Circuit board photoresist coating device

Abstract

A circuit board photoresist coating device disclosed by the present invention comprises a box body, a photoresist spraying assembly, a rotating shaft and an adsorption assembly, the box body is provided with an operation cavity, the rotating shaft is provided with a threaded section, the rotating shaft is in threaded connection with an adjusting disc, the upper end of the adjusting disc is rotatably connected with a moving disc through a bearing, and the upper side of the moving disc is provided with a rotating disc. Inserting holes are uniformly formed in the rotating disc and the moving disc, an abutting frame is arranged on the upper side of the rotating disc, inserting rods are arranged on the bottom side of the abutting frame, the inserting holes are distributed in the rotating disc and the moving disc in an X shape, the inserting holes are movably inserted into the bottom sides of the inserting rods, positioning holes are formed in the side, away from the axis, of the moving disc, and pressing rods are in threaded connection in the positioning holes; the invention has the beneficial effects that the four trapezoidal abutting frames are arranged, and the recesses are formed in the opposite sides of the trapezoidal abutting frames, so that the edges of the circuit board can be effectively limited and shielded, and in the spin-coating process, the abnormal flowing of photoresist on the edges can be reduced, and the formation of photoresist beads can be avoided, thereby improving the coating quality of the photoresist and reducing the subsequent treatment procedures.

Description

Technical Field

[0001] This invention relates to the field of circuit board coating production, specifically to a circuit board photoresist coating apparatus. Background Technology

[0002] Photoresist coating on circuit boards is a core step in the photolithography process. Typically, photoresist is dropped onto the surface of a rotating substrate, and a uniform thin film is formed by centrifugal force. This process can shorten the coating time per application, and the film thickness can be precisely controlled by adjusting the rotation speed and time.

[0003] In the process of photoresist coating on circuit boards, firstly, deionized water, solvents and chemical solutions are used to remove impurities, organic residues and moisture from the substrate surface. Then, a layer of compound is coated on the substrate surface by vapor phase coating to improve the adhesion between the photoresist and the substrate. Next, the photoresist is dropped onto the surface of a rotating substrate by spin coating, and a uniform thin film is formed by centrifugal force. After processes such as soft baking, cooling, exposure, development and etching, the circuit structure is formed.

[0004] However, in the actual coating process, the flow of photoresist at the edge of the substrate is affected by surface tension. When the rotation speed is too low, the photoresist in the edge area is prone to forming a meniscus, which leads to the accumulation of photoresist and the formation of photoresist beads at the edge of the photoresist. This means that after the circuit board is formed, the photoresist beads at the edge of the substrate need to be treated, which increases the photoresist coating time of the circuit board and reduces the photoresist coating efficiency. Summary of the Invention

[0005] The purpose of this invention is to provide a circuit board photoresist coating apparatus to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a circuit board photoresist coating device, comprising a housing, a spraying assembly, a rotating shaft, and an adsorption assembly. The housing has an operating cavity, the rotating shaft has a threaded section, an adjusting disk is threadedly connected to the rotating shaft, a movable disk is rotatably connected to the upper end of the adjusting disk via a bearing, a rotating disk is provided on the upper side of the movable disk, insertion holes are evenly provided on the rotating disk and the movable disk, an abutment frame is provided on the upper side of the rotating disk, an insertion rod is provided on the bottom side of the abutment frame, the insertion holes are distributed in an X-shape on the rotating disk and the movable disk, the insertion rod is movably inserted into the insertion hole on the bottom side, a positioning hole is provided on the side of the movable disk away from the axis, a pressure rod is threadedly connected to the positioning hole, and the end of the pressure rod abuts against the insertion rod.

[0007] The abutment frame is provided in four parts. The abutment frame is trapezoidal in structure. Both ends of the abutment frame are provided with slanted openings, and two opposite abutment frames are provided with recesses on opposite sides.

[0008] The bottom end of the abutment frame is fixedly connected to a slide rail, and a slider is provided inside the slide rail. Each of the four mutually spaced sides of the slider is rotatably embedded with a sliding ball. The bottom end of the slider is fixedly connected to the upper end of the insertion rod. A pressure plate is threadedly connected to the insertion rod, and the upper end of the pressure plate abuts against the slide rail.

[0009] In a further embodiment, the abutment frame is located on the outside of the adsorption component, and an abutment plate is fixedly connected to the bottom side of the recessed area of ​​the abutment frame, with the abutment plate flush with one end of the abutment frame.

