Method and device for monitoring temperature control process of phase change copper foil deposition equipment

Abstract

The invention provides a monitoring method and device for the temperature control process of phase change copper foil deposition equipment. The monitoring method comprises the steps that the electrolyte temperature, the copper foil surface temperature and the heat flux density penetrating through an inactivation product layer are obtained; identifying the temperature difference change between the electrolyte temperature and the copper foil surface temperature, and extracting the offset of the temperature difference ratio along with time; performing temperature interval matching on the time stamp of the transition time node and a phase change interval reference, determining a starting point of a buffer layer entering function of an inactivated product layer, and generating a dynamically adjusted temperature control target value; and predicting the change trend of the subsequent heat flux density according to the dynamically adjusted temperature control target value, generating a feedback signal, transmitting the feedback signal to deposition equipment control, and realizing real-time compensation on the product accumulation influence.

Description

Technical Field

[0001] This invention relates to the field of information technology, and in particular to a monitoring method and apparatus for the temperature control process of a phase change copper foil deposition equipment. Background Technology

[0002] In industrial production, temperature control in copper foil deposition equipment is crucial for ensuring product quality and production efficiency. This process directly affects the grain structure and performance of materials, playing a key role in the manufacturing of high-end electronic components. Precise temperature control is not only the foundation of process stability but also a core guarantee for avoiding production defects and improving product consistency. However, some existing temperature control methods often struggle to adapt to dynamically changing process conditions in complex production environments. Especially during deposition, the internal material state and heat transfer characteristics of the equipment change significantly over time, and traditional control methods often overlook the profound impact of these changes on temperature response, leading to insufficient accuracy in monitoring and adjustment, and consequently affecting process stability. Focusing on specific technical challenges, the impact of the deactivation product layer formed on the cathode surface during deposition on heat transfer becomes a core issue. The deactivation product layer refers to the byproduct layer that gradually accumulates on the cathode surface. It can both hinder heat transfer and, under certain conditions, alter the way heat is stored and distributed. The characteristics of this layered structure are not fixed; when it forms a porous structure and is wetted by liquid, the heat transfer mode changes from simple obstruction to a buffering effect. This dual nature significantly increases the difficulty of temperature control because it's impossible to accurately determine whether the deactivated product layer hinders heat transfer or stabilizes the temperature at a given moment, thus affecting control over critical temperature ranges. In a real-world production scenario, during copper foil deposition, the initial deactivated product layer may cause a slow temperature response on the cathode surface, making it difficult for operators to quickly perceive temperature changes. Conversely, when the layer structure changes, temperature fluctuations may be excessively smoothed out, masking actual process anomalies. This inconsistency makes it difficult to determine a baseline for temperature monitoring, rendering adjustments to process parameters unfounded. Therefore, dynamically identifying changes in the heat transfer characteristics of the deactivated product layer during deposition and adjusting temperature monitoring and control strategies accordingly becomes crucial for ensuring stable grain performance in copper foil production. Summary of the Invention

[0003] This invention provides a method for monitoring the temperature control process of a phase change copper foil deposition equipment, mainly including: The electrolyte temperature, copper foil surface temperature, and heat flux density through the deactivation product layer were obtained to form an initial dataset. Based on the initial temperature acquisition results, identify the temperature difference change between the electrolyte temperature and the copper foil surface temperature, and extract the offset of the temperature difference ratio over time. The temperature difference ratio is grouped according to the thermal resistance change characteristics based on the offset over time, distinguishing between the thermal resistance increase stage and the heat capacity increase stage, and identifying the time node when the deactivation product layer changes from hindering heat transfer to a buffer layer. Analyze the response hysteresis duration during the thermal resistance increase phase, identify the inflection point where the rate of change changes from increasing to decreasing, extract the corresponding transition time node timestamp, and switch the monitoring benchmark from electrolyte temperature to copper foil surface temperature. The transition time node timestamp is matched with the pre-set phase transition interval benchmark to determine the starting point for the deactivated product layer to enter the buffer layer function, and a dynamically adjusted temperature control target value is generated.

[0004] Furthermore, the acquisition of electrolyte temperature, copper foil surface temperature, and heat flux density through the deactivated product layer to form an initial dataset includes: A heat flux probe is installed in the middle of the deposition tank. The heat flux probe is vertically aligned with the cathode surface to collect heat flux data passing through the deactivated product layer and form heat flux density acquisition results. A temperature sensor is installed at the inlet of the electrolyte circulation pipeline to obtain the electrolyte temperature sequence; The surface temperature of the copper foil is scanned and measured to obtain the temperature sequence of the copper foil surface; An initial dataset was formed by combining the heat flux density acquisition results, electrolyte temperature sequence, and copper foil surface temperature sequence.

[0005] Furthermore, the step of identifying the temperature difference change between the electrolyte temperature and the copper foil surface temperature based on the initial dataset and extracting the offset of the temperature difference ratio over time includes: The electrolyte temperature sequence and the copper foil surface temperature sequence are extracted from the initial dataset. The difference between the two at each sampling time is calculated to form a temperature difference time series. The temperature difference series is smoothed by the moving average method to obtain a smooth temperature difference curve. Divide the temperature difference value at each moment in the smoothed temperature difference curve by the heat flux density acquisition result at the corresponding moment to obtain the temperature difference to heat flux density ratio sequence. Perform linear fitting on the ratio sequence using the least squares method to obtain the slope and intercept of the fitted line. A ratio baseline is constructed based on the slope and intercept values. The vertical distance between each point in the actual ratio sequence and the baseline is calculated as the deviation. If the deviation exceeds a preset threshold, it is marked as an offset point. The deviation values ​​of each offset point are accumulated in time sequence to obtain the offset of the temperature difference ratio over time.

