Low water loss rate liquid cooling thin film module and electronic device

Abstract

The application discloses a liquid cooling thin film module with low water loss rate and electronic equipment. The liquid cooling thin film module comprises a driving element and a thin film body. The thin film body comprises a flow channel layer and cover layers covering both sides of the flow channel layer. A through groove structure is arranged on the flow channel layer. The through groove structure and the cover layers on both sides form a fluid channel. A water and oxygen barrier layer is arranged on the inner surface of the fluid channel. The driving element is used for driving the circulation flow of the cooling working medium in the fluid channel. The water and oxygen barrier layer is arranged on the outer surface of the thin film body and / or the inner surface of the fluid channel, so that the barrier property of the flow channel is increased, the water loss rate of the liquid cooling thin film is reduced, the water loss phenomenon of the liquid cooling thin film in long-term use is inhibited, and the service life of the liquid cooling thin film is greatly increased. The water and oxygen barrier layer is deposited after the assembly of each layer structure, can cover the gap between the flow channel layer and the adjacent layer structure, and further improves the water and oxygen barrier effect.

Description

Technical Field

[0001] This invention belongs to the field of liquid cooling technology for electronic devices, specifically relating to a liquid-cooled thin-film module with low water loss rate and an electronic device. Background Technology

[0002] In today's digital age, AI technology is booming at an unprecedented pace. From intelligent voice assistants to image recognition systems, from autonomous driving technology to various intelligent applications, AI has deeply integrated into every aspect of our lives. As AI technology continues to evolve, its demand for computing power is growing exponentially. To meet this ever-increasing demand, mobile devices such as tablets and smartphones are constantly upgrading their hardware configurations to enhance their computing capabilities.

[0003] However, this upgrade process has brought new challenges. While mobile devices are continuously improving their computing power, their power consumption is also constantly increasing. When running some large AI applications, the battery consumption of mobile phones and tablets accelerates significantly, and the heat generated by core components such as processors becomes increasingly noticeable. For example, when users use their phones for high-definition video editing or to run AI-driven games, the devices quickly become overheated. This excessive heat not only affects the device's battery life but may also lead to a decline in device performance, or even system lag and crashes, severely impacting the user experience.

[0004] Therefore, heat dissipation in mobile devices has become a critical issue that urgently needs to be addressed, especially during high-intensity operation, where mobile devices require stronger heat dissipation capabilities. Effective heat dissipation technology is crucial for maintaining stable device performance, extending device lifespan, and ensuring a smooth user experience. Failure to overcome this challenge in a timely manner will significantly hinder the further development of mobile devices in the field of AI applications.

[0005] To address the heat dissipation problem of mobile devices, the industry has tried various heat dissipation solutions, but all of them have certain limitations, such as:

[0006] 1. Existing heat dissipation plates commonly used in mobile devices, such as VC vapor chambers and graphene, have shortcomings. VC vapor chambers utilize the principle of internal liquid evaporation absorbing heat at high temperatures and condensation releasing heat at low temperatures to achieve heat transfer. However, their heat flux density is relatively low. When faced with the high power surges generated by the increased AI computing power of mobile devices, they cannot quickly and effectively dissipate heat. Furthermore, VC vapor chambers are prone to dry burning at high power, leading to deterioration in thermal conductivity. Moreover, when the thickness of the VC vapor chamber is less than 0.2mm, the equivalent thermal conductivity decreases significantly. While graphene possesses good electrical conductivity, its thermal conductivity does not meet the ideal requirements for efficient heat dissipation in practical applications. This results in heat accumulating on these heat dissipation plates during high-load operation, failing to dissipate heat in a timely manner, and thus affecting the overall heat dissipation performance of the device.

[0007] 2. Regarding air-cooling solutions, while traditional fan cooling is widely used and effective in desktop computers and other devices, it's difficult to integrate fans into mobile devices with extremely limited space. This is because mobile devices prioritize a thin and portable design, and the size and structure of fans contradict these requirements. Another approach, using piezoelectric micropumps for air cooling, while addressing the size issue to some extent, suffers from limited adaptability. Air-cooled piezoelectric micropumps have high requirements for waterproofing and dustproofing, which cannot meet the requirements of mobile phones. This significantly limits the practical application of piezoelectric micropump air cooling.

[0008] 3. Liquid cooling films are a novel type of liquid cooling heat dissipation method. Liquid cooling films include ultra-thin and flexible liquid microchannels. Coolant circulates inside the liquid microchannels, and the heat generated by the chip is carried away by the liquid flow. However, in order to achieve lightweight, flexibility and efficient heat conduction, ordinary liquid cooling films usually use very thin polymer materials. However, the barrier properties of these materials are far less than those of metals, which causes the coolant to slowly evaporate or permeate through the film material, resulting in water loss. The high water loss rate of liquid cooling films will lead to a decrease in heat dissipation efficiency, the generation of bubbles, and in turn, local overheating and system failure of electronic devices using liquid cooling films. Moreover, the smaller the thickness, the shorter the permeation path, and the higher the water loss rate.

[0009] Furthermore, in liquid cooling films, which are a type of liquid cooling heat dissipation, the liquid cooling film includes ultra-thin and flexible liquid microchannels. However, due to the thinness and small area of ​​the liquid cooling film, it is necessary to set up dense liquid microchannels in a small area. The liquid microchannels must be narrow and too long, resulting in high flow resistance. This requires a higher power pump to drive the liquid cooling film, which not only increases energy consumption but may also generate more noise.

[0010] For example, Chinese patent CN117615557A discloses "A mobile terminal heat dissipation device," which specifically discloses the following: "A battery cover is disposed outside a shielding cover, and an air inlet is provided in the middle of the mobile terminal battery cover, the area and shape of which are not limited; it also includes a cooling structure; the cooling structure is fitted to the outside of the shielding cover and is correspondingly set to the main heat-generating chip SOC; the cooling structure provides cooling to the main heat-generating chip SOC, and the cooling structure uses a TEC semiconductor cooling chip. It also includes a heat dissipation structure; the heat dissipation structure includes a cooling fan and heat dissipation fins, the cooling fan is installed on the upper side of the shell body near the battery, the cooling fan is set corresponding to the air inlet, the frame has symmetrically opened air outlets on both sides of the cooling fan's air outlet position, the heat dissipation fins are symmetrically arranged on both sides of the cooling fan, and the heat dissipation fins have horizontally opened air ducts." "Connected to the air outlet" (paragraphs 0040 to 0042 of the specification), indicating that in this patent, a fan is used to dissipate heat from the mobile terminal. The specific heat dissipation process is as follows: "When using this invention, after the main heat-generating chip SOC generates heat, the heat is transferred to the shielding device through the thermally conductive TIM material, and then transferred to the thermally conductive TIM material on the other side through the shielding device. The thermally conductive TIM material transfers the heat to the cold side of the TEC semiconductor cooling chip, and then the cold side of the TEC semiconductor cooling chip transfers the heat to the hot side. The hot side of the TEC semiconductor cooling chip contacts the cold end of the VC heat sink, and the hot end of the VC heat sink is close to the heat dissipation fins. The heat is then discharged from the mobile terminal through the air duct and the air outlet" (paragraph 0047 of the specification). It can be seen that the heat dissipation process in this patent is to first conduct heat to the main heat-generating chip SOC, and then discharge the heat from the mobile terminal through the fan. Referring to the attached drawings of this patent specification, it can be seen that after integrating a fan into mobile terminals such as mobile phones, their thickness and volume increase. However, mobile devices pursue a thin and portable design concept, and the size and structure of the fan contradict this design requirement and are not suitable for the high integration and thin and light requirements.

[0011] For example, Chinese patent CN119255565A discloses an "Electronic Device," which specifically discloses the following: "The electronic device includes a back shell, a decorative component, a heating element, and a piezoelectric cooling module. The back shell has a first opening. The decorative component has a receiving groove, a first air inlet, and a first air outlet. The receiving groove communicates with the first opening to form a receiving space. The first air inlet and the first air outlet are both connected to the receiving groove. The heating element is disposed within the receiving space. The piezoelectric cooling module is disposed within the receiving space and is disposed corresponding to the heating element. The piezoelectric cooling module includes one or more piezoelectric cooling components. The piezoelectric cooling components include one or more piezoelectric cooling units." (paragraph 0028 of the specification). It can be seen that in this patent... The piezoelectric cooling unit is used for heat dissipation. The specific heat dissipation process is as follows: "The piezoelectric element of the piezoelectric cooling unit can deform under the control of the control signal, and drive the vibrating element to deform, so as to form active air cooling and dissipate heat from the heat-generating device, thereby achieving a better heat dissipation effect." (Section 0038 of the instruction manual). That is, the piezoelectric cooling unit vibrates under the action of the piezoelectric effect, thereby driving the vibrating element to vibrate, similar to the effect of a fan, to dissipate heat from the heat-generating device. Although the method of using piezoelectric elements for air cooling solves the size problem to a certain extent, piezoelectric elements for air cooling are very susceptible to external influences. For example, the micro-pump of the piezoelectric air cooling is prone to dust and water ingress, and is not easy to prevent dust and water, making it difficult to meet the waterproof and dustproof requirements of mobile phones.

