Vinyl modified MXene, conductive compound, organosilicon conductive foam material and preparation method thereof

By combining vinyl-modified MXene with conductive fillers to form a three-dimensional skeleton network structure, the problem of uneven aggregation and dispersion of conductive fillers in flexible electronic devices is solved, thereby improving conductivity and flexibility.

CN121554826APending Publication Date: 2026-02-24GUANGZHOU BAIYUN CHEM IND +1
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Patent Information

Application Number
CN202511967416.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-24
Publication Date
2026-02-24

AI Technical Summary

Technical Problem

Excessive filling of conductive fillers in existing flexible electronic devices leads to aggregation and uneven dispersion, affecting conductivity, mechanical properties and flexibility.

Method used

Vinyl-modified MXene is combined with conductive fillers to form a conductive composite, which is then crosslinked with components in the silicone conductive foam material to form a three-dimensional skeleton network structure, thereby improving conductivity and flexibility.

Benefits of technology

The prepared organosilicon conductive foam material is lightweight, has excellent conductivity and flexibility, and good mechanical properties, solving the problems of conductive filler aggregation and uneven dispersion.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention belongs to the field of high polymer materials, and discloses vinyl modified MXene, a conductive compound, an organosilicon conductive foam material and a preparation method thereof, and the vinyl modified MXene is obtained by modifying MXene through vinyl silicone oil under the action of a catalyst. The vinyl modified MXene is mixed with a conductive filler to obtain a conductive compound, and when the conductive compound is added into the organic silicon conductive foam material containing alpha, omega-dihydroxy polydimethylsiloxane, hydrogen-containing silicone oil and hydroxyl silicone oil, the prepared organic silicon conductive foam material has the characteristics of light weight and good mechanical property; meanwhile, the conductive performance and the flexibility are excellent.
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Description

Technical Field

[0001] This invention belongs to the field of polymer materials, specifically relating to a vinyl-modified MXene, a conductive composite, an organosilicon conductive foam material, and a method for preparing the same. Background Technology

[0002] Foamed silicone rubber is a porous polymer material prepared by vulcanization and foaming of silicone rubber. It combines the advantages of ordinary silicone rubber and foamed materials, and has the characteristics of low density, good high and low temperature resistance, flame retardancy, cushioning and shock absorption, heat insulation and sound absorption, and resistance to compression deformation. Therefore, it has a wide range of application prospects.

[0003] With the diversification of flexible electronic products, flexible conductive materials have become a popular research direction. They possess advantages such as lightweight, flexibility, bendability, stretchability, and high conductivity, allowing them to transcend the physical limitations of traditional, rigid conductive materials. Traditional electronic devices, due to their rigid circuit structures, have limited practicality. The introduction of flexible electronics technology allows for applications in wearable electronics, flexible sensors, and flexible batteries. Furthermore, the structure of flexible circuits is evolving towards three-dimensional structures to adapt to more complex application requirements. However, current research faces challenges such as excessive conductive filler content, leading to filler aggregation, uneven dispersion, and discontinuous conductive pathways, thus affecting the conductivity, mechanical properties, and flexibility of flexible electronic devices. Summary of the Invention

[0004] The purpose of this invention is to provide a vinyl-modified MXene, which, when combined with conductive fillers, can effectively improve conductivity, mechanical properties, and flexibility when applied to silicone conductive foam materials.

[0005] The following technical solutions are used to achieve the above objectives.

[0006] The first aspect of the present invention provides a vinyl-modified MXene, which is obtained by modifying MXene with vinyl silicone oil under the action of a catalyst.

[0007] In some embodiments, the mass ratio of MXene to vinyl silicone oil is 1:1 to 3, preferably 1:1.5 to 2.2, and more preferably 1:1.8 to 2.2;

[0008] And / or, the vinyl silicone oil is a double-ended vinyl silicone oil;

[0009] And / or, the mass ratio of MXene to catalyst is 1:0.2%~0.8%;

[0010] And / or, the catalyst is a platinum catalyst;

[0011] And / or, the viscosity of the vinyl silicone oil is 50 mPa•s to 1000 mPa•s, preferably 50 mPa•s to 400 mPa•s, more preferably 280 mPa•s to 320 mPa•s.