[0010] In a further embodiment, the abutment frame has a slot on one of the inclined openings, and the abutment frame is fixedly connected to a block at the other inclined opening, with the slots and blocks of the four abutment frames corresponding to each other.

[0011] In a further embodiment, a limiting plate is fixedly connected to one side of the upper end of the abutment frame, and a fixing block is fixedly connected to the side of the limiting plate near the inner wall of the box. A spring rod is fixedly connected inside the fixing block, and the end of the spring rod has a hemispherical structure. The limiting plate is flush with one end of the abutment plate.

[0012] In a further embodiment, a connecting plate is fixedly connected to one of the abutting frames near the abutting plate, and a distance sensor is fixedly connected to the connecting plate.

[0013] In a further embodiment, support rods are fixedly connected to all four sides of the bottom of the rotating disk, and contact balls are rotatably embedded at the bottom of the support rods, with the contact balls contacting the bottom side of the operating cavity of the housing.

[0014] In a further embodiment, an air pump is fixedly connected to one side of the box, and a connecting sleeve is fixedly connected to the output end of the air pump. A connecting inner tube is inserted into the connecting sleeve, and a negative pressure ring is fixedly connected to one side of the connecting inner tube. Adsorption holes are evenly opened on the inner side of the negative pressure ring.

[0015] In a further embodiment, the bottom side of the negative pressure ring contacts a support plate, and the support plate is fixedly connected to one side of the operating cavity.

[0016] In a further embodiment, the bottom end of the adjusting disc is threaded with two locking rods, the ends of which abut against the bottom end of the movable disc.

[0017] Compared with the prior art, the beneficial effects of the present invention are:

[0018] (1) By setting four trapezoidal abutment frames with recesses on their opposite sides, the edge of the circuit board can be effectively limited and blocked. During spin coating, the abnormal flow of photoresist at the edge can be reduced, and the formation of glue beads can be avoided, thereby improving the quality of photoresist coating and reducing subsequent processing steps.

[0019] (2) The insert rod on the bottom side of the abutment frame is movably inserted into the X-shaped holes on the rotating disk and the moving disk. The moving disk is also equipped with a threaded pressure rod to abut the insert rod, so that the position of the abutment frame can be flexibly adjusted according to the size of the circuit board. By changing the insertion position of the insert rod in different holes and fixing it with the pressure rod, it can be adapted to circuit boards of various specifications. At the same time, the cooperation of the slide rail and the slider further increases the flexibility and stability of the position adjustment of the abutment frame, so that the abutment frame can more accurately adapt to the size of the circuit board and ensure good positioning of the circuit board.

[0020] (3) The connection method of the card slot and the card block can firmly connect the adjacent abutment frames after the abutment frame is adjusted to the position, enhance the stability of the overall structure, and ensure that the abutment frame will not be displaced during the spin coating process, thereby reliably limiting the circuit board.

[0021] (4) By setting a limiting plate, a fixing block and a spring rod, a four-sided temporary limiting structure is formed. In the initial stage of placing the circuit board, it is convenient to temporarily limit the circuit board. When adsorption is needed, the circuit board can be made to contact the suction cup assembly by simply pressing the circuit board, thus facilitating the adsorption of the circuit board.

[0022] (5) The support rod and contact ball provide stable support for the rotating disk, making the rotating disk more stable during rotation, reducing shaking, ensuring the stability of the spin coating process, and the negative pressure ring can actively adsorb the free photoresist, reducing the working stagnation caused by the contact between the photoresist mist and other components in the coating device. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0024] Figure 2 This is a front sectional view of the present invention;

[0025] Figure 3 This is a side sectional view of the rotating disk structure of the present invention;

[0026] Figure 4 This is a three-dimensional structural diagram of the contact frame of the present invention;

[0027] Figure 5 This is an enlarged structural diagram of point A in the present invention.

