Molding device, injection molding system and molding method

Abstract

A molding apparatus includes a first mold, a second mold including a base and a peripheral portion disposed around or above the base, a mold cavity defined by the first mold and the second mold, and a first carrier disposed within the mold cavity, the first carrier is attachable to and detachable from the base or the peripheral portion of the second mold.

Description

Technical Field

[0001] This invention relates to a molding apparatus, injection molding system, and molding method, and more particularly to a molding apparatus, injection molding system, and molding method for forming an article comprising more than one part having different physical or functional properties. Background Technology

[0002] Foamed polymer materials offer numerous advantages, such as high strength, light weight, impact resistance, and thermal insulation. Foamed articles can be manufactured through injection molding or extrusion molding. For example, after melting a polymer material and mixing it with a foaming agent to form a mixture, force or pressure is applied to the mixture to inject or extrude it into the cavity of a mold, where the mixture is allowed to foam and cool to form the foamed article.

[0003] However, it is necessary to improve the properties of foamed products manufactured by injection molding systems, for example, to give different parts of the foamed product different properties. Therefore, improvements are still needed in the structure of the molding apparatus, the injection molding system, and the methods for manufacturing foamed products. Summary of the Invention

[0004] One object of the present invention is to provide a molding apparatus, an injection molding system, and an injection molding method.

[0005] According to a specific embodiment of the present invention, a molding apparatus is provided. The molding apparatus includes: a first mold, a second mold including a base and a peripheral portion disposed around or above the base, a mold cavity defined by the first mold and the second mold, and a first carrier disposed within the mold cavity and attachable to and detachable from the base or the peripheral portion of the second mold.

[0006] According to a specific embodiment of the present invention, a molding method is provided. The molding method includes: providing a molding apparatus including a first mold, a second mold having a base and a peripheral portion disposed around or above the base, and a third mold; providing a first carrier that can be attached to and detached from the base or the peripheral portion; disposing of a first layer on the first carrier, the first layer comprising a first polymer material; engaging the first carrier to the second mold; engaging the first mold to the second mold to form a first mold cavity, wherein the first carrier and the first layer contained therein are disposed within the first mold cavity; injecting a second polymer material from an injection unit into the first mold cavity to form a second layer and an article comprising the first layer and the second layer made of the second polymer material; and removing the article from the molding apparatus. Attached Figure Description

[0007] The present invention can be best understood from the following detailed description when read in conjunction with the accompanying drawings. It should be noted that, in accordance with industry standard practice, the various components are not drawn to scale. In fact, for clarity, the dimensions of many components may be arbitrarily enlarged or reduced.

[0008] Figure 1 This is a schematic perspective view of a molding apparatus according to some specific embodiments of the present invention;

[0009] Figure 2 This is a schematic perspective view of a molding apparatus according to some specific embodiments of the present invention;

[0010] Figure 3 This is a schematic top view of a part of a molding apparatus according to some specific embodiments of the present invention;

[0011] Figure 4 This is a schematic cross-sectional view of a part of a molding apparatus according to some specific embodiments of the present invention;

[0012] Figure 5 This is a schematic perspective view of a part of a molding apparatus according to some specific embodiments of the present invention;

[0013] Figure 6 This is a schematic perspective view of a part of a molding apparatus according to some specific embodiments of the present invention;

[0014] Figure 7 This is a schematic perspective view of a part of a molding apparatus according to some specific embodiments of the present invention;

[0015] Figure 8 This is a schematic perspective view of a part of a molding apparatus according to some specific embodiments of the present invention;

[0016] Figure 9 This is a schematic top view of a part of a molding apparatus according to some specific embodiments of the present invention;

[0017] Figure 10 This is a schematic cross-sectional view of a part of a molding apparatus according to some specific embodiments of the present invention;

[0018] Figure 11 This is a schematic perspective view of an injection molding system according to some specific embodiments of the present invention;

[0019] Figure 12 This is a schematic perspective view of a molding apparatus according to some specific embodiments of the present invention;

[0020] Figure 13 A flowchart illustrating a molding method according to some specific embodiments of the present invention;

[0021] Figure 14 and Figures 16 to 22 This is a schematic perspective view of the injection molding system used in the molding method according to some specific embodiments of the present invention;

[0022] Figure 15 This is a schematic perspective view of a portion of an injection molding system used in a molding method according to some specific embodiments of the present invention. Detailed Implementation

[0023] [Cross-referencing related applications]

[0024] This application claims priority to U.S. Patent Application No. 19 / 200,646, filed May 6, 2025, and U.S. Provisional Patent Application No. 63 / 686,854, filed August 25, 2024, the entire contents of which are incorporated herein by reference.

[0025] The following description provides many different specific embodiments or examples for implementing various features of the provided subject matter. Specific examples of components and configurations are described below to simplify the invention. Of course, these are merely examples and not intended to be limiting. For example, the following description of forming a first feature above or on a second feature may include specific embodiments in which the first and second features are formed in direct contact, and may also include specific embodiments in which an additional feature may be formed between the first and second features such that the first and second features do not directly contact each other. Furthermore, reference numerals and / or letters may be repeated in the various examples. This repetition is for simplicity and clarity and does not in itself imply a relationship between the various specific embodiments and / or configurations discussed.

[0026] In addition, this document may use spatial terms such as "below," "under," "below," "above," and "above" to describe the relationship between one element or feature and another, as shown in the figures. Besides the orientations depicted in the figures, such spatial terms also cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial descriptors used herein may be interpreted accordingly.

[0027] While the numerical ranges and parameters describing the broad scope of this invention are approximate, the values ​​disclosed in specific examples are reported as precisely as possible. However, any numerical value inherently contains some error due to the standard deviation necessarily found in individual test measurements. Additionally, as used herein, the term "about" generally means within 10%, 5%, 1%, or 0.5% of a known value or range. Alternatively, when considered by a person skilled in the art, the term "about" means within an acceptable standard error of the average. Except in operational / working examples, or unless explicitly stated otherwise, all numerical ranges, quantities, values, and percentages disclosed herein, such as material quantities, durations, temperatures, operating conditions, quantity ratios, etc., should be understood to be modified by the term "about" in all cases. Therefore, unless indicated to the contrary, the numerical parameters set forth in this invention and the appended claims are approximate values ​​that may vary as needed. At a minimum, each numerical parameter should be interpreted according to the number of significant figures reported and by applying common rounding techniques. In this document, a range may be expressed as from one endpoint to another or between two endpoints. Unless otherwise stated, all ranges disclosed herein include such endpoints.

[0028] Figure 1 This is a schematic perspective view of the molding apparatus 100 in the open state according to some specific embodiments of the present invention, and Figure 2 This is a schematic perspective view of the molding apparatus 100 in another open state.

