Processing method and processing device for high-efficiency laser linear groove

Abstract

The invention discloses a processing method and a processing device for a high-efficiency laser linear groove, the processing method is executed by a controller of a processing device, and the method comprises the following steps: reading a processing file to obtain a starting point coordinate and an end point coordinate of a linear groove formed by a plane in a coordinate system; calculating a movement change vector from the starting point coordinate to the end point coordinate, taking the vector length as the length of the linear groove, and calculating an included angle between the movement change vector and an axial direction; calculating a quotient obtained by dividing the length of the linear groove by a preset blind hole pitch as an integer, and dividing the length of the linear groove by the quotient as an adjusted blind hole pitch; the laser moving speed obtained by dividing the adjusted blind hole distance by the laser percussion period is calculated, and an acceleration length distance and an acceleration starting point coordinate are further calculated, so that the blind holes which are connected at equal intervals are subsequently drilled through laser beams.

Description

Technical Field

[0001] This invention discloses a laser processing method and processing apparatus, and more particularly a high-efficiency laser linear groove processing method and processing apparatus. Background Technology

[0002] Please see Figure 8 As shown, a typical circuit board 100 on the market today usually has multiple independent blind vias 101 and multiple non-independent blind vias 102. Due to various circuit designs and requirements, the independent blind vias 101 generally do not have any corresponding positional relationship, and therefore, the independent blind vias 101 are randomly distributed on the circuit board 100. In contrast, the non-independent blind vias 102 have specific corresponding positional relationships on the circuit board 100. For example, the non-independent blind vias 102 can be arranged in a straight line and connected to form a slot-shaped blind via 103, so the formation of the non-independent blind vias 102 is not randomly distributed in position.

[0003] Currently, the independent blind hole 101 and the non-independent blind hole 102 are formed by laser processing. Blind holes can be formed by moving the laser beam while fixing the ordinary circuit board 100, or by moving the ordinary circuit board 100 while fixing the laser beam. However, regardless of which method is used, relative movement between the laser beam and the ordinary circuit board 100 is required to create blind holes at different positions on the ordinary circuit board 100 using laser drilling.

[0004] Currently, the method of forming blind vias by laser processing of the ordinary circuit board 100, whether for the independent blind via 101 or the non-independent blind via 102, involves the following steps:

[0005] Step A: Accelerate the laser beam from its stationary state and move it to the location where a blind hole is to be drilled;

[0006] Step B: Begin deceleration before the laser beam reaches the location where the blind hole is to be drilled;

[0007] Step C: Finally, stop the laser beam at the position where the blind hole is to be drilled, fire the laser to drill the blind hole, and repeat step A until all the positions where blind holes are to be drilled have been laser-processed to form blind holes.

[0008] Please refer to the following: Figure 9 As shown, Figure 9 To represent a velocity-time graph (vt graph) in the physical domain, where Figure 9 The horizontal axis represents the time required to form a blind via on the ordinary circuit board 100, while Figure 9The vertical axis represents the relative movement speed between the laser beam and the ordinary circuit board 100. Furthermore, regarding the formation method of the slot-shaped blind via 103, that is, the formation method of the linearly arranged non-independent blind vias 102, Figure 9 The first curve (dashed line) corresponds to the laser processing of the non-independent blind hole 102 using the methods described in steps A to C. For example, the 1µs to 2µs stage is step A, the 2µs to 3µs stage is step B, and the 3µs stage is step C. Figure 9 The second curve (solid line) corresponds to the use of another method to laser process the non-independent blind hole 102.

[0009] As can be seen from the first curve, the linearly arranged non-independent blind holes 102 are equidistantly spaced, thus the time spent laser processing each of the non-independent blind holes 102 is the same. For example, the time required to process and form a first blind hole V1 among the non-independent blind holes 102 is the same as the time required to process and form a second blind hole V2 after forming the first blind hole V1. Therefore, the time required to form an Nth blind hole VN will also be the same as the time required to form the first blind hole V1 or the second blind hole V2, where N is a positive integer. The equidistantly arranged linearly arranged non-independent blind holes 102 ensures that each of the slotted blind holes 103 is laser-processed to the same degree, that is, ensures that each of the slotted blind holes 103 has consistent specifications and presents a higher level of processing quality.

