Deformation detection assembly, lower electrode device and semiconductor process equipment

Abstract

The invention discloses a deformation detection assembly, a lower electrode device and semiconductor process equipment, and belongs to the technical field of semiconductors. The semiconductor process equipment comprises a to-be-detected piece, the to-be-detected piece is provided with a to-be-detected surface, the to-be-detected surface is used for forming a vacuum area and an atmosphere area, the deformation detection assembly comprises a base, a rotating part, an elastic part and a detection part, the rotating part is rotationally connected with the base, and the first end of the rotating part is used for abutting against the to-be-detected surface corresponding to the atmosphere area; the second end part of the rotating part is opposite to the base; two ends of the elastic part are respectively connected with the base and the rotating part; the elastic piece is used for providing a restoring force so as to keep the base separated from the second end part under the condition that the deformation quantity of the to-be-detected surface is smaller than a preset deformation quantity and enable the base to be in contact with the second end part under the condition that the deformation quantity of the to-be-detected surface reaches the preset deformation quantity; the detection part is used for detecting the contact state between the second end part and the base. The lower electrode device comprises the deformation detection assembly.

Description

Technical Field

[0001] This application belongs to the field of semiconductor technology, specifically relating to a deformation detection component, a lower electrode device, and semiconductor process equipment. Background Technology

[0002] In the field of semiconductor technology, semiconductor process equipment includes a chamber body and a lower electrode device disposed within the chamber body. The lower electrode device includes a base for supporting a wafer and an interface disk. In a vacuum environment, plasma is generated above the base, and the wafer on the surface of the base is processed using the plasma. The interface disk is located below the base and is connected to the base.

[0003] Before the process begins, a vacuum pump is used to evacuate the chamber body to a vacuum state, and the base will also be in a vacuum environment. However, multiple sealing rings are typically installed between the base and the interface plate. Some of these sealing rings seal the gap between the base and the interface plate, while others seal pre-drilled holes in the base and interface plate (such as through holes for back air lines and through holes for ejector pins). The sealing ring sealing the gap between the base and the interface plate is larger, while the sealing ring sealing the pre-drilled holes is smaller. The sealing ring sealing the gap between the base and the interface plate is located outside the sealing ring sealing the pre-drilled holes. The area formed between these two types of sealing rings is in an atmospheric state and is not affected by the vacuum state of the chamber body. Therefore, the atmospheric pressure in this area will exert pressure on the lower surface of the base, causing deformation of the lower surface of the base. Moreover, the operating conditions of the base are relatively complex, with frequent temperature changes. Temperature changes can cause fatigue in the base, thereby reducing its resistance to deformation and making it more prone to deformation. This, in turn, affects the sealing effect between the interface plate and the base, impacting the process results.

[0004] Similarly, some other components in semiconductor process equipment, besides the base, can also deform, and it is currently impossible to monitor this deformation. Summary of the Invention

[0005] The purpose of this application is to provide a deformation detection component, a lower electrode device, and a semiconductor process equipment, which can solve the problem in related technologies that the deformation of components in semiconductor process equipment cannot be monitored.

[0006] In a first aspect, embodiments of this application provide a deformation detection component applied to semiconductor process equipment. The semiconductor process equipment includes a workpiece to be inspected, the workpiece to be inspected having a surface to be inspected, the surface to be inspected being used to form a vacuum region and an atmospheric region. The deformation detection component includes:

[0007] Base;

[0008] A rotating component is rotatably connected to the base. The rotating component has a first end and a second end located on both sides of its rotation center. The first end is used to abut against the surface to be detected corresponding to the atmospheric region, and the second end is opposite to the base.

[0009] An elastic element, the first end of which is connected to the base and the second end of which is connected to the rotating component, is used to provide a restoring force to keep the base separated from the second end when the deformation of the surface to be detected is less than a preset deformation, and to make the base contact the second end when the deformation generated by the surface to be detected reaches the preset deformation.

[0010] A detection component is used to detect the contact state between the second end and the base.

[0011] Secondly, embodiments of this application also provide a lower electrode device, including a base, an interface disk, and the aforementioned deformation detection component. The base is connected to the interface disk, and the base is the component to be tested. The surface of the base facing the interface disk is the surface to be tested. An inner sealing ring and an outer sealing ring are provided between the base and the interface disk. The outer sealing ring is located around the inner sealing ring. The inner sealing ring, the outer sealing ring, and the surface to be tested together form the atmospheric region, and the inner sealing ring and the surface to be tested together form the vacuum region.

[0012] Thirdly, embodiments of this application also provide a semiconductor process apparatus, including a reaction chamber, wherein the reaction chamber is provided with the aforementioned lower electrode device.

[0013] In this embodiment, a deformation detection component is used to detect the deformation of the component to be tested, which is a component in a semiconductor process equipment capable of deformation. When the deformation of the surface to be tested is less than a preset deformation, i.e., when the deformation of the component to be tested is small or nonexistent, the restoring force of the elastic element keeps the base separated from the second end. When the deformation of the surface to be tested is greater than the preset deformation, i.e., when the deformation of the component to be tested is large, the restoring force of the elastic element brings the base into contact with the second end.

