Optical module adjusting and testing system and method

Abstract

The invention relates to an optical module adjusting and testing system and method, and belongs to the technical field of optical communication, and the system comprises an optical module adjusting and testing plate which is used for receiving and executing an adjusting and testing instruction from an adjusting and testing computer, and adjusting and testing an optical module to be adjusted from the outside under the control of the instruction of the adjusting and testing computer; the optical module adjusting and testing board specifically comprises a digital signal processing chip, an optical module interface, a central control unit, a power supply module and a serial port to USB unit. According to the invention, the use of a large number of expensive high-speed radio frequency cable connecting lines is eliminated, the adaptation scene of adjusting and testing the optical module in different working environments is widened, the adjusting and testing cost of the optical module is reduced, the testing efficiency is improved, and the testing cost is reduced. Automatic and intelligent debugging and testing of optical modules with different packaging forms in various temperature environments are realized.

Description

Technical Field

[0001] This invention belongs to the field of optical communication technology. Specifically, this invention relates to an optical module commissioning system, method, and processor-readable storage medium. Background Technology

[0002] The optical module R&D industry requires substantial R&D investment. Product development often involves the use of various high-cost equipment, instruments, meters, and other instruments. This is especially true for high-speed COB (Chip on Board) optical modules. On the one hand, manufacturers must purchase expensive, high-precision placement machines, wire bonding machines, optical coupling machines, dispensing machines, plasma cleaning machines, and other optical module processing and manufacturing equipment. On the other hand, they must also purchase a large number of specialized and expensive testing instruments and supporting testing equipment, such as optical module test carriers, adjustable optical attenuators, high-speed signal generators, broadband oscilloscopes, optical clock recovery units, a considerable number of high-speed RF cables, bit error rate detectors, and multi-channel optical switchgear. The purchase of these testing instruments undoubtedly significantly increases the R&D and manufacturing costs of optical modules.

[0003] Existing testing and commissioning setups involve various instruments, meters, and high-speed RF cables, making them complex and expensive. The complex optical and electrical connections make the testing and commissioning system prone to errors. For example, testing an 800G optical module uses up to 32 high-speed electrical interface RF cables, which are not only numerous but also prone to problems. During the testing and commissioning process, issues such as reversed P and N signals on high-speed RF cables, loose high-speed connectors, or loosening of connectors due to long-term working stress can cause high-speed signal reflection and lead to errors in the system's optoelectronic performance testing. These potential system faults increase the difficulty of testing and require a high level of expertise from the testing personnel. Furthermore, the testing setup is not mobile, limiting the testing scenarios. Once the system test environment is set up, the optical module commissioning work is basically fixed in a certain location. If testing is required in high and low temperature environments, and the optoelectronic performance parameters of the optical module need to be monitored at the same time, then signal generators, bit error rate detectors, etc. need to be deployed around the temperature chamber. Moving bulky test instruments and meters brings an unfriendly experience to the testing work; the testing efficiency is low. The current optical module commissioning environment can generally only commission 1 to 2 optical modules under test, and most of the commissioning work of the optical modules is carried out serially. Only after one optical module is commissioned can the commissioning work of the next optical module be carried out, which is equivalent to increasing the testing cost.

[0004] Existing testing equipment suffers from drawbacks such as complex configuration, high cost, complex and error-prone connections, limited testing scenarios, bulky and difficult-to-move equipment, inflexible deployment in special environments such as high and low temperatures, low testing efficiency, and support for simultaneous testing of only 1-2 modules. Existing optical module commissioning devices require highly skilled production and commissioning technicians, and the immobility of the equipment significantly limits the application scenarios of current optical module testing, reducing the efficiency of optical module production and testing. Currently, there is a lack of small, flexible testing equipment capable of simultaneously monitoring optical module performance in real time for batch testing of optical modules, hindering the improvement of testing efficiency and thus increasing optical module production capacity. Summary of the Invention

[0005] To address the shortcomings of existing testing methods, this invention proposes a miniaturized optical module commissioning system that eliminates the need for numerous expensive high-speed RF cables, broadens the adaptability of optical module commissioning in different working environments, reduces commissioning costs, improves testing efficiency, and achieves automated and intelligent commissioning.

