Anchored light mixing structures in LED packaging devices and related methods

Abstract

A light emitting diode (LED) packaging device is disclosed, and more particularly, an anchored light mixing structure in an LED packaging device is disclosed, and a related method is also disclosed. The LED package device includes one or more LED chips and an integrated light mixing structure, such as a light collector, disposed over the LED chips for changing the far field pattern. A light mixing structure is disposed on and in place on the LED chip within the recess of the LED package device housing. A sidewall of the recess may include an alignment feature having a shape configured to receive a corresponding shape of the light mixing structure. The alternative configuration may include an alignment feature on the top surface of the LED package device outside the recess, which may be separate or in combination with a sidewall alignment feature. As disclosed herein, the alignment feature is arranged to effectively anchor the light mixing structure in place during package assembly. Additional encapsulation structures, such as encapsulation materials and / or epoxy resins, may further hold the light mixing structure in place.

Description

Technical Field

[0001] This disclosure relates to a light-emitting diode (LED) packaging device, and more specifically to an anchored light mixing structure in an LED packaging device, and also to a related method. Background Technology

[0002] Solid-state lighting devices, such as light-emitting diodes (LEDs), are finding increasing use in both consumer and commercial applications. Advances in LED technology have resulted in highly efficient, mechanically robust, and long-lasting light sources. Consequently, modern LEDs have enabled a variety of new display applications and are increasingly used in general lighting applications, often replacing incandescent and fluorescent lamps.

[0003] LEDs are solid-state devices that convert electrical energy into light and typically include one or more active layers (or active regions) of semiconductor material disposed between oppositely doped n-type and p-type layers. When a bias voltage is applied to the doped layers, holes and electrons are injected into the one or more active layers, where they recombine to produce emission of light such as visible or ultraviolet light. LED chips typically include active regions, which can be made of, for example, gallium nitride, gallium phosphide, aluminum nitride, indium nitride, gallium-indium based materials, gallium arsenide based materials, and / or organic semiconductor materials. Photons generated by the active regions are emitted in all directions.

[0004] LED packaging devices have been developed to provide mechanical support, electrical connections, and encapsulation for LED emitters. Light-emitting materials such as phosphors can also be placed close to the LED emitter to convert some of the emitted light into different wavelengths. As LED technology continues to evolve to meet the ever-changing demands of modern applications, challenges remain in meeting the operational requirements of LED packaging devices and their related components.

[0005] LED packages that contain more than one LED chip, especially those with LED chips of different colors, will exhibit varying color intensity of their far-field pattern (FFP) depending on the viewing angle. This is detrimental to color uniformity in LED displays and other applications, as the observed color changes with the viewing angle.

[0006] The field is constantly seeking improved LED and solid-state lighting devices with ideal lighting characteristics that can overcome the challenges associated with conventional lighting devices. Summary of the Invention

[0007] This disclosure relates to a light-emitting diode (LED) packaging device, and more specifically, to an anchored light mixing structure in an LED packaging device, and also to a related method. The LED packaging device includes one or more LED chips and an integrated light mixing structure, such as a light collector, disposed on the LED chips to modify the far-field pattern. Such a light collector is particularly capable of effectively mixing multiple emission point sources from multiple LED chips to substantially form a single point source or a smaller point source with improved far-field pattern uniformity. The light mixing structure is disposed on and in place within a recess of the LED packaging device housing on the LED chip. The sidewalls of the recess may include alignment features shaped to receive a corresponding shape of the light mixing structure. Alternative configurations (alone or in combination with sidewall alignment features) may include alignment features on the top surface of the LED packaging device outside the recess. As disclosed herein, the alignment features are arranged to effectively anchor the light mixing structure in place during packaging assembly. Additional encapsulation structures, such as encapsulation materials and / or epoxy resins, may further hold the light mixing structure in place.

[0008] In one aspect, an LED packaging device includes: one or more LED chips; a light collector disposed on the one or more LED chips; and at least one alignment feature configured to receive a portion of the light collector. The LED packaging device may further include a housing, wherein the housing forms a recess having a recessed bottom and one or more recessed sidewalls, and wherein at least one alignment feature is formed in the one or more recessed sidewalls. In some embodiments, the at least one alignment feature includes one or more of a notch, recess, drill hole, channel, groove, and dimple in the one or more recessed sidewalls. In some embodiments, the at least one alignment feature includes a horizontal lip extending parallel to the recessed bottom and along the one or more recessed sidewalls. In some embodiments, the ratio of the lateral dimension of the at least one alignment feature parallel to the recessed bottom to the distance from the outer wall of the housing to the edge of the at least one alignment feature closest to the one or more LED chips is less than 0.6. The LED packaging device may also include an attachment feature located within the horizontal lip. In some embodiments: the ratio of the lateral dimension of at least one alignment feature parallel to the bottom of the recess to the distance from the outer wall of the housing to the edge of the at least one alignment feature closest to one or more LED chips is less than 0.6; and the ratio of the lateral dimension of at least one alignment feature to the lateral dimension of the attachment feature in the direction parallel to the bottom of the recess is less than 0.5. In some embodiments, at least one alignment feature and the attachment feature extend continuously around the entire periphery of the recess. The LED package may also include segmented attachment features located within a horizontal lip. In some embodiments, at least one alignment feature includes a cutout shape in one or more recess sidewalls configured to receive a corresponding protrusion of a light collector. The LED package may also include attachment features located within the cutout shape. In some embodiments, at least one alignment feature includes two alignment features located on opposite sides of one or more LED chips. The LED package may also include a lead frame structure at least partially located within the housing, wherein one or more LED chips are electrically connected to one or more anode leads and one or more cathode leads of the lead frame structure. In some embodiments, a portion of one or more anode leads and a portion of one or more cathode leads extend out of the housing and bend along the bottom surface of the housing. The LED packaging apparatus may further include an underfill material located on the bottom of the recess and adjacent to one or more LED chips. The LED packaging apparatus may also include: a first encapsulation layer located on the underfill material, wherein the first encapsulation layer is situated between a light collector and the underfill material; and a second encapsulation layer located on the light collector, wherein the light collector is situated between the first encapsulation layer and the second encapsulation layer. The LED packaging apparatus may also include a lens, wherein the light collector is situated between the lens and one or more LED chips.

[0009] In another aspect, a method for manufacturing an LED packaging device includes: mounting one or more LED chips within a recess of a housing, the recess including a bottom and one or more sidewalls having one or more alignment features; disposing a first encapsulation material within the recess and on the one or more LED chips; positioning a light collector on the first encapsulation material such that a portion of the light collector is received by the one or more alignment features; and disposing a second encapsulation material within the recess and on the light collector. The method may further include: at least partially curing the first encapsulation material after the light collector is positioned and before the second encapsulation material is positioned. The method may further include: curing the second encapsulation material. In some embodiments, the second encapsulation material includes at least one of a reflective material and a light-absorbing material. In some embodiments, the first encapsulation material is disposed within the recess and at least reaches one or more alignment features. In some embodiments, the one or more alignment features include one or more of a notch, recess, drill hole, channel, groove, and dimple in the one or more recess sidewalls. In some embodiments, the one or more alignment features include a horizontal lip extending parallel to the bottom of the recess and along the one or more recess sidewalls. The method may also include an attachment feature located within the horizontal lip. In some embodiments, the attachment features are segmented within a horizontal lip. In some embodiments, one or more alignment features and attachment features extend continuously around the entire periphery of the recess. In some embodiments, one or more alignment features include cutout shapes in one or more recess sidewalls configured to receive corresponding protrusions of the light collector. The method may further include: disposing an underfill material within the recess prior to disposing the first encapsulation material.

[0010] In another aspect, an LED display includes: a display panel; and at least one LED packaging device, the at least one LED packaging device including: one or more LED chips; a light collector disposed on the one or more LED chips; and at least one alignment feature configured to receive a portion of the light collector.

[0011] In another aspect, any of the foregoing aspects (alone or together) and / or the individual aspects and features described herein may be combined to obtain additional advantages. Unless otherwise stated herein, any feature and element disclosed herein may be combined with one or more other disclosed features and elements.

