Temperature control system of semiconductor cleaning equipment based on adaptive PID algorithm

Abstract

The application provides a semiconductor cleaning equipment temperature control system based on an adaptive PID algorithm, and relates to the technical field of semiconductor devices, and comprises: a liquid supplement execution module, which is used for obtaining a liquid supplement thermal disturbance correction value; a heating power analysis module, which is used for obtaining a correction execution instruction, and if the correction execution instruction is a steady-state maintenance instruction, the correction adjustment is not executed, otherwise the correction adjustment is executed; a heating power increase correction module, which is used for executing heating power increase correction adjustment and synchronously executing first correction adjustment of PID control parameters; and a heating power decrease correction module, which is used for executing heating power decrease adjustment based on the liquid supplement thermal disturbance correction value when the correction execution instruction is heating power decrease correction, and synchronously executing second correction adjustment of PID control parameters. The application solves the problem of temperature control response lag or overcompensation caused by fixed feedforward parameters, without considering the dynamic changes of liquid properties and flow in the prior art.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor devices, in particular to a temperature control system of a semiconductor cleaning equipment based on an adaptive PID algorithm. BACKGROUND

[0002] In the semiconductor manufacturing process, wafers undergo multiple stages of cleaning, oxidation, etching, deposition, ion implantation, chemical mechanical polishing, etc. By using a semiconductor cleaning equipment to clean the wafers, micron-level contaminants on the wafer surface can be removed to ensure chip yield and performance. In the cleaning process, in order to ensure process quality and product yield, the temperature of each process stage needs to be accurately controlled, because the preparation temperature directly affects the chemical reaction rate, material deposition uniformity and wafer surface quality, and unstable temperature control will lead to process deviation and defects. Therefore, the temperature of each process stage often needs to be accurately controlled. The temperature control system usually includes a temperature sensor, a heating / cooling unit, a mixed or heat transfer medium, a controller (using a proportional-integral-derivative (PID) algorithm), and a closed-loop feedback mechanism. A typical slot cleaning equipment, for example, a semiconductor cleaning equipment, includes a liquid supplement pipeline, a mixing tank, a circulating pump, a filter, an immersion heating unit (such as a resistance heating module), a PT100 temperature sensor, and a wafer bearing tank. The temperature control object is the cleaning liquid (such as alkaline cleaning liquid SC-1, composition: NH4OH + H2O2+ DI water) in the mixing tank, which has strong temperature sensitivity. The temperature rise will accelerate the oxidation reaction, so it is necessary to control the heating power of the heating unit (heat source is a resistance heating rod) of the semiconductor cleaning equipment to achieve fine temperature control of the cleaning liquid in the mixing tank. When the heating unit is heating, it first heats according to the preset initial heating power. When the mixing tank is being replenished with cleaning liquid, the temperature of the cleaning liquid to be replenished is compared with the temperature of the original cleaning liquid, and the heating power of the heating unit is changed accordingly. An increase in heating power corresponds to the generation of more heat supplied to the cleaning liquid in the mixing tank, and a decrease in heating power corresponds to the delivery of less heat to the cleaning liquid in the mixing tank, thereby achieving temperature consistency before and after the cleaning liquid is replenished. The temperature control principle is to detect the temperature in real time through the temperature sensor and feed it back to the PID controller. The PID controller dynamically adjusts the heating power according to the temperature deviation, forms a closed-loop control, and stabilizes the temperature at the target value. In the prior art, these temperature control systems often use feedforward signals (such as flow, inlet temperature, and heating power preset value) in combination with feedback adjustment to maintain the process temperature within the target range, reduce thermal inertia, response delay, and steady-state deviation.

[0003] For example, Chinese invention patent CN112259472B discloses a semiconductor cleaning equipment and a cleaning medium temperature control method, which includes: a process tank, a heating component, a cooling component, a temperature measuring element, and a controller. The temperature measuring element is used to measure the actual temperature of the cleaning medium in the process tank; the controller is used to turn on the cooling component when its actual temperature is greater than or equal to a preset cooling start temperature; turn off the cooling component and turn on the heating component when the actual temperature is less than a preset cooling stop temperature; and turn off the heating component when the actual temperature of the cleaning medium is greater than or equal to a preset target process temperature; wherein the cooling start temperature is greater than the target process temperature, and the target process temperature is greater than the cooling stop temperature.

[0004] For example, Chinese invention patent CN117524930B discloses a temperature control system and method for a semiconductor cavity with dual heating plates, comprising: a first heating plate and a second heating plate; a temperature acquisition unit for acquiring the temperature of the first heating plate and the second heating plate; a control unit disposed outside the cavity for adjusting the output power of the execution unit; and an execution unit for heating the first heating plate and the second heating plate. The control unit is a PID controller that selects multiple temperature ranges for segmented PID tuning and performs PID adjustment on the execution unit.

[0005] In summary, existing technologies for semiconductor cleaning temperature control rely solely on determining whether the actual temperature has reached the preset cooling or heating temperature before implementing the corresponding cooling or heating treatment, lacking PID feedforward control for temperature. However, in actual operation, frequent changes in heat load across different process stages and significant differences in thermal inertia between heating and cooling zones cause fluctuations in the overall system temperature response. During the rinsing stage after etching or thin film deposition, and during replenishment, the initial temperature of the replenished solution differs from the original rinsing solution in the mixing tank, leading to temperature response delays or localized overshoot during mixing. Because existing proportional-integral-derivative (PI-DE) control is based on fixed feedforward parameters, it cannot dynamically respond to changes in replenishment properties and flow rate. In practice, this manifests as temperature deviations from the target value, or excessively slow or rapid heating or cooling, resulting in lag or overcompensation in temperature control response. Therefore, the fixed feedforward parameters fail to adapt to dynamic changes in the chemical properties of the cleaning solution, leading to lag or overcompensation in temperature control response, ultimately affecting the stability and efficiency of temperature control during semiconductor production. Summary of the Invention

[0006] In view of this, embodiments of the present invention provide a temperature control system for semiconductor cleaning equipment based on an adaptive PID algorithm, which can promptly identify and compensate for thermal disturbances after the replenished solution enters the mixing tank, thereby achieving precise and stable temperature response control.

[0007] This invention provides a temperature control system for semiconductor cleaning equipment based on an adaptive PID algorithm. The system includes: a replenishment execution module, used to adjust heating power using an adaptive PID algorithm upon receiving a replenishment signal from the semiconductor cleaning equipment, and to obtain replenishment execution parameters within a preset sampling period, analyzing and obtaining a replenishment thermal disturbance correction value; a heating power analysis module, used to analyze and obtain a correction execution command based on the replenishment thermal disturbance correction value. If the correction execution command is a steady-state maintenance command, no correction adjustment is performed; otherwise, a correction adjustment is performed. The correction execution commands include a heating power increase correction command, a heating power decrease correction command, and a steady-state maintenance command; a heating power increase correction module, used to perform a heating power increase correction adjustment based on the replenishment thermal disturbance correction value and temperature change parameters within a preset repair period when the correction execution command is a heating power increase correction, and simultaneously perform a first correction adjustment of the PID control parameters; and a heating power decrease correction module, used to perform a heating power decrease adjustment based on the replenishment thermal disturbance correction value when the correction execution command is a heating power decrease correction, and simultaneously perform a second correction adjustment of the PID control parameters.

[0008] It also includes a PID control parameter recovery processing module, used to obtain the corrected and adjusted replenishment temperature difference value, analyze and obtain the PID control parameter recovery processing instruction. If the PID control parameter recovery processing instruction is to execute recovery, then the PID control parameter recovery processing is executed; otherwise, it is not executed. The specific method is as follows: obtain the corrected and adjusted mixing tank temperature and perform difference processing with the target temperature to obtain the second mixing temperature difference value; based on the absolute value of the second mixing temperature difference value and the theoretical disturbance allowable value, obtain the PID control parameter recovery processing instruction; if the absolute value of the mixing temperature difference value is less than or equal to the theoretical disturbance allowable value, and the mixing temperature difference value remains stable within a third preset time period, then the PID control parameter recovery processing is executed. If the instruction to perform PID control parameter recovery is to execute recovery, then the current PID control parameters are obtained and their differences are processed with the preset values ​​to obtain a set of PID control parameter differences. These differences are then compared with corresponding benchmark sets. If any difference in the set is greater than or equal to the benchmark set, then progressive PID control parameter recovery is executed; otherwise, linear PID control parameter recovery is executed. If the instruction to not perform recovery is to maintain the current PID control parameter recovery state, then the current PID control parameters are maintained. The preceding PID control parameters are not processed; the PID control parameter difference set includes proportional term difference, integral term difference, and derivative term difference; the PID control parameter difference reference set includes proportional term reference difference, integral term reference difference, and derivative term reference difference; during execution, the PID control parameters are progressively restored, specifically by: obtaining the PID recovery execution time and dividing it into three stages, with the first stage being the start stage, the second stage being the middle stage, and the third stage being the end stage; mapping processing is performed based on the proportional term difference, integral term difference, and derivative term difference respectively to obtain the corresponding proportional term adjustment execution rate, integral term adjustment execution rate, and derivative term adjustment execution rate, and these are jointly labeled as the [missing information]. The process begins with restoring the execution parameter set, which then performs a gradual recovery of the PID control parameters. In the second stage, heat absorption or release is assessed to obtain the heat absorption / release determination result. If the heat absorption / release determination result is satisfactory, the third stage of gradual recovery of the PID control parameters is performed according to the first restored execution parameter set until the PID control parameters are restored to preset values ​​(proportional term preset value, integral term preset value, and derivative term preset value). This completes the gradual recovery of the PID control parameters; otherwise, a warning is issued. The next step is to perform linear recovery of the PID control parameters. Specifically, the PID recovery execution time is obtained, and the values ​​of the PID control parameters are restored from their current values ​​to preset values ​​based on the PID recovery execution time.

