Efficient GPU chip liquid cooling heat dissipation device

Abstract

The invention relates to the technical field of chips, in particular to an efficient GPU chip liquid cooling heat dissipation device which comprises a mounting frame, a cold plate is fixedly arranged at the top of the outer wall of the mounting frame, a heating chip is arranged at the top of the cold plate, and a heat dissipation mechanism is arranged at the position, located at the bottom of the cold plate, of the outer wall of the mounting frame. The heat dissipation mechanism comprises two liquid storage cylinders oppositely arranged on the inner wall of the mounting frame, each liquid storage cylinder is provided with a liquid storage cavity for containing liquid, a liquid inlet is formed in one side of the outer wall of each liquid storage cavity, a liquid outlet is formed in the other side of the outer wall of each liquid storage cavity, and a first pipeline set connected with one end of a cold plate is arranged on the inner wall of each liquid inlet. A second pipeline group connected with the other end of the cold plate is arranged on the inner wall of the liquid outlet; compared with the prior art, by arranging the two liquid storage cylinders, the cooling plates are alternately cooled through the cooling liquid in the liquid storage cylinders, and the problem that the heat dissipation efficiency of a single liquid storage cylinder is reduced due to temperature rise of the cooling liquid is solved.

Description

Technical Field

[0001] This invention relates to the field of chip technology, specifically to a high-efficiency liquid cooling device for GPU chips. Background Technology

[0002] GPU chips are integrated circuits specifically designed for efficient graphics rendering and parallel computing. They are widely used in games, film and television production, artificial intelligence, scientific computing, and other fields. With the rapid development of science and technology, chips are showing a trend of high integration, complexity, and high frequency. Chips are widely used in today's society. However, chips always generate a lot of heat during operation. When this heat causes the chip temperature to be too high, it will affect the operation of the chip. Excessive chip heat leads to a decrease in product stability and performance. Therefore, chip heat dissipation is particularly important. Chip liquid cooling devices are efficient heat dissipation systems that use liquid circulation to remove heat from the chip. The core principle is to use the high heat capacity and high thermal conductivity of the liquid to quickly transfer the heat generated by the chip to the heat dissipation unit far away from the heat source, ensuring that the chip operates stably within a safe temperature range.

[0003] CN220491879U discloses a chip and a chip heat dissipation device, including an upper housing. A heat sink is fixedly connected to the top of the upper housing, and mounting blocks are fixedly connected to the left and right sides of the top of the upper housing. A first heat dissipation component is fixedly installed on the top of the two mounting blocks. A chip body is installed in the inner cavity of the upper housing. The chip body has rectangular mounting holes arranged in a row at the top of the chip body. A second heat dissipation component is arranged below the chip body. A lower housing is connected to the bottom of the upper housing. A heat dissipation space is opened in the inner cavity of the lower housing. The second heat dissipation component is installed on the bottom wall of the inner cavity of the lower housing. The heat generated during chip operation is dispersed upward by the heat sink, dispersed to the outside by the cooling fan, and the temperature of the chip is reduced by the condensate pipe, thus reducing heat generation. The temperature of the chip surface is reduced by the heat dissipation plate on the surface of the condensate pipe, thereby improving the chip heat dissipation efficiency.

[0004] In the prior art, the cooling process for the chip involves circulating the coolant in the storage tank through a liquid pump and delivery pipes. However, when the chip is used under high load for a long time, the coolant in the storage tank will continue to heat up, resulting in an overall increase in the temperature of the coolant and affecting the cooling effect on the chip. Therefore, we propose an efficient liquid cooling device for GPU chips to solve this defect of the prior art. Summary of the Invention

[0005] To achieve the above objectives, the present invention provides the following technical solution: a high-efficiency liquid cooling heat dissipation device for GPU chips, including a mounting bracket, a cold plate fixedly disposed on the top of the outer wall of the mounting bracket, a heat-generating chip disposed on the top of the cold plate, and a heat dissipation mechanism disposed on the outer wall of the mounting bracket at the bottom of the cold plate; The heat dissipation mechanism includes two liquid storage cylinders arranged opposite each other on the inner wall of the mounting bracket. Each liquid storage cylinder has a liquid storage chamber for containing liquid. An inlet is opened on one side of the outer wall of the liquid storage chamber, and an outlet is opened on the other side of the outer wall of the liquid storage chamber. A first pipe assembly connected to one end of the cold plate is provided on the inner wall of the inlet, and a second pipe assembly connected to the other end of the cold plate is provided on the inner wall of the outlet.