[0012] Those skilled in the art will understand the scope of this disclosure and recognize its additional aspects after reading the following detailed description of preferred embodiments in conjunction with the accompanying drawings. Attached Figure Description

[0013] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate various aspects of this disclosure and, together with the specification, serve to explain the principles of this disclosure.

[0014] Figure 1A This is a top view of a light-emitting diode (LED) package containing multiple LED chips.

[0015] Figure 1B yes Figure 1A A top-view perspective view of an LED packaging device, in which the LED chip is omitted for illustrative purposes.

[0016] Figure 1C yes Figure 1A A top view of an LED packaging device, in which the light collector is positioned on top of the LED chip.

[0017] Figure 1D yes Figure 1C A top-view perspective view of an LED packaging device.

[0018] Figure 1E It is along Figure 1C The line AA is intercepted Figure 1C A cross-sectional view of an LED packaging device.

[0019] Figure 1F It is along Figure 1C The line BB cut Figure 1C A cross-sectional view of an LED packaging device.

[0020] Figure 2A This is a top view of another LED packaging device having multiple LED chips according to the principles of this disclosure.

[0021] Figure 2B yes Figure 2A A top-view perspective view of an LED packaging device, in which the LED chip is omitted for illustrative purposes.

[0022] Figure 2C yes Figure 2A A top view of an LED packaging device, wherein the light collector is positioned at... Figure 2A On top of the LED chip.

[0023] Figure 2D yes Figure 2C A top-view perspective view of an LED packaging device.

[0024] Figure 2E It is along Figure 2C The line AA is intercepted Figure 2C A cross-sectional view of an LED packaging device.

[0025] Figure 2F It is along Figure 2CThe line BB cut Figure 2C A cross-sectional view of an LED packaging device.

[0026] Figure 3A This is a top view of another LED packaging device having multiple LED chips according to the principles of this disclosure.

[0027] Figure 3B yes Figure 3A A top-view perspective view of an LED packaging device, in which the LED chip is omitted for illustrative purposes.

[0028] Figure 3C yes Figure 3A A top view of an LED packaging device, wherein the light collector is positioned at... Figure 3A On top of the LED chip.

[0029] Figure 3D yes Figure 3C A top-view perspective view of an LED packaging device.

[0030] Figure 3E It is along Figure 3C The line AA is intercepted Figure 3C A cross-sectional view of an LED packaging device.

[0031] Figure 3F It is along Figure 3C The line BB cut Figure 3C A cross-sectional view of an LED packaging device.

[0032] Figure 4A This is a top view of another LED packaging device having multiple LED chips according to the principles of this disclosure.

[0033] Figure 4B yes Figure 4A A top-view perspective view of an LED packaging device, in which the LED chip is omitted for illustrative purposes.

[0034] Figure 4C yes Figure 4A A top view of an LED packaging device, wherein the light collector is positioned at... Figure 4A On top of the LED chip.

[0035] Figure 4D yes Figure 4C A top-view perspective view of an LED packaging device.

[0036] Figure 4E It is along Figure 4C The line AA is intercepted Figure 4C A cross-sectional view of an LED packaging device.

[0037] Figure 4F It is along Figure 4CThe line BB cut Figure 4C A cross-sectional view of an LED packaging device.

[0038] Figure 5A This is a top view of another LED packaging device having multiple LED chips according to the principles of this disclosure.

[0039] Figure 5B yes Figure 5A A top-view perspective view of an LED packaging device, in which the LED chip is omitted for illustrative purposes.

[0040] Figure 5C yes Figure 5A A top view of an LED packaging device, wherein the light collector is positioned at... Figure 5A On top of the LED chip.

[0041] Figure 5D yes Figure 5C A top-view perspective view of an LED packaging device.

[0042] Figure 5E It is along Figure 5C The line AA is intercepted Figure 5C A cross-sectional view of an LED packaging device.

[0043] Figure 5F It is along Figure 5C The line BB cut Figure 5C A cross-sectional view of an LED packaging device.

[0044] Figure 6A This is a top view of another LED packaging device having multiple LED chips according to the principles of this disclosure.

[0045] Figure 6B yes Figure 6A A top-view perspective view of an LED packaging device, in which the LED chip is omitted for illustrative purposes.

[0046] Figure 6C yes Figure 6A A top view of an LED packaging device, wherein the light collector is positioned at... Figure 6A On top of the LED chip.

[0047] Figure 6D yes Figure 6C A top-view perspective view of an LED packaging device.

[0048] Figure 6E It is along Figure 6C The line AA is intercepted Figure 6C A cross-sectional view of an LED packaging device.

[0049] Figure 6F It is along Figure 6CThe line BB cut Figure 6C A cross-sectional view of an LED packaging device.

[0050] Figure 7A This is a top view of another LED packaging device having multiple LED chips according to the principles of this disclosure.

[0051] Figure 7B It is along Figure 7A The line AA is intercepted Figure 7A A cross-sectional view of an LED packaging device.

[0052] Figure 7C It is along Figure 7A The line BB cut Figure 7A A cross-sectional view of an LED packaging device.

[0053] Figure 8A This is a top view of another LED packaging device having multiple LED chips according to the principles of this disclosure.

[0054] Figure 8B yes Figure 8A A top-view perspective view of an LED packaging device, in which the LED chip is omitted for illustrative purposes.

[0055] Figure 8C yes Figure 8A A top view of an LED packaging device, wherein the light collector is positioned at... Figure 8A On top of the LED chip.

[0056] Figure 8D yes Figure 8C A top-view perspective view of an LED packaging device.

[0057] Figure 8E It is along Figure 8C The line AA is intercepted Figure 8C A cross-sectional view of an LED packaging device.

[0058] Figure 8F It is along Figure 8C The line BB cut Figure 8C A cross-sectional view of an LED packaging device.

[0059] Figure 9A This is a top view of another LED packaging device having multiple LED chips according to the principles of this disclosure.

[0060] Figure 9B yes Figure 9A A top-view perspective view of an LED packaging device, in which the LED chip is omitted for illustrative purposes.

[0061] Figure 9C yes Figure 9AA top view of an LED packaging device, wherein the light collector is positioned at... Figure 9A On top of the LED chip.

[0062] Figure 9D yes Figure 9C A top-view perspective view of an LED packaging device.

[0063] Figure 9E It is along Figure 9C The line AA is intercepted Figure 9C A cross-sectional view of an LED packaging device.

[0064] Figure 9F It is along Figure 9C The line BB cut Figure 9C A cross-sectional view of an LED packaging device.

[0065] Figure 10A This is a top view of another LED packaging device having multiple LED chips according to the principles of this disclosure.

[0066] Figure 10B yes Figure 10A A top-view perspective view of an LED packaging device, in which the LED chip is omitted for illustrative purposes.

[0067] Figure 10C yes Figure 10A A top view of an LED packaging device, wherein the light collector is positioned at... Figure 10A On top of the LED chip.

[0068] Figure 10D yes Figure 10C A top-view perspective view of an LED packaging device.

[0069] Figure 10E It is along Figure 10C The line AA is intercepted Figure 10C A cross-sectional view of an LED packaging device.

[0070] Figure 10F It is along Figure 10C The line BB cut Figure 10C A cross-sectional view of an LED packaging device.

[0071] Figure 11A This is a top view of another LED packaging device having multiple LED chips according to the principles of this disclosure.

[0072] Figure 11B yes Figure 11A A top-view perspective view of an LED packaging device, in which the LED chip is omitted for illustrative purposes.

[0073] Figure 11C yes Figure 11AA top view of an LED packaging device, wherein the light collector is positioned at... Figure 11A On top of the LED chip.

[0074] Figure 11D yes Figure 11C A top-view perspective view of an LED packaging device.

[0075] Figure 11E It is along Figure 11C The line AA is intercepted Figure 11C A cross-sectional view of an LED packaging device.

[0076] Figure 11F It is along Figure 11C The line BB cut Figure 11C A cross-sectional view of an LED packaging device.

[0077] Figure 12 Is with Figures 1A to 1F A cross-sectional view of an LED packaging device similar to an LED packaging device, wherein one or more packaging materials are formed in a recess.

[0078] Figure 13 Is with Figure 12 The cross-sectional view of the LED packaging device is similar to that of the LED packaging device, but it is applicable to the implementation of aligning features to form drill holes located in the housing.