[0009] The beneficial effects of the technical solutions provided in the embodiments of the present invention include at least the following:

[0010] 1. The temperature control system for semiconductor cleaning equipment based on adaptive PID algorithm provided by this invention, after receiving the cleaning liquid replenishment signal, sequentially performs liquid replenishment thermal disturbance correction analysis, heating power increase / decrease correction processing, PID control parameter first and second correction adjustment, stirring speed increase adjustment, and PID control parameter recovery processing, thereby achieving dynamic adjustment of the mixing tank temperature throughout the entire process. This ensures that the thermal disturbance after the replenished liquid enters the mixing tank can be identified and compensated in a timely manner, achieving accurate and stable temperature response control. This solves the problem of temperature control response lag or overcompensation caused by fixed feedforward parameters and failure to consider the physical properties and dynamic changes in flow rate of the replenished liquid in the prior art.

[0011] 2. This invention obtains liquid supply execution parameters such as initial replenishment temperature, mixing tank temperature, replenishment flow rate, and specific heat capacity of the liquid, and performs coupled calculations with the replenishment disturbance correction coefficient and the mixing response time constant to obtain the replenishment thermal disturbance correction value, thereby achieving a quantitative assessment of the replenishment thermal disturbance intensity. This effectively solves the problem in the prior art that it is impossible to accurately characterize the thermal disturbance after the replenishment enters the mixing tank.

[0012] 3. This invention generates heating power correction execution values, secondary increase or decrease processing execution values, and replenishment circulation flow correction values ​​by mapping analysis based on temperature change rate, temperature difference, and historical data during the correction process of heating power increase or decrease. Simultaneously, it executes dynamic response or output offset correction of PID control parameters, thereby achieving the matching of temperature improvement speed with the ideal temperature curve. This ensures steady-state convergence and dynamic optimization of the replenishment heating or cooling process, effectively solving the problem that single PID parameter adjustment in the prior art is difficult to cope with temperature fluctuations and nonlinear responses.

[0013] 4. This invention divides the PID control parameter recovery process into two modes: gradual recovery and linear recovery. It also combines the temperature change during the recovery period to determine whether the PID parameters are endothermic or exothermic, thereby achieving dynamic rate adjustment and phased recovery of the proportional, integral, and derivative terms. This ensures that the PID control parameters smoothly return to the preset value after the liquid replenishment temperature difference converges. This effectively solves the problem of overshoot or oscillation during the temperature control recovery process in the prior art, which leads to a decrease in system stability. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the temperature control system for a semiconductor cleaning device based on an adaptive PID algorithm provided in an embodiment of the present invention;

[0015] Figure 2 This is a global flowchart of the temperature control system for a semiconductor cleaning device based on an adaptive PID algorithm provided in an embodiment of the present invention.

[0016] Figure 3This is a flowchart detailing the heating power increase correction process of the temperature control system for semiconductor cleaning equipment based on adaptive PID algorithm provided in this embodiment of the invention.

[0017] Figure 4 This is a flowchart detailing the PID control parameter recovery process of a temperature control system for a semiconductor cleaning equipment based on an adaptive PID algorithm, provided in an embodiment of the present invention.

[0018] Figure 5 This is a schematic diagram of the progressive recovery processing of PID control parameters in a temperature control system for a semiconductor cleaning equipment based on an adaptive PID algorithm, provided in an embodiment of the present invention.

[0019] Figure 6 This is a schematic diagram of the linear recovery processing of PID control parameters in the temperature control system of a semiconductor cleaning equipment based on an adaptive PID algorithm, provided in an embodiment of the present invention. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0021] In this application, the terms "first," "second," "third," etc., are used to distinguish identical or similar items with substantially the same function and purpose. It should be understood that there is no logical or temporal dependency between "first," "second," and "nth," nor does it limit the quantity or execution order. It should also be understood that although the following description uses the terms "first," "second," etc., to describe various elements, these elements should not be limited by the terms. These terms are merely used to distinguish one element from another. For example, "first device," "second device," "third device," etc., are only used to distinguish devices. Similarly, "first sample data," "second sample data," and "third sample data," etc., are only used to distinguish sample data. Without departing from the scope of the various examples, a first device can be referred to as a second device, and similarly, a second device can be referred to as a first device. Both the first device and the second device are devices, and in some cases, they can be separate and distinct devices.

[0022] In this application, the term "at least one" means one or more, and the term "multiple" means two or more; for example, multiple devices means two or more devices. "At least two" means two or more. "At least three" means three or more.

[0023] It should be understood that the terminology used in the descriptions of the various examples herein is for the purpose of describing the particular examples only and is not intended to be restrictive. As in the descriptions of the various examples, the singular forms “a ('a' / 'an')” and “the” are intended to also include the plural forms unless the context explicitly indicates otherwise.

[0024] It should also be understood that the term "and / or" as used herein refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" describes an association between related objects, indicating that three relationships can exist; for example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects are in an "or" relationship.

[0025] It should also be understood that, in the various embodiments of this application, the sequence number of each process does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0026] It should also be understood that determining B based on A does not mean determining B solely based on A; it is also possible to determine B based on A and / or other information.

[0027] It should also be understood that the term “comprising” (also referred to as “includes”, “including”, “comprises” and / or “comprising”) as used in this specification specifies the presence of the stated features, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0028] It should also be understood that the term "if" can be interpreted as meaning "when" or "upon" or "in response to determination" or "in response to detection." Similarly, depending on the context, the phrases "if determination..." or "if detection [the stated condition or event]" can be interpreted as meaning "when determination..." or "in response to determination..." or "when detection [the stated condition or event]" or "in response to detection [the stated condition or event]."

[0029] This invention provides a temperature control system for semiconductor cleaning equipment based on an adaptive PID algorithm, such as... Figure 1The diagram shows the structure of a temperature control system for a semiconductor cleaning equipment based on an adaptive PID algorithm. This system includes the following modules: a liquid replenishment execution module, used to adjust the heating power using an adaptive PID algorithm upon receiving a liquid replenishment signal from the semiconductor cleaning equipment, and to obtain the liquid supply execution parameters within a preset sampling period, analyzing and obtaining the liquid replenishment thermal disturbance correction value; a heating power analysis module, used to analyze and obtain a correction execution command based on the liquid replenishment thermal disturbance correction value. If the correction execution command is a steady-state maintenance command, no correction adjustment is performed; otherwise, a correction adjustment is performed. The correction execution commands include a heating power increase correction command, a heating power decrease correction command, and a steady-state maintenance command; a heating power increase correction module, used to perform a heating power increase correction adjustment based on the liquid replenishment thermal disturbance correction value and temperature change parameters within a preset repair period when the correction execution command is a heating power increase correction, and simultaneously perform a first correction adjustment of the PID control parameters; and a heating power decrease correction module, used to perform a heating power decrease adjustment based on the liquid replenishment thermal disturbance correction value when the correction execution command is a heating power decrease correction, and simultaneously perform a second correction adjustment of the PID control parameters.

[0030] In this embodiment, as Figure 2 As shown, Figure 2 This is a global flowchart of the temperature control system for a semiconductor cleaning equipment based on an adaptive PID algorithm, provided in this embodiment of the invention. When the system receives a cleaning fluid replenishment signal from the semiconductor cleaning equipment, it first acquires the fluid supply execution parameters within a preset sampling period. Then, it calculates the replenishment thermal disturbance correction value and compares it with the theoretical allowable disturbance value. Based on the comparison result, the system generates a correction execution command: if an increase correction is required, it executes a heating power increase correction; if a decrease correction is required, it executes a heating power decrease correction; if the system is within the steady-state range, it executes a steady-state maintenance command without correction. After completing the corresponding correction, the system executes PID control parameter recovery processing, ultimately ending the current temperature control adjustment process.