[0006] Furthermore, the first pipe assembly includes a first L-shaped pipe located at one end of the cold plate, a first tee pipe connected to the end of the first L-shaped pipe away from the cold plate, the first tee pipe having a first inlet pipe and a second inlet pipe respectively connected to two liquid inlets, a first opening and closing valve located on the outer wall of the first inlet pipe, and a second opening and closing valve located on the outer wall of the second inlet pipe.

[0007] Furthermore, the second pipe assembly includes a second L-shaped pipe located at the other end of the cold plate. A drive water pump is provided on the outer wall of the second L-shaped pipe. A second tee pipe is connected to the end of the second L-shaped pipe away from the cold plate. The second tee pipe is provided with a first liquid outlet pipe and a second liquid outlet pipe respectively connected to two liquid outlets. A first synchronization valve is provided on the outer wall of the first liquid outlet pipe, and a second synchronization valve is provided on the outer wall of the second liquid outlet pipe.

[0008] Furthermore, a control panel is provided on the top of the outer wall of the mounting bracket, and a temperature sensing probe for sending electrical signals to the control panel is provided on the inner wall of the liquid storage chamber.

[0009] Furthermore, multiple mounting slots are equidistantly provided through the top of the inner wall of the liquid storage cavity. The heat dissipation mechanism also includes a heat-conducting block that slides in the mounting slot. The heat-conducting block has a heat-conducting part that extends into the liquid storage cavity for contact with the coolant. An mounting plate is formed on the outer wall of the heat-conducting block at the top of the heat-conducting part. A sealing strip is provided at the bottom of the outer wall of the mounting plate that extends into the gap of the mounting slot.

[0010] Furthermore, extension plates are formed at both ends of the top of the outer wall of the liquid storage cylinder, and the heat dissipation mechanism also includes a protective cover that is slidably connected to the side wall of the extension plate. Multiple ventilation slots are equidistantly opened on both sides of the outer wall of the protective cover, and multiple cooling fans are provided on the top of the outer wall of the protective cover.

[0011] Furthermore, a replenishment mechanism is provided on the inner wall of the mounting frame at the bottom of the liquid storage cylinder. The replenishment mechanism includes two replenishment cylinders fixedly installed at the bottom of the inner wall of the mounting frame. The top of the outer wall of one replenishment cylinder is connected to a third pipe assembly that communicates with one end of the two liquid storage cylinders, and the top of the outer wall of the other replenishment cylinder is connected to a fourth pipe assembly that communicates with the other end of the two liquid storage cylinders.

[0012] Furthermore, the third pipeline group includes a first main pipeline connected to the inner wall of the replenishment cylinder, and the first main pipeline is provided with a first branch pipeline connected to one side of the inner wall of the two storage cylinders. The fourth pipeline group includes a second main pipeline connected to the inner wall of the replenishment cylinder, and the second main pipeline is provided with a second branch pipeline connected to the other side of the inner wall of the two storage cylinders.

[0013] Furthermore, the replenishing cylinder is provided with a replenishing cavity for storing liquid. A drive rod is rotatably connected to both sides of the outer wall of the replenishing cylinder. The two ends of the drive rod are respectively formed with threads. A connecting plate is threaded to the outer wall of the drive rod at the thread. One end of the connecting plate forms a squeezing plate that extends into the replenishing cavity. A drive motor is fixedly connected to both sides of the top of the outer wall of the replenishing cylinder. A first transmission gear is fixedly connected to the drive end of the drive motor. A second drive gear corresponding to the first transmission gear is formed on the outer wall of the drive rod. A drive chain is provided between the first transmission gear and the second drive gear.

