Automatic micro-slice defect positioning device and method

Abstract

The invention relates to the technical field of PCBA micro-slices, in particular to a micro-slice automatic defect positioning method, and a micro-slice automatic defect positioning device comprises a support connecting base table, a support base fixedly connected to the bottom of the support connecting base table, and a support mounting seat fixedly connected to the support connecting base table. The eight functional rotating discs are installed on the rotating connecting disc in an array mode, stations can be automatically switched, abrasive paper does not need to be manually replaced, tool replacement time is greatly shortened, efficiency is improved, and compared with a traditional automatic grinding and polishing machine needing to be shut down for inspection, by observing the inspection disc and the detection assembly, the state of a sample can be detected online, the rotating discs do not need to be paused for workpiece taking for inspection, and work efficiency is improved. Working procedure interruption is avoided; meanwhile, the adjusting assembly drives the sample clamping sleeve to act, grinding and polishing of a plurality of samples can be completed at a time, the problem that the efficiency of a traditional automatic machine is lower than that of manual work is solved, automation and high efficiency are considered, and the requirement for sharp increase of the micro-section test workload is met.

Description

Technical Field

[0001] This invention relates to the field of microslicing technology, and in particular to an automatic defect location device and method for microslicing. Background Technology

[0002] Microsection testing specifically refers to metallographic testing applied to electronic components and assemblies. It is an important means of observing the cross-sectional structure of samples and evaluating the quality of electronic packaging and assembly. Due to its low cost, ease of operation, and intuitive and easily interpretable test results, it is widely used by relevant laboratories. The test steps include cutting and sampling, mounting, polishing, and microscopic photography. The first three steps are sample preparation steps, and the accuracy of the final test results is closely related to the completeness of the sample preparation operation. However, the sample preparation step is time-consuming and involves many consumables, thus becoming a key factor affecting the overall cost and efficiency of microsection testing.

[0003] In the existing technology, the early microsection test sample preparation process was polished by the operator on a flat table under the tap, with one hand pressing water on the sandpaper and the other hand holding the sample and making a straight unidirectional movement. This method is not only time-consuming and laborious, but the quality of the final test surface also depends heavily on the operator's skill level. Later, manual single-disc or double-disc polishing machines were introduced to the market. Sandpaper was laid on the adjustable-speed turntable for polishing. At this time, it was only necessary to press the sample at a fixed point and change the sandpaper at regular intervals, which shortened the polishing time and reduced the difficulty of operation. Even operators with simple training could obtain a microsection inspection surface of acceptable quality. With the rapid development of the electronics assembly industry, the workload of microsection testing also increased rapidly. In order to adapt to the market, automatic polishing machines emerged. Automatic polishing machines added a pneumatic pressure head to the original manual polishing machine to replace the manual operation of pressing the sample. However, such machines still require operators to change the sandpaper on the turntable. Although the pneumatic pressure head can clamp and press 6 to 8 samples at a time, it is still necessary to stop the turntable, remove the sample for testing, check it, and then reinstall it each time to observe the condition of the inspection surface and judge whether to change the sandpaper to the next grit. The efficiency of this process is far less than that of skilled microsection testing operators. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic defect location device and method for microslices, so as to solve the problem in the background art that the automatic defect location device and method for microslices that requires frequent replacement by operators is inefficient and affects subsequent experimental operations.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automatic defect location device for microsections, comprising a supporting connecting base, a supporting base fixedly connected to the bottom of the supporting connecting base, a supporting mounting seat fixedly connected to the supporting connecting base, a dust cleaning component mounted on the supporting mounting seat, an adjusting component mounted on the supporting mounting seat, a driving component mounted on the supporting connecting base, an execution component mounted on the driving component, a guiding component mounted on the supporting connecting base, an observation and inspection disc mounted on a rotating connecting disc, a 120-grit sandpaper turntable, a 600-grit sandpaper turntable, a 1200-grit sandpaper turntable, a 2400-grit sandpaper turntable, a woolen coarse polishing turntable, a short-fiber fine polishing turntable, a pure water cleaning turntable, and a detection component mounted on the observation and inspection disc. The execution component drives the rotating connecting disc to rotate clockwise, and the adjusting component drives the sample clamping sleeve to move along a preset direction. Microsection testing, as a metallographic testing method unique to the field of electronic components and assemblies, occupies an irreplaceable position in electronic packaging quality evaluation and assembly process optimization. Its core principle is to visually present internal structural features, such as solder joint integrity, chip package gaps, and circuit connection status, by observing the cross-section of electronic components or assemblies, thereby determining whether the product meets design standards and usage requirements. Compared with other testing methods, micro-section testing has the advantages of low cost, relatively simple operation procedures, and intuitive and easy-to-understand test results. Therefore, it is widely used by various electronic industry laboratories and has become one of the key testing links to ensure the quality of electronic products.

[0006] The complete process of microsection testing encompasses four core steps: cutting and sampling, mounting, polishing, and microscopic imaging. The first three steps together constitute the sample preparation stage. In this series of steps, the completeness of the sample preparation directly determines the accuracy of the final test results. If scratches, insufficient flatness, or structural damage occur on the sample cross-section during preparation, it will severely interfere with the observation results in the microscopic imaging stage, making it impossible for inspectors to accurately determine the internal state of electronic components, and may even lead to misjudgments, affecting the reliability of product quality assessment. Simultaneously, the sample preparation stage is also the most time-consuming and involves the most types of consumables in the entire microsection testing process. From tool wear during cutting and sampling to resin materials required during mounting, and sandpaper and polishing agents in the polishing stage, both consumable costs and time costs account for a significant proportion of the total test cost. Therefore, the efficiency and quality of the sample preparation stage become the core factors affecting the overall cost control and testing efficiency of microsection testing.

