Wafer scanning equipment with accurate positioning

Abstract

The invention discloses a wafer scanning device with accurate positioning, and relates to the technical field of wafer processing, and the wafer scanning device comprises an operation table; the supporting frame is fixedly arranged on the upper surface of the operation table, a switching mechanism used for switching working states is arranged on the upper surface of the supporting frame, and by arranging the switching mechanism, the positions of the material placing mechanism, the scanning mechanism and the etching mechanism can be adjusted in the wafer processing process, and then the effects of placing and taking out the wafer and scanning the wafer are achieved; the protective cover is fixedly arranged on the upper surface of the operation table, the etching mechanism can be wrapped by the protective cover, so that the damage to operators caused by overflow of acid gas generated by an acid solution placed on the surface of the machine table during working of the machine table is prevented, the etching mechanism is used for etching wafers, and the etching efficiency is improved by arranging the etching mechanism. And the wafer can be placed, so that the effect of cleaning and monitoring the surface etching liquid after the wafer is etched is achieved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of wafer processing, in particular to a wafer scanning device with accurate positioning. BACKGROUND

[0002] Wafer etching is a key process step in semiconductor manufacturing, which is to accurately transfer the circuit pattern on the photoresist to the thin film on the wafer surface. This process directly determines the feature size and structure accuracy of integrated circuits, and has a decisive influence on the electrical performance and reliability of the device. Etching process is mainly divided into dry etching and wet etching. Dry etching uses active ions in plasma to physically bombard and chemically react with materials, which has the advantages of good anisotropy, high resolution, precise process control, etc., and is suitable for pattern transfer of nanoscale line width in advanced processes. The reaction ion etching (RIE) technology can realize excellent profile control and selectivity by adjusting the parameters such as radio frequency power, gas composition and chamber pressure. Wet etching uses chemical solution for isotropic etching, although it still has application value in some material systems (such as anisotropic etching of silicon), but due to its lateral etching effect, it has been gradually replaced by dry etching process.

[0003] The existing wafer etching equipment often relies on single static flushing or manual transfer cleaning after etching, which has problems such as uneven cleaning, residual liquid corroding the pattern, metal ion pollution, etc. In addition, there is a lack of real-time monitoring means for the surface state of the wafer during etching, which makes it difficult to control the etching precision. SUMMARY

[0004] In order to achieve the above purpose, the application is implemented by the following technical scheme: a wafer scanning device with accurate positioning, comprising an operation table; A support frame is fixedly arranged on the upper surface of the operation table, and the upper surface of the support frame is provided with a switching mechanism for switching the working state. By arranging the switching mechanism, the positions of the placing mechanism and the scanning mechanism and the etching mechanism can be adjusted during the wafer processing process, so as to realize the placing and taking out of the wafer and the scanning effect of the wafer; A protective cover is fixedly arranged on the upper surface of the operation table. By arranging the protective cover, the etching mechanism can be wrapped, so as to prevent the acid gas generated by the acid solution placed on the surface of the machine table from overflowing and causing harm to the operator during the operation of the machine table; An etching mechanism is arranged for etching the wafer. By arranging the etching mechanism, the wafer can be placed, and when the wafer needs to be etched, the wafer is clamped and immersed in the etching liquid, and after the wafer etching is completed, the wafer is separated from the etching liquid and the etching liquid in the inner cavity is discharged; The placing mechanism is used for transferring the wafer. By arranging the placing mechanism, the wafer can be adsorbed and placed into the inner cavity of the etching mechanism during the wafer operation, and the wafer etched by the etching mechanism can be removed from the etching mechanism. The scanning mechanism is used for scanning the wafer after etching. By arranging the scanning mechanism, the wafer surface can be scanned during the etching of the wafer by the etching mechanism, and the etching liquid can be continuously added into the etching mechanism under control, and the wafer surface can be washed after the wafer etching is completed. The etching mechanism comprises an etching box, a sliding frame is arranged through the outer surface of the etching box, a placing frame is riveted at one end of the inner cavity of the etching box, a soft pad is arranged at the inner wall of the placing frame, a sliding sleeve is slidably connected to one end of the outer surface of the etching box, and a baffle is arranged on the outer surface of the sliding sleeve. The baffle is used to block the track groove arranged on the outer surface of the etching box. By arranging the etching box, the etching liquid required for wafer etching can be stored and placed. The outer surface of the etching box is provided with a track groove. By arranging the sliding frame, the sliding frame can drive the placing frame to move in the inner cavity of the etching box under control. By arranging the sliding sleeve, the baffle can move on the outer surface of the sliding frame.