[0014] Furthermore, a replenishment port is formed at the top of the outer wall of the replenishment cylinder, and a cap is threaded onto the top of the outer wall of the replenishment port. Beneficial effects

[0015] Compared with the prior art, the present invention provides a highly efficient liquid cooling device for GPU chips, which has the following beneficial effects: 1. After the coolant temperature inside the liquid storage tank reaches the set temperature, the other liquid storage tank is connected to the cold plate through the first pipe group and the second pipe group for circulation. The coolant in the other liquid storage tank is used for cooling. Compared with the prior art, this application sets two liquid storage tanks and uses the coolant inside them to alternately cool the cold plate, avoiding the problem of reduced heat dissipation efficiency caused by the temperature rise of the coolant in a single liquid storage tank.

[0016] 2. The cleaning fluid in the replenishment chamber is discharged into the storage tank through the fourth pipeline group to flush the residual coolant on the inner wall of the storage tank, thereby cleaning the storage tank.

[0017] 3. Start the cooling fan to quickly extract the air from inside the protective cover. Outside air flows into the protective cover through the vent slot to cool the heat conduction block. The heat conduction block cools the coolant in the liquid storage chamber, thereby improving the heat dissipation efficiency of the coolant in the liquid storage chamber. At the same time, it can also cool down another unused liquid storage tank, increasing the service life of the coolant in a single liquid storage tank. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of an efficient liquid cooling device for GPU chips proposed in this invention. Figure 2 This is a schematic front cross-sectional view of the overall high-efficiency liquid cooling heat dissipation device for GPU chips proposed in this invention. Figure 3 This is a schematic side cross-sectional view of an efficient liquid cooling device for GPU chips proposed in this invention. Figure 4 This is a schematic diagram showing the positions of the liquid storage tank, the first pipe group, and the second pipe group in a high-efficiency liquid cooling device for GPU chips proposed in this invention. Figure 5This is a schematic diagram showing the location of the liquid storage tank and protective cover of a high-efficiency liquid cooling device for GPU chips proposed in this invention. Figure 6 This is a side cross-sectional view of the liquid storage tank of a high-efficiency liquid cooling heat dissipation device for GPU chips proposed in this invention. Figure 7 This is a schematic diagram of a heat-conducting block for a high-efficiency liquid cooling heat dissipation device for GPU chips proposed in this invention. Figure 8 This is a schematic diagram of the liquid cooling device for GPU chips proposed in this invention, including the liquid replenishment cylinder, the third pipe group, and the fourth pipe group. Figure 9 This is a schematic diagram of the liquid replenishment cylinder for a high-efficiency liquid cooling device for GPU chips proposed in this invention. Figure 10 This is a side cross-sectional view of the liquid replenishment cylinder of a high-efficiency liquid cooling device for GPU chips proposed in this invention.

[0019] In the diagram: 100, mounting bracket; 110, cold plate; 120, heating chip; 200, heat dissipation mechanism; 210, liquid storage tank; 211, liquid storage chamber; 212, liquid inlet; 213, liquid outlet; 214, mounting groove; 215, extension plate; 220, first pipe assembly; 221, first L-shaped pipe; 222, first tee pipe; 223, first liquid inlet pipe; 2231, first opening and closing valve; 224, second liquid inlet pipe; 2241, second opening and closing valve; 230, second pipe assembly; 231, second L-shaped pipe; 232, second tee pipe; 233, first liquid outlet pipe; 2331, first synchronization valve; 234, second liquid outlet pipe; 2341, second synchronization valve; 235, drive water pump; 250, control... Panel; 251. Temperature sensor; 260. Heat-conducting block; 261. Heat-conducting part; 262. Mounting plate; 263. Sealing strip; 270. Protective cover; 271. Ventilation groove; 272. Cooling fan; 300. Liquid replenishment mechanism; 310. Liquid replenishment cylinder; 311. Liquid replenishment chamber; 320. Third pipe group; 321. First main pipe; 322. First branch pipe; 330. Fourth pipe group; 331. Second main pipe; 332. Second branch pipe; 340. Drive rod; 341. Threaded wire; 342. Connecting plate; 343. Extrusion plate; 344. Second drive gear; 350. Drive motor; 351. First transmission gear; 352. Drive chain; 360. Liquid replenishment port; 361. Cap. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see Figures 1 to 5 A high-efficiency liquid cooling heat dissipation device for GPU chips includes a mounting bracket 100, a cold plate 110 fixedly provided on the top of the outer wall of the mounting bracket 100, a heat-generating chip 120 provided on the top of the cold plate 110, and a heat dissipation mechanism 200 provided on the outer wall of the mounting bracket 100 at the bottom of the cold plate 110. The heat dissipation mechanism 200 includes two liquid storage cylinders 210 arranged opposite each other on the inner wall of the mounting bracket 100. Each liquid storage cylinder 210 has a liquid storage chamber 211 for containing liquid. One side of the outer wall of the liquid storage chamber 211 has an inlet 212 and the other side of the outer wall of the liquid storage chamber 211 has an outlet 213. The inner wall of the inlet 212 is provided with a first pipe assembly 220 connected to one end of the cold plate 110, and the inner wall of the outlet 213 is provided with a second pipe assembly 230 connected to the other end of the cold plate 110.