[0007] In the development of microsection sample preparation technology, the polishing process, as a key step determining the quality of the sample cross-section, has undergone multiple iterations, each addressing different industry needs and technical challenges. Early microsection sample polishing operations relied entirely on manual labor. The operation was typically conducted on a flat surface under a water tap—the operator had to press down on the sandpaper with one hand to fix its position, while the other hand held the sample and moved it linearly across the sandpaper, achieving surface polishing through friction between the sample and the sandpaper. This purely manual method had significant limitations: firstly, the process was time-consuming and labor-intensive, requiring operators to maintain a fixed posture for extended periods, resulting in high labor intensity and extremely low polishing efficiency, making it difficult to meet the testing needs of batches of samples; secondly, the final sample surface quality highly depended on the operator's skill level. Different operators varied in pressure, speed, and friction direction, and even the same operator's operating state could differ at different times, leading to inconsistent surface quality across different batches, and even within the same batch, resulting in scratches, uneven flatness, and other problems that severely affected the accuracy of subsequent microscopic observation.

[0008] With the initial development of the electronics industry, the demand for microsection testing has gradually increased, and the market has placed higher demands on the efficiency and quality stability of polishing technology. Manual single-disc or double-disc polishing machines have emerged to meet this need. The core improvement of these machines lies in the addition of an adjustable-speed circular turntable. Operators simply place sandpaper on the turntable, and the rotation of the turntable moves the sandpaper. At this point, operators no longer need to hold the sandpaper by hand; they only need to press the sample at a fixed point to complete the polishing operation. Compared to purely manual operation, manual single-disc or double-disc polishing machines have significant advantages: First, the mechanical rotation of the turntable replaces the linear movement of manually holding sandpaper, greatly reducing the operator's labor intensity. Simultaneously, the turntable speed can be adjusted according to the sample material and polishing requirements, shortening polishing time and improving overall efficiency. Second, the operational difficulty is significantly reduced. Operators do not need extensive experience to master the basic operating methods, and after simple training, they can obtain microsection inspection surfaces of acceptable quality, improving the consistency of inspection surface quality to a certain extent. However, these manual polishing machines still have obvious technical shortcomings. During the polishing process, operators need to change sandpaper of different grits at regular intervals. From coarse grinding to fine grinding and then to polishing, the machine needs to be stopped manually, the sandpaper needs to be changed, and the equipment needs to be restarted after each polishing stage is completed. The operation process is still quite cumbersome. Moreover, the sandpaper is easily laid unevenly due to improper operation during the sandpaper change process, which affects the polishing quality.

[0009] With the rapid development of the electronics assembly industry, the output and complexity of electronic products have increased significantly, leading to an explosive growth in the workload of microsection testing. Traditional manual polishing machines can no longer meet the demands for large-scale, high-efficiency sample preparation, prompting the emergence of automatic polishing machines. Early automatic polishing machines made key improvements to manual single-disc or double-disc polishing machines by adding a pneumatic pressure head assembly. This pneumatically driven mechanism automatically presses the samples, replacing the manual hand-held pressing operation. This improvement allows the equipment to simultaneously clamp and press 6-8 samples for polishing, significantly increasing the number of samples polished in a single pass and further reducing the workload of operators. However, these automated polishing machines still fail to address two core technical pain points: First, sandpaper replacement still relies on manual operation. After each polishing stage, operators must stop the machine and manually replace the sandpaper, preventing full automation. Second, judging the condition of the sample inspection surface still requires manual intervention. After each polishing stage, operators must pause the turntable, remove the sample from the equipment, and visually inspect or use simple testing tools to determine if the inspection surface meets the standards for the next polishing stage. If not, the sample must be reinstalled for a second polishing; if it meets the standards, the sandpaper is replaced and the operation continues. This process not only interrupts the polishing process, reducing overall efficiency, but also makes the manual judgment of the inspection surface condition susceptible to subjective factors, compromising the accuracy and consistency of the results. Consequently, the overall efficiency of these automated polishing machines is far lower than that of skilled microsection testing operators, failing to fully meet the high-efficiency sample preparation needs of the rapidly developing electronics assembly industry.

[0010] Based on the preferred embodiment of this technical solution, the observation and inspection disc, the 120-grit sandpaper turntable, the 600-grit sandpaper turntable, the 1200-grit sandpaper turntable, the 2400-grit sandpaper turntable, the wool coarse polishing turntable, the short-fiber fine polishing turntable, and the pure water cleaning turntable are all arrayed and installed on the rotating connecting disc.

[0011] According to the preferred embodiment of this technical solution, the drive assembly includes a mounting base mounted on a support base, a first motor fixedly connected to the mounting base, a first rotating pulley fixedly connected to the output end of the first motor, a second rotating pulley rotatably connected inside the mounting base, and a transmission belt body rotatably connected between the second rotating pulley and the first rotating pulley. The first motor drives the first rotating pulley to rotate in a clockwise direction.

[0012] In a preferred embodiment of this technical solution, the first rotating pulley and the second rotating pulley are provided with grooves at corresponding positions on the transmission belt body, and the calipers on the transmission belt body are engaged with the first rotating pulley and the second rotating pulley.

[0013] In a preferred embodiment of this technical solution, the execution component includes a rotating worm gear rotatably connected inside the mounting connection seat, a rotating connecting rod rotatably connected inside the support connection base, and a rotating worm wheel fixedly connected to the rotating connecting rod. The rotating worm wheel is meshed with the rotating worm gear, a second rotating pulley is fixedly connected to the rotating worm gear, and the rotating connecting rod is fixedly connected to the rotating connecting disc.