[0010] Furthermore, as can be seen from the second curve, this other method involves the laser beam performing only one acceleration and one deceleration, and then allowing the laser to move at a constant speed for a period of time. Because the non-independent blind holes 102 are arranged in a straight line, the laser beam moves along a straight line, accelerating, maintaining a constant speed, and decelerating. During this movement, the laser is periodically fired to drill interconnected non-independent blind holes 102 into the ordinary circuit board 100, thereby forming the slotted blind hole 103.

[0011] Please see Figure 10A As shown, however, the distance of the non-independent blind hole 102 formed using the movement method of this second curve is not uniform. Because... Figure 9 The vt graph already reflects this situation; that is, when moving with acceleration, the distance the laser beam moves relative to the target changes exponentially, meaning the position-time graph (xt graph) becomes exponential. Therefore, a time-deployed laser beam will produce... Figure 10A The trajectory shown. Figure 10AIn the trajectory shown, the distances during the acceleration and deceleration phases are proportional to the speed. Initially, the speed is slower, and the distance between two adjacent non-independent blind holes 102 is closer. As the speed increases, the distance between two adjacent non-independent blind holes 102 also begins to increase. Similarly, during the deceleration phase, the speed is faster initially, and the distance between two adjacent non-independent blind holes 102 is farther. As the speed decreases, the distance between two adjacent non-independent blind holes 102 also begins to decrease. However, during the constant-speed movement phase, because the speed is constant, the distance between any two adjacent non-independent blind holes 102 will be equidistant. For example, the non-independent blind holes 102 covered by the first segment Seg1 are equidistant from each other, while the remaining non-independent blind holes 102 are not equidistant from each other. This result indicates that the grooved blind holes 103 are subjected to varying degrees of laser processing, resulting in grooved blind holes 103 with low processing quality. In other words, compared to the method of generating the slotted blind hole 103 in steps A to C, this method can generate a longer slotted blind hole 103 in the same amount of time, that is, although this method can generate a slotted blind hole 103 in less time, it cannot take into account the processing quality of the slotted blind hole 103.

[0012] Please see Figure 10B As shown, in order to improve the quality of processing the slotted blind hole 103 and make the non-independent blind holes 102 included in the slotted blind hole 103 more equidistant, the existing method can use a mask to block the firing of the laser beam in a timely manner, so as to reduce the number of non-equidistant blind holes 102 generated when the laser beam accelerates or decelerates, thereby producing Figure 10B The improved trajectory is shown. However, this method still cannot completely ensure that the non-independent blind holes 102 are equidistant, thus the improvement is limited. Figure 10B Within the trajectory shown, only the non-independent blind holes 102 covered by the first segment Seg1 are substantially equidistant from each other. Therefore, in order to ensure that the non-independent blind holes 102 are equidistant from each other, the prior art further improves the processing method by firing the laser only during the aforementioned constant-speed movement phase, so as to facilitate processing only during the constant-speed movement phase. Figure 10B The first segment Seg1 shown is not fired at a non-uniform speed to avoid generating the non-independent blind holes 102 with unequal spacing.

[0013] Please see Figure 11As shown, however, when drilling is performed in the aforementioned state of constant-speed movement only in an improved processing method, another problem arises: at one end 104 of the slotted blind hole 103 being generated at a constant speed, because the intended end point of drilling for the slotted blind hole 103 does not match the timing of the laser beam ignition, when using laser processing to generate the slotted blind hole 103, the blind hole drilled at the end 104 of the slotted blind hole 103 does not coincide with the endpoint coordinates. This problem still needs to be improved and resolved. Summary of the Invention

[0014] To address the problem that when using laser processing to generate slotted blind holes at a constant speed, the blind hole drilled at the end of the slotted blind hole does not coincide with the endpoint coordinates, this invention provides a high-efficiency laser linear slot processing method and processing device.

[0015] The high-efficiency laser linear groove processing method of the present invention is executed by a controller and includes the following steps:

[0016] Read a machining file to obtain the starting point coordinates and the ending point coordinates of a plane forming a straight groove in a coordinate system;

[0017] Calculate a movement vector from the starting point coordinate to the ending point coordinate, and calculate that the length of the movement vector is the length of a straight line groove, and calculate the angle formed between the movement vector and one of the axes in the coordinate system;

[0018] Calculate a quotient obtained by dividing the length of the straight groove by a preset blind hole spacing; wherein the quotient is an integer;

[0019] The adjusted blind hole spacing is obtained by dividing the length of the straight groove by the quotient.

