Packaging structure and preparation method thereof

By designing light-transmitting dielectric material pillars in the photonic chip packaging structure, the problem of optical window contamination was solved, high-performance optical coupling was achieved, and the reliability and signal integrity of the optical interface were improved.

CN121568474APending Publication Date: 2026-02-24JCET SEMICON (SHAOXING) CO LTD
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Patent Information

Application Number
CN202511731236.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-11-24
Publication Date
2026-02-24

AI Technical Summary

Technical Problem

In the current silicon photonics chip packaging process, the optical window is easily contaminated, which leads to a decrease in the performance of the optical interface and makes it impossible to achieve high-performance optical coupling.

Method used

A first encapsulation layer is formed around the photonic chip on the substrate, exposing the optical coupler. A pillar of light-transmitting medium material is formed on the side away from the substrate to prevent the optical window from being blocked. Subsequent encapsulation layers do not contaminate the optical window, and vertical optical coupling is achieved through the light-transmitting medium material.

Benefits of technology

It effectively protects the optical window, avoids contamination during the packaging process, ensures the optical performance of the optical coupler, and achieves a high-performance optical interface.

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Abstract

The invention relates to a packaging structure and a preparation method thereof, and relates to the technical field of semiconductors, in the packaging structure and the preparation method thereof, a first rewiring layer comprises a wiring layer and a dielectric layer, the orthographic projection of the wiring layer on a carrier plate is not overlapped with the orthographic projection of an optical coupler on the carrier plate, namely, the wiring layer does not shield an optical window of the optical coupler, and the dielectric layer is arranged on the dielectric layer; a light-transmitting dielectric material column is formed on the side, away from the carrier plate, of the first rewiring layer, the orthographic projection of the light-transmitting dielectric material column on the carrier plate is overlapped with the orthographic projection of the optical coupler on the carrier plate, at the moment, an optical window of the optical coupler is shielded by the light-transmitting dielectric material column, and the optical window cannot be polluted when the second packaging layer is prepared subsequently; the second packaging layer exposes the light-transmitting dielectric material columns, and the optical coupler achieves vertical optical coupling through the light-transmitting dielectric material columns.
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