Refrigerating system and control method thereof

Abstract

The invention relates to the technical field of refrigeration, and discloses a refrigeration system which comprises a cooling unit and a refrigeration unit. The cooling unit is configured to provide a refrigerant to the refrigeration unit, and is provided with a first refrigerant inlet and a first refrigerant outlet. The refrigeration unit is configured to perform refrigeration by using the refrigerant provided by the cooling unit, and is provided with a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is communicated with the first refrigerant outlet, and the second refrigerant outlet is communicated with the first refrigerant inlet. In the refrigeration system, the refrigeration unit directly utilizes the low-temperature refrigerant provided by the cooling unit, so that heat exchange refrigeration can be carried out at the heat exchanger, and heat exchange refrigeration can be carried out at the liquid cooling server. In this way, refrigeration can be achieved without the need for a plate heat exchanger in the cold liquid distribution unit to conduct heat exchange in the refrigeration unit. Therefore, a cold liquid distribution unit does not need to be arranged in the refrigerating system, and the deployment cost of the refrigerating system is reduced. The invention further discloses a control method of the refrigerating system.

Description

Technical Field

[0001] This application relates to the field of refrigeration technology, and for example to a refrigeration system and its control method. Background Technology

[0002] Currently, with the improvement of server performance, the heat generated by servers in data centers is also increasing, and the heat dissipation requirements of data centers are also increasing.

[0003] In related technologies, data centers typically employ cooling systems including cold-plate liquid-cooled servers to address heat dissipation issues. However, cold-plate liquid-cooled servers, along with the liquid cooling units within the cooling system, can only dissipate heat from components that generate significant heat (such as the CPU). For components in the server that generate less heat (such as hard drives and power modules), air-cooling units within the cooling system are required for heat dissipation. Furthermore, the cooling system needs to be equipped with a refrigerant distribution unit to allocate the cooling capacity between the liquid cooling units and the air-cooling units. This makes the configuration of the cooling system relatively complex and increases the deployment cost.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this application, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] To provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is given below. This summary is not intended as a general commentary, nor is it intended to identify key / important components or describe the scope of protection of these embodiments, but rather as a prelude to the detailed description that follows.

[0006] This disclosure provides a refrigeration system and its control method, which can simplify the configuration of the refrigeration system and thus reduce the deployment cost of the refrigeration system.

[0007] In a first aspect, embodiments of this disclosure provide a refrigeration system, comprising: a cooling unit and a refrigeration unit; wherein:

[0008] The cooling unit is configured to supply refrigerant to the refrigeration unit and has a first refrigerant inlet and a first refrigerant outlet; the refrigerant pipeline between the first refrigerant inlet and the first refrigerant outlet is equipped with a compressor, a condenser and a refrigerant pump;

[0009] The refrigeration unit is configured to use refrigerant provided by the cooling unit for refrigeration, and is provided with a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is connected to the first refrigerant outlet, and the second refrigerant outlet is connected to the first refrigerant inlet; the refrigerant pipeline between the second refrigerant inlet and the second refrigerant outlet is provided with a first electronic expansion valve, a heat exchanger, and multiple liquid-cooled cabinets connected in parallel; the inlet of the first electronic expansion valve is connected to the second refrigerant inlet through the refrigerant pipeline, and the outlet of the first electronic expansion valve is connected to the inlet of the heat exchanger; the outlet of the heat exchanger is connected to the refrigerant... The refrigerant lines are connected to each liquid-cooled cabinet; each liquid-cooled cabinet includes a distribution manifold, multiple liquid-cooled components, and a gas collection manifold; each liquid-cooled component includes a second electronic expansion valve and a liquid-cooled server, with the outlet of the second electronic expansion valve connected to the inlet of the liquid-cooled server; the inlet of the distribution manifold is connected to the outlet of the heat exchanger via a refrigerant line, each outlet of the distribution manifold is connected to the inlet of the second electronic expansion valve in a liquid-cooled component, each inlet of the gas collection manifold is connected to the outlet of the liquid-cooled server in a liquid-cooled component, and the outlet of the gas collection manifold is connected to the second refrigerant outlet via a refrigerant line.

[0010] Alternatively, the condensing device can be an air-cooled condenser or an evaporative condenser.

[0011] Optionally, the evaporative condenser includes a condenser body, cooling water pipes, a first circulating water pump, a spray device, packing material, and a fan; wherein: the spray device and packing material are disposed inside the condenser body; the cooling water pipes, the first circulating water pump, and the fan are disposed outside the condenser body; one end of the cooling water pipe is connected to the spray device, and the other end is connected to the bottom of the condenser body; the first circulating water pump is disposed in the cooling water pipes and is configured to provide power for the circulation of cooling water.

[0012] Optionally, the condensing device includes a second circulating water pump forming a cooling water circuit, a cooling tower, and a water-cooled condenser; wherein: the water-cooled condenser includes a first branch and a second branch; the first branch is connected to the second circulating water pump and the cooling tower respectively, and the second branch is connected to a refrigerant pipeline; the cooling water in the first branch and the refrigerant in the second branch exchange heat; the cooling tower is configured to provide cooling water to the first branch of the water-cooled condenser; and the second circulating water pump is configured to provide power for the circulation of cooling water.

