by multiplying them through lamination, co-extrusion, etc. (2- to 3-layer composites), etc.

[0234] There are no particular limitations on the release agent constituting the release layer described above. For example, silicone-based release agents, fluorinated release agents, long-chain alkyl-based release agents, fatty acid amide-based release agents, etc., can be used, with silicone-based release agents being preferred. Two or more release agents can be used alone or in combination. It should be noted that since the first adhesive layer includes a low-adhesion adhesive layer, a substrate that has not been treated with a release agent can also be used as a spacer.

[0235] From the viewpoint of adjusting F(1) and T(1) to the above-mentioned numerical range, the thickness of the release layer of the first spacer is preferably 10nm to 2000nm, more preferably 20nm to 500nm, even more preferably 30nm to 150nm, and particularly preferably 40nm to 80nm.

[0236] From the viewpoint of adjusting F(2), P(2), P'(2) and T(2) to the above-mentioned numerical range, the thickness of the release layer of the second spacer is preferably 10nm to 2000nm, more preferably 30nm to 500nm, even more preferably 50nm to 250nm, and particularly preferably 70nm to 150nm.

[0237] It should be noted that the thickness of the release layer of the first spacer is preferably less than the thickness of the release layer of the second spacer.

[0238] To prevent adverse effects on electronic components, the aforementioned spacer may have an antistatic layer formed on at least one side of the spacer substrate. The antistatic layer may be formed on one side of the spacer (the peeled-off side or the untreated side) or on both sides of the spacer (the peeled-off side and the untreated side).

[0239] Antistatic agents contained in antistatic resins can include: quaternary ammonium salts, pyridine, etc. Salts; cationic antistatic agents with cationic functional groups such as primary, secondary, and tertiary amine groups; anionic antistatic agents with anionic functional groups such as sulfonates, sulfates, phosphonates, and phosphates; amphoteric antistatic agents such as alkyl betaines and their derivatives, imidazolines and their derivatives, and alanine and its derivatives; nonionic antistatic agents such as amino alcohols and their derivatives, glycerol and its derivatives, and polyethylene glycol and its derivatives; and ionically conductive polymers obtained by polymerizing or copolymerizing monomers having the above-mentioned cationic, anionic, and amphoteric ion-conducting groups. These compounds can be used alone or in combination of two or more.

[0240] From the viewpoint of adjusting F(1) and T(1) to the above-mentioned numerical range, the thickness of the first spacer is preferably 1 μm to 150 μm, more preferably 5 μm to 100 μm, and even more preferably 10 μm to 80 μm.

[0241] From the viewpoint of adjusting F(2), P(2), P'(2) and T(2) to the above-mentioned numerical range, the thickness of the second spacer is preferably 10 μm to 150 μm, more preferably 15 μm to 100 μm, and even more preferably 20 μm to 80 μm.

[0242] The manufacturing method of the laminated film of the present invention varies depending on the composition of the adhesive composition described above, and is not particularly limited. Known forming methods can be used, such as the following methods (1) to (4).

[0243] (1) A method of manufacturing an adhesive film by coating (applying) the above-mentioned adhesive composition onto a substrate to form a composition layer and curing the composition layer (e.g., by heat curing or curing by irradiation with active energy rays such as ultraviolet light) to form an adhesive layer.

[0244] (2) A method of manufacturing an adhesive film by coating the adhesive composition described above onto a spacer to form a composition layer, curing the composition layer (e.g., by heat curing or curing by irradiation with active energy rays such as ultraviolet light) to form an adhesive layer, and then transferring the adhesive layer onto a substrate.

[0245] (3) A method of manufacturing an adhesive film by applying (coating) the above adhesive composition onto a substrate and drying it to form an adhesive layer.

[0246] (4) A method of manufacturing an adhesive film by coating (applying) the above adhesive composition onto a spacer and drying it to form an adhesive layer, and then transferring the adhesive layer onto a substrate.

[0247] From the viewpoint of excellent productivity and the ability to form a uniform and smooth adhesive layer, the heat curing method is preferred as the curing method in (1) to (4) above.

[0248] As a method for applying (coating) the above-mentioned adhesive composition to a specified surface, any known coating method can be used without particular limitation. Examples include: roller coating, roller licking coating, gravure coating, reverse coating, roller brush coating, spraying, dip roller coating, doctor blade coating, doctor blade coating, air knife coating, curtain coating, lip die coating, and extrusion coating using a die coating machine, etc.