[0005] Preferably, the protective cover is arranged on the outer surface of the switching mechanism, the outer surface of the protective cover is provided with a glass plate for observing the state of the etching mechanism, and the outer surface of the protective cover is provided with a door plate.

[0006] Preferably, the etching mechanism further comprises a fixing frame riveted to the upper surface of the supporting frame, a heightening frame riveted to the upper surface of the fixing frame, the etching box welded to the upper surface of the heightening frame, a connecting frame welded to the outer surface of the etching box, a hydraulic cylinder welded to the end of the connecting frame, the hydraulic cylinder being arranged obliquely, an extrusion rod arranged at the output end of the hydraulic cylinder, the end of the extrusion rod being welded to the end of the sliding frame away from the placing frame, an extrusion block welded to the end of the sliding frame away from the placing frame, a first spring welded to the side of the extrusion block close to the baffle, and the end of the first spring away from the extrusion block being welded to the outer surface of the sliding sleeve.

[0007] Preferably, the lower surface of the placing frame is welded with a moving sleeve, the inner cavity of the moving sleeve is slidably connected with a limiting frame, the end of the limiting frame away from the placing frame is welded with a connecting column, the bottom end of the connecting column is welded with a plugging disc, the plugging disc is extruded and matched with the bottom of the inner wall of the etching box, a plurality of water permeable holes are arranged on the surface of the plugging disc, the bottom of the inner wall of the etching box is welded with a water permeable plate, the upper surface of the water permeable plate is welded with a plugging column, and the plugging column is aligned with the water permeable holes arranged on the surface of the plugging disc.

[0008] Preferably, the lower surface of the etching box is welded with a discharge box, the lower surface of the blocking disc is welded with a second spring, the bottom end of the second spring is welded on the bottom of the inner wall of the discharge box, the outer surface of the discharge box is penetrated with a discharge pipe, and the etching mechanism further comprises a collection box, the collection box is welded on the upper surface of the support frame, and the collection box is located directly below the discharge pipe.

[0009] Preferably, the switching mechanism comprises a ball screw device, the ball screw device is arranged on the upper surface of the support frame, the movable end of the ball screw device is provided with a first sliding plate, the upper surface of the first sliding plate is riveted with a first connecting rod, the end of the first connecting rod away from the first sliding plate is welded with a fixed frame, the end of the fixed frame away from the first connecting rod is welded with a second connecting rod, the end of the second connecting rod is welded with a second sliding plate, and the second sliding plate is slidably connected to the outer surface of the ball screw device.

[0010] Preferably, the upper surface of the support frame is welded with a cushion plate, the top end of the cushion plate is welded with a placing frame, the placing frame is located at the inner cavity of the first connecting rod, the placing mechanism comprises a first top shell, the first top shell is welded on the inner wall of the fixed frame, the inner wall of the first top shell is welded with a ventilation disc, the inner wall of the ventilation disc is welded with an exhaust box, the inner wall of the exhaust box is provided with an exhaust fan, the bottom end of the exhaust box is fixedly connected with a gasket, and the outer surface of the exhaust box is penetrated with an exhaust pipe.

[0011] Preferably, the scanning mechanism comprises a second top shell, a third connecting rod and a fourth connecting rod, the second top shell is welded on the inner wall of the fixed frame, the third connecting rod is welded on the outer surface of the second top shell, the fourth connecting rod is welded on the outer surface of the fixed frame, the end of the third connecting rod and the fourth connecting rod is fixedly provided with a liquid outlet mechanism, the liquid outlet mechanism comprises a liquid storage tank, and two liquid storage tanks are respectively riveted on the end of the third connecting rod and the fourth connecting rod, the upper surface of the liquid storage tank is penetrated with a liquid inlet valve, the upper surface of the liquid storage tank is penetrated with a connecting pipe, the end of the connecting pipe is fixedly connected with a water pump, and the end of the water pump penetrates the second top shell.

[0012] Preferably, the top of the inner wall of the second top shell is welded with an annular water tank, the end of the water pump penetrates the annular water tank, the bottom end of the annular water tank is rotatably connected with a rotating ring, the upper surface of the rotating ring is welded with an inclined plate, the lower surface of the rotating ring is penetrated with a water outlet pipe, the lower surface of the water outlet pipe is penetrated with a water outlet, and the end of the water outlet pipe away from the annular water tank is penetrated with a rotating ring.

