Integrated micro Dewar assembly for infrared detector and infrared detector

Abstract

The invention provides an integrated micro Dewar assembly for an infrared detector and the infrared detector, and relates to the technical field of infrared detectors, and the micro Dewar assembly comprises a lead ring flange which comprises a flange plate used for being fixedly connected and electrically communicated with a micro Dewar shell, the flange plate is provided with an insulator pin used for being connected with a getter and a connector used for leading out electrical signals. A getter assembly is assembled on the flange plate, the getter assembly comprises a getter, a first electrode of the getter is welded with the insulator pin, and a second electrode of the getter is electrically connected with the flange plate. The infrared detector comprises the micro Dewar assembly. According to the invention, miniaturization and light weight of the micro Dewar structure and the infrared detector are realized.

Description

Technical Field

[0001] This invention relates to the field of infrared detector technology, and more particularly to an integrated micro Dewar assembly for infrared detectors and an infrared detector thereof. Background Technology

[0002] With the rapid development of infrared systems, integration and miniaturization are becoming increasingly sophisticated. As a core component, miniaturization, lightweighting, and low power consumption of infrared detectors have become important development directions. Infrared detector components mainly consist of three parts: a detector chip, micro-Dewars, and a cooler. The micro-Dewars, as the supporting structure, provide the detector chip with optical, mechanical, electrical, and thermal interfaces and a vacuum operating environment. Therefore, the micro-Dewar structure is a component that requires careful consideration.

[0003] In related technologies, micro Dewars are an assembly of multiple functional modules, mainly including electrical modules, vacuum modules, optical modules, support modules, and shell modules. In traditional designs, the layout and assembly methods of these modules restrict the miniaturization of micro Dewars.

[0004] Specifically, in terms of vacuum modules, the getter is a key component for maintaining a long-term high vacuum inside the Dewar. It is usually assembled inside the Dewar shell through structures such as ohm rings, L-shaped brackets, and insulator pins. The getter is generally fixed by being held tightly by ohm rings. After assembly, the ohm rings are welded to the micro Dewar shell. Sufficient space needs to be left for the welding process and to prevent interference from other structures. As a result, the assembly of the getter occupies a large local space in the Dewar shell, making the Dewar large in size.

[0005] In terms of electrical modules, traditional electrical signal outputs typically employ a lead ring structure. This lead ring is fixed to the Dewar shell via laser welding. Its physical dimensions are relatively large, and in order to meet welding process requirements and avoid interference with other internal structures, a large installation space must be reserved inside the Dewar. This forces an increase in the diameter of the Dewar shell, resulting in a significant amount of unusable internal space, which is detrimental to the miniaturization and weight reduction of the overall structure. Summary of the Invention

[0006] This invention provides an integrated micro Dewar assembly for infrared detectors and an infrared detector thereof, solving the problems of miniaturization and weight reduction of micro Dewar structures.

[0007] To achieve the above objectives, this application adopts the following technical solution: In a first aspect, an integrated micro Dewar assembly for an infrared detector is provided, comprising: A lead ring flange, comprising a flange for fixed connection and electrical communication with a micro Dewar housing, the flange being provided with an insulator pin for connection with a getter and a connector for outputting electrical signals; The flange is equipped with a getter assembly, which includes a getter. The first electrode of the getter is welded to the insulator needle, and the second electrode of the getter is electrically connected to the flange.

[0008] Furthermore, the insulator pin includes a metal portion and an insulating portion, the insulating portion electrically isolating the metal portion from the flange.

[0009] Furthermore, the getter assembly also includes an ohm ring and a bracket, and the getter is fixed to the flange by the ohm ring and the bracket.

[0010] Furthermore, the getter assembly is configured in multiple groups, each group including two getter assemblies, and the two getters are arranged in parallel.

[0011] Furthermore, the second electrode of the getter is electrically connected to the flange via a connector, which is configured as a metal sheet, and the two getters in each group share one connector.

[0012] Furthermore, the connector includes an insulator and metal pad portions and a standard connector portion respectively disposed on both sides of the insulator; the metal pad portions are electrically connected to the standard connector portion through multiple metal pins encapsulated inside the insulator; the metal pad portions are used for bonding with the electrical chip leads of the micro Dewar assembly, and the standard connector portion is used for connecting to an external system.

