Parallel parallel micro-channel back plate type heat exchanger capable of efficiently exchanging heat

Abstract

The invention discloses a parallel-connection parallel micro-channel back plate type heat exchanger capable of efficiently exchanging heat. Comprising a cooling back plate, parallel micro channels, a matrix pin fin array and an embedded groove, a heat dissipation structure is arranged on one side of the cooling back plate, and a plurality of embedded grooves which are arranged in parallel are formed in the other side of the cooling back plate; the parallel micro channel comprises a heat exchanger inlet pipeline, a heat exchanger outlet pipeline and a plurality of pipelines which are connected in parallel and are arranged in parallel; all the pipelines are vertically arranged between the heat exchanger inlet pipeline and the heat exchanger outlet pipeline, one end is communicated with the heat exchanger inlet pipeline, and the other end is communicated with the heat exchanger outlet pipeline; the pipelines correspond to the embedding grooves in a one-to-one mode, one sides of the pipelines are embedded in the corresponding embedding grooves, the side walls of the pipelines are connected with the groove walls through the friction welding technology, and the other sides of the pipelines are provided with planes formed through machining. The invention has the advantages of simple structure, small volume, light weight, high heat dissipation efficiency, low manufacturing cost and stable and reliable long-time operation, and is easy to manufacture and maintain.

Description

Technical Field

[0001] This invention relates to the field of heat exchanger technology, and specifically to a parallel microchannel backplate heat exchanger with high-efficiency heat exchange. Background Technology

[0002] With the rapid development of the digital economy, the demand for artificial intelligence and high-performance computing is driving a continuous increase in the power density of single racks in computing centers. Currently, the power of a single rack in some ultra-large computing centers has reached 20kW, far exceeding the heat dissipation limit of 1-2kW for traditional air-cooling technology. The cooling energy consumption of traditional air-cooling systems exceeds 40% of the total energy consumption of data centers, and they also suffer from problems such as large footprint, complex system maintenance, high noise, and dust accumulation during long-term operation. They can no longer meet the construction requirements of high-density, low-energy-consumption green computing centers.

[0003] Therefore, liquid cooling technology has become a fundamental solution for environmental protection and energy conservation. Cold plate liquid cooling, employing an indirect heat exchange mode—where the coolant circulates only within a closed cold plate pipe system without contacting the chip or motherboard—offers advantages such as strong hardware compatibility, convenient maintenance, and flexible modification. It has become the mainstream choice for transitioning from traditional air-cooling systems to green liquid cooling solutions in high-density computing scenarios, with over 50,000 commercially deployed nodes and broad application prospects. As a core component of liquid cooling technology, the performance of the cold plate heat exchanger directly determines heat dissipation efficiency and system benefits. Parallel microchannel cooling backplanes, due to their small channel feature size and high surface area / volume ratio, have become a key technical solution for adapting to high power density chips.

[0004] Currently, cold plate heat exchangers mainly include traditional embedded pipe cold plates and microfinned cold plates. Both microfinned cold plates and parallel microchannel cooling back plates are superior to traditional structures, but parallel microchannel cooling back plates have greater advantages in terms of efficiency and energy consumption balance. A detailed comparison is as follows:

[0005] The core drawback of traditional embedded pipe cooling plates is that their flow field depends on pipe bends, and local resistance makes it difficult to balance pressure drop and heat exchange efficiency. This results in high pump consumption, PUE that is difficult to meet construction requirements, and inability to adapt to high-power scenarios.

[0006] Microfinned cold plates enhance heat transfer through high-density fins, further reducing thermal resistance. However, they have significant drawbacks. Due to the small gaps between the microfins, the pressure drop increases, and this pressure drop increases quadratically with the flow rate, requiring a higher-power circulating pump and resulting in higher system energy consumption. Furthermore, the manufacturing process of microfinned cold plates is complex, leading to higher assembly and maintenance costs. Summary of the Invention

[0007] To address the problems existing in the background technology, this invention proposes a parallel microchannel backplate heat exchanger with low flow resistance, easy integration, and high-efficiency heat exchange characteristics, which can be applied to high-power, small-space scenarios such as chip heat dissipation, data center cooling, and battery thermal management.

