Composite electronic component and array

Abstract

The invention relates to a composite electronic component and an array. The composite electronic component comprises a plurality of solid capacitors and a plurality of solid inductors which are stacked, the solid capacitor comprises a plurality of stacked first ceramic layers; an inner conductive layer or an outer conductive layer is arranged between the adjacent first ceramic layers; the inner conductive layers and the outer conductive layers are alternately arranged in sequence along the thickness direction of the solid capacitor; the first ceramic layer is provided with an electric conductor penetrating through the first ceramic layer in the thickness direction. The adjacent conductors in the thickness direction of the solid capacitor are electrically connected with each other; the conductor is electrically connected with the inner conducting layer and is insulated from the outer conducting layer; the solid inductor comprises a plurality of stacked second ceramic layers and connecting conductors which are connected with the second ceramic layers; the plurality of connecting conductors constitute a coil conductor. According to the invention, various composite electronic components can be formed through the stacked solid capacitors and solid inductors; through the special structure of the solid capacitor and the solid inductor, production and manufacturing of the composite electronic component are facilitated, and the size can be effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of capacitor technology, and more particularly to a composite electronic component and array. Background Technology

[0002] Composite electronic components composed of capacitors and inductors come in various forms. However, existing technologies that directly assemble capacitors and inductors into composite electronic components suffer from large size issues. While some integrated structures achieve functional and structural integration of capacitors and inductors, changes in their internal structure (distribution of conductive layers) prevent them from being directly manufactured using existing capacitor and inductor production equipment, resulting in inefficient resource utilization. How to achieve direct assembly of capacitors and inductors into composite electronic components while effectively controlling product size is a technical problem that needs to be solved in this field.

[0003] Multilayer ceramic through-hole capacitors are based on multilayer surface-mount capacitor (MLCC) technology, but with a modified internal structure. They are manufactured similarly to MLCCs because the ceramic dielectric layers are interleaved with noble metal electrodes, forming a monolithic structure. Holes are then drilled in the ceramic body to create contacts with the inner or outer electrodes. Capacitance is formed between the holes and the outer edges. In the case of planar arrays, capacitance is formed between each hole and the outer edge. The capacitance characteristics of each hole will vary within certain limits.

[0004] Single-hole devices are commonly referred to as "disks," while multi-hole devices are called planar arrays. The manufacturing process of a single-hole disc-shaped multilayer ceramic capacitor is roughly as follows: slurry preparation, tape casting, screen printing, lamination, shaping, high-temperature sintering, end sealing, end firing, and surface treatment. After a series of processes, a disc-shaped multilayer ceramic capacitor composed of a ferroelectric ceramic body and metal electrodes is produced. The materials used are generally BaTiO3 ceramic dielectric and PdAg or Ni internal electrodes. A typical disc-shaped multilayer ceramic capacitor structure includes a ferroelectric ceramic body, internally staggered metal electrodes, and a centrally located inner hole for fixing the guide pins.

[0005] For several years, it has been recognized that soldering copper or copper alloy leads to the internal holes of a disc-shaped ceramic capacitor can induce cracks within the ceramic structure. The cracks produced by this process are called "longbow" or "comma" cracks because they have such a distinctive shape when viewed from either a side or top cross-section.

[0006] These cracks can be benign, but they can also lead to complete electrical failure, depending on whether they pass through the electrode-covered area. Perhaps more worrying is that cracks may originate during welding but only spread during further processing or use, causing the capacitor to fail during operation.

[0007] Capacitor failures tend to be short circuits. If the power supply is strong enough, the component can become extremely hot and potentially a source of combustion.

[0008] The materials used for ceramics and pins are typically fixed and cannot be changed. Therefore, through continuous experimentation, existing technologies have shown that using high-lead flux can effectively prevent soldering cracks. Commonly used high-lead fluxes are 50Pb / 50In, 95Pb / 5In, and 93.5Pb / 5Sn / 1.5Ag. High-lead solder is used because its high ductility prevents excessive force from being transferred to the ceramic dielectric material, thus avoiding cracking in the short term. Although high-lead, ductile soldering materials are used, after repeated rapid temperature changes (high and low temperatures) or under stress in harsh external environments, the ferroelectric ceramic body of disc-shaped multilayer ceramic capacitors will develop cracks of varying degrees, especially at the solder joints between the holes and pins. Furthermore, the use of high-lead solder is clearly detrimental to the lead-free process of electronic products and causes serious environmental pollution.