[0013] Furthermore, the connector configuration has multiple sets.

[0014] Furthermore, the insulator pin is vertically inserted through the flange, the insulating part covers the metal part, and the insulating part is welded and fixedly connected to the flange.

[0015] Secondly, an infrared detector is provided, comprising: Integrated micro Dewar assembly for infrared detectors as described in the first aspect.

[0016] The integrated micro Dewar assembly for infrared detectors of the present invention has the following beneficial effects: Electrical leads are brought out using connectors. The connector and lead ring flange are designed as the electrical lead-out structure, making the electrical pins more compact and reducing space requirements. The connector and getter are assembled as independent components with the lead ring flange, utilizing the remaining internal space of the micro Dewar. This frees up the micro Dewar structural design, enabling miniaturization, weight reduction, and low power consumption of the Dewar.

[0017] The infrared detector corresponding to the integrated micro Dewar component of this invention can achieve the same technical effect, and will not be described in detail here to avoid repetition. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a conventional micro Dewar assembly provided in an embodiment of this application; Figure 2 A schematic diagram of the lead ring structure of a conventional micro Dewar provided in this application embodiment; Figure 3 This is a schematic diagram of the lead ring flange structure of an integrated micro Dewar assembly provided in an embodiment of this application.

[0019] Figure labels: 1. Getter; 2. Insulator pin; 3. Connector; 4. Ohm ring. Detailed Implementation

[0020] To further illustrate the technical means and effects adopted by the present invention to achieve its intended purpose, the technical solutions in the embodiments of this application are clearly described. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art are within the scope of protection of this application.

[0021] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0022] The steps described in the specification and the flowcharts in the accompanying drawings of this invention are not necessarily strictly executed according to the step numbers; the execution order of the method steps can be changed. Furthermore, certain steps can be omitted, multiple steps can be combined into one step, and / or one step can be broken down into multiple steps.

[0023] This specification provides an integrated micro Dewar assembly for an infrared detector, and also relates to an infrared detector, which will be described in detail below with reference to the accompanying drawings and preferred embodiments.

[0024] See Figure 1-2In traditional micro Dewar assemblies, the electrical module includes the Dewar lead ring, electrical chip, and electrical frame, primarily used for electrical signal extraction (its physical dimensions directly affect the Dewar size). The vacuum module includes the getter and getter support, mainly used to ensure a high vacuum in the Dewar (directly occupying physical space, making the Dewar larger). The outer shell module includes the Dewar shell, forming the Dewar vacuum chamber (its main dimensions are mainly affected by the vacuum module and support module). The support module includes the Dewar cold fingers, serving as a cantilever beam load-bearing structure and a cryostat interface (affected by the cryostat). The optical module includes windows, filters, and cold shields, achieving system optical matching (affected by the infrared optical system). Notably, the getter components of the vacuum module and the Dewar lead ring components of the electrical module are located in different parts, one above the other.

[0025] Please see Figure 3 This application provides an integrated micro Dewar assembly for an infrared detector, comprising: Lead ring flange, comprising a flange for fixed connection and electrical communication with the micro Dewar housing, the flange being provided with an insulator pin 2 for connection with getter 1 and a connector 3 for lead-out of electrical signals; The flange is equipped with a getter assembly, which includes a getter 1. The first electrode of the getter 1 is welded to the insulator needle, and the second electrode of the getter is electrically connected to the flange.

[0026] The insulator pin 2 includes a metal part and an insulating part, wherein the insulating part electrically isolates the metal part from the flange.

[0027] Furthermore, the getter assembly also includes an ohm ring 4 and a bracket, and the getter 1 is fixed to the flange via the ohm ring 4 and the bracket. Specifically, each component is welded and fixed to the micro Dewar shell by means of laser welding or other methods.

[0028] Furthermore, the getter assembly is configured in multiple groups, each group including two getter assemblies, and the two getters are arranged in parallel.

[0029] In some possible implementations, the second electrode of the getter is electrically connected to the flange via a connector configured as a metal sheet, and the two getters in each group share one connector.

[0030] In some possible implementations, the connector 3 includes an insulator and metal pad portions and a standard connector portion respectively disposed on both sides of the insulator; the metal pad portions are electrically connected to the standard connector portion through a plurality of metal pins encapsulated inside the insulator; the metal pad portions are used for wire bonding with the electrical chip leads of the micro Dewar assembly, and the standard connector portion is used for connection to an external system.

