Flip chip packaging structure of MIP chip and packaging process thereof

Abstract

This invention relates to a MIP (Multi-In-Package) chip flip-chip packaging structure and its packaging process, comprising a carrier plate and a cover plate that fit together as a box and lid. A semiconductor chip is mounted inside the carrier plate. Interlocking grooves are formed at the edges of the carrier plate and the cover plate. The invention also includes a current collector inner ring plate, a mating ring plate, a first rotating plate, and a second rotating plate. A flow groove is formed on the mating ring plate, and the flow groove is wider at the bottom and narrower at the top. The first and second rotating plates are rotatably connected by a rotating shaft. An inclined snap-fit ​​cavity is formed between the end of the first rotating plate and the second rotating plate, and an injection head is snapped into the snap-fit ​​cavity. The injection head for injecting adhesive corresponds to the position of the interlocking groove. This invention, through the interlocking groove structure formed at the edges of the carrier plate and the cover plate, and the slow injection of adhesive during the interlocking process, allows the adhesive to be evenly applied to the interlocking tooth surfaces, effectively avoiding gaps or weak points that may occur with traditional planar adhesive application methods, thereby ensuring sufficient filling and consistent sealing of the adhesive at all points of the bonding surface.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging structure technology, specifically to a MIP chip flip-chip packaging structure and its packaging process. Background Technology

[0002] Flip-chip packaging technology is widely used in the semiconductor packaging field due to its advantages of high density and high performance, especially in advanced packaging forms such as Micro LED in Package (MIP). In precision packaging processes like MIP, a carrier plate and a cover plate are typically used to form a sealed cavity to protect the internal semiconductor chip and interconnect structures. During the packaging process, an adhesive is injected to achieve bonding and sealing between the carrier plate and the cover plate, which is crucial for the mechanical strength and long-term reliability of the package.

[0003] However, a prominent technical problem exists in existing technologies: in the bonding and sealing process between the carrier plate and the cover plate, it is often difficult to simultaneously achieve uniform application of the adhesive and its shear resistance after curing. On the one hand, traditional planar adhesive application methods easily lead to uneven adhesive distribution, creating gaps or weak points on the bonding surface, thus affecting the overall sealing effect. On the other hand, the bonding surface, which mainly relies on the adhesive force of the adhesive itself, is prone to relative slippage or misalignment when faced with thermal stress, mechanical vibration, or shear forces during operation. This can lead to sealing failure, reduced connection reliability, and consequently affect the lifespan and stability of the entire encapsulation structure.

[0004] Therefore, a MIP chip flip-chip packaging structure and its packaging process are proposed to address the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a MIP chip flip-chip packaging structure and its packaging process.

[0006] The objective of this invention is achieved through the following technical solution: a MIP chip flip-chip packaging structure, comprising a carrier plate and a cover plate that fit together as a box and cover, wherein a semiconductor chip is mounted inside the carrier plate, and meshing grooves that engage with each other are formed at the edges of the carrier plate and the cover plate, a current collector inner ring plate is fixedly connected to the inner side of the carrier plate, and a mating ring plate that presses against the current collector inner ring plate is fixedly connected to the inner side of the cover plate, wherein a flow groove is formed on the mating ring plate, and the flow groove is shaped as being wider at the bottom and narrower at the top;

[0007] It also includes a first rotating plate and a second rotating plate that are respectively installed and connected to the carrier plate and the cover plate. The first rotating plate and the second rotating plate are rotatably connected by a rotating shaft. An inclined snap-fit ​​cavity is formed between the end of the first rotating plate and the second rotating plate. An injection head is snapped into the snap-fit ​​cavity. The injection head for injecting colloid corresponds to the position of the meshing groove.

[0008] As a further description of the above technical solution:

[0009] An outer ring plate for collecting flow is fixedly connected to the outer surface of the carrier plate, and a brushing mechanism is installed on the injection head. By adding an outer ring plate for collecting flow outside the carrier plate and setting a brushing mechanism with an elastic rod on the injection head, excess colloid can be collected to avoid contamination, and the brush head can be adaptively adjusted during engagement, ensuring that the colloid is fully and evenly applied to all corners of the engagement groove, further optimizing the sealing and filling effect.