[0031] Furthermore, the replenishment thermal disturbance correction value is obtained. The specific method is as follows: obtain the liquid supply execution parameters within a preset sampling period, including the initial replenishment temperature, mixing tank temperature, replenishment flow rate, and specific heat capacity of the liquid; obtain the preset replenishment disturbance correction coefficient and mixing response time constant; perform difference processing based on the initial replenishment temperature and mixing tank temperature to obtain the replenishment temperature difference value; multiply the replenishment temperature difference value with the specific heat capacity of the liquid and the replenishment flow rate respectively to obtain the product coupling result; multiply the product coupling result with the replenishment disturbance correction coefficient to obtain the replenishment disturbance coupling correction result; and perform ratio processing based on the replenishment disturbance coupling correction result with the mixing response time constant to obtain the replenishment thermal disturbance correction value. The replenishment thermal disturbance correction value is used to characterize the potential thermal disturbance intensity of the system caused by the differences in temperature, flow rate, and specific heat capacity after the replenishment enters the mixing tank.

[0032] In this embodiment, it should be noted that the replenishment temperature difference value is obtained by processing the difference between the initial replenishment temperature and the mixing tank temperature, specifically by subtracting the mixing tank temperature from the initial replenishment temperature. The ratio of the replenishment disturbance coupling correction result to the mixing response time constant is also processed, specifically by dividing the replenishment disturbance coupling correction result by the mixing response time constant to obtain the replenishment thermal disturbance correction value.

[0033] The mixing tank temperature refers to the temperature of the chemical solution (rinsing fluid) currently in the mixing tank. Supply parameters, including initial replenishment temperature, mixing tank temperature, replenishment flow rate, and specific heat capacity of the chemical solution, can all be obtained from the computer-based management system. This system is connected to a PT100 type resistance temperature sensor, several temperature sensors, and an electromagnetic flowmeter. The resistance temperature sensor detects the initial replenishment temperature input to the replenishment pipeline. Several temperature sensors are positioned at various locations at the bottom of the mixing tank and the outlet. The average temperature value detected by these sensors is used as the mixing tank temperature. The electromagnetic flowmeter detects the replenishment flow rate. The specific heat capacity of the chemical solution (rinsing fluid) can be obtained by querying the construction log to determine its composition.

[0034] The specific method for obtaining the thermal disturbance correction value for liquid replenishment is as follows:

[0035] In the formula, △u represents the correction value for thermal disturbance of replenishment, α represents the correction coefficient for replenishment disturbance, Qin represents the replenishment flow rate, Cp represents the specific heat capacity of the drug solution, Tin represents the initial temperature of replenishment, Tmix represents the temperature of the mixing tank, and rmix represents the mixing response time constant.

[0036] The replenishment disturbance correction coefficient can be obtained from historical operation logs. By analyzing the current real-time operation data, historical data consistent with the current operation data is retrieved from the historical operation logs, and the corresponding historical replenishment disturbance correction coefficient is used as the replenishment disturbance correction coefficient. The mixing response time constant represents the time required for the mixed liquid to reach thermal equilibrium. Its physical nature is related to the fluid's specific heat, flow rate, stirring intensity, and tank thermal inertia. It can be obtained by comparing the current sensor's actual detection data with historical construction batches. The mixing response time constant can be obtained based on the patterns of historical batches.

[0037] By analyzing the thermal disturbance correction value of the replenishment solution, a quantitative characterization of transient thermal disturbances caused by differences in temperature, flow rate, and specific heat capacity after the replenishment solution enters the mixing tank is achieved. Analyzing this correction value allows for real-time assessment of the impact of external thermal disturbances on the system's energy balance before PID control execution, enabling the control algorithm to provide targeted compensation capabilities. This effectively avoids controller misjudgments or delayed responses caused by excessive differences between the replenishment solution temperature and the tank solution temperature. Even under conditions of discontinuous heat input, frequent replenishment cycles, or significant flow fluctuations, the system can maintain a dynamic matching relationship between heating power output and changes in heat load, thereby improving the response speed and stability of temperature regulation and reducing the risk of overheating or temperature oscillations caused by unidentified thermal disturbances. This achieves feedforward identification and compensation of thermal disturbance intensity under mixed thermal coupling conditions, transforming the entire temperature control system from traditional passive response regulation to active balance regulation based on disturbance prediction, thus improving the accuracy and consistency of thermal control during semiconductor cleaning.

[0038] Furthermore, the correction execution instruction is obtained. The specific method is as follows: obtain the preset theoretical disturbance allowable value and compare it with the absolute value of the liquid replenishment thermal disturbance correction value. If the absolute value of the liquid replenishment thermal disturbance correction value is less than or equal to the theoretical disturbance allowable value, the correction execution instruction is not to perform the correction adjustment. Otherwise, based on the analysis of the liquid replenishment thermal disturbance correction value, if the liquid replenishment thermal disturbance correction value is positive, the correction execution instruction is to reduce the heating power correction. If the liquid replenishment thermal disturbance correction value is negative, the correction execution instruction is to increase the heating power correction.

[0039] In this embodiment, as Figure 3 As shown, Figure 3 This is a detailed flowchart of the heating power increase correction process in the temperature control system of a semiconductor cleaning equipment based on an adaptive PID algorithm, provided in this embodiment of the invention. After the system obtains the corrected output control value, it first generates a heating power correction execution value and collects the temperature values ​​at each moment during the recovery period. The system determines whether the temperature continues to rise: if it continues to rise, it further determines whether the initial and final temperature change rate is greater than or equal to a preset temperature change rate threshold; if the condition is met, the current heating state is maintained until the replenishment temperature difference converges to less than or equal to the theoretical disturbance allowable value, and the PID execution parameter correction process is not executed; if the condition is not met, a second heating power increase process is executed, and the replenishment circulation flow rate is reduced, while the dynamic response correction adjustment of the PID execution parameters is performed. If the temperature does not continue to rise, exhaust processing is performed and the PID execution parameter output offset correction adjustment is performed, and then the process ends.

[0040] The absolute value of the replenishment thermal disturbance correction value characterizes the intensity of the total system thermal energy shift introduced after the replenishment enters the mixing tank. It reflects the degree of deviation between the current liquid energy state and the steady-state energy balance point. By comparing the absolute value of the replenishment thermal disturbance correction value with the preset theoretical disturbance allowable value, it is possible to effectively distinguish between "negligible disturbance" and "disturbance requiring active correction." This allows the system to avoid meaningless PID correction operations when the replenishment disturbance is small (e.g., small temperature difference, insignificant flow rate change), thereby reducing controller inefficiencies, invalid calculations, and heating power fluctuations, maintaining system stability and reasonable energy consumption.

[0041] When the absolute value of the replenishment thermal disturbance correction exceeds the theoretical allowable disturbance value, it indicates that the system's thermal balance is significantly disrupted. In this case, different control strategies need to be implemented based on the positive or negative direction of the correction value. Specifically, a negative replenishment thermal disturbance correction indicates that the temperature of the introduced flushing fluid is lower than the original liquid temperature in the mixing tank, leading to heat dilution in the mixing tank and a decrease in overall system thermal energy. In this case, increasing the heating power correction can quickly compensate for the energy gap caused by the injection of external cold liquid, achieving timely temperature recovery and dynamic balance restoration. Conversely, a positive replenishment thermal disturbance correction indicates that the temperature of the introduced flushing fluid is higher than the original liquid temperature in the mixing tank. Maintaining the original heating power in this case can easily cause overshooting of the tank liquid temperature or uneven heat distribution. By reducing the heating power correction, excess heat input can be reduced, allowing the system's thermal load and heating output to be rematched, thereby avoiding abnormalities such as heat accumulation and bubble formation.