[0006] In a first aspect, the present invention provides an optical module tuning system, comprising:

[0007] The optical module debugging board is used to receive and execute debugging instructions from the debugging computer, and to debug the external optical module to be debugged under the control of the debugging computer instructions;

[0008] The optical module tuning board specifically includes:

[0009] The digital signal processing chip is electrically connected to A optical module interfaces via onboard high-speed signal lines. It is used as an electrical digital signal transmitter to send a preset code high-speed signal to an external optical module under test via the optical module interface, or as an electrical digital signal receiver to receive signals sent from an external optical module under test.

[0010] An optical module interface is provided for plugging in an external optical module to be adjusted; the optical module interface includes a high-speed electrical connector, which is electrically connected to the digital signal processing chip and the central control unit respectively through onboard high-speed signal lines, and can plug in an external optical module to be adjusted.

[0011] The central control unit is electrically connected to the digital signal processing chip and the A optical module interfaces. It is used to communicate with the digital signal processing chip via data and to communicate with the internal MCU of the external optical module under test via I2C, so as to adjust the equalization parameters or operating parameters of the optical module through the internal MCU of the optical module, or to extract the operating parameters of the optical module.

[0012] The power module includes a power terminal, a power supply circuit, and surge and reverse protection circuits, used to supply power to the digital signal processing chip, the central control unit, A optical module interfaces, and the serial-to-USB unit.

[0013] The serial-to-USB unit is used to convert the internal serial bus of the optical module debugging board into an external USB direct connection port, which is connected to the USB interface of the debugging computer via a USB data cable.

[0014] Furthermore, it also includes:

[0015] The testing computer, connected to the optical module testing board via a USB data cable, is used to test and adjust external optical modules under test through the testing board, including electrical interface debugging, optical interface debugging, and receiver debugging.

[0016] Electrical interface debugging includes: sending PRBS test signals to the optical module, adjusting the optical module equalization parameters by optimizing the bit error rate, and saving the optical module host-side equalization parameters.

[0017] Optical interface debugging includes: connecting an eye diagram meter via a 2dB fixed attenuator, adjusting the parameters of the optical module driver chip and optical engine, and saving the Line-side parameters of the optical module;

[0018] Receiver debugging includes: optical module optical interface loopback test, adjustment of optical module transimpedance amplifier parameters, and optimization of receive bit error rate.

[0019] Furthermore, the preset code pattern high-speed signal includes high-speed signals with different code patterns;

[0020] The digital signal processing chip is a multi-core parallel digital signal processing chip with built-in FIR filters and FFT modules;

[0021] The digital signal processing chip has real-time analysis capabilities for time-domain and frequency-domain parameters, with a signal processing delay of ≤1μs;

[0022] The digital signal processing chip has a built-in storage module, which is used to record the adjustment data of the optical module;

[0023] The high-speed electrical connector is a replaceable high-speed connector.

[0024] Furthermore, the digital signal processing chip has a built-in machine learning inference module that can handle faults during the commissioning of the optical module under test. The machine learning inference module is a fault diagnosis model built by training on massive amounts of commissioning data. During the commissioning process, it can automatically identify the fault type when abnormal parameters are detected.

[0025] Furthermore, the central control unit can read the optical module's power supply voltage, optical power, laser bias current or temperature, signal bit error rate and bit error block information, and optical module power configuration information. It can also perform power-on / off sequence control, power-off control, optical module internal ADC / DAC debugging, optical module internal oDSP equalization parameter configuration, and various loopback function configurations of the optical module. In addition, it can configure the full temperature parameter table and calibrate and standardize the laser bias current, optical module input, and output average optical power parameters.