[0010] As a further description of the above technical solution:

[0011] A base plate is inserted into the bottom of the first rotating plate via a first insert rod. A connecting pipe that is rotatably connected to the base plate is fixedly connected to the base plate. The bottom of the connecting pipe is connected to two through pipes, and the ends of the two through pipes are located in the gap between the semiconductor chip and the carrier plate. The base plate, connecting pipe and through pipes connected to the bottom of the first rotating plate form a heat dissipation airflow channel to the gap between the semiconductor chip and the carrier plate, which enhances the active cooling effect on the core heat-generating components and effectively improves the thermal reliability of the packaging structure.

[0012] As a further description of the above technical solution:

[0013] The top of the second rotating plate is connected to a top plate via a second insert rod. A movable shaft, which is fixedly connected to the cover plate, is movably inserted into the top plate. A limit ring is fixedly connected to the movable shaft. Through the top plate, movable shaft, and limit ring connected to the top of the second rotating plate, the cover plate can move up and down and rotate in a controllable manner, which facilitates the precise alignment and progressive engagement of the meshing groove, and provides operational convenience and guarantee for uniform glue injection and final sealing.

[0014] As a further description of the above technical solution:

[0015] Both the top plate and the cover plate are equipped with mutually cooperating anti-slip rings. A baffle that presses against the second rotating plate is fixedly connected to the first rotating plate. Both the top plate and the bottom plate are L-shaped structures, and the bottom plate is inserted into the top plate. Through multiple designs such as anti-slip rings, baffles, and L-shaped insertion structures, the connection stability and anti-displacement ability between the top plate and the bottom plate, and between the carrier plate and the cover plate are enhanced, preventing accidental slippage of each component during the glue injection and curing process, and ensuring the precise execution of the entire encapsulation process.

[0016] As a further description of the above technical solution:

[0017] The first rotating plate has a sliding column that slides on it, and the second rotating plate has a fixed column that rotates on it. A connecting rope is fixedly connected to the fixed column. A tension spring is connected between the sliding column and the connecting rope, and the connecting rope, which is inclined, cooperates with the rotating shaft. Through the elastic reset mechanism composed of the sliding column, the fixed column, the connecting rope, and the tension spring, as well as the inclined lever design of the connecting rope with the rotating shaft as the fulcrum, a stable and adjustable vertical holding force is provided for the first and second rotating plates. This ensures the accurate positioning of the injection head during the dispensing stage and can be easily compensated when the elasticity of the tension spring decays, thus ensuring the reliability of the mechanism in long-term operation.

[0018] As a further description of the above technical solution:

[0019] The first rotating plate has a movable groove with an inclined bottom, and the second rotating plate has an inclined surface at its bottom, which together with the movable groove forms a locking cavity. The movable groove with an inclined bottom on the first rotating plate and the inclined surface at the bottom of the second rotating plate cooperate to form a self-locking locking cavity, which can more securely hold the inclined injection head and prevent it from loosening due to vibration or reaction force during the dispensing process, thus ensuring the continuous stability of the dispensing process.

[0020] As a further description of the above technical solution:

[0021] The first rotating plate has a U-shaped groove, in which the sliding column slides. The end of the sliding column is also provided with an anti-detachment plate that slides in the U-shaped groove. By having the sliding column slide in the U-shaped groove and equipped with an anti-detachment plate, a limiting sliding mechanism with an anti-detachment function is formed, which effectively prevents the sliding column from accidentally detaching from the track. At the same time, the special design that the inner end of the U-shaped groove is larger than the outer end may provide additional activity space or limiting function for the anti-detachment plate, ensuring the safe and accurate operation of the sliding column adjustment mechanism.

[0022] A packaging process for a MIP chip flip-chip structure, the specific process according to the above-mentioned MIP chip flip-chip structure includes the following steps;

[0023] S1. Component pre-assembly and positioning: Install and solder the semiconductor chip to the center of the carrier board, and connect the top plate and the bottom plate through an L-shaped structure to initially align the positions of the carrier board and the cover plate.

[0024] At the same time, the first rotating plate is inserted and connected to the bottom plate of the carrier plate, and the second rotating plate is inserted and connected to the top plate of the cover plate.