[0013] Preferably, the top of the inner wall of the second top shell is penetrated by a fixing cylinder, the inner wall of the fixing cylinder is provided with a camera module, the outer surface of the fixing cylinder is welded with a cooling ring, the lower surface of the cooling ring is provided with a hole, the lower surface of the cooling ring is fixedly connected with a sealing ring, and the outer surface of the cooling ring is penetrated by a water-permeable limiting ring, and the rotating ring is rotationally connected to the outer surface of the water-permeable limiting ring.

[0014] The application provides a wafer scanning device with accurate positioning. I. The wafer scanning device with accurate positioning can adjust the positions of the placing mechanism, the scanning mechanism and the etching mechanism during wafer processing, thereby achieving wafer placement and removal and wafer scanning effect.

[0015] II. The wafer scanning device with accurate positioning can place the wafer, clamp and immerse the wafer in etching liquid when etching is needed, and separate the wafer from the etching liquid and discharge the etching liquid in the inner cavity after etching is completed.

[0016] III. The wafer scanning device with accurate positioning can adsorb the wafer and place it into the inner cavity of the etching mechanism when the wafer works, and can move the wafer etched by the etching mechanism out of the etching mechanism.

[0017] IV. The wafer scanning device with accurate positioning can scan the wafer surface when the etching mechanism etches the wafer, can continuously add etching liquid to the etching mechanism under control, and can flush the wafer surface after etching is completed.

[0018] V. The wafer scanning device with accurate positioning has real-time visual monitoring and rotating spray cleaning functions, monitors the etching process through the camera module, realizes uniform coverage of etching liquid and cleaning liquid through the rotatable spray system, and realizes rapid discharge of etching liquid through the cooperation of the blocking disc and the blocking column, thereby effectively avoiding secondary corrosion and metal pollution of the wafer pattern caused by residual liquid. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is an external structure diagram of the wafer scanning device with accurate positioning. Figure 2 It is an internal structure diagram of the wafer scanning device with accurate positioning. Figure 3 It is a structure diagram of the etching mechanism. Figure 4It is a partial structure schematic view of the etching mechanism of the application; Figure 5 It is a sectional structure schematic view of the etching mechanism of the application; Figure 6 It is a structure schematic view of the switching mechanism of the application; Figure 7 It is a sectional structure schematic view of the material placing mechanism of the application; Figure 8 It is a structure schematic view of the scanning mechanism of the application; Figure 9 It is a sectional structure schematic view of the scanning mechanism of the application; Figure 10 It is a partial sectional structure schematic view of the scanning mechanism of the application.

[0020] In the figure: 1, operation table; 2, support frame; 3, protective cover; 4, glass plate; 5, door plate; 6, etching mechanism; 7, switching mechanism; 8, material placing mechanism; 9, scanning mechanism; 10, heightening plate; 11, placing frame; 61, fixing frame; 62, collecting box; 63, heightening frame; 64, etching box; 65, sliding frame; 66, placing frame; 67, connecting frame; 68, hydraulic cylinder; 69, extrusion rod; 610, extrusion block; 611, sliding sleeve; 612, baffle; 613, first spring; 614, discharging box; 615, discharging pipe; 616, moving sleeve; 617, limiting frame; 618, connecting column; 619, plugging disc; 620, water-permeable plate; 621, plugging column; 622, second spring; 71, ball screw device; 72, first sliding plate; 73, first connecting rod; 74, fixed frame; 75, second sliding plate; 76, second connecting rod; 81, first top shell; 82, air-permeable disc; 83, exhaust box; 84, exhaust fan; 85, gasket; 86, exhaust pipe; 91, second top shell; 92, third connecting rod; 93, fourth connecting rod; 94, liquid outlet mechanism; 95, annular water tank; 96, rotating ring; 97, inclined plate; 98, water outlet pipe; 99, water spraying opening; 910, rotating ring; 911, fixed cylinder; 912, camera module; 913, cooling ring; 914, water-permeable limiting ring; 915, sealing ring; 941, liquid storage tank; 942, liquid inlet valve; 943, connecting pipe; 944, water pump. DETAILED DESCRIPTION

[0021] The application will be further described below in conjunction with the drawings and specific embodiments. The embodiments of the application are given for illustration and description only, and are not intended to be exhaustive or to limit the application to the forms disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. Embodiments were chosen and described in order to best explain the principles of the application and its practical application, and to enable others skilled in the art to understand the application for various embodiments with various modifications as are suited to the particular use contemplated.