[0079] Figure 14 A top view of various shapes for aligning features according to the principles of this disclosure is shown.

[0080] Figure 15 Is with Figures 1A to 1F The top view of the LED packaging device is similar to that of the LED packaging device, but it is applicable to the embodiment where the alignment features are set on the opposite sidewalls of the recess.

[0081] Figure 16 Is with Figure 15 The top view of the LED packaging device is similar to that of the LED packaging device, except that the protrusions of the alignment features and the light collector have different shapes.

[0082] Figure 17 Is with Figure 16 The top view of a similar LED packaging device is also applicable to implementations where the alignment features and light-collector protrusions have different shapes.

[0083] Figure 18 Is with Figure 15 The top view of the LED packaging device is similar to that of the LED packaging device, except that it is applicable to the alignment features formed above. Figure 14 The described circular or dot-shaped implementation.

[0084] Figure 19 This is a schematic process flow diagram illustrating a method for manufacturing an LED packaging apparatus according to the principles of this disclosure.

[0085] Figure 20 Is with Figure 12 The cross-sectional view is similar to that of an LED packaging device, except that a lens has been added.

[0086] Figure 21 LED displays include multiple Figures 1A to 20 A schematic diagram of a portion of the LED packaging device in any of the diagrams. Detailed Implementation

[0087] The embodiments described below provide the necessary information to enable those skilled in the art to practice the embodiments and illustrate the best mode for practicing the embodiments. After reading the following description with reference to the accompanying drawings, those skilled in the art will understand the concepts of this disclosure and will recognize the application of these concepts not specifically mentioned herein. It should be understood that these concepts and applications fall within the scope of this disclosure and the appended claims.

[0088] It will be understood that while the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element, without departing from the scope of this disclosure. As used herein, the term “and / or” includes any and all combinations of one or more associated listed items.

[0089] It will be understood that when an element such as a layer, region, or substrate is referred to as "on another element" or "extending to another element," the element may be directly on or directly extended to the other element, or intermediate elements may exist. Conversely, when an element is referred to as "directly on another element" or "directly extending to another element," no intermediate elements exist. Similarly, it will be understood that when an element such as a layer, region, or substrate is referred to as "on top of another element" or "extending over another element," the element may be directly on top of or directly extended over the other element, or intermediate elements may exist. Conversely, when an element is referred to as "directly on top of another element" or "extending directly over another element," no intermediate elements exist. It will also be understood that when an element is referred to as "connected" or "linked" to another element, the element may be directly connected or directly linked to the other element, or intermediate elements may exist. Conversely, when an element is referred to as "directly connected" or "directly linked" to another element, no intermediate elements exist.

[0090] Relative terms such as “below” or “above” or “upper” or “lower” or “horizontal” or “vertical” may be used herein to describe the relationship between one element, layer, or region and another element, layer, or region shown in the accompanying drawings. It will be understood that these terms, and those discussed above, are intended to cover different orientations of the device other than those depicted in the accompanying drawings.

[0091] The terminology used herein is for the purpose of describing certain embodiments only and is not intended to limit this disclosure. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” as used herein are also intended to include the plural forms. It will also be understood that the terms “comprising,” “including,” “having,” and / or “containing” as used herein mean the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0092] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that the terms used herein shall be interpreted as having the same meaning as they have in the context of this specification and the relevant field, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0093] Embodiments are described herein with reference to illustrative drawings of embodiments of this disclosure. Therefore, the actual dimensions of layers and elements may differ, and variations in shape from those illustrated are to be expected due to factors such as manufacturing techniques and / or tolerances. For example, areas shown or described as square or rectangular may also have circular or curved features, and areas shown as straight lines may have some irregularity. Therefore, the areas shown in the figures are schematic, and their shapes are not intended to show the precise shape of an area of ​​the device, nor are they intended to limit the scope of this disclosure. Furthermore, for illustrative purposes, the dimensions of these structures or areas may be enlarged relative to other structures or areas, and are thus provided to illustrate the general structure of the subject matter of the invention; the dimensions of these structures or areas may be drawn to scale or not. Common elements between the figures may be shown herein using common element numbers and may not be described again subsequently.

[0094] This disclosure relates to a light-emitting diode (LED) packaging device, more particularly to an anchored light mixing structure in an LED packaging device, and also to a related method. The LED packaging device includes one or more LED chips and an integrated light mixing structure, such as a light collector, disposed on the LED chips to modify the far-field pattern (FFP). Such a light collector is particularly capable of effectively mixing multiple emission point sources from multiple LED chips to substantially form a single point source with improved FFP uniformity or a smaller point source. The light mixing structure is disposed on and in place within a recess of the LED packaging device housing on the LED chip. The sidewalls of the recess may include alignment features shaped to receive a corresponding shape of the light mixing structure. Alternative configurations (alone or in combination with sidewall alignment features) may include alignment features on the top surface of the LED packaging device outside the recess. As disclosed herein, the alignment features are arranged to effectively anchor the light mixing structure in place during packaging assembly. Additional encapsulation structures, such as encapsulation materials and / or epoxy resins, may further hold the light mixing structure in place.

[0095] Before delving into the specific details of the various aspects of this disclosure, for ease of understanding, an overview of the various elements that may be included in the exemplary LED packaging apparatus of this disclosure is provided. LED chips typically include active LED structures or regions, which may have many different semiconductor layers arranged in different ways. The fabrication and operation of LEDs and their active structures are generally known in the art and are only briefly discussed herein. The layers of the active LED structure can be fabricated using known processes, one suitable process being metal-organic chemical vapor deposition. The layers of the active LED structure may include many different layers and typically include an active layer sandwiched between a reverse-doped n-type epitaxial layer and a p-type epitaxial layer, all of which are sequentially formed on a growth substrate. It should be understood that other layers and elements may also be included in the active LED structure, including but not limited to buffer layers, nucleation layers, superlattice structures, undoped layers, cladding layers, contact layers, and current diffusion layers, as well as light extraction layers and elements. Active layers may include single quantum wells, multiple quantum wells, dual heterostructures, or superlattice structures.

[0096] Active LED structures can be made from various material systems, some of which are based on group III nitrides. Group III nitrides are semiconductor compounds formed from nitrogen (N) and elements from group III of the periodic table (typically aluminum (Al), gallium (Ga), and indium (In)). Gallium nitride (GaN) is a commonly used binary compound. Group III nitrides also refer to ternary and quaternary compounds, such as aluminum gallium nitride (AlGaN), indium gallium nitride (InGaN), and aluminum indium gallium nitride (AlInGaN). For group III nitrides, silicon (Si) is a commonly used n-type dopant, and magnesium (Mg) is a commonly used p-type dopant. Therefore, for group III nitride-based material systems, the active layer, n-type layer, and p-type layer can comprise one or more layers of undoped or Si- or Mg-doped GaN, AlGaN, InGaN, and AlInGaN. Other material systems include organic semiconductors and other group III-V systems, such as gallium phosphide (GaP), gallium arsenide (GaAs), and related compounds.

[0097] Active LED structures can be grown on a substrate, which can include many materials such as sapphire, SiC, silicon, aluminum nitride (AlN), and GaN. Sapphire is a commonly used substrate for group III nitrides and has several advantages over other related substrates, including lower cost, mature manufacturing processes, and good light transmission optical properties.

[0098] Different implementations of active LED structures can emit light of different wavelengths depending on the composition of the active layer. In some implementations, the active LED structure emits blue light with a peak wavelength range of approximately 430 nanometers (nm) to 480 nm. In other implementations, the active LED structure emits green light with a peak wavelength range of 500 nm to 570 nm. In other implementations, the active LED structure emits red light with a peak wavelength range of 600 nm to 700 nm. In some implementations, the active LED structure can be configured to emit light beyond the visible spectrum, including one or more portions of the ultraviolet (UV) spectrum, or one or more portions of the near-infrared spectrum, and / or the infrared spectrum (e.g., 700 nm to 1000 nm). The UV spectrum is typically divided into three wavelength range categories, denoted by the letters A, B, and C. In this way, UV-A light is typically defined as having a peak wavelength range of 315 nm to 400 nm, UV-B is typically defined as having a peak wavelength range of 280 nm to 315 nm, and UV-C is typically defined as having a peak wavelength range of 100 nm to 280 nm. UV LEDs have garnered significant attention due to their applications in the disinfection of microorganisms in air, water, and surfaces. In other applications, UV LEDs can also incorporate one or more luminescent materials to broaden the spectrum and improve the color quality of the aggregated emission light from the LED package, thus enabling their use in visible light applications.

