Positioning type wafer detection device

Abstract

The invention discloses a positioning type wafer detection device. The positioning type wafer detection device comprises a wafer fixing platform, a horizontal moving base, a probe module, a crystal grain position retainer and a detection parameter acquisition module, the wafer fixing platform is provided with a positioning structure which is used for maintaining a wafer in a detection position range and enabling the wafer to be exposed from an opening. The horizontal moving base is used for driving the wafer fixing platform to move on a horizontal plane. The probe module is movably arranged on one side of the wafer along a contact direction. The crystal grain position retainer is movably arranged on the other side of the wafer along a stopping direction. The detection parameter acquisition module is arranged on the other side of the wafer relative to the probe module and is used for acquiring optical detection parameters.

Description

Technical Field

[0001] This invention relates to a wafer inspection device, and more particularly to a positioning type wafer inspection device. Background Technology

[0002] Traditionally, when inspecting multiple flip-chips on a wafer, the wafer is usually placed on a transparent carrier with the flip-chip electrodes facing upwards and the light-emitting parts facing downwards. Then, a probe is extended from above the wafer to contact the electrodes of the flip-chip to be inspected and energized, so that the light signal generated by the light-emitting part of the flip-chip to be inspected penetrates the transparent carrier below and is received by the receiving device below.

[0003] However, when the light signal generated by the light-emitting part penetrates the transparent carrier below, the light signal is often refracted, scattered, or absorbed due to the transparent carrier, resulting in distortion of the signal received by the receiving device. Summary of the Invention

[0004] The main objective of this invention is to provide a positioning wafer inspection device that can effectively stabilize the wafer without the need for a transparent carrier to support and stabilize it during inspection.

[0005] To address the problems of prior art, the present invention provides a positioning wafer inspection device for inspecting multiple flip-chip dies on a wafer. The wafer has a first surface and a second surface arranged opposite to each other. Each of the flip-chip dies has an electrode portion on the first surface and a light-emitting portion electrically connected to the electrode portion on the second surface. The positioning wafer inspection device includes a wafer fixing platform, a horizontal moving base, a probe module, a die position holder, and a detection parameter acquisition module.

[0006] The wafer holding platform has a positioning structure with an opening, which is used to hold the wafer in a detection position range and expose the wafer in the opening.

[0007] The horizontal moving base is used to support the wafer fixing platform and to move the wafer fixing platform on a horizontal plane, so that one of the flip-chip dies to be tested is moved to a detection position.

[0008] The probe module is movably disposed on one side of the wafer along a contact direction perpendicular to the horizontal plane, for electrically contacting the electrode portion of the die to be tested along the contact direction.

[0009] A die position holder is movably disposed on the other side of the wafer opposite to the probe module along a stop direction opposite to the contact direction, so as to apply a holding force to the wafer along the stop direction, thereby keeping the die under test in the detection position when the probe module contacts the die under test.

[0010] The detection parameter acquisition module is located on the other side of the wafer opposite to the probe module, and is used to acquire optical detection parameters of the light-emitting part of the die under test when the probe module is electrically in contact with the die under test.

[0011] In a subsidiary technical means derived from the aforementioned necessary technical means, the die position holder has a through hole. When the die position holder applies the holding force to the wafer along the stop direction, the die to be tested is exposed from the through hole, so that the detection parameter acquisition module can acquire the optical detection parameters of the light-emitting part of the die to be tested through the through hole.

[0012] Preferably, the grain position holder is a non-contact holder, and the grain position holder is provided with a plurality of air pressure regulating holes in a ring around the through hole.

[0013] In a supplementary technical means derived from the aforementioned necessary technical means, when the first surface of the wafer is facing downwards and exposed from the opening, the probe module is disposed below the wafer, and the die position holder and the detection parameter acquisition module are disposed above the wafer.

[0014] In a supplementary technical means derived from the aforementioned necessary technical means, when the second side of the wafer is facing down and exposed from the opening, the probe module is disposed above the wafer, and the die position holder and the detection parameter acquisition module are disposed below the wafer.