[0022] As Figure 1 - Figure 10 The application provides a technical solution: a precise positioning wafer scanning device, which comprises an operation table 1; A support frame 2 is fixedly arranged on the upper surface of the operation table 1, and the upper surface of the support frame 2 is provided with a switching mechanism 7 for switching the working state. By arranging the switching mechanism 7, the position of a placing mechanism 8 and a scanning mechanism 9 and an etching mechanism 6 can be adjusted during wafer processing, so as to realize the placing and taking out of the wafer and the scanning effect of the wafer. A protective cover 3 is fixedly arranged on the upper surface of the operation table 1. By arranging the protective cover 3, the etching mechanism 6 can be wrapped, so as to prevent the acid gas generated by the acid solution placed on the machine table from overflowing and causing harm to the operator during the operation of the machine table. The etching mechanism 6 is used for etching the wafer. By arranging the etching mechanism 6, the wafer can be placed, and when the wafer needs to be etched, the wafer is clamped and immersed in the etching solution, and after the wafer etching is completed, the wafer is separated from the etching solution and the etching solution in the inner cavity is discharged. The placing mechanism 8 is used for transferring the wafer. By arranging the placing mechanism 8, the wafer can be adsorbed and placed into the inner cavity of the etching mechanism 6 when the wafer works, and the wafer etched by the etching mechanism 6 can be moved out of the etching mechanism 6. The scanning mechanism 9 is used for scanning the wafer after etching. By arranging the scanning mechanism 9, the wafer surface can be scanned when the wafer is etched by the etching mechanism 6, and the etching solution can be continuously added to the inside of the etching mechanism 6 under control, and the wafer surface can be washed after the wafer etching is completed. The etching mechanism 6 comprises an etching box 64, a sliding frame 65 is arranged through the outer surface of the etching box 64, a placing frame 66 is riveted at one end of the inner cavity of the etching box 64, a soft pad is arranged at the inner wall of the placing frame 66, a sliding sleeve 611 is slidably connected to one end of the outer surface of the etching box 64, and a baffle 612 is arranged on the outer surface of the sliding sleeve 611. The baffle 612 is used for blocking the track groove arranged on the outer surface of the etching box 64. By arranging the etching box 64, the etching solution required for wafer etching can be stored and placed, and the outer surface of the etching box 64 is provided with a track groove. By arranging the sliding frame 65, the sliding frame 65 can drive the placing frame 66 to move in the inner cavity of the etching box 64 under control. By arranging the sliding sleeve 611, the baffle 612 can move on the outer surface of the sliding frame 65.

[0023] The protective cover 3 is sleeved on the outer surface of the switching mechanism 7, the outer surface of the protective cover 3 is provided with a glass plate 4 for observing the state of the etching mechanism 6, and the outer surface of the protective cover 3 is provided with a door plate 5. Through the glass plate 4, the etching effect of the etching mechanism 6 on the wafer can be observed, and through the door plate 5, the wafer to be etched can be conveniently placed and taken out.