[0042] Furthermore, the heating power increase correction adjustment is performed. Specifically, the absolute value of the liquid replenishment thermal disturbance correction value is added to a preset output control value to obtain a corrected output control value. This corrected output control value is then used for matching and mapping to obtain the heating power correction execution value, which is used for liquid replenishment and heating. The temperature values ​​at each moment during the recovery period are obtained and analyzed. If the temperature continues to rise during the recovery period, and the temperature change rate at the beginning and end is greater than or equal to a preset temperature change rate threshold, the heating power correction execution value continues to run until the liquid replenishment temperature difference converges to less than or equal to the theoretical disturbance allowable value, thus completing the heating power increase correction adjustment. Specifically, if the liquid replenishment temperature difference is less than or equal to the theoretical disturbance allowable value, no further adjustments are made. PID execution parameter correction processing is performed. If the temperature continues to rise during the recovery period, and the temperature change rate at the beginning and end is less than the preset temperature change rate threshold, a second heating power increase processing is performed, and the replenishment circulation flow rate is reduced until the replenishment temperature difference converges to less than or equal to the theoretical disturbance allowable value to complete the heating power increase correction adjustment. PID execution parameter dynamic response correction adjustment is also performed. If the temperature fluctuates repeatedly during the recovery period, venting processing is performed, and a second improvement judgment is performed after venting processing to obtain the second improvement judgment result. If the second improvement judgment result is satisfactory, heating power re-correction adjustment is performed until the replenishment temperature difference converges to less than or equal to the theoretical disturbance allowable value to complete the heating power increase correction adjustment. Otherwise, an early warning reminder is issued, and PID execution parameter output offset correction adjustment is performed.

[0043] In this embodiment, it should be noted that the continuous temperature rise during the recovery period refers to the gradual increase in temperature values ​​at each moment within the recovery period. The temperature change rate at the beginning and end of the recovery period is specifically calculated as follows: subtract the temperature value at the beginning of the recovery period from the temperature value at the end of the recovery period to obtain the temperature difference between the beginning and end of the recovery period; divide the temperature difference between the beginning and end of the recovery period by the interval between the beginning and end of the recovery period to obtain the temperature change rate between the beginning and end of the recovery period. Because the heating power is being increased and corrected at this time, the temperature of the rinsing liquid in the mixing tank gradually increases, and therefore the replenishment temperature difference gradually decreases. The "output control value" refers to the heating execution quantity calculated by the adaptive PID algorithm in the temperature control loop based on the current temperature deviation and its rate of change, where the current temperature deviation is specifically the difference between the set temperature and the measured temperature. This value reflects the real-time adjustment command of the controller to the heater output power, and is usually a comprehensive output signal generated by the combined action of the proportional, integral, and derivative terms.

[0044] The system performs matching mapping based on the corrected output control value to obtain the corrected heating power execution value. Specifically, it acquires the preset response relationships between the output control values ​​and the actual heating power under different temperature ranges and heater load conditions, forming piecewise power response curves. The parameters corresponding to each curve are then organized into a heating power response characteristic set, where each curve's parameters include the control signal range, power output proportional coefficient, and delay correction coefficient. When the corrected output control value is obtained, the system first identifies the current temperature range and selects the corresponding power response curve from the heating power response characteristic set. Based on the corrected output control value, it finds the corresponding range within that curve and calculates the relative proportional position of the corrected output control value within that range. Based on this proportional position, it uses piecewise linear interpolation to calculate the corresponding heating power corrected execution value, thus obtaining the corrected heating power execution value.

[0045] Venting refers to the process of releasing gas and equalizing pressure inside a mixing tank or reaction chamber under conditions of repeated temperature fluctuations. This is done to eliminate uneven heat transfer caused by trapped air bubbles and localized gas-liquid interface blockage. The specific method is as follows: the vent valve is activated and controlled to gradually release the gas inside the chamber according to a preset opening duration and frequency. Pressure changes are monitored by a pressure sensor installed on the top of the mixing tank, and the vent valve is automatically closed after the pressure value is confirmed to be stable.

[0046] Furthermore, a secondary increase in heating power is performed, and the replenishment circulation flow rate is reduced. Specifically, the following methods are employed: Based on the temperature change rate at the beginning and end of the recovery period, a difference analysis is performed between this rate and a temperature change rate threshold to obtain a temperature change difference value. This value characterizes the difference between the temperature improvement rate and the ideal temperature improvement rate during the recovery period. A mapping analysis is then performed based on this temperature change difference value to obtain a secondary correction value for heating power and a correction value for replenishment circulation flow rate. The current replenishment circulation flow rate is obtained and proportionally processed against the maximum replenishment circulation flow rate to obtain a replenishment circulation flow rate constraint factor. The secondary correction value for heating power is coupled with the heating power correction execution value to obtain the secondary increase in heating power execution value. Finally, the replenishment circulation flow rate correction value and the replenishment circulation flow rate constraint factor are linearly scaled to obtain the replenishment circulation flow rate execution value, thus completing the heating power increase correction adjustment.

[0047] In this embodiment, the temperature change difference value is obtained by subtracting the temperature change rate at the beginning and end of the time frame from the temperature change rate threshold, and then dividing this difference by the temperature change rate threshold. The replenishment circulation flow constraint factor is obtained by dividing the current replenishment circulation flow rate by the maximum replenishment circulation flow rate to obtain the current proportion of the current replenishment circulation flow rate, and using this proportion as the replenishment circulation flow constraint factor. The heating power secondary correction value and the heating power correction execution value are coupled to obtain the heating power secondary enhancement processing execution value, specifically by adding the heating power secondary correction value to the heating power correction execution value. The replenishment circulation flow rate execution value is obtained by linear scaling based on the replenishment circulation flow rate correction value and the replenishment circulation flow rate constraint factor, specifically by adding the product of the replenishment circulation flow rate correction value and the replenishment circulation flow rate constraint factor to obtain the replenishment circulation flow rate execution value.

[0048] like Figure 4 As shown, Figure 4 This is a detailed flowchart of the PID control parameter recovery process in a temperature control system for semiconductor cleaning equipment based on an adaptive PID algorithm, provided in this embodiment of the invention. After detecting a second mixed temperature difference, the system determines whether a PID control parameter recovery instruction exists. If recovery is not performed, the current PID control parameters are maintained without processing; if recovery is performed, the PID control parameter difference set is calculated, and it is determined whether any difference exceeds the corresponding benchmark difference. If an exceeding term exists, progressive PID control parameter recovery processing is performed; if no exceeding term exists, linear PID control parameter recovery processing is performed. After completing the corresponding recovery operation, the process ends.

[0049] Based on the degree of temperature change difference, a mapping analysis is performed to obtain the secondary correction value of heating power and the correction value of replenishment circulation flow rate. The specific method is as follows: a correspondence matrix between temperature improvement difference and the adjustment range of heating power and circulation flow rate is established based on historical operating data and empirical control records. The data item with the closest temperature change difference to the current temperature change difference is found in the historical control records, and the corresponding heating power adjustment and replenishment circulation flow rate adjustment are extracted. The found heating power adjustment is used as the secondary correction value of heating power, and the found circulation flow rate adjustment is used as the correction value of replenishment circulation flow rate.

[0050] The difference value can reflect the "hysteresis" or "excessive slowness" of the system's thermal response in real time. By using it as a mapping input, the heating power and circulation flow rate can be dynamically corrected, so that the control strategy changes from the traditional static correction to "dynamic correction that changes with the rate of temperature improvement". This automatically increases the heat input when the temperature recovery is too slow and suppresses overshoot when the temperature rises too fast, thereby improving the stability of the overall temperature control process.

[0051] Liquid replenishment operations often cause a sudden drop in the average temperature of the liquid in the mixing tank. The heating power after the first correction is often insufficient to offset the combined effects of the liquid's specific heat difference and thermal inertia. Therefore, after the initial correction, a second correction value for the heating power is calculated based on the degree of temperature change difference. By coupling the current heating power correction execution value, a second increase in heating power is obtained, realizing the second adjustment of thermal compensation and preventing the lag in temperature recovery that occurs under conditions of high flow rate replenishment or low temperature replenishment.

[0052] Maintaining a high circulation flow rate while increasing heating power results in a short residence time of the liquid in the mixing tank, leading to insufficient heat transfer and potentially causing localized temperature fluctuations or the formation of thermal gradients. By reducing the circulation flow rate, the heat absorption process of the liquid in the heating zone is made more complete, ensuring a more uniform distribution of heat energy. At the same time, the reduced flow rate also suppresses bubble formation or liquid disturbance caused by high-speed agitation, thereby improving the thermal stability of the system.

[0053] Furthermore, a secondary improvement judgment result is obtained. The specific method is as follows: after the exhaust treatment is completed, the temperature fluctuation parameters within the second preset time period are obtained, and the temperature fluctuation secondary judgment result is analyzed. If the temperature fluctuation secondary judgment result is temperature fluctuation, the secondary improvement judgment result is that the improvement is unqualified; otherwise, the secondary improvement judgment result is that the improvement is qualified.

