High-temperature calibration plate and high-temperature calibration method

Abstract

The invention provides a high-temperature calibration board and a high-temperature calibration method. The high-temperature calibration board comprises a visual main board, a heat conduction part, a heat insulation part and a heating part, the plurality of heat conduction pieces are embedded and fixed in a calibration area of the visual mainboard, the heating piece is arranged on the back side of the visual mainboard and heats the heat conduction pieces, and the heat insulation piece is arranged between the heating piece and the visual mainboard. According to the invention, the cylindrical plug is heated by the quartz lamp tube to form obvious cold and hot contrast on the visual mainboard, so that the high-temperature imaging equipment can conveniently acquire an infrared thermal image with high contrast; through the special structural design, the high-temperature calibration plate has excellent insulation performance; meanwhile, measures such as household power supply and high-pressure gas cooling are adopted, the system has the advantages of simple structure, simple system, good safety and the like, and optical geometric parameter calibration of the imaging equipment in a high-temperature section can be effectively completed.

Description

Technical Field

[0001] This invention relates to the field of high-temperature testing technology, and in particular to a high-temperature calibration plate and a high-temperature calibration method. Background Technology

[0002] Calibrating the geometrical optical parameters of imaging equipment is a key technology for geometrical measurements using cameras, infrared thermal imagers, and other instruments, directly determining the accuracy of the optical measurement results. In the room-temperature domain, various calibration devices are available, including checkerboard calibration boards, center calibration boards, and QR code calibration boards, offering high calibration accuracy and wide application. However, in high-temperature applications, due to the shift in the wavelength of the primary radiated light, equipment that has been focused at room temperature often exhibits out-of-focus issues when photographing high-temperature objects, requiring refocusing and recalibration. This out-of-focus problem is particularly pronounced in infrared thermal imagers, as different imaging bands are used for different measurement ranges.

[0003] Therefore, equipment is needed for calibrating geometric optical parameters in high-temperature environments. Summary of the Invention

[0004] The purpose of this invention is to provide a high-temperature calibration plate and a high-temperature calibration method, which can complete the calibration of the geometric optical parameters of imaging equipment under high-temperature conditions; The present invention provides a high-temperature calibration plate, including a vision main board, a heat-conducting component, a heat-insulating component, and a heating component; a plurality of the heat-conducting components are embedded and fixed in the calibration area of ​​the vision main board, the heating component is disposed on the back side of the vision main board and heats the heat-conducting components, and the heat-insulating component is disposed between the heating component and the vision main board.

[0005] Furthermore, the heat-conducting component is a cylindrical plug, and the visual motherboard has holes for embedding the heat-conducting component.

[0006] Furthermore, the visual motherboard and the heat-conducting component are different colors.

[0007] Furthermore, the heat insulation component is a heat insulation plate, and the heat insulation plate has holes for the heat-conducting component to pass through.

[0008] Furthermore, the heating element includes a quartz lamp tube and a current-carrying plate, the quartz lamp tube being electrically connected to the current-carrying plate, and the current-carrying plate having a plurality of wire access holes arranged thereon; the quartz lamp tube is placed on the back side of the heat-conducting element in the same row or column.

[0009] Furthermore, it also includes a heat sink, which is disposed on the back side of the heating element.

[0010] Furthermore, the heat sink includes a radiating plate with S-shaped heat dissipation grooves machined on it, and a cooling medium is introduced into the radiating plate.

[0011] Furthermore, the heat sink also includes a cover plate connected to the back side of the radiating plate, and a cooling medium is introduced between the radiating plate and the cover plate.

[0012] Furthermore, it also includes a loop frame, which is fitted onto the outside of the visual motherboard, the heat-conducting component, the heat-insulating component, the heating component, and the heat-dissipating component and fixed into a closed whole.