[0025] S2. Injection head installation and colloid pre-coating: Rotate the second rotating plate to a horizontal position, insert the injection head and brushing mechanism into the snap-fit ​​cavity, and after the injection head is aligned with the meshing groove on the carrier plate, rotate the second rotating plate back and adjust the position of the sliding column in the U-shaped groove to keep the second rotating plate stable and vertical. Start the injection head and slowly and continuously inject colloid into the meshing groove of the carrier plate.

[0026] S3. Meshing motion and uniform adhesive application: The robotic arm controls the movable shaft connected to the cover plate to move the cover plate up and down and rotate it, so that the adhesive is evenly applied to the meshing tooth surfaces. The elastic rod on the brushing mechanism can be adjusted adaptively to ensure that the adhesive is fully filled. Excess adhesive will be collected in the inner and outer ring plates of the flow collector.

[0027] S4. Complete fit and solidification locking: Change the fulcrum position of the connecting rope on the rotating shaft, causing the first and second rotating plates to tilt, and the injection head to disengage from the locking cavity.

[0028] Meanwhile, the inclined first and second rotating plates press against the carrier plate and the cover plate respectively to prevent them from rotating. The mating ring plate on the inner side of the cover plate is sealed and engaged with the inner ring plate of the flow collector on the inner side of the carrier plate. The reserved flow groove helps to evenly disperse excess colloid and seal the connection between the mating ring plate and the inner ring plate of the flow collector, thus completing the final sealing and mechanical interlocking.

[0029] Compared with the prior art, the advantages of the present invention are as follows:

[0030] 1. By using the interlocking groove (tooth) structure set on the edges of the carrier plate and the cover plate, and slowly injecting the colloid during the interlocking process, the colloid can be evenly applied to the interlocking tooth surfaces, effectively avoiding the gaps or weak points that may be generated by the traditional flat gluing method, thereby ensuring the full filling and consistent sealing of the colloid at all joint surfaces.

[0031] 2. The carrier plate and cover plate are assembled and joined through an interlocking toothed structure, which provides a mechanical interlocking effect. After encapsulation, the fully engaged grooves not only rely on the adhesive force of the adhesive but also effectively resist shear and torsional forces in multiple directions through the physical interlocking between the teeth. This significantly reduces the risk of relative displacement between the carrier plate and cover plate under vibration, thermal stress, and other effects, thereby greatly improving the overall mechanical strength and long-term structural stability of the encapsulation. Attached Figure Description

[0032] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0033] Figure 2 This is a bottom view of the overall structure of the present invention;

[0034] Figure 3 This is a schematic diagram showing the overall structure of the present invention broken down;

[0035] Figure 4 This is a schematic diagram of the disassembled structure of the top plate and the bottom plate of the present invention;

[0036] Figure 5 This is a schematic diagram of the mating structure of the carrier plate, cover plate, and meshing groove of the present invention;

[0037] Figure 6 This is a schematic diagram of the mating structure of the carrier plate and the cover plate of the present invention;

[0038] Figure 7 This is a schematic diagram of the mating structure of the first and second rotating plates of the present invention;

[0039] Figure 8 This is a schematic diagram of the disassembled structure of the first and second rotating plates of the present invention;

[0040] Figure 9 This is a cross-sectional structural diagram of the first rotating plate of the present invention;

[0041] Figure 10 This is a schematic diagram showing the disassembled structure of the injection head and the snap-fit ​​cavity of the present invention.

[0042] Labeling Explanation: 1. Carrier plate; 2. Cover plate; 3. Engaging groove; 4. Inner annular plate of the flow collector; 5. Mating ring plate; 6. Flow groove; 7. First rotating plate; 8. Second rotating plate; 9. Rotating shaft; 10. Outer annular plate of the flow collector; 11. First insertion rod; 12. Base plate; 13. Connecting pipe; 14. Top plate; 15. Movable shaft; 16. Anti-slip ring; 17. Baffle; 18. Sliding column; 19. Fixed column; 20. Connecting rope; 21. Tension spring; 22. Movable groove; 23. Inclined surface; 24. U-shaped groove. Detailed Implementation

[0043] The present invention will now be described in detail with reference to the accompanying drawings and embodiments:

[0044] like Figures 1-10 The diagram shows an embodiment of a flip-chip MIP packaging structure provided by the present invention, including a carrier plate 1 and a cover plate 2 that fit together as a box and cover. A semiconductor chip is installed in the carrier plate 1. Engaging grooves 3 that cooperate with each other are opened at the edges of the carrier plate 1 and the cover plate 2. A current collector inner ring plate 4 is fixedly connected to the inner side of the carrier plate 1. A mating ring plate 5 that abuts against the current collector inner ring plate 4 is fixedly connected to the inner side of the cover plate 2. A flow groove 6 is opened on the mating ring plate 5. The flow groove 6 is wide at the bottom and narrow at the top.