[0009] The core function of the guide pin is to conduct electricity to the multiple spaced internal electrodes in the middle of the disc-shaped multilayer ceramic capacitor, so as to realize the function of the capacitor. As can be seen from the aforementioned manufacturing process, the existing multilayer stacking production method of feedthrough capacitors is difficult to achieve conduction between the upper and lower layers. Therefore, a feedthrough structure is required in conjunction with the guide pin to realize the electrical connection of the internal electrodes, and a welding process is introduced, which will lead to various risks such as poor welding and cracks. How to ensure the functional integrity of the feedthrough capacitor used in composite electronic components and avoid welding cracks or poor welding is a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0010] To address the aforementioned problems in the prior art, the present invention provides a composite electronic component and array.

[0011] To achieve the above objectives, the main technical solutions adopted by the present invention include:

[0012] A composite electronic component includes a plurality of stacked solid capacitors and a plurality of solid inductors; the solid capacitors include multiple stacked first ceramic layers; an inner conductive layer or an outer conductive layer is provided between adjacent first ceramic layers; the inner conductive layer and the outer conductive layer are alternately arranged along the thickness direction of the solid capacitor; a conductor is provided on the first ceramic layer through the thickness direction of the first ceramic layer; adjacent conductors are electrically connected to each other along the thickness direction of the solid capacitor; the conductor is electrically connected to the inner conductive layer and forms an insulation between itself and the outer conductive layer; the solid inductors include multiple stacked second ceramic layers and connecting conductors disposed in relation to the second ceramic layers; a plurality of the connecting conductors constitute a coil conductor, which is connected in series within the range of the multiple second ceramic layers and extends in a coil shape.

[0013] In one embodiment of the present invention, a conductive connecting layer is provided at a distance in the middle of the outer conductive layer; the conductive connecting layer is electrically connected to a conductive body; an insulating portion is provided between the outer conductive layer and the conductive connecting layer to form insulation between the outer conductive layer and the conductive connecting layer.

[0014] In one embodiment of the present invention, the solid capacitor is cylindrical; the first ceramic layer is circular; the inner conductive layer is located in the middle of the first ceramic layer and has a diameter of R1; the outer conductive layer is annular with the outer large circle having a diameter equivalent to that of the first ceramic layer, and the inner small circle having a diameter of R2; the insulating portion is annular with the outer large circle having a diameter of R2 and the inner small circle having a diameter of R3; the conductive connecting layer is located in the middle of the first ceramic layer and has a diameter of R3; satisfying R1 > R2 > R3.

[0015] In one embodiment of the present invention, a plurality of through holes are provided in the middle of the first ceramic layer along its thickness direction; a conductor is provided in the through holes; the through holes are located in the middle of the conductor connecting layer.

[0016] In one embodiment of the present invention, the connecting conductor includes a surface conductive layer disposed on the surface of the second ceramic layer and a second conductor extending through the thickness direction of the second ceramic layer.

[0017] In one embodiment of the present invention, the solid capacitor has an outer conductor layer electrically connected to a conductor on the outside of the first ceramic layer located at the end; the solid inductor has a second outer conductor layer electrically connected to a second conductor on the outside of the second ceramic layer located at the end.

[0018] In one embodiment of the present invention, the solid capacitor comprises eight stacked first ceramic layers; the solid inductor comprises eight stacked second ceramic layers.

[0019] A composite electronic component array includes a plurality of the aforementioned composite electronic components arranged in an array.

[0020] A composite electronic component array includes a plurality of stacked solid capacitor arrays and a plurality of solid inductor arrays; the solid capacitor array includes multiple stacked first ceramic layers; an array of inner conductive layers or outer conductive layers are provided between adjacent first ceramic layers; the inner conductive layers and outer conductive layers are alternately arranged along the thickness direction of the solid capacitor array; a conductor is provided on the first ceramic layer through the thickness direction of the first ceramic layer; adjacent conductors are electrically connected to each other along the thickness direction of the solid capacitor array; the conductor is electrically connected to the inner conductive layer and forms an insulation between itself and the outer conductive layer; the solid inductor array includes multiple stacked second ceramic layers and an array of connecting conductors connected to the second ceramic layers; a plurality of adjacent connecting conductors along the thickness direction of the solid inductor array constitute a coil conductor, which is connected in series within the range of the multiple second ceramic layers and extends in a coil shape.