[0012] For example, Chinese patent CN120583648A discloses "A Foldable Heat Dissipation Device," which specifically discloses the following: "A foldable heat dissipation device includes a flow channel layer, a first substrate, a second substrate, a first support layer, a second support layer, and a fluid drive component. In embodiments of the present invention, the flow channel layer has a cooling flow channel for the flow of cooling medium; the cooling flow channel is used for the flow of cooling medium, and its main function is to remove heat from the heat source of the electronic device through the flow of cooling medium, so as to achieve rapid cooling of the heat source. Here, the heat source can be a CPU, graphics card, battery, or other heat-generating electronic devices; the electronic device can be a medical device, a small mobile device, a game console control board, a laptop computer, or other water-cooled products" (specification). (Section 0023) It can be seen that this patent is an ultra-thin liquid cooling film that carries away heat through the flow of cooling medium and is used in electronic devices. The following contents are disclosed regarding its structure and use: "The flow channel layer, the first substrate and the second substrate are made of TPU material, that is, thermoplastic polyurethane material" (Section 0034 of the specification) and "The first support layer and the second support layer are made of stainless steel, which has the effect of corrosion resistance and high strength" (Section 0033 of the specification). However, because its liquid cooling film is thin and the penetration path is short, and the flow channel layer, the first substrate and the second substrate are made of very thin polymer materials, but the barrier properties of these materials are far less than those of metals, the coolant will slowly evaporate or permeate through the film material, resulting in water loss.

[0013] For example, Chinese patent CN119277729A discloses a "Foldable Heat Dissipation Device," which specifically discloses the following: "The first array microchannel includes at least two first straight channels, at least two first bends, and at least two second bends. Each first straight channel is parallel to each other and spaced apart. Each first bend is connected to one end of two adjacent first straight channels, and each second bend is connected to the other end of two adjacent first straight channels. Furthermore, each first bend and each second bend are at least partially offset. In this embodiment, the first array microchannel is in a meandering and curved shape, and its channel density is proportional to the heat generated by the heat-generating device of the display assembly; that is, the greater the heat generated by the heat-generating device, the greater the channel density of the first array microchannel." It can be seen that to increase the heat dissipation capacity, this patent's solution is to increase the channel density. However, increasing the channel density will inevitably lead to a greater number of bends in the microchannels and make the microchannels longer and narrower, resulting in high flow resistance. This requires a higher-power pump for driving, increasing energy consumption and potentially generating more noise. Summary of the Invention

[0014] To address the problem of existing liquid cooling films experiencing slow evaporation or permeation through the film material, resulting in high water loss rates, this invention provides a low-water-loss liquid cooling film module. By covering the flow channel layer of the film with a water-oxygen barrier layer, the barrier effect of the flow channel on the coolant is increased, thereby reducing the water loss rate of the liquid cooling film. This results in reduced water loss during long-term use and increases the service life of the liquid cooling film.

[0015] In a first aspect, the present invention provides a liquid-cooled thin-film module with low water loss rate, comprising a driving element and a thin-film body. The thin-film body includes a flow channel layer and a cover layer covering both sides of the flow channel layer; a through-slot structure is formed on the flow channel layer. The through-slot structure and the cover layers on both sides together form a fluid channel.

[0016] The outer surface of the film body is covered with a water-oxygen barrier layer, and / or the inner surface of the fluid channel is provided with a water-oxygen barrier layer to resist the loss of cooling working fluid.

[0017] The drive element is configured to drive the cooling medium to circulate within the fluid channel.

[0018] Preferably, the outer surface of the film body is covered with a water-oxygen barrier layer; the water-oxygen barrier layer on the outer surface of the film body is any one or more of organic polymer materials, metals, and silicon dioxide.

[0019] Preferably, the water-oxygen barrier layer is formed by chemical vapor deposition after the driving element is mounted on the thin film body.

[0020] Preferably, the surface of the fluid channel within the channel layer groove structure and the surface of the corresponding groove structure on the cover layer are both completely covered by a water and oxygen barrier layer.

[0021] Preferably, the material of the water-oxygen barrier layer is any one or more of copper, gold, titanium, and silicon dioxide; the thickness of the water-oxygen barrier layer is less than 5 μm, preferably 0.5 μm to 5 μm, and more preferably 1 μm.

[0022] Preferably, the water-oxygen barrier layer is formed by chemical deposition on the inner surface of the fluid channel after the flow channel layer and the cover layers on both sides are assembled into one unit.

[0023] Preferably, the driving element is a piezoelectric micropump; the fluid channel has an inflow port and an outflow port spaced apart. The side of the membrane body has a mounting area covering the inflow port and the outflow port. The piezoelectric micropump is fixed to the mounting area and communicates with the inflow port and the outflow port through two fluid flow holes opened on one side of the membrane body.

[0024] Preferably, the piezoelectric micropump is fixed to the mounting area on the film body by adhesive bonding.

[0025] Preferably, the adhesive between the piezoelectric micropump and the film body comprises a main adhesive. The main adhesive is formed by dispensing along a dispensing path on the piezoelectric micropump or the film body. The dispensing path comprises a peripheral adhesive path that encircles the inner side of the piezoelectric micropump connection side or the inner side of the outer contour of the film body mounting area.

[0026] Preferably, the dispensing path further includes two internal dispensing paths surrounding the piezoelectric micropump's pump flow inlet and outlet, and / or a separating dispensing path that divides the pump flow inlet and outlet into two independent regions.

[0027] Preferably, the colloid between the piezoelectric micropump and the film body further includes a damming membrane to prevent the main colloid from overflowing into the pump inlet and outlet; the pump inlet and outlet are located within the outer contour of the damming membrane. The damming membrane has clearance holes at positions corresponding to the pump inlet and outlet.

[0028] Preferably, the mounting area includes a first solder resist zone, a second solder resist zone, and a welding zone. The first solder resist zone surrounds the welding zone. Two second solder resist zones surround the two fluid flow holes, respectively. The welding zone is covered with a solderable metal; the first and second solder resist zones are covered with solder resist material. The piezoelectric micropump is welded and fixed to the welding zone.

[0029] Preferably, the first solder resist area further includes a partition portion that divides the solder area into two independent regions. The partition portion is disposed between the two fluid flow holes.

[0030] Preferably, the film body further includes film layers; the two film layers respectively cover the side of the two cover layers away from the flow channel layer.

[0031] Preferably, the flow channel layer, the cover layer, and the film layer are bonded and fixed together, and their outer contours are completely identical.

[0032] Preferably, the liquid-cooled thin-film module has a bending region in the middle. The thin-film layer has multiple bending grooves arranged at intervals in the bending region. A limiting portion is formed between two adjacent bending grooves.

[0033] Preferably, the bending region includes a first bending region, two second bending regions located on either side of the first bending region, and two third bending regions located on opposite sides of the two second bending regions. The width of the limiting portion is largest in the second bending region, followed by the third bending region, and smallest in the first bending region. The number of limiting portions is smallest in the second bending region, followed by the third bending region, and largest in the first bending region.

[0034] Preferably, the liquid-cooled thin-film module has a bending region in the middle; the thin-film layer has a mesh-like perforated structure in the bending region. The mesh-like perforated structure can improve the bending deformation capability of the bending region, thereby enabling the liquid-cooled thin-film module to effectively adapt to the needs of foldable electronic devices.

[0035] Preferably, the material of the thin film layer is one or more of stainless steel, PET, copper, copper alloy, aluminum, and aluminum alloy. The material of the cover layer is one or more of PET, PE, copper, and TPU.

[0036] Preferably, the thickness of the thin film layer is 0.01 mm to 0.04 mm. The thickness of the cover layer is 0.01 mm to 0.02 mm. The thickness of the flow channel layer is 0.03 mm to 0.06 mm.

[0037] Preferably, some or all of the cover layer has fluid recesses on its side facing the flow channel layer. The fluid recesses communicate with the through-groove structure on the flow channel layer, becoming part of the fluid channel.

[0038] Preferably, the fluid recess comprises multiple recess units; the cross-section of each recess unit is arc-shaped, and its length extends along the flow direction of the fluid channel. The recess units are arranged side by side and spaced apart.

[0039] Preferably, the flow channel layer includes multiple fluid channels that are independent of each other but interlocked. Each fluid channel has an inlet port and an outlet port, and corresponds to a driving element.

[0040] Preferably, the liquid-cooled thin-film module is divided into a heat-absorbing region corresponding to the location of the heating element and a heat-releasing region corresponding to the location other than the heating element; the fluid channel is provided with multiple flow-diverting structures arranged at intervals along the flow direction of the cooling medium. Each flow-diverting structure includes flow-diverting strips arranged at intervals along the width of the fluid channel. The corresponding region of each flow-diverting strip on the fluid channel is divided into multiple parallel branch channels. The width of the flow-diverting strips and the spacing between adjacent flow-diverting strips in the heat-absorbing region flow-diverting structure are smaller than the width of the flow-diverting strips and the spacing between adjacent flow-diverting strips in the heat-releasing region flow-diverting structure, respectively.

[0041] Secondly, the present invention provides a method for preparing a liquid-cooled thin-film module, which is used to prepare the aforementioned liquid-cooled thin-film module. The preparation method includes:

[0042] The sheet materials for the flow channel layer, cover layer, and film layer are cut into the target shape, and through-slot structures are cut into the flow channel layer.

[0043] The flow channel layer, two cover layers, and two thin film layers are bonded and fixed together to form a fluid channel.

[0044] An external drive pump and infusion pipeline are used to connect the fluid channel. By switching the liquid introduced, the inner surface of the fluid channel is cleaned, roughened, activated and reduced in sequence.

[0045] A precursor solution of a water-oxygen barrier material is introduced into the fluid channel, so that an integral water-oxygen barrier layer is formed on the inner surface of the fluid channel.

[0046] Preferably, the flow direction of the precursor solution is switched once or multiple times during the formation of the water-oxygen barrier layer.

[0047] Thirdly, the present invention provides an electronic device comprising a housing module, a motherboard module for mounting a heating element, and the aforementioned liquid-cooled thin-film module. The liquid-cooled thin-film module covers the heating element.

[0048] Preferably, the middle part of the liquid-cooled thin-film module passes through the rotating shaft module.

[0049] The present invention has the following beneficial effects.