[0012] In some embodiments, the MXene is prepared from titanium aluminum carbide; preferably, the preparation method of the MXene includes the following steps:

[0013] Titanium aluminum carbide was added to a mixed solution of lithium fluoride and concentrated hydrochloric acid, and stirred in a water bath at 40℃~50℃ for 20h~36h. After washing, centrifugation and freeze drying, the MXene was obtained.

[0014] Preferably, the ratio of titanium aluminum carbide, lithium fluoride and concentrated hydrochloric acid is 2g:2g~5g:10ml~15ml, and the molar concentration of the concentrated hydrochloric acid is 8M~11M.

[0015] A second aspect of the present invention provides a method for preparing the vinyl-modified MXene as described above, comprising the following steps:

[0016] Mix MXene, vinyl silicone oil, catalyst and solvent, heat to 60℃~70℃ under nitrogen protection, and reflux for 6h~10h. After the reaction is completed, remove the solvent and low-boiling substances to obtain the vinyl-modified MXene.

[0017] In some embodiments, the solvent is ethanol;

[0018] And / or, the mass ratio of MXene to solvent is 1:5~35.

[0019] A third aspect of the present invention provides a conductive composite obtained by combining a conductive filler with vinyl-modified MXene as described above.

[0020] In some embodiments, the conductive filler is at least one of nickel powder, silver powder, nickel-coated graphite powder, carbon black, and graphite, preferably silver powder;

[0021] And / or, the mass ratio of the conductive filler to vinyl-modified MXene is 1:2~7, preferably 1:4~5.

[0022] A fourth aspect of this invention provides an organosilicon conductive foam material, prepared from components A and B:

[0023] Based on mass percentage, component A comprises the following components:

[0024] α,ω-dihydroxypolydimethylsiloxane 20~50%

[0025] Conductive composite 20-60%

[0026] 5-55% filler

[0027] Hydrogen-containing silicone oil 5-30%

[0028] Inhibitors: 0.2-1.5%;

[0029] Based on mass percentage, component B comprises the following components:

[0030] α,ω-dihydroxypolydimethylsiloxane 20~50%

[0031] Conductive composite 20-65%

[0032] 5-55% filler

[0033] Hydroxy silicone oil 2~20%

[0034] Platinum catalyst 0.5-3%;

[0035] The conductive composite is as described above.

[0036] In some embodiments, the viscosity of the α,ω-dihydroxypolydimethylsiloxane is 8000 mpa•s to 150000 mpa•s;

[0037] And / or, the filler is at least one of the following: silica, calcium carbonate, aluminum hydroxide, silica powder, diatomaceous earth, organosilicon resin, silica, carbon black, graphite, nickel powder, silver powder, and nickel-coated graphite powder.

[0038] And / or, the hydrogen-containing silicone oil is a side-hydrogen-containing silicone oil; preferably, the viscosity of the side-hydrogen-containing silicone oil is 40cs~80cs, and the hydrogen content is 0.36%~1.6%;

[0039] And / or, the hydroxyl silicone oil is a double-hydroxyl-terminated silicone oil; preferably, the hydroxyl content in the double-hydroxyl-terminated silicone oil is 5% to 15%;

[0040] And / or, the inhibitor is at least one of 3-methyl-1-butyn-3-ol, 1-ethynyl-1-cyclohexanol, 3-methyl-1-pentyn-3-ol, 3-phenyl-1-butyn-3-ol and diethyl fumarate;

[0041] And / or, the platinum content in the platinum catalyst is 3000ppm~5000ppm;

[0042] And / or, the mass ratio of component A to component B is 1:0.8~1.2;