[0099] LED chips may also be coated with one or more luminescent materials (also referred to herein as luminescent agents), such as phosphors, such that at least some of the light emitted from the LED chip is absorbed by one or more luminescent agents and converted into light of one or more different wavelength spectra according to the characteristics of the one or more luminescent agents. In this respect, at least one luminescent agent that receives at least a portion of the light generated by the LED light source can re-emit light with a peak wavelength different from that of the LED light source. The LED light source and one or more luminescent materials can be selected such that their combination outputs light with one or more desired characteristics (such as color, color point, intensity, etc.). In some embodiments, the aggregated emission light of the LED chip (optionally combined with one or more luminescent materials) can be arranged to provide, for example, cool white light, neutral white light, or warm white light in a color temperature range of 2500 Kelvin (K) to 10,000 K. In some embodiments, luminescent materials having cyan, green, amber, yellow, orange, and / or red peak emission wavelengths can be used. In some embodiments, the combination of the LED chip with one or more luminescent agents (e.g., phosphors) emits a mixed light that is generally white. One or more phosphors may include yellow (e.g., YAG:Ce), green (e.g., LuAg:Ce), and red (e.g., Ca). i-x-y Sr x Euy AlSiN3 luminescent phosphors and their combinations.

[0100] The luminescent materials described herein may be or may include one or more of phosphors, scintillators, luminescent inks, quantum dot materials, luminescent tapes, etc. The luminescent materials may be provided by any suitable means, such as by direct coating on one or more surfaces of an LED, dispersion in an encapsulation material configured to cover one or more LEDs, and / or coating on one or more optical or support elements (e.g., by powder coating, inkjet printing, etc.). In some embodiments, the luminescent material may be a down-conversion material or an up-conversion material, and a combination of both may be provided. In some embodiments, multiple different (e.g., different in composition) luminescent materials arranged to produce different peak wavelengths may be arranged to receive light emitted from one or more LED chips. One or more luminescent materials may be provided on one or more portions of an LED chip in various configurations. In some embodiments, the luminescent material may be provided on one or more surfaces of an LED chip, while other surfaces of such an LED chip may be free of luminescent material.

[0101] As used herein, a layer or region incident on a light-emitting device can be considered "transparent" when at least 80% of the emitted radiation can penetrate that layer or region. Furthermore, as used herein, a layer or region incident on an LED is considered "reflective" or embodies a "mirror" or "reflector" when at least 80% of the emitted radiation is reflected. In some embodiments, the emitted radiation includes visible light, such as in blue and / or green LEDs with or without a light-emitting material. In other embodiments, the emitted radiation can include invisible light. For example, in the case of GaN-based blue and / or green LEDs, silver (Ag) can be considered a reflective material (e.g., with a reflectivity of at least 80%). In the case of UV LEDs, appropriate materials can be selected to provide the desired reflectivity (and in some embodiments, a high reflectivity) and / or the desired absorptivity (and in some embodiments, a low absorptivity). In some embodiments, the "transparent" material can be configured to transmit at least 50% of the emitted radiation of the desired wavelength.

[0102] This disclosure can be applied to LED chips having various geometries, such as LED chips having vertical or horizontal geometries. LED chips with vertical geometries typically include an anode connector and a cathode connector on opposite sides or faces of the LED chip. LED chips with horizontal geometries typically include both an anode connector and a cathode connector on the same side of the LED chip opposite a substrate (such as a growth substrate). In some embodiments, the LED chip with a horizontal geometries can be mounted on a base of an LED package such that the anode connector and cathode connector are located on the face of the LED chip opposite to the base. In this configuration, wire bonding can be used to provide electrical connections to the anode and cathode connectors. In other embodiments, the LED chip with a horizontal geometries can be flip-chip mounted on the surface of a base of an LED package such that the anode connector and cathode connector are located on the face of the active LED structure adjacent to the base. In this configuration, traces or patterns can be provided on the base to provide electrical connections to the anode and cathode connectors of the LED chip. In a flip-chip configuration, the active LED structure is disposed between the substrate of the LED chip and the base of the LED package. Therefore, light emitted by the active LED structure can pass through the substrate in the desired emission direction. In other embodiments, the active LED structure can be bonded to a carrier substrate, and the growth substrate can be removed, allowing light to exit the active LED structure without passing through the growth substrate.

[0103] According to various aspects of this disclosure, an LED packaging device may include one or more elements disposed together with one or more LED chips, such as light-emitting materials, encapsulation materials, light-modulating materials, lenses, and electrical contacts. In some aspects, the LED packaging device may include a support member, such as a base or lead frame. Suitable materials for the base include, but are not limited to, ceramic materials (such as alumina or bauxite, AlN) or organic insulators (e.g., polyimide (PI) and polyphthalamide (PPA)). In other embodiments, the base may include a printed circuit board (PCB), sapphire, Si, or any other suitable material. For PCB embodiments, different types of PCBs may be used, such as standard FR-4 PCBs, metal-core PCBs, or any other type of PCB. In still other embodiments, the support structure may be a lead frame structure. Light-modulating materials may be arranged within the LED packaging device to reflect or otherwise redirect light from one or more LED chips to a desired emission direction or pattern.

[0104] In some embodiments, aspects of this disclosure relate to an LED packaging device having a lead frame structure at least partially surrounded by a body or housing. The lead frame structure can typically be made of a metal, such as copper, copper alloys, or other conductive metals. The lead frame structure may initially be a portion of a large metal structure separated during the manufacture of individual LED packaging devices. Within a single LED packaging device, the isolating portions of the lead frame structure can form the anode and cathode connectors for the LED chips. The body or housing can be made of an insulating material arranged to surround or enclose portions of the lead frame structure. For example, the body or housing may comprise one or more of PPA, PCT, EMC, FR4, BT, impregnated fibers, and / or plastics. The body can be formed on the lead frame structure prior to separation, such that the individual lead frame portions are electrically isolated from each other and mechanically supported within the single LED packaging device by the body. The body can be formed into a cup-shaped or recessed structure, wherein one or more LED chips can be mounted to the lead frame at the bottom of the recess. Some portions of the lead frame structure may extend through the recess and protrude from the body or be accessible from the outside of the body to provide external electrical connections. Encapsulation materials (such as silicone or epoxy) may fill the recess to encapsulate one or more LED chips.

[0105] As used herein, light-modulating materials can include a variety of different materials, including reflective materials that reflect or redirect light, light-absorbing materials that absorb light, and materials that act as thixotropic agents. As used herein, the term "reflective" refers to a material or particle that reflects, refracts, or otherwise redirects light. For reflective materials, light-modulating materials can include at least one of the following suspended in a binder such as silicone or epoxy resin: fused silica, fumed silica, titanium dioxide (TiO2), or metal particles. For light-absorbing materials, light-modulating materials can include at least one of the following suspended in a binder such as silicone or epoxy resin: carbon, silicon, or metal particles. Reflective and light-absorbing materials can include nanoparticles. In some embodiments, light-modulating materials can be substantially white to reflect and redirect light. In other embodiments, light-modulating materials can include substantially opaque or black colors to absorb light and enhance contrast.

[0106] As described above, an exemplary LED package device may include one or more LED chips and an integrated light mixing structure, such as a light collector. The light collector is positioned inside the LED package device and above the LED chips to modify the far-field pattern (FFP). For implementations emitting multiple colors, such as red, green, and blue LED chips, the light collector can effectively mix multiple emission point sources from multiple LED chips to substantially form a single point source for the LED package device. The light collector can be anchored and / or secured within the package device by alignment features integrated within the housing.

