Bonding device and bonding method

Abstract

The invention relates to a laminating device and a laminating method, and belongs to the technical field of optical device manufacturing equipment. By integrating the complete processes of feeding of the light guide plate, multi-station circulation, gluing, taking and placing of the light equalizing film and press fit, and discharging through the conveying line after press fit is completed, high-precision and high-efficiency attachment of the optical film and the light guide plate is achieved, and the problems that a traditional operation mode is low in efficiency, unstable in yield and large in accumulative error of multi-device connection are effectively solved.

Description

Technical Field

[0001] This invention relates to the field of optical device manufacturing equipment technology, and in particular to a bonding device and bonding method. Background Technology

[0002] With the development of backlight module manufacturing technology, a process has emerged in which optical films (such as light-diffusing films) are bonded to light guide plates. This technology has a key impact on the optical performance and assembly accuracy of the product.

[0003] In related technologies, the process mainly relies on manual labor, which involves completing operations such as loading the light guide plate, applying adhesive, loading the film, bonding and unloading through decentralized processes, and manual transfer and connection of materials between different equipment.

[0004] However, the aforementioned manual or semi-automatic operation methods and related devices have problems such as low production efficiency, high labor intensity, easy introduction of air bubbles and alignment errors, difficulty in consistent glue application accuracy, significant cumulative positioning errors in multiple stages, and unstable production cycle due to the lack of overall automation and intelligent control. Summary of the Invention

[0005] In response to the shortcomings of the existing production technology, the applicant provides a bonding device and bonding method that integrates feeding, gluing, film bonding and unloading functions into one unit. This enables high-precision, high-efficiency and high-quality bonding of the light guide plate and the light-diffusing film, effectively solving the problems of unstable quality of manual operation, low efficiency of multi-equipment connection and poor production consistency.

[0006] The technical solution adopted in this invention is as follows: An adhesive device, comprising: The support assembly includes a frame and a cover disposed above the frame in the height direction, forming a working area inside the cover; The light guide plate hopper assembly, located within the working area, is used to hold the light guide plate. A first transfer assembly is disposed on one side of the light guide plate hopper assembly and extends along a first horizontal direction for transferring a light guide plate from the light guide plate hopper assembly. The second transfer assembly extends along the second horizontal direction and is disposed on one side of the first transfer assembly. The second transfer assembly includes a turntable that can move along the second horizontal direction. The turntable has a material picking station, an intermediate adhesive application station, and a bonding station. The bonding assembly includes a gantry for assembly, an adhesive application unit located in a second horizontal direction near the first transfer assembly, and a pressing unit located away from the first transfer assembly. The adhesive application unit is arranged corresponding to the intermediate adhesive application station, and the pressing unit is arranged corresponding to the bonding station. The homogenization film hopper assembly is located on one side of the pressing unit in the first horizontal direction and is used to hold the homogenization film; A conveyor belt, disposed on the side of the first transfer assembly away from the light guide plate hopper assembly in the first horizontal direction, is used to deliver the bonded workpiece; and A feeding assembly, disposed on the conveyor belt, is used to receive and transfer the bonded workpieces to the conveyor belt; The first horizontal direction is the length direction based on the frame, and the second horizontal direction is the width direction based on the frame.

[0007] In one embodiment, the light guide plate hopper assembly includes a enclosure and a first hopper bottom plate disposed within the enclosure. A first lifting cylinder is connected to the bottom of the first hopper bottom plate in the height direction. A first sensor mounting plate is disposed on one side of the enclosure in the height direction. A first laser sensor for detecting the position of the light guide plate is disposed on the top of the first sensor mounting plate.

[0008] In one embodiment, the enclosure is further provided with a plurality of limiting rods extending in the height direction, the limiting rods being distributed around the light guide plate.

[0009] In one embodiment, the first transfer assembly includes a first linear module extending along a first horizontal direction, a first connecting plate connected to a sliding end of the first linear module, a second linear module extending in the height direction mounted on the side of the first connecting plate near the light guide plate hopper assembly, and a first vacuum nozzle connected to a sliding end of the second linear module; a third linear module extending in the height direction mounted on the side of the first connecting plate away from the light guide plate hopper assembly, and a second vacuum nozzle connected to a sliding end of the third linear module.