[0043] And / or, by mass percentage, component A comprises the following components:

[0044] α,ω-Dihydroxypolydimethylsiloxane 32~35%

[0045] Conductive composite 30-34%

[0046] 12-17% of filler

[0047] Hydrogen-containing silicone oil 16-20%

[0048] Inhibitors: 0.5-1.2%;

[0049] Based on mass percentage, component B comprises the following components:

[0050] α,ω-Dihydroxypolydimethylsiloxane 32~35%

[0051] Conductive composite 40-43%

[0052] 12-17% of filler

[0053] Hydroxy silicone oil 5~10%

[0054] Platinum catalyst 1-3%.

[0055] The fifth aspect of this invention provides a method for preparing the organosilicon conductive foam material as described above, the method comprising the following steps:

[0056] α,ω-dihydroxypolydimethylsiloxane, conductive composite and filler were added to a planetary mixer and stirred evenly under vacuum. Then, hydrogen-containing silicone oil and inhibitor were added to the planetary mixer and mixed under vacuum to remove bubbles, thus obtaining component A.

[0057] α,ω-dihydroxypolydimethylsiloxane, conductive composite and filler were added to a planetary mixer and stirred evenly under vacuum. Then hydroxyl silicone oil and platinum catalyst were added to the planetary mixer and mixed under vacuum to obtain component B.

[0058] In this invention, vinyl-modified MXene is obtained by modifying MXene with vinyl silicone oil. This vinyl-modified MXene is then mixed with conductive fillers to obtain a conductive composite. When this conductive composite is added to an organosilicon conductive foam material containing α,ω-dihydroxy polydimethylsiloxane, hydrogen-containing silicone oil, and hydroxyl silicone oil, on the one hand, the mixing of vinyl-modified MXene with conductive fillers allows the conductive fillers to be uniformly embedded in the surface of the vinyl-modified MXene skeleton and evenly distributed on the modified MXene surface. The conductive fillers, acting as spacers, increase the interlayer distance of the modified MXene, which helps alleviate problems such as conductive filler aggregation and uneven dispersion. On the other hand... Vinyl-modified MXene not only possesses a three-dimensional wrinkled porous system that can serve as a conductive and flexible substrate, but also has vinyl groups. Therefore, under the action of a catalyst, it can crosslink with hydrogen-containing silicone oil to form a three-dimensional skeletal network structure, improving mechanical properties and flexibility. Meanwhile, α,ω-dihydroxypolydimethylsiloxane, hydrogen-containing silicone oil, and hydroxyl silicone oil react to dehydrogenate and generate pores. These pores are uniformly distributed within the skeletal structure of α,ω-dihydroxypolydimethylsiloxane, preparing a low-density foam material. The conductive composite obtained by combining conductive filler and modified MXene can form a three-dimensional interconnected conductive network on the surface of the pore walls, thus significantly improving the conductivity of the foam material. Therefore, the prepared organosilicon conductive foam material not only possesses lightweight and good mechanical properties, but also excellent conductivity and flexibility. Detailed Implementation

[0059] To facilitate understanding of the present invention, a more complete description will be provided below. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the present invention.

[0060] Unless otherwise specified, experimental methods in the following examples are generally performed under standard conditions or as recommended by the manufacturer. All commonly used chemical reagents used in the examples are commercially available products.

[0061] Unless otherwise defined, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used in this invention includes any and all combinations of one or more of the associated listed items.

[0062] The present invention will be described below with reference to specific embodiments.

[0063] Example 1

[0064] This embodiment provides an organosilicon conductive foam material, the preparation method of which includes the following steps:

[0065] (1) 2g of titanium aluminum carbide (Ti3AlC2) was slowly added to a mixed solution of 2g of lithium fluoride and 12mL of concentrated hydrochloric acid (9.5M). The mixture was stirred in a water bath at 45℃ for 24 hours, washed, centrifuged, and freeze-dried to obtain MXene.