[0013] Optionally, the outlet of the heat exchanger is provided with a first pressure sensor and a first temperature sensor; the first pressure sensor is configured to detect a first pressure at the outlet of the heat exchanger; the first temperature sensor is configured to detect a first temperature at the outlet of the heat exchanger; wherein, the superheat of the heat exchanger is determined based on the first pressure and the first temperature, and the opening degree of the first electronic expansion valve is adjusted based on the superheat of the heat exchanger.

[0014] Optionally, a temperature and humidity sensor is installed inside the liquid-cooled cabinet; a second pressure sensor and a second temperature sensor are installed at the outlet of the liquid-cooled server; wherein: the temperature and humidity sensor is configured to detect the temperature and humidity inside the liquid-cooled cabinet; the second pressure sensor is configured to detect the second pressure at the outlet of the liquid-cooled server; the second temperature sensor is configured to detect the second temperature at the outlet of the liquid-cooled server; wherein, the dew point temperature inside the liquid-cooled cabinet is determined based on the temperature and humidity inside the liquid-cooled cabinet; the superheat of the liquid-cooled server is determined based on the second pressure and the second temperature; and the opening of the second electronic expansion valve is adjusted based on the dew point temperature inside the liquid-cooled cabinet and the superheat of the liquid-cooled server.

[0015] Optionally, each liquid cooling assembly further includes a quick connector disposed between the outlet of the second electronic expansion valve and the inlet of the liquid cooling server; wherein the quick connector is in a blocking state when the liquid cooling server is disconnected from the refrigerant circuit.

[0016] Optionally, the cooling unit also includes a gas-liquid separator located at the compressor inlet.

[0017] In a second aspect, embodiments of this disclosure provide a control method for a refrigeration system, wherein a first pressure sensor and a first temperature sensor are provided at the outlet of a heat exchanger; the first pressure sensor is configured to detect a first pressure at the outlet of the heat exchanger; the first temperature sensor is configured to detect a first temperature at the outlet of the heat exchanger; the method includes:

[0018] Calculate the evaporation temperature of the refrigerant flowing through the heat exchanger based on the first pressure;

[0019] Calculate the temperature difference between the first temperature and the evaporation temperature of the refrigerant flowing through the heat exchanger, and use it as the superheat of the heat exchanger;

[0020] Adjust the opening of the first electronic expansion valve according to the relationship between the superheat of the heat exchanger and the first target superheat.

[0021] Optionally, a temperature and humidity sensor is installed inside the liquid-cooled cabinet; a second pressure sensor and a second temperature sensor are installed at the outlet of the liquid-cooled server; wherein: the temperature and humidity sensor is configured to detect the temperature and humidity inside the liquid-cooled cabinet; the second pressure sensor is configured to detect the second pressure at the outlet of the liquid-cooled server; the second temperature sensor is configured to detect the first temperature at the outlet of the heat exchanger; the method further includes: calculating the dew point temperature inside the liquid-cooled cabinet based on the temperature and humidity inside the liquid-cooled cabinet; calculating the second evaporation temperature of the refrigerant flowing through the liquid-cooled server based on the second pressure; calculating the temperature difference between the second temperature and the evaporation temperature flowing through the liquid-cooled server as the superheat of the liquid-cooled server; and adjusting the opening of the second electronic expansion valve based on the dew point temperature inside the liquid-cooled cabinet, the superheat of the liquid-cooled server, and the second target superheat.

[0022] The refrigeration system and control method provided in this disclosure can achieve the following technical effects:

[0023] In the cooling unit, the compressor compresses the low-pressure, high-temperature gaseous refrigerant into a high-pressure, high-temperature gaseous refrigerant, which is then sent to the condenser. The high-pressure, high-temperature gaseous refrigerant is condensed into a low-temperature, high-pressure liquid refrigerant. Under the action of the refrigerant pump, the low-temperature, high-pressure liquid refrigerant flows through the first refrigerant outlet into the second refrigerant inlet of the refrigeration unit, and then through the refrigerant pipeline into the first electronic expansion valve for throttling. After throttling, the refrigerant absorbs heat in the heat exchanger and is converted into a medium-temperature refrigerant. The medium-temperature refrigerant flows through the refrigerant pipeline into each liquid-cooled cabinet. The second electronic expansion valve in the liquid-cooled cabinet throttles the medium-temperature refrigerant, which then absorbs heat again in the liquid-cooled server and is converted into a low-pressure, high-temperature refrigerant. The low-pressure, high-temperature refrigerant flows in the refrigerant pipeline, flows through the second refrigerant outlet of the refrigeration unit back to the first refrigerant inlet of the cooling unit, and then flows back to the compressor through the refrigerant pipeline. This completes the refrigeration process of the refrigeration system.