[0022] In use, this application first connects one of the liquid storage cylinders 210 to the cold plate 110 via the first pipe group 220 and the second pipe group 230. A drive water pump 235 draws coolant from the liquid storage cylinder 210 into the cold plate 110, and then the second pipe group 230 returns the drawn coolant to the liquid storage cylinder 210, thus circulating the coolant within the cold plate 110 and cooling the heat-generating chip 120. When the coolant temperature inside the liquid storage cylinder 210 reaches a certain level, the other liquid storage cylinder 210 is connected to the cold plate 110 via the first pipe group 220 and the second pipe group 230 for circulation, cooling the cold plate 110 with the coolant inside the other liquid storage cylinder 210. Compared with existing technologies, this application, by setting two liquid storage cylinders 210, allows the coolant inside each cylinder to alternately cool the cold plate 110, avoiding the problem of the coolant temperature inside a single liquid storage cylinder 210 increasing after prolonged use and affecting the cooling effect.

[0023] Please see Figures 1 to 6The first pipe assembly 220 includes a first L-shaped pipe 221 located at one end of the cold plate 110. A first tee pipe 222 is connected to the end of the first L-shaped pipe 221 away from the cold plate 110. The first tee pipe 222 has a first inlet pipe 223 and a second inlet pipe 224 respectively connected to two liquid inlets 212. A first opening / closing valve 2231 is provided on the outer wall of the first inlet pipe 223, and a second opening / closing valve 2241 is provided on the outer wall of the second inlet pipe 224. The second pipe assembly 230 includes a second L-shaped pipe 231 located at the other end of the cold plate 110. A drive water pump 235 is provided on the outer wall. The end of the second L-shaped pipe 231 away from the cold plate 110 is connected to a second three-way pipe 232. The second three-way pipe 232 is provided with a first liquid outlet pipe 233 and a second liquid outlet pipe 234 respectively connected to two liquid outlets 213. A first synchronization valve 2331 is provided on the outer wall of the first liquid outlet pipe 233, and a second synchronization valve 2341 is provided on the outer wall of the second liquid outlet pipe 234. A control panel 250 is provided on the top of the outer wall of the mounting bracket 100, and a temperature sensing probe 251 for sending electrical signals to the control panel 250 is provided on the inner wall of the liquid storage chamber 211.