[0249] There is no particular limitation on the thickness (total thickness) of the double-sided adhesive film for transfer of the present invention, but it is preferably 10 μm or more, more preferably 15 μm or more. When the thickness is above a certain value, the first adhesive layer can easily and accurately receive electronic components, which is preferred. Furthermore, there is no particular limitation on the upper limit of the thickness (total thickness) of the double-sided adhesive film for transfer of the present invention, but it is preferably 500 μm, more preferably 300 μm. When the thickness is below a certain value, it is easy and accurate to transfer electronic components onto the mounting substrate, which is preferred.

[0250] The double-sided adhesive film for transfer printing of the present invention is suitable for use in methods for mounting electronic components onto a mounting substrate. A method for mounting electronic components onto a mounting substrate using the double-sided adhesive film for transfer printing of the present invention preferably includes the following steps.

[0251] The process of receiving the cut electronic components in the first adhesive layer of the double-sided adhesive film for transfer (first process).

[0252] The process of transferring the electronic components received by the first adhesive layer onto the mounting substrate (second process).

[0253] Figure 2 This is a cross-sectional schematic diagram illustrating an embodiment of the first step in a method for mounting electronic components onto a mounting substrate using the double-sided adhesive film for transfer of the present invention.

[0254] exist Figure 2 In (a), the double-sided adhesive film 1 for transfer is adhered to the carrier substrate 22 using the adhesive side of the second adhesive layer 12. Marking patterns for arranging electronic components may be present on the surface of the carrier substrate 22 that is adhered to the second adhesive layer 12. Because the double-sided adhesive film 1 for transfer has high transparency, the marking patterns on the carrier substrate 22 can be visually identified.

[0255] Multiple electronic components 21, which are made into single pieces by cutting, are disposed on the upper part of the adhesive surface of the first adhesive layer 11, opposite to and separated from the adhesive surface of the first adhesive layer 11, while being pasted on the cutting tape 20.

[0256] exist Figure 2 In (b), the ejector pin 23 pushes the electronic component 21 from the unattached side of the cutting tape 20, bringing the electronic component 21 close to the adhesive surface of the first adhesive layer 11, where the adhesive surface of the first adhesive layer 11 receives the electronic component 21. Receiving can be done by bringing the electronic component 21 into contact with the first adhesive layer 11, or it can be done non-contactly. In the case of non-contact receiving, the electronic component 21 is pushed until it peels off the cutting tape 20, causing it to fall onto the adhesive surface. When receiving by bringing it into contact, the adhesive surface of the first adhesive layer 11 has low adhesion, resulting in weak stress when receiving the electronic component 21, thus suppressing damage to the electronic component 21. In the case of non-contact receiving, the adhesive surface of the first adhesive layer 11 has low adhesion, allowing for accurate positioning of the falling electronic component 21. It should be noted that the electronic component 21 can also be peeled off the cutting tape 20 by irradiation with ultraviolet light, a laser beam, or other radiation instead of the ejector pin 23.

[0257] The electronic components 21 can be received onto the first adhesive layer 11 individually or in multiple batches at once. Figure 2 (c) A cross-sectional schematic diagram showing the shape of the adhesive surface of the first adhesive layer 11 of the double-sided adhesive film 1 for transfer, on which all the electronic components 21 on the cutting tape 20 are received.

[0258] Figure 3 This is a cross-sectional schematic diagram illustrating the second step in a method for mounting electronic components onto a mounting substrate using the double-sided adhesive film for transfer of the present invention.

[0259] like Figure 3 As shown in (a), electronic components 21 arranged on the adhesive surface of the first adhesive layer 11 of the transfer double-sided adhesive film 1 are disposed opposite to and separated on the circuit surface 31 (circuit pattern omitted) of the mounting substrate 30. Next, as... Figure 3 As shown in (b), the circuit surface 31 of the mounting substrate 30 is brought close to the adhesive surface of the first adhesive layer 11 of the transfer double-sided adhesive film 1, so that the electronic component 21 contacts the circuit surface 31 of the mounting substrate 30.