[0020] The adjusted blind hole spacing is divided by one laser firing cycle to obtain a laser moving speed;

[0021] Calculate the acceleration distance based on the laser's moving speed and acceleration time.

[0022] Calculate the coordinates of the acceleration starting point based on the acceleration length, the included angle, and the starting point coordinates.

[0023] The high-efficiency laser linear groove processing apparatus of the present invention includes:

[0024] A platform for carrying a circuit board;

[0025] A laser unit generates a laser beam and fires the laser beam according to a laser firing cycle; wherein the laser beam is aligned with a plane in a coordinate system, and the plane corresponds to the circuit board on the platform aligned with the laser beam.

[0026] A laser beam shielding unit for shielding the laser beam;

[0027] A moving mechanism for relative movement between the laser beam generated by the laser unit and the circuit board carried by the platform;

[0028] A controller, electrically connected to the laser unit, the laser beam shielding unit, and the moving mechanism, is used to perform the following steps:

[0029] Read a machining file to obtain the starting point coordinates and the ending point coordinates of the plane forming a straight groove in the coordinate system;

[0030] Calculate a movement vector from the starting point coordinate to the ending point coordinate, and calculate that the length of the movement vector is the length of a straight line groove, and calculate the angle formed between the movement vector and one of the axes in the coordinate system;

[0031] Calculate a quotient obtained by dividing the length of the straight groove by a preset blind hole spacing; wherein the quotient is an integer;

[0032] The adjusted blind hole spacing is obtained by dividing the length of the straight groove by the quotient.

[0033] The adjusted blind hole spacing divided by the laser firing cycle is calculated as the laser moving speed;

[0034] Calculate the acceleration distance based on the laser's moving speed and acceleration time.

[0035] Calculate the coordinates of the acceleration starting point based on the acceleration length, the included angle, and the starting point coordinates.

[0036] The acceleration starting point coordinates calculated by the controller in this invention are crucial because they ensure that when a laser beam begins to move from these coordinates, the final firing position of the laser beam will still follow the adjusted blind hole spacing. In other words, because this invention first adjusts the preset blind hole spacing to the adjusted blind hole spacing before determining the laser movement speed, acceleration distance, and acceleration starting point coordinates based on the adjusted blind hole spacing, the actual laser drilling to form the straight groove will not be as... Figure 11 The prior art shown typically drills a blind hole at the end 104 of the groove-shaped blind hole 103 that does not coincide with the endpoint coordinate, thereby improving the technical level of forming the straight groove. Attached Figure Description

[0037] Figure 1 This is a system block diagram of the high-efficiency laser linear groove processing device of the present invention.

[0038] Figure 2This is a schematic diagram illustrating the application of the high-efficiency laser linear groove processing device of the present invention.

[0039] Figure 3 This is a schematic diagram of the high-efficiency laser linear groove processing device of the present invention, which presents the coordinates in a plane using a software coordinate system.

[0040] Figure 4 This is a flowchart of the high-efficiency laser linear groove processing method of the present invention.

[0041] Figure 5 This is a speed-time diagram showing the relative movement between the laser beam and the circuit board in the high-efficiency laser linear groove processing device of the present invention.

[0042] Figure 6 This is a velocity-time diagram of a laser beam moving relative to another laser beam in a conventional manner.

[0043] Figure 7 This is a schematic diagram of the period of the laser beam emitted by the processing device for the high-efficiency laser linear groove of the present invention.

[0044] Figure 8 A schematic diagram showing the formation of multiple independent blind vias and multiple non-independent blind vias on a typical circuit board.

[0045] Figure 9 This is a velocity-time graph showing the relative movement between the laser beam and a regular circuit board.

[0046] Figure 10A A schematic diagram of a trajectory with uneven spacing to form multiple non-independent blind holes.

[0047] Figure 10B This is another schematic diagram of a trajectory that forms multiple non-independent blind holes with uneven spacing.

[0048] Figure 11 A schematic diagram showing the uneven spacing between non-independent blind holes at the end of a groove-shaped blind hole in a process of forming a groove-shaped blind hole at a constant speed. Detailed Implementation

[0049] This invention provides a high-efficiency laser linear groove processing method and processing apparatus.

