Electronic atomization device, heating element and application of alloy sheet in electronic atomization device

Abstract

The invention provides an electronic atomization device, a heating element and application of an alloy sheet in the electronic atomization device. The electronic atomization device comprises a liquid storage cavity used for storing a liquid matrix; the heating element is used for heating the liquid substrate to generate aerosol; the heating element includes a heating portion made of a first metal or alloy having an electrical resistivity greater than 160 [mu] [Omega] * cm, a temperature coefficient of resistance greater than 200 ppm / DEG C, and a thermal conductivity less than 8 W / m.k. According to the electronic atomization device, the heating element prepared from the first metal or alloy can keep a proper balance in self heat storage and heat delivery to the liquid matrix for atomization, and the improvement of the layering sense of atomization of different components in the liquid matrix is facilitated.

Description

Technical Field

[0001] This application relates to the field of electronic atomization technology, and in particular to an electronic atomization device, a heating element, and the application of an alloy sheet in an electronic atomization device. Background Technology

[0002] Tobacco products (such as cigarettes, cigars, etc.) produce tobacco smoke by burning tobacco during use. Efforts are being made to replace these tobacco-burning products by creating products that release compounds without combustion.

[0003] Examples of such products are heating devices that release compounds by heating rather than burning a material. This material could be, for example, tobacco or other non-tobacco products, which may or may not contain nicotine. As another example, aerosol-providing articles exist, such as so-called electronic atomizing devices. These devices typically contain a liquid that is heated to vaporize, thereby producing an inhalable aerosol. This liquid may contain nicotine and / or flavorings and / or aerosol-generating substances (e.g., glycerin). Known electronic atomizing devices draw in and retain the liquid via capillary elements, with a mesh-like resistance heating element attached to the capillary elements to heat the liquid and generate an aerosol. Known resistance heating elements are made of resistive alloys containing iron, chromium, or nickel, such as stainless steel or iron-chromium-aluminum alloys; in use, these commercially available standard resistance alloys, due to their heating and thermal conductivity properties, do not create a temperature field suitable for the layered atomization of the liquid matrix. Summary of the Invention

[0004] One embodiment of this application provides an electronic atomizing device, comprising:

[0005] A liquid storage chamber is used to store a liquid matrix;

[0006] Heating elements are used to heat liquid matrices to generate aerosols;

[0007] The heating element includes a heating section made of a first metal or alloy, wherein the resistivity of the first metal or alloy is greater than 160 μΩ·cm, the temperature coefficient of resistance is greater than 200 ppm / ℃, and the thermal conductivity is less than 8 W / m·k.

[0008] In some embodiments, the first metal or alloy does not contain iron, nickel, and copper.

[0009] In some embodiments, the heating element can be configured as a tube wound from a sheet made of the first metal or alloy.

[0010] In some embodiments, the heating element can be configured as a mesh with openings.

[0011] In some embodiments, a liquid guiding element is used to deliver the liquid matrix of the liquid storage chamber to the heating element;

[0012] The heating element is at least partially integrated with the liquid guiding element.

[0013] In some embodiments, the specific heat capacity of the first metal or alloy is between 460 and 680 J / kg·K.

[0014] In some embodiments, the density of the first metal or alloy is less than 6 g / cm³. 3 .

[0015] In some embodiments, the coefficient of linear expansion of the first metal or alloy is less than 12 × 10⁻⁶. -6 / ℃. In a more preferred embodiment, the coefficient of linear expansion of the first metal or alloy is less than 10 × 10⁻⁶. -6 / ℃.

[0016] In some embodiments, the heating element can be configured as a cylindrical shape and has a wall thickness of 0.05 to 0.15 mm.

[0017] In some embodiments, the thermal conductivity of the first metal or alloy is greater than 4 W / m·K.

[0018] In some embodiments, the heating element is a cylindrical shape formed by winding a sheet; or, the heating element is sheet-shaped.

[0019] And / or, the elastic modulus of the heating element is above 80 GPa and the tensile strength is above 800 MPa.

[0020] In some embodiments, the sheet is a mesh-like structure with open openings. In some embodiments, the heating element is a cylindrical form of the sheet wound up.

[0021] In some embodiments, the sheet has a thickness of 0.05 to 0.15 mm.

[0022] In some embodiments, the first metal or alloy comprises the following components in weight percentages: 80 wt% to 95 wt% titanium, 3 wt% to 12 wt% aluminum, and 1 wt% to 16 wt% molybdenum and / or vanadium.

[0023] In some embodiments, the first metal or alloy comprises the following components in weight percentages: 80wt% to 95wt% titanium, 3wt% to 12wt% aluminum, 1wt% to 10wt% molybdenum, and 1wt% to 6wt% vanadium.

[0024] In some embodiments, the first metal or alloy further comprises the following components in weight percentages: 1 wt% to 6 wt% tin, 1 wt% to 4 wt% zirconium, 0.1 wt% to 4 wt% chromium, 0.1 wt% to 2 wt% silicon, and 0.1 wt% to 2 wt% neodymium.

[0025] In some embodiments, the heating element further includes conductive pins; the conductive pins are electrically connected to the heating element for guiding current on the heating portion;

[0026] The conductive pins include:

[0027] A conductor substrate made of a second metal or alloy, wherein the difference between the melting point of the second metal or alloy and the melting point of the first metal or alloy is less than or equal to 300°C;

[0028] A conductive cladding layer surrounds or wraps around the surface of the conductor substrate; the cladding layer is made of a third metal or alloy, and the resistivity of the third metal or alloy is less than 10 μΩ·cm.

[0029] In some embodiments, the standard electrode potential of the third metal or alloy is +0.7V to +1.5V;

[0030] And / or, the third metal or alloy is less reactive than copper.