[0260] The transfer of electronic component 21 onto the circuit surface 31 of mounting substrate 30 can be performed by heat pressing (e.g., 150°C for 1 minute). The substrate 10, the first adhesive layer 11 and / or the second adhesive layer 12 constituting the double-sided adhesive film 1 for transfer have excellent heat resistance, so they are not prone to expansion, contraction or changes in adhesive force due to heat pressing, thus enabling the electronic component 21 to be transferred onto the circuit surface 31 of mounting substrate 30 with high precision.

[0261] Next, as Figure 3 As shown in (c), by separating the double-sided adhesive film 1 for transfer from the mounting substrate 30, the electronic component 21 is peeled off from the first adhesive layer 11 and transferred onto the circuit surface 31 of the mounting substrate 30. Since the first adhesive layer 11 is composed of a low-adhesion adhesive layer, the electronic component 21 is easy to peel off and can be efficiently mounted onto the mounting substrate 30 without damaging the electronic component 21.

[0262] After the electronic component 21 is mounted onto the mounting substrate 30 Figure 3 (c) The double-sided adhesive film 1 for transfer can be peeled off from the carrier substrate 22 (illustration omitted). Since the second adhesive layer 12 is composed of a peelable adhesive layer, it can be peeled off without any glue residue, has excellent reworkability, and therefore the carrier substrate 22 can be easily reused.

[0263] As an electronic component to be mounted on a mounting substrate, there are no particular restrictions, and it is suitable for using fine and thin semiconductor chips and LED chips.

[0264] Example

[0265] The present invention will be described in more detail below with reference to specific embodiments, but the present invention is not limited to these embodiments in any way.

[0266] <Manufacturing Example 1> Manufacturing of Acrylic Copolymer (1)

[0267] 95 parts by weight of butyl acrylate (manufactured by Nippon Shokubai Co., Ltd.), 5 parts by weight of acrylic acid (manufactured by Toa Synthetic Co., Ltd.), 0.2 parts by weight of 2,2'-azobisisobutyronitrile (manufactured by Wako Pure Chemical Industries, Ltd.) as a polymerization initiator and 156 parts by weight of ethyl acetate were added to a four-necked flask equipped with a stirring blade, a thermometer, a nitrogen inlet pipe and a condenser. Nitrogen gas was introduced while stirring slowly to maintain the liquid temperature in the flask at around 63°C and to carry out the polymerization reaction for 10 hours, thereby preparing a solution of acrylic copolymer (1) with a weight average molecular weight of 700,000 (solid content: 40% by weight).

[0268] <Manufacturing Example 2> Manufacturing of Acrylic Copolymer (2)

[0269] 2.8 parts by weight of 80% acrylic acid (AA) (manufactured by Osaka Organic Chemical Industry Co., Ltd.), 44 parts by weight of 2-ethylhexyl acrylate (2EHA) (manufactured by Nippon Shokubai Co., Ltd.), 35.2 parts by weight of vinyl acetate (manufactured by Denka Co., Ltd.), and 20 parts by weight of toluene were added to a four-necked flask equipped with a stirring blade, thermometer, nitrogen inlet pipe, and condenser. Nitrogen gas was introduced while stirring slowly, and the mixture was stirred for 1 hour. Then, 0.2 parts by weight of Nyper BW (manufactured by Nippon Yu Co., Ltd.), diluted with 96 parts by weight of toluene as a polymerization initiator, were added dropwise, and the liquid temperature in the flask was maintained at around 40°C. Then, the liquid temperature in the flask was raised to 60°C and the polymerization reaction was carried out for 8 hours. Then, the temperature was raised to 95°C and stirred for 4 hours, thereby preparing a solution of acrylic copolymer (2) with a weight average molecular weight of 560,000 (solid content: 35% by weight).

[0270] <Manufacturing Example 3> Manufacturing of the spacer (1)

[0271] A silicone-based release agent (manufactured by Shin-Etsu Chemical Industry Co., Ltd., KS-847) and a catalyst (manufactured by Shin-Etsu Chemical Industry Co., Ltd., CAT-PL-50T) were diluted to 1.0% by weight using toluene to obtain a silicone-based release treatment liquid. The obtained silicone-based release treatment liquid was applied to the surface of a substrate film (50 μm thick, trade name "Diafoil T100-50S", manufactured by Mitsubishi Chemical Corporation) as a release layer using a wire-wound bar to a dry thickness of 50 nm. The film was cured and dried at a drying temperature of 130 °C for 3 minutes (release treatment A) to manufacture a spacer (1) comprising a [release layer (thickness 50 nm, release treatment A)] / [substrate layer].