[0050] 1. Based on a stacked liquid-cooled film, the present invention provides a water-oxygen barrier layer on the outer surface of the film body with a piezoelectric micropump and / or on the inner surface of the film fluid channel, thereby increasing the barrier properties of the liquid-cooled film, reducing the water loss rate of the liquid-cooled film, suppressing the water loss phenomenon of the liquid-cooled film during long-term use, and greatly increasing the service life of the liquid-cooled film.

[0051] 2. This invention addresses the water-oxygen barrier layer on the inner surface of the thin-film fluid channel. After the layers of the stacked liquid-cooled thin film are bonded together, the water-oxygen barrier layer is deposited and formed by introducing a gaseous or liquid precursor into the fluid channel. This allows the water-oxygen barrier layer to form an integrated, closed structure, covering the gaps between the closed flow channel layer and adjacent layers, further improving the water-oxygen barrier effect. Simultaneously, the micron-scale water-oxygen barrier layer eliminates the need for excessive consideration of permeation issues in the other layers, thereby further promoting the thinning of each layer. The thin film layer effectively increases the strength of the liquid-cooled thin film, making the liquid-cooled thin-film module more suitable for micro-devices.

[0052] 3. This invention provides a five-layer liquid-cooled thin film that effectively protects the flow channels, inhibits the loss of cooling fluid, and features bending grooves in designated areas on the outermost film layer, enabling the liquid-cooled thin film module to bend in these areas, meeting the requirements of foldable electronic devices. Furthermore, the bending area of ​​this invention has a symmetrical, differentiated structure from the center outwards, which better meets the bending requirements at the turning points of foldable electronic devices.

[0053] 4. The present invention provides a liquid-cooled thin-film module with low water loss rate, wherein bending areas are provided in the upper and lower thin-film layers of the liquid-cooled thin-film module, so that the liquid-cooled thin-film module can be bent, and can be bent along the limiting part during bending, to meet the application scenarios that require folding.

[0054] 5. By setting fluid recesses on the cover layer corresponding to the fluid channel positions, the present invention can further reduce the flow resistance of the liquid cooling film module without increasing the liquid cooling film module, so that the flow rate of the cooling medium in the fluid channel is faster, the piezoelectric micropump has lower energy consumption and higher equivalent thermal conductivity when driving the cooling medium.

[0055] 6. This invention etches a transparent area into the thin film layer, making the internal cooling medium of the liquid cooling film visible. The movement of the internal cooling medium can be observed directly, making debugging and use more convenient. Attached Figure Description

[0056] Figure 1 This is an overall top view of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 1 of the present invention;

[0057] Figure 2 This is an exploded view of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 1 of the present invention.

[0058] Figure 3 This is a top view of the flow channel layer in Embodiment 1 of the present invention.

[0059] Figure 4 This is a schematic diagram of the bending region in Embodiment 1 of the present invention (i.e.) Figure 1 (A magnified view of part A in the middle).

[0060] Figure 5 This is a schematic diagram of the structure of the first bending part in Embodiment 1 of the present invention (i.e. Figure 2 (A magnified view of part B in the middle section).

[0061] Figure 6 This is a schematic diagram of the structure of the drive element mounting area in Embodiment 1 of the present invention.

[0062] Figure 7 This is a top view of the upper covering layer in Embodiment 1 of the present invention.

[0063] Figure 8 This is a cross-sectional schematic diagram of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 1 of the present invention.

[0064] Figure 9 This is a schematic diagram of the fluid depression structure in Embodiment 1 of the present invention (i.e.) Figure 7 (A magnified view of part C in the middle).

[0065] Figure 10 This is a simulation diagram of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 1 of the present invention.

[0066] Figure 11 This is an overall top view of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 2 of the present invention.

[0067] Figure 12 This is an exploded view of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 2 of the present invention.

[0068] Figure 13 This is a top view of the flow channel layer in Embodiment 2 of the present invention.

[0069] Figure 14 This is a simulation diagram of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 2 of the present invention.

[0070] Figure 15 This is an exploded view of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 3 of the present invention.

[0071] Figure 16 This is a top view of the flow channel layer in Embodiment 3 of the present invention.

[0072] Figure 17 This is a simulation diagram of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 3 of the present invention.

[0073] Figure 18 This is an exploded view of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 4 of the present invention.

[0074] Figure 19 This is a top view of the flow channel layer in Embodiment 4 of the present invention.

[0075] Figure 20 This is a simulation diagram of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 4 of the present invention.

[0076] Figure 21 This is a cross-sectional schematic diagram of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 5 of the present invention.

[0077] Figure 22 This is a schematic diagram of the dispensing path for a liquid-cooled thin-film module with low water loss rate provided in Embodiment 6 of the present invention.

[0078] Figure 23 This is a schematic diagram of the colloidal structure of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 7 of the present invention.

[0079] Figure 24 This is a schematic diagram of the welding structure of a liquid-cooled thin-film module with low water loss rate provided in Embodiment 8 of the present invention.

[0080] Figure 25 This is a partial schematic diagram of the bending area of ​​a liquid-cooled thin-film module with low water loss rate provided in Embodiment 9 of the present invention.

[0081] Figure 26 This is a schematic diagram of an electronic device provided in Embodiment 10 of the present invention.

[0082] In the figure, 1000 is the liquid-cooled thin-film module provided in Example 1; 100 is the upper thin-film layer; 110 is the first inflow passage; 120 is the first outflow passage; 130 is the first solder resist area; 140 is the second solder resist area; 150 is the welding area; 160 is the partition groove; 170 is the connecting groove; 200 is the upper cover layer; 210 is the second inflow passage; 220 is the second outflow passage; 230 is the fluid recess; 300 is the flow channel layer; 310 is the fluid channel; 311 is the inflow interface; 312 is the outflow interface; 400 is the lower cover layer; 500 is the lower thin-film layer; and 510 is the first limiting part. ; 520, Second limiting part; 530, Third limiting part; 600, First heat dissipation part; 700, Second heat dissipation part; 800, Piezoelectric micropump; 810, Main colloid; 820, Damping film; 900, Water and oxygen barrier layer; 2000, Liquid-cooled thin film module provided in Example 2; 3000, Liquid-cooled thin film module provided in Example 3; 4000, Liquid-cooled thin film module provided in Example 4; 9000, Electronic device; 9100, Housing module; 9200, Sub-board module; 9300, Screen module; 9400, Mainboard module; 9500, Battery module; 9600, Hinge module. Detailed Implementation

[0083] The present invention will be further described below with reference to the accompanying drawings.

[0084] Example 1

[0085] exist Figures 1 to 10 The embodiment 1 shown provides a technical solution: a liquid-cooled thin film module 1000 with low water loss rate, including a driving element, a thin film body and a water and oxygen barrier layer 900; the thin film body includes a flow channel layer 300, two cover layers fixedly connected to both sides of the flow channel layer 300, and two thin film layers respectively disposed on the outside of the two cover layers.

[0086] Figure 1 This is an overall top view of a liquid-cooled thin-film module 1000 with low water loss rate provided in this embodiment. Figure 2 These are exploded views of a low-water-loss liquid-cooled thin-film module 1000 provided in Embodiment 1. The two figures specifically show the outer shape and peripheral connection relationship of the low-water-loss liquid-cooled thin-film module 1000 of this embodiment.

[0087] like Figure 1 and Figure 2As shown, the flow channel layer 300 has a through-slot structure; the shape of the through-slot structure is set according to the target flow path of the cooling medium. The sidewalls of the through-slot structure and the upper and lower cover layers form a fluid channel 310 for the flow of the cooling medium. The cover layer includes an upper cover layer 200 and a lower cover layer 400, which are respectively attached to and fixedly connected to the upper and lower sides of the flow channel layer 300. The thin film layer includes an upper thin film layer 100 and a lower thin film layer 500. The upper thin film layer 100 is attached to and fixedly connected to the outer side of the upper cover layer 200. The lower thin film layer 500 is attached to and fixedly connected to the outer side of the lower cover layer 400.

[0088] In this embodiment, the fluid channel 310 has a serpentine, meandering structure, and flows back and forth along the length direction within the rounded rectangular film body.

[0089] The water-oxygen barrier layer 900 is wrapped around the outer surface of the film body, completely covering the upper and lower sides and the surrounding edges of the film body. The water-oxygen barrier layer 900 is completely sealed, providing comprehensive protection against permeation and evaporation of the coolant within the film body, thereby significantly reducing the water loss rate of the film body. A driving element is fixedly connected to the upper film layer 100 in series with the fluid channel 310. The fluid channel 310 forms a circulation loop through the driving element. In some embodiments, the driving element is attached to the water-oxygen barrier layer 900.

[0090] In this embodiment, the liquid-cooled thin-film module 1000 is a rectangle with rounded corners on all four sides, and it is elongated, meaning its length is significantly greater than its width. The upper thin-film layer 100, upper cover layer 200, flow channel layer 300, lower cover layer 400, and lower thin-film layer 500 have identical outer contours and sizes, and are stacked together to form a single, low-water-loss liquid-cooled thin-film module. In this embodiment, the upper thin-film layer 100, upper cover layer 200, flow channel layer 300, lower cover layer 400, and lower thin-film layer 500 are sequentially fixed together using an adhesive bonding method. The driving element is fixedly connected to the upper thin-film layer 100, forming the liquid-cooled thin-film module 1000.

[0091] In this embodiment, the upper thin film layer 100 and the lower thin film layer 500 are made of stainless steel. In some other embodiments, the upper thin film layer 100 and the lower thin film layer 500 may also be made of one or more of copper, copper alloy, aluminum, and aluminum alloy. The upper thin film layer 100 and the lower thin film layer 500 can protect the liquid-cooled thin film module and further reduce the water loss rate of the liquid-cooled thin film module.