[0029] In some specific embodiments, reference is made to Figure 1 and Figure 2 The molding apparatus 100 includes a first mold 11, a second mold 14, a first mold cavity 19a defined by the first mold 11 and the second mold 14, and a first carrier 132 disposed within the first mold cavity 19a. In some embodiments, the first mold 11 serves as an upper mold, and the second mold 14 serves as a lower mold. In some embodiments, the second mold 14 includes a first base 13a and a first peripheral portion 15a disposed around or above the first base 13a. In some embodiments, the second mold 14 is movable relative to the first mold 11. In some embodiments, the first carrier 132 is configured to receive a first layer M1 and is attachable to or detachable from the first base 13a or the first peripheral portion 15a of the second mold 14.

[0030] In some embodiments, a first mold 11, a first base 13a, and a first peripheral portion 15a define a first mold cavity 19a. In some embodiments, in certain configurational aspects, such as size, shape, etc., the first mold 11 corresponds to a second mold 14. The first mold 11 can be placed on and engaged with the first peripheral portion 15a. In some embodiments, the molding apparatus 100 is configured to transport the first base 13a and the first peripheral portion 15a toward the first mold 11, and then arrange the first mold 11 above the first peripheral portion 15a. In some embodiments, the molding apparatus 100 is configured to transport the first mold 11 toward the second mold 14, and then arrange the second mold 14 below the first mold 11. In some embodiments, the first mold 11 is aligned with the first base 13a. In some embodiments, such as Figure 1 and Figure 2 As shown, the molding device 100 is in the open state. In some specific embodiments, the first mold 11 is arranged above the first peripheral portion 15a, movable relative to it and capable of engaging with it, and the first peripheral portion 15a is arranged above the first base 13a, movable relative to it and capable of engaging with it.

[0031] In some embodiments, when the first mold 11 and the second mold 14 are arranged opposite each other, the first mold 11 and the second mold 14 together define a first mold cavity 19a for forming an article (not shown). In some embodiments, a first peripheral portion 15a of the second mold 14 is arranged between the first mold 11 and the first base 13a.

[0032] In some embodiments, the molding apparatus 100 further includes a third mold 17a attached to the first mold 11. In some embodiments, when the first mold 11 is arranged opposite to the second mold 14 and the third mold 17a is surrounded by the second mold 14, the first mold cavity 19a is defined by the first mold 11, the second mold 14, and the third mold 17a. In some embodiments, the third mold 17a includes a shoe last.

[0033] Figure 3 This is a schematic top view of a portion of the molding apparatus 100 in a closed state. Figure 4 For along Figure 3 A cross-sectional view of this part of the forming apparatus 100 for the A-A' line. In some specific embodiments, refer to... Figure 3 and Figure 4The first peripheral portion 15a of the second mold 14 includes a first portion 151 and a second portion 152 that are adjacent to and engageable with each other, and a first base 13a is disposed between the first portion 151 and the second portion 152. In some embodiments, the first portion 151 and the second portion 152 are movable and separable from each other. The first portion 151 and the second portion 152 can move toward or away from each other. In some embodiments, the extension 151a of the first portion 151 and the extension 152a of the second portion 152 surround the first base 13a and the first carrier 132. In some embodiments, a first layer M1, accommodated by the first carrier 132, is disposed between the first portion 151 and the second portion 152.

[0034] The first base 13a may be stationary relative to the first portion 151 and the second portion 152. In some embodiments, when the molding apparatus 100 is in a closed state, the first portion 151 and the second portion 152 are attached to and engaged with each other to seal the first mold cavity 19a. In some embodiments, when the molding apparatus 100 is in a closed state, the first portion 151 and the second portion 152 are attached to and engaged with the first base 13a and the first carrier 132.

[0035] In some specific embodiments, when the molding device 100 is in the open state (e.g. Figure 2 As shown), the first part 151 and the second part 152 are separated from each other, and the first mold 11 is further away from the second mold 14 (as shown). Figure 1 As shown), the article (not shown) formed in the first mold cavity 19a and having a first layer M1 disposed thereon can be easily removed from the first mold cavity 19a. For some specific embodiments, please refer back to... Figure 2 The first portion 151 moves or slides away from the second portion 152 to expand the first mold cavity 19a. In some embodiments, when the molding device 100 is in the open state, the first mold cavity 19a is in the expanded state. In some embodiments, when the molding device 100 is in the open state, a first gap G1 is formed between the first portion 151 and the second portion 152.

[0036] In some embodiments, the first carrier 132 may be attached to and detached from the first base 13a. The first carrier 132 attached to the first base 13a is configured to receive the first layer M1 and attach the first layer M1 to the bottom surface of the article, or to form a pattern on the bottom surface of the article. In some embodiments, the first peripheral portion 15a has an inner sidewall 153. In some embodiments, the first mold 11, the inner sidewall 153 of the first peripheral portion 15a, and the first carrier 132 together define a first mold cavity 19a, and the first layer M1 is disposed within the first mold cavity 19a. Alternatively, the first carrier 132 may be attached to any suitable location in the first mold cavity 19a. In some embodiments, the first carrier 132 is attached to the inner sidewall 153 of the first peripheral portion 15a. The first carrier 132 attached to the inner sidewall 153 is configured to receive the first layer M1 and attach the first layer M1 to the sidewall of the article, or to form a pattern on the sidewall of the article. In some specific embodiments, the first carrier 132 attached to the first mold 11 is configured to receive the first layer M1 and attach the first layer M1 to the top surface of the article (not shown), or to form a pattern on the top surface of the article.

[0037] Figure 5 This is an enlarged schematic perspective view of a portion of the molding apparatus 100 according to some specific embodiments of the present invention. For some specific embodiments, please refer to... Figure 5 A first carrier 132 is disposed on a first base 13a. In some embodiments, the first carrier 132 includes a recess 133 configured to receive a first layer M1. In some embodiments, the first layer M1 may be temporarily received by the recess 133. In some embodiments, the first carrier 132 is manufactured by 3D printing. In some embodiments, the first carrier 132 comprises metal, polymer, or any suitable material.

[0038] In some embodiments, the recess 133 includes a first recess 133a and a second recess 133b located within the first recess 133a. The first recess 133a and the second recess 133b recess from the top surface 13t of the first carrier 132. In some embodiments, the depth Db of the second recess 133b exceeds the depth Da of the first recess 133a. In some embodiments, the first mold cavity 19a is defined by the first mold 11, the first peripheral portion 15a, the first recess 133a, and a first layer M1 disposed within the second recess 133b. In some embodiments, the second recess 133b is used to prevent movement of the first layer M1 during the injection of fluid or liquid into the first mold cavity 19a. The second recess 133b can be disposed at any suitable location on the top surface 13t of the first carrier 132. In some embodiments, the configuration of the second recess 133b corresponds to the configuration of the first layer M1. The second recess 133b is conformal to the first layer M1. In some embodiments, the first layer M1 is disposed on the first carrier 132 and within the second recess 133b. In some embodiments, the first layer M1 and the second recess 133b may be temporarily engaged with each other. In some embodiments, the first layer M1 is temporarily fixed within the second recess 133b and may be removed or detached from the second recess 133b and the first carrier 132.