[0010] In one embodiment, the second transfer assembly includes a fourth linear module extending along a second horizontal direction, the sliding end of the fourth linear module being connected to a second connecting plate, a rotary drive being disposed on one side of the second connecting plate, and the output end of the rotary drive being connected to the turntable.

[0011] A bonding method, applied to the bonding device described above, includes the following steps: Place the stacked light guide plates into the light guide plate hopper assembly and lift them to the material handling position; The light guide plate at the material picking position is picked up and transferred to the turntable of the second transfer component by the first transfer component, at which time the turntable is located at the material picking position; Drive the turntable to move along the second horizontal direction to the middle adhesive application station, and use the adhesive application unit of the bonding component to stick the tape to the set position on the surface of the light guide plate and cut it. The turntable is driven to move along the second horizontal direction to the bonding station. The bonding unit of the bonding component picks up the light homogenizing film from the light homogenizing film hopper assembly and presses the light homogenizing film onto the light guide plate that has been glued, thus completing the bonding process. The completed bonding process is transferred to the feeding component via the first transfer component; When the workpiece on the feeding assembly reaches a predetermined height, the feeding assembly descends, causing the bottom surface of the workpiece to contact the conveyor belt, and is then conveyed out by the conveyor belt.

[0012] In one embodiment, the step of placing the stacked light guide plates in the light guide plate hopper assembly and lifting them to the material retrieval position specifically includes: lifting the bottom plate of the first hopper by the first lifting cylinder until the first laser sensor detects that the uppermost light guide plate is in place.

[0013] In one embodiment, the step of driving the turntable to move along the second horizontal direction to the middle adhesive application station, and then applying and cutting the adhesive tape to a predetermined position on the surface of the light guide plate by the adhesive application unit of the bonding assembly specifically includes: The tape turntable carrying the tape is driven down by the sixth linear module, so that the tape comes into contact with the surface of the light guide plate. The tape turntable is driven by the fifth linear module to move along the first horizontal direction, so that the tape is flatly pasted on the surface of the light guide plate. After the tape is pasted, the blade pusher cylinder drives the cutting blade to cut the tape.

[0014] In one embodiment, before the step of picking up the homogenizing film from the homogenizing film hopper assembly by the pressing unit of the bonding assembly, the method further includes: lifting the homogenizing film base plate by the second lifting cylinder until the homogenizing film is detected by the second laser sensor.

[0015] In one embodiment, the step of transferring the completed bonding work to the feeding component via the first transfer component specifically includes: driving the turntable back to the material picking station, and driving the turntable to rotate horizontally via a rotation drive component so that the placement direction of the bonded light guide plate corresponds to the feeding component; picking up the bonded work on the turntable via the second vacuum nozzle of the first transfer component, and transferring it to the support plate of the feeding component.

[0016] The beneficial effects of this invention are as follows: This invention features a compact structure. By integrating multiple previously separate processes, such as light guide plate loading, adhesive application, film loading and unloading, lamination, and finished product unloading, into the working area of ​​a single machine, it eliminates the manual transfer and repetitive positioning between multiple machines in the traditional model. This not only significantly reduces manual intervention and labor intensity but also avoids the cumulative errors caused by multiple positioning, fundamentally improving the stability of production cycle and overall operational efficiency.

[0017] This invention also has the following advantages: In the material positioning stage, this invention uses a lifting cylinder in conjunction with a high-precision laser sensor to achieve real-time detection and compensation of the stacking height of the light guide plate and the light uniform film, ensuring that the starting position of each material pick-up is accurate and consistent. In the adhesive application process, a linear module drives the adhesive application head, combined with a shearing mechanism, which can ensure that the adhesive application position, length and smoothing pressure of the tape on each light guide plate are uniform, effectively avoiding problems such as bubbles and glue overflow caused by uneven adhesive application or manual cutting, laying the foundation for high-quality bonding in the future.

[0018] The second transfer component of this invention has multiple workstations and is equipped with a turntable. This turntable serves as a carrier, sequentially passing through the material handling, adhesive application, and bonding workstations. Specifically, after bonding, the turntable can rotate at a specific angle, allowing the finished product to be moved out in a preset optimal direction, facilitating subsequent stacking and unloading. This design enables each process module to work collaboratively while operating relatively independently, shortening material waiting time, optimizing internal logistics, and enhancing the continuity of the production process.