[0031] In some embodiments, the third metal or alloy includes noble metals or alloys thereof;

[0032] And / or, the third metal or alloy includes gold, silver, platinum, palladium, ruthenium, rhodium, or alloys thereof.

[0033] In some embodiments, the third metal or alloy has a resistivity between 1 μΩ·cm and 10 μΩ·cm at 20°C.

[0034] In some embodiments, the diameter of the conductor substrate is between 0.2 and 0.5 mm;

[0035] And / or, the thickness of the coating layer is between 20 nm and 20 μm.

[0036] In some embodiments, the second metal or alloy includes at least one of stainless steel, titanium alloy, zirconium or zirconium alloy, cobalt or cobalt alloy.

[0037] In some embodiments, the conductive pins are soldered to the heating element.

[0038] In some embodiments, the cladding layer does not contain nickel and / or copper; or the conductor substrate does not contain nickel and / or copper.

[0039] In some embodiments, the heating element is a cylindrical shape formed by winding a sheet; or, the heating element is sheet-shaped.

[0040] In some embodiments, it also includes:

[0041] A liquid guiding element is used to deliver the liquid matrix from the liquid storage chamber to the heating element;

[0042] At least a portion of the conductive pin is in contact with or connected to the liquid-conducting element.

[0043] Another embodiment of this application provides a heating element for an electronic atomization device, used to heat a liquid matrix to generate an aerosol; the heating element includes:

[0044] The first conductive pin and the second conductive pin are arranged at intervals;

[0045] A heating element is electrically connected between the first conductive pin and the second conductive pin; the heating element can guide current through the first conductive pin and the second conductive pin to generate resistance Joule heating for heating; the heating element is made of a first metal or alloy.

[0046] The first conductive pin and / or the second conductive pin include:

[0047] A conductor substrate made of a second metal or alloy, wherein the difference between the melting point of the second metal or alloy and the melting point of the first metal or alloy is less than or equal to 300°C;

[0048] A conductive cladding layer surrounds or wraps the surface of the conductor substrate; the cladding layer is made of a third metal or alloy, the resistivity of which is less than 10 μΩ·cm.

[0049] Another embodiment of this application also proposes an electronic atomizing device, comprising:

[0050] A liquid storage chamber is used to store a liquid matrix;

[0051] Heating elements are used to heat liquid matrices to generate aerosols;

[0052] The heating element includes a heating section made of a first metal or alloy, the first metal or alloy comprising the following components by mass percentage: 80wt% to 95wt% titanium, 3wt% to 12wt% aluminum, and 1wt% to 16wt% molybdenum and / or vanadium.

[0053] Another embodiment of this application provides a heating element for an electronic atomization device, used to heat a liquid matrix to generate an aerosol; the heating element includes:

[0054] The heating element, formed from a sheet, is heated by resistance Joule heating; the heating element is made of a first metal or alloy, the first metal or alloy having a resistivity greater than 160 μΩ·cm, a temperature coefficient of resistance greater than 200 ppm / ℃, and a thermal conductivity less than 8 W / m·K; the sheet has a thickness of 0.05 to 0.15 mm.

[0055] Another embodiment of this application provides a heating element for an electronic atomization device, used to heat a liquid matrix to generate an aerosol; the heating element includes:

[0056] The heating element, formed from a sheet, is heated by resistance Joule heating; the heating element is made of a first metal or alloy; the first metal or alloy comprises the following components in weight percentages: 80wt% to 95wt% titanium, 3wt% to 12wt% aluminum, and 1wt% to 16wt% molybdenum and / or vanadium; the sheet has a thickness of 0.05 to 0.15 mm.

[0057] Another embodiment of this application proposes the application of an alloy sheet in an electronic atomizing device, wherein the alloy comprises the following components in weight percentages:

[0058] The sheet contains 80wt%–95wt% titanium, 3wt%–12wt% aluminum, 1wt%–10wt% molybdenum, 1wt%–6wt% vanadium, 1wt%–6wt% tin, 1wt%–4wt% zirconium, 0.1wt%–4wt% chromium, 0.1wt%–2wt% silicon, and 0.1wt%–2wt% neodymium; the sheet has a thickness of 0.05–0.15 mm.

[0059] The above electronic atomizing device, with its heating element made of a first metal or alloy, can maintain a suitable balance between storing heat itself and delivering heat to the liquid matrix for atomization, which is beneficial for improving the layering of atomization of different components in the liquid matrix. Attached Figure Description

[0060] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0061] Figure 1 This is a schematic diagram of an electronic atomizing device provided in one embodiment;

[0062] Figure 2 yes Figure 1 A schematic diagram of the structure of an embodiment of a central atomizer;

[0063] Figure 3 yes Figure 2A schematic diagram of the structure of one embodiment of the heating element;

[0064] Figure 4 This is a metallographic analysis diagram of a heating element made of a first metal or alloy in one embodiment;

[0065] Figure 5 yes Figure 2 A schematic diagram of the cross-section of the conductive pin in the middle;

[0066] Figure 6 The heating element of one embodiment and several comparative embodiments is shown as a temperature rise curve within 3 seconds under a constant power supply of 4W.

[0067] Figure 7 yes Figure 6 Temperature field distribution diagram of the heating element in an embodiment of this application under a constant power supply of 4W;

[0068] Figure 8 yes Figure 6 Temperature field distribution diagram of the heating element in Comparative Example 1 under constant power supply of 4W;

[0069] Figure 9 yes Figure 6 Temperature field distribution diagram of the heating element in Comparative Example 2 under constant power supply of 4W;

[0070] Figure 10 yes Figure 6 Temperature field distribution diagram of the heating element in Comparative Example 3 under constant power supply of 4W. Detailed Implementation

[0071] To facilitate understanding of this application, a more detailed description of this application will be provided below in conjunction with the accompanying drawings and specific embodiments.