[0015] In an auxiliary technical means derived from the aforementioned necessary technical means, the wafer fixing platform includes a carrier plate and two side support seats. The carrier plate has the positioning structure, the two side support seats are respectively connected to opposite sides of the carrier plate, and the horizontal moving base is used to support the two side support seats.

[0016] Preferably, the horizontal moving base further includes a first moving component and a second moving component. The first moving component receives the two side support seats and drives the wafer fixing platform to reciprocate along a first horizontal direction. The second moving component receives the first moving component and drives the first moving component and the wafer fixing platform to reciprocate along a second horizontal direction perpendicular to the first horizontal direction.

[0017] As described above, since the positioning wafer inspection device of the present invention uses a positioning structure with an opening to hold the wafer, the bottom of the wafer can be exposed from the opening, allowing the probe module to contact the electrode portion of the wafer from below or above. Furthermore, the present invention also provides a die position holder on the other side of the wafer relative to the probe module, thereby stabilizing the wafer when the probe module contacts it, so that the image captured by the detection parameter acquisition module is not disturbed, and the stability during detection is increased. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of a positioning wafer inspection device provided in a preferred embodiment of the present invention;

[0019] Figure 2 A three-dimensional schematic diagram of the wafer fixing platform and horizontal moving base provided in a preferred embodiment of the present invention;

[0020] Figure 3 for Figure 1 Enlarged schematic diagram of circle A;

[0021] Figure 4 A schematic diagram showing the simultaneous contact of the probe module and the die position holder with the wafer;

[0022] Figure 5 A magnified schematic diagram showing the specific details of the probe module and the die position holder simultaneously contacting the wafer; and

[0023] Figure 6 This is a schematic diagram of a positioning wafer inspection device provided in another preferred embodiment of the present invention.

[0024] In the attached figures, the following labels are used:

[0025] 100,100a: Positioning type wafer inspection device;

[0026] 1: Wafer fixing platform;

[0027] 11: Carrier plate;

[0028] 111: Positioning structure;

[0029] 1111: Opening;

[0030] 12, 13: Side support base;

[0031] 2: Horizontal moving base;

[0032] 21: First moving component;

[0033] 22: Second moving component;

[0034] 3,3a: Probe module;

[0035] 31, 32: Probes;

[0036] 4,4a: Grain position retainer;

[0037] 41: Through hole;

[0038] 42: Air pressure regulating port;

[0039] 5,5a: Detection parameter acquisition module;

[0040] 200: Wafer;

[0041] 201: First page;

[0042] 202: Second page;

[0043] 203: Flip crystal grains;

[0044] 2031: Electrode section;

[0045] 20311, 20312: Electrode contacts;

[0046] 2032: Light-emitting part;

[0047] DR: Detection location range;

[0048] DP: Detection location;

[0049] HP: Horizontal plane;

[0050] D1: First horizontal direction;

[0051] D2: Second horizontal direction;

[0052] D3, D3a: contact direction;

[0053] D4, D4a: Stop direction. Detailed Implementation

[0054] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of a positioning wafer inspection device provided in a preferred embodiment of the present invention; Figure 2 This is a three-dimensional schematic diagram of the wafer fixing platform and horizontal moving base provided in a preferred embodiment of the present invention.

[0055] like Figure 1 and Figure 2 As shown, a positioning wafer inspection device 100 includes a wafer fixing platform 1, a horizontal moving base 2, a probe module 3, a die position holder 4, and a detection parameter acquisition module 5.

[0056] The wafer holding platform 1 includes a carrier plate 11 and two side supports 12 and 13. The carrier plate 11 has a positioning structure 111, and the positioning structure 111 has an opening 1111; wherein, the positioning structure 111 is used to place a wafer 200, thereby maintaining the wafer 200 within a detection position range DR, and exposing the wafer 200 in the opening 1111. In addition, the positioning structure 111 is an annular groove in this embodiment, and in practice it may also be provided with an air extraction hole to use negative pressure to adsorb and fix the periphery of the wafer 200. The opening 1111 is a circular opening in this embodiment, but it is not limited to this.