[0092] In some embodiments, the thicknesses of the upper thin film layer 100 and the lower thin film layer 500 are between 0.01 mm and 0.04 mm. In this embodiment, the thicknesses of the upper thin film layer 100 and the lower thin film layer 500 are preferably 0.02 mm.

[0093] In this embodiment, the upper cover layer 200 and the lower cover layer 400 are made of PET. In some other embodiments, the upper cover layer 200 and the lower cover layer 400 may also be made of one or more of PE and TPU.

[0094] In some embodiments, the thickness of the upper cover layer 200 and the lower cover layer 400 is between 0.01 mm and 0.02 mm. In this embodiment, the thickness of the upper cover layer 200 and the lower cover layer 400 is preferably 0.125 mm.

[0095] Figure 3 This is a top view of the flow channel layer 300 in a low-water-loss liquid-cooled thin-film module 1000 provided in this embodiment. The figure specifically shows the peripheral shape and peripheral connection relationship of the low-water-loss liquid-cooled thin-film module 1000 of this embodiment. Figure 2 and Figure 3 As shown, in this embodiment, the fluid channel 310 is a hollowed-out channel provided on the flow channel layer 300. The upper cover layer 200 and the lower cover layer cover and seal the fluid channel 310 so that the cooling medium can flow through the fluid channel 310 in the flow channel layer 300.

[0096] The fluid channel 310 includes an inlet port 311, an outlet port 312, and a flow channel body connecting the inlet port 311 and the outlet port 312. The inlet port 311 and the outlet port 312 are close to each other, with a partition structure between them. The inlet port 311 and the outlet port 312 are respectively connected to the pump output port and pump input port of the driving element to realize the cyclic driving of the cooling medium by the driving element. When the cooling medium flows in the fluid channel 310, it continuously circulates between the inlet port 311 and the outlet port 312. In this embodiment, the flow channel layer 300 is made of PET. In some other embodiments, the material of the flow channel layer 300 can be one or more of PE, copper, and TPU. The inlet port 311 and the outlet port 312 are located at the ends of the film body.

[0097] In some embodiments, the thickness of the flow channel layer 300 is between 0.03 and 0.06 mm, and in this embodiment, the thickness of the flow channel layer 300 is 0.05 mm.

[0098] Figure 4 This embodiment provides a low-water-loss liquid-cooled thin-film module 1000. Figure 2 Enlarged view of point A, Figure 5This embodiment provides a low-water-loss liquid-cooled thin-film module 1000. Figure 1 The enlarged view at point B in the two images specifically shows the bending area of ​​a low-water-loss liquid-cooled thin-film module 1000 according to this embodiment. For example... Figure 4 and Figure 5 As shown, in this embodiment, the upper film layer 100 and the lower film layer 500 have mutually aligned bending regions in the middle, and the bending regions are perpendicular to the stainless steel rolling and stretching direction of the upper film layer 100 and the lower film layer 500.

[0099] like Figure 1 As shown, the bending region divides the liquid-cooled thin-film module 1000 into a first heat dissipation section 600 and a second heat dissipation section 700. The first heat dissipation section 600, the bending region, and the second heat dissipation section 700 are arranged sequentially along the length of the liquid-cooled thin-film module 1000.

[0100] The bending region includes a first bending region, a second bending region, and a third bending region. A second bending region is located on each side of the first bending region; a third bending region is located on the side of each of the two second bending regions opposite to the first bending region. The two second bending regions are symmetrically arranged. The two third bending regions are symmetrically arranged.

[0101] The first bending region includes a plurality of first limiting portions 510 arranged at intervals in sequence; the first limiting portions 510 are elongated strips and extend along the width direction of the liquid-cooled thin film module 1000 (i.e., Figure 4 Extending in the left-right direction. Each first limiting part 510 is formed and separated by multiple first bending grooves formed in the thin film layer. Each second bending region is provided with a second limiting part 520. Each third bending region includes multiple third limiting parts 530 arranged at intervals (in this embodiment, the number on one side is 3). The third limiting part 530 is elongated and extends along the width direction of the liquid-cooled thin film module 1000 (i.e., in the left-right direction). Figure 4 Extending in the left-right direction. Each third limiting portion 530 is formed and separated by a plurality of third bending grooves formed in the thin film layer. The second limiting portion 520 is separated from the adjacent first limiting portion 510 and third limiting portion 530 by bending grooves.

[0102] Among all the bending portions, the first limiting portion 510 has the smallest width, referring to... Figure 4 The distance between any two first limiting portions 510 is equal. The second limiting portion 520 has the largest width; the width of the third limiting portion 530 is in the middle. The bending area of ​​the liquid-cooled thin-film module 1000 can be bent during use to meet the requirements of foldable electronic products. In addition, the differentiated design of the first, second, and third bending areas can disperse bending stress and reduce bending stress caused by rigid or thicker layers.

[0103] Figure 6 This is a schematic diagram of the installation of the driving element of a low-water-loss liquid-cooled thin-film module 1000 provided in this embodiment. The diagram specifically shows the installation position and area of ​​the driving element of the low-water-loss liquid-cooled thin-film module 1000 in this embodiment. Figure 2 and Figure 6 As shown, in this embodiment, both the upper thin film layer 100 and the cover layer 200 have two fluid flow holes for connecting the drive element. The two fluid flow holes on the upper thin film layer 100 are aligned with the two fluid flow holes on the cover layer 200.

[0104] The two fluid flow holes include two symmetrically arranged inflow and outflow holes. A first inflow hole 110 and a first outflow hole 120 are provided on the upper thin film layer 100, and a second inflow hole 210 and a second outflow hole 220 are provided on the upper cover layer 200. Both the inflow and outflow holes are circular holes, spaced apart. The second inflow hole 210 and the second outflow hole 220 are aligned with and connected to the inflow interface 311 and the outflow interface 312 of the fluid channel 310, respectively.

[0105] The diameter of the inflow orifice is larger than the diameter of the outflow orifice. In this embodiment, the driving element is a piezoelectric micropump 800, which is rectangular and includes two fluid drive ports: a pump inlet and a pump outlet. The pump outlet and pump inlet are respectively sealed to the inflow and outflow orifices. In some other embodiments, other pumping elements, such as impeller pumps, can also be used as the driving element.

[0106] In this embodiment, as Figure 6 As shown, the piezoelectric micropump 800 has a pump flow inlet and a pump flow outlet connected side that is bonded and fixed to the mounting area on the upper thin film layer 100.

[0107] The specific process of bonding the piezoelectric micropump 800 to the upper thin film layer 100 is as follows:

[0108] (1) The membrane body and the pump body are subjected to dust removal, degreasing and plasma treatment to ensure that the cleanliness and surface energy of the membrane body and the pump body meet the predetermined process requirements.

[0109] (2) Place the film body to be dispensed or the piezoelectric micropump 800 at the dispensing station, and preset the dispensing path, dispensing position coordinates, dispensing amount, dispensing speed, glue valve opening / closing time, nozzle height and ambient temperature and humidity in the dispensing control system, and associate the parameters with the corresponding product model.

[0110] In this embodiment, Figure 6In the middle, the shape of the outer contour of the connecting side of the piezoelectric micropump 800 and the pump inlet and outlet is as follows: Figure 6 As shown by the blue line in the image. The dispensing path is as follows. Figure 6 As shown by the red line, the adhesive path includes an outer adhesive path that surrounds the inner side of the outer edge of the piezoelectric micropump 800's connecting side, and two inner adhesive paths that surround the pump inlet and outlet of the piezoelectric micropump 800, respectively. The adhesive path can be set on either the film body or the surface of the piezoelectric micropump.

[0111] (3) Precise alignment is required for dispensing. The dispensing platform or dispensing head is driven to move along a preset path. The dispensing valve is opened and closed according to the set dispensing amount and dispensing speed, so that the adhesive is discharged from the nozzle in a stable, continuous or intermittent manner and deposited on the film or pump body at a predetermined position. Among them, the dispensing pressure, dispensing flow rate, nozzle height and ambient temperature and humidity are collected in real time through the closed-loop control module. Feedback correction is made for cycle deviation or dispensing abnormality to ensure that the single dispensing amount and adhesive line width are within the tolerance range.

[0112] (4) After dispensing, pre-curing or full curing is carried out under preset temperature and time conditions; the dispensing position, glue dot (glue line) size, glue volume and appearance defects are detected by online visual inspection or three-dimensional height measurement equipment. Products that do not meet the preset quality standards are marked and rejected. If necessary, the test results are fed back to the dispensing parameter setting step to adaptively optimize the dispensing parameters.

[0113] The colloid selected in this embodiment has sufficient water tightness and can withstand moisture and humidity for a long time. It also has low flowability (which facilitates the formation of insulating dams) and is not prone to overflow inside or outside the pores. The colloid here includes, but is not limited to, silicone system colloids, epoxy system colloids, acrylic system colloids and organosilicon system colloids.

[0114] Figure 7 This is a top view of the cover layer on a liquid-cooled thin-film module with a low water loss rate in some optional embodiments. Figure 8 This is a cross-sectional view of a liquid-cooled thin-film module with low water loss rate provided in this embodiment. Figure 9 These are liquid-cooled thin-film modules in some optional embodiments. Figure 7 Enlarged view of point C.

[0115] like Figure 8 As shown, the water-oxygen barrier layer 900 completely covers all external surfaces of the film body. In this embodiment, the water-oxygen barrier layer 900 uses an organic polymer material. When the cooling medium flows, the organic polymer material can effectively block the evaporation or permeation of the cooling medium, reducing the water loss rate. The thickness of the organic polymer material is between 0.5 μm and 1 μm. In this embodiment, the thickness of the organic polymer material is 0.5 μm, and the organic polymer material is formed by chemical vapor deposition (CVD).