[0019] This invention uses a laser sensor to detect the stacking height of finished products and controls the lowering of the support plate to connect with the conveyor line, realizing automatic batch unloading without the need for manual supervision and judgment, further improving the automation level of the entire line and ensuring the smooth operation of continuous production. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0021] Figure 2 for Figure 1 A schematic diagram of the structure after the cover is removed.

[0022] Figure 3 This is a schematic diagram of the structure of the light guide plate hopper assembly of the present invention.

[0023] Figure 4 This is a schematic diagram of the structure of the first transfer component of the present invention.

[0024] Figure 5 This is a schematic diagram of the structure of the second transfer component of the present invention.

[0025] Figure 6 This is a schematic diagram of the bonding component of the present invention.

[0026] Figure 7 This is a schematic diagram of the bonding component of the present invention from another perspective.

[0027] Figure 8 This is a schematic diagram of the structure of the uniform light film hopper assembly of the present invention.

[0028] Figure 9 This is a schematic diagram of the feeding assembly of the present invention.

[0029] The components are as follows: 100, support assembly; 200, light guide plate hopper assembly; 300, first transfer assembly; 400, second transfer assembly; 500, bonding assembly; 600, light homogenizing film hopper assembly; 700, feeding assembly; 800, conveyor belt. 110. Frame; 120. Housing; 210. Enclosure; 220. Limiting rod; 230. First hopper bottom plate; 240. First lifting cylinder; 250. Light guide plate; 260. First sensor assembly plate; 270. First laser sensor; 310. First linear module; 320. First connecting plate; 330. Second linear module; 340. First vacuum nozzle; 350. Third linear module; 360. Second vacuum nozzle; 410. Fourth linear module; 420. Second connecting plate; 430. Rotary drive component; 440. Turntable; 510. Adhesive application unit; 520. Pressing unit; 511. Fifth linear module; 512. Adhesive tape; 513. Adhesive tape turntable; 514. Sixth linear module; 515. Shearing blade; 516. Blade pusher cylinder; 521. Seventh linear module; 522. Third connecting plate; 523. Eighth linear module; 524. Third vacuum nozzle; 610. Light-diffusing film base plate; 620. Baffle plate; 630. Second lifting cylinder; 640. Second sensor assembly plate; 650. Second laser sensor; 710, Support plate; 720, Cylinder mounting plate; 730, Third lifting cylinder; 740, Third laser sensor. Detailed Implementation

[0030] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the description of the present invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0032] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0033] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0034] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0035] See Figures 1 to 9 This invention provides a bonding device, which is integrally integrated onto a support assembly 100. The support assembly 100 includes a frame 110, which is typically welded from aluminum profiles or steel structures, providing a stable foundation for the entire device. Above the frame 110, a cover 120 is installed in the vertical direction (i.e., perpendicular to the ground). The cover 120 can be made of sheet metal or other materials, and its interior forms a closed or semi-closed working area to prevent dust contamination and ensure operational safety.

[0036] Within this working area, the length direction of rack 110 is defined (i.e. Figure 1 The first horizontal direction (X direction) is the left-right direction, and the width direction of the frame 110 (i.e., the width direction) is the first horizontal direction. Figure 1 The front-to-back direction is the second horizontal direction (Y direction).

[0037] First, at one end of the work area (e.g.) Figure 1 On the left side, there is a light guide plate hopper assembly 200. This assembly is mainly used for batch storage of light guide plates 250 to be processed.

[0038] Specifically, the light guide plate hopper assembly 200 includes a square enclosure 210 formed by four plates. Inside the enclosure 210, a first hopper base plate 230 is placed horizontally, and multiple light guide plates 250 are stacked on the first hopper base plate 230. To accurately position the stacked light guide plates 250 and prevent them from shifting, multiple vertically extending limiting rods 220 are provided on the inner side of the enclosure 210 and around the circumference of the light guide plates 250. At the bottom center of the first hopper base plate 230, the output end of a first lifting cylinder 240 is connected. The first lifting cylinder 240 is fixed to the frame 110, and its extension and retraction can drive the first hopper base plate 230 and the light guide plates 250 thereon to move up and down in the height direction. On one outer wall of the enclosure 210, a first sensor mounting plate 260 is vertically fixed by bolts, and a first laser sensor 270 is mounted on the top of the mounting plate. The emitting end of the first laser sensor 270 is horizontally oriented towards the inside of the enclosure 210, and its optical path is directly opposite the side edge of the light guide plate 250. It is used to detect in real time whether the uppermost light guide plate 250 has risen to the preset material picking height position.