[0024] The etching mechanism 6 further comprises a fixed frame 61 riveted to the upper surface of the support frame 2, the upper surface of the fixed frame 61 is riveted with a raised frame 63, the etching box 64 is welded to the upper surface of the raised frame 63, the outer surface of the etching box 64 is welded with a connecting frame 67, the end of the connecting frame 67 is welded with a hydraulic cylinder 68, the hydraulic cylinder 68 is arranged obliquely, the output end of the hydraulic cylinder 68 is provided with a pressing rod 69, the end of the pressing rod 69 is welded to one end of the sliding frame 65 away from the placing frame 66, the one end of the sliding frame 65 away from the placing frame 66 is welded with a pressing block 610, the side of the pressing block 610 close to the baffle 612 is welded with a first spring 613, the end of the first spring 613 away from the pressing block 610 is welded to the outer surface of the sliding sleeve 611, by arranging the hydraulic cylinder 68, the output end of the pressing rod 69 can move during work, and then the end of the sliding frame 65 moves, at the same time, the hydraulic cylinder 68 is arranged obliquely, so that the sliding frame 65 can immerse the wafer in the etching liquid while clamping the wafer by the placing frame 66 when moving downward, by arranging the pressing block 610 and the first spring 613, the first spring 613 can press the sliding sleeve 611 when the sliding frame 65 moves, so that the baffle 612 is always pressed with the outer surface of the etching box 64, thereby preventing the gas in the inner cavity of the etching box 64 from leaking out, the lower surface of the placing frame 66 is welded with a moving sleeve 616, the inner cavity of the moving sleeve 616 is slidably connected with a limiting frame 617, the end of the limiting frame 617 away from the placing frame 66 is welded with a connecting column 618, the bottom end of the connecting column 618 is welded with a plug disc 619, the plug disc 619 is pressed and matched with the bottom of the inner wall of the etching box 64, a plurality of water permeable holes are formed in the surface of the plug disc 619, the bottom of the inner wall of the etching box 64 is welded with a water permeable plate 620, the upper surface of the water permeable plate 620 is welded with a plug column 621, the plug column 621 is aligned with the water permeable holes formed in the surface of the plug disc 619, the plug disc 619 and the plug column 621 are linked to realize the sealing and rapid discharge of the etching liquid, and residual liquid is avoided.The mobile sleeve 616 and the limiting frame 617 are arranged, so that when the placing rack 66 moves in the inclined track, the mobile sleeve 616 moves on the outer surface of the limiting frame 617, and then the connecting column 618 is always in a horizontal plane with the placing rack 66. The plug disc 619 is arranged, so that when the plug disc 619 contacts the inner wall of the etching box 64, the etching liquid in the inner cavity of the etching box 64 is prevented from leaking out. The water permeable plate 620 and the plug column 621 are arranged, so that when the plug column 621 contacts the plug disc 619, the etching liquid is prevented from leaking out. The lower surface of the etching box 64 is welded with a discharge box 614, the lower surface of the plug disc 619 is welded with a second spring 622, the bottom end of the second spring 622 is welded on the bottom of the inner wall of the discharge box 614, the outer surface of the discharge box 614 penetrates a discharge pipe 615, and the etching mechanism 6 further comprises a collection box 62. The collection box 62 is welded on the upper surface of the support frame 2 and is located directly below the discharge pipe 615. The discharge box 614 and the discharge pipe 615 are arranged, so that when the plug disc 619 no longer blocks the bottom of the etching box 64, the etching liquid in the inner cavity of the etching box 64 can flow into the inner cavity of the discharge box 614, and finally flow into the inner cavity of the collection box 62 through the discharge pipe 615.

[0025] The switching mechanism 7 comprises a ball screw device 71, which is arranged on the upper surface of the support frame 2. The movable end of the ball screw device 71 is provided with a first sliding plate 72. The upper surface of the first sliding plate 72 is riveted with a first connecting rod 73. One end of the first connecting rod 73 away from the first sliding plate 72 is welded with a fixed frame 74. One end of the fixed frame 74 away from the first connecting rod 73 is welded with a second connecting rod 76. The end of the second connecting rod 76 is welded with a second sliding plate 75. The second sliding plate 75 is slidably connected to the outer surface of the ball screw device 71. The ball screw device 71 is arranged, so that in the working process, the first sliding plate 72 can move horizontally. The first connecting rod 73 is arranged, so that the first sliding plate 72 moves, and then the fixed frame 74 and the second sliding plate 75 move horizontally.

[0026] The upper surface of the support frame 2 is welded with a pad plate 10, the top end of the pad plate 10 is welded with a placing frame 11, the placing frame 11 is located at the inner cavity of the first connecting rod 73, the placing mechanism 8 comprises a first top shell 81, the first top shell 81 is welded at the inner wall of the fixed frame 74, the inner wall of the first top shell 81 is welded with a breathable disc 82, the inner wall of the breathable disc 82 is welded with an exhaust box 83, the inner wall of the exhaust box 83 is provided with an exhaust fan 84, the bottom end of the exhaust box 83 is fixedly connected with a gasket 85, the outer surface of the exhaust box 83 penetrates an exhaust pipe 86, by setting the placing frame 11, the wafer to be etched can be placed, by setting the exhaust fan 84, the airflow in the inner cavity of the exhaust box 83 can be discharged through the exhaust pipe 86 during work, by setting the gasket 85, when the wafer in the inner cavity of the placing frame 11 is contacted and suction is generated in the inner cavity of the exhaust box 83, the wafer is tightly adsorbed at the gasket 85 at the bottom of the exhaust box 83.