[0024] In the above-described process, when the device is in use, the control panel 250 controls the first opening valve 2231 to open and the second opening valve 2241 to close. The coolant in the reservoir 210 located at the first opening valve 2231 flows through the first inlet pipe 223 into the first three-way pipe 222, and then into the first L-shaped pipe 221 to inject coolant into the cold plate 110. Once the coolant in the reservoir 210 reaches the specified temperature, the control panel 250 controls the first opening valve 2231 to close and the second opening valve 2241 to open, thereby canceling the original connection between the reservoir 210 and the cold plate 110 and connecting the other reservoir 210 to the cold plate 110. Once the reservoir 210 also reaches the specified temperature, the control panel 250 controls the second opening valve 2241 to open again. The system switches between different coolant reservoirs 210 in a continuous cycle. Simultaneously, when the first opening / closing valve 2231 opens, the control panel 250 simultaneously controls the first synchronization valve 2331 to open synchronously. Similarly, when the second opening / closing valve 2241 opens, the control panel 250 also controls the second synchronization valve 2341 to open, allowing the coolant extracted from the reservoir 210 to return to the current reservoir 210, thus achieving self-circulation of the coolant within the reservoir 210. Furthermore, when the temperature sensor 251 in the currently used reservoir 210 detects that the coolant has reached a specified temperature, it sends an electrical signal to the control panel 250 to connect the other reservoir 210 to the cold plate 110, thereby achieving automatic switching between the two reservoirs 210.

[0025] Please see Figures 4 to 7The top of the inner wall of the liquid storage chamber 211 is provided with multiple mounting slots 214 at equal intervals. The heat dissipation mechanism 200 also includes a heat-conducting block 260 slidably disposed in the mounting slot 214. The heat-conducting block 260 is provided with a heat-conducting part 261 that extends into the liquid storage chamber 211 for contact with the coolant. An mounting plate 262 is formed on the outer wall of the heat-conducting block 260 at the top of the heat-conducting part 261. A sealing strip 263 that extends into the gap of the mounting slot 214 is provided at the bottom of the outer wall of the mounting plate 262. Extension plates 215 are formed at both ends of the top of the outer wall of the liquid storage cylinder 210. The heat dissipation mechanism 200 also includes a protective cover 270 that is slidably connected to the side wall of the extension plate 215. Multiple ventilation slots 271 are provided at equal intervals on both sides of the outer wall of the protective cover 270. Multiple cooling fans 272 are provided on the top of the outer wall of the protective cover 270.

[0026] In the above process, multiple heat-conducting blocks 260 are installed on the inner wall of the mounting groove 214, so that the heat-conducting part 261 extends into the liquid storage cavity 211. The heat-conducting blocks 260 are then fixed to the surface of the liquid storage cylinder 210 by the mounting plate 262, and the gap between the mounting groove 214 and the heat-conducting blocks 260 is sealed by the sealing strip 263. The heat-conducting blocks 260 cool the coolant in the liquid storage cavity 211, thereby reducing the cooling efficiency of the coolant in the liquid storage cavity 211. At the same time, the other unused liquid storage cylinder 210 can also be cooled. Meanwhile, by snapping the protective cover 270 onto the extension plate 215, the protective cover 270 can protect the heat-conducting blocks 260. At the same time, the cooling fan 272 is activated to quickly extract the air inside the protective cover 270, and the outside air flows into the protective cover 270 through the vent groove 271 to cool the heat-conducting blocks 260.

[0027] Please see Figures 3 to 10 The inner wall of the mounting bracket 100 is provided with a replenishment mechanism 300 at the bottom of the liquid storage cylinder 210. The replenishment mechanism 300 includes two replenishment cylinders 310 fixedly installed at the bottom of the inner wall of the mounting bracket 100. The top of the outer wall of one replenishment cylinder 310 is connected to a third pipe group 320 that communicates with one end of the two liquid storage cylinders 210. The top of the outer wall of the other replenishment cylinder 310 is connected to a fourth pipe group 330 that communicates with the other end of the two liquid storage cylinders 210. The third pipe group 320 includes a first main pipe 321 that communicates with the inner wall of the replenishment cylinder 310. The first main pipe 321 has a first branch pipe 322 that communicates with one side of the inner wall of the two liquid storage cylinders 210. The fourth pipe group 330 includes a second main pipe 331 that communicates with the inner wall of the replenishment cylinder 310. The second main pipe 331 has a second branch pipe 332 that communicates with the other side of the inner wall of the two liquid storage cylinders 210.