[0066] Add 2g MXene, 3g dual-terminated vinyl silicone oil (viscosity 100mpa•s), 8mg platinum catalyst and 25mL ethanol to a three-necked flask, heat to 65℃ under nitrogen protection, reflux for 8 hours, and remove solvent and low-boiling substances by vacuum distillation after the reaction to obtain vinyl-modified MXene.

[0067] Take 0.5g of nickel-coated graphite powder (Ni@C) and 2g of vinyl-modified MXene, add them to 20mL of deionized water, mix and stir for 30 minutes, and freeze dry to obtain Ni@C / modified MXene conductive composite.

[0068] (2) By mass percentage, 30% α,ω-dihydroxypolydimethylsiloxane (viscosity 80000 mpa•s), 46.5% Ni@C / modified MXene conductive composite, and 8% fumed silica were added to a planetary mixer and stirred uniformly under vacuum. Then, 15% hydrogen-containing silicone oil (viscosity 56.03 cs, hydrogen content 1.25%) and 0.5% inhibitor (3-methyl-1-pentyn-3-ol) were added to the planetary mixer and mixed under vacuum to remove bubbles, thus obtaining component A.

[0069] 30% α,ω-dihydroxypolydimethylsiloxane (viscosity 80000 mpa•s), 52.5% Ni@C / modified MXene conductive composite, and 8% fumed silica were added to a planetary mixer and stirred uniformly under vacuum. Then, 8% double-hydroxyl-terminated silicone oil (hydroxyl content 8%) and 1.5% platinum catalyst (platinum content 3200 ppm) were added to the planetary mixer, and the mixture was degassed and mixed under vacuum to obtain component B.

[0070] Mix components A and B in a 1:1 mass ratio until homogeneous, pour into a mold of fixed volume and allow to foam at room temperature.

[0071] Example 2:

[0072] This embodiment provides an organosilicon conductive foam material, the preparation method of which includes the following steps:

[0073] (1) The preparation method of Ni@C / modified MXene conductive composite is the same as that in Example 1.

[0074] (2) By mass percentage, 36% α,ω-dihydroxypolydimethylsiloxane (viscosity 80000 mpa•s), 37.5% Ni@C / modified MXene conductive composite, and 10% calcium carbonate were added to a planetary mixer and stirred evenly under vacuum. Then, 16% hydrogen-containing silicone oil (viscosity 56.03 cs, hydrogen content 1.25%) and 0.5% inhibitor (1-ethynyl-1-cyclohexanol) were added to the planetary mixer and mixed under vacuum to remove bubbles, thus obtaining component A.

[0075] 36% α,ω-dihydroxypolydimethylsiloxane (viscosity 80000 mpa•s), 45% Ni@C / modified MXene conductive composite, and 10% calcium carbonate were added to a planetary mixer and stirred uniformly under vacuum. Then, 8% double-hydroxyl-terminated silicone oil (hydroxyl content 8%) and 1% platinum catalyst (platinum content 3200 ppm) were added to the planetary mixer, and the mixture was degassed and mixed under vacuum to obtain component B. Components A and B were mixed uniformly at a mass ratio of 1:1 and poured into a mold of fixed volume for foaming at room temperature.

[0076] Example 3:

[0077] This embodiment provides an organosilicon conductive foam material, the preparation method of which includes the following steps:

[0078] (1) 2g Ti3AlC2 was slowly added to a mixed solution of 2g lithium fluoride and 12mL concentrated hydrochloric acid (9.5M), stirred for 24 hours in a water bath at 45℃, washed, centrifuged, and freeze-dried to obtain MXene.

[0079] Add 2g MXene, 3g dual-terminated vinyl silicone oil (viscosity 50mpa•s), 10mg platinum catalyst and 30mL ethanol to a three-necked flask, heat to 65℃ under nitrogen protection, reflux for 8 hours, and remove solvent and low-boiling substances by vacuum distillation after the reaction to obtain vinyl-modified MXene.