[0050] Please see Figure 1 and Figure 2 As shown, the high-efficiency laser linear groove processing device of the present invention includes a carrying platform 10, a laser unit 20, a laser beam shielding unit 30, a moving mechanism 40 and a controller 50.

[0051] The platform 10 is used to carry a circuit board 11 that is compatible with the present invention. That is, the circuit board 11 is to be drilled with multiple blind holes along a straight line direction by laser drilling and then connected to form a straight groove 60.

[0052] The controller 50 of the present invention is electrically connected to the laser unit 20, the laser beam shielding unit 30, and the moving mechanism 40. The controller 50 stores a processing setting, a preset blind hole spacing, a laser firing cycle, and a laser acceleration time.

[0053] The laser unit 20 generates a laser beam, and the laser unit 20 fires the laser beam according to the laser firing cycle stored in the controller 50. In a real-world application, the laser beam is aimed at the circuit board 11 on the platform 10 and fired. Corresponding to this application, the invention uses computer software to aim the laser beam at a plane in a coordinate system and fire it; this plane corresponds to the surface of the circuit board on the platform that the laser beam is aimed at in the real world.

[0054] Please see Figure 2 and Figure 3 As shown, in one embodiment of the present invention, the coordinate system is a two-dimensional XY coordinate system, and the plane of the XY coordinate system is an XY plane formed by a mutually perpendicular X-axis and a Y-axis. This XY plane represents, in software, the surface of the circuit board to be laser-driven in the real world. The present invention marks a known starting point coordinate P1 and an ending point coordinate P2 on this plane of the XY coordinate system using software. The starting point coordinate P1 can be represented by (x1, y1), and the ending point coordinate P2 can be represented by (x2, y2). The position between the starting point coordinate P1 and the ending point coordinate P2 represents the position of the straight groove 60 to be drilled by laser-driven ...

[0055] The laser beam shielding unit 30 is used to shield the laser beam. Preferably, the laser beam shielding unit 30 is disposed in an electronically controlled shutter on the optical path of the laser beam generated by the laser unit 20. When the electronically controlled shutter is activated, it blocks the optical path of the laser beam and thus shields the laser beam. When the electronically controlled shutter is not activated, it does not block the optical path of the laser beam and thus does not shield the laser beam.

[0056] The moving mechanism 40 of the present invention is used to generate relative movement between the laser beam generated by the laser unit 20 and the circuit board 11 carried by the carrying platform 10. In this embodiment, the moving mechanism 40 is used to adjust the optical path of the laser beam to change the position where the laser beam is intended to illuminate the circuit board 11.

[0057] In this embodiment, the moving mechanism 40 includes a first galvanometer scanning mirror 41 (first Galvoscanner), a second galvanometer scanning mirror 42 (second Galvo scanner), and a flat-field laser focusing lens 43 (f-theta lens). The first galvanometer scanning mirror 41 and the second galvanometer scanning mirror 42 are electrically connected to the controller 50. The first galvanometer scanning mirror 41 reflects the laser beam generated by the laser unit 20 to the second galvanometer scanning mirror 42, and the second galvanometer scanning mirror 42 further reflects the laser beam from the first galvanometer scanning mirror 41 to the flat-field laser focusing lens 43. The flat-field laser focusing lens 43 receives the laser beam reflected by the second galvanometer scanning mirror 42 and focuses the laser beam onto the circuit board 11 of the carrying platform 10.

[0058] When the controller 50 controls the moving mechanism 40 to create relative movement between the laser beam generated by the laser unit 20 and the circuit board 11 carried by the platform 10, the controller 50 controls the first galvanometer reflecting scanning mirror 41 to rotate along a first direction and controls the second galvanometer reflecting scanning mirror 42 to rotate along a second direction, so that the controller 50 can control the movement of the laser beam focused on the circuit board 11 by the flat-field laser focusing lens 43. The first direction and the second direction are perpendicular to each other. In this embodiment, the first direction and the second direction correspond to the aforementioned Y-axis and X-axis directions. In other words, the first galvanometer reflecting scanning mirror 41 rotates along the Y-axis, thus controlling the reflected laser beam to move along the Y-axis. Similarly, the second galvanometer reflecting scanning mirror 42 rotates along the X-axis, thus controlling the reflected laser beam to move along the X-axis.