[0072] One embodiment of this application provides an electronic atomizing device, which can be found in [reference needed]. Figure 1 As shown, it includes an atomizer 100 that stores a liquid matrix and atomizes it to generate an aerosol, and a power supply mechanism 200 that supplies power to the atomizer 100. Figure 1In the illustrated embodiment, the atomizer 100 and power supply mechanism 200 of the electronic atomizing device are detachable from each other; electronic atomizing devices with such detachable atomizer 100 and power supply mechanism 200 are, for example, so-called "refillable" electronic atomizing devices. Alternatively, in some further variations, the atomizer 100 and power supply mechanism 200 of the electronic atomizing device are securely enclosed and fixed by a housing component of the electronic atomizing device, thereby preventing the atomizer 100 and power supply mechanism 200 from being detachable from each other within the housing component. Electronic atomizing devices with such non-detachable atomizer 100 and power supply mechanism 200 are, for example, so-called "integrated or disposable" electronic atomizing devices.

[0073] In an alternative embodiment, for example Figure 1 As shown, the power supply mechanism 200 includes a receiving cavity 270 disposed at one end along the length direction for receiving and accommodating at least a portion of the atomizer 100, and an electrical contact 230 at least partially exposed on the surface of the receiving cavity 270 for supplying power to the atomizer 100 when at least a portion of the atomizer 100 is received and accommodated within the power supply mechanism 200.

[0074] A sealing element 260 is provided inside the power supply mechanism 200, and the sealing element 260 divides at least a portion of the internal space of the power supply mechanism 200 to form the receiving cavity 270. Figure 1 In the exemplary embodiment shown, the seal 260 is configured to extend along the cross-sectional direction of the power supply mechanism 200, and is preferably made of a flexible material, thereby preventing the liquid matrix that seeps from the atomizer 100 into the receiving cavity 270 from flowing into components such as the circuit board 220 and the airflow sensor 250 inside the power supply mechanism 200.

[0075] exist Figure 1 In the exemplary embodiment shown, the power supply mechanism 200 further includes a battery cell 210 for power supply, arranged away from the receiving cavity 270 along the length direction; and a circuit board 220 disposed between the battery cell 210 and the receiving cavity, on which circuitry is arranged or integrated, so that the circuit board 220 can operatively guide current between the battery cell 210 and the electrical contact 230.

[0076] In use, the power supply mechanism 200 includes an airflow sensor 250, which is used to sense the suction airflow generated when the atomizer 100 is inhaled. Then, the circuit board 220 controls the battery cell 210 to output current to the atomizer 100 according to the detection signal of the airflow sensor 250.

[0077] exist Figure 1 In the exemplary embodiment shown, the power supply mechanism 200 is provided with a charging interface 240 at the other end away from the receiving cavity 270 for charging the battery cell 210.

[0078] Figure 2 A schematic diagram of an atomizer according to one embodiment is shown, in which the atomizer 100 includes:

[0079] The outer shell 10, defining the outer surface of the atomizer 100, is made of rigid materials such as ceramic or polymer plastic; Figure 2 In the illustrated embodiment, the housing 10 is generally cylindrical; the housing 10 has a proximal end 110 and a distal end 120 opposite each other in the longitudinal direction; wherein, according to the needs of normal use, the proximal end 110 is configured as the end for the user to inhale the aerosol, and an air outlet 113 for the user to inhale is provided at the proximal end 110; while the distal end 120 is the end for connection with the power supply mechanism 200, and the distal end 120 of the housing 10 is open, the open structure for installing the necessary functional components inside the housing 10.

[0080] according to Figure 2 As shown, the interior of the outer casing 10 defines a liquid storage chamber 112 for storing a liquid matrix, and an atomizing assembly for drawing the liquid matrix from the liquid storage chamber 112 and heating and atomizing the liquid matrix. The outer casing 10 also includes a longitudinally arranged aerosol output tube 111. The space between the outer surface of the aerosol output tube 111 and the inner surface of the outer casing 10 forms a portion of the liquid storage chamber 112. One end of the aerosol output tube 111, located near its proximal end 110, communicates with an outlet 113, thereby transporting the generated aerosol to the outlet 113 for inhalation. Figure 2 As shown, the aerosol output tube 111 and the outer shell 10 are integrally molded using a moldable material, and the resulting liquid storage cavity 112 is closed on the side facing the proximal end 110 and open or open on the side facing the distal end 120.

[0081] See Figure 2 As shown, the atomizer 100 also includes:

[0082] A tubular element 14 extends longitudinally along the atomizer 100; the tubular element 14 is at least partially located within the liquid reservoir 112; Figure 2 As shown, the tubular element 14 is at least partially located between the aerosol output tube 111 and the distal end 120. The tubular element 14 is arranged coaxially with the aerosol output tube 111 along the longitudinal direction of the atomizer 100; and the tubular element 14 is airflow connected to the aerosol output tube 111.

[0083] exist Figure 2 In the illustrated embodiment, the tubular element 14 is a separate component, preferably made of a thin, rigid material; the tubular element 14 is a conductor, for example, it is made of stainless steel or aluminum alloy. Figure 2In the illustrated embodiment, the upper end of the assembled tubular element 14 is connected to the aerosol output tube 111. Specifically, a flexible sealing element 15 is arranged between the tubular element 14 and the aerosol output tube 111 to provide a seal between them. In some embodiments, the flexible sealing element 15 is made of flexible silicone, thermoplastic elastomer, etc. Alternatively, in some variations, the rigid tubular element 14 is at least partially attached to the aerosol output tube 111 by riveting or the like, the tubular element 14 surrounding at least a portion of the aerosol output tube 111 and forming a seal between them; in this variation, there is no flexible sealing element 15 between the rigid tubular element 14 and the aerosol output tube 111.