[0014] Therefore, by detecting whether the base of the detection component contacts the second end of the rotating component, the deformation of the part to be tested can be determined. By monitoring the deformation of the part to be tested, process personnel can promptly screen the cause of deformation during the process, thereby preventing further deformation of the part to be tested and ensuring the process effect. Attached Figure Description

[0015] Figure 1 It is a cross-sectional view of semiconductor process equipment disclosed in the prior art;

[0016] Figure 2 This is a schematic diagram of the fit between the base and the interface disk when the base does not deform, as disclosed in the embodiments of this application.

[0017] Figure 3 This is a schematic diagram of the cooperation between the base and the interface disk when the base is deformed, as disclosed in the embodiments of this application;

[0018] Figure 4 This is a top view of the interface disk disclosed in the embodiments of this application;

[0019] Figure 5 This is a schematic diagram of the cooperation between the deformation detection component, the base, and the interface disk when the deformation of the surface to be detected on the base is less than the preset deformation, as disclosed in the embodiments of this application.

[0020] Figure 6 This is a schematic diagram of the deformation detection component, the base, and the base in cooperation when the deformation of the surface to be detected on the base is greater than or equal to a preset deformation, as disclosed in the embodiments of this application.

[0021] Figure 7 This is a cross-sectional view of the semiconductor process equipment disclosed in the embodiments of this application.

[0022] Explanation of reference numerals in the attached figures:

[0023] 10-Deformation detection component

[0024] 100 - Base, 110 - First connecting part, 120 - Second connecting part, 130 - Third connecting part, 131 - First conductive structure

[0025] 200 - Rotating component, 210 - Rotating rod, 211 - Second conductive structure, 211a - Second arc surface, 220 - Follower rod, 221 - Insulating structure, 221a - First arc surface

[0026] 300-elastic component

[0027] 410 - Support component, 420 - Rotating shaft

[0028] 500-Power Supply

[0029] 600-Detection Components

[0030] 20-Base, 20a-Surface to be tested,

[0031] 30-Interface plate, 30a-Allowing hole, 31-Ejector pin through hole, 31a-First sealing groove, 32-Back vent hole, 32a-Second sealing groove, 33-Cooling through hole, 33a-Third sealing groove, 34-Fourth sealing groove, 35-Temperature measuring hole

[0032] 41-First sealing ring, 42-Second sealing ring, 43-Fourth sealing ring, 44-Fastener

[0033] 51-Lower electrode base, 51a-Atmospheric chamber,

[0034] 60 - Gas supply device, 61 - Back gas pipeline,

[0035] 70-Ejector device,

[0036] 80 - Chamber body, 81 - Vacuum pump. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0038] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0039] In related technologies, refer to Figures 1-4 As shown, the semiconductor process equipment includes a chamber body 80 and a lower electrode device disposed within the chamber body 80. The lower electrode device includes a base 20, an interface disk 30, and a lower electrode base 51. The base 20 is used to support the wafer. The interface disk 30 is located below the base 20, and the lower surface of the base 20 is connected to the interface disk 30 by fasteners 44 such as screws. The lower electrode base 51 is located below the interface disk 30 and is connected to the interface disk 30. An atmospheric chamber 51a communicating with the external atmosphere is formed between the lower electrode base 51 and the interface disk 30.

[0040] Both the base 20 and the interface disk 30 are provided with multiple ejector pin through holes 31, back vent through holes 32, and cooling through holes 33. The ejector pin device 70 is connected to the interface disk 30. The ejector pin device 70 can support the wafer on the base 20 through the ejector pin through holes 31. A gas supply device 60 located outside the chamber body 80 can provide back vents to the upper surface of the base 20 through a back vent pipe 61. The back vent pipe 61 passes through the back vent through holes 32, and a cooling water path supplying coolant passes through the cooling through holes 33. For sealing purposes, refer to... Figure 4 As shown, a first sealing groove 31a is provided on the outside of the ejector pin through hole 31 of the interface plate 30. The first sealing groove 31a is used to install a first sealing ring 41, which seals the ejector pin through hole 31. A second sealing groove 32a is provided on the outside of the back vent hole 32 of the interface plate 30. The second sealing groove 32a is used to install a second sealing ring 42, which seals the back vent hole 32. A third sealing groove 33a is provided on the outside of the cooling through hole 33. The third sealing groove 33a is used to install a third sealing ring, which seals the cooling through hole 33. In addition, a fourth sealing groove 34 is also provided on the periphery of the interface plate 30. The fourth sealing groove 34 is used to install a fourth sealing ring 43, which seals the gap between the base 20 and the interface plate 30. The first sealing ring 41, the second sealing ring 42, the third sealing ring, and the fourth sealing ring 43 are all located between the base 20 and the interface plate 30. The interface panel 30 is also provided with a temperature measuring hole 35 through which the probe of the temperature measuring element passes, and the temperature measuring hole 35 is connected to the atmospheric chamber 51a.

[0041] like Figure 1 As shown, the chamber body 80 is connected to a vacuum pump 81. Under process conditions, the vacuum pump 81 creates a vacuum environment inside the chamber body 80. At this time, the areas within the first sealing ring 41, the second sealing ring 42, and the third sealing ring (i.e., the vacuum area mentioned later) in the gap between the base 20 and the interface plate 30 are in a vacuum state, while the areas within the fourth sealing ring 43 and the areas outside the first, second, and third sealing rings (i.e., the vacuum area mentioned later) are in a vacuum state. Figure 4 The area shown in the mid-section (i.e., the atmospheric area mentioned later) is in an atmospheric state. Therefore, the atmospheric pressure at the interface plate 30 will exert pressure on the lower surface of the base 20, causing the base 20 to deform (see reference). Figure 3 As shown in the figure, the deformation is usually 0.05mm-0.3mm. Due to the complex operating conditions of the base 20, different temperature conditions will also cause fatigue of the base 20, reduce its ability to resist deformation, and cause further deformation of the lower surface of the base 20.