[0014] According to the preferred embodiment of this technical solution, the guide component includes a support connecting seat fixedly connected to the support connecting base, a rotation limiting shaft rotatably connected inside the support connecting seat, and a guide support wheel fixedly connected to the rotation limiting shaft, with the guide support wheel fitting against the bottom of the rotation connecting disc.

[0015] Based on the preferred embodiment of this technical solution, the dust cleaning component includes a dust collection box installed at one end of the support mounting base, a fan structure fixedly connected to the support mounting base, a dust guide pipe installed between the fan structure and the dust collection box, a suction pipe fixedly connected to the fan structure, and an air suction plate installed on the suction pipe.

[0016] According to the preferred embodiment of this technical solution, the adjustment component includes a telescopic pressure rod fixedly connected to the support mounting base, a mounting connecting sleeve fixedly connected to the bottom of the telescopic pressure rod, a second motor fixedly connected to the mounting connecting sleeve, and a rotation adjustment shaft fixedly connected to the bottom of the second motor, with the sample clamping sleeve fixedly connected to the rotation adjustment shaft.

[0017] According to the preferred embodiment of this technical solution, the detection component includes an observation hole installed on the observation and inspection plate and an inverted miniature camera installed on the observation and inspection plate.

[0018] Based on the preferred embodiment of this technical solution, the automatic defect location device and method for micro-slices is characterized by comprising the automatic defect location device for micro-slices according to claim 1, the steps of which are as follows:

[0019] Step 1: The first motor starts running, driving the first rotating pulley to rotate. Through the transmission belt body meshing with the pulley, the power is transmitted to the second rotating pulley, which in turn drives the rotating worm fixed thereto to rotate. The rotating worm meshes with the rotating worm wheel, converting the rotational motion into rotational motion, which then drives the rotating connecting plate to rotate clockwise through the rotating connecting rod. At this time, the guide support wheel rolls with the bottom of the rotating connecting plate, supporting the turntable and limiting wobbling, ensuring smooth rotation.

[0020] Step Two: When the 120-grit sandpaper turntable rotates to directly below the sample holder, the rotating connecting plate pauses. The telescopic pressure rod extends and retracts downwards, causing the mounting connecting sleeve, the second motor, and the rotating adjustment shaft to descend synchronously, bringing the sample in the sample holder against the sandpaper surface and applying appropriate pressure. Then, the second motor starts, driving the rotating adjustment shaft to rotate the sample holder, creating relative friction between the sample and the sandpaper, initiating coarse grinding. Simultaneously, the fan structure generates negative pressure, drawing in the dust generated during polishing through the suction plate. The dust then enters the dust collection box through the suction pipe and dust guide pipe, completing the dust cleaning of the coarse grinding stage.

[0021] Step 3: After coarse grinding, the telescopic pressure rod retracts upwards, and the sample is removed from the sandpaper. Rotate the connecting plate again, and sequentially rotate the 600-grit sandpaper disc, 1200-grit sandpaper disc, and 2400-grit sandpaper disc to below the sample. Repeat the steps to gradually complete the medium, fine, and finishing grinding. After finishing the finishing grinding, rotate the connecting plate again to rotate the wool coarse polishing disc to the corresponding position. Use the same lifting and rotating method as described above, along with the polishing compound, to complete the coarse polishing. Then switch to the short-pile fine polishing disc to complete the fine polishing. During each polishing step, the dust cleaning component works synchronously to clean up the polishing debris.

[0022] Step 4: After fine polishing, the pure water cleaning turntable rotates to below the sample. The telescopic pressure rod lowers the sample close to the turntable, and pure water is sprayed from the water spray holes on the turntable surface. At the same time, the second motor drives the sample to rotate, cleaning the surface of residual polishing agent and debris. After cleaning, the connecting plate is rotated to move the observation and inspection plate to below the sample. The sample descends to above the observation hole, and the inverted miniature camera takes an image of the sample surface through the observation hole. The image is transmitted to the control system in real time to determine whether the polishing quality meets the standard. If it meets the standard, the telescopic pressure rod raises the sample, the device stops operating, and the sample is removed. If it does not meet the standard, the process returns to the corresponding polishing step for reprocessing.

[0023] Step 5: Observe the inspection tray by opening the observation hole and installing an inverted miniature camera. For polished samples that pass the grinding and polishing process, the camera acquires images, identifies PCBA defects such as solder cracks and holes, and automatically records the defect morphology, location, and sample number to achieve precise positioning. For samples that meet the grinding and polishing quality standards, after identifying PCBA soldering process defects such as solder cracks, holes, and insufficient filling through surface image recognition, the defect morphology, location, and sample number are directly recorded to achieve defect positioning. Beneficial effects of this invention:

[0024] 1. By integrating components such as the support connection base and support mounting base, the entire process is automated, eliminating the need for manual sample handling. This saves manpower and reduces reliance on operator skill, ensuring stable quality of the inspection surface. Compared to manual single / double disc polishing machines, it mounts an array of 8 functional turntables on a rotating connecting disc, allowing for automatic station switching without manual sandpaper replacement, significantly reducing tool change time and improving efficiency. Compared to traditional automatic polishing machines that require machine stoppage for inspection, it can monitor sample status online by observing the inspection disc and detection components, eliminating the need to pause the turntable for sample removal and avoiding process interruptions. Simultaneously, adjusting the components to drive the sample clamping sleeve allows for polishing multiple samples at once, solving the problem of traditional automatic machines being less efficient than manual methods. It balances automation and high efficiency, adapting to the rapidly increasing workload demands of microsection testing.

