Hemispherical harmonic oscillator leveling device

Abstract

The hemispherical harmonic oscillator leveling device comprises a vacuum cavity and a sample feeding and taking mechanism, the vacuum cavity is provided with a process chamber, a plurality of ion sources are arranged on the vacuum cavity, the emitting ends of the ion sources extend into the process chamber, the sample feeding and taking mechanism comprises a sealing cover and a sample feeding and taking rod, the sealing cover is detachably connected to the upper end of the vacuum cavity in a sealed mode, and the sample feeding and taking rod is connected to the lower end of the vacuum cavity. The vacuum cavity is provided with a sample feeding and taking channel communicated with the process chamber and the inner cavity of the sealing cover, the vacuum cavity is further provided with a sample bin gate valve capable of extending into the sample feeding and taking channel to disconnect the communication of the process chamber and the inner cavity of the sealing cover, and the sample feeding and taking rod penetrates through the sealing cover, is in dynamic sealing connection with the sealing cover and can move up and down relative to the sealing cover; the hemispherical harmonic oscillator is detachably connected to the lower end of the sample feeding and taking rod. The device can realize full-area, high-efficiency, high-precision and damage-free ion beam quality modification and shape modification of the outer surface of the hemispherical resonator, and meets the manufacturing requirements of hemispherical resonator gyroscopes with the precision above the navigation level.

Description

Technical Field

[0001] This invention relates to the field of inertial navigation technology, and more specifically to a hemispherical harmonic oscillator leveling device. Background Technology

[0002] A hemispherical resonator gyroscope is a high-precision, high-reliability, and long-life inertial sensor. Its core component is a hemispherical resonator made of fused silica, which is excited at its natural frequency to generate four-wave antinode standing wave oscillations. The performance of a hemispherical resonator gyroscope depends on the perfect symmetry of the hemispherical resonator's geometry and the consistency of its vibration frequency. Any minute mass or uneven frequency distribution, i.e., frequency splitting, will cause a sharp decrease in the gyroscope's accuracy. Therefore, during the manufacturing process, the shaped hemispherical resonator must undergo nanometer- or even atomic-level precision shaping to eliminate its inherent frequency splitting.

[0003] To address this, the industry has explored and developed various leveling technologies. The earliest was chemical leveling, which uses a hydrofluoric acid solution to react with fused silica to remove material. While this method eliminates mechanical stress, its isotropic corrosion leads to severe lateral erosion, poor edge steepness, and low morphology control accuracy. Furthermore, chemical residues easily contaminate the surface of the hemispherical harmonic oscillator, significantly increasing energy loss and drastically reducing the quality factor, thus failing to meet the requirements of high-precision gyroscopes. Later, laser leveling technology was developed. This technology uses a high-energy pulsed laser focused on the workpiece surface, causing localized material to melt, vaporize, and be removed instantaneously. Laser processing offers advantages such as non-contact operation, high efficiency, and ease of programming control. However, the inherent thermal processing properties of lasers lead to a series of drawbacks that cannot be ignored: First, laser ablation produces a significant heat-affected zone, causing phase transformation, remelting, or even microcracks in the material, introducing thermal stress; second, the molten debris generated by ablation will redeposit on the workpiece surface, forming rough particles and defects; most importantly, these thermal operations and surface defects will become centers of vibrational energy dissipation, severely degrading the Q value of the hemispherical harmonic oscillator, thus fundamentally limiting the performance accuracy of HRG.

[0004] In summary, both chemical leveling and laser leveling technologies introduce irreversible physical or chemical damage during processing, leading to a decline in the performance of the resonator itself, making them unsuitable for manufacturing high-performance hemispherical resonator gyroscopes for navigation and strategic applications. Summary of the Invention

[0005] To address the problems in the background technology, this invention proposes a hemispherical resonator leveling device, which aims to solve the technical bottlenecks such as ion beam obstruction, poor processing uniformity, and low efficiency in the processing of hemispherical resonators by general ion beam platforms. It achieves high-efficiency, high-precision, and damage-free ion beam quality and shape repair of the entire outer surface of the hemispherical resonator, meeting the manufacturing requirements of hemispherical resonator gyroscopes with navigation-grade and higher precision.