[0084] exist Figure 2 In the illustrated embodiment, a liquid storage chamber 112 for storing a liquid matrix is ​​defined between the outer surface of the aerosol output tube 111, the outer surface of the tubular element 14, and the inner surface of the housing 10.

[0085] exist Figure 2 In the illustrated embodiment, the tubular element 11 contains and is equipped with an atomizing assembly for receiving and atomizing the liquid matrix within the reservoir 112 to generate an aerosol. And according to... Figure 2 As shown, a plurality of perforations 141 are arranged on the wall of the tubular element 14; in some embodiments, the plurality of perforations 141 are arranged at intervals along the circumference of the tubular element 11, so that in use, the atomizing assembly is in fluid communication with the liquid storage chamber 112 through the perforations 141 to receive the liquid matrix.

[0086] according to Figure 2 As shown, the atomizing assembly is housed and assembled within the tubular element 14; the atomizing assembly includes a liquid guiding element 30 and a heating element 40 coupled to the liquid guiding element 30. The liquid guiding element 30 is used to draw in or receive a liquid matrix originating from the liquid storage chamber 112, and the heating element 40 is used to heat at least a portion of the liquid matrix within the liquid guiding element 30 to generate an aerosol. Alternatively, the liquid guiding element 30 is used to transfer the liquid matrix between the liquid storage chamber 112 and the heating element 40.

[0087] In some embodiments, the liquid guiding element 30 is flexible; for example, the liquid guiding element 30 is made of a flexible fibrous material such as cotton fiber, nonwoven fabric, sponge, etc.; the liquid guiding element 30 is configured as an annular shape arranged along the longitudinal direction of the outer shell 10; the liquid guiding element 30 is coaxial with the tubular element 14 and located within the tubular element 14. Specifically, for example, the liquid guiding element 30 is a tubular fibrous element formed by winding a sheet-like precursor comprising multiple layers of flexible fibers. Alternatively, in some other variations, the liquid guiding element 30 is rigid; for example, the liquid guiding element 30 may include a rigid porous element, such as porous ceramic or porous glass.

[0088] In some embodiments, the outer surface of the liquid guiding element 30 in the radial direction is either shielded from or connected to the perforation 141, thereby configuring the outer surface of the liquid guiding element 30 as an absorbent surface to receive and absorb the liquid matrix of the reservoir 112 through the perforation 141, for example... Figure 2 As indicated by the middle arrow R1, the inner surface of the liquid guiding element 30 in the radial direction is configured as an atomizing surface, which is combined / adhered to / abuts against the heating element 40; subsequently, after the liquid matrix is ​​transferred to the atomizing surface, it is heated and atomized by the heating element 40 to generate an aerosol and is released.

[0089] according to Figure 2 As shown, the atomizer 100 also includes:

[0090] End cap 20 is attached to the distal end 120 of housing 10. End cap 20 at least partially closes the distal end 120 of housing 10. End cap 20 extends at least partially into housing 10 from the distal end 120 and supports or holds tubular element 14. End cap 20 is also provided with air inlet 22 for supplying outside air into atomizer 100 during suction.

[0091] according to Figure 2 As shown, the atomizer 100 also includes:

[0092] An airflow channel is provided during suction to allow air to flow from the inlet 22 through the atomizing assembly to the outlet 113, thereby outputting the aerosol to the outlet 113. In some exemplary embodiments, the complete airflow channel is defined by multiple components. Specifically, according to... Figure 2 As shown by the middle arrow R2, the complete airflow path during suction includes: air entering from the air inlet 22 passes through the end cap 20 and flows over the atomizing surface of the atomizing assembly / heating element 40, and carries the aerosol generated by the heating element 40 to the air outlet 113 through the aerosol output pipe 111, thereby providing suction for the user.

[0093] exist Figure 2 In the illustrated embodiment, the heating element 40 is configured to extend longitudinally along the housing 10 / liquid guiding element 30; the heating element 40 is arranged coaxially with the liquid guiding element 30. In some embodiments, the heating element 40 is a resistance heating mesh or resistance heating coil, etc. In this embodiment, the heating element 40 is a heating element wound from a sheet or mesh.

[0094] In some embodiments, the liquid guiding element 30 is formed by winding or wrapping flexible capillary fibers around the heating element 40. Alternatively, in some embodiments, the liquid guiding element 30 is molded around the heating element 40 and then sintered to be bonded to the heating element 40; for example, the liquid guiding element 30 is formed by in-mold injection molding of porous ceramic slurry around the heating element 40 and then sintering it to be bonded to the heating element 40.

[0095] In some other variations, the liquid guiding element 30 is configured to be arranged perpendicular to the longitudinal direction of the atomizer 100; for example, the liquid guiding element 30 is a rod or bar-shaped object arranged perpendicular to the longitudinal direction of the atomizer 100. The liquid guiding element 30 extends from the tubular element 14 through the perforation 14 into the liquid storage chamber 112, and the heating element 40 surrounds or wraps around the liquid guiding element 30.

[0096] Alternatively, in some variations, the heating element 40 may be bonded to the liquid guiding element 30 by means of printing, deposition, sintering, or physical assembly. In some other variations, the liquid guiding element 30 may have a planar or curved surface for supporting the heating element 40, which is formed on the planar or curved surface of the liquid guiding element 30 by means of mounting, printing, deposition, etc. Alternatively, in some variations, the heating element 40 is a conductive trace formed on the surface of the liquid guiding element 30. In some variations, the conductive trace of the heating element 40 may be in the form of printed lines formed by printing. In some variations, the heating element 40 is a patterned conductive trace. In some embodiments, the heating element 40 is planar. In some variations, the heating element 40 is a tortuous, meandering, reciprocating, or zigzag extended conductive trace.

