Manufacturing method of composite substrate combining BT substrate and glass substrate

Abstract

The invention discloses a manufacturing method of a composite substrate formed by combining a BT substrate and a glass substrate. The manufacturing method comprises the following steps: taking the BT substrate as a substrate layer; a plurality of through cavities are formed in the base material layer, and a set number of through cavities form a group; a layer of PET film is attached to the bottom surface of the base material layer; putting a glass substrate into the through cavity by using a chip mounter; filling a gap between the glass substrate and the through cavity with a hole plugging agent, and curing to form a protective layer; tearing off the PET film on the bottom surface of the base material layer; forming a copper plating layer on the base material layer and the copper foil on the surface of the glass base material; and manufacturing circuit copper layers on the copper plating layers on the upper surface and the lower surface by using a copper reduction method to obtain the whole composite substrate. According to the invention, the glass substrate and the BT substrate are combined to form the composite substrate, and the characteristic of good stress of the glass substrate is utilized, so that the warping risk of a flip chip area in a high-heat process is effectively reduced.

Description

Technical Field

[0001] This invention belongs to the field of glass substrate manufacturing technology, specifically relating to a method for manufacturing a composite substrate that combines a BT substrate and a glass substrate. Background Technology

[0002] Traditionally, the substrate material used to manufacture integrated circuits (ICs) and optoelectronic devices is BT substrate (BT resin substrate material). The main components of BT substrate are resin and glass fiber. In practical applications, there are some defects. For example, there is a risk of warping in the flip-chip area of ​​high-temperature processes. Since glass fiber can block the transmission of some signals, the spacing between two holes is strictly limited, which affects the number of signal contacts (I / O).

[0003] Silicon substrate glass is a substrate material used in the manufacture of integrated circuits (ICs) and optoelectronic devices. It possesses excellent chemical stability, thermal stability, and mechanical strength, making it suitable for the manufacture of high-density integrated circuits.

[0004] Therefore, in order to meet the requirement of having multiple high-density flip-chip regions with internal circuitry on a single substrate, there is an urgent need for a method to manufacture a composite substrate that combines a BT substrate with a glass substrate, thereby achieving the combination of the glass substrate and the BT substrate. Summary of the Invention

[0005] The purpose of this invention is to provide a method for manufacturing a composite substrate combining a BT substrate and a glass substrate, thereby solving the problems mentioned in the background art. The method for manufacturing a composite substrate combining a BT substrate and a glass substrate provided by this invention achieves the bonding of the glass substrate and the BT substrate, and satisfies the characteristic of having multiple high-density flip-chip regions with internal circuitry on a single substrate.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a method for manufacturing a composite substrate combining a BT substrate and a glass substrate, comprising the following steps:

[0007] (a) Take a BT substrate as the substrate layer, wherein a set number of through cavities constitute a group, corresponding to a single composite substrate;

[0008] (ii) Several through cavities are formed in the substrate layer;

[0009] (iii) Attach a layer of PET film to the bottom surface of the substrate layer;

[0010] (iv) Use a pick and place machine to place the glass substrate into the through cavity;

[0011] (v) Fill the gap between the glass substrate and the through cavity with a pore-sealing agent and allow it to cure to form a protective layer;

[0012] (vi) Remove the PET film from the bottom surface of the substrate layer;

[0013] (vii) The copper foil on the substrate layer and the surface of the glass substrate is thinned by the copper thinning method, and then a copper plating layer is formed on the copper foil on the substrate layer and the surface of the glass substrate by the chemical copper plating method and the electroplating copper plating method in sequence.

[0014] (viii) Using the copper reduction method, a circuit copper layer is made on the copper plating layer on the upper and lower surfaces to obtain a whole board composite substrate.

[0015] (ix) Package the whole board or use a cutting machine to cut the whole board of composite substrates into individual composite substrates for packaging.

[0016] In this invention, in step (a), copper foil is attached to the upper and lower surfaces of the substrate layer respectively.

[0017] In this invention, in step (ii), the through cavity is formed by mechanical forming process.

[0018] In this invention, in step (ii), the length and width dimensions of the cavity are 0.2 mm larger than the length and width dimensions of the glass substrate.

[0019] In this invention, in step (iv), the glass substrate is a glass substrate that has already undergone through-hole metallization and surface coating with copper foil.