[0008] The technical solution adopted in this invention is:

[0009] I. A parallel microchannel backplate heat exchanger for high-efficiency heat exchange

[0010] The backplate heat exchanger includes a cooling backplate, parallel microchannels, a heat dissipation structure, and embedded slots; a heat dissipation structure is arranged on one side surface of the cooling backplate, and an embedded slot array consisting of several parallel embedded slots is opened on the other side surface, with parallel microchannels installed in the embedded slot array.

[0011] The parallel microchannels include a heat exchanger inlet pipe, a heat exchanger outlet pipe, and several parallel pipes arranged in parallel with each other; all pipes are arranged vertically between the heat exchanger inlet pipe and the heat exchanger outlet pipe, with one end connected to the heat exchanger inlet pipe and the other end connected to the heat exchanger outlet pipe.

[0012] The pipes correspond one-to-one with the embedded grooves. One side of the pipe is embedded in the corresponding embedded groove, and the side wall is connected to the groove wall by friction welding. The other side is provided with a flat surface formed by machining.

[0013] The cooling backplate is made of aluminum or copper.

[0014] The heat dissipation structure is a matrix-type needle-fin array or a shovel-shaped heat dissipation structure.

[0015] The matrix-type needle-wing array is composed of several needle-wing structures arranged along a matrix. The shape of the needle-wing structure is a cube, cylinder, cuboid, teardrop, mountain-shaped, or leaf-shaped, etc.

[0016] The shovel-shaped heat dissipation structure is composed of multiple parallel thin plates arranged at intervals along the length of the cooling back plate. Each thin plate extends out from the surface of the cooling back plate, and its extension direction is perpendicular to the pipe direction of the parallel microchannels.

[0017] The backplate heat exchanger is arranged as a contact radiator, the matrix-type pin fin array faces the heat dissipation air duct, the plane is attached to the heat source surface and contacts the heat source surface through the heat-conducting layer, and the heat exchanger inlet pipe and heat exchanger outlet pipe are respectively connected to the external coolant supply source and return port.

[0018] The backplate heat exchanger is an array-type condenser. At least two parallel backplate heat exchangers are stacked to form a heat exchanger array. The cooling backplates of each backplate heat exchanger are arranged horizontally, and the heat dissipation structure is arranged facing the air inlet side. The heat exchanger inlet pipe is connected to the gaseous working fluid source, and the heat exchanger outlet pipe is connected to the liquid working fluid return port.

[0019] II. A chip heat dissipation system suitable for high-density data center racks

[0020] The chip heat dissipation system includes:

[0021] The centralized cooling unit has an internal coolant circulation loop and is equipped with a coolant output main pipe and a coolant return main pipe;

[0022] Multiple backplate heat exchangers, each in the form of a flat plate, are suitable for dense installation in confined spaces.

[0023] In a single cabinet, a backplate heat exchanger is attached to the surface of the package shell of each chip. The plane of the backplate heat exchanger is in close contact with the surface of the package shell of the corresponding chip through a thermally conductive layer. The heat dissipation structure is a matrix pin fin array, which is arranged towards the heat dissipation air duct of the cabinet.

[0024] All the heat exchanger inlet pipes of the backplate heat exchangers are connected in parallel to the coolant outlet main pipe, and all the heat exchanger outlet pipes of the backplate heat exchangers are connected in parallel to the coolant return main pipe, forming a parallel coolant distribution network.

[0025] A circulation pump is installed in the coolant circulation loop to drive the flow of coolant;

[0026] The backplate heat exchanger is used as a contact cold plate to transfer the heat generated by each chip to the coolant, and the heat is finally discharged to the unified heat dissipation system of the data center through the centralized cooling unit.

[0027] III. A condensation system for an air conditioner outdoor unit

[0028] The condensation system includes:

[0029] The compressor, whose exhaust port is used to discharge high-temperature, high-pressure gaseous refrigerant;

[0030] A throttling device is used to reduce the pressure of liquid refrigerant from the condenser;

[0031] An evaporator is where the refrigerant, after being throttled and depressurized, absorbs heat and evaporates to achieve refrigeration.

