Rotary test fixture for air-cooled high and low temperature chip

Abstract

The invention relates to the technical field of chip function testing, in particular to a rotary test fixture for an air-cooled high and low temperature chip, which comprises a test mechanism, the test mechanism comprises a spinning assembly, a shell assembly, a heat supply assembly, a cold supply assembly and a fixture assembly, the fixture assembly is positioned below the spinning assembly, and the shell assembly is positioned below the shell assembly. The heat supply assembly and the cold supply assembly are located between the clamp assembly and the spinning assembly, and the outer side of the clamp assembly is sleeved with the shell assembly. The clamp assembly comprises a chip function test circuit board used for detecting and supporting, a double-end spring probe, a tested chip positioning frame, a clamp needle die, a clamp upper cover, a clamp base and a clamp upper cover tray, the spinning assembly comprises a spinning handle, an elastic bolt and a lifting flange, and the heat supply assembly comprises a thermocouple. According to the invention, stable electrical signal connection is realized, and a good electrical performance test loop is constructed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip function test, in particular to a rotary test fixture for air-cooled high and low temperature chips. BACKGROUND

[0002] The present application relates to the technical field of chip function test, in particular to a rotary test fixture for air-cooled high and low temperature chips.

[0003] Generally, to test the function of a chip under high and low temperature conditions, a high and low temperature environmental chamber is used. The environmental chamber has a chip test fixture inside. The test fixture has a test cable that passes through the environmental chamber insulation wall and is connected to a test function board or a test system. When the chip is positioned and clamped on the test fixture, the chip pins are physically connected to the test cable, that is, the chip pins are electrically connected to the test function board or the test system through the cable, thereby forming an electrical parameter test loop under high and low temperature conditions.

[0004] With the development of chip technology, many chips now contain high-speed signals or radio frequency wireless signals. In the traditional chip test scheme, when the chip signals pass through the test cable, the cable causes excessive attenuation of the signals, which seriously attenuates the signals, distorts the test data, causes errors, or makes it impossible to perform data sampling tests.

[0005] Therefore, the rotary test fixture for air-cooled high and low temperature chips is proposed to solve the above problems. SUMMARY

[0006] In view of the deficiencies of the prior art, the present application provides a rotary test fixture for air-cooled high and low temperature chips, which can solve the problem of excessive attenuation of signals caused by cables, which seriously attenuates the signals, distorts the test data, causes errors, or makes it impossible to perform data sampling tests.

[0007] To achieve the above purpose, the present application provides the following technical scheme: a test mechanism, the test mechanism comprising a spinning assembly, an outer shell assembly, a heating assembly, a cooling assembly, and a clamp assembly;

[0008] The clamp assembly is located below the spinning assembly, the heating assembly and the cooling assembly are located between the clamp assembly and the spinning assembly, and the outer shell assembly is sleeved on the outer side of the clamp assembly.

[0009] The clamp assembly comprises a chip function test circuit board for detection and support, double-end spring probes, a measured chip positioning frame, a clamp needle mold, a clamp upper cover, a clamp base, and a clamp upper cover tray.

[0010] The spinning assembly comprises a spinning handle, an elastic bolt, and a lifting flange.

[0011] The heating assembly comprises a thermocouple and an electric heating press plate; the cooling assembly comprises a cold air inlet pipe A, a cold air pipe B, and a cold air pipe C.

[0012] The heating assembly and the cooling assembly are provided with an air-cooled heat exchanger.

[0013] Preferably, a connecting hole is formed in the middle of the clamp upper cover, and an internal thread is arranged in the connecting hole; an external thread is arranged on the outer side of the lower half of the connecting shaft of the spinning handle; the spinning handle is threadedly connected with the clamp upper cover, and the lower side of the spinning handle abuts against the upper side of the lifting flange.

[0014] Preferably, elastic bolt mounting holes are uniformly arranged on the side edges of the upper surface of the clamp upper cover, and elastic bolts are arranged in the elastic bolt mounting holes; the bottom ends of the elastic bolts are tightly mounted on the upper end of the lifting flange; and the lifting flange is located inside the clamp upper cover.

[0015] Preferably, the air-cooled heat exchanger is mounted on the lower side of the lifting flange; an electric heating press plate is mounted on the lower side of the air-cooled heat exchanger; the electric heating press plate is located above the test chip; the thermocouple is mounted inside the electric heating press plate; a thermocouple socket is arranged on one side of the thermocouple; an electric heating socket is arranged on one side of the electric heating press plate; and a thermocouple plug matched with the thermocouple socket and an electric heating plug matched with the electric heating socket are arranged on the lifting flange.