[0107] Alignment features can include various shapes, such as notches, recesses, drill holes, channels, grooves, and dimples, as well as other features, whose shapes correspond to the shapes of the various parts of the light collector. Alignment features can include bonding cuts of circular, square, or other shapes along the package housing. Alignment features can be spaced discontinuously along portions of the package housing. In other embodiments, one or more alignment features can be arranged continuously along the package housing, including around the entire periphery of a package housing recess. The package housing recess can include various shapes, such as a circular upper opening and a rectangular elliptical (rounded rectangle) bottom where the lead frame is exposed. During package assembly, the light collector can be positioned within the housing and locked in place by the alignment features. Such alignment features can be implemented, for example, using a vibration table, to allow for manual placement of the light collector.

[0108] The alignment features disclosed herein can be formed in portions of the package housing using various techniques, including custom injection molding, laser engraving, and textured but still demoldable etched injection molding. In some embodiments, the alignment features are formed after the housing has been formed by one or more of etching, grinding, cutting, and / or grooving.

[0109] Figure 1A This is a top view of an LED packaging device 10 having multiple LED chips 12 according to the principles of this disclosure. Figure 1B yes Figure 1A The image shows a top perspective view of an LED packaging device 10, in which the LED chip 12 is omitted for illustrative purposes. The LED chip 12 can be configured to emit the same color of light, or it can be configured to emit different colors of light, such as red, green, and blue wavelengths. The LED packaging device 10 is a lead-frame type packaging device, which includes a lead-frame structure 14 located within a housing 16. The LED chip 12 is located in a recess 16 of the housing 16. R Inside, and the exposed portion 16 is mounted and / or electrically connected to the lead frame structure 14. RThe bottom part. Figure 1A In this configuration, each LED chip 12 is mounted and electrically connected to a lead in the lead frame structure 14, and is also electrically connected to a corresponding lead via wire bonding. However, other electrical connections are also possible, such as in a lateral LED chip structure where two wires can be used to connect to opposing leads, or in a flip-chip structure where wire bonding is not required. In this way, each LED chip 12 is electrically connected to both the anode lead and the corresponding cathode lead in the lead frame structure 14. Figure 1A As shown in, recess 16 R 16 side walls S Includes one or more alignment features 18. As an example, four alignment features 18 are provided on the sidewalls 16 opposite each other. S An alignment feature 18 is provided on each sidewall of the housing 16. The alignment feature 18 can be formed as a notch or recess in the housing 16. For example... Figure 1B As shown in the optimal diagram, alignment feature 18 forms sidewall 16. S The circular cut portion, wherein a lip is present at the base of the alignment feature 18.

[0110] Figure 1C yes Figure 1A A top view of the LED packaging device 10, wherein the light collector 20 is positioned at... Figure 1A On LED chip 12. Figure 1D yes Figure 1C A top perspective view of the LED packaging device 10. As shown in the figure, the light collector 20 is located in the recess 16. R 16 along the inner sidewall S Positioning. Certain portions of the light collector 20 mate along the alignment feature 18 to effectively anchor the light collector 20 in place. For example, the light collector 20 may mate within a circular cutout portion and onto the lip of the alignment feature 18, such as... Figure 1B As shown in the diagram. According to various embodiments, the light collector 20 can have many different shapes. Figure 1C and Figure 1D In the middle, the light collector 20 includes an aperture 22 and a rod portion 24.

[0111] In some embodiments, the light concentrator 20 may be made of epoxy resin, silicone resin, or some other light-transmitting material. In addition to the aperture 22 at or near the apex, center, or top of the light concentrator 20, the light concentrator 20 may be coated with a reflective coating on its top surface. The light concentrator 20 may include a reflective material that penetrates the light concentrator 20. For example, the light concentrator 20 may be made of a white material. Light emitted by the LED chip 12 enters the light concentrator 20 and may be reflected once or multiple times, thus mixing within the light concentrator 20 before it finally exits through the aperture 22. The light mixed within the light concentrator 20 before exiting through the aperture 22 makes the light emitted from each LED chip 12 appear to originate from a single emission point or region (i.e., aperture 22), rather than from three separate and distinct locations of the LED chip 12. Therefore, the emission pattern and color of the light with angular deviation can be improved. It should be understood that when this disclosure refers to a single emission point, it is not a point in the mathematical sense, but rather refers to a single emission source (e.g., an LED chip, or the output of multiple LED chips from aperture 22). In this sense, a “point” can be referred to as a light source smaller than the described LED package 10 or system, and its size can depend on the entire system.

[0112] In some embodiments, the light collector 20 is configured to receive light from the LED chip 12, and the rod portion 24 may have a columnar shape projecting from the top, center, or apex of the light collector 20. In other embodiments, the rod portion 24 may have a shape different from that of a column. The height of the rod portion 24 allows it to reduce or avoid direct line-of-sight from the LED chip 12. In other embodiments, the light collector 20 may be formed without the rod portion 24.

[0113] Figure 1E It is along Figure 1C The line AA is intercepted Figure 1C A cross-sectional view of an LED packaging device. Figure 1F It is along Figure 1C The line BB cut Figure 1C A cross-sectional view of an LED packaging device. As shown, the alignment feature 18 is positioned to position the light collector 20 at a predetermined distance above the LED chip 12. The alignment feature 18 may include a horizontal lip portion at which the light collector 20 engages. In some embodiments, portions of the leads (e.g., anode leads and / or cathode leads) extend out of the housing 16 and bend along the bottom surface of the housing 16. This configuration can create a useful geometry or form factor suitable for outdoor applications.

[0114] Figure 2AThis is a top view of another LED packaging device 26 having multiple LED chips 12 according to the principles of this disclosure. The LED packaging device 26 and... Figures 1A to 1F The LED packaging device 10 is similar, and also includes an attachment feature 28 located in one or more alignment features 18. Figure 2B yes Figure 2A A top perspective view of the LED packaging device 26, wherein the LED chip 12 is omitted for illustrative purposes. Figure 2C yes Figure 2A A top view of the LED packaging device 26, wherein the light collector 20 is positioned at... Figure 2A On LED chip 12. Figure 2D yes Figure 2C Top-view perspective of the LED packaging device 26. Figure 2E It is along Figure 2C The line AA is intercepted Figure 2C A cross-sectional view of the LED packaging device 26. Figure 2F It is along Figure 2C The line BB cut Figure 2C A cross-sectional view of the LED packaging device 26. Attachment feature 28 may be integrally formed with one or more alignment features 18 to facilitate improved adhesion during final packaging. Attachment feature 28 may include one or more of the following: recesses, channels, dots, indentations, or textures located within one or more alignment features 18. Figure 2E As best shown, in some embodiments, the attachment feature 28 may be formed as a downwardly recessed groove or trench with a rounded bottom in the lip of the alignment feature 18. In this way, when encapsulation material (such as silicone or epoxy) is filled into the recess 16... R In the middle, some portions of the encapsulation material can fill the attachment feature 28 to better attach the light collector 20 in place.

[0115] Figure 3A This is a top view of another LED packaging device 30 having multiple LED chips 12 according to the principles of this disclosure. The LED packaging device 30 and... Figures 1A to 1F The LED packaging device 10 is similar, except that it is suitable for the recess 16. R The top is formed in a square and / or rectangular oval shape in some embodiments. Figure 3B yes Figure 3A A top perspective view of the LED packaging device 30, wherein the LED chip 12 is omitted for illustrative purposes. Figure 3C yes Figure 3A A top view of the LED packaging device 30, wherein the light collector 20 is positioned at... Figure 3A On LED chip 12. Figure 3D yes Figure 3C A top-view perspective view of the LED packaging device 30. Figure 3E It is along Figure 3C The line AA is intercepted Figure 3C A cross-sectional view of the LED packaging device 30. Figure 3F It is along Figure 3C The line BB cut Figure 3C A cross-sectional view of the LED packaging device 30.