[0006] The present invention adopts the following technical solution: A hemispherical resonator leveling device includes a vacuum chamber and a sampling mechanism. The vacuum chamber has a process chamber and multiple ion sources are provided on it. The emitting end of the ion source extends into the process chamber. The ion source includes a horizontal ion source and an inclined ion source. The horizontal ion source is arranged horizontally and its ion source beam outlet axis is parallel to the substrate stage plane in the process chamber. The inclined ion source is arranged at an angle and its ion beam outlet axis forms a set angle with the substrate stage plane. The sampling mechanism includes a sealing cover and a sampling rod. The sealing cover is detachably and sealed to the upper end of the vacuum chamber. The vacuum chamber has a sampling channel that connects the process chamber and the inner cavity of the sealing cover. The vacuum chamber is also equipped with a sample chamber gate valve, which can extend into the sampling channel to disconnect the process chamber and the inner cavity of the sealing cover. The sampling rod passes through the sealing cover and is dynamically sealed to the sealing cover. It can move up and down relative to the sealing cover. The hemispherical resonator can be detached from the lower end of the sampling rod. The sampling rod can be moved down to deliver the hemispherical resonator to the substrate stage plane inside the process chamber.

[0007] As a further improvement to the above technical solution: It also includes a sampling chamber, which is sealed to the upper end of the vacuum chamber and communicates with the inner cavity of the process chamber and the sealing cover. The inner cavity of the sampling chamber forms the sampling channel, and a sampling chamber gate valve is provided on the sampling chamber.

[0008] The hemispherical resonator can be detached from the lower end of the sampling rod via a clamping mechanism. Multiple extension rods are circumferentially spaced on the lower sidewall of the clamping mechanism, extending radially outward along the hemispherical resonator. A locking cover is located at the lower part of the sampling rod, with multiple receiving slots on the lower inner sidewall of the locking cover. Each receiving slot corresponds to one of the extension rods. Multiple telescopic structures, including steel balls and springs, are located within the receiving slots. One end of the spring is connected to the locking cover, and the other end is connected to the steel ball, with the steel ball extending beyond the receiving slot. When the clamping mechanism extends into the locking cover, the extension rod abuts against the corresponding steel ball, pressing the steel ball into the receiving slot and compressing the corresponding spring, thereby detaching the clamping mechanism from the sampling rod.

[0009] The bottom surface of the clamping mechanism is provided with a threaded hole, and the process chamber is provided with a piezoelectric ceramic seat. The top surface of the piezoelectric ceramic seat is provided with a threaded post that mates with the threaded hole. The sampling rod can also rotate axially relative to the sealing cover until the threaded post is connected to the clamping mechanism by a thread.

[0010] The clamping mechanism includes a base, a positioning sleeve, and a flexible clamping cylinder. The top surface of the base has a tapered hole that is wider at the top and narrower at the bottom. The flexible clamping cylinder has a central through hole that mates with the anchor rod inside the hemispherical resonator. The flexible clamping cylinder has multiple circumferential slots that extend downwards through the lower end face of the flexible clamping cylinder and inwards to communicate with the central through hole, thus dividing the lower part of the flexible clamping cylinder into multiple clamping blocks. The positioning sleeve, from top to bottom, has a first hole that mates with the anchor rod inside the hemispherical resonator, a second hole that mates with the outer circle of the flexible clamping cylinder, and a third hole that mates with the anchor rod inside the hemispherical resonator. The second hole and the third hole that mates with the upper part of the base are connected. The upper part of the base is fitted into the third hole, the upper part of the flexible clamp is fitted into the second hole, and its lower part is set in the conical hole. The inner anchor rod of the hemispherical resonator is inserted into the first hole and then extends into the central through hole. During the process of the positioning sleeve moving down relative to the base to drive the flexible clamp to move down, the outer wall of the flexible clamp is squeezed by the hole wall of the conical hole, so that its clamping block gathers inward to hold the inner anchor rod of the hemispherical resonator tightly. The threaded hole is opened on the lower end face of the base.

[0011] The upper part of the outer circumferential wall of the base has an external thread, and the third hole wall of the positioning sleeve has an internal thread that mates with the external thread. The positioning sleeve is threadedly connected to the base. The outer wall of the positioning sleeve is marked with angular scale.

[0012] The top of the sampling chamber is equipped with a clamp that detachably connects the sampling rod to the sealing cover.

