Wafer mapping edge finding device and wafer mapping edge finding method

Abstract

This invention belongs to the field of semiconductor processing technology and discloses a wafer mapping edge finding device and method. In this invention, a mounting stage first adsorbs and fixes the wafer. A coarse positioning camera of a vision positioning mechanism performs preliminary positioning of the wafer's standard notch or mark. A fine positioning camera performs fine alignment based on the coarse positioning result and transmits the fine positioning data to a central control mechanism for algorithmic coordination. The central control mechanism, based on the coordination result, controls a second position adjustment mechanism to drive an alignment stage, which is installed in the rack's clearance opening, to rise along the Z-axis to adsorb the wafer and rotate around the θ-axis. A first position adjustment mechanism drives a second position adjustment mechanism to move along the X and Y axes, causing the wafer adsorbed on the alignment stage to complete position calibration, ensuring that the actual center of the wafer precisely coincides with a preset reference axis. After calibration, the second position adjustment mechanism drives the alignment stage downwards away from the wafer, allowing the wafer to smoothly mount on the mounting stage and remain adsorbed and fixed, ensuring wafer alignment accuracy and edge finding accuracy.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more particularly to a wafer mapping edge finding device and a wafer mapping edge finding method. Background Technology

[0002] In precision manufacturing processes such as semiconductor manufacturing and wafer packaging and testing, the positioning accuracy of the wafer directly affects the processing quality of subsequent processes such as photolithography, bonding, and dicing, and is one of the key factors determining product yield.

[0003] Currently, existing positioning devices consist of a single vision positioning mechanism and a position adjustment mechanism. The position adjustment mechanism directly attaches to the wafer and adjusts it in the X and Y axes. The vision positioning mechanism moves up and down toward the wafer along the Z axis. This results in a large positioning error, an inability to quickly respond to wafer attitude correction commands, and often only adaptability to wafers with a single type of marking. This makes it difficult to adapt to the processing needs of wafers of different specifications, resulting in insufficient versatility and an inability to meet the requirements of high-precision processing. Furthermore, the lack of a mapping edge-finding mechanism makes it impossible to accurately record the actual outline and feature marking positions of the wafer.

[0004] Therefore, there is an urgent need for wafer mapping edge finding devices and methods to solve the above problems. Summary of the Invention

[0005] The first objective of this invention is to provide a wafer mapping edge finding device that is compatible with wafers of different specifications marked with Notch or Mark, can quickly respond to wafer orientation correction commands, improve the alignment accuracy of products, ensure that the positioning state of each wafer remains consistent when entering subsequent processes, guarantee the accuracy of mapping edge finding, and meet the requirements of high-precision processing.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] The wafer mapping edge finding device includes:

[0008] The frame is equipped with clearance openings;

[0009] The carrier component includes an alignment stage and multiple overlapping stages. The alignment stage is disposed through the recess, and the multiple overlapping stages are fixed on the frame and evenly distributed along the circumference of the recess. The overlapping stages can overlap and adsorb wafers, and the alignment stage can carry and adsorb the wafers.

[0010] The visual positioning mechanism includes a coarse positioning camera and a fine positioning camera mounted on the rack. The coarse positioning camera is configured to perform coarse alignment of the wafer with a standard Notch or Mark marking, and the fine positioning camera is configured to perform fine alignment of the wafer based on the coarse positioning result.

[0011] A first position adjustment mechanism and a second position adjustment mechanism are configured to drive the second position adjustment mechanism to move along the X-axis and the Y-axis. A alignment stage is disposed at the output end of the second position adjustment mechanism. The second position adjustment mechanism is configured to drive the alignment stage to move along the Z-axis and rotate around the central axis θ of the alignment stage extending along the Z-axis, so as to drive the wafer on it to move synchronously, so that the actual center of the wafer coincides with a preset reference axis, and the Z-axis, X-axis and Y-axis are mutually perpendicular. After the wafer position is accurately adjusted, the second position adjustment mechanism can drive the alignment stage to move downward away from the wafer along the Z-axis and make the wafer overlap the overlap stage.

[0012] The central control unit is electrically connected to the visual positioning unit, the first position adjustment unit, and the second position adjustment unit. It can receive the positioning data from the visual positioning unit and perform algorithm coordination. Based on the coordination results, it controls the actions of the first position adjustment unit and the second position adjustment unit to complete the mapping and edge finding of the wafer.

[0013] As an alternative solution to a wafer mapping edge-finding device, the first position adjustment mechanism includes:

[0014] The first drive assembly includes a first slide rail, a first sliding seat, and a first cylinder. The first slide rail extends along the X-axis direction. The first sliding seat is slidably disposed on the first slide rail and connected to the output end of the first cylinder. The first cylinder can drive the first sliding seat to move along the first slide rail.

[0015] The second drive assembly includes a second slide rail, a second sliding seat, and a second cylinder. The second slide rail is fixed to the first sliding seat and extends along the Y-axis. The second sliding seat is slidably disposed on the second slide rail and connected to the output end of the second cylinder. The second cylinder can drive the second sliding seat to move along the second slide rail.

[0016] The second position adjustment mechanism is mounted on the second sliding seat. The movement of the first sliding seat along the X-axis direction can drive the second slide rail, the second sliding seat and the second position adjustment mechanism to move synchronously, thereby driving the alignment stage and the wafer on it to move synchronously along the X-axis direction. The movement of the second sliding seat along the Y-axis direction can drive the second position adjustment mechanism to move synchronously, thereby driving the alignment stage and the wafer on it to move synchronously along the Y-axis direction.

[0017] As an alternative to a wafer mapping edge-finding device, the second position adjustment mechanism includes:

[0018] A mounting plate, a movable plate, and a limiting plate are arranged sequentially from bottom to top along the Z-axis direction, and the mounting plate is fixedly connected to the second sliding seat.

[0019] The guide assembly includes multiple guide posts, each of which extends along the Z-axis and is evenly distributed around the circumference of the mounting plate. One end of each guide post is fixedly connected to the mounting plate, and the other end of each guide post slides through the movable plate and is fixedly connected to the limiting plate.