[0116] Figure 4A This is a top view of another LED packaging device 32 having multiple LED chips 12 according to the principles of this disclosure. The LED packaging device 32 and... Figures 2A to 2F The LED packaging device 26 is similar, except that it is suitable for an implementation where the attachment feature 28 has a square bottom and / or is segmented in some alignment features 18. Figure 4B yes Figure 4A A top perspective view of the LED packaging device 32, wherein the LED chip 12 is omitted for illustrative purposes. Figure 4C yes Figure 4A A top view of the LED packaging device 32, wherein the light collector 20 is positioned at... Figure 4A On LED chip 12. Figure 4D yes Figure 4C A top-view perspective view of the LED packaging device 32. Figure 4E It is along Figure 4C The line AA is intercepted Figure 4C A cross-sectional view of the LED packaging device 32. Figure 4F It is along Figure 4C The line BB cut Figure 4C A cross-sectional view of the LED packaging device 32. The attachment feature 28 may be integrally formed with one or more alignment features 18 to facilitate improved adhesion during final packaging. Figure 4A As shown, attachment feature 28 may extend continuously along certain alignment features or extend discontinuously or segmentally along certain alignment features. For example, the left side wall and right side wall 16 R The alignment feature 18 includes segmented attachment features 28 spaced apart along the same lip edge to further facilitate attachment, while the top sidewall and bottom sidewall 16 R It then possesses the continuous attachment characteristic 28. For example... Figure 4E As best shown, the attachment feature 28 can be formed as a downwardly recessed groove or trench with a square bottom located in the lip of the alignment feature 18. In this way, when encapsulation material (such as silicone or epoxy) fills the recess 16... R In the middle, some portions of the encapsulation material can fill the attachment feature 28, thereby better attaching the light collector 20 into place.

[0117] Figure 5AThis is a top view of another LED packaging device 34 having multiple LED chips 12 according to the principles of this disclosure. The LED packaging device 34 and... Figures 1A to 1F The LED packaging device 10 is similar, except that it is applicable to an embodiment in which the alignment feature 18 is formed in a bonding cut shape, which is configured to receive the corresponding protrusion 20 of the light collector 20. P . Figure 5B yes Figure 5A A top perspective view of the LED packaging device 34, wherein the LED chip 12 is omitted for illustrative purposes. Figure 5C yes Figure 5A A top view of the LED packaging device 34, wherein the light collector 20 is positioned at... Figure 5A On LED chip 12. Figure 5D yes Figure 5C A top-view perspective view of the LED packaging device 34. Figure 5E It is along Figure 5C The line AA is intercepted Figure 5C A cross-sectional view of the LED packaging device 34. Figure 5F It is along Figure 5C The line BB cut Figure 5C A cross-sectional view of the LED packaging device 34. As shown in the figure, the protrusion 20 of the light collector 20... P It fits into the bonding cut shape of the alignment feature 18 to lock the light collector 20 in place.

[0118] Figure 6A This is a top view of another LED packaging device 36 having multiple LED chips 12 according to the principles of this disclosure. The LED packaging device 36 and... Figures 5A to 5F The LED packaging device 34 is similar, except that the bonding cut shape of the alignment feature 18 further includes an embodiment of the attachment feature 28 as described above. Figure 6B yes Figure 6A A top perspective view of the LED packaging device 36, wherein the LED chip 12 is omitted for illustrative purposes. Figure 6C yes Figure 6A A top view of the LED packaging device 36, wherein the light collector 20 is positioned at... Figure 6A On LED chip 12. Figure 6D yes Figure 6C A top-view perspective view of the LED packaging device 36. Figure 6E It is along Figure 6C The line AA is intercepted Figure 6C A cross-sectional view of the LED packaging device 36. Figure 6F It is along Figure 6C The line BB cut Figure 6C A cross-sectional view of the LED packaging device 36. As shown in the figure, the protrusion 20 of the light collector 20...P It fits into the bonding cut shape of the alignment feature 18 to lock the light collector 20 in place together with the attachment feature 28.

[0119] Figure 7A This is a top view of another LED packaging device 38 according to the principles of this disclosure, wherein the light collector 20 is positioned above a plurality of LED chips 12. The LED packaging device 38 and... Figures 6A to 6F The LED packaging device 36 is similar, except that the bonding cut shape of the alignment feature 18 extends further into a recess 16. R and along the top surface 16 of the housing 16 T Extended implementation methods. Figure 7B It is along Figure 7A The line AA is intercepted Figure 7A A cross-sectional view of the LED packaging device 38. Figure 7C It is along Figure 7A The line BB cut Figure 7A A cross-sectional view of the LED packaging device 38. As shown in the figure, the protrusion 20 of the light collector 20... P It fits into the bonding cut shape of the alignment feature 18, and also extends into the recess 16. R and along the top surface 16 of the housing 16 T Extension. In some embodiments, the protrusion 20 P extending out of the recess 16 R The top surface of part of it can be connected to the top surface 16 of housing 16. T Coplanar or below the top surface.

[0120] Figure 8A This is a top view of another LED packaging device 40 having multiple LED chips 12 according to the principles of this disclosure. The LED packaging device 40 and... Figures 1A to 1F The LED packaging device 10 is similar, except that it is adapted to one or more alignment features 18 along the sidewall 16. S Implementation method for forming a curved lip. Figure 8B yes Figure 8A A top perspective view of the LED packaging device 40, wherein the LED chip 12 is omitted for illustrative purposes. Figure 8C yes Figure 2A A top view of an LED packaging device 40, wherein the light collector 20 is positioned at... Figure 8A On LED chip 12. Figure 8D yes Figure 8C A top-view perspective view of the LED packaging device 40. Figure 8E It is along Figure 8C The line AA is intercepted Figure 8C A cross-sectional view of the LED packaging device 40. Figure 8F It is along Figure 8C The line BB cut Figure 8C A cross-sectional view of the LED packaging device 40. As shown in the figure, the recess 16... R The top is rounded, and the bottom of the recess has a rectangular elliptical shape. One or more alignment features 18 follow the recess 16. R The curvature of the sidewall 16 S The bend, and one or more alignment features 18 are formed around the recess 16. R A curved horizontal lip. When assembling the light collector 20, a portion of the light collector 20 is supported on the lip and then further attached as previously described by encapsulation material and / or epoxy resin. Figure 8E and Figure 8F As shown in the best example, sidewall 16 S The portion below the light collector 20 and the alignment feature 18 also faces the recess 16. R The bottom slopes.

[0121] Figure 9A This is a top view of another LED packaging device 42 having multiple LED chips 12 according to the principles of this disclosure. The LED packaging device 42 and... Figures 8A to 8F The LED packaging device 40 is similar, except that it is applicable to an embodiment that also includes an attachment feature 28 formed along the curved lip of the alignment feature 18. Figure 9B yes Figure 9A A top perspective view of the LED packaging device 42, wherein the LED chip 12 is omitted for illustrative purposes. Figure 9C yes Figure 9A A top view of the LED packaging device 42, wherein the light collector 20 is positioned at... Figure 9A On LED chip 12. Figure 9D yes Figure 9C Top-view perspective view of the LED packaging device 42. Figure 9E It is along Figure 9C The line AA is intercepted Figure 9C A cross-sectional view of the LED packaging device 42. Figure 9F It is along Figure 9C The line BB cut Figure 9C A cross-sectional view of the LED packaging device 42. For the LED packaging device 42, the attachment feature 28 surrounds the recess 16. R The entire periphery and along the horizontal lip edge of aligned feature 18 form a continuous groove.

[0122] Figure 10A This is a top view of another LED packaging device 44 having multiple LED chips 12 according to the principles of this disclosure. The LED packaging device 44 and... Figures 8A to 8F The LED packaging device 40 is similar, except that it is suitable for sidewall 16.S The portion below the light collector 20 and the alignment feature 18 with the recess 16 R The implementation method is vertical at the bottom. Figure 10B yes Figure 10A A top perspective view of the LED packaging device 44, wherein the LED chip 12 is omitted for illustrative purposes. Figure 10C yes Figure 10A A top view of the LED packaging device 44, wherein the light collector 20 is positioned at... Figure 10A On LED chip 12. Figure 10D yes Figure 10C A top-view perspective view of the LED packaging device 44. Figure 10E It is along Figure 10C The line AA is intercepted Figure 10C A cross-sectional view of the LED packaging device 44. Figure 10F It is along Figure 10C The line BB cut Figure 10C A cross-sectional view of the LED packaging device 44.