[0013] This invention also provides a high-temperature calibration method based on a high-temperature calibration plate, comprising the following steps: Step 1, the infrared thermal imager is installed and fixed, the range is selected and focused; Step 2, a thermocouple is arranged on the back of the heat-conducting component of the calibration plate; Step 3, the heating element of the calibration plate is activated to heat the heat-conducting component; Step 4, when the calibration plate is continuously heated until the thermocouple acquisition temperature reaches the set temperature, the orientation of the calibration plate is changed, and the infrared thermal imager takes pictures of the calibration plate in different orientations. During the process, the thermocouple temperature is monitored, and if the temperature is too high, the heating element is reduced or stopped to adjust the temperature; Step 5, the geometric parameters of the infrared thermal imager are calibrated using infrared thermal images.

[0014] The technical solution of this invention heats the heat-conducting component with a heating element and blocks the heating element from the vision motherboard with a heat insulation component, so that there is a significant temperature difference between the embedded heat-conducting component and the vision motherboard. By changing the orientation of the calibration plate, the infrared thermal imager takes pictures of the calibration plate in different orientations, and the geometric optical parameters of the infrared thermal imager can be successfully calibrated in the high-temperature range. Attached Figure Description

[0015] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the high-temperature calibration plate of the present invention; Figure 2 This is a schematic diagram of the calibration area of ​​the high-temperature calibration plate of the present invention; Explanation of reference numerals in the attached figures: 1-Visual mainboard; 2-Heat-conducting component; 3-Heat insulation component; 4-Heating component; 5-Current-carrying plate; 6-Heat insulation pad; 7-U-shaped frame; 8-Radiation plate; 9-Cover plate; 10-Wire inlet hole; 11-Heat dissipation hole. Detailed Implementation

[0017] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. Furthermore, the terms "installed," "connected," and "linked" should be interpreted broadly; for example, they may refer to a fixed connection, a detachable connection, or an integral connection; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection through an intermediate medium; and they may refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0020] Example 1 like Figures 1-2 As shown, the present invention provides a high-temperature calibration plate, including a vision main board 1, a heat-conducting component 2, a heat-insulating component 3, and a heating component 4; multiple heat-conducting components 2 are embedded and fixed in the calibration area of ​​the vision main board 1, the heating component 4 is disposed on the back side of the vision main board 1 and heats the heat-conducting components 2, and the heat-insulating component 3 is disposed between the heating component 4 and the vision main board 1.

[0021] Specifically, the visual motherboard 1 is made of a high-silica composite material, and the heat-conducting component 2 is made of a metal material with good thermal conductivity. The heat insulation component 3 is used to isolate the radiative heat transfer from the heating component 4 to the visual motherboard 1.

[0022] The high-temperature calibration method of this invention is illustrated using a specific example of infrared thermal imager calibration: In a certain high-temperature test, the required range of the infrared thermal imager is 200℃~2000℃. The calibration process is as follows: Step 1: Install and fix the infrared thermal imager, select the range and focus; Step 2: Arrange a K-type thermocouple on the back of the heat-conducting component 2 of the calibration plate; Step 3: The heating element 4 of the calibration plate starts heating the heat conduction element 2; Step 4: Continue heating the calibration board until the thermocouple acquisition temperature is about 300℃. Then, start changing the orientation of the calibration board and take pictures of the calibration board in different orientations with an infrared thermal imager. During the process, monitor the thermocouple temperature. If the temperature is too high, reduce or stop the power supply to adjust the temperature. Step 5: Use infrared thermal imaging to calibrate the geometric parameters of the infrared thermal imager.

[0023] This invention heats the heat-conducting component 2 with the heating element 4 and blocks the heating element 4 from the vision mainboard 1 with the heat insulation component 3, so that there is a significant temperature difference between the embedded heat-conducting component 2 and the vision mainboard 1, forming a significant hot-cold contrast on the vision mainboard 1, which facilitates the acquisition of high-contrast infrared thermal images by high-temperature imaging equipment; by changing the orientation of the calibration plate, the infrared thermal imager can take pictures of the calibration plate in different orientations, and the geometric optical parameters of the infrared thermal imager can be successfully calibrated in the high-temperature range.

