Manufacturing method of ultrathin light guide system light-emitting module based on MiniLED

Abstract

The invention relates to a manufacturing method of an ultrathin light guide system light-emitting module based on a Mini LED, and the method comprises the following steps: S1, manufacturing a Mini LED flexible light bar, transferring a blue light wafer to a flexible substrate for die bonding, and sealing and fixing the blue light wafer on the flexible substrate through an optical sealing glue layer made of a transparent epoxy resin material; s2, manufacturing a PC membrane, printing lattice points on the lower surface of the PC membrane with the thickness of more than 0.5 mm or dotting by using carbon dioxide laser to form the lattice points, and enabling light of the Mini LED flexible light bar to enter from the side edge; s3, installing the Mini LED flexible light bar on the side surface of the PC membrane, and placing a high-reflectivity reflector plate below the PC membrane; the Mini LED flexible light bar is used for emitting light and the light enters the PC membrane with the lattice points from the side face; the side-in type Mini LED light bar has the advantages that through the collaborative design of the side-in type Mini LED light bar and the lattice point diffusion structure, the ultra-thinness of an optical system and the improvement of light emitting uniformity are achieved, and meanwhile the light energy utilization rate is optimized so as to reduce power consumption.

Description

Technical Field

[0001] This invention relates to the field of automotive interior and exterior lighting technology, and in particular to a method for manufacturing an ultra-thin light guide system light-emitting module based on MiniLED. Background Technology

[0002] As the demands for styling and lighting effects in automotive interior and exterior lighting continue to rise, optical systems are rapidly evolving towards thinner designs. Traditional solutions are mainly divided into two categories: direct-lit LED arrays and side-lit LED arrays, both of which struggle to meet the core requirements of thinness and flexibility in lighting structures.

[0003] The current disadvantages of direct-lit LED arrays stem from the requirement of a certain light mixing distance (OD value) in the optical system to ensure the mixing effect. A small OD value leads to decreased optical uniformity, which needs to be compensated for by increasing LED density, directly increasing costs. Simultaneously, due to limitations in LED particle thickness and light mixing distance, the overall thickness of the optical system is difficult to control within 10mm. Traditional side-lit LED arrays often use 3014 packaged LEDs paired with a 2mm thick rigid light guide plate, which can transform a point light source into a uniform surface light source, reducing the optical system thickness to 5-10mm. However, automotive interior and exterior surfaces are often non-flat, making this solution unable to achieve flexible adaptation. There is an urgent need for a method to manufacture ultra-thin light guide system modules suitable for applications with stringent requirements for thickness and optical performance, such as automotive interior lighting, exterior lighting, illuminated logos, reading lights, and ambient lighting. Summary of the Invention

[0004] In view of the above problems, the purpose of this invention is to provide a method for manufacturing an ultra-thin light-emitting module based on MiniLED. By coordinating the design of side-entered MiniLED light strips and dot diffusion structures, the optical system is made thinner and the light emission uniformity is improved. At the same time, the light energy utilization rate is optimized to reduce power consumption, thereby overcoming the shortcomings of the prior art.

[0005] This invention provides a method for fabricating an ultra-thin light-emitting module based on MiniLED, comprising the following steps:

[0006] Step S1: Fabrication of Mini LED flexible light strip. The blue light chip is transferred to a flexible substrate for die bonding. An optical sealing layer made of transparent epoxy resin is used to seal and fix the blue light chip on the flexible substrate. The flexible substrate is a flexible circuit board. The optical sealing layer is used to protect the blue light chip. A diffusing agent is added to the transparent epoxy resin material of the optical sealing layer. The diffusing agent is used to make the light emitted by the blue light chip more uniform.

[0007] Step S2: Fabrication of PC (polycarbonate) film. Dots are printed on the lower surface of a PC film with a thickness of 0.5mm or more, or dots are formed by carbon dioxide laser. Light from the Mini LED flexible light strip enters from the side, is conducted within the PC film, and total internal reflection is disrupted by the dots to form a uniform surface light source. A layer of adhesive film containing yellow phosphor is attached to the PC film. Blue LED chips excite the yellow phosphor to form white light, thereby improving light conversion efficiency and reducing energy loss.

[0008] Step S3: Install the Mini LED flexible light strip on the side of the PC film and place a high reflectivity reflector under the PC film; thereby realizing the use of the Mini LED flexible light strip to emit light and enter the PC film with dots from the side. The dots destroy the light and form total internal reflection in the PC film, so that the light enters the backlight cavity through the upper surface of the PC film to form a surface light source.

[0009] As a preferred embodiment of the present invention, the thickness of the PC film is 0.5-0.6 mm.

[0010] As a preferred embodiment of the present invention, the Mini LED flexible light strip adopts a flip-chip structure, that is, the electrodes of the Mini LED flexible light strip are disposed at the bottom of the flexible circuit board.