[0059] Please see Figure 4 As shown, the focus of this invention is a high-efficiency laser linear groove processing method executed by the controller 50. This high-efficiency laser linear groove processing method includes the following steps performed by the controller 50:

[0060] Step S10: Read the machining file to obtain the starting coordinate P1 and the ending coordinate P2 of the plane forming the straight groove 60 in the coordinate system.

[0061] Step S20: Calculate a movement vector from the starting point coordinate P1 to the ending point coordinate P2, and calculate the length of the movement vector as the length of a straight line groove, and calculate the angle formed between the movement vector and one of the axes in the coordinate system.

[0062] For example, in the XY coordinate system shown in this embodiment, the controller 50 calculates a movement vector Vec from the starting point coordinate P1 to the ending point coordinate P2 as [(x2-x1),(y2-y1)], and the controller 50 calculates the length of the movement vector Vec as... Furthermore, the controller 50 calculates the angle θ formed between the movement vector Vec and the X-axis as tan θ. -1 ((y2-y1) / (x2-x1)).

[0063] Step S30: Calculate a quotient obtained by dividing the length of the straight groove by the preset blind hole spacing; wherein the quotient is an integer;

[0064] Step S40: Calculate the adjusted blind hole spacing obtained by dividing the length of the straight groove by the quotient.

[0065] Step S50: Calculate the adjusted blind hole spacing divided by the laser firing cycle to obtain a laser movement speed.

[0066] Step S60: Calculate an acceleration length distance based on the laser's moving speed and acceleration time.

[0067] Step S70: Calculate the acceleration starting point coordinates P0 based on the acceleration length distance, the included angle, and the starting point coordinates P1.

[0068] The acceleration starting point coordinate P0 calculated by the controller 50 is crucial in this invention because it ensures that when a laser beam starts moving from this acceleration starting point coordinate P0, the final position where the laser beam fires will still follow the adjusted blind hole spacing. In other words, because this invention first adjusts the preset blind hole spacing to the adjusted blind hole spacing, and then determines the laser movement speed, the acceleration distance, and the acceleration starting point coordinate P0 based on the adjusted blind hole spacing, the subsequent actual laser drilling to form the straight groove 60 will not be as... Figure 11 The prior art shown generally drills a blind hole at the end 104 of the groove blind hole 103 that does not coincide with the end coordinate, thereby improving the technical level of forming the straight groove 60.

[0069] In one embodiment of the present invention, step S60 includes the following sub-steps executed by the controller 50:

[0070] Step S61: Calculate the laser's moving speed divided by its acceleration time to obtain a laser acceleration.

[0071] Step S62: Calculate the acceleration distance using the following formula:

[0072] S=(1 / 2)*a*t 2

[0073] Where S is the acceleration distance, a is the laser acceleration, and t is the laser acceleration time.

[0074] In another embodiment of the present invention, step S60 involves the controller 50 directly calculating the acceleration length distance according to the following formula:

[0075] S=(1 / 2)*V*t

[0076] Where S is the acceleration distance, V is the laser speed, and t is the laser acceleration time.

[0077] After calculating the acceleration distance, in the subsequent step S70 executed by the controller 50, the controller 50 calculates the acceleration starting point coordinate P0 according to the following formula:

[0078] x0 = x1 - S·cosθ

[0079] y0=y1-S·sinθ

[0080] As defined above, S is the acceleration length distance, and θ is the included angle.

[0081] In this embodiment, the high-efficiency laser linear groove processing method further includes the following steps executed by the controller 50 after step S70:

[0082] Step S80: Control the moving mechanism 40 to move the laser beam generated by the laser unit 20 onto the plane, so that the laser beam accelerates from the starting point coordinate P0 from the stationary state to the starting point coordinate P1 in a linear constant acceleration manner, and at the same time control the laser beam shielding unit 30 to shield the laser beam.

[0083] Step S90: Control the laser beam to move from the starting point coordinate P1 to the ending point coordinate P2 at a constant speed, while controlling the laser beam shielding unit 30 to stop shielding the laser beam, and controlling the laser unit 20 to fire the laser beam according to the laser firing cycle.

[0084] Please see Figure 5 , Figure 5A vt graph, representing the relative movement of the laser beam with respect to time, is used, along with a schematic diagram illustrating when the laser beam is used to drill a hole in the circuit board 11. Figure 5 As shown, by executing steps S80 and S90 by the controller 50, this invention limits the laser beam to actually drilling the circuit board 11 only when it is moving at a constant speed, so that the straight groove 60 formed by the laser beam on the circuit board 11 is formed by connecting blind holes that are equidistant from each other.