[0024] In this embodiment, the refrigeration unit directly utilizes the cryogenic refrigerant provided by the cooling unit to perform heat exchange and cooling at the heat exchanger and at the liquid-cooled server. Thus, the refrigeration unit can achieve cooling without relying on the plate heat exchanger in the cold liquid distribution unit. Therefore, a cold liquid distribution unit is unnecessary in the refrigeration system, simplifying its configuration and reducing deployment costs.

[0025] The above general description and the description below are exemplary and illustrative only and are not intended to limit this application. Attached Figure Description

[0026] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations and drawings do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are shown as similar elements. The drawings are not to be scaled. And wherein:

[0027] Figure 1 This is an environmental diagram of a traditional refrigeration system;

[0028] Figure 2 This is a schematic diagram of a refrigeration system provided in an embodiment of this disclosure;

[0029] Figure 3 This is a schematic diagram of a cooling unit in a refrigeration system provided in an embodiment of this disclosure;

[0030] Figure 4 This is a schematic diagram of a refrigeration unit in a refrigeration system provided in an embodiment of this disclosure;

[0031] Figure 5 This is a schematic diagram of a liquid cooling cabinet in a refrigeration unit provided in an embodiment of this disclosure;

[0032] Figure 6 This is a schematic diagram of a refrigeration unit provided in an embodiment of this disclosure;

[0033] Figure 7 This is a schematic diagram of another refrigeration unit provided in an embodiment of this disclosure;

[0034] Figure 8 This is a schematic diagram of another refrigeration unit provided in an embodiment of this disclosure;

[0035] Figure 9 This is a schematic diagram of a heat exchanger provided in an embodiment of this disclosure;

[0036] Figure 10 This is a schematic diagram of a liquid cooling cabinet in another refrigeration unit provided in this embodiment of the present disclosure;

[0037] Figure 11 This is a schematic diagram of another refrigeration unit provided in an embodiment of this disclosure.

[0038] Figure label:

[0039] Refrigeration system: 200; Cooling unit: 201; Refrigeration unit: 202;

[0040] First refrigerant inlet: 31; First refrigerant outlet: 32; Compressor: 33; Condenser: 34; Refrigerant pump: 35; Gas-liquid separator: 36; Liquid receiver: 37; First check valve: 38; Second check valve: 39;

[0041] Second refrigerant inlet: 41; Second refrigerant outlet: 42; First electronic expansion valve: 43; Heat exchanger: 44; Liquid-cooled cabinet: 45; Second electronic expansion valve: 46; Liquid-cooled server: 47; Temperature and humidity sensor: 48;

[0042] First pressure sensor: 441; First temperature sensor: 442;

[0043] Liquid manifold: 451; Liquid cooling assembly: 452; Gas manifold: 453; Quick connector: 454; Needle valve: 455;

[0044] Second pressure sensor: 471; Second temperature sensor: 472;

[0045] Condenser body: 71; Cooling water piping: 72; First circulating water pump: 73; Spray device: 74; Packing: 75; Fan: 76;

[0046] Water-cooled condenser: 81; Cooling tower: 82; Second circulating water pump: 83; First branch: 811; Second branch: 812. Detailed Implementation

[0047] To provide a more detailed understanding of the features and technical content of the embodiments of this disclosure, the implementation of the embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. The accompanying drawings are for illustrative purposes only and are not intended to limit the embodiments of this disclosure. In the following technical description, for ease of explanation, several details are used to provide a full understanding of the disclosed embodiments. However, one or more embodiments may still be implemented without these details. In other cases, well-known structures and devices may be simplified in their depiction to simplify the drawings.

[0048] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0049] Unless otherwise stated, the term "multiple" means two or more. The term "multiple units" means two or more units.

[0050] In this embodiment of the disclosure, the character " / " indicates that the objects before and after it are in an "or" relationship. For example, A / B means: A or B.

[0051] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0052] The term "correspondence" can refer to an association or binding relationship. The correspondence between A and B means that there is an association or binding relationship between A and B.

[0053] Currently, with the improvement of server performance, the heat generated by servers in data centers is also increasing, and the heat dissipation requirements of data centers are also increasing.

[0054] Traditionally, data centers typically include cooling systems for cold-plate liquid-cooled servers to address heat dissipation issues. Combined with... Figure 1 The diagram illustrates an environmental schematic of a conventional refrigeration system, which includes a cabinet, supply and return manifolds, a refrigerant distribution unit, and a cold source. Wherein:

[0055] The server rack contains multiple liquid-cooled servers, each with its inlet and outlet connected to the supply and return manifold. The cooling distribution unit includes a first circulating water pump and a heat exchanger. The outlet of the first circulating water pump is connected to the inlet (a) of the heat exchanger. The inlet of the first circulating water pump is connected to the outlet of the supply and return manifold, and the outlet (b) of the heat exchanger is connected to the inlet of the supply and return manifold. The cooling source includes a cooling tower and a second circulating water pump. The outlet of the cooling tower is connected to the inlet of the second circulating water pump. The outlet of the second circulating water pump is connected to the inlet (c) of the heat exchanger, and the outlet (d) of the heat exchanger is connected to the inlet of the cooling tower.