[0021] In one embodiment of the present invention, a conductive connecting layer is provided at a distance in the middle of the outer conductive layer; the conductive connecting layer is electrically connected to a conductive body; an insulating portion is provided between the outer conductive layer and the conductive connecting layer to form insulation between the outer conductive layer and the conductive connecting layer; a plurality of through holes are provided in the middle of the first ceramic layer along its thickness direction; a conductive body is provided in the through holes; the through holes are located in the middle of the conductive connecting layer; an external conductor layer electrically connected to a conductive body is provided on the outer side of the first ceramic layer at the end of the solid capacitor array; the connecting conductor includes a surface conductive layer disposed on the surface of the second ceramic layer and a second conductive body penetrating in the thickness direction of the second ceramic layer; a second external conductor layer electrically connected to a second conductive body is provided on the outer side of the second ceramic layer at the end of the solid inductor array; the solid capacitor array is electrically connected to the second external conductor layer of the solid inductor array through the external conductor layer.

[0022] The beneficial effects of this invention are: various composite electronic components can be constructed by stacking solid capacitors and solid inductors; the special structure of solid capacitors and solid inductors facilitates the production of composite electronic components, effectively reducing size and avoiding various defects that may occur during soldering in existing production technologies. Furthermore, solid capacitors and solid inductors can be used separately, and the production of composite electronic components can rely entirely on the stacking of ceramic layers of solid capacitors and solid inductors, effectively utilizing resources and reducing costs.

[0023] The main function of the conductor penetrating the first ceramic layer in the thickness direction is to achieve electrical connection between adjacent stacked first ceramic layers. When multiple conductors are connected, it achieves the same function as the lead in a feedthrough capacitor in the prior art. However, the structure of this invention can achieve an integrated structure, simplifying the processing flow and directly omitting the lead, thus eliminating the need for welding and preventing welding cracks at the source. The through-hole is located in the middle of the conductive connecting layer, so that the conductive connecting layer can be printed simultaneously when the outer conductive layer is printed on the first ceramic layer, and the through-hole in the middle of the first ceramic layer can be filled to form a conductor, effectively reducing processing steps. By increasing the conductive connecting layer, the contact area can also be increased. When adjacent first ceramic layers are stacked, adjacent conductors along the thickness direction of the first ceramic layer can achieve better mutual electrical connection. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a first embodiment of the composite electronic component of the present invention;

[0026] Figure 2 This is a schematic diagram of the structure of the composite electronic component of the present invention in Embodiment 2;

[0027] Figure 3 This is a schematic diagram of the structure of the composite electronic component of the present invention in Embodiment 3;

[0028] Figure 4 Front view of the solid capacitor of this invention;

[0029] Figure 5 yes Figure 4 AA section diagram;

[0030] Figure 6 yes Figure 5 Middle BB section view;

[0031] Figure 7 This is a front view of the solid capacitor with the hidden line visible in the present invention;

[0032] Figure 8 This is a schematic diagram of the solid capacitor array structure of the present invention;

[0033] Figure 9 This is a front view of the solid capacitor array of the present invention with the hidden lines visible.

[0034] Figure 10 This is a front view of the solid inductor of the present invention;

[0035] Figure 11 yes Figure 10 C-section view;

[0036] Figure 12 yes Figure 10 Cross-sectional view of DD;

[0037] Figure 13 This is a perspective view of the solid inductor hidden wire of the present invention in a visible state;

[0038] Figure 14 This is a top view of the coil conductor of the solid inductor of the present invention across multiple ceramic layers.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1. Substrate; 2. Composite electronic component; 100. Solid capacitor; 101. Through-hole; 102. Conductor; 10. First ceramic layer; 11. First ceramic layer; 12. First ceramic layer; 13. First ceramic layer; 14. First ceramic layer; 15. First ceramic layer; 16. First ceramic layer; 17. First ceramic layer; 18. First ceramic layer; 20. Inner conductive layer; 30. Outer conductive layer; 40. Conductor connection layer; 50. Insulating part; 60. External conductor Layer; 200, Solid inductor; 201, Second through-hole; 210, Second ceramic layer; 211, Second ceramic layer; 212, Second ceramic layer; 213, Second ceramic layer; 214, Second ceramic layer; 215, Second ceramic layer; 216, Second ceramic layer; 217, Second ceramic layer; 218, Second ceramic layer; 220, Connecting conductor; 221, Surface conductive layer; 222, Second conductor; 230, Coil conductor; 240, Second outer conductor layer. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0042] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0043] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0044] Example 1, as Figure 1 As shown, a composite electronic component includes a plurality of stacked solid capacitors and a plurality of solid inductors; preferably, it includes a stacked solid capacitor and a solid inductor, thereby constituting an LC-type composite electronic component.