[0042] The normal operating temperature of the coolant is 20℃. When the temperature of the coolant is high, such as 60℃ or even 70℃, the strength of the base 20 decreases, which will aggravate the deformation of the lower surface of the base 20. The coupling of air pressure and temperature will reduce the sealing performance of the sealing ring, allowing external atmosphere to enter the interior of the chamber body 80 through the sealing ring, thereby affecting the process effect and even causing scrap.

[0043] Currently, there is no dedicated detection device to detect the deformation of the lower surface of the base 20, and process engineers cannot know the deformation of the base 20 in a timely manner. Based on this, this application provides a deformation detection component 10, which is used to detect the deformation of the lower surface of the base 20. Of course, the deformation detection component 10 can also be applied to other deformable components in semiconductor process equipment besides the base 20.

[0044] The deformation detection component 10, the lower electrode device, and the semiconductor process equipment provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0045] Please refer to Figures 5-7 The deformation detection component 10 disclosed in this application is applied to semiconductor process equipment. The semiconductor process equipment includes a test piece, which has a test surface 20a. The test surface 20a is used to form a vacuum region and an atmospheric region. The deformation detection component 10 is used to detect whether the test surface 20a is deformed.

[0046] Optionally, the deformation detection component 10 can be applied to the lower electrode device of a semiconductor process equipment, and the device to be detected can be the base 20 of the lower electrode device.

[0047] Specifically, the deformation detection assembly 10 includes a base 100, a rotating component 200, an elastic element 300, and a detection component 600. The base 100 provides a mounting foundation for the rotating component 200 and the elastic element 300. The rotating component 200 interacts with the surface 20a of the component to be tested. When the surface 20a of the component to be tested undergoes a large deformation, the rotating component 200 rotates relative to the base 100. The elastic element 300 is used to generate elastic deformation to provide a restoring force to the rotation of the rotating component 200.

[0048] The rotating component 200 is rotatably connected to the base 100. The rotating component 200 can be a rod-shaped structure or other structures. This embodiment does not limit the specific structure of the rotating component 200. Optionally, a rotating shaft 420 is provided at the rotation center of the rotating component 200. The axis of the rotating shaft 420 is perpendicular to the rotation plane of the rotating component 200. The deformation detection assembly 10 also includes a support member 410. One end of the support member 410 is connected to the base 100, and the other end of the support member 410 has a shaft hole through which the rotating shaft 420 passes. The rotating shaft 420 and the support member 410 are rotatably engaged, thereby enabling the rotating component 200 to rotate relative to the base 100. Further optionally, a bearing can also be provided between the support member 410 and the rotating shaft 420 to reduce rotational friction. Of course, the rotating component 200 and the base 100 can also be rotatably connected through other structures.

[0049] The rotating component 200 has a first end and a second end located on both sides of its rotation center. The first end is used to abut against the surface 20a to be tested corresponding to the atmospheric region, and the second end is opposite to the base 100. Thus, during the rotation of the rotating component 200 relative to the base 100, the second end contacts or separates from the base 100, thereby indicating the magnitude of the deformation of the surface 20a to be tested.

[0050] The elastic element 300 can be, but is not limited to, a spring. The first end of the elastic element 300 is connected to the base 100, and the second end of the elastic element 300 is connected to the rotating component 200. Optionally, the first end of the elastic element 300 can be fixedly connected to the base 100 by welding, bonding, or other methods, and the second end of the elastic element 300 can be fixedly connected to the rotating component 200 by welding, bonding, or other methods. The elastic element 300 is used to provide a restoring force to keep the base 100 separated from the second end when the deformation of the surface 20a to be detected is less than a preset deformation, and to bring the base 100 into contact with the second end when the deformation generated by the surface 20a to be detected reaches the preset deformation.

[0051] refer to Figure 5 As shown, when the deformation of the surface 20a to be tested is less than the preset deformation and the first end abuts against the surface 20a to be tested, it indicates that the deformation of the surface 20a to be tested is small or no deformation has occurred. At this time, the deformation detection component 10 is in the initial state, the base 100 is separated from the second end, and the elastic element 300 undergoes elastic deformation. The elastic element 300 can be in a compressed state or a stretched state. In short, the elastic element 300 accumulates elastic potential energy to provide restoring force for the subsequent driving of the rotating component 200.

[0052] refer to Figure 6As shown, when the deformation of the surface 20a to be tested is greater than or equal to the preset deformation, and the first end abuts against the surface 20a to be tested, it indicates that the deformation of the surface 20a to be tested is large. At this time, the surface 20a to be tested deforms to the side away from the rotating component 200. Then, the force exerted by the surface 20a to be tested on the rotating component 200 decreases, and the elastic force generated by the elastic deformation becomes the main force. The elastic element 300 restores the elastic deformation and drives the rotating component 200 to rotate relative to the base 100 so that the base 100 contacts the second end.

[0053] The detection component 600 is used to detect the contact state between the second end and the base 100. Specifically, when the detection component 600 detects that the second end is in contact with the base 100, it indicates that the deformation of the surface 20a to be detected is greater than or equal to a preset deformation; when the detection component 600 detects that the second end is separated from the base 100, it indicates that the deformation of the surface 20a to be detected is less than the preset deformation.