[0097] according to Figures 2 to 3 As shown, in some embodiments, the heating element 40 is a cylindrical shape wound from a planar mesh precursor. Specifically, the heating element 40 is arranged as a cylindrical shape wound from a sheet; the heating element 40 is not closed in the circumferential direction and has a side opening 44; first conductive pins 41 and second conductive pins 42 are arranged on the heating element 40 on both sides of the side opening 44. The heating element 40 includes a heating portion 430 extending between the first conductive pins 41 and the second conductive pins 42; Figure 3 In the illustrated embodiment, the heating element 430 is essentially constructed as a mesh shape with openings. In this embodiment, the heating element 430 is a resistance heating element. During use, the heating element 430 generates heat through resistance Joule heating. After assembly, when the atomizer 100 is received in the receiving cavity 270 by connecting the first conductive pin 41 and the second conductive pin 42 to the two electrical contacts 21 respectively, the first conductive pin 41 and the second conductive pin 42 are indirectly connected to the circuit board 20 via the contact conductivity between the electrical contacts 21 and 230, thereby guiding current in the heating element 430 of the heating element 40.

[0098] In some embodiments, the mesh on the heating part 430 is typically circular or polygonal in shape; or in other embodiments, the mesh may be rectangular, polygonal, or irregular in shape, such as elongated slits.

[0099] exist Figure 3 In the illustrated embodiment, the heating element 40 may further include:

[0100] A first electrical connection portion 410 and a second electrical connection portion 420 are spaced circumferentially apart. The first electrical connection portion 410 and the second electrical connection portion 420 are located on both sides of a side opening 44 and define the side opening 44. In some embodiments, the first electrical connection portion 410 and the second electrical connection portion 420 are not perforated and are dense. During fabrication or arrangement, a heating portion 430 is formed or located between the first electrical connection portion 410 and the second electrical connection portion 420. In use, the first electrical connection portion 410 and the second electrical connection portion 420 define the electrical connection area of ​​the heating element 40, and the heating portion 430 defines the heating area of ​​the heating element 40. A first conductive pin 41 is connected to the first electrical connection portion 410 by welding or the like, and a second conductive pin 42 is connected to the second electrical connection portion 420 by welding or the like, thereby guiding current on the heating element 40. Welding may include laser welding, ultrasonic welding, friction welding, spot welding, etc.

[0101] In some embodiments, the heating element 40 and / or the heating section 430 are made of a first metal or alloy. In some embodiments, the resistivity of the first metal or alloy is greater than 160 μΩ·cm, the temperature coefficient of resistance is greater than 200 ppm / ℃, and the thermal conductivity is less than 8 W / m·K. This allows the heating element 40 to achieve a suitable resistance value, for example, 0.5 to 1.2 Ω, within a defined cylindrical size and shape, and the heating element 40 can be stably balanced in terms of heating and heat conduction, which is advantageous for precise temperature control. In use, the heating element 40 made of the self-developed first metal or alloy, compared to conventional relatively fast-conducting alloys such as iron-chromium-aluminum, has reduced thermal conductivity, which may help maintain a temperature gradient in different areas of the heating element 40 and help improve the layering of atomization of different components in the liquid matrix.

[0102] In some embodiments, the thermal conductivity of the first metal or alloy is greater than 4 W / m·K; in order to avoid excessively reducing the efficiency of the heating element 40 in transferring heat to the liquid matrix for atomization, and at the same time suppressing excessive temperature gradients on the heating element 40 that could cause local overheating and dry burning.

[0103] In some embodiments, the first metal or alloy has a resistivity greater than 165 μΩ·cm, a temperature coefficient of resistance greater than 250 ppm / ℃, and a thermal conductivity less than 7.5 W / m·K.

[0104] In some embodiments, the specific heat capacity of the first metal or alloy of the heating element 40 is between 460 and 680 J / kg·K, and its density is less than 6 g / cm³. 3This allows the cylindrical heating element 40 to maintain a suitable balance between its own heat storage and the atomization of heat delivered to the liquid matrix. In some preferred embodiments, the specific heat capacity of the heating element 40 is between 520 and 620 J / kg·K. In some preferred embodiments, the density of the first metal or alloy is less than 6 g / cm³. 3 .

[0105] In some embodiments, the coefficient of linear expansion of the first metal or alloy is less than 12 × 10⁻⁶. -6 / ℃; In a more preferred embodiment, the coefficient of linear expansion of the first metal or alloy is less than 10 × 10⁻⁶. -6 / ℃. This is advantageous for maintaining a gradient temperature field in the heating element 40 during heating.

[0106] In some embodiments, the wall thickness of the cylindrical heating element 40 is 0.05 to 0.15 mm. Or, in a more preferred embodiment, the wall thickness of the heating element 40 is 0.08 to 0.12 mm. This is to maintain a suitable balance between the volume of the heating element 40 being suitable for its own heat storage and for delivering heat to the liquid matrix.

[0107] In some embodiments, the first metal or alloy does not contain iron, nickel, and copper.

[0108] In some embodiments, the first electrical connection portion 410, the second electrical connection portion 420, and the heating portion 430 of the heating element 40 are integrally formed. For example, in some specific embodiments, the heating element 40 is formed by etching or stamping a sheet of a first metal or alloy. The sheet of the first metal or alloy can be obtained by preparing the raw material of the first metal or alloy into an ingot through metallurgical and smelting processes, and then rolling the ingot to the required thickness.

[0109] In some embodiments, the melting point of the first metal or alloy is above 1200°C, which is advantageous for giving the heating element 40 high thermal stability.

[0110] In some embodiments, the elastic modulus of the tubular heating element 40 is above 80 GPa and the tensile strength is above 800 MPa; this enables it to maintain sufficient shape stability during thermal cycling, which is advantageous for maintaining a stable temperature field. In a more preferred embodiment, the elastic modulus of the tubular heating element 40 is above 90 GPa and the tensile strength is above 900 MPa.