[0032] Axial flow fans are used to drive outside air to flow through the heat dissipation duct inside the air conditioner's outdoor unit;

[0033] A backplate heat exchanger array is used as the condenser and arranged in the heat dissipation duct; the backplate heat exchanger array is composed of at least two parallel backplate heat exchangers arranged side by side in the horizontal direction.

[0034] Each backplate heat exchanger is placed horizontally, with the plane of the cooling backplate parallel to the ground and its pipes parallel to the horizontal direction; the heat dissipation structure is a shovel-shaped heat dissipation structure, which is arranged towards the air inlet direction of the axial flow fan to optimize the airflow and increase the convective heat transfer area.

[0035] The inlet pipes of all backplate heat exchangers are connected in parallel and then connected to the exhaust port of the compressor to receive the high-temperature and high-pressure gaseous refrigerant; the outlet pipes of all heat exchangers are connected in parallel and then connected to the evaporator in sequence through the dryer filter and the throttling device.

[0036] During operation, the high-temperature and high-pressure gaseous refrigerant flows in the pipes of the backplate heat exchanger array and condenses into a liquid state through forced convection heat exchange with the air flowing through its heat dissipation structure, thereby achieving heat dissipation.

[0037] The beneficial effects of this invention are:

[0038] 1. This invention, through the parallel flow channel design of parallel microchannels, can significantly reduce the pressure drop of liquid flowing over long distances in micro-scale pipes, thereby reducing pump drive power and system energy consumption, and achieving efficient heat dissipation in a large-area flat structure.

[0039] 2. This invention achieves large-area uniform temperature by tightly connecting parallel microchannels with the matrix-type needle fin array on the top of the cooling backplate, avoiding the problem of temperature rise along the flow path of traditional serpentine channels. At the same time, it significantly improves the surface area / volume ratio for effective heat dissipation, greatly improving the convective heat transfer coefficient and heat transfer efficiency.

[0040] 3. The present invention flattens the bottom of the parallel microchannels, making the heat source fit closer to the parallel channels and effectively reducing the contact thermal resistance. In addition, the parallel microchannels and the cooling back plate are tightly fitted by friction welding, and the microchannels and the back plate are in close contact. No additional interface material is required, so there is no problem with additional thermal resistance and long-term operational reliability. It can ensure that the overall thermal resistance of the heat exchanger is low and the heat transfer efficiency is high.

[0041] In summary, the present invention has the advantages of simple structure, small size, light weight, high heat dissipation efficiency, easy manufacturing, low manufacturing cost, easy maintenance, and stable and reliable long-term operation. Attached Figure Description

[0042] Figure 1 A schematic diagram of the parallel microchannel backplate heat exchanger provided by the present invention;

[0043] Figure 2 An exploded schematic diagram of the parallel microchannel backplate heat exchanger provided by the present invention.

[0044] Figure 3 This is a schematic diagram of the parallel parallel microchannel structure in the parallel microchannel backplate heat exchanger provided by the present invention.

[0045] Figure 4 This is a schematic diagram of the matrix needle-fin array in the parallel microchannel backplate heat exchanger provided by the present invention.

[0046] Figure 5 This is a schematic diagram of the shovel-shaped heat dissipation structure in the parallel microchannel backplate heat exchanger provided by the present invention.

[0047] In the diagram, 1 is the cooling backplate, 2 is the parallel microchannels, 3 is the heat exchanger inlet pipe, 4 is the heat exchanger outlet pipe, 5 is the matrix-type pin fin array, 6 is the embedded slot, 7 is the plane, and 8 is the shovel-shaped heat dissipation structure. Detailed Implementation

[0048] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0049] This invention provides a parallel microchannel backplate heat exchanger with high heat exchange efficiency. For example... Figure 1 As shown, the backplate heat exchanger of the present invention includes a cooling backplate 1, parallel microchannels 2, a matrix needle-fin array 5, and an embedded groove 6.