[0039] On one side of the light guide plate hopper assembly 200 along the first horizontal direction (e.g.) Figure 1 On its right side, a first transfer assembly 300 is provided. The first transfer assembly 300 is used to perform two actions: picking up material from the hopper and discharging material to the feeding station. Its core structure includes a first linear module 310 extending along a first horizontal direction (X direction) and fixed to the frame 110. A vertical first connecting plate 320 is bolted to the sliding block of the first linear module 310. On the side of the first connecting plate 320 near the light guide plate hopper assembly 200 (i.e. Figure 4 On the left side), a second linear module 330 extending in the height direction (Z direction) is installed, and a first vacuum nozzle 340 is mounted on the sliding block of the second linear module 330. On the other side of the first connecting plate 320 away from the light guide plate hopper assembly 200 (i.e. Figure 4On the right side, a third linear module 350 extending in the height direction is installed, and a second vacuum nozzle 360 ​​is mounted on the sliding block of the third linear module 350. Both the first vacuum nozzle 340 and the second vacuum nozzle 360 ​​are connected to an external vacuum generator via air pipes.

[0040] On one side of the first transfer assembly 300 along the second horizontal direction (Y direction) (e.g.) Figure 1 A second transfer assembly 400 is provided at the front of the first transfer assembly 300. The second transfer assembly 400 is used to carry the light guide plate 250 and transfer it between multiple workstations. It includes a fourth linear module 410 extending along the second horizontal direction (Y direction) and fixed to the frame 110. A second connecting plate 420 is fixed on the sliding block of the fourth linear module 410. A rotary drive 430 is mounted on the second connecting plate 420. The rotary drive 430 can be a servo motor with a reducer or a rotary cylinder. The output shaft of the rotary drive 430 is vertically upward, and a disc-shaped turntable 440 is fixedly mounted on it. The turntable 440 is used to carry a single piece of light guide plate 250. Driven by the fourth linear module 410, the turntable 440 can move between three workstations: the material picking station near the first transfer assembly 300, the middle adhesive application station in the middle, and the bonding station at the far end.

[0041] A bonding assembly 500 is positioned above the second transfer assembly 400. The bonding assembly 500 includes a gantry frame made of profiles, which spans and is fixed to the frame 110. Two functional units are arranged on the crossbeams of the gantry frame in a second horizontal direction. An adhesive application unit 510 is installed on the side closer to the first transfer assembly 300 (i.e., the rear side in the Y direction), and a pressing unit 520 is installed on the side farther from the first transfer assembly 300 (i.e., the front side in the Y direction). The adhesive application unit 510 faces the central adhesive application station of the turntable 440, and the pressing unit 520 faces the bonding station of the turntable 440.

[0042] The specific structure of the adhesive application unit 510 is as follows: A fifth linear module 511 is mounted on the crossbeam of the gantry along the first horizontal direction (X direction). A sixth linear module 514 is mounted on the sliding block of the fifth linear module 511, and the extension direction of the sixth linear module 514 is the height direction (Z direction). An adhesive applicator is mounted on the sliding block of the sixth linear module 514. The adhesive applicator includes a rotatable tape turntable 513 on which double-sided tape 512 is wound. On the side of the tape turntable 513, there is a shearing blade 515, the sharp edge of which faces the position of the tape 512 to be cut. The tail of the shearing blade 515 is connected to the piston rod of a blade push cylinder 516. The cylinder body of the blade push cylinder 516 is fixed, and its extension and retraction can push the shearing blade 515 forward or backward to complete the shearing action.