[0028] In the diagram: 1. Box body; 2. Glue spraying assembly; 3. Rotating shaft; 4. Adsorption assembly; 5. Adjusting disc; 6. Moving disc; 7. Rotating disc; 8. Insertion hole; 9. Insertion rod; 10. Abutment frame; 11. Positioning hole; 12. Pressure rod; 13. Slide rail; 14. Slider; 15. Pressure plate; 16. Abutment plate; 17. Slot; 18. Locking block; 19. Limiting plate; 20. Fixing block; 21. Spring rod; 22. Connecting plate; 23. Distance sensor; 24. Support rod; 25. Air pump; 26. Connecting sleeve; 27. Negative pressure ring; 28. Support plate; 29. ​​Locking rod. Detailed Implementation

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Example 1

[0031] Please see Figure 1-5 This embodiment provides a circuit board photoresist coating device, including a housing 1, a spraying assembly 2, a rotating shaft 3, and an adsorption assembly 4. The rotating shaft 3 is driven by a servo motor, and the speed of the servo motor is controllable, slowing down in the early and late stages of circuit board rotation and increasing speed in the middle stage. The adsorption assembly 4 consists of a vacuum pump, a fixed cover, the rotating shaft 3, a suction cup, and air holes on the bottom side of the rotating shaft 3. The suction cup is fixedly connected to the rotating shaft 3 by bolts. The vacuum pump, in conjunction with a vacuum generator, creates a negative pressure inside the fixed cover, and then creates a negative pressure at the through hole at the upper end of the suction cup. An operating chamber is provided on the housing 1, and a threaded section is provided on the rotating shaft 3. An adjusting plate 5 is threadedly connected to the rotating shaft 3. During the process of the insertion rod 9 being limited by the pressure rod 12, rotating the adjusting plate 5 can drive the moving plate 6 to move upward. The upper end of the adjusting plate 5 is open to the air hole. A movable disk 6 is rotatably connected via a bearing. A rotating disk 7 is provided on the upper side of the movable disk 6. Insertion holes 8 are evenly provided on the rotating disk 7 and the movable disk 6. The insertion holes 8 are distributed in an X-shape on the rotating disk 7 and the movable disk 6. By setting the insertion holes 8 in an X-shape, the size can be adjusted according to the size of the circuit board. An abutment frame 10 is provided on the upper side of the rotating disk 7. The size of the abutment frame 10 can be adaptively adjusted according to the length and width of the circuit board. An insertion rod 9 is provided on the bottom side of the abutment frame 10. The bottom side of the insertion rod 9 is movably inserted into the insertion hole 8. A positioning hole 11 is provided on the side of the movable disk 6 away from the axis. A pressure rod 12 is internally threaded into the positioning hole 11. The end of the pressure rod 12 abuts against the insertion rod 9. By setting the pressure rod 12, the friction between the insertion rod 9 and the movable disk 6 can be increased, thereby limiting the height of the abutment frame 10.

[0032] There are four abutment frames 10. The abutment frames 10 are trapezoidal in shape. Both ends of the abutment frames 10 are provided with bevels, and the opposite sides of the two abutment frames 10 are provided with recesses. The bevels can increase the contact surface of two adjacent abutment frames 10. At the same time, when the four abutment frames 10 are in contact, they can cooperate with the plug rod 9 to form mutual limiting.

[0033] The bottom of the abutment frame 10 is fixedly connected to a slide rail 13, and a slider 14 is provided inside the slide rail 13. Each of the four sides of the slider 14 is rotatably embedded with a ball. The bottom of the slider 14 is fixedly connected to the upper end of the insertion rod 9. A pressure plate 15 is threadedly connected to the insertion rod 9. The upper end of the pressure plate 15 abuts against the slide rail 13. The slide rail 13 and the slider 14 facilitate the replacement of the abutment frame 10.

[0034] The abutment frame 10 is located outside the suction cup of the adsorption assembly 4. The abutment frame 10 is fixedly connected to the abutment plate 16 on the bottom side of the recess. The abutment plate 16 is flush with one end of the abutment frame 10.

[0035] A slot 17 is provided on one side of the abutment frame 10 near one of the inclined openings, and a block 18 is fixedly connected to the abutment frame 10 at another inclined opening. The slots 17 and blocks 18 of the four abutment frames 10 correspond to each other.