[0028] As mentioned above, considering that in actual use, after a period of use, the coolant inside the reservoir 210 will decrease due to evaporation and other reasons, thus affecting the cooling effect of the device, both the first branch pipe 322 and the second branch pipe 332 are equipped with manually operable valves. When replenishment is required, the valve of the corresponding first branch pipe 322 below the reservoir 210 to be replenished is opened, allowing the coolant in the reservoir 310 to flow into the corresponding first branch pipe 322 through the first main pipe 321, adding liquid to the reservoir 211, thereby achieving the replenishment of coolant. Considering the long-term coolant replenishment... After use, its internal properties change and it needs to be replaced. The coolant in the storage chamber 211 can be completely put into the replenishment cylinder 310 through the first branch pipe 322 and the first main pipe 321 to replace the coolant in the storage cylinder 210. At the same time, cleaning fluid is put into another replenishment cylinder 310 and sent into the second branch pipe 332 through the second main pipe 331. The valve on the second branch pipe 332 is opened to connect the second branch pipe 332 with the storage cylinder 210, and the cleaning fluid is sent into the storage cylinder 210 to clean the inside of the storage cylinder 210.

[0029] Please see Figures 4 to 10 The replenishment cylinder 310 is provided with a replenishment chamber 311 for storing liquid. A drive rod 340 is rotatably connected to both sides of the outer wall of the replenishment cylinder 310. The two ends of the drive rod 340 are respectively formed with threaded lines 341. A connecting plate 342 is threadedly connected to the outer wall of the drive rod 340 at the threaded line 341. One end of the connecting plate 342 forms a squeezing plate 343 that extends into the replenishment chamber 311. A drive motor 350 is fixedly connected to both sides of the top of the outer wall of the replenishment cylinder 310. A first transmission gear 351 is fixedly connected to the drive end of the drive motor 350. A second drive gear 344 corresponding to the first transmission gear 351 is formed on the outer wall of the drive rod 340, and a drive chain 352 is provided between the first transmission gear 351 and the second drive gear 344. A replenishment port 360 is formed on the top of the outer wall of the replenishment cylinder 310, and a cap 361 is threadedly connected to the top of the outer wall of the replenishment port 360.

[0030] In the above-mentioned process, when the coolant inside the replenishment cylinder 310 is completely drained into the third pipe group 320 during use, the operator can replace the coolant in the reservoir 210. By starting the drive motor 350, the drive motor 350 drives the first transmission gear 351 to rotate. The drive chain 352 on the first transmission gear 351 drives the two extrusion plates 343 to move towards the center of the replenishment chamber 311, compressing the space inside the replenishment chamber 311 and pushing the coolant or cleaning fluid in the replenishment chamber 311 into the first main pipe 321 or the second main pipe 331, thereby replacing the coolant in the reservoir 210. The addition and discharge of coolant: A liquid inlet is provided on the upper side wall of the liquid storage cylinder 210, through which coolant is injected into the liquid storage cylinder 210. A drain outlet is provided on the lower side wall of the liquid storage cylinder 210, which is a common technical means in the field and will not be described in detail here. When the coolant in the liquid storage cylinder 210 is replaced, it is discharged through the drain outlet on the lower side wall of the liquid storage cylinder 210. After the liquid inside the liquid storage cylinder 210 is drained, the two extrusion plates 343 are moved to both ends of the drive rod 340, and coolant is filled into the liquid replenishment cylinder 310 through the liquid replenishment port 360.

[0031] Working principle and usage steps: The control panel 250 controls the first opening valve 2231 to open and the second opening valve 2241 to close. The coolant in the reservoir 210 located at the first opening valve 2231 flows into the first three-way pipe 222 through the first inlet pipe 223, and then into the first L-shaped pipe 221 to inject coolant into the cold plate 110. Simultaneously, when the first opening valve 2231 opens, the control panel 250 also controls the first synchronization valve 2331 to open synchronously, allowing the coolant drawn from the reservoir 210 to return to the current reservoir 210. Once the coolant in the current reservoir 210 reaches the specified temperature... The control panel 250 controls the first opening and closing valve 2231 to close and the second opening and closing valve 2241 to open, thereby canceling the original connection between the liquid storage tank 210 and the cold plate 110. When the second opening and closing valve 2241 is opened, the control panel 250 also controls the second synchronization valve 2341 to open, so that the coolant drawn out of the liquid storage tank 210 can return to the current liquid storage tank 210, realizing the self-circulation of the coolant in the liquid storage tank 210. The cooling fan 272 is started to quickly draw out the air inside the protective cover 270, and the outside air flows into the protective cover 270 through the vent 271 to cool the heat conduction block 260, thereby cooling the coolant.