[0045] It also includes a first rotating plate 7 and a second rotating plate 8 that are respectively installed and connected to the carrier plate 1 and the cover plate 2. The first rotating plate 7 and the second rotating plate 8 are rotatably connected by a rotating shaft 9. An inclined snap-fit ​​cavity is formed between the end of the first rotating plate 7 and the second rotating plate 8. An injection head is snapped into the snap-fit ​​cavity. The injection head for injecting colloid corresponds to the position of the engagement groove 3.

[0046] Traditional encapsulation structures often result in uneven distribution of the colloid on a flat surface, potentially creating gaps or weak points that affect the sealing effect. They primarily rely on the adhesive force of the colloid to resist shear forces, and when subjected to vibration or thermal stress, the parallel adhesive surfaces are prone to relative slippage.

[0047] This application utilizes the interlocking grooves 3 (teeth) between the edges of the carrier plate 1 and the cover plate 2, and slowly injects adhesive during the interlocking process. This allows the adhesive to be evenly applied to the interlocking tooth surfaces, and the interlocking tooth structure itself provides a mechanical interlocking effect. In the final stage of the encapsulation process, when the carrier plate 1 and the cover plate 2 are fully bonded, the interlocking grooves 3 are fully engaged. This structure effectively resists shear and torsional forces in all directions, prevents relative displacement between the carrier plate 1 and the cover plate 2, and improves the overall mechanical strength of the encapsulation.

[0048] A packaging process for a MIP chip flip-chip structure, the specific process according to the above-mentioned MIP chip flip-chip structure includes the following steps;

[0049] S1. Component pre-assembly and positioning: Install and solder the semiconductor chip to the middle of the carrier plate 1, and connect the top plate 14 and the bottom plate 12 through an L-shaped structure to make the carrier plate 1 and the cover plate 2 initially aligned.

[0050] At the same time, the first rotating plate 7 is inserted and connected to the bottom plate 12 of the carrier plate 1, and the second rotating plate 8 is inserted and connected to the top plate 14 of the cover plate 2.

[0051] S2. Injection head installation and colloid pre-coating: Rotate the second rotating plate 8 to a horizontal position, insert the injection head and brushing mechanism into the snap-fit ​​cavity, and after the injection head is aligned with the meshing groove 3 on the carrier plate 1, rotate the second rotating plate 8 back to adjust the position of the sliding column 18 in the U-shaped groove 24 to keep the second rotating plate 8 stable and vertical, start the injection head, and slowly and continuously inject colloid into the meshing groove 3 of the carrier plate 1.

[0052] S3. Meshing motion and uniform adhesive application: The cover plate 2 is moved up and down and rotated by the manipulator through the movable shaft 15 connected to the cover plate 2, so that the adhesive is evenly applied to the meshing tooth surface. The elastic rod on the brushing mechanism can be adjusted adaptively to ensure that the adhesive is fully filled. Excess adhesive will be collected in the inner ring plate 4 and the outer ring plate 10.

[0053] S4. Complete fit and solidification locking: Change the fulcrum position of the connecting rope 20 on the rotating shaft 9 to tilt the first rotating plate 7 and the second rotating plate 8, and the injection head will disengage from the locking cavity.

[0054] Meanwhile, the inclined first rotating plate 7 and the second rotating plate 8 press against the carrier plate 1 and the cover plate 2 respectively to prevent them from rotating. The mating ring plate 5 on the inner side of the cover plate 2 is sealed and engaged with the inner collecting ring plate 4 on the inner side of the carrier plate 1. The reserved flow groove 6 helps to evenly disperse excess colloid and seal the connection between the mating ring plate 5 and the inner collecting ring plate 4, thus completing the final sealing and mechanical interlocking.