[0036] First, check that all components, including the housing 1, glue spraying assembly 2, rotating shaft 3, and adsorption assembly 4, are securely installed and properly connected. Ensure that the vacuum pump, servo motor, and other equipment are operating normally and that the glue supply to the glue spraying assembly 2 is sufficient. Next, rotate the adjusting disc 5. Since the adjusting disc 5 is threadedly connected to the rotating shaft 3 and rotatably connected to the moving disc 6 via a bearing, rotating the adjusting disc 5 will cause the moving disc 6 to move up and down. The insertion holes 8 on the moving disc 6 and the insertion holes 8 on the rotating disc 7 are arranged in an X-shape. The insertion rod 9 on the bottom side of the abutment frame 10 is inserted into the insertion hole 8. As the moving disc 6 moves, the height of the abutment frame 10 can be adjusted. After the abutment frame 10 is adjusted to the appropriate height, tighten the pressure rod 12 in the positioning hole 11 so that the end of the pressure rod 12 tightly abuts against the insertion rod 9, increasing the position of the insertion rod 9. The friction between the sliding plate 6 and the movable disk 6 fixes the height of the abutment frame 10. The horizontal position of the abutment frame 10 can be finely adjusted through the cooperation of the slide rail 13 and the slider 14. A ball is embedded in the slider 14, reducing the resistance to its movement within the slide rail 13 and making the adjustment smoother. After the position is adjusted, the pressure plate 15 on the insertion rod 9 is tightened, causing the upper end of the pressure plate 15 to abut against the slide rail 13, fixing the position of the slider 14 and the abutment frame 10. Simultaneously, the slots 17 and blocks 18 of the four abutment frames 10 correspond to each other. After adjustment, the blocks 18 of adjacent abutment frames 10 are inserted into the slots 17 to enhance the stability of the overall structure. Then, the circuit board to be coated with photoresist is placed between the four abutment frames 10, with the edge of the circuit board facing the abutment frames 10. Corresponding to the recess on one side, the abutment plate 16 located at the bottom of the recess of the abutment frame 10 is flush with one end of the abutment frame 10, which can provide better support and limit the edge of the circuit board. Next, the vacuum pump is started. The vacuum pump, together with the vacuum generator, creates a negative pressure inside the fixing cover, and the through hole at the top of the suction cup is also in a negative pressure state, thereby adsorbing and fixing the circuit board on the suction cup. The servo motor is started, and the servo motor drives the rotating shaft 3 to rotate. The rotating shaft 3 drives the rotating disk 7 and the circuit board above it to rotate. The speed of the servo motor is controllable. The speed is reduced in the early and late stages of the circuit board rotation and increased in the middle stage to meet the process requirements of photoresist coating. The adhesive spraying assembly 2 is started to spray the photoresist onto the surface of the rotating circuit board. Under the action of centrifugal force, the photoresist is evenly spread on the surface of the circuit board to form a thin film. During the process, four trapezoidal abutment frames 10 effectively limit and shield the edges of the circuit board, reducing abnormal flow of photoresist at the edges and preventing the formation of adhesive beads. During the coating process, adhesive mist formed by free photoresist may be generated. At this time, the air pump 25 on one side of the housing 1 works. The output end of the air pump 25 is connected to the negative pressure ring 27 through the connecting sleeve 26 and the connecting inner tube. The suction holes evenly opened on the inner side of the negative pressure ring 27 actively adsorb the adhesive mist, reducing the working stagnation caused by the adhesive mist contacting other components in the coating device. The support plate 28 on the bottom side of the negative pressure ring 27 provides support for the negative pressure ring 27 to ensure its stability. After the photoresist coating is completed, the adhesive spraying assembly 2 is turned off, the servo motor gradually slows down until it stops rotating, the vacuum pump is turned off, and the adsorption and fixation on the circuit board is released.Remove the circuit board that has been coated with photoresist.

[0037] Please see Figure 1-5 Further improvements were made based on Example 1.

[0038] A limiting plate 19 is fixedly connected to one side of the upper end of the abutment frame 10. A fixing block 20 is fixedly connected to the side of the limiting plate 19 near the inner wall of the box 1. A spring rod 21 is fixedly connected inside the fixing block 20. The end of the spring rod 21 is hemispherical. The limiting plate 19 is flush with one end of the abutment plate 16.

[0039] The elastic properties of the spring rod 21 enable it to adapt to circuit boards of different thicknesses or with certain deviations in placement, ensuring that the circuit board will not move arbitrarily before adsorption and fixation, facilitating subsequent adsorption operations. During adsorption, simply pressing the circuit board will easily bring it into contact with the adsorption component 4, completing the adsorption and fixation, thus improving the convenience of operation.

[0040] One of the abutment frames 10 is fixedly connected to a connecting plate 22 on the side near the abutment plate 16, and a distance sensor 23 is fixedly connected to the connecting plate 22.