[0080] Take 0.7g Ni@C and 2g vinyl-modified MXene and add them to 20mL of deionized water. Mix and stir for 30 minutes, then freeze-dry to obtain Ni@C / modified MXene conductive composite.

[0081] (2) By mass percentage, 25% α,ω-dihydroxypolydimethylsiloxane (viscosity 20000 mpa•s), 56.5% Ni@C / modified MXene conductive composite, and 6% silica powder were added to a planetary mixer and stirred uniformly under vacuum. Then, 12% hydrogen-containing silicone oil (viscosity 56.03 cs, hydrogen content 1.25%) and 0.5% inhibitor (3-methyl-1-butyn-3-ol) were added to the planetary mixer and mixed under vacuum to remove bubbles, thus obtaining component A.

[0082] 25% α,ω-dihydroxypolydimethylsiloxane (viscosity 20000 mpa•s), 62% Ni@C / modified MXene conductive composite, and 6% silica powder were added to a planetary mixer and stirred uniformly under vacuum. Then, 6% double-hydroxyl-terminated silicone oil (hydroxyl content 8%) and 1% platinum catalyst (platinum content 3200 ppm) were added to the planetary mixer, and the mixture was degassed and mixed under vacuum to obtain component B.

[0083] Mix components A and B in a 1:1 mass ratio until homogeneous, pour into a mold of fixed volume and allow to foam at room temperature.

[0084] Example 4:

[0085] (1) 2g Ti3AlC2 was slowly added to a mixed solution of 2g lithium fluoride and 12mL concentrated hydrochloric acid (9.5M), stirred for 24 hours in a water bath at 45℃, washed, centrifuged, and freeze-dried to obtain MXene.

[0086] 2g MXene, 4g dual-terminated vinyl silicone oil (viscosity 300mpa•s), 12mg platinum catalyst and 40mL ethanol were added to a three-necked flask and heated to 65℃ under nitrogen protection. The mixture was refluxed for 10 hours. After the reaction was completed, the solvent and low-boiling substances were removed by vacuum distillation to obtain vinyl-modified MXene.

[0087] Take 0.4g of silver powder and 2g of vinyl-modified MXene, add them to 20mL of deionized water, mix and stir for 30 minutes, and freeze dry to obtain Ag / modified MXene conductive composite.

[0088] (2) 34% α,ω-dihydroxypolydimethylsiloxane (viscosity 80000 mpa•s), 32% Ag / modified MXene conductive composite, and 15% fumed silica were added to a planetary mixer and stirred evenly under vacuum. Then, 18% hydrogen-containing silicone oil (viscosity 56.03 cs, hydrogen content 1.25%) and 1% inhibitor (1-ethynyl-1-cyclohexanol) were added to the planetary mixer and mixed under vacuum to remove bubbles, thus obtaining component A.

[0089] 34% α,ω-dihydroxypolydimethylsiloxane (viscosity 80000 mpa•s), 41% Ag / modified MXene conductive composite, and 15% fumed silica were added to a planetary mixer and stirred uniformly under vacuum. Then, 8% double-hydroxyl-terminated silicone oil (hydroxyl content 8%) and 2% platinum catalyst (platinum content 3200 ppm) were added to the planetary mixer, and the mixture was degassed and mixed under vacuum to obtain component B.

[0090] Mix components A and B in a 1:1 mass ratio until homogeneous, pour into a mold of fixed volume and allow to foam at room temperature.

[0091] Comparative Example 1

[0092] This comparative example provides an organosilicon conductive foam material, the preparation method of which includes the following steps:

[0093] (1) 2g Ti3AlC2 was slowly added to a mixed solution of 2g lithium fluoride and 12mL concentrated hydrochloric acid (9.5M), stirred for 24 hours in a water bath at 45℃, washed, centrifuged, and freeze-dried to obtain MXene.