[0025] 2. By placing the suction plate close to the polishing area and using the negative pressure generated by the fan structure, the dust generated by sandpaper / polishing disc polishing is directly sucked in, preventing dust from spreading and polluting the working environment. This protects the respiratory health of operators, reduces the risk of pneumoconiosis, and eliminates the need for frequent cleaning of workshop equipment, thus reducing environmental maintenance costs. Furthermore, it effectively ensures polishing quality and equipment lifespan, preventing secondary dust adhesion to the sample surface, which can lead to scratches and increased roughness, ensuring the accuracy of the inspection surface. Simultaneously, it prevents dust from entering drive components (such as rotating pulleys) and actuator components (rotating worm gears, worm wheels), reducing component wear, lowering the probability of equipment failure, and extending service life.

[0026] 3. The detection component uses an inverted miniature camera to capture the sample surface condition in real time through an observation hole, allowing for the identification of process defects in PCBA electronic assembly without stopping the machine to remove components. The adjustment component adjusts parameters instantly based on the detection results—the telescopic pressure rod precisely changes the pressure of the sample clamping sleeve on the sample, and the second motor adjusts the sample rotation speed and angle by rotating the adjustment shaft, enabling targeted rework. This combination avoids the efficiency losses caused by downtime inspections in traditional equipment and solves the quality problems caused by human judgment bias. At the same time, the automated action of the adjustment component, combined with the objective data from the detection component, reduces human intervention and significantly improves the processing consistency of different batches of samples, especially meeting the high precision and high stability requirements of the micro-section inspection surface in the electronic assembly industry. Attached Figure Description

[0027] Figure 1 The diagram shown is a structural schematic of one embodiment of the automatic grinding and polishing device of the present invention.

[0028] Figure 2 The diagram shown is a schematic representation of the rotating connecting disc structure of the automatic grinding and polishing device of the present invention.

[0029] Figure 3 The diagram shown is a schematic representation of the drive assembly of the automatic grinding and polishing device of the present invention.

[0030] Figure 4 The diagram shown is a schematic representation of the structure of the automatic grinding and polishing device execution components of the present invention.

[0031] Figure 5 The diagram shown is a schematic representation of the structure of the guide assembly of the automatic polishing device of the present invention.

[0032] Figure 6 The diagram shown is a schematic representation of the structure of the dust cleaning component of the automatic polishing device of the present invention.

[0033] Figure 7 The diagram shown is a schematic representation of the structure of the adjustment component of the automatic polishing device of the present invention.

[0034] Figure 8 The diagram shown is a schematic representation of the structure of the detection component of the automatic polishing device of the present invention. Figure 9 The diagram shown is a schematic representation of the height structure of the through-hole filler in the automatic grinding and polishing device of the present invention.

[0035] Figure 10 The diagram shown is a schematic representation of the cold welding structure of the automatic grinding and polishing device of the present invention.

[0036] Figure 11 The diagram shown is a schematic representation of the solder cavity structure of the automatic polishing device of the present invention.

[0037] Figure 12 The diagram shown is a schematic representation of the voids and cracks in the automatic polishing device of the present invention.

[0038] Explanation of reference numerals in the attached drawings: 1. Supporting connecting base; 2. Supporting base; 3. Supporting mounting seat; 4. Rotating connecting plate; 5. Sample clamping sleeve; 701. Observation and inspection plate; 702. 120-grit sandpaper turntable; 703. 600-grit sandpaper turntable; 704. 1200-grit sandpaper turntable; 705. 2400-grit sandpaper turntable; 706. Coarse polishing turntable for woolen fabric; 707. Fine polishing turntable for short-fiber fabric; 708. Pure water washing turntable; 801. First motor; 802. First rotating pulley; 803. Second rotating pulley; 804. 805. Transmission belt body; 806. Rotating worm gear; 807. Rotating connecting rod; 808. Rotating worm wheel; 809. Support connecting seat; 810. Rotating limit shaft; 811. Guide support wheel; 812. Mounting connecting seat; 903. Dust collection box; 904. Fan structure; 905. Dust guide tube; 906. Suction pipe; 907. Suction disc; 108. Telescopic pressure rod; 109. Mounting connecting sleeve; 1000. Second motor; 101. Rotating adjustment shaft; 102. Observation hole; 103. Inverted miniature camera. Detailed Implementation

[0039] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0040] Please see Figure 1-8 This invention provides an embodiment of an automatic defect location device and method for micro-slices: It includes a supporting connecting base 1, a supporting base 2 fixedly connected to the bottom of the supporting connecting base 1, a supporting mounting seat 3 fixedly connected to the supporting connecting base 1, a dust cleaning component mounted on the supporting mounting seat 3, an adjusting component mounted on the supporting mounting seat 3, a driving component mounted on the supporting connecting base 1, an execution component mounted on the driving component, a guiding component mounted on the supporting connecting base 1, an observation and inspection disc 701 mounted on a rotating connecting disc 4, a 120-grit sandpaper turntable 702, a 600-grit sandpaper turntable 703, a 1200-grit sandpaper turntable 704, a 2400-grit sandpaper turntable 705, a woolen coarse polishing turntable 706, a short-fiber fine polishing turntable 707, a pure water washing turntable 708, and a detection component mounted on the observation and inspection disc 701. The execution component drives the rotating connecting disc 4 to rotate clockwise, and the adjusting component drives the sample clamping sleeve 5 to move in a preset direction. By integrating the supporting connecting base 1, supporting base 2, supporting mounting seat 3, and other multi-functional components such as dust cleaning components and adjustment components into a unified device, the entire process of micro-slicing, from coarse grinding with 120-grit sandpaper turntable 702, fine grinding with 600-grit sandpaper turntable 703, 1200-grit sandpaper turntable 704, 2400-grit sandpaper turntable 705 to polishing with woolen coarse polishing turntable 706, short-fiber fine polishing turntable 707, cleaning with pure water turntable 708, and testing and observation tray 701 and testing components, is fully automated. This avoids the tedious steps of manually transferring samples multiple times in traditional equipment, significantly reducing the impact of human intervention on sample preparation accuracy. At the same time, the collaborative design of each component ensures the continuous connection of each process, improving the overall sample preparation efficiency.