[0272] <Manufacturing Example 4> Manufacturing of the spacer (2)

[0273] A release layer was obtained by coating a substrate film (25 μm thick, trade name "Diafoil T100-25", manufactured by Mitsubishi Chemical Corporation) with a thickness of 100 nm after drying. Otherwise, a spacer (2) comprising a [release layer (100 nm thick, demolding treatment B)] / [substrate layer] was manufactured in the same manner as in Manufacturing Example 3. Furthermore, a spacer used as a second spacer was manufactured by arbitrarily changing the thickness of the substrate film as described in Table 1.

[0274] <Manufacturing Example 5> Manufacturing of the spacer (3)

[0275] Except for changing the catalyst (manufactured by Shin-Etsu Chemical Industry Co., Ltd., CAT-PL-50T) to 1.0 parts by weight, a spacer (3) comprising a [release layer (thickness 50 nm, demolding treatment C)] / [substrate layer] was manufactured in the same manner as in Manufacturing Example 3.

[0276] <Example 1>

[0277] A silicone adhesive composition was prepared by adding 100 parts by weight of an addition-reaction silicone adhesive (trade name "X-40-3306", manufactured by Shin-Etsu Chemical Industry Co., Ltd.), 1.4 parts by weight of a platinum catalyst 1 (trade name "CAT-PL-50T", manufactured by Shin-Etsu Chemical Industry Co., Ltd.), and 5 parts by weight of a silicone release agent 1 (an addition-reaction silicone release agent with dimethyl polysiloxane as the main component, trade name "KS-776A", manufactured by Shin-Etsu Chemical Industry Co., Ltd.), diluting with toluene to make the total solid content 25% by weight, and mixing using a disperser.

[0278] A silicone adhesive composition was applied to the silicone-primed side of a substrate film (a 75μm thick polyester film with one side treated with a silicone primer, trade name "Diafoil MRF#75", manufactured by Mitsubishi Resin Co., Ltd.) with a dried paste thickness of 10μm. The mixture was then cured and dried at 120°C for 5 minutes. This resulted in a film having a silicone adhesive layer on top of the silicone primer layer of the substrate film.

[0279] The release layer side of the separator (1) manufactured in Manufacturing Example 3, which serves as the first separator, is attached to the silicone adhesive layer to protect the silicone adhesive layer, thereby obtaining a laminate (1) having a laminated structure of [first separator layer] / [silicone adhesive layer] / [substrate film layer].

[0280] Next, TETRAD-C (manufactured by Mitsubishi Gas Chemical Co., Ltd.), a crosslinking agent, was added to a solution of the acrylic copolymer (1) obtained in Manufacturing Example 1, with a solid content of 100 parts by weight (equivalent to 6 parts by weight based on the solid content of the solution). The solution was diluted with ethyl acetate to make the total solid content 25% by weight. The acrylic adhesive composition (1), stirred by a disperser, was applied to the release layer side of the second spacer (spacer (2)) using an impregnation roller to a thickness of 5 μm after drying. The mixture was then cured and dried at a drying temperature of 130°C for 30 seconds. In this manner, an acrylic adhesive layer (1) was formed on the second spacer.

[0281] Next, the substrate film side (non-silicone primer treated side) of the above-obtained laminate (1) is attached to the surface of the acrylic adhesive layer (1) to obtain a laminated film with a laminated structure of [first spacer layer] / [silicone adhesive layer (first adhesive layer)] / [substrate film layer] / [acrylic adhesive (1) layer (second adhesive layer)] / [second spacer layer].

[0282] <Example 2>

[0283] The thickness of the dried silicone adhesive of the first adhesive layer was adjusted to 25 μm. For the second separator, a separator (2) was replaced by a separator obtained by changing the substrate film in the separator (2) to a substrate film (thickness 38 μm, trade name "Diafoil T100C38", manufactured by Mitsubishi Chemical Corporation). Otherwise, the laminated film was obtained in the same manner as in Example 1.

[0284] <Example 3>

[0285] The thickness of the dried silicone adhesive of the first adhesive layer was adjusted to 50 μm. For the second separator, a separator (2) was replaced by a separator obtained by changing the substrate film in the separator (2) to a substrate film (50 μm thick, trade name "Diafoil T100-50S", manufactured by Mitsubishi Chemical Corporation). Otherwise, the laminated film was obtained in the same manner as in Example 1.