[0011] The beneficial effects of this invention are as follows:

[0012] 1. This invention achieves ultra-thinness of the optical system and improved light emission uniformity through the synergistic design of side-entered MiniLED light strips and dot diffusion structure, while optimizing light energy utilization to reduce power consumption.

[0013] 2. This invention uses a PC film instead of a rigid light guide plate, achieving an ultra-thin overall thickness of about 5mm, thus realizing an ultra-thin design for automotive interior and exterior lighting structures.

[0014] 3. The PC film of the present invention has a certain degree of flexibility, and the overall structure is better adapted to the curves of the car body. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this embodiment.

[0016] Figure 2 This is a schematic diagram of the PC film in this embodiment using a printed halftone dot pattern.

[0017] Figure 3 This is a schematic diagram of the PC film in this embodiment using laser dotting.

[0018] Figure 4 This is a schematic diagram of the Mini LED flexible light strip in this embodiment.

[0019] Reference numerals: Mini LED flexible light strip 1, blue light chip 101, flexible substrate 102, optical sealing layer 103, PC film 2, adhesive film 201, reflective sheet 3. Detailed Implementation

[0020] See Figure 1-4 As shown in the figure, this embodiment provides a method for fabricating an ultra-thin light guide system light-emitting module based on MiniLED, which includes the following steps:

[0021] Step S1: Fabrication of Mini LED Flexible Light Strip 1. The blue LED chip 101 is transferred to the flexible substrate 102 for die bonding. The blue LED chip 101 is sealed and fixed on the flexible substrate 102 using an optical encapsulation layer 103 made of transparent epoxy resin. The flexible substrate 102 is a flexible circuit board. The optical encapsulation layer 103 is used to protect the blue LED chip 101. A diffusing agent is added to the transparent epoxy resin material of the optical encapsulation layer 103. The diffusing agent is used to make the light emitted by the blue LED chip 101 more uniform.

[0022] Step S2: Fabrication of PC (polycarbonate) film 2. Dots are printed on the lower surface of the 0.5mm thick PC film 2 or dots are formed by carbon dioxide laser. Light from the Mini LED flexible light strip 1 enters from the side, is conducted in the PC film 2, and total internal reflection is destroyed by the dots to form a uniform surface light source. A layer of adhesive film 201 containing yellow phosphor is attached to the PC film 2. The blue light chip 101 excites the yellow phosphor to form white light, so as to improve the light conversion efficiency and reduce energy loss.

[0023] Step S3: Install the Mini LED flexible light strip 1 on the side of the PC film 2, and place a high-reflectivity reflector 3 below the PC film 2; thereby enabling the Mini LED flexible light strip 1 to emit light and enter the PC film 2 with dots from the side. The dots destroy the light, causing total internal reflection within the PC film 2, allowing the light to enter the backlight cavity through the upper surface of the PC film 2, forming a surface light source. The Mini LED flexible light strip 1 adopts a flip-chip structure, that is, the electrodes of the Mini LED flexible light strip 1 are set at the bottom of the flexible circuit board.

[0024] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for fabricating a light-emitting module of an ultra-thin light guide system based on MiniLED, characterized in that, Includes the following steps: Step S1: Fabrication of Mini LED flexible light strip. The blue light chip is transferred to a flexible substrate for die bonding. An optical sealing layer made of transparent epoxy resin is used to seal and fix the blue light chip on the flexible substrate. The flexible substrate is a flexible circuit board. The optical sealing layer is used to protect the blue light chip. A diffusing agent is added to the transparent epoxy resin material of the optical sealing layer. The diffusing agent is used to make the light emitted by the blue light chip more uniform. Step S2: Fabrication of the PC film. Dots are printed on the lower surface of a PC film with a thickness of 0.5mm or more, or dots are formed by carbon dioxide laser. This allows the light from the Mini LED flexible light strip to enter from the side, be conducted within the PC film, and have total internal reflection destroyed by the dots to form a uniform surface light source. A layer of adhesive film containing yellow phosphor is attached to the PC film. The blue LED chip excites the yellow phosphor to form white light, thereby improving the light conversion efficiency and reducing energy loss. Step S3: Install the Mini LED flexible light strip on the side of the PC film and place a high reflectivity reflector under the PC film; thereby realizing the use of the Mini LED flexible light strip to emit light and enter the PC film with dots from the side. The dots destroy the light and form total internal reflection in the PC film, so that the light enters the backlight cavity through the upper surface of the PC film to form a surface light source.

2. The method for fabricating a light-emitting module of an ultra-thin light guide system based on MiniLED according to claim 1, characterized in that, The thickness of the PC film is 0.5-0.6 mm.

3. The method for fabricating a light-emitting module of an ultra-thin light guide system based on MiniLED according to claim 1, characterized in that, The Mini LED flexible light strip adopts a flip-chip structure, that is, the electrodes of the Mini LED flexible light strip are set at the bottom of the flexible circuit board.

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