[0020] The third drive assembly is mounted on the movable plate. The alignment stage is located at the output end of the third drive assembly. The third drive assembly is configured to drive the alignment stage to rotate around the θ axis, thereby causing the wafer on it to rotate synchronously around the θ axis.

[0021] The fourth drive component is configured to drive the movable plate to slide along the guide post, thereby causing the third drive component to move synchronously, and causing the alignment stage and the wafer on it to move synchronously along the Z-axis.

[0022] As an alternative solution for a wafer mapping edge finding device, the third drive assembly includes a first motor and a drive shaft. The first motor is fixed to the movable plate, and the drive shaft extends along the Z-axis direction. One end of the drive shaft is connected to the output end of the first motor, and the other end is connected to the alignment stage. The first motor can drive the drive shaft to rotate around the θ-axis, so as to drive the alignment stage and the wafer on it to rotate synchronously around the θ-axis.

[0023] As an optional solution for a wafer mapping edge finding device, the limiting plate is provided with a first clearance slot adapted to the position of the first motor and the drive shaft. The first clearance slot is used to avoid the first motor and the drive shaft when the movable plate moves along the Z-axis direction.

[0024] As an alternative to the wafer mapping edge finding device, the fourth drive component includes:

[0025] A threaded sleeve seat is fixed on the mounting plate. The threaded sleeve seat has a connecting hole extending along the Z-axis direction. The inner wall of the connecting hole has an internal thread.

[0026] The second motor and the screw are fixed on the movable plate. The screw extends along the Z-axis and has an external thread on its surface that mates with the internal thread. One end of the screw is connected to the second motor for transmission, and the other end is threaded through the connecting hole. The second motor can drive the screw to rotate, and the rotation of the screw can drive the movable plate to move along the guide post along the Z-axis.

[0027] As an optional solution for a wafer mapping edge finding device, the mounting plate is provided with a clearance hole adapted to the position of the screw, the clearance hole being used to avoid the screw when the screw moves along the Z-axis direction; the limiting plate is provided with a second clearance slot adapted to the position of the second motor, the second clearance slot being used to avoid the second motor when the second motor moves along the Z-axis direction.

[0028] As an alternative to the wafer mapping edge finding device, the wafer mapping edge finding device also includes a pressure regulating mechanism configured to individually or simultaneously regulate the adsorption circuit pressure of the overlapping stage and the alignment stage.

[0029] As an optional solution for a wafer mapping edge finding device, the wafer mapping edge finding device further includes a pressure monitoring mechanism, which includes a first negative pressure gauge and a second negative pressure gauge. The first negative pressure gauge is connected to the adsorption circuit of the overlapping stage and can display the adsorption circuit pressure of the overlapping stage in real time. The second negative pressure gauge is connected to the adsorption circuit of the alignment stage and can display the adsorption circuit pressure of the alignment stage in real time. Based on the difference between the values ​​of the first negative pressure gauge and the second negative pressure gauge and a preset threshold, it can be determined that the wafer is currently being carried by the alignment stage and / or the overlapping stage.

[0030] The second objective of this invention is to provide a wafer mapping edge finding method, which is applied to the aforementioned wafer mapping edge finding device to accurately map the actual outline and feature positions of the wafer, ensuring the processing quality of subsequent processes and adapting to the high-precision processing requirements of wafers of different specifications.

[0031] To achieve this objective, the present invention adopts the following technical solution:

[0032] The wafer mapping edge finding method, which uses the aforementioned wafer mapping edge finding device, includes the following steps:

[0033] Step S1: The wafer is first placed on the mounting platform of the rack, and the mounting platform adsorbs and fixes the wafer to ensure that the initial orientation deviation of the wafer is kept within a preset range;

[0034] Step S2: The central control unit activates the vision positioning mechanism. The coarse positioning camera first acquires images of the wafer with standard Notch or Mark markings, and completes coarse alignment by recognizing the Notch or Mark markings, controlling the positioning error within a preset range. The fine positioning camera performs local scanning based on the coarse positioning results to obtain the actual center coordinates and edge contour data of the wafer, completing the fine alignment. The fine positioning data is transmitted to the central control unit in real time.

[0035] Step S3: Based on the precise positioning data and after algorithm coordination, the central control mechanism first controls the overlapping stage to release the adsorption, and then drives the alignment stage to move upward along the Z-axis direction through the second position adjustment mechanism until the adsorption surface of the alignment stage is attached to the lower surface of the wafer and the adsorption is started to carry the wafer.

[0036] Step S4: Drive the alignment stage to rotate around the θ axis through the second position adjustment mechanism to compensate for the angular deviation of the wafer. Drive the second position adjustment mechanism to move along the X-axis and Y-axis through the first position adjustment mechanism to make the actual center of the wafer coincide with the preset reference axis, and complete the position calibration of the wafer in a coordinated manner. The positioning error after calibration is controlled within the preset range.

[0037] Step S5: After calibration, the second position adjustment mechanism drives the alignment stage downwards and away from the wafer along the Z-axis direction, and the wafer is re-attached to the lap stage, and the lap stage starts adsorption and fixation again;

[0038] Step S6: The central control unit activates the precision positioning camera of the vision positioning mechanism to perform a full-circumference scan of the edge of the wafer, mapping and recording the actual center coordinates, radius, edge contour, and position of Notch or Mark marker of the wafer, thus completing the edge mapping of the wafer.

[0039] The beneficial effects of this invention are:

[0040] This invention provides a wafer mapping edge finding device. When using the wafer mapping edge finding device, the central control mechanism is activated, and the lap stage first adsorbs and fixes the wafer. The coarse positioning camera of the visual positioning mechanism performs preliminary positioning on the standard Notch or Mark mark of the wafer. Subsequently, the fine positioning camera performs fine alignment based on the coarse positioning result and transmits the fine positioning data to the central control mechanism for algorithm coordination. According to the coordination result, the central control mechanism controls the second position adjustment mechanism to drive the alignment stage, which is installed in the rack clearance, to rise along the Z-axis to adsorb the wafer and rotate around its own central axis θ. Then, the first position adjustment mechanism is controlled to drive the second position adjustment mechanism to move along the X-axis and Y-axis, so that the wafer adsorbed on the alignment stage completes the position calibration, so that the actual center of the wafer is precisely aligned with the preset reference axis. After calibration, the second position adjustment mechanism drives the alignment stage to move downward away from the wafer along the Z-axis, and the wafer is stably lapped on the lap stage and remains adsorbed and fixed. This wafer mapping edge-finding device utilizes a visual positioning mechanism consisting of a coarse positioning camera and a fine positioning camera, combined with a dual-position adjustment mechanism, to achieve precise multi-dimensional adjustments along the X, Y, Z, and θ axes. The coarse positioning camera improves alignment efficiency, while the fine positioning camera enhances product alignment accuracy, resulting in smaller positioning errors and faster response to attitude correction commands. It is adaptable to wafers of different specifications with Notch or Mark markings, offering strong versatility and ensuring consistent positioning for each wafer as it enters subsequent processes, providing a stable foundation for high-precision machining. Simultaneously, the rack's clearance ports and the structural design of the alignment and overlapping stages ensure flexibility in switching between adjusted and fixed states. Combined with the central control mechanism's algorithmic collaboration, it accurately records the actual contour and feature positions of the wafer, guaranteeing mapping accuracy, meeting high-precision machining requirements, and improving product yield.

[0041] This invention also provides a wafer mapping edge finding method. This method involves initially adsorbing and fixing the wafer on a stacking stage, obtaining accurate data through a combination of coarse and fine positioning by a coarse positioning camera and a fine positioning camera, and then completing the wafer angle and position calibration through the coordinated operation of a first position adjustment mechanism and a second position adjustment mechanism. After calibration, the stacking stage re-adsorbs the wafer and records key parameters through a full-circumference scan by a fine positioning camera. The process is tightly integrated, with positioning and calibration implemented in steps. With the stable switching of the adsorption circuit, the positioning accuracy is high and the error is controllable. It accurately maps the actual contour and feature position of the wafer, ensuring the processing quality of subsequent processes and adapting to the high-precision processing requirements of wafers of different specifications. Attached Figure Description

[0042] Figure 1 This is an isometric view of the wafer mapping edge-finding device described in this embodiment of the invention when placing the wafer;

[0043] Figure 2 This is an isometric view of the wafer mapping edge-finding device described in this embodiment of the invention when no wafer is placed.

[0044] Figure 3 This is a top view of the wafer mapping edge finding device described in this embodiment of the invention when no wafer is placed;

[0045] Figure 4 This is a side view of the wafer mapping edge finding device described in this embodiment of the invention when no wafer is placed;

[0046] Figure 5 This is a first structural schematic diagram of the wafer mapping edge-finding device according to an embodiment of the present invention;

[0047] Figure 6 This is a schematic diagram of the second structure of the wafer mapping edge-finding device according to an embodiment of the present invention;

[0048] Figure 7 This is a cross-sectional view of the wafer mapping edge-finding device described in an embodiment of the present invention.

[0049] In the picture:

[0050] 100. Wafer; 101. 8-inch wafer; 102. 12-inch wafer;

[0051] 1. Frame; 11. Clearance opening;

[0052] 2. Load-bearing components; 21. Alignment platform; 22. Jointing platform;

[0053] 3. Visual positioning mechanism; 31. Coarse positioning camera; 32. Fine positioning camera; 33. Light source;

[0054] 4. First position adjustment mechanism;

[0055] 41. First drive assembly; 411. First slide rail; 412. First sliding seat; 413. First cylinder;

[0056] 42. Second drive assembly; 421. Second slide rail; 422. Second sliding seat; 423. Second cylinder;

[0057] 5. Second position adjustment mechanism;

[0058] 511, Mounting plate; 5111, Clearance hole;

[0059] 512. Movable board;

[0060] 513, Limiting plate; 5131, First clearance slot; 5132, Second clearance slot;

[0061] 52. Guide assembly; 521. Guide post;

[0062] 53. Third drive assembly; 531. First motor; 532. Drive shaft;

[0063] 54. Fourth drive assembly; 541. Screw sleeve seat; 542. Second motor; 543. Screw;

[0064] 6. Pressure regulating mechanism;

[0065] 7. Pressure monitoring mechanism; 71. First negative pressure gauge; 72. Second negative pressure gauge. Detailed Implementation

[0066] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0067] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0068] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0069] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0070] like Figures 1-4 As shown, this embodiment provides a wafer mapping edge finding device and a wafer mapping edge finding method. The wafer mapping edge finding device includes a frame 1, a support component 2, a visual positioning mechanism 3, a first position adjustment mechanism 4, a second position adjustment mechanism 5, and a central control mechanism. The frame 1 is provided with a notch 11. The support component 2 includes an alignment stage 21 and multiple overlapping stages 22. The alignment stage 21 passes through the notch 11, and the multiple overlapping stages 22 are fixed on the frame 1 and evenly distributed along the circumference of the notch 11. The overlapping stages 22 can overlap and adsorb wafers 100, and the alignment stage 21 can support and adsorb wafers 100. The visual positioning mechanism 3 includes a coarse positioning camera 31 and a fine positioning camera 32 disposed on the frame 1. The coarse positioning camera 31 is used to coarsely align wafers 100 with standard notch or mark markings, and the fine positioning camera 32 is used to finely align wafers 100 based on the coarse positioning results. The first position adjustment mechanism 4 drives the second position adjustment mechanism 5 to move along the X-axis and the Y-axis. The alignment stage 21 is located at the output end of the second position adjustment mechanism 5. The second position adjustment mechanism 5 drives the alignment stage 21 to move along the Z-axis and rotate around the central axis θ of the alignment stage 21 extending along the Z-axis, so as to drive the wafer 100 on it to move synchronously, so that the actual center of the wafer 100 coincides with the preset reference axis, and the Z-axis, X-axis and Y-axis are mutually perpendicular. After the wafer 100 is accurately positioned, the second position adjustment mechanism 5 can drive the alignment stage 21 to move downward away from the wafer 100 along the Z-axis, and make the wafer 100 overlap on the overlap stage 22. The central control mechanism is electrically connected to the visual positioning mechanism 3, the first position adjustment mechanism 4 and the second position adjustment mechanism 5. It can receive the positioning data of the visual positioning mechanism 3 and perform algorithm coordination. Based on the coordination result, it controls the actions of the first position adjustment mechanism 4 and the second position adjustment mechanism 5 to complete the mapping and edge finding of the wafer 100.