[0057] The two side supports 12 and 13 are respectively connected to the opposite sides of the bottom of the carrier plate 11 to form an arch-shaped structure.

[0058] The horizontal moving base 2 includes a first moving component 21 and a second moving component 22. The first moving component 21 supports the two side supports 12 and 13 and is used to drive the wafer fixing platform 1 to reciprocate along a first horizontal direction D1. The second moving component 22 supports the first moving component 21 and is used to drive the first moving component 21 and the wafer fixing platform 1 to reciprocate along a second horizontal direction D2 perpendicular to the first horizontal direction D1.

[0059] As mentioned above, by using the horizontally movable base 2 to support the wafer fixing platform 1, the wafer fixing platform 1 can be effectively moved on a horizontal plane HP.

[0060] Please continue reading. Figure 3 and Figure 4 , Figure 3 for Figure 1 Enlarged schematic diagram of circle A; Figure 4 This is a schematic diagram showing the probe module and the die position holder simultaneously contacting the wafer. (Example) Figures 1 to 4 As shown, the probe module 3 is movably disposed on one side of the wafer 200 along a contact direction D3 perpendicular to the horizontal plane HP, and has two probes 31 and 32.

[0061] The die position holder 4 is movably disposed on the other side of the wafer 200 opposite to the probe module 3 along a stop direction D4 opposite to the contact direction D3, to apply a holding force to the wafer along the stop direction D4. The detection parameter acquisition module 5 is disposed on the other side of the wafer 200 opposite to the probe module 3, that is, the detection parameter acquisition module 5 and the die position holder 4 are disposed on the same side of the wafer 200; wherein, the detection parameter acquisition module 5 can be a device such as a camera or an integrating sphere for acquiring optical detection parameters.

[0062] As described above, in this embodiment, the die position holder 4 also has a through hole 41, and the image acquisition axis of the detection parameter acquisition module 5 is aligned with the center of the through hole 41, so that when the die position holder 4 applies a holding force to the wafer 200, the detection parameter acquisition module 5 can acquire the optical detection parameters of the wafer 200 through the through hole 41.

[0063] Please continue reading. Figure 5 , Figure 5 A magnified diagram showing the specific details when the probe module and the die position holder simultaneously contact the wafer. (See diagram for example.) Figures 1 to 5 As shown, in this embodiment, the wafer 200 has a first surface 201 and a second surface 202 disposed opposite to each other, and the wafer 200 also includes a plurality of flip-chip chips 203 (only one is shown in the figure). Each flip-chip chip 203 has an electrode portion 2031 on the first surface 201, and the electrode portion 2031 includes two electrode contact portions 20311 and 20312, and has a light-emitting portion 2032 electrically connected to the two electrode contact portions 20311 and 20312 on the second surface 202. Specifically, the flip-chip chip 203 in this embodiment is an LED flip-chip chip, but it is not limited thereto.

[0064] As described above, in this embodiment, the first side 201 of the wafer 200 is placed downwards with the opening 1111 exposed, while the second side 202 is relatively upwards. Therefore, the probe module 3 in this embodiment is disposed below the wafer 200 and facing the first side 201, while the die position holder 4 and the detection parameter acquisition module 5 are disposed above the wafer 200 and facing the second side 202. Therefore, when the probe module 3 approaches the first surface 201 of the wafer 200 from below along the contact direction D3, the die position holder 4 also approaches the second surface 202 of the wafer 200 along the stop direction D4 to apply a holding force to the wafer 200 along the stop direction D4, so that when the probes 31 and 32 of the probe module 3 contact the two electrode contacts 20311 and 20312 respectively, the flip-chip die 203 is held at a detection position DP; wherein, in this embodiment, the probe module 3, the die position holder 4 and the detection parameter acquisition module 5 are aligned with the detection position DP by default, and the wafer 200 is driven by the horizontal moving base 2 and the wafer fixing platform 1 mentioned above, so that the flip-chip die 203, which is a die to be tested, moves to the detection position DP.