[0026] Furthermore, the testing computer adjusts the module parameters of the external optical module to be tested by sending optical module parameter adjustment instructions to the optical module testing board;

[0027] The testing computer provides a user interface for displaying, adjusting, and saving test data.

[0028] Furthermore, the testing computer has the function of receiving and adjusting eye diagrams, optical power, wavelength, bit error rate, temperature and current parameters from the optical module testing board; by collecting bit error rate, optical power, wavelength, bit error rate, temperature and current parameters in real time, a parameter coupling model is established to achieve multi-parameter collaborative optimization and complete the automated testing of the optical module under test.

[0029] Furthermore, the value of A can be 1, 2, 3, 4, 5, 6, 7 or 8.

[0030] A second aspect of the present invention provides an optical module commissioning method, applied to the optical module commissioning system described in the first aspect of the present invention, comprising the following steps:

[0031] S1, connect the external optical module to be tested to the optical module interface of the optical module testing board, and connect the optical module testing board to the testing computer;

[0032] S2, the digital signal processing chip sends a PRBS signal of a specific code for optical module testing to the electrical interface of the optical module under test, and receives the electrical signal fed back from the electrical interface of the optical module under test.

[0033] S3, send a loopback command to the optical module under test to cause the high-speed electrical signal inside the optical module under test to loop back;

[0034] S4, the testing computer reads the bit error rate from the digital signal processing chip, instructs the central control unit to adjust the equalization parameters of the internal electrical interface of the optical module under test in the direction of reducing the bit error rate, until the bit error rate meets the bit error rate threshold requirement, and saves the equalization parameters of the optical module host side.

[0035] S5 sends a pass-through command to the optical module under test to enable the electrical signal of the optical module under test to be directly connected to the optical engine, and connects the optical interface of the optical module to the eye diagram meter through an optical fiber patch cord and a 2dB fixed optical attenuator.

[0036] S6, the command control unit adjusts the optical interface parameters of the optical module, including: Line-side electrical interface equalization parameters, driver chip bandwidth parameters, gain parameters, optical engine operating current, and modulation current parameters, until the optical interface parameters of the optical module displayed on the eye diagram meet the standard threshold for optical signal transmission of the optical module.

[0037] S7, save the equalization parameters of the transmitter on the Line side of the optical module and the operating parameters of the driver chip, and complete the initial adjustment of the operating parameters of the transmitter of the optical module under test;

[0038] S8, use optical fiber to loop back the optical interface side of the optical module under test through a 2dB fixed optical attenuator;

[0039] S9, the testing computer extracts the bit error rate of the digital signal processing chip receiver and adjusts the transimpedance amplifier gain, bandwidth and equalization parameters of the Line side receiver of the optical module under test in the direction of reducing the bit error rate until the bit error rate of the receiver cannot be reduced and reaches the lowest value, thus completing the initial adjustment of the working parameters of the optical module under test receiver.

[0040] S10, Repeat the above steps by placing the optical module under test in high temperature, normal temperature and low temperature environments to obtain the working parameters of the optical module under test under different ambient temperatures, and obtain the working parameter table of the optical module under test in the full temperature range.

[0041] S11, save the operating parameter table of the optical module under test in the full temperature range to the integrated software inside the optical module, and complete the adjustment and testing of the operating parameters of the optical module under test.

[0042] In a third aspect, the present invention provides a processor-readable storage medium storing a computer program, wherein the processor executes the computer program to implement the optical module commissioning method as described in the second aspect of the present invention.

[0043] The advantages of this invention compared to the prior art are:

[0044] Compared with existing testing devices, the present invention reduces the cost by more than 90%, eliminating the need for expensive high-frequency cables, high-speed signal generators and receiving instruments, high-speed bit error detection instruments, adjustable optical attenuators and other equipment.

[0045] This invention features a highly integrated, miniaturized testing board that integrates a multi-core digital signal processing chip, supports 16-channel high-speed parallel signal processing, and has a signal processing delay of ≤1μs, meeting the real-time testing requirements of high-bandwidth modules.