[0045] Example 2, as Figure 2 As shown, it includes a solid capacitor, a solid inductor, and a solid capacitor stacked sequentially from bottom to top, thus forming a π-type composite electronic component.

[0046] Example 3, as Figure 3 As shown, it includes a solid inductor, a solid capacitor, and a solid inductor stacked sequentially from bottom to top, thus forming a T-shaped composite electronic component.

[0047] Specifically, the solid capacitor 100 includes multiple stacked first ceramic layers 10; an inner conductive layer 20 or an outer conductive layer 30 is provided between adjacent first ceramic layers 10; the inner conductive layer 20 and the outer conductive layer 30 are alternately arranged along the thickness direction of the solid capacitor 100; a conductive body 102 is provided on the first ceramic layer 10 and extends through it in the thickness direction; adjacent conductive bodies 102 are electrically connected to each other along the thickness direction of the solid capacitor 100; the conductive body 102 is electrically connected to the inner conductive layer 20 and forms an insulation between itself and the outer conductive layer 30. The thickness direction of the solid capacitor 100 participates in... Figure 4 The up and down directions in the middle.

[0048] The first ceramic layer 10 is, for example, composed of BaTiO3 ceramic dielectric or ferrite ceramic. As a ferrite ceramic, for example, ferrite ceramics composed of Fe-Ni-Zn-Cu, Fe-Zn-Cu, or Fe-Mn-Zn systems can be used. Furthermore, all of the first ceramic layers 10 can be composed of ferrite ceramic, or only a portion of the first ceramic layers 10 can be composed of ferrite ceramic, or the other first ceramic layers 10 can be composed of dielectric ceramic or insulating ceramic. The inner conductive layer 20 or the outer conductive layer 30 can be a layered conductive layer made of PdAg or Ni, and the inner conductive layer 20 or the outer conductive layer 30 corresponds to the inner and outer electrodes of the solid capacitor 100. Alternatively, the inner conductive layer 20 or the outer conductive layer 30 can be formed by printing a conductive paste layer on the first ceramic layer 10 to create an unsintered inner conductive layer 20 or outer conductive layer 30. For example, a conductive paste can be formed by dispersing metal powders such as Ag, Ag-Pd, Ag-Pt, Cu, Au, Pt, and Al as the main components of the conductive material in an organic excipient. The inner conductive layer 20 and the outer conductive layer 30 are alternately arranged along the thickness direction of the solid capacitor 100. The main function of the conductor 102 that penetrates the first ceramic layer 10 in the thickness direction is to realize the electrical connection between adjacent stacked first ceramic layers 10. When multiple conductors 102 are connected, they achieve the same function as the lead of the feedthrough capacitor in the prior art. The structure of the present invention can realize an integrated structure, simplify the processing flow, directly omit the lead, and thus eliminate the need for welding process, thereby eliminating the problem of welding cracks from the root.

[0049] See Figure 4 The structure is illustrated using an eight-layer stack. An inner conductive layer 20 is disposed between the first ceramic layer 11 and the first ceramic layer 12. Preferably, the inner conductive layer 20 is disposed on the end face of the first ceramic layer 11 near the first ceramic layer 12, for example, by printing onto the first ceramic layer 11. In one embodiment, the conductor 102 can be made of the same material as the inner conductive layer 20. Therefore, the conductor 102 penetrating the middle of the first ceramic layer 11 can be formed in the same process as printing the inner conductive layer. Figure 5 As shown, a plurality of through holes 101 can be provided in the middle of the first ceramic layer 11; when the inner conductive layer 20 is printed, conductive paste can also be filled in the through holes 101 to form a conductor 102.

[0050] Furthermore, an external conductive layer 30 is disposed between the first ceramic layer 12 and the first ceramic layer 13. Preferably, the external conductive layer 30 is disposed on the end face of the first ceramic layer 12 near the first ceramic layer 13, for example, by printing on the first ceramic layer 12. Figure 6As shown, the first ceramic layer 12 also has several through holes 101 in the middle, and the conductive paste is filled in the through holes 101 to form a conductor 102. When the first ceramic layer 11 and the first ceramic layer 12 are stacked, the conductors 102 in the first ceramic layer 11 and the first ceramic layer 12 abut against each other to form an electrical connection. Preferably, a conductive connecting layer 40 is provided at intervals in the middle of the outer conductive layer 30 on the first ceramic layer 12. The through holes 101 are located in the middle of the conductive connecting layer 40, so that the conductive connecting layer 40 can be printed at the same time as the outer conductive layer 30 is printed on the first ceramic layer 12, and the through holes 101 in the middle of the first ceramic layer 12 are filled to form a conductor 102, which effectively reduces the processing steps. By increasing the conductive connecting layer 40, the contact area can also be increased. When adjacent first ceramic layers 10 are stacked, the adjacent conductors 102 along the thickness direction of the first ceramic layer 10 can be better electrically connected to each other.