[0013] It also includes a moving mechanism, which includes a drive assembly and a moving rod. The drive assembly is located on the outer wall of the vacuum chamber. One end of the moving rod is connected to the drive assembly for transmission, and the other end extends into the process chamber and is connected to the piezoelectric ceramic seat through a conductive slip ring. The moving rod is dynamically sealed to the vacuum chamber. The drive assembly is used to drive the moving rod to move up and down and rotate axially.

[0014] The drive assembly includes a linear drive structure and a rotary drive structure. The linear drive structure is located on the outer wall of the vacuum cavity, and the rotary drive structure is located on the linear drive structure. The moving rod is connected to the rotary drive structure for transmission. The linear drive structure is used to drive the rotary drive structure to move up and down, and the rotary drive structure is used to drive the moving rod to move up and down.

[0015] The vacuum chamber is equipped with an exhaust channel that connects the process chamber and the exhaust equipment. The vacuum chamber is also equipped with a main gate valve that can extend into the exhaust channel to disconnect the process chamber and the exhaust equipment.

[0016] Compared with the prior art, the advantages of the present invention are as follows: The dual-ion-source precision leveling device for hemispherical resonator leveling of this invention can solve the technical bottlenecks of ion beam obstruction, poor processing uniformity, and low efficiency in the processing of hemispherical resonators by general ion beam platforms. It achieves high-efficiency, high-precision, and non-destructive ion beam finishing and shaping of the entire outer surface of the hemispherical resonator, meeting the manufacturing requirements of hemispherical resonator gyroscopes with precision of navigation grade or higher. Furthermore, by setting a sample chamber gate valve to disconnect the sample delivery and sampling channel from the process chamber, this design allows for the removal of the sealing cover for workpiece loading and unloading while maintaining a high vacuum in the process chamber, as well as pre-vacuuming after installing the sealing cover, greatly improving the production efficiency and vacuum stability of the equipment. Attached Figure Description

[0017] To facilitate understanding of the invention, it will be described in more detail with reference to the specific embodiments shown in the accompanying drawings. These drawings depict only typical embodiments of the invention and should not be considered as limiting the scope of protection of the invention.

[0018] Figure 1 This is a schematic diagram of the front view of the hemispherical harmonic oscillator leveling device of the present invention.

[0019] Figure 2 This is a cross-sectional structural diagram of the sampling mechanism.

[0020] Figure 3 A schematic diagram of the cross-sectional structure of the clamping mechanism holding the hemispherical harmonic oscillator.

[0021] Figure 4 A schematic diagram of the three-dimensional structure for holding a hemispherical harmonic oscillator by a clamping mechanism.

[0022] Figure 5 This is a cross-sectional structural diagram of the positioning sleeve.

[0023] Figure 6 This is a cross-sectional schematic diagram of the clamping mechanism suspended on the sampling mechanism.

[0024] Figure 7 This is a cross-sectional structural schematic diagram of the hemispherical harmonic oscillator leveling device of the present invention (initial sample delivery state).

[0025] Figure 8 This is a cross-sectional structural schematic diagram of the hemispherical harmonic oscillator leveling device of the present invention (sample delivery state).

[0026] Figure 9 This is a cross-sectional structural diagram of the hemispherical harmonic oscillator leveling device of the present invention (sample delivery completed).

[0027] Figure 10 This is a schematic cross-sectional view of a hemispherical harmonic oscillator tuned using a transverse ion source.

[0028] Figure 11This is a schematic cross-sectional view of a hemispherical harmonic oscillator being polished using a tilted ion source.

[0029] Figure label: 1. Vacuum chamber; 101. Process chamber; 102. Sampling channel; 103. Exhaust channel; 2. Lateral ion source; 3. Inclined ion source; 4. Linear drive structure; 5. Rotary drive structure; 6. Sampling chamber; 7. Sampling mechanism; 71. Sealing cover; 72. Locking cover; 73. Sampling rod; 74. Clamp; 77. Telescopic structure; 8. Moving rod; 10. Main gate valve; 11. Sample chamber gate valve; 12. Piezoelectric ceramic seat; 121. Threaded column; 13. Conductive slip ring; 14. Clamping mechanism; 141. Base; 1411. Conical hole; 142. Positioning sleeve; 1421. First hole; 1422. Second hole; 1423. Third hole; 1424. Angle scale marking; 143. Flexible clamp; 1431. Central through hole; 144. Extension rod; 145. Threaded hole. Detailed Implementation

[0030] The embodiments of the present invention are described below with reference to the accompanying drawings to enable those skilled in the art to better understand and implement the present invention. However, the listed embodiments are not intended to limit the present invention. In the absence of conflict, the following embodiments and the technical features in the embodiments can be combined with each other, wherein the same components are indicated by the same reference numerals.