[0050] like Figure 2 As shown, a heat dissipation structure is arranged on one side surface of the cooling backplate 1, and an array of embedded slots consisting of several parallel embedded slots 6 is opened on the other side surface. Parallel microchannels 2 are installed in the embedded slot array.

[0051] like Figure 3 As shown, the parallel microchannel 2 includes a heat exchanger inlet pipe 3, a heat exchanger outlet pipe 4, and several parallel pipes arranged in parallel with each other; all pipes are arranged vertically between the heat exchanger inlet pipe 3 and the heat exchanger outlet pipe 4, with one end connected to the heat exchanger inlet pipe 3 and the other end connected to the heat exchanger outlet pipe 4; the number of pipes and the embedded grooves 6 are the same and correspond one-to-one, one side of the pipe is embedded in the corresponding embedded groove 6, and the side wall of the pipe is connected to the groove wall of the corresponding embedded groove 6 by friction welding process, and the other side of the pipe is provided with a plane 7 formed by machining.

[0052] The pipes in the parallel microchannel 2 are all microchannels, which are pipes with an inner diameter of less than or equal to 6 mm.

[0053] In practice, machining includes milling, grinding, and cutting, with cutting being the preferred method.

[0054] Preferably, the process of connecting the pipe and the embedded groove 6 by friction welding includes:

[0055] Pretreatment: Clean the sidewalls of each pipe of the parallel microchannel 2 and the inner wall of the embedding groove 6 to remove oxide layer, oil and impurities, and ensure that each pipe maintains a circular cross-section and that the surface to be welded after embedding is in close contact with the inner wall of the embedding groove 6.

[0056] Positioning and clamping: Fix the cooling back plate 1, and embed each pipe of the parallel micro-channel 2 into the embedding groove 6 one by one and position it. Clamp the cooling back plate 1 and each pipe with the clamp to ensure that the welding surface is stably attached and the pipe cross-section remains circular.

[0057] Frictional heating: Start the main shaft of the equipment to drive the pipe to rotate around its own axis at a frictional speed of 800~1200 r / min, apply a frictional pressure of 5~8 MPa to the pipe, so that the surface to be welded generates frictional heat to the corresponding plastic temperature range of copper and aluminum, maintain the friction time for 3~5s until a uniform plastic deformation layer is formed on the surface to be welded, and control the deformation amount to 0.2~0.5 mm.

[0058] Upsetting bonding: After stopping the spindle rotation, immediately increase the pressure to an upsetting pressure of 12~16 MPa and maintain the pressure for 2~4 s to form a dense metallurgical bonding layer with a thickness of greater than or equal to 5 μm on the surface to be welded.

[0059] Post-processing: After depressurization and cooling, remove the tooling, turn the side of the parallel microchannel 2 that is not embedded in the embedding groove 6 to form a plane 7, and trim the joint.

[0060] Preferably, the cooling backplate 1 is made of aluminum or copper.

[0061] Preferably, the heat dissipation structure is a matrix-type needle-fin array 5 or a shovel-shaped heat dissipation structure 8.

[0062] Preferably, such as Figure 4 As shown, the matrix needle-wing array 5 is composed of several needle-wing structures arranged along a matrix. The shapes of the needle-wing structures are cubes, cylinders, cuboids, teardrop shapes, mountain shapes, or leaf shapes, etc.

[0063] Preferably, such as Figure 5 As shown, the shovel-shaped heat dissipation structure 8 is composed of multiple parallel thin plates arranged at intervals along the length of the cooling back plate 1. Each thin plate extends out from the surface of the cooling back plate 1, and its extension direction is perpendicular to the pipe direction of the parallel microchannels 2.

[0064] Preferably, the heat exchanger inlet pipe 3, the heat exchanger outlet pipe 4, and the pipes are all made of copper.

[0065] Preferably, plane 7 is parallel to cooling back plate 1.

[0066] Furthermore, the backplate heat exchanger is arranged as a contact radiator, with the matrix-type pin fin array 5 facing the heat dissipation duct, the plane 7 being attached to the heat source surface and in contact with the heat source surface through the heat-conducting layer, and the heat exchanger inlet pipe 3 and heat exchanger outlet pipe 4 being connected to the external coolant supply source and return port, respectively.