[0055] The outer surface of the carrier plate 1 is fixedly connected to a flow collecting outer ring plate 10. A brushing mechanism is installed on the injection head via an elastic rod. When the bottom of the engagement groove 3 of the cover plate 2 contacts the top of the engagement groove 3 of the carrier plate 1, the elastic rod bends adaptively, and the brushing mechanism adjusts its position within a small range to facilitate the full action of the colloid on the engagement groove 3.

[0056] It is worth noting that: the bottom of the first rotating plate 7 is connected to the base plate 12 by the first insertion rod 11, and the base plate 12 is fixedly connected to the connecting pipe 13 which is rotatably connected to the carrier plate 1. The bottom of the connecting pipe 13 is connected to two connecting pipes, and the ends of the two connecting pipes are located in the gap between the semiconductor chip and the carrier plate 1.

[0057] Furthermore, a top plate 14 is inserted into the top of the second rotating plate 8 via a second insert rod. A movable shaft 15, which is connected and fixed to the cover plate 2, is movably inserted into the top plate 14. A limit ring is fixedly connected to the movable shaft 15.

[0058] In this application, both the top plate 14 and the cover plate 2 are provided with anti-slip rings 16 that cooperate with each other. The first rotating plate 7 is fixedly connected with a baffle 17 that abuts against the second rotating plate 8. Both the top plate 14 and the bottom plate 12 are L-shaped structures, and the bottom plate 12 is inserted into the top plate 14.

[0059] It is worth noting that: a sliding column 18 is slidably fitted on the first rotating plate 7, a fixed column 19 is rotatably connected on the second rotating plate 8, a connecting rope 20 is fixedly connected to the fixed column 19, and a tension spring 21 is suspended between the sliding column 18 and the connecting rope 20, and the tension spring 21 is always in a tensile state.

[0060] The inclined connecting rope 20 cooperates with the rotating shaft 9. The rotating shaft 9 serves as the fulcrum, making the first rotating plate 7 and the second rotating plate 8 vertically distributed. When the tension spring 21 loses its elasticity or the tensile force is insufficient, the connecting rope 20 can be wound onto the rotating shaft 9 several times to ensure the tensile effect and maintain the state of the first rotating plate 7 and the second rotating plate 8.

[0061] The first rotating plate 7 has a movable groove 22 with an inclined bottom. The second rotating plate 8 has an inclined surface 23 at its bottom. The inclined surface 23 and the movable groove 22 form a snap-fit ​​cavity. A rubber layer can be provided at the bottom of the inclined surface 23 and the movable groove 22 to facilitate the stable clamping and fixing of the injection head.

[0062] It is worth noting that: the first rotating plate 7 is provided with a U-shaped groove 24, the sliding column 18 slides at the outer end of the U-shaped groove 24, and the end of the sliding column 18 is also provided with an anti-detachment plate that slides at the inner end of the U-shaped groove 24. The size of the inner end of the U-shaped groove 24 is larger than the size of the outer end of the U-shaped groove 24.

[0063] Working principle: First, the semiconductor chip is installed in the middle of the carrier board 1, that is, the solder feet of the semiconductor chip are soldered to the carrier board 1. There is a gap between the carrier board 1 and the semiconductor chip, and the two tubes are located in the gap and correspond exactly to the semiconductor chip. The two tubes are used to flow gas to cool the semiconductor chip and the carrier board 1 (enhancing the cooling of the semiconductor chip).

[0064] And the top plate 14 and the bottom plate 12 are inserted into each other, so that the positions of the carrier plate 1 and the cover plate 2 correspond to each other;

[0065] Then, the first rotating plate 7 is inserted and connected to the bottom plate 12 of the carrier plate 1, and the second rotating plate 8 is inserted and connected to the top plate 14 of the cover plate 2. The second rotating plate 8 is rotated to a horizontal state (the first rotating plate 7 is in a vertical state) so that the injection head and the brushing mechanism pass through the movable groove 22. After the position of the injection head corresponds to the position of the meshing groove 3 on the carrier plate 1, the second rotating plate 8 is rotated back to a vertical state, and the second rotating plate 8 is pressed against the baffle 17.