[0024] Example 2 The heat-conducting component 2 is a cylindrical plug, and the visual main board 1 has holes for embedding the heat-conducting component 2. The visual main board 1 and the heat-conducting component 2 are different colors. The heat insulation component 3 is a heat insulation plate, and the heat insulation plate has holes for the heat-conducting component 2 to pass through. The heating component 4 includes a quartz lamp tube and a current-carrying plate 5. The quartz lamp tube is electrically connected to the current-carrying plate 5, and the current-carrying plate 5 has multiple wire access holes 10 arranged on it; the quartz lamp tube is placed on the back side of the heat-conducting component 2 in the same row or column.

[0025] Specifically, the visual motherboard 1 is made of high silica-oxygen composite material, and the central area of ​​the visual motherboard 1 has M×N (e.g. 4×5) equal diameter circular holes distributed at equal intervals; the cylindrical plugs are circular plugs made of bronze material, which ensures good heat conduction during use, while maintaining high strength at high temperatures. The M×N (e.g. 4×5) equal height and equal diameter cylindrical plugs are tightly fitted onto the visual motherboard 1.

[0026] The outer surface of the vision motherboard 1 is coated with a white high-temperature resistant ceramic coating, while the outer surface of the cylindrical plug is coated with a black Fe3O4 coating. The outer surface of the cylindrical plug is flush with the coating surface of the vision motherboard 1, and its back protrudes from the vision motherboard 1 by a certain height L. The black and white coatings used on the cylindrical plug and the vision plate can effectively improve the contrast of the infrared thermal image, facilitating more accurate identification and extraction of circular marks. At the same time, this black and white contrast can be simultaneously applied to the calibration of the camera's geometric optical parameters, thereby facilitating the calibration of the rigid body transformation parameters of the camera and the infrared thermal imager.

[0027] The heat insulation board is made of ceramic heat insulation tile with a thickness not exceeding L. The middle area of ​​the heat insulation board has M×N (e.g. 4×5) round holes with the same diameter as the visual main board 1 for the cylindrical plug to pass through. Other un-holeed positions are used to isolate the radiative heat transfer of the quartz lamp assembly to the visual main board 1.

[0028] The filament of the quartz lamp is made of tungsten wire, ensuring higher heating capacity and reducing the likelihood of burnout. The quartz lamp is positioned directly above the cylindrical plugs in the same row / column, with its filament covering all the plugs. This modular quartz lamp heating method is characterized by its simple structure and ease of implementation.

[0029] The current-carrying plate 5 is made of metal, preferably stainless steel, and has multiple wire inlet holes 10 machined on it for parallel connection of multiple power supplies as needed. The electrodes of the quartz lamp are installed in the current-carrying plate 5. This invention can use household electricity (220V / 10A or 220V / 16A). The heating efficiency of the quartz lamp assembly is adjusted by changing the logarithm of the parallel power supplies. By using multiple sets of household electricity in parallel, a dedicated power supply system is not required.

[0030] Example 3 It also includes a heat sink, which is disposed on the back side of the heating element 4. The heat sink includes a radiating plate 8, on which S-shaped heat dissipation grooves are machined, and a cooling medium is introduced into the radiating plate 8. The heat sink also includes a cover plate 9, which is connected to the back side of the radiating plate 8, and the cooling medium is introduced between the radiating plate 8 and the cover plate 9.

[0031] Specifically, the radiant plate 8 is made of stainless steel, with an S-shaped heat dissipation groove machined on top. The radiant plate 8 has a perimeter with heat dissipation holes 11 for circulating cooling water or high-pressure air during calibration plate operation. The cover plate 9 is made of stainless steel and is sealed and welded to the top of the radiant plate 8. A heat-insulating strip 6, made of ceramic heat-insulating tile, is placed between the current-carrying plate 5 and the radiant plate 8 for heat insulation and electrical insulation, giving the high-temperature calibration plate excellent insulation performance. Cooling by circulating high-pressure air into the heat dissipation groove on the radiant plate 8 is simpler than a circulating cooling water system and also avoids the risk of electric leakage caused by cooling water leakage.

[0032] Example 4 It also includes a loop frame 7, which is fitted onto the outside of the visual main board 1, the heat conduction component 2, the heat insulation component 3, the heating component 4 and the heat dissipation component and fixed into a closed whole.

