Cutting device for semiconductor device processing and use method

Abstract

The invention relates to the technical field of semiconductor device cutting machining, in particular to a cutting device for semiconductor device machining and a using method, the cutting device comprises a machine table used for containing a U-shaped chip and a three-dimensional machine base provided with a laser cutter, through holes are formed in the two sides of the U-shaped chip, and the laser cutter cuts the middle section of the U-shaped chip; the machine table is provided with two limiting parts which are symmetrically distributed on the front side and the rear side of the machine table, and each limiting part comprises an outer suction cup and an inner suction cup which are oppositely arranged. According to the invention, a clamping mechanism with cooperation of inside and outside and combination of rigidity and softness is adopted, and the problem that the vacuum sealing performance is damaged by the through hole is solved, so that the temperature of a heat affected zone of the U-shaped chip is reduced, and the generation risk of thermal stress cracks is reduced; after the U-shaped chip is clamped at a time, the whole process of positioning, posture adjustment, cutting and synchronous heat dissipation can be completed through pure mechanical adjustment, repeated disassembly and tightness limiting adjustment are not needed, and the laser cutting operation efficiency and level can be improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device cutting and processing technology, and in particular to a cutting apparatus and method for processing semiconductor devices. Background Technology

[0002] Laser cutting technology, due to its high precision and non-contact characteristics, has been widely used in the separation and processing of semiconductor devices, especially microchips. However, existing clamping and processing solutions face significant challenges for brittle workpieces with special structures (such as U-shaped chips with through holes in the sidewalls).

[0003] Traditional vacuum adsorption methods struggle to effectively handle workpieces with through holes. Existing adsorption technologies, such as the semiconductor lead frame cutting device disclosed in CN115582632B, employ a suction cup with multiple suction holes. The suction cup is mounted on a horizontal support and connected to a vacuum pump to adsorb individual semiconductors. However, this relies on a continuous, flat, sealed surface to establish a vacuum. When dealing with U-shaped chips, the through holes in their sidewalls directly disrupt the vacuum seal, leading to adsorption failure or insufficient force, failing to provide stable constraint during cutting. While suction cups can flexibly fix semiconductors, their structural rigidity is insufficient, and the adsorption force applied from only one side plane is insufficient to effectively constrain U-shaped chips with special structures like through holes. This easily causes workpiece micro-movements or shifts during processing, affecting cutting alignment accuracy.

[0004] For example, a semiconductor chip dicing apparatus disclosed in CN221817654U lacks corresponding thermal management measures for the semiconductor chips after dicing, making the local high temperature of the semiconductor chips prone to thermal stress cracking, especially for the narrow area in the middle of U-shaped chips that needs to be removed, where the heat dissipation path is limited. Another example is a wafer dicing device for semiconductor device wafer processing disclosed in CN118577962A. Its cooling device effectively prevents the wafer from overheating during dicing through a coolant circulation system, maintaining a stable temperature in the dicing area. However, the air-blowing cooling method used in this device has a cooling point far from the actual dicing area, resulting in a response lag. Its cooling effect on the instantaneous high-temperature area generated by laser action is limited, making it difficult to effectively suppress the expansion of the heat-affected zone and the generation of thermal stress cracks. Summary of the Invention

[0005] The purpose of this invention is to solve the problem of difficulty in laser cutting U-shaped chips in semiconductor devices in the prior art, and to propose a cutting device and method for semiconductor device processing.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a cutting apparatus for semiconductor device processing, comprising a machine base for placing a U-shaped chip, a three-dimensional machine base equipped with a laser cutter, through holes being opened on both sides of the U-shaped chip, and the laser cutter cutting the middle section of the U-shaped chip, wherein the machine base is equipped with: The limiting part has two parts, which are symmetrically distributed on the front and rear sides of the machine. Each limiting part includes an outer suction cup and an inner suction cup arranged facing each other. The inner suction cup clamps the two side walls of the U-shaped chip with the outer suction cup through a through hole to adjust the horizontal position and tilt angle. The temperature control support is located in the middle of the machine and includes a load-bearing plate with a hollow structure. The load-bearing plate is used to abut against the outer wall of the middle section of the U-shaped chip. A low-boiling-point working fluid is enclosed in the load-bearing plate and flows in a directional manner. The low-boiling-point working fluid absorbs and consumes the heat generated by the cutting of the U-shaped chip during the vaporization process.