[0094] Take 0.5g Ni@C and 2g MXene, add them to 20mL of deionized water, mix and stir for 30 minutes, and freeze dry to obtain Ni@C / MXene conductive composite.

[0095] (2) The preparation methods of components A and B in this comparative example are the same as those in Example 1, except that the Ni@C / modified MXene conductive composite in components A and B is replaced with the Ni@C / MXene conductive composite described above.

[0096] Mix components A and B in a 1:1 mass ratio until homogeneous, pour into a mold of fixed volume and allow to foam at room temperature.

[0097] Comparative Example 2

[0098] This comparative example provides an organosilicon conductive foam material, the preparation method of which includes the following steps:

[0099] (1) The preparation method of Ni@C / MXene conductive composite is the same as step (1) in Comparative Example 1.

[0100] (2) 30% α,ω-dihydroxypolydimethylsiloxane (viscosity 80000 mpa•s), 14.88% double-ended vinyl silicone oil (viscosity 1000 mpa•s), 31.62% Ni@C / MXene, and 8% fumed silica were added to a planetary mixer and stirred evenly under vacuum. Then, 15% side-containing hydrogen silicone oil (viscosity 56.03 cs, hydrogen content 1.25%) and 0.5% inhibitor (3-methyl-1-pentyn-3-ol) were added to the planetary mixer and mixed under vacuum to remove bubbles, thus obtaining component A.

[0101] 30% α,ω-dihydroxypolydimethylsiloxane (viscosity 80000 mPa·s), 16.8% double-ended vinyl silicone oil (viscosity 1000 mPa·s), 35.7% Ni@C / MXene, and 8% fumed silica were added to a planetary mixer and stirred uniformly under vacuum. Then, 8% double-ended hydroxyl silicone oil (hydroxyl content 8%) and 1.5% platinum catalyst (platinum content 3200 ppm) were added to the planetary mixer, and the mixture was degassed and mixed under vacuum to obtain component B.

[0102] Mix components A and B in a 1:1 mass ratio until homogeneous, pour into a mold of fixed volume and allow to foam at room temperature.

[0103] Comparative Example 3

[0104] This comparative example provides an organosilicon conductive foam material, the preparation method of which includes the following steps:

[0105] By weight percentage, 30% α,ω-dihydroxypolydimethylsiloxane (viscosity 20000 mPa·s), 14.88% double-ended vinyl silicone oil (viscosity 1000 mPa·s), 31.62% Ni@C, and 8% fumed silica were added to a planetary mixer and stirred uniformly under vacuum. Then, 15% side-containing hydrogen silicone oil (viscosity 56.03 cs, hydrogen content 1.25%) and 0.5% inhibitor (3-methyl-1-pentyn-3-ol) were added to the planetary mixer, and the mixture was degassed and mixed under vacuum to obtain component A.

[0106] 30% α,ω-dihydroxypolydimethylsiloxane (viscosity 20000 mPa·s), 16.8% double-ended vinyl silicone oil (viscosity 1000 mPa·s), 35.7% Ni@C, and 8% fumed silica were added to a planetary mixer and stirred uniformly under vacuum. Then, 8% double-ended hydroxyl silicone oil (hydroxyl content 8%) and 1.5% platinum catalyst (platinum content 3200 ppm) were added to the planetary mixer and mixed under vacuum to remove bubbles, thus obtaining component B.

[0107] Mix components A and B in a 1:1 mass ratio until homogeneous, pour into a mold of fixed volume and allow to foam at room temperature.

[0108] Comparative Example 4

[0109] This comparative example provides an organosilicon conductive foam material, the preparation method of which includes the following steps: compared with Example 1, the difference is that the vinyl silicone oil in step (1) is replaced with double-terminated vinyl dimethyl ethoxysilane.

[0110] The other steps are the same as in Example 1.