[0039] In some embodiments, the molding apparatus 100 further includes a locking device 134. In some embodiments, the locking device 134 is configured to lock the first carrier 132 onto the second mold 14. In some embodiments, the locking device 134 allows the first carrier 132 to temporarily engage with the first base 13a or the first peripheral portion 15a. In some embodiments, the locking device 134 is used to prevent movement of the first carrier 132 during the injection of fluid or liquid into the first mold cavity 19a. The locking device 134 can be arranged at any suitable location between the first carrier 132 and the second mold 14.

[0040] In some embodiments, the locking device 134 includes a first locking element 134a disposed on a first carrier 132, and a second locking element 134b disposed on a second mold 14 and corresponding to the first locking element 134a. In some embodiments, the second locking element 134b is disposed at a first base 13a. In some embodiments, the first locking element 134a is disposed on the bottom surface of the first carrier 132. In some embodiments, the first locking element 134a and the second locking element 134b may clamp or engage with each other, but the invention is not limited thereto. In some embodiments, when the first locking element 134a and the second locking element 134b are clamped or engaged with each other, the first locking element 134a overlaps the second locking element 134b.

[0041] In some embodiments, the first locking element 134a is part of the first carrier 132, and the second locking element 134b is part of the second mold 14. In some embodiments, the second locking element 134b protrudes from the first base 13a, and the first locking element 134a is configured to receive the second locking element 134b. In some embodiments, the second locking element 134b protrudes from the first peripheral portion 15a. In some embodiments, the first locking element 134a protrudes from the first carrier 132, and the second locking element 134b is configured to receive the first locking element 134a. The position and number of the first locking elements 134a can be adjusted as needed and are not particularly limited. The position and number of the second locking elements 134b can also be adjusted as needed and are not particularly limited. In some embodiments, the position and number of the second locking elements 134b correspond to the position and number of the first locking elements 134a.

[0042] Figure 6 This is a schematic perspective view of the first layer M1 according to some specific embodiments of the present invention. In some specific embodiments, reference is made to... Figure 6 The first layer M1 comprises a first polymer material. The first layer M1 is configured to form part of an article (not shown). In some embodiments, the first polymer material comprises rubber. In some embodiments, the first polymer material comprises thermoplastic polyurethane (TPU), polyurethane (PU), plastic, or any other suitable material. In some embodiments, the first polymer material comprises a physical foaming agent, such as a supercritical fluid. In some embodiments, the physical foaming agent is gaseous nitrogen, carbon dioxide, etc. In some embodiments, the first polymer material is foamable, non-foamable, or slightly foamable. In some embodiments, the first polymer material comprises a first dye. In some embodiments, the first layer M1 is abrasion resistant. In some embodiments, the first layer M1 comprises multiple segments. These segments may comprise the same or different materials. In some embodiments, the first layer M1 is manufactured by 3D printing.

[0043] Figure 7 This is a schematic perspective view of a portion of a molding apparatus 100 according to some specific embodiments of the present invention. In some specific embodiments, reference is made to... Figure 7 A first layer M1 is disposed on a first carrier 132, and the first carrier 132 carries the first layer M1 and engages with a first base 13a. In some embodiments, the first layer M1 is disposed within a second recess 133b and surrounded by a first recess 133a. In some embodiments, the first layer M1 is formed and then disposed on the first carrier 132 and within the recess 133b. In some embodiments, the first base 13a and the first carrier 132 are engaged with each other through a locking device 134.

[0044] In some specific embodiments, multiple carriers (e.g., the first carrier 132) may be arranged within the first mold cavity 19a. Figure 8 This is a schematic perspective view of a portion of a molding apparatus 100 according to some specific embodiments of the present invention. Figure 9 This is a schematic top view of a portion of the molding apparatus 100 in a closed state. Figure 10 For along Figure 9 A cross-sectional view of this part of the forming apparatus 100 for the B-B' line. In some specific embodiments, refer to... Figures 8 to 10 The molding apparatus 100 further includes a second carrier 155 disposed within a first mold cavity 19a. In some embodiments, an extension 151a of the first portion 151 and an extension 152a of the second portion 152 surround the first base 13a and the first carrier 132, and the second carrier 155, configured to accommodate the second layer M2, is disposed within the first mold cavity 19a. In some embodiments, the second carrier 155, configured to accommodate the second layer M2, is attached to and engages with the first peripheral portion 15a. In some embodiments, the second carrier 155 is attached to an inner sidewall 153 and configured to accommodate the second layer M2. The second layer M2 accommodated by the second carrier 155 is configured to attach the second layer M2 to a sidewall of the article, or to form a pattern on the sidewall of the article. In some embodiments, the first layer M1 and the second layer M2 have the same or different patterns or structures, such that the pattern on the sidewall of the article formed by the second layer M2 and the pattern on the bottom surface of the article formed by the first layer M1 may be the same or different. In some embodiments, the second carrier 155 is arranged adjacent to the first carrier 132. In some embodiments, the second carrier 155 is manufactured by 3D printing. In some embodiments, the second layer M2 is manufactured by 3D printing.

[0045] In some embodiments, a second carrier 155 is attached to and engaged with one of the first portion 151 and the second portion 152, and is disposed between the first base 13a and the first mold 11. In some embodiments, the second carrier 155 is attached to and engaged with the first portion 151, the second carrier 155 includes a recess 156 facing the second portion 152, and a second layer M2 is disposed in the recess 156. In some embodiments, the second carrier 155 is attached to and engaged with the second portion 152, and the recess 156 faces the first portion 151. In some embodiments, the second carrier 155 is embedded in one of the first portion 151 and the second portion 152 of the second mold 14. In some embodiments, as... Figure 8 As shown, the second carrier 155 includes a first side 155a and a second side 155b opposite to the first side, the first side 155a being exposed, and the second side 155b being attached to one of the first portion 151 and the second portion 152 of the second mold 14.

[0046] In some specific embodiments, the second carrier 155 is similar to Figure 5 and Figure 7 The first carrier 132 shown is omitted in detail for the sake of brevity; a detailed description of this operation is omitted. In some specific embodiments, the second layer M2 is similar to... Figure 6 and Figure 7 The first layer M1 shown is omitted in detail for the sake of brevity. In some embodiments, the first layer M1 and the second layer M2 may comprise the same or different materials. In some embodiments, the first carrier 132 and the first layer M1 are omitted.

[0047] In some embodiments, the second layer M2 comprises a second polymer material. In some embodiments, the second polymer material comprises a second dye. In some embodiments, the second polymer material comprises rubber. In some embodiments, the second polymer material comprises TPU, PU, ​​plastic, or any other suitable material. In some embodiments, the second polymer material comprises a physical foaming agent, such as a supercritical fluid. In some embodiments, the physical foaming agent is gaseous nitrogen, carbon dioxide, etc. In some embodiments, the second polymer material is foamable, non-foamable, or slightly foamable. In some embodiments, the second layer M2 is abrasion resistant. In some embodiments, the second layer M2 comprises multiple segments. These segments may comprise the same or different materials. In some embodiments, the second layer M2 is manufactured by 3D printing.