[0054] It should be noted that the deformation refers to the deformation generated in the vertical direction, and the preset deformation can be set according to the needs of the process engineers. Optionally, the preset deformation can be zero or a value greater than zero. In this embodiment, the preset deformation can be 0.2 mm.

[0055] In this embodiment, the deformation detection component 10 is used to detect the deformation of the component to be tested (which may be the base 20). The component to be tested is a part in a semiconductor process equipment that can deform. The deformation may be caused by the component being in both a vacuum environment and an atmospheric environment. When the deformation of the surface 20a to be tested is less than a preset deformation, that is, when the deformation of the component to be tested is small or non-deformable, the rotating component 200 is kept against the surface 20a to be tested. The rotating component 200 rotates relative to the base 100 to a certain position. At this time, the elastic component 300 undergoes elastic deformation, and the base 100 separates from the second end. When the deformation of the surface 20a to be tested is greater than the preset deformation, that is, when the deformation of the component to be tested is large, the elastic component 300 recovers its elastic deformation. The elastic component 300 drives the rotating component 200 to rotate relative to the base 100, thereby bringing the base 100 into contact with the second end.

[0056] Therefore, the deformation of the part to be tested is determined by whether the base 100 and the second end of the rotating part are in contact. The deformation of the part to be tested is monitored so that process personnel can screen the cause of deformation in a timely manner during the process, thereby avoiding further deformation of the part to be tested and ensuring the process effect.

[0057] In one optional embodiment, the rotating component 200 includes only a rotating rod 210, which is rotatably connected to the base 100. The elastic element 300 is connected to the rotating rod 210, and the second end is the first end of the rotating rod 210. The second end of the rotating rod 210 can directly abut against the surface 20a to be tested corresponding to the atmospheric region.

[0058] In another embodiment, the rotating component 200 further includes a follower rod 220. The first end of the follower rod 220 is connected to the second end of the rotating rod 210. The rotating rod 210 can abut against the surface 20a to be tested corresponding to the atmospheric region via the follower rod 220. That is, the second end of the follower rod 220 can abut against the surface 20a to be tested corresponding to the atmospheric region. Furthermore, the extension direction of the rotating rod 210 intersects with the extension direction of the follower rod 220. Optionally, the extension direction of the rotating rod 210 is perpendicular to the extension direction of the follower rod 220, so the extension direction of the rotating rod 210 can be parallel to the undeformed surface 20a to be tested. Optionally, the rotating rod 210 and the follower rod 220 can be an integral structure; or, the rotating rod 210 and the follower rod 220 can also be separate structures, fixedly connected by welding, bonding, or other methods.

[0059] In this embodiment, the rotating component 200 adopts a bent structure. Therefore, the extension direction of the follower rod 220 can be consistent with the deformation direction of the surface to be detected 20a. The overall movement of the follower rod 220 makes it easier to rotate the rotating rod 210. That is, compared with the rotating rod 210 directly abutting against the surface to be detected 20a corresponding to the atmospheric area, the rotating component 200 is easier to rotate, thereby changing the contact state of the base 100 and the second end, and thus detecting the deformation state.

[0060] In one optional embodiment, the position where the rotating rod 210 contacts the base 100 is the first position, and the position where the follower rod 220 abuts against the surface 20a to be tested is the second position. In the direction in which the rotating rod 210 extends, the distance from the first position to the rotation center is equal to the distance from the second position to the rotation center.

[0061] In another embodiment, in the direction in which the rotating rod 210 extends, the distance from the first position to the center of rotation is greater than the distance from the second position to the center of rotation, and the rotating component 200 is equivalent to a lever structure. (See reference) Figure 5 As shown, the distance from the first position to the rotation center is L1, and the distance from the second position to the rotation center is L2, where L1 > L2. Optionally, the extension direction of the rotating rod 210 is perpendicular to the extension direction of the follower rod 220, so the distance from the second position to the rotation center is the distance from the connection point of the rotating rod 210 and the follower rod 220 to the rotation center.

[0062] Optionally, L1 is 30 times L2, and L1 can be 3mm-5mm, while L2 can be 50mm-100mm. When the deformation of the surface 20a to be tested is 0.1mm, the first end of the rotating rod 210 moves a distance of 0.1mm × 30 = 3mm. The elastic element 300 recovers some elastic deformation, but the base 100 and the second end are not in contact and remain separated. When the deformation of the surface 20a to be tested reaches 0.2mm, the first end of the rotating rod 210 moves a distance of 0.2mm × 30 = 6mm, at which point the base 100 contacts the second end. Of course, L1 can also be other multiples of L2.

[0063] By using this embodiment, by enlarging the lever arm on the side where the second end is located, the second end moves a greater distance during the rotation of the rotating component 200, making it easier for the second end to contact the base and thus more conducive to detecting the deformation state.

[0064] In one alternative embodiment, the elastic element 300 is disposed near the second end of the rotating rod 210, or the elastic element 300 is disposed near the rotation center of the rotating rod 210.

[0065] In another embodiment, the elastic element 300 is disposed near the first end of the rotating rod 210, that is, the elastic element 300 is relatively far from the rotation center of the rotating rod 210.