[0006] Furthermore, the process of grouping the temperature difference ratio over time according to the characteristics of thermal resistance change, distinguishing between the thermal resistance increase stage and the heat capacity increase stage, and identifying the transition time point from the deactivation product layer hindering heat transfer to the buffer layer includes: The sequence of the temperature difference ratio offset over time is divided into segments with equal time intervals. The average growth rate of the offset within each segment is calculated. Based on the average growth rate of the offset within each segment, the thermal resistance increase stage and the heat capacity increase stage are distinguished to form a stage marking sequence. Identify the boundary position from the thermal resistance increase stage to the thermal capacity increase stage from the stage marker sequence, extract the offset data within each preset length interval before and after the boundary position, and determine the initial transition point; The preliminary transition point is verified by obtaining the standard deviation of heat flux density within the time window before and after the transition point, and extracting the second derivative of the temperature difference ratio for the corresponding time period. If the standard deviation after the transition point is less than that before the transition point and the second derivative changes from positive to negative, then the point is confirmed as the transition time node of the deactivation product layer from hindering heat transfer to becoming a buffer layer.

[0007] Furthermore, the analysis of the response hysteresis duration during the thermal resistance increase phase includes: extracting data for each sampling moment from the sequence of the temperature difference ratio during the thermal resistance increase phase and the offset over time, calculating the rate of change between adjacent moments, and when a preset number of rate values ​​show a decreasing trend, calculating the time interval from the starting point of the thermal resistance increase phase to the point where the rate begins to decrease, thereby obtaining the response hysteresis duration.

[0008] Furthermore, the identification of the inflection point where the rate of change changes from increasing to decreasing, the extraction of the corresponding transition time node timestamp, and the switching of the monitoring benchmark from electrolyte temperature to copper foil surface temperature include: The rate of change of the temperature difference ratio over time is differentially calculated. By comparing the magnitude of adjacent rate values, the inflection point where the rate value changes from increasing to decreasing is identified. The timestamp information corresponding to the inflection point is extracted. The validity of the inflection point is verified based on the response hysteresis duration, and the timestamp of the transition time node is determined. Using the transition time node timestamp as a switching trigger signal, at that moment the data source for temperature monitoring is switched from the electrolyte temperature sensor to the copper foil surface temperature sensor, establishing a new monitoring benchmark sequence based on the copper foil surface temperature.

[0009] Furthermore, the step of matching the transition time node timestamp with a pre-set phase transition interval reference to determine the starting point for the deactivated product layer to enter the buffer layer function, and generating a dynamically adjusted temperature control target value, includes: Obtain the copper foil surface temperature value at the time corresponding to the timestamp of the transition time node, compare the temperature value with the phase transition interval reference, and if the temperature value falls between the upper and lower limits of the phase transition interval, mark the time as the starting point for the deactivated product layer to enter the buffer layer function. The difference between the copper foil surface temperature at the starting point and the lower limit of the phase transition interval is calculated and then divided by the total width of the phase transition interval to obtain the temperature relative position coefficient. The original temperature control target value is multiplied by the temperature relative position coefficient and then an offset is added to generate the dynamically adjusted temperature control target value.

[0010] Furthermore, the method also includes: predicting the subsequent heat flux density change trend based on the dynamically adjusted temperature control target value, generating a feedback signal and transmitting it to the deposition equipment control to achieve real-time compensation for the impact on product accumulation.

[0011] Furthermore, the step of predicting the subsequent change trend of heat flux density based on the dynamically adjusted temperature control target value, generating a feedback signal and transmitting it to the deposition equipment control to achieve real-time compensation for the impact on product accumulation includes: Based on the dynamically adjusted temperature control target value and historical heat flux density data, the heat flux density prediction value at each moment in the future preset period is calculated using a time series prediction method to form a predicted heat flux density sequence. The actual heat flux density acquisition results at the corresponding time of the predicted heat flux density sequence are obtained, and the difference between the predicted value and the actual value is calculated point by point. The root mean square error is calculated as the deviation value for the difference sequence. If the deviation value is less than the preset stability threshold, the temperature conduction is determined to be in a stable state. If the deviation value is greater than the stability threshold, the temperature conduction is determined to be in an unstable state. A digital feedback signal containing specific adjustment parameters is generated based on the temperature conduction status, and the digital feedback signal is transmitted to the deposition equipment control module.

[0012] A monitoring device for the temperature control process of a phase change copper foil deposition equipment, the device comprising: The data acquisition module is used to obtain the electrolyte temperature, copper foil surface temperature, and heat flux density through the deactivation product layer to form an initial dataset; The temperature difference offset extraction module is used to identify the temperature difference change between the electrolyte temperature and the copper foil surface temperature based on the initial temperature acquisition results, and extract the offset of the temperature difference ratio over time. The thermal resistance change grouping and transition identification module is used to group the temperature difference ratio over time according to the thermal resistance change characteristics, distinguish the thermal resistance increase stage from the heat capacity increase stage, and identify the transition time node of the deactivation product layer from hindering heat transfer to becoming a buffer layer. The monitoring benchmark switching module is used to analyze the response hysteresis duration during the thermal resistance increase stage, identify the inflection point where the rate of change changes from increasing to decreasing, extract the corresponding transition time node timestamp, and switch the monitoring benchmark from electrolyte temperature to copper foil surface temperature. The temperature range matching and target value generation module is used to match the transition time node timestamp with the pre-set phase transition range benchmark to determine the starting point for the deactivated product layer to enter the buffer layer function, and generate a dynamically adjusted temperature control target value.