[0020] In this invention, in step (v), after the pore-filling agent has cured, a Plasma device is used to remove the substrate layer and the protective layer on the surface of the glass substrate.

[0021] In this invention, in step (eight), a light-transmitting dry film is first applied to the surface of the copper plating layer by a hot-pressing process, and then a copper layer for circuitry is fabricated using a copper reduction method.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] 1. This invention combines a glass substrate with a BT substrate to form a composite substrate. By utilizing the good stress characteristics of the glass substrate, the risk of warping in the flip-chip region during high-heat processing is effectively reduced.

[0024] 2. Because the glass substrate has low signal loss, this invention can meet the needs of high-speed interconnection, and can produce smaller vias to meet the needs of more signal contacts, resulting in higher line density.

[0025] 3. The present invention provides a composite substrate by combining a glass substrate and a BT substrate, which has the characteristic of containing multiple flip-chip regions with high internal circuit density on a single substrate. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a single composite substrate in step (I) of the present invention.

[0027] Figure 2 This is a schematic diagram of the structure of a single composite substrate in step (II) of the present invention.

[0028] Figure 3 This is a schematic diagram of the structure of a single composite substrate in step (iii) of the present invention.

[0029] Figure 4 This is a schematic diagram of the structure of a single composite substrate in step (iv) of the present invention.

[0030] Figure 5 and 6 This is a schematic diagram of the structure of a single composite substrate in step (v) of the present invention.

[0031] Figure 7 This is a schematic diagram of the structure of a single composite substrate in step (six) of the present invention.

[0032] Figure 8 This is a schematic diagram of the structure of a single composite substrate in step (seven) of the present invention.

[0033] Figure 9 This is a schematic diagram of the structure of a single composite substrate in step (viii) of the present invention.

[0034] Figure 10 This is a top view of the substrate layer in step (II) of the present invention.

[0035] In the diagram: 1. Substrate layer; 2. Copper foil; 3. Through cavity; 4. PET film; 5. Glass substrate; 6. Protective layer; 7. Copper plating layer; 8. Circuit copper layer. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] Example 1

[0038] Please see Figures 1-10 This embodiment provides the following technical solution: a method for manufacturing a composite substrate combining a BT substrate and a glass substrate, comprising the following steps:

[0039] (a) Take a BT substrate as the substrate layer 1, and attach copper foil 2 to the upper and lower surfaces of the substrate layer 1 respectively.

[0040] (ii) Several through cavities 3 are made on the substrate layer 1 by mechanical forming process. Four through cavities 3 form a group, corresponding to a single composite substrate. The length and width of the through cavity 3 are 0.2 mm larger than the length and width of the glass substrate.

[0041] (iii) A layer of PET film 4 is attached to the bottom surface of the substrate layer 1;

[0042] (iv) Use a pick and place machine to place the glass substrate 5 into the through cavity 3. The glass substrate 5 is a glass substrate that has completed through-hole metallization and surface copper foil covering.

[0043] (v) Fill the gap between the glass substrate 5 and the through cavity 3 with a plugging agent and cure it to form a protective layer 6. After the plugging agent has cured, use a Plasma device to remove the substrate layer 1 and the protective layer 6 on the surface of the glass substrate 5.

[0044] (vi) Remove the PET film 4 from the bottom surface of the substrate layer 1;

[0045] (vii) The copper foil on the surface of the substrate layer 1 and the glass substrate 5 is thinned by the copper thinning method, and then a copper plating layer 7 is formed on the copper foil on the surface of the substrate layer 1 and the glass substrate 5 by the chemical copper plating method and the electroplating copper plating method in sequence.

[0046] (viii) The light-transmitting dry film is covered onto the surface of the copper plating layer 7 by hot pressing, and then the copper reduction method is used to create the circuit copper layer 8 on the copper plating layer 7 on the upper and lower surfaces to obtain the whole board composite substrate.

[0047] (ix) Pack the whole board.

[0048] Example 2

[0049] This embodiment provides the following technical solution: a method for manufacturing a composite substrate combining a BT substrate and a glass substrate, comprising the following steps:

[0050] (a) Take a BT substrate as the substrate layer 1, and attach copper foil 2 to the upper and lower surfaces of the substrate layer 1 respectively.

[0051] (ii) Several through cavities 3 are made on the substrate layer 1 by mechanical forming process. Four through cavities 3 form a group. The length and width of the through cavity 3 are 0.2 mm larger than the length and width of the glass substrate.