[0066] With this configuration, during the rotation of the rotating component 200, since the elastic element 300 is relatively far from the rotation center, the elastic deformation that the elastic element 300 can generate in the initial state is greater, and the elastic element 300 can accumulate more elastic potential energy. When the surface to be detected 20a deforms, it is more conducive to the elastic element 300 driving the rotating rod 210 to rotate, which in turn facilitates the stable contact between the base 100 and the second end to achieve electrical connection.

[0067] In this embodiment, reference Figures 5-7 As shown, the elastic element 300 is vertically arranged, with its upper end connected to the base 100 and its lower end connected to the rotating rod 210. In the initial state, i.e., when the surface to be tested 20a has not deformed, the surface to be tested 20a acts on the rotating component 200. At this time, the elastic element 300 is in a compressed state. Therefore, the length of the elastic element 300 in its free state is greater than the distance from the rotation center of the rotating component 200 in the vertical direction to the base 100. Optionally, the length of the elastic element 300 in its free state is 10 mm, and the distance from the rotation center of the rotating component 200 in the vertical direction to the base 100 is 5 mm.

[0068] In an optional embodiment, refer to Figure 6As shown, the base 100 includes a first connecting portion 110, a second connecting portion 120, and a third connecting portion 130 that are bent and connected in sequence. The first connecting portion 110 is rotatably connected to the rotating rod 210. Optionally, the support member 410 is connected to the first connecting portion 110. The first connecting portion 110, the second connecting portion 120, and the third connecting portion 130 together form a slot into which the first end of the rotating rod 210 extends, so that the first end of the rotating rod 210 moves within the slot. Moreover, the second end is opposite to the third connecting portion 130 and contacts the third connecting portion 130.

[0069] Optionally, the first connecting part 110, the second connecting part 120 and the third connecting part 130 can be an integral structure, that is, the first connecting part 110, the second connecting part 120 and the third connecting part 130 are all first conductive structures 131.

[0070] In this embodiment, the bending structure of the base 100 can form a slot, allowing the rotating rod 210 to move within the area corresponding to the slot. This makes the structure of the deformation detection component 10 more compact, while the base 100 protects the rotating rod 210.

[0071] Of course, in other embodiments, the base 100 may also take the form of other shapes.

[0072] In this application, the base 100 is insulated from the components of the semiconductor process equipment to which it is connected. Optionally, the semiconductor process equipment includes an interface disk 30, and the base 100 is insulated from the interface disk 30 to prevent the interface disk 30 from affecting the conductive path of the deformation detection component 10. Further optionally, the base 100 and the interface disk 30 can be insulated from each other using insulating materials such as insulating adhesive.

[0073] The base 100 is provided with a first conductive structure 131. Optionally, the base 100 is made of insulating material, such as insulating resin or other insulating material. The base 100 is installed on the interface plate 30, which can directly achieve an insulating connection between the two. The first conductive structure 131 provided on the base 100 can be a metal sheet or other conductive structure. The metal sheet can be an aluminum sheet, a stainless steel sheet, etc.

[0074] Alternatively, at least a portion of the base 100 may be a first conductive structure 131. Optionally, a portion of the base 100 may be the first conductive structure 131, while the portion of the base 100 in contact with the interface disk 30 may be an insulating structure. The base 100 is mounted on the interface disk 30, directly achieving an insulated connection between the base 100 and the interface disk 30. Alternatively, the entire base 100 may be the first conductive structure 131, and the base 100 and the interface disk 30 may be insulatedly connected using insulating materials such as insulating adhesive. In this way, the base 100 does not require a separate conductive structure. Further optionally, the base 100 may be made of a metal material, such as aluminum or stainless steel.

[0075] The second end is provided with a second conductive structure 211, which is opposite to the first conductive structure 131. Thus, during the rotation of the rotating component 200 relative to the base 100, the second conductive structure 211 comes into contact with or separates from the first conductive structure 131, thereby achieving electrical connection or disconnection between the two. Optionally, the second conductive structure 211 protrudes from the surface of the rotating component 200, and the second conductive structure 211 can be a metal structure, specifically aluminum, stainless steel, etc.

[0076] Specifically, when the base 100 is in contact with the second end, the first conductive structure 131 and the second conductive structure 211 are in contact and electrically connected; when the base 100 is separated from the second end, the first conductive structure 131 and the second conductive structure 211 are separated to disconnect the electrical connection, that is, the two are not electrically connected.

[0077] Furthermore, the first end of the rotating component 200 is provided with an insulating structure 221, through which the rotating component 200 abuts against the surface to be tested 20a. Typically, the component to be tested is a conductive structure, thus preventing the rotating component 200 from directly contacting the surface to be tested 20a, thereby preventing the component to be tested from affecting the electrical connection between the first conductive structure 131 and the second conductive structure 211.

[0078] The detection component 600 is used to detect the electrical connection status between the first conductive structure 131 and the second conductive structure 211. When the detection component 600 detects that the first conductive structure 131 and the second conductive structure 211 are electrically connected, it indicates that the second end is in contact with the base 100, and the deformation of the surface 20a to be detected is greater than or equal to a preset deformation. When the detection component 600 detects that the first conductive structure 131 and the second conductive structure 211 are disconnected, it indicates that the second end is separated from the base 100, and the deformation of the surface 20a to be detected is less than a preset deformation.

[0079] In this embodiment, the detection component 600 detects whether the first conductive structure 131 and the second conductive structure 211 are electrically connected, which helps to accurately determine whether the base 100 is in contact with the second end, and thus accurately determine the deformation of the part to be tested.