[0046] This invention has multi-functional testing capabilities, simultaneously testing the performance of the electrical and optical interfaces of optical modules, supporting testing in both normal service flow and loopback directions, and enabling rapid fault location and performance optimization.

[0047] This invention has broad environmental adaptability. The miniaturized test system can be used in a wide range of scenarios and supports long-term reliability testing of monitoring optical modules in various harsh environments such as high temperature, low temperature, temperature cycling, and dual 85 (85℃ / 85% humidity), which greatly expands the test scenarios.

[0048] This invention features multi-package compatibility, adapting optical modules of different package types through replaceable high-speed connectors (such as QSFP, QSFP-DD, OSFP, etc.), without requiring modification of the host computer software, making maintenance and upgrades convenient.

[0049] This invention achieves automated and intelligent commissioning and testing, with a built-in machine learning inference engine that automatically diagnoses faults (such as laser aging, fiber coupling misalignment, etc.) with a diagnostic accuracy of >95%; it also supports integration with MES systems to achieve full lifecycle quality traceability.

[0050] This invention features a distributed parallel commissioning architecture that supports simultaneous commissioning of 4 to 8 optical modules, improving efficiency to 4 to 8 times that of traditional serial commissioning, thus solving the efficiency bottleneck in mass production.

[0051] This invention achieves parameter collaborative optimization by collecting multi-dimensional parameters such as bit error rate, optical power, and wavelength in real time, establishing a coupling model, and realizing real-time dynamic feedback adjustment of the operating point parameters of the optical module.

[0052] This invention significantly improves testing efficiency. Its modular design supports batch replication, simplifies the testing process, avoids manually connecting complex cables, and reduces the complexity of the testing environment. The testing board is low-cost, can be mass-produced, and can rapidly improve the testing efficiency of optical modules while avoiding the use of expensive instruments and meters, greatly reducing testing costs.

[0053] This invention simplifies the testing process, eliminating the need for additional instrument configuration. Loopback testing of electrical and optical signals can be completed through host computer software, reducing human error. Attached Figure Description

[0054] Figure 1 This is a schematic diagram of an optical module commissioning system with one optical module interface provided in an embodiment of the present invention.

[0055] Figure 2 This is a schematic diagram of an optical module commissioning system with four optical module interfaces provided in an embodiment of the present invention.

[0056] Figure 3This is a schematic flowchart of an optical module commissioning method provided in an embodiment of the present invention. Detailed Implementation

[0057] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0058] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0059] Example

[0060] This invention discloses a miniaturized single-board optical module commissioning and testing system, which eliminates the use of a large number of expensive high-speed radio frequency cables, broadens the adaptability scenarios for commissioning and testing optical modules in different working environments, reduces the commissioning and testing cost of optical modules, improves testing efficiency, and realizes automated and intelligent commissioning and testing.

[0061] System Implementation Examples

[0062] A first aspect of the present invention provides an optical module tuning and testing system, as shown in the appendix. Figure 1 As shown, it includes the optical module calibration board.

[0063] The optical module commissioning board is used to receive and execute commissioning instructions from the commissioning computer, and to commission external optical modules to be commissioned under the control of the commissioning computer instructions.

[0064] The optical module tuning board specifically includes:

[0065] (1) A digital signal processing chip is electrically connected to the A optical module interfaces via onboard high-speed signal lines. It is used as an electrical digital signal transmitter to send a preset code high-speed signal to the external optical module to be tested via the optical module interface, or as an electrical digital signal receiver to receive signals sent from the external optical module to be tested.

[0066] For example, the preset code pattern high-speed signal includes high-speed signals with different code patterns, such as PRBS, which is a random code signal. The value of A is 1, 2, 3, 4, 5, 6, 7, or 8.