[0116] In some other embodiments, the water and oxygen barrier layer 900 may also be made of copper, gold, titanium, silicon dioxide, or other materials with high water and oxygen barrier properties.

[0117] like Figure 8 and Figure 9 As shown, in some embodiments, both the upper cover layer 200 and the lower cover layer 400 have fluid recesses 230 on their sides facing the flow channel layer 300. The position and shape of the fluid recesses 230 match the position of the fluid channel 310 on the flow channel layer 300. The fluid recesses 230 are recessed away from the flow channel layer 300, thus becoming part of the fluid channel 310. This allows the cooling medium to sink into the fluid recesses 230 as it passes through, further expanding the cross-sectional size of the fluid channel 310 and reducing flow resistance. Furthermore, the fluid recesses 230 are groove structures that do not penetrate the cover layer.

[0118] like Figure 9 As shown, the fluid recess 230 comprises multiple small recessed units that do not penetrate the covering layer; the cross-section of each recessed unit is arc-shaped, and its length extends along the flow direction of the fluid channel 310. The recessed units are arranged side-by-side and spaced apart. The fluid recess 230 is part of the fluid channel 310; that is, the inlet port 311, the outlet port 312, and the fluid recess 230 together constitute the fluid channel 310. Figure 10 This is a simulation diagram of Embodiment 1 of a low-water-loss liquid-cooled thin-film module 1000 provided in this embodiment, simulating the heat dissipation under natural convection at room temperature and a power consumption of 3W. Figure 10 As shown, the simulated liquid-cooled thin-film module has a maximum temperature of 58.9℃ and a minimum temperature of 31.4℃ within a 1000-area region, and still has a high equivalent thermal conductivity within a relatively small area.

[0119] The heat dissipation process of a low-water-loss liquid-cooled thin-film module 1000 provided in this embodiment is as follows: This embodiment is applicable to foldable electronic devices. When in use, the liquid-cooled thin-film module 1000 covers the heat-generating element. When the electronic device is working, the heat-generating element generates heat, which is absorbed by the liquid-cooled thin-film module 1000. The cooling medium is driven by the piezoelectric micro-pump 800 to enter the inlet 311 of the fluid channel 310 through the outlet 312 of the fluid channel 310, thereby driving the cooling medium to circulate in the fluid channel 310. During this process, it will also pass through the fluid depression 230, which makes the flow rate of the cooling medium faster and realizes the dissipation of heat from the heat-generating area.

[0120] The fabrication process of a low-water-loss liquid-cooled thin-film module 1000 provided in this embodiment is as follows:

[0121] (1) The whole sheet is laser-cut into the target shape, and then the fluid channel 310 is laser-cut into the sheet of the flow channel layer 300. In this embodiment, the target shape is a rectangle with rounded corners.

[0122] (2) Inflow and outflow holes are cut into the upper cover layer 200 and the upper thin film layer 100 using laser cutting.

[0123] (3) The upper thin film layer 100, the upper cover layer 200, the flow channel layer 300, the lower cover layer 400, and the lower thin film layer 500 are fixedly connected by adhesive hot pressing to form a fluid channel 310. Then, the limiting parts of the upper thin film layer 100 and the lower thin film layer 500 are etched by etching solution.

[0124] (4) Bond the piezoelectric micropump to the welding area.

[0125] (5) Deposit organic polymer materials on the entire liquid cooling film to form a water-oxygen barrier layer 900.

[0126] In some embodiments, to make the liquid cooling film visible, after the upper film layer 100, upper cover layer 200, flow channel layer 300, lower cover layer 400, and lower film layer 500 are stacked and fixed, and before the water and oxygen barrier layer 900 is deposited, etching is performed on the upper film layer 100 and / or the lower film layer 500 to form a visualization area for the user to view the flow of the cooling medium.

[0127] In this embodiment, the cooling medium flows within the flow channel layer of the liquid-cooled thin-film module. By actively controlling the circulation of the cooling medium within the flow channel layer, heat from the heat source is absorbed. The simulated heat dissipation effect at a power consumption of 3W is as follows: Figure 10 As shown. Compared to ordinary VC heat sinks, the low-water-loss liquid-cooled thin-film module provided in this embodiment can increase the equivalent thermal conductivity by more than 60%, resulting in stronger heat dissipation capabilities.

[0128] Figure 10 This is a simulation diagram of a low-water-loss liquid-cooled thin-film module 1000 provided in this embodiment, simulating heat dissipation under natural convection at room temperature and a power consumption of 3W. Figure 10 As shown, in this embodiment, the highest temperature in the simulated liquid-cooled thin-film module 2000 area is 58.9℃ and the lowest temperature is 31.4℃, which can achieve effective heat dissipation.

[0129] Example 2

[0130] like Figures 11 to 14 The illustrated embodiment 2 provides a technical solution: a liquid-cooled thin-film module 2000 with low water loss rate. The difference between the liquid-cooled thin-film module 2000 provided in this embodiment and the liquid-cooled thin-film module provided in embodiment 1 is that this embodiment is applicable to flat-panel electronic devices and does not have a limiting part.

[0131] Figure 11 This is an overall top view of a second embodiment of a low-water-loss liquid-cooled thin-film module 2000 provided in this embodiment, referring to... Figure 11 In this embodiment, the outer contour shape of the liquid-cooled thin-film module 2000 is set according to the internal space of the candybar electronic device. The liquid-cooled thin-film module 2000 covers the heat-generating element.

[0132] Figure 12 This is an exploded view of a second embodiment of a low-water-loss liquid-cooled thin-film module 2000 provided in this embodiment. In this embodiment, the liquid-cooled thin-film module 2000 includes a driving element, a thin-film body, and a water-oxygen barrier layer 900. The thin-film body, from top to bottom, includes an upper thin-film layer 100, an upper cover layer 200, a flow channel layer 300, a lower cover layer 400, and a lower thin-film layer 500, all with identical peripheral shapes and sizes. The upper thin-film layer 100 and the lower thin-film layer 500 are made of stainless steel. The thickness of the upper thin-film layer 100 and the lower thin-film layer 500 is selected between 0.01 and 0.04 mm; in this embodiment, the thickness of the upper thin-film layer 100 and the lower thin-film layer 500 is 0.025 mm. The upper cover layer 200 and the lower cover layer 400 can be made of one or more of PET, PE, copper, and TPU. The upper cover layer 200 and the lower cover layer 400 are made of PET. The thickness of the upper cover layer 200 and the lower cover layer 400 is selected between 0.015 and 0.03 mm. In this embodiment, the thickness of the upper cover layer 200 and the lower cover layer 400 is 0.02 mm. The flow channel layer 300 is made of PET material, and the thickness of the flow channel layer 300 is selected between 0.05 and 0.1 mm. In this embodiment, the thickness of the flow channel layer 300 is 0.1 mm.

[0133] The flow channel layer 300 has a main body of fluid channel 310 for the flow of cooling working fluid; in some embodiments, the upper cover layer 200 and the lower cover layer 400 have fluid recesses that communicate with the main body of fluid channel 310.

[0134] The water and oxygen barrier layer 900 is wrapped around the outer surface of the film body. The material and manufacturing process of the water and oxygen barrier layer 900 are the same as in Example 1.

[0135] Figure 13 This is a top view of the flow channel layer 300 of a low-water-loss liquid-cooled thin-film module 2000 provided in this embodiment, with reference to... Figure 13In this embodiment, the flow channel layer 300 includes two sets of independent and interlocking fluid channels 310. Each set of fluid channels 310 has an inlet port 311 and an outlet port 312. Correspondingly, in this embodiment, two piezoelectric micropumps are respectively provided and connected to the two sets of fluid channels 310. The piezoelectric micropumps are connected to the inlet port 311 and outlet port 312 of the corresponding fluid channel 310. When the liquid-cooled thin film module 2000 in this embodiment is working, cooling medium flows through both fluid channels 310 and dissipates heat independently.

[0136] This interlocking dual-channel structure helps reduce flow resistance, increase flow rate, and maintains heat dissipation function without complete loss when a partial failure occurs in the liquid-cooled thin-film module 2000 (such as blockage of one set of fluid channels 310, damage to one of the piezoelectric micropumps, etc.).

[0137] Figure 14 This is a simulation diagram of a low-water-loss liquid-cooled thin-film module 2000 provided in this embodiment, simulating heat dissipation under natural convection at room temperature and a power consumption of 3W. Figure 14 As shown, in this embodiment, the highest temperature in the simulated liquid-cooled thin film module 2000 area is 49.2°C and the lowest temperature is 30.6°C. Compared with Embodiment 1, the liquid-cooled thin film module 2000 in this embodiment has higher manufacturing cost and driving power, but its thermal conductivity is also higher, and its temperature uniformity is better than that of Embodiment 1.

[0138] Based on the optional materials for the upper cover layer 200 and lower cover layer 400 provided in Embodiment 1, the materials for the upper cover layer 200 and lower cover layer 400 can also be copper. Using copper for the cover layers provides greater structural strength and water / oxygen barrier properties, but it increases the module thickness and makes bending more difficult.

[0139] Example 3

[0140] like Figures 15 to 17 The embodiment 3 shown provides a technical solution: a liquid-cooled thin-film module 3000 with low water loss rate.

[0141] Figure 15 This is an exploded view of a second embodiment of a low-water-loss liquid-cooled thin-film module 3000 provided in this embodiment. In this embodiment, the liquid-cooled thin-film module 3000 includes a driving element, a thin-film body, and a water-oxygen barrier layer. The thin-film body includes, from top to bottom, an upper thin-film layer 100, an upper cover layer 200, a flow channel layer 300, a lower cover layer 400, and a lower thin-film layer 500, all with identical outer shapes and sizes.