[0013] The technical solutions provided by the embodiments of the present invention may include the following beneficial effects: This invention discloses a monitoring method and device for temperature control in a phase change copper foil deposition equipment. During electrolytic copper foil deposition, the deactivated product layer gradually transforms from an initial heat transfer hindrance layer into a layered structure with thermal buffering capabilities, leading to dynamic changes in thermal resistance and thermal capacity. Traditional fixed temperature control is ill-suited to this transformation, easily causing intensified product accumulation and uncontrolled grain phase transition. This invention deploys heat flux probes and temperature sensing components in the deposition tank to collect real-time data on electrolyte temperature, copper foil surface temperature, heat flux density, and grain phase transition temperature range. It analyzes the shift in temperature difference ratio over time and the characteristics of changes in thermal resistance and thermal capacity, accurately identifying the functional transformation nodes and response hysteresis inflection points of the product layer. It dynamically switches monitoring benchmarks and adjusts the temperature control target value, combining this with heat flux density prediction deviation feedback to achieve closed-loop compensation for temperature conduction stability. This effectively suppresses the impact of product accumulation, optimizes the grain phase transition process, and improves copper foil deposition quality and production stability. Attached Figure Description

[0014] Figure 1 This is a flowchart of a monitoring method for the temperature control process of a phase change copper foil deposition equipment according to the present invention.

[0015] Figure 2 This is a schematic diagram of a monitoring method and device for temperature control process in a phase change copper foil deposition equipment according to the present invention. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0017] like Figures 1-2 This embodiment of a monitoring method and device for the temperature control process of a phase change copper foil deposition equipment may specifically include: Step S101: Obtain the electrolyte temperature, copper foil surface temperature, and heat flux density through the deactivated product layer to form an initial dataset.

[0018] A heat flux probe is installed in the middle of the deposition tank, vertically aligned with the cathode surface, to collect heat flux data passing through the deactivated product layer in real time. Simultaneously, a temperature sensor is placed at the inlet of the electrolyte circulation pipeline to obtain the electrolyte temperature value, forming initial temperature and heat flux density acquisition results. An infrared thermometer scans the copper foil surface to obtain temperature distribution data. The heat flux density acquisition results are compared and analyzed with the copper foil surface temperature. Specifically, the heat transfer efficiency is obtained by calculating the ratio of heat flux density q to the temperature difference ΔT, where q is the heat flux density and ΔT is the difference between the copper foil surface temperature and the electrolyte temperature. When a continuous decrease in heat transfer efficiency is detected, operators or the automatic control system can intervene in advance (e.g., adjusting current density, strengthening electrolyte flushing, adjusting additives) to proactively prevent the situation from deteriorating to the point of triggering a temperature alarm. When the copper foil surface temperature reaches the preset grain phase transition temperature threshold of 85 degrees Celsius, the upper and lower limits near this temperature are recorded to obtain the phase transition range benchmark.

[0019] In one embodiment, the heat flux probe employs a thin-film heat flux sensor with a sensing area of ​​10 square centimeters, installed in the center of the deposition tank. The heat flux probe is vertically aligned with the cathode surface, maintaining a 5-millimeter gap between the probe and the cathode surface, and obtains the heat flux density value by measuring the heat transfer rate per unit area. As heat in the electrolyte passes through the deactivated product layer to the copper foil surface, the heat flux probe can capture the dynamic changes of this heat transfer process in real time.

[0020] Specifically, a platinum resistance thermometer is used as the temperature sensor and is installed at the inlet of the electrolyte circulation pipeline, collecting electrolyte temperature data every 10 seconds. The initial temperature acquisition results include a temperature sequence over a continuous time period, forming a temperature-time curve.

[0021] It should be noted that the infrared thermometer uses a scanning temperature measurement method to scan the copper foil surface point by point, with a scanning resolution of 0.5 mm. When the local temperature on the copper foil surface exceeds the preset grain phase transition temperature threshold of 85 degrees Celsius, the upper and lower temperature limits of that area are automatically recorded. The phase transition interval reference is this temperature range, representing the critical temperature range in which the copper foil grain structure undergoes a transformation.

[0022] Step S102: Identify the temperature difference change between the electrolyte temperature and the copper foil surface temperature based on the initial dataset, and extract the offset of the temperature difference ratio over time.

[0023] The electrolyte temperature sequence and the copper foil surface temperature sequence are extracted from the initial temperature acquisition results. The difference between the two at each sampling time is calculated to form a temperature difference time series. The temperature difference series is smoothed using a moving average method, with the moving window containing a preset number of adjacent sampling points, resulting in a smoothed temperature difference curve. The temperature difference value at each time point in the smoothed temperature difference curve is divided by the heat flux density acquisition result at the corresponding time point to obtain a temperature difference to heat flux density ratio sequence. The ratio sequence is then linearly fitted using the least squares method to minimize the sum of squared errors, as shown in the formula: , Where k is the slope, b is the intercept, and x i For time, y i Let n be the ratio and n be the number of points. Obtain the slope and intercept values ​​of the fitted line. Construct a ratio baseline based on the slope and intercept values. The vertical distance between each point in the actual ratio sequence and the baseline is calculated as the deviation. If the deviation exceeds the preset threshold of 0.05, it is marked as an offset point. The threshold of 0.05 is set based on experimental experience, and the unit is dimensionless ratio deviation. The deviation values ​​of each offset point are accumulated in time sequence to obtain the offset of the temperature difference ratio over time.

[0024] In one implementation, the identification of temperature difference changes is based on continuously acquired temperature data sequences. Electrolyte temperature sequences and copper foil surface temperature sequences are extracted from the initial temperature acquisition results, each sequence containing temperature sampling points at equal time intervals. A temperature difference time series is obtained by subtracting these points one by one; this series reflects the temperature gradient changes during the process of heat transfer from the electrolyte to the copper foil surface.