[0071] When using the wafer mapping edge finding device, the central control mechanism is activated. The lap stage 22 first adsorbs and fixes the wafer 100. The coarse positioning camera 31 of the visual positioning mechanism 3 performs preliminary positioning on the standard Notch or Mark of the wafer 100. Then, the fine positioning camera 32 performs fine alignment based on the coarse positioning result and transmits the fine positioning data to the central control mechanism for algorithm coordination. According to the coordination result, the central control mechanism controls the second position adjustment mechanism 5 to drive the alignment stage 21, which is installed in the clearance 11 of the rack 1, to rise along the Z-axis to adsorb the wafer 100 and rotate around its own central axis θ. Then, the first position adjustment mechanism 4 is controlled to drive the second position adjustment mechanism 5 to move along the X-axis and Y-axis, so that the wafer 100 adsorbed on the alignment stage 21 completes the position calibration, so that the actual center of the wafer 100 is precisely aligned with the preset reference axis. After calibration, the second position adjustment mechanism 5 drives the alignment stage 21 to move downward away from the wafer 100 along the Z-axis, and the wafer 100 is stably lapped on the lap stage 22 and remains adsorbed and fixed. This wafer mapping edge-finding device, through a visual positioning mechanism 3 consisting of a coarse positioning camera 31 and a fine positioning camera 32, combined with a dual-position adjustment mechanism, achieves precise multi-dimensional adjustments along the X, Y, Z, and θ axes. The coarse positioning camera 31 improves alignment efficiency, while the fine positioning camera 32 improves product alignment accuracy, resulting in smaller positioning errors and faster response to attitude correction commands. It is adaptable to wafers 100 of different specifications with Notch or Mark markings, offering strong versatility and ensuring that the positioning state of each wafer 100 remains consistent when entering subsequent processes, providing a stable prerequisite for high-precision processing. At the same time, the structural design of the clearance port 11 of the rack 1, the alignment stage 21, and the overlapping stage 22 ensures the flexibility of switching between the adjustment and fixed states of the wafer 100. Combined with the algorithm collaboration of the central control mechanism, it accurately records the actual contour and feature positions of the wafer 100, ensuring mapping accuracy, meeting the requirements of high-precision processing, and improving product yield.

[0072] It is worth noting that both the Notch and Mark are indispensable positioning markers in wafer manufacturing and subsequent processing. The Notch is a V-shaped notch on the edge of wafer 100, and its core function is to accurately mark the crystal orientation and front and back sides of wafer 100, providing an initial positioning reference for subsequent chip manufacturing processes such as photolithography and dicing. The Mark is an alignment template formed on the surface of wafer 100 through an etching process. With a crosshair cursor as a typical marking feature, it has a clear and identifiable geometric shape and can serve as a precise alignment reference between processes, ensuring the positional accuracy of pattern transfer and structure superposition in each process step.

[0073] like Figure 1As shown, the wafer mapping edge finding device is compatible with both 8-inch wafer 101 and 12-inch wafer 102 mapping edge finding without the need for additional adapter parts. It boasts strong versatility, effectively reducing changeover costs and operational complexity, ensuring stable positioning and adjustment accuracy for both wafer 100 sizes, and meeting the high-precision mapping edge finding requirements of wafer 100 of different specifications. In other embodiments, the wafer 100 can also be replaced with glass to achieve mapping edge finding on the glass; no specific limitations are made here.

[0074] In this embodiment, in order to adapt to wafers 100 and glass of different sizes, the positions of the coarse positioning camera 31 and the fine positioning camera 32 are adjustable, and they are fixed after accurate focusing, which improves the versatility and flexibility of the wafer mapping edge finding device.

[0075] In this embodiment, as Figure 2 As shown, there are two overlapping platforms 22, which are symmetrically arranged around the circumference of the recess 11 of the frame 1. This arrangement can evenly distribute the weight of the wafer 100, achieving stable overlapping and adsorption fixation, effectively reducing initial posture deviation, improving load-bearing stability, optimizing positioning response efficiency, and meeting the requirements of high-precision mapping and edge finding. In other embodiments, the number of overlapping platforms 22 can also be three, four, five, etc., and no specific limitation is made here.

[0076] like Figures 1-2 As shown, the wafer mapping edge finding device also includes a pressure adjustment mechanism 6, which is used to adjust the adsorption circuit pressure of the overlapping stage 22 and the alignment stage 21 individually or simultaneously. The pressure adjustment mechanism 6 can adjust the adsorption circuit pressure of the overlapping stage 22 and the alignment stage 21 individually or simultaneously, accurately matching the adsorption force according to the wafer 100 specifications and positioning process requirements. This avoids damage to the wafer 100 due to excessive adsorption pressure, and also prevents wafer 100 displacement during positioning due to insufficient pressure. During the alternating bearing of the wafer 100 by the alignment stage 21 and the overlapping stage 22, the stable adsorption pressure ensures the smoothness of wafer 100 transfer and positioning. Combined with the coordinated action of the visual positioning mechanism 3 and the dual-position adjustment mechanism, this further improves the accuracy and reliability of wafer 100 mapping edge finding, adapting to the processing requirements of wafers 100 of different specifications and ensuring the processing quality of subsequent processes.

[0077] like Figures 1-2As shown, the wafer mapping edge finding device also includes a pressure monitoring mechanism 7, which includes a first negative pressure gauge 71 and a second negative pressure gauge 72. The first negative pressure gauge 71 is connected to the adsorption circuit of the overlapping stage 22 and can display the adsorption circuit pressure of the overlapping stage 22 in real time. The second negative pressure gauge 72 is connected to the adsorption circuit of the alignment stage 21 and can display the adsorption circuit pressure of the alignment stage 21 in real time. Based on the difference in values ​​between the first negative pressure gauge 71 and the second negative pressure gauge 72 and a preset threshold, it can be determined that the current bearing of the wafer 100 belongs to the alignment stage 21 and / or the overlapping stage 22. The first negative pressure gauge 71 of the pressure monitoring mechanism 7 displays the pressure of the adsorption circuit of the overlapping stage 22 in real time, and the second negative pressure gauge 72 provides real-time feedback on the adsorption circuit pressure of the alignment stage 21. By comparing the difference between the two gauge values ​​with the preset threshold, the current bearing status of the wafer 100 can be accurately determined, and abnormal adsorption pressure can be detected in time to avoid wafer 100 displacement due to insufficient pressure or damage caused by excessive pressure. In conjunction with the pressure regulating mechanism 6, the adsorption pressure can be precisely controlled to ensure the stability of the alternating bearing of the alignment stage 21 and the overlapping stage 22, further improving the reliability and safety of the mapping edge finding, and adapting to the high-precision processing requirements of wafers 100 of different specifications.