[0111] The performance of the silicone conductive foam materials in the examples and comparative examples was tested. Apparent density was measured according to GB / T 6343—2009; tensile strength was measured according to GB / T 528—2009; elongation at break was measured according to GB / T 528—2009; electrical resistance at room temperature was measured according to GB / T 1410—2006; flexibility was assessed by bending the prepared foam material strips 180° to observe whether they would break, with "0" indicating breakage and "1" indicating no breakage. The test results are shown in the table below:

[0112]

[0113] The results from Examples 1-4 and Comparative Examples 1-3 show that modifying MXene with vinyl silicone oil to obtain vinyl-modified MXene, and mixing this vinyl-modified MXene with conductive fillers to obtain a conductive composite, results in a flexible silicone conductive foam material with significant improvements in lightweighting, mechanical properties, conductivity, and flexibility. Example 4 exhibits the best overall performance.

[0114] As can be seen from the results of Examples 1-3, increasing the content of conductive composite can effectively improve the conductivity of foamed silicone rubber. However, as the three-dimensional conductive pathway becomes more complete, the resistance change is relatively gradual. Adding too much conductive composite will not significantly change the conductivity.

[0115] As can be seen from the results of Example 1 and Comparative Examples 1-2, vinyl-modified MXene crosslinks to form a three-dimensional skeleton network structure through hydrosilylation reaction. When mixed with conductive fillers, the conductive fillers can be uniformly embedded in the surface of the vinyl-modified MXene skeleton. Compared with using unmodified MXene mixed with conductive fillers, it can more effectively improve the mechanical properties and flexibility of silicone conductive foam materials, and the conductivity is better.

[0116] The results of Example 1 and Comparative Example 3 show that pre-mixing the conductive filler with modified MXene before adding it to the colloid helps to alleviate the aggregation of the conductive filler in the colloid, effectively limiting the deformation of the silicone rubber molecular chains, thereby improving the mechanical properties of the foamed silicone rubber. Simultaneously, the conductive composite formed by the conductive filler / modified MXene creates three-dimensional interconnected conductive pathways on the surface of the cell walls, significantly improving the conductivity of the foamed silicone rubber.

[0117] As can be seen from the results of Example 1 and Comparative Example 4, the molecular chain of vinyldimethylethoxysilane is shorter, and the resulting organosilicon conductive foam material is more brittle. Its mechanical properties, electrical properties and flexibility are not as good as those of Example 1.

[0118] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0119] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A vinyl-modified MXene, characterized in that, The vinyl-modified MXene is obtained by modifying MXene with vinyl silicone oil under the action of a catalyst.

2. The vinyl-modified MXene as described in claim 1, characterized in that, The mass ratio of MXene to vinyl silicone oil is 1:1 to 3, preferably 1:1.5 to 2.2, and more preferably 1:1.8 to 2.2; And / or, the vinyl silicone oil is a double-ended vinyl silicone oil; And / or, the mass ratio of MXene to catalyst is 1:0.2%~0.8%; And / or, the catalyst is a platinum catalyst; And / or, the viscosity of the vinyl silicone oil is 50 mPa•s to 1000 mPa•s, preferably 50 mPa•s to 400 mPa•s, more preferably 280 mPa•s to 320 mPa•s.

3. The vinyl-modified MXene according to any one of claims 1-2, characterized in that, The MXene is prepared from titanium aluminum carbide as a raw material; preferably, the preparation method of the MXene includes the following steps: Titanium aluminum carbide was added to a mixed solution of lithium fluoride and concentrated hydrochloric acid, and stirred in a water bath at 40℃~50℃ for 20h~36h. After washing, centrifugation and freeze drying, the MXene was obtained. Preferably, the ratio of titanium aluminum carbide, lithium fluoride and concentrated hydrochloric acid is 2g:2g~5g:10ml~15ml, and the molar concentration of the concentrated hydrochloric acid is 8M~11M.