[0051] Furthermore, an inner conductive layer 20 is provided between the first ceramic layer 13 and the first ceramic layer 14, preferably the inner conductive layer 20 is provided on the end face of the first ceramic layer 13 near the first ceramic layer 14; an outer conductive layer 30 is provided between the first ceramic layer 14 and the first ceramic layer 15, preferably the outer conductive layer 30 is provided on the end face of the first ceramic layer 14 near the first ceramic layer 15; an inner conductive layer 20 is provided between the first ceramic layer 15 and the first ceramic layer 16, preferably the inner conductive layer 20 is provided on the end face of the first ceramic layer 15 near the first ceramic layer 16; an outer conductive layer 30 is provided between the first ceramic layer 16 and the first ceramic layer 17, preferably the outer conductive layer 30 is provided on the end face of the first ceramic layer 16 near the first ceramic layer 17; an inner conductive layer 20 is provided between the ceramic layer 17 and the first ceramic layer 18, preferably the inner conductive layer 20 is provided on the end face of the first ceramic layer 17 near the first ceramic layer 18; in this stacked structure, there are only two main basic units, which are alternately arranged to form a capacitor, simplifying the production and processing steps.

[0052] Specifically, the solid inductor 200 includes multiple layers of second ceramic layers 210 and connecting conductors 220 disposed in relation to the second ceramic layers 210; a plurality of connecting conductors 220 constitute a coil conductor 230, which is connected in series within the range of the multiple layers of second ceramic layers 210 and extends in a coil shape.

[0053] The second ceramic layer 210 can be made of the same material as the first ceramic layer 10 or a different material. The selection of the second ceramic layer 210 is the same as that of the first ceramic layer 10 and will not be described in detail here. The connecting conductor 220 can be made of the same material as the inner conductive layer 20 or the outer conductive layer 30 or a different material. The selection of the connecting conductor 220 is the same as that of the inner conductive layer 20 or the outer conductive layer 30 and will not be described in detail here.

[0054] like Figure 10 As shown, an eight-layer stacked structure is described; the second ceramic layer 210 includes, from bottom to top, second ceramic layers 211, 212, 213, 214, 215, 216, 217, and 218; the connecting conductor 220 has various forms: first, there is a surface conductive layer 221 extending along the surface of the second ceramic layer 210; second, there is a second conductor 222 for interlayer electrical connection penetrating along the thickness direction of the second ceramic layer 210; as shown... Figure 10 and Figure 11 As shown, the connecting conductor 220 disposed in relation to the second ceramic layer 211 includes a second conductor 222 disposed through the second ceramic layer 211 and located in the middle of the second ceramic layer 211, and a surface conductive layer 221 electrically connected to the second conductor 222 and located on the upper surface of the second ceramic layer 211. The surface conductive layer 221 extends from the middle to form a lower semi-circular structure. Figure 11 The second through hole 201 and the second conductor 222 on the right side of the middle surface conductive layer 221 are actually the bottom structure of the second conductor 222 in the second ceramic layer 212, which also indicates that the second ceramic layer 212 is electrically connected to the surface conductive layer 221 in the second ceramic layer 211 through the second conductor 222 inside it.

[0055] like Figure 12 As shown, the connecting conductor 220 associated with the second ceramic layer 212 includes a surface conductive layer 221 with an upper semi-circular structure, and a second conductor 222 penetrating the second ceramic layer 212 on the right side of the surface conductive layer 212. The second through hole 201 and the second conductor 222 shown on the left side of the surface conductive layer 212 are actually the bottom structure of the second conductor 222 in the second ceramic layer 213, which also indicates that the second ceramic layer 213 is connected to the second ceramic layer 212 here through the second conductor 222 inside it. The surface conductive layer 221 is electrically connected; similarly, the connecting conductors associated with the second ceramic layers 213, 214, 215, 216, and 217 all include the surface conductive layer 221 and a through-through second conductor 222; the connecting conductor 220 associated with the second ceramic layer 218 only includes a second conductor 222 disposed through the middle of the second ceramic layer 218 and electrically connected to the surface conductive layer 221 disposed on the surface of the second ceramic layer 217; Figure 14 The diagram shows a top view of the coil conductor 230 of a solid inductor 200 across multiple ceramic layers, where dashed lines indicate the connection between adjacent second ceramic layers 210 to form the coil conductor 230; in one embodiment, the second ceramic layer 210 is in the form of a circular sheet.