[0056] However, in traditional methods, cold-plate liquid-cooled servers, with their liquid cooling units in the cooling system, can only dissipate heat from components that generate significant heat (such as the CPU). For components in the server that generate less heat (such as hard drives and power modules), air cooling units in the cooling system are required for heat dissipation. Furthermore, a refrigerant distribution unit is needed in the cooling system to allocate cooling capacity between the liquid cooling and air cooling units. This makes the configuration of the cooling system complex and increases its deployment cost.

[0057] Therefore, this disclosure provides a refrigeration system in which the refrigeration unit directly utilizes the low-temperature refrigerant provided by the cooling unit to perform heat exchange and cooling at the heat exchanger and at the liquid-cooled server. This eliminates the need for a plate heat exchanger in the cold liquid distribution unit to achieve cooling. Consequently, a cold liquid distribution unit is not required in the refrigeration system, simplifying its configuration and reducing deployment costs.

[0058] Combination Figure 2 As shown, this embodiment of the present disclosure provides a refrigeration system 200, which includes a cooling unit 201 and a refrigeration unit 202; wherein:

[0059] Combination Figure 3 As shown, the cooling unit 201 is configured to supply refrigerant to the refrigeration unit 202, and is provided with a first refrigerant inlet 31 and a first refrigerant outlet 32. A compressor 33, a condenser 34, and a refrigerant pump 35 are installed in the refrigerant pipeline between the first refrigerant inlet 31 and the first refrigerant outlet 32. Specifically, the outlet of the compressor 33 is connected to the inlet of the condenser 34 via a refrigerant pipeline, the outlet of the condenser 34 is connected to the inlet of the refrigerant pump 35 via a refrigerant pipeline, the outlet of the refrigerant pump 35 is connected to the first refrigerant outlet 32 ​​via a refrigerant pipeline, and the inlet of the compressor 33 is connected to the first refrigerant inlet 31 via a refrigerant pipeline.

[0060] Combination Figure 4As shown, the refrigeration unit 202 is configured to use the refrigerant provided by the cooling unit 201 for refrigeration, and is provided with a second refrigerant inlet 41 and a second refrigerant outlet 42. The second refrigerant inlet 41 is connected to the first refrigerant outlet 32, and the second refrigerant outlet 42 is connected to the first refrigerant inlet 31. The refrigerant pipeline between the second refrigerant inlet 41 and the second refrigerant outlet 42 is provided with a first electronic expansion valve 43, a heat exchanger 44, and multiple liquid-cooled cabinets 45 connected in parallel. The inlet of the first electronic expansion valve 43 is connected to the second refrigerant inlet 41 through a refrigerant pipeline, and the outlet of the first electronic expansion valve 43 is connected to the inlet of the heat exchanger 44. The outlet of the heat exchanger 44 is connected to each liquid-cooled cabinet 45 through a refrigerant pipeline.

[0061] Combination Figure 5 As shown, each liquid-cooled cabinet 45 includes a distribution manifold 451, multiple liquid-cooled components 452, and a gas collection manifold 453. Each liquid-cooled component 452 includes a second electronic expansion valve 46 and a liquid-cooled server 47. The outlet of the second electronic expansion valve 46 is connected to the inlet of the liquid-cooled server 47. The inlet of the distribution manifold 451 is connected to the outlet of the heat exchanger 44 via a refrigerant line. Each outlet of the distribution manifold 451 is connected to the inlet of the second electronic expansion valve 46 in a liquid-cooled component 452. Each inlet of the gas collection manifold 453 is connected to the outlet of the liquid-cooled server 47 in a liquid-cooled component 452. The outlet of the gas collection manifold 453 is connected to a second refrigerant outlet 42 via a refrigerant line.

[0062] In this embodiment, the compressor 33 in the cooling unit 201 compresses the low-pressure, high-temperature gaseous refrigerant into a high-pressure, high-temperature gaseous refrigerant, and sends the high-pressure, high-temperature gaseous refrigerant into the condensing device 34. The high-temperature, high-pressure gaseous refrigerant is then condensed into a low-temperature, high-pressure liquid refrigerant in the condensing device 34. Under the action of the refrigerant pump 35, the low-temperature, high-pressure liquid refrigerant flows into the second refrigerant inlet 41 of the cooling unit 202 through the first refrigerant outlet 32, and then flows into the first electronic expansion valve 43 through the refrigerant pipeline for throttling. After throttling, the refrigerant absorbs heat in the heat exchanger 44 and is converted into a medium-temperature refrigerant. The medium-temperature refrigerant flows into each liquid-cooled cabinet 45 through the refrigerant pipeline. The second electronic expansion valve 46 in the liquid-cooled cabinet 45 throttles the medium-temperature refrigerant, and after throttling, the medium-temperature refrigerant absorbs heat again in the liquid-cooled server 47 and is converted into a low-pressure, high-temperature refrigerant. Low-pressure, high-temperature refrigerant flows within the refrigerant pipeline and returns to the first refrigerant inlet 31 of the cooling unit 201 via the second refrigerant outlet 42 of the refrigeration unit 202. It then flows back to the compressor 33 through the refrigerant pipeline, thus completing the refrigeration process of the refrigeration system.