[0085] As described in the previous paragraphs, the present invention accelerates from the acceleration starting point coordinate P0 and accelerates linearly between the acceleration starting point coordinate P0 and the starting point coordinate P1, while shielding the laser beam to avoid drilling holes in the circuit board 11. This avoids drilling multiple blind holes with non-linear and uneven spacing in the circuit board 11. Then, after the laser beam moves to the starting point coordinate P1, it moves at a constant speed to the ending point coordinate P2. This constant-speed movement ensures that the present invention drills multiple blind holes with equal and uniform spacing in the circuit board 11. Furthermore, because the present invention executes the preparation steps S10 to S70 through the controller 50, the last blind hole drilled by the present invention will not have uneven spacing. Thus, the present invention can drill multiple blind holes with completely equal spacing, thereby forming a high-quality, highly symmetrical straight groove 60.

[0086] Please see Figure 5 and Figure 6 As shown, Figure 6 This represents the VT diagram of the straight groove 60 generated using steps A to C as described in the prior art. (Comparison) Figure 5 and Figure 6 It can be seen that according to Figure 5 As shown, the time required to drill 10 blind holes according to the present invention, that is, the time required from drilling a first blind hole V1 to drilling a tenth blind hole V10, is approximately 10 times 20 microseconds (µs; µs), or 200 microseconds. However, according to Figure 6 As shown, the conventional method requires 10 x 200-microsecond intervals, or 2000 microseconds. Therefore, if the time is calculated from the start of drilling the first blind hole V1, the present invention accelerates the drilling of the blind hole by 10 times. Similarly, the present invention can accelerate the drilling of the straight groove 60 by 10 times. Thus, the present invention can assist a user in forming the straight groove 60 on the circuit board 11 more efficiently and with higher quality.

[0087] Please see Figure 5 and Figure 7 As shown, Figure 7 express Figure 5In the example shown, the laser beam generated by the laser unit 20 has a firing period of 20 microseconds. Figure 7 The vertical axis represents the normalized drilling laser intensity. For example, Figure 7 The vertical axis 1 represents 100% strength, while Figure 7 The vertical axis value of 0.8 represents 80% strength, and so on. From... Figure 7 As can be seen, in this embodiment, the laser beam generated by the laser unit 20 has a 50% duty cycle. At the end of each cycle, the laser beam generated by the laser unit 20 completes drilling a blind hole on the circuit board 11.

[0088] Preferably, in this embodiment, the controller 50 stores a processing file in Excellon2 or RX274 data format. This processing file defines the starting coordinates P1 and the ending coordinates P2, and also defines the diameter of the spot on the circuit board 11 generated by the laser unit 20, and the precision of moving the laser beam by the moving mechanism 40. The controller 50 also stores, for example, a preset blind hole spacing of 30 micrometers (μm; um), a laser firing cycle of 20 microseconds, and a laser acceleration time of 500 microseconds.

[0089] When the present invention adjusts the preset blind hole spacing to the adjusted blind hole spacing, the adjusted blind hole spacing multiplied by the number of cycles of the fired laser beam will equal the distance that the laser beam drills through the connected blind holes on the circuit board 11. The adjusted blind hole spacing is equal to the laser firing cycle multiplied by the laser moving speed. Therefore, in this embodiment, the controller 50 calculates the laser moving speed as 30µm / 20µs = 3 / 2m / s = 1.5m / s, or a moving speed of 1.5 meters per second, by executing step S50. This moving speed is also reflected in... Figure 5 In the example shown.

[0090] like Figure 5 As shown, the present invention takes 25 x 20-microsecond intervals, or 500 microseconds, to accelerate the laser beam from a stationary state to a moving speed of 1.5 m / s. This means that in one embodiment, the controller 50 performs step S61, calculating the laser acceleration a as (1.5 m / s) / (500 μs) = (1.5 m / s) / (0.0005 s) = 3000 m / s². 2 This translates to an acceleration of 3000 meters per second squared. Therefore, step S62 executed by the controller 50 can further calculate the acceleration distance S as (1 / 2)*(3000m / s²).2 )*(500us) 2 =375um, meaning that the distance between the acceleration starting point coordinate P0 and the starting point coordinate P1 is calculated to be 375 micrometers. With this acceleration length distance S, the controller 50 can calculate the detailed position of the acceleration starting point coordinate P0 using the aforementioned included angle θ, to ensure that when the controller 50 subsequently executes steps S80 and S90, all the blind holes drilled on the circuit board 11, including the blind holes drilled at the tail end of the straight groove 60, are spaced evenly to form a high-quality straight groove 60.