[0056] like Figure 13 As shown, the coil conductor 230 extending in a coil shape within the solid inductor 200 is shown in a display form visible through hidden lines.

[0057] like Figure 6 As shown, in one embodiment of the present invention, a conductive connecting layer 40 is provided at a distance from the middle of the outer conductive layer 30; the conductive connecting layer 40 is electrically connected to the conductor 102; an insulating portion 50 is provided between the outer conductive layer 30 and the conductive connecting layer 40 to form an insulation between them. By providing the conductive connecting layer 40, the contact area can be effectively increased, ensuring the stability of the electrical connection between the conductive connecting layer 40 and the conductor 102. Furthermore, by increasing the contact area through the conductive connecting layer 40, when adjacent first ceramic layers 10 are stacked, the conductive connecting layer 40 provides a larger contact area to cooperate with the adjacent conductor 102, ensuring the effectiveness of the electrical connection during stacking and avoiding poor contact caused by misalignment.

[0058] In one embodiment of the present invention, the first ceramic layer 10 is in the shape of a circular sheet; the inner conductive layer 20 is located in the middle of the first ceramic layer and has a diameter of R1; the outer conductive layer 30 is in the shape of a ring with the outer large circle having a diameter similar to that of the first ceramic layer 10, and the inner small circle having a diameter of R2; the insulating portion 50 is in the shape of a ring with the outer large circle having a diameter of R2 and the inner small circle having a diameter of R3; the conductive connecting layer 40 is located in the middle of the first ceramic layer 10 and has a diameter of R3; satisfying R1 > R2 > R3. By controlling the difference in the diameter of each part, the capacitance can be effectively controlled, while ensuring effective electrical connection between the upper and lower first ceramic layers and ensuring insulation between the conductor and the outer conductive layer.

[0059] In one embodiment of the present invention, a plurality of through holes 101 are provided in the middle of the first ceramic layer 10 along its thickness direction; a conductor 102 is provided in the through holes 101; the through holes 101 are located in the middle of the conductive connecting layer 40. The through hole 101 structure facilitates the generation of the conductor 102, for example, by filling the through holes 101 with printing to form the conductor 102. It should be noted that in actual production, the thickness of the solid capacitor 100 is usually only 1-3 mm, and the thickness of a single first ceramic layer 10 is even thinner. Therefore, when printing the conductive layer, conductive paste or conductive slurry can be easily filled into the through holes 101 to form the conductor 102.

[0060] In one embodiment of the present invention, the connecting conductor 220 includes a surface conductive layer 221 disposed on the surface of the second ceramic layer 210 and a second conductor 222 penetrating in the thickness direction of the second ceramic layer 210. To enable the connecting conductor 220 to form a series-connected coil conductor 230, the second conductors 222 in each of the second ceramic layers 210 are located at different positions. The second ceramic layer 210 has a plurality of through-holes 201 along its thickness direction; the second conductors 222 are disposed within the through-holes 201. The structure of the through-holes 201 facilitates the generation of the second conductors 222, for example, by filling the through-holes 201 with printing. It should be noted that in actual production, the thickness of the solid inductor 200 is usually only 1-3 mm, and the thickness of a single second ceramic layer 210 is even thinner. Therefore, when printing the conductive layer, conductive paste or conductive slurry can be easily filled into the through-holes 201 to form the second conductors 222.

[0061] In one embodiment of the present invention, eight through holes 101 are arranged in a ring. By providing multiple through holes 101, multiple conductors 102 can be formed on a single first ceramic layer 10, so that even if a single conductor 102 fails to connect, other conductors 102 can still perform the function.

[0062] In one embodiment of the present invention, the solid capacitor 100 has an outer conductor layer 60 electrically connected to the conductor 102 on the outer side of the first ceramic layer 10 located at the end; the solid inductor 200 has a second outer conductor layer 240 electrically connected to the second conductor 222 on the outer side of the second ceramic layer 210 located at the end; by providing the outer conductor layer 60, the contact area can be effectively increased, facilitating the connection between the capacitor and external devices; it is understood that the outer conductor layer 60 can also be constructed by conductive paste printing; similarly, by providing the second outer conductor layer 240, the contact area can be effectively increased, facilitating the connection between the solid inductor 200 and external devices or the solid capacitor 100; the second outer conductor layer 240 can also be constructed by conductive paste printing.