[0063] Using the refrigeration system provided in this embodiment, the refrigeration unit 202 directly utilizes the low-temperature refrigerant provided by the cooling unit 201 to perform heat exchange and cooling at the heat exchanger 44 and at the liquid-cooled server 47. Thus, the refrigeration unit 202 does not require a plate heat exchanger in the cold liquid distribution unit to achieve cooling. Therefore, a cold liquid distribution unit is not needed in the refrigeration system, simplifying its configuration and reducing deployment costs.

[0064] Optionally, in this embodiment of the disclosure, the refrigerant flowing in the refrigerant pipeline is Freon.

[0065] The refrigerants used in cold-plate liquid-cooled servers are typically deionized water, ethylene glycol, and propylene glycol. When using deionized water, the refrigerant piping is prone to corrosion after prolonged use. Corroded piping can leak deionized water, which is difficult to evaporate and can remain inside the server for extended periods, potentially causing electrical conductivity and damage. When using flammable refrigerants like ethylene glycol or propylene glycol, leaks from corroded piping can easily ignite inside the server, damaging it and potentially causing a fire. Therefore, this embodiment uses Freon, a non-flammable, non-explosive, non-conductive, and easily volatile refrigerant, to improve the safety of the liquid-cooled server 47.

[0066] Optionally, in this embodiment of the present disclosure, the condensing device 34 can be an air-cooled condenser or an evaporative condenser. Specifically, when the condensing device 34 is an air-cooled condenser, the cooling unit 201 can refer to... Figure 6 As shown.

[0067] Alternatively, if the condensing device 34 is an evaporative condenser, the cooling unit 201 may refer to Figure 7 As shown. The evaporative condenser includes a condenser body 71, cooling water pipes 72, a first circulating water pump 73, a spray device 74, packing material 75, and a fan 76. The spray device 74 and packing material 75 are located inside the condenser body 71. The cooling water pipes 72, the first circulating water pump 73, and the fan 74 are located outside the condenser body 71. One end of the cooling water pipes 72 is connected to the spray device 74, and the other end is connected to the bottom of the condenser body 71. The first circulating water pump 73 is located in the cooling water pipes 72 and is configured to provide power for the circulation of cooling water.

[0068] In this embodiment, the high-temperature, high-pressure gaseous refrigerant discharged from the compressor 33 flows into the inlet of the evaporative condenser, exchanges heat with the cooling water sprayed by the spray device 74, and is converted into a low-temperature, high-pressure liquid refrigerant, which then flows out through the outlet of the evaporative condenser. The cooling water inside the evaporative cooler, after heat exchange, becomes high-temperature cooling water. When this high-temperature cooling water accumulates in the packing 75, it is cooled by the high-speed airflow under the action of the fan 76, converting it into low-temperature cooling water. This low-temperature cooling water flows into the cooling water pipe 72 at the bottom of the condenser body 71. The first circulating water pump 73 installed on the cooling water pipe 72 causes the low-temperature cooling water to flow to the spray device 74. Thus, the cooling of the high-temperature, high-pressure gaseous refrigerant discharged from the compressor 33 is completed.

[0069] Optionally, in this embodiment of the present disclosure, the condensing device 34 can also be a hybrid condensing device. Specifically, when the condensing device 34 is a hybrid condensing device, the cooling unit 201 can refer to... Figure 8 As shown. The hybrid condensation device includes a water-cooled condenser 81, a cooling tower 82, and a second circulating water pump 83. The water-cooled condenser 81 includes a first branch 811 and a second branch 812. The first branch 811 is connected to the second circulating water pump 83 and the cooling tower 82, respectively, and the second branch 812 is connected to a refrigerant pipeline; the cooling water in the first branch 811 and the refrigerant in the second branch 812 exchange heat. The cooling tower 82 is configured to supply cooling water to the first branch 811 of the water-cooled condenser 81. The second circulating water pump 83 is configured to provide power for the circulation of the cooling water.

[0070] In this embodiment, the high-temperature, high-pressure gaseous refrigerant discharged from the compressor 33 flows through the second branch 812 and exchanges heat with the cooling water in the first branch 811, transforming it into a low-temperature, high-pressure liquid refrigerant. The cooling water in the first branch 811 is then converted into high-temperature cooling water, which, under the action of the second circulating water pump 83, flows back to the cooling tower 82 for cooling. This completes the cooling of the high-temperature, high-pressure gaseous refrigerant discharged from the compressor 33.

[0071] Optionally, combined Figure 9 As shown in this embodiment, the outlet of the heat exchanger 44 is provided with a first pressure sensor 441 and a first temperature sensor 442. The first pressure sensor 441 is configured to detect a first pressure at the outlet of the heat exchanger 44. The first temperature sensor 442 is configured to detect a first temperature at the outlet of the heat exchanger 44. Based on the first pressure and the first temperature, the superheat of the heat exchanger 44 is determined, and the opening degree of the first electronic expansion valve 43 is adjusted according to the superheat of the heat exchanger 44.