[0025] Specifically, the moving average method uses a fixed window width to process the temperature difference sequence. The moving window contains five consecutive sampling points, and the arithmetic mean of the data points within the window is used to replace the original value at the center point. As the window slides along the time axis, the average value at each position forms a new smooth temperature difference curve, eliminating the interference of instantaneous fluctuations on subsequent analysis. The ratio of temperature difference to heat flux density has important physical significance; this ratio actually represents the thermal resistance characteristics of the deactivation product layer. During copper foil deposition, the thickness and structure of the deactivation product layer continuously change, leading to changes in its thermal resistance. By calculating the temperature difference at each moment and dividing it by the corresponding heat flux density value, the resulting ratio sequence can dynamically reflect the evolution of the thermal conductivity of the deactivation product layer. When the deactivation product layer changes from a dense state to a porous state, the ratio sequence shows a significant changing trend.

[0026] Preferably, the least squares method is used for linear fitting of the comparison value sequence. By minimizing the sum of squared vertical distances from the actual data points to the fitted line, the slope and intercept values ​​in the fitted line equation are obtained. The slope value characterizes the average rate of change of the ratio over time, while the intercept value represents the baseline ratio at the initial time.

[0027] In one embodiment, the offset calculation process involves a deviation accumulation mechanism. A ratio baseline is constructed based on the fitted linear equation. For each data point in the ratio sequence, its vertical distance from the baseline is calculated as the deviation at that point. When the deviation exceeds a preset threshold of 0.05, that moment is marked as the offset start point. Starting from the offset start point, the deviation values ​​at subsequent moments are accumulated sequentially over time, and the accumulated result is the offset of the temperature difference ratio over time. This offset can quantitatively characterize the degree to which the thermal conductivity of the deactivated product layer deviates from the normal state.

[0028] Step S103: The temperature difference ratio is grouped according to the thermal resistance change characteristics based on the offset over time, the thermal resistance increase stage and the heat capacity increase stage are distinguished, and the time node of the transition from the deactivation product layer to the buffer layer is identified.

[0029] The sequence of temperature difference ratio offset over time is segmented at equal time intervals, with each segment containing a preset number of continuous data points. The average growth rate of the offset within each segment is calculated. When the growth rate of multiple consecutive segments is positive and the rate of the later segment is greater than that of the earlier segment, these segments are marked as the thermal resistance increase stage. Otherwise, when the growth rate is positive but the rate difference between adjacent segments is less than 0.01, it is marked as the heat capacity increase stage, forming a stage marking sequence. The boundary position of the transition from the thermal resistance increase stage to the heat capacity increase stage is identified from the stage marking sequence. The offset data within each preset length interval before and after the boundary position are extracted, and linear fitting is performed to obtain two slope values. The slope difference is calculated. If the difference exceeds 0.05, the boundary position is determined as the preliminary transition point. The preliminary transition point is verified by obtaining the standard deviation of heat flux density within the time window before and after the transition point, and simultaneously extracting the second derivative of the temperature difference ratio for the corresponding time period. If the standard deviation after the transition point is less than that before the transition point and the second derivative changes from positive to negative, then this point is confirmed as the transition time node of the deactivation product layer from hindering heat transfer to a buffer layer.

[0030] In one implementation, the grouping processing of the temperature difference ratio offset over time is based on a time series segmentation method. The offset sequence is divided into equal-length segments at fixed time intervals, with each segment containing 10 consecutive sampling data points. By calculating the linear growth rate of the offset data within each segment, a rate time series is formed, which reflects the dynamic evolution of the thermal conductivity characteristics of the deactivated product layer. The thermal resistance increase stage and the heat capacity increase stage represent two different states of the deactivated product layer. In the thermal resistance increase stage, the deactivated product layer exhibits a dense structure, hindering heat transfer, resulting in a continuous and rapid increase in the temperature difference ratio offset over time. When a porous structure begins to form inside the deactivated product layer and it becomes wetted by the electrolyte, its heat capacity characteristics begin to appear. Although the offset is still increasing, the growth rate tends to stabilize. The stage marking sequence is determined by comparing the growth rate differences between adjacent time segments. When the rate difference of three consecutive time segments exceeds a preset threshold of 0.01, it is marked as the thermal resistance increase stage; when the rate difference is less than the threshold, it is marked as the heat capacity increase stage.

[0031] Specifically, a sliding window detection method is used to identify the transition boundary. Starting from the beginning of the stage marker sequence, the changes in marker values ​​are examined point by point. When a transition from the thermal resistance increase stage to the thermal capacity increase stage is detected, this position is recorded as a potential transition boundary. For each potential boundary, the offset values ​​of 20 data points before and after it are extracted, and linear fitting is performed on each. The slope of the fitting of the first segment reflects the offset growth characteristics during the thermal resistance-dominated period, while the slope of the second segment reflects the characteristics during the thermal capacity-dominated period.

[0032] Preferably, the verification process incorporates multiple criteria to improve the accuracy of transition time point identification. The standard deviation of heat flux density is calculated using a 30-second time window; the degree of improvement in heat conduction stability is determined by comparing the standard deviations before and after the transition point. The second derivative of the temperature difference ratio is calculated using the central difference method; its sign change reflects the change in the acceleration of the offset growth, with a change from positive to negative indicating a shift from acceleration to deceleration.

[0033] In one embodiment, when the copper foil deposition reached the 45th minute, the offset growth rate was detected to decrease from 0.08 to 0.03, while the standard deviation of the heat flux density decreased from 1.2 to 0.6, and the second derivative changed from 0.002 to -0.001. These characteristics together confirmed that this moment was the transition point of the deactivated product layer properties. The accurate identification of this point is of great guiding significance for the subsequent adjustment of temperature control parameters.

[0034] Step S104: Analyze the response hysteresis duration during the thermal resistance increase stage, identify the inflection point where the rate of change changes from increasing to decreasing, extract the corresponding transition time node timestamp, and switch the monitoring benchmark from electrolyte temperature to copper foil surface temperature.