[0078] In this embodiment, both the alignment stage 21 and the overlapping stage 22 employ suction cups and metal flat heads for adsorption. The suction cups ensure a stable negative pressure adsorption effect, while the metal flat heads provide rigid support. The combination of the two can firmly fix the wafer 100, preventing displacement during positioning and transportation, and also reducing contact damage to the surface of the wafer 100. The adsorption method is adaptable to wafers 100 of different sizes. With the control of the pressure adjustment mechanism 6 and the pressure monitoring mechanism 7, the load-bearing stability and positioning accuracy are further improved, meeting the process requirements of high-precision mapping and edge finding.

[0079] like Figures 1-2 As shown, the visual positioning mechanism 3 also includes a light source 33, which is fixed on the frame 1. The light source 33 provides sufficient and uniform illumination for image acquisition by the coarse positioning camera 31 and the fine positioning camera 32, effectively improving the imaging clarity of the Notch port, Mark mark and edge contour on the surface of the wafer 100, and reducing the recognition error caused by ambient light interference; it helps the camera to accurately extract positioning feature data, providing a reliable positioning basis for the central control mechanism. With the coordinated calibration of the dual position adjustment mechanism, it further improves the positioning accuracy and stability of the wafer 100 mapping edge finding, and ensures the accuracy of the mapping record data.

[0080] like Figures 3-5As shown, the first position adjustment mechanism 4 includes a first drive assembly 41 and a second drive assembly 42. The first drive assembly 41 includes a first slide rail 411, a first sliding seat 412, and a first cylinder 413. The first slide rail 411 extends along the X-axis direction. The first sliding seat 412 is slidably disposed on the first slide rail 411 and connected to the output end of the first cylinder 413. The first cylinder 413 can drive the first sliding seat 412 to move along the first slide rail 411. The second drive assembly 42 includes a second slide rail 421, a second sliding seat 422, and a second cylinder 423. The second slide rail 421 is fixed to the first sliding seat 412 and extends along the Y-axis direction. The second sliding seat 422 is slidably disposed on the second slide rail 421 and connected to the output end of the second cylinder 423. The second cylinder 423 can drive the second sliding seat 422 to move along the second slide rail 421. The second position adjustment mechanism 5 is mounted on the second sliding seat 422. The movement of the first sliding seat 412 along the X-axis direction can drive the second slide rail 421, the second sliding seat 422 and the second position adjustment mechanism 5 to move synchronously, thereby driving the alignment stage 21 and the wafer 100 on it to move synchronously along the X-axis direction. The movement of the second sliding seat 422 along the Y-axis direction can drive the second position adjustment mechanism 5 to move synchronously, thereby driving the alignment stage 21 and the wafer 100 on it to move synchronously along the Y-axis direction. The first position adjustment mechanism 4 drives the first sliding seat 412 to move along the first slide rail 411 in the X-axis direction through the first cylinder 413, and cooperates with the second cylinder 423 to drive the second sliding seat 422 to move along the second slide rail 421 in the Y-axis direction. This enables the second position adjustment mechanism 5, the alignment stage 21, and the wafer 100 to move precisely along the X-axis and Y-axis directions. The transmission structure of the slide rail and cylinder has strong stability, rapid response, and high motion accuracy, which can reduce the offset error in the position adjustment process. This lays a precise foundation for the subsequent Z-axis lifting and θ-axis rotation adjustment of the wafer 100, ensures the multi-dimensional positioning coordination effect, and improves the overall mapping edge finding accuracy and processing stability.

[0081] like Figures 5-6As shown, the second position adjustment mechanism 5 includes a mounting plate 511, a movable plate 512, a limiting plate 513, a guide assembly 52, a third drive assembly 53, and a fourth drive assembly 54. The mounting plate 511, the movable plate 512, and the limiting plate 513 are arranged sequentially from bottom to top along the Z-axis. The mounting plate 511 is fixedly connected to the second sliding seat 422. The guide assembly 52 includes a plurality of guide posts 521. The plurality of guide posts 521 extend along the Z-axis and are evenly distributed along the circumference of the mounting plate 511. One end of each guide post 521 is fixedly connected to the mounting plate 511, and the other end of each guide post 521 slides through the movable plate 512 and is fixedly connected to the limiting plate 513. The third drive assembly 53 is mounted on the movable plate 512, and the alignment stage 21 is located at the output end of the third drive assembly 53. The third drive assembly 53 is used to drive the alignment stage 21 to rotate around the θ axis, thereby causing the wafer 100 on it to rotate synchronously around the θ axis. The fourth drive assembly 54 is used to drive the movable plate 512 to slide along the guide post 521, so as to drive the third drive assembly 53 to move synchronously, thereby causing the alignment stage 21 and the wafer 100 on it to move synchronously along the Z-axis. The second position adjustment mechanism 5 provides stable guidance for the movable plate 512 through guide posts 521 that extend along the Z-axis and are evenly distributed circumferentially. The fourth drive component 54 drives the movable plate 512 to slide along the guide posts 521, so as to realize the smooth lifting and lowering of the alignment stage 21 and the wafer 100 along the Z-axis. The third drive component 53 drives the alignment stage 21 to rotate precisely around the θ-axis. With the guidance and limiting of the guide component 52, the motion accuracy is high and the stability is strong. It can quickly complete the attitude correction of the wafer 100. Together with the first position adjustment mechanism 4, it can achieve multi-dimensional precise positioning, ensure that the center of the wafer 100 coincides with the preset reference axis, and improve the accuracy of mapping edge finding and processing adaptability.