[0054] In this embodiment, it should be noted that the temperature fluctuation parameter refers to the temperature values ​​at each moment within the second preset time period. The secondary judgment result of repeated temperature fluctuation is obtained. The specific process is as follows: Based on the temperature value sequence, the temperature change rate sequence between adjacent sampling moments is calculated. Specifically, the temperature change rate sequence is a set of temperature change rates arranged in chronological order at each adjacent moment. Then, sign analysis is performed on the change rate sequence, and the variance of the temperature values ​​at each moment within the second preset time period is calculated. If the temperature change rate alternates between positive and negative values ​​within the preset time period and / or the variance exceeds the preset fluctuation threshold, it is determined that "repeated temperature fluctuation" exists. For example, alternating positive and negative values ​​can exist at three consecutive moments: moment A, moment B, and moment C. The difference between the temperature values ​​at moment B and moment A is positive, and the difference between the temperature values ​​at moment C and moment B is negative, which is the alternation of positive and negative values. If the sign of the temperature change rate converges unidirectionally and the variance is lower than the fluctuation threshold, it is determined that "temperature is stable". The unidirectional convergence of the sign of the temperature change rate specifically means that the positive and negative directions are consistent.

[0055] If the temperature continues to fluctuate repeatedly within the second preset time period, it indicates that there are residual deviations in the system in terms of disturbance attenuation and thermal inertia compensation. In this case, the control system can be prompted to enter the readjustment stage if the second improvement judgment result is "improvement unqualified". This will achieve multi-level convergence optimization of adaptive PID control. If the judgment result is "improvement qualified", it can be confirmed that the temperature control process has been effectively stabilized.

[0056] Furthermore, the first correction adjustment of the PID control parameters is performed, which includes dynamic response correction adjustment of the PID execution parameters and output offset correction adjustment of the PID execution parameters. Specifically, the method is as follows: Preset values ​​for the PID control parameters are obtained, including preset values ​​for the proportional, integral, and derivative terms. If the first correction adjustment is a dynamic response correction adjustment, a comprehensive analysis is performed based on the liquid replenishment thermal disturbance correction value and the temperature change rate at the beginning and end of the recovery time to obtain a comprehensive difference ratio. A mapping process is performed based on the comprehensive difference ratio to obtain a second set of constraint factors, and the PID control parameters are corrected based on the second set of constraint factors. If the first correction adjustment is a PID output offset correction adjustment, the heating power execution value after the heating power recalibration adjustment is obtained and marked as the heating power recalibration value. A difference analysis is performed between the recalibrated heating power value and the initial execution power to obtain a recalibrated power difference value. A mapping process is performed based on the recalibrated power difference value to obtain a third set of constraint factors, and the PID control parameters are corrected based on the third set of constraint factors, thus completing the first correction adjustment of the PID control parameters.

[0057] In this embodiment, the comprehensive difference ratio is obtained by subtracting the replenishment thermal disturbance correction reference value from the replenishment thermal disturbance correction value to obtain the replenishment thermal disturbance reference difference value. The replenishment thermal disturbance reference difference value is divided by the replenishment thermal disturbance correction reference value to obtain the replenishment thermal disturbance correction difference ratio. The temperature change reference difference value is obtained by subtracting the temperature change rate at the first and last moments from the temperature change rate threshold. The temperature change reference difference value is obtained by dividing the temperature change rate threshold by the temperature change rate threshold to obtain the temperature recovery change difference ratio. The replenishment thermal disturbance correction difference ratio and the temperature recovery change difference ratio are added together to obtain the comprehensive difference ratio.

[0058] A second set of constraint factors is obtained by mapping based on the comprehensive difference ratio. Specifically, historical operating data is acquired, and a correspondence table between the comprehensive difference ratio and constraint factors is established based on this data. This table provides a one-to-one correspondence between historical operating data and their corresponding constraint factors, including the correction magnitudes for the proportional, integral, and derivative terms. The currently calculated comprehensive difference ratio is then matched against the historical mapping table to find the closest record. The constraint factor values ​​for the proportional, integral, and derivative terms in the matched record are extracted to form the second set of constraint factors.

[0059] The second constraint factor set includes the proportional term second constraint factor, the integral term second constraint factor, and the derivative term second constraint factor. The PID control parameters are corrected based on this second constraint factor set. Specifically, the proportional term value is subtracted from the product of the proportional term value and the proportional term second constraint factor to obtain the corrected integral term value. The integral term value is then subtracted from the product of the integral term value and the integral term second constraint factor to obtain the corrected integral term value. Finally, the derivative term value is added to the product of the integral term value and the derivative term second constraint factor to obtain the corrected derivative term value. This completes the correction of the PID control parameters.

[0060] The third constraint factor set includes the proportional term third constraint factor, the integral term third constraint factor, and the derivative term third constraint factor. The PID control parameters are corrected and adjusted based on this third constraint factor set. Specifically, the proportional term value in the current PID control parameters is multiplied by the proportional term value and the proportional term third constraint factor to obtain the corrected integral term value. The integral term value in the current PID control parameters is then subtracted from the integral term value and the integral term third constraint factor to obtain the corrected integral term value. Finally, the derivative term value in the current PID control parameters is multiplied by the integral term value and the derivative term third constraint factor to obtain the corrected derivative term value. This completes the correction of the PID control parameters.

[0061] After the replenishing liquid enters the mixing tank, transient thermal disturbances will occur in the system due to differences in temperature, flow rate, and specific heat capacity. If the system's response speed is slow or lags, resulting in a prolonged temperature recovery process, the system will determine that there is a "dynamic response deviation." Therefore, dynamic response correction adjustment of the PID controller's execution parameters will be performed. At this time, by analyzing the thermal disturbance correction value of the replenishing liquid and the temperature change rate at the beginning and end of the recovery period, a comprehensive difference ratio is obtained. This ratio is then used to generate a second set of constraint factors to dynamically correct the proportional, integral, and derivative terms. This allows the PID controller to accelerate its response speed and reduce overshoot in subsequent temperature control, ensuring that the system quickly enters the steady-state range and achieves temperature control. Dynamic optimization for temperature recovery: Even though the system has recovered to the target temperature range, a steady-state deviation still exists after liquid replenishment and secondary increase in heating power. This steady-state deviation, such as the temperature deviating from the set value, indicates an "output offset" in the control output. At this time, the PID execution parameter output offset correction adjustment is performed. By obtaining the difference between the corrected heating power value and the initial execution power, the degree of difference in corrected power is obtained. The third constraint factor set is obtained through mapping, and the offset compensation adjustment of the PID control parameters is performed, enabling the system to adaptively correct the steady-state error and ensure that the heating power output is accurately matched with the system's heat demand, thereby achieving high-precision control in the steady-state stage.

[0062] Furthermore, the heating power is reduced and adjusted. Specifically, the absolute value of the preset heating power and the liquid replenishment thermal disturbance correction value are subtracted to obtain a second execution value for the heating power reduction correction. This second execution value is then executed, specifically by setting the current heating power execution value to the second execution value and simultaneously performing venting. After venting, the stirring speed is adjusted. The stirring speed adjustment is performed by: performing mapping analysis based on the liquid replenishment thermal disturbance correction value to obtain the initial stirring execution speed; acquiring the current mixing tank temperature and performing difference processing with the target temperature to obtain the first mixing temperature difference (the current mixing tank temperature is then adjusted). The first mixing temperature difference is obtained by subtracting the target temperature from the initial temperature, and a mapping analysis is performed to obtain the stirring speed adjustment step size. Within each preset cycle, the initial stirring speed is gradually increased and adjusted using the stirring speed adjustment step size as the increment, and the temperature value at each moment during the stirring speed increase adjustment process is obtained, thereby obtaining the temperature reduction value within each preset cycle. A preset temperature reduction threshold is obtained and compared with the temperature reduction value within each preset cycle. If the temperature reduction value within a certain cycle is greater than or equal to the temperature reduction threshold, stirring is continued at the stirring speed of that cycle until the first mixing temperature difference converges to less than or equal to the theoretical disturbance allowable value, and that cycle is marked as the ideal execution cycle, thereby completing the heating power reduction correction process.

[0063] In this embodiment, the first mixing temperature difference is obtained by subtracting the target temperature from the current mixing tank temperature.

[0064] The initial stirring execution speed is obtained by mapping analysis based on the replenishment thermal disturbance correction value. The specific method is as follows: compare the replenishment thermal disturbance correction value with the data set of historical replenishment thermal disturbance correction values ​​and corresponding stirring execution speeds, and use the linear interpolation method to map the current replenishment thermal disturbance correction value to the corresponding stirring speed range in the historical experience data, and output the mapped initial stirring execution speed as the initial stirring execution speed.