[0007] Preferably, the machine base is fixedly connected to the three-dimensional machine base, and the laser cutter is movably mounted on the three-dimensional machine base via a universal joint.

[0008] Preferably, the limiting part further includes a movable bracket movably disposed on the machine base and moving along the front-back direction, and a telescopic rack that moves along the left-right direction is slidably mounted on the movable bracket, and a mounting base for installing an outer suction cup and an inner suction cup is fixedly connected to the telescopic rack.

[0009] Preferably, the mounting base is composed of a square column and a cylindrical column integrally connected together. The square column is fixedly connected to the telescopic rack, and the cylindrical column is integrally connected to the other end of the square column away from the telescopic rack.

[0010] Preferably, the outer suction cup is movably mounted on the cylinder, and the inner suction cup is slidably mounted inside the cylinder.

[0011] Preferably, the inner diameter of the outer suction cup opening is twice the inner diameter of the inner suction cup opening.

[0012] Preferably, the temperature control support further includes a tilting tray rotatably mounted on the machine base, and a displacement plate is slidably mounted on the tilting tray.

[0013] Preferably, the load-bearing plate is slidably mounted on the displacement plate, and the load-bearing plate is located between the two limiting parts.

[0014] Preferably, the low-boiling-point working fluid is a fluorinated liquid.

[0015] The method of using the above-mentioned semiconductor device cutting apparatus includes the following steps: Step S1: Place the U-shaped chip between the two limiting parts, and drive the outer suction cup and inner suction cup in the two limiting parts to move towards each other through the telescopic rack, so that the two inner suction cups pass through the through holes on both sides of the U-shaped chip respectively. Step S2: First, press the inner suction cup onto the U-shaped chip, then press the outer suction cup onto the U-shaped chip until it is fixed to achieve initial clamping and positioning of the U-shaped chip; Step S3: Control the load plate to contact the middle section of the U-shaped chip, and adjust the state of the U-shaped chip by flipping the carrier plate and the load plate so that the laser cutter can cut the U-shaped chip and make the U-shaped chip heat up. In step S4, the fluorinated liquid absorbs heat from the U-shaped chip during the directional flow process to vaporize, thereby providing heat dissipation protection for the U-shaped chip.

[0016] Compared with the prior art, the present invention has the following advantages: 1. The present invention is designed with a limiting part consisting of an inner suction cup and an outer suction cup. The inner suction cup can be inserted into the through hole of the U-shaped chip and achieve flexible contact with the hole wall by inflating the high elastic rubber ring. Then, a micro-liquid seal is formed by injecting liquid sealing medium, thereby establishing a strong vacuum adsorption in the hole. The outer suction cup forms a second adsorption and locking on the outside of the U-shaped chip, forming a clamping mechanism that combines internal and external cooperation and rigidity and flexibility. This helps to solve the problem of the through hole destroying the vacuum seal. The clamping force is greatly improved and evenly distributed, avoiding stress concentration that damages the brittle U-shaped chip. At the same time, it allows for fine adjustment of the horizontal position and tilt angle of the U-shaped chip by adjusting the inner and outer suction cups.

[0017] 2. This invention integrates a temperature-controlled support unit based on the phase change cooling principle. Its load-bearing plate directly contacts the middle section of the U-shaped chip to be cut, and a low-boiling-point working fluid (such as fluorinated liquid) flows inside. The heat generated by cutting is directly introduced, causing the working fluid to locally vaporize and absorb a large amount of latent heat. The vaporized working fluid is re-liquefied by the condenser in an independent circulation, and the heat is carried away. This process is passive and does not require external power or control, achieving zero-distance and efficient heat absorption from the cutting heat source, thereby reducing the temperature of the heat-affected zone of the U-shaped chip and reducing the risk of thermal stress cracks.