[0048] In some embodiments, the molding apparatus 100 includes a plurality of locking devices 134. In some embodiments, the locking devices 134 are configured to lock the second carrier 155 onto the first peripheral portion 15a. In some embodiments, the locking devices 134 allow the second carrier 155 to be temporarily engaged with the first peripheral portion 15a. In some embodiments, the locking devices 134 are used to prevent movement of the second carrier 155 during the injection of fluid or liquid into the first mold cavity 19a. The locking devices 134 can be arranged at any suitable location between the second carrier 155 and the first peripheral portion 15a.

[0049] In some embodiments, the locking device 134 includes a first locking element 134a disposed on the second carrier 155, and a second locking element 134b disposed on the first peripheral portion 15a and corresponding to the first locking element 134a. In some embodiments, the first locking element 134a is disposed on the bottom surface of the second carrier 155. In some embodiments, the first locking element 134a is part of the second carrier 155, and the second locking element 134b is part of the first peripheral portion 15a. In some embodiments, the second locking element 134b protrudes from the first peripheral portion 15a, and the first locking element 134a is configured to receive the second locking element 134b. In some embodiments, the first locking element 134a protrudes from the second carrier 155, and the second locking element 134b is configured to receive the first locking element 134a.

[0050] Figure 11 This is a schematic perspective view of an injection molding system 200 according to some specific embodiments of the present invention. In some specific embodiments, the injection molding system 200 is configured to form an article (not shown) and includes a molding device 100, a mixing unit 201, and an injection unit 202.

[0051] In some embodiments, the injection unit 202 is connected to the mixing unit 201. In some embodiments, the molding apparatus 100 includes a feed port 12 extending through the first mold 11 and configured to connect to the injection unit 202. In some embodiments, the first mold 11 includes a feed port 12 communicatively with a first mold cavity 19a. The feed port 12 has an opening 121 disposed on the first mold 11.

[0052] In some embodiments, the material can enter the first mold cavity 19a via multiple feed ports 12. For simplicity and clarity, two feed ports 12 communicating with the first mold cavity 19a are illustrated, but it will be understood that any suitable number of feed ports 12 may be provided at the first mold 11. In some embodiments, the second mold 14 includes feed ports 12. In some embodiments, the first peripheral portion 15a or the first base 13a includes feed ports 12.

[0053] In some embodiments, the molding apparatus 100 further includes one or more pressure regulating systems 18. In some embodiments, the pressure regulating system 18 is attached to the second mold 14. In some embodiments, the pressure regulating system 18 is attached to a first peripheral portion 15a or a first base 13a. In some embodiments, when the first mold 11 and the second mold 14 are arranged opposite each other, the pressure regulating system 18 includes a gas conduit 181 and a junction 187 connecting the first mold cavity 19a and the gas conduit 181.

[0054] In some embodiments, one end of the first gas conduit 181 is connected to the junction 187, and the other end of the first gas conduit 181 is connected to the gas controller 183. In some embodiments, the gas controller 183 is configured to supply or discharge a fluid or gas, wherein a suitable fluid or gas can be supplied or discharged as needed; for example, the fluid or gas may be air, an inert gas, etc., but the invention is not limited thereto.

[0055] Figure 12 This is a schematic perspective view of a molding apparatus according to some specific embodiments of the present invention. For some specific embodiments, please refer to... Figure 12 The second mold 14 further includes a second base 13b and a second peripheral portion 15b. In some embodiments, the first mold 11 is disposed above the second peripheral portion 15b, movable relative to it, and engageable therewith, and the second peripheral portion 15b is disposed above the second base 13b, movable relative to it, and engageable therewith. In some embodiments, when the first mold 11 and the second peripheral portion 15b are disposed opposite each other, the first mold 11, the second base 13b, and the second peripheral portion 15b together define a second mold cavity 19b for forming an article (not shown). In some embodiments, the molding apparatus 100 includes a first mold cavity 19a and a second mold cavity 19b.

[0056] In some embodiments, both the third mold 17a and the fifth mold 17b are attached to the first mold 11. The third mold 17a is configured to define a first mold cavity 19a together with the first mold 11, the first peripheral portion 15a, and the first base 13a, and the fifth mold 17b is configured to define a second mold cavity 19b together with the first mold 11, the second peripheral portion 15b, and the second base 13b. In some embodiments, the fifth mold 17b is a shoe last. In some embodiments, the second base 13b, the second peripheral portion 15b, the second mold cavity 19b, and the fifth mold 17b are omitted.

[0057] This invention discloses an injection molding method M300. Figure 13This is a flowchart of method M300 of an injection molding method according to some specific embodiments of the present invention. Method M300 includes a number of operations: (O301) providing a molding apparatus including a first mold, a second mold having a first base and a first peripheral portion disposed around or above the first base, and a third mold; (O302) providing a first carrier that can be attached to and detached from the first base or the first peripheral portion; (O303) disposing a first layer on the first carrier, the first layer comprising a first polymer material; (O304) engaging the first carrier with the second mold; (O305) disposing an assembly on the third mold; (O306) engaging the first mold with the second mold. The first mold cavity is formed by engaging the second mold to surround the third mold, wherein the first carrier and the first layer contained by the first carrier are arranged within the first mold cavity; (O307) a third polymer material is injected from the injection unit into the first mold cavity to form an article comprising the first layer, the component and a third layer formed of the third polymer material; (O308) the article is removed from the molding apparatus to obtain the article; and (O309) after the article is formed, the first carrier is replaced with a third carrier having a fourth layer comprising a fourth polymer material disposed thereon.

[0058] The method includes many operations, and the descriptions and illustrations are not considered as restrictions on the order of operations. Figures 14 to 22 This is a schematic perspective view illustrating one or more operations of the molding method M300 according to some specific embodiments of the present invention. The injection molding method M300 comprises a molding apparatus 100 (such as...) Figure 1 and Figure 2 Injection molding system 200 (as shown) Figure 11 As shown in the figure. Figure 5 and Figure 7 This is a schematic perspective view of the first carrier 132 of the molding apparatus 100 according to some specific embodiments of the present invention.

[0059] Method M300 begins with operation O301. Operation O301 includes providing a molding apparatus comprising a first mold, a second mold having a first base and a first peripheral portion disposed around or above the first base, and a third mold. In some specific embodiments, please refer to... Figure 14The injection molding method M300 includes operation O301, which includes providing a molding apparatus 100, the molding apparatus 100 including a first mold 11, a second mold 14 having a first base 13a and a first peripheral portion 15a disposed around or above the first base 13a, and a third mold 17a. In some specific embodiments, the injection molding method M300 includes providing a mixing unit 201 and an injection unit 202 above the molding apparatus 100.

[0060] In some specific embodiments, such as Figure 5 and Figure 7 The molding apparatus 100 is provided or received as shown. In some embodiments, the molding apparatus 100 is configured to form an article. In some embodiments, the molding apparatus 100 includes a pressure regulating system 18 having a junction 187, a gas conduit 181, and a pressure sensing unit (not shown).