[0016] Preferably, a heat exchanger insulation shell is mounted on the lower side of the lifting flange; and the air-cooled heat exchanger and the electric heating press plate are located inside the heat exchanger insulation shell.

[0017] Preferably, the clamp base is located above the chip function test circuit board; the clamp needle mold is fixedly arranged on the upper end of the chip function test circuit board; a measured chip positioning frame is built-in the clamp needle mold; the measured chip positioning frame is used for positioning and placing the test chip; a probe mounting hole is formed in the middle of the clamp needle mold; the probe mounting hole is located in the middle of the measured chip positioning frame; double-head spring probes are arranged in the probe mounting hole; the double-head spring probes comprise upper elastic probes and lower elastic probes; circuit contact points matched with the lower elastic probes are arranged on the chip function test circuit board; the circuit contact points are a plurality of; and the upper elastic probes are located below the test chip.

[0018] Preferably, a control pipeline flange is mounted on the rear side of the clamp base; and an insulation layer flange is mounted on the rear side of the control pipeline flange.

[0019] Preferably, the clamp upper cover is provided with drying air cover A and drying air cover B on the two sides respectively, the lower side of the drying air cover A is provided with drying air nozzle A, the lower side of the drying air cover B is provided with drying air nozzle B, one side of the drying air cover A is provided with drying air pipe, the other end of the drying air pipe is communicated with the control pipeline flange and the heat preservation layer flange, one side of the drying air cover A is provided with LED display lamp, the electrical signal of the LED display lamp, the electric heating press plate and the thermocouple electrical component is connected with control cable through wire.

[0020] Preferably, one side of the heat preservation layer flange is provided with cold air pipe heat preservation layer, the cold air heat preservation layer is communicated with drying auxiliary air pipe and cold air pipe A through the heat preservation layer flange, the clamp base is provided with cold air pipe B and cold air pipe C, the heat exchanger protection shell is provided with cold air inlet pipe A, one side of the air-cooled heat exchanger is provided with cold air inlet pipe B, the lower side of the air-cooled heat exchanger is provided with cold air nozzle A and cold air nozzle B.

[0021] Preferably, the clamp upper cover is provided with hanging buckle on the two sides respectively, the clamp base and the clamp upper cover tray are provided with corresponding hanging buckle hanging position on the two sides respectively.

[0022] Compared with the prior art, the application provides a rotary test clamp for air-cooled high and low temperature chip, which has the following beneficial effects:

[0023] 1. The chip pin is connected with the chip function test circuit board through double-head spring probe, stable electrical signal connection is realized, and a good electrical performance test loop is constructed.

[0024] 2. The testability of high-frequency signal chip and radio frequency chip in high and low temperature environment is realized, and the high-frequency and radio frequency chip is tested in high and low temperature environment without damage.

[0025] 3. The product test efficiency of chip manufacturer is improved, and the production cost is reduced. DETAILED DESCRIPTION

[0026] Figure 1 It is an overall explosion view of the structure of the application;

[0027] Figure 2 It is a schematic view of the lower half of the structure of the application;

[0028] Figure 3 It is an enlarged schematic view of the structure at A of the application;

[0029] Figure 4 It is an enlarged schematic view of the structure at B of the application;

[0030] Figure 5The schematic diagram of the temperature adjusting part structure of the present application is shown in the figure.

[0031] Figure 6 The schematic diagram of the overall structure of the present application is shown in the figure.

[0032] In the figure: 1, clamp base; 2, clamp upper cover; 3, clamp needle mold; 4, chip function test circuit board; 5, clamp upper cover tray; 6, spinning handle; 7, elastic bolt; 8, elastic bolt mounting hole; 9, lifting flange; 10, air-cooled heat exchanger; 11, heat exchanger insulation shell; 12, electric heating press plate; 13, thermocouple; 14, thermocouple socket; 1401, thermocouple plug; 15, electric heating socket; 1501, electric heating plug; 16, test chip positioning frame; 17, probe mounting hole; 18, double-end spring probe; 19, circuit contact; 20, upper side elastic probe; 21, lower side elastic probe; 22, drying air cover A; 23, drying air cover B; 24, drying air jet A; 25, drying air jet B; 26, hanging buckle; 27, control pipeline flange; 28, insulation layer flange; 29, cold air pipe insulation layer; 30, control cable; 31, drying gas pipe; 32, hanging buckle hanging position; 33, cold air pipe A; 34, cold air pipe B; 35, cold air pipe C; 36, cold air inlet pipe A; 37, cold air inlet pipe B; 38, cold air jet A; 39, cold air jet B; 40, LED display lamp. DETAILED DESCRIPTION

[0033] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0034] Embodiment:

[0035] Please refer to Figure 1 - Figure 6 The rotary test clamp for air-cooled high and low temperature chips in the embodiment includes a test mechanism, and the test mechanism includes a spinning assembly, a shell assembly, a heat supply assembly, a cold supply assembly, and a clamp assembly.