[0067] Preferably, the thermally conductive layer can be a thermally conductive silicone grease layer.

[0068] Furthermore, the backplate heat exchanger serves as an array-type condenser, with at least two parallel backplate heat exchangers stacked together to form a heat exchanger array. The cooling backplates 1 of each backplate heat exchanger are arranged horizontally, and the heat dissipation structures are all arranged facing the air inlet side. The heat exchanger inlet pipes 3 are all connected to the high-temperature gaseous working fluid source, and the heat exchanger outlet pipes 4 are all connected to the low-temperature liquid working fluid return port.

[0069] Furthermore, the present invention also provides an application of a parallel microchannel backplate heat exchanger in chip heat dissipation systems, condensation systems, and thermal management systems.

[0070] Furthermore, the present invention also provides a chip heat dissipation system suitable for high-density data center racks.

[0071] The chip heat dissipation system includes:

[0072] The centralized cooling unit has an internal coolant circulation loop and is equipped with a coolant output main pipe and a coolant return main pipe;

[0073] Multiple backplate heat exchangers, each in a flat plate shape, are suitable for dense installation in confined spaces.

[0074] In a single cabinet, a backplate heat exchanger is attached to the surface of the package shell of each chip. The plane 7 of the backplate heat exchanger is in close contact with the surface of the package shell of the corresponding chip through the heat-conducting layer. The heat dissipation structure is a matrix pin array 5, which is arranged towards the heat dissipation air duct of the cabinet.

[0075] All the heat exchanger inlet pipes 3 of the backplate heat exchangers are connected in parallel to the coolant outlet main pipe, and all the heat exchanger outlet pipes 4 are connected in parallel to the coolant return main pipe, forming a parallel coolant distribution network.

[0076] A circulation pump, installed in the coolant circulation loop, is used to drive the flow of coolant;

[0077] Backplate heat exchangers, acting as contact cold plates, transfer the heat generated by each chip to the coolant, and then discharge the heat to the unified cooling system of the data center through a centralized cooling unit.

[0078] Preferably, the thermally conductive layer can be a thermally conductive silicone grease layer.

[0079] Furthermore, the present invention also provides a condensation system for an outdoor unit of an air conditioner.

[0080] The condensation system includes:

[0081] The compressor, whose exhaust port is used to discharge high-temperature, high-pressure gaseous refrigerant;

[0082] A throttling device is used to reduce the pressure of liquid refrigerant from the condenser;

[0083] An evaporator is where the refrigerant, after being throttled and depressurized, absorbs heat and evaporates to achieve refrigeration.

[0084] Axial flow fans are used to drive outside air to flow through the heat dissipation duct inside the air conditioner's outdoor unit;

[0085] And, a backplate heat exchanger array, which is arranged as a condenser in the heat dissipation duct; the backplate heat exchanger array is composed of at least two parallel backplate heat exchangers stacked as above.

[0086] Each backplate heat exchanger is placed horizontally, with the plane of its cooling backplate 1 parallel to the ground and its pipes parallel to the horizontal direction. Each backplate heat exchanger preferably adopts a shovel-shaped heat dissipation structure 8, which is arranged towards the air inlet direction of the axial flow fan to optimize the air flow channel and increase the convective heat transfer area.

[0087] The inlet pipes 3 of all backplate heat exchangers are connected in parallel and then connected to the exhaust port of the compressor to receive high-temperature and high-pressure gaseous refrigerant; the outlet pipes 4 of all heat exchangers are connected in parallel and then connected to the evaporator in sequence through a dryer filter and a throttling device.

[0088] During operation, the high-temperature and high-pressure gaseous refrigerant flows in the pipes of the backplate heat exchanger array. It condenses into a liquid state through forced convection heat exchange with the air flowing through its heat dissipation structure, thereby releasing heat.