[0061] In some embodiments, the molding apparatus 100 is in an open state during operation O301. In some embodiments, the first mold 11 and the second mold 14 are separated from each other during operation O301. In some embodiments, the first mold 11 is moved vertically to a first position above the second mold 14. At this first position, the first mold 11 is aligned with the second mold 14 of the molding apparatus 100. In some embodiments, a first distance D1 between the first mold 11 and the second mold 14 is greater than 0.

[0062] Method M300 continues with operations O302 and O303. Operation O302 includes providing a first carrier that is attachable to and detachable from the first base or the first peripheral portion. Operation O303 includes disposing of a first layer on the first carrier, the first layer comprising a first polymer material.

[0063] In operating O302, please refer to Figure 15 A first carrier 132 is provided that is attachable to and detachable from a first base 13a or a first peripheral portion 15a. In operation O303, a first layer M1 is provided that is disposed on the first carrier 132. The first layer M1 is configured to form part of an article of manufacture (not shown). In some embodiments, the first layer M1 comprises a first polymer material. In some embodiments, the first layer M1 is manufactured by 3D printing. In some embodiments, the first carrier 132 is manufactured by 3D printing.

[0064] In some embodiments, the first carrier 132 accommodates the first layer M1. In some embodiments, the first layer M1 is temporarily accommodated by a recess 133 of the first carrier 132. In some embodiments, the first layer M1 is disposed within the recess 133. In some embodiments, the recess 133 includes a first recess 133a and a second recess 133b located within the first recess 133a, and the first layer M1 is accommodated by the first carrier 132 and disposed within the second recess 133b corresponding to the structure of the first layer M1. In some embodiments, the first layer M1 and the second recess 133b may be temporarily engaged with each other. In some embodiments, the first layer M1 is temporarily fixed within the second recess 133b and may be removed or detached from the second recess 133b and the first carrier 132.

[0065] Method M300 continues with operation O304. Operation O304 includes engaging the first carrier with the second mold.

[0066] In some specific embodiments, reference is made to Figure 16 Operation O304 includes engaging the first base 13a with the first carrier 132. In some embodiments, the first layer M1 is disposed on the first carrier 132 before the first base 13a is engaged with the first carrier 132. In some embodiments, after the first layer M1 is disposed on the first carrier 132 and located within the recess 133, the first carrier 132, which accommodates the first layer M1, is engaged with the first base 13a. In some embodiments, the first layer M1 is disposed on the first carrier 132 after the first base 13a is engaged with the first carrier 132.

[0067] In some specific embodiments, when the molding device 100 is in the open state, such as Figure 16 As shown in the diagram, the first carrier 132 accommodating the first layer M1 is placed on the first base 13a. In some specific embodiments, when the molding apparatus 100 is in the open state, such as... Figure 16 As shown in the diagram, the first layer M1 is placed on the first carrier 132. In some specific embodiments, the first base 13a and the first carrier 132 are surrounded by a first peripheral portion 15a.

[0068] In some specific embodiments, reference is made to Figure 16Operation O304 includes engaging the first carrier 132 and the second mold 14 through a locking device 134 between the first carrier 132 and the second mold 14. In some embodiments, the locking device 134 prevents the first carrier 132 from moving when it is positioned within the molding apparatus 100. In some embodiments, the locking device 134 temporarily engages the first carrier 132 and the second mold 14. In some embodiments, the locking device 134 temporarily engages the first carrier 132 and the first base 13a.

[0069] In some embodiments, the locking device 134 includes a first locking element 134a disposed on the first carrier 132, and a second locking element 134b disposed on the second mold 14 and corresponding to the first locking element 134a. In some embodiments, operation O304 includes clamping or engaging the first locking element 134a and the second locking element 134b with each other, but the invention is not limited thereto.

[0070] In some embodiments, the second locking element 134b protrudes from the first base 13a, and when the first locking element 134a and the second locking element 134b are engaged, the first locking element 134a receives the second locking element 134b. In some embodiments, the first locking element 134a protrudes from the first carrier 132, and when the first locking element 134a and the second locking element 134b are engaged, the second locking element 134b receives the first locking element 134a.

[0071] In some specific embodiments, method M300 further includes providing a second carrier 155 and disposing a second layer M2 on the second carrier 155, wherein the second layer M2 comprises a second polymer material.

[0072] In some embodiments, method M300 further includes engaging the second carrier 155 with the second mold 14. In some embodiments, method M300 further includes attaching a first carrier 132 having a first layer M1 disposed thereon to a first base 13a, and attaching a second carrier 155 having a second layer M2 disposed thereon to a first peripheral portion 15a.

[0073] In some embodiments, the first peripheral portion 15a is engaged with the second carrier 155. In some embodiments, the second layer M2 is disposed on the second carrier 155 before the first peripheral portion 15a is engaged with the second carrier 155. In some embodiments, after the second layer M2 is disposed on the second carrier 155 and located within the recess 156, the second carrier 155, which accommodates the second layer M2, is engaged with the first peripheral portion 15a. In some embodiments, the second layer M2 is disposed on the second carrier 155 after the first peripheral portion 15a is engaged with the second carrier 155.

[0074] In some specific embodiments, when the molding device 100 is in the open state, such as Figure 16 As shown, the second carrier 155, which accommodates the second layer M2, is placed on the first peripheral portion 15a. In some specific embodiments, the second layer M2 is placed on the second carrier 155 when the molding apparatus 100 is in the open state.

[0075] In some embodiments, method M300 further includes engaging the second carrier 155 and the second mold 14 through a locking device 134 between the second carrier 155 and the second mold 14. In some embodiments, the locking device 134 prevents the second carrier 155 from moving when it is disposed within the molding apparatus 100. In some embodiments, the locking device 134 temporarily engages the second carrier 155 and the second mold 14. In some embodiments, the locking device 134 temporarily engages the second carrier 155 and the first peripheral portion 15a.

[0076] In some embodiments, the locking device 134 includes a first locking element 134a disposed on the second carrier 155, and a second locking element 134b disposed on the second mold 14 and corresponding to the first locking element 134a. In some embodiments, the method M300 includes clamping or engaging the first locking element 134a and the second locking element 134b disposed on the second carrier 155.

[0077] In some embodiments, the second locking element 134b protrudes from the first peripheral portion 15a, and when the first locking element 134a and the second locking element 134b are engaged, the first locking element 134a receives the second locking element 134b. In some embodiments, the first locking element 134a protrudes from the second carrier 155, and when the first locking element 134a and the second locking element 134b are engaged, the second locking element 134b receives the first locking element 134a.

[0078] In some embodiments, the first carrier 132 and the first layer M1 are omitted, and only the second carrier 155, which accommodates the second layer M2, is attached to the second mold 14. In some embodiments, the second carrier 155 and the second layer M2 are omitted, and only the first carrier 132, which accommodates the first layer M1, is attached to the second mold 14. In some embodiments, the second carrier 155 and the second layer M2 are omitted, and the first carrier 132 having the first layer M1 is attached to the first peripheral portion 15a.

[0079] Method M300 continues with operation O305. Operation O305 includes placing a component on the third mold.