[0041] Please see Figure 2 A further embodiment of this design includes: an observation and inspection disc 701, a 120-grit sandpaper disc 702, a 600-grit sandpaper disc 703, a 1200-grit sandpaper disc 704, a 2400-grit sandpaper disc 705, a woolen coarse polishing disc 706, a short-fiber fine polishing disc 707, and a pure water rinsing disc 708, all arranged in an array on the rotating connecting disc 4. By arranging the observation and inspection disc 701, the sandpaper discs of different grits, the polishing disc, and the pure water rinsing disc 708 in an array on the rotating connecting disc 4, the device can quickly switch processing positions by rotating the connecting disc 4, eliminating the need for manual tool changes. This ensures an orderly progression of the polishing process from coarse to fine, reduces time wasted during tool changes, and ensures precise alignment of each position with the sample clamping sleeve 5, improving the consistency of the polishing process.

[0042] Please see Figure 3A further solution based on this embodiment is as follows: the drive assembly includes a mounting connection seat 811 mounted on the support connection base 1, a first motor 801 fixedly connected to the mounting connection seat 811, a first rotating pulley 802 fixedly connected to the output end of the first motor 801, a second rotating pulley 803 rotatably connected inside the mounting connection seat 811, and a transmission belt body 804 rotatably connected between the second rotating pulley 803 and the first rotating pulley 802. The first motor 801 drives the first rotating pulley 802 to rotate in a clockwise direction. The combination structure of the first motor 801 driving the first rotating pulley 802, the transmission belt body 804, and the second rotating pulley 803 provides a stable power source for the rotating connecting disc 4. The controllability of the first motor 801 ensures the adjustability of the rotation speed of the rotating connecting disc 4, which can adapt to the grinding and polishing requirements of samples of different materials. The pulley drive method has the characteristics of smooth transmission and low noise, avoiding the impact of the power transmission process on the sample processing accuracy. At the same time, the closed design of the mounting connecting seat 811 protects the transmission components such as the first rotating pulley 802 and the second rotating pulley 803, reducing the risk of failure caused by dust pollution.

[0043] Please see Figure 3 A further solution based on this embodiment is as follows: The first rotating pulley 802 and the second rotating pulley 803 have corresponding slots on the transmission belt body 804, and the teeth on the transmission belt body 804 are engaged with the first rotating pulley 802 and the second rotating pulley 803. Through the slotted engagement design of the first rotating pulley 802, the second rotating pulley 803, and the transmission belt body 804, slip-free power transmission is achieved, ensuring that the rotational speed of the first motor 801 can be accurately converted into the rotational speed of the second rotating pulley 803. This avoids the positioning error of the rotating connecting disc 4 caused by slippage that may occur in traditional friction transmission, thereby ensuring the positional accuracy of the observation and inspection disc 701 and various sandpaper discs during switching, enabling the sample to accurately align with the corresponding grinding and polishing station, and improving the reliability of the processing.

[0044] Please see Figure 4A further embodiment of this solution is as follows: the execution component includes a rotating worm 805 rotatably connected inside the mounting base 811, a rotating connecting rod 806 rotatably connected inside the support base 1, and a rotating worm wheel 807 fixedly connected to the rotating connecting rod 806. The rotating worm wheel 807 is meshed with the rotating worm 805. A second rotating pulley 803 is fixedly connected to the rotating worm 805, and the rotating connecting rod 806 is fixedly connected to the rotating connecting disk 4. Through the meshing transmission of the rotating worm 805 and the rotating worm wheel 807, the power of the drive component is efficiently transmitted to the rotating connecting disk 4. The structure of the rotating worm 805 and the rotating worm wheel 807 has the characteristics of large transmission ratio and good self-locking, which can not only achieve precise speed control of the rotating connecting disk 4, but also maintain a stable position when the rotating connecting disk 4 stops rotating, preventing the position deviation caused by external force. At the same time, the rigid connection of the rotating connecting rod 806 ensures the directness of power transmission, reduces energy loss, and improves the response speed of the device.

[0045] Please see Figure 5 A further solution based on this embodiment is as follows: the guide assembly includes a support connecting seat 808 fixedly connected to the support connecting base 1, a rotation limiting shaft 809 rotatably connected inside the support connecting seat 808, and a guide support wheel 810 fixedly connected to the rotation limiting shaft 809. The guide support wheel 810 is in contact with the bottom of the rotating connecting disk 4. Through the contact design between the guide support wheel 810 and the bottom of the rotating connecting disk 4, stable support is provided for the rotating connecting disk 4, effectively distributing the weight of the rotating connecting disk 4 and each functional turntable 701-708, reducing radial swaying caused by the shift of the center of gravity during rotation. Simultaneously, the rolling friction characteristics of the support connecting seat 808, the rotation limiting shaft 809, and the guide support wheel 810 reduce the resistance during rotation of the rotating connecting disk 4, making the rotation smoother and more stable, avoiding the impact of vibration on the surface finish of the sample, and improving the overall processing quality.

[0046] Please see Figure 6A further solution based on this embodiment is as follows: the dust cleaning component includes a dust collection box 901 installed at one end of the support mounting base 3, a fan structure 902 fixedly connected to the support mounting base 3, a dust guide pipe 903 installed between the fan structure 902 and the dust collection box 901, a suction pipe 904 fixedly connected to the fan structure 902, and a suction plate 905 installed on the suction pipe 904. The negative pressure generated by the fan structure 902 draws the dust generated during grinding and polishing directly into the dust collection box 901 via the suction plate 905, dust suction pipe 904, and dust guide pipe 903. This achieves source collection of dust, preventing dust from spreading in the working environment. This protects the health of operators and prevents dust from adhering to the sample surface and affecting the grinding and polishing quality. It also reduces wear caused by dust entering the drive components such as the first rotating pulley 802 and the second rotating pulley 803, as well as the actuator components such as the rotating worm gear 805 and the rotating worm wheel 807. This extends the service life of the device and improves operational safety.