[0142] The only difference between the liquid-cooled thin-film module 3000 provided in this embodiment and the liquid-cooled thin-film module provided in Embodiment 1 is that: this embodiment is applicable to straight-board electronic devices and has no limiting part; the shape of the thin-film body is different and the path of the internal fluid channel 310 is different.

[0143] like Figure 16 As shown, in this embodiment, the inflow port 311 and outflow port 312 of the fluid channel 310 are located at one corner of the liquid-cooled thin-film module 3000. The fluid channel 310 has multiple flow-diverting structures arranged at intervals along the flow direction of the cooling medium. Each flow-diverting structure includes flow-diverting strips arranged at intervals along the width direction of the fluid channel 310. The corresponding area of ​​each flow-diverting strip on the fluid channel 310 is divided into multiple parallel branch channels. These multiple flow-diverting structures cause the cooling medium to continuously split and merge during flow, disturbing the flowing cooling medium and promoting the uniform distribution of heat absorbed in the cooling medium, thereby improving heat dissipation efficiency.

[0144] The fluid channel 310 is provided with a heat absorption region corresponding to the location of the heating element. The width of the flow divider and the spacing between adjacent flow dividers in the flow divider structure in the heat absorption region are smaller than the width of the flow dividers and the spacing between adjacent flow dividers in the flow divider structure in other regions, so that the cooling medium is divided into more branches in the heat absorption region, thereby improving the heat absorption efficiency.

[0145] Figure 17 This is a simulation diagram of a low-water-loss liquid-cooled thin-film module 3000 provided in this embodiment, simulating heat dissipation under natural convection at room temperature and a power consumption of 3W. Figure 17 As shown, in this embodiment, the highest temperature in the simulated liquid-cooled thin-film module 3000 area is 56.3℃, and the lowest temperature is 30.2℃.

[0146] Example 4

[0147] like Figures 18 to 20 The illustrated embodiment 4 provides a technical solution: a liquid-cooled thin-film module 4000 with low water loss rate.

[0148] Figure 18 This is an exploded view of a second embodiment of a low-water-loss liquid-cooled thin-film module 4000 provided in this embodiment. In this embodiment, the liquid-cooled thin-film module 4000 includes a driving element, a thin-film body, and a water-oxygen barrier layer. The thin-film body includes, from top to bottom, an upper thin-film layer 100, an upper cover layer 200, a flow channel layer 300, a lower cover layer 400, and a lower thin-film layer 500, all with identical outer shapes and sizes.

[0149] The only difference between the liquid-cooled thin-film module 4000 provided in this embodiment and the liquid-cooled thin-film module provided in Embodiment 1 is that: this embodiment is applicable to straight-board electronic devices and has no limiting part; the shape of the thin-film body is different and the path of the internal fluid channel 310 is different.

[0150] like Figure 19 As shown, in this embodiment, the inflow port 311 and outflow port 312 of the fluid channel 310 are located at one corner of the liquid-cooled thin-film module 4000. The fluid channel 310 includes a main flow path and multiple branch circulation flow paths. The main flow path includes a heat-absorbing section and a connecting section. The heat-absorbing section is connected to the inflow port 311 and the outflow port 312 through the connecting section. The position of the heat-absorbing section corresponds to the heat-absorbing area of ​​the heating element attached to the liquid-cooled thin-film module 4000. The branch circulation flow paths are connected to the heat-absorbing section of the main flow path and do not pass through the inflow port 311 and the outflow port 312.

[0151] Figure 20 This is a simulation diagram of a low-water-loss liquid-cooled thin-film module 4000 provided in this embodiment, simulating heat dissipation under natural convection at room temperature and a power consumption of 3W. Figure 20 As shown, in this embodiment, the highest temperature in the simulated liquid-cooled thin-film module 4000 area is 41.1℃ and the lowest temperature is 31℃.

[0152] Example 5

[0153] A liquid-cooled thin-film module with low water loss rate includes a driving element, a water-oxygen barrier layer 900, and a thin-film body; the structure of the thin-film body in this embodiment is the same as that provided in any one of the embodiments 1-4.

[0154] The location and formation method of the water-oxygen barrier layer 900 in this embodiment differ from those in embodiments 1-4, the difference being: ... Figure 21 As shown, the water-oxygen barrier layer 900 is not disposed on the outer surface of the film body, but on the inner wall of the fluid channel 310.

[0155] In this embodiment, the water-oxygen barrier layer 900 is made of copper. The copper layer completely covers all surfaces within the fluid channels 310 of the flow channel layer 300. Specifically, the copper layer covers the upper and lower surfaces and the inner surface of the fluid channels 310. When the cooling medium flows, it flows within the copper layer covering the flow channel layer 300. The copper layer effectively blocks the evaporation or permeation of the cooling medium, reducing water loss. The thickness of the flow channel layer 300 is between 0.03 and 0.06 mm; in this embodiment, the thickness is 0.05 mm, while the thickness of the covering copper layer is between 0.5 μm and 1 μm; in this embodiment, the copper layer thickness is 0.5 μm. In this embodiment, the copper layer as the water-oxygen barrier layer 900 is formed using a chemical vapor deposition method. In some other embodiments, the copper layer can also be formed using physical vapor deposition (PVD), chemical vapor deposition (CVD), electroplating, or other methods. In some other embodiments, the water and oxygen barrier layer 900 may also be made of gold, titanium, silicon dioxide, or other materials with high water and oxygen barrier properties.

[0156] In this embodiment, the overall width of the film body is narrower than that of Embodiment 1, making it more suitable for small-sized devices or devices with insufficient internal space.

[0157] The heat dissipation process of the low-water-loss liquid-cooled thin-film module 5000 provided in this embodiment is as follows: This embodiment is applicable to foldable electronic devices. During use, the liquid-cooled thin-film module 5000 covers the heat-generating element. When the electronic device is working, the heat-generating element generates heat, which is absorbed by the liquid-cooled thin-film module 5000. The cooling medium is driven by the piezoelectric micro-pump 800 from the outflow port 312 of the fluid channel 310 to the inflow port 311 of the fluid channel 310, thereby driving the cooling medium to circulate within the fluid channel 310. During this process, it also passes through the fluid depression 230, which makes the flow rate of the cooling medium faster, realizing the dissipation of heat from the heat-generating area. At the same time, since the inner surface of the fluid channel 310 is covered with a water-oxygen barrier layer 900, the fluid channel 310 has high barrier properties for the cooling medium during the flow process, resulting in a low water loss rate and a longer service life of the liquid-cooled thin-film module.

[0158] The fabrication process of a low-water-loss liquid-cooled thin-film module 5000 provided in this embodiment is as follows: First, a whole sheet of material is laser-cut into a rectangle with rounded corners. Then, a fluid channel 310 is laser-cut on the sheet of the flow channel layer 300. Next, inflow and outflow holes are laser-cut on the upper cover layer 200 and the upper thin film layer 100. Then, the upper thin film layer 100, upper cover layer 200, flow channel layer 300, lower cover layer 400, and lower thin film layer 500 are fixedly connected by adhesive hot pressing. Next, the limiting parts of the upper thin film layer 100 and the lower thin film layer 500 are etched by etching solution. Then, a copper layer is coated on the inner surface of the fluid channel 310 in the flow channel layer 300 by chemical copper plating. Finally, the piezoelectric micropump 800 is bonded and fixed.

[0159] In some embodiments, the copper layer is coated on the inner surface of the fluid channel 310 by chemical deposition (including vapor phase chemical deposition and liquid phase chemical deposition), such as the following liquid phase chemical deposition scheme:

[0160] (1) An external drive pump and a delivery pipeline are used to connect the inflow port 311 and the outflow port 312 of the fluid channel 310. The external drive pump is a peristaltic pump or other drive pump structure in which the liquid does not pass through the internal structure of the pump. The delivery pipeline is made of Teflon tubing or other low surface energy materials to prevent metal deposition from occurring simultaneously inside the external drive pump or the delivery pipeline.

[0161] (2) Turn on the external drive pump, and introduce alcohol, deionized water (DI Water) or other cleaning agents to clean the inner surface of the fluid channel 310. Control the flow rate of the external drive pump to avoid damage to the liquid-cooled film module. Continuously drain the liquid for more than 10 minutes, and finally drain and clean with deionized water for more than 5 minutes.

[0162] (3) Place the membrane in a water bath or other continuously heated equipment.

[0163] (4) Turn on the external drive pump and introduce a roughening agent (such as Skyclean 323C, 321C or high concentration alkaline solution) to roughen the inner surface of the fluid channel 310. Control the flow rate of the external drive pump to avoid damage to the liquid-cooled film module. Set the water bath temperature to 40-60℃, preferably 50℃, and continue to drain for 5-10 minutes. Finally, drain and clean with deionized water for more than 5 minutes.

[0164] (5) Turn on the external drive pump and introduce prepreg (Skycat 330C or other similar products) to pre-wet the sidewall of the film. Control the flow rate of the external pump to avoid damage to the liquid-cooled film module. Set the water bath temperature to 20-35℃, preferably 28℃, and continue to drain for 10-60 seconds.

[0165] (6) Turn on the external drive pump and introduce activator (Skycat 333C or other similar products) to activate the membrane sidewall. Control the flow rate of the external pump to avoid membrane damage. Set the water bath temperature to 40-60℃, preferably 50℃. Continuously drain for 60-120s. Finally, drain and rinse with deionized water for more than 5min.