[0089] Furthermore, the present invention also provides a new energy vehicle battery thermal management system, comprising:

[0090] The centralized liquid cooling unit has an internal coolant circulation loop and is equipped with a coolant output main pipe and a coolant return main pipe;

[0091] Multiple backplate heat exchangers as described above, each heat exchanger being flat;

[0092] Multiple backplate heat exchangers are arranged in parallel in a horizontally spread manner, covering the upper and / or lower surfaces of the vehicle battery pack to form a heat dissipation array that is adapted to the shape of the battery pack.

[0093] Each backplate heat exchanger's plane 7 is in close contact with the battery pack surface through a heat-conducting layer, and its matrix-type needle-fin array 5 or shovel-shaped heat dissipation structure 8 is arranged towards the heat dissipation space outside the battery pack.

[0094] All the heat exchanger inlet pipes 3 of the backplate heat exchangers are connected in parallel to the coolant outlet main pipe, and all the heat exchanger outlet pipes 4 are connected in parallel to the coolant return main pipe, forming a parallel liquid cooling network.

[0095] A circulation pump, installed in the coolant circulation loop, is used to drive the flow of coolant;

[0096] The backplate heat exchanger array acts as a uniform cooling plate, transferring the heat generated by the battery pack to the coolant evenly and efficiently, and then dissipating the heat from the system through a centralized liquid cooling unit.

[0097] Specific embodiments of the present invention are as follows:

[0098] Example 1

[0099] This embodiment provides a GPU chip cooling system for use in server rooms. Specifically designed for GPU chip cooling in a single AI server rack, this embodiment uses a mixture of deionized water and 15% ethylene glycol as the coolant, and is equipped with a cooling distribution unit (CDU), a circulation pump, and a heat dissipation pipe network to form a complete cooling system.

[0100] The matrix-style pin array 5 on the top of the cooling backplate 1 is oriented towards the heat dissipation duct of the computer room. After applying thermal grease to its bottom plane (including the plane 7 of the parallel microchannels 2), it is fixed to the surface of the GPU chip package shell with bolts, ensuring that the plane 7 of the parallel microchannels 2 is completely in contact with the chip package shell. The heat exchanger inlet pipe 3 is connected to the coolant outlet of the CDU, and the heat exchanger outlet pipe 4 is connected to the coolant return port of the CDU, thus forming a closed loop.

[0101] When the GPU chip is running, the coolant flows from the CDU into the heat exchanger inlet pipe 3 under the drive of the circulation pump. After being split in parallel through the parallel microchannels 2, it absorbs the heat generated by the chip and heats up. Then it flows into the heat exchanger outlet pipe 4 and returns to the CDU for cooling, finally completing the cycle.

[0102] The heat generated by the chip is first transferred to the inner wall of the parallel microchannels through heat conduction on the solid wall, and then carried away by the flowing coolant through convection. The matrix-type needle-fin array 5 provides sufficient heat exchange area for the parallel microchannels 2, which can maintain the efficient heat dissipation of the liquid cooling system under low airflow conditions and further reduce the temperature gradient on the surface of the heat exchanger.

[0103] In this embodiment, the surface area to volume ratio, heat transfer efficiency, and pressure drop of the parallel microchannel backplate heat exchanger were tested, and the results are as follows: the surface area to volume ratio of the parallel microchannel backplate heat exchanger is 3 to 5 times that of the traditional pipe cold plate heat exchanger, and the convective heat transfer coefficient exceeds 10,000 W / (m²). 2 With a thermal resistance that can be stably controlled below 0.01℃ / W, it can quickly remove heat from high-power chips, ensuring the cooling effect of high-power chips and is expected to cope with scenarios with higher power consumption. Under the same flow rate, the pressure drop of parallel microchannels is only 1 / 3 of that of traditional embedded pipe cold plates and microfin cold plates. It can further reduce the power usage efficiency (PUE) of data centers without increasing the pump power. At the same time, the low flow resistance advantage can also reduce the risk of corrosion and blockage, and has significant advantages in long-term operation and maintenance cleaning.