[0080] In some specific embodiments, see Figure 16 Component 175 is attached to the third mold 17a. In some embodiments, component 175 is placed on the third mold 17a. In some embodiments, component 175 is conformally fitted to the third mold 17a. In some embodiments, component 175 comprises a polymer material. In some embodiments, component 175 is permeable to a gas or fluid (e.g., air, supercritical fluid, inert gas, nitrogen, carbon dioxide, etc.). In some embodiments, component 175 comprises a fabric. In some embodiments, component 175 is any other suitable component of an insole, upper, or footwear.

[0081] In some embodiments, a barrier layer (not shown) is provided between component 175 and the third mold 17a. In some embodiments, the barrier layer (not shown) is attached to the inner surface of component 175 before component 175 is placed on the third mold 17a. After component 175 is placed on the third mold 17a, the inner surface of component 175 and the barrier layer (not shown) are positioned above the third mold 17a. In some embodiments, the barrier layer (not shown) is conformal to component 175. In some embodiments, the barrier layer (not shown) is a TPU film.

[0082] In some specific embodiments, the third mold 17a and component 175 are moved to a predetermined position above the first layer M1, such as... Figure 16 As shown, the first mold 11a, the third mold 17a, and the component 175 then move toward the first layer M1. In some embodiments, the molding apparatus 100 is arranged below the mixing unit 201 and the injection unit 202. In some embodiments, the injection molding method M300 further includes arranging the component (not shown) as... Figure 12 The fifth mold 17b is attached to the first mold 11 as shown.

[0083] Method M300 continues with operation O306. Operation O306 includes engaging the first mold with the second mold to form the first mold cavity and surrounding the third mold, wherein the first carrier and the first layer contained by the first carrier are arranged within the first mold cavity.

[0084] In some specific embodiments, reference is made to Figure 17 The first mold 11 and the second mold 14 are joined to form a first mold cavity 19a, and a third mold 17a and a first layer M1 carried by a first carrier 132 are arranged within the first mold cavity 19a. In some embodiments, a second layer M2 is carried by a second carrier 155 and arranged within the first mold cavity 19a. In some embodiments, the molding apparatus 100 including the first mold cavity 19a is in a closed state.

[0085] In some specific embodiments, when the molding apparatus 100 is in a closed state and the first mold 11 and the second mold 14 are arranged opposite each other, the first mold cavity 19a is defined by the first mold 11, the first peripheral portion 15a, the third mold 17a, the first base 13a, the first carrier 132, the second carrier 155, the component 175, the first layer M1, and the second layer M2. In some specific embodiments, the third mold 17a, the component 175, the first layer M1, and the second layer M2 are all surrounded by the first mold 11, the second mold 14, the first carrier 132, and the second carrier 155.

[0086] In some embodiments, component 175, the first layer M1, and the second layer M2 are all arranged between the first mold 11 and the second mold 14. In some embodiments, component 175, the first layer M1, and the second layer M2 are all arranged within the first mold cavity 19a. In some embodiments, component 175 surrounds the third mold 17, is located above the first layer M1, and is adjacent to the second layer M2. In some embodiments, component 175, the first layer M1, and the second layer M2 are all surrounded by the second mold 14.

[0087] In some embodiments, the two ends 176, 177 of component 175 are attached to the first peripheral portion 15a. In some embodiments, a barrier layer (not shown) is configured to prevent gas or fluid inside the first mold cavity 19a from leaking out of the first mold cavity 19a.

[0088] Method M300 continues with operation O307. Operation O307 includes injecting a third polymer material from the injection unit into the first mold cavity to form an article comprising the first layer, the component, and a third layer formed of the third polymer material.

[0089] In some specific embodiments, see Figure 18A third polymer material is injected from the injection unit into the first mold cavity 19a to form an article 178 comprising a first layer M1, a second layer M2, a component 175, and a third layer M3 formed from the third polymer material.

[0090] In some embodiments, the third polymer material is injected from the mixing unit 201 and the injection unit 202 into the molding apparatus 100. In some embodiments, the third polymer material is injected into the molding apparatus 100 through the first mold 11.

[0091] In some embodiments, the third polymer material is injected into the first mold cavity 19a through one of the feed ports 12. In some embodiments, the third polymer material includes TPU, PU, ​​plastic, or any other suitable material. In some embodiments, the third polymer material includes a physical foaming agent, such as a supercritical fluid. In some embodiments, the physical foaming agent is gaseous nitrogen, carbon dioxide, etc. In some embodiments, the third polymer material is foamable or slightly foamable. In some embodiments, the composition of the third polymer material is similar to or different from the composition of the first polymer material or the second polymer material.

[0092] In some embodiments, a third layer M3 is attached to component 175, a first layer M1, and a second layer M2. In some embodiments, the third layer M3 is disposed above the first layer M1 and adjacent to the second layer M2, and component 175 is disposed above the third layer M3. In some embodiments, component 175, the first layer M1, the second layer M2, and the third layer M3 form an article 178. In some embodiments, article 178 is a shoe. In some embodiments, the density of the third layer M3 is substantially less than the density of the first layer M1. In some embodiments, the density of the third layer M3 is substantially less than the density of the second layer M2.

[0093] In some embodiments, the pressure within the first mold cavity 19a is sensed before the third polymer material is injected. In some embodiments, a first gas (not shown) is injected into the first mold cavity 19a through the junction 187 before the third polymer material is injected, until a predetermined pressure is sensed in the first mold cavity 19a.

[0094] In some embodiments, the method further includes sensing the pressure within the first mold cavity 19a and filling the first mold cavity 19a with a predetermined pressure from the inlet 12. In some embodiments, the method further includes discharging a portion of a first gas (not shown) from the first mold cavity 19a through the junction 187.

[0095] In some embodiments, when the molding apparatus 100 is in a closed state, a first force is applied to the second mold 14 toward the first mold 11 to facilitate engagement of the first mold 11 and the second mold 14. In some embodiments, the first force is applied to the second mold 14 before the first gas is injected into the first mold cavity 19a, or before the third polymer material is injected into the first mold cavity 19a. In some embodiments, the first force is applied to the second mold 14 during the injection of the first gas into the first mold cavity 19a, or during the injection of the third polymer material into the first mold cavity 19a.

[0096] Method M300 continues with operation O308. Operation O308 includes removing the article from the molding apparatus to obtain the article.

[0097] In some specific embodiments, the injection molding method M300 includes operation O308, which includes removing the article 178 from the molding apparatus 100. In some specific embodiments, reference... Figure 19 After the third layer M3 is formed within the molding apparatus 100, the article 178, including the first layer M1, the second layer M2, the third layer M3, and the component 175, is removed from the first mold cavity 19a. In some specific embodiments, the molding apparatus 100 is in the open state when the article 178 is removed.

[0098] In some embodiments, after the article 178 is formed, the first mold 11 separates from the second mold 14 so that the article 178 having the first layer M1, the second layer M2, the third layer M3, and the component 175 can be removed from the second mold 14. In some embodiments, the article 178 having the first layer M1, the second layer M2, the third layer M3, the component 175, and the barrier layer can be removed from the molding apparatus 100.