[0031] Furthermore, the connector 3 is configured with multiple sets.

[0032] In practice, the connector is designed as an independent component that can be assembled independently with the lead ring flange and fixed by laser welding. The size of the lead ring flange can be freely reduced.

[0033] Specifically, two getters, ohm rings, brackets, and other structures can be integrated and assembled on both sides of the lead ring flange in parallel. Connectors and getters are respectively arranged on the top, bottom, left, and right sides of the lead ring flange to achieve reasonable use of space.

[0034] In one possible implementation, the insulator pin is disposed perpendicularly through the flange, the insulating portion covers the metal portion, and the insulating portion is welded and fixedly connected to the flange.

[0035] In practice, the insulator pin and the flange are welded together to form the electrode of the getter.

[0036] Based on the above technical solution, this application adopts a connector-type electrical lead-out, designing the connector and lead ring flange as the electrical lead-out structure, making the electrical pins more compact and facilitating space reduction. Assembling the connector and getter as independent components with the lead ring flange utilizes the remaining internal space of the micro Dewar, freeing up the micro Dewar structural design and achieving miniaturization, lightweighting, and low power consumption of the Dewar.

[0037] By adopting an integrated structure of connectors, getter, and lead ring flange, the diameter of the micro Dewar shell components can be reduced by about 32%, thereby reducing the overall weight by about 26%, which greatly realizes the miniaturization and lightweighting of the micro Dewar structure.

[0038] This application also provides an infrared detector, which includes the integrated micro Dewar component described above for infrared detectors.

[0039] Based on the aforementioned micro Dewar component, the infrared detector has been miniaturized and made lighter.

[0040] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0041] It is understood that the embodiments of this application have been described above in conjunction with the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. As those skilled in the art will know, various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of the invention. Furthermore, those skilled in the art, under the guidance or instruction of this application, can modify these features and embodiments to adapt to specific situations and materials without departing from the spirit and scope of the invention. Therefore, this invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the protection scope of this invention.

Claims

1. An integrated micro Dewar assembly for an infrared detector, characterized in that, include: A lead ring flange, comprising a flange for fixed connection and electrical communication with a micro Dewar housing, the flange being provided with an insulator pin for connection with a getter and a connector for outputting electrical signals; The flange is equipped with a getter assembly, which includes a getter. The first electrode of the getter is welded to the insulator needle, and the second electrode of the getter is electrically connected to the flange.

2. The integrated micro Dewar assembly for an infrared detector according to claim 1, characterized in that, The insulator pin includes a metal part and an insulating part, the insulating part electrically isolating the metal part from the flange.

3. The integrated micro Dewar assembly for an infrared detector according to claim 1, characterized in that, The getter assembly also includes an ohm ring and a bracket, and the getter is fixed to the flange by the ohm ring and the bracket.

4. The integrated micro Dewar assembly for an infrared detector according to claim 1, characterized in that, The getter assembly is configured in multiple groups, each group including two getter assemblies, and the two getters are arranged in parallel.

5. The integrated micro Dewar assembly for an infrared detector according to claim 4, characterized in that, The second electrode of the getter is electrically connected to the flange via a connector, which is configured as a metal sheet, and the two getters in each group share one connector.

6. The integrated micro Dewar assembly for an infrared detector according to claim 1, characterized in that, The connector includes an insulator and metal pad portions and a standard connector portion respectively disposed on both sides of the insulator; the metal pad portions are electrically connected to the standard connector portion through multiple metal pins encapsulated inside the insulator; the metal pad portions are used for wire bonding with the electrical chip leads of the micro Dewar assembly, and the standard connector portion is used for connection with an external system.

7. The integrated micro Dewar assembly for an infrared detector according to claim 1, characterized in that, The connector configuration has multiple sets.

8. The integrated micro Dewar assembly for an infrared detector according to claim 1, characterized in that, The insulator pin is vertically inserted through the flange, the insulating part covers the metal part, and the insulating part is welded and fixedly connected to the flange.

9. An infrared detector, characterized in that, include: The integrated micro Dewar assembly for an infrared detector as described in any one of claims 1-8.

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