[0065] In actual operation, when probes 31 and 32 contact the two electrode contacts 20311 and 20312 respectively, the light-emitting part 2032 will be turned on and the light-emitting part 2032 will emit light. Since the die position holder 4 will expose the light-emitting part 2032 through the through hole 41, the detection parameter acquisition module 5 can acquire the optical detection parameters of the light-emitting part 2032 through the through hole 41.

[0066] It should be noted that the die position holder 4 in this embodiment is a non-contact holder, and the die position holder 4 is provided with multiple air pressure regulating holes 42 (only one is shown in the figure) around the through hole 41. Specifically, the air pressure regulating holes 42 in this embodiment are arranged in a four-ring structure from the inside out, centered on the through hole 41. Figure 5 It can be seen that the air pressure provided by the air pressure regulating holes 42 from the innermost ring to the outermost ring is positive pressure, negative pressure, and positive pressure and negative pressure in an alternating arrangement. This can effectively keep the wafer 200 stable and keep the position of the flip-chip 203 of the die under test stable. However, in other embodiments, it is not limited to this form. Positive and negative pressure can also be provided by the air pressure regulating holes 42 in the same ring in an alternating arrangement. It is even possible to provide airflow by setting a guide outside the air pressure regulating holes 42, so that the airflow ejected from the air pressure regulating holes 42 is guided by the guide to form an airflow between the die position holder 4 and the wafer 200, thereby stabilizing the wafer 200 according to Bernoulli's principle.

[0067] In other embodiments, the die position holder 4 can also be a contact holder. Specifically, when the die position holder 4 is a contact holder, the die position holder 4 stabilizes the wafer 200 by directly contacting it, thereby stabilizing the position of the flip-chip die 203 under test. Therefore, the die position holder 4 can be made of a soft material that will not damage the wafer 200.

[0068] Please continue reading. Figure 6 , Figure 6 This is a plan view of a positioning wafer inspection device provided in another preferred embodiment of the present invention. Figures 1 to 6 As shown, in another embodiment, a positioning wafer inspection device 100a also includes a wafer fixing platform 1, a horizontal moving base 2, a probe module 3a, a die position holder 4a, and a detection parameter acquisition module 5a; wherein, the main difference between the positioning wafer inspection device 100a and the positioning wafer inspection device 100 described above is that the wafer 200 is placed on the positioning structure 111 with the second surface 202 facing down, and the second surface 202 is exposed from the opening 1111, and the probe module 3a is movably disposed on one side of the wafer 200 along a contact direction D3a, while the die position holder 4a is movably disposed on the other side of the wafer 200 along a stop direction D4a opposite to the contact direction D3a, and the detection parameter acquisition module 5a is also disposed on the other side of the wafer 200 relative to the probe module 3a.

[0069] As described above, in this embodiment, the wafer 200 is placed on the positioning structure 111 with the second surface 202 facing down, and the second surface 202 is exposed from the opening 1111. Therefore, when the probe module 3a makes electrical contact with the two electrode contacts (not shown, equivalent to the two electrode contacts 20311 and 20312) of the die to be tested (not shown, equivalent to the flip-chip die 203 mentioned above) from top to bottom along the contact direction D3a, the die position holder 4a applies a holding force to the wafer 200 from bottom to top along the stop direction D4a.

[0070] In summary, prior art wafer inspection technology utilizes a transparent carrier to support the wafer. When a probe contacts the wafer from above, the signal or image generated by the wafer's die can penetrate through the transparent carrier at the bottom, but this also results in some distortion due to the presence of the transparent carrier. In contrast, this invention mainly utilizes a positioning structure with an opening to support the wafer, and provides a probe module and a die position holder on opposite sides of the wafer, allowing the bottom of the wafer to be exposed through the opening. This allows the probe module and die position holder to approach the wafer's die from both sides. Therefore, regardless of whether the light-emitting side of the die is facing up or down, it can be directly received by the image capture device without being distorted by the transparent carrier. Furthermore, the holding force applied to the wafer by the die position holder when the probe module contacts the wafer effectively prevents the wafer from moving or deforming due to the contact of the probe module, increasing the stability of the inspection.