[0080] Of course, in other embodiments, the base 100 may not be provided with the first conductive structure 131, the second end may not be provided with the second conductive structure 211, and the detection component 600 may be a pressure sensor, which detects the pressure between the base 100 and the second end to determine whether the two are in contact, and then determines the deformation of the component to be detected.

[0081] In an optional embodiment, the deformation detection assembly 10 further includes a power supply 500, at least one of the first conductive structure and the second conductive structure being electrically connected to the power supply 500. The power supply 500, the first conductive structure 131, and the second conductive structure 211 form a detection circuit. The power supply 500 is used to keep the detection circuit in a closed state when the first conductive structure 131 and the second conductive structure 211 are in contact, and to keep the detection circuit in an open state when the first conductive structure 131 and the second conductive structure 211 are separated. The detection component 600 is used to detect the on / off state of the detection circuit.

[0082] Optionally, the first conductive structure 131 and the second conductive structure 211 are electrically connected to the two poles of the power supply 500, respectively. The first conductive structure 131 is electrically connected to the positive pole of the power supply 500, and the second conductive structure 211 is electrically connected to the negative pole of the power supply 500; or, the first conductive structure 131 is electrically connected to the negative pole of the power supply 500, and the second conductive structure 211 is electrically connected to the positive pole of the power supply 500. (Reference) Figure 7 As shown, one of the first conductive structure 131 and the second conductive structure 211 can be electrically connected to the positive terminal of the power supply 500, while the other is grounded. Specifically, the first conductive structure 131 is electrically connected to the positive terminal of the power supply 500, and the second conductive structure 211 is grounded; or, the first conductive structure 131 is grounded, and the second conductive structure 211 is electrically connected to the positive terminal of the power supply 500. In short, the first conductive structure 131, the second conductive structure 211, and the power supply 500 can form a detection circuit. Both the first conductive structure 131 and the second conductive structure 211 can be electrically connected to the power supply 500 or grounded via wires.

[0083] When the first conductive structure 131 and the second conductive structure 211 are separated and disconnected, the detection circuit is in an open-circuit state; when the first conductive structure 131 and the second conductive structure 211 are in contact and connected, the detection circuit is in a closed-circuit state. Thus, the detection component 600 determines whether the first conductive structure 131 and the second conductive structure 211 are electrically connected by detecting the state of the detection circuit.

[0084] The embodiments of this application do not limit the detection position of the detection component 600. Optionally, the detection component 600 can be electrically connected to the first conductive structure 131 or the second conductive structure 211. When the detection circuit is in a closed state, both the first conductive structure 131 and the second conductive structure 211 are energized; when the detection circuit is in an open state, neither the first conductive structure 131 nor the second conductive structure 211 are energized.

[0085] The detection component 600 can be a voltmeter, which uses whether the voltmeter detects voltage to provide feedback on whether the detection circuit is in a closed state; or, the detection component 600 can be an ammeter, which uses whether the ammeter detects current to provide feedback on whether the detection circuit is in a closed state; or, the detection component 600 can be replaced by a test lamp, which uses whether the test lamp is lit to provide feedback on whether the detection circuit is in a closed state.

[0086] In this embodiment, the detection component 600 detects whether the detection circuit is in a closed state to provide feedback on whether the first conductive structure 131 and the second conductive structure 211 are electrically connected, thereby determining whether the deformation of the surface 20a to be detected is greater than the preset deformation, thus realizing the detection of the deformation state.

[0087] Of course, in other embodiments, the deformation detection component 10 may also detect the electrical connection state between the first conductive structure 131 and the second conductive structure 211 in other ways.

[0088] In a further embodiment, the rotating component 200 is a third conductive structure, and the second conductive structure 211 is electrically connected to the power supply 500 or grounded through the third conductive structure. Alternatively, the second conductive structure 211 can also be electrically connected to the detection component 600 through the third conductive structure, and the detection component 600 detects whether the second conductive structure 211 is energized to provide feedback on the on / off state of the detection circuit. Optionally, the rotating component 200 includes a rotating rod 210 and a follower rod 220, both of which are third conductive structures. The rotating rod 210 is electrically connected to the power supply 500, or the rotating rod 210 is grounded. Further optionally, both the rotating rod 210 and the follower rod 220 are metal rods, specifically stainless steel rods or other metal rods.

[0089] In this embodiment, the second conductive structure 211 is small in size and inconvenient to be directly connected to the power supply 500 or grounded. By setting the rotating component 200 as the third conductive structure, the power supply 500 can be directly connected to the rotating component 200, or the rotating component 200 can be directly grounded, making the way the second conductive structure 211 is connected to the power supply 500 or the way it is grounded simpler and more convenient.

[0090] Of course, in other embodiments, the power supply 500 can be directly electrically connected to the second conductive structure 211, or the second conductive structure 211 can be directly grounded.

[0091] In one alternative embodiment, the surface of the insulating structure 221 facing the surface to be tested 20a can be a first plane.

[0092] In another embodiment, such as Figure 5 and Figure 6As shown, the surface of the insulating structure 221 facing the surface 20a to be tested is the first arc surface 221a. Optionally, the insulating structure 221 can be an arc-shaped structure, or a spherical structure, a cylindrical structure, etc.

[0093] In this embodiment, the surface of the insulating structure 221 facing the surface to be tested 20a is arc-shaped. The arc-shaped surface has higher stability when in contact with the surface to be tested 20a, which is more conducive to the stable mutual contact between the insulating structure 221 and the surface to be tested 20a.