[0047] Please see Figure 7 A further embodiment of this solution includes: an adjustment component comprising a telescopic pressure rod 101 fixedly connected to the support mounting base 3, a mounting connecting sleeve 102 fixedly connected to the bottom of the telescopic pressure rod 101, a second motor 103 fixedly connected to the mounting connecting sleeve 102, and a rotation adjustment shaft 104 fixedly connected to the bottom of the second motor 103. The sample clamping sleeve 5 is fixedly connected to the rotation adjustment shaft 104. Through the lifting and lowering action of the telescopic pressure rod 101, the contact pressure between the sample in the sample clamping sleeve 5 and the polishing turntable can be precisely adjusted to adapt to the polishing force requirements of different material samples. The rotation adjustment shaft 104 driven by the second motor 103 can drive the sample clamping sleeve 5 and the sample to rotate, so that the sample and the turntable form uniform relative friction, avoiding the problem of insufficient surface flatness caused by uneven pressure and unidirectional friction during manual polishing. The rigid connection of the mounting connecting sleeve 102 ensures the stable transmission of pressure and rotational power, improving the uniformity and controllability of polishing.

[0048] Please see Figure 8A further embodiment of this solution is as follows: the detection component includes an observation hole 106 installed on the observation and inspection tray 701 and an inverted miniature camera 107 installed on the observation and inspection tray 701. The inverted miniature camera 107 captures real-time images of the sample surface through the observation hole 106, and transmits the images to the control system to achieve online detection of process defects in PCBA electronic assembly. This replaces the traditional manual component removal and observation method, avoiding process interruptions caused by machine downtime for component removal. Simultaneously, the image-based detection results are more objective and accurate, reducing subjective errors in manual judgment, facilitating timely detection and feedback of process defects in PCBA electronic assembly, and improving the sample pass rate. The miniature camera 107 can identify some typical defects, such as insufficient solder filling height in through-holes, solder voids, and cracks.

[0049] Please see Figure 1-9 A further solution based on this embodiment is as follows: It includes the automatic defect location device for micro-slices according to claims 1-9, and its steps are as follows:

[0050] Step 1: The first motor 801 starts running, driving the first rotating pulley 802 to rotate. Through the transmission belt body 804 meshing with the pulley, the power is transmitted to the second rotating pulley 803, which in turn drives the rotating worm 805 fixed thereto to rotate. The rotating worm 805 meshes with the rotating worm wheel 807, converting the rotational motion into rotational motion. Through the rotating connecting rod 806, the rotating connecting disk 4 is driven to rotate clockwise. At this time, the guide support wheel 810 rolls with the bottom of the rotating connecting disk 4, supporting the turntable and limiting wobbling, ensuring smooth rotation. Through the coordinated transmission of drive components such as the first motor 801 and the first rotating pulley 802 with execution components such as the rotating worm 805 and the rotating worm wheel 807, the smooth rotation of the rotating connecting disk 4 is achieved. The cooperation of the guide support wheel 810 effectively controls the sway amplitude of the rotating connecting disk 4, laying the foundation for the precise switching of the subsequent observation and inspection disk 701 and various functional turntables 702-708. The power transmission method in this step not only ensures the controllability of the rotation speed, but also ensures the stability of the rotation of the rotating connecting disk 4, avoiding the impact of power fluctuations on the overall process in the initial stage.

[0051] Step Two: When the 120-grit sandpaper turntable 702 rotates to directly below the sample holder sleeve 5, the rotating connecting plate 4 pauses. The telescopic pressure rod 101 extends and retracts downward, causing the mounting connecting sleeve 102, the second motor 103, and the rotating adjustment shaft 104 to descend synchronously, so that the sample in the sample holder sleeve 5 is in contact with the sandpaper surface and appropriate pressure is applied. Then, the second motor 103 starts, driving the rotating adjustment shaft 104 to rotate the sample holder sleeve 5, and the sample and sandpaper form relative friction, starting the coarse grinding. At the same time, the fan structure 902 works to generate negative pressure, which sucks in the dust generated by grinding and polishing through the suction plate 905. The dust enters the dust collection box 901 through the dust suction pipe 904 and the dust guide pipe 903, completing the dust cleaning of the coarse grinding stage. Through the precise movement of the telescopic pressure rod 101, the second motor 103 and other adjustment components, stable contact and relative friction between the sample in the sample clamping sleeve 5 and the 120-grit sandpaper turntable 702 are achieved, ensuring the efficient execution of the rough grinding process. At the same time, the synchronous operation of the dust cleaning components such as the fan structure 902 and the suction plate 905 removes a large amount of dust generated by rough grinding from the source, which not only avoids the health threat of dust to the operators, but also prevents dust from adhering and affecting subsequent processing. The coordinated operation of this step makes the rough grinding process both environmentally friendly and ensures quality.