[0031] like Figures 1-11 As shown, this embodiment provides a hemispherical resonator leveling device, including a vacuum chamber 1 and a sampling mechanism 7. The vacuum chamber 1 has a process chamber 101, and multiple ion sources are provided on it. The emitting end of the ion source extends into the process chamber 101. The ion source includes a horizontal ion source 2 and an inclined ion source 3. The horizontal ion source 2 is arranged horizontally, and its ion source beam outlet axis is parallel to the substrate stage plane in the process chamber 101. The inclined ion source 3 is arranged inclined, and its ion beam outlet axis forms a set angle with the substrate stage plane. The sampling mechanism 7 includes a sealing cover 71 and a sampling rod 73. The sealing cover 71 is detachably and sealed to the upper end of the vacuum chamber 1. The vacuum chamber 1 has a sampling channel that connects the process chamber 101 and the inner cavity of the sealing cover 71. The vacuum chamber 1 is also provided with a sample chamber gate valve 11, which can extend into the sampling channel to disconnect the process chamber 101 and the inner cavity of the sealing cover 71. The sampling rod 73 passes through the sealing cover 71 and is dynamically sealed to the sealing cover 71. It can move up and down relative to the sealing cover 71. The hemispherical resonator 15 can be detached from the lower end of the sampling rod 73. The sampling rod 73 can be moved down to deliver the hemispherical resonator 15 to the substrate stage plane in the process chamber 101.

[0032] The aforementioned dual-ion-source precision leveling device for hemispherical resonator leveling overcomes the technical bottlenecks of general-purpose ion beam platforms in processing hemispherical resonators, such as ion beam obstruction, poor processing uniformity, and low efficiency. It achieves high-efficiency, high-precision, and damage-free ion beam finishing and shaping of the entire outer surface of the hemispherical resonator, meeting the manufacturing requirements of navigation-grade and higher precision hemispherical resonator gyroscopes. Furthermore, by setting a sample chamber gate valve to disconnect the sample delivery / receiving channel from the process chamber, this design allows for the removal of the sealing cover for workpiece loading and unloading while maintaining a high vacuum in the process chamber, as well as pre-vacuuming after installing the sealing cover, greatly improving the equipment's production efficiency and vacuum stability.

[0033] In this embodiment, a sampling chamber 6 is also included. The sampling chamber 6 is sealed to the upper end of the vacuum chamber 1 and is connected to the inner cavity of the process chamber 101 and the sealing cover 71. The inner cavity of the sampling chamber 6 forms a sampling channel, and the sample chamber gate valve 11 is provided on the sampling chamber 6.

[0034] By adding a sampling chamber that connects the sealing cover and the process chamber, it is convenient to install a high-vacuum gate valve and to pre-vacuum the sampling chamber.

[0035] In this embodiment, the hemispherical resonator can be detached from the lower end of the sampling rod 73 via the clamping mechanism 14. The lower sidewall of the clamping mechanism 14 is provided with multiple extension rods 144 spaced circumferentially. The extension rods 144 extend radially outward along the hemispherical resonator. The lower part of the sampling rod 73 is provided with a locking cover 72. The lower part of the inner sidewall of the locking cover 72 is provided with multiple receiving slots. The multiple receiving slots correspond one-to-one with the multiple extension rods 144. Multiple telescopic structures 77 are provided in the receiving slots. The telescopic structure 77 includes a steel ball and a spring. One end of the spring is connected to the locking cover 72, and the other end is connected to the steel ball. The steel ball extends out of the receiving slot. When the clamping mechanism 14 extends into the locking cover 72, the extension rod 144 abuts against the corresponding steel ball and presses the steel ball into the receiving slot, and compresses the corresponding spring, thereby detaching the clamping mechanism 14 from the sampling rod 73.

[0036] Therefore, when no external force is applied to the clamping mechanism, it can remain suspended at the lower end of the sampling rod without falling off. When the sampling rod delivers the clamping mechanism holding the hemispherical resonator to the process chamber, and the clamping mechanism is connected to the fixture in the process chamber, the clamping mechanism can be disengaged from the sampling rod by pulling it up.