[0099] In some specific embodiments, the first mold 11, the third mold 17a, and the article 178 are removed from the second mold 14. The second distance D2 after the first mold 11 and the third mold 17a are removed from the second mold 14 is greater than zero.

[0100] In some specific embodiments, before removing the first mold 11, the third mold 17a, and the product 178 from the second mold 14, the first portion 151 and the second portion 152 of the first peripheral portion 15a are first moved apart from each other, so that a first gap G1 is formed between the first portion 151 and the second portion 152, such as... Figure 2 As shown, the article 178 can thus be separated from the first peripheral portion 15a and easily removed from the first mold cavity 19a. In some embodiments, the molding device 100 changes from a closed state to an open state due to the generation of a first gap G1.

[0101] In some embodiments, the injection molding method M300 further includes removing an article (not shown) formed in a second mold cavity 19b from the molding apparatus 100. In some embodiments, an article 178 formed in a first mold cavity 19a and an article (not shown) formed in a second mold cavity 19b are obtained simultaneously. In some embodiments, after the article (not shown) is formed in the second mold cavity 19b, the first mold 11 separates from the second peripheral portion 15b, allowing the article (not shown) to be removed from the second base 13b and the second peripheral portion 15b. In some embodiments, the first mold 11, the fifth mold 17b, and the article (not shown) are removed from the second base 13b and / or the second peripheral portion 15b.

[0102] In some specific embodiments, before removing the first mold 11, the fifth mold 17b, and the article (not shown) from the second base 13b and the second peripheral portion 15b, the third portion 153 and the fourth portion 154 of the second peripheral portion 15b are first moved apart from each other, forming a second gap G2 between the third portion 153 and the fourth portion 154, such as... Figure 12 As shown, the article (not shown) can thus be separated from the second peripheral portion 15b and easily removed from the second mold cavity 19b. In some embodiments, the molding device 100 changes from a closed state to an open state due to the generation of a second gap G2. In some embodiments, the molding device 100 changes from a closed state to an open state due to the generation of a gap G2.

[0103] In some specific embodiments, reference is made to Figure 20 After the article 178 is removed from the molding apparatus 100, an article 178 comprising a first layer M1, a third layer M3, and a component 175 is obtained from the molding apparatus 100. In some embodiments, after the first mold 11, the third mold 17a, and the article 178 are removed from the second mold 14, the article 178 is then removed from the third mold 17a. In some embodiments, the article 178 having the first layer M1, the second layer M2, the third layer M3, the component 175, and the barrier layer can be removed from the third mold 17a. In some embodiments, the article 178 is removed from the third mold 17a by human or mechanical arm (not shown). In some embodiments, the first mold 11 and the third mold 17a are tilted before the article 178 is removed from the third mold 17a.

[0104] In some embodiments, article 178 includes a first layer M1, a third layer M3, and component 175. In some embodiments, article 178 further includes a second layer M2. In some embodiments, the barrier layer is removed from article 178. The first layer M1 has a first density, and the third layer M3 has a third density. The first density and the third density may be the same or different. In some embodiments, a first interface between the first layer M1 and the third layer M3 has a first density gradient. The second layer M2 has a second density, and the second density and the third density may be the same or different. In some embodiments, a second interface between the second layer M2 and the third layer M3 has a second density gradient. The first density gradient and the second density gradient may be the same or different.

[0105] Method M300 continues with operation O309. Operation O309 includes, after the article is formed, replacing the first carrier with a third carrier, the third carrier being configured to have a fourth layer, the fourth layer comprising a fourth polymer material disposed thereon.

[0106] In some specific embodiments, reference is made to Figure 21 The injection molding method M300 includes operation O309, which includes replacing the first carrier 132 with one of carriers 132a, 132b, and 132c. In some specific embodiments, after the article 178 is formed, the first carrier 132, which is engaged with the second mold 14, is replaced, so that another layer subsequently attached to the next article (not shown) can be placed in the first mold cavity 19a before the third polymer material is injected again into the molding apparatus 100.

[0107] In some embodiments, the injection molding method M300 includes removing a first carrier 132 from the molding apparatus 100 after forming the article 178. In some embodiments, the first carrier 132 is separated from the first base 13a and the first peripheral portion 15a by manual operation or a robotic arm 138. In some embodiments, the injection molding method M300 includes removing a second carrier 155 from the molding apparatus 100 after forming the article 178. In some embodiments, the second carrier 155 is separated from the first base 13a and the first peripheral portion 15a by manual operation or a robotic arm 138. In some embodiments, the first carrier 132 and the second carrier 155 are removed from the molding apparatus 100 separately or simultaneously.

[0108] In some embodiments, the injection molding system 200 further includes a plurality of carriers 132a, 132b, 132c arranged near the molding apparatus 100. In some embodiments, layers M4, M5, and M6 are pre-arranged on each carrier 132a, 132b, 132c. In some embodiments, the carriers 132a, 132b, 132c are arranged on a conveyor or turntable 139. Layers M4, M5, and M6 are similar to the first layer M1 and are configured to form part of an article (not shown) produced by the injection molding system 200, and each of layers M4, M5, and M6 is temporarily housed by the corresponding carrier 132a, 132b, 132c. In some embodiments, layers M4, M5, and M6 are manufactured by 3D printing.

[0109] In some specific embodiments, the injection molding method M300 further includes arranging one of the carriers 132a, 132b, and 132c, and the corresponding layers M4, M5, and M6 within the molding apparatus 100. In some specific embodiments, one of the carriers 132a, 132b, and 132c can be moved from a conveyor belt or turntable 139 by human or robotic arm 138 to be positioned above the first base 13a, and this can be repeated. Figures 15 to 19 Operations 303 to 308 are shown, so method 300 can efficiently manufacture multiple articles, such as multiple articles 178.

[0110] In some specific embodiments, reference is made to Figure 22 The carrier 132a and the layer M4 contained by the carrier 132a are moved into the molding apparatus 100 and can be repeated. Figures 16 to 20 Operations 303 to 308 are shown. In some embodiments, method M300 further includes, after the article 178 is removed from the molding apparatus 100, joining a carrier 132a to a first base 13a or a first peripheral portion 15a, and joining a first mold 11 to a second mold 14 to form a third mold cavity 19c, wherein the carrier 132a and the layer M4 contained by the carrier 132a are both arranged within the third mold cavity 19c. In some embodiments, the first base 13a is joined to the carrier 132a, and the layer M4 is temporarily joined to the first carrier 132a.

[0111] In some embodiments, method M300 further includes engaging the carrier 132a and the second mold 14 through a locking device 134 between the carrier 132a and the second mold 14. In some embodiments, the locking device 134 is used to prevent movement of the carrier 132a during the injection of fluid or liquid into the molding apparatus 100. In some embodiments, the locking device 134 between the carrier 132a and the second mold 14 temporarily engages the carrier 132a and the second mold 14. In some embodiments, the locking device 134 between the carrier 132a and the first base 13a temporarily engages the carrier 132a and the first base 13a. In some embodiments, the locking device 134 includes a first locking element 134a disposed on the carrier 132a and a second locking element 134b disposed on the second mold 14 and corresponding to the first locking element 134a.