[0082] In this embodiment, the guide assembly 52 includes four guide posts 521. The four guide posts 521 are evenly distributed around the mounting plate 511 and extend along the Z-axis, providing stable guidance for the sliding of the movable plate 512, effectively suppressing the swaying and shaking of the movable plate 512 during movement, ensuring the straightness of the alignment stage 21 and the wafer 100 along the Z-axis, improving the positioning accuracy of the wafer 100, and ensuring the reliability of subsequent processing steps. In other embodiments, the number of guide posts 521 in the guide assembly 52 can also be six, eight, etc., and no specific limitation is made here.

[0083] like Figures 6-7As shown, the third drive assembly 53 includes a first motor 531 and a drive shaft 532. The first motor 531 is fixed to the movable plate 512, and the drive shaft 532 extends along the Z-axis. One end of the drive shaft 532 is connected to the output end of the first motor 531, and the other end is connected to the alignment stage 21. The first motor 531 can drive the drive shaft 532 to rotate around the θ-axis, thereby driving the alignment stage 21 and the wafer 100 on it to rotate synchronously around the θ-axis. The third drive assembly 53 drives the drive shaft 532 extending along the Z-axis to rotate around the θ-axis through the first motor 531 fixed to the movable plate 512, directly driving the alignment stage 21 and the wafer 100 on it to rotate synchronously. The transmission path is short, the power loss is small, the rotation accuracy is high, and the response is fast. It can accurately correct the attitude deviation of the wafer 100. The motor-driven transmission method has strong stability and can realize fine adjustment and rapid positioning in the θ-axis direction, further improving the accuracy of the multi-dimensional positioning of the wafer 100, ensuring that the center of the circle coincides precisely with the preset reference axis, and meeting the requirements of high-precision mapping edge finding.

[0084] like Figures 6-7 As shown, the limiting plate 513 is provided with a first clearance slot 5131 adapted to the position of the first motor 531 and the drive shaft 532. The first clearance slot 5131 is used to avoid the first motor 531 and the drive shaft 532 when the movable plate 512 moves along the Z-axis. The first clearance slot 5131 on the limiting plate 513 is precisely adapted to the position of the first motor 531 and the drive shaft 532. When the movable plate 512 moves up and down along the guide post 521 in the Z-axis direction, it can provide sufficient movement space for the first motor 531 and the drive shaft 532, effectively avoiding interference and collision with the limiting plate 513 during the movement, and ensuring the smoothness and safety of the movement of each component of the third drive assembly 53; at the same time, it does not affect the accuracy of the first motor 531 driving the drive shaft 532 to drive the alignment stage 21 to rotate around the θ-axis, ensuring reliable coordination between the Z-axis lifting and θ-axis rotation actions, further improving the stability and accuracy of the wafer's 100+ dimension positioning, and ensuring the efficient advancement of the mapping edge finding process.

[0085] like Figures 6-7As shown, the fourth drive assembly 54 includes a screw sleeve seat 541, a second motor 542, and a screw 543. The screw sleeve seat 541 is fixed on the mounting plate 511. The screw sleeve seat 541 has a connecting hole extending along the Z-axis direction, and the inner wall of the connecting hole has an internal thread. The second motor 542 is fixed on the movable plate 512. The screw 543 extends along the Z-axis direction, and its surface has an external thread that mates with the internal thread. One end of the screw 543 is connected to the second motor 542 for transmission, and the other end is threaded through the connecting hole. The second motor 542 can drive the screw 543 to rotate. The rotation of the screw 543 can drive the movable plate 512 to move along the guide post 521 along the Z-axis direction. The screw sleeve seat 541, fixed to the mounting plate 511, provides a foundation for threaded engagement. The second motor 542 drives the screw 543, which extends along the Z-axis, to rotate. The external thread of the screw 543 precisely engages with the internal thread of the connecting hole in the screw sleeve seat 541, driving the second motor 542 to move. This, in turn, causes the movable plate 512, connected to the second motor 542, to rise and fall smoothly along the guide post 521. The threaded transmission has high precision and good self-locking properties, enabling fine-tuning and precise positioning along the Z-axis. The movement is stable and free from slippage. In conjunction with the guide limit of the guide component 52, the stability of the movable plate 512 in driving the alignment stage 21 and the wafer 100 to rise and fall is ensured, further improving the multi-dimensional positioning accuracy of the wafer 100 and meeting the requirements for high-precision mapping and edge finding.

[0086] like Figures 6-7 As shown, the mounting plate 511 is provided with a clearance hole 5111 that is adapted to the position of the screw 543. The clearance hole 5111 is used to avoid the screw 543 when it moves along the Z-axis. The limiting plate 513 is provided with a second clearance slot 5132 that is adapted to the position of the second motor 542. The second clearance slot 5132 is used to avoid the second motor 542 when it moves along the Z-axis. The clearance hole 5111 on the mounting plate 511 is precisely matched with the position of the screw 543, and the second clearance slot 5132 on the limiting plate 513 is matched with the position of the second motor 542. When the second motor 542 drives the screw 543 to rotate, causing the movable plate 512 to move up and down along the guide post 521 in the Z-axis direction, the clearance hole 5111 provides sufficient space for the screw 543 to move, avoiding interference and collision between the screw 543 and the mounting plate 511. The second clearance slot 5132 provides space for the second motor 542 to move, avoiding interference and collision between the second motor 542 and the limiting plate 513. This ensures the smoothness of the threaded transmission and component movement, without affecting the guiding accuracy of the guide assembly 52. ​​It ensures that the movable plate 512 drives the alignment stage 21 and the wafer 100 to move up and down smoothly, further improving the stability and accuracy of multi-dimensional positioning, and providing structural guarantee for the efficient advancement of wafer 100 mapping and edge finding.

[0087] The wafer mapping edge finding method of this embodiment is applied to the wafer mapping edge finding device of this embodiment, and the wafer mapping edge finding method includes the following steps:

[0088] Step S1: The wafer 100 is first placed on the mounting platform 22 of the rack 1. The mounting platform 22 adsorbs and fixes the wafer 100 to ensure that the initial orientation deviation of the wafer 100 is kept within the preset range.