[0036] The clamp assembly is located below the spinning assembly, the heat supply assembly and the cold supply assembly are located between the clamp assembly and the spinning assembly, and the shell assembly is sleeved outside the clamp assembly.

[0037] The clamp assembly includes a chip function test circuit board 4 for detection and support, a double-end spring probe 18, a test chip positioning frame 16, a clamp needle mold 3, a clamp upper cover 2, a clamp base 1, and a clamp upper cover tray 5.

[0038] The spinning assembly comprises a spinning handle 6, an elastic bolt 7, and a lifting flange 9.

[0039] The heating assembly comprises a thermocouple 13, and the cooling assembly comprises a cold air inlet pipe A36, a cold air pipe B34, and a cold air pipe C35.

[0040] The heating assembly and the cooling assembly are provided with an air-cooled heat exchanger 10.

[0041] First, the overall structure of the testing mechanism is the existing equipment, and the specific operation control and circuit connection are the known technology in the field, and the corresponding fixing, installation, rotation and other modes in the application can adopt the conventional processing means in the mechanical field. Since they are all conventional technologies, they are not described in detail in the embodiment.

[0042] The fixture upper cover 2, the fixture base 1, the fixture needle mold 3, the chip function test circuit board 4, and the fixture upper cover tray 5 constitute an air-cooled high-low temperature test fixture. The test chip in the test chip positioning frame 16 placed on the test chip in the test chip positioning frame 16 on the fixture needle mold 3 is positioned in the temperature range of -60℃ to +150℃, and the electrical performance test under the specified high-low temperature constant temperature condition is performed. Therefore, a small high-low temperature environment is constructed on the test fixture, and the chip high-low temperature test is realized without the need for an environmental box. Without the need for an environmental box, the pins of the test chip do not need a test cable, and can be directly connected to the function test circuit board through a double-head spring probe or connected to a metering instrument through a very short test cable.

[0043] In this way, the electrical circuit of the chip test is shortened to optimize the test circuit and realize good data acquisition and function test of high-speed signal chips and radio frequency signal chips under high-low temperature conditions.

[0044] Please refer to Figure 1 A connecting hole is formed in the middle of the fixture upper cover 2, and an internal thread is arranged in the connecting hole. An external thread is arranged on the outer side of the connecting shaft of the lower half of the spinning handle 6, and the spinning handle 6 is threadedly connected with the fixture upper cover 2.

[0045] Uniform elastic bolt mounting holes 8 are arranged on the upper surface side edges of the fixture upper cover 2, and elastic bolts 7 are arranged in the elastic bolt mounting holes 8. The bottom ends of the elastic bolts 7 are tightly installed on the upper end of the lifting flange 9, and the lifting flange 9 is located inside the fixture upper cover 2.

[0046] The spring on the elastic bolt 7 upwardly lifts the lifting flange 9, and the spinning handle 6 is fitted in the external thread on the upper side of the fixture upper cover 2. Rotating the spinning handle 6 downwardly can resist the downward movement of the lifting flange 9.

[0047] Please refer to Figure 1 and Figure 5The air-cooled heat exchanger 10 is installed on the lower side of the lifting flange 9, and the electric heating press plate 12 is installed on the lower side of the air-cooled heat exchanger 10, which is located above the test chip. The thermocouple 13 is installed inside the electric heating press plate 12, and the thermocouple socket 14 is arranged on one side of the thermocouple 13. The electric heating socket 15 is arranged on one side of the electric heating press plate 12. The thermocouple plug 1401 matched with the thermocouple socket 14 and the electric heating plug 1501 matched with the electric heating socket 15 are arranged on the lifting flange 9.

[0048] The heat exchanger insulation shell 11 is installed on the lower side of the lifting flange 9, and the air-cooled heat exchanger 10 and the electric heating press plate 12 are located inside the heat exchanger insulation shell 11.