[0067] Furthermore, the digital signal processing chip is a multi-core parallel digital signal processing chip with built-in FIR (Finite Impulse Response) filters and FFT (Fast Fourier Transform) modules.

[0068] Furthermore, the transmitting end of the digital signal processing chip integrates 16 high-speed DAC digital-to-analog converters; each channel transmits a maximum rate of 112Gb / s PAM4 electrical signals.

[0069] Furthermore, the receiver of the digital signal processing chip integrates an ADC analog-to-digital converter with a maximum sampling rate of 125GS / s and a resolution of 14bit, and can simultaneously acquire electrical signals from 16 channels of the optical module.

[0070] Furthermore, the digital signal processing chip has real-time analysis functions for time-domain and frequency-domain parameters such as signal eye diagram, jitter, and signal-to-noise ratio (SNR), with a signal processing delay of ≤1μs, meeting the rapid debugging requirements of high-bandwidth modules.

[0071] Furthermore, the digital signal processing chip incorporates a machine learning inference module, capable of handling faults during the commissioning of the optical module under test. This machine learning inference module is a fault diagnosis model built by training on massive amounts of commissioning data (such as the BER variation curves of each channel with temperature, calibration coefficient distribution, etc.). During commissioning, when abnormal parameters are detected (such as a sudden increase in BER of a certain channel, abnormal power attenuation, etc.), it can automatically identify the fault type (such as fiber coupling misalignment, drive circuit failure, optical interface contamination, etc.), with a diagnostic accuracy rate >95%.

[0072] Furthermore, the digital signal processing chip has a built-in storage module for recording the testing data of the optical module, which supports interface with MES (Manufacturing Execution System) to achieve quality traceability throughout the product lifecycle.

[0073] This invention utilizes a digital signal processing chip as a stable and reliable signal source, namely a signal pattern generator and bit error monitoring device, replacing traditional pattern generators and bit error detection instruments. A certain length of onboard high-speed signal trace is designed between the digital signal processing chip and the optical module under test, replacing traditional expensive high-speed RF cables, thus achieving miniaturization of the optical module commissioning equipment. The digital signal processing chip supports simultaneous communication with multiple external optical modules under test, enabling automated commissioning of multiple optical modules.

[0074] (2) Optical module interface, including a high-speed electrical connector for pluggable connection of an external optical module to be adjusted.

[0075] The high-speed electrical connector is electrically connected to the digital signal processing chip and the central control unit via onboard high-speed signal lines, and can be plugged into external optical modules to be tuned. The high-speed electrical connector is a replaceable high-speed connector, supporting various packages such as QSFP, QSFP-DD, and OSFP.

[0076] The high-speed connector in this invention can be replaced with QSFP, QSFP-DD, OSFP, or even other types of optical speed connectors. It can be adapted to the debugging of optical modules with different package types without changing the configuration of the debugging computer. It is highly adaptable and easy to maintain and upgrade.

[0077] (3) Central control unit, which is electrically connected to the digital signal processing chip and the A optical module interfaces, is used to communicate with the digital signal processing chip and to communicate with the internal MCU of the external optical module under test via I2C, so as to adjust the equalization parameters or operating parameters of the optical module through the internal MCU of the optical module, or extract the operating parameters of the optical module, such as power supply voltage, optical power, laser bias current or temperature, signal bit error rate and bit error block, optical module power supply configuration, and to perform power-on and power-off sequence control, power-off control, internal ADC / DAC debugging, internal oDSP equalization parameter configuration and various loopback function configuration of the optical module, as well as to configure the full temperature parameter table, and to calibrate and standardize parameters such as laser bias current, optical module input and output average optical power.

[0078] (4) Power supply module, including power supply terminals, power supply circuit, surge protection and reverse protection circuit, used to supply power to the digital signal processing chip, central control unit, A optical module interfaces, and serial-to-USB unit. Power supply module ripple <10mV.

[0079] (6) Serial port to USB unit, used to convert the serial bus inside the optical module debugging board into an external USB direct connection port, and connect to the USB interface of the debugging computer via a USB data cable.