[0035] Data for each sampling moment is extracted from the sequence of temperature difference ratio offset over time during the thermal resistance increase phase. The rate of change between adjacent moments is calculated. When a predetermined number of consecutive rate values ​​show a decreasing trend, the time interval from the starting point of the thermal resistance increase phase to the point where the rate begins to decrease is calculated, yielding the response hysteresis duration. This duration reflects the delayed response characteristics of the deactivation product layer to temperature changes. A differential operation is performed on the rate of change of the temperature difference ratio offset over time. By comparing the magnitudes of adjacent rate values, the inflection point where the rate value changes from increasing to decreasing is identified. The timestamp information corresponding to this inflection point is extracted. The validity of the inflection point is verified based on the response hysteresis duration; if the response hysteresis duration is within the range of 5 to 30 seconds, it is considered valid; otherwise, it is considered invalid. The transition time node timestamp is determined. Using the transition time node timestamp as a switching trigger signal, the temperature monitoring data source is switched from the electrolyte temperature sensor to the copper foil surface temperature sensor at this moment, establishing a new monitoring reference sequence based on the copper foil surface temperature, thus completing the monitoring reference conversion.

[0036] In one implementation, the response hysteresis duration analysis is based on the dynamic characteristics of the temperature difference ratio's shift over time. The response hysteresis duration reflects the delayed response of the deactivated product layer to temperature changes during the thermal resistance increase phase. By extracting the shift data at each sampling moment within the thermal resistance increase phase, the rate of change between adjacent moments is calculated, forming a rate time series. When more than five consecutive rate values ​​show a decreasing trend, the system records the time interval from the start of the phase to the point where the rate begins to decrease; this interval is the response hysteresis duration. The identification of the rate of change inflection point is achieved using a differential operation method. A first-order difference is performed on the rate of change sequence of the temperature difference ratio's shift over time to obtain the acceleration sequence of the rate change. By scanning this sequence point by point, when the difference value at a certain position changes from positive to negative, it indicates that the rate of change has reached its peak at that position and then begins to decrease. The moment corresponding to this inflection point is the critical time node where the system needs to adjust its monitoring strategy. During copper foil deposition, the appearance of this inflection point means that the thermal resistance effect of the deactivated product layer has reached saturation, and continuing to rely on the electrolyte temperature as the control reference will lead to increased control hysteresis.

[0037] Specifically, the switching process of the monitoring benchmark involves the dynamic adjustment of the sensor signal source. Before the transition time point, the temperature control system mainly relies on the signal from the electrolyte temperature sensor for adjustment, because in the initial stage of increased thermal resistance, the electrolyte temperature can better reflect the overall thermal field state. However, when the deactivation product layer accumulates to a certain extent, its thermal resistance effect is significantly enhanced, and the correlation between the electrolyte temperature and the actual temperature of the copper foil weakens. At this point, based on the identified transition time point timestamp, the data acquisition channel is automatically switched from the electrolyte temperature sensor to the copper foil surface temperature sensor, establishing a new monitoring benchmark sequence.

[0038] Preferably, the switching process adopts a gradual transition method. During the transition period of 30 seconds before and after the transition time node, the system simultaneously collects data from two sensors, and gradually adjusts the weighting coefficients by weighted averaging, transitioning from complete dependence on electrolyte temperature to complete dependence on copper foil surface temperature.

[0039] In one embodiment, when the response hysteresis duration exceeds 120 seconds and a clear inflection point in the rate of change occurs, the system determines that a baseline switch needs to be performed immediately. The temperature monitoring accuracy is improved by approximately 15% after the switch, effectively improving the real-time performance of temperature control.

[0040] Step S105: Match the transition time node timestamp with the pre-set phase transition interval reference temperature range to determine the starting point for the deactivated product layer to enter the buffer layer function, and generate a dynamically adjusted temperature control target value.

[0041] Obtain the copper foil surface temperature value at the time corresponding to the transition time node timestamp. Compare this temperature value with the phase transition interval reference. If the temperature value falls between the upper and lower limits of the phase transition interval, mark this time as the starting point for the deactivated product layer to enter the buffer layer function. Based on the copper foil surface temperature value at the starting point, calculate the difference between it and the lower limit of the phase transition interval, and then divide it by the total width of the phase transition interval to obtain the temperature relative position coefficient. Multiply the original temperature control target value by the temperature relative position coefficient and add an offset to generate the dynamically adjusted temperature control target value.

[0042] In one implementation, the matching process between the transition time node timestamp and the phase transition interval reference is achieved through temperature value comparison. The real-time temperature of the copper foil surface at the corresponding moment of the transition time node is obtained and compared with a pre-determined phase transition interval reference. The phase transition interval reference includes an upper and lower temperature limit for grain phase transition; when the real-time temperature falls within this interval, it indicates that the copper foil is in a critical stage of grain structure transformation. The calculation of the temperature relative position coefficient reflects the current temperature distribution within the phase transition interval. By calculating the difference between the real-time temperature and the lower limit of the interval, and then dividing by the total width of the interval, a dimensionless coefficient between 0 and 1 is obtained. The closer this coefficient is to 1, the closer the temperature is to the upper limit of the phase transition interval, and the more significant the buffering effect of the deactivation product layer.

[0043] Specifically, the dynamically adjusted temperature control target value is obtained through weighted calculation. The original temperature control target value is multiplied by the temperature relative position coefficient, and then an offset determined based on historical data is added to form the new control target. This dynamic adjustment mechanism enables temperature control to adapt to changes in the state of the deactivated product layer. After it enters the buffer layer function, the control parameters are automatically adjusted to avoid temperature overshoot or undershoot.