[0286] <Example 4>

[0287] The thickness of the dried silicone adhesive of the first adhesive layer was adjusted to 75 μm. For the second separator, a separator (2) was replaced by a separator obtained by changing the substrate film in the separator (2) to a substrate film (75 μm thick, trade name "Diafoil T100-75S", manufactured by Mitsubishi Chemical Corporation). Otherwise, the laminated film was obtained in the same manner as in Example 1.

[0288] <Example 5>

[0289] The thickness of the dried silicone adhesive of the first adhesive layer was adjusted to 50 μm. For the first spacer, spacer (2) was used. Otherwise, the laminated film was obtained in the same manner as in Example 1.

[0290] <Example 6>

[0291] Except that the thickness of the dried silicone adhesive paste of the first adhesive layer was adjusted to 75 μm, the laminated film was obtained in the same manner as in Example 5.

[0292] <Example 7>

[0293] The thickness of the dried silicone adhesive of the first adhesive layer was adjusted to 25 μm. A spacer (3) was used as the first spacer. For the first adhesive layer, an acrylic adhesive (2) was used instead of an acrylic adhesive (1). Otherwise, a laminated film was obtained in the same manner as in Example 1.

[0294] <Example 8>

[0295] Except that the thickness of the dried silicone adhesive paste of the first adhesive layer was adjusted to 50 μm, the laminated film was obtained in the same manner as in Example 7.

[0296] <Example 9>

[0297] Except that the thickness of the dried silicone adhesive paste of the first adhesive layer was adjusted to 75 μm, the laminated film was obtained in the same manner as in Example 7.

[0298] <Comparative Example 1>

[0299] Except that a spacer (2) was used as the first spacer, a laminated film was obtained in the same manner as in Example 1.

[0300] <Comparative Example 2>

[0301] Except that a spacer (2) was used as the first spacer, a laminated film was obtained in the same manner as in Example 2.

[0302] <Evaluation>

[0303] The double-sided adhesive films for transfer obtained in the examples and comparative examples were evaluated as follows. The results are shown in Table 2.

[0304] <Determination of the peel force F(1) of the first spacer against the first adhesive layer>

[0305] The double-sided adhesive film for transfer printing of the examples and comparative examples was cut into pieces with a width of 50 mm and a length of 100 mm, and used as evaluation samples.

[0306] The second adhesive layer was peeled off, and the surface of the second adhesive layer was bonded to a glass plate (trade name "S200423", manufactured by Matsunami Glass Industry Co., Ltd.) using a roller with a speed of 0.25 MPa and 0.3 m / min at 23°C and 50% RH. Then, the first spacer was peeled off from the first adhesive layer using a universal tensile testing machine (product name "TCM-1kNB", manufactured by Minebea Co., Ltd.) at a peel angle of 180 degrees and a peel speed of 0.3 m / min. The peel force F (1) was then measured.

[0307] <Determination of the peel force F(2) of the second spacer on the second adhesive layer>

[0308] The double-sided adhesive film for transfer printing of the examples and comparative examples was cut into pieces with a width of 50 mm and a length of 100 mm, and used as evaluation samples.

[0309] The spacer of the first adhesive layer was peeled off. Under the conditions of 23°C and 50%RH, the surface of the first adhesive layer was bonded to a glass plate (trade name "S200423", manufactured by Matsunami Glass Industry Co., Ltd.) using a roller with a speed of 0.25 MPa and 0.3 m / min. Then, the second spacer was peeled off from the second adhesive layer using a universal tensile testing machine (product name "TCM-1kNB", manufactured by Minebea Co., Ltd.) at a peel angle of 180 degrees and a peel speed of 0.3 m / min. The peel force F (2) was then measured.

[0310] <Determination of the adhesive force P(2) of the second adhesive layer peeling off the carrier substrate>

[0311] The double-sided adhesive film for transfer printing of the examples and comparative examples was cut into pieces with a width of 50 mm and a length of 100 mm, and used as evaluation samples.

[0312] In an environment of 23°C and 50%RH, the surface of the second adhesive layer of the sample after the septum was adhered to a glass plate (trade name "S200423", manufactured by Matsunami Glass Industry Co., Ltd.) using a roller with a pressure of 0.25 MPa and a speed of 0.3 m / min, and aged for 30 minutes. Then, the second adhesive layer was peeled off from the glass plate using a universal tensile testing machine (product name "TCM-1kNB", manufactured by Minebea Co., Ltd.) at a peel angle of 180 degrees and a pulling speed of 0.3 m / min. The peel adhesion force P(2) was then measured.