[0027] The scanning mechanism 9 comprises a second top shell 91, a third connecting rod 92 and a fourth connecting rod 93, the second top shell 91 is welded at the inner wall of the fixed frame 74, the third connecting rod 92 is welded at the outer surface of the second top shell 91, the fourth connecting rod 93 is welded at the outer surface of the fixed frame 74, the end of the third connecting rod 92 and the fourth connecting rod 93 is fixedly provided with a liquid outlet mechanism 94, the liquid outlet mechanism 94 comprises a liquid storage tank 941, and the two liquid storage tanks 941 are respectively riveted at the end of the third connecting rod 92 and the fourth connecting rod 93, the upper surface of the liquid storage tank 941 penetrates a liquid inlet valve 942, the upper surface of the liquid storage tank 941 penetrates a connecting pipe 943, the end of the connecting pipe 943 is fixedly connected with a water pump 944, the end of the water pump 944 penetrates the second top shell 91, by arranging a plurality of liquid outlet mechanisms 94, the etching liquid and the cleaning liquid can be respectively stored, by arranging the liquid inlet valve 942, the etching liquid or the cleaning liquid can be conveniently poured into the inner cavity of the liquid storage tank 941, by arranging the water pump 944, the liquid in the inner cavity of the liquid storage tank 941 can be discharged through the connecting pipe 943 during work, the top of the inner wall of the second top shell 91 is welded with an annular water tank 95, the end of the water pump 944 penetrates the annular water tank 95, the bottom end of the annular water tank 95 is rotatably connected with a rotating ring 96, the upper surface of the rotating ring 96 is welded with an inclined plate 97, the lower surface of the rotating ring 96 penetrates a water outlet pipe 98, the lower surface of the water outlet pipe 98 penetrates a water outlet 99, the end of the water outlet pipe 98 away from the annular water tank 95 penetrates a rotating ring 910, by arranging the annular water tank 95, when the water pump 944 starts to work, the liquid can flow into the inner cavity of the annular water tank 95, and the rotating ring 96 can produce stable rotation at the bottom of the annular water tank 95, by arranging the inclined plate 97, when the water flows in the inner cavity of the annular water tank 95, the inclined plate 97 can be extruded, so that the rotating ring 96 drives the water outlet pipe 98 and the water outlet 99 to rotate, and finally the liquid uniformly flows to the upper surface of the wafer, the rotating ring 96+the inclined plate 97 makes the water outlet 99 rotate and spray, realizes uniform coverage of the etching liquid / cleaning liquid, and avoids cleaning dead angle.

[0028] The top of the inner wall of the second top shell 91 is penetrated through with a fixing cylinder 911, the inner wall of the fixing cylinder 911 is provided with a camera module 912, the outer surface of the fixing cylinder 911 is welded with a cooling ring 913, the lower surface of the cooling ring 913 is provided with a hole, the lower surface of the cooling ring 913 is fixedly connected with a sealing ring 915, the outer surface of the cooling ring 913 is penetrated through with a water-permeable limiting ring 914, and the rotating ring 910 is rotationally connected to the outer surface of the water-permeable limiting ring 914. By arranging the camera module 912, the pattern on the wafer surface can be monitored during work. The camera module 912 can take pictures of the wafer surface in real time during etching, so as to realize visual monitoring of the etching process. By arranging the cooling ring 913, the heat generated by the work of the camera module 912 can be dissipated by using the flow of liquid. The cooling ring 913 cools the camera module, ensuring stable imaging for a long time. By arranging the water-permeable limiting ring 914, the liquid in the inner cavity of the rotating ring 910 can flow into the inner cavity of the cooling ring 913 through the water-permeable limiting ring 914. By arranging the sealing ring 915, the hole in the lower surface of the cooling ring 913 can be blocked, and the liquid can extrude the sealing ring 915 when the liquid flows, so that the liquid can be discharged through the hole in the lower surface of the cooling ring 913.