[0072] In this embodiment, the process of adjusting the opening of the first electronic expansion valve 43 can be as follows: Calculate the evaporation temperature of the refrigerant flowing through the heat exchanger 44 based on the first pressure. Calculate the temperature difference between the first temperature and the evaporation temperature of the refrigerant flowing through the heat exchanger 44, which is taken as the superheat of the heat exchanger 44. Adjust the opening of the first electronic expansion valve 43 according to the relationship between the superheat of the heat exchanger 44 and the first target superheat. Specifically, when the superheat of the heat exchanger 44 is greater than the first target superheat, increase the opening of the first electronic expansion valve 43. When the superheat of the heat exchanger 44 is less than the first target superheat, decrease the opening of the first electronic expansion valve 43. When the superheat of the heat exchanger 44 is equal to the first target superheat, keep the opening of the first electronic expansion valve 43 unchanged. In this way, by adjusting the opening of the first electronic expansion valve 43, the superheat of the heat exchanger 44 can meet the requirement of the first target superheat. Therefore, the cooling effect of the heat exchanger 44 meets the user's needs.

[0073] Optionally, the first target superheat value ranges from 0°C to 2°C.

[0074] Optionally, combined Figure 10 As shown in this embodiment, a temperature and humidity sensor 48 is installed inside the liquid-cooled cabinet 45. A second pressure sensor 471 and a second temperature sensor 472 are installed at the outlet of the liquid-cooled server 47. Specifically: the temperature and humidity sensor 472 is configured to detect the temperature and humidity inside the liquid-cooled cabinet 45; the second pressure sensor 471 is configured to detect the second pressure at the outlet of the liquid-cooled server 47; and the second temperature sensor 472 is configured to detect the second temperature at the outlet of the liquid-cooled server 47. The dew point temperature inside the liquid-cooled cabinet 45 is determined based on the temperature and humidity inside the liquid-cooled cabinet 45. The superheat of the liquid-cooled server 47 is determined based on the second pressure and the second temperature. Furthermore, the opening degree of the second electronic expansion valve 46 is adjusted based on the dew point temperature inside the liquid-cooled cabinet 45 and the superheat of the liquid-cooled server 47.

[0075] In this embodiment, the process of adjusting the opening of the second electronic expansion valve 46 can be as follows: Calculate the dew point temperature inside the liquid-cooled cabinet 45 based on the temperature and humidity inside the liquid-cooled cabinet 45. Calculate the second evaporation temperature of the refrigerant flowing through the liquid-cooled server 47 based on the second pressure. Calculate the temperature difference between the second temperature and the evaporation temperature flowing through the liquid-cooled server 47 as the superheat of the liquid-cooled server 47. Adjust the opening of the second electronic expansion valve 46 based on the dew point temperature inside the liquid-cooled cabinet 45, the superheat of the liquid-cooled server 47, and the second target superheat.

[0076] Specifically, when the evaporation temperature of the liquid-cooled server 47 is lower than the dew point temperature, the opening of the second electronic expansion valve 46 is increased to raise the evaporation temperature of the liquid-cooled server 47 above the dew point temperature, thereby reducing condensation or even frost formation on the liquid-cooled server 47 and thus lowering its failure rate. When the evaporation temperature of the liquid-cooled server 47 is higher than the dew point temperature and also higher than the second target superheat, the opening of the second electronic expansion valve 46 is increased to raise the evaporation temperature of the liquid-cooled server 47, thereby reducing its superheat. When the evaporation temperature of the liquid-cooled server 47 is higher than the dew point temperature but lower than the second target superheat, the adjustment amount of the opening of the second electronic expansion valve 46 can be determined based on the temperature difference between the evaporation temperature and the dew point temperature. Based on this adjustment amount, the opening of the second electronic expansion valve 46 is then reduced to lower the evaporation temperature of the liquid-cooled server 47, thus ensuring that the evaporation temperature of the liquid-cooled server 47 remains above the dew point temperature while appropriately reducing its superheat. This reduces the occurrence of condensation or even frost on the liquid-cooled server 47, thereby lowering the failure rate of the liquid-cooled server 47.

[0077] Optionally, the second target superheat value ranges from 10°C to 15°C.

[0078] Optionally, combined Figure 10 As shown, each liquid cooling assembly 452 also includes a quick connector 454 and a needle valve 455. The quick connector 454 is located between the outlet of the second electronic expansion valve 46 and the inlet of the liquid cooling server 47. The needle valve 455 is located between the quick connector 454 and the liquid cooling server 47.