[0052] Step 3: After coarse grinding, the telescopic pressure rod 101 retracts upward, and the sample is removed from the sandpaper. Rotate the connecting plate 4 again, and sequentially rotate the 600-grit sandpaper disc 703, 1200-grit sandpaper disc 704, and 2400-grit sandpaper disc 705 to below the sample. Repeat the steps to gradually complete the medium grinding, fine grinding, and finishing grinding. After finishing grinding, rotate the connecting plate 4 to rotate the wool coarse polishing disc 706 to the corresponding position. Use the same lifting and rotating method as above, along with polishing agent, to complete the coarse polishing. Then switch to the short-pile fine polishing disc 707 to complete the fine polishing. During each polishing step, the dust cleaning component works synchronously to clean the debris generated during polishing. By sequentially performing medium grinding, fine grinding, and precision grinding using a 600-grit sandpaper turntable 703, a 1200-grit sandpaper turntable 704, and a 2400-grit sandpaper turntable 705, followed by polishing using a woolen coarse polishing turntable 706 and a short-fiber fine polishing turntable 707, the surface precision of the sample is gradually improved, meeting the requirements of high-precision testing for sample surface quality. The continuous operation of the dust cleaning components in each step ensures the cleanliness of the sample surface and equipment environment after each process, avoiding cross-contamination of debris from different grinding and polishing stages. At the same time, automated station switching reduces manual intervention, ensuring the consistency and stability of the processing.

[0053] Step 4: After fine polishing, the pure water cleaning turntable 708 rotates to below the sample. The telescopic pressure rod 101 lowers the sample close to the turntable, and pure water is sprayed from the water spray holes on the turntable surface. At the same time, the second motor 103 drives the sample to rotate, cleaning the surface of residual polishing agent and debris. After cleaning, the connecting plate 4 rotates the observation and inspection plate 701 to below the sample. The sample descends to above the observation hole 106, and the inverted miniature camera 107 captures an image of the sample surface through the observation hole 106. The image is transmitted to the control system in real time to determine whether the polishing quality meets the standard. If it does, the telescopic pressure rod 101 raises the sample, the device stops operating, and the sample is removed. If it does not meet the standard, the process returns to the corresponding polishing step for reprocessing. The pure water cleaning turntable 708 removes residual polishing agent and debris from the sample surface, providing a clean surface condition for subsequent testing and ensuring the accuracy of the test results from the inverted miniature camera 107. The online observation function of the testing component enables real-time judgment of the polishing quality, preventing unqualified samples from flowing into subsequent stages. If rework is required, the sample can be directly returned to the corresponding polishing step, reducing the waste of time and materials. The entire process forms a closed loop of "processing-cleaning-testing-feedback", improving the reliability and efficiency of sample preparation.

[0054] Step 5: Observe the inspection tray 701, open the observation hole 106, and install an inverted miniature camera 107. For polished samples that pass the grinding and polishing process, the camera acquires images, identifies PCBA defects such as solder cracks and holes, and automatically records the defect morphology, location, and sample number to achieve precise positioning. For samples that meet the grinding and polishing quality standards, after identifying PCBA soldering process defects such as solder cracks, holes, and insufficient filling through surface image recognition, directly record the defect morphology, location, and sample number to achieve defect positioning. The observation hole 106 of the inspection tray 701 provides a stable connection for the inverted miniature camera 107. The image acquisition benchmark ensures that the camera accurately captures the details of the sample surface, improving the identification accuracy of defects such as solder cracks and holes, and avoiding subjective errors from manual observation. It also enables rapid archiving of defect information and sample serial numbers via automatic shooting and recording, eliminating the tedious process of manual recording and significantly improving detection efficiency. Furthermore, complete defect morphology and location data provide a reliable basis for subsequent analysis of PCBA soldering process issues and tracing production processes, helping to optimize soldering parameters in a targeted manner, reducing the probability of similar defects from the source, and ensuring the stability of PCBA product soldering quality.

[0055] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic defect location device for micro-slices, comprising a supporting connecting base (1), characterized in that: It also includes a support base (2) fixedly connected to the bottom of the support connection base (1), a support mounting seat (3) fixedly connected to the support connection base (1), a dust cleaning component installed on the support mounting seat (3), an adjustment component installed on the support mounting seat (3), a drive component installed on the support connection base (1), an execution component installed on the drive component, a guide component installed on the support connection base (1), an observation and inspection plate (701), a 120-grit sandpaper turntable (702), a 600-grit sandpaper turntable (703), a 1200-grit sandpaper turntable (704), a 2400-grit sandpaper turntable (705), a woolen coarse polishing turntable (706), a short-fiber fine polishing turntable (707), a pure water washing turntable (708), and a detection component installed on the observation and inspection plate (701). The execution component drives the rotating connection plate (4) to rotate clockwise, and the adjustment component drives the sample clamping sleeve (5) to rotate in a preset direction.

2. The automatic defect location device for micro-slices according to claim 1, characterized in that: The observation and inspection disc (701), the 120-grit sandpaper turntable (702), the 600-grit sandpaper turntable (703), the 1200-grit sandpaper turntable (704), the 2400-grit sandpaper turntable (705), the wool coarse polishing turntable (706), the short-fiber fine polishing turntable (707), and the pure water washing turntable (708) are all arrayed and installed on the rotating connecting disc (4).

3. The automatic defect location device for micro-slices according to claim 1, characterized in that: The drive assembly includes a mounting bracket (811) mounted on a support base (1), a first motor (801) fixedly connected to the mounting bracket (811), a first rotating pulley (802) fixedly connected to the output end of the first motor (801), a second rotating pulley (803) rotatably connected inside the mounting bracket (811), and a transmission belt body (804) rotatably connected between the second rotating pulley (803) and the first rotating pulley (802). The first motor (801) drives the first rotating pulley (802) to rotate clockwise.

4. The automatic defect location device for micro-slices according to claim 1, characterized in that: The first rotating pulley (802) and the second rotating pulley (803) have grooves at corresponding positions on the transmission belt body (804), and the calipers on the transmission belt body (804) are engaged with the first rotating pulley (802) and the second rotating pulley (803).