[0112] According to a specific embodiment of the present invention, a first carrier 132 configured to accommodate a first layer M1 is arranged within a first mold cavity 19a and is attachable to and detachable from a first base 13a or a first peripheral portion 15a of a second mold 14. The first layer M1 is placed into the first mold cavity 19a before the third polymer material is injected. After the third polymer material is injected from the injection unit 202 into the first mold cavity 19a and forms a third layer M3 from the third polymer material, an article 178 comprising the first layer M1 and the third layer M3 is obtained, and the first carrier 132 may be replaced by another carrier 132a configured to accommodate another layer M4. In some specific embodiments, the first layer M1 and the layer M4 have the same or different patterns or structures, and the pattern formed on the article 178 by the first layer M1 and the pattern formed on the article 178 by the layer M4 may be the same or different.

[0113] The foregoing outlines features of several specific embodiments to enable those skilled in the art to better understand the various aspects of the invention. Those skilled in the art should understand that they can readily use this invention as the basis for designing or modifying other programs and structures to achieve the same purpose and / or realize the same advantages of the specific embodiments described herein. Those skilled in the art should also recognize that such equivalent constructions do not depart from the spirit and scope of the invention, and that various changes, substitutions, and modifications can be made therein without departing from the spirit and scope of the invention.

[0114] Furthermore, the scope of this application is not limited to the specific embodiments of the procedures, machines, manufactures, compositions of matter, means, methods, and steps described in the specification. From the disclosure of this invention, those skilled in the art will readily understand that, based on this invention, existing or future-developed procedures, machines, manufactures, compositions of matter, means, methods, or steps can be used to perform substantially the same function or obtain substantially the same results as the corresponding embodiments described herein. Therefore, the appended claims are intended to include such procedures, machines, manufactures, compositions of matter, means, methods, and steps within their scope.

[0115] Symbol Explanation

[0116] 100: Molding device

[0117] 11: First mold

[0118] 12: Feed inlet

[0119] 13a: First base

[0120] 13b: Second base

[0121] 13t: Top surface

[0122] 14: Second mold

[0123] 15a: First peripheral section

[0124] 15b: Second peripheral section

[0125] 17a: Third mold

[0126] 17b: Fifth Mold

[0127] 18: Pressure Regulation System

[0128] 19a: First mold cavity

[0129] 19b: Second mold cavity

[0130] 121: Opening

[0131] 132: The First Carrier

[0132] 132a, 132b, 132c: Carriers

[0133] 133,156: Depression

[0134] 133a: First depression

[0135] 133b: Second depression

[0136] 134: Locking device

[0137] 134a: First locking element

[0138] 134b: Second locking element

[0139] 138: Human or robotic arm

[0140] 139: Conveyor shield or turntable

[0141] 151: Part One

[0142] 151a, 152a: Extension

[0143] 152: Part Two

[0144] 153: Inner wall; Part Three

[0145] 154: Part Four

[0146] 155: Second Carrier

[0147] 155a: First side

[0148] 155b: Second side

[0149] 175: Components

[0150] 176,177: End

[0151] 178: Products

[0152] 181: Gas conduit

[0153] 183: Gas Controller

[0154] 187: Joint point

[0155] 200: Injection Molding System

[0156] 201: Hybrid Unit

[0157] 202: Injection Unit

[0158] D1: First Distance

[0159] D2: Second distance

[0160] Da,Db: Depth

[0161] G1: First gap

[0162] G2: Second gap

[0163] M1: First Floor

[0164] M2: Second Floor

[0165] M3: Third Floor

[0166] M4, M5, M6: Layers

[0167] M300: Injection molding method; method

[0168] O301-O309: Operation.

Claims

1. A molding apparatus, characterized in that, include: First mold; The second mold includes a base and a peripheral portion arranged around or above the base; A mold cavity, which is defined by the first mold and the second mold; as well as A first carrier is disposed within the mold cavity and is attachable to or detachable from the base or peripheral portion of the second mold.

2. The molding apparatus as claimed in claim 1, characterized in that, It further includes a first layer disposed within the mold cavity and contained by the first carrier.

3. The molding apparatus as claimed in claim 1, characterized in that, Further includes: A locking device configured to temporarily engage the first carrier with the peripheral portion or base of the second mold. The locking device is located between the first carrier and the second mold.

4. The molding apparatus as claimed in claim 1, characterized in that, The first carrier can be attached to and detached from the base, and the peripheral portion includes a first part and a second part that are adjacent to each other and can be joined, and the base is arranged between the first part and the second part.

5. The molding apparatus as claimed in claim 1, characterized in that, Further includes: The second carrier is disposed within the mold cavity and is attachable to and detachable from the peripheral portion. The first carrier can be attached to and detached from the base, and the second carrier is configured to temporarily accommodate the second layer.

6. A molding method, characterized in that, include: A molding apparatus is provided, the molding apparatus comprising a first mold, a second mold having a base and a peripheral portion disposed around or above the base, and a third mold; A first carrier is provided that can be attached to the base or the peripheral portion and can be detached from the base or the peripheral portion; A first layer comprising a first polymer material is disposed on the first carrier; The first carrier is joined to the second mold; The first mold and the second mold are joined to form a first mold cavity, wherein the first carrier and the first layer contained by the first carrier are arranged within the first mold cavity; A second polymer material from the injection unit is injected into the first mold cavity to form a second layer and an article comprising the first layer and the second layer made of the second polymer material; and The product is removed from the molding device.

7. The method of claim 6, characterized in that, Further includes: Before forming the first mold cavity, the components are arranged on the third mold that has been attached to the first mold; The first mold is joined with the second mold to form the first mold cavity and surround the third mold, wherein the first mold cavity is defined by the first mold, the second mold and the third mold; An article comprising the first layer, the second layer, and the component is obtained from the molding apparatus. The second layer is formed between the component and the first layer.

8. The method of claim 6, characterized in that, Further includes: Before forming the first mold cavity, the first carrier on which the first layer is arranged is attached to the base or the peripheral portion.

9. The method of claim 6, characterized in that, Further includes: Provide a second carrier; A third layer is disposed on the second carrier, the third layer comprising a third polymer material; Before forming the first mold cavity, the first carrier on which the first layer is disposed is attached to the base; Before forming the first mold cavity, the second carrier on which the third layer is arranged is attached to the peripheral portion; as well as The second polymer material from the injection unit is injected into the mold cavity to form the article comprising the first layer, the third layer, and the second layer made of the second polymer material.

10. The method of claim 6, characterized in that, Further includes: After the article is formed, the first carrier is replaced with a third carrier, which is configured to have a fourth layer, the fourth layer including a fourth polymer material disposed thereon; After the article is removed from the molding device, the third carrier is attached to the base or the peripheral portion; as well as The first mold is joined with the second mold to form a second mold cavity, wherein the third carrier and the fourth layer contained by the third carrier are arranged within the second mold cavity.

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