[0104] Example 2

[0105] This embodiment provides a condensing system for an outdoor unit of an air conditioner. Specifically for a household split-type air conditioner outdoor unit, this embodiment uses a parallel microchannel backplate heat exchanger as the core component of the condenser, replacing the traditional finned tube condenser. The refrigerant used is environmentally friendly R32, and the system is composed of a compressor, evaporator, and axial fan.

[0106] Multiple parallel microchannel backplate heat exchangers are horizontally stacked in parallel, with the cooling backplate 1 of each heat exchanger parallel to the ground plane. The pipes of the parallel microchannels 2 are parallel to the horizontal direction. The entire heat exchanger is fixed inside the heat dissipation cavity of the air conditioner outdoor unit, with one side of its shovel-shaped heat dissipation structure 8 facing the axial flow fan. The heat exchanger inlet pipe 3 is connected to the exhaust port of the air conditioner compressor; the heat exchanger outlet pipe 4 is connected to the inlet of the evaporator through a dryer filter, forming a refrigerant circulation loop.

[0107] After the air conditioner is turned on in cooling mode, the compressor runs. High-temperature, high-pressure gaseous refrigerant enters the heat exchanger inlet pipe 3 from the compressor's exhaust port. After being split into parallel microchannels 2, it undergoes a phase change and condenses, releasing heat as it flows within the channels. The heat released by the condensing refrigerant is transferred to the outer wall of the parallel microchannels 2. A small portion of this heat is directly dissipated through air convection outside the smooth pipe wall, while the majority is transferred through heat conduction to the cooling back plate 1, and then to the toothed heat dissipation structure 8. An axial fan blows outside air towards the toothed heat dissipation structure 8 and the parallel microchannels 2. The air carries away heat through strong convection and is then discharged from the outdoor unit's outlet. Thus, the refrigerant in the parallel microchannels 2, after releasing heat, forms a low-temperature, low-pressure liquid, which enters the evaporator from the heat exchanger outlet pipe 4 via a dryer filter, ultimately completing the refrigeration cycle.

[0108] It is evident that the compactness of the parallel microchannel cooling backplate provided by this invention has significant advantages in blade server layouts. Through the vertical stacking of multiple layers of cold plates, space utilization can be greatly improved, enabling the deployment of high-power-density racks. Furthermore, it is easy to achieve uniform flow distribution, reduce local hot spot temperature differences, and is more suitable for high-density scenarios such as AI computing clusters and supercomputing centers.

[0109] The above description is only a preferred embodiment of the present invention. Therefore, all equivalent changes or modifications made to the structure, features and principles described in the claims of this patent application are included in the scope of this patent application.

Claims

1. A high-efficiency parallel microchannel backplate heat exchanger, characterized in that: The backplate heat exchanger includes a cooling backplate (1), parallel microchannels (2), a heat dissipation structure, and an embedded groove (6); a heat dissipation structure is arranged on one side surface of the cooling backplate (1), and an embedded groove array composed of several parallel embedded grooves (6) is opened on the other side surface, with parallel microchannels (2) installed in the embedded groove array. The parallel microchannel (2) includes a heat exchanger inlet pipe (3), a heat exchanger outlet pipe (4) and several parallel pipes arranged in parallel with each other; all pipes are arranged vertically between the heat exchanger inlet pipe (3) and the heat exchanger outlet pipe (4), with one end connected to the heat exchanger inlet pipe (3) and the other end connected to the heat exchanger outlet pipe (4). The pipes correspond one-to-one with the embedded grooves (6). One side of the pipe is embedded in the corresponding embedded groove (6), and the side wall is connected to the groove wall by friction welding. The other side is provided with a plane (7) formed by machining.

2. The high-efficiency heat exchange parallel microchannel backplate heat exchanger according to claim 1, characterized in that: The cooling backplate (1) is made of aluminum or copper.

3. The high-efficiency heat exchange parallel microchannel backplate heat exchanger according to claim 1, characterized in that: The heat dissipation structure is a matrix-type needle-fin array (5) or a shovel-shaped heat dissipation structure (8).

4. The high-efficiency heat exchange parallel microchannel backplate heat exchanger according to claim 3, characterized in that: The matrix needle-wing array (5) is composed of several needle-wing structures arranged along a matrix. The shape of the needle-wing structure is a cube, cylinder, cuboid, teardrop, mountain-shaped or leaf-shaped.