[0041] The distance sensor 23 can monitor the thickness of the photoresist at the edge of the circuit board during the later stage of the circuit board rotation. By acquiring the photoresist thickness information in real time, it can promptly feed back to the control system so as to accurately control parameters such as the rotation speed of the servo motor according to the actual situation, ensuring that the photoresist coating thickness is uniform and meets the process requirements, thereby improving the coating quality.

[0042] In the initial stage of circuit board placement, the four-sided temporary limiting structure formed by the limiting plate 19, fixing block 20 and spring rod 21 on one side of the upper end of the abutment frame 10 can temporarily limit the circuit board, making it convenient to place the circuit board. When adsorption is required, simply press the circuit board to make it contact the adsorption component 4 and complete the adsorption and fixation. The distance sensor 23 can monitor the thickness of the photoresist at the edge of the circuit board in the later stage of the circuit board rotation in order to control the rotation of the servo motor.

[0043] Please see Figure 1-5 Further improvements were made based on Example 1.

[0044] Support rods 24 are fixedly connected to the four sides of the bottom of the rotating disk 7. The bottom of the support rods 24 is rotatably embedded with contact balls, and the contact balls are in contact with the bottom side of the operating cavity of the housing 1.

[0045] The support rod 24 and the contact ball provide stable support for the rotating disk 7, ensuring the smoothness of the rotating disk 7 during rotation and reducing shaking. This is crucial for ensuring the stability of the circuit board during the spin coating of photoresist, which is conducive to the uniform application of photoresist on the surface of the circuit board, improving the coating quality. At the same time, it can also reduce the impact of the shaking of the rotating disk 7 on other components of the device and extend the service life of the device.

[0046] An air pump 25 is fixedly connected to one side of the housing 1. A connecting sleeve 26 is fixedly connected to the output end of the air pump 25. A connecting inner tube is inserted into the connecting sleeve 26. A negative pressure ring 27 is fixedly connected to one side of the connecting inner tube. Adsorption holes are evenly opened on the inner side of the negative pressure ring 27.

[0047] The negative pressure generated by the air pump 25 is transmitted to the negative pressure ring 27 through the connecting sleeve 26 and the connecting inner tube. The uniformly opened adsorption holes on the inner side of the negative pressure ring 27 can actively adsorb the free photoresist mist generated during the coating process, effectively reducing the possibility of the mist coming into contact with other components in the coating device, avoiding the work stagnation caused by the mist adhering to other parts, and ensuring the normal operation of the device and the cleanliness of the coating environment.

[0048] The bottom side of the negative pressure ring 27 contacts the support plate 28, and the support plate 28 is fixedly connected to one side of the operating chamber.

[0049] The bottom of the adjusting disc 5 is threaded with two locking rods 29, the ends of which abut against the bottom of the moving disc 6.

[0050] The locking rod 29, which is threaded at the bottom of the adjusting plate 5, is mainly used to prevent the adjusting plate 5 from rotating or moving during the operation of the device. If it is not locked during the operation of the device, the adjusting plate 5 may rotate due to vibration or other reasons, which will cause the position of the moving plate 6 to change, affecting the height and position of the abutment frame 10, and reducing the limiting effect on the circuit board and the coating effect.

[0051] The servo motor is started, driving the rotating shaft 3 to rotate. The rotating shaft 3 drives the rotating disk 7 and the circuit board above it to rotate. The speed of the servo motor is controllable, slowing down in the early and late stages of rotation and increasing in the middle stage to meet the requirements of the photoresist coating process. The support rods 24 on the four sides of the bottom of the rotating disk 7 and the contact ball embedded in the bottom rotating part contact the bottom side of the operating cavity of the housing 1, providing stable support for the rotating disk 7 and reducing shaking during rotation. The adhesive spraying assembly 2 is started to spray photoresist onto the surface of the rotating circuit board. The photoresist spreads evenly to form a thin film under the action of centrifugal force. At the same time, the air pump 25 on one side of the housing 1 works. The output end of the air pump 25 is connected to the connecting sleeve 26. The inner tube is connected to the negative pressure ring 27. The adsorption holes evenly opened on the inner side of the negative pressure ring 27 actively adsorb the free photoresist mist generated during the coating process, reducing the working stagnation caused by the contact between the mist and other components in the device. The support plate 28 on the bottom side of the negative pressure ring 27 provides stable support. Before subsequent use of the device or before readjusting the position of the abutment frame 10, the two locking rods 29 threaded to the bottom of the adjusting plate 5 abut against the bottom of the moving plate 6 to prevent the adjusting plate 5 from rotating or moving during the operation of the device, thus enhancing the stability of the device. If it is necessary to readjust the position of the abutment frame 10, the corresponding operation can be performed by loosening the locking rods 29.