[0065] A mapping analysis is performed to obtain the stirring speed adjustment step size. The specific method is as follows: based on the mapping and matching of the first mixing temperature difference and historical data, the historical first mixing temperature difference that is closest to the first mixing temperature difference is selected as the historical reference first mixing temperature difference, and the historical stirring speed adjustment step size corresponding to the historical reference first mixing temperature difference is used as the stirring speed adjustment step size.

[0066] By adjusting the stirring speed in increments, refined control of the system's thermal disturbance decay phase and gradual adjustment of energy release are achieved, effectively avoiding sudden temperature drops and thermal inertia imbalances. Dynamically increasing the stirring speed step size ensures coordination between the fluid's internal heat conduction rate and mechanical disturbance rate, preventing localized accelerated cooling or temperature overshoot caused by sudden increases in stirring speed. By calculating the first mixing temperature difference between the current mixing tank temperature and the target temperature in real time and mapping it to the stirring speed adjustment step size, adaptive correspondence between stirring speed and system thermal deviation is achieved. Specifically, the step size increases when the temperature difference is large to accelerate heat diffusion; the step size decreases when the temperature difference approaches the target to smooth the convergence process.

[0067] By acquiring the temperature drop value of each cycle and comparing it with the preset temperature drop threshold, the actual cooling effect of the current stirring speed can be determined. When the temperature drop value exceeds the threshold, the system locks the stirring execution speed corresponding to that cycle and continues stirring until the temperature difference converges to less than or equal to the theoretical disturbance allowable value, thus achieving the optimal residence of the stirring rate.

[0068] Furthermore, the second correction adjustment of the PID control parameters is performed, specifically as follows: The temperature difference between the end temperature of the ideal execution cycle and the target temperature is obtained and marked as the corrected execution temperature difference; the temperature difference between the beginning and end of the ideal execution cycle is obtained, and combined with the analysis of the corrected execution temperature difference to obtain a temperature deviation risk index; based on the temperature deviation risk index, a mapping process is performed to obtain a first scaling factor set consisting of a first scaling factor including a proportional term, an integral term, and a derivative term; based on the absolute value of the liquid replenishment thermal disturbance correction value, a mapping process is performed to obtain a second scaling factor set consisting of a second scaling factor including a proportional term, an integral term, and a derivative term. A second scaling factor set is formed by the factors; a comprehensive scaling factor set is obtained by coupling the first and second scaling factor sets; and a second correction adjustment of the PID control parameters is performed based on the comprehensive scaling factor set. Specifically, the comprehensive scaling factor set is obtained by adding the first scaling factor and the second scaling factor of the proportional term to obtain the comprehensive scaling factor of the proportional term, adding the first scaling factor and the second scaling factor of the integral term to obtain the comprehensive scaling factor of the integral term, and adding the first scaling factor and the second scaling factor of the derivative term to obtain the comprehensive scaling factor of the derivative term. Therefore, the comprehensive scaling factor set includes the comprehensive scaling factor of the proportional term, the comprehensive scaling factor of the integral term, and the comprehensive scaling factor of the derivative term.

[0069] In this embodiment, the temperature deviation risk index is obtained by the following method:

[0070] ;

[0071] In the formula, WP represents the temperature deviation risk index, C1 represents the corrected execution temperature difference, C2 represents the temperature difference at the beginning and end of the ideal execution cycle, ω1 represents the weight of the corrected execution temperature difference, and ω2 represents the weight of the temperature difference at the beginning and end of the cycle.

[0072] The weights for corrected execution temperature differences and the weights for the first and last time intervals can be obtained from the database. For example, the weights for corrected execution temperature differences can be obtained by retrieving the historically stored corrected execution temperature differences and their corresponding historical weights. The current corrected execution temperature difference is then matched with the historically stored corrected execution temperature differences. The historical corrected execution temperature difference closest to the current one is taken as the historical reference corrected execution temperature difference, and its corresponding historical weight is taken as the corrected execution temperature difference weight. The weights for the first and last time intervals are obtained in the same way as those for corrected execution temperature differences, by matching them with historical data.

[0073] The mapping process based on the temperature deviation risk index yields the first scaling factor set. Specifically, the method involves: acquiring a historical temperature deviation risk index dataset, which includes several historical temperature deviation risk index data. These historical temperature deviation risk index data are qualified data that has undergone historical verification, meaning the data is complete and can be executed correctly. The current temperature deviation risk index is matched with the historical temperature deviation risk index data, and the historical temperature deviation risk index data that is closest to the current temperature deviation risk index data is selected as the historical reference temperature deviation risk index data. The historical first scaling factor set corresponding to the historical reference temperature deviation risk index data is then acquired and used as the first scaling factor set.

[0074] The second scaling factor set is obtained by mapping the liquid replenishment thermal disturbance correction value. The specific method is as follows: obtain the stored historical liquid replenishment thermal disturbance correction value dataset, which includes each historical liquid replenishment thermal disturbance correction value and the historical scaling factor set corresponding to each historical liquid replenishment thermal disturbance correction value. Compare the current liquid replenishment thermal disturbance correction value with each historical liquid replenishment thermal disturbance correction value, select the historical liquid replenishment thermal disturbance correction value that is closest to the current liquid replenishment thermal disturbance correction value as the historical reference liquid replenishment thermal disturbance correction value, and use the historical second scaling factor set corresponding to the historical reference liquid replenishment thermal disturbance correction value as the second scaling factor set.

[0075] The second correction adjustment of PID control parameters is performed based on the comprehensive scaling factor set. The specific method is as follows: subtract the product of the proportional term value and the comprehensive scaling factor from the current proportional term value in the PID control parameters to obtain the corrected integral term value; subtract the product of the integral term value and the comprehensive scaling factor from the current integral term value in the PID control parameters to obtain the corrected integral term value; add the product of the integral term value and the comprehensive scaling factor to the current derivative term value in the PID control parameters to obtain the corrected derivative term value. This completes the second correction adjustment of the PID control parameters.

[0076] By extracting the initial and final temperature differences and the target temperature difference within the ideal execution cycle, a temperature deviation risk index is established, which can accurately reflect the degree of steady-state deviation of the system after liquid replenishment and cooling. Furthermore, the absolute values ​​of this risk index and the liquid replenishment thermal disturbance correction value are used to generate the first and second scaling factor sets, respectively, and coupled them to achieve fine scaling of the proportional, integral, and derivative parameters based on a comprehensive consideration of the system's thermal inertia and disturbance intensity.

[0077] Furthermore, it also includes a PID control parameter recovery processing module, used to obtain the corrected and adjusted replenishment temperature difference value, analyze it to obtain the PID control parameter recovery processing instruction, and if the PID control parameter recovery processing instruction is to execute recovery, then the PID control parameter recovery processing is executed; otherwise, it is not executed. The specific method is as follows: obtain the corrected and adjusted mixing tank temperature, and perform difference processing with the target temperature to obtain the second mixing temperature difference value; based on the absolute value of the second mixing temperature difference value and the theoretical disturbance allowable value, obtain the PID control parameter recovery processing instruction; if the absolute value of the mixing temperature difference value is less than or equal to the theoretical disturbance allowable value, and the mixing temperature difference value remains stable within a third preset time period, then the PID control parameter recovery processing instruction is to execute recovery; otherwise, the PID control parameter recovery processing instruction is not to execute recovery. If the PID control parameter recovery instruction is to execute recovery, then the current PID control parameters are obtained and their differences are processed with the preset values ​​of the PID control parameters to obtain a set of PID control parameter differences. These sets of PID control parameter differences are then compared with their corresponding reference sets. If any difference in the set of PID control parameter differences is greater than or equal to the corresponding reference set, then progressive PID control parameter recovery processing is executed; otherwise, linear PID control parameter recovery processing is executed. If the PID control parameter recovery instruction is to not execute recovery, then the current PID control parameters are maintained without processing. The set of PID control parameter differences includes proportional term differences, integral term differences, and derivative term differences; the reference set of PID control parameter differences includes proportional term reference differences, integral term reference differences, and derivative term reference differences.

[0078] The PID control parameter progressive recovery process is performed as follows: The PID recovery execution time is obtained and divided into three stages: the first stage is the start stage, the second stage is the intermediate stage, and the third stage is the end stage. Mapping is performed based on the proportional term difference, integral term difference, and derivative term difference to obtain the corresponding proportional term adjustment execution rate, integral term adjustment execution rate, and derivative term adjustment execution rate. These are jointly marked as the first recovery execution parameter set, and progressive recovery of the PID control parameters is performed accordingly. In the second stage, heat absorption or release is judged to obtain the heat absorption / release judgment result. If the heat absorption / release judgment result is qualified, the third stage of progressive recovery of the PID control parameters is performed according to the first recovery execution parameter set until the PID control parameters are restored to the preset values, thus completing the progressive recovery of the PID control parameters. Otherwise, an early warning is issued. The preset values ​​include the proportional term preset value, integral term preset value, and derivative term preset value. The PID control parameter linear recovery process is then performed. Specifically, the PID recovery execution time is obtained, and the PID control parameter values ​​are restored from the current values ​​to the preset values ​​based on the PID recovery execution time.