[0049] The thermocouple socket 14 and the electric heating socket 15 are matched with the thermocouple plug 1401 and the electric heating plug 1501 on the lifting flange 9, and are inserted correspondingly to ensure the stability of the connection state.

[0050] The heat exchanger insulation shell 11 is installed on the lower side of the lifting flange 9, and the air-cooled heat exchanger 10 and the electric heating press plate 12 are surrounded by the heat exchanger insulation shell 11 to keep warm.

[0051] Please refer to Figure 3 and Figure 4 The clamp base 1 is located above the chip function test circuit board 4, and the clamp needle mold 3 is fixedly arranged on the upper end of the chip function test circuit board 4. The clamp needle mold 3 is internally provided with a test chip positioning frame 16 for positioning and placing the test chip. The probe mounting hole 17 is formed in the middle of the clamp needle mold 3, and the probe mounting hole 17 is located in the middle of the test chip positioning frame 16. The double-head spring probe 18 is arranged in the probe mounting hole 17. The double-head spring probe 18 includes an upper elastic probe 20 and a lower elastic probe 21. The circuit contact 19 is arranged on the chip function test circuit board 4 and contacts the lower elastic probe 21. The circuit contact 19 has a plurality of upper elastic probes 20 located below the test chip.

[0052] The clamp base 1 tightly installs the clamp needle mold 3 on the chip function test circuit board 4. The double-head spring probe 18 is positioned and installed in the probe mounting hole 17 of the clamp needle mold 3, and the lower elastic probe 21 of the double-head spring probe 18 is pressed and contacted on the circuit contact 19 of the test board to realize the conduction of the circuit.

[0053] When the test chip is placed in the test chip positioning frame 16 on the needle mold and is pressed on the double-head spring probe 18 by the electric heating press plate 12, the upper elastic probe 20 of the spring needle is pressed and contacted on the pin of the test chip to realize the conduction of the circuit.

[0054] Please refer to Figure 1 and Figure 2The rear side of the clamp base 1 is provided with a control pipeline flange 27, and the rear side of the control pipeline flange 27 is provided with a heat preservation layer flange 28.

[0055] The clamp upper cover 2 is provided with a drying air cover A22 and a drying air cover B23 on the two opposite sides, respectively. The lower side of the drying air cover A22 is provided with a drying air outlet A24, and the lower side of the drying air cover B23 is provided with a drying air outlet B25. The drying air cover A22 is provided with a drying air pipe 31 on one side, and the other end of the drying air pipe 31 is in communication with the control pipeline flange 27 and the heat preservation layer flange 28. The drying air cover A22 is provided with an LED display lamp on one side. The electrical signals of the LED display lamp, the electric heating press plate 12, and the thermocouple electrical components are connected with a control cable 30 through wires.

[0056] The heat preservation layer flange 28 is provided with a cold air pipe heat preservation layer 29 on one side. The cold air pipe heat preservation layer is in communication with a drying auxiliary air pipe and a cold air pipe A33 through the heat preservation layer flange 28. The clamp base 1 is provided with a cold air pipe B34 and a cold air pipe C35. The heat exchanger protection shell is provided with a cold air inlet pipe A36. The air-cooled heat exchanger 10 is provided with a cold air inlet pipe B37 on one side. The air-cooled heat exchanger 10 is provided with a cold air outlet A38 and a cold air outlet B39 on the lower side.

[0057] The clamp upper cover 2 is provided with a hanging buckle 26 on the two opposite sides. The clamp base 1 and the clamp upper cover tray 5 are provided with corresponding hanging buckle hanging positions 32 on the two opposite sides.

[0058] The drying air enters the drying air cover A22 and the drying air cover B23 through the drying air pipe 31 and is sprayed out from the drying air outlet A24 and the drying air outlet B25 to form a drying air curtain around the clamp, which isolates the humid air in the normal temperature environment. In the low temperature condition, the clamp, the test chip, and the surrounding electronic devices are prevented from condensing water and frosting.

[0059] Thus, the pins of the test chip are stably connected and conducted with the electrical test loop on the chip function test circuit board 4 through the double-head spring probe 18, so as to complete the data acquisition and function test of the chip electrical signal in the high and low temperature environment.

[0060] The qualified and unqualified information of the test chip test result is displayed by the green light and the red light of the clamp LED display lamp through the control cable 30, so as to remind the operator to correctly sort the test chip.

[0061] The tested chip is taken out from the clamp.