[0079] In this embodiment, when the liquid-cooled server 47 is disconnected from the refrigerant circuit, the quick connector 454 is in a blocked state. This facilitates the disassembly or replacement of the liquid-cooled server 47 within the liquid-cooled cabinet 45, and the blocked state of the quick connector 454 during disassembly or replacement prevents refrigerant leakage. Furthermore, before installing the liquid-cooled server 47 into the liquid-cooled cabinet 45, or while the liquid-cooled server 47 is in use within the liquid-cooled cabinet 45, the user can use the needle valve 455 to perform a vacuuming operation on the refrigerant piping inside the liquid-cooled server 47. This prevents air from mixing into the refrigerant, thereby preventing damage to the compressor 33 caused by air intake during the cooling process of the refrigeration system.

[0080] Optionally, combined Figure 11As shown, the cooling unit 201 also includes a gas-liquid separator 36, a liquid receiver 37, a first check valve 38, and a second check valve 39. The gas-liquid separator 36 is located at the inlet of the compressor 33. The liquid receiver 37 is located in the refrigerant line between the condensing unit 34 and the refrigerant pump 35. The first check valve 38 is located in the refrigerant line between the compressor 33 and the condensing unit 34. The second check valve 39 is connected in parallel with the compressor 33 and the gas-liquid separator 36 via the refrigerant line; the inlet of the second check valve 39 is connected to the inlet of the gas-liquid separator 36, and the outlet of the second check valve 39 is connected to the outlet of the compressor 33.

[0081] In this embodiment, before the refrigerant flows back to the compressor 33, it passes through a gas-liquid separator 36 to separate the gaseous and liquid refrigerant, preventing the liquid refrigerant from flowing back into the compressor 33, thus preventing liquid slugging and reducing the compressor's failure rate. A first one-way valve 38 is installed at the outlet of the compressor 33 to prevent the refrigerant discharged from the compressor 33 from flowing back into the compressor 33, i.e., the liquid refrigerant condensed by the condenser 34 cannot flow back into the compressor 33, reducing the possibility of compressor damage. Furthermore, a liquid receiver 37 is used to store liquid refrigerant, allowing refrigerant to be added to the refrigerant line when the refrigerant pressure or flow rate is low. This ensures the refrigeration efficiency of the entire refrigeration system.

[0082] The foregoing description and accompanying drawings fully illustrate embodiments of this disclosure to enable those skilled in the art to practice them. Other embodiments may include structural, logical, electrical, procedural, and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included in or replace parts and features of other embodiments. Moreover, the terminology used in this application is for describing embodiments only and is not intended to limit the claims. As used in the description of embodiments and claims, the singular forms “a,” “an,” and “the” are intended to equally include the plural forms unless the context clearly indicates otherwise. Similarly, the term “and / or” as used in this application means including one or more of the associated listed items and all possible combinations thereof. Additionally, when used in this application, the term "comprise" and its variations "comprises" and / or "comprising" refer to the presence of stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. Without further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the process, method, or apparatus that includes said element. In this document, each embodiment may focus on the differences from other embodiments, and similar or identical parts between embodiments can be referred to mutually. For methods, products, etc., disclosed in the embodiments, if they correspond to the method section disclosed in the embodiments, the relevant parts can be referred to the description of the method section.

[0083] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of this disclosure. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0084] The methods and products (including but not limited to devices and equipment) disclosed in the embodiments herein can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units may be merely a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the shown or discussed units may be through some interfaces, and the indirect coupling or communication connection between devices or units may be electrical, mechanical, or other forms. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of the units may be selected to implement this embodiment according to actual needs. Furthermore, the functional units in the embodiments of this disclosure may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0085] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than that shown in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. In the descriptions corresponding to the flowcharts and block diagrams in the accompanying drawings, the operations or steps corresponding to different blocks may also occur in a different order than disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. Each block in a block diagram and / or flowchart, and combinations of blocks in a block diagram and / or flowchart, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

Claims

1. A refrigeration system, characterized in that, include: Cooling unit and refrigeration unit; wherein: The cooling unit is configured to supply refrigerant to the refrigeration unit and has a first refrigerant inlet and a first refrigerant outlet; the refrigerant pipeline between the first refrigerant inlet and the first refrigerant outlet is equipped with a compressor, a condenser and a refrigerant pump; The refrigeration unit is configured to use refrigerant provided by the cooling unit for refrigeration, and is provided with a second refrigerant inlet and a second refrigerant outlet; the second refrigerant inlet is connected to the first refrigerant outlet, and the second refrigerant outlet is connected to the first refrigerant inlet; the refrigerant pipeline between the second refrigerant inlet and the second refrigerant outlet is provided with a first electronic expansion valve, a heat exchanger, and multiple liquid-cooled cabinets connected in parallel; the inlet of the first electronic expansion valve is connected to the second refrigerant inlet through the refrigerant pipeline, and the outlet of the first electronic expansion valve is connected to the inlet of the heat exchanger; the outlet of the heat exchanger is connected to the refrigerant... The refrigerant lines are connected to each liquid-cooled cabinet; each liquid-cooled cabinet includes a distribution manifold, multiple liquid-cooled components, and a gas collection manifold; each liquid-cooled component includes a second electronic expansion valve and a liquid-cooled server, with the outlet of the second electronic expansion valve connected to the inlet of the liquid-cooled server; the inlet of the distribution manifold is connected to the outlet of the heat exchanger via a refrigerant line, each outlet of the distribution manifold is connected to the inlet of the second electronic expansion valve in a liquid-cooled component, each inlet of the gas collection manifold is connected to the outlet of the liquid-cooled server in a liquid-cooled component, and the outlet of the gas collection manifold is connected to the second refrigerant outlet via a refrigerant line.