[0037] In this embodiment, the bottom surface of the clamping mechanism 14 is provided with a threaded hole 145, the process chamber 101 is provided with a piezoelectric ceramic seat 12, the top surface of the piezoelectric ceramic seat 12 is provided with a threaded post 121 that mates with the threaded hole 145, and the sampling rod 73 can also rotate axially relative to the sealing cover 71 until the threaded post 121 is connected to the clamping mechanism 14 by a thread.

[0038] Therefore, when the sampling rod delivers the clamping mechanism holding the hemispherical resonator to the process chamber, and the threaded post at the upper end of the piezoelectric ceramic seat is fitted into the threaded hole at the bottom of the clamping mechanism, the threaded post can be threadedly connected to the clamping mechanism by rotating the sampling rod, and the clamping mechanism can be disengaged from the sampling rod by pulling the sampling rod.

[0039] In this embodiment, the clamping mechanism 14 includes a base 141, a positioning sleeve 142, and a flexible clamping cylinder 143. The top surface of the base 141 has a tapered hole 1411 that is wider at the top and narrower at the bottom. The flexible clamping cylinder 143 has a central through hole 1431 that mates with the inner anchor rod of the hemispherical resonator. It has multiple slots circumferentially, which extend downward to penetrate the lower end face of the flexible clamping cylinder 143 and inward to communicate with the central through hole 1431, so as to divide the lower part of the flexible clamping cylinder 143 into multiple clamping blocks. The positioning sleeve 142 has a first hole 1421 that mates with the inner anchor rod of the hemispherical resonator and a second hole 1421 that mates with the outer circle of the flexible clamping cylinder 143, which are opened sequentially from top to bottom. 22, and a third hole 1423 that mates with the upper part of the base 141. The upper part of the base 141 is fitted into the third hole 1423. The upper part of the flexible clamp 143 is fitted into the second hole 1422, and its lower part is located in the conical hole 1411. The inner anchor rod of the hemispherical resonator passes through the first hole 1421 and then extends into the central through hole 1431. During the process of the positioning sleeve 142 moving down relative to the base 141 to drive the flexible clamp 143 to move down, the outer wall of the flexible clamp 143 is squeezed by the hole wall of the conical hole 1411 so that its clamping block gathers inward to hold the inner anchor rod of the hemispherical resonator tightly. The threaded hole 145 is opened on the lower end face of the base 141.

[0040] In this embodiment, the upper part of the outer circumferential wall of the base 141 has an external thread, the third hole 1423 of the positioning sleeve 142 has an internal thread that mates with the external thread, and the positioning sleeve 142 is threadedly connected to the base 141; the outer wall of the positioning sleeve 142 is provided with an angle scale mark 1424.

[0041] In this embodiment, a clamp 74 is provided at the top of the sampling chamber 71, which detachably connects the sampling rod 73 to the sealing cover 71.

[0042] In this embodiment, a moving mechanism is also included. The moving mechanism includes a driving component and a moving rod 8. The driving component is disposed on the outer wall of the vacuum chamber 1. One end of the moving rod 8 is connected to the driving component for transmission, and the other end extends into the process chamber 101 and is connected to the piezoelectric ceramic seat 12 through a conductive slip ring 13. The moving rod 8 is dynamically sealed to the vacuum chamber 1. The driving component is used to drive the moving rod 8 to move up and down and rotate axially.

[0043] In this embodiment, the driving assembly includes a linear driving structure 4 and a rotary driving structure 5. The linear driving structure 4 is disposed on the outer wall of the vacuum cavity 1, and the rotary driving structure 5 is disposed on the linear driving structure 4. The moving rod 8 is connected to the rotary driving structure 5 in a transmission manner. The linear driving structure 4 is used to drive the rotary driving structure 5 to move up and down, and the rotary driving structure 5 is used to drive the moving rod 8 to move up and down.

[0044] In this embodiment, the vacuum chamber 1 is provided with an exhaust channel 102 that connects the process chamber 101 and the exhaust equipment. The vacuum chamber 1 is also provided with a main gate valve 10, which can extend into the exhaust channel 102 to disconnect the process chamber 101 and the exhaust equipment.

[0045] The device in this embodiment is a dual-ion-source precision leveling device specifically designed for hemispherical resonators, including: a vacuum chamber, a multi-axis workpiece stage system, a sample delivery and transfer system, and a dual-ion-source system.