[0166] (7) Turn on the external drive pump and introduce a reducing agent (Skycat 336R or other similar products) to reduce the sidewalls of the thin film. Control the flow rate of the external drive pump to avoid damage to the thin film. Set the water bath temperature to 30-50℃, preferably 45℃, and continue draining for 30-60 seconds. Finally, rinse with deionized water for at least 5 minutes. The reduction treatment is used to provide electrons, which will cause the Cu in the copper plating solution to be in a complexed state. 2+ The ions are reduced to elemental copper (Cu), allowing copper to be deposited without an applied current.

[0167] (8) Turn on the external drive pump and introduce copper deposition solution (Skycat 369 series or other similar products) to deposit copper on the sidewall of the membrane. Increase the flow rate of the external pump to improve the ion exchange rate. The flow rate can be set to 5-15 mL / min, preferably 10 mL / min. The water bath temperature is set to 30-50℃, preferably 35℃. After continuously draining for 5-6 minutes, reduce the flow rate to 3-5 mL / min to stabilize the formation of a dense copper layer on the surface. Continue draining for 3-5 minutes. In some other embodiments, the water and oxygen barrier layer 900 uses other high water and oxygen barrier materials besides copper, and the copper deposition solution is replaced with the precursor solution of the corresponding high water and oxygen barrier material.

[0168] (9) After reversing the connection between the inlet and outlet of the external drive pump and the infusion pipeline, repeat the steps to pump the copper plating solution in reverse, thereby increasing the uniformity of the plating layer and avoiding or reducing the problem of inconsistent ion exchange rates in different areas of the film caused by the reduced flow rate at the tail end.

[0169] (10) Replace with a brand new pipeline to prevent copper fragments deposited on the pipe wall from flowing into the flow channel. Finally, rinse with deionized water for more than 5 minutes to complete the copper deposition on the pipe wall.

[0170] The chemical deposition method after thin film encapsulation (that is, after the thin film layer, cover layer and flow channel layer 300 are bonded into a multi-layer thin film) enables the water and oxygen barrier layer 900 on the inner surface of the fluid channel to be formed in one step without any gaps. At the same time, the water and oxygen barrier layer 900 can cover the gap at the connection between the flow channel layer 300 and the cover layer, further improving the water and oxygen barrier effect.

[0171] In some other embodiments, the water and oxygen barrier layer 900 can also be formed by processing or installing on the flow channel layer 300 and the cover layer 300 respectively before the cover layer and the flow channel layer 300 are assembled. In these embodiments, there are gaps at the connection between the cover layer and the flow channel layer 300. The water and oxygen barrier effect is slightly lower than that of the embodiment with chemical deposition after encapsulation, but it can still achieve a good water and oxygen barrier effect.

[0172] Example 6

[0173] A liquid-cooled thin-film module with low water loss rate includes a driving element, a thin-film body, and a water-oxygen barrier layer; the structure of the thin-film body in this embodiment is the same as that in any one of the embodiments 1-5.

[0174] The only difference between this embodiment and Embodiment 1 is that the dispensing path in the bonding structure between the piezoelectric micropump 800 and the film body or water-oxygen barrier layer is different.

[0175] like Figure 22 As shown, in this embodiment, the dispensing path includes an outer adhesive path that surrounds the inner side of the outer edge of the connecting side of the piezoelectric micropump 800, and a separating adhesive path. The two ends of the separating adhesive path are connected to the two opposite sides of the outer adhesive path, respectively. The separating adhesive path passes between the pump inlet and the pump outlet of the piezoelectric micropump 800, separating the pump inlet and the pump outlet into two independent regions. Figure 22 In the diagram, the blue lines represent the outer contour of the connection side of the piezoelectric micropump 800 and the shape of the pump inlet and outlet contours, while the red lines represent the shape of the dispensing path.

[0176] Example 7

[0177] A liquid-cooled thin-film module with low water loss rate includes a driving element, a thin-film body, and a water-oxygen barrier layer; the structure of the thin-film body in this embodiment is the same as that in any one of the embodiments 1-5.

[0178] The only difference between this embodiment and embodiment 6 is that: Figure 23 As shown, the dispensing paths in the bonding structure between the piezoelectric micropump 800 and the membrane substrate or water-oxygen barrier layer are different. Each of the two independent regions separated by the partition adhesive path is equipped with a dammed adhesive membrane 820. The pump inlet and outlet are located within the outer contours of the two dammed adhesive membranes 820. The dammed adhesive membranes 820 have clearance holes at the corresponding pump inlet and outlet positions to prevent blockage of the pump inlet and outlet.

[0179] The colloid on the dispensing path is the main colloid 810; the dam glue film 820 uses a double-sided self-adhesive film. On the one hand, it can improve the reliability of the bonding structure, and on the other hand, it can protect the pump flow input port and the pump flow output port, avoiding the overflow glue or insufficient dispensing caused by directly dispensing the main colloid 810 around the pump flow input port and the pump flow output port, resulting in the failure of the internal self-circulation in the hole.

[0180] Embodiment 8

[0181] A liquid-cooled thin film module with a low water loss rate includes a driving element, a thin film main body, and a water and oxygen barrier layer; in this embodiment, the structure of the thin film main body is the same as that of the thin film main body in any one of Embodiments 1-5.

[0182] The difference between this embodiment and Embodiments 1-5 is only that: instead of using colloid bonding and fixing between the piezoelectric micropump 800 and the thin film main body or the water and oxygen barrier layer, welding fixing is adopted.

[0183] In this embodiment, as Figure 24 shown, the connecting side surface of the piezoelectric micropump 800 provided with the pump flow input port and the pump flow output port is welded and fixed to the installation area on the upper thin film layer 100. The outer contour of the installation area of the upper thin film layer 100 is the same as the outer contour of the connecting side surface of the piezoelectric micropump 800. The installation area of the upper thin film layer 100 includes a first solder mask area 130, two second solder mask areas 140, and two welding areas 150. The first solder mask area 130 is in the shape of a Chinese character 'Ri', including an outer peripheral part and a separating part. The outer peripheral part is in the shape of a rectangular frame and extends along the outer contour of the installation area of the upper thin film layer 100. The separating part is linear, and both ends are respectively connected to two opposite sides of the inner peripheral contour of the outer peripheral part. The separating part is arranged between the inflow through hole and the outflow through hole of the upper thin film layer 100.

[0184] The separating part divides the internal area surrounded by the first solder mask area 130 into two mutually independent welding areas 150. Two second solder mask areas 140 are respectively arranged inside the two welding areas 150. The two second solder mask areas 140 are respectively in the shape of two circular rings with one large and one small, and are respectively arranged around the inflow through hole and the outflow through hole of the upper thin film layer 100. The separating part can reduce the area of a single welding area 150, avoid the local area where the solder paste is overly concentrated, and improve the uniformity and reliability of welding.

[0185] The first solder mask area 130 and the two second solder mask areas 140 are covered with a solder mask material. In some embodiments, the solder mask material can adopt photosensitive ink, PI cover film, PET cover film, and in this embodiment, photosensitive ink is preferably used. In this embodiment, photosensitive ink is used as the solder mask area.

[0186] The welding area 150 is covered with a solderable metal. In this embodiment, copper is used as the welding area 150. When a copper layer is chemically deposited on the inner surface of the fluid channel 310, a solderable metal can be simultaneously applied to the welding area 150. In some other embodiments, the solderable metal can be low-temperature (medium-temperature) plaster, copper, or other solder sheets. Under the constraints of the first solder resist area 130 and the second solder resist area 140, the welding area 150 is neither connected to the outer edge of the mounting area nor to the inflow and outflow holes. This effectively prevents the solderable metal from overflowing outwards or completely or partially blocking the inflow and outflow holes during the welding process.

[0187] During the welding and fixing process, copper solderable metal is covered in the two welding areas 150, and then solder resist material is covered in the first solder resist area 130 and the second solder resist area 140. Finally, the piezoelectric micropump 800 is welded to the solderable metal in the solderable area 150, and the welding and fixing is completed.

[0188] Example 9

[0189] A liquid-cooled thin-film module with low water loss rate includes a driving element, a thin-film body, and a water-oxygen barrier layer; the structure of the thin-film body in this embodiment is the same as that in any one of the embodiments 1-5.

[0190] The only difference between this embodiment and Embodiment 1 is that the structure of the bending region on the upper thin film layer 100 and the lower thin film layer 500 is different.

[0191] In this embodiment, as Figure 25 As shown, the thin film layer has a mesh-like perforated structure in the bending area. The mesh-like perforated structure includes multiple dividing grooves; these grooves are arranged sequentially at intervals along the length of the thin film layer. The dividing grooves extend along the width of the thin film layer. Adjacent dividing grooves are connected by multiple connecting grooves. The connecting grooves between adjacent dividing grooves are arranged sequentially at intervals along the width of the thin film layer. The connecting grooves on opposite sides of the same dividing groove are staggered. The mesh-like perforated structure divides the portion of the thin film layer in the bending area into multiple independently arranged, staggered limiting strips.

[0192] Figure 25 In the diagram, the vertical direction represents the length of the thin film layer, and the horizontal direction represents its width. This mesh-like perforated structure allows the liquid-cooled thin-film module to bend along its length and possess a certain degree of torsional deformation capability, giving it greater flexibility and effectively adapting to the needs of foldable electronic devices.

[0193] In some embodiments, the mesh-like perforated structure is obtained by etching.

[0194] Example 10

[0195] exist Figure 26 In Embodiment 10 shown, the present invention provides a technical solution: an electronic device 9000, which applies a low-water-loss liquid-cooled thin-film module 1000 from Embodiment 1; the electronic device 9000 further includes: a screen module 9300, a housing module 9100, a battery module 9500, a hinge module 9600, a motherboard module 9400, and a sub-board module 9200, with chips installed on the motherboard module 9400.

[0196] In this embodiment, the electronic device 9000 includes, but is not limited to, mobile phones, tablets, laptops, computers, wearable devices, drones, robots, and other devices with communication functions. This embodiment uses a vertically folding mobile phone as an example for illustration; other electronic devices 9000 can refer to this embodiment.