5. The high-efficiency heat exchange parallel microchannel backplate heat exchanger according to claim 3, characterized in that: The shovel-shaped heat dissipation structure (8) is composed of multiple parallel thin plates arranged at intervals. Each thin plate extends out from the surface of the cooling back plate (1), and its extension direction is perpendicular to the pipe direction of the parallel microchannels (2).

6. The high-efficiency heat exchange parallel microchannel backplate heat exchanger according to claim 1, characterized in that: The backplate heat exchanger is arranged as a contact radiator. The matrix needle fin array (5) faces the heat dissipation duct. The plane (7) is attached to the heat source surface and contacts the heat source surface through the heat conduction layer. The heat exchanger inlet pipe (3) and heat exchanger outlet pipe (4) are respectively connected to the external coolant supply source and return port.

7. The high-efficiency heat exchanger with parallel microchannel backplate according to claim 1, characterized in that: The backplate heat exchanger is an array condenser. At least two parallel backplate heat exchangers are stacked to form a heat exchanger array. The cooling backplates (1) of each backplate heat exchanger are arranged horizontally, and the heat dissipation structures are all arranged facing the air inlet side. The heat exchanger inlet pipes (3) are all connected to the gaseous working fluid source, and the heat exchanger outlet pipes (4) are all connected to the liquid working fluid return port.

8. A chip heat dissipation system suitable for high-density data center racks, characterized in that, include: The centralized cooling unit has an internal coolant circulation loop and is equipped with a coolant output main pipe and a coolant return main pipe; Multiple backplate heat exchangers as described in any one of claims 1 to 7; In a single cabinet, a backplate heat exchanger is attached to the surface of the package shell of each chip. The plane (7) of the backplate heat exchanger is in close contact with the surface of the package shell of the corresponding chip through a heat-conducting layer. The heat dissipation structure is a matrix pin array (5), which is arranged towards the heat dissipation duct of the cabinet. The heat exchanger inlet pipes (3) of all backplate heat exchangers are connected in parallel to the coolant outlet main pipe, and the heat exchanger outlet pipes (4) of all backplate heat exchangers are connected in parallel to the coolant return main pipe, forming a parallel coolant distribution network. A circulation pump is installed in the coolant circulation loop to drive the flow of coolant; The backplate heat exchanger is used as a contact cold plate to transfer the heat generated by each chip to the coolant, and the heat is finally discharged to the heat dissipation system of the data center through the centralized cooling unit.

9. A condensation system for an outdoor unit of an air conditioner, characterized in that, include: The compressor's exhaust port is used to discharge gaseous refrigerant. A throttling device is used to reduce the pressure of liquid refrigerant from the condenser; The evaporator is used to allow the refrigerant, after being throttled and depressurized, to absorb heat and evaporate. Axial flow fans are used to drive outside air to flow through the heat dissipation duct inside the air conditioner's outdoor unit; A backplate heat exchanger array is used as the condenser and arranged in the heat dissipation duct; the backplate heat exchanger array is composed of at least two parallel backplate heat exchangers arranged side by side in the horizontal direction as described in any one of claims 1 to 7. Each backplate heat exchanger is placed horizontally, with the plane of the cooling backplate (1) parallel to the ground and its pipes parallel to the horizontal direction; the heat dissipation structure is a shovel-shaped heat dissipation structure (8), which is arranged towards the air inlet direction of the axial flow fan. The heat exchanger inlet pipes (3) of all backplate heat exchangers are connected in parallel and then connected to the exhaust port of the compressor to receive the high-temperature and high-pressure gaseous refrigerant; the heat exchanger outlet pipes (4) of all heat exchangers are connected in parallel and then connected to the evaporator through the dryer filter and the throttling device in sequence. During operation, the gaseous refrigerant flows in the pipes of the backplate heat exchanger array and condenses into a liquid state through forced convection heat exchange with the air flowing through its heat dissipation structure, thereby achieving heat dissipation.

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