[0046] Vacuum chamber 1 is used to maintain the high vacuum processing environment required by the ion source, and it has an observation window 9; The multi-axis workpiece stage system, located within the process chamber, is used to clamp and drive the hemispherical resonator to complete precise movements. It includes: The Z-axis diameter movement module (i.e., linear drive structure 4) is used to control the workpiece to rise and fall in the vertical direction in order to precisely adjust the etched area required for the hemispherical resonator. The R-axis rotational motion module (i.e., rotational drive structure 5) is used to drive the workpiece to rotate continuously or in increments around its axis to ensure the axisymmetry and circumferential uniformity of the processing.

[0047] The R-axis is mounted on the Z-axis ball screw motion platform via an R-axis rotation motion module. The R-axis is extended into the process cavity by an external motor through a dynamic sealing structure. The extended part is sealed to the cavity through a bellows. The Z-axis motor drives the R-axis to move up and down.

[0048] In summary, the sampling and conveying system of this invention includes: The sample delivery chamber is connected to the process chamber via a high-vacuum gate valve. This design allows the sample delivery chamber to be opened for workpiece loading / unloading and pre-vacuuming while maintaining a high vacuum in the process chamber, greatly improving the equipment's production efficiency and vacuum stability.

[0049] The sampling mechanism is detachably and sealed to the sampling chamber. It is mainly used to send the hemispherical resonator to be adjusted to the process chamber through the sampling chamber, and to take out the adjusted hemispherical resonator from the process chamber through the sampling chamber.

[0050] The dual ion source system of this invention, which is horizontally parallel and axially inclined, is respectively installed on the side wall and top of the process chamber, and includes: The first ion source is a horizontally mounted parallel ion source with its ion source beam outlet axis parallel to the plane of the equipment base. It is used to perform quality-oriented processing on the outer surface area of ​​the hemispherical harmonic oscillator. The second ion source is an inclined incident ion source, whose ion beam exit axis forms a specific angle with the parallel plane of the substrate stage, and is used for polishing and shaping auxiliary processing. Therefore, a small-spot lateral ion source is used for primary shaping, while a large-spot tilted ion source is used for auxiliary polishing. The small spot size signifies higher spatial resolution, allowing for more precise correction of high-frequency, small-scale surface errors. It enables point-to-point shaping and is the primary method for rapidly converging surface shapes and reducing frequency splitting. The large spot size signifies higher material removal rates. The tilted ion beam can effectively flatten microscopic steps or ripples that may remain after shaping with a small spot through physical sputtering effects. By integrating deterministic shaping and overall polishing into a single device, one-stop precision machining from shape correction to quality correction is achieved, simultaneously considering accuracy, efficiency, and final performance.

[0051] like Figure 7-11 As shown, the rotation drive structure 5 is mounted on the linear drive structure 4 and is sealed to the vacuum chamber 1 via a bellows. The rotating drive structure 5 extends into the cavity and is connected to the piezoelectric ceramic seat 12 via a conductive slip ring 13. The vacuum cavity 1 and the sample delivery / receiving chamber are separated by a sample chamber gate valve 11. The vacuum cavity 1 maintains a high vacuum to improve process efficiency. The exhaust system (not shown) is separated by a main gate valve 10. A transverse ion source 2 is installed on the side wall for small spot finishing, and an inclined ion source 3 is installed at an angle of 45-65 degrees on the upper part of the cavity for large spot finishing polishing.

[0052] Reference for vacuum transfer sampling structure of hemispherical harmonic oscillator Figures 2-5 , Figure 2 The diagram shows the structure of the sampling mechanism, in which a locking cover 72 is installed inside the sealing cover 71. The locking cover 72 is connected to the sampling rod 73, which passes through the sealing cover 71. A vacuum seal is achieved between the sampling rod 73 and the sealing cover 72 via a sealing ring 75 and a sealing sleeve 76. The sampling rod 73 can be detachably fixed by adjusting a clamp 74. A telescopic structure 77 is installed on the inner wall of the locking cover 72, which has a telescopic function to grip the clamping mechanism 14.

[0053] Figure 3 and Figure 4This is a schematic diagram of a hemispherical resonator clamping mechanism, consisting of a base 141, a positioning sleeve 142, a flexible clamping cylinder 143, and the positioning sleeve 142 marked with 360-degree markings on its edge. The inner anchor rod of the hemispherical resonator 15 is placed in the flexible clamping cylinder 143, and then the positioning sleeve 142 is rotated to lock it in place. The base 141 has extension rods 144 every 120 degrees starting from the origin. The extension rods 144 are limited and fixed by a telescopic structure 77 on the locking cover 72, thus ensuring that the hemispherical resonator clamping structure remains suspended and does not fall off.