[0044] Step S106: Based on the dynamically adjusted temperature control target value, predict the subsequent trend of heat flux density change, generate a feedback signal and transmit it to the deposition equipment control to achieve real-time compensation for the impact on product accumulation.

[0045] Based on the dynamically adjusted temperature control target value and historical heat flux density data collected in real time by a heat flux sensor, the LSTM time series prediction method is used to calculate the predicted heat flux density values ​​at each moment within a preset future time period. The method takes a temperature target value sequence and a historical heat flux density sequence as inputs. After model training, it outputs continuous predicted values ​​to form a predicted heat flux density sequence, thus revealing the trend of heat flux density changes. The actual heat flux density data at the corresponding moments of the predicted heat flux density sequence are obtained, and the difference between the predicted and actual values ​​is calculated point by point. The root mean square error (RMSE) of the difference sequence is calculated as the deviation value. If the deviation value is less than a preset stability threshold of 0.5 watts per square meter (set empirically based on historical data), the temperature conduction is determined to be in a stable state. If the deviation value is greater than the stability threshold, the temperature conduction is determined to be in an unstable state. Based on the temperature conduction state, the upper and lower limits of the grain phase transition temperature are extracted from the phase transition interval benchmark. When the copper foil surface temperature is below the lower limit, a heating control command is generated; when the copper foil surface temperature is above the upper limit, a cooling control command is generated; and when the temperature is within the interval, a maintenance command is generated, forming a digital feedback signal containing specific adjustment parameters. The digital feedback signal is transmitted to the deposition equipment control module through the communication interface. The control module increases the heating power according to the heating command in the feedback signal, increases the cooling flow according to the cooling command, and maintains the current operating parameters according to the maintenance command, so as to realize real-time compensation for the heat conduction changes caused by the accumulation of deactivated products.

[0046] In one implementation, the process of predicting heat flux density based on dynamically adjusted temperature control target values ​​involves several key steps. The heat flux density prediction employs time series analysis, establishing temporal correlations between data points by collecting heat flux density data from historical periods. The prediction process first preprocesses the historical data, including outlier removal and missing value imputation, and then extracts the trend and periodic components of the data. Based on the characteristics of the copper foil deposition process, heat flux density changes typically exhibit a gradual trend and small fluctuations, making predictions based on historical data highly reliable. The formation of the predicted heat flux density sequence needs to consider the dynamic influence of the deactivation product layer. In the early stages of the deposition process, the deactivation product layer is thin, and the heat flux density is mainly driven by the electrolyte temperature and the temperature difference on the copper foil surface, making prediction relatively simple. As the deactivation product layer gradually thickens and undergoes structural transformation, changes in its thermal resistance and thermal capacity characteristics lead to a nonlinear trend in heat flux density. The prediction algorithm adapts to this change by introducing time-varying parameters, estimating the trend of heat flux density changes over the next 5 to 10 minutes based on the current temperature control target value and the measured heat flux density value from the previous period. Each prediction point contains a predicted value and a confidence interval, forming a complete prediction sequence.

[0047] Specifically, the calculation of the deviation value and the determination of temperature conduction stability are the core basis for control decisions. After obtaining the actual collected values ​​at the corresponding moments of the predicted heat flux density sequence, the difference between the two is calculated point by point. These differences are not simple arithmetic differences, but take into account the effects of measurement errors and system noise. By calculating the root mean square error of the difference sequence, a deviation value that comprehensively reflects the prediction accuracy is obtained. When the deviation value is less than the preset stability threshold, it indicates that the heat conduction process is in a stable state, the thermal characteristics of the deactivation product layer have not changed abruptly, and the current control parameters can maintain the stability of the temperature field. Conversely, when the deviation value exceeds the threshold, it means that the system may have experienced a disturbance, and the control parameters need to be adjusted in a timely manner.

[0048] Preferably, the determination of temperature conduction stability also incorporates the analysis of deviation value trends. It examines not only the magnitude of the deviation value at the current moment but also analyzes the direction of deviation value changes over multiple consecutive moments. If the deviation value continues to increase, even if it has not yet exceeded the threshold, the system will issue an early warning signal to prepare for adjusting the control parameters.

[0049] In one embodiment, the generation process of the feedback signal embodies the concept of hierarchical control. The upper and lower limits of the grain phase transition temperature extracted from the phase transition range benchmark constitute the control constraint boundaries. When the copper foil surface temperature approaches the lower limit, the system determines that heating is required, and the feedback signal contains a heating command and a specific incremental value of heating power. This incremental value is not fixed but is calculated based on the distance between the current temperature and the lower limit, the predicted trend of heat flux density, and the state of the deactivated product layer. Similarly, when the temperature approaches the upper limit, the incremental cooling flow rate in the cooling command is also dynamically determined. When the temperature is in the middle region of the phase transition range, the system issues a maintenance command to keep the current operating parameters unchanged. Furthermore, the format design of the digital feedback signal considers compatibility with the control module of the deposition equipment. The feedback signal adopts a standard data frame format, including fields such as timestamp, control command type, adjustment parameter value, and checksum. The timestamp ensures the real-time nature of the control, the control command type field clearly indicates whether it is a heating, cooling, or maintenance operation, the adjustment parameter value field contains specific power or flow rate adjustment values, and the checksum is used to verify the integrity of data transmission.

[0050] For example, the execution process of the control module after receiving the feedback signal has a clear priority mechanism. The heating command is implemented by adjusting the power of the electric heater; the control module adjusts the conduction angle of the thyristor based on the power increment value in the feedback signal, thereby changing the heating power. The cooling command is implemented by increasing the cooling water flow rate; the control module adjusts the opening of the electric valve to increase the cooling water circulation rate. This direct execution method ensures a rapid response in temperature adjustment.