[0029] Working principle: in use, the operator places the wafer to be etched in the inner cavity of the placing frame 11, then controls the ball screw device 71 to make the first sliding plate 72 drive the first connecting rod 73 and the fixed frame 74 to move horizontally, finally makes the first top shell 81 located above the placing frame 11, then starts the exhaust fan 84 to make the inner cavity of the exhaust box 83 generate suction, so that the wafer is firmly sucked, then the ball screw device 71 works again and makes the first top shell 81 located above the etching box 64, then stops the exhaust fan 84, so that the wafer falls on the upper surface of the placing rack 66, then starts the hydraulic cylinder 68, and makes the extrusion rod 69 of the output end of the hydraulic cylinder 68 move obliquely downward, finally makes the placing rack 66 wrap the wafer, then starts the ball screw device 71 again, so that the second top shell 91 moves above the etching box 64, then the liquid outlet mechanism 94 filled with etching liquid is started, and the etching liquid flows into the inner cavity of the annular water tank 95. When the liquid flows, the inclined plate 97 is extruded, finally the etching liquid drives the water outlet pipe 98 and the water outlet 99 to rotate and flow into the wafer surface placed in the inner cavity of the etching box 64. The camera module 912 monitors the wafer at all times during the etching process. After the etching is completed, the output end of the hydraulic cylinder 68 is controlled to move obliquely upward, finally the blocking disc 619 no longer blocks the bottom of the etching box 64, finally the etching liquid flows out, then the liquid outlet mechanism 94 containing cleaning liquid is started, so that the cleaning liquid is sprayed out from the water outlet pipe 98 and the water outlet 99, finally the wafer is cleaned. The camera module 912 always monitors the wafer during the process. After the wafer meets the standard, the work is stopped and the wafer is taken out.

[0030] Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art and related fields without creative labor shall fall within the protection scope of the present application. The structures, devices and operation methods not specifically described and explained in the present application are implemented according to the conventional means in the art, unless specifically described and limited.

Claims

1. A wafer scanning device with precise positioning, characterized in that, include: Control panel (1); A support frame (2) is fixed on the upper surface of the operating table (1), and the upper surface of the support frame (2) is provided with a switching mechanism (7) for switching working states. A protective cover (3) is fixed to the upper surface of the operating table (1); An etching mechanism (6) is used to etch the wafer; The material placement mechanism (8) is used to transfer the wafer; A scanning mechanism (9) is used to scan the etched wafer; The etching mechanism (6) includes an etching box (64), and a sliding frame (65) runs through the outer surface of the etching box (64). A placement frame (66) is riveted to one end of the sliding frame (65) located in the inner cavity of the etching box (64). A soft pad is provided on the inner wall of the placement frame (66). A sliding sleeve (611) is slidably connected to one end of the sliding frame (65) located on the outer surface of the etching box (64). A baffle (612) is fitted on the outer surface of the sliding sleeve (611). The baffle (612) is used to block the track groove opened on the outer surface of the etching box (64).

2. The wafer scanning device with precise positioning according to claim 1, characterized in that: The protective cover (3) is fitted on the outer surface of the switching mechanism (7). A glass plate (4) is provided on the outer surface of the protective cover (3). The glass plate (4) is used to observe the status of the etching mechanism (6). A door panel (5) is provided on the outer surface of the protective cover (3).

3. The wafer scanning device with precise positioning according to claim 1, characterized in that: The etching mechanism (6) also includes a fixing frame (61), which is riveted to the upper surface of the support frame (2). A shim frame (63) is riveted to the upper surface of the fixing frame (61). The etching box (64) is welded to the upper surface of the shim frame (63). A connecting frame (67) is welded to the outer surface of the etching box (64). A hydraulic cylinder (68) is welded to the end of the connecting frame (67). The hydraulic cylinder (68) is inclined. A pressing rod (69) is provided at the output end of the hydraulic cylinder (68). The end of the pressing rod (69) is welded to the end of the sliding frame (65) away from the placement frame (66). A pressing block (610) is welded to the end of the sliding frame (65) away from the placement frame (66). A first spring (613) is welded to the side of the pressing block (610) near the baffle (612). The end of the first spring (613) away from the pressing block (610) is welded to the outer surface of the sliding sleeve (611).

4. The wafer scanning device with precise positioning according to claim 1, characterized in that: A movable sleeve (616) is welded to the lower surface of the placement rack (66). A limiting frame (617) is slidably connected to the inner cavity of the movable sleeve (616). A connecting column (618) is welded to the end of the limiting frame (617) away from the placement rack (66). A blocking plate (619) is welded to the bottom of the connecting column (618). The blocking plate (619) is squeezed and adapted to the bottom of the inner wall of the etching box (64). Several water-permeable holes are opened on the surface of the blocking plate (619). A water-permeable plate (620) is welded to the bottom of the inner wall of the etching box (64). A blocking column (621) is welded to the upper surface of the water-permeable plate (620). The blocking column (621) is aligned with the water-permeable holes opened on the surface of the blocking plate (619).