4. A method for preparing vinyl-modified MXene according to any one of claims 1-3, characterized in that, Includes the following steps: Mix MXene, vinyl silicone oil, catalyst and solvent, heat to 60℃~70℃ under nitrogen protection, and reflux for 6h~10h. After the reaction is completed, remove the solvent and low-boiling substances to obtain the vinyl-modified MXene.

5. The preparation method according to claim 4, characterized in that, The solvent is ethanol; And / or, the mass ratio of MXene to solvent is 1:5~35.

6. A conductive composite, characterized in that, The conductive composite is obtained by combining a conductive filler with vinyl-modified MXene as described in any one of claims 1-3.

7. The conductive composite according to claim 6, characterized in that, The conductive filler is at least one of nickel powder, silver powder, nickel-coated graphite powder, carbon black, and graphite, preferably silver powder; And / or, the mass ratio of the conductive filler to vinyl-modified MXene is 1:2~7, preferably 1:4~5.

8. An organosilicon conductive foam material, characterized in that, It is prepared from components A and B: Based on mass percentage, component A comprises the following components: α,ω-dihydroxypolydimethylsiloxane 20~50% Conductive composite 20-60% 5-55% filler Hydrogen-containing silicone oil 5-30% Inhibitors: 0.2-1.5%; Based on mass percentage, component B comprises the following components: α,ω-dihydroxypolydimethylsiloxane 20~50% Conductive composite 20-65% 5-55% filler Hydroxy silicone oil 2~20% Platinum catalyst 0.5-3%; The conductive composite is the conductive composite according to any one of claims 6-7.

9. The organosilicon conductive foam material as described in claim 8, characterized in that, The viscosity of the α,ω-dihydroxypolydimethylsiloxane is 8000 mpa•s to 150000 mpa•s; And / or, the filler is at least one of the following: silica, calcium carbonate, aluminum hydroxide, silica powder, diatomaceous earth, organosilicon resin, silica, carbon black, graphite, nickel powder, silver powder, and nickel-coated graphite powder. And / or, the hydrogen-containing silicone oil is a side-hydrogen-containing silicone oil; preferably, the viscosity of the side-hydrogen-containing silicone oil is 40cs~80cs, and the hydrogen content is 0.36%~1.6%; And / or, the hydroxyl silicone oil is a double-hydroxyl-terminated silicone oil; preferably, the hydroxyl content in the double-hydroxyl-terminated silicone oil is 5% to 15%; And / or, the inhibitor is at least one of 3-methyl-1-butyn-3-ol, 1-ethynyl-1-cyclohexanol, 3-methyl-1-pentyn-3-ol, 3-phenyl-1-butyn-3-ol and diethyl fumarate; And / or, the platinum content in the platinum catalyst is 3000ppm~5000ppm; And / or, the mass ratio of component A to component B is 1:0.8~1.2; And / or, by mass percentage, component A comprises the following components: α,ω-Dihydroxypolydimethylsiloxane 32~35% Conductive composite 30-34% 12-17% of filler Hydrogen-containing silicone oil 16-20% Inhibitors: 0.5-1.2%; Based on mass percentage, component B comprises the following components: α,ω-Dihydroxypolydimethylsiloxane 32~35% Conductive composite 40-43% 12-17% of filler Hydroxy silicone oil 5~10% Platinum catalyst 1-3%.

10. A method for preparing the organosilicon conductive foam material according to any one of claims 8-9, characterized in that, The preparation method includes the following steps: α,ω-dihydroxypolydimethylsiloxane, conductive composite and filler were added to a planetary mixer and stirred evenly under vacuum. Then, hydrogen-containing silicone oil and inhibitor were added to the planetary mixer and mixed under vacuum to remove bubbles, thus obtaining component A. α,ω-dihydroxypolydimethylsiloxane, conductive composite and filler were added to a planetary mixer and stirred evenly under vacuum. Then hydroxyl silicone oil and platinum catalyst were added to the planetary mixer and mixed under vacuum to obtain component B.