[0062] When the rotary pressure handle 6 is rotated, the outer thread is rotated to lift up, and the elastic bolt 7 lifts up the lifting flange 9.

[0063] The electric heating platen 12 goes up with the lifting flange, loosens the test chip pressed on the spring needle, and at the same time, the electric heating platen 12 also unloads the upward elastic force of the double-end spring probe 18; at this time, the operator can open the upper cover hook 26 to take off the clamp upper cover 2 from the clamp base 1 and place it on the clamp upper cover tray 5.

[0064] In this way, the operator can take out the test chip in the test chip positioning frame 16 on the clamp needle mold 3 without the clamp upper cover 2. According to the green light and red light prompt on the LED display lamp, the chip is correctly sorted.

[0065] Conversely, test the chip with the air-cooled high-low temperature clamp:

[0066] Place the test chip in the test chip positioning frame 16, move the clamp upper cover 2 on the clamp upper cover tray 5 to the clamp base 1, cooperate with the upper cover positioning pin, and hang the hook 26 in the hook hanging position 32.

[0067] Press the rotary handle 6 to rotate the outer thread, and then lower the clamp needle mold 3.

[0068] The electric heating platen 12 goes down with the lifting flange 9, contacts and presses the test chip on the double-end spring probe 18, and at the same time, the pins of the test chip are well and accurately connected with the upper elastic probe 20. The accurate connection is due to the positioning guide between each part, which is similar to using a positioning pin and other methods, and belongs to a conventional technical means to conduct an electrical signal.

[0069] The pins of the chip are connected with the chip function test circuit board 4 through the double-end spring probe 18

[0070] The stable electrical signal connection is realized, and a good electrical performance test loop is constructed.

[0071] According to the test needs, when high-temperature testing is performed, the electric heating platen 12 heats the test chip, the thermocouple 13 feeds back the heating temperature of the test chip shell, and constant temperature control is realized; under the specified high-temperature constant temperature condition, the chip function test circuit board 4 performs electrical performance data acquisition and testing on the test chip.

[0072] When the low temperature test is carried out, the low temperature cold air is controlled to enter the air-cooled heat exchanger 10 through the cold air pipe A 33, the cold air pipe B 34, the cold air inlet pipe A 36, the cold air inlet pipe B 37, and is sprayed out through the cold air spraying port A 38 and the cold air spraying port B 39, in the process, the air-cooled heat exchanger 10 cools and refrigerates the unheated electric heating press plate 12 and the test chip, the temperature of the test chip pipe shell is fed back by the thermocouple 13, constant temperature control is realized, at the same time, the dry air enters the dry air pipe 31, enters the dry air cover A 22 and the dry air cover B 23, and is sprayed out through the dry air spraying port A 24 and the dry air spraying port B 25, the dry air curtain around the clamp is surrounded, the humid air of the normal temperature environment is isolated, and the condensation and frosting of the clamp, the test chip and the surrounding electronic devices are prevented.

[0073] Under the specified low temperature constant temperature condition, the chip function test circuit board 4 carries out the electric performance data collection and test on the test chip.

[0074] The qualified and unqualified information of the test chip test result is displayed through the green light and the red light of the clamp LED display lamp controlled by the control cable, and the operator is reminded to correctly sort the test chip.

[0075] The mounting mode, the connecting mode or the setting mode disclosed in the embodiment are all common mechanical connecting modes, as long as the beneficial effects can be achieved, and the specific structure composition and working principle are not described in detail.

[0076] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A rotary test fixture for gas-cooled high and low temperature chips, characterized in that: The test mechanism includes a spinning assembly, a housing assembly, a heating assembly, a cooling assembly, and a fixture assembly. The clamping assembly is located below the spinning assembly, the heating assembly and the cooling assembly are located between the clamping assembly and the spinning assembly, and the outer shell assembly is sleeved on the outside of the clamping assembly; The fixture assembly includes a chip function test circuit board (4) for testing support, a double-headed spring probe (18), a chip positioning frame (16), a fixture needle mold (3), a fixture top cover (2), a fixture base (1), and a fixture top cover tray (5). The spinning assembly includes a spinning handle (6), an elastic bolt (7), and a lifting flange (9); The heating assembly includes a thermocouple (13) and an electric heating plate (12), and the cooling assembly includes a cold air inlet pipe A (36), a cold air pipe B (34), and a cold air pipe C (35). An air-cooled heat exchanger (10) is provided between the heating component and the cooling component.