[0123] Figure 11A This is a top view of another LED packaging device 46 having multiple LED chips 12 according to the principles of this disclosure. The LED packaging device 46 and... Figures 8A to 8F The LED packaging device 40 is similar, except that it is applicable to embodiments that also include a plurality of attachment features 28 formed along the curved lip of the alignment feature 18. Figure 11B yes Figure 11A A top perspective view of the LED packaging device 46, wherein the LED chip 12 is omitted for illustrative purposes. Figure 11C yes Figure 11A A top view of the LED packaging device 46, wherein the light collector 20 is positioned at... Figure 11A On LED chip 12. Figure 11D yes Figure 10C A top-view perspective view of the LED packaging device 46. Figure 10E It is along Figure 11C The line AA is intercepted Figure 11C A cross-sectional view of the LED packaging device 46. Figure 11F It is along Figure 11C The line BB cut Figure 10C A cross-sectional view of the LED packaging device 46.

[0124] Figure 12 Is with Figures 1A to 1F A cross-sectional view of an LED packaging device 48 similar to the LED packaging device 10, wherein one or more packaging materials 50, 52 are formed in the recess 16. R Inside. Alignment feature 18 may include one or more recessed sidewalls 16. SMacroscopic texture features, such as notches, recesses, channels, grooves, and dots, are incorporated. During assembly, the LED chip 12 is first mounted and electrically connected to the lead frame structure 14. Next, the first encapsulation material 50 is partially filled into the recess 16. R The light collector 20 is then positioned onto the alignment feature 18, and sometimes beyond it. The light collector 20 can then be positioned onto the first encapsulation material 50 and the alignment feature 18. In some embodiments, the amount of the first encapsulation material 50 should be sufficient to result in minimal or no bubbling when the light collector 20 is positioned onto the alignment feature 18. After positioning the light collector 20, the first encapsulation material 50 can be at least partially cured to anchor the light collector 20 in place. Next, a second encapsulation material 52 can be filled onto the light collector 20 and the recess 16. R The first encapsulation material 50 and the second encapsulation material 52 are then cured. In some embodiments, the first encapsulation material 50 and the second encapsulation material 52 include light-transmitting and / or light-transparent materials, such as silicone, epoxy, and polymethyl methacrylate (PMMA), as well as other encapsulation materials. In other embodiments, since the second encapsulation material 52 is located above the light collector 20, the second encapsulation material 52 may include a reflective material for enhancing brightness or a light-absorbing material for enhancing contrast. The LED encapsulation device 48 may also include a portion located between the first encapsulation material 50 and the recess 16. R A third encapsulation material 53 is formed between the bottom of the LED chip 12 and the first encapsulation material 50 and the second encapsulation material 52, as well as the light collector 20. In some embodiments, the third encapsulation material 53 may include a light-modulating material that is reflective to the light emitted by the LED chip 12. For example, the third encapsulation material 53 may include a silicone resin having light-reflecting and / or light-refracting particles (such as titanium dioxide). In this example, the third encapsulation material 53 may be white to enhance the appearance along the recess 16. R The light reflectivity at the bottom. As used herein, the third encapsulation material 53 may also be referred to as the underfill material.

[0125] Figure 13 Is with Figure 12 The cross-sectional view of the LED packaging device 48 is similar to that of the LED packaging device 54, but is adapted to an embodiment where the alignment feature 18 forms a drilled hole located in the housing 16. As shown, the alignment feature 18 forms a hole from the sidewall 16. S A hole extending downward toward the bottom of the LED package 54. A protrusion 20 of the light collector 20. P The size and shape are designed to fit within the hole to secure the light collector 20 in place. For example... Figure 13 As shown, protrusion 20 P Extending downwards from the light collector 20 to correspond to the shape of the corresponding alignment feature 18.

[0126] Figure 14 A top view of various shapes for aligning feature 18 according to the principles of this disclosure is shown. For example, from the top view, the shapes may include triangles (i.e., 18-1), rectangles (i.e., 18-2), semicircles (i.e., 18-3), and / or circles or dots (i.e., 18-4). In some embodiments, circles or dots may be embodied as described above regarding... Figure 13 The aforementioned drilling. Figure 14 The shape shown can be set for use in the preceding text. Figures 1A to 13 Any implementation described.

[0127] Figure 15 Is with Figures 1A to 1F The LED packaging device 10 is similar to the top view of the LED packaging device 56, except that the alignment feature 18-1 is provided in the recess 16. R 16 relative sidewalls S The above implementation method. As shown in the figure, alignment feature 18-1 is formed with Figure 14 A similar triangular shape. Similarly, the protrusion 20 of the light collector 20... P It is also formed into a triangular shape to secure the light collector 20 in place.

[0128] Figure 16 Is with Figure 15 The LED packaging device 56 is a top view similar to the LED packaging device 58, except that it is adapted to align the protrusion 20 of the alignment feature 18-2 and the light collector 20. P Implementations with different shapes. As shown in the figure, alignment feature 18-2 is formed with... Figure 14 A similar rectangular shape, and the protrusion 20 of the light collector 20 P It then forms a triangular shape and fits within the rectangle of alignment feature 18-2, thereby achieving a fixed position. By using different shapes, greater tolerances can be provided for arranging the light collector 20.

[0129] Figure 17 Is with Figure 16 The top view of the LED packaging device 58 is similar to that of the LED packaging device 60, and is also applicable to the alignment feature 18-3 and the protrusion 20 of the light collector 20. P Implementations with different shapes. As shown in the figure, alignment feature 18-3 is formed with... Figure 14 A similar semi-circular shape, and the protrusion 20 of the light collector 20 P It is then formed into a triangular shape and fits within the semicircle of the alignment feature 18-3 to fix the light collector 20 in place.

[0130] Figure 18 Is with Figure 15 The top view of LED packaging device 56 is similar to that of LED packaging device 62, except that it is adapted to align feature 18-4 formed with the above-mentioned... Figure 14 The described implementation is either circular or dot-shaped. As shown in the top view, the alignment feature 18-4 forms a circular shape. In some embodiments, the alignment feature 18-4 may be formed as a drill hole, and the protrusion 20 of the light collector 20... P Positioned in the borehole, such as Figure 13 As shown in the image.

[0131] Figure 19 This is a schematic process flow diagram illustrating a method for manufacturing an LED packaging apparatus according to the principles of this disclosure. This schematic process flow can be implemented for manufacturing the aforementioned... Figures 1A to 18 Any implementation thereof. Specific manufacturing details can be found in the documentation for... Figure 12 The description, and Figure 19 The following description refers to Figure 12 The instances are provided with numbers. In the first step 66, one or more LED chips 12 are mounted in the recess 16 of the housing 16. R Inside. As mentioned above, the recess 16 R It may include one or more sidewalls having one or more alignment features 18. In the second step 68, the first encapsulation material 50 is filled into the recess 16. R Inside, one or more LED chips 12 are covered. The first encapsulation material 50 may fill the alignment feature 18 or even exceed the alignment feature. In the third step 70, the light collector 20 is positioned on the first encapsulation material 50, such that some portions or protrusions 20 of the light collector 20 are positioned such that... P (For example, Figure 5E The first encapsulation material 50 is received by one or more alignment features 18. In the fourth step 72, the second encapsulation material 52 is disposed within the recess and on the light collector 20. In some embodiments, the first encapsulation material 50 may be partially or fully cured after the light collector 20 is in place, followed by curing of the second encapsulation material 52. In some embodiments, the first encapsulation material 50 is filled to a degree that reduces or prevents the formation of air bubbles. In other embodiments, the first encapsulation material 50 may be filled to a degree sufficient to form an upper surface with a downwardly curved meniscus below the light collector 20. In this embodiment, some portions of the second encapsulation material 52 may then also fill the area between the light collector 20 and the first encapsulation material 50.

[0132] Figure 20 Is with Figure 12 The LED packaging device 48 is a cross-sectional view similar to the LED packaging device 74, except that a lens 76 is added. The lens 76 is positioned on the housing 16 and in the recess 16. RAbove this, the emission pattern (e.g., far-field pattern) of the light leaving the LED package 74 is shaped. Lens 76 may comprise various light-transmitting and / or light-transparent materials, such as silicone, epoxy, or glass. Concentrator 20 is positioned between lens 76 and LED chip 12. In this way, concentrator 20 is positioned to receive light from LED chip 12 and transmit the light into lens 76 in a more uniform manner.