[0071] It should be noted that since wafers are actually very thin structures, in the prior art, when a transparent carrier was used to support the entire wafer, there was no need to worry about the wafer being deformed when the probes came into contact. However, in this invention, instead of using a transparent carrier to support the entire wafer, a positioning structure is used to support and position the outer periphery of the wafer. The wafer is easily deformed or displaced due to contact with the probe module. Therefore, the method of using a die position holder to apply a holding force to the wafer in this invention can effectively improve the stability of wafer inspection.

[0072] The detailed description of the preferred embodiments above is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the invention to the preferred embodiments disclosed herein. Rather, the aim is to cover various modifications and equivalent arrangements within the scope of the patent claims to be made by this invention.

Claims

1. A positioning-type wafer inspection device for inspecting multiple flip-chips on a wafer, characterized in that, The wafer has a first surface and a second surface disposed opposite to each other. Each of the flip-chips has an electrode portion on the first surface and a light-emitting portion electrically connected to the electrode portion on the second surface. The positioning type wafer inspection device includes: A wafer holding platform has a positioning structure with an opening, the positioning structure being used to hold the wafer within a detection position range and expose the wafer in the opening; A horizontally movable base is used to support the wafer fixing platform and to move the wafer fixing platform on a horizontal plane, so that one of the flip-chip dies to be tested is moved to a detection position; A probe module is movably disposed on one side of the wafer along a contact direction perpendicular to the horizontal plane, for electrically contacting the electrode portion of the die to be tested along the contact direction; A die position holder is movably disposed on the opposite side of the wafer from the probe module along a stop direction opposite to the contact direction, for applying a holding force to the wafer along the stop direction, thereby holding the die under test at the detection position when the probe module contacts the die under test; and A detection parameter acquisition module is disposed on the other side of the wafer opposite to the probe module, and is used to acquire optical detection parameters of the light-emitting part of the die under test when the probe module electrically contacts the die under test.

2. The positioning wafer inspection device as described in claim 1, characterized in that, The die position holder has a through hole. When the die position holder applies the holding force to the wafer along the stop direction, the die to be tested is exposed through the through hole, so that the detection parameter acquisition module can capture optical detection parameters of the light-emitting part of the die to be tested through the through hole.

3. The positioning wafer inspection device as described in claim 2, characterized in that, The grain position holder is a non-contact holder, and the grain position holder has multiple air pressure regulating holes arranged in a ring around the through hole.

4. The positioning wafer inspection device as described in claim 1, characterized in that, When the first side of the wafer is facing down and exposed through the opening, the probe module is positioned below the wafer, and the die position holder and the detection parameter acquisition module are positioned above the wafer.

5. The positioning wafer inspection device as described in claim 1, characterized in that, When the second side of the wafer is facing down and exposed through the opening, the probe module is positioned above the wafer, and the die position holder and the detection parameter acquisition module are positioned below the wafer.

6. The positioning wafer inspection device as described in claim 1, characterized in that, The wafer fixing platform includes a carrier plate and two side support bases. The carrier plate has the positioning structure. The two side support bases are respectively connected to opposite sides of the carrier plate, and the horizontal moving base is used to support the two side support bases.

7. The positioning wafer inspection device as described in claim 6, characterized in that, The horizontal moving base further includes a first moving component and a second moving component. The first moving component receives the two side support seats and drives the wafer fixing platform to reciprocate along a first horizontal direction. The second moving component receives the first moving component and drives the first moving component and the wafer fixing platform to reciprocate along a second horizontal direction perpendicular to the first horizontal direction.

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