2. The rotary test fixture for gas-cooled high and low temperature chips according to claim 1, characterized in that: The clamp cover (2) has a connecting hole in the middle and an internal thread in the connecting hole. The lower half of the spinning handle (6) has an external thread on the outside of the connecting shaft. The spinning handle (6) is threadedly connected to the clamp cover (2) and the lower side of the spinning handle (6) abuts against the upper side of the lifting flange (9).

3. The rotary test fixture for gas-cooled high and low temperature chips according to claim 2, characterized in that: The upper surface of the clamp cover (2) is uniformly provided with elastic bolt mounting holes (8), and elastic bolts (7) are provided in the elastic bolt mounting holes (8). The bottom end of the elastic bolts (7) is fastened to the upper end of the lifting flange (9), and the lifting flange (9) is located inside the clamp cover (2).

4. The rotary test fixture for gas-cooled high and low temperature chips according to claim 1, characterized in that: The air-cooled heat exchanger (10) is installed on the lower side of the lifting flange (9). An electric heating plate (12) is installed on the lower side of the air-cooled heat exchanger (10). The electric heating plate (12) is located above the test chip. The thermocouple (13) is installed inside the electric heating plate (12). A thermocouple socket (14) is provided on one side of the thermocouple (13). An electric heating socket (15) is provided on one side of the electric heating plate (12). A thermocouple plug (1401) that mates with the thermocouple socket (14) and an electric heating plug (1501) that mates with the electric heating socket (15) are provided on the lifting flange (9).

5. The rotary test fixture for gas-cooled high and low temperature chips according to claim 4, characterized in that: The lower side of the lifting flange (9) is equipped with a heat exchanger insulation shell (11), and the air-cooled heat exchanger (10) and the electric heating pressure plate (12) are both located inside the heat exchanger insulation shell (11).

6. The rotary test fixture for gas-cooled high and low temperature chips according to claim 1, characterized in that: The fixture base (1) is located above the chip function test circuit board (4). The fixture needle mold (3) is fixedly set on the upper end of the chip function test circuit board (4). The fixture needle mold (3) has a chip positioning frame (16) built in it. The chip positioning frame (16) is used to position and place the test chip. The fixture needle mold (3) has a probe mounting hole (17) in the middle. The probe mounting hole (17) is located in the middle of the chip positioning frame (16). A double-headed spring probe (18) is set in the probe mounting hole (17). The double-headed spring probe (18) includes an upper elastic probe (20) and a lower elastic probe (21). The chip function test circuit board (4) has a circuit contact (19) that contacts the lower elastic probe (21). There are several circuit contacts (19). The upper elastic probe (20) is located below the test chip.

7. The rotary test fixture for gas-cooled high and low temperature chips according to claim 4, characterized in that: A control pipeline flange (27) is installed on the rear side of the clamp base (1), and an insulation layer flange (28) is installed on the rear side of the control pipeline flange (27).

8. The rotary test fixture for gas-cooled high and low temperature chips according to claim 7, characterized in that: The clamp cover (2) is provided with a drying hood A (22) and a drying hood B (23) on opposite sides. A drying air nozzle A (24) is provided on the lower side of the drying hood A (22), and a drying air nozzle B (25) is provided on the lower side of the drying hood B (23). A drying air pipe (31) is provided on one side of the drying hood A (22), and the other end of the drying air pipe (31) is connected to the control pipeline flange (27) and the insulation layer flange (28). An LED indicator light (40) is provided on one side of the drying hood A (22). The electrical signals of the LED indicator light (40), the electric heating plate (12), and the thermocouple electrical components are connected to a control cable (30) through wires.

9. The rotary test fixture for gas-cooled high and low temperature chips according to claim 7, characterized in that: A cold air pipe insulation layer (29) is provided on one side of the insulation layer flange (28). The cold air insulation layer is connected to the insulation layer flange (28) by a drying air pipe (31) and a cold air pipe A (33). A cold air pipe B (34) and a cold air pipe C (35) are provided inside the clamp base (1). A cold air inlet pipe A (36) is provided inside the heat exchanger protective shell. A cold air inlet pipe B (37) is provided on one side of the air-cooled heat exchanger (10). A cold air nozzle A (38) and a cold air nozzle B (39) are provided on the lower side of the air-cooled heat exchanger (10).

10. The rotary test fixture for gas-cooled high and low temperature chips according to claim 1, characterized in that: The clamp cover (2) is provided with hooks (26) on both sides, and the clamp base (1) and the clamp cover tray (5) are provided with corresponding hook positions (32) on both sides.

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