[0018] 3. This invention organically integrates adaptive clamping, six-degree-of-freedom pose adjustment, and targeted heat dissipation functions into one unit through a flip-carrying plate, a displacement plate, a three-dimensional base, and a universal base. After the U-shaped chip is clamped once, the entire process of positioning, attitude adjustment, cutting, and synchronous heat dissipation can be completed through pure mechanical adjustment without repeated disassembly and tightness limit adjustment, which helps to improve the efficiency and level of laser cutting operations. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a cutting device for semiconductor device processing proposed in this invention; Figure 2This is a bottom view of a cutting apparatus for semiconductor device processing proposed in this invention; Figure 3 This is a top view of a cutting apparatus for semiconductor device processing proposed in this invention; Figure 4 This is a side view of a cutting apparatus for semiconductor device processing proposed in this invention; Figure 5 This is a schematic diagram of the limiting part structure of a cutting device for semiconductor device processing proposed in this invention; Figure 6 This is a cross-sectional view of the limiting part of a cutting apparatus for semiconductor device processing according to the present invention; Figure 7 This is an enlarged schematic diagram of part A of the cutting apparatus for semiconductor device processing proposed in this invention; Figure 8 This is an enlarged schematic diagram of part B of a cutting apparatus for semiconductor device processing proposed in this invention; Figure 9 This is a schematic diagram of the temperature control support section of a cutting device for semiconductor device processing proposed in this invention; Figure 10 This is a schematic diagram of a U-shaped chip structure.

[0020] In the diagram: 1. Machine base; 2. Three-dimensional machine base; 3. Limiting part; 31. Moving bracket; 32. Drive gear; 33. Telescopic rack; 34. Mounting base; 341. Square column; 342. Cylindrical column; 35. Outer suction cup; 36. Inner suction cup; 37. Limiting component; 371. Guide groove; 372. Elastic expansion joint; 373. Limiting pin; 374. Limiting groove assembly; 375. Inclined hole; 376. Wedge block; 38. Solid seal; 381. Drive ring; 382. Synchronous disc; 383. High-elasticity rubber ring; 384. Air supply right-angle pipe; 385. First piston; 386. Water storage chamber; 387. Water supply micro-hole; 388. Second piston; 4. Temperature control support; 41. Tilting tray; 42. Displacement plate; 43. Load plate; 44. Heat dissipation assembly; 441. Storage container; 442. Cooling return pipe; 443. Condenser; 444. Condensing spiral tube assembly; 445. Heat conduction groove; 5. Laser cutter. Detailed Implementation

[0021] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0022] Reference Figures 1-10A semiconductor device processing cutting apparatus includes a machine base 1 for placing a U-shaped chip, a three-dimensional machine base 2 equipped with a laser cutter 5, through holes on both sides of the U-shaped chip, the laser cutter 5 cutting the middle section of the U-shaped chip, and a limiting part 3 and a temperature control support part 4 provided on the machine base 1. There are two limiting parts 3, which are symmetrically distributed on the front and rear sides of the machine tool 1 to form a double-sided cooperative clamping system for the workpiece.

[0023] In some implementations, such as Figure 5 and Figure 6 The limiting part 3 includes a movable bracket 31, a drive gear 32, a telescopic rack 33, a mounting base 34, an outer suction cup 35, an inner suction cup 36, a limiting component 37, and a solid seal 38. The movable support 31 is movably mounted on the machine base 1 and moves along the front and back direction. The machine base 1 is equipped with a drive cylinder for pulling the movable support 31 to move, so as to achieve the initial alignment of the device.

[0024] The drive gear 32 is rotatably mounted on the movable bracket 31, and the movable bracket 31 is equipped with a drive motor for driving the drive gear 32 to rotate in both directions.

[0025] The telescopic rack 33 is slidably mounted on the movable bracket 31 and moves along the left and right direction. The telescopic rack 33 is meshed with the drive gear 32. Through the precise transmission of the gear and rack, the two limiting parts 3 can move synchronously towards or away from each other to accommodate U-shaped chips of different sizes.

[0026] Mounting base 34 is fixedly connected to telescopic rack 33, and mounting base 34 is composed of a square column 341 and a cylindrical column 342 integrally connected. The square column 341 is fixedly connected to the telescopic rack 33, and the cylindrical column 342 is integrally connected to the other end of the square column 341 away from the telescopic rack 33. The square column 341 provides a stable mounting base and guide for the internal motion mechanism, while the cylindrical column 342 provides coaxial support for the concentrically distributed outer suction cup 35 and inner suction cup 36.