[0079] In this embodiment, as Figure 5 and Figure 6 As shown, Figure 5 This is a schematic diagram of the gradual recovery processing of PID control parameters in the temperature control system of a semiconductor cleaning equipment based on an adaptive PID algorithm, provided in an embodiment of the present invention. Figure 6 This is a schematic diagram of the linear recovery processing of PID control parameters in a temperature control system for semiconductor cleaning equipment based on an adaptive PID algorithm, provided in an embodiment of the present invention. The diagram shows the specific changing trends of the proportional, derivative, and integral terms in the PID over time, as well as their normalized values ​​at different time points. It should be noted that... Figure 5 and Figure 6 This diagram illustrates the recovery of PID parameters under different conditions; therefore, there is no temporal relationship between the two.

[0080] Based on the mapping processing of proportional term difference, integral term difference, and derivative term difference, the corresponding proportional term adjustment execution rate, integral term adjustment execution rate, and derivative term adjustment execution rate are obtained. Specifically, the method is as follows: Obtain a historical PID control parameter difference matching dataset, which includes several historical data entries. For any historical data entry, the historical proportional term difference, historical integral term difference, and historical derivative term difference have their corresponding historical proportional term adjustment execution rate, historical integral term adjustment execution rate, and historical derivative term adjustment execution rate. The current proportional term difference, integral term difference, and derivative term difference are then mapped to the historical proportional term difference, integral term difference, and derivative term difference in the historical PID control parameter difference matching dataset, respectively. The historical integral term difference and the historical differential term difference are matched one by one. The historical proportional term difference, the historical integral term difference, and the historical differential term difference that are closest to the current proportional term difference are selected and marked as historical reference proportional term difference, historical reference integral term difference, and historical reference differential term difference, respectively. The historical proportional term adjustment execution rate, historical integral term adjustment execution rate, and historical differential term adjustment execution rate corresponding to the historical reference proportional term difference, historical reference integral term difference, and historical reference differential term difference are obtained as the proportional term adjustment execution rate, integral term adjustment execution rate, and differential term adjustment execution rate, respectively.

[0081] The specific method for obtaining the heat absorption / extension determination result is as follows: if the adjustment is to increase the heating power, then perform the heat absorption determination and obtain the heat absorption determination result; if the adjustment is to decrease the heating power, then perform the heat release determination and obtain the heat release determination result; if the heat absorption determination result is heat absorption and / or the heat release determination result is heat release, then the heat absorption / extension determination result is unqualified; otherwise, the heat absorption / extension determination result is qualified.

[0082] It should be noted that the first stage (initial stage) is used to confirm the initial conditions for recovery and establish the initial mapping relationship between the PID control parameters and the temperature dynamic response. This stage uses the difference between the corrected mixing tank temperature and the target temperature, which is the second mixing temperature difference, as the input reference. By initially scaling the differences in the proportional, integral, and derivative terms, the first set of recovery execution parameters is obtained. The second stage (intermediate stage) updates the second mixing temperature difference in real time based on the current moment to reflect the instantaneous thermal response state during the temperature recovery process. The system recalculates the absolute value of the second mixing temperature difference in each sampling period for determining whether heat is absorbed or released. At this point, the second mixed temperature difference is no longer fixed at the initial value, but is continuously updated to ensure that the recovery of PID parameters is synchronized with the actual thermal behavior; the third stage (end stage): if the heat absorption and release judgment result of the second stage is qualified (i.e. the temperature change direction is consistent with the expectation), the system performs the PID control parameter progressive recovery processing of the third stage according to the first recovery execution parameter set established in the first stage; if the judgment result is unqualified, the third stage recovery operation is not executed, and a recovery abnormality warning signal is issued. Therefore, the PID parameter adjustment rate of the third stage is consistent with that of the first stage to ensure that the system smoothly returns to the preset value of PID control parameters under stable conditions.

[0083] The logical relationship between the three stages in time is as follows: the first stage is the recovery start-up preparation period, the second stage is the thermal response verification period, and the third stage is the recovery execution period. The second mixed temperature difference is used as the initial reference value to determine the recovery baseline in the first stage, dynamically updated and driving the thermal response determination in the second stage through continuous sampling, and the latest value at the time of determination is retained in the third stage without further updates, in order to maintain the stability of the parameter recovery process.

[0084] The PID control parameter recovery methods are divided into two types: gradual recovery and linear recovery. This is based on the different impacts of parameter deviation on the stability of the system's thermal response. When a certain difference in the PID control parameter difference set exceeds the corresponding reference difference, it indicates that the system still has a significant deviation after the temperature disturbance. If a direct linear correction is performed at this time, it is easy to cause a sudden change in the control quantity, resulting in secondary temperature fluctuations. Therefore, gradual recovery is adopted, and the PID parameters are gradually returned to their original values ​​through phased and rate-based adjustments, ensuring a smooth temperature recovery process. When all differences in the PID control parameter difference set are within the corresponding reference difference, it indicates that the system has entered the stable range and the temperature response is gentle. If gradual adjustment is continued, the recovery efficiency will be reduced. Therefore, linear recovery is adopted, and the system is quickly restored to the preset value at a fixed rate, thereby shortening the control parameter correction time and maintaining the timeliness of the system response.

[0085] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0086] The program code used to implement the methods of this disclosure may be written in any combination of one or more programming languages. This program code may be provided to a processor or controller of a general-purpose computer, special-purpose computer, or other programmable data processing apparatus, such that when executed by the processor or controller, the program code causes the functions / operations specified in the flowcharts and / or block diagrams to be implemented. The program code may be executed entirely on a machine, partially on a machine, as a standalone software package partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0087] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device for displaying information to the user (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the computer. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0088] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as a data server), or computing systems that include middleware components (e.g., an application server), or computing systems that include frontend components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., a communication network). Examples of communication networks include local area networks (LANs), wide area networks (WANs), and the Internet.