[0313] <Determination of the adhesive force P'(2) of the second adhesive layer on the glass plate after peeling at 160°C and 5 minutes>

[0314] The double-sided adhesive film for transfer printing of the examples and comparative examples was cut into pieces with a width of 50 mm and a length of 100 mm, and used as evaluation samples.

[0315] In an environment of 23°C and 50%RH, the surface of the second adhesive layer after peeling off the septum of the evaluation sample was adhered to a glass plate (trade name "S200423", manufactured by Matsunami Glass Industry Co., Ltd.) using a roller with a speed of 0.25MPa and 0.3m / min, and aged for 30 minutes.

[0316] Next, the second adhesive layer was heated in an air-circulating constant temperature oven at 160°C for 5 minutes, and then allowed to cool naturally for 30 minutes at 23°C and 50%RH. The adhesive force P'(2) was then measured by peeling the second adhesive layer off the glass plate using a universal tensile testing machine (product name "TCM-1kNB", manufactured by Minebea Corporation) at a peel angle of 180 degrees and a pulling speed of 0.3 m / min.

[0317] <Determination of the initial peel force T(1) of the first spacer to the first adhesive layer>

[0318] The double-sided adhesive film for transfer of the examples and comparative examples was cut into 50 mm wide and 100 mm long using a die-cutting paper cutter, and these were used as evaluation samples.

[0319] The spacer of the second adhesive layer was peeled off. Under conditions of 23°C and 50% RH, the surface of the second adhesive layer was adhered to a glass plate (trade name "S200423", manufactured by Matsunami Glass Industry Co., Ltd.) using a roller at 0.25 MPa and 0.3 m / min. Then, under conditions of 23°C and 50% RH, a rubber adhesive tape (trade name "NO.315", width 19 mm, manufactured by Nitto Denko Co., Ltd.) was pressed onto the center of the width direction of the back side of the surface protective film using a manual roller. Under the same conditions, at a pulling speed of 0.3 m / min and a peeling angle of 90 degrees, the first spacer was peeled off from the first adhesive layer. The maximum stress applied at the start of peeling was recorded as the initial peeling force T(1) [N / 50 mm].

[0320] <Determination of the initial peel force T(2) of the second spacer on the second adhesive layer>

[0321] The double-sided adhesive film for transfer of the examples and comparative examples was cut into 50 mm wide and 100 mm long using a die-cutting paper cutter, and these were used as evaluation samples.

[0322] The spacer of the second adhesive layer was peeled off. Under conditions of 23°C and 50%RH, the surface of the second adhesive layer was adhered to a glass plate (trade name "S200423", manufactured by Matsunami Glass Industry Co., Ltd.) using a roller at 0.25MPa and 0.3m / min. Then, under conditions of 23°C and 50%RH, a rubber adhesive tape (trade name "NO.315", width 19mm, manufactured by Nitto Denko Co., Ltd.) was pressed onto the center of the width direction of the back side of the surface protective film using a manual roller. Under the same conditions, the second spacer was peeled off from the second adhesive layer at a pulling speed of 0.3m / min and a peeling angle of 90 degrees. The maximum stress applied at the start of peeling was recorded as the initial peeling force T(2) [N / 50mm].

[0323] <Evaluation of the peelability of the first septum>

[0324] The double-sided adhesive film for transfer printing of the examples and comparative examples was cut into 10 mm wide and 10 mm long pieces and used as evaluation samples.

[0325] The second adhesive layer was peeled off, and the surface of the second adhesive layer was bonded to a glass plate (trade name "S200423", manufactured by Matsunami Glass Industry Co., Ltd.) using a roller at 0.25 MPa and 0.3 m / min under conditions of 23°C and 50% RH. Then, using an acrylic adhesive tape (trade name "NO.31B", manufactured by Nitto Denko Co., Ltd.) pressed onto the right-angle portion of the evaluation sample by a manual roller as a handle, the first spacer was peeled off from the first adhesive layer under conditions of 23°C and 50% RH, at a peel angle of 180 degrees and a peel speed of 0.3 m / min. The peelability of the first spacer was evaluated according to the following criteria.