[0051] Understandably, the core of the real-time compensation mechanism lies in eliminating the adverse effects of deactivation product accumulation on temperature control. As the deactivation product layer accumulates, it continuously alters the system's thermal conductivity; without compensation, temperature control will gradually become inaccurate. By continuously monitoring the predicted deviation of heat flux density and adjusting control parameters in a timely manner, it is possible to adapt to changes in the deactivation product layer and maintain the stability of the copper foil grain structure.

[0052] For example, in actual copper foil deposition production, when the process reaches 60 minutes, the thickness of the deactivated product layer reaches 0.5 mm, and the thermal resistance increases significantly. At this point, the deviation between the predicted heat flux density and the actual value begins to increase, and the system determines that temperature conduction has entered an unstable state. Based on the condition that the copper foil surface temperature is 2 degrees Celsius below the lower limit of the phase transition range, the feedback signal includes a heating command, requesting a 15% increase in heating power. After the control module executes this command, the copper foil surface temperature rises back to within the phase transition range within 3 minutes, effectively compensating for the impact of deactivated product accumulation.

[0053] This invention provides a monitoring device for the temperature control process of a phase change copper foil deposition equipment, mainly comprising: The data acquisition module is used to obtain the electrolyte temperature, copper foil surface temperature, and heat flux density through the deactivation product layer to form an initial dataset; The temperature difference offset extraction module is used to identify the temperature difference change between the electrolyte temperature and the copper foil surface temperature based on the initial dataset, and to extract the offset of the temperature difference ratio over time. The thermal resistance change grouping and transition identification module is used to group the temperature difference ratio over time according to the thermal resistance change characteristics, distinguish the thermal resistance increase stage from the heat capacity increase stage, and identify the transition time node of the deactivation product layer from hindering heat transfer to becoming a buffer layer. The monitoring benchmark switching module is used to analyze the response hysteresis duration during the thermal resistance increase stage, identify the inflection point where the rate of change changes from increasing to decreasing, extract the corresponding transition time node timestamp, and switch the monitoring benchmark from electrolyte temperature to copper foil surface temperature. The temperature range matching and target value generation module is used to match the transition time node timestamp with the pre-set phase transition range benchmark to determine the starting point for the deactivated product layer to enter the buffer layer function and generate a dynamically adjusted temperature control target value. The heat flux prediction and feedback control module is used to predict the subsequent heat flux density change trend based on the dynamically adjusted temperature control target value, generate a feedback signal and transmit it to the deposition equipment control to achieve real-time compensation for the impact on product accumulation.

[0054] The above-disclosed embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of the invention. Those skilled in the art will understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present invention are still within the scope of the invention.

Claims

1. A method for monitoring the temperature control process of a phase change copper foil deposition equipment, characterized in that, include: The electrolyte temperature, copper foil surface temperature, and heat flux density through the deactivation product layer were obtained to form an initial dataset. Based on the initial dataset, identify the temperature difference between the electrolyte temperature and the copper foil surface temperature, and extract the offset of the temperature difference ratio over time. The temperature difference ratio is grouped according to the thermal resistance change characteristics based on the offset over time, distinguishing between the thermal resistance increase stage and the heat capacity increase stage, and identifying the time node when the deactivation product layer changes from hindering heat transfer to a buffer layer. Analyze the response hysteresis duration during the thermal resistance increase phase, identify the inflection point where the rate of change changes from increasing to decreasing, extract the corresponding transition time node timestamp, and switch the monitoring benchmark from electrolyte temperature to copper foil surface temperature. The transition time node timestamp is matched with the pre-set phase transition interval benchmark to determine the starting point for the deactivated product layer to enter the buffer layer function, and a dynamically adjusted temperature control target value is generated.

2. The monitoring method for the temperature control process of the phase change copper foil deposition equipment as described in claim 1, characterized in that, The acquisition of electrolyte temperature, copper foil surface temperature, and heat flux density through the deactivated product layer forms an initial dataset, including: A heat flux probe is installed in the middle of the deposition tank. The heat flux probe is vertically aligned with the cathode surface to collect heat flux data passing through the deactivated product layer and form heat flux density acquisition results. A temperature sensor is installed at the inlet of the electrolyte circulation pipeline to obtain the electrolyte temperature sequence; The surface temperature of the copper foil is scanned and measured to obtain the temperature sequence of the copper foil surface; An initial dataset was formed by combining the heat flux density acquisition results, electrolyte temperature sequence, and copper foil surface temperature sequence.

3. The monitoring method for the temperature control process of the phase change copper foil deposition equipment as described in claim 1, characterized in that, The step of identifying the temperature difference change between the electrolyte temperature and the copper foil surface temperature based on the initial dataset, and extracting the shift of the temperature difference ratio over time, includes: The electrolyte temperature sequence and the copper foil surface temperature sequence are extracted from the initial dataset. The difference between the two at each sampling time is calculated to form a temperature difference time series. The temperature difference series is smoothed by the moving average method to obtain a smooth temperature difference curve. Divide the temperature difference value at each moment in the smoothed temperature difference curve by the heat flux density acquisition result at the corresponding moment to obtain the temperature difference to heat flux density ratio sequence. Perform linear fitting on the ratio sequence using the least squares method to obtain the slope and intercept of the fitted line. A ratio baseline is constructed based on the slope and intercept values. The vertical distance between each point in the actual ratio sequence and the baseline is calculated as the deviation. If the deviation exceeds a preset threshold, it is marked as an offset point. The deviation values ​​of each offset point are accumulated in time sequence to obtain the offset of the temperature difference ratio over time.