[0094] In one optional embodiment, the surface of the second conductive structure 211 facing the first conductive structure 131 is a second plane.

[0095] In another embodiment, such as Figure 5 As shown, the surface of the second conductive structure 211 facing the first conductive structure 131 is a second arc surface 211a. Optionally, the second conductive structure 211 can be an arc-shaped structure, or a spherical structure, a cylindrical structure, etc.

[0096] In this embodiment, the surface of the second conductive structure 211 facing the first conductive structure 131 is an arc surface. The arc surface has higher stability when it contacts the first conductive structure 131, which is beneficial for the second conductive structure 211 to make stable contact with the first conductive structure 131 after the elastic element 300 drives the rotating component 200 to rotate, thereby achieving a stable electrical connection.

[0097] In this embodiment, the overall length, width and height of the deformation detection component 10 are 110mm, 20mm and 20mm, respectively.

[0098] Based on the deformation detection component 10 disclosed in this application, embodiments of this application also provide a lower electrode device, see reference. Figure 7 As shown, the lower electrode device includes a base 20, an interface disk 30, and the deformation detection component 10 in the above embodiment. The base 20 is connected to the interface disk 30 and is the part to be tested. The surface of the base 20 facing the interface disk 30 is the surface to be tested 20a. An inner sealing ring and an outer sealing ring are provided between the base 20 and the interface disk 30. The outer sealing ring is located outside the inner sealing ring. The inner sealing ring, the outer sealing ring, and the surface to be tested 20a together form an atmospheric area, and the inner sealing ring and the surface to be tested 20a together form a vacuum area. The inner sealing ring can be the first sealing ring 41, the second sealing ring 42, and the third sealing ring mentioned above, and the outer sealing ring can be the fourth sealing ring 43 mentioned above. In this embodiment, the lower electrode device is equipped with a deformation detection component 10, which can detect whether the base 20 has undergone abnormal deformation, that is, whether the deformation amount is greater than a preset deformation amount, so that process personnel can screen the cause of the deformation of the base 20 in a timely manner.

[0099] In an optional embodiment, refer to Figure 7As shown, the deformation detection component 10 is located on the side of the interface disk 30 facing away from the base 20. The base 100 is connected to the interface disk 30, and the interface disk 30 is provided with a clearance hole 30a for the rotating component 200 to pass through. Optionally, the first connecting part 110 of the base 100 and the interface disk 30 can be connected by welding, bonding or other means; the follower rod 220 of the rotating component 200 passes through the clearance hole 30a.

[0100] In this embodiment, the interface disk 30 has a larger space on the side facing away from the base 20, and the deformation detection component 10 is located on this side, which facilitates the installation of the deformation detection component 10. At the same time, the interface disk 30 has a clearance hole 30a to ensure that the rotating component 200 can stably abut against the surface to be detected 20a, so as to smoothly realize the monitoring process.

[0101] Of course, in other embodiments, the deformation detection component 10 may also be located in other positions.

[0102] Based on the lower electrode device disclosed in this application, embodiments of this application also provide a semiconductor process apparatus, see reference. Figure 7 As shown, the semiconductor process equipment includes a reaction chamber, and the reaction chamber is provided with the lower electrode device in the above embodiment. Optionally, the reaction chamber includes a chamber body 80, and the lower electrode device is disposed in the chamber body 80.

[0103] Optionally, the semiconductor process equipment also includes a machine tool that alarms when the detection component 600 of the deformation detection assembly 10 detects that the first conductive structure 131 and the second conductive structure 211 are in an electrically connected state. During installation, the deformation detection assembly 10 is first installed onto the interface plate 30, then the base 20 is connected to the interface plate 30 using fasteners 44, and finally the lower electrode device is installed into the chamber body 80.

[0104] With this configuration, the lower electrode device of the semiconductor process equipment can detect whether the base 20 has abnormal deformation, i.e. whether the deformation is greater than the preset deformation, by setting the deformation detection component 10, so that the process personnel can screen the cause of the deformation of the base 20 in a timely manner.

[0105] Specifically, when the deformation of the base 20 exceeds the preset deformation, the machine tool needs to be investigated to determine the cause, and appropriate measures should be taken based on the investigation results. Causes of abnormal deformation include: 1. Foreign objects exist between the interface plate 30 and the base 20, causing the base 20 to be improperly installed; 2. An abnormal situation occurs in the machine tool, causing a rapid increase in the temperature at the bottom of the base 20, which reduces the base 20's resistance to deformation, resulting in abnormal deformation. This situation is usually reversible; 3. Faults in the base 20 itself.

[0106] When the deformation generated by the base 20 exceeds the preset deformation, first confirm the status of the machine. If the abnormality occurs after the base 20 is installed and the temperature of the base 20 is within the normal range, check whether there are foreign objects between the interface plate 30 and the base 20, and reinstall the base 20. If the abnormality occurs during the operation of the machine, check whether the temperature of the base 20 is normal. Generally, the coolant temperature in the base 20 < the temperature range of the base 20 < the coolant temperature in the base 20 + 10℃. For example, if the coolant temperature in the base 20 is set to 20℃, the coolant temperature 20℃ < the temperature range of the base 20 < 30℃. If the temperature is abnormal, troubleshoot the temperature abnormality problem, check the machine malfunction and restore it. If the abnormality occurs during the operation of the machine and the temperature of the base 20 is not abnormal, or the test system still does not recover after the temperature abnormality problem is solved, it is considered that the base 20 itself is faulty and the base 20 needs to be replaced. By detecting alarm information in this way and taking preventative measures to check and handle the equipment in advance, losses of mass-produced wafers during the process can be avoided.