[0054] The vacuum sampling process for a hemispherical harmonic oscillator is as follows: Figures 7-9 As shown, after opening the sample chamber gate valve 11 and loosening the clamp 74, adjust the sample delivery rod 73 to extend it into the vacuum chamber 1. The base 141, with its threaded hole at the bottom, aligns with the threaded post on the top of the piezoelectric ceramic base 12 and rotates to lock it in place, as shown... Figure 7 Pull the sampling rod 73 to the top and lock the clamp 74, then close the sample chamber gate valve 11 to complete the sample delivery process.

[0055] like Figure 10 The diagram shows the main adjustment of the hemispherical harmonic oscillator by the transverse ion source 2. The beam spot 16 of the transverse ion source is aligned with the outer edge of the hemispherical harmonic oscillator near the equator, which allows for mass adjustment.

[0056] like Figure 11 The diagram shows the auxiliary adjustment of the hemispherical harmonic oscillator by the tilted ion source 3. The hemispherical harmonic oscillator is adjusted to the corresponding position of the tilted ion source beam spot 17 by the linear drive structure 4, and the rotation drive structure 5 is rotated to polish the outer sphere surface.

[0057] The embodiments described above are merely preferred embodiments of the present invention. The terms "in one embodiment," "in another embodiment," "in yet another embodiment," or "in still another embodiment" used in this specification all refer to one or more of the same or different embodiments according to this disclosure. Ordinary variations and substitutions made by those skilled in the art within the scope of the present invention should be included within the protection scope of the present invention.

Claims

1. A hemispherical harmonic oscillator leveling device, characterized in that, It includes a vacuum chamber (1) and a sampling mechanism (7). The vacuum chamber (1) has a process chamber (101) and multiple ion sources are provided thereon. The emitting end of the ion source extends into the process chamber (101). The ion source includes a horizontal ion source (2) and an inclined ion source (3). The horizontal ion source (2) is arranged horizontally, and its ion source beam outlet axis is parallel to the substrate stage plane in the process chamber (101). The inclined ion source (3) is arranged inclined, and its ion beam outlet axis forms a set angle with the substrate stage plane. The sampling mechanism (7) includes a sealing cover (71) and a sampling rod (73). The sealing cover (71) is detachably and sealedly connected to the upper end of the vacuum chamber (1). The vacuum chamber (1) has a sampling channel that connects the process chamber (101) and the inner cavity of the sealing cover (71). The vacuum chamber (1) is also provided with a sample chamber gate valve (11). The sample chamber gate valve (11) can be inserted into the sampling channel to disconnect the process chamber (101) and the inner cavity of the sealing cover (71). The sampling rod (73) passes through the sealing cover (71) and is dynamically sealed to the sealing cover (71). It can move up and down relative to the sealing cover (71). The hemispherical resonator (15) can be detached from the lower end of the sampling rod (73). The sampling rod (73) can be moved down to deliver the hemispherical resonator (15) to the substrate stage plane in the process chamber (101).

2. The hemispherical harmonic oscillator leveling device according to claim 1, characterized in that, It also includes a sampling chamber (6), which is sealed to the upper end of the vacuum chamber (1) and is connected to the inner cavity of the process chamber (101) and the sealing cover (71). The inner cavity of the sampling chamber (6) forms the sampling channel, and the sample chamber gate valve (11) is provided on the sampling chamber (6).

3. The hemispherical harmonic oscillator leveling device according to claim 1, characterized in that, The hemispherical resonator (15) can be detached from the lower end of the sampling rod (73) via the clamping mechanism (14). The lower side wall of the clamping mechanism (14) is provided with multiple extension rods (144) spaced circumferentially. The extension rods (144) extend radially outward along the hemispherical resonator. The lower part of the sampling rod (73) is provided with a locking cover (72). The lower part of the inner side wall of the locking cover (72) is provided with multiple receiving slots. The multiple receiving slots correspond one-to-one with the multiple extension rods (144). The receiving slots are provided with multiple telescopic structures (77). The telescopic structure (77) includes steel balls and springs. One end of the spring is connected to the locking cover (72). The other end of the clamping mechanism (14) is connected to the steel ball, with the steel ball extending out of the receiving groove. When the clamping mechanism (14) extends into the locking cover (72), the extension rod (144) abuts against the corresponding steel ball and presses the steel ball into the receiving groove, and compresses the corresponding spring, thereby disengaging the clamping mechanism (14) from the sampling rod (73).