[0080] Furthermore, the optical module commissioning system also includes a commissioning computer;

[0081] (7) A test computer is connected to the optical module test board via a USB data cable. It is used to test the external optical module to be tested through the optical module test board, including electrical interface debugging, optical interface debugging and receiver debugging.

[0082] Electrical interface debugging includes: sending PRBS test signals to the optical module, adjusting the equalization parameters of the optical module by optimizing the bit error rate, and saving the equalization parameters of the optical module on the host side.

[0083] Optical interface debugging includes: connecting an eye diagram meter via a 2dB fixed attenuator, adjusting the parameters of the optical module driver chip and optical engine, and saving the Line-side parameters of the optical module.

[0084] Receiver debugging includes: optical module optical interface loopback test, adjustment of optical module transimpedance amplifier parameters, and optimization of receive bit error rate.

[0085] Furthermore, the testing computer adjusts the module parameters of the external optical module under test by sending optical module parameter adjustment commands to the optical module testing board.

[0086] Furthermore, the testing computer has the function of receiving and adjusting parameters such as eye diagram, optical power, wavelength, bit error rate, temperature, and current from the optical module testing board. By real-time acquisition of multi-dimensional parameters such as bit error rate, optical power, wavelength, bit error rate (BER), temperature, and current, a parameter coupling model is established to achieve multi-parameter collaborative optimization. This enables automated testing and optimization of the optical module under test, improving the efficiency of optical module testing.

[0087] Furthermore, the testing computer provides a user interface for displaying, adjusting, and saving test data.

[0088] Furthermore, when using the optical module testing system, the optical interface of the optical module under test is connected to equipment such as an eye diagram meter via an optical fiber patch cord to test relevant optical performance parameters, or connected to a fixed-length optical fiber to perform actual optical fiber transmission performance testing.

[0089] Method Implementation Examples

[0090] A second aspect of the present invention provides an optical module debugging method for the aforementioned optical module debugging system, specifically comprising the following steps:

[0091] S1, connect the external optical module to be adjusted to the optical module interface of the optical module adjustment board, and connect the optical module adjustment board to the adjustment computer.

[0092] S2, the digital signal processing chip sends a PRBS signal of a specific code pattern for optical module testing to the electrical interface of the optical module under test, and receives the electrical signal fed back from the electrical interface of the optical module under test.

[0093] S3 sends a loopback command to the optical module under test to cause the high-speed electrical signal inside the optical module under test to loop back.

[0094] S4, the testing computer reads the bit error rate from the digital signal processing chip, instructs the central control unit to adjust the equalization parameters of the internal electrical interface of the optical module under test in the direction of reducing the bit error rate, until the bit error rate meets the bit error rate threshold requirement, and saves the equalization parameters of the optical module host side.

[0095] S5 sends a pass-through command to the optical module under test to enable the electrical signal of the optical module under test to be directly connected to the optical engine, and connects the optical interface of the optical module to the eye diagram meter through an optical fiber patch cord and a 2dB fixed optical attenuator.

[0096] S6, the command control unit adjusts the optical interface parameters of the optical module, including: Line-side electrical interface equalization parameters, driver chip bandwidth parameters, gain parameters, optical engine operating current, modulation current and other parameters, until the optical interface parameters of the optical module displayed on the eye diagram meet the standard threshold for optical signal transmission of the optical module.

[0097] S7 saves the equalization parameters of the transmitter on the Line side of the optical module and the operating parameters of the driver chip, completing the initial adjustment of the operating parameters of the transmitter of the optical module under test.

[0098] S8, the optical interface side of the optical module under test is looped back using optical fiber through a 2dB fixed optical attenuator.