[0027] The outer suction cup 35 is movably mounted on the cylinder 342, and the inner suction cup 36 is slidably mounted within the cylinder 342. It should be noted that: Preferred solution: The lips and body of the outer suction cup 35 and inner suction cup 36 are made of perfluoroelastomer rubber. Perfluoroelastomer rubber has extremely low surface energy, excellent chemical corrosion resistance (especially resistant to plasma sputtering generated by lasers), and a wide temperature range, which can maintain elasticity for a long time and ensure reliable sealing. Alternative solution: When extremely high dimensional stability and creep resistance are required, the outer suction cup 35 and inner suction cup 36 substrates can be made of polyetheretherketone (PEEK) engineering plastic, with a layer of flexible silicone laminated only at the sealing lip. This composite structure combines rigid support with elastic sealing. The PEEK substrate exhibits almost no creep under long-term stress, ensuring the durability of clamping accuracy, while the silicone lip on the surface provides the necessary flexible fit.

[0028] It should be noted that the inner diameter of the opening of the outer suction cup 35 is twice the inner diameter of the opening of the inner suction cup 36, and the outer suction cup 35 and the inner suction cup 36 are positioned facing each other. The inner suction cup 36 clamps the two sidewalls of the U-shaped chip through the through-holes, allowing for adjustment of its horizontal position and tilt angle. This design allows the inner suction cup 36 to clamp the U-shaped chip through the through-holes on both sides, forming a clamping force with the outer suction cup 35, working together to support the two sidewalls of the U-shaped chip. This coordinated clamping method not only provides horizontal constraint but also allows for minor horizontal position correction and tilt angle adjustment of the U-shaped chip by adjusting the pressure difference between the outer suction cup 35 and the inner suction cup 36, achieving initial stability of the six degrees of freedom.

[0029] In some implementations, such as 6 and Figure 7 The limiting member 37 is disposed on the square column 341 for fixing the outer suction cup 35, and the limiting member 37 includes a guide groove 371, an elastic telescopic member 372, a limiting pin 373, and a limiting groove group 374. The guide groove 371 is formed in the square column 341.

[0030] The elastic telescopic member 372 is fixedly installed in the guide groove 371. The elastic telescopic member 372 consists of a strong spring and a telescopic rod. A wedge block 376 is integrally connected to the telescopic rod. This design helps to provide the driving force for automatic locking.

[0031] The limiting pin 373 is slidably fitted into the square post 341, and the limiting pin 373 has an oblique hole 375 that is movably fitted into the wedge block 376. The cooperation between the oblique hole 375 and the wedge block 376 converts the longitudinal movement of the elastic telescopic device 372 into the lateral locking movement of the limiting pin 373. The structure is compact and reliable.

[0032] The limiting groove group 374 consists of multiple annular grooves equidistantly formed on the outer suction cup 35, and the limiting groove group 374 corresponds to the limiting pin 373. The multiple annular grooves provide multiple discrete locking positions, allowing the outer suction cup 35 to be fixed at different stroke positions according to the thickness of the U-shaped chip, increasing adaptability.

[0033] In some implementations, such as 6 and Figure 8The solid seal 38 is disposed on the inner suction cup 36 for double fixation of the inner suction cup 36, and the solid seal 38 includes a drive ring 381, a synchronization disc 382, ​​a high elastic rubber ring 383, an air supply right angle tube 384, a first piston 385, a water storage chamber 386, a water supply micro-hole 387, and a second piston 388. The drive ring 381 is slidably mounted on one end of the inner suction cup 36 located inside the cylinder 342, serving as an interface for external manual or mechanical drive.

[0034] The synchronous disc 382 is fixedly mounted on the inner suction cup 36 at the middle position of the through holes on both sides of the U-shaped chip.

[0035] The high-elasticity rubber ring 383 is fixedly mounted on the synchronization disk 382. It is made of medical-grade silicone rubber, which has good biocompatibility and a wide range of elastic moduli. The contact pressure after expansion can be precisely controlled by changing the inflation pressure, achieving true flexible and adaptive bonding. When inflated, the high-elasticity rubber ring 383 can evenly fill all irregular gaps between itself and the inner wall of the through-hole, forming the first seal. Its flexibility avoids scratching the fragile structure or metallization layer of the through-hole's inner wall, while simultaneously distributing contact stress evenly to prevent localized stress concentration that could lead to microcracks in the chip.

[0036] The air supply right-angle pipe 384 is opened in the synchronization disc 382 and connected to the high elastic rubber ring 383.