[0066] Next, slide the slide column 18 to the end of the U-shaped groove 24 away from the semiconductor chip, so that the non-elastic connecting rope 20 presses against the side of the rotating shaft 9 (the side of the rotating shaft 9 closer to the semiconductor chip), thereby tilting the connecting rope 20 and the tension spring 21, so that the second rotating plate 8 is stably kept in a vertical state and cooperates with the first rotating plate 7. At this time, the inclined surface 23 at the bottom of the second rotating plate 8 cooperates with the inclined shape at the bottom of the movable groove 22 to firmly clamp the inclined injection head.

[0067] The injection head (the other end of the injection head is connected to the automatic injection device) continuously and slowly injects the colloid into the engagement groove 3 of the carrier plate 1. The robotic arm moves the movable shaft 15 up and down and rotates the movable shaft 15, so that the engagement groove 3 on the cover plate 2 and the engagement groove 3 on the carrier plate 1 come into contact with each other and drive the carrier plate 1 to rotate slightly (during this process, the engagement groove 3 on the cover plate 2 and the engagement groove 3 on the carrier plate 1 will not be completely fitted, and there will always be a certain gap, that is, the bottom of the engagement groove 3 on the cover plate 2 and the top of the engagement groove 3 on the carrier plate 1 are in contact), so that the colloid is evenly coated on the engagement groove 3, and the excess colloid flows into the inner ring plate 4 and the outer ring plate 10 of the collector.

[0068] Then, the slide column 18 moves to the end of the U-shaped groove 24 near the semiconductor chip, and the connecting rope 20 presses against the other side of the rotating shaft 9 (i.e., the side of the rotating shaft 9 away from the semiconductor chip). The second rotating plate 8 and the first rotating plate 7 tilt, causing the injection head to disengage from the movable groove 22. On the one hand, the top plate 14 and the bottom plate 12 move closer to each other, that is, the carrier plate 1 and the cover plate 2 fit together, and the meshing groove 3 fits completely. On the other hand, the tilted ends of the first rotating plate 7 and the second rotating plate 8 press against the carrier plate 1 and the cover plate 2 respectively, preventing the carrier plate 1 and the cover plate 2 from rotating.

[0069] Two anti-slip rings 16 press against each other to further ensure the stability of the carrier plate 1 and the cover plate 2;

[0070] It is worth noting that: excess colloids are collected in the inner ring plate 4 and the outer ring plate 10 of the flow collector. After the carrier plate 1 and the cover plate 2 are attached to each other, the mating ring plate 5 is sealed and snapped into the inner ring plate 4 of the flow collector. The excess colloids are evenly dispersed at the connection between the mating ring plate 5 and the inner ring plate 4 through multiple flow grooves 6. The flow grooves 6 are wide at the bottom and narrow at the top, which makes it easy for the colloids to completely block the flow grooves 6.

Claims

1. A MIP chip flip-chip packaging structure, characterized in that, The device includes a carrier plate (1) and a cover plate (2) that fit together as a box and lid. A semiconductor chip is installed inside the carrier plate (1). The edges of the carrier plate (1) and the cover plate (2) are provided with meshing grooves (3) that fit together. A current collecting inner ring plate (4) is fixedly connected to the inside of the carrier plate (1). A mating ring plate (5) that presses against the current collecting inner ring plate (4) is fixedly connected to the inside of the cover plate (2). A flow groove (6) is provided on the mating ring plate (5). The flow groove (6) is wide at the bottom and narrow at the top. It also includes a first rotating plate (7) and a second rotating plate (8) that are respectively installed and connected to the carrier plate (1) and the cover plate (2). The first rotating plate (7) and the second rotating plate (8) are rotatably connected by a rotating shaft (9). An inclined snap-fit ​​cavity is formed between the end of the first rotating plate (7) and the second rotating plate (8). The injection head is snapped in the snap-fit ​​cavity. The injection head that injects the colloid corresponds to the position of the meshing groove (3).

2. The MIP chip flip-chip packaging structure according to claim 1, characterized in that: The outer surface of the carrier plate (1) is fixedly connected to a flow collecting outer ring plate (10), and a brushing mechanism is installed on the injection head.

3. The MIP chip flip-chip packaging structure according to claim 2, characterized in that: The bottom of the first rotating plate (7) is connected to a base plate (12) via a first insert rod (11). A connecting pipe (13) that is rotatably connected to the base plate (1) is fixedly connected to the base plate (12). The bottom of the connecting pipe (13) is connected to two connecting pipes, and the ends of the two connecting pipes are located in the gap between the semiconductor chip and the base plate (1).