[0326] (Evaluation Criteria)

[0327] 〇 (Good): The first spacer is peeled off without any lifting at the interface between the second adhesive layer and the glass plate.

[0328] △(Pass): The first spacer was peeled off, but the second adhesive layer was lifted at the interface with the glass plate.

[0329] × (Unacceptable): The second adhesive layer peeled off from the glass plate before the first spacer was peeled off.

[0330] <Evaluation of the peelability of the second septum>

[0331] The double-sided adhesive film for transfer printing of the examples and comparative examples was cut into 10 mm wide and 10 mm long pieces and used as evaluation samples.

[0332] The evaluation sample was placed on the adsorption stage with the first spacer side facing down and fixed by suction. Using an acrylic adhesive tape (trade name "NO.31B", manufactured by Nitto Denko Corporation) pressed onto the right-angle portion of the fixed evaluation sample by a manual roller as a handle, the second spacer was peeled from the second adhesive layer at 23°C, 50%RH, a peel angle of 180 degrees, and a peel speed of 0.3 m / min. The peelability of the second spacer was evaluated according to the following criteria.

[0333] (Evaluation Criteria)

[0334] 〇 (Good): The second spacer is peeled off without any lifting at the interface between the first adhesive layer and the first spacer.

[0335] △(Pass): Although the second spacer was peeled off, a lift-up occurred at the interface between the first adhesive layer and the first spacer.

[0336] × (Unacceptable): The first adhesive layer and the first spacer peeled off before the second spacer was peeled off.

[0337] <Glass reworkability>

[0338] The samples were visually observed after the adhesion force P'(2) of the second adhesive layer to the glass plate was measured at 160°C for 5 minutes, and the reworkability was judged according to the following criteria.

[0339] (Evaluation Criteria)

[0340] ◎(Excellent): No glass breakage, glue residue or other contamination was observed in the glass plate.

[0341] 〇 (Good): For the glass plate, almost no glass breakage, glue residue or other contamination was observed.

[0342] × (Unacceptable): For the glass plate, contamination such as glass breakage and glue residue was observed.

[0343] [Table 1]

[0344]

[0345] [Table 2]

[0346]

[0347] Label Explanation

[0348] 1-layer film

[0349] 10 substrates

[0350] 11 First adhesive layer

[0351] 12 Second adhesive layer

[0352] 110 First partition

[0353] 120 Second Spacing

[0354] 20 Cutting Tape

[0355] 21 electronic components

[0356] 22 carrier substrates

[0357] 23 ejector pin components

[0358] 30 mounting base plates

[0359] 31 circuit planes

Claims

1. A laminated film, wherein, The laminated film is obtained by laminating a first spacer, a first adhesive layer, a substrate, a second adhesive layer, and a second spacer in this order. The first adhesive layer comprises a low-adhesion adhesive layer, and the second adhesive layer comprises a peelable adhesive layer. F(1), F(2), P(2), P'(2), T(1), and T(2) satisfy the following relationship: F(2) / F(1) < 0.80 P(2) / F(1)>1.00、 P'(2) / P(2)<1.20、 P’(2)＜1.00、 T(1) / T(2)>1.05、 P(2) / T(1) < 1.00, F(1) is the peel force (N / 50mm) of the first spacer peeling the first adhesive layer at 180°, measured under the conditions of 23°C, 50%RH and a peel speed of 0.3m / min. F(2) is the peel force (N / 50mm) of the second spacer against the second adhesive layer at 180°, measured under the conditions of 23°C, 50%RH and a peel speed of 0.3m / min. P(2) is the adhesive force (N / 50mm) of the second adhesive layer on the glass plate after a 180° peel, measured under the conditions of 23°C, 50%RH and a pulling speed of 0.3m / min. P'(2) is the adhesion force (N / 50mm) of the second adhesive layer to the glass plate after the second adhesive layer is bonded to the glass plate, subjected to 160°C for 5 minutes, and then subjected to 180°C, 50%RH and a pulling speed of 0.3m / min. T(1) is the initial peel force (N / 50mm) of the first adhesive layer to the first spacer at 90°, measured under conditions of 23°C, 50%RH and a pulling speed of 0.3m / min. T(2) is the initial peel force (N / 50mm) of the second adhesive layer on the second spacer at 90°, measured under the conditions of 23°C, 50%RH and a pulling speed of 0.3m / min.

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