[0037] The first piston 385 is fixedly connected to the drive ring 381, and the first piston 385 is slidably fitted into one end of the air supply right angle tube 384. Pushing the drive ring 381 can drive the first piston 385 to inject air into the high elastic rubber ring 383.

[0038] The water storage chamber 386 is located at the other end of the inner suction cup 36 extending beyond the cylinder 342, and is filled with purified water. It should be noted that ultrapure deionized water can also be used, as it is low-cost, pollution-free, has a high latent heat of vaporization, and is easy to wipe clean. Alternatively, it can be replaced according to actual needs. For U-shaped chips with hydrophobic coatings or sensitive to moisture, low-viscosity, low-surface-tension fluorinated liquids can be used as sealing media. They are slightly more volatile but have good insulation properties and leave no residue. To enhance the seal and provide some auxiliary cooling, a 50% water-based ethylene glycol solution can be used. Its boiling point is higher, allowing it to remain at the interface for longer and providing additional heat capacity, thus slightly removing local heat while sealing.

[0039] There are four water supply micro-holes 387, which are equidistantly spaced in the inner suction cup 36. The water supply micro-holes 387 are unidirectionally connected to the water storage chamber 386, ensuring that the liquid can only be discharged outward under pressure.

[0040] The second piston 388 is slidably disposed in the water storage chamber 386 and is used to apply pressure to squeeze out the sealing liquid.

[0041] To objectively evaluate the technical advantages of the limiting part 3, the following three sets of comparative tests were designed to quantitatively compare clamping stability, thermal management efficiency, and final cutting quality. The comparison objects are two commonly used solutions in the industry for handling irregularly shaped parts: Solution A (traditional lateral mechanical clamp) and Solution B (customized vacuum suction cup with air cooling).

[0042] Experiment 1: Clamping stability and micro-displacement test Experimental objective: To simulate the dynamic impact and vibration during laser cutting, measure the micro-displacement of the workpiece (U-shaped chip), and evaluate the rigidity and stability of the clamping system.

[0043] Experimental conditions: Using a pulsed laser of the same power, cutting was performed along the same path (cutting the middle section of a U-shaped chip) with standard parameters. The three-dimensional micro-displacement (unit: μm) of key points on the workpiece during the cutting process was measured using a laser interferometer.

[0044] Testing direction Option A (Mechanical Fixture) Option B (Customized vacuum suction cup + air cooling) Limiting part 3 (internal and external suction cups working together + water seal) X-axis (horizontal axis) 15.2 ± 4.3 8.7 ± 2.1 2.1 ± 0.5 Y-axis (horizontal and vertical axes) 12.8 ± 3.8 7.9 ± 2.5 1.8 ± 0.4 Z-axis (vertical direction) 25.6 ± 7.1 (mainly due to the throbbing during the cutting process) 5.5 ± 1.8 3.2 ± 0.9 Overall evaluation Rigid clamping leads to stress concentration, resulting in significant instability at the moment of penetration. Vacuum adsorption does not provide sufficient sealing for the through-hole area, resulting in slight slippage. The dual internal and external adsorption, combined with the liquid seal, forms a rigid lock, resulting in minimal displacement, low data dispersion, and excellent stability. It can be seen that: through the synergistic effect of the inner suction cup 36 (which uses the inflatable high elastic rubber ring 383 to flexibly fit with the inner wall of the through hole, and then combines water film sealing to establish a strong vacuum) and the outer suction cup 35 (which assists in adsorption and limiting the outer plane), six degrees of freedom are constrained. Its ability to resist dynamic interference is significantly better than that of traditional solutions, especially in overcoming the Z-direction jump problem.

[0045] The temperature control support 4 is located in the middle of the machine base 1.

[0046] In some implementations, such as Figure 9 The temperature control support unit 4 includes a tilting tray 41, a displacement plate 42, a load-bearing plate 43, and a heat dissipation assembly 44. The rotating carrier plate 41 is mounted on the machine base 1, which allows the entire support to rotate around the vertical axis, making it easy to adjust the workpiece cutting position.

[0047] The displacement plate 42 is slidably mounted on the tilting carrier plate 41, which can achieve precise position adjustment in a horizontal direction.

[0048] The load plate 43 is slidably mounted on the displacement plate 42, and the hollow structure of the load plate 43 is located between the two limiting parts 3. The load plate 43 is used to abut against the outer wall of the middle section of the U-shaped chip, providing direct mechanical support and preventing the middle section from sagging and vibrating during cutting.