[0091] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A method for processing high-efficiency laser-cut linear grooves, characterized in that, Performed by a controller, and includes the following steps: Read a machining file to obtain the starting point coordinates and the ending point coordinates of a plane forming a straight groove in a coordinate system; Calculate a movement vector from the starting point coordinate to the ending point coordinate, and calculate that the length of the movement vector is the length of a straight line groove, and calculate the angle formed between the movement vector and one of the axes in the coordinate system; Calculate a quotient obtained by dividing the length of the straight groove by a preset blind hole spacing; wherein the quotient is an integer; The adjusted blind hole spacing is obtained by dividing the length of the straight groove by the quotient. The adjusted blind hole spacing is divided by one laser firing cycle to obtain a laser moving speed; Calculate the acceleration distance based on the laser's moving speed and acceleration time. Calculate the coordinates of the acceleration starting point based on the acceleration length, the included angle, and the starting point coordinates.

2. The method for processing high-efficiency laser linear grooves as described in claim 1, characterized in that, The step of calculating the acceleration length distance based on the laser's moving speed and acceleration time includes the following sub-steps: The laser acceleration is calculated by dividing the laser's moving speed by its acceleration time. The acceleration distance is calculated using the following formula: S=(1 / 2)*a*t 2 Where S is the acceleration distance, a is the laser acceleration, and t is the laser acceleration time.

3. The method for processing high-efficiency laser linear grooves as described in claim 1, characterized in that, The step of calculating the acceleration distance based on the laser's moving speed and acceleration time is performed using the following formula: S=(1 / 2)*V*t Where S is the acceleration distance, V is the laser speed, and t is the laser acceleration time.

4. The method for processing high-efficiency laser linear grooves as described in claim 1, characterized in that, The plane is formed by an X-axis and a Y-axis in the coordinate system, the included angle is formed between the translation vector and the X-axis, and the starting point coordinates are (x1, y1), the ending point coordinates are (x2, y2), and the acceleration starting point coordinates are (x0, y0). The step of calculating the coordinates of the acceleration starting point based on the acceleration distance and the included angle is performed using the following formula: x0 = x1 - S·cosθ y0=y1-S·sinθ Where S is the acceleration distance and θ is the included angle.

5. The high-efficiency laser linear groove processing method as described in claim 4, characterized in that, The vector of this movement is [(x2-x1),(y2-y1)], and the included angle is tan -1 The length of the vector of this shift change is ((y2-y1) / (x2-x1)).

6. The method for processing high-efficiency laser linear grooves as described in claim 1, characterized in that, After calculating the coordinates of the acceleration starting point, the following steps are further included: A moving mechanism is controlled to move a laser beam generated by a laser unit onto the plane, so that the laser beam accelerates from a stationary state to the starting coordinate in a linear motion with constant acceleration, and at the same time a laser beam shielding unit is controlled to shield the laser beam. The laser beam is controlled to move from the starting coordinate to the ending coordinate at a constant speed, while the laser beam shielding unit is controlled to stop shielding the laser beam, and the laser unit is controlled to fire the laser beam according to the laser firing cycle.

7. The method for processing high-efficiency laser linear grooves as described in claim 6, characterized in that, The moving mechanism is controlled to move the laser beam generated by the laser unit onto the plane. By controlling a first galvanometer reflecting scanning mirror to rotate along a first direction and a second galvanometer reflecting scanning mirror to rotate along a second direction, the laser beam moves on the plane along the first direction and along the second direction. The first direction and the second direction are perpendicular to each other. The first galvanometer reflecting scanning mirror reflects the laser beam generated by the laser unit to the second galvanometer reflecting scanning mirror. The second galvanometer reflecting scanning mirror then reflects the laser beam to a flat-field laser focusing lens, so that the flat-field laser focusing lens can then focus the laser beam onto the plane.