[0111] In some embodiments, the elastic modulus of the tubular heating element 40 is less than 128 GPa and the tensile strength is less than 1200 MPa; this is advantageous for it to have suitable hardness so that it can be wound into a cylindrical shape and held within the liquid guiding element 30.

[0112] In some embodiments, the first metal or alloy of the heating element 40 is manganese or a manganese alloy; the manganese alloy contains at least 95% manganese by mass. For example, in some embodiments, the manganese or manganese alloy mesh heating element 40 has a resistivity of 185 μΩ·cm, a thermal conductivity of 7.8 W / m·K, and a temperature coefficient of resistance of 600 ppm / ℃ or higher.

[0113] In some embodiments, the first conductive pin 41 and / or the second conductive pin 42 are at least partially in contact with or bonded to the liquid guiding element 30. Furthermore, in some embodiments, at least a portion of the surface of the first conductive pin 41 and / or the second conductive pin 42 is in liquid communication with the liquid reservoir 112 through capillary pores or capillary channels within the liquid guiding element 30, thereby at least a portion of the surface of the first conductive pin 41 and / or the second conductive pin 42 is wetted or adhered to by the liquid matrix adsorbed or transferred by the liquid guiding element 30.

[0114] Alternatively, in some other embodiments, the first conductive pin 41 and / or the second conductive pin 42 extend at least partially within the reservoir 112; or the first conductive pin 41 and / or the second conductive pin 42 are at least partially immersed in or exposed within the reservoir 112.

[0115] In some embodiments, the first conductive pin 41 and the second conductive pin 42 are made of a high-quality conductor material with low resistivity, such as gold, silver, copper, nickel, or alloys thereof.

[0116] In some embodiments, the first conductive pin 41 and / or the second conductive pin 42 include a conductive wire substrate and a conductive covering layer formed or wrapped around the wire substrate. For example Figure 5 The diagram shows a schematic cross-sectional view of the first conductive pin 41 and / or the second conductive pin 42, according to... Figure 5 The first conductive pin 41 and / or the second conductive pin 42 shown include:

[0117] The conductive wire substrate 411 includes a second metal or alloy, or is made of a second metal or alloy;

[0118] A conductive coating layer 412 is formed or wrapped around the conductor substrate 411, comprising a third metal or alloy, or being made of a third metal or alloy.

[0119] In some embodiments, the conductive coating layer 412 is formed on the outside of the conductor substrate 411 by means of electroplating, chemical plating, vapor deposition, spraying, etc.

[0120] In some embodiments, the conductor substrate 411 has a diameter of 0.2 to 0.5 mm; for example, in some specific embodiments, the conductor substrate 411 has a diameter of 0.35 mm. In some embodiments, the thickness of the conductive coating layer 412 is between 20 nm and 20 μm; for example, in some more preferred embodiments, the thickness of the conductive coating layer 412 is between 1 and 10 μm.

[0121] In some embodiments, the difference between the melting point of the second metal or alloy and the melting point of the first metal or alloy is less than or equal to 300°C. By having a melting point difference of less than 300°C between the second metal or alloy and the first metal or alloy, when the first conductive pin 41 and / or the second conductive pin 42 are soldered to the heating element 40, the first conductive pin 41 and / or the second conductive pin 42 melt approximately simultaneously with the heating element 40 during the soldering instant, without the formation of flow or spatter due to asynchronous melting. This is advantageous for improving the convenience of soldering preparation and their weld strength. In an embodiment, the wire substrate 411 provides the welded connection strength to the heating element 40. In a more preferred embodiment, the difference between the melting point of the second metal or alloy and the melting point of the first metal or alloy is less than 260°C; more preferably, the difference between the melting point of the second metal or alloy and the melting point of the first metal or alloy is less than 110°C.

[0122] In some optional embodiments, the second metal or alloy includes at least one of stainless steel grade 316, stainless steel grade 304, stainless steel grade 631, stainless steel grade 2205, stainless steel grade 2507, stainless steel grade 904, or titanium alloy grade TA1, titanium alloy grade TC4, zirconium or zirconium alloy, cobalt or cobalt alloy, etc.

[0123] In some embodiments, the resistivity of the third metal or alloy is less than 10 μΩ·cm. In some embodiments, the resistivity of the third metal or alloy is less than the resistivity of the second metal or alloy. In embodiments, a coating layer 412 prepared or formed of the third metal or alloy provides good conductivity for the first conductive pin 41 and / or the second conductive pin 42. In some specific embodiments, the third metal or alloy has a resistivity between 1 μΩ·cm and 10 μΩ·cm at 20°C.

[0124] In some embodiments, the third metal or alloy has lower metallic reactivity than copper; metallic reactivity is a chemical term referring to the degree of reactivity of a metal in a chemical reaction, typically determined by reference to the periodic table of elements. In some embodiments, the third metal or alloy includes only noble metals or alloys thereof. Noble metals are a chemical term referring to "gold, silver, and platinum group metals," which possess strong chemical stability and are generally resistant to chemical reactions with other substances. In some specific embodiments, the third metal or alloy includes gold (Au), silver (Ag), platinum (Pt), palladium (Pd), ruthenium (Ru), rhodium (Rh), or alloys thereof. In some embodiments, it is advantageous to significantly reduce the line resistance of the conductive substrate having the above melting point requirements through a noble metal coating. And in some embodiments, the first conductive lead 41 and / or the second conductive lead 42 have an inert surface coating, which is advantageous for preventing the deposition of heavy metals such as nickel or copper from the wire substrate.