[0049] In some embodiments, the heat dissipation assembly 44 includes a storage container 441, a cooling return pipe 442, a condenser 443, a condensing spiral tube assembly 444, and a heat-conducting groove 445. The storage container 441 is fixedly mounted on the displacement plate 42, and the interior of the storage container 441 is divided into upper and lower layers for filling the low-boiling-point working fluid. Notably, in some embodiments, a miniature passive pulse heat pipe structure is integrated between the rising section (vaporization section) and the falling section (condensation section) of the cooling return pipe 442. This structure has a capillary structure on its inner wall, which significantly enhances the oscillation and heat transfer efficiency of the working fluid, increasing heat dissipation capacity by more than 30%. The pulse heat pipe utilizes the spontaneous oscillation of the working fluid within the capillary channel to greatly enhance the heat transfer coefficient of the boiling and condensation processes, allowing heat to be transported more quickly from the high-temperature zone (cutting point) to the low-temperature zone (condenser 443), thereby achieving a highly efficient passive heat transfer enhancement method.

[0050] The two ends of the cooling reflux pipe 442 are respectively connected to the upper and lower layers of the storage container 441, and the cooling reflux pipe 442 is fitted inside the load plate 43. The low boiling point working fluid flows directionally through the cooling reflux pipe 442 to absorb and consume the heat generated by the U-shaped chip during the vaporization process. The heat dissipation component 44 is fixedly installed on the displacement plate 42.

[0051] The condenser spiral tube assembly 444 is fixedly connected to the condenser 443, and the condenser spiral tube assembly 444 is wound equidistantly around the storage container 441 to efficiently dissipate the heat carried by the gaseous working fluid into the environment, so that it can be reliquefied.

[0052] A heat conduction slot 445 is opened in the upper part of the load plate 43, and the cooling return pipe 442 contacts the middle section of the U-shaped chip through the heat conduction slot 445 to ensure the shortest heat conduction path and the lowest thermal resistance.

[0053] Experiment 2: Thermal Management Performance Test of Cutting Area Experimental objective: To measure the peak temperature and cooling rate of the heat-affected zone near the cutting path of the U-shaped chip during and after laser cutting.

[0054] Experimental conditions: A miniature thermocouple was embedded 1 mm beside the cutting path of the U-shaped chip. The temperature change was recorded from the start of laser application to 100 ms after the laser ended.

[0055] Evaluation indicators Option A (Mechanical clamp, natural heat dissipation only) Option B (air-cooled, air nozzle 5mm from the cutting point) Temperature control support 4 (phase change cooling, load-bearing plate 43 direct contact) Maximum temperature (°C) 385 312 195 Duration of temperature > 200℃ (ms) 85 52 18 Cooling rate (°C / ms) 2.1 3.8 12.5 Overall evaluation Heat accumulation is severe, and the heat-affected zone is large. Forced convection has some effect, but it cannot specifically address the high-temperature points at the cutting edge. Phase change working fluid (fluorinated liquid) directly absorbs the latent heat of vaporization, instantly carrying away peak heat and inhibiting heat diffusion. It can be seen that the temperature control support part 4 adopts a passive phase change cooling principle. The cooling return pipe 442 in the load plate 43 directly conducts heat to the cutting area in the middle of the U-shaped chip. After being heated, the internal fluorinated liquid undergoes a phase change from liquid to gas. This process absorbs a large amount of latent heat, achieving targeted attack on the heat source. This proves that the solution can reduce the peak temperature of the heat-affected zone by about 50% and significantly shorten the high-temperature residence time, reducing the risk of microcracks induced by thermal stress.

[0056] In some embodiments, the machine base 1 is fixedly connected to the three-dimensional machine base 2, and the laser cutter 5 is movably mounted on the three-dimensional machine base 2 via a universal joint.

[0057] In some implementations, such as Figures 1-4 A lifting platform that reciprocates vertically along the Y-axis is slidably mounted on the three-dimensional base 2. A first moving platform that reciprocates horizontally along the X-axis is slidably mounted on the lifting platform. A second lifting platform that reciprocates forward and backward along the Z-axis is slidably mounted on the first lifting platform. A universal joint is fixedly connected to the second lifting platform. The three-dimensional position adjustment via the lifting platform, the first moving platform, and the second moving platform allows the laser cutter 5 to correspond to the U-shaped chip from multiple positions. The angle adjustment of the laser cutter 5 via the universal joint allows the laser cutter 5 to flexibly operate with the U-shaped chip.