[0033] Specifically, the loop frame 7 is made of non-metallic insulating material, preferably high-silica. The vision mainboard 1, the loop frame 7, and the radiation plate 8 are fixed together as a closed unit by screws. By adopting a closed external structure, the external structure is completely insulated from the internal electrically conductive parts, ensuring safe operation during use.

[0034] How this invention works: The high-temperature calibration method of this invention is illustrated using a specific example of infrared thermal imager calibration: In a certain high-temperature test, the required range of the infrared thermal imager is 200℃~2000℃. The calibration process is as follows: Step 1: Install and fix the infrared thermal imager, select the range and focus; Step 2: Place a K-type thermocouple on the back of the marking cylinder of the calibration plate; Step 3: The calibration board is supplied with cooling high-pressure gas and power. Step 4: Continue heating the calibration board until the thermocouple acquisition temperature is about 300℃. Then, start changing the orientation of the calibration board and take pictures of the calibration board in different orientations with an infrared thermal imager. During the process, monitor the thermocouple temperature. If the temperature is too high, reduce or stop the power supply to adjust the temperature. Step 5: Use infrared thermal images to calibrate the geometric parameters of the infrared thermal imager, employing a publicly available algorithm—the planar template calibration method.

[0035] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A high-temperature calibration plate, characterized in that, It includes a visual motherboard (1), a heat-conducting component (2), a heat-insulating component (3), and a heating component (4); Multiple heat-conducting components (2) are embedded and fixed in the calibration area of ​​the vision motherboard (1), the heating component (4) is disposed on the back side of the vision motherboard (1) and heats the heat-conducting components (2), and the heat insulation component (3) is disposed between the heating component (4) and the vision motherboard (1).

2. The high-temperature calibration plate according to claim 1, characterized in that, The heat-conducting component (2) is a cylindrical plug, and the visual motherboard (1) has a hole for embedding the heat-conducting component (2).

3. The high-temperature calibration plate according to claim 2, characterized in that, The visual motherboard (1) and the heat-conducting component (2) are different colors.

4. The high-temperature calibration plate according to claim 1, characterized in that, The heat insulation component (3) is a heat insulation plate, and the heat insulation plate has holes for the heat conduction component (2) to pass through.

5. The high-temperature calibration plate according to claim 1, characterized in that, The heating element (4) includes a quartz lamp tube and a current-carrying plate (5). The quartz lamp tube is electrically connected to the current-carrying plate (5), and the current-carrying plate (5) has multiple wire access holes arranged thereon. The quartz lamp tube is placed on the back side of the heat-conducting component (2) in the same row or column.

6. The high-temperature calibration plate according to claim 1, characterized in that, It also includes a heat sink, which is disposed on the back side of the heating element (4).

7. The high-temperature calibration plate according to claim 6, characterized in that, The heat dissipation component includes a radiating plate (8), on which an S-shaped heat dissipation groove is machined, and a cooling medium is introduced into the radiating plate (8).

8. The high-temperature calibration plate according to claim 7, characterized in that, The heat sink also includes a cover plate (9), which is connected to the back side of the radiating plate (8), and a cooling medium is introduced between the radiating plate (8) and the cover plate (9).

9. The high-temperature calibration plate according to claim 6, characterized in that, It also includes a spiral frame (7), which is fitted onto the outside of the visual motherboard (1), the heat-conducting component (2), the heat-insulating component (3), the heating component (4) and the heat dissipation component and fixed into a closed whole.

10. A high-temperature calibration method based on the high-temperature calibration plate according to any one of claims 1-9, characterized in that, Includes the following steps: Step 1: Install and fix the infrared thermal imager, select the range and focus; Step 2: Arrange thermocouples on the back of the thermally conductive parts of the calibration plate; Step 3: The heating element of the calibration plate is activated to heat the heat conduction element; Step 4: When the calibration board is heated to the set temperature, start changing the orientation of the calibration board. The infrared thermal imager takes pictures of the calibration board in different orientations. During the process, monitor the temperature of the thermocouple. If the temperature is too high, reduce or stop the heating element to adjust the temperature. Step 5: Use infrared thermal imaging to calibrate the geometric parameters of the infrared thermal imager.

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