[0107] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A deformation detection component, applied to semiconductor process equipment, the semiconductor process equipment including a workpiece to be inspected, the workpiece to be inspected having a surface to be inspected (20a), the surface to be inspected (20a) being used to form a vacuum region and an atmospheric region, characterized in that, The deformation detection component (10) includes: Base (100); A rotating component (200) is rotatably connected to the base (100). The rotating component (200) has a first end and a second end located on both sides of its rotation center. The first end is used to abut against the surface to be tested (20a) corresponding to the atmospheric region, and the second end is opposite to the base (100). An elastic element (300) is provided, the first end of which is connected to the base (100) and the second end of which is connected to the rotating component (200). The elastic element (300) is used to provide a restoring force to keep the base (100) separated from the second end when the deformation of the surface to be tested (20a) is less than a preset deformation, and to make the base (100) contact the second end when the deformation generated by the surface to be tested (20a) reaches the preset deformation. A detection component (600) is used to detect the contact state between the second end and the base (100).

2. The deformation detection component according to claim 1, characterized in that, The base (100) is insulated from the components of the semiconductor process equipment to which it is connected. The base (100) is provided with a first conductive structure (131), or at least a portion of the base (100) is the first conductive structure (131). The first end of the rotating component (200) is provided with an insulating structure (221), through which the rotating component (200) can abut against the surface to be tested (20a). The second end is provided with a second conductive structure (211), which is opposite to the first conductive structure (131). When the base (100) is in contact with the second end, the first conductive structure (131) is in contact with and electrically connected to the second conductive structure (211); when the base (100) is separated from the second end, the first conductive structure (131) is separated from the second conductive structure (211) to disconnect the electrical connection. The detection component (600) is used to detect the electrical connection state between the first conductive structure (131) and the second conductive structure (211).

3. The deformation detection component according to claim 2, characterized in that, The deformation detection assembly further includes a power supply (500), at least one of the first conductive structure (131) and the second conductive structure (211) is electrically connected to the power supply (500), the power supply (500), the first conductive structure (131) and the second conductive structure (211) form a detection circuit, the power supply (500) is used to keep the detection circuit in a closed state when the first conductive structure (131) and the second conductive structure (211) are in contact, and to keep the detection circuit in an open state when the first conductive structure (131) and the second conductive structure (211) are separated, and the detection component (600) is used to detect the on / off state of the detection circuit.

4. The deformation detection component according to claim 3, characterized in that, The rotating component (200) is a third conductive structure, and the second conductive structure (211) is electrically connected to the power supply (500) or grounded through the third conductive structure.

5. The deformation detection component according to claim 2, characterized in that, The surface of the insulating structure (221) facing the surface to be tested (20a) is a first arc surface (221a).

6. The deformation detection component according to claim 1, characterized in that, The rotating component (200) includes a rotating rod (210) and a follower rod (220). The rotating rod (210) is rotatably connected to the base (100). The elastic element (300) is connected to the rotating rod (210). The second end is the first end of the rotating rod (210). The first end of the follower rod (220) is connected to the second end of the rotating rod (210). The rotating rod (210) can abut against the surface to be tested (20a) corresponding to the atmospheric area through the follower rod (220). The extension direction of the rotating rod (210) intersects with the extension direction of the follower rod (220).

7. The deformation detection component according to claim 6, characterized in that, The position where the rotating rod (210) contacts the base (100) is the first position, and the position where the follower rod (220) abuts against the surface to be tested (20a) is the second position. In the direction in which the rotating rod (210) extends, the distance from the first position to the rotation center is greater than the distance from the second position to the rotation center, and the elastic member (300) is disposed adjacent to the first end of the rotating rod (210).

8. The deformation detection component according to claim 6, characterized in that, The base (100) includes a first connecting part (110), a second connecting part (120) and a third connecting part (130) that are bent and connected in sequence. The first connecting part (110) is rotatably connected to the rotating rod (210). The first connecting part (110), the second connecting part (120) and the third connecting part (130) together form a slot into which the first end of the rotating rod (210) extends. The third connecting part (130) is in contact with or separate from the second end.

9. A lower electrode device, characterized in that, The device includes a base (20), an interface disk (30), and a deformation detection component (10) as described in any one of claims 1-8. The base (20) is connected to the interface disk (30). The base (20) is the part to be tested. The surface of the base (20) facing the interface disk (30) is the surface to be tested (20a). An inner sealing ring and an outer sealing ring are provided between the base (20) and the interface disk (30). The outer sealing ring is located around the inner sealing ring. The inner sealing ring, the outer sealing ring, and the surface to be tested (20a) together form the atmospheric region. The inner sealing ring and the surface to be tested (20a) together form the vacuum region.

10. The lower electrode device according to claim 9, characterized in that, The deformation detection component (10) is located on the side of the interface disk (30) facing away from the base (20). The base (100) is connected to the interface disk (30), and the interface disk (30) is provided with a clearance hole (30a) for the rotating component (200) to pass through.

11. A semiconductor process apparatus, characterized in that, It includes a reaction chamber, wherein the reaction chamber is provided with a lower electrode device as described in any one of claims 9-10.

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