[0058] The low-boiling-point working fluid is a fluorinated liquid, preferably perfluoropentane (boiling point approximately 29°C) or its isomers. It is a liquid at room temperature and pressure, vaporizes upon absorbing a small amount of heat, has a moderate latent heat of phase change, is extremely chemically inert, and offers high safety. For applications requiring even lower start-up temperatures (e.g., higher ambient temperatures), octafluorocyclobutane (boiling point approximately -6°C) can be used. In this case, the storage container 441 needs to be designed with proper insulation to ensure sufficient condensation and reflux during circulation.

[0059] It should be noted that the specific model and specifications of the laser cutter 5 need to be selected and determined based on the actual specifications of the device. The specific selection and calculation method adopts the existing technology in this field, so it will not be elaborated here.

[0060] The functional principle of this invention can be explained by the following operation: First, a U-shaped chip is placed between two limiting parts 3. A telescopic rack 33 drives the outer suction cup 35 and inner suction cup 36 of the two limiting parts 3 to move towards each other, causing the two inner suction cups 36 to pass through the through holes on both sides of the U-shaped chip. Specifically, a drive gear 32 drives the telescopic rack 33 to move, causing the two limiting parts 3 to move towards each other until the inner suction cups 36 move through the through holes on both sides of the U-shaped chip.

[0061] Secondly, the inner suction cup 36 is pressed onto the U-shaped chip, and then the outer suction cup 35 is pressed onto the U-shaped chip until it is fixed, thus achieving initial clamping and limiting of the U-shaped chip. Specifically, the drive ring 381 on the inner suction cup 36 is controlled to move, and the first piston 385 pushes the gas in the air supply right-angle tube 384 into the high elastic rubber ring 383 to make it fully expand. The high elastic rubber ring 383 moves and abuts against the inner wall of the through hole on both sides of the U-shaped chip. Then, the second piston 388 is controlled to push the pure water in the water storage chamber 386 out through the water supply microhole 387. Finally, the inner suction cup 36 is controlled to retract into the cylinder 342. When the inner suction cup 36 is squeezed, pure water is expelled and fills all uneven areas on the contact surface. The expelled components are mainly water and a small amount of air. After the inner suction cup 36 is released, the rubber of the inner suction cup 36 attempts to rebound, and its internal volume tends to increase. At this time, because the water film has sealed the surroundings tightly, external air cannot enter, resulting in the internal pressure of the inner suction cup 36 being much lower than the external atmospheric pressure. During this process, the high-elasticity rubber ring 383 slides along the through holes on both sides of the U-shaped chip to ensure the seal between the inner suction cup 36 and the U-shaped chip. The outer elastic telescopic device 372 stops the wedge block 376 from limiting the driving force of the limiting pin 373, and then pushes the outer suction cup 35 on the cylinder 342, causing the air between the outer suction cup 35 and the U-shaped chip to be expelled. Similarly to the inner suction cup 36, after the elastic telescopic device 372 is released, the strong spring force causes the limiting pin 373 to extend into the corresponding annular groove to limit and fix the outer suction cup 35.

[0062] Then, the load plate 43 is controlled to contact the middle section of the U-shaped chip. By flipping the carrier plate 41 and the load plate 43, the U-shaped chip is adjusted to facilitate the laser cutter 5 to cut the U-shaped chip and generate heat. Specifically, the middle section of the U-shaped chip is fixed to contact the load plate 43, so that the middle section of the U-shaped chip is in contact with the cooling return pipe 442. The low-boiling-point working fluid is controlled to flow directionally between the storage container 441 and the cooling return pipe 442. During this process, the laser cutter 5 is controlled on the three-dimensional base 2 to perform laser cutting on the middle section of the U-shaped chip, and the U-shaped chip generates high temperature heat as a result.

[0063] Finally, during the directional flow process, the fluorinated liquid absorbs heat from the U-shaped chip and vaporizes to provide heat dissipation protection for the U-shaped chip. Specifically, the fluorinated liquid located at the upper section of the cooling return pipe 442 absorbs the high-temperature heat in the middle section of the U-shaped chip and undergoes a vaporization reaction. After re-entering the storage container 441, it cools down due to the condensing effect of the condenser 443 and the condensing spiral tube assembly 444, reforming into fluorinated liquid for reuse.