4. The MIP chip flip-chip packaging structure according to claim 3, characterized in that: The top plate (14) of the second rotating plate (8) is inserted into the top of the second insert rod. The top plate (14) is movably inserted into the movable shaft (15) which is connected and fixed to the cover plate (2). A limit ring is fixedly connected to the movable shaft (15).

5. The MIP chip flip-chip packaging structure according to claim 4, characterized in that: The top plate (14) and the cover plate (2) are provided with anti-slip rings (16) that cooperate with each other. The first rotating plate (7) is fixedly connected with a baffle (17) that presses against the second rotating plate (8). The top plate (14) and the bottom plate (12) are both L-shaped structures, and the bottom plate (12) and the top plate (14) are inserted into each other.

6. The MIP chip flip-chip packaging structure according to claim 1, characterized in that: The first rotating plate (7) has a sliding column (18) that is slidably fitted on it, and the second rotating plate (8) has a fixed column (19) that is rotatably connected on it. A connecting rope (20) is fixedly connected to the fixed column (19), and a tension spring (21) is attached between the sliding column (18) and the connecting rope (20).

7. A MIP chip flip-chip packaging structure according to claim 6, characterized in that: The inclined connecting rope (20) is matched with the rotating shaft (9).

8. The MIP chip flip-chip packaging structure according to claim 1, characterized in that: The first rotating plate (7) has a movable groove (22) with an inclined bottom. The second rotating plate (8) has an inclined surface (23) at its bottom end, and the inclined surface (23) and the movable groove (22) form a snap-fit ​​cavity.

9. A MIP chip flip-chip packaging structure according to claim 6, characterized in that: The first rotating plate (7) has a U-shaped groove (24) and the sliding column (18) slides in the U-shaped groove (24). The end of the sliding column (18) is also provided with an anti-detachment plate that slides in the U-shaped groove (24).

10. A packaging process for a MIP chip flip-chip structure, characterized in that, According to any one of claims 1-9, the specific process includes the following steps; S1. Component pre-assembly and positioning: Install and solder the semiconductor chip to the middle of the carrier plate (1), and connect the top plate (14) and the bottom plate (12) through an L-shaped structure to make the carrier plate (1) and the cover plate (2) initially aligned. At the same time, the first rotating plate (7) is inserted and connected to the bottom plate (12) of the carrier plate (1), and the second rotating plate (8) is inserted and connected to the top plate (14) of the cover plate (2); S2. Injection head installation and colloid pre-coating: Rotate the second rotating plate (8) to a horizontal position, insert the injection head and brushing mechanism into the snap-fit ​​cavity, and after the injection head is aligned with the meshing groove (3) on the carrier plate (1), rotate the second rotating plate (8) and adjust the position of the sliding column (18) in the U-shaped groove (24) so ​​that the second rotating plate (8) remains stable and vertical. Start the injection head and slowly and continuously inject colloid into the meshing groove (3) of the carrier plate (1). S3, Meshing motion and uniform coating: The robotic arm controls the movable shaft (15) connected to the cover plate (2) to move up and down and rotate the cover plate (2) so that the adhesive is evenly coated on the meshing tooth surface. The elastic rod on the brushing mechanism can be adjusted adaptively to ensure that the adhesive is fully filled. Excess adhesive will be collected in the inner ring plate (4) and the outer ring plate (10). S4. Complete fit and solidification locking: Change the fulcrum position of the connecting rope (20) on the rotating shaft (9) to tilt the first rotating plate (7) and the second rotating plate (8), and the injection head will disengage from the snap-fit ​​cavity. Meanwhile, the ends of the inclined first rotating plate (7) and the second rotating plate (8) press against the carrier plate (1) and the cover plate (2) respectively to prevent them from rotating. The mating ring plate (5) on the inner side of the cover plate (2) is sealed and engaged with the inner ring plate (4) on the inner side of the carrier plate (1). The reserved flow groove (6) helps to evenly disperse excess colloid and seal the connection between the mating ring plate (5) and the inner ring plate (4), thus completing the final sealing and mechanical interlocking.

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