8. A high-efficiency laser linear groove processing device, characterized in that, include: A platform for carrying a circuit board; A laser unit generates a laser beam and fires the laser beam according to a laser firing cycle; wherein the laser beam is aligned with a plane in a coordinate system, and the plane corresponds to the circuit board on the platform aligned with the laser beam. A laser beam shielding unit for shielding the laser beam; A moving mechanism for relative movement between the laser beam generated by the laser unit and the circuit board carried by the platform; A controller, electrically connected to the laser unit, the laser beam shielding unit, and the moving mechanism, is used to perform the following steps: Read a machining file to obtain the starting point coordinates and the ending point coordinates of the plane forming a straight groove in the coordinate system; Calculate a movement vector from the starting point coordinate to the ending point coordinate, and calculate that the length of the movement vector is the length of a straight line groove, and calculate the angle formed between the movement vector and one of the axes in the coordinate system; Calculate a quotient obtained by dividing the length of the straight groove by a preset blind hole spacing; wherein the quotient is an integer; The adjusted blind hole spacing is obtained by dividing the length of the straight groove by the quotient. The adjusted blind hole spacing divided by the laser firing cycle is calculated as the laser moving speed; Calculate the acceleration distance based on the laser's moving speed and acceleration time. Calculate the coordinates of the acceleration starting point based on the acceleration length, the included angle, and the starting point coordinates.

9. The high-efficiency laser linear groove processing apparatus as described in claim 8, characterized in that, The step of the controller calculating the acceleration distance based on the laser's moving speed and acceleration time involves the following sub-steps: The laser acceleration is calculated by dividing the laser's moving speed by its acceleration time. The acceleration distance is calculated using the following formula: S=(1 / 2)*a*t 2 Where S is the acceleration distance, a is the laser acceleration, and t is the laser acceleration time.

10. The method for processing high-efficiency laser linear grooves as described in claim 8, characterized in that, The step of the controller calculating the acceleration distance based on the laser's moving speed and acceleration time involves the controller calculating the acceleration distance using the following formula: S=(1 / 2)*V*t Where S is the acceleration distance, V is the laser speed, and t is the laser acceleration time.

11. The method for processing high-efficiency laser linear grooves as described in claim 8, characterized in that, The plane is formed by an X-axis and a Y-axis in the coordinate system, the included angle is formed between the translation vector and the X-axis, and the starting point coordinates are (x1, y1), the ending point coordinates are (x2, y2), and the acceleration starting point coordinates are (x0, y0). The step of the controller calculating the coordinates of the acceleration starting point based on the acceleration length and the included angle is performed by the controller using the following formula: x0 = x1 - S·cosθ y0=y1-S·sinθ Where S is the acceleration distance and θ is the included angle.

12. The method for processing high-efficiency laser linear grooves as described in claim 11, characterized in that, The vector of this movement is [(x2-x1),(y2-y1)], and the included angle is tan -1 The length of the vector of this shift change is ((y2-y1) / (x2-x1)).

13. The method for processing high-efficiency laser linear grooves as described in claim 8, characterized in that, After calculating the coordinates of the acceleration starting point, the controller further performs the following steps: The moving mechanism is controlled to move the laser beam generated by the laser unit onto the plane, so that the laser beam accelerates from the starting point coordinate from a stationary state to the starting point coordinate in a linear motion with constant acceleration, and at the same time the laser beam shielding unit is controlled to shield the laser beam. The laser beam is controlled to move from the starting coordinate to the ending coordinate at a constant speed, while the laser beam shielding unit is controlled to stop shielding the laser beam, and the laser unit is controlled to fire the laser beam according to the laser firing cycle.

14. The method for processing high-efficiency laser linear grooves as described in claim 8, characterized in that, The mobile facility includes: A first galvanometer reflecting scanning mirror is electrically connected to the controller to reflect the laser beam generated by the laser unit; A second galvanometer reflecting scanning mirror, electrically connected to the controller, receives the laser beam reflected by the first galvanometer reflecting scanning mirror and further reflects the laser beam; A flat-field laser focusing lens receives the laser beam reflected by the second galvanometer reflective scanning mirror and focuses the laser beam onto the circuit board of the carrier platform. The controller controls the first galvanometer reflective scanning mirror to rotate along a first direction and controls the second galvanometer reflective scanning mirror to rotate along a second direction, so that the controller can control the movement of the laser beam focused on the circuit board by the flat-field laser focusing lens. The first direction and the second direction are perpendicular to each other.

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