2. The system according to claim 1, characterized in that, The condensing device is either an air-cooled condenser or an evaporative condenser.

3. The system according to claim 2, characterized in that, An evaporative condenser includes a condenser body, cooling water piping, a first circulating water pump, a spray system, packing material, and a fan; wherein: The spray device and packing are located inside the condenser body; the cooling water pipeline, the first circulating water pump and the fan are located outside the condenser body; one end of the cooling water pipeline is connected to the spray device and the other end is connected to the bottom of the condenser body; the first circulating water pump is located in the cooling water pipeline and is configured to provide power for the circulation of cooling water.

4. The system according to claim 1, characterized in that, The condensation unit includes a second circulating water pump forming a cooling water circuit, a cooling tower, and a water-cooled condenser; wherein: The water-cooled condenser includes a first branch and a second branch; the first branch is connected to the second circulating water pump and the cooling tower respectively, and the second branch is connected to the refrigerant pipeline; the cooling water in the first branch and the refrigerant in the second branch exchange heat. The cooling tower is configured to supply cooling water to the first branch of the water-cooled condenser; The second circulating water pump is configured to provide power for the circulation of cooling water.

5. The system according to claim 1, characterized in that, The heat exchanger outlet is equipped with a first pressure sensor and a first temperature sensor; The first pressure sensor is configured to detect the first pressure at the heat exchanger outlet; The first temperature sensor is configured to detect the first temperature at the heat exchanger outlet. Specifically, the superheat of the heat exchanger is determined based on the first pressure and the first temperature, and the opening of the first electronic expansion valve is adjusted according to the superheat of the heat exchanger.

6. The system according to claim 1, characterized in that, Temperature and humidity sensors are installed inside the liquid-cooled cabinet; a second pressure sensor and a second temperature sensor are installed at the outlet of the liquid-cooled server; wherein: Temperature and humidity sensors are configured to detect the temperature and humidity inside the liquid-cooled cabinet; The second pressure sensor is configured to detect the second pressure at the outlet of the liquid-cooled server. The second temperature sensor is configured to detect the second temperature at the outlet of the liquid-cooled server. Specifically, the dew point temperature inside the liquid-cooled cabinet is determined based on the temperature and humidity inside the cabinet; the overheating degree of the liquid-cooled server is determined based on the second pressure and the second temperature; and the opening degree of the second electronic expansion valve is adjusted based on the dew point temperature inside the liquid-cooled cabinet and the overheating degree of the liquid-cooled server.

7. The system according to claim 1, characterized in that, Each liquid cooling assembly also includes: A quick connector is located between the outlet of the second electronic expansion valve and the inlet of the liquid-cooled server; In the event that the liquid-cooled server is disconnected from the refrigerant circuit, the quick connector will be in a blocked state.

8. The system according to claim 1, characterized in that, The cooling unit also includes: The gas-liquid separator is located at the inlet of the compressor.

9. A control method for a refrigeration system as described in claim 1, characterized in that, The heat exchanger outlet is equipped with a first pressure sensor and a first temperature sensor; the first pressure sensor is configured to detect the first pressure at the heat exchanger outlet. A first temperature sensor is configured to detect a first temperature at the heat exchanger outlet; the method includes: Calculate the evaporation temperature of the refrigerant flowing through the heat exchanger based on the first pressure; Calculate the temperature difference between the first temperature and the evaporation temperature of the refrigerant flowing through the heat exchanger, and use it as the superheat of the heat exchanger; Adjust the opening of the first electronic expansion valve according to the relationship between the superheat of the heat exchanger and the first target superheat.

10. The method according to claim 9, characterized in that, A temperature and humidity sensor is installed inside the liquid-cooled cabinet; a second pressure sensor and a second temperature sensor are installed at the outlet of the liquid-cooled server; wherein: the temperature and humidity sensor is configured to detect the temperature and humidity inside the liquid-cooled cabinet; the second pressure sensor is configured to detect the second pressure at the outlet of the liquid-cooled server; the second temperature sensor is configured to detect the first temperature at the outlet of the heat exchanger; the method further includes: Calculate the dew point temperature inside the liquid cooling cabinet based on the temperature and humidity inside the cabinet; Calculate the second evaporation temperature of the refrigerant flowing through the liquid-cooled server based on the second pressure; The temperature difference between the second temperature and the evaporation temperature flowing through the liquid-cooled server is calculated as the superheat of the liquid-cooled server. Adjust the opening of the second electronic expansion valve based on the dew point temperature inside the liquid-cooled cabinet, the overheating of the liquid-cooled server, and the second target overheating.

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