[0032] When coolant needs to be added to the reservoir 210, the drive motor 350 on the coolant replenishment cylinder 310 is started. The drive motor 350 drives the first transmission gear 351 to rotate. The drive chain 352 on the first transmission gear 351 drives the extrusion plate 343 to move towards the center of the replenishment chamber 311, compressing the space in the replenishment chamber 311 and pushing the coolant in the replenishment chamber 311 into the first main pipe 321. The valve on the first branch pipe 322 is manually opened, and the coolant in the replenishment chamber 311 flows into the reservoir 210 through the first branch pipe 322, thereby realizing the addition of coolant to the inside of the reservoir 210.

[0033] When the coolant inside the replenishment cylinder 310 is completely drained into the third pipe group 320, open the drain opening at the lower side wall of the reservoir 210 to drain the coolant that needs to be replaced from the reservoir 210. The operator closes the valve on the first branch pipe 322 and starts the drive motor 350 on the replenishment cylinder 310 containing cleaning fluid to drain the cleaning fluid in the replenishment chamber 311 into the reservoir 210 through the fourth pipe group 330 to flush the residual coolant on the inner wall of the reservoir 210. Then, open the drain opening at the lower side wall of the reservoir 210 to drain the cleaning fluid.

[0034] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An efficient GPU chip liquid cooling heat dissipation device, comprising a mounting frame (100), a cold plate (110) is fixedly arranged on the top of the outer wall of the mounting frame (100), a heat generating chip (120) is arranged on the top of the cold plate (110), and a heat dissipation mechanism (200) is arranged on the outer wall of the mounting frame (100) at the bottom of the cold plate (110); characterized in that: the heat dissipation mechanism (200) comprises two liquid storage cylinders (210) oppositely arranged at the inner wall of the mounting frame (100), the liquid storage cylinder (210) is provided with a liquid storage cavity (211) for containing liquid, a liquid inlet (212) is formed on one side of the outer wall of the liquid storage cavity (211), a liquid outlet (213) is formed on the other side of the outer wall of the liquid storage cavity (211), a first pipeline group (220) connected to one end of the cold plate (110) is arranged at the inner wall of the liquid inlet (212), and a second pipeline group (230) connected to the other end of the cold plate (110) is arranged at the inner wall of the liquid outlet (213).

2. The high-efficiency GPU chip liquid cooling heat dissipation device according to claim 1, characterized in that: The first pipeline group (220) comprises a first L-shaped pipe (221) arranged at one end of the cold plate (110), the first L-shaped pipe (221) is connected with a first three-way pipe (222) away from one end of the cold plate (110), the first three-way pipe (222) is provided with a first liquid inlet pipe (223) and a second liquid inlet pipe (224) connected with two liquid inlets (212) respectively, and a first opening and closing valve (2231) is arranged on the outer wall of the first liquid inlet pipe (223), and a second opening and closing valve (2241) is arranged on the outer wall of the second liquid inlet pipe (224).

3. The high-efficiency GPU chip liquid cooling heat dissipation device according to claim 2, characterized in that: The second pipeline group (230) comprises a second L-shaped pipe (231) arranged at the other end of the cold plate (110), the second L-shaped pipe (231) is provided with a driving water pump (235) on the outer wall, the second L-shaped pipe (231) is connected with a second three-way pipe (232) away from one end of the cold plate (110), the second three-way pipe (232) is provided with a first liquid outlet pipe (233) and a second liquid outlet pipe (234) connected with two liquid outlets (213) respectively, a first synchronous valve (2331) is arranged on the outer wall of the first liquid outlet pipe (233), and a second synchronous valve (2341) is arranged on the outer wall of the second liquid outlet pipe (234).