4. The monitoring method for the temperature control process of the phase change copper foil deposition equipment as described in claim 1, characterized in that, The process of grouping the temperature difference ratio over time according to the characteristics of thermal resistance change, distinguishing between the stage of increasing thermal resistance and the stage of increasing heat capacity, and identifying the transition time point from the deactivation product layer that hinders heat transfer to the buffer layer includes: The sequence of temperature difference ratio offset over time is divided into segments with equal time intervals. The average growth rate of the offset within each segment is calculated. Based on the average growth rate of the offset within each segment, the thermal resistance increase stage and the heat capacity increase stage are distinguished, forming a stage marker sequence. Identify the boundary position from the thermal resistance increase stage to the thermal capacity increase stage from the stage marker sequence, extract the offset data within each preset length interval before and after the boundary position, and determine the initial transition point; The preliminary transition point is verified by obtaining the standard deviation of heat flux density within the time window before and after the transition point, and extracting the second derivative of the temperature difference ratio for the corresponding time period. If the standard deviation after the transition point is less than that before the transition point and the second derivative changes from positive to negative, then the point is confirmed as the transition time node of the deactivation product layer from hindering heat transfer to becoming a buffer layer.

5. The monitoring method for the temperature control process of the phase change copper foil deposition equipment as described in claim 4, characterized in that, The analysis of the response hysteresis duration during the thermal resistance increase phase includes: extracting data for each sampling moment from the sequence of the temperature difference ratio during the thermal resistance increase phase and the offset over time; calculating the rate of change between adjacent moments; and when a preset number of rate values ​​show a decreasing trend, calculating the time interval from the starting point of the thermal resistance increase phase to the point where the rate begins to decrease, thereby obtaining the response hysteresis duration.

6. The monitoring method for the temperature control process of the phase change copper foil deposition equipment as described in claim 5, characterized in that, The identification of the inflection point where the rate of change changes from increasing to decreasing, the extraction of the corresponding transition time node timestamp, and the switching of the monitoring benchmark from electrolyte temperature to copper foil surface temperature include: The rate of change of the temperature difference ratio over time is differentially calculated. By comparing the magnitude of adjacent rate values, the inflection point where the rate value changes from increasing to decreasing is identified. The timestamp information corresponding to the inflection point is extracted. The validity of the inflection point is verified based on the response hysteresis duration, and the timestamp of the transition time node is determined. Using the transition time node timestamp as a switching trigger signal, at that moment the data source for temperature monitoring is switched from the electrolyte temperature sensor to the copper foil surface temperature sensor, establishing a new monitoring benchmark sequence based on the copper foil surface temperature.

7. The monitoring method for the temperature control process of the phase change copper foil deposition equipment as described in claim 1, characterized in that, The step of matching the transition time node timestamp with a pre-set phase transition interval reference to determine the starting point for the deactivated product layer to enter the buffer layer function, and generating a dynamically adjusted temperature control target value, includes: Obtain the copper foil surface temperature value at the time corresponding to the timestamp of the transition time node, compare the temperature value with the phase transition interval reference, and if the temperature value falls between the upper and lower limits of the phase transition interval, mark the time as the starting point for the deactivated product layer to enter the buffer layer function. The difference between the copper foil surface temperature at the starting point and the lower limit of the phase transition interval is calculated and then divided by the total width of the phase transition interval to obtain the temperature relative position coefficient. The original temperature control target value is multiplied by the temperature relative position coefficient and then an offset is added to generate the dynamically adjusted temperature control target value.

8. The monitoring method for the temperature control process of the phase change copper foil deposition equipment as described in claim 1, characterized in that, The method further includes: predicting the subsequent heat flux density change trend based on the dynamically adjusted temperature control target value, generating a feedback signal and transmitting it to the deposition equipment control to achieve real-time compensation for the impact on product accumulation.

9. The monitoring method for the temperature control process of the phase change copper foil deposition equipment as described in claim 8, characterized in that, The step of predicting the subsequent change trend of heat flux density based on the dynamically adjusted temperature control target value, generating a feedback signal and transmitting it to the deposition equipment control to achieve real-time compensation for the impact on product accumulation includes: Based on the dynamically adjusted temperature control target value and historical heat flux density data, the heat flux density prediction value at each moment in the future preset period is calculated using a time series prediction method to form a predicted heat flux density sequence. The actual heat flux density acquisition results at the corresponding time of the predicted heat flux density sequence are obtained, and the difference between the predicted value and the actual value is calculated point by point. The root mean square error is calculated as the deviation value for the difference sequence. If the deviation value is less than the preset stability threshold, the temperature conduction is determined to be in a stable state. If the deviation value is greater than the stability threshold, the temperature conduction is determined to be in an unstable state. A digital feedback signal containing specific adjustment parameters is generated based on the temperature conduction status, and the digital feedback signal is transmitted to the deposition equipment control module.

10. A monitoring device for the temperature control process of a phase change copper foil deposition equipment, characterized in that, The device includes: The data acquisition module is used to obtain the electrolyte temperature, copper foil surface temperature, and heat flux density through the deactivation product layer to form an initial dataset; The temperature difference offset extraction module is used to identify the temperature difference change between the electrolyte temperature and the copper foil surface temperature based on the initial temperature acquisition results, and extract the offset of the temperature difference ratio over time. The thermal resistance change grouping and transition identification module is used to group the temperature difference ratio over time according to the thermal resistance change characteristics, distinguish the thermal resistance increase stage from the heat capacity increase stage, and identify the transition time node of the deactivation product layer from hindering heat transfer to becoming a buffer layer. The monitoring benchmark switching module is used to analyze the response hysteresis duration during the thermal resistance increase stage, identify the inflection point where the rate of change changes from increasing to decreasing, extract the corresponding transition time node timestamp, and switch the monitoring benchmark from electrolyte temperature to copper foil surface temperature. The temperature range matching and target value generation module is used to match the transition time node timestamp with the pre-set phase transition range benchmark to determine the starting point for the deactivated product layer to enter the buffer layer function, and generate a dynamically adjusted temperature control target value.

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