[0197] In this embodiment, the electronic device 9000 uses a low-water-loss liquid-cooled thin-film module 1000 from embodiment 1 or 9. Figure 26 This is a schematic diagram of an electronic device 9000 according to the present invention, which specifically describes the components and specific structure of the electronic device 9000 in this embodiment. Figure 26 As shown, the housing module 9100 includes two flip-up parts rotatably connected by a pivot module 9600. The liquid-cooled thin-film module 1000, motherboard module 9400, sub-board module 9200, battery module 9500, and screen module 9300 are all disposed within the housing module 9100.

[0198] In this embodiment, the liquid-cooled thin-film module 1000 covers the motherboard module 9400, the sub-board module 9200, the battery module 9500, and the screen module 9300. The liquid-cooled film completely covers the chips on the motherboard module 9400. The bending area of ​​the liquid-cooled thin-film module 1000 passes through the hinge module 9600. When the electronic device 9000 is bent, the liquid-cooled thin-film module 1000 will bend together.

[0199] The working process of the electronic device 9000 in this embodiment is as follows: When the electronic device 9000 is working, the motherboard module 9400, the sub-board module 9200, the battery module 9500 and the screen module 9300 will all generate heat. The driving element in the liquid cooling film module 1000 drives the cooling medium to circulate continuously, passing through the motherboard module 9400, the sub-board module 9200, the battery module 9500 and the screen module 9300, thereby deheating the motherboard module 9400, the sub-board module 9200, the battery module 9500 and the screen module 9300.

Claims

1. A low-water-loss liquid-cooled thin-film module, comprising a driving element and a thin-film body; the thin-film body comprising a flow channel layer (300) and a covering layer covering both sides of the flow channel layer (300); characterized in that: The liquid-cooled thin-film module also includes a water-oxygen barrier layer (900); a through-slot structure is provided on the flow channel layer (300); the through-slot structure and the cover layers on both sides together form a fluid channel (310). The inner and outer surfaces of the film body are provided with a water and oxygen barrier layer (900) to resist the loss of the cooling working fluid, or the film body is provided with a water and oxygen barrier layer (900) only on the outer surface to resist the loss of the cooling working fluid. The water and oxygen barrier layer (900) on the outer surface of the thin film body is deposited on the assembled flow channel layer (300), cover layer and drive element; A fluid recess (230) is provided on the side of the cover layer facing the flow channel layer (300) in part or all; the fluid recess (230) is connected to the through groove structure on the flow channel layer (300) and becomes part of the fluid channel (310); The drive element is configured to drive the cooling medium to circulate within the fluid channel (310).

2. The liquid-cooled thin-film module according to claim 1, characterized in that: The outer surface of the film body is covered with a water and oxygen barrier layer (900); the water and oxygen barrier layer (900) on the outer surface of the film body is made of any one or more of organic polymer materials, metals, and silicon dioxide.

3. The liquid-cooled thin-film module according to claim 2, characterized in that: The water-oxygen barrier layer (900) is formed by chemical vapor deposition after the driving element is mounted on the thin film body.

4. The liquid-cooled thin-film module according to claim 1, characterized in that: The surface of the fluid channel (310) within the channel structure of the flow channel layer (300) and the surface of the corresponding channel structure on the cover layer are completely covered by the water and oxygen barrier layer (900).

5. The liquid-cooled thin-film module according to claim 4, characterized in that: The water and oxygen barrier layer (900) on the inner surface of the fluid channel (310) is made of any one or more of copper, gold, titanium, and silicon dioxide.

6. The liquid-cooled thin-film module according to claim 1, characterized in that: The water-oxygen barrier layer (900) on the inner surface of the fluid channel (310) is formed by chemical deposition on the inner surface of the fluid channel (310) after the flow channel layer (300) and the cover layers on both sides are assembled into one.

7. The liquid-cooled thin-film module according to claim 1, characterized in that: The driving element includes a piezoelectric micropump; the fluid channel (310) is provided with an inflow port (311) and an outflow port (312) spaced apart; the side of the film body is provided with an installation area covering the inflow port (311) and the outflow port (312); the piezoelectric micropump is fixed on the installation area and is connected to the inflow port (311) and the outflow port (312) through two fluid flow holes opened on one side of the film body.

8. The liquid-cooled thin-film module according to claim 7, characterized in that: The piezoelectric micropump is fixed to the mounting area on the film body by adhesive bonding.

9. The liquid-cooled thin-film module according to claim 8, characterized in that: The adhesive between the piezoelectric micropump and the film body includes a main adhesive (810); the main adhesive (810) is formed by dispensing adhesive along a dispensing path on the piezoelectric micropump (800) or the film body; the dispensing path includes a peripheral adhesive path that surrounds the inner side of the outer contour of the connecting side of the piezoelectric micropump (800) or the inner side of the outer contour of the mounting area of ​​the film body.

10. The liquid-cooled thin-film module according to claim 9, characterized in that: The dispensing path also includes two internal dispensing paths surrounding the pump flow inlet and outlet of the piezoelectric micropump (800), and / or a partition dispensing path separating the pump flow inlet and outlet into two independent areas.

11. The liquid-cooled thin-film module according to claim 9, characterized in that: The colloid between the piezoelectric micropump and the film body also includes a dammed colloid (820) that prevents the main colloid from overflowing into the pump inlet and pump outlet; the pump inlet and pump outlet are located within the outer contour of the dammed colloid (820); the dammed colloid (820) has clearance holes at the positions corresponding to the pump inlet and pump outlet.

12. The liquid-cooled thin-film module according to claim 7, characterized in that: The installation area includes a first solder resist area (130), a second solder resist area (140), and a welding area (150); the first solder resist area (130) is arranged around the periphery of the welding area (150); the two second solder resist areas (140) are respectively arranged around the periphery of the two fluid flow holes; the welding area (150) is covered with a solderable metal; the first solder resist area (130) and the second solder resist area (140) are covered with solder resist material; the piezoelectric micropump is welded and fixed to the welding area (150).

13. The liquid-cooled thin-film module according to claim 1, characterized in that: The film body also includes film layers; the two film layers cover the side of the two cover layers away from the flow channel layer (300).

14. The liquid-cooled thin-film module according to claim 13, characterized in that: The liquid-cooled thin film module has a bending area in the middle; the thin film layer has multiple bending grooves arranged at intervals in the bending area; a limiting part is formed between two adjacent bending grooves.

15. The liquid-cooled thin-film module according to claim 14, characterized in that: The bending area includes a first bending area, two second bending areas located on both sides of the first bending area, and two third bending areas located on opposite sides of the two second bending areas. The width of the limiting part is the largest in the second bending area, the width of the limiting part is the second largest in the third bending area, and the width of the limiting part is the smallest in the first bending area.

16. The liquid-cooled thin-film module according to claim 13, characterized in that: The liquid-cooled thin film module has a bending area in the middle; the thin film layer has a mesh-like perforated structure in the bending area.

17. The liquid-cooled thin-film module according to claim 13, characterized in that: The material of the thin film layer is one or more of stainless steel, PET, copper, copper alloy, aluminum, and aluminum alloy; the material of the cover layer is one or more of PET, PE, copper, and TPU.

18. The liquid-cooled thin-film module according to claim 1, characterized in that: The fluid recess (230) includes multiple recess units; the cross-section of the recess unit is arc-shaped and its length extends along the flow direction of the fluid channel (310); the recess units are arranged side by side and spaced apart.

19. The liquid-cooled thin-film module according to claim 1, characterized in that: The flow channel layer (300) includes multiple fluid channels (310) that are independent of each other and interlocked with each other; each fluid channel (310) is provided with an inflow interface (311) and an outflow interface (312), and corresponds to a driving element.

20. The liquid-cooled thin-film module according to claim 1, characterized in that: The liquid-cooled thin film module is divided into a heat-absorbing region corresponding to the position of the heating element and a heat-releasing region corresponding to the position other than the heating element; the fluid channel (310) is provided with a plurality of flow-dividing structures arranged sequentially at intervals along the flow direction of the cooling medium; the flow-dividing structure includes flow-dividing strips arranged sequentially at intervals along the width direction of the fluid channel (310); the corresponding area of ​​each flow-dividing strip on the fluid channel (310) is divided into a plurality of parallel branch channels; the width of the flow-dividing strips and the spacing between adjacent flow-dividing strips in the flow-dividing structure in the heat-absorbing region are smaller than the width of the flow-dividing strips and the spacing between adjacent flow-dividing strips in the flow-dividing structure in the heat-relieving region.

21. A method for preparing a liquid-cooled thin-film module, characterized in that: Used to prepare the liquid-cooled thin-film module as described in claim 6; the preparation method includes: The sheet material of the flow channel layer (300), the cover layer and the film layer is cut into the target shape, and a through groove structure is cut into the flow channel layer (300); The flow channel layer (300), two cover layers and two film layers are bonded and fixed to form a fluid channel (310). Using an external drive pump and infusion pipeline connected to the fluid channel (310), the inner surface of the fluid channel (310) is cleaned, roughened, activated and reduced in sequence by switching the liquid introduced; A precursor solution of a water-oxygen barrier material is introduced into the fluid channel (310) to form an integral water-oxygen barrier layer (900) on the inner surface of the fluid channel (310).

22. The preparation method according to claim 21, characterized in that: During the formation of the water-oxygen barrier layer (900), the flow direction of the precursor solution is switched once or multiple times.

23. An electronic device, comprising a housing module (9100) and a motherboard module (9400) for mounting heating elements; characterized in that: It also includes the liquid-cooled thin-film module as described in claim 1; the liquid-cooled thin-film module covers the heating element.

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