[0089] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0090] The above description is only an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A temperature control system for semiconductor cleaning equipment based on an adaptive PID algorithm, characterized in that, Includes the following modules: The liquid replenishment execution module is used to adjust the heating power through an adaptive PID algorithm after receiving the cleaning liquid replenishment signal from the semiconductor cleaning equipment, and to obtain the liquid supply execution parameters within a preset sampling period and analyze them to obtain the liquid replenishment thermal disturbance correction value. The heating power analysis module is used to obtain correction execution instructions based on the analysis of the liquid replenishment thermal disturbance correction value. If the correction execution instruction is a steady-state maintenance instruction, the correction adjustment will not be executed; otherwise, the correction adjustment will be executed. The correction execution instructions include heating power increase correction instructions, heating power decrease correction instructions, and steady-state maintenance instructions. The heating power increase correction module is used to perform heating power increase correction adjustment based on the liquid replenishment thermal disturbance correction value and the temperature change parameters within the preset repair period when the correction execution command is heating power increase correction; and simultaneously perform the first correction adjustment of PID control parameters. The heating power reduction correction module is used to adjust the heating power reduction based on the liquid replenishment thermal disturbance correction value when the correction execution command is heating power reduction correction, and simultaneously execute the second correction adjustment of PID control parameters; The specific method for obtaining the thermal disturbance correction value for liquid replenishment is as follows: The liquid supply execution parameters include the initial liquid replenishment temperature, the mixing tank temperature, the liquid replenishment flow rate, and the specific heat capacity of the liquid. Obtain the preset liquid replenishment disturbance correction coefficient and mixing response time constant; The temperature difference between the initial temperature of the replenishment solution and the temperature of the mixing tank is processed to obtain the temperature difference value of the replenishment solution. The temperature difference value of the replenishment solution is multiplied by the specific heat capacity of the drug solution and the replenishment flow rate to obtain the product coupling result. The product coupling result is multiplied by the replenishment disturbance correction coefficient to obtain the replenishment disturbance coupling correction result. The replenishment disturbance coupling correction result is ratioped with the mixing response time constant to obtain the replenishment thermal disturbance correction value. The replenishment thermal disturbance correction value is used to characterize the potential thermal disturbance intensity of the system caused by differences in temperature, flow rate and specific heat capacity after the replenishment enters the mixing tank. The specific method for obtaining the modified execution instruction is as follows: Obtain the preset theoretical permissible disturbance value and compare it with the absolute value of the liquid replenishment thermal disturbance correction value. If the absolute value of the liquid replenishment thermal disturbance correction value is less than or equal to the theoretical permissible disturbance value, the correction execution instruction is not to perform the correction adjustment. Otherwise, based on the analysis of the liquid replenishment thermal disturbance correction value, if the liquid replenishment thermal disturbance correction value is positive, the correction execution instruction is to reduce the heating power correction. If the liquid replenishment thermal disturbance correction value is negative, the correction execution instruction is to increase the heating power correction. The specific method for correcting and adjusting the increased heating power is as follows: The absolute value of the liquid replenishment thermal disturbance correction value is added to the preset output control value to obtain the corrected output control value. The corrected output control value is then used for matching and mapping to obtain the heating power correction execution value, thereby performing liquid replenishment and heating. The temperature values ​​at each moment during the recovery period of the replenishment and heating process are obtained and analyzed. If the temperature continues to rise during the recovery period and the temperature change rate at the beginning and end of the period is greater than or equal to the preset temperature change rate threshold, the heating power correction execution value is used to continue running until the replenishment temperature difference converges to less than or equal to the theoretical disturbance allowable value to complete the heating power increase correction adjustment. PID execution parameter correction processing is not performed. If the temperature continues to rise during the recovery period, and the rate of temperature change at the beginning and end of the period is less than the preset temperature change rate threshold, then the heating power will be increased twice and the liquid replenishment circulation flow rate will be reduced until the liquid replenishment temperature difference converges to less than or equal to the theoretical disturbance allowable value to complete the heating power increase correction adjustment, and the PID execution parameter dynamic response correction adjustment will be performed. If the temperature fluctuates repeatedly during the recovery period, exhaust treatment will be performed, and a second improvement judgment will be made after exhaust treatment. If the second improvement judgment result is qualified, the heating power will be recalibrated and adjusted until the liquid replenishment temperature difference converges to less than or equal to the theoretical disturbance allowable value to complete the heating power increase correction adjustment. Otherwise, an early warning reminder will be issued, and PID execution parameter output offset correction adjustment will be performed. The first correction adjustment of the PID control parameters includes dynamic response correction adjustment of the PID execution parameters and output offset correction adjustment of the PID execution parameters. The specific method is as follows: Obtain preset values ​​for PID control parameters, including preset values ​​for proportional, integral, and derivative terms; If the first correction adjustment of the PID control parameter is adjusted to the dynamic response correction adjustment of the PID execution parameter, then a comprehensive analysis is performed based on the correction value of the thermal disturbance of the replenishment liquid and the temperature change rate at the beginning and end of the recovery time to obtain the comprehensive difference ratio. The second constraint factor set is obtained by mapping based on the comprehensive difference ratio, and the PID control parameters are corrected based on the second constraint factor set. If the first correction adjustment of the PID control parameter is to adjust the output offset of the PID execution parameter, then obtain the heating power execution value after the heating power re-correction adjustment and mark it as the heating power re-correction value; The degree of difference between the corrected heating power value and the initial execution power is analyzed to obtain the degree of difference of the corrected power. The degree of difference of the corrected power value is then mapped to obtain the third constraint factor set. The PID control parameters are then corrected and adjusted based on the third constraint factor set, thus completing the first correction and adjustment of the PID control parameters. The specific method for adjusting the heating power reduction is as follows: The absolute value of the preset heating power and the liquid replenishment thermal disturbance correction value are subtracted to obtain the second execution value of the heating power reduction correction. The heating power reduction correction is then executed, and the exhaust process is executed simultaneously. After the exhaust process is completed, the stirring speed is adjusted. To adjust the stirring speed, the specific method is as follows: The initial stirring speed is obtained by mapping analysis based on the correction value of thermal disturbance caused by liquid replenishment. The current mixing tank temperature is obtained and the difference between it and the target temperature is processed to obtain the first mixing temperature difference. Then, a mapping analysis is performed to obtain the stirring speed adjustment step size. Within each preset cycle, the initial stirring speed is gradually increased and adjusted using the stirring speed adjustment step size as the increment, and the temperature value at each moment during the stirring speed increase adjustment process is obtained, thereby obtaining the temperature decrease value within each preset cycle; A preset temperature reduction threshold is obtained and compared with the temperature reduction value in each preset cycle. If the temperature reduction value in a certain cycle is greater than or equal to the temperature reduction threshold, the stirring is continuously performed according to the stirring execution speed of that cycle until the first mixing temperature difference converges to less than or equal to the theoretical disturbance allowable value, and that cycle is marked as the ideal execution cycle, thereby completing the heating power reduction correction process. The specific method for performing the second correction adjustment of the PID control parameters is as follows: Obtain the temperature difference between the end temperature of the ideal execution cycle and the target temperature, and mark it as the corrected execution temperature difference; Obtain the temperature difference at the beginning and end of the ideal execution cycle, and combine it with the analysis of the corrected execution temperature difference to obtain the temperature deviation risk index; The first scaling factor set is obtained by mapping based on the temperature deviation risk index. The second scaling factor set is obtained by mapping the correction value of the thermal disturbance of the replenishment solution. The first scaling factor set and the second scaling factor set are coupled together to obtain a comprehensive scaling factor set, and the second correction adjustment of the PID control parameters is performed based on the comprehensive scaling factor set.

2. The temperature control system for semiconductor cleaning equipment based on adaptive PID algorithm as described in claim 1, characterized in that, The specific method for performing the secondary heating power enhancement process and reducing the replenishment circulation flow rate is as follows: Based on the temperature change rate at the beginning and end of the recovery period and the difference analysis with the temperature change rate threshold, the temperature change difference value is obtained. The temperature change difference value is used to characterize the difference between the temperature improvement rate and the ideal temperature improvement rate during the recovery period. Based on the degree of temperature change difference, a mapping analysis was performed to obtain the secondary correction value of heating power and the correction value of liquid replenishment circulation flow rate. Obtain the current replenishment circulation flow rate and proportionally compare it with the maximum replenishment circulation flow rate to obtain the replenishment circulation flow rate constraint factor; The heating power is adjusted by coupling the secondary correction value and the heating power correction execution value to obtain the secondary increase processing execution value. The replenishment circulation flow rate is adjusted by linear scaling based on the replenishment circulation flow rate correction value and the replenishment circulation flow rate constraint factor to obtain the replenishment circulation flow rate execution value. Thus, the heating power increase correction adjustment is completed.

3. The temperature control system for semiconductor cleaning equipment based on adaptive PID algorithm as described in claim 1, characterized in that, The specific method for obtaining the secondary improvement judgment result is as follows: After the exhaust treatment is completed, the temperature fluctuation parameters are obtained within the second preset time period. The results of the second judgment on repeated temperature fluctuations are analyzed. If the second judgment result on repeated temperature fluctuations is that the temperature fluctuates repeatedly, the second improvement judgment result is that the improvement is unqualified; otherwise, the second improvement judgment result is that the improvement is qualified.

4. The temperature control system for semiconductor cleaning equipment based on adaptive PID algorithm as described in claim 1, characterized in that, It also includes a PID control parameter recovery processing module, used to obtain the corrected and adjusted replenishment temperature difference value, analyze it to obtain the PID control parameter recovery processing instruction, and if the PID control parameter recovery processing instruction is to be executed, then the PID control parameter recovery processing is executed; otherwise, it is not executed. The specific method is as follows: The corrected mixing tank temperature is obtained and its difference from the target temperature is processed to obtain the second mixing temperature difference. Based on the comparison between the absolute value of the second mixing temperature difference and the theoretical permissible disturbance value, a PID control parameter recovery processing instruction is obtained. If the absolute value of the mixing temperature difference is less than or equal to the theoretical permissible disturbance value, and the mixing temperature difference remains stable within the third preset time period, then the PID control parameter recovery processing instruction is executed; otherwise, the PID control parameter recovery processing instruction is not executed. If the PID control parameter recovery processing instruction is to perform recovery, then the current PID control parameters are obtained and the difference is processed with the preset value of the PID control parameters to obtain the PID control parameter difference set. Based on the PID control parameter difference set, it is compared with the corresponding PID control parameter difference benchmark set. If there is a difference in the PID control parameter difference set that is greater than or equal to the corresponding PID control parameter difference benchmark set, then the PID control parameter asymptotic recovery processing is performed; otherwise, the PID control parameter linear recovery processing is performed. If the PID control parameter recovery instruction is to not perform recovery, then the current PID control parameters will be maintained and not processed. The PID control parameter difference set includes proportional term difference, integral term difference, and derivative term difference; The PID control parameter difference benchmark set includes proportional term benchmark difference, integral term benchmark difference, and derivative term benchmark difference.

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