[0089] Step S2: The central control unit activates the visual positioning mechanism 3. The coarse positioning camera 31 first acquires images of the wafer 100 with standard Notch or Mark markings, and completes coarse alignment by recognizing the Notch or Mark markings, controlling the positioning error within a preset range. The fine positioning camera 32 performs local scanning based on the coarse positioning results to obtain the actual center coordinates and edge contour data of the wafer 100, and completes fine alignment. The fine positioning data is transmitted to the central control unit in real time.

[0090] Step S3: Based on the precise positioning data and after algorithm coordination, the central control mechanism first controls the overlapping stage 22 to release the adsorption, and then drives the alignment stage 21 to move upward along the Z-axis through the second position adjustment mechanism 5 until the adsorption surface of the alignment stage 21 is attached to the lower surface of the wafer 100 and the adsorption is started to support the wafer 100.

[0091] Step S4: Drive the alignment stage 21 to rotate around the θ axis through the second position adjustment mechanism 5 to compensate for the angular deviation of the wafer 100. Drive the second position adjustment mechanism 5 to move along the X-axis and Y-axis through the first position adjustment mechanism 4 to make the actual center of the wafer 100 coincide with the preset reference axis, and complete the position calibration of the wafer 100 in a coordinated manner. The positioning error after calibration is controlled within the preset range.

[0092] Step S5: After calibration, the second position adjustment mechanism 5 drives the alignment stage 21 downward along the Z-axis away from the wafer 100, and the wafer 100 is re-attached to the lap stage 22, and the lap stage 22 starts adsorption and fixation again.

[0093] Step S6: The central control unit activates the fine positioning camera 32 of the visual positioning mechanism 3 to perform a full-circle scan of the edge of the wafer 100, and maps and records the actual center coordinates, radius, edge contour, and position of Notch or Mark of the wafer 100, thus completing the edge mapping of the wafer 100.

[0094] This wafer mapping edge-finding method initially fixes the wafer 100 by adsorbing it on the lap stage 22. It then obtains accurate data through the combination of coarse and fine positioning by the coarse positioning camera 31 and the fine positioning camera 32. The first position adjustment mechanism 4 and the second position adjustment mechanism 5 work together to complete the angle and position calibration of the wafer 100. After calibration, the lap stage 22 re-adsorbs the wafer and the fine positioning camera 32 scans the entire circumference to record key parameters. The process is closely connected, with positioning and calibration implemented in steps. With the stable switching of the adsorption circuit, the positioning accuracy is high and the error is controllable. It accurately maps the actual contour and feature position of the wafer 100, ensuring the processing quality of subsequent processes and adapting to the high-precision processing requirements of wafers 100 of different specifications.

[0095] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A wafer mapping edge-finding device, characterized in that, include: A frame (1) is provided with a clearance opening (11). The support component (2) includes an alignment stage (21) and multiple overlapping stages (22). The alignment stage (21) is inserted through the clearance opening (11). The multiple overlapping stages (22) are fixed on the frame (1) and are evenly distributed along the circumference of the clearance opening (11). The overlapping stages (22) can overlap and adsorb wafers (100). The alignment stage (21) can support and adsorb the wafers (100). The visual positioning mechanism (3) includes a coarse positioning camera (31) and a fine positioning camera (32) mounted on the rack (1). The coarse positioning camera (31) is configured to perform coarse alignment on the wafer (100) with a standard Notch or Mark marking, and the fine positioning camera (32) is configured to perform fine alignment on the wafer (100) based on the coarse positioning result. The first position adjustment mechanism (4) and the second position adjustment mechanism (5) are configured to drive the second position adjustment mechanism (5) to move along the X-axis and along the Y-axis. The alignment stage (21) is located at the output end of the second position adjustment mechanism (5). The second position adjustment mechanism (5) is configured to drive the alignment stage (21) to move along the Z-axis and rotate around the central axis θ of the alignment stage (21) extending along the Z-axis, so as to drive the wafer (100) on it to move synchronously, so that the actual center of the wafer (100) coincides with the preset reference axis, and the Z-axis, X-axis and Y-axis are perpendicular to each other. After the wafer (100) is accurately positioned, the second position adjustment mechanism (5) can drive the alignment stage (21) to move downward away from the wafer (100) along the Z-axis and make the wafer (100) overlap on the overlap stage (22). The central control mechanism is electrically connected to the visual positioning mechanism (3), the first position adjustment mechanism (4) and the second position adjustment mechanism (5). It can receive the positioning data of the visual positioning mechanism (3) and perform algorithm coordination. Based on the coordination result, it controls the actions of the first position adjustment mechanism (4) and the second position adjustment mechanism (5) to complete the mapping and edge finding of the wafer (100).

2. The wafer mapping edge-finding device according to claim 1, characterized in that, The first position adjustment mechanism (4) includes: The first drive assembly (41) includes a first slide rail (411), a first sliding seat (412), and a first cylinder (413). The first slide rail (411) extends along the X-axis direction. The first sliding seat (412) is slidably disposed on the first slide rail (411) and connected to the output end of the first cylinder (413). The first cylinder (413) can drive the first sliding seat (412) to move along the first slide rail (411). The second drive assembly (42) includes a second slide rail (421), a second sliding seat (422), and a second cylinder (423). The second slide rail (421) is fixed to the first sliding seat (412) and extends along the Y-axis. The second sliding seat (422) is slidably disposed on the second slide rail (421) and connected to the output end of the second cylinder (423). The second cylinder (423) can drive the second sliding seat (422) to move along the second slide rail (421). The second position adjustment mechanism (5) is mounted on the second sliding seat (422). The movement of the first sliding seat (412) along the X-axis direction can drive the second slide rail (421), the second sliding seat (422) and the second position adjustment mechanism (5) to move synchronously, thereby driving the alignment stage (21) and the wafer (100) on it to move synchronously along the X-axis direction. The movement of the second sliding seat (422) along the Y-axis direction can drive the second position adjustment mechanism (5) to move synchronously, thereby driving the alignment stage (21) and the wafer (100) on it to move synchronously along the Y-axis direction.