[0099] S9, the testing computer extracts the bit error rate of the digital signal processing chip receiver and adjusts the gain, bandwidth, and equalization parameters of the transimpedance amplifier of the optical module under test receiver and the line-side receiver of the optical module in the direction of reducing the bit error rate until the bit error rate of the receiver can no longer be reduced and reaches the minimum value, thus completing the initial adjustment of the operating parameters of the optical module under test receiver.

[0100] S10, Repeat the above steps by placing the optical module under test in different ambient temperatures such as high temperature, room temperature and low temperature to obtain the operating parameters of the optical module under test under different ambient temperatures, and obtain the operating parameter table of the optical module under test in the full temperature range.

[0101] S11, save the operating parameter table of the optical module under test in the full temperature range to the integrated software inside the optical module, and complete the adjustment and testing of the operating parameters of the optical module under test.

[0102] In a third aspect, the present invention provides a processor-readable storage medium storing a computer program, wherein the processor executes the computer program to implement the optical module commissioning method as described in the second aspect of the present invention.

[0103] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An optical module commissioning system, characterized in that, include: The optical module debugging board is used to receive and execute debugging instructions from the debugging computer, and to debug the external optical module to be debugged under the control of the debugging computer instructions; The optical module tuning board specifically includes: The digital signal processing chip is electrically connected to A optical module interfaces via onboard high-speed signal lines. It is used as an electrical digital signal transmitter to send a preset code high-speed signal to an external optical module under test via the optical module interface, or as an electrical digital signal receiver to receive signals sent from an external optical module under test. An optical module interface is provided for plugging in an external optical module to be adjusted; the optical module interface includes a high-speed electrical connector, which is electrically connected to the digital signal processing chip and the central control unit respectively through onboard high-speed signal lines, and can plug in an external optical module to be adjusted. The central control unit is electrically connected to the digital signal processing chip and the A optical module interfaces. It is used to communicate with the digital signal processing chip via data and to communicate with the internal MCU of the external optical module under test via I2C, so as to adjust the equalization parameters or operating parameters of the optical module through the internal MCU of the optical module, or to extract the operating parameters of the optical module. The power module includes a power terminal, a power supply circuit, and surge and reverse protection circuits, used to supply power to the digital signal processing chip, the central control unit, A optical module interfaces, and the serial-to-USB unit. The serial-to-USB unit is used to convert the internal serial bus of the optical module debugging board into an external USB direct connection port, which is connected to the USB interface of the debugging computer via a USB data cable.

2. The optical module tuning and testing system according to claim 1, characterized in that, Also includes: The testing computer, connected to the optical module testing board via a USB data cable, is used to test and adjust external optical modules under test through the testing board, including electrical interface debugging, optical interface debugging, and receiver debugging. Electrical interface debugging includes: sending PRBS test signals to the optical module, adjusting the optical module equalization parameters by optimizing the bit error rate, and saving the optical module host-side equalization parameters. Optical interface debugging includes: connecting an eye diagram meter via a 2dB fixed attenuator, adjusting the parameters of the optical module driver chip and optical engine, and saving the Line-side parameters of the optical module; Receiver debugging includes: optical module optical interface loopback test, adjustment of optical module transimpedance amplifier parameters, and optimization of receive bit error rate.

3. The optical module tuning and testing system according to claim 1, characterized in that: The preset code pattern high-speed signal includes high-speed signals with different code patterns; The digital signal processing chip is a multi-core parallel digital signal processing chip with built-in FIR filters and FFT modules; The digital signal processing chip has real-time analysis capabilities for time-domain and frequency-domain parameters, with a signal processing delay of ≤1μs; The digital signal processing chip has a built-in storage module, which is used to record the adjustment data of the optical module; The high-speed electrical connector is a replaceable high-speed connector.

4. The optical module tuning and testing system according to claim 1, characterized in that: The digital signal processing chip has a built-in machine learning inference module that can handle faults during the commissioning of the optical module under test. The machine learning inference module is a fault diagnosis model built by training on massive amounts of commissioning data. During the commissioning process, it can automatically identify the fault type when abnormal parameters are detected.