[0125] In some embodiments, the standard electrode potential of the third metal or alloy is +0.7V to +1.5V. The standard electrode potential is a term in electrochemistry, referring to the potential of an electrode made of a given material combined with a standard hydrogen electrode to form a galvanic cell: standard hydrogen electrode || given material electrode. According to the official definition of IUPAC (International Union of Pure and Applied Chemistry) in 1958, the electrode potential of the standard hydrogen electrode is zero; therefore, the potential of the galvanic cell formed by them is the standard electrode potential of the given material electrode. For example, in some specific embodiments, the third metal or alloy is silver (Ag), with a standard electrode potential of +0.799V; in some specific embodiments, the third metal or alloy is platinum (Pt), with a standard electrode potential of +1.200V; in some specific embodiments, the third metal or alloy is gold (Au), and the standard electrode potential for the reduction of trivalent gold ions to gold (Au) is +1.492V.

[0126] In some embodiments, the third metal or alloy does not contain nickel and / or copper.

[0127] In some specific embodiments, the conductor substrate 411 of the first conductive pin 41 and / or the second conductive pin 42 is stainless steel, and the cladding layer 412 is silver.

[0128] For example, in one specific embodiment, the resistivity of the conductor substrate 411 of a 40mm long, 0.3mm diameter 316L stainless steel wire is 0.4Ω. After forming a silver (Ag) coating layer 412 on the surface of the 316L stainless steel wire conductor substrate 411, the resistivity of the first conductive pin 41 / second conductive pin 42 drops to 0.1Ω, and the overall resistivity of the first conductive pin 41 / second conductive pin 42 is 17μΩcm. The conductivity of the first conductive pin 41 / second conductive pin 42 with the coating layer 412 is significantly better. Compared to the theoretical resistivity of pure silver (Ag) of 1.6μΩcm, this indicates that the conductivity of the first conductive pin 41 / second conductive pin 42 is not solely provided by the coating layer 412, but is jointly defined by the conductor substrate 411 and the coating layer 412.

[0129] In some embodiments, the first metal or alloy used to prepare the heating element 40 comprises, by weight percentage, the main functional phases: 80 wt% to 95 wt% titanium, 3 wt% to 12 wt% aluminum, and 1 wt% to 16 wt% molybdenum and / or vanadium. In these embodiments, the combination of alloying elements enables the first metal or alloy to achieve the desired performance requirements and has a lower density. In some embodiments, the first metal or alloy used to prepare the heating element 40 comprises, by weight percentage, the main functional phases: 80 wt% to 95 wt% titanium, 3 wt% to 12 wt% aluminum, 1 wt% to 10 wt% molybdenum, and 1 wt% to 6 wt% vanadium.

[0130] In some embodiments, the first metal or alloy used to prepare the heating element 40 may further include auxiliary phases in the following mass percentages: 1 wt% to 6 wt% tin, 1 wt% to 4 wt% zirconium, 0.1 wt% to 4 wt% chromium, 0.1 wt% to 2 wt% silicon, and 0.1 wt% to 2 wt% neodymium. In some embodiments, the first metal or alloy used to prepare the heating element 40 may further include unavoidable impurity elements such as oxygen, nitrogen, and carbon.

[0131] In the design of primary metal or alloy systems, aluminum, oxygen, and nitrogen are elements that promote the stabilization of the α-phase in the alloy; molybdenum, vanadium, neodymium, and chromium are elements that promote the stabilization of the β-phase. Here, α-phase and β-phase are chemical terms. The α-phase has a hexagonal close-packed structure (HCP), which is relatively brittle due to the lack of sufficient slip systems; the β-phase has a body-centered cubic structure (BCC) and has better ductility. Therefore, the combination of these two phases is often used to improve strength and modulus. For example... Figure 4 The diagram shows the metallographic structure analysis of a heating element 40 made of a first metal or alloy having the above-described α-phase and β-phase dual-phase structure in the embodiments. In the alloy, lattice defect aggregation sites are also formed at the phase interface between the α-phase and β-phase, which enhances the overall electron scattering ability of the material and is beneficial for increasing resistivity.

[0132] In the design of the first metal or alloy system, auxiliary neutral stabilizing elements such as tin, zirconium, chromium, silicon, and neodymium help to increase the solid solubility in the matrix. At the same time, with certain heat treatment, a large number of dispersed precipitates can be formed, further improving the strength. This strength enables the heating element 40 to have sufficient strength to meet the requirements of winding, assembly with the liquid guiding element 30, and resistance to deformation during operation, even at a very thin thickness, such as 0.1 mm or 0.08 mm.

[0133] In one specific embodiment, the first metal or alloy comprises the following components in weight percentages: titanium 80wt%–95wt%, aluminum 3wt%–12wt%, molybdenum 1wt%–10wt%, vanadium 1wt%–6wt%, tin 1wt%–6wt%, zirconium 1wt%–4wt%, chromium 0.1wt%–4wt%, silicon 0.1wt%–2wt%, and neodymium 0.1wt%–2wt%.

[0134] Figure 6 The above embodiments and several comparative examples illustrate the preparation of alloys. Figure 3 The heating element 40 is shown as having a temperature rise curve within 3 seconds under a constant power supply of 4W. Figure 6 Curve S1 is the heating element 40 made of the first metal or alloy of this application; curve S2 is the heating element 40 made of iron-chromium-aluminum alloy in Comparative Example 1; curve S3 is the heating element 40 made of 904L stainless steel alloy in Comparative Example 2; and curve S4 is the heating element 40 made of 316L stainless steel alloy in Comparative Example 3.

[0135] further Figure 7 The temperature field distribution diagram of the heating element 40 made of the first metal or alloy described above is shown when it is powered by a constant power of 4W for 3s. Figure 8 The temperature field distribution diagram of the heating element 40 of the iron-chromium-aluminum alloy in Comparative Example 1 is shown when it is powered by a constant power of 4W for 3s.

[0136] Figure 9 The temperature field distribution diagram of the heating element 40 of 904L stainless steel alloy in Comparative Example 2 when powered by a constant power of 4W for 3s is shown. Figure 10 The temperature field distribution of the heating element 40 of the 316L stainless steel alloy in Comparative Example 3 is shown when it is powered by a constant power supply of 4W for 3s.