4. The high-efficiency GPU chip liquid cooling heat dissipation device according to claim 1, characterized in that: A control panel (250) is arranged on the top of the outer wall of the mounting frame (100), and a temperature sensing probe (251) for sending an electric signal to the control panel (250) is arranged at the inner wall of the liquid storage cavity (211).

5. The high-efficiency GPU chip liquid cooling heat dissipation device according to claim 1, characterized in that: A plurality of mounting grooves (214) are equidistantly and penetratively formed on the inner wall of the liquid storage cavity (211), the heat dissipation mechanism (200) further comprises a heat conduction block (260) slidingly arranged in the mounting groove (214), the heat conduction block (260) is provided with a heat conduction part (261) deeply arranged in the liquid storage cavity (211) for contacting the cooling liquid, a mounting plate (262) is formed on the outer wall of the heat conduction block (260) at the top of the heat conduction part (261), and a sealing strip (263) deeply arranged in the gap of the mounting groove (214) is arranged on the bottom of the outer wall of the mounting plate (262).

6. The high-efficiency GPU chip liquid cooling heat dissipation device according to claim 5, characterized in that: The outer wall of the liquid storage cylinder (210) is provided with extension plates (215) at the top of both ends, the heat dissipation mechanism (200) further comprises a protective cover (270) slidably connected to the side wall of the extension plate (215), a plurality of air vents (271) are equidistantly arranged on the outer wall of the protective cover (270), and a plurality of heat dissipation fans (272) are arranged on the top of the outer wall of the protective cover (270).

7. The high-efficiency GPU chip liquid cooling heat dissipation device according to claim 1, characterized in that: The inner wall of the mounting rack (100) is provided with a liquid supplementing mechanism (300) at the bottom of the liquid storage cylinder (210), the liquid supplementing mechanism (300) comprises two liquid supplementing cylinders (310) fixedly arranged on the inner wall of the mounting rack (100), one end of each of the two liquid supplementing cylinders (310) is connected with a third pipeline group (320) in communication with one end of the two liquid storage cylinders (210), and the other end of each of the two liquid supplementing cylinders (310) is connected with a fourth pipeline group (330) in communication with the other end of the two liquid storage cylinders (210).

8. The high-efficiency GPU chip liquid cooling heat dissipation device according to claim 7, characterized in that: The third pipeline group (320) comprises a first main pipeline (321) in communication with the inner wall of the liquid supplementing cylinder (310), and the first main pipeline (321) is provided with a first branch pipeline (322) in communication with one side of the inner wall of the two liquid storage cylinders (210); the fourth pipeline group (330) comprises a second main pipeline (331) in communication with the inner wall of the liquid supplementing cylinder (310), and the second main pipeline (331) is provided with a second branch pipeline (332) in communication with the other side of the inner wall of the two liquid storage cylinders (210).

9. The high-efficiency GPU chip liquid cooling heat dissipation device according to claim 8, characterized in that: The liquid supplementing cylinder (310) is provided with a liquid supplementing cavity (311) for storing liquid, and the outer wall of the liquid supplementing cylinder (310) is rotatably connected with a driving rod (340) on both sides, the two ends of the driving rod (340) are respectively provided with threaded lines (341), the outer wall of the driving rod (340) is threadedly connected with a connecting plate (342) at the threaded lines (341), one end of the connecting plate (342) is provided with an extrusion plate (343) extending into the liquid supplementing cavity (311), the outer wall of the liquid supplementing cylinder (310) is fixedly connected with a driving motor (350) on both sides at the top, the driving end of the driving motor (350) is fixedly connected with a first transmission gear (351), the outer wall of the driving rod (340) is provided with a second driving gear (344) corresponding to the first transmission gear (351), and the first transmission gear (351) and the second driving gear (344) are provided with a driving chain (352) therebetween.

10. The high-efficiency liquid cooling heat dissipation device for GPU chip according to claim 9, characterized in that: The outer wall of the liquid supplementing cylinder (310) is provided with a liquid supplementing opening (360) at the top, and the outer wall of the liquid supplementing opening (360) is threadedly connected with a cap (361).

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