[0052] (iii) A layer of PET film 4 is attached to the bottom surface of the substrate layer 1;

[0053] (iv) Use a pick and place machine to place the glass substrate 5 into the through cavity 3. The glass substrate 5 is a glass substrate that has completed through-hole metallization and surface copper foil covering.

[0054] (v) Fill the gap between the glass substrate 5 and the through cavity 3 with a plugging agent and cure it to form a protective layer 6. After the plugging agent has cured, use a Plasma device to remove the substrate layer 1 and the protective layer 6 on the surface of the glass substrate 5.

[0055] (vi) Remove the PET film 4 from the bottom surface of the substrate layer 1;

[0056] (vii) The copper foil on the surface of the substrate layer 1 and the glass substrate 5 is thinned by the copper thinning method, and then a copper plating layer 7 is formed on the copper foil on the surface of the substrate layer 1 and the glass substrate 5 by the chemical copper plating method and the electroplating copper plating method in sequence.

[0057] (viii) The light-transmitting dry film is covered onto the surface of the copper plating layer 7 by hot pressing, and then the copper reduction method is used to create the circuit copper layer 8 on the copper plating layer 7 on the upper and lower surfaces to obtain the whole board composite substrate.

[0058] (ix) Use a cutting machine to cut the completed whole composite substrate into individual composite substrates for packaging.

[0059] In summary, this invention combines a glass substrate and a BT substrate to form a composite substrate. Utilizing the good stress characteristics of the glass substrate, the warpage risk in the flip-chip region during high-heat processing is effectively reduced. Because the glass substrate has lower signal loss, this invention can meet the requirements of high-speed interconnects, allowing for the fabrication of smaller vias and accommodating a larger number of signal contacts, resulting in higher circuit density. The composite substrate formed by combining a glass substrate and a BT substrate in this invention allows for multiple flip-chip regions with high internal circuit density on a single substrate.

[0060] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A method for manufacturing a composite substrate combining a BT substrate and a glass substrate, characterized in that: Includes the following steps: (a) Take a BT substrate as the substrate layer; (ii) A number of through cavities are formed on the substrate layer, wherein a set number of through cavities constitute a group, corresponding to a single composite substrate; (iii) Attach a layer of PET film to the bottom surface of the substrate layer; (iv) Use a pick and place machine to place the glass substrate into the through cavity; (v) Fill the gap between the glass substrate and the through cavity with a pore-sealing agent and allow it to cure to form a protective layer; (vi) Remove the PET film from the bottom surface of the substrate layer; (vii) The copper foil on the substrate layer and the surface of the glass substrate is thinned by the copper thinning method, and then a copper plating layer is formed on the copper foil on the substrate layer and the surface of the glass substrate by the chemical copper plating method and the electroplating copper plating method in sequence. (viii) Using the copper reduction method, a circuit copper layer is made on the copper plating layer on the upper and lower surfaces to obtain a whole board composite substrate. (ix) Package the whole board or use a cutting machine to cut the whole board of composite substrates into individual composite substrates for packaging.

2. The method for manufacturing a composite substrate combining a BT substrate and a glass substrate according to claim 1, characterized in that: In step (a), copper foil is attached to the upper and lower surfaces of the substrate layer, respectively.

3. The method for manufacturing a composite substrate combining a BT substrate and a glass substrate according to claim 1, characterized in that: In step (ii), the through cavity is formed by mechanical forming process.

4. The method for manufacturing a composite substrate combining a BT substrate and a glass substrate according to claim 1, characterized in that: In step (ii), the length and width dimensions of the cavity are 0.2 mm larger than the length and width dimensions of the glass substrate.

5. The method for manufacturing a composite substrate combining a BT substrate and a glass substrate according to claim 1, characterized in that: In step (iv), the glass substrate is a glass substrate that has already undergone through-hole metallization and surface coating with copper foil.

6. The method for manufacturing a composite substrate combining a BT substrate and a glass substrate according to claim 1, characterized in that: In step (v), after the pore-filling agent has cured, a Plasma device is used to remove the substrate layer and the protective layer on the surface of the glass substrate.

7. The method for manufacturing a composite substrate combining a BT substrate and a glass substrate according to claim 1, characterized in that: In step (eight), a light-transmitting dry film is first applied to the surface of the copper plating layer using a hot-pressing process, and then the copper layer of the circuit is fabricated using a copper reduction method.

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