[0137] Figure 7 In the embodiment of this application, the heating element 40 has a maximum temperature of 756°C at the center of the heating grid, and the temperature at the upper and lower ends is approximately 50°C. Figures 8 to 10 The grid-like heating element 430 in the middle-proportion model has a relatively low maximum temperature and a relatively smaller temperature gradient; wherein, Figure 7The heating element 430 of the iron-chromium-aluminum alloy shown has a maximum temperature of 674°C at the center of the heating grid, and the temperature at the upper and lower ends is approximately 150°C. Furthermore, compared to the grid-shaped heating element 430 of the embodiment of this application, it has a larger temperature gradient from the center to the edge, which helps to enhance the layered atomization of different components in the liquid matrix.

[0138] It should be noted that the preferred embodiments of this application are given in the specification and accompanying drawings, but are not limited to the embodiments described in this specification. Furthermore, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. An electronic atomizing device, characterized in that, include: A liquid storage chamber is used to store a liquid matrix; Heating elements are used to heat liquid matrices to generate aerosols. The heating element includes a heating section made of a first metal or alloy, wherein the resistivity of the first metal or alloy is greater than 160 μΩ·cm, the temperature coefficient of resistance is greater than 200 ppm / ℃, and the thermal conductivity is less than 8 W / m·k.

2. The electronic atomizing device as described in claim 1, characterized in that, The first metal or alloy does not contain iron, nickel, or copper.

3. The electronic atomizing device as described in claim 1 or 2, characterized in that, The specific heat capacity of the first metal or alloy is between 460 and 680 J / kg·K.

4. The electronic atomizing device as described in claim 1 or 2, characterized in that, The density of the first metal or alloy is less than 6 g / cm³. 3 .

5. The electronic atomizing device as described in claim 1 or 2, characterized in that, The thermal conductivity of the first metal or alloy is greater than 4 W / m·K.

6. The electronic atomizing device as described in claim 1 or 2, characterized in that, The coefficient of linear expansion of the first metal or alloy is less than 12 × 10⁻⁶. -6 / ℃.

7. The electronic atomizing device as described in claim 1 or 2, characterized in that, The heating element can be constructed in a cylindrical shape and has a wall thickness of 0.05 to 0.15 mm.

8. The electronic atomizing device as described in claim 1 or 2, characterized in that, The heating element is a cylindrical shape made of sheet material wound up; or, the heating element is sheet-shaped. And / or, the elastic modulus of the heating element is above 80 GPa and the tensile strength is above 800 MPa.

9. The electronic atomizing device as described in claim 1 or 2, characterized in that, The first metal or alloy comprises the following components in weight percentages: 80wt% to 95wt% titanium, 3wt% to 12wt% aluminum, and 1wt% to 16wt% molybdenum and / or vanadium.

10. The electronic atomizing device as described in claim 1 or 2, characterized in that, The first metal or alloy comprises the following components in weight percentages: 80wt% to 95wt% titanium, 3wt% to 12wt% aluminum, 1wt% to 10wt% molybdenum, and 1wt% to 6wt% vanadium.

11. The electronic atomizing device as described in claim 10, characterized in that, The first metal or alloy further comprises the following components in weight percentages: 1 wt% to 6 wt% tin, 1 wt% to 4 wt% zirconium, 0.1 wt% to 4 wt% chromium, 0.1 wt% to 2 wt% silicon, and 0.1 wt% to 2 wt% neodymium.

12. The electronic atomizing device as described in claim 1 or 2, characterized in that, The heating element can be configured as a cylinder made of a sheet of the first metal or alloy wound together; And / or, the heating element is configured as a mesh with openings.

13. The electronic atomizing device as described in claim 1 or 2, characterized in that, Also includes: A liquid guiding element is used to deliver the liquid matrix from the liquid storage chamber to the heating element; The heating element is at least partially integrated with the liquid guiding element.

14. An electronic atomizing device, characterized in that, include: A liquid storage chamber is used to store a liquid matrix; Heating elements are used to heat liquid matrices to generate aerosols; The heating element includes a heating section made of a first metal or alloy, the first metal or alloy comprising the following components by mass percentage: 80wt% to 95wt% titanium, 3wt% to 12wt% aluminum, and 1wt% to 16wt% molybdenum and / or vanadium.

15. A heating element for an electronic atomization device, used to heat a liquid matrix to generate an aerosol; characterized in that, The heating element includes: The heating element, formed from a sheet, is heated by resistance Joule heating; the heating element is made of a first metal or alloy, the first metal or alloy having a resistivity greater than 160 μΩ·cm, a temperature coefficient of resistance greater than 200 ppm / ℃, and a thermal conductivity less than 8 W / m·K; the sheet has a thickness of 0.05 to 0.15 mm.

16. A heating element for an electronic atomization device, used to heat a liquid matrix to generate an aerosol; characterized in that, The heating element includes: The heating element, formed from a sheet, is heated by resistance Joule heating; the heating element is made of a first metal or alloy; the first metal or alloy comprises the following components in weight percentages: 80wt% to 95wt% titanium, 3wt% to 12wt% aluminum, and 1wt% to 16wt% molybdenum and / or vanadium; the sheet has a thickness of 0.05 to 0.15 mm.

17. The application of an alloy sheet in an electronic atomization device, characterized in that, The alloy comprises the following components in weight percentages: Titanium 80wt%–95wt%, aluminum 3wt%–12wt%, molybdenum 1wt%–10wt%, vanadium 1wt%–6wt%, tin 1wt%–6wt%, zirconium 1wt%–4wt%, chromium 0.1wt%–4wt%, silicon 0.1wt%–2wt%, neodymium 0.1wt%–2wt%; The sheet has a thickness of 0.05 to 0.15 mm.

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