4. The hemispherical harmonic oscillator leveling device according to claim 3, characterized in that, The bottom surface of the clamping mechanism (14) is provided with a threaded hole (145), and the process chamber (101) is provided with a piezoelectric ceramic seat (12). The top surface of the piezoelectric ceramic seat (12) is provided with a threaded post (121) that mates with the threaded hole (145). The sampling rod (73) can also rotate axially relative to the sealing cover (71) until the threaded post (121) is connected to the clamping mechanism (14) by a thread.

5. The hemispherical harmonic oscillator leveling device according to claim 4, characterized in that, The clamping mechanism (14) includes a base (141), a positioning sleeve (142), and a flexible clamp (143). The top surface of the base (141) has a tapered hole (1411) that is wider at the top and narrower at the bottom. The flexible clamp (143) has a central through hole (1431) that mates with the anchor rod inside the hemispherical resonator. The flexible clamp (143) has multiple slots around its circumference. The slots extend downward to penetrate the lower end face of the flexible clamp (143) and extend inward to communicate with the central through hole (1431) to divide the lower part of the flexible clamp (143) into multiple clamping blocks. The positioning sleeve (142) has a first hole (1421) that mates with the anchor rod inside the hemispherical resonator and a second hole (1431) that mates with the outer circle of the flexible clamp (143) in sequence from top to bottom. 22), and a third hole (1423) that mates with the upper part of the base (141). The upper part of the base (141) is fitted into the third hole (1423), the upper part of the flexible clamp (143) is fitted into the second hole (1422), and its lower part is set in the conical hole (1411). The inner anchor rod of the hemispherical resonator passes through the first hole (1421) and extends into the central through hole (1431). During the process of the positioning sleeve (142) moving down relative to the base (141) to drive the flexible clamp (143) to move down, the outer wall of the flexible clamp (143) is squeezed by the hole wall of the conical hole (1411) so that its clamping block gathers inward to hold the inner anchor rod of the hemispherical resonator tightly; the threaded hole (145) is opened on the lower end face of the base (141).

6. The hemispherical harmonic oscillator leveling device according to claim 5, characterized in that, The upper part of the outer circumferential wall of the base (141) has an external thread, and the third hole (1423) of the positioning sleeve (142) has an internal thread that mates with the external thread. The positioning sleeve (142) is threadedly connected to the base (141). The outer wall of the positioning sleeve (142) is provided with an angular scale mark (1424).

7. The hemispherical harmonic oscillator leveling device according to any one of claims 1-6, characterized in that, The top of the sampling chamber (71) is provided with a clamp (74), which detachably connects the sampling rod (73) to the sealing cover (71).

8. The hemispherical harmonic oscillator leveling device according to any one of claims 1-6, characterized in that, It also includes a moving mechanism, which includes a drive assembly and a moving rod (8). The drive assembly is located on the outer wall of the vacuum chamber (1). One end of the moving rod (8) is connected to the drive assembly for transmission, and the other end extends into the process chamber (101) and is connected to the piezoelectric ceramic seat (12) through a conductive slip ring (13). The moving rod (8) is dynamically sealed to the vacuum chamber (1). The drive assembly is used to drive the moving rod (8) to move up and down and rotate axially.

9. The hemispherical harmonic oscillator leveling device according to claim 8, characterized in that, The drive assembly includes a linear drive structure (4) and a rotary drive structure (5). The linear drive structure (4) is located on the outer wall of the vacuum cavity (1), and the rotary drive structure (5) is located on the linear drive structure (4). The moving rod (8) is connected to the rotary drive structure (5) in a transmission manner. The linear drive structure (4) is used to drive the rotary drive structure (5) to move up and down, and the rotary drive structure (5) is used to drive the moving rod (8) to move up and down.

10. The hemispherical harmonic oscillator leveling device according to any one of claims 1-6, characterized in that, The vacuum chamber (1) is provided with an exhaust channel (102) connecting the process chamber (101) and the exhaust equipment. The vacuum chamber (1) is also provided with a main gate valve (10). The main gate valve (10) can be inserted into the exhaust channel (102) to disconnect the process chamber (101) and the exhaust equipment.

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