[0043] The specific structure of the pressing unit 520 is as follows: A seventh linear module 521 is mounted on the crossbeam of the gantry along the first horizontal direction (X direction). A third connecting plate 522 is bolted to the sliding block of the seventh linear module 521. An eighth linear module 523 extending in the vertical direction (Z direction) is mounted on the third connecting plate 522. A third vacuum nozzle 524 is mounted on the sliding block of the eighth linear module 523 for sucking up the homogenizing film.

[0044] On one side of the pressing unit 520 along the first horizontal direction (e.g.) Figure 1 On its right side, a light-diffusing film hopper assembly 600 is provided. Its structure is similar to that of the light guide plate hopper assembly 200, including a light-diffusing film base plate 610 for supporting stacked light-diffusing films. Multiple baffles 620 are vertically arranged around the circumference of the light-diffusing film base plate 610 for limiting movement. The output end of a second lifting cylinder 630 is connected to the bottom center of the light-diffusing film base plate 610. A second sensor mounting plate 640 is installed on top of one of the baffles 620, and a second laser sensor 650 is mounted on the plate to detect whether the uppermost light-diffusing film has reached a preset absorption height.

[0045] At the end of the working area, on the side of the first transfer assembly 300 away from the light guide plate hopper assembly 200 along the first horizontal direction (e.g.) Figure 1On the right side, a conveyor belt 800 is installed. The top surface of the conveyor belt 800 is slightly lower than the top surface of the turntable 440, and its running direction is the first horizontal direction, used to send the finished products that have been bonded out of the working area. Above the starting end of the conveyor belt 800, there is a feeding assembly 700. The feeding assembly 700 includes two support plates 710 located on both sides of the conveyor belt 800. The initial position of the support plates 710 is higher than the top surface of the conveyor belt 800, used to receive and temporarily stack the finished products transferred from the turntable 440. The bottom of each support plate 710 is connected to the piston rod of a third lifting cylinder 730, and the cylinder body of the third lifting cylinder 730 is fixed to the frame 110 by a cylinder mounting plate 720. On the side of one of the support plates 710, a third laser sensor 740 is installed, whose optical path passes horizontally through the space between the two support plates 710, used to detect the height of the stacked finished products.

[0046] The working method of the bonding device, i.e. the bonding method, includes the following steps: Step 1: Loading. The operator places a stack of light guide plates 250 into the enclosure 210 of the light guide plate hopper assembly 200. The light guide plates 250 are circumferentially restricted by the limiting rods 220. The device is activated; the first lifting cylinder 240 pushes the first hopper bottom plate 230 upwards until the uppermost light guide plate 250 reaches the picking height, where its side is detected by the first laser sensor 270, at which point the first lifting cylinder 240 stops. Step 2: The light guide plate is transferred to the turntable. The first linear module 310 drives the first connecting plate 320 to move, positioning the first vacuum nozzle 340 above the hopper. Next, the second linear module 330 drives the first vacuum nozzle 340 to descend, adsorbing the uppermost light guide plate 250 before rising. Then, the first linear module 310 drives the first vacuum nozzle 340 to move above the turntable 440 (at this time, the turntable 440 is located at the material handling station). The second linear module 330 again drives the first vacuum nozzle 340 to descend, placing the light guide plate 250 on the turntable 440. The first vacuum nozzle 340 breaks the vacuum, releasing the light guide plate 250 before resetting. Step 3: Applying adhesive. The fourth linear module 410 drives the turntable 440 carrying the light guide plate 250 to move along the second horizontal direction to the middle adhesive application station. The adhesive application unit 510 is activated: the sixth linear module 514 drives the tape turntable 513 to descend, so that the end of the tape 512 contacts the preset position on the surface of the light guide plate; then the fifth linear module 511 drives the tape turntable 513 to move a distance along the first horizontal direction, and flatly pastes the tape 512 onto the light guide plate 250; after pasting, the blade push cylinder 516 pushes the cutting blade 515 forward to cut the tape 512, and then all components are reset. Step 4: Film preparation and suction. The fourth linear module 410 drives the turntable 440 to continue moving along the second horizontal direction to the bonding station. Simultaneously, the second lifting cylinder 630 in the homogenizing film hopper assembly 600 lifts the homogenizing film base plate 610 until the uppermost homogenizing film is detected by the second laser sensor 650, reaching the preparatory position. The pressing unit 520 is activated: the seventh linear module 521 and the eighth linear module 523 work together to drive the third vacuum nozzle 524 to move above the homogenizing film at the preparatory position. The eighth linear module 523 drives the third vacuum nozzle 524 to descend and absorb the homogenizing film, then lifts it up. Step 5: Lamination. The seventh linear module 521 drives the third vacuum nozzle 524, which holds the light-diffusing film, to move horizontally to directly above the light guide plate 250 at the lamination station. Next, the eighth linear module 523 drives the third vacuum nozzle 524 to descend, precisely pressing the light-diffusing film onto the surface of the light guide plate 250, which already has adhesive tape applied, completing the lamination process. After releasing the light-diffusing film by breaking the vacuum, the third vacuum nozzle 524 rises and resets. Step Six: Finished Product Removal. After bonding, the fourth linear module 410 drives the turntable 440 to return the finished product to the picking station. The rotation drive 430 drives the turntable 440 to rotate horizontally by 90 degrees (or other required angle) so that the placement direction of the finished product matches the direction of the support plate 710 of the feeding assembly 700. Next, the second vacuum nozzle 360 ​​of the first transfer assembly 300, driven by the first linear module 310 and the third linear module 350, moves above the turntable 440, picks up the finished product, and then transfers and places it on the two support plates 710 of the feeding assembly 700.