[0063] In one embodiment of the present invention, the solid capacitor 100 comprises eight stacked first ceramic layers; the solid inductor comprises eight stacked second ceramic layers. Figure 7 As shown, the conductors 102 in each first ceramic layer 10 are interconnected, connecting the inner conductive layers 20 in series; as Figure 10 As shown, the connecting conductors 220 in each second ceramic layer 210 are connected in series to form coil conductors 230.

[0064] A composite electronic component array includes a plurality of the aforementioned composite electronic components arranged in an array. For example... Figure 8As shown, a plurality of composite electronic components 2 can be arrayed on the substrate 1; the composite electronic components 2 can be any one of Embodiment 1, Embodiment 2, and Embodiment 3.

[0065] like Figure 9 As shown, a composite electronic component array includes several stacked solid capacitor arrays and several solid inductor arrays; the solid capacitor array includes multiple stacked first ceramic layers 10; an inner conductive layer 20 or an outer conductive layer 30 is arranged in an array between adjacent first ceramic layers 10; the inner conductive layer 20 and the outer conductive layer 30 are alternately arranged along the thickness direction of the solid capacitor array; a conductor 102 is provided on the first ceramic layer 10 and extends through the thickness direction of the first ceramic layer 10; adjacent conductors 102 are electrically connected to each other along the thickness direction of the solid capacitor 100; the conductor 102 is electrically connected to the inner conductive layer 20 and forms insulation between itself and the outer conductive layer 30. The solid inductor array includes multiple stacked second ceramic layers 210 and arrayed connecting conductors 220 connected to the second ceramic layers 210. Multiple adjacent connecting conductors 220 along the thickness direction of the solid inductor array constitute coil conductors 230, which are sequentially connected in series within the range of the multiple second ceramic layers 210 and extend in a coil shape. In this embodiment, a solid capacitor array is directly formed through the stacked multiple first ceramic layers 10 via an arrayed inner conductive layer 20 or outer conductive layer 30, and can be manufactured in the same way as a single solid capacitor. Similarly, in this embodiment, the arrayed connecting conductors 220 form an arrayed coil conductor 230, thereby forming a solid capacitor array, which can be manufactured in the same way as a single solid inductor.

[0066] In one embodiment of the present invention, a conductive connecting layer 40 is provided at a distance from the middle of the outer conductive layer 30; the conductive connecting layer 40 is electrically connected to the conductor 102; an insulating portion 50 is provided between the outer conductive layer 30 and the conductive connecting layer 40 to form an insulation between the outer conductive layer 30 and the conductive connecting layer 40; a plurality of through holes 101 are provided in the middle of the first ceramic layer 10 along its thickness direction; a conductor 102 is provided in the through holes 101; the through holes 101 are located in the middle of the conductive connecting layer 40; the solid capacitor array is located in the middle of the first ceramic layer 10. An external conductor layer 60 electrically connected to a conductor 102 is provided on the outer side of the first ceramic layer 10 at the end; the connecting conductor 220 includes a surface conductive layer 221 disposed on the surface of the second ceramic layer 210 and a second conductor 222 penetrating in the thickness direction of the second ceramic layer 210; a second external conductor layer 240 electrically connected to the second conductor 222 is provided on the outer side of the second ceramic layer 210 at the end of the solid inductor array; the solid capacitor array is electrically connected to the second external conductor layer 240 of the solid inductor array through the external conductor layer 60.

[0067] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent modifications made based on the content of the present invention specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A composite electronic component, characterized in that: Includes a stack of solid capacitors (100) and a stack of solid inductors (200); The solid capacitor (100) includes multiple layers of first ceramic layers (10) stacked together; an inner conductive layer (20) or an outer conductive layer (30) is provided between adjacent first ceramic layers (10); the inner conductive layer (20) and the outer conductive layer (30) are alternately arranged in sequence along the thickness direction of the solid capacitor (100); a conductor (102) is provided on the first ceramic layer (10) through the thickness direction of the first ceramic layer (10); adjacent conductors (102) are electrically connected to each other along the thickness direction of the solid capacitor (100); the conductor (102) is electrically connected to the inner conductive layer (20) and forms an insulation between itself and the outer conductive layer (30); The solid inductor (200) includes multiple layers of second ceramic layers (210) and connecting conductors (220) disposed in relation to the second ceramic layers (210); a plurality of the connecting conductors (220) constitute a coil conductor (230), which is connected in series within the range of the multiple layers of second ceramic layers (210) and extends in a coil shape.