5. The automatic defect location device for micro-slices according to claim 1, characterized in that: The actuating components include a rotating worm (805) rotatably connected inside the mounting connector (811), a rotating connecting rod (806) rotatably connected inside the support connecting base (1), and a rotating worm wheel (807) fixedly connected to the rotating connecting rod (806). The rotating worm wheel (807) is meshed with the rotating worm (805), the second rotating pulley (803) is fixedly connected to the rotating worm (805), and the rotating connecting rod (806) is fixedly connected to the rotating connecting disc (4).

6. The automatic defect location device for micro-slices according to claim 1, characterized in that: The guide assembly includes a support connection seat (808) fixedly connected to the support connection base (1), a rotation limit shaft (809) rotatably connected inside the support connection seat (808), and a guide support wheel (810) fixedly connected to the rotation limit shaft (809). The guide support wheel (810) is in contact with the bottom of the rotation connection disk (4).

7. The automatic defect location device for micro-slices according to claim 1, characterized in that: The dust cleaning assembly includes a dust collection box (901) installed at one end of the support mounting base (3), a fan structure (902) fixedly connected to the support mounting base (3), a dust guide pipe (903) installed between the fan structure (902) and the dust collection box (901), a suction pipe (904) fixedly connected to the fan structure (902), and a suction plate (905) installed on the suction pipe (904).

8. The automatic defect location device for micro-slices according to claim 1, characterized in that: The adjustment assembly includes a telescopic pressure rod (101) fixedly connected to the support mounting base (3), a mounting connecting sleeve (102) fixedly connected to the bottom of the telescopic pressure rod (101), a second motor (103) fixedly connected to the mounting connecting sleeve (102), and a rotation adjustment shaft (104) fixedly connected to the bottom of the second motor (103). The sample clamping sleeve (5) is fixedly connected to the rotation adjustment shaft (104).

9. The automatic defect location device for micro-slices according to claim 1, characterized in that: The detection assembly includes an observation hole (106) installed on the observation inspection plate (701) and an inverted miniature camera (107) installed on the observation inspection plate (701).

10. An automatic defect location device and method for micro-slices, characterized in that: An automatic defect location device and method for micro-slices, characterized by comprising the automatic defect location device for micro-slices according to claims 1-9, wherein the steps are as follows: Step 1: The first motor (801) starts running, driving the first rotating pulley (802) to rotate. Through the transmission belt body (804) meshing with the pulley, the power is transmitted to the second rotating pulley (803), which in turn drives the rotating worm (805) fixed thereto to rotate. The rotating worm (805) meshes with the rotating worm wheel (807), converting the rotational motion. Through the rotating connecting rod (806), the rotating connecting disc (4) is driven to rotate clockwise. At this time, the guide support wheel (810) rolls with the bottom of the rotating connecting disc (4), supporting the turntable and limiting the shaking, ensuring smooth rotation. Step 2: When the 120-grit sandpaper turntable (702) rotates to directly below the sample holder sleeve (5), the rotating connecting plate (4) pauses. The telescopic pressure rod (101) extends and retracts downward, causing the mounting connecting sleeve (102), the second motor (103), and the rotating adjustment shaft (104) to descend synchronously, so that the sample in the sample holder sleeve (5) adheres to the sandpaper surface and applies appropriate pressure. Then the second motor (103) starts, driving the rotating adjustment shaft (104) to rotate the sample holder sleeve (5), and the sample and sandpaper form relative friction, starting the coarse grinding. At the same time, the fan structure (902) works to generate negative pressure, sucking in the dust generated by grinding and polishing through the suction plate (905). The dust enters the dust collection box (901) through the dust suction pipe (904) and the dust guide pipe (903), completing the dust cleaning of the coarse grinding stage. Step 3: After coarse grinding, the telescopic pressure rod (101) retracts upward, and the sample is removed from the sandpaper. Rotate the connecting plate (4) again, and rotate the 600-grit sandpaper turntable (703), 1200-grit sandpaper turntable (704), and 2400-grit sandpaper turntable (705) to the bottom of the sample in sequence. Repeat the steps to gradually complete the medium grinding, fine grinding, and fine grinding. After the fine grinding is completed, rotate the connecting plate (4) to continue rotating, and rotate the wool coarse polishing turntable (706) to the corresponding position. Use the same lifting and rotating method as above to complete the coarse polishing with polishing agent. Then switch to the short-fiber fine polishing turntable (707) to complete the fine polishing. During each polishing process, the dust cleaning component always works synchronously to clean the debris generated during polishing. Step 4: After fine polishing, the pure water cleaning turntable (708) is rotated to the bottom of the sample. The telescopic pressure rod (101) drives the sample to descend and approach the turntable. Pure water is sprayed out from the water spray holes on the turntable surface. At the same time, the second motor (103) drives the sample to rotate, cleaning the residual polishing agent and debris on the surface. After cleaning, the connecting plate (4) is rotated to rotate the observation and inspection plate (701) to the bottom of the sample. The sample descends to the top of the observation hole (106). The inverted miniature camera (107) takes an image of the sample surface through the observation hole (106) and transmits it to the control system in real time to determine whether the polishing quality meets the standard. If it meets the standard, the telescopic pressure rod (101) drives the sample to rise, the device stops operating, and the sample is removed. If it does not meet the standard, the corresponding polishing step is returned for reprocessing. Step 5: Observe the inspection plate (701), open the observation hole (106) and install the inverted miniature camera (107). For the polished qualified sample, the camera collects images, identifies PCBA defects such as solder cracks and holes, and automatically records the defect morphology, location and sample number to achieve precise positioning. For the sample with the polished quality meets the standard, after identifying PCBA welding process defects such as solder cracks, holes and insufficient filling through the surface image, the defect morphology, location and sample number are directly recorded to achieve the positioning of the defect.

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