[0047] Step Seven: Unloading. Finished products are stacked one by one on the support plate 710. When the stack height reaches the preset value, the top layer of finished products will block the optical path of the third laser sensor 740. The sensor signal triggers, and the two third lifting cylinders 730 retract synchronously, driving the two support plates 710 to descend until the bottom surface of the stacked finished products contacts the top surface of the conveyor belt 800. Subsequently, the conveyor belt 800 starts, transporting the entire stack of finished products out of the working area and into the next process or receiving area. The support plate 710 is then driven by the third lifting cylinder 730 to rise to the initial high position, waiting to receive the next batch of finished products.

[0048] This completes one work cycle, and the device can automatically begin the next cycle.

[0049] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The embodiments described above are merely illustrative of implementation methods of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A bonding device, characterized in that, It includes a support assembly (100), a frame (110), and a cover (120) disposed above the frame (110) in the height direction, with a working area formed inside the cover (120); The working area includes: Light guide plate hopper assembly (200) for holding light guide plate (250); A first transfer assembly (300) is disposed on one side of the light guide plate hopper assembly (200) and extends along a first horizontal direction for transferring the light guide plate (250) from the light guide plate hopper assembly (200); The second transfer assembly (400) extends along the second horizontal direction and is disposed on one side of the first transfer assembly (300). The second transfer assembly (400) includes a turntable (440) movable along the second horizontal direction. The turntable (440) has a material picking station, an intermediate adhesive application station, and a bonding station. The bonding assembly (500) includes a gantry for assembly, an adhesive application unit (510) located in a second horizontal direction near the first transfer assembly (300), and a pressing unit (520) located away from the first transfer assembly (300), the adhesive application unit (510) being disposed corresponding to the intermediate adhesive application station, and the pressing unit (520) being disposed corresponding to the bonding station; The homogenization film hopper assembly (600) is located on one side of the pressing unit (520) in the first horizontal direction and is used to hold the homogenization film; A conveyor belt (800), disposed on the side of the first transfer assembly (300) away from the light guide plate hopper assembly (200) in a first horizontal direction, is used to transport the bonded workpiece out of the working area; and A feeding assembly (700) is disposed on the conveyor belt (800) for receiving and transferring the bonded workpieces to the conveyor belt (800); The first horizontal direction is the length direction based on the frame (110), and the second horizontal direction is the width direction based on the frame (110).

2. The bonding device according to claim 1, characterized in that, The light guide plate hopper assembly (200) includes a enclosure (210) and a first hopper bottom plate (230) disposed within the enclosure (210). A first lifting cylinder (240) is connected to the bottom of the first hopper bottom plate (230) in the height direction. A first sensor mounting plate (260) is disposed on one side of the enclosure (210) in the height direction. A first laser sensor (270) for detecting the position of the light guide plate (250) is disposed on the top of the first sensor mounting plate (260).