5. The optical module tuning and testing system according to claim 1, characterized in that: The central control unit can read the optical module's power supply voltage, optical power, laser bias current or temperature, signal bit error rate and bit error block information, and optical module power configuration information. It can also control the optical module's power-on and power-off sequence, power-off control, internal ADC / DAC debugging, internal oDSP equalization parameter configuration, and various loopback function configurations. In addition, it can configure the full temperature parameter table and calibrate and standardize the laser bias current, optical module input, and output average optical power parameters.

6. The optical module tuning and testing system according to claim 1, characterized in that: The testing computer adjusts the module parameters of the external optical module to be tested by sending optical module parameter adjustment commands to the optical module testing board. The testing computer provides a user interface for displaying, adjusting, and saving test data.

7. The optical module tuning and testing system according to claim 1, characterized in that: The testing computer has the function of receiving and adjusting eye diagram, optical power, wavelength, bit error rate, temperature and current parameters from the optical module testing board; by collecting bit error rate, optical power, wavelength, bit error rate, temperature and current parameters in real time, it establishes a parameter coupling model, realizes multi-parameter collaborative optimization, and completes the automated testing of the optical module under test.

8. The optical module tuning and testing system according to claim 1, characterized in that: The value of A can be 1, 2, 3, 4, 5, 6, 7 or 8.

9. A method for adjusting and testing an optical module, applied to the optical module adjustment and testing system according to any one of claims 1 to 8, characterized in that, Includes the following steps: S1, connect the external optical module to be tested to the optical module interface of the optical module testing board, and connect the optical module testing board to the testing computer; S2, the digital signal processing chip sends a PRBS signal of a specific code for optical module testing to the electrical interface of the optical module under test, and receives the electrical signal fed back from the electrical interface of the optical module under test. S3, send a loopback command to the optical module under test to cause the high-speed electrical signal inside the optical module under test to loop back; S4, the testing computer reads the bit error rate from the digital signal processing chip, instructs the central control unit to adjust the equalization parameters of the internal electrical interface of the optical module under test in the direction of reducing the bit error rate, until the bit error rate meets the bit error rate threshold requirement, and saves the equalization parameters of the optical module host side. S5 sends a pass-through command to the optical module under test to enable the electrical signal of the optical module under test to be directly connected to the optical engine, and connects the optical interface of the optical module to the eye diagram meter through an optical fiber patch cord and a 2dB fixed optical attenuator. S6, the command control unit adjusts the optical interface parameters of the optical module, including: Line-side electrical interface equalization parameters, driver chip bandwidth parameters, gain parameters, optical engine operating current, and modulation current parameters, until the optical interface parameters of the optical module displayed on the eye diagram meet the standard threshold for optical signal transmission of the optical module. S7, save the equalization parameters of the transmitter on the Line side of the optical module and the operating parameters of the driver chip, and complete the initial adjustment of the operating parameters of the transmitter of the optical module under test; S8, use optical fiber to loop back the optical interface side of the optical module under test through a 2dB fixed optical attenuator; S9, the testing computer extracts the bit error rate of the digital signal processing chip receiver and adjusts the transimpedance amplifier gain, bandwidth and equalization parameters of the Line side receiver of the optical module under test in the direction of reducing the bit error rate until the bit error rate of the receiver cannot be reduced and reaches the lowest value, thus completing the initial adjustment of the working parameters of the optical module under test receiver. S10, Repeat the above steps by placing the optical module under test in high temperature, normal temperature and low temperature environments to obtain the working parameters of the optical module under test under different ambient temperatures, and obtain the working parameter table of the optical module under test in the full temperature range. S11, save the operating parameter table of the optical module under test in the full temperature range to the integrated software inside the optical module, and complete the adjustment and testing of the operating parameters of the optical module under test.

10. A processor-readable storage medium, characterized in that, The processor-readable storage medium stores a computer program, and when the processor executes the computer program, it implements the method as described in claim 9.

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