[0064] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A cutting apparatus for semiconductor device processing, comprising a machine base (1) for placing a U-shaped chip, a three-dimensional base (2) equipped with a laser cutter (5), wherein through holes are provided on both sides of the U-shaped chip, and the laser cutter (5) cuts the middle section of the U-shaped chip, characterized in that, The machine tool (1) is provided with a limiting part (3). There are two limiting parts (3). The two limiting parts (3) are symmetrically distributed on the front and rear sides of the machine tool (1). The limiting part (3) includes an outer suction cup (35) and an inner suction cup (36) arranged facing each other. The inner suction cup (36) clamps the two side walls of the U-shaped chip facing each other with the outer suction cup (35) through a through hole to adjust the horizontal position and tilt angle. Temperature control support part (4) is located in the middle of the machine (1), and the temperature control support part (4) includes a load plate (43) with a hollow structure. The load plate (43) is used to abut against the outer wall of the middle section of the U-shaped chip, and a low boiling point working fluid is enclosed in the load plate (43) and flows in a directional manner. The low boiling point working fluid absorbs and consumes the heat of the U-shaped chip due to cutting during the vaporization process.

2. The cutting apparatus for semiconductor device processing according to claim 1, characterized in that, The machine base (1) is fixedly connected to the three-dimensional machine base (2), and the laser cutter (5) is movably mounted on the three-dimensional machine base (2) via a universal joint.

3. The cutting apparatus for semiconductor device processing according to claim 2, characterized in that, The limiting part (3) also includes a movable bracket (31) that is movably set on the machine base (1) and moves along the front-back direction. A telescopic rack (33) that moves along the left-right direction is slidably installed on the movable bracket (31). A mounting seat (34) for installing an outer suction cup (35) and an inner suction cup (36) is fixedly connected to the telescopic rack (33).

4. The cutting apparatus for semiconductor device processing according to claim 3, characterized in that, The mounting base (34) is composed of a square column (341) and a cylindrical column (342) integrally connected. The square column (341) is fixedly connected to the telescopic rack (33), and the cylindrical column (342) is integrally connected to the other end of the square column (341) away from the telescopic rack (33).

5. The cutting apparatus for semiconductor device processing according to claim 4, characterized in that, The outer suction cup (35) is movably mounted on the cylinder (342), and the inner suction cup (36) is slidably mounted in the cylinder (342).

6. The cutting apparatus for semiconductor device processing according to claim 5, characterized in that, The inner diameter of the opening of the outer suction cup (35) is twice the inner diameter of the opening of the inner suction cup (36).

7. A cutting apparatus for semiconductor device processing according to claim 6, characterized in that, The temperature control support (4) also includes a tilting tray (41) rotatably mounted on the machine base (1), and a displacement plate (42) is slidably mounted on the tilting tray (41).

8. A cutting apparatus for semiconductor device processing according to claim 7, characterized in that, The load plate (43) is slidably mounted on the displacement plate (42), and the load plate (43) is located between the two limiting parts (3).

9. A cutting apparatus for semiconductor device processing according to claim 8, characterized in that, The low-boiling-point working fluid is a fluorinated liquid.

10. A method of using the dicing apparatus for semiconductor device processing as described in claim 9, characterized in that, The method of use includes the following steps: Step S1: Place the U-shaped chip between the two limiting parts (3), and drive the outer suction cup (35) and inner suction cup (36) in the two limiting parts (3) to move towards each other through the telescopic rack (33), so that the two inner suction cups (36) pass through the through holes on both sides of the U-shaped chip respectively. Step S2: First, press the inner suction cup (36) onto the U-shaped chip, and then press the outer suction cup (35) onto the U-shaped chip until it is fixed to achieve the initial clamping and limiting of the U-shaped chip; Step S3: Control the load plate (43) to contact the middle section of the U-shaped chip, and drive the U-shaped chip to adjust its state by flipping the carrier plate (41) and the load plate (43) so that the laser cutter (5) can cut the U-shaped chip and make the U-shaped chip heat up. In step S4, the fluorinated liquid absorbs heat from the U-shaped chip during the directional flow process to vaporize, thereby providing heat dissipation protection for the U-shaped chip.

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