3. The bonding device according to claim 2, characterized in that, The enclosure (210) is also provided with a plurality of limiting rods (220) extending in the height direction, and the limiting rods (220) are distributed around the light guide plate (250).

4. The bonding device according to claim 1, characterized in that, The first transfer assembly (300) includes a first linear module (310) extending along a first horizontal direction, a first connecting plate (320) connected to the sliding end of the first linear module (310), a second linear module (330) extending in the height direction installed on the side of the first connecting plate (320) near the light guide plate hopper assembly (200), a first vacuum nozzle (340) connected to the sliding end of the second linear module (330); a third linear module (350) extending in the height direction installed on the side of the first connecting plate (320) away from the light guide plate hopper assembly (200), a second vacuum nozzle (360) connected to the sliding end of the third linear module (350).

5. The bonding device according to claim 1, characterized in that, The second transfer assembly (400) includes a fourth linear module (410) extending along a second horizontal direction. The sliding end of the fourth linear module (410) is connected to a second connecting plate (420). A rotary drive (430) is disposed on one side of the second connecting plate (420). The output end of the rotary drive (430) is connected to the turntable (440).

6. A bonding method, applied to the bonding apparatus according to any one of claims 1-5, characterized in that, Includes the following steps: The stacked light guide plates (250) are placed inside the light guide plate hopper assembly (200) and lifted to the material picking position; The light guide plate (250) at the picking position is picked up and transferred to the turntable (440) of the second transfer component (400) by the first transfer component (300), at which time the turntable (440) is located at the picking position; Drive the turntable (440) to move along the second horizontal direction to the middle adhesive application station, and use the adhesive application unit (510) of the bonding assembly (500) to stick the tape (512) to the set position on the surface of the light guide plate (250) and cut it. Drive the turntable (440) to move along the second horizontal direction to the bonding station, and use the pressing unit (520) of the bonding assembly (500) to pick up the light homogenizing film from the light homogenizing film hopper assembly (600) and press the light homogenizing film onto the light guide plate (250) that has been glued to complete the bonding; The completed bonding process is transferred to the feeding assembly (700) via the first transfer assembly (300); When the workpiece on the feeding assembly (700) reaches a predetermined height, the feeding assembly (700) descends, so that the bottom surface of the workpiece contacts the conveyor belt (800) and is fed out by the conveyor belt (800).

7. The bonding method according to claim 6, characterized in that, The specific steps of placing the stacked light guide plates (250) into the light guide plate hopper assembly (200) and lifting them to the material retrieval position include: lifting the first hopper bottom plate (230) by the first lifting cylinder (240) until the first laser sensor (270) detects that the uppermost light guide plate (250) is in place.

8. The bonding method according to claim 6, characterized in that, The steps of driving the turntable (440) to move along the second horizontal direction to the middle adhesive application station, and using the adhesive application unit (510) of the bonding assembly (500) to stick the tape (512) to the set position on the surface of the light guide plate (250) and cut it specifically include: The tape turntable (513) with tape (512) is driven to descend by the sixth linear module (514) so ​​that the tape (512) comes into contact with the surface of the light guide plate (250). The tape turntable (513) is driven by the fifth linear module (511) to move along the first horizontal direction, so that the tape (512) is flatly pasted on the surface of the light guide plate (250); After the tape is pasted, the cutting blade (515) is driven by the blade push cylinder (516) to cut the tape (512).

9. The bonding method according to claim 6, characterized in that, Before the step of picking up the homogenizing film from the homogenizing film hopper assembly (600) by the pressing unit (520) of the bonding assembly (500), the method further includes: lifting the homogenizing film base plate (610) by the second lifting cylinder (630) until the homogenizing film is detected by the second laser sensor (650).

10. The bonding method according to claim 6, characterized in that, The steps of transferring the completed bonding work to the feeding assembly (700) via the first transfer assembly (300) specifically include: driving the turntable (440) back to the material picking station, and driving the turntable (440) to rotate horizontally by the rotation drive (430) so that the placement direction of the bonded light guide plate corresponds to the feeding assembly (700); The bonding work is completed by the second vacuum nozzle (360) of the first transfer assembly (300) picking up the turntable (440) and transferring it to the support plate (710) of the feeding assembly (700).

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