[0052] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A circuit board photoresist coating device, comprising a housing (1), a spraying assembly (2), a rotating shaft (3), and an adsorption assembly (4), wherein the housing (1) has an operating cavity, characterized in that, The rotating shaft (3) is provided with a threaded section, and the rotating shaft (3) is threadedly connected to an adjusting disk (5). The upper end of the adjusting disk (5) is rotatably connected to a movable disk (6) through a bearing. The movable disk (6) is provided with a rotating disk (7) on its upper side. The rotating disk (7) and the movable disk (6) are evenly provided with insertion holes (8). The rotating disk (7) is provided with an abutting frame (10) on its upper side. The abutting frame (10) is provided with an insertion rod (9) on its bottom side. The insertion rod (9) is movably inserted into the insertion hole (8) on its bottom side. The insertion holes (8) are distributed in an X shape on the rotating disk (7) and the movable disk (6). The movable disk (6) is provided with a positioning hole (11) on its side away from the axis. The positioning hole (11) is threadedly connected to a pressure rod (12). The end of the pressure rod (12) abuts against the insertion rod (9). The abutment frame (10) is provided in four parts. The abutment frame (10) is trapezoidal in shape. Both ends of the abutment frame (10) are provided with slanted openings, and the two abutment frames (10) opposite each other are provided with recesses on opposite sides. The bottom end of the abutment frame (10) is fixedly connected to a slide rail (13), and a slider (14) is provided inside the slide rail (13). Sliding balls are rotatably embedded on the four sides of the slider (14) that are far apart from each other. The bottom end of the slider (14) is fixedly connected to the upper end of the plug rod (9). A pressure plate (15) is threadedly connected to the plug rod (9), and the upper end of the pressure plate (15) abuts against the slide rail (13).

2. The circuit board photoresist coating apparatus according to claim 1, characterized in that: The abutment frame (10) is located outside the adsorption component (4), and the abutment frame (10) is fixedly connected to the bottom side of the recess with an abutment plate (16), and the abutment plate (16) is flush with one end of the abutment frame (10).

3. The circuit board photoresist coating apparatus according to claim 2, characterized in that: The abutment frame (10) has a slot (17) on one of the inclined sides, and a block (18) is fixedly connected to the abutment frame (10) at the other inclined side. The slots (17) and blocks (18) of the four abutment frames (10) correspond to each other.

4. The circuit board photoresist coating apparatus according to claim 3, characterized in that: A limiting plate (19) is fixedly connected to one side of the upper end of the abutment frame (10). A fixing block (20) is fixedly connected to the side of the limiting plate (19) near the inner wall of the box (1). A spring rod (21) is fixedly connected inside the fixing block (20). The end of the spring rod (21) is hemispherical. The limiting plate (19) is flush with one end of the abutment plate (16).

5. The circuit board photoresist coating apparatus according to claim 4, characterized in that: One of the abutment frames (10) is fixedly connected to a connecting plate (22) on the side near the abutment plate (16), and a distance sensor (23) is fixedly connected to the connecting plate (22).

6. The circuit board photoresist coating apparatus according to claim 1, characterized in that: The rotating disk (7) has four fixed support rods (24) on its bottom side. The bottom of the support rod (24) is fitted with a contact ball, and the contact ball contacts the bottom side of the operating cavity of the box (1).

7. The circuit board photoresist coating apparatus according to claim 6, characterized in that: An air pump (25) is fixedly connected to one side of the box (1). A connecting sleeve (26) is fixedly connected to the output end of the air pump (25). A connecting inner tube is inserted into the connecting sleeve (26). A negative pressure ring (27) is fixedly connected to one side of the connecting inner tube. Adsorption holes are evenly opened on the inner side of the negative pressure ring (27).

8. The circuit board photoresist coating apparatus according to claim 7, characterized in that: The bottom side of the negative pressure ring (27) is in contact with a support plate (28), and the support plate (28) is fixedly connected to one side of the operating cavity.

9. The circuit board photoresist coating apparatus according to claim 1, characterized in that: The bottom end of the adjusting disc (5) is threaded with two locking rods (29), the ends of which abut against the bottom end of the moving disc (6).

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