[0133] Figure 21 This is a schematic diagram of a portion of an LED display screen 78 (e.g., an indoor and / or outdoor screen), which typically includes a display panel comprising a driving printed circuit board (PCB) 80 carrying a large number of surface mount devices (SMDs) 82 arranged in rows and columns, each SMD 82 defining a pixel. The SMDs 82 may include those described above regarding... Figures 1A to 20 The LED package device with LED chip 12 described in any of the embodiments shown. SMD 82 is electrically connected to traces or pads on PCB 80 in response to appropriate electrical signal processing and drive circuitry (not shown). As disclosed above, it should be understood that, although Figure 21 The LED chips 12 are depicted in a linear arrangement, but in other embodiments, the LED chips 12 may also be arranged in different configurations.

[0134] For any of the embodiments described above, alignment feature 18 and / or attachment feature 28 may be formed with relative dimensions to improve alignment and attachment while occupying a smaller area of ​​housing 16. For example, the lateral dimension of alignment feature 18 may be along, for example, Figure 1E / Figure 1F , Figure 2E / Figure 2F , Figure 3E / Figure 3F , Figure 4E / Figure 4F , Figure 5E / Figure 5F , Figure 6E / Figure 6F , Figure 7B / Figure 7C , Figure 8E / Figure 8F , Figure 9E / Figure 9F , Figure 10E / Figure 10F , Figure 11E / Figure 11F , Figures 12 to 18 as well as Figure 20 The cross-section of the LED packaging device shown in any of the figures is parallel to the recess 16. RThe measurement is taken in the direction of the bottom. In various embodiments, the ratio of the lateral dimension of the alignment feature 18 to the distance measured from the edge of the alignment feature 18 closest to the LED chip 12 to the outer wall of the housing 16 closest to the alignment feature 18 may be less than 0.6, or less than 0.5, or less than 0.4, or less than 0.25.

[0135] In a similar manner, the lateral dimension of the attachment feature 28 can be along, for example, Figure 4E / Figure 4F , Figure 6E / Figure 6F , Figure 7B / Figure 7C , Figure 9E / Figure 9F and Figure 11E / Figure 11F The cross-section of the LED packaging device shown in any of the figures is parallel to the recess 16. R The measurement is taken in the direction of the bottom. In various embodiments, the ratio of the lateral dimension of the attachment feature 28 to the lateral dimension of the corresponding alignment feature 18 on which the attachment feature 28 is formed may be less than 0.5, less than 0.3, or less than 0.2.

[0136] It is conceivable that any of the foregoing aspects and / or the individual aspects and features described herein can be combined to obtain additional advantages. Unless otherwise stated herein, any of the various embodiments disclosed herein can be combined with one or more other disclosed embodiments.

[0137] Those skilled in the art will recognize improvements and modifications to the preferred embodiments of this disclosure. All such improvements and modifications are considered to be within the scope of the concepts disclosed herein and the appended claims.

Claims

1. A light-emitting diode (LED) packaging device, comprising: One or more LED chips; A light collector is arranged on the one or more LED chips; as well as At least one alignment feature is configured to receive a portion of the light collector.

2. The LED packaging device according to claim 1 further includes a housing, wherein, The housing forms a recess having a recessed bottom and one or more recessed sidewalls, wherein the at least one alignment feature is formed in the one or more recessed sidewalls.

3. The LED packaging apparatus according to claim 2, wherein, The at least one alignment feature includes one or more of the following: notch, recess, drill hole, channel, groove, and pit in the sidewall of the one or more recesses.

4. The LED packaging apparatus according to claim 2, wherein, The at least one alignment feature includes a horizontal lip that is parallel to the bottom of the recess and extends along the sidewalls of the one or more recesses.

5. The LED packaging apparatus according to claim 4, wherein, The ratio of the lateral dimension of the at least one alignment feature parallel to the bottom of the recess to the distance from the outer wall of the housing to the edge of the at least one alignment feature closest to the one or more LED chips is less than 0.

6.

6. The LED packaging apparatus of claim 4 further includes an attachment feature located within the horizontal lip.

7. The LED packaging apparatus according to claim 6, wherein: The ratio of the lateral dimension of the at least one alignment feature parallel to the bottom of the recess to the distance from the outer wall of the housing to the edge of the at least one alignment feature closest to the one or more LED chips is less than 0.6; and The ratio of the lateral dimension of the at least one alignment feature to the lateral dimension of the attachment feature in the direction parallel to the bottom of the recess is less than 0.

5.

8. The LED packaging apparatus according to claim 6, wherein, The at least one alignment feature and the attachment feature extend continuously around the entire periphery of the recess.

9. The LED packaging device according to claim 4, further comprising a segmented attachment feature located within the horizontal lip.

10. The LED packaging apparatus according to claim 2, wherein, The at least one alignment feature includes a cutout shape in the sidewalls of the one or more recesses, the cutout shape being configured to receive a corresponding protrusion of the light collector.

11. The LED packaging apparatus of claim 10, further comprising an attachment feature located within the cutout shape.

12. The LED packaging apparatus according to claim 2, wherein, The at least one alignment feature includes two alignment features located on opposite sides of the one or more LED chips.

13. The LED packaging device according to claim 2, further comprising a lead frame structure at least partially located within the housing, wherein, The one or more LED chips are electrically connected to one or more anode leads and one or more cathode leads of the lead frame structure.

14. The LED packaging apparatus according to claim 13, wherein, A portion of the one or more anode leads and a portion of the one or more cathode leads extend out of the housing and bend along the bottom surface of the housing.

15. The LED packaging apparatus of claim 2, further comprising an underfill material located on the bottom of the recess and adjacent to the one or more LED chips.

16. The LED packaging apparatus according to claim 15, further comprising: A first encapsulation layer located on the bottom filler material, wherein the first encapsulation layer is situated between the light collector and the bottom filler material; and A second encapsulation layer is located on the light collector, wherein the light collector is located between the first encapsulation layer and the second encapsulation layer.

17. The LED packaging apparatus according to claim 1, further comprising a lens, wherein, The light collector is located between the lens and the one or more LED chips.

18. A method for manufacturing a light-emitting diode (LED) packaging device, the method comprising: One or more LED chips are mounted in a recess of the housing, the recess including a bottom and one or more sidewalls having one or more alignment features; The first encapsulation material is disposed within the recess and on one or more LED chips; Position the light collector on the first encapsulation material such that a portion of the light collector is received by the one or more alignment features; as well as The second encapsulation material is disposed within the recess and on the light collector.

19. The method of claim 18, further comprising: The first encapsulation material is at least partially cured after the light collector is installed and before the second encapsulation material is installed.

20. The method of claim 19, further comprising: The second encapsulation material is then cured.

21. The method according to claim 18, wherein, The second encapsulation material includes at least one of a reflective material and a light-absorbing material.

22. The method according to claim 18, wherein, The first encapsulation material is disposed within the recess and reaches at least one or more alignment features.

23. The method according to claim 18, wherein, The one or more alignment features include one or more of the following: notches, recesses, drill holes, channels, grooves, and dimples in the one or more recess sidewalls.

24. The method according to claim 18, wherein, The one or more alignment features include a horizontal lip that is parallel to the bottom of the recess and extends along the sidewalls of the one or more recesses.

25. The method of claim 24, further comprising an attachment feature located within the horizontal lip.

26. The method of claim 25, wherein, The attachment feature is segmented within the horizontal lip.

27. The method according to claim 25, wherein, The one or more alignment features and the attachment features extend continuously around the entire periphery of the recess.

28. The method according to claim 18, wherein, The one or more alignment features include cutout shapes in the sidewalls of the one or more recesses, the cutout shapes being configured to receive corresponding protrusions of the light collector.

29. The method of claim 18, further comprising: Before setting the first encapsulation material, the bottom filler material is placed in the recess.

30. A light-emitting diode (LED) display, comprising: Display panel; as well as At least one LED packaging device, the at least one LED packaging device comprising: One or more LED chips; A light collector, disposed on one or more of the LED chips; and At least one alignment feature is configured to receive a portion of the light collector.

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