5. A wafer scanning device with precise positioning according to claim 4, characterized in that: The lower surface of the etching box (64) is welded with a discharge box (614), the lower surface of the blocking disc (619) is welded with a second spring (622), the bottom end of the second spring (622) is welded to the bottom of the inner wall of the discharge box (614), the outer surface of the discharge box (614) is penetrated by a discharge pipe (615), the etching mechanism (6) also includes a collection box (62), the collection box (62) is welded to the upper surface of the support frame (2), and the collection box (62) is located directly below the discharge pipe (615).

6. The wafer scanning device with precise positioning according to claim 1, characterized in that: The switching mechanism (7) includes a ball screw device (71), which is disposed on the upper surface of the support frame (2). The movable end of the ball screw device (71) is provided with a first sliding plate (72). A first connecting rod (73) is riveted to the upper surface of the first sliding plate (72). A fixing frame (74) is welded to the end of the first connecting rod (73) away from the first sliding plate (72). A second connecting rod (76) is welded to the end of the fixing frame (74) away from the first connecting rod (73). A second sliding plate (75) is welded to the end of the second connecting rod (76). The second sliding plate (75) is slidably connected to the outer surface of the ball screw device (71).

7. A wafer scanning device with precise positioning according to claim 6, characterized in that: The upper surface of the support frame (2) is welded with a raised plate (10), and the top of the raised plate (10) is welded with a placement frame (11). The placement frame (11) is located in the inner cavity of the first connecting rod (73). The material placement mechanism (8) includes a first top shell (81), which is welded to the inner wall of the fixed frame (74). A vent plate (82) is welded to the inner wall of the first top shell (81), and an exhaust box (83) is welded to the inner wall of the vent plate (82). An exhaust fan (84) is provided on the inner wall of the exhaust box (83). A washer (85) is fixedly connected to the bottom of the exhaust box (83), and an exhaust pipe (86) passes through the outer surface of the exhaust box (83).

8. A wafer scanning device with precise positioning according to claim 6, characterized in that: The scanning mechanism (9) includes a second top shell (91), a third connecting rod (92), and a fourth connecting rod (93). The second top shell (91) is welded to the inner wall of the fixed frame (74). The third connecting rod (92) is welded to the outer surface of the second top shell (91). The fourth connecting rod (93) is welded to the outer surface of the fixed frame (74). The ends of the third connecting rod (92) and the fourth connecting rod (93) are both fixed with a liquid outlet mechanism (94). The liquid outlet mechanism (94) includes a liquid storage tank (941). The two liquid storage tanks (941) are respectively riveted to the ends of the third connecting rod (92) and the fourth connecting rod (93). The upper surface of the liquid storage tank (941) is penetrated by a liquid inlet valve (942). The upper surface of the liquid storage tank (941) is penetrated by a connecting pipe (943). The end of the connecting pipe (943) is fixedly connected to a water pump (944). The end of the water pump (944) penetrates the second top shell (91).

9. A wafer scanning device with precise positioning according to claim 8, characterized in that: An annular water tank (95) is welded to the top of the inner wall of the second top shell (91). The end of the water pump (944) passes through the annular water tank (95). A rotating ring (96) is rotatably connected to the bottom of the annular water tank (95). An inclined plate (97) is welded to the upper surface of the rotating ring (96). The inclined plate (97) drives the rotating ring (96) to rotate when the liquid flows, so that the spray nozzle (99) can spray the wafer surface evenly. A water outlet pipe (98) passes through the lower surface of the rotating ring (96). A spray nozzle (99) passes through the lower surface of the water outlet pipe (98). A rotating ring (910) passes through the end of the water outlet pipe (98) away from the annular water tank (95).

10. A wafer scanning device with precise positioning according to claim 9, characterized in that: A fixed cylinder (911) is passed through the top of the inner wall of the second top shell (91). A camera module (912) is provided on the inner wall of the fixed cylinder (911). A cooling ring (913) is welded to the outer surface of the fixed cylinder (911). A hole is opened on the lower surface of the cooling ring (913). A sealing ring (915) is fixedly connected to the lower surface of the cooling ring (913). A water-permeable limiting ring (914) passes through the outer surface of the cooling ring (913). The rotating ring (910) is rotatably connected to the outer surface of the water-permeable limiting ring (914).

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