3. The wafer mapping edge-finding device according to claim 2, characterized in that, The second position adjustment mechanism (5) includes: A mounting plate (511), a movable plate (512), and a limiting plate (513) are arranged sequentially from bottom to top along the Z-axis direction. The mounting plate (511) is fixedly connected to the second sliding seat (422). The guide assembly (52) includes a plurality of guide posts (521), which extend along the Z-axis and are evenly distributed along the circumference of the mounting plate (511). One end of each guide post is fixedly connected to the mounting plate (511), and the other end of each guide post slides through the movable plate (512) and is fixedly connected to the limiting plate (513). The third driving component (53) is mounted on the movable plate (512), and the alignment stage (21) is located at the output end of the third driving component (53). The third driving component (53) is configured to drive the alignment stage (21) to rotate around the θ axis, thereby causing the wafer (100) on it to rotate synchronously around the θ axis. The fourth drive assembly (54) is configured to drive the movable plate (512) to slide along the guide post (521) to drive the third drive assembly (53) to move synchronously, thereby driving the alignment stage (21) and the wafer (100) thereon to move synchronously along the Z-axis.

4. The wafer mapping edge finding device according to claim 3, characterized in that, The third drive assembly (53) includes a first motor (531) and a drive shaft (532). The first motor (531) is fixed to the movable plate (512). The drive shaft (532) extends along the Z-axis direction, with one end connected to the output end of the first motor (531) and the other end connected to the alignment stage (21). The first motor (531) can drive the drive shaft (532) to rotate around the θ-axis, thereby driving the alignment stage (21) and the wafer (100) on it to rotate synchronously around the θ-axis.

5. The wafer mapping edge finding device according to claim 4, characterized in that, The limiting plate (513) is provided with a first clearance slot (5131) adapted to the position of the first motor (531) and the transmission shaft (532). The first clearance slot (5131) is used to avoid the first motor (531) and the transmission shaft (532) when the movable plate (512) moves along the Z-axis direction.

6. The wafer mapping edge finding device according to claim 4, characterized in that, The fourth drive component (54) includes: A threaded sleeve seat (541) is fixed on the mounting plate (511). The threaded sleeve seat (541) has a connecting hole extending along the Z-axis direction. The inner wall of the connecting hole has an internal thread. The second motor (542) and the screw (543) are fixed on the movable plate (512). The screw (543) extends along the Z-axis and has an external thread that mates with the internal thread. One end of the screw (543) is connected to the second motor (542) for transmission, and the other end is threaded through the connecting hole. The second motor (542) can drive the screw (543) to rotate. The rotation of the screw (543) can drive the movable plate (512) to move along the guide post (521) along the Z-axis.

7. The wafer mapping edge finding device according to claim 6, characterized in that, The mounting plate (511) is provided with a clearance hole (5111) adapted to the position of the screw (543), the clearance hole (5111) is used to avoid the screw (543) when the screw (543) moves along the Z-axis direction; the limiting plate (513) is provided with a second clearance slot (5132) adapted to the position of the second motor (542), the second clearance slot (5132) is used to avoid the second motor (542) when the second motor (542) moves along the Z-axis direction.

8. The wafer mapping edge finding device according to any one of claims 1-7, characterized in that, The wafer mapping edge finding device also includes a pressure regulating mechanism (6), which is configured to individually or simultaneously regulate the adsorption circuit pressure of the overlapping stage (22) and the alignment stage (21).

9. The wafer mapping edge finding device according to any one of claims 1-7, characterized in that, The wafer mapping edge finding device also includes a pressure monitoring mechanism (7), which includes a first negative pressure gauge (71) and a second negative pressure gauge (72). The first negative pressure gauge (71) is connected to the adsorption circuit of the overlapping stage (22) and can display the adsorption circuit pressure of the overlapping stage (22) in real time. The second negative pressure gauge (72) is connected to the adsorption circuit of the alignment stage (21) and can display the adsorption circuit pressure of the alignment stage (21) in real time. Based on the difference in values ​​between the first negative pressure gauge (71) and the second negative pressure gauge (72) and a preset threshold, it can be determined that the current bearing of the wafer (100) belongs to the alignment stage (21) and / or the overlapping stage (22).

10. A wafer mapping edge-finding method, characterized in that, The wafer mapping edge finding apparatus applied to any one of claims 1-9, the wafer mapping edge finding method includes the following steps: Step S1: The wafer (100) is first placed on the mounting platform (22) of the rack (1). The mounting platform (22) adsorbs and fixes the wafer (100) to ensure that the initial posture deviation of the wafer (100) is kept within a preset range. Step S2: The central control unit activates the visual positioning mechanism (3). The coarse positioning camera (31) first acquires images of the wafer (100) with standard Notch or Mark markings, and completes coarse alignment by recognizing the Notch or Mark markings, controlling the positioning error within a preset range. The fine positioning camera (32) performs local scanning based on the coarse positioning results to obtain the actual center coordinates and edge contour data of the wafer (100), and completes fine alignment. The fine positioning data is transmitted to the central control unit in real time. Step S3: Based on the precise positioning data and after algorithm coordination, the central control mechanism first controls the overlapping platform (22) to release the adsorption, and then drives the alignment platform (21) to move upward along the Z-axis direction through the second position adjustment mechanism (5) until the adsorption surface of the alignment platform (21) is attached to the lower surface of the wafer (100) and adsorption is started to carry the wafer (100). Step S4: Drive the alignment stage (21) to rotate around the θ axis through the second position adjustment mechanism (5) to compensate for the angular deviation of the wafer (100). Drive the second position adjustment mechanism (5) to move along the X-axis and Y-axis through the first position adjustment mechanism (4) so ​​that the actual center of the wafer (100) coincides with the preset reference axis, and complete the position calibration of the wafer (100) in a coordinated manner. The positioning error after calibration is controlled within the preset range. Step S5: After calibration, the second position adjustment mechanism (5) drives the alignment stage (21) downward away from the wafer (100) along the Z-axis direction, and the wafer (100) is re-attached to the overlapping stage (22), and the overlapping stage (22) starts adsorption and fixation again; Step S6: The central control mechanism activates the fine positioning camera (32) of the visual positioning mechanism (3) to perform a full-circle scan of the edge of the wafer (100), and maps and records the actual center coordinates, radius, edge contour, Notch or Mark position of the wafer (100) to complete the edge mapping of the wafer (100).

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