2. The composite electronic component according to claim 1, characterized in that: A conductive connecting layer (40) is provided at a distance in the middle of the outer conductive layer (30); the conductive connecting layer (40) is electrically connected to the conductor (102); an insulating part (50) is provided between the outer conductive layer (30) and the conductive connecting layer (40) so that insulation is formed between the outer conductive layer (30) and the conductive connecting layer (40).

3. A composite electronic component according to claim 2, characterized in that: The solid capacitor (100) is cylindrical; the first ceramic layer (10) is circular; the inner conductive layer (20) is located in the middle of the first ceramic layer (10) and has a diameter of R1; the outer conductive layer (30) is annular and the outer large circle is approximately equal to the diameter of the first ceramic layer (10), and the inner small circle has a diameter of R2; the insulating part (50) is annular and the outer large circle has a diameter of R2, and the inner small circle has a diameter of R3; the conductive connecting layer (40) is located in the middle of the first ceramic layer (10) and has a diameter of R3; satisfying R1 > R2 > R3.

4. A composite electronic component according to claim 2, characterized in that: The first ceramic layer (10) has a plurality of through holes (101) in the middle along its thickness direction; a conductor (102) is provided in the through hole (101); the through hole (101) is located in the middle of the conductor connection layer (40).

5. A composite electronic component according to claim 1, characterized in that: The connecting conductor (220) includes a surface conductive layer (221) disposed on the surface of the second ceramic layer (210) and a second conductor (222) extending through the thickness direction of the second ceramic layer (210).

6. A composite electronic component according to claim 1, characterized in that: The solid capacitor (100) has an outer conductor layer (60) electrically connected to the conductor (102) on the outside of the first ceramic layer (10) located at the end; the solid inductor (200) has a second outer conductor layer (240) electrically connected to the second conductor (222) on the outside of the second ceramic layer (210) located at the end.

7. A composite electronic component according to claim 1, characterized in that: The solid capacitor (100) comprises eight stacked first ceramic layers (10); the solid inductor (200) comprises eight stacked second ceramic layers (210).

8. A composite electronic component array, characterized in that: The composite electronic components include an array of components as described in any one of claims 1-7.

9. A composite electronic component array, characterized in that: The system includes several solid capacitor arrays and several solid inductor arrays stacked together; the solid capacitor arrays include multiple stacked first ceramic layers (10); adjacent first ceramic layers (10) are provided with an array of inner conductive layers (20) or outer conductive layers (30); along the thickness direction of the solid capacitor array, the inner conductive layers (20) and outer conductive layers (30) are alternately arranged in sequence; a conductor (102) penetrating in the thickness direction of the first ceramic layer (10) is provided on the first ceramic layer (10); adjacent conductors (102) along the thickness direction of the solid capacitor array are arranged in a specific manner. The conductors are electrically connected to each other; the conductor (102) is electrically connected to the inner conductive layer (20) and forms an insulation between it and the outer conductive layer (30); the solid inductor array includes multiple layers of second ceramic layers (210) stacked together and an array of connecting conductors (220) connected to the second ceramic layers (210); a plurality of adjacent connecting conductors (220) along the thickness direction of the solid inductor array constitute a coil conductor (230), which is connected in series within the range of the multiple layers of second ceramic layers (210) and extends in a coil shape.

10. A composite electronic component array according to claim 9, characterized in that: A conductive connecting layer (40) is provided at a distance from the middle of the outer conductive layer (30); the conductive connecting layer (40) is electrically connected to the conductor (102); an insulating portion (50) is provided between the outer conductive layer (30) and the conductive connecting layer (40) to form an insulation between the outer conductive layer (30) and the conductive connecting layer (40); a plurality of through holes (101) are provided in the middle of the first ceramic layer (10) along its thickness direction; a conductor (102) is provided in the through hole (101); the through hole (101) is located in the middle of the conductive connecting layer (40); the solid capacitor array is located at the ends The outer side of the first ceramic layer (10) is provided with an external conductor layer (60) electrically connected to the conductor (102); the connecting conductor (220) includes a surface conductive layer (221) disposed on the surface of the second ceramic layer (210) and a second conductor (222) penetrating in the thickness direction of the second ceramic layer (210); the outer side of the second ceramic layer (210) located at the end of the solid inductor array is provided with a second external conductor layer (240) electrically connected to the second conductor (222); the solid capacitor array is electrically connected to the second external conductor layer (240) of the solid inductor array through the external conductor layer (60).

Images